Entries |
Document | Title | Date |
20080233667 | MICRODISPLAY PACKAGING SYSTEM - Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to thermal expansion characteristics of the protective cover. According to some embodiments, at least one set of imaging elements is fabricated on an upper surface of a semiconductor substrate, and a base is affixed to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base. | 09-25-2008 |
20080241978 | LIGHT EMITTING DEVICE PROCESSES - Light-emitting devices, and related components, processes, systems and methods are disclosed. | 10-02-2008 |
20090053840 | HIGH POWER LIGHT EMITTING DEVICE ASSEMBLY WITH ESD PROTECTION ABILITY AND THE METHOD OF MANUFACTURING THE SAME - A high power light emitting device assembly with electro-static-discharge (ESD) protection ability and the method of manufacturing the same, the assembly comprising: at least two sub-mounts, respectively being electrically connected to an anode electrode and a cathode electrode, each being made of a metal of high electric conductivity and high thermal conductivity; a light emitting device, arranged on the sub-mounts; and an ESD protection die, sandwiched and glued between the sub-mounts, for enabling the high-power operating light emitting device to have good heat dissipating path while preventing the same to be damaged by transient power overload of static surge. | 02-26-2009 |
20090053841 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device comprises an element that emits light and a substrate on a main surface of which the element is mounted. The main surface of the substrate composed of two areas, (i) a mount area which is rectangle and on which the element is mounted, and (ii) a pad area that is equipped with a pad for wire bonding. The pad area is contiguous to the mount area on one side of the mount area, and the pad area decreases in width continuously or stepwise in a direction away from the one side. | 02-26-2009 |
20090148969 | MICROELECTRONIC IMAGING UNITS - Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes providing a plurality of imaging dies on a microfeature workpiece. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes attaching a plurality of covers to corresponding imaging dies, cutting the microfeature workpiece to singulate the imaging dies, and coupling the singulated dies to a support member. The covers can be attached to the imaging dies before or after the workpiece is cut. | 06-11-2009 |
20090155939 | Method of isolating semiconductor laser diodes - Provided is a method of isolating semiconductor laser diodes (LDs), the method including the steps of: preparing a substrate; forming a plurality of semiconductor LDs on the substrate, each semiconductor LD including an n-type semiconductor layer, an active layer, a p-type semiconductor layer, an n-electrode, a ridge portion, and a p-electrode, the ridge portion being formed by etching the p-type semiconductor layer such that a portion of the p-type semiconductor layer protrudes, the p-electrode being formed on the ridge portion; partially forming base cut lines on the surface of the substrate excluding the ridge portions; and isolating the semiconductor LDs into a bar shape along the base cut lines. | 06-18-2009 |
20090176324 | METHOD FOR ENCAPSULATING A SUBSTRATE AND METHOD FOR FABRICATING A LIGHT EMITTING DIODE DEVICE - The present invention relates to a method for encapsulating a substrate, which comprises: (a1) providing a substrate with a plurality of chips mounted on a top side of the substrate; | 07-09-2009 |
20090311810 | METHOD OF MANUFACTURING BENDABLE SOLID STATE LIGHTING - The invention provides a method of manufacturing a bendable solid state lighting (SSL). A first metal layer and a second metal layer with a predetermined circuit layout pattern and structure region pattern are first deposited on both sides of a flexible substrate respectively, where a plurality of bonding pads is formed on the structure regions in the structure region pattern and is used for being electrically connected to the first metal layer. A plurality of LED dies is arranged on the structure regions in an array, and the LED dies are bonded with the corresponding bonding pads, such that the LED dies are conducted with current via the circuit layout of the first metal layer on the flexible substrate, so as to form a planar light source. | 12-17-2009 |
20090311811 | HIGH POWER LIGHT EMITTING DIODE PACKAGE AND METHOD OF PRODUCING THE SAME - A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof. | 12-17-2009 |
20100022039 | METHOD OF MAKING LIGHT EMITTING DIODES - A method of making LEDs simultaneously includes steps of : a) providing a wafer having LED dies on a substrate; b) forming a passivation layer on the LED dies; c) forming an electrode layer on the passivation layer and the LED dies; d) assembling a conducting board on the electrode layer; e) removing the substrate to expose a light emitting surface of each LED die; f) forming a terminal on the light emitting surface; g) forming a channel at a lateral side of each LED die; h) assembling a cover onto the LED dies; i) wire bonding and encapsulating the LED dies to the LEDs connected with each other; and j) cutting through the interconnected LEDs to form the LEDs separated from each other. | 01-28-2010 |
20100047943 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted. | 02-25-2010 |
20100062553 | Organic Light Emitting Display Device - An organic light emitting display device capable of hermetically sealing a space between a deposition substrate and an encapsulation substrate with inorganic sealing materials is disclosed. One embodiment of the organic light emitting display device includes a first substrate including power supply lines formed on an array, and a circumference of the array, of an organic light emitting diode, and connected to a pad unit through the power pad line to supply a power source to each of the organic light emitting diodes; a second substrate arranged on at least the array of the first substrate; and an inorganic sealing material for sealing an inner space between the first substrate and the second substrate while forming a closed boundary, wherein the inorganic sealing material is not overlapped with a region in which the power supply line is formed. | 03-11-2010 |
20100093118 | METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE - Semiconductor laser elements are formed on a common substrate. Au plating is formed on principal surfaces of the semiconductor laser elements. The semiconductor laser elements are mounted on a package with solder applied to the Au plating. Areas opposed to each other across a light-emitting area of each semiconductor laser element are designated first and second areas. Average thickness of the Au plating is different in the first and second areas of each semiconductor laser element. | 04-15-2010 |
20100136726 | LED ARRAY - An illuminator ( | 06-03-2010 |
20100144073 | Light-Emitting Diode Arrays and Methods of Manufacture - A representative LED array includes: a base substrate (BS) and a plurality of light emitting diodes, each of the light emitting diodes comprising a stack of a first contact layer, a semiconductor stack and a second contact layer, the semiconductor stack being on top of the first contact layer, the second contact layer being on top of the semiconductor stack; the plurality of light emitting diodes being arranged in pixel matrix on the base substrate as LEDs of at least three types (R, G, B); the LEDs according to their type (R, G, B) being arranged as at least a first, second and third sub-pixel in the pixel matrix for emission of radiation of a respective specific at least first, second and third color; and interconnection circuitry on the substrate, operative to connect to the light emitting diodes of the array for addressing each of the light emitting diodes. | 06-10-2010 |
20100190280 | MANUFACTURING METHOD OF LIGHT-EMITTING DIODE - A manufacturing method of an LED comprises attaching an LED epitaxial wafer (LED wafer) to an expanding tape, dicing the LED wafer on the expanding tape longitudinally and laterally to a certain element size to divide into a plurality of LED elements, expanding the expanding tape to a certain size to form an enlarged expanding tape, placing respective pairs of element electrodes of the plurality of LED elements that are attached to the enlarged expanding tape on respective pairs of electrodes on a printed-circuit board assembly collectively to perform a bonding, and removing the enlarged expanding tape from the plurality of the LED elements. | 07-29-2010 |
20100248403 | Light-Emitting Device and Method for Manufacturing the Same - In a manufacturing method of a light-emitting device, a separation layer is formed over a substrate; a semiconductor circuit element layer and first electrodes are formed over the separation layer; a partition wall overlapping with end portions of the first electrodes is formed; and organic material layers are formed over the first electrodes. Organic material layers emitting light of the same color are arranged adjacent to each other in a line and extend in a first direction. A second electrode is formed using a material having high adhesiveness to the partition wall over the organic material layers to be in contact with the partition wall. A stack structure including the semiconductor circuit element layer, the first electrodes, the partition wall, the organic material layers, and the second electrode is separated from the substrate using the separation layer in a second direction perpendicular to the first direction. | 09-30-2010 |
20110003412 | LED PACKAGE STRUCTURE AND MANUFACTURING METHOD, AND LED ARRAY MODULE - An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED. | 01-06-2011 |
20110008919 | Electronic Textiles with Electronic Devices on Ribbons - Ribbons containing e.g. inorganic NMOS devices are assembled in electrical contact with ribbons containing e.g. PMOS devices (preferably organic) to enable flexible electronic textile circuits to be inexpensive and practical for a wide variety of functions. The use of ribbons provides flexibility, reduces costs, and allows testing during assembly and different processes to be efficiently used for different components. This is apparently the first time that ribbons (especially inorganic-device-containing ribbons) have been interconnected to form a flexible CMOS electronic textile. | 01-13-2011 |
20110027923 | ORGANIC LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - An organic light emitting device and a manufacturing method thereof are provided. The organic light emitting device includes a first display substrate, a second display substrate, and a first adhesive force improving member. The first display substrate includes a first substrate, a first electrode, organic light emitting patterns, a first spacer, and a second electrode. The first electrode is formed on an entire surface of the first substrate, and the organic light emitting patterns are disposed on the first electrode. The first spacer corresponds to the organic light emitting pattern and is disposed on the first electrode. The second electrode covers the organic light emitting patterns and the first spacer. The second display substrate includes a second substrate, and a first driving signal delivery part. The first adhesive force improving member electrically/physically couples the second electrode to the first driving signal delivery part. | 02-03-2011 |
20110033961 | FLEXIBLE DISPLAY AND MANUFACTURING METHOD OF THE SAME - A flexible display of the present invention is an active matrix flexible display in which a TFT is provided for each pixel. In the flexible display, an adhesive layer, a protective layer, a gate electrode for the TFT, which is buried in the protective layer, a gate insulating layer for the TFT, source and drain electrodes for the TFT, a pixel electrode electrically connected to the drain electrode, an organic active layer for the TFT, an organic EL layer including a red (R) emitting layer, a green (G) emitting layer and a blue (B) emitting layer, which are formed on a plurality of the pixel electrodes, a metal electrode, and a sealing layer are formed on a plastic film. | 02-10-2011 |
20110059559 | ALTERNATING CURRENT LIGHT-EMITTING DEVICE AND FABRICATION METHOD THEREOF - An alternating current light-emitting device includes a substrate, a plurality of microdie light-emitting elements formed on the substrate, a rectifying element-dedicated member formed on a surface of a portion of microdie light-emitting elements, a rectifying unit formed on the rectifying element-dedicated member and provided with at least four rectifying elements forming a Wheatstone bridge circuit, and an electrically conductive structure electrically connecting the rectifying elements and the microdie light-emitting elements. With the rectifying unit being formed on the rectifying element-dedicated member, the rectifying elements are highly tolerant of reverse bias and feature low starting forward bias. Also, the present invention provides a method for fabricating an alternating current light-emitting device. | 03-10-2011 |
20110065218 | PRE-THERMAL GREASED LED ARRAY - An apparatus includes a backing material and a solid state component. The backing material carries a thermally conductive non-solid substance. The solid state component is set into the thermally conductive non-solid substance. The backing material is arranged with the solid state component so that the backing material may be removed from the apparatus leaving at least a portion of the thermally conductive non-solid substance on the solid state component for mounting to a heat sink. | 03-17-2011 |
20110065219 | LIGHT EMITTING DIODE PACKAGE, CIRCUIT BOARD FOR LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance. | 03-17-2011 |
20110092004 | MANUFACTURING METHOD OF FLAT PANEL DISPLAY - A manufacturing method of a flat panel display according to an exemplary embodiment of the present invention includes: coating a first adhering member on a first supporting plate; disposing a first substrate on the first adhering member; using ultrasonic waves to adhere the first supporting plate and the first substrate; and forming a gate line, a data line, a thin film transistor connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor on the first substrate. According to the manufacturing method of the flat panel display according to an exemplary embodiment of the present invention, the first adhering member made of the plurality of adhering particles is melted by using the ultrasonic waves without an additional adhering film to adhere the flexible first substrate and the first supporting plate, thereby reducing the overall manufacturing cost. | 04-21-2011 |
20110092005 | LIGHT-EMITTING-DIODE ARRAY AND METHOD FOR MANUFACTURING THE SAME - A method for forming a light-emitting-diode (LED) array is disclosed which comprises forming a LED structure on a substrate, dividing the LED structure into at least a first and a second LED device with a gap, depositing at least one polymer material over the LED structure substantially filling the gap, removing portions of the at least one polymer material to expose a first electrode of the first LED device and a second electrode of the second LED device, and forming an interconnect on top of the at least one polymer material electrically connecting the first and second electrode. | 04-21-2011 |
20110104835 | METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENTS - A method of manufacturing semiconductor light emitting elements with improved yield and emission power uses laser lift-off and comprises the steps of forming a semiconductor grown layer formed of a first semiconductor layer, an active layer, and a second semiconductor layer on a first principal surface of a growth substrate; forming a plurality of junction electrodes apart on the second semiconductor layer and forming guide grooves arranged in a lattice to surround each of the junction electrodes in the second semiconductor layer; joining together a support and the semiconductor grown layer via the junction electrodes; projecting a laser to separate the growth substrate; dividing the semiconductor grown layer into respective element regions for the semiconductor light emitting elements; and cutting the support, thereby separating into the semiconductor light emitting elements. Removed regions include regions where the guide grooves are formed, and side walls of the second semiconductor layer formed by the guide grooves have a beveled shape at intersections of the guide grooves. | 05-05-2011 |
20110165709 | NANOWIRE ELECTRONIC DEVICES AND METHOD FOR PRODUCING THE SAME - The present invention is directed to an electrical device that comprises a first and a second fiber having a core of thermoelectric material embedded in an electrically insulating material, and a conductor. The first fiber is doped with a first type of impurity, while the second fiber is doped with a second type of impurity. A conductor is coupled to the first fiber to induce current flow between the first and second fibers. | 07-07-2011 |
20110171763 | METHOD OF FORMING ORGANIC THIN FILM PATTERN AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE BY USING THE METHOD OF FORMING ORGANIC THIN FILM PATTERN - A method of manufacturing an organic thin film pattern, the method including: forming a dummy organic thin film on a substrate; radiating light on the dummy organic thin film pattern the dummy organic thin film; forming a main organic thin film, having a sublimation temperature is higher than that of the dummy organic thin film, on the substrate and the patterned dummy organic thin film; and heating patterned the dummy organic thin film and the main organic thin film, to sublimate the dummy organic thin film and thereby pattern the main organic thin film. | 07-14-2011 |
20110177636 | MANUFACTURING PROCESS FOR SOLID STATE LIGHTING DEVICE ON A CONDUCTIVE SUBSTRATE - A method for fabricating a light emitting device includes forming a trench in a first surface on a first side of a substrate. The trench comprises a first sloped surface not parallel to the first surface, wherein the substrate has a second side opposite to the first side of the substrate. The method also includes forming light emission layers over the first trench surface and the first surface, wherein the light emission layer is configured to emit light and removing at least a portion of the substrate from the second side of the substrate to form a protrusion on the second side of the substrate to allow the light emission layer to emit light out of the protrusion on the second side of the substrate. | 07-21-2011 |
20110177637 | ENCAPSULATED ORGANIC ELECTRONIC DEVICES AND METHOD FOR MAKING SAME - Encapsulated organic electronic devices including organic light emitting diodes are made using an adhesive component as a mask while the device is being constructed. An adhesive-coated liner can be applied to the device substrate and openings created therein by removing portions of the liner and adhesive, or a patterned adhesive layer having openings therein can be formed on the device substrate, followed by deposition of the device layers and application of a sealing layer. | 07-21-2011 |
20110201141 | LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD OF LIQUID CRYSTAL DISPLAY DEVICE - To sophisticate a portable electronic appliance without hindering reduction of the weight and the size, more specifically, to sophisticate a liquid crystal display apparatus installed in a portable electronic appliance without hindering the mechanical strength, a liquid crystal display apparatus includes a first plastic substrate, a light-emitting device which is disposed over the first plastic substrate, resin which covers the light-emitting device, an insulating film which is in contact with the resin, a semiconductor device which is in contact with the insulating film, a liquid crystal cell which is electrically connected to the semiconductor device, and a second plastic substrate, wherein the semiconductor device and the liquid crystal cell are disposed between the first plastic substrate and the second plastic substrate. | 08-18-2011 |
20110207253 | FLIP-CHIP LED MODULE FABRICATION METHOD - A flip-chip LED module fabrication method includes the steps of (a) growing an epitaxial layer consisting of a N-type semiconductor layer, a light-emitting layer and a P-type semiconductor layer on a wafer substrate, (b) dividing the wafer into individual light-emitting chips, (c) selecting qualified light-emitting chips, (d) coating an UV-curable adhesive on o a film and then bonding the selected light-emitting chips to the film by means of the UV-curable adhesive, (e) curing the UV-curable adhesive with ultraviolet rays, and (f) operating push-up needles of an equipment to knock the opposite side of the film to let the light-emitting chips be separated from the film without causing damage. | 08-25-2011 |
20110223697 | METHOD OF MANUFACTURING FLEXIBLE DISPLAY DEVICE - A method of manufacturing a flexible display device is disclosed. The method includes arranging a first substrate having a plurality of depression units, forming a first plastic film in each of the plurality of depression units, forming a thin film transistor (TFT) on the first plastic film, forming a display device on the TFT, where the display device is configured to be electrically connected to the TFT, encapsulating an upper portion of the display device, cutting the first substrate, and separating the first substrate from the first plastic film. | 09-15-2011 |
20110250711 | METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE - A method of manufacturing a light-emitting device includes forming a planar board that includes a plurality of first metallic plates and a plurality of second metallic plates continuously connected by a resin, by use of a positioning frame including a plurality of first concave portions and a plurality of second concave portions, mounting a plurality of light-emitting diode elements on the planar board, and sealing the light-emitting diode elements collectively, thereby producing a plurality of light-emitting devices. | 10-13-2011 |
20110312110 | OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element. | 12-22-2011 |
20120009702 | METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY - A method for manufacturing an organic light emitting diode (OLED) display device, the method including: forming a mother substrate that includes a first glass substrate, a second glass substrate, organic light emitting diodes, and a sealant; etching the first and second glass substrates, to reduce the thicknesses thereof; forming a protective layer on the first glass substrate; and dividing the mother substrate into a plurality the displays, by cutting the first substrate through the protective layer. | 01-12-2012 |
20120009703 | THIN GLASS PROCESSING USING A CARRIER - A method of fabricating a display panel from a thin substrate using a carrier substrate is disclosed. The method includes depositing a bonding agent on a first surface of the thin substrate; depositing a bonding agent on a second surface of the carrier substrate; bonding the thin substrate and the carrier substrate with the bonding agent deposited on the first surface and the second surface; performing thin film processing on a third surface of the thin substrate opposite the first surface; and separating the processed thin substrate from the carrier substrate. The thin substrate has a thickness less than a required thickness for sustaining thin film processing while a thickness of the bonded thin substrate and the carrier substrates is greater than or equal to that the required thickness. | 01-12-2012 |
20120045856 | METHOD OF MANUFACTURING ORGANIC EL DEVICE - According to one embodiment, a method of manufacturing an organic EL device is disclosed. The method can arrange an adhesive agent of an ultraviolet curable type between a first substrate on which a plurality of light emitting parts are formed in a predetermined direction and a second substrate arranged to face the first substrate separately so as to surround the light emitting parts. Each of the light emitting parts comprises a plurality of organic EL elements. The method can form a substrate pair by exposing the adhesive agent to ultraviolet rays to bond the first substrate and the second substrate to each other with the adhesive agent. The method can place the substrate pair on a first holding member capable of holding an entire surface of the first substrate or the second substrate. The method can place the substrate pair on a second holding member after a predetermined period of time has passed, the second holding member being capable of holding the substrate pair with at least two supporting members positioned along the first substrate or the second substrate. The method can cut the substrate pair around the adhesive agent with each of the light emitting parts as a unit. | 02-23-2012 |
20120070923 | FABRICATION METHOD OF ORGANIC ELECTROLUMINESCENCE DISPLAY HAVING A GETTER LAYER - Provided herein is a method of manufacturing an organic electroluminescence display device, including the steps of: forming a getter layer on a unit sealing substrate using a dry method; providing a device substrate including a device array formed thereon, the device array including a plurality of unit organic electroluminescence devices; attaching the device substrate to the unit sealing substrate such that the getter layer faces the device array, thus forming a module; and imparting fluidity to the getter layer such that the getter layer covers upper and lateral sides of the device array. The method is advantageous in that fluidity is imparted to the getter layer, so that the upper and lateral sides of the device array is covered by the getter layer, thereby greatly improving the moisture resistance of the organic electroluminescence device. | 03-22-2012 |
20120100647 | Method of manufacturing flexible display device - A method of manufacturing a flexible display device is provided. The method includes: preparing a first flexible substrate on which a display unit is formed; forming an encapsulation unit including a base substrate, a second flexible substrate formed on the base substrate, and a barrier layer formed on the second flexible substrate; combining the encapsulation unit with the display unit; and separating the base substrate from the second flexible substrate by using a difference between a coefficient of thermal expansion of the base substrate and a coefficient of thermal expansion of the second flexible substrate, by applying a heated solution between the base substrate and the second flexible substrate. The flexible display device is easily manufactured since the base substrate and the second flexible substrate, which have different coefficients of thermal expansion and are coupled to each other, are separable from each other by applying the heated solution. | 04-26-2012 |
20120122256 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE - A method for manufacturing light emitting diodes includes steps of: providing a base have an upper conductive layer and a lower conductive layer on a top face and a bottom face thereof, respectively; forming a plurality of through holes in the base; defining a plurality of grooves to divide the upper and lower conductive layers into discrete strips; forming a connection layer on an inner circumferential face of each hole to connect the opposite strips of the upper and lower conductive layers; filling a supporting layer in an upper portion of each hole; forming a reinforcing layer on the supporting layer and the upper conductive layer; fixing chips on the reinforcing layer and electrically connecting the chips with the strips of the upper conductive layer; forming an encapsulant on the reinforcing layer; and cutting the base into individual LEDs along the holes. | 05-17-2012 |
20120135551 | LIGHT EMITTING DIODE AND METHOD OF FABRICATING THE SAME - Disclosed herein is a light emitting diode. The light emitting diode includes a support substrate, semiconductor layers formed on the support substrate, and a metal pattern located between the support substrate and the lower semiconductor layer. The semiconductor layers include an upper semiconductor layer of a first conductive type, an active layer, and a lower semiconductor layer of a second conductive type. The semiconductor layers are grown on a sacrificial substrate and the support substrate is homogeneous with the sacrificial substrate. | 05-31-2012 |
20120171788 | IC CARD AND BOOKING-ACCOUNT SYSTEM USING THE IC CARD - It is an object of the present invention to provide a highly sophisticated functional IC card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. An IC card comprising a display device and a plurality of thin film integrated circuits; wherein driving of the display device is controlled by the plurality of thin film integrated circuits; a semiconductor element used for the plurality of thin film integrated circuits and the display device is formed by using a polycrystalline semiconductor film; the plurality of thin film integrated circuits are laminated; the display device and the plurality of thin film integrated circuits are equipped for the same printed wiring board; and the IC card has a thickness of from 0.05 mm to 1 mm. | 07-05-2012 |
20120171789 | SOLID ELEMENT DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part. | 07-05-2012 |
20120208307 | MANUFACTURING METHOD OF HIGH-EFFICIENCY LED - A manufacturing method of a high-efficiency light-emitting diode (LED) is provided. A soft mold is used to transfer a microstructure or a nano-scale pattern thereon onto an imprinting material. The imprinting material is distributed all over an LED wafer; and the imprinting process may be performed through forward imprinting or reverse imprinting. | 08-16-2012 |
20120214265 | METHOD FOR FORMING COATING FILM ON FACET OF SEMICONDUCTOR OPTICAL DEVICE - The method includes the steps of preparing an epitaxial wafer by forming a multilayer semiconductor structure on a main surface of a substrate; forming stripe electrodes and bonding pads on the multilayer semiconductor structure with the bonding pads being respectively electrically connected to the stripe electrodes; forming a projection portion on the multilayer semiconductor structure; forming laser diode (LD) bars by cutting the epitaxial wafer; arranging the LD bars on a support surface such that a side surface thereof is oriented normal to the support surface, and disposing spacers between the LD bars; and forming a coating film on the side surface. The projection portion has a height, measured from the main surface of the substrate, greater than a height of the stripe electrodes. Furthermore, the laser diode bar has at least one projection portion. | 08-23-2012 |
20120214266 | MANUFACTURING METHOD OF NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENTS - A manufacturing method of nitride semiconductor light emitting elements, which can reliably form a mechanically stable wiring electrode leading from a light emitting element surface. A structure protective sacrifice layer is formed around a first electrode layer on a device structure layer beforehand, and after separation of the device structure layer into respective portions for the light emitting elements, the resultant is stuck to a support substrate. Subsequently, forward tapered grooves reaching the structure protective sacrifice layer are formed, and the inverse tapered portion formed outward of the forward tapered groove is lifted off in a lift-off step. Thus, an insulating layer is formed on the forward tapered side walls of the light emitting element, and a wiring electrode layer electrically connected to the second electrode layer on the principal surface of the light emitting element is formed on the insulating layer. | 08-23-2012 |
20120225510 | METHOD FOR ENCAPSULATING A SUBSTRATE AND METHOD FOR FABRICATING A LIGHT EMITTING DIODE DEVICE - The present invention relates to a method for encapsulating a substrate, which comprises: | 09-06-2012 |
20120238045 | THREE DIMENSIONAL LIGHT EMITTING DIODE SYSTEMS, AND COMPOSITIONS AND METHODS RELATING THERETO - A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs. | 09-20-2012 |
20120276668 | METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE - In one embodiment, a method is disclosed for manufacturing a semiconductor light emitting device. The method can include forming a plurality of light emitting regions on a major surface of a support substrate. The method can include forming V-shaped grooves by anisotropic etching between the plurality of light emitting regions in the major surface of the support substrate. In addition, the method can include dividing the support substrate at positions of the grooves to separate the light emitting regions. | 11-01-2012 |
20120295376 | METHOD FOR MANUFACTURING A LED ARRAY DEVICE, AND LED ARRAY DEVICE MANUFACTURED THEREBY - Disclosed are a method for fabricating a GaN LED array device for optogenetics and a GaN LED array device fabricated thereby. | 11-22-2012 |
20120301982 | Optoelectronic Headlight, Method for Production of an Optoelectronic Headlight and a Luminescence Diode Chip - An optoelectronic headlight which emits electromagnetic radiation is specified, which has a luminescence diode chip with at least two spatial emission regions or which has at least two luminescence diode chips each having at least one spatial emission region. The headlight is suitable in particular for a front headlight for motor vehicles. The emission regions, in a plan view of a main extension plane associated with them, are shaped differently, are of different sizes and/or are not shaped rectangularly and are differently oriented. Particularly preferably, the emission regions can be driven independently of one another. Methods for production of an optoelectronic headlight and a luminescence diode chip are furthermore specified. | 11-29-2012 |
20130005059 | METHOD OF MANUFACTURING FLEXIBLE DISPLAY - Provided is a method of manufacturing a flexible display, which can simplify manufacturing processes and reduce manufacturing expenses. A method of manufacturing a flexible display according to one exemplary embodiment of the present invention may include: forming a sacrificial layer on a carrier substrate; forming a flexible substrate on the sacrificial layer; forming a TFT array on the flexible substrate; etching the sacrificial layer to separate the flexible substrate from the carrier substrate; attaching the flexible substrate to an adhesive roll; and attaching the flexible substrate, which has been attached to the adhesive roll, to a rear substrate. | 01-03-2013 |
20130017632 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODEAANM CHEN; PIN-CHUANAACI HukouAACO TWAAGP CHEN; PIN-CHUAN Hukou TW - A method for manufacturing LEDs (light emitting diodes) includes steps: providing a substrate; attaching an adhesive layer on the substrate; forming a blocking layer on the adhesive layer, the blocking layer having a plurality of first holes and second holes alternating with and spaced from the first holes; forming a conductive layer including first leads and second leads in the first holes and the second holes; removing the blocking layer; forming a housing layer on the adhesive layer, the housing layer having a plurality of cavities to expose the first leads and second leads; fixing chips on the first leads and electrically connecting the chips with the first and second leads; forming encapsulants in the cavities to seal the chips; and removing the substrate and adhesive layer from the housing layer and the conductive layer. | 01-17-2013 |
20130017633 | VAPOR DEPOSITION APPARATUS AND METHOD, AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY APPARATUSAANM Seo; Sang-JoonAACI Yongin-cityAACO KRAAGP Seo; Sang-Joon Yongin-city KRAANM Kim; Seung-HunAACI Yongin-cityAACO KRAAGP Kim; Seung-Hun Yongin-city KRAANM Kim; Jin-KwangAACI Yongin-cityAACO KRAAGP Kim; Jin-Kwang Yongin-city KRAANM Song; Seung-YongAACI Yongin-cityAACO KRAAGP Song; Seung-Yong Yongin-city KR - A vapor deposition apparatus, which is capable of performing a thin film deposition process and improving characteristics of a formed thin film, includes a chamber having an exhaust opening; a stage located in the chamber, and including a plurality of mounting surfaces on which the plurality of substrates may be mounted; and an injection unit having at least one injection opening for injecting a gas into the chamber in a direction parallel with surfaces of the plurality of substrates. | 01-17-2013 |
20130023072 | Substrate For Integrated Modules - A method of fabricating a plurality of components using wafer-level processing can include bonding first and second wafer-level substrates together to form a substrate assembly, such that first surfaces of the first and second substrates confront one another, the first substrate having first electrically conductive elements exposed at the first surface thereof, forming second electrically conductive elements contacting the first conductive elements, and processing the second substrate into individual substrate elements. The second conductive elements can extend through a thickness of the first substrate and can be exposed at a second surface thereof opposite the first surface. The processing can include trimming material to produce the substrate elements at least some of which have respective different controlled thicknesses between first surfaces adjacent the first substrate and second surfaces opposite therefrom. | 01-24-2013 |
20130089937 | METHOD AND APPARATUS FOR ACCURATE DIE-TO-WAFER BONDING - A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating. | 04-11-2013 |
20130102097 | MULTICOLOR LIGHT EMITTING DIODES - A device such as a multicolor light emitting diode that emits different colors of light and that may combine the different colors emitted by individual light emitting diodes. The multicolor LED may include a common anode terminal that may be connected to each anode of the individual light emitting diodes. The multicolor LED may be a five terminal multicolor LED. Additionally, the multicolor LED may include two anode terminals, in which the first anode terminal may be a common anode terminal connected to three of the individual color LEDs and the second anode terminal may be connected to an anode of a white LED. In this embodiment, the multicolor LED may be a six terminal multicolor LED. | 04-25-2013 |
20130122618 | LED PACKAGE AND MOLD OF MANUFACTURING THE SAME - A light emitting diode package includes a base having a first surface, an electrode portion attached to the base, a pair of inner electrodes disposed on the first surface, a pair of outer electrodes, a pair of conductive pillars, a light emitting diode die, and a cap layer. Each outer electrode includes an end surface section and a side surface section. The end surface sections are disposed, corresponding to the inner electrodes, on the second surface. Each side surface section extends onto the side surface of the electrode portion. The conductive pillar penetrates between the inner electrode and the outer electrode. The light emitting diode die is on the first surface, electrically connecting the inner electrode file cap layer covers the light emitting diode die. | 05-16-2013 |
20130157396 | METHOD OF FORMING ENCAPSULATION SUBSTRATE FOR AN ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE - An organic light emitting diode (OLED) display device and method of fabrication that includes a substrate having a device region, an outer dam region and an encapsulation region. The encapsulation region includes an inner dam region, an outer dam region and an encapsulation region that correspond to the device region. An encapsulation agent is formed in the encapsulation region of the encapsulation substrate, and filling dams are formed of the same material in the outer dam region and the inner dam region of the encapsulation substrate. | 06-20-2013 |
20130164870 | LIQUID CRYSTAL DISPLAY APPARATUS AND METHOD FOR MANUFACTURING THE SAME - An approach is provided for manufacturing a LCD apparatus. A first substrate is formed by forming a transparent conductive layer on a first transparent insulating substrate and forming a transparent conductive electrode on the transparent conductive layer. A second substrate is formed by forming a thin-film transistor (TFT) on a second transparent insulating substrate and forming a pixel electrode. The first substrate is coupled to the second substrate using a sealing member. | 06-27-2013 |
20130183779 | Packaged LED Module - The invention relates to a packaged LED module ( | 07-18-2013 |
20130189804 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS - A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure. | 07-25-2013 |
20130189805 | ENCAPSULATION FOR ORGANIC OPTOELECTRONIC DEVICES - An organic optoelectronic device includes a substrate, an anode, a cathode, an active region comprising an organic material, an encapsulation that isolates the active region from an ambient environment, wherein the encapsulation comprises a housing, and a first hermetically sealed electrical path through the housing. | 07-25-2013 |
20130244358 | METHOD OF MANUFACTURING LIGHT EMITTING DIODE - A method of manufacturing a light emitting diode (LED) comprising: providing a porous carrier, a base disposed on the carrier and a plurality of light emitting elements mounted on the base, wherein the carrier defines a plurality of micro through-holes extending through a first face to a second face of the carrier, and the base has electrical structures formed thereon electrically connecting to the light emitting elements, respectively; providing a mold to receive the carrier therein and distributing a phosphor glue on the base to cover the light emitting elements, and the mold defining an air outlet communicated with the through-holes of the carrier; vacuuming the mold via the air outlet to flatten an outer face of the phosphor glue; heating the phosphor glue and removing the mold; and removing the carrier. | 09-19-2013 |
20130252358 | PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE - In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure. | 09-26-2013 |
20130302920 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING - A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure. | 11-14-2013 |
20130302921 | METHOD FOR PRODUCING ELECTRO-OPTICAL DEVICE AND SUBSTRATE FOR ELECTRO-OPTICAL DEVICE - Disclosed is a method for producing an electro-optical device, which includes a step of defining sealing materials on either an element substrate side of a mother substrate or an opposing substrate side of the mother substrate, a step of supplying liquid crystal inside the sealing materials, a step of bonding the element substrate side of the mother substrate and the opposing substrate side of the mother substrate together, and a step of hardening the sealing materials in order to apply a predetermined potential to a peripheral electrode provided between a pixel region and sealing materials in at least a portion of the steps. | 11-14-2013 |
20130309791 | SEMICONDUCTOR ACTIVE MATRIX ON BURIED INSULATOR - A high resolution active matrix backplane is fabricated using techniques applicable to flexible substrates. A backplane layer including active semiconductor devices is formed on a semiconductor-on-insulator substrate. The backplane layer is spalled from the substrate. A frontplane layer including passive devices such as LCDs, OLEDs, photosensitive materials, or piezo-electric materials is formed over the backplane layer to form an active matrix structure. The active matrix structure may be fabricated to allow bottom emission and provide mechanical flexibility. | 11-21-2013 |
20130309792 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, light-emitting dies are fabricated on a substrate, separated from at least a portion of the substrate, and coated with a wavelength-conversion material. | 11-21-2013 |
20130337594 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing LED packages includes following steps: providing an engaging frame including a lead frame, electrode structures having first and second electrodes, and defining slots between the electrode structure, each first electrode including a first inserting part and each second electrode including a second inserting part; | 12-19-2013 |
20140030829 | Optoelectronic Module Having a Carrier Substrate and a Plurality of Radiation-Emitting Semiconductor Components and Method for the Production Thereof - An optoelectronic module is described including a carrier substrate and a plurality of radiation-emitting semiconductor components. The carrier substrate includes structured conductor tracks. The semiconductor components each include an active layer for generating electromagnetic radiation, a first contact area and a second contact area. The first contact area is in each case arranged on that side of the semiconductor components that is remote from the carrier substrate. The semiconductor components are provided with an electrically insulating layer having a cutout in a region of the first contact area. Conductive structures are arranged in regions on the insulating layer. One of the conductive structures electrically conductively connects at least the first contact area of a semiconductor component to a further first contact area of a further semiconductor component or to a conductor track of the carrier substrate. A method for producing such a module is also described. | 01-30-2014 |
20140038325 | LIGHT-EMITTING DEVICE MANUFACTURING METHOD - A method for manufacturing a light-emitting device comprises retaining a conductor wire so that a straight-line distance between adjacent mounting portions while the conductor is retained is less than a distance along the conductor wire between the adjacent mounting portions; mounting a plurality of light emitting diodes to respective ones of the mounting portions on the retained conductor wire; and after the mounting step, sealing the plurality of light-emitting diodes mounted on the conductor wire. | 02-06-2014 |
20140038326 | DISPLAY SUBSTRATE HAVING ARCHED SIGNAL TRANSMISSION LINE AND MANUFACTURE METHOD THEREOF - This invention discloses a display device mother substrate, a display device substrate and a manufacture method of display device substrate thereof. The display device mother substrate includes a first substrate, a second substrate, a first active area circuit and a first transmission line, wherein a first cutting line is defined between the first substrate and the second substrate. The first active area circuit is disposed on the first substrate and is electrically connected to the first transmission line. The first transmission line includes a display line portion, an end line portion and a middle line portion, wherein the display line portion is electrically connected to the first active area circuit. The middle line portion is disposed on the second substrate, wherein two ends of the middle line portion are electrically connected to the display line portion and the end line portion respectively at the first cutting line. The display device mother substrate is cut along the first cutting line to be separated into the first substrate and the second substrate, wherein the middle line portion is also separated from the display line portion and the end line portion. | 02-06-2014 |
20140038327 | FRIT SEALING SYSTEM AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY (OLED) APPARATUS USING THE SAME - A frit sealing system and a method of manufacturing an organic light-emitting display (OLED) using the frit sealing system are disclosed. In one embodiment, the frit sealing system includes: a thermal expansion film formed on the second substrate to pressurize the second substrate when heat is applied to the frit and thermal expansion film, wherein the frit is interposed between the first and second substrates and a mask formed on the thermal expansion film. | 02-06-2014 |
20140065741 | Method and Apparatus for Accurate Die-to-Wafer Bonding - A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating. | 03-06-2014 |
20140073072 | METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY - A method of manufacturing an organic light emitting diode (OLED) display according to an exemplary embodiment includes: forming a diplay unit displaying an image and a driver positioned near the display unit to drive a light emitting element of the display unit in a lower mother substrate; forming a sealant and a plurality of bumps in an upper mother substrate; aligning the lower mother substrate and the upper mother substrate to face each other; melting and hardening the sealant to combine the lower mother substrate and the upper mother substrate; cutting the upper mother substrate; and cutting the lower mother substrate, wherein the cutting of the upper mother substrate is performed according to a first cutting line between the sealant and the bumps and a second cutting line corresponding to the bumps. | 03-13-2014 |
20140087499 | METHOD FOR HANDLING A SEMICONDUCTOR WAFER ASSEMBLY - Systems and methods for fabricating a light emitting diode include forming a multilayer epitaxial structure above a carrier substrate; depositing at least one metal layer above the multilayer epitaxial structure; removing the carrier substrate. | 03-27-2014 |
20140099742 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE - The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed. | 04-10-2014 |
20140113394 | FILM LAMINATION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS USING THE FILM LAMINATION APPARATUS - A film lamination apparatus for laminating a film on a flat display panel including a display unit on one surface of a substrate, the film lamination apparatus including: a work table configured to support the flat display panel such that the display unit is below the substrate; and a transfer robot configured to support the flat display panel such that the display unit faces upward and then transfer the flat display panel to the work table while the flat display panel is turned over such that the display unit faces downward. | 04-24-2014 |
20140127840 | DISPLAY APPARATUS HAVING MULTIPLE SPACERS - A display apparatus includes a display substrate and a counter substrate. The display substrate includes a first substrate and a plurality of pixel electrodes formed on the first substrate. The counter substrate includes a second substrate facing the first substrate, a common electrode formed on the second substrate, a first spacer formed on the common electrode and making contact with the display substrate, a second spacer having a first gap with the display substrate, a third spacer having a second gap larger than the first gap with the display substrate, and a fourth spacer having a third gap larger than the second gap with the display substrate. | 05-08-2014 |
20140134767 | LED LIGHT SOURCE, ITS MANUFACTURING METHOD, AND LED-BASED PHOTOLITHOGRAPHY APPARATUS AND METHOD - Structurally-simple LED light source preventing temperature variations among multiple LED elements arranged densely on LED-mounting substrate is described. LED light source includes a plurality of LED elements each of which is formed by connecting an LED chip to electrodes formed on a ceramic substrate; LED-mounting substrate on which to mount the plurality of LED elements, the LED-mounting substrate having through holes therein; and heat sink plate for releasing heat from the LED-mounting substrate, wherein a thermally conductive resin is present between the LED-mounting substrate and the heat sink plate and wherein part of the thermally conductive resin protrudes from the through holes of the LED-mounting substrate and covers the top surface of the LED-mounting substrate on which the plurality of LED elements are mounted, so thermally conductive resin is in contact with the plurality of LED elements. | 05-15-2014 |
20140134768 | VAPOR DEPOSITION APPARATUS AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - A vapor deposition apparatus for depositing a thin film on a substrate, by which a deposition process is efficiently performed and deposition film characteristics are easily improved, and a vapor deposition apparatus including: a stage onto which a substrate is disposed; and a supply unit disposed to face the substrate and having a main body member and a nozzle member disposed on one surface of the main body member facing the substrate, to sequentially supply a plurality of gases towards the substrate, and a method of manufacturing an organic light-emitting display apparatus using the same. | 05-15-2014 |
20140134769 | NANOSTRUCTURE OPTOELECTRONIC DEVICE WITH INDEPENDENTLY CONTROLLABLE JUNCTIONS - Nanostructure array optoelectronic devices are disclosed. The optoelectronic device may have one or more intermediate electrical contacts that are physically and electrically connected to sidewalls of the array of nanostructures. The contacts may allow different photo-active regions of the optoelectronic device to be independently controlled. For example, one color light may be emitted or detected independently of another using the same group of one or more nanostructures. The optoelectronic device may be a pixilated device that may serve as an LED display or imaging sensor. The pixilated device may have an array of nanostructures with alternating rows and columns of sidewall electrical contacts at different layers. A pixel may be formed at the intersection of a row contact and a column contact. As one example, a single group of one or more nanostructures has a blue sub-pixel, a green sub-pixel, and a red sub-pixel. | 05-15-2014 |
20140141551 | APPARATUS FOR MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY - A manufacturing apparatus of an OLED display includes: a mounter to which a substrate that includes a display area coated with a liquid layer including a thermally curable material and a non-display area neighboring the display area is mounted; a separator disposed on the substrate while contacting the non-display area of the substrate, and a separation space that separates the liquid layer and the substrate; and a heater configured to apply heat to the liquid layer. | 05-22-2014 |
20140141552 | METHOD OF BONDING A SEMICONDUCTOR DEVICE TO A SUPPORT SUBSTRATE - A method according to embodiments of the invention includes providing a wafer of semiconductor devices grown on a growth substrate. The wafer of semiconductor devices has a first surface and a second surface opposite the first surface. The second surface is a surface of the growth substrate. The method further includes bonding the first surface to a first wafer and bonding the second surface to a second wafer. In some embodiments, the first and second wafer each have a different coefficient of thermal expansion than the growth substrate. In some embodiments, the second wafer may compensate for stress introduced to the wafer of semiconductor devices by the first wafer. | 05-22-2014 |
20140179041 | APPARATUS AND METHOD FOR MANUFACTURING THIN FILM ENCAPSULATION - An apparatus and method for manufacturing a thin film encapsulation includes: a first cluster configured to form a first inorganic layer on a display substrate using a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the display substrate using a monomer deposition process; and a third cluster configured to form a second inorganic layer on the first organic layer on the display substrate using a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process. | 06-26-2014 |
20140213004 | LIGHT-EMITTING DEVICE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING THE SAME - It is known that a light-emitting element utilizing organic EL deteriorates due to moisture. Therefore, a sealing technique to prevent moisture permeation is important. A light-emitting device including a light-emitting element utilizing organic EL is manufactured over a support substrate having flexibility and a high heat dissipation property (e.g., stainless steel or duralumin), and the light-emitting device is sealed with a stack body having moisture impermeability and a high light-transmitting property or with glass having moisture impermeability and a high light-transmitting property and having a thickness greater than or equal to 20 μm and less than or equal to 100 μm. | 07-31-2014 |
20140220718 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE HAVING A VOLTAGE STABILIZING MODULE CONSISTING OF TWO DOPING LAYERS - A method for manufacturing an LED (light emitting diode) package comprises following steps: providing an electrically insulated base, the base having a first surface and a second surface opposite thereto; an annular voltage stabilizing module is formed on the first surface; a first electrode is formed on the first surface, wherein the first electrode is attached to and encircled by the voltage stabilizing module; a second electrode is formed on the first surface, wherein the second electrode is attached to and encircles the voltage stabilizing module; an LED chip is mounted on the first electrode, wherein the LED chip is electrically connected to the first and second electrodes, and the LED chip and the voltage stabilizing module are connected in reverse parallel. Finally, an encapsulative layer is brought to encapsulate the LED chip. | 08-07-2014 |
20140256072 | Semiconductor Light Emitting Device Packages and Methods - A submount for a light emitting device package includes a substrate with a first bond pad and a second bond pad on a first surface. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are on the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. | 09-11-2014 |
20140287543 | ORGANIC LIGHT EMITTING DIODE DISPLAY - Disclosed is an organic light emitting diode (OLED) display comprising a substrate; an organic light emitting element disposed on the substrate; an encapsulation substrate disposed on the organic light emitting element; and an adhesive layer formed on the substrate, covering the organic light emitting element, and bonding the substrate on which the organic light emitting element is formed with the encapsulation substrate. | 09-25-2014 |
20140295594 | DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS - Discontinuous bonds for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a first substrate and a second substrate, with at least one of the first substrate and the second substrate having a plurality of solid-state transducers. The second substrate can include a plurality of projections and a plurality of intermediate regions and can be bonded to the first substrate with a discontinuous bond. Individual solid-state transducers can be disposed at least partially within corresponding intermediate regions and the discontinuous bond can include bonding material bonding the individual solid-state transducers to blind ends of corresponding intermediate regions. Associated methods and systems of discontinuous bonds for semiconductor devices are disclosed herein. | 10-02-2014 |
20140322842 | DONOR SUBSTRATE, METHOD OF MANUFACTURING DONOR SUBSTRATE, AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICE - Aspects of the present invention are directed toward donor substrate, method of manufacturing donor substrate, and method of manufacturing organic light-emitting display device. According to an embodiment of the present invention, a donor substrate includes a base layer which includes an element region and an encapsulation region surrounding the element region; a transfer assist layer which is disposed on the base layer and includes a first uneven portion disposed on the encapsulation region; and a transfer layer which is disposed on the transfer assist layer. The first uneven portion is formed on a surface of the transfer assist layer which contacts the transfer layer. | 10-30-2014 |
20140322843 | ANNEALING APPARATUS AND ANNEALING METHOD - The present disclosure relates to an annealing apparatus and an annealing method, which are applied to the packaging art of the AMOLED panel, wherein the annealing apparatus comprises an electromagnetic wave generator coupled with a plurality of irradiators and comprises a plate whose surface is provided with the irradiators and which is placed above or below the AMOLED panel for annealing it. The method comprises the following steps: annealing the AMOLED panel by an annealing apparatus which comprises an electromagnetic wave generator and a plate having lots of irradiators; when the irradiators aim at the annealing area, the annealing areas are annealed by the high frequency electromagnetic wave generated by the electromagnetic wave generator and irradiated from the irradiators. The present disclosure can save the time of the annealing process and can improve the process situation. Meanwhile, the present disclosure increases production yield and improves product quality. | 10-30-2014 |
20140356993 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a light-emitting device, comprises the steps of: providing a carrier; performing a coating step comprises coating a film on the carrier; performing a baking step comprises baking the film at a first temperature; and forming a thick film by repeating the coating step and the baking step a predetermined number of times. | 12-04-2014 |
20140370629 | Method of Manufacturing a Printable Composition of a Liquid or Gel Suspension of Diodes - An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary method of making a liquid or gel suspension of diodes comprises: adding a viscosity modifier to a plurality of diodes in a first solvent; and mixing the plurality of diodes, the first solvent and the viscosity modifier to form the liquid or gel suspension of the plurality of diodes. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns. | 12-18-2014 |
20150017751 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated. | 01-15-2015 |
20150031152 | METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - A method of manufacturing an organic light-emitting display apparatus includes: providing an organic light emission part on a substrate; providing a first inorganic layer including a first low temperature viscosity transition (“LVT”) inorganic material on the substrate to cover the organic light emission part; and adding fluoride into the first inorganic layer using a fluorine group material such that the first inorganic layer is converted into a second inorganic layer comprising a second low temperature viscosity transition inorganic material. | 01-29-2015 |
20150031153 | SPUTTERING TARGET, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING AN ORGANIC LIGHT EMITTING DISPLAY APPARATUS - A method of fabricating a sputtering target is provided. The method includes preparing a first powder material, wherein the first powder material includes tin oxide; preparing a mixture by mixing the first powder material and a second powder material, wherein the second powder material includes carbon; and fabricating the sputtering target by compressing and sintering the mixture simultaneously in a reducing atmosphere. | 01-29-2015 |
20150037916 | LOCAL SEAL FOR ENCAPSULATION OF ELECTRO-OPTICAL ELEMENT ON A FLEXIBLE SUBSTRATE - An electroluminescent display or lighting product incorporates a panel comprising a collection of distinct light-emitting elements formed on a substrate. A plurality of distinct local seals are formed over respective individual light-emitting elements or groups of light-emitting elements. Each local seal is formed by depositing a low melting temperature glass powder suspension or paste using inkjet technology, and fusing the glass powder using a scanning laser beam having a tailored beam profile. The local seal may be used in conjunction with a continuous thin film encapsulation structure. Optical functions can be provided by each local seal, including refraction, filtering, color shifting, and scattering. | 02-05-2015 |
20150050761 | LIGHT EMITTING DIODES AND A METHOD OF PACKAGING THE SAME - Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate. | 02-19-2015 |
20150064818 | METHODS OF MANUFACTURING OLED PIXEL AND DISPLAY DEVICE - A method of manufacturing an Organic Light Emitting Diode (OLED) pixel is disclosed. The method includes forming an anode and forming a pixel definition layer. The pixel definition layer includes a first sub-pixel area, a second sub-pixel area, a third sub-pixel area corresponding to the third sub-pixel, and a pixel spacing area. The first sub-pixel, the second sub-pixel and the third sub-pixel are separated from each other by the pixel spacing area. The method also includes coating a long-chain fatty acid ester layers on the pixel spacing area, the second sub-pixel area, and the third sub-pixel area, coating light emitting layers on the sub-pixel areas and on the long-chain fatty acid ester layers, and ashing the substrate and removing the long-chain fatty acid ester layers to form light emitting patterns. The method also includes forming a cathode. | 03-05-2015 |
20150064819 | METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY - A manufacturing method of an organic light emitting device may include the following. A panel displaying an image is formed. A buffering member including a dummy buffering member is adhered to the panel. A film is adhered to an upper surface of the buffering member. The film and the dummy buffering member are removed. | 03-05-2015 |
20150064820 | ORGANIC LIGHT EMITTING DIODE DISPLAY, MANUFACTURING METHOD AND MANUFACTURING EQUIPMENT THEREOF - A method for manufacturing an OLED display according to an exemplary embodiment comprises: forming a thermosetting adhesive layer having a getter receiving portion on a metal sheet; forming a display unit including a plurality of pixels on a substrate; forming a getter layer at an external side of the display unit on the substrate; adhering the thermosetting adhesive layer and the metal sheet to the substrate so as to locate the getter layer in the getter receiving unit; and hardening the thermosetting adhesive layer. The forming of the thermosetting adhesive layer includes layering a solid thermosetting adhesive sheet which has been patterned so as to have the getter receiving portion on the metal sheet. | 03-05-2015 |
20150072453 | VAPOR DEPOSITION APPARATUS, VAPOR DEPOSITION METHOD AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY APPARATUS - A vapor deposition apparatus for depositing thin films on a substrate includes a supply unit including a plurality of linear supply members configured to supply at least one gas; and a nozzle unit including a plurality of nozzle members connected to the plurality of supply members and configured to supply the at least one gas toward the substrate, wherein two adjacent nozzle members of the plurality of nozzle members are connected to at least one common supply member of the plurality of supply members. | 03-12-2015 |
20150072454 | METHOD FOR MANUFACTURING DISPLAY PANEL - A method of manufacturing a display panel is provided. A release layer is formed on a support substrate. A thin film substrate is formed on the release layer and the support substrate. A pixel and an encapsulation member are formed on a part of the thin film substrate. The part of the thin film substrate is overlapped with the release layer. The part of the thin film substrate is separated from the support substrate. The release layer includes siloxane and polyimide silane. | 03-12-2015 |
20150099320 | LIGHT-EMITTING DIODE ASSEMBLY AND FABRICATION METHOD THEREOF - Disclosed embodiments include a manufacturing method for an LED assembly. Providing a first carrier, wherein several LED chips are formed on the first carrier, and providing a second carrier. Attaching the second carrier to the LED chips and detaching the first carrier from the LED chips but leaving the LED chips on the second carrier. | 04-09-2015 |
20150111329 | TRANSFER-BONDING METHOD FOR LIGHT EMITTING DEVICES - A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and an interlayer sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The interlayers uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate. | 04-23-2015 |
20150125978 | Method For Increasing Heat Conductivity In Systems That Use High Power Density LEDs - There is provided a method for improving heat dissipation in systems that use LEDs with high power density mounted on a printed circuit board, the LEDs each being provided, on a face thereof, with a plurality of electrical contacts for connecting electrically the LEDs to conducting tracks made on the board, and with a heat dissipating element, the board including a substrate made of heat-conducting material, covered by a layer of electrically insulating material, on which the conducting tracks are made, the LEDs being mounted on the board in such a manner that the face with the heat dissipating element faces the layer of electrically insulating material, the method including the steps of removing the material of the electrically insulating layer at a contact zone between the heat dissipating element of each LED and the electrically insulating layer; and making a heat-conducting connection between the heat dissipating element and substrate. | 05-07-2015 |
20150140704 | CLEANING SOLUTION AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE SAME - A cleaning solution and a method for manufacturing a display device, the cleaning solution including about 2 wt % to about 12 wt % of nitric acid; about 0.5 wt % to about 15 wt % of an organic acid; about 0.1 wt % to about 10 wt % of a salt compound; about 0.01 wt % to about 3 wt % of an inorganic salt that includes fluorine; and a balance of water, all amounts being based on a total weight of the cleaning solution. | 05-21-2015 |
20150140705 | METHOD FOR MANUFACTURING DISPLAY PANEL - A method for manufacturing a display panel, including defining a desorbing area of a support substrate by forming one of a release layer or a recess portion in the desorbing area, cleaning a surface of the support substrate, disposing a thin film substrate on the support substrate, directly bonding, in an adsorbing area external to the desorbing area, the thin film substrate to the support substrate, forming a pixel and a sealing member on the thin film substrate, cutting the sealing member and the thin film substrate at a location that corresponds to the desorbing area, and separating the support substrate from the thin film substrate. | 05-21-2015 |
20150147834 | NOVEL SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS - The substrate with through silicon plugs (or vias) described above removes the need for conductive bumps. The process flow is very simple and cost efficient. The structures described combines the separate TSV, redistribution layer, and conductive bump structures into a single structure. By combining the separate structures, a low resistance electrical connection with high heat dissipation capability is created. In addition, the substrate with through silicon plugs (or vias, or trenches) also allows multiple chips to be packaged together. A through silicon trench can surround the one or more chips to provide protection against copper diffusing to neighboring devices during manufacturing. In addition, multiple chips with similar or different functions can be integrated on the TSV substrate. Through silicon plugs with different patterns can be used under a semiconductor chip(s) to improve heat dissipation and to resolve manufacturing concerns. | 05-28-2015 |
20150321387 | METHOD OF MANUFACTURING LIGHT EMITTING DEVICE - A novel method of producing an encapsulated light emitting device. A preferred mold release film that can be used during the encapsulation of a LED chip has an elastic modulus and a glass transition temperature that are low enough as compared to the desired molding temperature that the release film will closely conform to the interior of the molding cavities used to form a protective lens surrounding an LED chip. A preferred release film according to embodiments of the present invention comprises a fully fluorinated polymer, such as a perfluoroalkoxy polymer, including MFA, or fluorinated ethylene propylene. | 11-12-2015 |
20150340661 | METHOD OF MANUFACTURING A DISPLAY DEVICE - A method of manufacturing a display device includes preparing a multilayout display panel which has a structure of a first substrate and a second substrate which are bonded to each other and is able to be cut into a plurality of products, scribing the first substrate, bending and breaking the scribed first substrate, performing thinning on the second substrate and the broken first substrate by chemical polishing, scribing the second substrate which is subjected to chemical polishing, and bending and breaking the scribed second substrate. | 11-26-2015 |
20150349297 | OLED DISPLAY PANEL - An OLED display panel and manufacturing method of the panel are provided in which a terminal electrode is exposed by performing etching with fixed etching conditions without performing step processing. A terminal region comprised from a plurality of metal electrodes | 12-03-2015 |
20150357605 | METHOD FOR PRODUCING ORGANIC ELECTROLUMINESCENCE DEVICE - A method for producing an organic electroluminescence device using a roll-to-roll method includes the step of sticking a belt-shaped sealing substrate | 12-10-2015 |
20160005996 | DISPLAY APPARATUS AND THE SEALING METHOD THEREOF - This disclosure provides a display apparatus and the sealing method thereof. The display apparatus includes: a substrate having a displaying region and a non-displaying region surrounding the displaying region; and a frit disposed on the non-displaying region to form a closed loop which surrounds the displaying region and has both a start portion and an end portion not overlapping each other; wherein a first light beam is applied to the frit to sinter it along the loop in a first direction, and a second light beam is applied to the frit to sinter it along the loop in a second direction, starting at the start portion and ending up at the end portion; wherein, the second direction is different from the first direction. | 01-07-2016 |
20160064697 | DEPOSITION APPARATUS, METHOD OF FORMING THIN FILM BY USING THE SAME, AND METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS - A deposition apparatus includes a chamber, a support in the chamber, the support supporting a substrate, a deposition source in the chamber, the deposition source being above the support and emitting one or more deposition materials toward the substrate, a mask between the support and the deposition source, the mask including a deposition region having one or more openings, the one or more deposition materials passing through the one or more openings, and an edge region having a plurality of first slits, the edge region surrounding the deposition region, and a first coating layer on a first surface of the mask, the first surface of the mask facing the substrate. | 03-03-2016 |
20160071828 | METHOD OF MANUFACTURING LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE - A method of manufacturing a light emitting device includes: disposing a group of electrically conductive members on a support substrate, the group of the electrically conductive members forming a plurality of mounting portions arranged in two or more columns and two or more rows with the mounting portions respectively corresponding to a plurality of light emitting elements; placing the light emitting elements on the group of the electrically conductive members with a bonding member being disposed between the light emitting elements and the electrically conductive members, each of the light emitting elements being shifted from a corresponding one of the mounting portions; and melting the bonding member to mount the light emitting elements respectively on the mounting portions by self-alignment effect generated by the melting of the bonding member. | 03-10-2016 |
20160079565 | ORGANIC OPTOELECTRONIC DEVICE AND METHOD FOR THE ENCAPSULATION THEREOF - The invention relates to an organic optoelectronic device which is protected from ambient air by a sealed encapsulation structure of the type including at least one thin layer. The device includes a substrate; at least one light-emitting unit deposited on the substrate, incorporating internal electrodes and external electrodes defining an active zone and, between the electrodes, a stack of organic films; and a sealed encapsulation structure having one or more thin layers including at least one inorganic layer placed on top of the light-emitting unit and encasing same laterally. The device also includes a pre-encapsulation structure located between the external electrode and the encapsulation structure and which includes a buffer layer covering the external electrode and contains a heterocyclic organometallic complex having a glass transition temperature above 80° C., and a barrier layer covering the buffer layer and contains a silicon oxide SiOx, wherein x is 003-17-2016 | |
20160087182 | Surface-Mountable Optoelectronic Component and Method for Producing a Surface-Mountable Optoelectronic Component - A surface-mountable optoelectronic component has a radiation passage face, an optoelectronic semiconductor chip and a chip carrier. A cavity is formed in the chip carrier and the semiconductor chip is arranged in the cavity. A molding surrounds the chip carrier at least in places. The chip carrier extends completely through the molding in a vertical direction perpendicular to the radiation passage face. | 03-24-2016 |
20160099235 | METHOD OF MANUFACTURING A SINGLE LIGHT-EMITTING STRUCTURE - The instant disclosure provides a light-emitting module and a method of manufacturing a single light-emitting structure. The light-emitting module includes two identical light-emitting structures disposed on the same plane. One of the two light-emitting structures disposed on the plane is rotated by 180 degrees relative to the other light-emitting structure, and the two light-emitting structures are connected to each other. Each light-emitting structure includes a base, a conducting element, a light-emitting element and an encapsulation element. The conducting element includes a plurality of conductors separated from each other and passing through the base body, where the number of the conductors is N and N>1. The light-emitting element includes at least one light-emitting chip electrically connected between at least two of the conductors. The encapsulation element includes a transparent encapsulation body disposed on the base to cover the conducting element and the light-emitting element. | 04-07-2016 |
20160111408 | LIGHT EMITTING DIODES AND A METHOD OF PACKAGING THE SAME - Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate. | 04-21-2016 |
20160111680 | APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS - An apparatus for manufacturing a display apparatus includes a stage supporting a substrate, a deposition gas supplying unit above the substrate, the deposition gas supplying unit spraying a deposition gas onto the substrate, and a first mask between the stage and the deposition gas supplying unit, the first mask including at least two first openings through which the deposition gas selectively passes. | 04-21-2016 |
20160126491 | Method for Producing an Optical Module - The invention relates to a method for producing an optical module, comprising the following steps: a) providing a chip having an optical element integrated in the chip, wherein the optical element bas a first electrode and a second electrode, and wherein the chip has a first connection contact for the first electrode and a second connection contact for the second electrode, such that an operating voltage for the optical element can be applied between the first connection contact and the second connection contact, and wherein the chip has an optically active side, which is designed to emit and/or to receive radiation; b) connecting the chip to a film, such that the film completely covers the optically active side of the chip, wherein the film is a film made from acrylate, polyarylate, or polyurethane, wherein the film, at least in the region located above the optically active side, is transparent to radiation which. when operating voltage is applied, can be emitted or received by the optical element; c) contacting the first connection contact of the chip by means of a conducting track arranged on the film and contacting the second connection contact by means of an additional conducting track. | 05-05-2016 |
20160133870 | Sintering Method and Display Device Packaging Method using the Same - A sintering method includes defining a closed pattern having at least one arcuate section. A substance is applied on a substrate along the closed pattern and is sintered along the closed pattern in a first rectilinear direction. The sintering is finished in a second rectilinear direction along the closed pattern. A display device packaging method includes defining a closed pattern having at least one arcuate section. Frit is applied on a substrate of a display device along the closed pattern. A cover plate is provided on the substrate. The frit is sintered along the closed pattern. The sintering is finished in a second rectilinear direction. Then, the cover plate and the substrate of the display device are packaged. | 05-12-2016 |
20160133881 | Nozzle-Droplet Combination Techniques to Deposit Fluids in Substrate Locations within Precise Tolerances - An ink printing process employs per-nozzle droplet volume measurement and processing software that plans droplet combinations to reach specific aggregate ink fills per target region, guaranteeing compliance with minimum and maximum ink fills set by specification. In various embodiments, different droplet combinations are produced through different print head/substrate scan offsets, offsets between print heads, the use of different nozzle drive waveforms, and/or other techniques. Optionally, patterns of fill variation can be introduced so as to mitigate observable line effects in a finished display device. The disclosed techniques have many other possible applications. | 05-12-2016 |
20160141557 | METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DIODE (OLED) DISPLAY - A method of manufacturing an organic light-emitting diode (OLED) display is disclosed. In one aspect, the method includes forming an OLED over a first substrate and forming a sealing member over the first substrate or a second substrate opposite to the first substrate, to at least partially surround the OLED, wherein a plurality of holes are defined in a first region of the sealing member. The method further includes aligning the first and second substrates with the sealing member interposed therebetween and irradiating a laser beam along a path of the sealing member. | 05-19-2016 |
20160155906 | METHOD FOR TRANSFERRING LIGHT-EMITTING ELEMENTS ONTO A PACKAGE SUBSTRATE | 06-02-2016 |
20160164043 | METHODS FOR FABRICATING OLEDs - Systems and methods for fabricating an OLED are provided, which include dispensing a substrate material onto a substrate carrier, the substrate carrier being rotated by one or more drums, curing the substrate material to form a substrate, depositing at least one OLED onto the substrate, and separating the substrate from the substrate carrier. | 06-09-2016 |
20160164044 | MANUFACTURING METHOD OF ORGANIC LIGHT EMITTING DIODE DISPLAY - A manufacturing method of an organic light emitting diode display includes: setting, on a mother substrate, a plurality of panel areas of which boundary lines contact each other in a row direction and a column direction; forming a plurality of display units in the plurality of panel areas, respectively; forming a plurality of thin film encapsulations on the plurality of display units, respectively; and cutting the mother substrate along the boundary lines to divide the mother substrate into a plurality of display panels. Forming of the plurality of thin film encapsulations includes forming the thin film encapsulations in panel areas positioned in a first column among the plurality of panel areas and forming the plurality of thin film encapsulations in panel areas positioned in a second column adjacent to the first column. | 06-09-2016 |
20160164048 | DISPLAY PANEL INCLUDING MULTILAYER DIFFERSION BARRIER - Disclosed is a display panel including: a flexible substrate; a buffer layer disposed on the flexible substrate; a pixel disposed on the buffer layer and comprising a thin film transistor and an image device connected to the thin film transistor; a barrier layer disposed on the flexible substrate to protect the pixel from a substance from the flexible substrate; and a diffusion prevention layer disposed between the barrier layer and the buffer layer and configured to prevent hydrogen generated from the barrier layer from being diffused into the thin film transistor. | 06-09-2016 |
20160190404 | Manufacturing method of light-emitting device - A method of manufacturing a light-emitting device includes forming a separation layer on an upper surface of a supporting substrate; forming a plurality of external electrode layers on the separation layer; mounting a plurality of light-emitting elements on the external electrode layers; forming a plurality of resin layers between the supporting substrate and each of the light-emitting elements after mounting the light-emitting elements, the resin layers being formed such that the resin layers are separated from one another, and each resin layer underlies at least one light-emitting element; and applying laser light to the separation layer from a lower surface side of the supporting substrate, and separating the supporting substrate and the light-emitting elements from each other. | 06-30-2016 |
20160197312 | ELEMENT MANUFACTURING METHOD AND ELEMENT MANUFACTURING APPARATUS | 07-07-2016 |
20160380165 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING SAME - A light-emitting device includes a substrate; a light-emitting element mounted on the substrate; a first light-transmissive member bonded to an upper surface of the light-emitting element via an adhesive; and a second light-transmissive member placed on an upper surface of the first light-transmissive member. In a plan view of the light-emitting device, a peripheral edge of a lower surface of the first light-transmissive member is positioned more inward than a peripheral edge of the upper surface of the light-emitting element. The adhesive extends from the upper surface of the light-emitting element to a lower surface of the second light-transmissive member, the adhesive covers a side surface of the first light-transmissive member, and the adhesive is separated from the substrate. | 12-29-2016 |
20160380202 | Mask Plate, Method for Packaging OLED Device and OLED Device - A mask plate, a method for packaging an OLED device and an OLED device are disclosed, the mask plate includes at least one opening for forming a pattern of a package layer; the side of the mask plate close to the OLED device to be packaged has an etching layer which is used to etch the material of a package layer. | 12-29-2016 |
20180026191 | ORGANIC LIGHT EMITTING DIODE DISPLAY | 01-25-2018 |