| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 451177000 |
Rotary tool
| 178 |
| 451075000 |
Sandblast
| 64 |
| 451065000 |
Combined
| 44 |
| 451296000 |
Endless band tool
| 27 |
| 451119000 |
Rotary reciprocating tool
| 12 |
| 451312000 |
Stationary tool
| 12 |
| 451162000 |
Reciprocating tool
| 11 |
| 451103000 |
Scouring device | 2 |
| 20120149285 | Golf Ball Deburring Apparatus - A structure for deburring a ball is provided. The structure includes an arm, a gear structure for changing the effective length of the arm, and a cam structure for changing the effective angular position of the arm. A finger having an abrasive surface reciprocates on the arm. A ball is placed in a rotating holder and positioned in effective position for the abrasive surface to contact and remove at least one burr on the ball. | 06-14-2012 |
| 20120264357 | GAME BALL SURFACE TREATMENT APPARATUS - A game ball surface treatment apparatus for abrading, cleaning or polishing game balls includes an outer housing having a base portion and a side wall portion, an inner housing arranged within the outer housing and having a bottom portion and a circumferential wall portion extending upwards from the bottom portion, a damper arranged to interconnect the outer housing and the inner housing, an electric motor fixed to the bottom portion of the inner housing and having an output shaft extending upwards, a rotary disc fixed to the output shaft of the electric motor to support the game balls and provided with an abrading fabric making contact with the game balls, an impeller arranged above the rotary disc to accommodate the game balls in a mutually isolated state, and a lining attached to the circumferential wall portion of the inner housing to make contact with the game balls. | 10-18-2012 |
| 451113000 |
Immersion | 1 |
| 20090280729 | Machine for polishing submerged surfaces, i.e. a pool - A hand held machine for polishing submerged surfaces, i.e. a pool powered by pressurized water with only one rotating element enclosed in a two part casing, feeded through a pressure connector, and using standard commercial polishing disks that uses pressurized water as power source. | 11-12-2009 |
| Entries |
| Document | Title | Date |
|---|
| 20080280542 | CLEANING APPARATUS FOR A PROBE - The present invention provides a cleaning apparatus capable of removing foreign matters attached to a tip of a probe effectively without impairing the durability of the probe. The cleaning apparatus for the probe comprises a base plate having a rough surface and a surface layer formed to conform to and cover the rough surface for the purpose of providing a polishing surface for the probe and having lower hardness than hardness of the probe tip of the probe. | 11-13-2008 |
| 20110300783 | MACHINE FOR GRINDING DIES - The invention relates to a machine and process for grinding dies, in which the work axis (CO) of the plate ( | 12-08-2011 |
| 20110287696 | Abrasion Apparatus - An apparatus for machining a spectacle lens by abrasion of material in the area of a joining surface to be formed is provided. The apparatus comprises a tool provided with a cutting end face whose axis of rotation is movable in a forward direction relative to a holding device and covers a reference plane. The holding device comprises a support surface, a contact surface aligned perpendicularly thereto and a stop edge. The support surface and the contact surface extend perpendicularly to the reference plane and the stop edge extends perpendicularly to the support surface and in parallel to the reference plane and has a distance from the reference plane which is variable. The support surface is interrupted such that the projecting end face of the tool can be moved along the interruption. When provided at its machining position the lens rests on the support surface, contacts the contact surface and abuts with its edge against the stop edge. When the distance of the stop edge from the reference plane is adjusted to a value predetermined for the lens to be machined, the joining surface is formed by means of the tool exactly at the location of the joining surface predetermined for the lens. | 11-24-2011 |
| 20110165825 | POLISHING APPARATUS - A polishing apparatus according to the present invention is a polishing apparatus for polishing a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate (W) by bringing a polishing tool ( | 07-07-2011 |
| 20090111362 | Polishing Apparatus - A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material. | 04-30-2009 |
| 20110039480 | Polishing Pads Including Sidewalls and Related Polishing Apparatuses - A polishing pad may include a base and a plurality of polishing protrusions on a surface of the base. Each polishing protrusion may include a sidewall defining an opening in a surface of the polishing protrusion opposite the base. In addition, portions of the sidewall opposite the base may define a contact surface. | 02-17-2011 |
| 20110081841 | WAFER SUPPORT MEMBER, METHOD FOR MANUFACTURING THE SAME AND WAFER POLISHING UNIT COMPRISING THE SAME - Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support. | 04-07-2011 |
| 20110151753 | EDGE GRINDING APPARATUS - An edge grinding apparatus for sheets of glass includes a conveyance device coupled to a support structure, wherein the conveyance device includes a conveying position and a grinding position, a carriage support disposed adjacent the conveyor, and a grinding carriage slidingly coupled to the carriage support, the grinding carriage including at least one movable grinding head, wherein a glass sheet is carried by the conveyance device from the conveying position to the grinding position, the glass sheet secured to one of the conveyance device and a fixed table while in the grinding position, at least one edge of the glass sheet ground by the at least one moveable grinding head while in the grinding position. | 06-23-2011 |
| 20100003902 | MODULAR BASE-PLATE SEMICONDUCTOR POLISHER ARCHITECTURE - The present invention generally relates to a polishing system. Particularly, the present invention relates a polishing apparatus having one or more modular polishing stations, and a plurality of polishing heads movably connected to a transferring system. | 01-07-2010 |
| 20110104996 | FINISHING MACHINE - A finishing machine comprises a motor mounted on a support frame and connected to a drive shaft and two or more finishing heads and an impeller fan driven by the drive shaft via a serpentine belt drive which rotates the finishing heads in opposite directions. The impeller fan impels dust from the grinding heads into a rear vacuum manifold and the support frame has rear wheels the height of which is adjustable by means of an hydraulic cylinder. | 05-05-2011 |
| 20120122378 | GRINDING HEAD FOR A SURFACE GRINDING MACHINE - The invention relates to a grinding head for a grinding machine. The grinding head comprises a tool holder, which in use is moved in a plane, in particular rotated or translated back and forth, by the grinding machine. The grinding head furthermore comprises at least two tools which are connectable to the tool holder by a releasable sticking connection. One of the tools or the tool holder is provided with at least one protrusion and the other one is provided with an associated cavity to lock which extend transverse to said plane of movement of the tool with respect to the tool holder in a direction parallel to said plane when the tool is connected to the tool holder. | 05-17-2012 |
| 20120164925 | SYSTEM FOR MAGNETORHEOLOGICAL FINISHING OF SUBSTRATES - A system for magnetorheological finishing of a substrate. An integrated fluid management module (IFMM) provides dynamic control of the rheological fluid properties of the MR fluid on a conventional MR finishing apparatus, and dispensing of the fluid to the wheel. A magnetically shielded chamber charged with MR fluid is in contact with the carrier wheel. A transverse line removes the spent MR fluid from the wheel as the ribbon leaves the work zone. Replenishment fluid is added to the chamber via a dripper, and preferably an electric mixer agitates MR fluid in the chamber. A grooved magnetically-shielded insert at the exit of the chamber forms a polishing ribbon on the carrier wheel as the wheel is turned. A sensor sensitive to concentration of magnetic particles provides a signal for control of MR fluid properties, particularly, water content in the MR fluid. Means is provided for cooling fluid within the chamber. | 06-28-2012 |
| 20120258650 | APPARATUS FOR GRINDING A CONTINUOUSLY CAST WORKPIECE - An apparatus for grinding a continuously cast slab having a longitudinal axis and a rectangular cross-sectional shape with two opposite wide faces and two opposite narrow faces apparatus has a frame, two transversely spaced grinders carried on the frame, and a holder having two transversely spaced grippers engageable with the opposite faces of the slab in a vertical position with the wide faces of the slab vertical for grinding of the wide faces of the slab by the grinders and in a horizontal position offset by 90° to the vertical position with the wide faces of the slab horizontal for grinding of the narrow faces of the slab. | 10-11-2012 |
| 20110263183 | POLISHING SOLUTION DISTRIBUTION APPARATUS AND POLISHING APPARATUS HAVING THE SAME - The present invention provides a polishing solution distribution apparatus capable of reducing distribution deviation of polishing solution even when leveling for installation is insufficient or inclination of an installation location varies and a polishing apparatus having the same. The polishing solution distribution apparatus includes a cone-shaped branch body in which a solution pan to store supplied polishing solution is formed and in which plural flow passages radially connected to a side face of the solution pan respectively and having a delivery port to supply polishing solution to a position lower than the connected position are formed, a support portion to support the branch body, and a universal joint mechanism to support the branch body via the support portion at a position being higher than the gravity center of the branch body. | 10-27-2011 |
| 20120289128 | CHEMICAL MECHANICAL POLISHING SYSTEM - A chemical mechanical polishing (CMP) system includes a wafer polishing unit comprising a waste liquid sink for receiving a used slurry and a waste slurry drain piping for draining the used slurry; and a post-CMP cleaning unit coupled to the wafer polishing unit such that a used base chemical such as tetramethyl ammonium hydroxide (TMAH) produced from the post-CMP cleaning unit flows toward the wafer polishing unit to frequently wash at least the waste slurry drain piping in a real time fashion on a wafer by wafer basis. | 11-15-2012 |
| 20080233844 | RETAINER RING AND POLISHING MACHINE - To provide a retainer ring by which an object to be polished can be uniformly polished, and deterioration thereof can be suppressed, and it does not take time to recycle, and a polishing machine having the retainer ring. The retainer ring | 09-25-2008 |
| 20130115862 | CHEMICAL MECHANICAL POLISHING PLATFORM ARCHITECTURE - Embodiments of the invention provide polishing systems for increasing production efficiency, maximizing substrate throughput, and reducing production costs. The polishing systems generally include one or more polishing stations for performing a CMP process and one or more cleaning stations at which post-polishing cleaning is performed. The number of cleaning stations and polishing heads present may be increased depending on the desired substrate throughput or processing time at each polishing station. The number of polishing stations or cleaning stations can also be reduced in order to reduce the footprint of the polishing system. The polishing pads at each polishing station can be adjusted in size to accommodate one or more polishing heads simultaneously depending on substrate throughput and system footprint. Additionally, the polishing pads may be replaced with a fixed abrasive pad, or adapted to polish 450 millimeter substrates. | 05-09-2013 |
