Entries |
Document | Title | Date |
20080207095 | APPARATUS FOR PROCESSING WAFER - An apparatus for processing wafer is provided, in which a re-adhesion of the slurry to the wafer edge, which has been adhered to the elastic abrasion member, can be inhibited, since a stronger contact of the rotating elastic abrasion member with the wafer edge, which is occurred when the rotating elastic abrasion member enters to the surface of the wafer, is avoided, and further, an abrasion of the elastic abrasion member can be inhibited. The apparatus for processing wafer is an apparatus for processing wafers, wherein a shaft center of the mechanism for rotating the wafer is inclined relative to a shaft center of the abrading-rotating mechanism, so that a distance between the support member and the wafer in a position where the elastic abrasion member enters the inner side of the surface of the wafer from the outer side thereof due to the actuation toward the predetermined direction by the abrading-rotating mechanism is larger than the distance between the support member and the wafer in a position where the elastic abrasion member escapes from the inner side of the surface of the wafer to the outer side thereof. | 08-28-2008 |
20080268756 | GRINDING MACHINE FOR GRINDING OF A GEAR - The invention relates to a grinding machine for grinding of a gear or of a gear-like workpiece, which has a grinding worm ( | 10-30-2008 |
20080274676 | Abrading device - An abrading device features a flexible abrading membrane supported by two supports. The device may be used in either linear or rotary configurations. The device can be used in conjunction with devices that impart continuous or vibratory linear or rotary motion. | 11-06-2008 |
20080280544 | Apparatus for lapping sliders using axially deformable member - An apparatus for lapping sliders comprises a rotatable lapping plate for lapping elements that are to be formed into sliders, a pushing force adjusting member that has an internal space therein and that extends vertically along an lapping plate axis that is perpendicular to the lapping plate, a pusher for pressing the elements, the pusher being connected to the pushing force adjusting member, and gas supply means for supplying a gas into the internal space, the gas supply means being connected to the pushing force adjusting member. The pushing force adjusting member comprises a first part that includes a connection with the pusher, a second part that includes a coupling between the internal space and the gas supply means, and an axially deformable part that is located between the first part and the second part. A length of the axially deformable part changes in a direction of the lapping plate axis in accordance with pressure in the internal space such that deformation of the axially deformable part causes a change in the pushing force of the pushing force adjusting member against the pusher. | 11-13-2008 |
20090004954 | Drive For a Grinding Spindle - The invention relates to a grinding-spindle assembly comprising a fixed shaft and a ring motor that has a stator and a rotor, wherein the stator is connected in a fixed fashion to the shaft, the rotor is a hollow shaft and is pivotal on the fixed shaft, and the grinding tool is connected in a rotationally fixed fashion to the rotor, and the ring motor extends through the grinding tool. The fact that the grinding tool is mounted directly on the rotor produces an especially space-saving construction. | 01-01-2009 |
20090036039 | METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE - Methods of and systems for polishing an edge of a substrate are provided. The invention includes a substrate rotation driver adapted to rotate the edge of a substrate against a polishing film; and a first sensor coupled to the rotation driver adapted to detect one of an energy and torque exerted by the substrate rotation driver as it rotates the substrate against the polishing film. Numerous other aspects are provided. | 02-05-2009 |
20090305616 | GLASS MOLD POLISHING METHOD AND STRUCTURE - A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation. | 12-10-2009 |
20100190419 | TOOL - A tool for surface machining of a workpiece includes a drive, a spindle operatively and detachably connected to the drive so as to be acted upon by the drive and a basic body connected to the spindle having at least two working surfaces. The drive is configured to act on the basic body so that the at least two working surfaces simultaneously machine the workpiece. | 07-29-2010 |
20100216377 | Grinding structure having micro ball - A micro-grinding device with a micro ball at an end is made. The micro ball is deposited with grinding particles. The grinding device is able to grind a surface having an arc degree more than 180 degrees. Thus, the present invention is suitable to be used for forming micro molds, removing burr, and micro-milling, micro-paring or micro-grinding a surface. | 08-26-2010 |
20110021117 | LIGHTWEIGHT FLAP WHEEL - A rotary finishing device is provided comprising a substantially solid hub having an inner periphery and an outer periphery, the inner periphery defining an axial throughhole. The device further provides a plurality of slots formed about the outer periphery of a generally circular hub, each of the plurality of slots being defined by a pair of side portions extending from the outer periphery. Each of the pair of side portions includes a tip portion, an intermediate side surface portion, and a base portion. The slot increases in width from the outer periphery to the base portion. A finishing media is secured in each of the plurality of slots by an epoxy resin, wherein each of the slots is consumed in its entirety by a combination of mounting ends of the finishing media and the epoxy resin. The hub and the consumed slots form a solid integral finishing device extending from the inner periphery to the outer periphery. | 01-27-2011 |
20110151754 | POLISHER - A polisher includes a connecting member, a polishing member mounted on the connecting member, an elastic member sleeved on the connecting member, and a fixing assembly for movably receiving the connecting member. An end of the elastic member resists the polishing member, and the other end of the elastic member resists the fixing assembly, such that the connecting member is moveable to adjust a position of the polishing member when polishing. | 06-23-2011 |
20110256815 | Method for polishing silicon wafer, method for producing silicon wafer, apparatus for polishing disk-shaped workpiece, and silicon wafer - The present invention is a method for polishing a silicon wafer, in which an oxide film is formed on a back surface side of the wafer, wherein the oxide film on a chamfered portion of the silicon wafer is removed, and the oxide film on a peripheral portion of the back surface of the wafer is polished over at least 2 mm from the outermost peripheral portion of the back surface of the wafer so that a thickness of the polished oxide film decreases from inside to outside of the wafer, a method for producing such a silicon wafer, and a silicon wafer. Thereby, there are provided a method for polishing a silicon wafer in which particles' attaching to a wafer surface after handling can be prevented, decrease of resistivity due to autodoping is not brought about, and moreover, productivity does not decrease; a method for producing such a silicon wafer; an apparatus for polishing a disk-shaped workpiece suitable for performing the methods; and a silicon wafer in which particles do not attach to a surface after handling even if an oxide film is formed on a back surface of the wafer and decrease of resistivity due to autodoping is not brought about. | 10-20-2011 |
20120009852 | WORK FEEDER FOR ROLLER END FACE WORKING MACHINE, ROLLER END FACE WORKING MACHINE AND ROLLERS FOR ROLLER BEARING - Provided are a workpiece feeder for roller end face processing which is capable of feeding a roller to a roller end face processing machine in a stable posture, a roller end face processing machine which is capable of stably and highly accurately processing both end faces of the roller fed by such a workpiece feeder for roller end face processing, and a roller for a rolling bearing processed by such a roller end face processing machine. The workpiece feeder for roller end face processing includes: a carrier ring ( | 01-12-2012 |
20120034853 | METHOD, SYSTEM, AND APPARATUS FOR MODIFYING SURFACES - The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management. | 02-09-2012 |
20120329372 | SYSTEM FOR MACHINING A BEVEL - The invention relates to a system ( | 12-27-2012 |
20130029566 | POLISHING PAD AUXILIARY PLATE AND POLISHING DEVICE EQUIPPED WITH POLISHING PAD AUXILIARY PLATE - A polishing pad auxiliary plate including: a lower auxiliary plate overlapping a top surface of a rotating surface plate of a polishing device; a first adhering member adhering the lower auxiliary plate to the rotating surface plate; an upper auxiliary plate with a pad support surface on which the polishing pad is overlapped and adhered, while overlapping a top surface of the lower auxiliary plate; a second adhering member adhering the upper auxiliary plate to the lower auxiliary plate; and an alignment member for mutually aligning the lower and upper auxiliary plates and matching center axes thereof. By removing the upper auxiliary plate from the lower auxiliary plate, the polishing pad is removed from the rotating surface plate while being adhered to the pad support surface of the upper auxiliary plate, and the removed upper auxiliary plate is reattached and aligned to the lower auxiliary plate by the alignment member. | 01-31-2013 |
20130040540 | Multi-Layer Surface Treatment Pad For Motorized Device - A multi-layer surface treating pad is disclosed. It has an upper layer suitable to serve as one part of a hook/loop type fastener system, a bottom layer which comprises an abrasive or polishing material, and a cleaning or other surface treating formulation positioned between the upper and bottom layer in the form of a bump which is positioned mostly in a central region of the pad. The bump of the formulation causes the upper layer to bulge upwardly so as to provide a visual indication as to where one optimally should attach a motorized device thereto. | 02-14-2013 |
20130045666 | Grinding Machine - A grinding machine includes a pair of workpiece support devices ( | 02-21-2013 |
20130157547 | BLADE GRINDER COMPRISING A BLADE HOLDER - Disclosed is a blade grinder comprising a blade holder that is mounted so as to be rotatable about a horizontal shaft which is mounted so as to be rotatable about a vertical axis, thus allowing the blade to be optimally adjusted relative to a grinding disk. The grinding disk can preferably be vertically and horizontally moved using spindles. This creates a simple design allowing a lawnmower blade to be ground in a fully automatic manner. | 06-20-2013 |
20130165025 | PLATE LOCKING MECHANISM - A plate locking mechanism for a surface preparation device comprising a connecting plate having a receiving aperture, a base plate and a floating plate capable of being substantially aligned with the base plate. A fastener extends through a floating plate aperture and engages with a base plate aperture and a resilient member is operatively associated with the fastener to maintain the floating plate in contact with the base plate and wherein, when the base plate is located within the receiving aperture, the floating plate is rotatable to retain the connecting plate in position. | 06-27-2013 |
20130303059 | LENS SURFACING PAD - A lens pad for use in surfacing a lens work piece, one side of which pad provides a working surface and the other side of which pad provides micro formations spread out substantially uniformly over that other side of the pad. When the lens pad is in use, it is attached to a surface of a lens surfacing tool. The latter surface provides micro formations spread substantially uniformly over that surface of the lens surfacing tool. The micro formations of the pad interengage or interlock with those of such a surface of such a lens surfacing tool when the pad is in use. | 11-14-2013 |
20140030964 | ELECTRIC CUTTING-TOOL GRINDER - The grinding surface of a grinding stone is formed from a circular conical surface, a drive device for rotation is installed within a housing. The blade of a cutting tool is ground while the longitudinal direction of the cutting tool is aligned with the direction of a generating line of the grinding surface. When grinding the blade, the cutting tool can be aligned with the direction of the generating line of the grinding surface and the blade can be brought in contact with the grinding surface without the handle of the cutting tool and the hand that holds the cutting tool being interfered with the grinder. This is achieved irrespective of in which one of the directions of lines the tip of the blade faces, the lines being obtained by extending the generating line of the grinding surface from both ends of the generating line. | 01-30-2014 |
20140248824 | PROCESSING APPARATUS AND OPTICAL MEMBER MANUFACTURING METHOD - There is provided a processing apparatus and an optical member manufacturing method that can improve the figure accuracy and the waviness accuracy, and can highly and precisely process an optical element surface. A processing apparatus generates a pressure between a polishing member and a workpiece and relatively moves the polishing member and the workpiece to process a workpiece. The processing apparatus includes a support member that can perform oscillating movement, and a processing portion that is rotatably attached to the support member. The processing portion includes one or more pressure generation units to generate different pressures between the polishing member and the workpiece. | 09-04-2014 |