| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 438486000 | And subsequent crystallization | 87 |
| 20100075486 | FORMATION OF SINGLE CRYSTAL SEMICONDUCTOR NANOWIRES - A method is provided for growing mono-crystalline nanostructures onto a substrate. The method comprises at least the steps of first providing a pattern onto a main surface of the substrate wherein said pattern has openings extending to the surface of the substrate, providing a metal into the openings of the pattern on the exposed main surface, at least partly filling the opening with amorphous material, and then annealing the substrate at temperatures between 300° C. and 1000° C. thereby transforming the amorphous material into a mono-crystalline material by metal mediated crystallization to form the mono-crystalline nanostructure. | 03-25-2010 |
| 20090155988 | ELEMENT OF LOW TEMPERATURE POLY-SILICON THIN FILM AND METHOD OF MAKING POLY-SILICON THIN FILM BY DIRECT DEPOSITION AT LOW TEMPERATURE AND INDUCTIVELY-COUPLED PLASMA CHEMICAL VAPOR DEPOSITION EQUIPMENT THEREFOR - A low temperature poly-silicon thin film element, method of making poly-silicon thin film by direct deposition at low temperature, and the inductively-coupled plasma chemical vapor deposition equipment utilized, wherein the poly-silicon material is induced to crystallize into a poly-silicon thin film at low temperature by means of high density plasma and substrate bias voltage. Furthermore, the atom structure of the poly-silicon thin film is aligned in regular arrangement by making use of the induction layer having optimal orientation and lattice constant close to that of the silicon, thus raising the crystallization quality of the poly-silicon thin film and reducing the thickness of the incubation layer. | 06-18-2009 |
| 20090124066 | PARTICLE BEAM ASSISTED MODIFICATION OF THIN FILM MATERIALS - Several examples of a method for processing a substrate are disclosed. In a particular embodiment, the method may include: disposing a substrate having an upper surface and a lower surface on a platen contained in a chamber; generating a plasma containing a plurality of charged particles above the upper surface of the substrate, the plasma having a cross sectional area equal to or greater than a surface area of the upper surface of the substrate; applying a first bias voltage to the substrate to attract the charged particles toward the upper surface of the substrate; introducing the charged particles to a region extending under entire upper surface of the substrate; and initiating, concurrently, a first phase transformation in the region from the amorphous phase to a crystalline phase. | 05-14-2009 |
| 20090124065 | PARTICLE BEAM ASSISTED MODIFICATION OF THIN FILM MATERIALS - Several examples of a method for processing a substrate are disclosed. In a particular embodiment, the method may include: disposing a substrate having an upper surface and a lower surface on a platen contained in a chamber; generating a plasma containing a plurality of charged particles above the upper surface of the substrate, the plasma having a cross sectional area equal to or greater than a surface area of the upper surface of the substrate; applying a first bias voltage to the substrate to attract the charged particles toward the upper surface of the substrate; introducing the charged particles to a region extending under entire upper surface of the substrate; and initiating, concurrently, a first phase transformation in the region from the amorphous phase to a crystalline phase. | 05-14-2009 |
| 20090124064 | PARTICLE BEAM ASSISTED MODIFICATION OF THIN FILM MATERIALS - Several examples of a method for processing a substrate are disclosed. In a particular embodiment, the method may include: disposing a substrate having an upper surface and a lower surface on a platen contained in a chamber; generating a plasma containing a plurality of charged particles above the upper surface of the substrate, the plasma having a cross sectional area equal to or greater than a surface area of the upper surface of the substrate; applying a first bias voltage to the substrate to attract the charged particles toward the upper surface of the substrate; introducing the charged particles to a region extending under entire upper surface of the substrate; and initiating, concurrently, a first phase transformation in the region from the amorphous phase to a crystalline phase. | 05-14-2009 |
| 20090170293 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes forming a first semiconductor layer on a semiconductor substrate, forming a second semiconductor layer on the first semiconductor layer, etching the second semiconductor layer and the first semiconductor layer to form a first groove passing through the second semiconductor layer and the first semiconductor layer, forming a support in the first groove, etching the second semiconductor layer to form a second groove that exposes the first semiconductor layer, forming a cavity between the second semiconductor layer and the semiconductor substrate by etching the first semiconductor layer through the second groove, forming a semiconductor film in the cavity, and thermally oxidizing the semiconductor film. | 07-02-2009 |
| 20110217828 | METHODS OF FABRICATING VERTICAL SEMICONDUCTOR DEVICE UTILIZING PHASE CHANGES IN SEMICONDUCTOR MATERIALS - A method of fabricating a vertical NAND semiconductor device can include changing a phase of a first preliminary semiconductor layer in an opening from solid to liquid to form a first single crystalline semiconductor layer in the opening and then forming a second preliminary semiconductor layer on the first single crystalline semiconductor layer. The phase of the second preliminary semiconductor layer is changed from solid to liquid to form a second single crystalline semiconductor layer that combines with the first single crystalline semiconductor layers to form a single crystalline semiconductor layer in the opening. | 09-08-2011 |
| 20100197121 | Methods of manufacturing semiconductor devices - A method of manufacturing a semiconductor device, the method including providing a substrate, the substrate including single crystalline silicon and having the first region and a second region; growing a pillar from a top surface of the substrate in the first region; forming a vertical channel transistor including a first gate structure such that first gate structure surrounds a central portion of the pillar; and forming a second transistor on the second region of the substrate such that the second transistor includes a second gate structure. | 08-05-2010 |
| 20120190180 | Thin film crystallization device and method for making a polycrystalline composition - A method for making a polycrystalline composition, wherein the method includes the steps of a) preparing a precursor material, b) heating the precursor material to a reaction temperature in the presence of a precursor vapor supplied from a source at a preselected partial pressure, for a sufficient time to initiate an interaction between the precursor material and the precursor vapor to form a heated precursor material, and c) cooling the heated precursor material at a predetermined cooling rate, optionally, in the presence of the precursor vapor supplied at a partial pressure, to yield the polycrystalline composition. A device for implementing the method of the present invention is also provided | 07-26-2012 |
| 20100087051 | LOCAL CRYSTALLIZATION BY HEAT TREATMENT - Disclosed is a crystallization apparatus capable of locally crystallizing amorphous silicon. The crystallization apparatus includes a heat emission part, a support part and a roller. The heat emission part emits heat upon receiving a heat emission source. The support part supports the heat emission part and provides the heat emission source to the heat emission part. The roller receives the heat emission part and has at least one opening to provide heat to a target (e.g., amorphous silicon). Local crystallization is performed without causing damage to a substrate. | 04-08-2010 |
| 20080233718 | Method of Semiconductor Thin Film Crystallization and Semiconductor Device Fabrication - A method of fabricating a semiconductor device includes providing a substrate, forming an amorphous silicon layer over the substrate, forming a patterned heat retaining layer over the amorphous silicon layer, doping the amorphous silicon layer to form a pair of doped regions in the amorphous silicon layer by using the patterned heat retaining layer as a mask, and irradiating the amorphous silicon layer to activate the pair of doped regions, forming a pair of activated regions, and form a crystallized region between the pair of activated regions. | 09-25-2008 |
| 20120058631 | Semiconductor Device and Manufacturing Method Thereof - An object is to provide a semiconductor device with improved reliability and for which a defect due to an end portion of a semiconductor layer provided in an island-shape is prevented, and a manufacturing method thereof. A structure includes an island-shaped semiconductor layer provided over a substrate, an insulating layer provided over a top surface and a side surface of the island-shaped semiconductor layer, and a gate electrode provided over the island-shaped semiconductor layer with the insulating layer interposed therebetween. In the insulating layer provided to be in contact with the island-shaped semiconductor layer, a region that is in contact with the side surface of the island-shaped semiconductor layer is made to have a lower dielectric constant than a region over the top surface of the island-shaped semiconductor layer. | 03-08-2012 |
| 20080286950 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device using a crystalline semiconductor film is manufactured. The crystalline semiconductor film is formed by providing an amorphous silicon film with a catalyst metal for promoting a crystallization thereof and then heated for performing a thermal crystallization, following which the crystallized film is further exposed to a laser light for improving the crystallinity. The concentration of the catalyst metal in the semiconductor film and the location of the region to be added with the catalyst metal are so selected in order that a desired crystallinity and a desired crystal structure such as a vertical crystal growth or lateral crystal growth can be obtained. Further, active elements and driver elements of a circuit substrate for an active matrix type liquid crystal device are formed by such semiconductor devices having a desired crystallinity and crystal structure respectively. | 11-20-2008 |
| 20080268622 | METHOD FOR MANUFACTURING A CRYSTALLINE SILICON LAYER - A method of forming a crystalline silicon layer on a microrough face of a substrate by reducing the microroughness of the face and then performing a metal induced crystallization process on the face is disclosed. The method further comprises, after metal induced crystallization and before removing the metal layer, removing silicon islands using the metal layer as a mask. | 10-30-2008 |
| 20100323503 | INTEGRATED EMITTER FORMATION AND PASSIVATION - Embodiments of the present invention provide a method for forming an emitter region in a crystalline silicon substrate and passivating the surface thereof by depositing a doped amorphous silicon layer onto the crystalline silicon substrate and thermally annealing the crystalline silicon substrate while oxidizing the surface thereof. In one embodiment, the deposited film is completely converted to oxide. In another embodiment, the doped amorphous silicon layer deposited onto the crystalline silicon substrate is converted into crystalline silicon having the same grain structure and crystal orientation as the underlying crystalline silicon substrate upon which the amorphous silicon was initially deposited during emitter formation. In one embodiment, at least a portion of the converted crystalline silicon is further converted into silicon dioxide during the emitter surface passivation. | 12-23-2010 |
| 20090004835 | Method for producing semi-conducting material wafers by moulding and directional crystallization - Wafers of semi-conducting material are formed by moulding and directional crystallization from a liquid mass of this material. A seed, situated at the bottom of the crucible, presents an orientation along non-dense crystallographic planes. The mould is filled with the molten semi-conducting material by means of a piston or by creation of a pressure difference in the device. The mould is preferably coated with a non-wettable anti-adhesive deposit. | 01-01-2009 |
| 20090221135 | Rapid Heating With Nanoenergetic Materials - The present process for rapidly heating and cooling a target material without damaging the substrate upon which it has been deposited. More specifically, target material is coated onto a first substrate. A self-propagating nanoenergetic material is selected that combusts at temperatures sufficient to change the target material and creates a flame front that propagates sufficiently quickly that the first substrate is not substantially heated. The nanoenergetic material is deposited on the target material, such that the target material and the nanoenergetic material is sandwiched between the substrate and the target material. The nanoenergetic material is ignited and the flame front of the nanoenergetic material is allowed to propagate over the second substrate and change the target material. | 09-03-2009 |
| 20080213983 | Method for manufacturing semiconductor device - Method for manufacturing a semiconductor device including a transistor having a grooved gate structure and a transistor having a planar gate structure on the same substrate, in which, even when the semiconductor device is configured as a dual gate structure in which a gate electrode structure is a poly-metal gate structure, and a grooved gate and a planar gate are made in different conductivity types, then sufficient dopant is injected into polysilicon in the grooved gate to prevent depletion, and impurity ions do not pass through a gate insulating film even when the planar gate is formed also polysilicon having the same film thickness. The method includes: injecting ions into an amorphous silicon layer for the grooved gate; subsequently, turning it into polysilicon once; injecting ions once again to amorphousize a surface layer of the polysilicon layer and injecting ions of a different conductivity type for the planar gate. | 09-04-2008 |
| 20100144128 | Phase Change Memory Cell and Manufacturing Method - A phase change memory cell includes first and second electrodes electrically coupled by a phase change element. At least a section of the phase change element comprises a higher reset transition temperature portion and a lower reset transition temperature portion. The lower reset transition temperature portion comprises a phase change region which can be transitioned, by the passage of electrical current therethrough, from generally crystalline to generally amorphous states at a lower temperature than the higher reset transition temperature portion. The phase change element may comprise an outer, generally tubular, higher reset transition temperature portion surrounding an inner, lower reset transition temperature portion. | 06-10-2010 |
| 20120034766 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A process for fabricating a highly stable and reliable semiconductor, comprising: coating the surface of an amorphous silicon film with a solution containing a catalyst element capable of accelerating the crystallization of the amorphous silicon film, and heat treating the amorphous silicon film thereafter to crystallize the film. | 02-09-2012 |
| 20110014781 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - According to one embodiment, a method of fabricating a semiconductor device includes forming a first insulator on a semiconductor substrate, forming a first groove on the insulator to expose at least a part of the semiconductor substrate at a bottom of the first groove, forming a first embedding film including at least germanium in the groove, melting the first embedding film by heat treatment, and crystallizing the first embedding film being melted to a single-crystalline film using the semiconductor substrate as a seed. | 01-20-2011 |
| 20110097881 | Method of Forming Mono-Crystalline Germanium or Silicon Germanium - A method is presented for forming mono-crystalline germanium or silicon germanium in a trench. In an embodiment, the method comprises providing a substrate comprising at least one active region that is adjacent to two insulating regions, forming in the active region a trench having a width of less than 100 nm, and forming in the trench a fill layer at a temperature of less than 450° C. that comprises germanium or silicon germanium and substantially fills the trench. The method further comprises heating the fill layer to a temperature sufficient to substantially melt the fill layer and allowing re-crystallization of the substantially melted fill layer, thereby forming mono-crystalline germanium or silicon germanium in the trench. In an embodiment, the method further comprises forming a mono-crystalline germanium or silicon germanium fin by removing at least a portion of the insulating regions. The mono-crystalline fin may be comprised in a fin field-effect-transistor (finFET). | 04-28-2011 |
| 20110151651 | METHOD FOR FORMING INTEGRATED CIRCUITS WITH ALIGNED (100) NMOS AND (110) PMOS FINFET SIDEWALL CHANNELS - A method of forming an integrated circuit device that includes a plurality of multiple gate FinFETs (MuGFETs) is disclosed. Fins of different crystal orientations for PMOS and NMOS MuGFETs are formed through amorphization and crystal regrowth on a direct silicon bonded (DSB) hybrid orientation technology (HOT) substrate. PMOS MuGFET fins are formed with channels defined by fin sidewall surfaces having (110) crystal orientations. NMOS MuGFET fins are formed with channels defined by fin sidewall surfaces having (100) crystal orientations in a Manhattan layout with the sidewall channels of the different PMOS and NMOS MuGFETs aligned at 0° or 90° rotations. | 06-23-2011 |
| 20080206968 | Manufacturing method of semiconductor device - To create a laminated film of a silicon oxide film and a silicon nitride film, with large current driving force and large dielectric constant. A manufacturing method of a semiconductor device includes: forming an amorphous silicon film on the silicon oxide film; and forming a single crystal silicon film by annealing the amorphous silicon film. | 08-28-2008 |
| 20080200014 | METHOD OF FORMING A VERTICAL DIODE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - A method of forming a vertical diode and a method of manufacturing a semiconductor device (e.g., a semiconductor memory device such as a phase-change memory device) includes forming an insulating structure having an opening on a substrate and filling the opening with an amorphous silicon layer. A metal silicide layer is formed to contact at least a portion of the amorphous silicon layer and a polysilicon layer is then formed in the opening by crystallizing the amorphous silicon layer using the metal silicide layer. A doped polysilicon layer is formed by implanting impurities into the polysilicon layer. Thus, the polysilicon layer is formed in the opening without performing a selective epitaxial growth (SEG) process, so that electrical characteristics of the diode may be improved. | 08-21-2008 |
| 20110021008 | Directional Solid Phase Crystallization of Thin Amorphous Silicon for Solar Cell Applications - Embodiments of the present invention provide a method for converting a doped amorphous silicon layer deposited onto a crystalline silicon substrate into crystalline silicon having the same grain structure and crystal orientation as the underlying crystalline silicon substrate upon which the amorphous silicon was initially deposited. Additional embodiments of the present invention provide depositing a dielectric passivation layer onto the amorphous silicon layer prior to the conversion. A temperature gradient is provided at a temperature and for a time period sufficient to provide a desired p-n junction depth and dopant profile. | 01-27-2011 |
| 20090061602 | METHOD FOR DOPING POLYSILICON AND METHOD FOR FABRICATING A DUAL POLY GATE USING THE SAME - A method for doping polysilicon improves a doping profile during plasma doping and includes forming a silicon layer using two separate operations. After forming a first silicon layer, thermal annealing is performed to crystallize the first silicon layer, such that the uniformity of a doping concentration according to the depth of a layer inside is improved during plasma doping. Additionally, a doping concentration at the interface between a polysilicon layer and a gate oxide layer is increased. A by-product deposition layer is reduced, which is formed on the surface of a polysilicon layer due to the increase of a doping concentration in a polysilicon layer. As a result, the dopant loss, which is caused by the removing and cleansing of an ion implantation barrier used during doping, is reduced. | 03-05-2009 |
| 20090042372 | Polysilicon Deposition and Anneal Process Enabling Thick Polysilicon Films for MEMS Applications - A method of forming a thick polysilicon layer for a MEMS inertial sensor includes forming a first amorphous polysilicon film on a substrate in an elevated temperature environment for a period of time such that a portion of the amorphous polysilicon film undergoes crystallization and grain growth at least near the substrate. The method also includes forming an oxide layer on the first amorphous polysilicon film, annealing the first amorphous polysilicon film in an environment of about 1100° C. or greater to produce a crystalline film, and removing the oxide layer. Lastly, the method includes forming a second amorphous polysilicon film on a surface of the crystalline polysilicon film in an elevated temperature environment for a period of time such that a portion of the second amorphous polysilicon film undergoes crystallization and grain growth at least near the surface of the crystalline polysilicon film. | 02-12-2009 |
| 20110053355 | Plasma apparatus and method of fabricating nano-crystalline silicon thin film - A plasma apparatus having a chamber, a set of arc electrodes and a substrate holder is provided. The set of arc electrodes disposed within the chamber has an anode and a cathode, wherein an arc forming space is formed between the anode and the cathode. The anode and the cathode respectively have a crystallized silicon target. The crystallized silicon target of the anode is disposed on an end facing to that of the cathode, wherein the resistance of the crystallized silicon targets is smaller than 0.01 Ω·cm. The substrate holder is disposed within the chamber and has a carrying surface, wherein the carrying surface is face to the arc forming space. Besides, a method of fabricating nano-crystalline silicon thin film is also provided. By using the plasma apparatus, a nano-crystalline silicon thin film with high quality is formed. | 03-03-2011 |
| 20090081855 | FABRICATION METHOD OF POLYSILICON LAYER - A fabrication method of a polysilicon layer is provided. First, a substrate is provided. Then, an amorphous silicon layer is formed on the substrate. After that, a patterned photomask having a light transmitting area and a light shielding area is provided, and the amorphous silicon layer is irradiated with a light by using the patterned photomask as a mask, wherein the amorphous silicon layer corresponding to the light transmitting area is transformed into a hydrophilic amorphous silicon layer, and the amorphous silicon layer corresponding to the light shielding area remains as a hydrophobic amorphous silicon layer. Next, a hydrophilic metal catalyst is provided and disposed on the hydrophilic amorphous silicon layer. After that, an annealing process is performed to transform the hydrophilic metal catalyst into a metal catalyst layer, and the metal catalyst layer reacts with the amorphous silicon layer to form a polysilicon layer. | 03-26-2009 |
| 20120164819 | APPARATUS AND METHOD FOR MANUFACTURING POLY-SI THIN FILM - An apparatus and method for fabricating a polycrystalline silicon (poly-Si) thin film are provided. The apparatus includes a chamber, a substrate stage installed at a lower portion in the chamber and on which a substrate including a conductive layer is located, a power application unit installed at an upper portion in the chamber and including an electrode terminal applying power to the conductive layer, and a conductive pad interposed between the electrode terminal and the conductive layer. Thus, it is possible to form a uniform electric field on the conductive layer, and to form a good quality of poly-Si thin film. | 06-28-2012 |
| 20090130827 | INTRINSIC AMORPHOUS SILICON LAYER - Embodiments of the present invention may include an improved thin film solar cell device that is formed by sequentially depositing an intrinsic amorphous silicon layer and an intrinsic microcrystalline silicon layer during the p-i-n or n-i-p junction formation process. Embodiments of the invention also generally provide a method and apparatus for forming the same. The present invention may be used to advantage to form other single junction, tandem junction, or multi-junction thin film solar cell devices. | 05-21-2009 |
| 20110207302 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SUBSTRATE PROCESSING METHOD AND APPARATUS - Embodiments described herein relate to improving the quality of a substrate and the performance of a semiconductor device, which is caused by contaminates or particles being engrained into a substrate with a silicon film formed thereon, and forming a silicon film with a small surface roughness. Provided is a semiconductor device manufacturing method that includes forming a silicon film on a substrate, supplying an oxidation seed onto the substrate, performing heat treatment on the silicon film, modifying the surface layer of the silicon film into an oxidized silicon film, and removing the oxidized silicon film. | 08-25-2011 |
| 20110237055 | Methods of Manufacturing Stacked Semiconductor Devices - A stacked semiconductor device that is reliable by forming an insulating layer on a lower memory layer and by forming a single crystalline semiconductor in portions of the insulating layer. A method of manufacturing the stacked semiconductor device, including: providing a lower memory layer including a plurality of lower memory structures; forming an insulating layer on the lower memory layer; forming trenches by removing portions of the insulating layer; forming a preparatory semiconductor layer for filling the trenches; and forming a single crystalline semiconductor layer by phase-changing the preparatory semiconductor layer. | 09-29-2011 |
| 20100184276 | LOW-TEMPERATURE FORMATION OF POLYCRYSTALLINE SEMICONDUCTOR FILMS VIA ENHANCED METAL-INDUCED CRYSTALLIZATION - A method for forming polycrystalline semiconductor film from amorphous semiconductor film at reduced temperatures and/or accelerated rates. The inclusion of a small percentage of semiconductor material, such as 2% within the metal layer, reduces the temperatures required for crystallization of the amorphous semiconductor by at least 50° C. in comparison to the use of the metal layer without the small percentage of semiconductor material. During a low temperature isothermal annealing process adjacent Al-2% Si and a-Si films undergo a layer exchange resulting in formation of a continuous polycrystalline silicon film having good physical and electrical properties. Formation of polycrystalline-semiconductor in this manner is suitable for use with low temperature substrates (e.g., glass, plastic) as well as with numerous integrated circuit and MEMs fabrication devices and practices. | 07-22-2010 |
| 20130023111 | LOW TEMPERATURE METHODS AND APPARATUS FOR MICROWAVE CRYSTAL REGROWTH - Semiconductor devices and methods for making such devices are described. The semiconductor devices contain an epitaxial layer made by providing a semiconductor substrate containing an upper surface with a single-crystal structure; forming a layer on the upper surface of the substrate, wherein the layer comprises substantially the same material as the semiconductor substrate and comprises an amorphous or polycrystalline structure; and heating the layer using low temperature microwaves to change the amorphous structure to a single-crystal structure. The epitaxial layer can also be made by providing the semiconductor substrate with an upper surface of a single-crystal material and then forming an epitaxial layer on the substrate upper surface using microwaves at a wafer temperature less than about 550° C. In-situ or implanted dopants in the epitaxial layer can be activated using the same, or separate, low temperature microwave processing. Other embodiments are described. | 01-24-2013 |
| 438487000 | Utilizing wave energy (e.g., laser, electron beam, etc.) | 51 |
| 20110183502 | Linear and Cross-Linked High Molecular Weight Polysilanes, Polygermanes, and Copolymers Thereof, Compositions Containing the Same, and Methods of Making and Using Such Compounds and Compositions - Methods are disclosed of making linear and cross-linked, HMW (high molecular weight) polysilanes and polygermanes, polyperhydrosilanes and polyperhydrogermanes, functional liquids containing the same, and methods of using the liquids in a range of desirable applications. The silane and germane polymers are generally composed of chains of Si and/or Ge substituted with R′ substituents, where each instance of R′ is, for example, independently hydrogen, halogen, alkenyl, alkynyl, hydrocarbyl, aromatic hydrocarbyl, heterocyclic aromatic hydrocarbyl, SiR″ | 07-28-2011 |
| 20100159676 | Method For Manufacturing A Mono-Crystalline Semiconductor Layer on a Substrate - The described system relates to a method for forming a layer of a mono-crystalline semiconductor material on a substrate comprising providing a substrate, growing epitaxially a template comprising at least one monolayer of a semiconductor material on the substrate, thereafter depositing an amorphous layer of said semiconductor material on the template, and performing a thermal treatment or a laser anneal, thereby converting substantially all of the amorphous layer of the semiconductor material into a mono-crystalline layer of said semiconductor material. According to an embodiment, the semiconductor material is Ge, and the substrate is a Si substrate. The template is preferably a few monolayers thick. | 06-24-2010 |
| 20100075487 | Crystallization method - To crystallize a material, a thin layer of amorphous or polycrystalline material is deposited on at least one area of the surface of a top part of a substrate. A metal layer is then deposited on at least one area of the thin layer. Thermal treatment is then performed to enable crystalline growth of the material of the thin layer, resulting in:
| 03-25-2010 |
| 20100105196 | METHOD FOR PATTERNING POLYCRYSTALLINE INDIUM TIN OXIDE - A method for patterning polycrystalline indium tin oxide by using a Gaussian laser beam focused on an amorphous indium tin oxide layer is disclosed to pattern the non-crystalline amorphous indium tin oxide layer and transfer part of the amorphous indium tin oxide layer into polycrystalline indium tin oxide while the remaining amorphous indium tin oxide layer is etched due to etching selectivity of an etching solution. The method comprises: providing a substrate with an amorphous indium tin oxide layer thereon on a carrier; transferring the amorphous indium tin oxide layer in a predetermined area into a polycrystalline indium tin oxide layer by emitting a Gaussian laser beam focused on the amorphous indium tin oxide layer in the predetermined area; and removing the remaining amorphous indium tin oxide layer on the substrate by an etching solution to form a patterned polycrystalline indium tin oxide layer. | 04-29-2010 |
| 20090061603 | METHOD OF CRYSTALLIZING SEMICONDUCTOR FILM - A method of crystallizing a semiconductor film including splitting a pulse laser beam oscillated from a laser oscillator, and synthesizing the split pulse laser beams after the split pulse laser beams have propagated through optical paths different in optical path length, modulating the synthesized pulse laser beam into a pulse laser beam by a phase modulating element, and irradiating a non-single-crystal film formed on a substrate with the laser beam to crystallize the non-single-crystal film. Splitting the pulse laser beam and synthesizing the split pulse laser beams are performed using at least three optical splitting/synthesizing units arranged in order, and include sequentially splitting one pulse laser beam split by one optical splitting/synthesizing unit by succeeding splitting/synthesizing unit, and synthesizing the other pulse laser beam split by one optical splitting/synthesizing unit with the other pulse laser beam split by preceding splitting/synthesizing unit. | 03-05-2009 |
| 20090149007 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are an electronic device and a method of manufacturing the same. The device includes a plastic substrate, a transparent thermal conductive layer stacked on the plastic substrate, a polysilicon layer stacked on the thermal conductive layer; and a functional device disposed on the polysilicon layer. The functional device is any one of a transistor, a light emitting device, and a memory device. The functional device may be a thin film transistor including a gate stack stacked on the polysilicon layer. | 06-11-2009 |
| 20120295426 | CMOS WITH CHANNEL P-FINFET AND CHANNEL N-FINFET HAVING DIFFERENT CRYSTALLINE ORIENTATIONS AND PARALLEL FINS - A method for fabricating an integrated circuit with at least one p-FinFET device and at least one n-FinFET device. The method includes bonding a first silicon layer having a first crystalline orientation to a second silicon layer having a second crystalline orientation that is different from the first crystalline orientation. A first plurality of fins and a second plurality of fins are created. A spacer is formed around each fin in the first plurality of fins and second plurality of fins. A set of regions of the second layer between each fin in the first plurality of fins and the second plurality of fins are recessed to form a base with exposed sidewalls under each fin in the first plurality of fins and the second plurality of fins. The base under each fin and a set of exposed regions between each fin is oxidized. | 11-22-2012 |
| 20110201183 | METHOD FOR MANUFACTURING CRYSTALLINE SEMICONDUCTOR FILM AND SEMICONDUCTOR DEVICE - There is provided a method for manufacturing a crystalline semiconductor film. An insulating film is formed over a substrate; an amorphous semiconductor film is formed over the insulating film; a cap film is formed over the amorphous semiconductor film; the amorphous semiconductor film is scanned and irradiated with a continuous wave laser beam or a laser beam with a repetition rate of greater than or equal to 10 MHz, through the cap film; and the amorphous semiconductor film is melted and crystallized At this time, an energy distribution in a length direction and a width direction in a laser beam spot is a Gaussian distribution, and the amorphous semiconductor film is scanned with the laser beam so as to be irradiated with the laser beam for a period of greater than or equal to 5 microseconds and less than or equal to 100 microseconds per region. | 08-18-2011 |
| 20110207304 | Method of Fabricating Semiconductor Devices - Methods of fabricating a semiconductor device include alternatingly and repeatedly stacking sacrificial layers and first insulating layers on a substrate, forming an opening penetrating the sacrificial layers and the first insulating layers, and forming a spacer on a sidewall of the opening, wherein a bottom surface of the opening is free of the spacer. A semiconductor layer is formed in the opening. Related devices are also disclosed. | 08-25-2011 |
| 20110207303 | Methods of Fabricating Semiconductor Devices - Methods for fabricating a semiconductor device are provided. In the methods, first material layers and second material layers may be alternatingly and repeatedly stacked on a substrate. An opening penetrating the first material layers and the second material layers may be formed. A semiconductor solution may be formed in the opening by using a spin-on process. | 08-25-2011 |
| 20080233719 | Method for Manufacturing Crystalline Semiconductor Film and Method for Manufacturing Thin Film Transistor - The present invention relates to a method for manufacturing a polycrystalline semiconductor film that can be used for a semiconductor device. In the method, an amorphous semiconductor film is irradiated with a femtosecond laser to be crystallized. By laser irradiation using a femtosecond laser, when an amorphous semiconductor film over which a cap film is formed is crystallized with a laser, it becomes possible to perform crystallization of the semiconductor film and removal of the cap film at the same time. Therefore, a step of removing the cap film in a later step can be omitted. | 09-25-2008 |
| 20080206969 | Laser Optical Apparatus - There is provided a structure for reducing optical loss in an optical apparatus (homogenizer) for making the intensity distribution of a laser beam uniform. | 08-28-2008 |
| 20090137105 | SYSTEMS AND METHODS FOR PREPARING EPITAXIALLY TEXTURED POLYCRYSTALLINE FILMS - The disclosed subject matter relates to systems and methods for preparing epitaxially textured polycrystalline films. In one or more embodiments, the method for making a textured thin film includes providing a precursor film on a substrate, the film includes crystal grains having a surface texture and a non-uniform degree of texture throughout the thickness of the film, wherein at least a portion of the this substrate is transparent to laser irradiation; and irradiating the textured precursor film through the substrate using a pulsed laser crystallization technique at least partially melt the film wherein the irradiated film crystallizes upon cooling to form crystal grains having a uniform degree of texture. | 05-28-2009 |
| 20090137104 | Method of fabricating polycrystalline semiconductor - Disclosed is a method of providing a poly-Si layer used in fabricating poly-Si TFT's or devices containing poly-Si layers. Particularly, a method utilizing at least one metal plate covering the amorphous silicon layer or the substrate, and applying RTA (Rapid Thermal Annealing) for light illuminating process, then the light converted into heat by the metal plate will further be conducted to the amorphous silicon layer to realize rapid thermal crystallization. Thus the poly-Si layer of the present invention is obtained. | 05-28-2009 |
| 20080318398 | Method for manufacturing crystalline semiconductor film and semiconductor device - There is provided a method for manufacturing a crystalline semiconductor film. An insulating film is formed over a substrate; an amorphous semiconductor film is formed over the insulating film; a cap film is formed over the amorphous semiconductor film; the amorphous semiconductor film is scanned and irradiated with a continuous wave laser beam or a laser beam with a repetition rate of greater than or equal to 10 MHz, through the cap film; and the amorphous semiconductor film is melted and crystallized. At that time, an energy period in a length direction in a laser beam spot of the laser beam is 0.5 μm to 10 μm, preferably, 1 μm to 5 μm; an energy distribution in a width direction in a laser beam spot of the laser beam is a Gaussian distribution; and the amorphous semiconductor film is scanned with the laser beam so as to be irradiated with the laser beam for a period of greater than or equal to 5 microseconds and less than or equal to 100 microseconds per region. | 12-25-2008 |
| 20110223748 | METHOD FOR PHASE TRANSITION OF AMORPHOUS MATERIAL - Disclosed herein is a method of crystallizing an amorphous material for use in fabrication of thin film transistors. The method includes forming an amorphous silicon layer on a substrate, depositing a Ni metal layer on part of the amorphous silicon layer, and heat-treating the amorphous silicon layer to cause phase transition of the amorphous silicon, wherein the Ni metal layer is deposited to an average thickness of 0.79 Å or less. The method can crystallize an amorphous material for use in thin film transistors using the metal induced lateral crystallization while restricting thickness and density of Ni, thereby minimizing current leakage in the thin film transistor. | 09-15-2011 |
| 20090104759 | Methods of manufacturing semiconductor devices including a doped silicon layer - Methods for manufacturing a semiconductor device include forming a seed layer containing a silicon material on a substrate. An amorphous silicon layer containing amorphous silicon material is formed on the seed layer. The amorphous silicon layer is doped with an impurity. A laser beam is irradiated onto the amorphous silicon layer to produce a phase change of the amorphous silicon layer and change the amorphous silicon layer into a single-crystal silicon layer based on the seed layer. | 04-23-2009 |
| 20090075460 | PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE - A process for fabricating a semiconductor device comprising the steps of introducing into an amorphous silicon film, a metallic element which accelerates the crystallization of the amorphous silicon film; applying heat treatment to the amorphous silicon film to obtain a crystalline silicon film; irradiating a laser beam or an intense light to the crystalline silicon film; and heat treating the crystalline silicon film irradiated with a laser beam or an intense light. | 03-19-2009 |
| 20110230037 | BEAM HOMOGENIZER, LASER IRRADIATION APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - The present invention provides a beam homogenizer being able to form a rectangular beam spot having homogeneous energy distribution in a direction of its major axis without using the optical lens requiring to be manufactured with high accuracy. In addition, the present invention provides a laser irradiation apparatus being able to irradiate the laser beam having homogeneous energy distribution in a direction of its major axis. Furthermore, the present invention provides a method for manufacturing a semiconductor device being able to enhance crystallinity in the surface of the substrate and to manufacture TFT with a high operating characteristic. | 09-22-2011 |
| 20090117716 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE - To provide a high-performance semiconductor device using an SOI substrate in which a substrate having low heat resistance is used as a base substrate, to provide a high-performance semiconductor device without performing mechanical polishing, and to provide an electronic device using the semiconductor device, planarity of a semiconductor layer is improved and defects in the semiconductor layer are reduced by laser beam irradiation. Accordingly, a high-performance semiconductor device can be provided without performing mechanical polishing. In addition, a semiconductor device is manufactured using a region having the most excellent characteristics in a region irradiated with the laser beam. Specifically, instead of the semiconductor layer in a region which is irradiated with the edge portion of the laser beam, the semiconductor layer in a region which is irradiated with portions of the laser beam except the edge portion is used as a semiconductor element. Accordingly, performance of the semiconductor device can be greatly improved. Moreover, an excellent electronic device can be provided. | 05-07-2009 |
| 20100227458 | METHOD OF FORMING POLYCRYSTALLINE SILICON LAYER AND ATOMIC LAYER DEPOSITION APPARATUS USED FOR THE SAME - A method of forming a polycrystalline silicon layer and an atomic layer deposition apparatus used for the same. The method includes forming an amorphous silicon layer on a substrate, exposing the substrate having the amorphous silicon layer to a hydrophilic or hydrophobic gas atmosphere, placing a mask having at least one open and at least one closed portion over the amorphous silicon layer, irradiating UV light toward the amorphous silicon layer and the mask using a UV lamp, depositing a crystallization-inducing metal on the amorphous silicon layer, and annealing the substrate to crystallize the amorphous silicon layer into a polycrystalline silicon layer. This method and apparatus provide for controlling the seed position and grain size in the formation of a polycrystalline silicon layer. | 09-09-2010 |
| 20080213986 | LASER ANNEALING METHOD AND LASER ANNEALING DEVICE - In order to promote an effect of laser annealing in respect of a semiconductor film, moisture is intentionally included in an atmosphere in irradiating laser beam to the semiconductor film by which a temperature holding layer comprising water vapor is formed on the surface of the semiconductor film in irradiating the laser beam and the laser annealing operation can be performed effectively. | 09-04-2008 |
| 20100221899 | METHOD OF MANUFACTURING A POLYCRYSTALLINE SEMICONDUCTOR THIN FILM - A TFT and the like capable of realizing performances such as a low threshold voltage value, high carrier mobility and a low leak current easily. A TFT consists of a polycrystalline Si film having a small heat capacity part and a large heat capacity part, and the small heat capacity part is used at least as a channel part. The polycrystalline Si film is formed of a crystal grain film through laser annealing of an energy density with which the small heat capacity part melts completely but the large heat capacity part does not melt completely. Since the channel part is formed of large crystal grains grown from the boundaries between the small heat capacity part and the large heat capacity parts, it is possible to realize performances such as a low threshold voltage value, high carrier mobility and a low leak current by using a typical laser annealing device. | 09-02-2010 |
| 20080280425 | Beam Homogenizer, and Laser Irradiation Method, Laser Irradiation Apparatus, and Laser Annealing Method of Non-Single Crystalline Semiconductor Film Using the Same - A rectangular beam having the energy density distribution homogenized in its short-side direction is formed in a beam homogenizer wherein two light reflection surfaces are parallel-provided in a beam progression optical waveguide with a predetermined space so as to face each other at surfaces along the beam progression direction and a course change reflection surface for changing the beam progression direction is formed at a surface in the direction intersected with the light reflection surfaces. The beam enters a cylindrical lens array and a cylindrical lens sequentially to homogenize the energy density distribution in its long-side direction. Then, the irradiation laser from the cylindrical lens is projected onto a non-single crystalline semiconductor film to perform annealing. | 11-13-2008 |
| 20100221898 | LASER ANNEALING METHOD AND LASER ANNEALING DEVICE - The energy distribution in the short-side direction of a rectangular laser beam applied to an amorphous semiconductor film (amorphous silicon film) is uniformized. It is possible to the energy distribution in the short-side direction of the rectangular laser beam by the use of a cylindrical lens array | 09-02-2010 |
| 20110117731 | LASER MASK AND SEQUENTIAL LATERAL SOLIDIFICATION CRYSTALLIZATION METHOD USING THE SAME - A laser mask is disclosed. In one embodiment, the laser mask includes: a mask substrate including i) at least one light transmission portion configured to transmit light therethrough and ii) a plurality of light interruption portions separated by the light transmission portion interposed therebetween. The light interruption portions are configured to block light; and a plurality of protrusion and depression regions positioned on the light interruption portions of the mask substrate. The protrusion and depression regions comprise a plurality of concave portions and a plurality of convex portions which are alternately formed. | 05-19-2011 |
| 20110111580 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE - According to one embodiment, a method of fabricating a semiconductor device is disclosed. The method can include forming an amorphous layer on a portion of a first silicon substrate having a first plane orientation, and irradiating with micro wave on the amorphous layer to transform from the amorphous layer into a crystalline layer having the first plane orientation. | 05-12-2011 |
| 20100330785 | METHOD OF MANUFACTURING CRYSTALLINE SEMICONDUCTOR THIN FILM - Provided is a method of manufacturing a crystalline semiconductor thin film formed on an amorphous or poly-crystalline substrate such as a glass substrate, a ceramic substrate, and a plastic substrate through induction heating using photo-charges. The method of manufacturing a crystalline semiconductor thin film includes a process of forming a low-concentration semiconductor layer on an inexpensive amorphous or poly-crystalline substrate such as a glass substrate, a ceramic substrate, and a plastic substrate and a process of crystallizing the low-concentration semiconductor layer through an induction heating manner using photo-charges. Accordingly, a low-concentration crystalline semiconductor thin film having characteristics better than those of general amorphous or poly-crystalline semiconductor thin film can be obtained by using simple processes at low production cost. | 12-30-2010 |
| 20110034009 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - To provide a thin film transistor having a high field effect mobility and a small variation in characteristics thereof, a second amorphous semiconductor layer patterned in a predetermined shape is formed on a first crystalline semiconductor layer | 02-10-2011 |
| 20100112792 | THICK EPITAXIAL SILICON BY GRAIN REORIENTATION ANNEALING AND APPLICATIONS THEREOF - The invention provides a high temperature (about 1150° C. or greater) annealing process for converting thick polycrystalline Si layers on the order of 1 μm to 40 μm on a single crystal seed layer into thick single crystal Si layers having the orientation of the seed layer, thus allowing production of thick Si films having the quality of single crystal silicon at high rates and low cost of processing. Methods of integrating such high temperature processing into solar cell fabrication are described, with particular attention to process flows in which the seed layer is disposed on a porous silicon release layer. Another aspect pertains to the use of similar high temperature anneals for poly-Si grain growth and grain boundary passivation. A further aspect relates to structures in which these thick single crystal Si films and passivated poly-Si films are incorporated. | 05-06-2010 |
| 20090317961 | BEAM HOMOGENIZER AND LASER IRRADIATION APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The inhomogeneous energy distribution at the beam spot on the irradiated surface is caused by a structural problem and processing accuracy of the cylindrical lens array forming an optical system. | 12-24-2009 |
| 20080213985 | METHOD OF FORMING POLYCRYSTALLINE SILICON THIN FILM AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR USING THE METHOD - Provided is a method of forming a polycrystalline silicon thin film with improved electrical characteristics. The method includes forming an amorphous silicon thin film on a substrate, partially melting a portion of the amorphous silicon thin film by irradiating the portion of the amorphous silicon thin film with a laser beam having a low energy density, forming polycrystalline silicon grains with a predetermined crystalline arrangement by crystallizing the partially molten portion of the amorphous silicon thin film, completely melting a portion of the polycrystalline silicon grains and a portion of the amorphous silicon thin film by irradiation of a laser beam having a high energy density while repeatedly moving the substrate by a predetermined distance, and growing the polycrystalline silicon grains by crystallizing the completely molten silicon homogeneously with the predetermined crystalline arrangement. | 09-04-2008 |
| 20080213984 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A cap film is formed over semiconductor films formed over an insulating substrate; the semiconductor films are irradiated with a laser beam which is capable of completely melting the semiconductor film in a film-thickness direction to completely melt the semiconductor film. By controlling the laser beam, a crystalline semiconductor films are formed over the substrate, in each of which orientations of crystal planes are controlled. In addition, an n-channel thin film transistor is formed using a crystalline region in which crystal planes are oriented along {001} and a p-channel thin film transistor is formed using a crystalline region in which crystal planes are oriented along {211} or {101}. | 09-04-2008 |
| 20080227274 | MANUFACTURING METHOD OF DISPLAY DEVICE - In crystallization of a silicon film by annealing using a linear-shaped laser beam having a width of the short axis of the beam is ununiform, the profile (intensity distribution) of the laser beam is evaluated and the results are fed back to a condition of oscillating the laser beam or an optical condition for projecting the laser beam onto the silicon film, whereby a display device comprising a high-quality crystalline silicon film is manufactured. The energy distribution of the linear-shaped laser beam is determined by a detector type CCD camera which is moved stepwise in the directions in which its long axis and short axis extend, respectively, and a value obtained by dividing an accumulated intensity E in the long axis direction obtained by accumulating the detected signal in the direction parallel to the short axis by the square root of the width W of the short axis of the above linear-shaped laser beam in each position of the long axis: E/√{square root over ( )}(W), is determined in all the positions of a cross section of the linear-shaped laser beam to evaluate the above intensity distribution. | 09-18-2008 |
| 20110263107 | METHOD OF FORMING POLYCRYSTALLINE SILICON LAYER AND ATOMIC LAYER DEPOSITION APPARATUS USED FOR THE SAME - A method of forming a polycrystalline silicon layer and an atomic layer deposition apparatus used for the same. The method includes forming an amorphous silicon layer on a substrate, exposing the substrate having the amorphous silicon layer to a hydrophilic or hydrophobic gas atmosphere, placing a mask having at least one open and at least one closed portion over the amorphous silicon layer, irradiating UV light toward the amorphous silicon layer and the mask using a UV lamp, depositing a crystallization-inducing metal on the amorphous silicon layer, and annealing the substrate to crystallize the amorphous silicon layer into a polycrystalline silicon layer. This method and apparatus provide for controlling the seed position and grain size in the formation of a polycrystalline silicon layer. | 10-27-2011 |
| 20100323504 | LASER IRRADIATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - It is an object of the present invention to provide a laser irradiation apparatus being able to irradiate the irradiation object with the laser beam having homogeneous energy density without complicating the optical system. The laser irradiation apparatus of the present invention comprises a laser oscillator, an optical system for scanning repeatedly a beam spot of the laser beam emitted from the laser oscillator in a uniaxial direction over the surface of the irradiation object, and a position controlling means for moving the position of the irradiation object relative to the laser beam in a direction perpendicular to the uniaxial direction. | 12-23-2010 |
| 20090186468 | Laser Annealing Method - In crystallizing an amorphous silicon film by illuminating it with linear pulse laser beams having a normal-distribution type beam profile or a similar beam profile, the linear pulse laser beams are applied in an overlapped manner. There can be obtained effects similar to those as obtained by a method in which the laser illumination power is gradually increased and then decreased in a step-like manner in plural scans. | 07-23-2009 |
| 20090176354 | METHOD FOR FABRICATION OF SINGLE CRYSTAL DIODES FOR RESISTIVE MEMORIES - The present invention, in one embodiment, provides a method of producing a PN junction the method including providing a single crystal substrate; forming an insulating layer on the single crystal substrate; forming a via through the insulating layer to provide an exposed portion of the single crystal substrate; forming amorphous Si on at least the exposed portion of the single crystal substrate; converting at least a portion of the amorphous Si into single crystal Si; and forming dopant regions in the single crystal Si. In one embodiment the diode of the present invention is integrated with a memory device. | 07-09-2009 |
| 20110312165 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A layer including a semiconductor film is formed over a glass substrate and is heated. A thermal expansion coefficient of the glass substrate is greater than 6×10 | 12-22-2011 |
| 20110318908 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS - The present invention is a semiconductor manufacturing apparatus by which an impurity can be introduced into an active layer at a low and a stable concentration in order to form semiconductor elements that have little variation in threshold voltage. In the semiconductor manufacturing apparatus that includes a washing unit; an impurity introduction unit used to attach the impurity to the surface of the semiconductor film; a laser crystallization unit used to crystallize the semiconductor film to which an impurity has been attached; and transfer robots, the amount of the impurity attached to the semiconductor film is controlled by the length of time of exposure of the substrate in the impurity introduction unit, and the semiconductor film is crystallized while a crystalline semiconductor film that contains an impurity at low concentration is formed simultaneously by laser crystallization. | 12-29-2011 |
| 20120115316 | Crystallization apparatus, crystallization method, and method of manufacturing organic light-emitting display device, which use sequential lateral solidification - A crystallization apparatus, which uses sequential lateral solidification (SLS) and crystallizes an amorphous silicon layer formed on a substrate, includes a laser generating device, a first optical system, a second optical system, and a path switching member. The laser generating device is configured to emit a laser beam. The first optical system is configured to process the laser beam emitted from the laser generating device and to irradiate the processed laser beam onto the substrate. The second optical system is parallel to the first optical system and is configured to process the laser beam emitted from the laser generating device and to irradiate the processed laser beam onto the substrate. The path switching member is configured to switch a path of the laser beam emitted from the laser generating device and to alternately distribute the laser beam to the first and second optical systems. | 05-10-2012 |
| 20110065264 | METHODS OF SOLID PHASE RECRYSTALLIZATION OF THIN FILM USING PULSE TRAIN ANNEALING METHOD - Embodiments of the present invention provide methods of solid phase recrystallization of thin film using a plurality of pulses of electromagnetic energy. In one embodiment, the methods of the present invention may be used to anneal an entire substrate surface or selected regions of a surface of a substrate by delivering a plurality of pluses of energy to a crystalline seed region or layer upon which an amorphous layer is deposited to recrystallize the amorphous layer so that it has the same grain structure and crystal orientation as that of the underlying crystalline seed region or layer. | 03-17-2011 |
| 20120129323 | SEMICONDUCTOR THIN FILM, THIN FILM TRANSISTOR, METHOD FOR MANUFACTURING SAME, AND MANUFACTURING EQUIPMENT OF SEMICONDUCTOR THIN FILM - A method for manufacturing a semiconductor thin film is provided which can form its crystal grains having a uniform direction of crystal growth and being large in size and a manufacturing equipment using the above method, and a method for manufacturing a thin film transistor. In the above method, by applying an energy beam partially intercepted by a light shielding element, melt and re-crystallization occur with a light-shielded region as a starting point. The irradiation of the beam gives energy to the light-shielded region of the silicon thin film so that melt and re-crystallization occur with the light-shielded region as the starting point and so that a local temperature gradient in the light-shielded region is made to be 1200° C./μm or more. In the manufacturing method, a resolution of an optical system used to apply the energy beam is preferably 4 μm or less. | 05-24-2012 |
| 20100221900 | MASK FOR SEQUENTIAL LATERAL SOLIDIFICATION (SLS) PROCESS AND A METHOD FOR CRYSTALLIZING AMORPHOUS SILICON BY USING THE SAME - A mask for sequential lateral solidification (SLS) processes including at least one first window, one second window, one third window, and one fourth window is provided. Each window has a length extending longitude on the mask. The second window is aligned to the first window. The width of the first window is greater than that of the second window. The fourth window is aligned to the third window. The width of the third window is greater than that of the fourth window. | 09-02-2010 |
| 20100173480 | LASER ANNEALING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - This invention is intended to provide a laser annealing method by employing a laser annealer lower in running cost so as to deal with a large-sized substrate, for preventing or decreasing the generation of a concentric pattern and to provide a semiconductor device manufacturing method including a step using the laser annealing method. While moving a substrate at a constant rate between 20 and 200 cm/s, a laser beam is radiated aslant to a semiconductor film on a surface of the semiconductor substrate. Therefore, it is possible to radiate a uniform laser beam to even a semiconductor film on a large-sized substrate and to thereby manufacture a semiconductor device for which the generation of a concentric pattern is prevented or decreased. By condensing a plurality of laser beams into one flux, it is possible to prevent or decrease the generation of a concentric pattern and to thereby improve the reliability of the semiconductor device. | 07-08-2010 |
| 20100173481 | LASER MASK AND CRYSTALLIZATION METHOD USING THE SAME - A crystallization method using a mask includes providing a substrate having a semiconductor layer; positioning a mask over the substrate, the mask having first, second and third blocks, each block having a periodic pattern including a plurality of transmitting regions and a blocking region, the periodic pattern of the first block having a first position, the periodic pattern of the second block having a second position, the periodic pattern of the third block having a third position, the first, second and third positions being different from each other; and crystallizing the semiconductor layer by irradiating a laser beam through the mask. | 07-08-2010 |
| 20100009523 | MASK AND METHOD OF FABRICATING A POLYSILICON LAYER USING THE SAME - A mask includes a primary opaque pattern and a number of clusters of secondary opaque patterns. The primary opaque pattern defines a number of strip transparent slits whose extending directions are substantially the same. The clusters of the secondary opaque patterns are connected to the primary opaque pattern, and each of the clusters of the secondary opaque patterns is disposed in one of the transparent slits, respectively. Each of the clusters of the secondary opaque patterns includes a number of secondary opaque patterns, and extending directions of at least a portion of the secondary opaque patterns and the extending directions of the transparent slits together form included angles that are not equal to about 90°. | 01-14-2010 |
| 20100291760 | Method and system for spatially selective crystallization of amorphous silicon - The manufacturing methodology to produce polycrystalline silicon in time and cost efficient manner uses a spatially selective crystallization approach to greatly reduce the amount of energy delivered to the work surface. The amorphous silicon film is subjected to laser radiation substantially exclusively at localized areas where TFTs are to be formed. The source of radiation is a copper vapor laser which produces a highly stable radiation in a visible spectrum with an energy sufficient to convert amorphous silicon into polysilicon in 1-3 shots. The optic system delivers the homogenized, conditioned and focused laser beam to the area of interest in a controlled manner. Single or multi-laser beam arrangements, as well as different shapes and sizes of laser beam spots are contemplated. | 11-18-2010 |
| 20080293224 | METHOD OF FORMING A DIODE AND METHOD OF MANUFACTURING A PHASE-CHANGE MEMORY DEVICE USING THE SAME - In a method of forming a diode, a first amorphous thin film doped with first impurities is formed on a single crystalline substrate. A second amorphous thin film doped with second impurities is formed on the first amorphous thin film. A laser beam having sufficient energy to melt both of the first and second amorphous thin films is irradiated on the first and second amorphous thin films to change crystal structures of the first and second amorphous thin films using the single crystalline substrate as a seed, so that first and second single crystalline thin films are sequentially formed on the single crystalline substrate. | 11-27-2008 |
| 20120329255 | OUT-OF-PLANE MEMS RESONATOR WITH STATIC OUT-OF-PLANE DEFLECTION - A method of forming a microelectromechanical systems (MEMS) device includes forming an electrode on a substrate. The method includes forming a structural layer on the substrate. The structural layer is disposed about a perimeter of the electrode and has a residual film stress gradient. The method includes releasing the structural layer to form a resonator coupled to the substrate. The residual film stress gradient deflects a first portion of the resonator out of a plane defined by a surface of the electrode. | 12-27-2012 |
| 20100184277 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A semiconductor device is fabricated by forming a first crystalline region by irradiating a laser beam to a first region of an amorphous semiconductor film by relatively moving the laser beam with respect to the first region of the amorphous semiconductor film. A second crystalline region is formed by irradiating the laser beam to a second region of the amorphous semiconductor film including a portion of the first crystalline region by relatively moving the laser beam with respect to the second region of the amorphous semiconductor film. The wavelength of the laser beam falls in a range of 370 rim through 650 nm. In general, crystalline performance of the first crystalline region, the second crystalline region, and a region of overlap between the first crystalline region and the second crystalline region are the same. | 07-22-2010 |
