Class / Patent application number | Description | Number of patent applications / Date published |
451443000 | Dressing | 68 |
20090042494 | PAD CONDITIONER OF SEMICONDUCTOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREOF - A pad conditioner of semiconductor wafer polishing apparatus and a pad conditioner manufacturing method thereof are provided with a uniform conditioning for a polishing pad of a polishing apparatus, the polishing apparatus being for evenly planarizing a metal layer formed on the surface of wafer in a semiconductor device manufacturing processor. The pad conditioner may include a substrate constructed of a flat plate of disk shape, a coating part formed with a given thickness on the substrate, and a plurality of protrusion parts formed on the coating part, the plurality of protrusion parts having a plurality of polishing members based on the same size in a predetermined grouping or pattern. | 02-12-2009 |
20090053980 | Optimized CMP Conditioner Design for Next Generation Oxide/Metal CMP - A study of several key conditioner design parameters has been conducted. The purpose was to improve conditioner performance by considering factors such as wafer defects, pad life, and conditioner life. For this study, several key conditioner design parameters such as diamond type, diamond size, diamond shape, diamond concentration and distribution, were selected to determine their effect on CMP performance and process stability. Experimental validations were conducted. Conditioner specifications were matched to each specific CMP environment (intended application) in order to improve process stability and CMP performance particularly for emerging technology nodes. Several conditioner designs were developed and run successfully in the field. Significant planarity improvement for a 300 mm CMP process was achieved in accordance with one embodiment, and an increase of pad life and wafer polish rate was simultaneously achieved with another embodiment. | 02-26-2009 |
20090104863 | PAD CONDITIONER FOR CHEMICAL MECHANICAL POLISHING - A pad conditioner for chemical mechanical polishing includes a dressing component for conditioning a pad and a housing for accommodating the dressing component. The housing includes at least one fluid hole surrounding the dressing component for providing at least a fluid. | 04-23-2009 |
20090215366 | Tool with Sintered Body Polishing Surface and Method of Manufacturing the Same - An efficiently processible polishing tool, particularly used for a CMP pad conditioner, capable solving problems in a fixing strength for fixing abrasive grains to a base plate and problems in nonuniform polished surface and a method of effectively manufacturing the polishing tool. The polishing tool ( | 08-27-2009 |
20090239454 | CMP CONDITIONER AND PROCESS FOR PRODUCING THE SAME - A CMP conditioner having excellent corrosion resistance around abrasive grains includes a grindstone base having, formed on one side, an abrasive grain layer including abrasive grains fixed in a metallic bonding phase treated to form a first protective layer comprising an oxide on the surface of the metallic bonding phase of the abrasive grain layer by the sol-gel method. Subsequently, an aerosol obtained by dispersing fine particles of a brittle material in a gas is jetted and caused to strike on the surface of the first protective layer to form a second protective layer comprising a thick oxide film. | 09-24-2009 |
20090264057 | DRESSER FEEDING DEVICE - A dresser supply device of a grinding tool which supplies powdery dresser to a grinding tool having an abrasive grain layer on cutting blade tips, the dresser supply device comprising: an air supply source which supplies air; a dresser supply air pipe including a base end which is connected to the air supply source; a dresser tank which holds the dresser; a dresser supply pipe which connects the dresser tank and the dresser supply air pipe to each other, is smaller in diameter than the dresser supply air pipe at a connecting portion with the dresser supply air pipe, has a first tip inserted and projecting into the dresser supply air pipe, and is located at a space from an inner peripheral surface of the dresser supply air pipe; and an opening-and-closing valve which is provided in the dresser supply air pipe between the connecting portion and the air supply source side. | 10-22-2009 |
20090275274 | Polishing Pad Conditioner - The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive grain brazing condition, and enhancement of flatness by minimizing thermal deformation of the metal support. The polishing pad conditioner is fabricated by brazing multiple abrasive grains to the surface of a metal support with brazing metal, wherein the composition of the brazing metal expressed in mass % is such that 70%≦Ni+Fe≦90% (provided that 0≦Fe/(Ni+Fe)≦0.4), 1%≦Cr≦25%, 2%≦Si+B≦15% (provided that 0≦B/(Si+B)≦0.8), and 0.1%≦P≦8%. | 11-05-2009 |
20090305618 | TRUING APPARATUS OF GRINDING WHEEL - A wheel truing apparatus adapted for use in a cylindrical grinding machine wherein a work head with a work spindle for support of a workpiece and a wheel head with a grinding wheel for grinding the workpiece are mounted on a bed for relative movement in a Z-axis direction parallel with the rotation axis of the work spindle and in an X-axis direction crossing the Z-axis direction, characterized in that the wheel truing apparatus comprises a rotary drive portion mounted on the work head or a member united therewith, and a wheel truing tool supported on the rotary drive portion for rotation therewith, the wheel truing tool being provided at its outer periphery with a truing portion for truing a grinding surface of the wheel brought into contact therewith, wherein the rotary drive portion is placed in a position adjacent to said work head in a tooling area defined by a stroke of the relative movements of said wheel head and said work head in the Z-axis direction and apart from said work spindle radially outward and is arranged in such a manner that the rotation axis line of said truing tool is oriented toward the rotation axis line of said grinding wheel in a condition where said truing portion is retained in contact with the grinding surface of said wheel, whereby the truing portion of said tool is brought into contact with the grinding surface of said wheel by relative movement of said wheel head to said work head for truing the grinding surface. | 12-10-2009 |
20090325471 | DIAMOND POLISHING DISK AND MANUFACTURING METHOD THEREOF - A diamond polishing disk and a manufacturing method thereof are described. The method includes the steps as follows. A plurality of diamond particles are disposed in an accommodation unit, and each diamond particle has at least one acute polishing end. Next, a guiding mold is supplied, in which the guiding mold has a plurality of grooves. The guiding mold is pressed on the diamond particles, such that the acute polishing ends of the diamond particles are respectively inserted in the grooves correspondingly. Next, the guiding mold is removed, and then a polymer material is injected into the accommodation unit to cover the diamond particles. The polymer material is hardened. Finally, the accommodation unit is removed, so as to finish manufacturing the diamond polishing disk. | 12-31-2009 |
20090325472 | CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER AND METHOD OF FORMING - A CMP pad conditioner including a substrate having a transparency window represented by an average internal transmittance of not less than about 90% over a wavelength range extending from about 400 nm to about 500 nm along a path length extending through the substrate of not less than about 10 mm a bonding layer overlying a surface of the substrate, and abrasive grains contained within the bonding layer. | 12-31-2009 |
20100015898 | Conditioner for Chemical Mechanical Planarization Pad - The present invention provides a conditioner for CMP pad required for global planarization of wafer to achieve high integration of a semiconductor element. The conditioner for CMP pad includes a metal substrate having abrasive particles fixed thereto, a plurality of abrasive particles fixed to the metal substrate, and a layer of metal binder fixing the abrasive particles to the metal substrate. The abrasive particles include at least one pattern. The pattern includes at least one row of abrasive particles and the abrasive particles include bigger abrasive particles and smaller abrasive particles. In addition, a diameter difference between smaller and bigger abrasive particles is 10 to 40%. The present invention ensures uniform dressing of conditioner, superior dressing efficiency and superior performance reproducibility. | 01-21-2010 |
20100056030 | MECHANISM FOR DETECTING SHAFT MOTION, AND CONDITIONER HEAD - To provide a shaft motion detection mechanism capable of detecting the displacement of a rotating body in a direction along a rotational axis and whether or not the rotating body is rotated, and a conditioner head capable of detecting the displacement of a polishing disk in a direction along a rotational axis and whether or not the polishing disk is rotated. A conditioner head | 03-04-2010 |
20100190423 | Thin Film Brazing of Superabrasive Tools - Methods for orienting superabrasive particles in a superabrasive tool are provided. In one aspect, for example, a method for orienting superabrasive particles in a tool is provided. Such a method can include providing a plurality of superabrasive particles having a preselected average size, preselecting a thickness for an amorphous braze layer to be applied to a substrate, wherein the thickness is based on the average size of the plurality of superabrasive particles, and applying an amorphous braze layer to the substrate at the preselected thickness. The method can further include dispersing the plurality of superabrasive particles onto the amorphous braze layer, and melting the amorphous braze layer to cause the plurality of superabrasive particles to rotate and sink into the amorphous braze layer, wherein the thickness of the amorphous braze layer is such that the rotation and sinking of the plurality of superabrasive particles is halted by the substrate in an attitude whereby substantially all working ends of the plurality of superabrasive particles are sharp portions. The amorphous braze layer can then be cooled to fix the plurality of superabrasive particles into the tool. | 07-29-2010 |
20100221988 | Superhard Cutters and Associated Methods - A cutting device comprises a base having a solidified organic material layer disposed thereon. A plurality of individual polycrystalline cutting elements are secured in the solidified organic material layer. Each of the plurality of individual polycrystalline cutting elements has a substantially matching geometric configuration. | 09-02-2010 |
20100261419 | Superabrasive Tool Having Surface Modified Superabrasive Particles and Associated Methods - Superabrasive tools and associated methods of making and using are provided. In one aspect, for example, a superabrasive tool having improved superabrasive particle retention is provided. Such a tool can include a matrix layer and a plurality of superabrasive particles held in and protruding from the matrix layer, whereby surfaces of the plurality of superabrasive particles contacting the matrix layer have been roughened to have an RA of greater than about 1 micron, and wherein the roughened surfaces improve the retention of the plurality of superabrasive particles in the matrix layer. | 10-14-2010 |
20100291844 | DRESSER FOR ABRASIVE CLOTH - The invention provides a dresser for an abrasive cloth, which has a smaller abrasive grain diameter than the conventional dresser and has an abrasive grain spacing regulated in a predetermined range depending upon the abrasive grain diameter to simultaneously meet a high level of pad grinding power and a pad flatness and, at the same time, is less likely to cause dropout of abrasive grains. The dresser comprises a plurality of abrasive grains fixed as a single layer on a surface of a metallic support material. The dresser is characterized in that the metallic support material on its surface on which the abrasive grains are fixed has a convex shape, the difference in height between the end part and the central port on the surface is not less than 3 μm and not more than 40 μm, and the center-to-center spacing between at least one set of adjacent grains is d≦L<2d wherein d represents the diameter of the abrasive grains; L represents the center-to-center spacing between adjacent abrasive grains. The diameter (d) of the abrasive grains is preferably 3 μm≦d<100 μm. | 11-18-2010 |
20110081848 | GRINDING TOOL AND METHOD OF MANUFACTURING THE GRINDING TOOL - A manufacturing method for grinding tool includes following steps. Step 1 is providing a substrate. Step 2 is fixing diamond or abrasive grit in a predetermined position or base by DIAMAP (Diamond Implant Array Mapping & Arrangement Process). The last step is providing a second fixing layer onto the first fixing base and the exposed surface of the substrate. The first fixing base and the second fixing layer are used for fixing the abrasive grits on the substrate. Moreover, a grinding tool is provided in the present invention. | 04-07-2011 |
20110151756 | FULL PROFILE DRESSING ROLL FOR DRESSING MULTI-START CYLINDRICAL GRINDING WORMS - Full profile dressing roll ( | 06-23-2011 |
20110250826 | PAD CONDITIONER HAVING REDUCED FRICTION AND METHOD OF MANUFACTURING THE SAME - This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a structure able to reduce friction with a pad so as to solve the problems caused by a lot of friction being generated upon conditioning, and to a method of manufacturing the same. | 10-13-2011 |
20120071068 | POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING APPARATUS - This disclosure relates to a polishing pad for chemical mechanical polishing, having a shape where 3 or more semi-oval or semicircular curves that connect 2 valleys neighboring on the plane are connected, and including 2 or more modified patterns that are formed to a determined thickness on the polishing pad, wherein a peak of one modified pattern and a valley of another modified pattern neighboring thereto are sequentially located on the same line. The polishing pad may uniformly disperse slurry over the whole area during a polishing process to provide improved polishing uniformity, and appropriately control residence time of the slurry to increase polishing rate. | 03-22-2012 |
20120108153 | ROTARY DRESSER - A rotary dresser is provided with a roll having an outer circumferential surface which includes an arc portion or inclined portion differing in diameter in dependence on the axial position thereof, and a plurality of diamond abrasive grains embedded on the outer circumferential surface of the roll. The number of the diamond abrasive grains in the circumferential direction is fixed even at any axial position on the outer circumferential surface of the roll. | 05-03-2012 |
20120115402 | CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER AND METHODS OF FORMING THEREOF - A CMP pad conditioner is provided that includes a substrate having a surface and three dimensional structures protruding relative to the surface of the substrate. The three dimensional structures include CVD carbon-containing material selected from the group consisting of carbon nanotubes and diamond, and may be arranged in a ordered array or desired pattern. The CMP pad conditioner also includes a bonding layer overlying the three dimensional structures and the surface of the substrate. The condition may include a reinforcing layer disposed within gaps between the three dimensional structures. Techniques for manufacture and use are also disclosed. | 05-10-2012 |
20120115403 | PAD CONDITIONER HEAD FOR CONDITIONING A POLISHING PAD - The pad conditioner head for conditioning a polishing pad comprises a bearing seat, a spindle, a protective cover, an annular pressure plate, a self-adaptive platen, a diamond disk and a flexible ring. A flange is mounted on the lower end of the spindle. A press ring is mounted onto a lower surface of the flange. The flexible ring has an upper edge sandwiched between the flange and the press ring and a lower edge sandwiched between the protective cover and the annular pressure plate. The flexible ring, the flange, the annular pressure plate and the self-adaptive platen define a sealed chamber (M). The protective cover, the annular pressure plate, the self-adaptive platen and the diamond disk are rotatable along with the spindle through the flexible ring and movable in an up and down direction relative to the spindle via a deformation of the flexible ring. | 05-10-2012 |
20120149287 | CHEMICAL MECHANICAL PLANARIZATION (CMP) PAD CONDITIONER AND METHOD OF MAKING - A method of forming a chemical mechanical planarization (CMP) pad conditioner includes placing abrasive grains on a major surface of a substrate, forming a binding composition at an exterior surface of the abrasive grains, and depositing a bonding layer over the surface of the substrate and a portion of the abrasive grains to secure the abrasive grains to the major surface of the substrate. | 06-14-2012 |
20120220204 | CLEANING DEVICE FOR GRINDING PLATE - A cleaning device is used for cleaning scrap blocking a spiral slot of a grinding plate. The cleaning device includes a base, a sliding device, and at least one blade. The base includes two sliding poles. The sliding device slidably sleeves on the two sliding poles. The at least one blade is fixed on the sliding device, and resists on a bottom surface of the spiral slot. When the grinding plate rotates, the at least one blade can slide in the spiral slot. | 08-30-2012 |
20120220205 | Chemical Mechanical Polishing Conditioner - A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern. | 08-30-2012 |
20120244790 | Superabrasive Tools Having Substantially Leveled Particle Tips and Associated Methods - Superabrasive tools and methods for making and using the same are provided. In one aspect, for example, a CMP pad dresser includes a first monolayer of superabrasive particles disposed on and coupled to one side of a metal support layer and a second monolayer of superabrasive particles disposed on and coupled to the metal support layer on an opposite side from the first monolayer. The superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer. | 09-27-2012 |
20120244791 | Rotary Dressing Tool Containing Brazed Diamond Layer - A disc-shaped, rotary dressing tool has a rigid core and an abrasive rim around at least one surface of the periphery of the rigid core. The rigid core and the abrasive rim are oriented in a direction orthogonal to the axis of rotation of the tool. In an embodiment, the abrasive rim comprises an abrasive component bonded to the rigid core by means of an active braze. The abrasive component can be diamond grains arranged in a single layer or diamond film inserts. In a particular embodiment, the abrasive component can comprise a plurality of abrasive inserts mechanically fastened to the rigid core. In another embodiment, the abrasive rim can comprise strips of an abrasive component with each strip being filled into slots machined into and through the perimeter of the core. | 09-27-2012 |
20120289133 | CHEMICAL MECHANICAL POLISHING SYSTEM - A chemical mechanical polishing (CMP) system includes a wafer polishing unit producing a used slurry; a slurry treatment system for receiving and treating the used slurry to thereby produce an extracted basic solution; and a post-CMP cleaning unit utilizing the extracted basic solution to wash a polished wafer surface. The post-CMP cleaning unit includes a plurality of rollers for supporting and rotating a wafer, a brush for scrubbing the wafer, and a spray bar disposed in proximity to the brush for spraying the extracted basic solution onto the polished wafer surface. | 11-15-2012 |
20120302146 | CMP PAD DRESSER HAVING LEVELED TIPS AND ASSOCIATED METHODS - CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a matrix layer and a monolayer of a plurality of superabrasive particles embedded in the matrix layer, where each superabrasive particle in the monolayer protrudes from the matrix layer. The difference in the protrusion distance between the highest protruding tip and the next highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 20 microns, and the difference in protrusion distance between the highest 1% of the protruding tips of the monolayer of superabrasive particles are within about 80 microns or less. | 11-29-2012 |
20130078895 | ABRASIVE TOOL FOR USE AS A CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER - An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate. | 03-28-2013 |
20130171917 | ARC BLADE-SHAPED PROCESSING SURFACE STRUCTURE OF PAD CONDITIONER AND MANUFACTURING MOLD STRUCTURE THEREOF - An arc blade-shaped processing surface structure of a pad conditioner includes an outer frame, a combining layer and a plurality of polishing particles. The polishing particles are disposed on a surface of the combining layer, and the combining layer has a first region and a second region sequentially arrange from the center to the outside of the combining layer, and the second region has a plurality of arc-shaped protrusions arranged separately from one another and disposed around the external periphery of the first region, and the protrusions arranged in order and separated with an interval apart from each other can be used to provide an appropriate space for extension and rebound for a polished surface material to obtain a definite and uniform polishing effect. | 07-04-2013 |
20130225052 | "CMP PAD CONDITIONER AND METHOD FOR MANUFACTURING THE SAME" - Provided is a chemical mechanical polishing pad conditioner including a substrate including a plurality of protrusions formed on at least one surface thereof and made of ceramic or hard metal alloy. The plurality of protrusions may be formed through laser processing so as not to have angled edges on an upper end and an inclined side thereof. The chemical mechanical polishing pad conditioner further includes a diamond thin film deposited so as to cover the plurality of protrusions, wherein the diamond thin film includes a rough polishing surface on which micro protrusions having a size of several μm are formed. | 08-29-2013 |
20130244552 | MANUFACTURE AND METHOD OF MAKING THE SAME - A manufacture includes a substrate, a reinforcement layer over the substrate, and abrasive particles over the substrate. The abrasive particles are partially buried in the reinforcement layer. Upper tips of the abrasive particles are substantially coplanar. | 09-19-2013 |
20130267154 | DIAMOND TOOLS AND METHODS FOR MAKING THE SAME - Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material. | 10-10-2013 |
20130273820 | BRAZED DIAMOND TOOLS AND METHODS FOR MAKING THE SAME - Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material. | 10-17-2013 |
20130288582 | METHOD OF FORMING DIAMOND CONDITIONERS FOR CMP PROCESS - A method for making a conditioner disk used in a chemical mechanical polishing (CMP) process comprises applying a first layer of at least one binder over a substrate; disposing a plurality of diamond particles on the first layer of the at least one first binder at the plurality of locations; and fixing the plurality of diamond particles to the substrate by heating the substrate to a raised temperature and then cooling the substrate. The plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk is used in a CMP process. | 10-31-2013 |
20130316629 | CMP PAD DRESSER WITH ORIENTED PARTICLES AND ASSOCIATED METHODS - CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear. | 11-28-2013 |
20130316630 | TOOL FOR USE WITH DUAL-SIDED CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER - A tool includes a holder configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner. The holder has a magnetic material, a first magnetic field strength (H | 11-28-2013 |
20130344779 | CONDITIONER FOR SOFT PAD AND METHOD FOR MANUFACTURING SAME - The present invention relates to a conditioner for a chemical-mechanical planarization (CMP) pad, which is used in a CMP process that is part of a semiconductor element manufacturing process, and more particularly, to a conditioner for a soft pad, and a method of manufacturing the same, wherein the conditioner can be used under CMP conditions using a slurry having a small amount of polishing particles, and/or a porous pad having comparatively low hardness and very high porosity. | 12-26-2013 |
20140094101 | CMP PAD CONDITIONER, AND METHOD FOR PRODUCING THE CMP PAD CONDITIONER - This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same. | 04-03-2014 |
20140113532 | CHEMICAL MECHANICAL PLANARIZATION CONDITIONER - A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a matrixical arrangement of protrusions that have a layer of poly crystalline diamond on at least their top surfaces. The protrusions may have varying shapes and elevations and may comprise a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface. | 04-24-2014 |
20140113533 | DAMPER FOR POLISHING PAD CONDITIONER - A conditioner apparatus for use in substrate polishing includes a conditioner head constructed to receive an end effector for conditioning a surface of a polishing pad, an arm that supports the conditioner head, a base that supports the arm, and a damper system secured to the base. The base includes an actuator connected to the arm to move the arm and the conditioner head laterally over the polishing pad. The damper system is configured to reduce vibration of the arm. | 04-24-2014 |
20140127983 | CHEMICAL MECHANICAL POLISHING CONDITIONER AND MANUFACTURING METHODS THEREOF - The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner. | 05-08-2014 |
20140154960 | CMP PAD CONDITIONER - The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns. | 06-05-2014 |
20140170942 | METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SIDE GRINDING APPARATUS - A trimming apparatus for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpiece includes a trimming disk, a plurality of trimming bodies and an outer toothing, where the trimming bodies are configured to release abrasive substances upon contract with the working layers so as to effect material removal from the working layers. At least 80% of the area of the trimming bodies configured to come into contact with the working layers is arranged within a ring-shaped region on the trimming disk. The width of the ring-shaped region is between 1-25% of the diameters of the trimming disk and the area of the trimming bodies which comes into contact with the working layers occupies 20-90% of the total area of the ring-shaped region. | 06-19-2014 |
20140179204 | DRESSER - A dresser includes an attachment secured to a dresser shaft for rotating the dresser, a disk holder removably attached to the attachment by a magnetic force, and a dresser disk removably attached to the disk holder. The dresser disk has a dressing surface. Each of the attachment and the disk holder has magnet for generating the magnetic force. | 06-26-2014 |
20140256236 | PAD CONDITIONING TOOL AND METHOD OF MANUFACTURING THE SAME - A pad conditioning tool includes a sapphire chip having a side surface defining a polishing surface and a plurality of sapphire grains formed on the polishing surface in an integral manner. Each of the sapphire grains had a three-dimensional geometric structure. The sapphire grains are arranged on the polishing surface in a specific form so as to possess a specific pattern. | 09-11-2014 |
20140273772 | CHEMICAL MECHANICAL POLISHING CONDITIONER AND MANUFACTURING METHODS THEREOF - The present invention relates to a chemical mechanical polishing conditioner and manufacturing methods thereof. The chemical mechanical polishing conditioner comprises: a planar substrate having a leveling surface; a bonding layer disposed on the surface of the planar substrate; and a plurality of abrasive particles embedded in the surface of the bonding layer and fixed to the surface of the planar substrate by the binding layer; wherein the planar substrate is formed by a deformation compensation for the non-planar substrate during curing the binding layer, and thus the tips of the abrasive particles have a leveled height. Therefore, the present invention can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and thereby enhancing the surface flatness of chemical mechanical polishing conditioner. | 09-18-2014 |
20140273773 | SEGMENT-TYPE CHEMICAL MECHANICAL POLISHING CONDITIONER AND METHOD FOR MANUFACTURING THEREOF - The present invention relates to a segment-type chemical mechanical polishing conditioner and a method for manufacturing thereof. The segment-type chemical mechanical polishing conditioner comprises: a bottom substrate having a center protrusion; an abrasive unit binding layer disposed on the outside of the surface of the bottom substrate; and a plurality of abrasive units placed on the abrasive unit binding layer; wherein the abrasive units have a fan-shaped contour and are arrange along the center protrusion of the bottom substrate to form a discontinuous circular contour. Therefore, the present invention can utilize the center protrusion of the bottom substrate to adjust the arrangements of the abrasive units, and effectively improve the problem of thermal deformation of the surface of the chemical mechanical polishing conditioner during heat-hardening process, thereby enhancing the surface flatness of chemical mechanical polishing conditioner. | 09-18-2014 |
20140302756 | CHEMICAL MECHANICAL POLISHING CONDITIONER - The present invention (utility model application in Taiwan) relates to a chemical mechanical polishing pad dresser, comprising: a substrate; a bonding layer disposed on the substrate; an electroplating layer disposed on the bonding layer; a fixed template disposed on the electroplating layer having a plurality of apertures; and a plurality of abrasive particles corresponding to and set in the apertures, wherein the plurality of abrasive particle fixed in the bonding layer and the substrate by means of the electroplating layer. Therefore, the present invention is not only to avoid damaging the abrasive particles due to the high temperature heating in the production process, but also to solve the corrosion problem of the surface of the chemical mechanical polishing pad dresser by the fixed template and the electroplating layer and to solve simultaneously the pollution problem generating on the polished workpieces by using conventional brazing bonding layer; and, the present invention can also provide to adjust the abrasive particles arrangement and protrude rate through the fixed template, so as to enhance the grinding performance and quality of the chemical mechanical polishing pad dresser. | 10-09-2014 |
20140302757 | ROTARY DRESSER AND MANUFACTURING METHOD THEREFOR - A rotary dresser includes a cored bar, an electroformed layer, and superabrasive grains fixed to an outer circumferential surface of the electroformed layer, and a plurality of island regions in which a plurality of superabrasive grains is gathered is provided at certain intervals. Since a plurality of the island regions in which a plurality of the superabrasive grains is gathered is provided at certain intervals, the same degree of dressing accuracy can be obtained as in a case in which expensive large superabrasive grains are fixed at a low density using cheap and small superabrasive grains, it is possible to decrease the contact area of a single superabrasive grain, and favorable cutting quality can be obtained. | 10-09-2014 |
20140308883 | CHEMICAL MECHANICAL POLISHING CONDITIONER - The present invention relates to a chemical mechanical polishing conditioner which comprises: a substrate; a bonding layer, disposed on the substrate; and an abrasive layer, having a thin metal sheet and a first layer of abrasive particles, wherein the first layer of abrasive particles is disposed on the thin metal sheet, and the abrasive layer is coupled to the substrate with the bonding layer; wherein the first layer of abrasive particles comprises a plurality of abrasive particles, of which protruding tips has a planar leveling surface, so that the plurality of abrasive particles do not have one or more protruding tips of the plurality of abrasive particles having particular significant difference in protrusion distance, and the plurality of abrasive particles have a patterning arrangement. Therefore, the present invention can reduce damage ratio of polished workpieces by a planar leveling surface of the chemical mechanical polishing conditioner, so that the chemical mechanical polishing conditioner has more excellent polishing efficiency and working life. | 10-16-2014 |
20140357167 | DRESSING METHOD FOR DRUM-SHAPED GEAR-LIKE GRINDSTONE, AND DISK DRESSER - A disk dresser and a dressing method enable high-precision dressing of a drum-shaped gear-like grindstone and shaping of the cutting teeth of the grindstone without changing the shape of the cutting teeth of the disk dresser. A drum-shaped gear-like grindstone is brought into linear contact with a workpiece so as to link with the contours of the tooth right angle cross-section orthogonal to the twist direction of the workpiece teeth. The grindstone and a disk dresser, in an engaged state, are caused to rotate synchronously, thereby causing the drum-shaped grindstone to be dressed by the disk dresser. The disk dresser blade shape is made to match the tooth right angle cross-section shape of the teeth of the ground workpiece. The grindstone and the disk dresser are caused to move and revolve in accordance with the drum shape and the angle of twist of the grindstone. | 12-04-2014 |
20150044950 | PAD CONDITIONING TOOL HAVING SAPPHIRE DRESSING PARTICLES - A pad conditioning tool includes a sapphire substrate with a specific orientation plane, wherein the specific orientation plane is selected from a group consisting of a-plane, c-plane, r-plane, m-plane, n-plane and v-plane, the sapphire substrate further defining a mounting surface; and a plurality of sapphire dressing particles and a plurality of scrapers formed on the mounting surface of the substrate in a predetermined geometric arrangement, wherein the dressing particles are scattered between an adjacent pair of the scrapers. In case a wafer polishing pad is conditioned by the pad conditioning tool, the dressing particles are capable of removing abrasive waste and particles from the wafer polishing pad during a dressing operation, thereby forming new trenches and cilia structure on a polishing surface of the wafer polishing pad. | 02-12-2015 |
20150050871 | Chemical Mechanical Polishing Conditioner Made From Woven Preform - The present invention relates to a chemical mechanical polishing conditioner made from a woven preform, comprising: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the bonding layer and fixed on the substrate by the bonding layer; wherein the bonding layer is formed by heat-curing a woven preform, and the abrasive particles are fixed to the woven preform in advance. Therefore, the present invention can provide the bonding layer with a better flexibility by the woven preform, and solve the conventional problem of resin residue in a powder-form bonding layer, or thermal cracking or thermal deformation of a sheet-form bonding layer during the heating and curing process, and thus improve the polishing performance and service time of the chemical mechanical polishing conditioner. | 02-19-2015 |
20150065019 | DRESSING DEVICE, CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME, AND DRESSER DISC USED IN THE SAME - A dressing device capable of remedying wobbly rotation of a dresser disc, a CMP apparatus, and a dresser disc. The dressing device is capable of dressing a polishing pad and includes a holder which can be coupled to a dresser driving shaft capable of rotating and moving upward and downward, a dresser disc which can be mounted to the holder and has a dressing surface to be rubbed against a polishing pad, a set of concave and convex torque transmitting sections extending in a disc radial direction which are formed at the holder and the dresser disc and fit together when the dresser disc is mounted to the holder, and a set of contact surfaces in the shapes of flat surfaces which are formed as one surfaces around the set of torque transmitting sections and come into surface-to-surface contact at the time of transmitting torque of the dresser driving shaft. | 03-05-2015 |
20150072601 | Superabrasive tools having substantially leveled particle tips and associated methods - Superabrasive tools and methods for making and using the same are provided. In one aspect, for example, a CMP pad dresser includes a first monolayer of superabrasive particles disposed on and coupled to one side of a metal support layer and a second monolayer of superabrasive particles disposed on and coupled to the metal support layer on an opposite side from the first monolayer. The superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer. | 03-12-2015 |
20150087212 | CMP CONDITIONER PADS WITH SUPERABRASIVE GRIT ENHANCEMENT - A pad conditioner for a CMP polishing pad. The pad conditioner includes a features having textured or roughened surfaces, with superabrasive grit seeds such as diamond interspersed on the roughened surface. A coating such as polycrystalline diamond can be applied over the surfaces and the grit seeds. In one embodiment, the coating has a thickness that is in the range of 50% to 100% of the larger superabrasive grit. | 03-26-2015 |
20150290768 | CHEMICAL MECHANICAL POLISHING CONDITIONER CAPABLE OF CONTROLLING POLISHING DEPTH - Provided is a chemical mechanical polishing conditioner capable of controlling a polishing depth. The CMP conditioner capable of controlling the polishing depth comprises a substrate; a binding layer disposed on the substrate; multiple abrasive units placed on the binding layer; and multiple abrasive terminal units placed on the binding layer. Each abrasive unit has an abrasive unit substrate and an abrasive layer, and the abrasive layer is a diamond film formed by chemical vapor deposition and has multiple abrasive tips. The abrasive tips of the abrasive units are relatively higher than surfaces of the abrasive terminal units to form a protrusion height. Accordingly, the CMP conditioner controls the polishing depth of an article to be conditioned. | 10-15-2015 |
20150306734 | CMP PAD DRESSER HAVING LEVELED TIPS AND ASSOCIATED METHODS - CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a matrix layer and a monolayer of a plurality of superabrasive particles embedded in the matrix layer, where each superabrasive particle in the monolayer protrudes from the matrix layer. The difference in the protrusion distance between the highest protruding tip and the next highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 20 microns, and the difference in protrusion distance between the highest 1% of the protruding tips of the monolayer of superabrasive particles are within about 80 microns or less. | 10-29-2015 |
20150367480 | CHEMICAL MECHANICAL POLISHING CONDITIONER - Provided is a CMP conditioner comprising: a substrate comprising multiple concave parts, the concave parts formed in a surface of the substrate and each concave part having a side wall; multiple fixed plates, each fixed plate comprising a bottom, a top, a concavity and an inclined plane, the bottom fixed into the concave part, the top integrated with the bottom with a contact surface formed between the top and the bottom, the concavity formed in the top and opposite the bottom, the inclined plane formed between the contact surface and the concavity, an angle and a space formed between the inclined plane and the side wall; and multiple abrasive units, each abrasive unit mounted in the concavity. When the CMP conditioner is applied to a pad, the thickness of the pad can recover to its original thickness; i.e., the cutting depth is increased to improve the dressing performance. | 12-24-2015 |
20160074993 | CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER - A pad conditioner for a CMP polishing pad is disclosed that includes a substrate that has a matrixical arrangement of protrusions that have a layer of poly crystalline diamond on at least their top surfaces. The protrusions may have varying shapes and elevations and may comprise a first set of protrusions and a second set of protrusions, the first set of protrusions have a first average height and the second set of protrusions have a second average height, the first average height different from the second average height, a top of each protrusion in the first set of protrusions has a non-flat surface and a top of each protrusion in the second set of protrusions has a non-flat surface. | 03-17-2016 |
20160074995 | CHEMICAL MECHANICAL POLISHING CONDITIONER WITH BRUSHES - Provided is a CMP conditioner with brushes comprising: a substrate comprising a surface, multiple concave parts formed in the surface; multiple abrasive assemblies, each abrasive assembly comprising a metal bar and an abrasive particle, the metal bar comprising a connecting end and a dressing end, the abrasive particle mounted in the dressing end of the metal bar and protruding a tip, wherein vertical distances between the tips and a level of the surface are equal; and multiple brushes mounted in the surface, wherein ends of the brushes are higher than the tips, vertical distances between the ends of the brushes and a level of the tips ranging from 0.1 mm to 1 mm. The present invention, with precise control of the vertical distance between the tips and the level of the surface, and of the vertical distance between the ends of the brushes and a level of the tips improves the cleaning ability of the CMP conditioner with brushes for the scraps in holes of the surface of a pad and avoid problems, e.g., scraps in some holes cannot be effectively removed. | 03-17-2016 |
20160114460 | METHOD OF FORMING DIAMOND CONDITIONERS FOR CMP PROCESS - A method for making a conditioner disk used in a chemical mechanical polishing (CMP) process comprises applying a first layer of at least one binder over a substrate; disposing a plurality of diamond particles on the first layer of the at least one first binder at the plurality of locations; and fixing the plurality of diamond particles to the substrate by heating the substrate to a raised temperature and then cooling the substrate. The plurality of diamond particles disposed over the substrate are configured to provide a working diamond ratio higher than 50% when the conditioner disk is used in a CMP process. | 04-28-2016 |
20160121454 | CMP PAD CONDITIONER AND METHOD FOR MANUFACTURING THE SAME - Provided is a chemical mechanical polishing (CMP) pad conditioner including a substrate including a plurality of protrusions formed on at least one surface thereof and made of ceramic or hard metal alloy. The plurality of protrusions may be formed through laser processing so as not to have angled edges on an upper end and an inclined side thereof. The chemical mechanical polishing pad conditioner further includes a diamond thin film deposited so as to cover the plurality of protrusions, wherein the diamond thin film includes a rough polishing surface on which micro protrusions having a size of several μm are formed. | 05-05-2016 |
20160176017 | Grinding Tool and Method of Manufacturing the Same | 06-23-2016 |
20170232577 | COMPOSITE CONDITIONER AND ASSOCIATED METHODS | 08-17-2017 |