Class / Patent application number | Description | Number of patent applications / Date published |
451037000 | Combined abrading | 28 |
20080200098 | POLISHING SLURRY FOR ALUMINUM AND ALUMINUM ALLOYS - The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and a liquid carrier to polish the surface of the object. The polishing composition includes the abrasive particles suspended in the liquid carrier, and is applied at a pH above about 7. | 08-21-2008 |
20080207091 | Slurry Composition For Color Filter Polishing - The invention provides a slurry composition for polishing color filters. The slurry composition at least includes an abrasive, a buffer solution and an additive. The abrasive is selected from the group consisting of alumina, ceria, magnesia, silica, titania, zirconia, cupric oxide, ferric oxide, zinc oxide and the mixture thereof. The buffer solution is used for adjusting pH to a desired range. The additive is used for stabilizing the polishing composition and also improving the polishing performance. | 08-28-2008 |
20080227370 | SUBSTRATE FOR MAGNETIC DISK - A method for manufacturing a substrate for a magnetic disk, including the steps of (a) polishing a substrate with a polishing composition A containing alumina abrasives having an average particle size of from 0.05 to 0.5 μm, and an oxidizing agent, and (b) polishing the substrate with a polishing composition B containing silica particles having an average particle size of from 0.005 to 0.1 μm; a substrate for a magnetic disk, obtainable by the method for manufacturing a substrate for a magnetic disk; and a substrate for a magnetic disk having the following surface properties of a long-wavelength waviness of 0.05 nm or more and 0.3 nm or less, and an AFM surface roughness of 0.03 nm or more and 0.2 nm or less. The substrate for a magnetic disk may be suitably used in the manufacture of a hard disk having a high recording density. Especially, a hard disk having a recording density of 50 G bits or more per square inch may be industrially manufactured. | 09-18-2008 |
20080233837 | METHODS OF REMOVING DEFECTS IN SURFACES - Methods of abrading surfaces by rotationally reciprocating abrasive surfaces in contact with the surfaces, abrasive articles for use in rotationally reciprocating tools, and methods of removing defects in a surface, where the methods include sanding using a rotationally reciprocating abrasive surface followed by one or more polishing operations are disclosed. | 09-25-2008 |
20080242198 | MULTI-STEP PLANARIZING AND POLISHING METHOD - A multi-step planarizing and polishing method includes performing a first and a second polishing steps, wherein one of the two polishing steps is performed using a silica abrasive based slurry, while the other one of the two polishing steps is performed using a CeO | 10-02-2008 |
20080242199 | POLISHING APPARATUS AND METHOD OF RECONDITIONING POLISHING PAD - This polishing apparatus includes a head that holds a semiconductor wafer, a polishing pad that polishes a surface to be polished of the semiconductor wafer held by the head, and a dresser that reconditions the polishing pad by cutting the polishing pad. The polishing apparatus polishes a surface to be polished of the semiconductor wafer while causing the head and the polishing pad to rotate and reconditions the polishing pad by use of the dresser before and after polishing the surface to be polished. The polishing apparatus of the present invention supports at least two said dressers so that the dressers can rotate on their own axes and further includes a dresser oscillator that causes the dressers to oscillate simultaneously on the polishing pad. | 10-02-2008 |
20080293330 | Alumina-film-polishing composition and chemical mechanical polishing method using the same - An alumina-film-polishing composition is for use in chemical mechanical polishing of an object to be polished that includes an alumina film with an irregular surface, so as to planarize the irregular surface. The polishing composition contains an alumina abrasive grain, and a protection-film-forming agent for forming a protection film on the surface of each of the alumina film and the alumina abrasive grain. The protection-film-forming agent is a water-soluble polymer that has a weight average molecular weight within a range of 100 to 1,000,000 and that is obtained by polymerizing a monomer having at least one OH group or COOH group in its molecule. | 11-27-2008 |
20080293331 | METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMINCONDUCTOR MANUFACTURING - Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abrasive beads affixed to the base by the resin layer. The plurality of abrasive particles and/or beads may be embossed in the resin layer. The plurality of abrasive beads may include a plurality of abrasive particles suspended in binder material. The plurality of abrasive particles and/or beads and the resin layer combine to form an abrasive side of the polishing device adapted to contact the substrate. Polishing of the substrate preferably includes polishing an edge of the substrate while the substrate is rotated by a holding device such that no apparatus other than the polishing tape contacts the edge while the substrate is rotating. | 11-27-2008 |
20080293332 | POLISHING PAD AND METHOD OF POLISHING - A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object. | 11-27-2008 |
20080299873 | CMP apparatus - The present invention provides a CMP apparatus less susceptible to slurry adhesion, easy to cleaning off the adhering slurry therefrom and excellent in chemical resistance. The present invention is a CMP apparatus, at least one covered surface selected from the group consisting of a head portion surface and an arm portion surface for holding a polishing target member on a polishing pad, a slurry feed pipe surface and an apparatus main body inside wall being covered with a fluororesin. | 12-04-2008 |
20080305719 | Scratch removal device and method - A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a central passage to an outer edge. A reduced profile for the main radial flutes is provided adjacent to the outer edge. A plurality of secondary radial flutes is provided extending from the outer edge, but not in communication with either the central passage or the main radial flutes. The reduced profile for the main radial flute is defined by a variable depth portion. The secondary radial flutes defined by a variable depth portion. Each of the main radial flutes and the secondary radial flutes formed by a circular saw. An indexing machine is used to move the polishing wheel during the forming process. | 12-11-2008 |
20090047871 | Interpenetrating network for chemical mechanical polishing - Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continous non-fugitive phase and a substaintially co-continuous fugitive phase. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates. | 02-19-2009 |
20090075566 | LOW PH BARRIER SLURRY BASED ON TITANIUM DIOXIDE - The invention provides a method of chemically-mechanically polishing a substrate. A substrate is contacted with a polishing pad and a polishing composition comprising an abrasive consisting of (A) particles consisting of titanium dioxide having a rutile structure and (B) particles consisting of titanium dioxide having an anatase structure, wherein an x-ray diffraction pattern of the particles has a ratio of X/Y of about 0.5 or more, wherein X is an intensity of a peak in an x-ray diffraction curve representing a d-spacing of about 3.24 Å, and Y is an intensity of a peak in an x-ray diffraction curve representing a d-spacing of about 3.51 Å, and water. The polishing component is moved relative to the substrate, and at least a portion of the substrate is abraded to polish the substrate. | 03-19-2009 |
20090124173 | COMPOSITIONS AND METHODS FOR RUTHENIUM AND TANTALUM BARRIER CMP - This invention provides a chemical-mechanical polishing composition comprising an abrasive, an aqueous carrier, an oxidizing agent having a standard reduction potential of greater than 0.7 V and less than 1.3 V relative to a standard hydrogen electrode, and optionally a source of borate anions, with the proviso that when the oxidizing agent comprises a peroxide other than perborate, perphosphate, or percarbonate, the chemical-mechanical polishing composition further comprises a source of borate anions, wherein the pH of the chemical-mechanical polishing composition is between about 7 and about 12. The invention also provides a method of polishing a substrate with the aforementioned chemical-mechanical polishing composition. | 05-14-2009 |
20090191793 | Method of and device for abrasive machining and abrasive tool provided therefor - Fine abrasive machining of a part includes providing a tool having a plurality of successive portions configured and arranged so that each preceding portion provides a coarser abrasive machining while each subsequent portion provides a final abrasive machining, and providing a relative movement of the abrasive tool relative to the part so that first a portion of the tool configured a coarser abrasive machining machines a part and thereafter a portion of the tool configured for a finer machine provides abrasive machining of the part. | 07-30-2009 |
20090258575 | Chemical Mechanical Polishing Pad and Methods of Making and Using Same - Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates. | 10-15-2009 |
20090280722 | GRINDING MACHINE AND METHOD - A grinding machine is provided which includes a holding table adapted to hold a workpiece; a grinding unit operative to grind the workpiece held on the holding piece; and a grinding unit transfer mechanism operative to shift the grinding unit in a direction coming close to or moving away from the workpiece. The grinding unit includes a porous pad having a large number of fine pores opposed to the workpiece held on the holding table, a gel-like slurry storing portion provided on the porous pad so as to store gel-like slurry therein, and a water supply unit operative to supply water between the porous pad and the workpiece. The porous pad contains superabrasives at least at an outer circumferential portion, and the fine pores of the porous pad each have a diameter greater than that of each of the superabrasives contained in the gel-like slurry. | 11-12-2009 |
20100029181 | Methods and compositions for polishing silicon-containing substrates - The invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing a silicon-containing substrate. A method of the invention comprises the steps of contacting a silicon-containing substrate with a polishing pad and an aqueous CMP composition, and causing relative motion between the polishing pad and the substrate while maintaining a portion of the CMP composition in contact with the surface of the substrate to abrade at least a portion of the substrate. The CMP composition comprises a ceria abrasive, a polishing additive bearing a functional group with a pK | 02-04-2010 |
20100041316 | METHOD FOR AN IMPROVED CHEMICAL MECHANICAL POLISHING SYSTEM - A method for polishing a substrate on a pad large enough to accommodate polishing at least two substrates simultaneously The method includes simultaneously pressing a first substrate and a second substrate against a single polishing surface of a polishing module, providing polishing fluid from a first fluid delivery arm in front of the first substrate while the first substrate is pressed against the polishing surface, providing polishing fluid from a second fluid delivery arm at a location in front of the second substrate while the second substrate is pressed against the polishing surface, conditioning the polishing surface with a first conditioner at a location behind the first substrate while the first substrate is pressed against the polishing surface, and conditioning the polishing surface with a second conditioner at a location behind the second substrate while the second substrate is pressed against the polishing surface. | 02-18-2010 |
20110111677 | METHOD FOR POLISHING A SEMICONDUCTOR WAFER - A method for polishing a semiconductor wafer having a first side and a second side, the method includes polishing the first side using a Fixed Abrasive Polishing (FAP) with a polishing pad including fixedly bonded abrasives having an average particle size of 0.1-1.0 μm; applying a cement layer with a thickness of at most 3 μm to the polished first side; fixing the polished and cemented first side on a carrier plate of a polishing machine; and polishing the second side using a single-side chemical mechanical polishing. | 05-12-2011 |
20110275285 | POLISHING SOLUTION FOR CMP AND POLISHING METHOD USING THE POLISHING SOLUTION - The polishing solution for CMP according to the invention comprises abrasive grains, an additive and water, and the polishing solution comprises an organic compound satisfying specified conditions as the additive. The polishing method of the invention is for polishing of a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad. | 11-10-2011 |
20120184184 | TOOL FOR MACHINING A CMC BY MILLING AND ULTRASONIC ABRASION - The invention relates to a tool for machining hard materials such as metal-matrix or organic-matrix composite materials, comprising a cylindrical sonotrode ( | 07-19-2012 |
20130122786 | RINSING AGENT, AND METHOD FOR PRODUCTION OF HARD DISK SUBSTRATE - Provided are a rinsing agent to produce a hard disk substrate free from remaining abrasive grains as well as a pit defect on the surface thereof and a method for production of a hard disk substrate using such a rinsing agent. A rinsing agent of the present invention is rinsing solution containing colloidal silica as abrasive grains. Letting that the colloidal silica abrasive grains have a concentration C and an average grain size R (C and R are represented in weight % and nm, respectively), the concentration C and the average grain size R of the colloidal silica abrasive grains have a relation matching the following Expression (1): | 05-16-2013 |
20130225050 | LOCALIZED SPOT LAPPING ON A LARGER WORK SURFACE AREA - An apparatus for lapping a portion of an exterior surface of a housing is described. The apparatus includes at least a lapping tool arranged to execute a lapping operation. The lapping tool takes the form of a lapping pad which includes a conduit through which slurry can be transported for local deposition on the housing during a lapping operation. The apparatus also includes a stage on which a workpiece in the form of a housing is mounted. During the lapping operation, slurry is passed through the slurry conduit in the lapping tool, the lapping tool and the housing are moved in various motions. In this way, a gradual transition region is created between an accessory region and the remainder of the housing. | 08-29-2013 |
20130337724 | Transdermal Intraosseous Device - A transdermal intraosseous device includes a transdermal adapter for an external prosthetic device for a bone of a patient and a bone fixator including a distal portion coupled to the transdermal adapter and a proximal portion for anchoring into the bone. The transdermal adapter includes a dome-shaped portion for transcutaneous implantation and an external shaft extending from the dome-shaped portion. A dermal transition structure is configured to include a controlled roughness gradient from the external shaft to the dome-shaped portion and configured for use in infection control at a dermis layer of the patient. | 12-19-2013 |
20160129542 | MACHINE TOOL OF HIGH-FREQUENCY VIBRATION AND CONTROL METHOD OF SENSING/FEEDBACK SIGNALS THEREOF - A machine tool of high-frequency vibration is provided. A main shaft structure of the machine tool comprises a rotating shaft, the end of which is provided with a tool holder chuck for fixing a tool holder; the upper portion of which is provided with a rotating coil portion; the main shaft structure is correspondingly provided with a stationary coil portion; and the tool holder is provided with a high-frequency vibration module. By non-contact coils, an external electric power/signal can be transmitted into the high-frequency vibration module to avoid a wear phenomenon in a contact-rotating electrode. Because the inductive coil is arranged outside of the tool holder, the manufacturing cost of the tool holder is reduced, and the convenience of changing the tool holder is increased. Moreover, the machining stability and efficiency of the tool holder are improved by a control method of sensing/feedback signals with wireless transmission. | 05-12-2016 |
20160129548 | Abrasive cloth and polishing method - In accordance with an embodiment, a polishing method includes supplying slurry to a surface of a polishing layer including a polymer, and bringing a polishing object into contact with the polishing layer to polish the polishing object. The polishing layer has a fibrous first substance mixed therein or contains a second substance. The second substance is higher in specific heat and higher in thermal conductivity than the polymer in such a manner that the second substance is surrounded by the polymer. | 05-12-2016 |
20160375531 | MACHINING SYSTEM, APPARATUS AND METHOD - A method and apparatus for processing a metallic workpiece with defined edges (e.g., a gear) comprises media blasting of the workpiece by directing a first media against exposed surfaces on the workpiece to increase the root strength of the gear, the blasting causing the defined edges to be radiused or mushroomed, ceasing the media blasting, loading the workpiece into a finishing apparatus, and subjecting the workpiece to a finishing process with a second media, the exposed surfaces on the workpiece being subjected to the finishing process to reduce the radiused edges on the workpiece created from the media blasting. The process of moving the workpiece to the spindle-finishing apparatus from the media blasting may be performed automatically by a machine. Once the workpiece has been subjected to the finishing process with the second media, it may be removed from the spindle-finishing machine, washed, and rinsed with rust inhibitor whereby wear properties of the workpiece are enhanced. | 12-29-2016 |