Class / Patent application number | Description | Number of patent applications / Date published |
451054000 | With critical nonabrading work treating | 45 |
20080233841 | DISK-SHAPED SUBSTRATE MANUFACTURING METHOD - The disk-shaped substrate manufacturing method is provided with: generating an air stream downward from an upper area during grinding a disk-shaped substrate in a grinding apparatus; arranging the grinding apparatus on an upper floor face of a floor and arranging water on a lower floor face of the floor, the upper floor face being made of a board having penetration holes or a mesh member, and the lower floor face supporting the upper floor face so as to be located above the lower floor face with a distance; and guiding dust made by the grinding apparatus to the water by use of the air stream. | 09-25-2008 |
20080248730 | WAFER PROCESSING METHOD - A wafer processing method including the step of removing a ringlike reinforcing portion formed along the outer circumference of a wafer on the back side thereof. The ringlike reinforcing portion is ground by a grinding stone in such a manner that the locus of the grinding stone rotating intersects the ringlike reinforcing portion as viewed in plan. The grinding of the ringlike reinforcing portion is ended when the ground surface of the ringlike reinforcing portion becomes higher by 20 to 1 μm than the upper surface of a metal film deposited on the back side of a device area of the wafer. It is unnecessary to accurately align the grinding stone to the ringlike reinforcing portion on the upper side thereof, so that the position control can be easily performed. Further, the grinding of the ringlike reinforcing portion is ended when the difference in height between the ground surface of the ringlike reinforcing portion and the upper surface of the metal film becomes 20 to 1 μm, so that there is no possibility that the metal film may be damaged. | 10-09-2008 |
20080318497 | METHOD OF MACHINING SUBSTRATE - A method of machining a wafer is disclosed, in which the wafer is held by sucking its back-side surface directly onto a suction surface of a chuck table, and the tips of protruding electrodes and a resist layer are cut to make them flush with each other (appendant part cutting step). Next, the wafer is held by sucking the surface of the cut appendant part directly onto the suction surface of the chuck table, and the back-side surface of the wafer is ground (back-side surface grinding step), followed by removing the resist layer. The wafer is held onto the chuck table without using any protective tape but by directly holding the wafer, whereby the wafer can be ground to have a uniform thickness. | 12-25-2008 |
20090117832 | WAFER POLISHING METHOD - A wafer polishing method is provided. First, a wafer, having a first surface, a second surface, and a plurality of opening portions depressed on the first surface, is provided. A plastic adhesive is filled in the opening portions and cured later. A polishing step is performed to thin the thickness of the wafer. Therefore, the yield of the wafer in the polishing process can be improved by the protection of the plastic adhesive. | 05-07-2009 |
20090163120 | WAFER GRINDING MACHINE AND WAFER GRINDING METHOD - A wafer grinding machine and a wafer grinding method are disclosed. A barrier ( | 06-25-2009 |
20090191796 | WAFER PROCESSING METHOD FOR PROCESSING WAFER HAVING BUMPS FORMED THEREON - A wafer processing method for processing a wafer ( | 07-30-2009 |
20090191797 | Polishing apparatus - A polishing apparatus ( | 07-30-2009 |
20090197513 | PROCESSING A FLEXOGRAPHIC PRINTING PLATE - A method for processing a flexographic printing plate on which patterned flexographic material that is uncured or partially cured has been provided, the method comprising mechanically shaping the upper surface of the flexographic material and fully curing the shaped material. | 08-06-2009 |
20090221215 | ADHESIVE SHEET FOR GRINDING BACK SURFACE OF SEMICONDUCTOR WAFER AND METHOD FOR GRINDING BACK SURFACE OF SEMICONDUCTOR WAFER USING THE SAME - The invention provides an adhesive sheet for grinding a back surface of a semiconductor wafer, which is to be adhered to a circuit forming surface of the semiconductor wafer when the back surface of the semiconductor wafer is ground, in which the adhesive sheet contains an adhesive layer, an intermediate layer and a substrate in this order from the circuit forming surface side, the intermediate layer has a JIS-A hardness of more than 55 to less than 80, and the intermediate layer has a thickness of 300 to 600 μm. Furthermore, the invention also provides a method for grinding a back surface of a semiconductor wafer, including adhering the above-mentioned adhesive sheet to a circuit forming surface of the semiconductor wafer, followed by grinding the back surface of the semiconductor wafer. | 09-03-2009 |
20090247056 | GRINDING METHOD FOR WAFER HAVING CRYSTAL ORIENTATION - A grinding method for a wafer having a mark indicating the crystal orientation. The grinding method includes a first grinding step for grinding the upper surface of the wafer by rotating a chuck table holding the wafer thereon, rotating a grinding ring, positioning the grinding ring so that the grinding ring is passed through the center of the wafer, and feeding the grinding ring in a direction perpendicular to the chuck table; a wafer positioning step for positioning the upper surface of an outer circumferential portion of the wafer directly below the locus of rotation of the grinding ring; and a second grinding step for grinding the upper surface of the wafer by first stopping the rotation of the chuck table so that the mark indicating the crystal orientation of the wafer held on the chuck table is pointed in a predetermined direction, next feeding the grinding ring in the direction perpendicular to the chuck table, and next relatively moving the chuck table and the grinding ring in parallel. | 10-01-2009 |
20090258577 | Method for Trimming Molds of Automotive Metal Sheets - The present invention provides a method for trimming molds of automotive metal sheets, which comprise a top mold and a bottom mold. The top mold has a concave mold surface, and the bottom mold has a corresponding convex mold surface. The method comprises: 1. Use the top mold as the base mold, and smear dye on the top mold; 2. Close the bottom mold to the top mold; and 3. Polish the mold surface of the bottom mold. Thereby, the processing method according to the prior art is broken through, and an ergonomic trimming operation is hence provided. Accordingly, the trimming process is simplified, and the labor hours are reduced. Beside, the accuracy of trimmed molds is improved and the subsequent mold-clamping process can be omitted. Thereby, the exterior quality of the metal sheets can be enhanced while reducing substantial labor hours, and economic benefits for manufacturing molds of metal sheets for an automotive body can be achieved. | 10-15-2009 |
20090311949 | METHOD FOR PRODUCING SEMICONDUCTOR WAFER - A semiconductor wafer is produced by a method comprising a slicing step of cutting out a thin disc-shaped semiconductor wafer from a crystalline ingot; and a fixed grain bonded abrasive grinding step of sandwiching the semiconductor wafer between a pair of upper and lower plates each having a pad of fixed grain bonded abrasive to simultaneously grind both surfaces of the semiconductor wafer. | 12-17-2009 |
20090325469 | SUBSTRATE SUPPORTING UNIT AND SINGLE TYPE SUBSTRATE POLISHING APPARATUS USING THE SAME - Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed. | 12-31-2009 |
20100173568 | SYSTEM FOR SURFACE PREPARATION - A system for preparing a surface for painting, staining, or other treatment is provided. This system includes a surface preparation material and an optional dispenser for dispensing the surface preparation material. The surface preparation material includes a single-layer or multi-layer substrate material or fabric; a sanding portion formed on the substrate, wherein the sanding portion further includes at least one abrasive substance deposited thereon or embedded therein; and a wiping portion formed on the substrate separate from the sanding portion, wherein the wiping portion further includes cleaning means for removing debris created by the sanding portion from the surface to be painted, stained, or otherwise treated. The cleaning means may be one or more dry textured regions or areas formed on the substrate or it may be one or more sticky or tacky regions or areas formed on the substrate. | 07-08-2010 |
20100216376 | PROCESS FOR PRODUCING A STENT FOR ANGIOPLASTY - A stent has surface sculpturing, preferably on its outer surface only, having, for example, microspheres, having the function of increasing the actual geometric surface area of the stent, of creating undercuts and roughness to encourage the application of coatings of active or activatable agents, as well as of improving the attachment of the stent to the blood vessel wall. | 08-26-2010 |
20110201259 | Oil composition for use in trace oil supply cutting/grinding work - This invention provides an oil composition for cutting and grinding by minimum quantity lubrication system, characterized by comprising an ester oil with a kinematic viscosity of 0.5-20 mm | 08-18-2011 |
20110269381 | Planarization of a Material System in a Semiconductor Device by Using a Non-Selective In Situ Prepared Slurry - For complex CMP processes requiring the removal of different dielectric materials, possibly in the presence of a polysilicon material, a slurry material may be adapted at the point of use by selecting an appropriate pH value and avoiding agglomeration of the abrasive particles. The in situ preparation of the slurry material may also enable a highly dynamic adaptation of the removal conditions, for instance when exposing the polysilicon material of gate electrode structures in replacement gate approaches. | 11-03-2011 |
20110300781 | METHOD OF MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE - In one embodiment, a first substrate including first and second array regions are prepared. The first and second array regions respectively include first and second active areas. A peripheral seal material having an air intake opening is arranged outside the first and second array regions. A second substrate is arranged on the surface of the first substrate in which the first and second seal materials and peripheral seal material are formed in a vacuum chamber under vacuum state. Atmosphere is introduced into the vacuum chamber and a space between the first and second seal materials from the air intake opening. Then, a pressure is applied to the first and second substrates by pressure difference between the atmospheric pressure of circumference which surrounds the first substrate and second substrate, and the atmospheric pressure of the space between the first substrate and second substrate. | 12-08-2011 |
20120178346 | METHOD FOR COOLING A WORKPIECE MADE OF SEMICONDUCTOR MATERIAL DURING WIRE SAWING - A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including a wire web having wire sections arranged in parallel by penetrating the wire sections into the workpiece by an oppositely directed relative movement of the wire sections and the workpiece. Wipers are disposed so as to bear on the surface of the workpiece. The temperature of the workpiece is controlled during the wire sawing using a liquid coolant applied onto the workpiece above the wipers so as to remove the liquid coolant with the wipers bearing on the workpiece surface. | 07-12-2012 |
20120202405 | METHOD OF TIP GRINDING THE BLADES OF A GAS TURBINE ROTOR - A method of grinding the tip of a blade which forms part of a rotor for a gas turbine engine is provided. The method includes mounting a plurality of blades in a disc to provide a blade assembly; mounting the blade assembly in a grinding apparatus; aligning the plurality of blades in a predetermined position using compressed fluid; and, grinding the blade tips. | 08-09-2012 |
20120220199 | WET SANDING COMPOSITIONS - A wet sanding adjuvant is comprised of a composition comprising: (1) an alkali metal or ammonium salt of an alkoxylated alkyl sulfate; (2) an alkali metal or ammonium salt of an alphaolefin sulfonate; (3) a cellulose derivative selected from the group consisting of hydroxyalkyl cellulose, a carboxyalkyl cellulose and combinations thereof. The adjuvant is used in a method of removing a coating from a surface comprising the steps of: (1) contacting a coated surface with a composition according to the invention to form a wet surface on the coating; (2) abrading the wet surface with an abrasive; (3) removing the composition from the surface. | 08-30-2012 |
20120244786 | UV PROTECTIVE COATING COMPOSITION AND METHOD - Plastic restoration kits and methods for restoring the light transmission and optical clarity properties of plastic surfaces, such as plastic aircraft windows, automobile plastic headlight covers, plastic sunglass lenses, and plastic corrective optical lenses. The kits and methods restore plastic surfaces that have been damaged by hazing, scratching and/or UV-induced oxidation. The kits and methods employ at least one polishing composition configured to improve clarity by removing scratches. A UV protective material is incorporated into at least one of the polishing compositions so that the UV protective material becomes worked into the plastic surface during polishing, and a protective coating that forms a hard protective coating over the plastic surface impregnated with the UV protective material is finally applied. The plastic surface may be heated after polishing and prior to application of the protective coating material. | 09-27-2012 |
20120276821 | METHOD AND SYSTEM ENABLING PREMATURE USE OF A TEXTILE GARMENT MADE OF DENIM FABRIC - The invention relates to a method of premature wear of a fabric garment made of a colored denim canvas, wherein the aforementioned garment is placed into a rotating machine including a drum, characterized by the fact that the aforementioned method comprises a step during which the garment is rotated in the drum without being wetted or dampened, ozone gas being injected simultaneously into the interior of the aforementioned drum so as to bleach the aforementioned garment and give it a wear effect. | 11-01-2012 |
20120295521 | METHOD FOR PRODUCING A COMPOSITE MIRROR AND COMPOSITE MIRROR OBTAINED WITH SAME - A method for producing a composite mirror. It comprises the steps of providing a glass blank with low coefficient of expansion, machining a convex shape ( | 11-22-2012 |
20120322348 | PAD FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF CHEMICAL MECHANICAL POLISHING USING SAME - A chemical mechanical polishing pad includes a polishing layer formed using a composition that includes a thermoplastic polyurethane, the polishing layer having a specific gravity of 1.15 to 1.30, and a durometer D hardness of 50 to 80. | 12-20-2012 |
20130095732 | DEVICES AND METHODS FOR AUTOMATICALLY CLEAVING AND ABRADING CABLES - An apparatus includes: a cleaver configured to automatically cleave a bare fiber extending from an end face of a terminus or connector of a fiber optic cable, the cleaver including a bending element configured to bend the bare fiber and a defect-formation device configured to create a surface defect in surface of the bare fiber under tension when the bare fiber is bent by the bending element; and an abrader configured to automatically finish the end face of the terminus or connector after the bare fiber is cleaved. | 04-18-2013 |
20130095733 | METHOD FOR TRIMMING AN OPHTHALMIC EYEGLASS LENS COMPRISING A COATING FILM - Method of shaping an ophthalmic eyeglass lens presenting two main optical working faces and including firstly a substrate made of a first material and presenting two main faces corresponding to the two main faces of the lens, and secondly at least one coating film made of a material distinct from that of the substrate, the coating film being previously secured on at least one of the main faces of the substrate, includes:
| 04-18-2013 |
20130115861 | PROCESSING METHOD FOR WAFER HAVING CHAMFERED PORTION ALONG THE OUTER CIRCUMFERENCE THEREOF - A wafer processing method for reducing the thickness of a wafer to a predetermined thickness, the wafer having a chamfered portion along the outer circumference thereof. The wafer processing method includes a stacked wafer forming step of attaching a support substrate to the front side of the wafer to thereby form a stacked wafer, and a chamfered portion removing step of positioning a cutting blade having a rotation axis parallel to the stacking direction of the stacked wafer formed by the stacked wafer forming step so that the outer circumference of the cutting blade faces the chamfered portion of the wafer, and then making the cutting blade cut into the wafer from the outer circumference toward the center thereof to thereby partially remove the chamfered portion in the range corresponding to the predetermined thickness from the front side of the wafer. | 05-09-2013 |
20130178135 | Methods for Testing the Polishability of Materials - A method and apparatus for measuring the polishability of a solid material such as a dental restorative material includes using a series of apparatus to perform the steps of forming the material into a desired specimen with a generally planar surface, conditioning the surface by abrasion, measuring the abraded surface with a profile determination device, optionally measuring the amount of material abraded from the surface and the gloss of the abraded surface, polishing a portion of the abraded surface with a polishing device at a controlled load for a pre-determined time and measuring the roughness and/or gloss of the polished surface followed by comparison thereof to the corresponding measurements of the unpolished, conditioned portion of the specimen surface. Polishing materials and devices may also be tested using the apparatus and method for polishing a standardized material. | 07-11-2013 |
20130244547 | Wood Sanding Bit and Method of Use - The invention seeks to provide a wood sanding bit that can be used for the sanding of routered work piece edges. Specifically, the invention seeks to provide a wood sanding bit for use with a rotary tool, the bit comprising a sanding body having an outwardly and radially disposed sanding surface, the sanding surface provided with an abrasive material, wherein the sanding surface has a profile corresponding to a standard contoured router bit profile. | 09-19-2013 |
20130303055 | COMPONENT MACHINING METHOD AND ASSEMBLY - An example component machining method includes immersing a surface of a component within a fluid during a machining process. The method heats the surface during the machining to vary the machining process at the surface relative to other surfaces of the component. | 11-14-2013 |
20140106649 | WAFER PROCESSING METHODS - Wafer processing methods are provided. The methods may include cutting respective edges of a wafer and an adhesive a predetermined angle before grinding a back surface of the wafer. | 04-17-2014 |
20140194039 | METHOD OF MANUFACTURING HEAD CHIP - A method of manufacturing a head chip includes a groove forming step for forming grooves which are the bases of ejection grooves on a first surface of the actuator substrate, a substrate grinding step for grinding a second surface of the actuator substrate so that each of the grooves has a predetermined depth, a recessed portion forming step for forming an inspection recessed portion which changes its state in the second surface of the actuator substrate according to the grinding amount of the actuator substrate in the substrate grinding step, and a grinding amount determination step for determining the grinding amount of the actuator substrate on the basis of a state of the inspection recessed portion after the substrate grinding step. | 07-10-2014 |
20140295740 | ULTRA FINE LAPPING SUBSTRATE THROUGH USE OF HARD COATED MATERIAL ON LAPPING KINEMATICS - A system according to one embodiment includes a substrate having one or more sacrificial row bars and one or more additional row bars, wherein the one or more sacrificial row bars comprise a wear resistant material and are adapted to be used in a lapping process to prepare a lapping plate, wherein the one or more additional row bars comprise a material that has less wear resistance than the wear resistant material and are adapted to be used for magnetic head slider production, and wherein the lapping plate is adapted to be used in a lapping process to polish the one or more additional row bars. | 10-02-2014 |
20140364043 | CONSUMABLE ABRASIVE TOOL FOR CREATING SHINY CHAMFER - The disclosed embodiments relate generally to methods for creating smooth cosmetic surfaces along small features of an electronic device. The disclosed embodiments are well suited for reaching surfaces disposed in constrained spaces. More specifically a method for finishing a workpiece is described. For example, the method may be employed to finish an inlet portion of a cable connector. The method may involve the use of an abrasive brush which may include a single filament and abrasive particles coupled thereto, which can be configured to provide any number of different surface geometries during a finishing operation. | 12-11-2014 |
20150065015 | RUBBING DEVICE AND RUBBING METHOD - The present invention relates to a rubbing device and a rubbing method. The rubbing device includes: a substrate carrier, an aligning roller having a surface that is rubbing fabric, a driving mechanism that drives the substrate carrier and the substrate that is to be subjected to alignment treatment carried thereby to undergo a translational movement, and an elevation arm. The lower surface of the aligning roller is made suitable to contact and rub the upper surface of the substrate that is to be subjected to alignment treatment and side edges of the upper surface of the substrate that is to be subjected to alignment treatment are made suitable to scrape the lower surface of the aligning roller. The substrate carrier is provided in a top thereof with channels corresponding to two opposite side edges of the substrate that is to be subjected to alignment treatment in the translational movement direction. The channels are arranged to be suitable to have the two side edges of the substrate that is to be subjected to alignment treatment respectively suspending in the channels. The present invention also provides a rubbing method. The rubbing device and the rubbing method of the present invention use a substrate that is to be subjected to alignment treatment to scrape PI chips from the aligning roller into channels so as to prevent the PI chips from moving with the aligning roller to spread over an AA zone of the substrate that is to be subjected to alignment treatment, thereby improving the defects of bright spots and mura generated in a rubbing process. | 03-05-2015 |
20150087207 | DEVICE WAFER PROCESSING METHOD - A device wafer includes a device area where a plurality of devices are formed on the front side of the device wafer and a peripheral marginal area surrounding the device area. Each device has an adhesion disliking region disliking adhesion to an adhesive tape. An ultraviolet curable protective tape is attached as the adhesive tape to the front side of the device wafer. Ultraviolet radiation is applied to a first area of the protective tape corresponding to the adhesion disliking region of the device wafer to thereby reduce the adhesive force in the first area. The ultraviolet radiation is not applied to a second area of the protective tape corresponding to the peripheral marginal area of the device wafer to thereby maintain the adhesive force in the second area. The device wafer is held through the protective tape while the back side of the device wafer is ground. | 03-26-2015 |
20150140906 | CLEANING AGENT FOR ALLOY MATERIAL, AND METHOD FOR PRODUCING ALLOY MATERIAL - A cleaning agent for an alloy material is provided. The cleaning agent has a pH in a range between 1.5 and 4, inclusive, and contains an anionic surfactant having an SO | 05-21-2015 |
20150367464 | Processing System and Method for a Work Piece Surface - A processing system and method for a work piece surface in the mechanical technical field. The processing system is disposed on the side of the processing center which could machine the work piece which comprises two milling cutter carving machines symmetrically located on both sides of the processing center and an article positioning shelf located between the said two milling cutter carving machines to place the work piece. A first manipulator is provided between the processing center and the article positioning shelf and between the two milling cutter carving machines. The first manipulator transfer the work piece among the processing center, the article positioning shelf and two milling cutter carving machines. A group of polishing units is located on the side of the article positioning shelf. A second manipulator is provided in the polishing unit which transfers the work piece. | 12-24-2015 |
20160082532 | FLUSH GRINDER BIT - A flush cut grinder tool bit made of an elongated cylindrical shape with an inwardly facing saw blade within the inner diameter of the elongated cylindrical shape that can be sleeved over a protruding object, such that the cutting saw blade portion of the tool bit is inside the cylindrical tool bit so that when it is sleeved over a protruding object, moving the tool bit back and forth over the protruding object will cut the protruding object off at the surface. The body of the drill bit terminates at its distal end with a flush flange having saw teeth therein, and may include a bit shank suspended in the middle of a drill bit body by spokes or a solid surface radially extending from said bit shank. A method of using such a flush cut grinder tool bit is included. | 03-24-2016 |
451055000 | Deforming | 5 |
20090036034 | Semiconductor wafer and processing method for same - A semiconductor wafer which is generally circular, and which has on its face an annular surplus region present in an outer peripheral edge portion of the face, and a circular device region surrounded by the surplus region, the device region having many semiconductor devices disposed therein. A circular concavity is formed in the back of the semiconductor wafer in correspondence with the device region, and the device region is relatively thin, while the surplus region is relatively thick. | 02-05-2009 |
20130189905 | METHOD FOR IMPROVING THE STRENGTH CHARACTERISTICS OF ORTHOPEDIC PROSTHESES - A method for improving the strength characteristics of orthopedic prostheses, such as femur necks, femoral stems, cotyloid elements, systems of the spinal column, including the step of: starting from a prosthesis made of metal, subjecting the prosthesis to a peening treatment to improve the surface hardness of the prosthesis and eliminate micro-scoring caused by the machining of machine tools, the method further including a subsequent step of performing a surface finishing treatment by vibration finishing. | 07-25-2013 |
20150079882 | OPTICAL FIBER CONNECTOR POLISHING APPARATUS AND METHOD - A polishing apparatus for polishing an optical fiber connector is disclosed. The polishing apparatus has a base portion to support a polishing media; and a polishing puck. The polishing puck includes a connector mount, to receive and hold the optical fiber connector secured to a terminal end of an optical fiber, and a polishing gear configured to engage with a ring gear disposed in the base portion such that a fiber tip of optical fiber mounted in the optical connector traces a roulette pattern on the polishing media upon rotational engagement of the polishing gear within the ring gear. | 03-19-2015 |
20160001419 | Brush-type Deburring Machine for Multiple Cutting with Individual Deburring - The invention relates to a deburring machine for ends of sections ( | 01-07-2016 |
20160045275 | MATERIAL REMOVAL FROM BALLOON CONE - A material-removing machine for removing material from a cone section of a medical balloon includes a material-removing element operatively connected to a prime mover such that operation of the prime mover imparts rotation to the material-removing element about a rotational axis. The material-removing element includes an interior surface defining a generally conical-shaped cavity extending along the rotational axis and adapted to receive at least a longitudinal portion of a cone section of an expanded medical balloon for removing material from the longitudinal portion of the cone section to reduce a wall thickness of the cone section. Material may be removed continuously around a 360-degree exterior perimeter of the longitudinal portion of the cone section of the medical balloon to reduce the thickness of the balloon wall defining the cone section. | 02-18-2016 |