Class / Patent application number | Description | Number of patent applications / Date published |
451262000 | Opposed abrading tools | 14 |
20080227371 | Double-side polishing apparatus - The double-side polishing apparatus for polishing both faces of a wafer is capable of reliably measuring not only a thickness of an outer part of the wafer but also a thickness of a center part thereof. The double-side polishing apparatus comprises: a lower polishing plate; an upper polishing plate held by a frame; and a carrier having a through-hole for holding the wafer. A window section, through which a laser beam passes, is formed in a part of the upper polishing plate, under which the wafer held by the carrier passes. An optical thickness measuring equipment is provided to a part of the frame, under which the window section passes while the upper polishing plate is rotated. The thickness measuring equipment emits the laser beam through the window section, receives reflected beams reflected from an upper face and a lower face of the wafer, and calculates the thickness of the wafer on the basis of peak values of the reflected beams. | 09-18-2008 |
20090081931 | BLADE DRESSING TOOL - A dressing device for sharpening or conditioning of a blade or the like includes one or more disk pairs each having a pair of disks respectively presenting a plurality of ribs. The disks are oriented in face-to-face relationship with the ribs thereof in meshed, intercalated relationship to thereby create circumferential dressing openings. The ribs are configured to create sharpened edge on a knife blade or the like. | 03-26-2009 |
20090124181 | KNIFE BLADE DRESSING APPARATUS - A dressing device for sharpening or conditioning of a blade or the like includes one or more disk pairs each having a pair of disks respectively presenting a plurality of ribs. The disks are oriented in face-to-face relationship with the ribs thereof in meshed, intercalated relationship to thereby create circumferential dressing openings. The ribs are configured to create sharpened edge on a knife blade or the like. | 05-14-2009 |
20100130111 | DOUBLE SIDE POLISHING METHOD AND APPARATUS - To provide a technique for rotating a plurality of carriers | 05-27-2010 |
20100221987 | Double Side Polishing Machine - The present invention is to provide a double side polishing machine which can apply a load by the upper lapping plate uniformly to works and the deflection of the upper lapping plate is restrained, which comprises a rotatable lower lapping plate, a rotatable upper lapping plate and movable to the lower lapping plate by an elevation mechanism, carriers which are put between the lower lapping plate and the upper lapping plate and in which a plurality of works are mounted, and a rotation and revolution mechanism for rotating and revolving the carriers between the lower lapping plate and the upper lapping plate, wherein a supporting plate for upper lapping plate which suspends the upper lapping plate is connected to an upper portion of a coupling mechanism provided oscillatably on a vertically movable supporting rod of the elevation mechanism, and an oscillation fulcrum of the coupling mechanism is located at approximately same height to a polishing surface of the upper polishing plate. | 09-02-2010 |
20120329373 | DOUBLE-SIDE POLISHING APPARATUS - A double-side polishing apparatus including at least: upper and lower turn tables each having a polishing pad attached thereto; a carrier having a holding hole formed therein for holding a wafer between the upper and lower turn tables; a sensor for detecting a thickness of the wafer during polishing, the sensor being disposed in a through-hole provided at the upper turn table in a direction of an upper-turn-table rotation axis; and a sensor holder for holding the sensor, wherein a material of the sensor holder is quartz. As a result, there is provided a double-side polishing apparatus that can polish a wafer while the difference from the target wafer thickness is reduced by surely inhibiting deformation of the sensor holder due to the influence of heat generated during the polishing of the wafer. | 12-27-2012 |
20150380255 | WAFER POLISHING APPARATUS AND METHOD - Disclosed is a wafer processing apparatus. The wafer processing apparatus includes a first surface plate on which a plurality of carriers is arranged, a first gear arranged at the central region of the first surface plate and engaged with the plurality of carriers, a second gear arranged around the edge region of the first surface plate and engaged with the plurality of carriers, a motor rotating the first surface plate in a first direction, a fixing hanger arranged opposite the first surface plate, and a second surface plate hung on the fixing hanger such that a clearance between the first surface plate and the second surface plate may be varied. | 12-31-2015 |
451264000 | Reciprocating work holder | 1 |
451266000 | Rocking | 1 |
20080274678 | Grinding machine and a grinding jig therefore - A grinding jig for use in the grinding of a straight edge woodworking tool on the peripheral surface of a rotating grindstone in a grinding machine. The grinding machine has a cylindrical support bar parallel with the rotation axis of the grindstone. The jig includes a base, which is parallel with the support bar and is intended for slidable and rotational mounting on the support bar, and a clamp, wherein the tool is attached between the base and the clamp. The grinding jig has a support surface on the base for supporting the face of the tool opposite its bevel. | 11-06-2008 |
451267000 | Work guide | 2 |
20090298400 | Bowling Ball Surface Treatment Apparatus - A bowling ball surface treatment apparatus is designed to uniformly abrade and polish a bowling ball. The apparatus includes a housing and a ball movement guider provided inside the housing for guiding movement of a bowling ball and confining the bowling ball within a limited surface treatment area, and a surface treatment disc arranged below the ball movement guider for supporting, rotating and revolving the bowling ball. The surface treatment disc has a disc shaft and a surface treatment element for abrading or polishing the bowling ball. The apparatus further includes a disc rotating device for rotating the surface treatment disc about a disc center axis and a disc revolving device for rotatably holding the disc shaft of the surface treatment disc and for causing the surface treatment disc to make revolving movement around a sun axis offset from the disc center axis. | 12-03-2009 |
20110300785 | Apparatus for Double-Sided, Grinding Machining of Flat Workpieces - The invention relates to an apparatus for the double-sided, grinding machining of flat workpieces with an upper and a lower work disk, each of which has a work surface with a grinding layer, wherein the work surfaces form a work gap amongst themselves, in which workpieces can be ground, wherein at least one of the work disks is rotatably drivable by means of a driving mechanism, and further having a device for guiding the workpieces in the work gap. It is provided according to the invention that debarring means are arranged on at least one of the work disks, which are designed to deburr the workpieces during their machining in the apparatus. | 12-08-2011 |
451268000 | Work rotating | 4 |
451269000 | Rotary work holder | 4 |
20090098811 | Surface grinder for ball of ball valve - A surface grinder for a ball of a ball valve comprises a ball positioning device at an X axis for driving the ball to rotate about the X axis and a grinding device at a Z axis for driving a grindstone set to rotate about the Z axis, wherein the grindstone set grinds a spherical surface of the ball. | 04-16-2009 |
20090209180 | Device for machining, in particular eroding and grinding, rotational work-pieces provided with cutting edges - The invention relates to a device ( | 08-20-2009 |
20090275270 | Brake Disk Braking Surface Processing Device - The present invention provides enhancement of processing accuracy of a braking surface of a brake disk. A brake disk braking surface processing device | 11-05-2009 |
20150352684 | PLATE AND DUAL SIDE WAFER GRINDING DEVICE INCLUDING SAME - An embodiment of the present invention provides a surface plate provided at a wafer double-side grinding device for grinding a wafer. The surface plate includes a plurality of first surface plate grooves formed in a first direction, and a plurality of second surface plate grooves formed in a second direction different from the first direction. The first surface plate grooves and the second surface plate grooves have first and second surface plate groove portions arranged therein, the first and second surface plate groove portions having steps formed in a direction toward the center or an outer periphery of a lower surface plate. | 12-10-2015 |