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Making emissive array

Subclass of:

438 - Semiconductor device manufacturing: process

438022000 - MAKING DEVICE OR CIRCUIT EMISSIVE OF NONELECTRICAL SIGNAL

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
438035000 Multiple wavelength emissive 21
Entries
DocumentTitleDate
20130045555THIN FILM SEMICONDUCTOR DEVICE, DISPLAY DEVICE USING SUCH THIN FILM SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A thin film semiconductor device formed as integrated circuits on an insulating substrate with bottom gate type thin film transistors stacked with gate electrodes, a gate insulating film and a semiconductor thin film in the order from below upward. The gate electrodes comprise metallic materials with thickness less than 100 nm. The gate insulating film has a thickness thicker than the gate electrodes. The semiconductor thin film comprises polycrystalline silicon crystallized by a laser beam. By reducing thickness of metallic gate electrodes, thermal capacity becomes small and difference in thermal condition on the metallic gate electrodes and on the insulating substrate made of glass or the like becomes small. This invention relates to the task of uniforming and optimizing recrystallization by a laser anneal treatment provided for the semiconductor thin film which works as an active layer of the bottom gate type thin film transistors.02-21-2013
20130040410PHOTORESIST COMPOSITION, METHOD OF FORMING A PATTERN USING THE SAME, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE - A photoresist composition, a method of forming a pattern using the photoresist composition, and a method of manufacturing a display substrate are disclosed. A photoresist composition includes an alkali-soluble resin, a quinone diazide-based compound, a multivalent phenol-based compound, and a solvent. Therefore, photosensitivity for light having a wavelength in a range of about 392 nm to about 417 nm may be improved, and reliability of forming a photo pattern and a thin film pattern using the photoresist composition may be improved.02-14-2013
20130045554DISPLAY DEVICE AND ELECTRONIC APPLIANCE INCLUDING THE DISPLAY DEVICE - To provide a display device which has a narrower frame region and which includes a driver circuit not affected by variation in transistor characteristics. A base substrate having an insulating surface to which a single-crystal semiconductor layer is attached is divided into strips and is used for a driver circuit of a display device. Alternatively, a base substrate having an insulating surface to which a plurality of single-crystal semiconductor layers is attached is divided into strips and is used for a driver circuit of a display device. Accordingly, a driver circuit corresponding to a size of a display device can be used for the display device, and a display device which has a narrower frame region and which includes a driver circuit not affected by variation in transistor characteristics can be provided.02-21-2013
20120202305ETCHANT FOR ETCHING DOUBLE-LAYERED COPPER STRUCTURE AND METHOD OF FORMING ARRAY SUBSTRATE HAVING DOUBLE-LAYERED COPPER STRUCTURES - An etchant for forming double-layered signal lines and electrodes of a liquid crystal display device includes hydrogen peroxide (H08-09-2012
20110207255Semiconductor Device and Method for Manufacturing the Same - A manufacturing method of an active matrix light emitting device in which the active matrix light emitting device can be manufactured in a shorter time with high yield at low cost compared with conventional ones will be provided. It is a feature of the present invention that a layered structure is employed for a metal electrode which is formed in contact with or is electrically connected to a semiconductor layer of each TFT arranged in a pixel area of an active matrix light emitting device. Further, the metal electrode is partially etched and used as a first electrode of a light emitting element. A buffer layer, a layer containing an organic compound, and a second electrode layer are stacked over the first electrode.08-25-2011
20120171795METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method of performing irradiation of laser light is given as a method of crystallizing a semiconductor film. However, if laser light is irradiated to a semiconductor film, the semiconductor film is instantaneously melted and expands locally. The temperature gradient between a substrate and the semiconductor film is precipitous, distortions may develop in the semiconductor film. Thus, the film quality of the crystalline semiconductor film obtained will drop in some cases. With the present invention, distortions of the semiconductor film are reduced by heating the semiconductor film using a heat treatment process after performing crystallization of the semiconductor film using laser light. Compared to the localized heating due to the irradiation of laser light, the heat treatment process is performed over the entire substrate and semiconductor film. Therefore, it is possible to reduce distortions formed in the semiconductor film and to increase the physical properties of the semiconductor film.07-05-2012
20120184060MANUFACTURING METHOD FOR ARRAY SUBSTRATE WITH FRINGE FIELD SWITCHING TYPE THIN FILM TRANSISTOR LIQUID CRYSTAL DISPLAY - A manufacturing method for an array substrate with a fringe field switching (FFS) type thin film transistor (TFT) liquid crystal display (LCD) includes the following steps. A pattern of a gate line (07-19-2012
20120184059METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE - A light emitting device includes a substrate and a plurality of pixel rows. The pixel rows are arranged on the substrate. Each of the pixel rows includes a first sub-pixel row having a plurality of first sub-pixels, a second sub-pixel row having a plurality of second sub-pixels, and a third sub-pixel row having a plurality of third sub-pixels. In the m07-19-2012
20100047946THIN FILM ARRAY PANEL AND MANUFACTURING METHOD THEREOF - A method of manufacturing a thin film array panel is provided, which includes: forming a gate line formed on a substrate; forming a gate insulating layer on the gate line; forming a semiconductor layer on the gate insulating layer; forming an ohmic contact layer on the semiconductor layer; forming a data line and a drain electrode disposed at least on the ohmic contact layer, forming an oxide on the data line; etching the ohmic contact layer using the data line and the drain electrode as an etch mask; and forming a pixel electrode connected to the drain electrode.02-25-2010
20100112740SUBSTRATE FOR LIQUID CRYSTAL DISPLAY - A method of manufacturing a substrate for a liquid crystal display. The method includes forming a plurality of first line-shaped fine grooves parallel to each other in a lengthwise direction and a plurality of second line-shaped fine grooves parallel to each other in a width direction on the substrate, forming an inorganic insulating film on the substrate including the first and second line-shaped fine grooves, forming a plurality of gate lines within the first line-shaped fine grooves, forming a plurality of data lines that contacts an upper surface of the inorganic insulating film within the second line-shaped fine grooves, and forming a passivation layer on the substrate including the data lines.05-06-2010
20100075451METHOD FOR MANUFACTURING A THIN FILM STRUCTURE - The present invention discloses a method for manufacturing thin film structure, which comprises the following steps: providing a substrate having a first recess and a second recess formed therein with the first recess being deeper than the second recess; depositing a first material layer and a second material layer of different thicknesses successively on the substrate; and grinding the substrate so that a flat upper surface is formed and the first material layer and the second material layer are remained in the first recess while only the first material layer is remained in the second recess. The present invention also discloses a method for manufacturing fringe field switching type liquid crystal display array substrate. With the present invention, it is possible to make the upper surface flat while forming patterns on two layers of thin films respectively by using a single mask.03-25-2010
20130078751DISPLAY SUBSTRATE AND METHOD OF FABRICATING THE SAME - A display substrate is provided that can prevent the opening of an upper conduction layer. The display substrate comprises a semiconductor layer pattern formed on a substrate, a data interconnection pattern formed on the semiconductor layer pattern, a protection layer formed on the substrate and the data interconnection pattern, contact holes formed on the substrate to expose at least a portion of an upper surface of the semiconductor pattern and at least a portion of an upper surface of the data interconnection pattern, and contact electrodes formed in the contact holes to be in contact with the exposed upper surfaces of the data interconnection pattern and the semiconductor layer pattern.03-28-2013
20130084663METHOD FOR FABRICATING PHOTO SPACER AND LIQUID CRYSTAL DISPLAY AND ARRAY SUBSTRATE - A method for fabricating a photo spacer and an array substrate having the photo spacer are provided. At least one exposure process, a developing process, and a baking process are performed to a photo-sensitive material layer formed a substrate to fabricate a photo spacer, wherein the at least one exposure process includes a back side exposure process. The substrate has a light transmitting region and a light shielding region so that the photo-sensitive material layer is defined into a first block and a second block after the back side exposure process. The developing process is performed to at least remove the second block. A front side exposure process is performed to the first block. The baking process is performed to cure the first block of the photo-sensitive material layer to form a photo spacer.04-04-2013
20130084664METHOD OF MANUFACTURING AN ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE - Provided is a method of manufacturing an organic electroluminescence display device which enables production of a high-resolution organic electroluminescence display device in which display failure is suppressed. The method of manufacturing an organic electroluminescence display device includes multiple organic electroluminescence elements each including an organic compound layer that includes at least an emission layer, the method including: forming the organic compound layer on a substrate; sequentially forming an intermediate layer and a resist layer on the organic compound layer; removing a part of the resist layer by a photolithography method; and selectively removing, by dry etching, the intermediate layer and the organic compound layer in a region in which the part of the resist layer is removed, the light shielding layer having a function of blocking light having a wavelength of 04-04-2013
20130034923ETCHING COMPOSITION, METHOD OF FORMING A METAL PATTERN USING THE ETCHING COMPOSITION, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE - An etching composition, a method of forming a metal pattern using the etching composition, and a method of manufacturing a display substrate are disclosed. The etching composition includes about 0.1% by weight to about 25% by weight of ammonium persulfate, about 0.1% by weight to about 25% by weight of an organic acid, about 0.01% by weight to about 5% by weight of a chelating agent, about 0.01% by weight to about 5% by weight of a fluoride compound, about 0.01% by weight to about 5% by weight of a chloride compound, about 0.01% by weight to about 2% by weight of an azole-based compound and a remainder of water. Thus, a copper layer may be stably etched to improve a reliability of manufacturing the metal pattern and the display substrate.02-07-2013
20120264245SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF - For forming a gate electrode, a conductive film with low resistance including Al or a material containing Al as its main component and a conductive film with low contact resistance for preventing diffusion of Al into a semiconductor layer are laminated, and the gate electrode is fabricated by using an apparatus which is capable of performing etching treatment at high speed.10-18-2012
20090155946METHOD OF VARYING TRANSMITTANCE OF TRANSPARENT CONDUCTIVE LAYER, FLAT PANEL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A method of varying a transmittance of a transparent conductive film includes forming the transparent conductive film on a substrate and injecting a high energy source into the transparent conductive film to vary the transmittance of the transparent conductive film.06-18-2009
20100041174LIQUID CRYSTAL DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME - An LCD panel and a method for manufacturing the same is disclosed, in which light leakage is prevented from occurring by forming a dummy pattern in an array peripheral region. The LCD panel includes a first substrate having an array region and an array peripheral region, a gate line on the first substrate, a gate insulating film on the entire surface of the first substrate including the gate line, a data line arranged to cross the gate line for defining a pixel region on the array region, a light leakage prevention film formed between the gate and/or data lines of the array peripheral region for preventing light leakage in the panel, and a TFT and a pixel electrode formed in each pixel region.02-18-2010
20130029446METHOD OF FORMING TRANSPARENT ELECTRODE AND FABRICATING ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE - A method of forming a transparent electrode includes forming a first transparent conductive material layer on a base; performing a plasma process on the first transparent conductive material layer such that the upper portion of the first transparent conductive material layer is changed into semitransparent; forming a second transparent conductive material layer on the first transparent conductive material layer; patterning the second transparent conductive material layer and the first transparent conductive material layer; and annealing the patterned second transparent conductive material layer and the patterned first transparent conductive material layer such that the upper portion of the first transparent conductive material layer is changed into transparent.01-31-2013
20130029447SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, DELAMINATION METHOD, AND TRANSFERRING METHOD - A substrate and a delamination film are separated by a physical means, or a mechanical means in a state where a metal film formed over a substrate, and a delamination layer comprising an oxide film including the metal and a film comprising silicon, which is formed over the metal film, are provided. Specifically, a TFT obtained by forming an oxide layer including the metal over a metal film; crystallizing the oxide layer by heat treatment; and performing delamination in a layer of the oxide layer or at both of the interface of the oxide layer is formed.01-31-2013
20130084665DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - To provide an input device including a display screen which has an image display function and a text information input function by using a display portion in which a pixel includes an optical sensor. An optical sensor is provided in each pixel of the display portion in order to detect position information. A transistor of a pixel circuit in the display portion and the optical sensor are formed using a single crystal semiconductor layer. By using the single crystal semiconductor layer, there is no variation in characteristics among pixels, and position detection with high accuracy is realized. Moreover, the display portion is formed using a substrate which is a light-transmitting substrate such as a glass substrate provided with a single crystal semiconductor layer separated from a single crystal semiconductor substrate.04-04-2013
20130089940METHOD OF MANUFACTURING DISPLAY UNIT - A method of manufacturing a display unit includes: forming, on a substrate, a thin-film transistor having an oxide semiconductor layer; and forming, above the thin-film transistor, a display region that includes a plurality of display elements. The oxide semiconductor layer is formed using a sputtering method in which a target and the substrate are opposed to each other. The target is made of an oxide semiconductor and includes a plurality of divided portions that are jointed in a planar form. A spacing interval between two joints that are formed by the plurality of divided portions and are side-by-side with one another of the target is equal to or less than a width of a luminance distribution arising in the display region in a direction substantially orthogonal to the joints.04-11-2013
20130071963METHOD OF FABRICATING A THIN FILM TRANSISTOR AND METHOD OF FABRICATING AN ORGANIC LIGHT-EMITTING DISPLAY DEVICE - A thin film transistor fabrication method allows forming a first photoresist pattern on a triple layer of insulation, conductive and metal films opposite to a semiconductor pattern. A first metal pattern and a conductive pattern are formed through an etch process before forming source and drain regions through a first ion injection process. A second photoresist pattern with a narrower width than that of the first photoresist pattern is derived from the first photoresist pattern. The first metal pattern is reformed into a second metal pattern with a narrower width than that of the second photoresist pattern. A process is performed that includes removing the second photoresist pattern, forming LDD (Lightly Doped Drain) regions in the semiconductor pattern, and forming GOLDD (Gate Overlap LDD) regions in the semiconductor pattern. A second insulation film is formed before forming source and drain electrodes on the second insulation film.03-21-2013
20130071962Method of Manufacturing TFT Array Substrate and TFT Array Substrate - The invention discloses a method of manufacturing TFT array substrate and a TFT array substrate, wherein the manufacturing method comprises the following steps: sequentially depositing a metal film, a insulating layer, and a semiconductor layer, and manufacturing a gate line and a gate electrode using a composition method; depositing a insulating layer, and manufacturing a channel region protecting layer using the composition method; sequentially depositing a doped semiconductor layer and a metal layer; forming a source electrode, a drain electrode and a data line using the composition method; and cutting the doped semiconductor layer and the metal layer to form an energizing channel; and depositing an ITO layer, and forming a pixel electrode by the ITO layer using the composition method. Because four-composition technologies are used by the invention, the gate electrode, the gate line, and the active layer are manufactured by the single-composition technology, and the pixel electrode, the data line, the source electrode, the drain electrode, the channel and the like are directly formed by the completely developed photoetching or dry etching method; the manufacturing difficulty of the array substrate is greatly reduced; the production cost of the array substrate is reduced; and the production efficiency is increased. The TFT component formed by the array substrate is of back-channel protection type structure in favour of reduction of the off-state current of the component.03-21-2013
20090111204Vertically Aligned Mode Liquid Crystal Display - A plurality of gate lines and a plurality of data lines intersecting each other are formed on a first insulating substrate having a plurality of first cutouts are formed on the respective pixel areas defined by the data lines and the gate lines. A thin film transistor is connected to each pixel electrode. A reference electrode having a plurality of second cutouts is formed on a second substrate opposite the first substrate. The first cutouts and the second cutouts in the adjacent two pixel areas opposite each other with respect to one data line have an inversion symmetry with respect to the data line.04-30-2009
20110039362MANUFACTURING METHOD OF FILM PATTERN OF MICRO-STRUCTURE AND MANUFACTURING METHOD OF TFT-LCD ARRAY SUBSTRATE - A method of forming a film pattern with micro-pattern and a method of manufacturing a thin film transistor liquid crystal display (TFT-LCD) array substrate are provided. The method of manufacturing the film pattern with micro-pattern comprises: depositing a thin film on a substrate; jetting or dropping etchant on the thin film with a predetermined etching pattern by an inkjet print device; etching the thin film by the etchant; and cleaning the thin film to form a film pattern on the substrate.02-17-2011
20130059406ORGANIC OPTOELECTRONIC DEVICE ELECTRODES WITH NANOTUBES - An electrode for use in an organic optoelectronic device is provided. The electrode includes a thin film of single-wall carbon nanotubes. The film may be deposited on a substrate of the device by using an elastomeric stamp. The film may be enhanced by spin-coating a smoothing layer on the film and/or doping the film to enhance conductivity. Electrodes according to the present invention may have conductivities, transparencies, and other features comparable to other materials typically used as electrodes in optoelectronic devices.03-07-2013
20130059405METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE - Provided is a method for manufacturing a light-emitting device in which an organic electroluminescent (EL) layer having an intended shape is formed. The method is, for manufacturing a light-emitting device (03-07-2013
20110014738LCD TFT array plate and fabricating method thereof - Lift-off method and half-tone photolithography are used to fabricate LCD TFT array plate. Only two photo masks are used to respectively define a first and a second metal layers to accomplish the LCD TFT array plate.01-20-2011
20110014736ORGANIC THIN FILM TRANSISTOR ARRAY PANEL AND METHOD OF MANUFACTURING THE SAME - An organic thin film transistor (“TFT”) array panel includes a substrate, a gate line extending in a first direction, a data line extending in a second direction, intersecting with and insulated from the gate line, a source electrode connected to the data line, a drain electrode facing the source electrode, a pixel electrode connected to the drain electrode, and an organic semiconductor connected to the source electrode and the drain electrode, the organic semiconductor made of an organic material with photosensitivity.01-20-2011
20110014735Dual Panel Type Organic Electroluminescent Display Device and Method of Fabricating the Same - An organic electroluminescent device includes: a switching element and a driving element connected to each other on a substrate including a pixel region; a planarization layer on the switching element and the driving element, the planarization layer having a substantially flat top surface; a cathode on the planarization layer, the cathode connected to the driving element; an emitting layer on the cathode; and an anode on the emitting layer.01-20-2011
20090269874METHOD FOR FABRICATING FLEXIBLE PIXEL ARRAY SUBSTRATE - In a method for fabricating a flexible pixel array substrate, first, a release layer is formed on a rigid substrate. Next, on the release layer, a polymer film is formed, the adhesive strength between the rigid substrate and the release layer being higher than that between the release layer and the polymer film. The polymer film is formed by spin coating a polymer monomer and performing a curing process to form a polymer layer. Afterwards, a pixel array is formed on the polymer film. The polymer film with the pixel array formed thereon is separated from the rigid substrate.10-29-2009
20130065338ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device and a method of its manufacture are provided, whereby manufacturing processes are simplified and display quality may be enhanced. The display device includes: an active layer of a thin film transistor (TFT), on a substrate and including a semiconducting material; a lower electrode of a capacitor, on the substrate, doped with ion impurities, and including a semiconducting material; a first insulating layer on the substrate to cover the active layer and the lower electrode; a gate electrode of the TFT, on the first insulating layer; a pixel electrode on the first insulating layer; an upper electrode of the capacitor, on the first insulating layer; source and drain electrodes of the TFT, electrically connected to the active layer; an organic layer on the pixel electrode and including an organic emission layer; and a counter electrode facing the pixel electrode, the organic layer between the counter electrode and the pixel electrode.03-14-2013
20130065339ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating a liquid crystal display device includes: a first step of attaching a polarizing plate to an outer surface of a liquid crystal panel; a second step of attaching a tape carrier package (TCP) to the liquid crystal panel; a third step of coating a resin onto a rear surface of the TCP and a connection portion of the liquid crystal panel and the TCP; a fourth step of inspecting the TCP and the liquid crystal display panel; a fifth step of inserting the liquid crystal panel into a transferring means; a sixth step of transferring the transferring means; a seventh step of extracting the liquid crystal panel from the transferring means; a eighth step of attaching the TCP to a printed circuit board (PCB); a ninth step of inspecting the PCB, the TCP and the liquid crystal panel; and a tenth step of assembling the liquid crystal panel and a backlight unit with a plurality of frames.03-14-2013
20130164871ARRAY SUBSTRATE FOR IN-PLANE SWITCHING MODE LIQUID CRYSTAL DISPLAY DEVICE HAVING DOUBLE-LAYERED METAL PATTERNS AND METHOD OF FABRICATING THE SAME - An array substrate of an in-plane switching liquid crystal display device includes, among other features, a gate electrode and a gate line having a first double-layered structure consisting of a first barrier layer and a first low resistance metallic layer; a data line defining a pixel region with the gate line, the data line having a second double-layered structure consisting of a second barrier layer and a second low resistance metallic layer; a plurality of common electrodes disposed in a direction opposite to an adjacent gate line; a thin film transistor (TFT) near a crossing of the gate and data lines, each of the source and drain electrodes of the TFT having the same double-layered structure as the data line; and a plurality of pixel electrodes arranged in an alternating pattern with the common electrodes and disposed in the direction opposite the adjacent gate line.06-27-2013
20120270348Semiconductor Device and Method for Manufacturing the Same - It is an object to obtain a liquid crystal display device in which a contact defect is reduced, increase in contact resistance is suppressed, and an opening ratio is high. The present invention relates to a liquid crystal display device having a substrate; a thin film transistor provided over the substrate, which includes a gate wiring, a gate insulating film, an island-shaped semiconductor film, a source region, and a drain region; a source wiring which is provided over the substrate and is connected to the source region; a drain electrode which is provided over the substrate and is connected to the drain region; an auxiliary capacitor provided over the substrate; a pixel electrode connected to the drain electrode; and a protective film formed so as to cover the thin film transistor and the source wiring, where the protective film has an opening, and the auxiliary capacitor is formed in the area where the opening is formed.10-25-2012
20130164872METHOD OF FABRICATING ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE - An organic light emitting diode display device and a method of manufacturing thereof, the device including a substrate, the substrate including a pixel part and a circuit part; a first semiconductor layer and a second semiconductor layer on the pixel part of the substrate; a gate insulating layer on an entire surface of the substrate; gate electrodes on the gate insulating layer, the gate electrodes corresponding to the first semiconductor layer and the second semiconductor layer, respectively; source/drain electrodes insulated from the gate electrodes, the source/drain electrodes being connected to the first and second semiconductor layers, respectively; a first electrode connected to the source/drain electrodes of the first semiconductor layer; an organic layer on the first electrode; a second layer on the organic layer; and a metal catalyst layer under the first semiconductor layer.06-27-2013
20110306157Opto-electrical Devices and Methods of Manufacturing the Same - A composition for ink jet printing an opto-electrical device, comprising a charge injecting and/or transporting organic material and a solvent mixture, wherein the solvent mixture is present in an amount of about 30% v/v based on the volume of the composition and comprises a first co-solvent and a second co-solvent miscible with the first co-solvent; wherein the first co-solvent comprises ethylene glycol; and the second co-solvent comprises glycerol, wherein the ratio by volume of the first co-solvent to second co-solvent is approximately 1:2. The composition provides slower drying PEDOT ink formulations having improved film uniformity within pixels and across swathe joins which do not compromise other aspects of the ink's performance.12-15-2011
20110092008LIQUID CRYSTAL DISPLAY FABRICATION METHOD - A method of fabricating an LCD includes providing first and second substrates. A gate electrode, a gate line, a connection electrode, a common electrode and a pixel electrode are formed on the first substrate through a first making process. A first insulation film is formed on the first substrate. A first insulation film pattern having multiple contact holes are formed through a second masking process. An active pattern is formed on the first substrate and source and drain electrodes are operationally connected with the active pattern through some of the contact holes. A gate electrode, a common electrode, and a pixel electrode may be formed substantially together through a slit exposure. An active pattern and source and drain electrodes may be formed substantially together. The number of masks needed to fabricate the display may be reduced to simplify a fabrication process and protect a channel region.04-21-2011
20110281385LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - In a liquid crystal display device of an IPS system, to realize reduction of manufacturing cost and improvement of yield by decreasing the number of steps for manufacturing a TFT. A channel etch type bottom gate TFT structure, where patterning of a source region and a drain region and patterning of a source wiring and a pixel electrode are carried out by the same photomask.11-17-2011
20110300654Method of manufacturing semiconductor light emitting device - Provided is a method of manufacturing semiconductor light emitting devices including: forming light emitting structures by sequentially depositing a first material layer, an active layer and a second material layer; forming the roughness pattern on a region of the bottom of a substrate except at least a cleaving region for forming cleaving planes; and forming n-electrodes.12-08-2011
20110300655LIQUID CRYSTAL DISPLAY DEVICE HAVING A COMPOSITE DATA LINE WITH A LINE OPENING EXPOSING THE TOP SURFACE AND SIDEWALLS - An LCD device includes plurality of gate lines and data lines crossing each other to define pixel regions on a substrate. A thin film transistor (TFT) resides at a crossing portion of the gate lines and the data lines and a pixel electrode is electrically connected with the TFT. The TFT includes a gate electrode, a gate insulation layer on the gate electrode and a semiconductor layer on the gate insulation layer. A portion of the data line and the semiconductor layer form a composite layer between adjacent pixel electrodes in which a line width of data line is the same as a line width of semiconductor layer. A method of fabricating the LCD device includes etching a passivation layer using a mask pattern and etching the semiconductor layer using the mask pattern and a portion of the data line as an etch mask to form the composite layer.12-08-2011
20110281386Array Substrate for Liquid Crystal Display Device and Method of Manufacturing the Same - An array substrate for a liquid crystal display device includes a substrate, a gate line on the substrate, a thin film transistor including a gate electrode of the gate line, a gate insulating layer over the gate electrode, an active layer on the gate insulating layer and ohmic contact layers on the active layer, and source and drain electrodes over the ohmic contact layers, a pixel electrode electrically connected to the drain electrode, a data line electrically connected to the source electrode and crossing the gate line, a common electrode spaced apart from the pixel electrode, and a passivation layer directly between the pixel electrode and the common electrode and directly between the source and drain electrodes.11-17-2011
20110281384METHOD OF MANUFACTURING THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING FLAT PANEL DISPLAY USING THE SAME - A method of manufacturing a thin film transistor (TFT) and a method of manufacturing a flat panel display (FPD) using the same. A metal layer made out of Mo having no etch selectivity with a semiconductor layer so that a source electrode, a drain electrode, and an activation layer may be produced using a single mask in a single etch step. The metal layer and the semiconductor layer are simultaneously etched to form the source electrode, the drain electrode, and the activation layer, of a same width so that the area occupied by the TFT may be minimized. When the TFT is applied to the FPD, the maximal aperture ratio of pixels may be obtained and the FPD may be manufactured using only four masks.11-17-2011
20110143470Method and Apparatus for Manufacturing Thin-Film Transistor Array Substrate - A method and apparatus of fabricating a thin film transistor array substrate is disclosed, which is capable of reducing fabrication time owing to a simplified fabrication process, wherein at least one of steps for forming a gate pattern, forming a semiconductor pattern, forming a data pattern, removing an ohmic contact layer pattern exposed between source and drain electrode patterns, and forming a conductive layer pattern is performed by a laser scribing process.06-16-2011
20110287565METHOD FOR MANUFACTURING DISPLAY DEVICE - Exposure is performed by controlling an exposure amount applied to a photosensitive resin 11-24-2011
20110294244METHOD FOR MANUFACTURING DISPLAY DEVICE - Provided is a method of manufacturing a display device, including: forming a polymer layer which includes an organic material on a principal surface side of a support substrate; forming one of a semiconductor circuit and a display circuit on the polymer layer; irradiating the polymer layer from the support substrate side with light having a wavelength that is absorbed in the polymer layer, to thereby separate the polymer layer from the support substrate; one of thinning and removing the polymer layer; and adhering a first substrate to one of a surface of the polymer layer and a face where the polymer layer has been provided.12-01-2011
20100035372High power top emitting vertical cavity surface emitting laser - A method of adjusting a power density in a laser device including a VCSEL array providing an increased power density at a high wall-plug efficiency in that the lateral design parameters are appropriately selected on the basis of a relationship that has been established for a specified vertical design, a corresponding process technology and specified operating conditions. Thus, the total output power, the power density, and the efficiency may be optimized independently from other design criteria and application requirements by tuning only the lateral size of the individual VCSEL elements and the pitch of nearest neighbors of the elements within the array. Hence, for a lateral size of less than 30 μm and a pitch of less than 80 μm, a highly efficient VCSEL array can be provided with a high power density, thereby optimizing manufacturing costs for the output power per chip area.02-11-2010
20110217802Fabrication System and Manufacturing Method of Light Emitting Device - The present invention provides a vapor deposition method and a vapor deposition system of film formation systems by which EL materials can be used more efficiently and EL materials having superior uniformity with high throughput rate are formed. According to the present invention, inside a film formation chamber, an evaporation source holder in a rectangular shape in which a plurality of containers sealing evaporation material is moved at a certain pitch to a substrate and the evaporation material is vapor deposited on the substrate. Further, a longitudinal direction of an evaporation source holder in a rectangular shape may be oblique to one side of a substrate, while the evaporation source holder is being moved. Furthermore, it is preferable that a movement direction of an evaporation source holder during vapor deposition be different from a scanning direction of a laser beam while a TFT is formed.09-08-2011
20120107985Semiconductor Device and Its Manufacturing Method - A manufacturing method of a semiconductor device includes forming a pixel portion and a driving circuit including a semiconductor layer. A scan line in a pixel portion and a first wiring in a driving circuit are formed by patterning a first conductive layer, and a data line in the pixel portion and a second wiring in the driving circuit are formed by patterning a second conductive layer. The first wiring, a channel formation region of the semiconductor layer, and the second wiring are overlapped with each other.05-03-2012
20120107984LASER CRYSTALLIZATION SYSTEM AND METHOD OF MANUFACTURING DISPLAY APPARATUS USING THE SAME - A laser crystallization system and a method of manufacturing a display apparatus using the laser crystallization system are disclosed. In one embodiment, the system includes i) a mother substrate in which first, second, and third display regions and ii) a stage for supporting the mother substrate and moving in first and second directions perpendicular to each other. The embodiment also includes i) a first laser irradiation unit for irradiating a first laser beam having a width greater than or identical to a width of a side of one of the first, second, and third display regions in the first direction and ii) a second laser irradiation unit spaced apart from the first laser irradiation unit and irradiating a second laser beam having a width greater than or identical to the width of the one side in the first direction.05-03-2012
20120107983METHOD OF FABRICATING ARRAY SUBSTRATE - A method of fabricating an array substrate including forming a first metal layer; forming a gate insulating layer and an active layer; forming a second metal layer; forming a gate line, an etch-stopper and a gate electrode by patterning the first and second metal layers; forming an interlayer insulating layer including an opening, wherein the opening corresponds to the etch-stopper such that the opening is divided into first and second semiconductor contact holes respectively exposing both sides of the active layer; forming first and second ohmic contact layers, a source electrode, a drain electrode and a data line, the first and second ohmic contact layers respectively contacting both sides of the active layer through the first and second semiconductor contact holes; removing an exposed portion of the etch-stopper; and forming a pixel electrode contacting the drain electrode.05-03-2012
20110263059LIGHT-EMITTING DEVICE, LIQUID-CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME - The present invention provides a structure of a semiconductor device that realizes low power consumption even where increased in screen size, and a method for manufacturing the same. The invention forms an insulating layer, forms a buried interconnection (of. Cu, Au, Ag, Ni, Cr, Pd, Rh, Sn, Pb or an alloy thereof) in the insulating layer. Furthermore, after planarizing the surface of the insulating layer, a metal protection film (Ti, TiN, Ta, TaN or the like) is formed in an exposed part. By using the buried interconnection in part of various lines (gate line, source line, power supply line, common line and the like) for a light-emitting device or liquid-crystal display device, line resistance is decreased.10-27-2011
20090137078Semiconductro laser device - This semiconductor laser device has the same structure as the conventional broad-area type semiconductor laser device, except that both side regions of light emission areas of active and clad layers are two-dimensional-photonic-crystallized. The two-dimensional photonic crystal formed on both side regions of the light emission area is the crystal having the property that 780 nm laser light cannot be wave-guided in a resonator direction parallel to a striped ridge within the region. The light traveling in the direction can exist only in the light emission area sandwiched between two photonic crystal regions, which results in the light laterally confined by the photonic crystal region. The optical confinement of the region suppresses the loss in the light at both edges of the stripe serving as the boundary of the optical confinement, which reduces the curve of wave surface and uniforms the light intensity distributions of NFP and FFP.05-28-2009
20110263060Method for Manufacturing Thin Film Transistor and Method for Manufacturing Display Device - An object is to provide a method for manufacturing a thin film transistor and a display device with reduced number of masks, in which adverse effects of optical current are suppressed. A manufacturing method comprises forming a stack including, from bottom to top, a light-blocking film, a base film, a first conductive film, a first insulating film, a semiconductor film, an impurity semiconductor film, and a second conductive film; performing first etching on the whole thickness of the stack using a first resist mask formed over it; forming a gate electrode layer by side etching the first conductive film in a second etching; forming a second resist mask over the stack; and performing third etching down to the semiconductor film, and partially etching it, using the second resist mask to form a source and drain electrode layer, a source and drain region, and a semiconductor layer.10-27-2011
20100267179Method for Manufacturing Semiconductor Device - A first layer is formed over a substrate, a light absorbing layer is formed over the first layer, and a layer having a light-transmitting property is formed over the light absorbing layer. The light absorbing layer is selectively irradiated with a laser beam via the layer having a light-transmitting property. When the light absorbing layer absorbs energy of the laser beam, due to emission of gas that is within the light absorbing layer, or sublimation, evaporation, or the like of the light absorbing layer, a part of the light absorbing layer and a part of the layer having a light-transmitting property in contact with the light absorbing layer are removed. By using the remaining part of the layer having a light-transmitting property or the remaining part of the light absorbing layer as a mask and etching the first layer, the first layer can be processed into a desired shape.10-21-2010
20100267177METHOD FOR FABRICATING ACTIVE DEVICE ARRAY SUBSTRATE - A method for fabricating an active device array substrate is provided. First, a substrate having a display area and a sensing area is provided. Then, a first patterned conductor layer is formed on the display area of the substrate. A gate insulator is formed on the substrate. A patterned semiconductor layer, a second patterned conductor layer and a patterned photosensitive dielectric layer are formed on the gate insulator, wherein the second patterned conductor layer includes a source electrode, a drain electrode and a lower electrode, the patterned photosensitive dielectric layer covering the second patterned conductor layer includes an interface protection layer disposed on the source electrode and the drain electrode and a photo-sensing layer disposed on the lower electrode. A passivation layer is then formed on the substrate. After that, a third patterned conductor layer including a pixel electrode and an upper electrode is formed on the passivation layer.10-21-2010
20120190145DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method of forming a display device including source/drain electrodes on a substrate, a pixel electrode, an insulating partition wall layer, a channel-region semiconductor layer. Source/drain electrodes of a thin-film transistor are formed on the substrate, while a pixel electrode is connected to the source/drain electrodes. The insulating partition wall layer is formed on the substrate, where the partition wall layer has a first opening extending to between the source electrode and the drain electrode. Furthermore, a channel-region semiconductor layer is formed by depositing a semiconductor layer over the partition wall layer. The channel-region semiconductor layer is on the bottom of the first opening to be separate from a upper part of the partition wall layer.07-26-2012
20120190144ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME TO PREVENT DAMAGE TO AN INTERLAYER - An organic light emitting display device prevents damage to an interlayer including an emitting layer and reduces IR drop in face electrodes, and a method of manufacturing the same. The organic light emitting display device includes: a substrate; a pixel electrode disposed on the substrate; an interlayer comprising an emitting layer disposed on the pixel electrode; a face electrode on the interlayer; and a sealing member disposed on the face electrodes, wherein the sealing member and the face electrode are bent along a curve of an upper portion of a layer below the face electrode so as to prevent a gap between the sealing member and the face electrode, and between the face electrode and the layer below the face electrode.07-26-2012
20120190143METHOD FOR FABRICATING LIQUID CRYSTAL DISPLAY DEVICE - A method of fabricating an LCD device is discussed. The method in one embodiment includes: forming a gate electrode and a gate pad on a substrate, which is defined into a display area corresponding to pixel regions and a non-display area corresponding to pad regions, through a first mask process; sequentially stacking a gate insulation film, an amorphous silicon layer, an impurity-doped amorphous silicon layer and a metal film on the substrate provided with the gate electrode and then forming an active layer, source/drain electrode and a data line through a second mask process which uses one of half-tone and diffraction masks; and forming a transparent conductive material on the substrate provided with the source/drain electrode and forming a pixel electrode through a third mask process.07-26-2012
20120034723DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method of forming a display device including source/drain electrodes on a substrate, a pixel electrode, an insulating partition wall layer, a channel-region semiconductor layer. The source/drain electrodes and the pixel electrode are formed on the substrate and in contact with each other. The insulating partition wall layer is formed on the substrate and provided with a first opening extending to between the source electrode and the drain electrode and a second opening formed on the pixel electrode and extending to the pixel electrode. The channel-region semiconductor layer is formed on the bottom of the first opening. The insulating film is formed on the partition wall layer so as to cover the first opening including the channel-region semiconductor layer. The oriented film covers the first opening from above the insulating film and the second opening from the pixel electrode.02-09-2012
20090087935Fabricating method for quantum dot of active layer of LED by nano-lithography - The present invention is to provide a “fabricating method for quantum dot active layer of LED by nano-lithography” for fabricating out a new active layer of LED of nano quantum dot structure in more miniature manner than that of the current fabricating facilities to have high quality LED with features in longer light wavelength, brighter luminance and lower forward bias voltage by directly using the current fabricating facilities without any alteration or redesign of the precision.04-02-2009
20100124798Method of manufacturing light emitting device - Provided is a method of manufacturing a light emitting device from a large-area bonding wafer by using a wafer bonding method using. The method may include forming a plurality of semiconductor layers, each having an active region for emitting light, on a plurality of growth substrates. The method may also include arranging the plurality of growth substrates on which the semiconductor layers are formed on one bonding substrate and simultaneously processing each of the semiconductor layers formed on each of the growth substrates through subsequent processes. The bonding wafer may be formed of a material that reduces or prevents bending or warping due to a difference of thermal expansion coefficients between a wafer material, such as sapphire, and a bonding wafer. According to the above method, because a plurality of wafers may be processed by one process, mass production of LEDs may be possible which may reduce manufacturing costs.05-20-2010
20110171769LASER MASK AND CRYSTALLIZATION METHOD USING THE SAME - A crystallization method includes providing a substrate having a silicon thin film; positioning a laser mask having first to fourth blocks on the substrate, each block having a periodic pattern including a plurality of transmitting regions and a blocking region; and crystallizing the silicon thin film by irradiating a laser beam through the laser mask. A polycrystalline silicon film crystallized by this method is substantially free from a shot mark, and has uniform crystalline characteristics.07-14-2011
20090142868ORGANIC ELECTRO-LUMINANCE DEVICE AND METHOD FOR FABRICATING THE SAME - Provided is an organic EL device and fabrication method thereof that can prevent the performance of the organic EL layer and the TFT from being lowered in forming the cathode using an E-beam heating evaporation process. The organic EL device includes a substrate, an anode, an organic EL layer, a cathode, and a transparent electrode connected with the cathode to extract the cathode to an outside, and further includes an interconnection line connected to the transparent electrode, for discharging charges accumulated on the cathode outside the organic EL device. According to the present invention, since the charges generated on the cathode can be removed through the interconnection line, the underlying organic EL layer and the TFT can be prevented from being damaged, so that the device reliability can be enhanced.06-04-2009
20100279449DISPLAY DEVICE PROVIDED WITH SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE INSTALLED WITH DISPLAY DEVICE PROVIDED WITH SEMICONDUCTOR ELEMENT - According to one feature of the invention, a region of an insulating film surface at least overlapped with a part of a gate electrode or wiring is coated with an organic agent; a fluid in which conductive fine particles are dispersed in an organic solvent is discharged by a droplet discharging method in the insulating film surface ranging from a region where the organic agent is coated and left to a region where the organic agent is not coated. The organic agent is coated to improve wettability of the fluid in the insulating film surface, and one of each ends of the source electrode and the drain electrode adjacent to each other by interposing the curve therebetween is formed by being curved in a concave and the other end is formed by being curved in a convex.11-04-2010
20110171768MASK FRAME ASSEMBLY FOR THIN LAYER DEPOSITION AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY DEVICE BY USING THE MASK FRAME ASSEMBLY - A mask frame assembly for thin film deposition includes a frame including an opening portion, and a plurality of unit mask strips that are fixed to the frame after a tensile force is applied to both of end portions of the unit mask strips in a lengthwise direction of the unit mask strips. Each of the plurality of unit mask strips includes a plurality of unit masking pattern portions each including a plurality of opening patterns. Before the tensile force is applied to both of the end portions of the unit mask strips in the lengthwise direction and the unit mask strips are fixed to the frame, a width of each of the unit masking pattern portions in a widthwise direction perpendicular to the lengthwise direction increases as a function of a closeness of a portion of the unit masking pattern portion where the width is measured to a central portion of each of the unit masking pattern portions.07-14-2011
20130217165METHOD FOR MANUFACTURING AN ORGANIC LIGHT EMITTING DIODE DISPLAY - Making an OLED display, includes forming a first storage plate and a gate insulating layer covering the first storage plate on a substrate; sequentially forming a second storage plate covering the first storage plate and a capacitor intermediate in the gate insulating layer; forming a first doping region by injecting an impurity to a part that is not covered by the capacitor intermediate in the first storage plate; forming an interlayer insulating layer having a capacitor opening exposing the capacitor intermediate, and a plurality of erosion preventing layers on an edge of the capacitor intermediate toward the first doping region in the capacitor opening; removing the capacitor intermediate including the erosion preventing layer and a lower region of the erosion preventing layer, and injecting an impurity in the first storage plate through the second storage plate to form a second doping region contacting the first doping region.08-22-2013
20100279450Active Device Array Substrate and Method for Fabricating the Same - An active device array substrate and its fabricating method are provided. According to the subject invention, the elements of an array substrate such as the thin film transistors, gate lines, gate pads, data lines, data pads and storage electrodes, are provided by forming a patterned first metal layer, an insulating layer, a patterned semiconductor layer and a patterned metal multilayer. Furthermore, the subject invention uses the means of selectively etching certain layers. Using the aforesaid means, the array substrate of the subject invention has some layers with under-cut structures, and thus, the number of the time-consuming and complicated mask etching process involved in the production of an array substrate can be reduced. The subject invention provides a relatively simple and time-saving method for producing an array substrate.11-04-2010
20100136730THIN FILM DEVICES FOR FLAT PANEL DISPLAYS AND METHODS FOR FORMING THE SAME - Methods of forming thin film devices with different electrical characteristics on a substrate comprising a driver circuit region and a pixel region. A first and a second polysilicon pattern layers are formed on the driving circuit region and the pixel region of the substrate, respectively. A first ion implantation is performed on the second polysilicon pattern layer using a masking layer covering the first polysilicon pattern layer as an implant mask, such that the first polysilicon pattern layer has an impurity concentration different from the second polysilicon pattern layer. After removal of the masking layer, a gate dielectric layer and a gate are successively formed on each of the first and second polysilicon pattern layers and a source/drain region is subsequently formed in each of the first and second polysilicon pattern layers to define a channel region therein.06-03-2010
20080274573Method of fabricating linear cascade high-speed green light emitting diode - Green light emitting diodes (LED) of gallium arsenide (GaAs) are series-connected. The series connection has a small transmission attenuation and a wide bandwidth. The GaAs LED has a big forward bias and so neither extra driving current nor complex resonant-cavity epitaxy layer is needed. Hence, the present invention has a high velocity, a high efficiency and a high power while an uneven current distribution is avoided.11-06-2008
20080305568Method for promoting light emission efficiency of LED using nanorods structure - Method for the light emitting diode (LED) having the nanorods-like structure is provided. The LED employs the nanorods are subsequently formed in a longitudinal direction by the etching method and the PEC method. In addition, the plurality of the nanorods is arranged in an array so that provide the LED having much greater brightness and higher light emission efficiency than the conventional LED.12-11-2008
20120295380ETCHANT AND METHOD OF MANUFACTURING AN ARRAY SUBSTRATE USING THE SAME - An etchant includes about 0.1 percent by weight to about 30 percent by weight of ammonium persulfate (NH11-22-2012
20110207254Method of manufacturing organic light emitting display device - A method of manufacturing an organic light emitting display device includes providing a panel including a first opening portion formed in a first substrate and a second opening portion spaced apart from the first opening portion, disposing a transmissive-window forming composition in the second opening portion, forming an organic layer in the first opening portion, forming a metal layer on the panel so as to cover the first opening portion and the second opening portion, and forming a transmissive window by volatilizing the transmissive-window forming composition to open a region of the metal layer corresponding to the second opening portion.08-25-2011
20100144077SUBSTRATE PROCESSING APPARATUS AND METHOD AND A MANUFACTURING METHOD OF A THIN FILM SEMICONDUCTOR DEVICE - A substrate processing apparatus includes a plurality of evacuable treatment chambers connected to one another via an evacuable common chamber, and the common chamber is provided with means for transporting a substrate between each treatment chamber. More specifically, a substrate processing apparatus includes a plurality of evacuable treatment chambers, at least one of said treatment chambers having a film formation function through a vapor phase reaction therein, at least one of said treatment chambers having an annealing function with light irradiation and at least one of said treatment chambers having a heating function therein. The apparatus also has a common chamber through which said plurality of evacuable treatment chambers are connected to one another, and a transportation means provided in said common chamber for transporting a substrate between each treatment chamber.06-10-2010
20100144076THIN FILM TRANSISTOR ARRAY PANEL AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a thin film transistor array panel including an insulating substrate, a gate line formed on the insulating substrate, a gate insulating layer formed on the gate line, a drain electrode and a data line having a source electrode formed on the gate insulating layer wherein the drain electrode faces the source electrode with a gap therebetween, and a pixel electrode connected to the drain electrode. At least one of the gate line, the data line, and the drain electrode includes a first conductive layer made of a conductive oxide and a second conductive layer of Ag that is deposited adjacent to the first conductive layer.06-10-2010
20120142132METHOD OF MANUFACTURING OPTICAL MATRIX DEVICE - According to a method of manufacturing an optical matrix device of this invention, an extension-promoting pattern that promotes extension of droplets printed and coated is formed on an insulation film as a foundation layer where printing patterns are to be formed, whereby the droplets extend along the extension-promoting pattern. Moreover, an extension-inhibiting pattern is formed at end portions of the printing patterns as to intersect the printing patterns, i.e., the extension-promoting pattern, whereby the extension-inhibiting pattern stops extension of the droplets extending along the extension-promoting pattern. Accordingly, control may be made of positional accuracy of the liquid droplets.06-07-2012
20090186438ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An array substrate for a liquid crystal display device includes a substrate, a gate line on the substrate, a data line crossing the gate line to define a pixel region, a thin film transistor connected to the gate line and the data line and including a gate electrode, an active layer, an ohmic contact layer, a buffer metallic layer, a source electrode and a drain electrode, and a pixel electrode in the pixel region and connected to the thin film transistor, wherein the data line includes a transparent conductive layer and an opaque conductive layer, and each of the source and drain electrodes and the pixel electrode includes a transparent conductive layer.07-23-2009
20110223700THIN FILM TRANSISTOR LIQUID CRYSTAL DISPLAY ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - A TFT LCD array substrate and a manufacturing method thereof. The manufacturing method includes the steps of forming a thin film transistor on a substrate to form a gate line and a gate electrode connected with the gate line on the substrate; forming a gate insulating layer and a semiconductor layer on the gate electrode; forming an ohmic contact layer on the semiconductor layer; forming a transparent pixel electrode layer and a source/drain electrode metal layer in sequence on the resultant substrate, wherein the transparent pixel electrode layer is electrically insulated from the gate line and the gate electrode, and the transparent pixel electrode layer forms an ohmic contact with two sides of the semiconductor layer via the ohmic contact layer; and performing masking and etching with a gray tone mask with respect to the resultant substrate to form a transparent pixel electrode, a source/drain electrode and a data line simultaneously.09-15-2011
20090023239LIGHT EMITTING DEVICE PROCESSES - Light-emitting devices, and related components, processes, systems and methods are disclosed.01-22-2009
20100248404Method for producing group III nitride-based compound semiconductor device - A method for producing a Group III nitride-based compound semiconductor device includes, before bonding a support substrate to an epitaxial layer formed on an epitaxial growth substrate, forming trenches in such a manner as to extend from the top surface of a stacked structure including the epitaxial layer to at least the interface between the epitaxial growth substrate and the bottom surface of the epitaxial layer. The trenches divide the epitaxial layer into extended device areas which encompass respective product device structures, and stress relaxation areas. A plurality of laser irradiations are performed for laser lift off such that, after each laser irradiation, the expanded device areas and the stress relaxation areas are formed by a laser-irradiated area and a laser-unirradiated area, and a strip-shaped laser-unirradiated stress relaxation area is formed at a boundary between the laser-irradiated area and the laser-unirradiated area.09-30-2010
20100248405METHOD OF FABRICATING DISPLAY DEVICE - To improve the use efficiency of materials and provide a technique of fabricating a display device by a simple process. The method includes the steps of providing a mask on a conductive layer, forming an insulating film over the conductive layer provided with the mask, removing the mask to form an insulating layer having an opening; and forming a conductive film in the opening so as to be in contact with the exposed conductive layer, whereby the conductive layer and the conductive film can be electrically connected through the insulating layer. The shape of the opening reflects the shape of the mask. A mask having a columnar shape (e.g., a prism, a cylinder, or a triangular prism), a needle shape, or the like can be used.09-30-2010
20110223699Wiring Material, Semiconductor Device Provided with a Wiring Using the Wiring Material and Method of Manufacturing Thereof - A semiconductor device having good TFT characteristics is realized. By using a high purity target as a target, using a single gas, argon (Ar), as a sputtering gas, setting the substrate temperature equal to or less than 300° C., and setting the sputtering gas pressure from 1.0 Pa to 3.0 Pa, the film stress of a film is made from −1×1009-15-2011
20090081820Method for manufacturing liquid crystal display device - A method for manufacturing a liquid crystal display device is disclosed. The method includes forming a gate electrode, a gate pad, a gate line on a substrate by using a first mask; forming a gate insulating film, an active layer, an ohmic contact layer and a conductive layer in sequence above the substrate including the gate electrode, the gate line and the gate pad; forming an active pattern, an ohmic contact pattern, source/drain electrodes, a data line and a data pad by using a second mask; forming a pixel electrode on the gate insulating film in a pixel region by using a third mask, to contact with the drain electrode; exposing the active pattern by etching the ohmic contact pattern using the source/drain electrodes as an etching mask; forming a passivation film above the substrate including the source/drain electrodes, the data line and the data pad; forming a first contact hole for exposing the gate pad and a second contact hole for exposing the data pad by etching the passivation and/or gate insulating films using a fourth mask; and forming a common electrode having a plurality of holes on the substrate by using a fifth mask.03-26-2009
20120171793METHOD OF MANUFACTURING A DISPLAY SUBSTRATE - A method of manufacturing a display substrate includes forming a common electrode line, a gate line, a data line and a switching element connected to the gate and data lines on an insulation substrate. A first pixel electrode and an insulation layer are sequentially formed on the insulation substrate. A first photoresist pattern having a first hole and a second hole is formed from a first photoresist layer on the insulation substrate. A first transparent electrode layer is coated on the insulation substrate. A second photoresist layer is coated on the insulation substrate. The second photoresist layer is exposed and developed to form a second photoresist pattern remaining in the first hole and the second hole. The first transparent electrode layer is patterned using the second photoresist pattern, to form a second pixel electrode.07-05-2012
20120142131METHOD OF MANUFACTURING DISPLAY APPARATUS - Provided is a method of manufacturing a display apparatus, including forming a drive circuit and a light-emitting portion on a substrate in which the forming the light-emitting portion includes forming a transparent anode electrode for applying a charge to an emission layer, forming a first coating layer and a second coating layer on the transparent anode electrode, removing the first coating layer by etching using the second coating layer as a mask, and forming a layer including the emission layer on a part of the transparent anode electrode from which the first coating layer is removed. A surface of the transparent anode electrode becomes as clean as a surface cleaned with ultraviolet irradiation.06-07-2012
20100273282LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - An LCD device and a method of fabricating the device, in which the method includes preparing an insulating substrate including a gate wiring area and sequentially forming a gate wiring layer including a silver layer and a self-assembled monolayer on the insulating substrate. A mold mask is positioned above the insulating substrate, where the mold mask has a predetermined pattern to expose the gate wiring area. A self-assembled monolayer pattern is formed by printing the predetermined pattern of the mold mask into the self-assembled monolayer and a gate wiring pattern is formed by selectively etching the silver layer using the self-assembled monolayer pattern as an etching mask, where the gate wiring pattern includes a gate pad, a gate electrode and a gate line. The LCD device includes a gate wiring layer including a self-assembled monolayer and a metal layer of silver overlying an insulating substrate.10-28-2010
20120034722MANUFACTURING METHOD FOR A THIN FILM TRANSISTOR-LIQUID CRYSTAL DISPLAY - A pixel unit of TFT-LCD array substrate and a manufacturing method thereof is disclosed. In the manufacturing method, besides a first insulating layer and a passivation layer, a second insulating layer is adopted to cover the gate island, and forms an opening on the gate island to expose the channel region, the source region and the drain region of the TFT. A gray tone mask and a photoresist lifting-off process are utilized to perform patterning, so that the TFT-LCD array substrate can be achieved with just three masks.02-09-2012
20130122623METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE - A method of manufacturing an optical semiconductor device includes: forming first and second optical semiconductor elements separated from each other by a separation groove on a semiconductor substrate; forming first and second electrodes containing Pt on top surfaces of the first and second optical semiconductor elements, respectively; forming a third electrode electrically connected to the first and second electrodes and preventing the third electrode from being formed in the separation groove; forming first and second Au plated layers on the first and second electrodes, respectively, by electrolytic plating, using the third electrode as a power supply layer; forming a resist covering the first and second Au plated layers by photolithography; and etching the third electrode, using the resist as a mask, to electrically separate the first electrode from the second electrode.05-16-2013
20130122624THIN FILM TRANSISTOR LIQUID CRYSTAL DISPLAY ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - A TFT LCD array substrate and a manufacturing method thereof. The manufacturing method includes the steps of: forming a thin film transistor on a substrate to form a gate line and a gate electrode connected with the gate line on the substrate; forming a gate insulating layer and a semiconductor layer on the gate electrode; forming an ohmic contact layer on the semiconductor layer; forming a transparent pixel electrode layer and a source/drain electrode metal layer in sequence on the resultant substrate, wherein the transparent pixel electrode layer is electrically insulated from the gate line and the gate electrode, and the transparent pixel electrode layer forms an ohmic contact with two sides of the semiconductor layer via the ohmic contact layer; and performing masking and etching with a gray tone mask with respect to the resultant substrate to form a transparent pixel electrode, a source/drain electrode and a data line simultaneously.05-16-2013
20100159624ETCHANT FOR ETCHING DOUBLE-LAYERED COPPER STRUCTURE AND METHOD OF FORMING ARRAY SUBSTRATE HAVING DOUBLE-LAYERED COPPER STRUCTURES - An etchant for forming double-layered signal lines and electrodes of a liquid crystal display device includes hydrogen peroxide (H06-24-2010
20110059561METHOD FOR FABRICATING A FLEXIBLE DISPLAY DEVICE - A method for fabricating a flexible display device includes providing a carrier substrate, forming a sacrificial layer on the carrier substrate, forming a metal layer and a buffer layer on the sacrificial layer in that order, forming at least one active device on the buffer layer, and separating the metal layer and the carrier substrate by laser treatment.03-10-2011
20100227426Liquid Crystal Display Array Substrate and Its Manufacturing Method - A liquid crystal display (LCD) array substrate and its manufacturing method are provided. Scan lines and data lines of the LCD array substrate are composed of two conductive layers to decrease their RC delay. Moreover, the dielectric layer and even the planarization layer are removed from pixel areas defined by the scan lines and the data lines to increase the light penetration percentage.09-09-2010
20120196395METHOD FOR CRYSTALLIZING THIN FILM, METHOD FOR MANUFACTURING THIN FILM SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING DISPLAY DEVICE - A method for crystallizing a thin film A gate insulating film formed on a substrate so as to cover a gate electrode. A light absorption layer is formed thereon through a buffer layer. Energy lines Lh are applied to the light absorption layer from a continuous-wave laser such as a semiconductor laser. This anneals only a surface side of the light absorption layer Lh and produces a crystalline silicon film obtained by crystallizing the amorphous silicon film using heat generated by thermal conversion of the energy lines Lh at the light absorption layer and heat of the annealing reaction.08-02-2012
20100221857CONTROL CIRCUIT FOR STACKED OLED DEVICE - A plurality of organic light-emitting diode (OLED) control circuits, each circuit comprising three electrodes, a first electrode, a second electrode independently controlled from the first electrode, and a third electrode is connected in common with the third electrode from another OLED control circuit and independently controlled from the first and second electrode. Given a first and second OLED, the first electrode is connected to a first terminal of the first OLED, the second electrode is connected to a second terminal of the first OLED and to a first terminal of the second OLED, and the third electrode is connected to a second terminal of the second OLED. At least one bypass transistor, responsive to a bypass signal, connects the second electrode and third electrode.09-02-2010
20100240160METHOD OF MANUFACTURING DISPLAY DEVICE, DISPLAY DEVICE THEREFROM AND MANUFACTURING APPARATUS THEREFOR - A method of manufacturing a display device includes forming a thin film transistor on an insulating substrate, forming an electrode which is electrically connected with the thin film transistor, forming a wall which surrounds the electrode, supplying a first solvent to the electrode that is surrounded by the wall, and supplying ink which comprises an organic material and a second solvent to the electrode which has previously received the first solvent. Thus, the manufacturing method produces a display device which has a uniform organic layer.09-23-2010
20100267178ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - An organic electroluminescent display device includes a substrate, gate and data lines on the substrate and crossing each other to define a pixel region, a switching element at each crossing point of the gate and data lines, a driving element coupled to the switching element, a field control electrode coupled to the driving element and overlapping a channel of the driving element, and an organic electroluminescent diode coupled to the driving element.10-21-2010
20100210057Method for Manufacturing Thin Film Transistor and Method for Manufacturing Display Device - An object is to provide a method for manufacturing a thin film transistor and a display device with reduced number of masks, in which adverse effects of optical current are suppressed. A manufacturing method comprises forming a stack including, from bottom to top, a light-blocking film, a base film, a first conductive film, a first insulating film, a semiconductor film, an impurity semiconductor film, and a second conductive film; performing first etching on the whole thickness of the stack using a first resist mask formed over it; forming a gate electrode layer by side etching the first conductive film in a second etching; forming a second resist mask over the stack; and performing third etching down to the semiconductor film, and partially etching it, using the second resist mask to form a source and drain electrode layer, a source and drain region, and a semiconductor layer.08-19-2010
20100210056Method of fabricating array substrate - A method of fabricating an array substrate for a display device includes steps of forming a gate line and a gate electrode on a substrate, forming a gate insulating layer and an intrinsic amorphous silicon layer, forming an oxide semiconductor layer, increasing a conductive property of the oxide semiconductor layer, forming a metal layer, forming a first photoresist pattern and a second photoresist pattern having a thinner thickness than the first photoresist pattern, forming a data line, a source drain pattern, an oxide semiconductor pattern and an active layer, removing the second photoresist pattern and exposing the source drain pattern, wet-etching the source drain pattern using a first etchant, thereby forming source and drain electrodes, wet-etching the oxide semiconductor pattern using a second etchant, thereby forming ohmic contact layers, removing the first photoresist pattern, forming a passivation layer having a drain contact hole exposing the drain electrode on the source and drain electrodes, and forming a pixel electrode connected to the drain electrode through the drain contact hole, wherein the active layer has a uniform thickness in the switching region.08-19-2010
20130217164ORGANIC LAYER DEPOSITION APPARATUS, AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY APPARATUS USING THE SAME - An organic layer deposition apparatus and a method of manufacturing an organic light emitting display apparatus by using the organic layer deposition apparatus. An organic layer deposition apparatus includes: a carrier including a chuck on which a substrate is mounted to form an organic layer; a scanning unit including a deposition unit for discharging a deposition raw material, and a patterning slit sheet having a plurality of patterning slits, the patterning slit sheet being smaller than the substrate in at least one of a first direction or a second direction perpendicular to the first direction; and a chamber accommodating the carrier and the scanning unit, the scanning unit being arranged to be spaced apart from the substrate and movable relative to the carrier.08-22-2013
20100151610COMPOSITION FOR PHOTORESIST STRIPPER AND METHOD OF FABRICATING THIN FILM TRANSISTOR ARRAY SUBSTRATE - A composition for a photoresist stripper and a method of fabricating a thin film transistor array substrate are provided according to one or more embodiments. In one or more embodiments, the composition includes about 5-30 weight % of a chain amine compound, about 0.5-10 weight % of a cyclic amine compound, about 10-80 weight % of a glycol ether compound, about 5-30 weight % of distilled water, and about 0.1-5 weight % of a corrosion inhibitor.06-17-2010
20100197059ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - An array substrate for a liquid crystal display device includes a substrate having a display area and a driving circuit area, a first semiconductor layer formed on the substrate in the display area, the first semiconductor layer having an active region and source and drain regions at opposing sides of the active region, a gate insulating layer formed on the first semiconductor layer, a gate electrode formed on the gate insulating layer and over the active region, the gate electrode being wider than the gate insulating layer, and an interlayer insulating layer formed over the substrate including the gate electrode, wherein the interlayer insulating layer, the gate electrode, the gate insulating layer, and the active region define a first cavity.08-05-2010
20100197058THIN FILM TRANSISTOR PANEL AND MANUFACTURING METHOD THEREOF - A thin film transistor array panel including a substrate, a gate line and a gate-layer signal transmitting line of a gate driving circuit portion formed on the substrate, a gate insulating layer formed on the gate line and the gate-layer signal transmitting line and having a first contact hole exposing a portion of the gate-layer signal transmitting line, a semiconductor layer formed on the gate insulating layer, a data line including a source electrode, and a drain electrode formed on the gate insulating layer and the semiconductor layer, a data-layer signal transmitting line of the gate driving circuit portion formed on the gate insulating layer and connected to the gate-layer signal transmitting line through the first contact hole, a pixel electrode connected to the drain electrode, and a passivation layer formed on the data line, the drain electrode, and the data-layer signal transmitting line of the driving circuit portion. The data line, the drain electrode, and the data-layer signal transmitting line have a triple-layered structure including a lower layer, an intermediate layer, and an upper layer. The lower layer is made of a same layer as the pixel electrode.08-05-2010
20110117687ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - Provided is an organic light-emitting display device (OLED) and method of manufacturing the same. The OLED comprises a substrate and a thin film transistor, with source/drain electrodes, located at a predetermined area on the substrate. A passivation layer is located on the source/drain electrodes with a via hole exposing one of the source/drain electrodes. A first pixel electrode is located at the bottom of the via hole, electrically coupled to the exposed source/drain electrode, and extending onto the side wall of the via hole and the passivation layer. A planarization pattern fills the via hole in which the first pixel electrode is located and exposes the portion of the first pixel electrode on the passivation layer.05-19-2011
20100304515DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device including a thin film transistor with high electric characteristics and high reliability, and a method for manufacturing the display device in high yield are proposed. In a display device including a channel stop thin film transistor with an inverted-staggered structure, the channel stop thin film transistor with the inverted-staggered structure includes a microcrystalline semiconductor film including a channel formation region. An impurity region including an impurity element imparting one conductivity type is formed as selected in a region in the channel formation region of the microcrystalline semiconductor film which does not overlap with a source electrode or a drain electrode. In the channel formation region, a non-doped region, to which the impurity element imparting one conductivity type is not added, is formed between the impurity region, which is a doped region to which the impurity element is added, and the source region or the drain region.12-02-2010
20130137204CRYSTALLIZATION APPARATUS, CRYSTALLIZING METHOD, AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - A crystallization apparatus for crystallizing a semiconductor layer formed on a substrate. The crystallization apparatus includes a laser generator, which generates a laser beam, an optical device for changing a path of the laser beam emitted from the laser generating device, and a stage on which the substrate is arranged, wherein the optical device changes the path of the laser beam by rotating with respect to a constant axis, and the stage is moved so that the laser beam having the changed path is irradiated to a constant region on the semiconductor layer.05-30-2013
20100311197LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - As a substrate gets larger, time of manufacture is increased due to the repetition of film formations and etchings; waste disposal costs of etchant and the like are increased; and material efficiency is significantly reduced. A base film for improving adhesion between a substrate and a material layer formed by a droplet discharge method is formed in the invention. Further, a manufacturing method of a liquid crystal display device according to the invention includes at least one step for forming the following patterns required for manufacturing a liquid crystal display device without using a photomask: a pattern of a material layer typified by a wiring (or an electrode) pattern, an insulating layer pattern; or a mask pattern for forming another pattern.12-09-2010
20110111541SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A silicon film is crystallized in a predetermined direction by selectively adding a metal element having a catalytic action for crystallizing an amorphous silicon and annealing. In manufacturing TFT using the crystallized silicon film, TFT provided such that the crystallization direction is roughly parallel to a current-flow between a source and a drain, and TFT provided such that the crystallization direction is roughly vertical to a current-flow between a source and a drain are manufactured. Therefore, TFT capable of conducting a high speed operation and TFT having a low leak current are formed on the same substrate.05-12-2011
20110014737THIN FILM TRANSISTOR ARRAY AND METHOD OF MANUFACTURING THE SAME - A thin film transistor array and method of manufacturing the same include a pixel electrode formed of a transparent conductive layer on a substrate, a gate line formed of the transparent conductive layer and an opaque conductive layer on the substrate, a gate electrode connected to the gate line and formed of the transparent conductive layer and an opaque conductive layer on the substrate, a gate insulating layer which covers the gate line and the gate electrode, a semiconductor layer formed on the gate insulating layer to overlap the gate electrode, a data line which intersects the gate line, a source electrode connected to the data line to overlap a part of the semiconductor layer, and a drain electrode connected to the pixel electrode to overlap a part of the semiconductor layer.01-20-2011
20110033964THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME - A thin film deposition apparatus and a method of manufacturing an organic light-emitting display device using the thin film deposition apparatus. The thin film deposition apparatus includes a plurality of thin film deposition assemblies, each of which includes: a deposition source that discharges a deposition material; a deposition source nozzle unit that is disposed at a side of the deposition source and includes a plurality of deposition source nozzles; a patterning slit sheet that is disposed opposite to the deposition source nozzle unit and includes a plurality of patterning slits arranged in a first direction; and a barrier plate assembly that is disposed between the deposition source nozzle unit and the patterning slit sheet, in the first direction. The barrier plate assembly includes a plurality of barrier plates that partition a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces.02-10-2011
20110244615METHOD FOR MANUFACTURING PIXEL STRUCTURE - A pixel structure includes a scan line, a data line, an active element, a first passivation layer, a second passivation layer and a pixel electrode. The data line includes a first data metal segment and a second data metal layer. The active element includes a gate electrode, an insulating layer, a channel layer, a source and a drain. The channel layer is positioned on the insulating layer above the gate electrode. The source and the drain are positioned on the channel layer. The source is coupled to the data line. The first passivation layer and the second passivation layer cover the active element and form a first contact hole to expose a part of the drain. The second passivation layer covers a part edge of the drain. The pixel electrode is disposed across the second passivation layer and coupled to the drain via the first contact hole.10-06-2011
20110244614METHOD OF MANUFACTURING AN OPTICAL MATRIX DEVICE - According to the method of manufacturing an optical matrix device of this invention, semiconductor films and gate insulating films which influence the characteristics of thin-film transistors most are formed in a vacuum (S10-06-2011
20110244613WAFER-LEVEL In-P Si BONDING FOR SILICON PHOTONIC APPARATUS - Wafer-level bonding of the hybrid laser portion of a silicon photonics platform is done by forming a weakened level in a semiconductive pillar that supports laser-active layers by ion implantation into the semiconductive pillar without penetrating the laser-active layers, and by separating the laser-active layers from the semiconductive pillar by cracking the weakened level by an epitaxial lift-off processes.10-06-2011
20100221858MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - To provide a semiconductor device with high performance and low cost and a manufacturing method thereof. A first region including a separated (cleavage) single-crystal semiconductor layer and a second region including a non-single-crystal semiconductor layer are provided over a substrate. It is preferable that laser beam irradiation be performed to the separated (cleavage) single-crystal semiconductor layer in an inert atmosphere, and laser beam irradiation be performed to the non-single-crystal semiconductor layer in an air atmosphere at least once.09-02-2010
20100216267THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURE THEREOF - A method for a thin film transistor array panel includes forming a gate line and a pixel electrode on a substrate, forming a gate insulating layer covering the gate line, forming a data line including a source electrode and a drain electrode on the gate insulating layer, forming an interlayer insulating layer covering the data line and the drain electrode on the gate insulating layer, forming a first opening in the interlayer insulating layer, forming an organic semiconductor in the first opening, forming a passivation layer on the organic semiconductor and the interlayer insulating layer, and forming a second opening in the interlayer insulating layer to expose the pixel electrode.08-26-2010
20100062557Liquid crystal display device and fabrication method thereof - A method for fabricating an LCD device includes forming an active layer having a source region, a drain region and a channel region on the first substrate; forming first and second conductive layers on the first substrate; forming a gate electrode, a gate line and a pixel electrode by patterning the first and second conductive layers, the gate electrode and the gate line being formed as a dual layer having the first and second conductive layers and the pixel electrode being formed of the first conductive layer; forming a contact hole exposing a portion of the source and drain regions; forming a source and drain electrodes electrically connected to the source and drain regions through the contact hole; and forming a liquid crystal layer between the first and second substrates.03-11-2010
20100062556METHODS FOR MANUFACTURING THIN FILM TRANSISTOR AND DISPLAY DEVICE - The present invention provides a method for manufacturing a thin film transistor with small leakage current and high switching characteristics. In a method for manufacturing a thin film transistor, a back channel portion is formed in the thin film transistor by conducting etching using a resist mask, the resist mask is removed by removal or the like, and a superficial part of the back channel portion is further etched. Through the steps, components of chemical solution used for the removal, residues of the resist mask, and the like which exist at the superficial part of the back channel portion can be removed and leakage current can be reduced. The further etching step of the back channel portion is preferably conducted by dry etching using an N03-11-2010
20110097836ARRAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF REPAIRING LINE IN THE SAME - An array substrate includes a substrate, a gate line on the substrate, a data line crossing the gate line to define a pixel region, a thin film transistor connected to the gate and data lines, a pixel electrode in the pixel region, and a common electrode including first, second, third, fourth and fifth portions, wherein the first and second portions are disposed at both sides of the data line, each of the third and fourth portions is connected to the first and second portions, and the fifth portion is connected to the second portion and is extended into a next pixel region adjacent to the pixel region.04-28-2011
20110097835PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME - A photoresist composition includes an alkali-soluble resin, a dissolution inhibitor including a quinone diazide compound, a first additive including a benzenol compound represented by the following Chemical Formula 1, a second additive including an acrylic copolymer represented by the following Chemical Formula 2 and an organic solvent. Accordingly, heat resistance of a photoresist pattern may be improved, and the photoresist pattern may be readily stripped. As a result, crack formation in the photoresist pattern may be reduced and/or prevented.04-28-2011
20090215212Method for Fabricating A Flat Panel Display - The method for fabricating a flat panel display includes performing a first crystallization process to re-crystallize an amorphous silicon layer on a glass substrate to make the amorphous silicon layer become a polysilicon layer, forming a patterned absorbing layer to cover an active area pattern of a driving TFT and to expose portions of the polysilicon layer, performing a second crystallization process to re-crystallization the exposed portions of the polysilicon layer so that the exposed portions of the polysilicon layer has a different grain structure from the grain structure of the driving TFT, removing the patterned absorbing layer, and removing portions of the polysilicon layer to form an active area of the driving TFT and an active area of a switching TFT area in the exposed portions of the polysilicon layer of each sub-pixel.08-27-2009
20100068842LONG-WAVELENGTH RESONANT-CAVITY LIGHT-EMITTING DIODE - An efficient long-wavelength light-emitting diode has a resonant-cavity design. The light-emitting diode preferably has self-organized (In,Ga)As or (In,Ga)(As,N) quantum dots in the light-emitting active region, deposited on a GaAs substrate. The light-emitting diode is capable of emitting in a long-wavelength spectral range of preferably 1.15-1.35 μm. The light-emitting diode also has a high efficiency of preferably at least 6 mW and more preferably at least 8 mW at an operating current of less than 100 mA and a low operating voltage of preferably less than 03-18-2010
20110250713ACTIVE MATRIX SUBSTRATE MANUFACTURING METHOD AND LIQUID CRYSTAL DISPLAY DEVICE MANUFACTURING METHOD - Provided is an active matrix substrate manufacturing method, including the steps of: selectively forming a laminated structure pattern, by forming the laminated structure on a glass substrate (10-13-2011
20110059562MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - An object is to provide a manufacturing method of a microcrystalline semiconductor film with favorable quality over a large-area substrate. After forming a gate insulating film over a gate electrode, in order to improve quality of a microcrystalline semiconductor film formed in an initial stage, glow discharge plasma is generated by supplying high-frequency powers with different frequencies, and a lower part of the film near an interface with the gate insulating film is formed under a first film formation condition, which is low in film formation rate but results in a good quality film. Thereafter, an upper part of the film is deposited under a second film formation condition with higher film formation rate, and further, a buffer layer is stacked on the microcrystalline semiconductor film.03-10-2011
20090311816AC LIGHT EMITTING DEVICE HAVING PHOTONIC CRYSTAL STRUCTURE AND METHOD OF FABRICATING THE SAME - Disclosed is an AC light emitting device having photonic crystal structures and a method of fabricating the same. The light emitting device includes a plurality of light emitting cells and metallic wirings electrically connecting the light emitting cells with one another. Further, each of the light emitting cells includes a first conductive type semiconductor layer, a second conductive type semiconductor layer disposed on one region of the first conductive type semiconductor layer, and an active layer interposed between the first and second conductive type semiconductor layers. In addition, a photonic crystal structure is formed in the second conductive type semiconductor layer. The photonic crystal structure prevents light emitted from the active layer from laterally propagating by means of a periodic array, such that light extraction efficiency of the light emitting device can be improved. Furthermore, the metallic wirings electrically connect a plurality of light emitting cells with one another such that an AC light emitting device can be provided.12-17-2009
20090280591METHOD OF MANUFACTURING A DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING A DISPLAY APPARATUS USING THE SAME - Provided is a method of manufacturing a display substrate. In the method, a gate line, a data line crossing the gate line, and a switching device are formed on a base substrate. A passivation layer, a first resist layer and a second resist layer are formed on the base substrate. The first resist layer and the second resist layer are patterned to form a resist pattern and an etch-stop pattern, the etch-stop pattern having a sidewall protruding from a sidewall of the resist pattern. A portion of the passivation layer is removed to form a contact hole on a drain electrode of the switching device. A pixel electrode electrically connected to the switching device through the contact hole is formed. Thus, an undercut between an etch-stop pattern and a resist pattern may be more easily formed without over-etching a passivation layer.11-12-2009
20110159621MANUFACTURING METHOD FOR LIGHT EMITTING DEVICE - A light emitting device manufacturing method including the steps of corrugatedly scanning a laser beam along a plurality of division lines formed on a light emitting device wafer having a sapphire substrate layer and a light emitting layer to apply the laser beam to the sapphire substrate layer, thereby performing laser processing for the sapphire substrate layer and next applying an external force to a processed locus formed along each division line by the above laser processing to thereby divide the light emitting device wafer into a plurality of light emitting devices. The sapphire layer of each light emitting device has side surfaces whose horizontal sectional shape is a corrugated shape. Accordingly, the number of total reflections on the side surfaces of the sapphire layer can be reduced to thereby achieve efficient emergence of light from the sapphire layer.06-30-2011
20110256650ELECTRO-OPTICAL DEVICE AND AN ELECTRONIC APPARATUS - An electro-optical device that drives each of plural pixels individually arranged in two dimensions so as to display information, is provided with a group of pixels displaying the information within an effective display region among the plural pixels arranged in two dimensions. A group of plural pseudo-pixels that do not contribute to the display of the information are located adjacent to a group of pixels within the effective display region. A bank layer separates a pixel in the group of the plural pseudo-pixels from a pixel in the group of pixels in the effective display region, and shields light leaked from a space between pixels located adjacently each other within the effective display region.10-20-2011
20080206914Patterning self-aligned transistors using back surface illumination - Fabrication methods for making thin film devices on transparent substrates are described. Gate, source, and drain electrodes of a transistor are formed on a transparent substrate. The widths of the drain electrode and source electrodes are greater than a width of the gate electrode. A dielectric layer is formed on the gate electrode. A semiconductor layer is deposited proximate to the gate, source and drain electrodes. Photoresist is deposited on the semiconductor. The photoresist is exposed to light directed through the transparent substrate so that the gate electrode masks the photoresist from the light. The semiconductor layer is removed in regions exposed to the light.08-28-2008
20110053301THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME - A thin film deposition apparatus that is suitable for production of large-sized substrates with fine patterns includes: an electrostatic chuck including a body that contacts a substrate that constitutes a deposition target and including a supporting surface supporting the substrate, an electrode installed in the body to generate an electrostatic force on the supporting surface, and a battery that is electrically connected to the electrode in the body; a plurality of chambers that are maintained in vacuum states; at least one thin film deposition assembly disposed in one of the plurality of chambers, separated by a predetermined distance from the substrate, and forming a thin film on the substrate supported by the electrostatic chuck; and a carrier moving the electrostatic chuck through the chambers.03-03-2011
20110053300THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME - A thin film deposition apparatus that can be applied to manufacture large-sized display devices on a mass scale and that improves manufacturing yield, and a method of manufacturing an organic light-emitting display device by using the thin film deposition apparatus.03-03-2011
20100285623Array Substrate and Method for Fabricating Thereof - The invention provides a method for manufacturing an array substrate utilizing a laser ablation process. A conductive layer can be selectively patterned by the laser ablation process without a photo mask due to different adhesions between the conductive layer and other materials. The patterned conductive layer thus formed adjoins an inorganic passivation layer to provide a substantially continuous surface.11-11-2010
20100285624DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME - A display device including a thin film transistor with high electric characteristics and high reliability, and a method for manufacturing the display device with high mass-productivity. In a display device including an inverted-staggered channel-stop-type thin film transistor, the inverted-staggered channel-stop-type thin film transistor includes a microcrystalline semiconductor film including a channel formation region, and an impurity region containing an impurity element of one conductivity type is selectively provided in a region which is not overlapped with source and drain electrodes, in the channel formation region of the microcrystalline semiconductor film.11-11-2010
20110076792FABRICATION METHOD OF PIXEL STRUCTURE AND THIN FILM TRANSISTOR - A method of fabricating a thin film transistor is disclosed. First, a substrate is provided and a patterned polysilicon layer is formed on the substrate. A metal layer is formed on the patterned polysilicon layer. Then, a portion of the metal layer is removed so that the remaining metal layer beside the patterned polysilicon layer forms a source and a drain. A gate insulation layer is formed on the substrate to cover the source, the drain and the patterned polysilicon layer. A gate is formed on the gate insulation layer over the patterned polysilicon layer.03-31-2011
20110256649PIXEL PERFORMANCE IMPROVEMENT BY USE OF A FIELD SHIELD - A pixel cell (10-20-2011
20110136279THIN FILM TRANSISTOR, THIN FILM TRANSISTOR DISPLAY PANEL, AND MANUFACTURING METHOD THEREOF - A thin film transistor is provided. The thin film transistor includes a frame formed on a substrate and having a plurality of grooves, line-shaped semiconductors disposed in at least one of the grooves, a first electrode overlapping with the line-shaped semiconductors, and second and third electrodes connected to ends of the line-shaped semiconductors.06-09-2011
20110136278METHOD OF FABRICATING ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE - An organic layer of an organic light emitting diode (OLED) display device is formed by transferring a transfer layer of a donor film to aligned pixel openings in a pixel defining region of the OLED display device such that the organic layer is formed in the pixel openings. Each aligned pixel opening has a pair of long sides and a pair of short sides, and the transferring of the transfer layer is performed by applying tensile force to the donor film in a direction perpendicular to the short sides of the pixel openings.06-09-2011
20110177639METHOD FOR MANUFACTURING A THIN FILM TRANSISTOR ARRAY PANEL - A thin film transistor display panel includes gate wiring formed on an insulation substrate and including gate lines, and gate electrodes and gate pads connected to the gate lines; a gate insulation layer covering the gate wiring; a semiconductor pattern formed over the gate insulation layer; data wiring formed over the gate insulation layer or the semiconductor pattern and including source electrodes, drain electrodes, and data pads; a protection layer including a Nega-PR type of organic insulating layer formed all over the semiconductor pattern and the data wiring, wherein the thickness of the Nega-PR type of organic insulating layer in both the gate and data pad regions is smaller than in the other regions; and a pixel electrode connected to the drain electrode. When exposing the Nega-PR type of passivation layer in the pad region during a photolithography process, a photomask having a lattice pattern made of a metal such as Cr that has a line width of less than the resolution of a light exposer is used. Thus, the resulting post-etch height of the passivation layer can be selectively controlled so as to provide reduced effective thickness in the pad regions.07-21-2011
20090176326SYSTEM FOR DISPLAYING IMAGES AND METHOD FOR FABRICATING THE SAME - An exemplary embodiment of a system comprises an active matrix organic electroluminescent device, having a substrate, and a plurality of scan lines and data lines disposed on the substrate, for defining a plurality of pixel regions. Each pixel structure comprises: a switching thin film transistor, a driving thin film transistor, and a storage capacitor. The switching TFT has a light-shielding layer adapted for preventing the sunlight from being incident into the switching TFT. The driving TFT is a bottom gate thin film transistor and have advantages of precisely controlling the current provided to the organic electroluminescent diode. Further, since the storage capacitor has a multilayer structure and occupies a reduced pixel area, the aperture ratio of the pixel structure can be increased.07-09-2009
20090176325HALFTONE MASK, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING AN ARRAY SUBSTRATE USING THE SAME - A halftone mask includes a transparent substrate, a light-blocking layer, a first semi-transparent layer and a second semi-transparent layer. The transparent substrate includes a light-blocking area, a light-transmitting area, a first halftone area transmitting first light, and a second halftone area transmitting second light that is less than the first light. The light-blocking layer is formed in the light-blocking area to fully block light from being transmitted. The first and second semi-transparent layers are formed on the transparent substrate. At least one of the first and second semi-transparent layers is formed in the first halftone area, and the first and second semi-transparent layers are overlapped with each other on the second halftone area.07-09-2009
20090197362Array substrate for liquid crystal display device and method of manufacturing the same - A method of manufacturing an array substrate for a liquid crystal display device includes forming a gate line, a gate pad and a gate electrode on a substrate through a first mask process, forming a data line, a data pad, a source electrode, a drain electrode and an active layer on the substrate including the gate line, the gate pad and the gate electrode through a second mask process, wherein the data line crosses the gate line to define a pixel region, the source electrode is extended from the data line, the drain electrode is spaced apart from the source electrode, and the active layer is disposed between the gate electrode and the source and drain electrodes, forming a passivation layer on an entire surface of the substrate including the data line, the source electrode and the drain electrode through a third mask process, the passivation layer being etched to expose the substrate in the pixel region, a part of the drain electrode, the gate pad and the data pad, and forming a pixel electrode, a gate pad terminal and a data pad terminal by depositing a transparent conductive material on an entire surface of the substrate including the passivation layer, the pixel electrode directly contacting the exposed part of the drain electrode, the gate pad terminal directly contacting the gate pad, and the data pad terminal directly contacting the data pad.08-06-2009
20120309122LIGHT EMITTING DISPLAY AND METHOD OF MANUFACTURING THE SAME - The present invention is to provide an organic light emitting display and a method of manufacturing the same. The light emitting display according to the present invention includes: a first substrate on which a plurality of light emitting devices having first electrodes, organic light emitting layers, and second electrodes are disposed; a second substrate disposed to face the first substrate; a dam member disposed between the first substrate and the second substrate to surround the plurality of light emitting devices; an inorganic sealing material disposed between the first substrate and the second substrate in an outer area of the dam member and attaching the first substrate to the second substrate; and a silicon filling material provided between the first substrate and the second substrate inward of the dam member to be in contact with the second electrodes.12-06-2012
20110136277METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY DEVICE - Disclosed is a method of fabricating a LCD device that includes forming sacrifice layer patterns in a pixel region while forming a gate line, a first storage electrode, and a gate pad on a substrate; sequentially forming a gate insulation film, an amorphous silicon film, an impurity-doped amorphous silicon film, and a source/drain metal film on a substrate, forming a transparent conductive material on the substrate covered with a protection and then patterning the transparent conductive material to form a second storage electrode overlapping the first storage electrode and an electrode pattern having a part overlapping an area of one side edge of the sacrifice layer patterns and the other part formed on the substrate; and simultaneously forming a common electrode and a pixel electrode in the pixel region by performing a lift-off process to remove the sacrifice layer patterns on the substrate where the electrode pattern is formed.06-09-2011
20120149139LOW-COST LARGE-SCREEN WIDE-ANGLE FAST-RESPONSE LIQUID CRYSTAL DISPLAY APPARATUS - A method of fabricating an IPS active matrix substrate, and said substrate constituting an active matrix display device, characterized in that: a photolithographic procedure is performed for three times for the manufacture: forming a gate electrode, a comb pixel electrode, a common electrode for shielding a video signal line (or a source electrode), a contact pad in said pixel electrode, and a video signal line for shielding said contact pad in common electrode, forming a separate thin film semiconductor layer component, and a contact hole, forming a source electrode, a drain electrode, a common electrode at the center of a pixel and a comb common electrode, such that after an ohmic contact layer of a channel portion of said thin film transistor is dry etched, a partial film of a passivation layer is formed by a silicon nitride film by using a mask deposition method is provided.06-14-2012
20120301988METHOD OF FORMING PIXEL STRUCTURE - A method of forming a pixel structure is provided. A pixel electrode made of transparent conductive material is formed to electrically connect a data line and a source electrode of a switching element of the adjacent sub-pixel region so that a plurality of sub-pixels can share the same data line. The number of data lines can be reduced, and the aperture ratio (AR) can be improved.11-29-2012
20120301986ORGANIC LAYER DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS BY USING THE SAME - An organic layer deposition apparatus including: a deposition source configured to discharge a deposition material; a deposition source nozzle unit arranged at a side of the deposition source and including a plurality of deposition source nozzles; a patterning slit sheet facing the deposition source nozzle unit and including a plurality of patterning slits, the patterning slit sheet being smaller than the substrate in at least one of a first direction or a second direction perpendicular to the first direction; a blocking member configured to be disposed between the substrate and the deposition source to block at least a portion of the substrate; and a heating member on the blocking member and configured to heat the blocking member, and the substrate is spaced apart from the organic layer deposition apparatus by a predetermined distance, and the substrate or the organic layer deposition apparatus is movable relative to the other.11-29-2012
20120301987TOP EMISSION TYPE ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A top emission type organic electroluminescent display device includes a first substrate including a pixel region, a switching TFT and a driving TFT, a passivation layer exposing a drain electrode of the driving TFT, a connection electrode contacting the drain electrode of the driving TFT, a partition wall corresponding to a border between adjacent pixel regions and overlapping an edge portion of the connection electrode, an x-ray shield layer on the connection electrode between adjacent partition walls, the x-ray shield layer patterned in the pixel region due to the partition wall, a first electrode on the x-ray shield layer, a bank covering the partition wall and contacting an edge portion of the first electrode, an organic emission layer on the first electrode between adjacent banks, a second electrode on the organic emission layer, and a second substrate facing the first substrate and being transparent.11-29-2012
20120301985METHOD OF ADJUSTING GAP BETWEEN BUMPS IN PIXEL REGION AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE METHOD - A method of manufacturing a display device includes forming a buffer layer on a top surface of a substrate, forming an amorphous silicon layer on a top surface of the buffer layer, and forming a polysilicon layer by irradiating the amorphous silicon layer with a laser beam. A plurality of first protrusions are formed on the top surface of the polysilicon layer, and a plurality of second protrusions are formed on a surface of the buffer layer by transferring the shape of the polysilicon layer to the buffer layer. A gate insulator on the buffer layer is then formed in the shape of bumps of the second protrusions.11-29-2012
20120040482Light-Emitting Device - To provide a long lifetime light-emitting element, in particular, to provide a long lifetime white light-emitting element, and to provide a light-emitting element having high luminous efficiency, in particular, to provide a white light-emitting element having high luminous efficiency. In a light-emitting element having, between an anode and a cathode, a first light-emitting layer containing a first light-emitting substance and a second light-emitting layer containing a second light-emitting substance which is provided to be in contact with the first light-emitting layer, the first light-emitting layer is divided into a layer provided on the anode side and a layer provided on the cathode side. At this time, a host material having a hole-transporting property is used for the layer provided on the anode side, and a host material having an electron-transporting property is used for the layer provided on the cathode side.02-16-2012
20110318856METHOD FOR FABRICATING THIN FILM TRANSISTOR ARRAY SUBSTRATE - A method for fabricating a TFT array substrate includes following steps. A gate pattern and a first pad pattern are formed on a substrate. A gate insulation layer and a semiconductor layer covering the two patterns are sequentially formed. A patterned photoresist layer having different resist blocks is formed, and patterns and thicknesses of the resist blocks in different regions are adjusted. The semiconductor layer and the gate insulation layer above the first pad pattern are removed through performing an etching process and reducing a thickness of the patterned photoresist layer. After removing the patterned photoresist layer, a source pattern, a drain pattern, and a second pad pattern electrically connected to the first pad pattern are formed. A patterned passivation layer is formed on the gate insulation layer and has a second opening exposing the source pattern or the drain pattern and a third opening exposing the second pad pattern.12-29-2011
20120045861METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.02-23-2012
20120003768THIN FLIM TRANSISTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF - A thin film transistor (TFT) substrate is provided in which a sufficiently large contact area between conductive materials is provided in a contact portion and a method of fabricating the TFT substrate. The TFT substrate includes a gate interconnection line formed on an insulating substrate, a gate insulating layer covering the gate interconnection line, a semiconductor layer arranged on the gate insulating layer, a data interconnection line including a data line, a source electrode and a drain electrode formed on the semiconductor layer, a first passivation layer formed on the data interconnection line and exposing the drain electrode, a second passivation layer formed on the first passivation film and a pixel electrode electrically connected to the drain electrode. An outer sidewall of the second passivation layer is positioned inside an outer sidewall of the first passivation layer.01-05-2012
20120003769THIN FILM TRANSISTOR SUBSTRATE, DISPLAY DEVICE HAVING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY DEVICE - A thin film transistor substrate includes an insulating plate; a gate electrode disposed on the insulating plate; a semiconductor layer comprising a metal oxide, wherein the metal oxide has oxygen defects of less than or equal to 3%, and wherein the metal oxide comprises about 0.01 mole/cm01-05-2012
20120009707THIN FILM TRANSISTOR AND METHOD OF FABRICATING THE SAME - A thin film transistor includes a multi-coaxial silicon nanowire unit including a plurality of coaxial silicon nanowires on a substrate, the multi-coaxial silicon nanowire unit including a central portion and end portions of the central portion; a gate electrode on the central portion; and a source electrode and a drain electrode on the respective end portions, respectively, so as to electrically connect to the multi-coaxial silicon nanowire unit.01-12-2012
20120009708THIN FILM TRANSISTOR, ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A thin film transistor for a thin film transistor liquid crystal display (TFT-LCD), an array substrate and manufacturing method thereof are provided. The thin film transistor comprises a source electrode, a drain electrode, and a channel region between the source electrode and drain electrode. A source extension region is connected with the source electrode, a drain extension region is connected with the drain electrode, and the source extension region is disposed opposite to the drain extension region to form a channel extension region therebetween.01-12-2012
20120009706THIN FILM DEPOSITION APPARATUS, METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE APPARATUS, AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE MANUFACTURED BY USING THE METHOD - A thin film deposition apparatus includes: a deposition source for discharging a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet disposed opposite to the deposition source nozzle unit and having a plurality of patterning slits arranged in the first direction; a barrier plate assembly including a plurality of barrier plates that are disposed between the deposition source nozzle unit and the patterning slit sheet in the first direction, the plurality of barrier plates partitioning a deposition space between the deposition source nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces; and a capacitive vacuum gauge disposed at a side of the deposition source and configured to measure a pressure inside the deposition source.01-12-2012
20110165715MANUFACTURING METHOD FOR AN AXIALLY SYMMETRIC LIGHT-EMITTING DIODE ASSEMBLY - A manufacturing method for an axially symmetric light-emitting diode assembly disclosed herein includes steps of: providing a substrate; and forming a plurality of light-emitting areas on the substrate. The substrate has a central axis. The light-emitting areas are arranged with axial symmetry around the central axis while being insulated from each other. Each of the light-emitting areas has at least one light-emitting diode, and the light-emitting diodes are electrically connected to each other. Since the light-emitting areas are formed on the substrate with the axially symmetric arrangement, the axially symmetric light-emitting diode assembly can present a well symmetric light pattern.07-07-2011
20110165714ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating an organic light emitting diode (OLED) display is provided. According to the method, a first electrode overlaps a scan line, a common power supply line and/or a data line. A pixel defining layer (PDL) is etched by backside exposure so that an aperture ratio of the OLED may be enhanced.07-07-2011
20110165713PIXEL STRUCTURE OF A THIN FILM TRANSISTOR LIQUID CRYSTAL DISPLAY AND FABRICATING METHOD THEREOF - A method of fabricating a pixel structure of a thin film transistor liquid crystal display is provided. A transparent conductive layer and a first metallic layer are sequentially formed over a substrate. The first metallic layer and the transparent conductive layer are patterned to form a gate pattern and a pixel electrode pattern. A gate insulating layer and a semiconductor layer are sequentially formed over the substrate. A patterning process is performed to remove the first metallic layer in the pixel electrode pattern while remaining the gate insulating layer and the semiconductor layer over the gate pattern. A second metallic layer is formed over the substrate. The second metallic layer is patterned to form a source/drain pattern over the semiconductor layer. A passivation layer is formed over the substrate and then the passivation layer is patterned to expose the transparent conductive layer in the pixel electrode pattern.07-07-2011
20110165712PROCESS FOR PRODUCING SURFACE-EMITTING LASER AND PROCESS FOR PRODUCING SURFACE-EMITTING LASER ARRAY - Provided is a producing of a surface-emitting laser capable of aligning a center axis of a surface relief structure with that of a current confinement structure with high precision to reduce a surface damage during the producing. The producing of the laser having the relief provided on a laminated semiconductor layer and a mesa structure, the process comprising the steps of: forming, on the layer, one of a first dielectric film and a first resist film having a first pattern for defining the mesa and a second pattern for defining the relief and then forming the other one of the films; forming a second resist film to cover the second pattern and expose the first pattern; and forming the mesa by removing the layer under the first pattern using the second resist film.07-07-2011
20110165711CARBON NANOTUBE DISPERSION LIQUID AND METHOD OF MANUFACTURING THIN LAYER AND DISPLAY PANEL USING THE SAME - The present invention relates to a carbon nanotube dispersion liquid includes carbon nanotubes, a self assembly material having —NR07-07-2011
20120115264PIXEL ELEMENT OF LIQUID CRYSTAL DISPLAY AND METHOD FOR PRODUCING THE SAME - The present invention provides a method for forming a pixel element. The method comprises: forming a first patterned metal layer within the pixel area; forming an insulation layer on the first patterned metal layer; forming a semiconductor layer on the insulation layer; patterning the semiconductor layer to form bend seed generation portion; and forming a second metal layer to connect the semiconductor layer.05-10-2012
20120115265DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A substrate comprising a thin-film-transistor (TFT) region, a pixel region, a gate-line region and a data-line region is provided. A transparent conductive layer and a first metal layer are orderly formed on the substrate. A conductive stack layer is formed within each of the TFT/pixel/gate-line regions and the end of the data-line region. Next, a first insulating layer and a semiconductor layer are orderly formed, and a patterned first insulating layer and a patterned semiconductor layer are formed above the conductive stack layer within the TFT region. Then, a second metal layer and a first photoresist layer are respectively formed. Afterwards, the second and the first metal layers are patterned by using the first photoresist layer as a photomask. Finally, the first photoresist layer is reflowed by heat, and part of the reflowed first photoresist layer covers a channel formed within the TFT region.05-10-2012
20120208311ORGANIC LIGHT EMITTING DISPLAY AND METHOD OF MANUFACTURING THE SAME - A top emission organic light emitting display and a method of manufacturing the same. The organic light emitting display includes a substrate, a plurality of thin film transistors (TFT) on the substrate, a plurality of first electrodes coupled to the plurality of TFTs, auxiliary electrodes having a mesh structure defining areas where the plurality of first electrodes are located, a pixel defining layer on a substantially entire area of the substrate and patterned to expose the first electrodes and the auxiliary electrodes, an organic light emission layer on the substantially entire area of the substrate including the exposed first electrodes and auxiliary electrodes, and second electrodes on the organic light emission layer. Steps are formed at lower parts of the auxiliary electrodes, and the second electrodes are coupled to the auxiliary electrodes through contact regions in which the auxiliary electrodes are exposed due to the steps.08-16-2012
20120208310NON-HALOGENATED ETCHANT AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE NON-HALOGENATED ETCHANT - Exemplary embodiments of the present invention disclose a non-halogenated etchant for etching an indium oxide layer and a method of manufacturing a display substrate using the non-halogenated etchant, the non-halogenated etchant including nitric acid, sulfuric acid, a corrosion inhibitor including ammonium, a cyclic amine-based compound, and water.08-16-2012
20120070928THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE SAME - A thin film deposition apparatus for forming a thin film on a substrate includes: a deposition source for discharging a deposition material; a deposition source nozzle unit having a plurality of nozzles arranged in a first direction; a patterning slit sheet located opposite to the deposition source and having a plurality of patterning slits arranged in the first direction; and a barrier plate assembly including a plurality of barrier plates that are arranged between the deposition source nozzle unit and the patterning slit sheet in the first direction to partition a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of sub-deposition spaces. The thin film deposition apparatus and the substrate are movable relative to each other in a movement direction that has an angle greater than about 90° and less than about 180° with respect to the first direction.03-22-2012
20110081738Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head - A semiconductor composite apparatus includes a semiconductor thin film layer and a substrate. The semiconductor thin film layer and the substrate are bonded to each other with a layer of an alloy of a high-melting-point metal and a low-melting-point metal formed between the semiconductor thin film layer and the substrate. The alloy has a higher melting point than the low-melting-point metal. The layer of the alloy contains a product resulting from a reaction of the low-melting-point metal and a material of said semiconductor thin film layer.04-07-2011
20110065221Method for Manufacturing an LCD Device Employing a Reduced Number of Photomasks Including Bottom and Top Gate Type Devices - A manufacturing method of the present invention includes a process using a first multi-tone mask, in which a first conductive layer in which a transparent conductive layer and a metal layer are stacked over a substrate, a gate electrode formed of a first conductive layer, and a pixel electrode formed of a single layer of the transparent conductive layer are formed, a process using a second multi-tone mask, in which a contact hole to the pixel electrode, and an island of an i-type semiconductor layer and an n03-17-2011
20120252150METHOD OF MANUFACTURING ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE - A method of manufacturing an organic electroluminescence display device includes an organic compound layer which is placed between a pair of electrodes and includes at least an emission layer, the organic compound layer being two-dimensionally arranged, includes forming the organic compound layer which is insoluble in water in an entire emission region on a substrate, providing a mask layer containing a water-soluble material in at least a part of a region on the organic compound layer, removing a part of the organic compound layer which is provided in a region which is other than the region in which the mask layer is provided, removing the mask layer, and forming, after the removing of the mask layer, a layer containing at least an alkali metal or an alkaline-earth metal in a region including at least the emission region.10-04-2012
20120252151METHOD OF MANUFACTURING ORGANIC ELECTROLUMINESCENCE DEVICE - A method of manufacturing an organic electroluminescence device includes forming a first organic electroluminescence layer at least on a first lower electrode, forming a first protective layer on the first organic electroluminescence layer, processing the first organic electroluminescence layer and the first protective layer, forming a second organic electroluminescence layer at least on a second lower electrode, forming a second protective layer on the second organic electroluminescence layer, and processing the second organic electroluminescence layer and the second protective layer. The second organic electroluminescence layer and the second protective layer, which have been processed by the processing the second organic electroluminescence layer and the second protective layer, cover an end portion of the first organic electroluminescence layer and an end portion of the first protective layer, which have been processed by the processing the first organic electroluminescence layer and the first protective layer.10-04-2012
20120252148ECHTANT AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE SAME - An etchant according to exemplary embodiments of the present invention includes about 0.5 wt % to about 20 wt % of persulfate, about 0.01 wt % to about 2 wt % of a fluorine compound, about 1 wt % to about 10 wt % of inorganic acid, about 0.5 wt % to about 5 wt % of a cyclic amine compound, about 0.1 wt % to about 5 wt % of a chlorine compound, about 0.05 wt % to about 3 wt % of copper salt, about 0.1 wt % to about 10 wt % of organic acid or organic acid salt, and water.10-04-2012
20120252149METHOD OF MANUFACTURING ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE - Provided is a method of manufacturing an organic electroluminescence display device including an emission region, the emission region including multiple organic compound layers arranged therein, each of the organic compound layers being provided between a pair of electrodes and including at least an emission layer, the method including: forming in the entire emission region an organic compound layer which is insoluble in water; forming on the organic compound layer a mask layer containing a water-soluble material in a predetermined pattern; removing a part of the organic compound layer which is formed in a region which is not covered with the mask layer; removing the mask layer; drying the organic compound layer; and forming a common layer on the organic compound layers, in which the steps from the drying of the organic compound layer to the forming of a common layer are carried out in a vacuum.10-04-2012
20110104841MASK LEVEL REDUCTION FOR MOFET - A method of fabricating a thin film transistor for an active matrix display using reduced masking operations includes patterning a gate on a substrate. A gate dielectric is formed over the gate and a semiconducting metal oxide is deposited on the gate dielectric. A channel protection layer is patterned on the semiconducting metal oxide overlying the gate to define a channel area and to expose the remaining semiconducting metal oxide. A source/drain metal layer is deposited on the structure and etched through to the channel protection layer above the gate to separate the source/drain metal layer into source and drain terminals and the source/drain metal layer and the semiconducting metal oxide are etched through at the periphery to isolate the transistor. A nonconductive spacer is patterned on the transistor and portions of the surrounding source/drain metal layer.05-05-2011
20110104840Etchant Solutions And Additives Therefor - The present invention is concerned with etchant or etching solutions and additives therefor, a process of preparing the same, a process of patterning a substrate employing the same, a patterned substrate thus prepared in accordance with the present invention and an electronic device including such a patterned substrate. An etchant solution according to the present invention for patterned etching of at least one surface or surface coating of a substrate comprises nitric acid, a nitrite salt, a halogenated organic acid represented by the formula C(H)n(Hal)m[C(H)o(Hal)p]qCθ2H, where Hal represents bromo, chloro, fluoro or b iodo, where n is 0, 1, 2 or 3, and m is 0, 1, 2 or 3, with the proviso that m+n=3; o is 0 or 1, p is 1 or 2, with the proviso that o+p=2; q is 0 or 1, with the proviso that q+m=1, 2, 3 or 4; and balance water.05-05-2011
20110104842MANUFACTURING METHOD OF ORGANIC EL DISPLAY - Provided is a method of manufacturing an organic EL display which includes a substrate having a TFT therein and a plurality of organic EL elements disposed on the substrate, each of the organic EL elements having a first electrode disposed on the substrate, an organic layer disposed on the first electrode, and a second electrode disposed on the organic layer, the method including: providing the substrate having the TFT therein; forming the first electrode connected to the TFT on the substrate; forming the organic layer on the first electrode; detecting a foreign substance introduced in the organic layer; forming a groove which surrounds the foreign substance in the organic layer; and forming the second electrode on the organic layer, the second electrode being separated by the groove from a region surrounded by the groove.05-05-2011
20120164772METHOD OF FABRICATING ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE - A method of forming an organic luminescent layer includes: sequentially disposing a shadow mask and a substrate over disposing at least one crucible having first and second organic materials therein; and heating up the first and second organic materials to form the organic luminescent layer on the substrate, wherein the second organic material has one of a heat capacity smaller than the first organic material and a sublimableness.06-28-2012
20120315717Methods of manufacturing wire, TFT, and flat panel display device - A method of manufacturing a wire may include forming a wire pattern, which at least includes a first conductive layer, a second conductive layer, and a third conductive layer arranged in the order stated on a substrate. At least the second conductive layer may have higher etch selectivity than the first and third conductive layers. Side holes may be formed by removing portions of the second conductive layer at ends of the wire pattern, and fine wires may be formed by injecting a masking material into the side holes and patterning the wire pattern by using the masking material as a mask.12-13-2012
20090130789SIGNAL LINE FOR DISPLAY DEVICE AND THIN FILM TRANSISTOR ARRAY PANEL INCLUDING THE SIGNAL LINE - A thin film transistor (TFT) array panel with signal lines that have low resistivity is presented. The TFT array panel includes an insulating substrate, a gate line formed on the insulating substrate, a gate insulating layer formed on the gate line, a drain electrode and a data line having a source electrode formed on the gate insulating layer, the drain electrode facing the source electrode with a gap, and a pixel electrode connected to the drain electrode. In one embodiment, at least one of the gate line, the data line, and the drain electrode includes a first conductive layer made of a Mo-containing conductor, a second conductive layer made of a Cu-containing conductor, and a third conductive layer made of a MoN-containing conductor.05-21-2009
20110183454Method for preparing OLED by imprinting process - A method for preparing an OLED by an imprinting process is disclosed, which comprises the following steps: (A) providing a substrate, and a first electrode is formed thereon; (B) coating a mold with a first organic material ink; (C) pressing the mold coated with the first organic material ink on the substrate to transfer the first organic material ink onto the first electrode of the substrate, to obtain a first light-emitting array; (D) baking the substrate having the first light-emitting array formed thereon; and (E) forming a second electrode on the first light-emitting array.07-28-2011
20120164771MASK - Disclosed is a mask which can be used for forming a pattern on a substrate in a deposition apparatus, and a method for manufacturing a display device using the same. The mask includes a mask pattern and a frame. The mask has a tapered shape where the inner surface of the frame tapers in a direction from an upper end to a lower end. A thin film pattern is formed on a substrate using the mask pattern of the mask. The frame supports an outer of the mask pattern, and includes an inclined plane which tapers in an inner direction where the mask pattern is disposed.06-28-2012
20120129288DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME - A display device including a thin film transistor with high electric characteristics and high reliability, and a method for manufacturing the display device with high mass-productivity. In a display device including an inverted-staggered channel-stop-type thin film transistor, the inverted-staggered channel-stop-type thin film transistor includes a microcrystalline semiconductor film including a channel formation region, and an impurity region containing an impurity element of one conductivity type is selectively provided in a region which is not overlapped with source and drain electrodes, in the channel formation region of the microcrystalline semiconductor film.05-24-2012
20120129287DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one aspect of the present invention, a laminated structure of conductive transparent oxide layers containing silicon or silicon oxide is applied as an electrode on the side of injecting a hole (a hole injection electrode; an anode) instead of the conventional conductive transparent oxide layer such as ITO. In addition, according to another aspect of the invention, a laminated structure of conductive transparent oxide layers containing silicon or silicon oxide, each of which content is different, is applied as a hole injection electrode. Preferably, silicon or a silicon oxide, concentration of the conductive layer on the side where it is connected to a TFT ranges from 1 atomic % to 6 atomic % and a silicon or silicon oxide concentration on the side of a layer containing an organic compound ranges from 7 atomic % to 15 atomic %.05-24-2012
20120135555METHOD FOR MANUFACTURING THIN FILM TRANSISTOR ARRAY PANEL - A method for manufacturing a thin film transistor array panel, including: sequentially forming a first silicon layer, a second silicon layer, a lower metal layer, and an upper metal layer on a gate insulating layer and a gate line; forming a first film pattern on the upper metal layer; forming a first lower metal pattern and a first upper metal pattern that includes a protrusion, by etching the upper metal layer and the lower metal layer; forming first and second silicon patterns by etching the first and second silicon layers; forming a second film pattern by ashing the first film pattern; forming a second upper metal pattern by etching the first upper metal pattern; forming a data line and a thin film transistor by etching the first lower metal pattern and the first and second silicon patterns; and forming a passivation layer and a pixel electrode on the resultant.05-31-2012
20120135556METHODS FOR MANUFACTURING ORGANIC EL DISPLAY PANEL AND ORGANIC EL DISPLAY DEVICE - Provided is an organic EL display panel offering improved luminance without increasing the current density of current flowing through organic light-emitting layers, comprising: substrate; TFT layer formed on substrate; planarizing film formed above TFT layer and having contact holes; lower electrodes arranged above planarizing film in a matrix in one-to-one correspondence with pixel units, and brought into conduction with TFT layer via contact holes; grid-shaped bank formed above planarizing film and defining openings corresponding one-to-one to lower electrodes; organic light-emitting layers formed in openings; and upper electrode formed above light-emitting layers. Each contact hole is positioned between a pair of openings adjacent in the column direction. At least one of opposing sides of any pair of openings adjacent in the column direction is reduced in width in the row direction and extends in the column direction so as to be adjacent in the row direction to the corresponding contact hole.05-31-2012
20120171792METHOD OF FABRICATING A PIXEL ARRAY - A method of fabricating a pixel array is provided. A first metal layer is formed over a substrate. The metal layer is patterned to form a plurality of data lines and a plurality of drain patterns adjacent to each data line. The data lines and the drain patterns are separated from each other. An oxide semiconductor layer and a first insulation layer covering the oxide semiconductor layer are formed over the substrate. A second metal layer is formed on the first insulation layer and patterned to form a plurality of scan lines intersected with the data lines and the drain patterns. By using the scan lines as a mask, the oxide semiconductor layer and the first insulation layer are patterned to form a plurality of oxide semiconductor channels located under each scan line. Each oxide semiconductor channel is located between one data line and one drain pattern.07-05-2012
20120171794POLYSILICON THIN FILM TRANSISTOR DEVICE AND METHOD OF FABRICATING THE SAME - A polysilicon thin film transistor device includes a gate metal pattern including a gate electrode and a gate line formed on a substrate, the gate metal pattern having a stepped portion, a gate insulating film formed on the gate metal pattern, a polysilicon semiconductor layer formed on the gate insulating film, the polysilicon semiconductor layer including an active region, lightly doped drain regions, a source region, and a drain region, a source electrode connected to the source region and a drain electrode connected to the drain region on the polysilicon semiconductor layer, and a pixel electrode connected with the drain electrode.07-05-2012
20120077297Conductor Structure, Pixel Structure, and Methods of Forming the Same - A method for forming a conductor structure is provided. The method comprises: (03-29-2012
20120178196METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE - A method of manufacturing an organic light-emitting display device includes forming a silicon layer and a gate insulating film over a substrate having a transistor region and a capacitor region; forming a halftone photoresist over the substrate; patterning the silicon layer and the gate insulating film; forming a residual photoresist by subjecting the halftone photoresist to an ashing process to leave part of the halftone photoresist over the transistor region; and doping at least a portion of the silicon layer with impurities by applying the impurities over an entire region of the substrate.07-12-2012
20100273285Array Substrate for LCD and Method of Fabrication Thereof - A liquid crystal display array substrate. A trench is in a substrate. A gate, a gate dielectric layer, a semiconductor layer and a doped semiconductor layer are disposed in the trench, wherein the semiconductor layer comprises a channel. A source electrode and a drain electrode are respectively electrically connected to portions of the semiconductor layer on opposite sides of the channel.10-28-2010
20100273284ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an array substrate for a liquid crystal display device includes forming a gate electrode and a gate line on a substrate through a first mask process, forming a first insulating layer, an active layer, an ohmic contact layer, a buffer metallic layer, and a data line on the substrate including the gate electrode and the gate line through a second mask process, and forming a source electrode, a drain electrode, and a pixel electrode through a third mask process, the pixel electrode extending from the drain electrode, wherein the active layer is disposed over and within the gate electrode.10-28-2010
20100273283METHOD OF MANUFACTURING FLAT PANEL DISPLAY - The present invention relates to a method for manufacturing a flat panel display. Herein, the same mask is used to form contact holes and pixel electrodes in the display substrate. Hence, the number of masks needed for manufacturing the flat panel display can be reduced to decrease the manufacturing cost.10-28-2010
20120178197THIN FILM TRANSISTOR ARRAY PANEL FOR LIQUID CRYSTAL DISPLAY HAVING PIXEL ELECTRODE - A TFT array panel includes an insulating substrate, a gate line, a storage electrode line, a gate insulating layer, a semiconductor island formed on the gate insulating layer, and a data line and a drain electrode formed thereon. The data line and drain electrode are covered with a passivation layer. A pixel electrode is formed on the passivation layer and connected to the drain electrode through a contact hole. The TFT array panel is covered with an alignment layer rubbed approximately in a direction from the upper left corner to lower right corner of the TFT array panel or the pixel electrodes. The pixel electrode overlaps the gate line and data line and has an expansion located near the upper left corner of the pixel electrode to increase the width of the corresponding overlapping area between the pixel electrode and the gate line and/or data line.07-12-2012
20100029030PROCESS FOR PRODUCING SURFACE EMITTING LASER, PROCESS FOR PRODUCING SURFACE EMITTING LASER ARRAY, AND OPTICAL APPARATUS INCLUDING SURFACE EMITTING LASER ARRAY PRODUCED BY THE PROCESS - Provided is a process for producing a surface emitting laser including a surface relief structure provided on laminated semiconductor layers, including the steps of transferring, to a first dielectric film, a first pattern for defining a mesa structure and a second pattern for defining the surface relief structure in the same process; and forming a second dielectric film on the first dielectric film and a surface of the laminated semiconductor layers to which the first pattern and the second pattern have been transferred. Accordingly, a center position of the surface relief structure can be aligned with a center position of a current confinement structure at high precision.02-04-2010
20100009482PHOTORESIST COMPOSITION, METHOD OF FORMING A METAL PATTERN, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME - A photoresist composition includes 5% to 50% by weight of an alkali-soluble resin, 0.5% to 30% by weight of a quinone diazide compound, 0.1% to 15 % by weight of a curing agent, and a remainder of an organic solvent. A method of forming a metal pattern includes coating a photoresist composition on a base substrate having a metal layer, and forming a first photoresist film. The photoresist composition includes 5% to 50% by weight of an alkali-soluble resin, 0.5% to 30% by weight of a quinone diazide compound, 0.1% to 15% by weight of a curing agent, and a remainder of an organic solvent. The first photoresist film is patterned, and forms a first photo pattern. The base substrate having the first photo pattern is heated, and forms a first baked pattern. The metal layer is patterned using the first baked pattern, and forms a metal pattern.01-14-2010
20100009481METHOD FOR FABRICATING THIN FILM TRANSISTOR ARRAY SUBSTRATE - A method for fabricating a TFT array substrate includes following steps. A gate pattern and a first pad pattern are formed on a substrate. A gate insulation layer and a semiconductor layer covering the two patterns are sequentially formed. A patterned photoresist layer having different resist blocks is formed, and patterns and thicknesses of the resist blocks in different regions are adjusted. The semiconductor layer and the gate insulation layer above the first pad pattern are removed through performing an etching process and reducing a thickness of the patterned photoresist layer. After removing the patterned photoresist layer, a source pattern, a drain pattern, and a second pad pattern electrically connected to the first pad pattern are formed. A patterned passivation layer is formed on the gate insulation layer and has a second opening exposing the source pattern or the drain pattern and a third opening exposing the second pad pattern.01-14-2010
20090061553MAUNFACTURING METHOD OF THIN FILM TRANSISTOR ARRAY SUBSTRATE - A thin film transistor array substrate and the manufacturing method thereof are disclosed herein. A first patterned metal layer, an insulating layer, a patterned layer, and a second patterned metal layer are sequentially formed on a substrate. Then, a number of scan lines and a number of source lines are disposed on the substrate and define a number of pixel regions. A number of the storage capacitance lines are disposed on the substrate in a direction extending along the scan lines and across the pixel regions, wherein each of the storage capacitance lines is essentially perpendicular to each of the source lines and to form a cross portion. A number of patterned thin films are disposed on the storage capacitance lines and above the cross portion.03-05-2009
20100291721PROCESSES FOR FORMING ELECTRONIC DEVICES INCLUDING SPACED-APART RADIATION REGIONS - Processes for forming an electronic device include forming a first radiation region, a second radiation region spaced apart from the first radiation region, and an insulating region. The insulating region can have a first side and a second side opposite the first side. The first radiation region can lie immediately adjacent to the first side, and the second radiation region can lie immediately adjacent to the second side. Within the insulating region, no other radiation region may lie between the first and second radiation regions, and the insulating region can include an insulating layer that includes a plurality of openings. A process for forming the electronic device can include patterning an insulating layer.11-18-2010
20100291720Method of fabricating organic light emitting diode display - A method of fabricating an organic light emitting diode display device includes: sequentially forming a thin film transistor (TFT) array, a first electrode, a bank pattern, a spacer, and a first relevant layer on an acceptor substrate; sequentially forming a metal pattern and an organic light emission material layer on a doner substrate; aligning and attaching the acceptor substrate and the doner substrate, and forming the light emission layer by transferring the organic light emission material onto the acceptor substrate by applying power to the metal pattern; and sequentially forming the second relevant layer and the second electrode on the light emission layer-formed acceptor substrate.11-18-2010
20110124138ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE AND METHOD OF PRODUCING THE SAME - An organic electroluminescent display device in which a plurality of light-emitting cells each having an organic electroluminescent portion are arranged on a substrate, wherein, for each of the light-emitting cells, a first transistor which controls energization on the organic electroluminescent portion, and a second transistor which switches a signal to be given to an input of the first transistor are disposed, active layers of the first and second transistors are formed by an amorphous oxide semiconductor, and, the first and second transistors are formed so that, when the first and second transistors are driven under same conditions, an amount of an output current of the first transistor is smaller than an amount of an output current of the second transistor.05-26-2011
20110124137ORGANIC ELECTRO-LUMINESCENCE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is an organic electro-luminescence display device. The organic electro-luminescence display device includes: a first electrode, a first charge transport pattern, an organic emission pattern, a second charge transport pattern, and a second electrode. The first charge transport pattern is formed on the first electrode, and the organic emission pattern is on the first charge transport pattern. The second charge transport pattern is formed on the organic emission pattern, and includes an insoluble material. The second electrode is formed on the second charge transport pattern.05-26-2011
20110124136PROCESS FOR PRODUCING ORGANIC ELECTROLUMINESCENT PANEL - Provided is a process for producing an organic EL panel by using an ultrathin glass plate, in which the ultrathin glass plate is not “fractured” or “cut” in the production process, the organic EL element is formed reliably when formed by vacuum deposition, and recovered without damage after the production process, and there is no need for installing an additional step of cleaning the rear face of the ultrathin glass plate. The process for producing an organic EL panel according to the present invention is a process for producing an organic electroluminescent panel by forming an organic electroluminescent element on an ultrathin glass plate by vacuum deposition method, comprising forming electrodes on the ultrathin glass plate, by temporarily fixing the ultrathin glass plate to a supporting plate via a double-sided adhesive tape having a thermal release adhesive layer formed at least on one face of the base material layer, containing heat-expandable microspheres that start expansion and/or foaming at temperature higher than the vacuum deposition temperature.05-26-2011
20120231567METHOD OF FORMING METAL PATTERN AND METHOD OF MANUFACTURING DISPLAY SUBSTRATE HAVING THE SAME - A method of forming a metal pattern includes forming a precursor layer including a metal precursor on a substrate, irradiating a light on the precursor layer to form a metal seed layer having a predetermined pattern, and electroless-plating the metal seed layer to form a metal pattern layer.09-13-2012
20080299693Manufacturing method for display device - A manufacturing method for a display device having a first conductive type thin film transistor and a second conductive type thin film transistor, comprising the steps of: in formation regions for a first conductive type thin film transistor and a second conductive type thin film transistor forming a semiconductor layer, a first insulating film covering the semiconductor layer and a gate electrode disposed on the first insulating film so as to intersect the semiconductor layer, on substrate having first conductive type impurity regions on both outer sides of a channel region of the semiconductor layer below the gate electrode forming a second insulating film, in the second insulating film and the first insulating film forming a contact hole for a drain electrode and a source electrode, in the formation region for the second conductive type thin film transistor forming electrodes and a second conductive type impurity region.12-04-2008
20120264244METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An object is to manufacture a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which an oxide semiconductor film is used for a semiconductor layer including a channel formation region, heat treatment (for dehydration or dehydrogenation) is performed to improve the purity of the oxide semiconductor film and reduce impurities including moisture or the like. After that, slow cooling is performed under an oxygen atmosphere. Besides impurities including moisture or the like exiting in the oxide semiconductor film, heat treatment causes reduction of impurities including moisture or the like exiting in a gate insulating layer and those in interfaces between the oxide semiconductor film and films which are provided over and below the oxide semiconductor and in contact therewith.10-18-2012
20110003418DISPLAY DEVICE INCLUDING TRANSISTOR AND MANUFACTURING METHOD THEREOF - An object is to provide a display device which operates stably with use of a transistor having stable electric characteristics. In manufacture of a display device using transistors in which an oxide semiconductor layer is used for a channel formation region, a gate electrode is further provided over at least a transistor which is applied to a driver circuit. In manufacture of a transistor in which an oxide semiconductor layer is used for a channel formation region, the oxide semiconductor layer is subjected to heat treatment so as to be dehydrated or dehydrogenated; thus, impurities such as moisture existing in an interface between the oxide semiconductor layer and the gate insulating layer provided below and in contact with the oxide semiconductor layer and an interface between the oxide semiconductor layer and a protective insulating layer provided on and in contact with the oxide semiconductor layer can be reduced.01-06-2011
20110003417Active matrix substrate, method of making the substrate, and display device - An active matrix substrate includes base substrate, gate lines, data lines, thin-film transistors and pixel electrodes. The gate lines are formed on the base substrate. The data lines are formed over the gate lines. Each of the data lines crosses all of the gate lines with an insulating film interposed therebetween. The thin-film transistors are formed over the base substrate. Each of the thin-film transistors is associated with one of the gate lines and operates responsive to a signal on the associated gate line. Each of the pixel electrodes is associated with one of the data lines and one of the thin-film transistors and is electrically connectable to the associated data line by way of the associated thin-film transistor. Each of the pixel electrodes and the associated thin-film transistor are connected together by way of a conductive member. Each of the pixel electrodes crosses one of the gate lines, while the conductive member for the pixel electrode crosses another one of the gate lines that is adjacent to the former gate line.01-06-2011
20120322187ETCHANTS AND METHODS OF FABRICATING METAL WIRING AND THIN FILM TRANSISTOR SUBSTRATE USING THE SAME - An etchant includes: a persulfate; a fluoride; an inorganic acid; a cyclic amine; a sulfonic acid; and one of an organic acid and a salt thereof.12-20-2012
20110039363ORGANIC THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF - An organic thin film transistor array panel according to an embodiment of the present invention includes: a substrate; a data line disposed on the substrate; an insulating layer disposed on the data line and having a contact hole exposing the data line; a first electrode disposed on the insulating layer and connected to the data line through the contact hole; a second electrode disposed on the insulating layer; an organic semiconductor disposed on the first and the second electrodes; a gate insulator disposed on the organic semiconductor; and a gate electrode disposed on the gate insulator.02-17-2011
20100203663Organic Thin Film Transistors, Organic Light-emissive Devices and Organic Light-emissive Displays - A method of manufacturing an organic thin film transistor, the method comprising: depositing a source and drain electrode; forming a thin self-assembled layer of material on the source and drain electrodes, the thin self-assembled layer of material comprising a dopant moiety for chemically doping an organic semi-conductive material by accepting or donating charge and a separate attachment moiety bonded to the dopant moiety and selectively bonded to the source and drain electrodes; and depositing a solution comprising a solvent and an organic semi-conductive material in a channel region between the source and drain electrode.08-12-2010
20110237010THIN FILM TRANSISTOR ARRAY SUBSTRATE AND METHOD FABRICATING THE SAME - A thin film transistor (TFT) array substrate and a method for fabricating the thin film transistor (TFT) array substrate is disclosed, wherein a passivation layer is directly subjected to exposing and patterning processes without using any photoresist, thereby simplifying the fabrication process and ensuring reduced preparation costs. In particular, the method comprises a thin film transistor (TFT) array comprising: forming a gate line and a gate electrode on a substrate; forming a semiconductor layer to be insulated from the gate electrode, and overlapped with a portion of the gate electrode; forming a source electrode and a drain electrode on both sides of the semiconductor layer, respectively, while forming a data line intersecting with the gate line; forming a passivation layer over an entire upper surface of the substrate including the source electrode and the drain electrode using a sol compound of a metal alkoxide having a photosensitive group X and a silicon alkoxide having a photosensitive group Y; light-exposing and developing the passivation layer to form a contact hole through which the drain electrode is exposed; and forming a pixel electrode to be in contact with the drain electrode through the contact hole.09-29-2011
20120329190ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An organic light emitting diode display includes a substrate. A control electrode is on the substrate. A gate insulating film covers the control electrode. An input electrode and an output electrode are on the gate insulating film and face each other. An oxide semiconductor is between the input electrode and the output electrode and on the control electrode. A pixel electrode is on portions of the edges of the output electrode and is electrically connected. An organic light emitting member is on the pixel electrode. A common electrode is on the organic light emitting member. The oxide semiconductor and the pixel electrode may be of the same layer.12-27-2012
20120329187APPARATUS FOR MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE, AND MANUFACTURING METHOD USING THE APPARATUS - An apparatus for manufacturing an organic light-emitting display device, and a manufacturing method using the apparatus. An apparatus includes a roll drum unit configured to removably adhere a flexible substrate and a transfer film thereon such that the transfer film overlaps the flexible substrate, and a laser irradiation unit configured to irradiate a laser in a pattern toward the transfer film adhered on the roll drum unit and transfer a transfer layer of the transfer film onto the flexible substrate to form an emission layer.12-27-2012
20120329188DEPOSITION MASK, DEPOSITION APPARATUS, AND DEPOSITION METHOD - A deposition mask is used to pattern a thin film 12-27-2012
20120329189FABRICATING METHOD OF ORGANIC ELECTRO-LUMINESCENCE DISPLAY UNIT - A fabricating method of an organic electroluminescent display unit is provided. A gate and a gate insulating layer covering the gate are formed on the substrate. A patterned metal-oxide layer with an etching stop layer thereon is formed on the gate insulating layer. A surface treatment is performed on the patterned metal-oxide layer with use of the etching stop layer as a mask, such that a portion of the patterned metal-oxide layer uncovered by the etching stop layer has greater conductivity than conductivity of another portion of the patterned metal-oxide layer covered by the etching stop layer. The patterned metal-oxide layer treated by the surface treatment includes a pixel electrode and an active layer located above the gate. A source and a drain are then formed. And then, an organic electro-luminescence layer and a top electrode are sequentially formed on the pixel electrode.12-27-2012
20120100653METHODS OF MANUFACTURING MASTER, PIXEL ARRAY SUBSTRATE AND ELECTRO-OPTICAL DEVICE - A master having a substrate including displaying units and an ESD protection structure including an adjacent first region and a second region is provided. The displaying units have a predetermined-cutting region therebetween. Each displaying unit includes a peripheral circuit region and a display region having pixels. The ESD protection structure disposed on the predetermined-cutting region, located in the peripheral circuit region, and connecting the display region includes a first patterned conductive layer disposed on the first region and having an end away from the predetermined-cutting region, a first patterned dielectric layer disposed on the first patterned conductive layer and the substrate and having a first opening exposing a portion of the first patterned conductive layer, a patterned transparent conductive layer disposed corresponding to the predetermined-cutting region and connecting the first patterned conductive layer, and a second patterned dielectric layer covering the patterned transparent conductive layer and the substrate.04-26-2012
20120100652FABRICATION METHOD OF ACTIVE DEVICE ARRAY SUBSTRATE - A fabrication method of an active device array substrate is disclosed. A first metal material layer, a gate insulation material layer, a channel material layer, a second metal material layer, and a first photoresist layer are formed over a substrate sequentially. The first photoresist layer is patterned with a multi-tone mask to form a first patterned photoresist layer with two thicknesses. A first and second removing processes are performed sequentially using the first patterned photoresist layer as a mask to form a gate, a gate insulation layer, a channel layer, and a source/drain. The first patterned photoresist layer is removed. A passivation layer and a second patterned photoresist layer are formed over the substrate. A third removing process is performed to form a plurality of contact holes. A pixel electrode material layer is formed over the substrate. The second patterned photoresist layer is lifted off to form a pixel electrode.04-26-2012
20120100651METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY APPARATUS USING THE SAME - A method of manufacturing an organic light emitting device that readily increases the characteristics of an intermediate layer having an organic light emitting layer, and a method of manufacturing an organic light emitting display apparatus. The method of manufacturing an organic light emitting device includes preparing a substrate having a first electrode; disposing the substrate on a base member; disposing a donor film that covers the substrate and contacts the base member exposed around the substrate; combining the base member and the donor film; forming an intermediate layer having an organic light emitting layer on the first electrode by performing a transfer process in a laser thermal transfer apparatus after placing the base member and the donor film combined with each other with the substrate interposed therebetween in the laser thermal transfer apparatus; and forming a second electrode on the intermediate layer.04-26-2012
20120288975ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - An organic light emitting display device (OLED) and a method of fabricating the same. The OLED includes: a substrate; a thin film transistor on the substrate and including a source electrode and a drain electrode; a first insulating layer on the substrate; a second insulating layer on the first insulating layer and including a trench; a via hole formed in the trench over the first and second insulating layers and exposing a portion of the source electrode or the drain electrode; a first electrode in the trench and connected to one of the source electrode and the drain electrode through the via hole; a pixel defining layer on the first electrode and having an opening exposing the first electrode; an organic layer in the opening and having at least an organic emission layer; and a second electrode on an entire surface of the substrate having the organic layer.11-15-2012
20100167443Active matrix substrate, method of making the substrate, and display device - An active matrix substrate includes base substrate, gate lines, data lines, thin-film transistors and pixel electrodes. The gate lines are formed on the base substrate. The data lines are formed over the gate lines. Each of the data lines crosses all of the gate lines with an insulating film interposed therebetween. The thin-film transistors are formed over the base substrate. Each of the thin-film transistors is associated with one of the gate lines and operates responsive to a signal on the associated gate line. Each of the pixel electrodes is associated with one of the data lines and one of the thin-film transistors and is electrically connectable to the associated data line by way of the associated thin-film transistor. Each of the pixel electrodes and the associated thin-film transistor are connected together by way of a conductive member. Each of the pixel electrodes crosses one of the gate lines, while the conductive member for the pixel electrode crosses another one of the gate lines that is adjacent to the former gate line.07-01-2010
20130017637METHOD FOR FORMING PATTERN AND METHOD FOR MANUFACTURING DISPLAY DEVICE BY USING THE SAMEAANM JEON; Woo-SeokAACI SeoulAACO KRAAGP JEON; Woo-Seok Seoul KRAANM LEE; Jong KwangAACI DaejeonAACO KRAAGP LEE; Jong Kwang Daejeon KRAANM JU; Jin HoAACI SeoulAACO KRAAGP JU; Jin Ho Seoul KRAANM KANG; MinAACI SeoulAACO KRAAGP KANG; Min Seoul KRAANM KANG; HoonAACI Suwon-siAACO KRAAGP KANG; Hoon Suwon-si KRAANM SHIM; Seung BoAACI Asan-siAACO KRAAGP SHIM; Seung Bo Asan-si KRAANM PARK; Gwui-HyunAACI Osan-siAACO KRAAGP PARK; Gwui-Hyun Osan-si KRAANM KIM; Bong-YeonAACI SeoulAACO KRAAGP KIM; Bong-Yeon Seoul KR - A method for forming a fine exposure pattern where a width and an interval of the pattern are each 1CD, by first exposing a photoresist by using an exposure mask where an interval ratio of a light shielding part and a light transmission part is 2CD:1CD to 4CD:1CD, and then second exposing the photoresist after the exposure mask is shifted at a predetermined interval, or second exposing the photoresist by using an exposure mask formed at a position where a light transmission part is shifted at a predetermined interval, and developing the photoresist, such that it is possible to form a display device having a pixel electrode including a plurality of fine branch electrodes having a smaller width and interval than a resolution of an exposure apparatus.01-17-2013
20130017636COMPOSITION FOR REMOVING A PHOTORESIST AND METHOD OF MANUFACTURING A THIN-FILM TRANSISTOR SUBSTRATE USING THE COMPOSITIONAANM KIM; Bong-KyunAACI Hwaseong-siAACO KRAAGP KIM; Bong-Kyun Hwaseong-si KRAANM CHOI; Shin-IlAACI Hwaseong-siAACO KRAAGP CHOI; Shin-Il Hwaseong-si KRAANM PARK; Hong-SickAACI Suwon-siAACO KRAAGP PARK; Hong-Sick Suwon-si KRAANM LEE; Wang-WooAACI Suwon-siAACO KRAAGP LEE; Wang-Woo Suwon-si KRAANM JANG; Seok-JunAACI Asan-siAACO KRAAGP JANG; Seok-Jun Asan-si KRAANM KIM; Byung-UkAACI Hwaseong-siAACO KRAAGP KIM; Byung-Uk Hwaseong-si KRAANM PARK; Sun-JooAACI Pyeongtaek-siAACO KRAAGP PARK; Sun-Joo Pyeongtaek-si KRAANM YOON; Suk-IlAACI Suwon-siAACO KRAAGP YOON; Suk-Il Suwon-si KRAANM JEONG; Jong-HyunAACI SeoulAACO KRAAGP JEONG; Jong-Hyun Seoul KRAANM HUR; Soon-BeomAACI Anyang-siAACO KRAAGP HUR; Soon-Beom Anyang-si KR - A composition for removing a photoresist, the composition including about 1% by weight to about 10% by weight of tetramethyl ammonium hydroxide (“TMAH”), about 1% by weight to about 10% by weight of an alkanol amine, about 50% by weight to about 70% by weight of a glycol ether compound, about 0.01% by weight to about 1% by weight of a triazole compound, about 20% by weight to about 40% by weight of a polar solvent, and water, each based on a total weight of the composition.01-17-2013
20110159622THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING A DISPLAY PANEL - Embodiments of the present invention relate to a thin film transistor and a manufacturing method of a display panel, and include forming a gate line including a gate electrode on a substrate, forming a gate insulating layer on the gate electrode, forming an intrinsic semiconductor on the gate insulating layer, forming an extrinsic semiconductor on the intrinsic semiconductor, forming a data line including a source electrode and a drain electrode on the extrinsic semiconductor, and plasma-treating a portion of the extrinsic semiconductor between the source electrode and the drain electrode to form a protection member and ohmic contacts on respective sides of the protection member. Accordingly, the process for etching the extrinsic semiconductor and forming an inorganic insulating layer for protecting the intrinsic semiconductor may be omitted such that the manufacturing process of the display panel may be simplified, manufacturing cost may be reduced, and productivity may be improved.06-30-2011
20080227232Method for manufacturing display device - An object is to provide a display device that can be manufactured by improvement of use efficiency of a material and simplification of a manufacturing process. A light absorbing layer is formed, an insulating layer is formed over the light absorbing layer, the light absorbing layer and the insulating layer are selectively irradiated with laser light, an irradiated region in the insulating layer is removed to form an opening in the insulating layer, and a conductive film is formed in the opening so as to be in contact with the light absorbing layer. The conductive film is formed in the opening so as to be in contact with the light absorbing layer, which is exposed, so that the light absorbing layer and the conductive layer can be electrically connected with the insulating layer interposed therebetween.09-18-2008
20120252152DISPLAY PANEL, ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - An array substrate comprises data lines, gate lines, thin film transistors and pixel electrodes formed on a base substrate. Pixel units are defined by intersecting the data lines and the gate lines, the thin film transistors are formed at the intersections of the data lines and the gate lines, and the data lines extend across each of the pixel units in the middle of the pixel units. At least two thin film transistors for controlling a same pixel electrode are respectively formed on both sides of the data line in each pixel unit.10-04-2012
20130115727ETCHING COMPOSITION AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SYSTEM - An etching composition and a method of manufacturing a display substrate using the etching composition are disclosed. The etching composition includes phosphoric acid (H05-09-2013
20130115726CRYSTALLIZATION APPARATUS, CRYSTALLIZATION METHOD, ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - A crystallization apparatus for crystallizing a semiconductor layer formed on a substrate, the crystallization apparatus including: a laser generator, which generates a laser beam, and a stage on which the substrate is mounted, where the semiconductor layer is divided into a plurality of crystallization areas and a plurality of non-crystallization areas, and the laser beam is radiated onto the crystallization areas a plurality of times to crystallize the crystallization areas, where the laser beam is radiated onto different positions of the same crystallization area a plurality of times.05-09-2013
20130095588SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a pixel portion having a first thin film transistor and a driver circuit having a second thin film transistor. Each of the first thin film transistor and the second thin film transistor includes a gate electrode layer, a gate insulating layer, a semiconductor layer, a source electrode layer, and a drain electrode layer. Each of the layers of the first thin film transistor has a light-transmitting property. Materials of the gate electrode layer, the source electrode layer and the drain electrode layer of the first thin film transistor are different from those of the second transistor, and each of the resistances of the second thin film transistor is lower than that of the first thin film transistor.04-18-2013
20130095589ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - In an array substrate capable of improving the quality of displayed images and a method for manufacturing the array substrate, the array substrate includes a base substrate, a first conductive pattern including a gate line and a first light-blocking pattern, a semiconductor layer overlapping the light-blocking pattern, a second conductive pattern including a data line and a storage line overlapping the first light-blocking pattern, and a pixel electrode overlapping the storage line to form a storage capacitor. The first conductive pattern may further include a second light-blocking pattern overlapping the semiconductor layer which is formed under the data line. The first and second light-blocking patterns block light proceeding toward the semiconductor layer formed under the storage line and under the data line, respectively, so that the semiconductor layer may be prevented from being excited by light energy.04-18-2013
20130130421Method of Manufacturing Oxide Thin Film Transistor and Display Device - A method of manufacturing oxide thin film transistor and display device are provided. In the method of manufacturing an oxide thin film transistor, the method includes: forming an active layer of an oxide semiconductor on a substrate, and performing surface treatment with plasma for the active layer to permeate oxygen into the active layer.05-23-2013
20080206915MANUFACTURING METHOD FOR DISPLAY DEVICE - With an interconnected fabrication step using the prior art photolithography, major portions of resist, interconnected material, and process gas necessary during plasma processing are wasted. Furthermore, a pumping means such as a vacuum system is necessary. Therefore, the whole equipment is increased in size. Consequently, as the processed substrate is increased in size, the manufacturing cost is increased. Accordingly, a means consisting of directly spraying the resist and interconnected material as liquid drops on necessary locations over the substrate to delineate a pattern is applied. Also, a means consisting of performing a vapor-phase reaction process such as ashing or etching at or near atmospheric pressure is applied.08-28-2008
20110212558LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - As a substrate gets larger, time of manufacture is increased due to the repetition of film formations and etchings; waste disposal costs of etchant and the like are increased; and material efficiency is significantly reduced. A base film for improving adhesion between a substrate and a material layer formed by a droplet discharge method is formed in the invention. Further, a manufacturing method of a liquid crystal display device according to the invention includes at least one step for forming the following patterns required for manufacturing a liquid crystal display device without using a photomask: a pattern of a material layer typified by a wiring (or an electrode) pattern, an insulating layer pattern; or a mask pattern for forming another pattern.09-01-2011
20110212557METHOD OF MANUFACTURING AN ARRAY SUBSTRATE FOR LCD DEVICE HAVING DOUBLE-LAYERED METAL STRUCTURE - The present invention is an array substrate for use in a liquid crystal display device, which includes a gate electrode, a gate line and a gate pad on a substrate, wherein the gate electrode, the gate line and the gate pad have a double-layered structure consisting of a first metal layer and a first barrier metal layer in series from the substrate, and wherein the first metal is one of aluminum and aluminum alloy; a gate insulation layer on the substrate covering the gate electrode, gate line and gate pad; an active layer and an ohmic contact layer sequentially formed on the gate insulation layer and over the gate electrode; a data line on the gate insulation layer perpendicularly crossing the gate line, source and drain electrodes contacting the ohmic contact layer, and a data pad on the gate insulation layer, wherein the data line, the source and drain electrode and the data pad have a double-layered structure consisting of a second barrier metal layer and a second metal layer of copper; a passivation layer formed on the gate insulation layer to cover the data line, source and drain electrodes, and data pad, wherein the passivation layer has a drain contact hole exposing a portion of the drain electrode, a gate pad contact hole exposing a portion of the gate pad, and a data pad contact hole exposing a portion of the data pad; and a pixel electrode, a gate pad terminal and a data pad terminal on the passivation layer, all of which are formed of a transparent conductive material on the passivation layer.09-01-2011
20110223698CRYSTALLIZATION APPARATUS, CRYSTALLIZATION METHOD, METHOD OF MANUFACTURING THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY APPARATUS - Provided are a crystallization apparatus and method, which prevent cracks from being generated, a method of manufacturing a thin film transistor (TFT), and a method of manufacturing an organic light emitting display apparatus. The crystallization apparatus includes a chamber for receiving a substrate, a first flash lamp and a second flash lamp, which are disposed facing each other within the chamber, wherein amorphous silicon layers are disposed on a first surface of the substrate facing the first flash lamp and a second surface of the substrate facing the second flash lamp, respectively.09-15-2011
20110275173ISOLATION BY IMPLANTATION IN LED ARRAY MANUFACTURING - An improved method of creating LED arrays is disclosed. A p-type layer, multi-quantum well and n-type layer are disposed on a substrate. The device is then etched to expose portions of the n-type layer. To create the necessary electrical isolation between adjacent LEDs, an ion implantation is performed to create a non-conductive implanted region. In some embodiments, an implanted region extends through the p-type layer, MQW and n-type layer. In another embodiment, a first implanted region is created in the n-type layer. In addition, a second implanted region is created in the p-type layer and multi-quantum well immediately adjacent to etched n-type layer. In some embodiments, the ion implantation is done perpendicular to the substrate. In other embodiments, the implant is performed at an angle.11-10-2011
20090162961ACTIVE MATRIX DEVICE WITH PHOTO SENSOR - An active matrix pixel device is provided, for example an electroluminescent display device, the device comprising circuitry supported by a substrate and including a polysilicon TFT (10) and an amorphous silicon thin film PIN diode (12). Polysilicon islands are formed before an amorphous silicon layer is deposited for the PIN diode. This avoids the exposure of the amorphous silicon to high temperature processing. The TFT comprises doped source/drain regions (1606-25-2009
20090215211Method Of Fabricating Microchannel Plate Devices With Multiple Emissive Layers - A method of fabricating a microchannel plate includes defining a plurality of pores extending from a top surface of a substrate to a bottom surface of the substrate where the plurality of pores has a resistive material on an outer surface that forms a first emissive layer. A second emissive layer is formed over the first emissive layer. The second emissive layer is chosen to achieve at least one of an increase in secondary electron emission efficiency and a decrease in gain degradation as a function of time. A top electrode is formed on the top surface of the substrate and a bottom electrode is formed on the bottom surface of the substrate.08-27-2009
20100311196THIN FILM TRANSISTOR HAVING OPENINGS FORMED THEREIN - A thin film transistor array panel includes a substrate, a plurality of first and second signal lines crossing each other on the substrate, source electrodes connected to the first signal lines, drain electrodes connected to the second signal lines, pixel electrodes connected to the drain electrodes, a first partition formed on the source and drain electrodes and having a first opening, wherein a lower width of the first opening is wider than an upper width of the first opening, an organic semiconductor formed in the first opening and at least overlapping the portions of the source electrode and the drain electrode, and a gate electrode connected to the second signal line and at least overlapping the portion of the organic semiconductor.12-09-2010
20100317135METHOD OF MANUFACTURING A DISPLAY SUBSTRATE - A method of manufacturing a display substrate includes forming a first metallic pattern including gate and storage conductors and a gate electrode of a switching device on a base substrate, forming a gate insulation layer, forming a second metallic pattern and a channel portion including a source line, source and drain electrodes of the switching device, forming a passivation layer and a photoresist film on the second metallic pattern, patterning the photoresist film to form a first pattern portion corresponding to the gate and source conductors and the switching device, and a second pattern portion formed on the storage line, etching the passivation layer and the gate insulation layer, and forming a pixel electrode using the first pattern portion. Therefore, excessive etching of the stepped portion may be prevented, so that a short-circuit defect between a metallic pattern and a pixel electrode may be prevented12-16-2010
20130157399DOUBLE GATE THIN-FILM TRANSISTOR AND OLED DISPLAY APPARATUS INCLUDING THE SAME - A double gate thin-film transistor (TFT), and an organic light-emitting diode (OLED) display apparatus including the double gate TFT, includes a double gate thin-film transistor (TFT) including: a first gate electrode on a substrate; an active layer on the first gate electrode; source and drain electrodes on the active layer; a planarization layer on the substrate and the source and drain electrodes, and having an opening corresponding to the active layer; and a second gate electrode in the opening.06-20-2013
20130157398DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - To achieve promotion of stability of operational function of display device and enlargement of design margin in circuit design, in a display device including a pixel portion having a semiconductor element and a plurality of pixels provided with pixel electrodes connected to the semiconductor element on a substrate, the semiconductor element includes a photosensitive organic resin film as an interlayer insulating film, an inner wall face of a first opening portion provided at the photosensitive organic resin film is covered by a second insulating nitride film, a second opening portion provided at an inorganic insulating film is provided on an inner side of the first opening portion, the semiconductor and a wiring are connected through the first opening portion and the second opening portion and the pixel electrode is provided at a layer on a lower side of an activation layer.06-20-2013
20110312116ELECTRONIC DISPLAYS USING OPTICALLY PUMPED LUMINESCENT SEMICONDUCTOR NANOCRYSTALS - A multicolor electronic display is based on an array of luminescent semiconductor nanocrystals. Nanocrystals which emit tight of different colors are grouped into pixels. The nanocrystals are optically pumped to produce a multicolor display. Different sized nanocrystals are used to produce the different colors. A variety of pixel addressing systems can be used.12-22-2011
20120021544DISPLAY DEVICE, METHOD FOR MANUFACTURING DISPLAY DEVICE, AND SOI SUBSTRATE - A manufacturing method is provided which achieves an SOI substrate with a large area and can improve productivity of manufacture of a display device using the SOI substrate. A plurality of single-crystalline semiconductor layers are bonded to a substrate having an insulating surface, and a circuit including a transistor is formed using the single-crystalline semiconductor layers, so that a display device is manufactured. Single-crystalline semiconductor layers separated from a single-crystalline semiconductor substrate are applied to the plurality of single-crystalline semiconductor layers. Each of the single-crystalline semiconductor layers has a size corresponding to one display panel (panel size).01-26-2012
20120028392ELECTROPHORETIC DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating an electrophoretic display device includes forming a gate line along a direction, a gate electrode extending from the gate line, a common line parallel to the gate line, and a first storage electrode extending from the common line on a substrate, forming a gate insulating layer on an entire surface of the substrate including the gate line, the gate electrode, the common line and the first storage electrode, forming a semiconductor layer, a data line, and source and drain electrodes through a mask process, wherein the semiconductor layer is disposed over the gate electrode, the data line crosses the gate line to define a pixel region, the source electrode extends from the data line, and the drain electrode is spaced apart from the source electrode over the semiconductor layer.02-02-2012
20120028391METHOD OF FABRICATING DISPLAY DEVICE - To improve the use efficiency of materials and provide a technique of fabricating a display device by a simple process. The method includes the steps of providing a mask on a conductive layer, forming an insulating film over the conductive layer provided with the mask, removing the mask to form an insulating layer having an opening; and forming a conductive film in the opening so as to be in contact with the exposed conductive layer, whereby the conductive layer and the conductive film can be electrically connected through the insulating layer. The shape of the opening reflects the shape of the mask. A mask having a columnar shape (e.g., a prism, a cylinder, or a triangular prism), a needle shape, or the like can be used.02-02-2012
20120028390THIN FILM DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE WITH THE SAME - A thin film deposition apparatus that may prevent a patterning slit sheet from sagging and increase a tensile force of the patterning slit sheet, and a method of manufacturing an organic light-emitting display device using the same.02-02-2012
20120028389METHOD FOR MANUFACTURING DISPLAY DEVICE - A method of manufacturing a display device is disclosed. In one embodiment, the method includes: i) forming a semiconductor layer where a plurality of crystallized areas and a plurality of noncrystallized areas are alternately arranged on a substrate, ii) aligning the substrate based on a difference in contrast ratio between the crystallized and noncrystallized areas and iii) performing a photo process or a photolithography process.02-02-2012
20120295379DEPOSITION MASK, DEPOSITION APPARATUS, AND DEPOSITION METHOD - A deposition mask 11-22-2012
20130203196MANUFACTURE METHOD OF THIN FILM TRANSISTOR ARRAY SUBSTRATE - Disclosed is a manufacture method of the thin film transistor array, comprising depositing a first transparent conductive layer and a first metal layer to perform patterning for forming a common electrode, a gate electrode and a transparent electrode array; depositing an insulating layer, an active layer, an ohmic contact layer and a second metal layer to perform patterning for forming a source and a drain; depositing a second transparent conductive layer to perform patterning for forming a source contact layer, a drain contact layer and a pixel electrode array connected to the drain contact layer. The present invention simplifies the manufacture process, saves the cost and time for the manufacture.08-08-2013
20130095590LIQUID CRYSTAL DISPLAY AND METHOD OF FABRICATING THE SAME TO HAVE TFT'S WITH PIXEL ELECTRODES INTEGRALLY EXTENDING FROM ONE OF THE SOURCE/DRAIN ELECTRODES - A liquid crystal display (LCD) includes thin film transistors (TFTs) each having spaced apart source/drain electrodes and an oxide-type semiconductive film disposed over and between the source/drain electrodes to define an active layer. Each of the source/drain electrodes includes a portion of a subdivided transparent conductive layer where one subdivision of the transparent conductive layer continues from within its one of the source/drain electrodes to define an optically exposed pixel-electrode that is reliably connected integrally to the one source/drain electrode. Mass production costs can be reduced and production reliability increased because a fewer number of photolithographic masks can be used to form the TFTs.04-18-2013
20130095587METHODS FOR MANUFACTURING THIN FILM TRANSISTOR AND DISPLAY DEVICE - The present invention provides a method for manufacturing a highly reliable semiconductor device with a small amount of leakage current. In a method for manufacturing a thin film transistor, etching is conducted using a resist mask to form a back channel portion in the thin film transistor, the resist mask is removed, a part of the back channel is etched to remove etching residue and the like left over the back channel portion, whereby leakage current caused by the residue and the like can be reduced. The etching step of the back channel portion can be conducted by dry etching using non-bias.04-18-2013
20120094416LOW-COST LARGE-SCREEN WIDE-ANGLE FAST-RESPONSE LIQUID CRYSTAL DISPLAY APPARATUS - A method of fabricating MVA active matrix substrate, and said substrate constituting an active matrix display device, characterized in that: a photolithographic procedure is performed three times for the manufacture: forming a gate electrode, a pixel electrode, a common electrode and a contact pad in said pixel electrode, forming a separate thin film semiconductor layer component, and a contact hole,forming a source electrode, a drain electrode and an orientation control electrode such that after an ohmic contact layer of a channel portion of said thin film transistor is dry etched, a partial film of a passivation layer is formed by a silicon nitride film by using a mask deposition method is provided.04-19-2012

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