Class / Patent application number | Description | Number of patent applications / Date published |
451282000 | Work guide | 9 |
20080280548 | ICE SKATE BLADE SHARPENING MACHINE - A ice skate blade sharpening machine comprises a skate holder which holds the blade in a releasably fixed position, a rotatable grinding wheel having a periphery and rotatable about a grinding wheel axis, and a contouring tool having a contour surface, moveable between an engaged position and a disengaged position, wherein in the engaged position the contouring tool is held in place with respect to the grinding wheel axis, the contour surface engages the rotating grinding wheel and grinds the periphery of the grinding wheel to define a grinding wheel contour, and wherein the grinding wheel contour grinds the blade to define a profile when the grinding wheel is rotating and the blade is held in the releasably fixed position. | 11-13-2008 |
20080305724 | Surface grinding machine, spindle device and surface grinding method - In through-feed grinding workpieces by grinding stones rotating around the axes of spindles, the spindles are tiltably held by elastic holding means around tilt axes substantially orthogonal to the direction of exit and entrance of the workpieces with respect to the grinding stones. When a grinding loads are imposed on the entrance sides of the grinding stones, the spindles are tilted by offset loads around the tilt axes against the force of urging means in such a manner that the axial displacement and the exit displacement of the grinding stone due to the offset load are substantially the same. The grinding stones are reset around the tilt axes by the elastic holding means immediately before the end of processing at which time the axial displacement is smaller. This makes it possible to reduce the number of defectively ground articles coming from the through-feed grinding and reduce the wear in the grinding stones. | 12-11-2008 |
20090011689 | GRINDING MACHINE - In a grinding machine with a grinding means for machining a workpiece surface which can be moved in a direction of conveyance relative to the grinding means and is arranged in a machining plane, wherein the grinding means has a large number of grinding heads with grinding elements ( | 01-08-2009 |
20100330888 | GLASS-PLATE WORKING MACHINE - A glass-plate working machine | 12-30-2010 |
20130267153 | GRINDING MACHINE - The grinding machine ( | 10-10-2013 |
20140024299 | Polishing Pad and Multi-Head Polishing System - A chemical mechanical polishing system includes a polishing pad, a platen to support the polishing pad, and two rotatable carrier heads configured to hold two substrates against the polishing pad at the same time. Each carrier head includes a retaining ring. Two actuators sweep the two carrier heads laterally across the polishing pad between positions closer to and farther from the center axis. A polishing surface of the polishing pad includes a center region with a first grooving pattern and an annular region with a second grooving pattern different than the first grooving pattern. A radius of the center region is equal to or less than a distance from a center axis of the platen to a closest outer edge of the two retaining rings when the carrier heads are in the closer positions. | 01-23-2014 |
20140024300 | CUTTING TOOL SHARPENER - A tool sharpening assembly suitable for sharpening cutting tools. In accordance with some embodiments, the apparatus has a rotatable abrasive surface, and a tool support structure which contactingly supports a body portion of a tool while a cutting surface of the tool is presented against the abrasive surface during a sharpening operation. A cooling mechanism operates to reduce a temperature of the tool. | 01-23-2014 |
20140329446 | POLISHING APPARATUS - A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position. | 11-06-2014 |
20150147945 | Adaptable Abrasive Cutting Assembly for Sharpener - An electric sharpener having a pair of abrasive wheel assemblies including energy absorbing hubs mounted a powered drive shaft and further integral flexible radially extending arms affixed to respective outer abrasive rings. A pair of disk abrasives assemblies are also affixed to the powered rotatable shaft and include a pair of flexible metal disks operatively connected to a hub attached to the rotatable shaft. | 05-28-2015 |