Class / Patent application number | Description | Number of patent applications / Date published |
438161000 | Including source or drain electrode formation prior to semiconductor layer formation (i.e., staggered electrodes) | 7 |
20080199992 | DISPLAY DEVICE, MANUFACTURING METHOD THEREOF, AND TELEVISION RECEIVER - The present invention discloses a method for manufacturing a display device comprising the steps of forming a first film pattern using a photosensitive material over a substrate, forming a second film pattern in such a way that the first film pattern is exposed by being irradiated with a laser beam, modifying a surface of the second film pattern into a droplet-shedding surface, forming a source electrode and a drain electrode by discharging a conductive material to an outer edge of the droplet-shedding surface by a droplet-discharging method, and forming a semiconductor region, a gate-insulating film, and a gate electrode over the source electrode and the drain electrode. | 08-21-2008 |
20110250724 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - An embodiment is a manufacturing method of a semiconductor device including the steps of forming a first insulating film; forming a first mask over the first insulating film; performing a slimming process on the first mask to form a second mask; performing an etching process on the first insulating film using the second mask to form a second insulating film; forming a first conductive film covering the second insulating film; performing a polishing process on the first conductive film and the second insulating film to form a third insulating film, a source electrode, and a drain electrode having equal thicknesses; forming an oxide semiconductor film over the third insulating film, the source electrode, and the drain electrode; forming a gate insulating film over the oxide semiconductor film; and forming a gate electrode in a region which is over the gate insulating film and overlaps with the third insulating film. | 10-13-2011 |
20110263083 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An embodiment of the disclosed invention is a method for manufacturing a semiconductor device, which includes the steps of forming a first insulating film; forming a source electrode, a drain electrode, and an oxide semiconductor film electrically connected to the source electrode and the drain electrode, over the first insulating film; performing heat treatment on the oxide semiconductor film to remove a hydrogen atom in the oxide semiconductor film; forming a second insulating film over the oxide semiconductor film; performing oxygen doping treatment on the second insulating film to supply an oxygen atom to the second insulating film; and forming a gate electrode in a region overlapping with the oxide semiconductor film, over the second insulating film | 10-27-2011 |
20110263084 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An embodiment of the disclosed invention is a method for manufacturing a semiconductor device, which includes the steps of forming a first insulating film; performing oxygen doping treatment on the first insulating film to supply oxygen to the first insulating film; forming a source electrode, a drain electrode, and an oxide semiconductor film electrically connected to the source electrode and the drain electrode, over the first insulating film; performing heat treatment on the oxide semiconductor film to remove a hydrogen atom in the oxide semiconductor film; forming a second insulating film over the oxide semiconductor film; and forming a gate electrode in a region overlapping with the oxide semiconductor film, over the second insulating film. The manufacturing method allows the formation of a semiconductor device including an oxide semiconductor, which has stable electrical characteristics and high reliability. | 10-27-2011 |
20110263085 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - One object of one embodiment of the present invention is to provide a highly reliable semiconductor device including an oxide semiconductor, which has stable electrical characteristics. In a method for manufacturing a semiconductor device, a first insulating film is formed; source and drain electrodes and an oxide semiconductor film electrically connected to the source and drain electrodes are formed over the first insulating film; heat treatment is performed on the oxide semiconductor film so that a hydrogen atom in the oxide semiconductor film is removed; oxygen doping treatment is performed on the oxide semiconductor film, so that an oxygen atom is supplied into the oxide semiconductor film; a second insulating film is formed over the oxide semiconductor film; and a gate electrode is formed over the second insulating film so as to overlap with the oxide semiconductor film. | 10-27-2011 |
20110318890 | METHODS OF FORMING SEMICONDUCTOR-ON-INSULATING (SOI) FIELD EFFECT TRANSISTORS WITH BODY CONTACTS - Semiconductor-on-insulator (SOI) field effect transistors include a semiconductor substrate and a first semiconductor active region on a first portion of a surface of the substrate. A first electrically insulating layer is provided. This first electrically insulating layer extends on a second portion of the surface of the substrate and also on a first sidewall of the first semiconductor active region. A second electrically insulating layer is provided, which extends on a third portion of the surface of the semiconductor substrate. The second electrically insulating layer also extends on a second sidewall of the first semiconductor active region. A second semiconductor active region is provided on the first semiconductor active region. The second semiconductor active region extends on the first semiconductor active region and on ends of the first and second electrically insulating layers. Source and drain regions are also provided, which are electrically coupled to opposite ends of the second semiconductor active region. An insulated gate electrode extends on the second semiconductor active region and opposite the first semiconductor active region. | 12-29-2011 |
20150364707 | ALL PRINTED AND TRANSPARENT CNT TFT - A transparent thin film transistor is fabricated on a substrate by first depositing a concentrated aqueous metallic carbon nanotube solution using an inkjet printer on the substrate to form source and drain electrodes with a channel therebetween. The deposited metallic carbon nanotubes are then cleaned in mild acid; and the source and drain electrodes are cured by heating. An aqueous semiconducting carbon nanotube solution is then deposited in the channel on the substrate using an inkjet printer on the substrate to form a channel semiconductor. The channel semiconductor is then cleaned using a mild acid. A dielectric gate of ionic gel dielectric is then deposited on the cleaned channel semiconductor using an inkjet printer; and the ionic gel dielectric is cured by heating. | 12-17-2015 |