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Having additional optical element (e.g., optical fiber, etc.)

Subclass of:

438 - Semiconductor device manufacturing: process

438022000 - MAKING DEVICE OR CIRCUIT EMISSIVE OF NONELECTRICAL SIGNAL

438026000 - Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor

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DocumentTitleDate
20130045550PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate 02-21-2013
20130045549CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate.02-21-2013
20110177635LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A light emitting device includes: a substrate having a concave portion formed on a surface thereof; a light emitting element emitting a first light which is a blue light or a near-ultraviolet light; a resin sheet being a deformable resin sheet formed on the substrate so as to cover the light emitting element; a first transmissive layer formed in a hemispherical shape on the first region of the resin sheet, and transmitting the first light; a color conversion layer including a fluorescent material that converts the first light into a second light of a different wavelength from that of the first light and a transmissive material that transmits the first light, the color conversion layer covering the first transmissive layer in such a manner that an end portion reaches an upper face of the resin sheet; and a second transmissive layer covering the color conversion layer in such a manner that an end portion reaches the upper face of the resin sheet, and transmitting the first light and the second light.07-21-2011
20080261339PACKAGING METHOD TO MANUFACTURE PACKAGE FOR A HIGH-POWER LIGHT EMITTING DIODE - A packaging method to manufacture a package for a high-power light emitting diode (LED) has steps of (a) obtaining a metal board, (b) treating the metal board, (c) molding a cell matrix with multiple reflective bases, (d) attaching LED chips onto the dissipating boards and bonding conductive wires in each corresponding reflective base of the cell matrix, (e) encapsulating the LED chips and conductive wires in the reflective base of the cell matrix to form a after-packaging board and (f) cutting off the after-packaging board to form multiple individual high-power LED packages. Most heat from the LED chips is conducted via the dissipating board thereby improving thermal conduction efficiency and allowing more powerful and numerous LED chips to operate per package so increasing applications of LEDs. Therefore, the present invention provides different pass ways for conducting heat and electricity to improve heat conduction of the LED.10-23-2008
20110195533METHOD OF MANUFACTURING ORGANIC LIGHTING DEVICE - A method of manufacturing an organic lighting device, having a form factor substantially equal to or less than 900 square centimeters, without involving a cutting process is provided. The method includes providing one or more first substrates with a size substantially equal to the form factor. Thereafter, the method includes a high throughput first processing of the one or more first substrates and active layer deposition processing on the one or more first substrates. Further, one or more second substrates having a size substantially equal or less than the form factor are provided. Thereafter, a high throughput second processing is performed on the one or more second substrates. Finally, the method includes encapsulating at least one of the one or more first substrates with at least one of the one or more second substrates to form the organic lighting device having the form factor.08-11-2011
20110195532Solid State Light Sheet for General Illumination - A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare blue-light LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. In one embodiment, an intermediate sheet having holes is then affixed to the bottom substrate, with the LEDs passing through the holes. A transparent top substrate having conductors is then laminated over the intermediate sheet. In another embodiment, no intermediate sheet is used. Various ways to connect the LEDs in series are described along with many embodiments. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture. A phosphor is used to generate white light.08-11-2011
20100047939SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE - In a semiconductor light emitting device, light is lost from a side surface of a substrate; therefore, if a substrate side surface occupies a large area, it decreases light extraction efficiency. The area of the substrate side surface may be reduced by reducing a thickness of the substrate. However, a thin substrate has low mechanical strength and is cracked by a stress during work process, and that decreases the yield.02-25-2010
20130034920MANUFACTURING METHOD OF LED PACKAGE STRUCTURE - A method for manufacturing a plurality of holders each being for an LED package structure includes steps: providing a base, pluralities of through holes being defined in the base to divide the base into a plurality of basic units; etching the base to form a dam at an upper surface of each of the basic units of the base; forming a first electrical portion and a second electrical portion on each basic unit of the base, the first electrical portion and the second electrical portion being separated and insulated from each other by the dam; providing a plurality of reflective cups each on a corresponding basic unit of the base, each of the reflective cups surrounding the corresponding dam; and cutting the base into the plurality of basic units along the through holes to form the plurality of holders.02-07-2013
20130034921SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a semiconductor light-emitting device includes forming a multilayer body including a first semiconductor layer having a first major surface and a second major surface which is an opposite side from the first major surface, a second semiconductor layer including a light-emitting layer laminated on the second major surface of the first semiconductor layer, and electrodes formed on the second major surface of the first semiconductor layer and on a surface of the second semiconductor layer on an opposite side from the first semiconductor layer. The method includes forming a groove through the first semiconductor layer. The method includes forming a phosphor layer on the first major surface and on a side surface of the first semiconductor layer in the groove.02-07-2013
20130210179PRINTING PHOSPHOR ON LED WAFER USING DRY FILM LITHOGRAPHY - A method for depositing a layer of phosphor-containing material on a plurality of LED (light-emitting diode) dies on a wafer includes disposing a layer of dry photoresist film over a plurality of LED dies on a wafer, disposing a mask layer over the dry photoresist film, and patterning the dry photoresist film to form a plurality of openings in the dry photoresist film to expose a top surface of each of the LED dies. The method also includes depositing a phosphor-containing material on the exposed top surface of each the LED dies using a screen printing process, and removing the patterned dry photoresist film.08-15-2013
20100099207LED chip package structure with high-efficiency light-emitting effect and method of packaging the same - An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.04-22-2010
20100178719Diamond LED Devices and Associated Methods - LED devices incorporating diamond materials and methods for making such devices are provided. One such method may include forming epitaxially a substantially single cyrstal SiC layer on a substantially single crystal Si wafer, forming epitaxially a substantially single crystal diamond layer on the SiC layer, doping the diamond layer to form a conductive diamond layer, removing the Si wafer to expose the SiC layer opposite to the conductive diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer such that at least one of the semiconductive layers contacts the SiC layer, and coupling an n-type electrode to at least one of the semiconductor layers such that the plurality of semiconductor layers is functionally located between the conductive diamond layer and the n-type electrode.07-15-2010
20090155938LIGHT EMITTING DIODE PACKAGE WITH DIFFUSER AND METHOD OF MANUFACTURING THE SAME - The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.06-18-2009
20100105156METHOD OF MANUFACTURING LIGHT-EMITTING DIODE PACKAGE - A method of manufacturing a light-emitting diode package, including following steps: providing a mounting base; providing a light-emitting chip on the mounting base, and the light-emitting chip including at least one electrode on the top surface thereof; forming a fluorescent layer on the top surface of the light-emitting chip, and the fluorescent layer covering the electrode; providing a laser generator to emit a focused laser beam to remove a portion of the fluorescent layer covered on the light-emitting chip to form a through-hole; providing a conductive wire to electrically connect the electrode of the light-emitting chip via the through-hole to the mounting base. The conductive wire can then be electrically connecting the electrode to the mounting base via the through-hole. Therefore, the thickness of fluorescent layer around the metal wire would be evenly formed, resulting better uniformity of white light mixing of the light-emitting diode package.04-29-2010
20130029438METHOD FOR MANUFACTURING WAFER-BONDED SEMICONDUCTOR DEVICE - The invention provides a wafer-bonded semiconductor device wherein warpage generated when wafers are bonded is reduced at a low cost ad through a simple process.01-31-2013
20130029439METHOD OF MANUFACTURING LIGHT EMITTING DEVICE - There is provided a method of manufacturing a light emitting device, the method including: mounting a plurality of light emitting devices on an adhesive layer; arranging upper surfaces of the plurality of light emitting devices to be disposed horizontally using a pressing member; forming a wavelength conversion part covering the plurality of light emitting devices on the adhesive layer by applying a resin including at least one phosphor material; planarizing an upper surface of the wavelength conversion part using the pressing member; and separating the adhesive layer from the plurality of light emitting devices.01-31-2013
20080293173White Multi-Wavelength LED and Its Manufacturing Process - A white multi-wavelength LED and its manufacturing process has bonded at the bottom of a light emitting chip in a given color a first non-conductive material containing phosphor in a corresponding color to that of the chip to become a die unit; the first non-conductive material functioning as the position where the die unit is bonded to a carrier; golden plated wire constituting the circuit connection of the chip; a second non-conductive material containing phosphor in a color corresponding to that of the chip being injected to cover up the top of the chip to emit the expected white light and effectively promote the luminance performance of the LED.11-27-2008
20130137201SOLID STATE LED BRIDGE RECTIFIER LIGHT ENGINE - A method of forming a light emitting diode (LED) for a solid state light engine includes depositing a layer of tacky resin onto a die portion of the LED, adhering a plurality of phosphor particles to the tacky resin, and encapsulating the layer of tacky resin and the plurality of phosphor particles in another layer of resin.05-30-2013
20090305444Liquid crystal display device and method for fabricating the same - A liquid crystal display device includes a first substrate having a step difference part; a second substrate facing the first substrate; a column spacer between the first substrate and the second substrate, a contact surface of the column spacer with the step difference part of the first substrate including a plurality of protrusions; and a liquid crystal layer between the first substrate and the second substrate.12-10-2009
20130164869PRODUCING METHOD OF LIGHT EMITTING DIODE DEVICE - A method for producing a light emitting diode device includes the steps of preparing a board mounted with a light emitting diode; preparing a hemispherical lens molding die; preparing a light emitting diode encapsulating material which includes a light emitting diode encapsulating layer and a phosphor layer laminated thereon, and in which both layers are prepared from a resin before final curing; and disposing the light emitting diode encapsulating material between the board and the lens molding die so that the phosphor layer is opposed to the lens molding die to be compressively molded, so that the light emitting diode is directly encapsulated by the hemispherical light emitting diode encapsulating layer and the phosphor layer is disposed on the hemispherical surface thereof.06-27-2013
20120309119VACUUM TRAY AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE USING THE SAME - There is provided a vacuum tray including a pocket part; a seating part being stepped downwardly from a bottom surface of the pocket part and having a light emitting device seated therein; and a cavity part being stepped downwardly from edges of the seating part and having an electrode terminal of the light emitting device accommodated therein. The pocket part may include a plurality of pocket parts having a matrix structure, such that the plurality of pocket parts are arranged in columns and rows.12-06-2012
20110014733OPTICAL INTERCONNECT DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optical interconnect device includes a first substrate, a second substrate, an optical waveguide, an electrical wiring and a switching device. The first substrate has an electrical wiring circuit, an electrical-optical converter for converting an electrical signal to an optical signal, and a light emitting device for emitting a light. The second substrate has an electrical wiring circuit, an optical-electrical converter for converting the optical signal to the electrical signal, and a light receiving device for receiving the light from the light emitted device. The optical waveguide optically connects the light emitting and light receiving devices. The electrical wiring electrically connects the electrical wiring circuits of the first and second substrates. The switching device determines a fast signal of data to be transmitted via the optical substrate and a slow signal of data to be transmitted via the electrical wiring.01-20-2011
20110014732LIGHT-EMITTING MODULE FABRICATION METHOD - A light-emitting module fabrication method includes the steps of (a) forming component contacts and positive-bonding and negative-bonding contacts on a circuit layout on a substrate, (b) electrically bonding the pins of electronic components to the component contacts and P-electrode bonding pads and N-electrode bonding pads of light-emitting chips to the positive-bonding and negative-bonding contacts at the substrate, (c) employing a coating technique to cover light-emitting surfaces of each of the light-emitting chips with a respective phosphor layer, and (d) employing a curing technique to cure the phosphor layers.01-20-2011
20120225509LED Flip-Chip Package Structure with Dummy Bumps - A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip.09-06-2012
20120225508PACKAGE SUBSTRATE FOR PTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.09-06-2012
20120225507SUSPENSIONS FOR PROTECTING SEMICONDUCTOR MATERIALS AND METHODS FOR PRODUCING SEMICONDUCTOR BODIES - A suspension for protecting a semiconductor material includes a polymeric matrix as carrier medium, inorganic particles, and at least one of an absorber dye or a plasticizer.09-06-2012
20130183777METHOD OF FORMING PHOSPHOR LAYER ON LIGHT-EMITTING DEVICE CHIP WAFER USING WAFER LEVEL MOLD - A method of forming a phosphor layer of light-emitting device chip wafer by using a wafer level mold includes clamping a wafer having a plurality of light-emitting device chips between a lower mold and an upper mold to form a space between the wafer and the upper mold, forming a phosphor layer on the wafer by injecting a phosphor liquid into the space, and releasing the wafer from the lower mold and the upper mold.07-18-2013
20130183778METHOD FOR PRODUCING INTEGRATED OPTICAL DEVICE - A method for producing an integrated optical device includes the steps of growing a first stacked semiconductor layer including a first optical waveguiding layer, a first cladding layer, and a side-etching layer; etching the first stacked semiconductor layer through a first etching mask; growing, a second stacked semiconductor layer including a second optical waveguiding layer and a second cladding layer through the first etching mask; and forming a reverse-mesa ridge structure by etching the first and second cladding layers. The step of etching the first stacked semiconductor layer includes a step of forming an overhang by etching the side-etching layer by wet etching. In the step of growing the second stacked semiconductor layer, the second cladding layer is grown at a lower growth temperature and a higher V/III ratio comparing to those in the growth of the second optical waveguiding layer.07-18-2013
20130065332METHOD FOR MANUFACTURING LED WITH AN ENCAPSULANT HAVING A FLAT TOP FACE - A method for manufacturing LEDs is disclosed. A base is firstly provided. The base includes a plate, sidewalls formed on the plate and pairs of leads connected to the plate. The sidewalls enclose cavities above the plate. Light emitting chips are fixed in the cavities and electrically connected to the leads, respectively. Encapsulants are formed in the cavities to seal the light emitting chips. Each encapsulant has a convex top face protruding beyond top faces of the sidewalls. The convex top faces of the encapsulants are grinded to become flat. Finally, the base is cut to form individual LEDs.03-14-2013
20110020967LED CHIP PACKAGE STRUCTURE WITH HIGH-EFFICIENCY LIGHT EMISSION BY ROUGH SURFACES AND METHOD OF MAKING THE SAME - An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.01-27-2011
20090246900Shaped Articles Comprising Semiconductor Nanocrystals and Methods of Making and Using Same - A shaped article comprising a plurality of semiconductor nanocrystals. Devices incorporating shaped articles are also provided. Methods of manufacturing shaped articles by various molding processes are also provided.10-01-2009
20110045618FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES - A wafer-level method of fabricating an opto-electronic component package, in which the opto-electronic component is mounted to a semiconductor wafer having first and second surfaces on opposite sides of the wafer. The method includes etching vias in the first surface of the semiconductor wafer. The first surface and surfaces in the vias are metallized, and the metal is structured to define a thermal pad and to define the anode and cathode contact pads. A carrier wafer is attached on the side of the semiconductor wafer having the first surface, and the semiconductor wafer is thinned from its second surface to expose the metallization in the vias. Metal is provided on the second surface, and the metal is structured to define a die attach pad and additional anode and cathode pads for the opto-electronic component. The opto-electronic component is mounted on the die attach pad and a protective cover is formed over the opto-electronic component.02-24-2011
20130164868METHOD FOR PACKAGING LIGHT EMITTING DIODE HAVING FLUORESCENT MATERIAL DIRECTLY COATED ON LED DIE THEREOF - A method for packaging an LED, includes steps: providing a substrate; arranging an LED die on the substrate; forming a photoresist layer on the substrate to cover the LED die; arranging a mask directly on the photoresist layer; exposing the photoresist layer with the mask to a radiation source; removing the mask and the unexposed portion of the photoresist layer formerly sheltered by the mask, thereby leaving the exposed portion of the photoresist layer formerly unsheltered by the mask on the substrate, wherein the remained exposed portion of the photoresist layer surrounds the LED die; spraying fluorescent material toward the LED die surrounded by the remained exposed portion of the photoresist layer; removing the remained exposed portion of the photoresist layer; and finally encapsulating the LED die covered by the fluorescent material.06-27-2013
20110027922SEMICONDUCTOR LIGHT EMITTING DEVICE MANUFACTURE METHOD - A semiconductor light emitting device manufacture method is provided which can manufacture a semiconductor light emitting device of high quality. A first substrate of an n-type ZnO substrate is prepared. A lamination structure including an optical emission layer made of ZnO based compound semiconductor is formed on the first substrate. A p-side conductive layer is formed on the lamination structure. A first eutectic material layer made of eutectic material is formed on the p-side conductive layer. A second eutectic material layer made of eutectic material is formed on a second substrate. The first and second eutectic material layers are eutectic-bonded to couple the first and second substrates. After the first substrate is optionally thinned, an n-side electrode is formed on a partial surface of the first substrate.02-03-2011
20120034716METHOD FOR MANUFACTURING LIGHT EMITTING DIODE - A method for manufacturing a light emitting diode includes steps: providing a base having leads formed thereon; fixing a light emitting die on the leads; disposing a glass encapsulant on the base; co-firing the encapsulant with the base to fix them together. The base is made of silicon or ceramic. The encapsulant has a cover covering the light emitting die received in a groove of the base and a positioning plate fittingly engaging into the groove in one embodiment. The encapsulant has a cavity receiving the light emitting die to cover the light emitting die fixed on a top face of the base in another embodiment. Various mechanisms are used to protect the light emitting die during co-firing of the encapsulant and the base.02-09-2012
20110300650LIGHT-EMITTING DIODE APPARATUS AND MANUFACTURING METHOD THEREOF - A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.12-08-2011
20120107977POLARIZED LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a polarized light emitting diode (LED) device and the method for manufacturing the same, in which the LED device comprises: a base, a light emitting diode (LED) chip, a polarizing waveguide and a packaging material. In an exemplary embodiment, the LED chip is disposed on the base and is configured with a first light-emitting surface for outputting light therefrom; and the waveguide, being comprised of a polarization layer, a reflection layer, a conversion layer and a light transmitting layer, is disposed at the optical path of the light emitted from the LED chip; and the packaging material is used for packaging the waveguide, the LED chip and the base into a package.05-03-2012
20120003765LED CHIP PACKAGE STRUCTURE USING SEDIMENTATION AND METHOD FOR MAKING THE SAME - An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.01-05-2012
20110294242FLIP-CHIP GAN LED FABRICATION METHOD - A flip-chip LED fabrication method includes the steps of (a) providing a GaN epitaxial wafer, (b) forming a first groove in the GaN epitaxial layer, (c) forming a second groove in the GaN epitaxial layer to expose a part of the N-type GaN ohmic contact layer of the GaN epitaxial layer, (d) forming a translucent conducting layer on the epitaxial layer, (e) forming a P-type electrode pad and an N-type electrode pad on the translucent conducting layer, (f) forming a first isolation protection layer on the P-type electrode pad, the N-type electrode pad, the first groove and the second groove, (g) forming a metallic reflection layer on the first isolation protection layer, (h) forming a second isolation protection layer on the first isolation protection layer and the metallic reflection layer, (i) forming a third groove to expose one lateral side of the N-type electrode pad, (j) separating the processed GaN epitaxial wafer into individual GaN LED chips, and (k) bonding at least one individual GaN LED chip thus obtained to a thermal substrate with a conducting material.12-01-2011
20110217800METHOD FOR FORMING A LIGHT CONVERSION MATERIAL - A method and system for manufacturing a light conversion structure for a light emitting diode (LED) is disclosed. The method includes forming a transparent, thermally insulating cover over an LED chip. The method also includes dispensing a conversion material onto the cover to form a conversion coating on the cover, and encapsulating the LED, the silicone cover, and the conversion coating within an encapsulant. Additional covers and conversion coatings can be added.09-08-2011
20080311689SECURING A TRANSISTOR OUTLINE CAN WITHIN AN OPTICAL COMPONENT - The present invention relates to affixing components of optical packages. The optical packages can include an optical component, such as a TO-Can. The TO-Can can house an optical transmitter and/or an optical receiver. Another optical component of the optical package can be a barrel for aligning the TO-Can with an optical fiber. The TO-Can can be affixed within an open end of the optical barrel using a bonding substance, such as an epoxy, that has wicking properties. The wicking properties cause the bonding substance to enter a gap between the optical barrel and the TO-Can by capillary action. Use of the bonding substance with wicking properties creates a more robust optical package in a cost effective manner.12-18-2008
20110263055IN-PLANE SWITCHING MODE LIQUID CRYSTAL DISPLAY DEVICE - An in-plane switching mode liquid crystal display device includes first and second substrates facing each other, a gate line and a data line arranged on the first substrate crossing each other and defining a pixel region, a switching device at a crossing of the gate line and the data line, a common electrode and a pixel electrode alternately disposed in the pixel region, at least one of the common electrode and the pixel electrode including a multi-layer having a conductor layer and a reflectance reducing layer, and a liquid crystal layer formed between the first and second substrates.10-27-2011
20120107976LED PACKAGE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to light emitting diode (LED) packages and methods of manufacturing the same, and more particularly, to an LED package and a method of manufacturing the same that can reduce a variation of color coordinates of mass-produced LED packages.05-03-2012
20120107975METHOD FOR PACKAGING LIGHT EMITTING DIODE - An LED packaging method includes: providing a mold with two isolated receiving spaces and a substrate with a die supporting portion and an electrode portion respectively received in the two receiving spaces; disposing an LED die on the die supporting portion and electrically connecting the LED die to the electrode portion of the substrate by metal wires; injecting a light wavelength converting material into the first receiving space and covering the LED die with the light wavelength converting material; communicating the first receiving space to the second receiving space, injecting a first light transmissive material into the communicated first and second spaces, and covering the light wavelength converting material and the metal wires with the first light transmissive material; and removing the mold to obtain a packaged LED.05-03-2012
20120107974MANUFACTURING LIGHT EMITTING DIODE (LED) PACKAGES - A method of manufacturing an LED package includes mounting a large panel frame/substrate (LPF/S) having a substantially square shape to a ring. The LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. Each of the die pads includes a planar chip attach surface. An LED chip is attached to the planar chip attach surface of each of the die pads. An encapsulant material is applied overlaying the LED chips and at least a part of the LPF/S. Each die pad and corresponding leads are separated from the LPF/S to form individual LED packages. The steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring.05-03-2012
20100112734APPARATUS AND METHOD FOR MANUFACTURING LED DEVICE - A method for manufacturing an LED device, includes: mounting an LED chip, which emits a first light, on a bottom surface of a recess formed in an upper surface of a package, pouring a resin liquid containing phosphor particles, which emits a second light upon incidence of the first light, into the recess, fixing the package to a package fixing plate of an apparatus of the LED device, precipitating the phosphor particles in the resin liquid with a centrifugal force applying to the package in a direction from the upper surface to the lower surface of the package by rotating a rotary member with a rotary driving unit, and curing the resin liquid.05-06-2010
20100120181INK COMPOSITION AND METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME - Disclosed are an ink composition and a method for fabricating a liquid crystal display (LCD) device using the same, wherein in forming patterns of the LCD device using an imprint lithography and a roll printing, an ink composition with high thermal resistance, consisting of polymer resin and additive both endurable even at a high temperature is used to form fine patterns with constantly maintaining pattern linewidths and line intervals, the ink composition consisting of 5-45% by weight of polymer resin, 5-45% by weight of additive added to retain thermal stability, and 50-90% by weight of organic solvent, wherein the ink composition is endurable even at a high temperature of 90-250° C.05-13-2010
20120034718VERTICAL DEEP ULTRAVIOLET LIGHT EMITTING DIODES - A vertical geometry light emitting diode with a strain relieved superlattice layer on a substrate comprising doped Al02-09-2012
20100120182MANUFACTURING METHOD OF LIGHT EMITTING DIODE PACKAGE - The invention provides a side-view LED having an LED window opened to a side to emit light sideward. A pair of lead frames each act as a terminal. An LED chip is attached to a portion of the lead frame and electrically connected thereto. A package body houses the lead frames and has a concave formed around the LED chip. Also, a high reflective metal layer is formed integrally on a wall of the concave. A transparent encapsulant is filled in the concave to encapsulate the LED chip, while forming the LED window. In addition, an insulating layer is formed on a predetermined area of the lead frames so that the lead frames are insulated from the high reflective metal layer. The side-view LED of the invention enhances light efficiency and heat release efficiency with an improved side-wall reflection structure.05-13-2010
20090239318Glass-coated light-emitting element, light-emitting element-attached wiring board, method for producing light-emitting element-attached wiring board, lighting device and projector - A glass-coated light-emitting element 09-24-2009
20120142127LIGHT EMITTING DIODE PACKAGE WITH A PHOSPHOR SUBSTRATE - Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.06-07-2012
20100081220METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE - The present invention relates to a light-emitting diode (LED) and a method for manufacturing the same. The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.04-01-2010
20090162957Mold for forming molding member and method of manufacturing LED package using the same - Provided is a method of manufacturing a light emitting diode (LED) package, the method including the steps of: preparing a package substrate having an LED chip mounted thereon; preparing a mold which has a convex portion, a plane portion extending outward from the convex portion, and a projecting portion formed on the lower surface of the plane portion, the projecting portion having a sharp end; engaging the mold with the package substrate such that the projecting portion is contacted with the surface of the package substrate; and filling transparent resin into the convex portion.06-25-2009
20100099208SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor light emitting device can include a casing having a concave-shaped cavity with an opening, a semiconductor light emitting element installed in a bottom portion of the cavity, and a resin layer for filling an interior of the cavity. The resin layer can include a wavelength conversion material, and can be formed in a convex shape in a light radiation direction of the light emitting element. In the resin layer a layer with a high density of the wavelength conversion material can be formed near a surface of the convex shape04-22-2010
20130217159METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.08-22-2013
20110171761METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE WITH FLUORESCENT LAYER - A method of manufacturing a light-emitting device includes disposing a light-emitting element on a supporting member, dispersing a fluorescent substance having a particle diameter of 20 to 45 μm in a material of the light-transmitting member at a concentration of 40 to 60 wt %, dripping raw material for the fluorescent layer on the light-emitting element while lowering the viscosity of the raw material, and thermally curing the coated layer.07-14-2011
20110171762Phosphor-Converted LED - A light source and method for fabricating the same are disclosed. The light source includes a die, a light conversion component, and a scattering ring. The die emits light of a first wavelength through a top surface of the die and one or more side surfaces of the die, and is bonded to a mounting substrate. The light conversion component converts light of the first wavelength to light of a second wavelength, the light conversion component having a bottom surface bonded to the top surface of the die. The light conversion component has lateral dimensions such that a space exists around the die, the space being bounded by the substrate and the light conversion component. The scattering ring is positioned in the space such that a portion of the light emitted from the side surfaces of the die is scattered into the light conversion component.07-14-2011
20080293172Method for manufacturing light emitting diode devices - A method for manufacturing LED devices is disclosed to manufacture vertical LED devices without removing nonconductive substrates. A conductive substrate is formed on the LED epitaxial layer of the nonconductive substrate to form a LED wafer by bonding or electroplating, which is further cut into a plurality of LED sticks with each space layer bonded between every two LED sticks. Secondly, the plurality of LED sticks and space layers are fixed by a fixture while type I semiconductor layer and active layer of the LED epitaxial layer of each LED stick are covered by each space layer. A transparent conductive layer is further formed thereon whereby to electrically connect with the type II semiconductor layer contrary to type I and are further formed with a plurality of electrodes thereon. Finally the said LED sticks are cut to a plurality of LED devices.11-27-2008
20100297794EFFICIENT LED ARRAY - An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.11-25-2010
20090029494Package structure for solid-state lighting devices and method of fabricating the same - Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.01-29-2009
20110207252LIGHT EMTTING DEVICE, METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE, AND LIGHT EMITTING APPARATUS - A light emitting device according to the embodiment includes a reflecting layer; an adhesion layer including an oxide-based material on the reflecting layer; an ohmic contact layer on the adhesion layer; and a light emitting structure layer on the ohmic contact layer.08-25-2011
20090162956LED FABRICATION METHOD EMPLOYING A WATER WASHING PROCESS - An LED fabrication method for fabricating LEDs comprises: covering all the P-contacts and N-contacts on a wafer with a hydrophilic resin mask layer, packaging the wafer with an organic or inorganic polymer compound containing a yellow fluorescent powder (or a mixture of red and green fluorescent powders), employing a water washing process to remove the hydrophilic resin mask layer so that all the P-contacts and the N-contacts are exposed to the outside, and saw-cutting the wafer into individual dies and wire-bonding the P-contact and N-contact of each die with a respective gold wire.06-25-2009
20090137073LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF - The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.05-28-2009
20130217160METHOD FOR MANUFACTURING PHOSPHOR FILM AND METHOD FOR MAKING LED PACKAGE HAVING THE PHOSPHOR FILM - A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.08-22-2013
20090023234METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing light emitting diode (LED) package first fabricates a silicon submount with at least one groove by wet etching, wherein a reflective layer, a transparent insulation layer and a metal bump are successively formed in the silicon submount. An LED die is mounted in the groove of the silicon submount. A protective glue is applied to fill the groove and provides a flat top face. A phosphor layer is formed on the flat top face by printing. The phosphor layer is formed with excellent uniformity due to the flat top face, and provides uniform wavelength conversion effect. Alternatively, a phosphor plate is manufactured in advance and selected with desired color temperature parameter. The phosphor plate with desired color temperature parameter is attached to the flat top face of the protective glue instead of printing.01-22-2009
20080233666Light emitting diode package with metal reflective layer and method of manufacturing the same - The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.09-25-2008
20110229992LIGHT EXTRACTION FILM FOR ORGANIC LIGHT EMITTING DIODE LIGHTING DEVICES - A multifunctional optical film for enhancing light extraction includes a flexible substrate, a structured layer, and a backfill layer. The structured layer effectively uses microreplicated diffractive or scattering nanostructures located near enough to the light generation region to enable extraction of an evanescent wave from an organic light emitting diode (OLED) device. The backfill layer has a material having an index of refraction different from the index of refraction of the structured layer. The backfill layer also provides a planarizing layer over the structured layer in order to conform the light extraction film to a layer of an OLED lighting device such as solid state lighting devices or backlight units. The film may have additional layers added to or incorporated within it to an emissive surface in order to effect additional functionalities beyond improvement of light extraction efficiency.09-22-2011
20090246898Vertically Emitting, Optically Pumped Semiconductor Having and External Resonator on a Separate Substrate - A method for fabricating an optically pumped semiconductor apparatus, having the following steps: provision of a connection carrier assembly (10-01-2009
20090246899Method of manufacturing light emitting diode - A method of manufacturing light emitting diode has steps of providing a package base, providing a light emitting structure and bonding the light emitting structure on the package base. The package base has a first metal layer and a second metal layer respectively formed on a top and a bottom thereon. The light emitting structure has a substrate, a light emitting lamination and a reflective metal layer. The light emitting lamination is formed on the substrate and has an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer and a transparent electrode layer deposited on the substrate in sequence. The reflective metal layer is formed on a bottom of the substrate. The first metal layer is connected to the reflective metal layer by an ultrasonic thermal press technique. Therefore, the thermal resistance of the finished LED reduces.10-01-2009
20120034717LIGHT EMITTING DIODE FOR HARSH ENVIRONMENTS - A light emitting diode for harsh environments includes a substantially transparent substrate, a semiconductor layer deposited on a bottom surface of the substrate, several bonding pads, coupled to the semiconductor layer, formed on the bottom surface of the substrate, and a micro post, formed on each bonding pad, for electrically connecting the light emitting diode to a printed circuit board. An underfill layer may be provided between the bottom surface of the substrate and the top surface of the printed circuit board, to reduce water infiltration under the light emitting diode substrate. Additionally, a diffuser may be mounted to a top surface of the light emitting diode substrate to diffuse the light emitted through the top surface.02-09-2012
20130122617METHOD OF FABRICATING OPTOELECTRONIC DEVICES DIRECTLY ATTACHED TO SILICON-BASED INTEGRATED CIRCUITS - Hybrid integration of vertical cavity surface emitting lasers (VCSELs) and/or other optical device components with silicon-based integrated circuits. A multitude of individual VCSELs or optical devices are processed on the surface of a compound semiconductor wafer and then transferred to a silicon-based integrated circuit. A sacrificial separation layer is employed between the optical components and the mother semiconductor substrate. The transfer of the optical components to a carrier substrate is followed by the elimination of the sacrificial or separation layer and simultaneous removal of the mother substrate. This is followed by the attachment and interconnection of the optical components to the surface of, or embedded within the upper layers of, an integrated circuit, followed by the release of the components from the carrier substrate.05-16-2013
20100159621SURFACE-MOUNT TYPE OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A small and thin surface-mount type optical semiconductor device having high air tightness, which can be manufactured at a reduced cost includes: a base 06-24-2010
20100159620MANUFACTURING METHOD OF LIGHT EMITTING DIODE - Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.06-24-2010
20100221854SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes attaching a first semiconductor substrate to a support substrate, and thinning the first semiconductor substrate to form a thinned semiconductor layer. The method additionally includes integrating a functional element with the thinned semiconductor layer, and forming at least one through-connect through the thinned semiconductor layer.09-02-2010
20100216265METHOD OF MANUFACTURING LIGHT EMITTING DIODE DEVICE - A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.08-26-2010
20100240158LED LIGHTING WITH INTEGRATED HEAT SINK AND PROCESS FOR MANUFACTURING SAME - A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a heat sink or be coupled to a heat sink. The anodized surface is chemically etched and circuit traces that include an LED landing are formed on the etched anodized surface. LEDs are electrically and mechanically attached to the LED landing by means of conductive metallic solder such that heat generated from the LED is transferred efficiently through the solder and LED landing to the base and heat sink through a metal-to-metal contact pathway.09-23-2010
20120196393PACKAGING METHOD OF WAFER LEVEL CHIPS - A packaging method of wafer level chips including following steps is provided. First, a plurality of chips attached on a first film is provided, and the chips on the first film are disposed respectively corresponding to a plurality of electrode patterns of a substrate. Then, a phosphor layer is respectively formed on at least one surface of each of the chips. Next, a second film is disposed on the phosphor layers, and the second film is opposite to the first film. Further, the first film is removed from the base surface of each of the chips. Then, the base surfaces of the chips are attached to the substrate. Afterward, each of the chips is electrically connected with the corresponding electrode pattern through a wire bonding. Finally, a packaging gel is provided to cover each of the chips, and the packaging gel is solidified.08-02-2012
20120196394METHODS FOR THE MANUFACTURE OF HIGH EFFICIENCY BACKLIGHT ASSEMBLIES FOR FLAT PANEL DISPLAY ASSEMBLIES - A backlight assembly is provided for deployment within a flat panel display assembly, as are methods for manufacturing such a backlight assembly. In one embodiment, the method includes the steps of fabricating a printed wiring board (PWB) having a display-facing surface, disposing a casing sidewall around the PWB to create light cavity within the backlight assembly, and electrically coupling a plurality of light emitting diodes (LEDs) to the PWB. A reflective solder mask is deposited over the display-facing surface of the PWB, and a first reflective silkscreen layer is applied over the reflective solder mask utilizing a silkscreen process. The first reflective silkscreen layer cooperates with the reflective solder mask to increase the reflectivity of the light cavity over the visible color spectrum.08-02-2012
20090286337Method of manufacturing light emitting diode package - There is provided a method of manufacturing a light emitting diode chip, the method including: providing a light emitting diode chip; forming a phosphor layer on a top of the light emitting diode chip; and forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder. There is also provided A method of manufacturing a light emitting diode package, the method including: forming a phosphor layer with a predetermined thickness; forming phosphors of a lattice structure on the phosphor layer by an ink jet process using an ink containing phosphor powder; and disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the light emitting diode chip.11-19-2009
20100311193LED MODULE FABRICATION METHOD - A method of fabricating a LED module by: bonding one or multiple LED chips and multiple conducting terminals to a circuit substrate, and then molding a packing cup on the circuit substrate over by over molding for enabling the LED chip(s) and the conducting terminals to be exposed to the outside of the packing cup, and then molding a lens on the packing cup and the LED chip(s) by over-molding. By means of directly molding the lens on the packing cup and the LED chip(s), no any gap is left in the lens, avoiding deflection, total reflection or light attenuation and enhancing luminous brightness and assuring uniform distribution of output light.12-09-2010
20110111539METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method of manufacturing a light emitting diode (LED) package includes disposing at least one LED chip on a first surface of a lead frame, and the LED chip is connected to the lead frame. At least one heat dissipation area corresponding to the LED chip is defined on a second surface of the lead frame. A thermal conductive material is disposed in the heat dissipation area. The thermal conductive material directly comes into contact with the lead frame. A solidification process is performed to solidify the thermal conductive material and form a plurality of heat dissipation blocks. The heat dissipation blocks directly come into contact with the lead frame, and the solidification process is performed at a temperature substantially lower than 300° C.05-12-2011
20110111538Method for forming LED phosphor resin layer - A method for forming an LED phosphor resin layer includes the following steps: (A) providing an upper mold, a lower mold, and an LED support, wherein the LED support supports an LED chip; (B) securing the LED support on the lower mold; (C) providing a phosphor resin material between the LED chip and an attaching surface of the upper mold; (D) aligning the upper mold with the lower mold, such that the phosphor resin material in part contacts the LED chip and in part attaches to the attaching surface of the upper mold, and that the LED chip and the attaching surface are apart from each other at a predetermined distance; and (E) heating the phosphor resin material. Accordingly, the phosphor resin layer so formed can have a thickness and configuration well controlled and that the problem of spatial color difference can be improved.05-12-2011
20110117686METHOD OF FABRICATING LIGHT EXTRACTOR - Methods of fabricating light extractors are disclosed. The method of fabricating an optical construction for extracting light from a substrate includes the steps of: (a) providing a substrate that has a surface; (b) disposing a plurality of structures on the surface of the substrate, where the plurality of structures form open areas that expose the surface of the substrate; (c) shrinking at least some of the structures; and (d) applying an overcoat to cover the shrunk structures and the surface of the substrate in the open areas.05-19-2011
20090239320SEMICONDUCTOR DEVICE AND PEELING OFF METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The present invention provides a peeling off method without giving damage to the peeled off layer, and aims at being capable of peeling off not only a peeled off layer having a small area but also a peeled off layer having a large area over the entire surface at excellent yield ratio. The metal layer or nitride layer 09-24-2009
20110244608SOLID-STATE LASERS - A method for assembling an optically pumped solid-state laser having an extended cavity. The method includes the steps of providing a casing, mounting a TEC and a base plate in the casing, and mounting a plurality of laser components on the base plate using a UV and heat curing adhesive. Once the laser components are correctly positioned and aligned on the base plate, the adhesive is pre-cured using UV radiation. Final curing of the adhesive is obtained by subjecting the entire laser package to an ambient temperature of at least 100° C. The base plate is preferably selected to have a CTE similar to that of the laser components in order to facilitate the high temperature curing. A preferred material for the base plate is AlSiC.10-06-2011
20110086447METHOD FOR PRODUCING A MULTIPLICITY OF OPTOELECTRONIC COMPONENTS - A method for producing a multiplicity of optoelectronic components includes providing a semiconductor body carrier including on a first main area a multiplicity of semiconductor bodies, each provided with a contact structure and having an active layer that generates electromagnetic radiation, in a semiconductor layer sequence, and forming a planar filling structure on the first main area such that the planar filling structure at least partly covers regions of the contact structure and the semiconductor body carrier without covering the semiconductor body.04-14-2011
20090239319Package for a light emitting diode and a process for fabricating the same - A package for an LED, comprises a metal substrate, at least one LED chip, and an insulative housing, wherein the metal substrate has a first terminal and a second terminal, and the first terminal is formed with a recess. The at least one LED chip is arranged in the recess of the first terminal of the metal substrate, wherein the chip is electrically connected with the first terminal and the second terminal of the metal substrate. Since the insulative housing caps the chip and the metal substrate, and the LED package can be reduced in size.09-24-2009
20120244652METHODS OF FABRICATING LIGHT EMITTING DIODE DEVICES - An embodiment of the disclosure includes a method of fabricating a plurality of light emitting diode devices. A plurality of LED dies is provided. The LED dies are bonded to a carrier substrate. A patterned mask layer comprising a plurality of openings is formed on the carrier substrate. Each one of the plurality of LED dies is exposed through one of the plurality of the openings respectively. Each of the plurality of openings is filled with a phosphor. The phosphor is cured. The phosphor and the patterned mask layer are polished to thin the phosphor covering each of the plurality of LED dies. The patterned mask layer is removed after polishing the phosphor.09-27-2012
20100047942METHOD OF MAKING WHITE LED PACKAGE STRUCTURE HAVING A SILICON SUBSTRATE - A method of making a white LED package structure having a silicon substrate comprises providing a silicon substrate and performing an etching process to form a plurality of cup-structures on a top surface of the silicon substrate. Next, a reflective layer on the top surface of the silicon substrate is formed, and a transparent insulating layer on the reflective layer is formed. Subsequently, a plurality of blue LEDs are respectively bonded in each cup-structure, wherein the blue LEDs have various wavelengths. Last, a plurality of kinds of phosphor powders corresponding to the wavelengths of the blue LEDs are mixed with each other and added to a sealing material, and a sealing process is performed to form a phosphor structure on the cup-structures.02-25-2010
20100055814METHOD OF MANUFACTURING LIGHT EMITTING DIODE DEVICE - A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.03-04-2010
20100055813Method of Packaging Light Emitting Diode on Through-Hole Substrate - In a method of packaging a light emitting diode on a through-hole substrate, through holes are created and a wire bonded light emitting diode (LED) chip is set on the substrate, and a lens is set on the through holes and the wire bonded LED chip. The through holes are provided for filling a phosphor into the lens and extracting air in the lens, so that the phosphor can be coated uniformly on the wire bonded LED chip. After the phosphor is solidified, the packaging of the LED is completed. The method can produce a desired shape of the phosphor while the cost is being taken into consideration, and thus the invention can help manufacturers to produce an accurate shape of the phosphor to provide an LED light source of a better quality without involving a complicated procedure.03-04-2010
20110151604LED PACKAGING METHOD - An LED packaging method provides a package that includes a substrate, a LED chip, a carbon naonotube thin film and an adhesive layer. The LED chip includes an anode and a cathode. The carbon naonotube thin film includes at least two electrically conductive areas spaced from each other. The anode and the cathode are electrically connected to the adjacent electrically conductive areas. The adhesive layer is coated on the LED chip and the carbon nanotube thin film.06-23-2011
20090215210METHOD OF MANUFACTURING LIGHT EMITTING DIODE DEVICE - A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.08-27-2009
20110081736METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE DEVICES - A method for manufacturing light-emitting diode devices. Multiple metal frames are provided. The metal frames are adjacent to each other and are arranged on a same plane. Each metal frame includes a first connection pin and a second connection pin. A light-emitting diode chip is disposed on and electrically connected to each metal frame. The metal frames are respectively bent, enabling the adjacent metal frames to separate from each other. A moldboard formed with a plurality of mold cavities is provided. The bent metal frames are respectively disposed in the mold cavities, locating each light-emitting diode chip in each mold cavity. The mold cavities are respectively filled with package gel. The package gel filled in each mold cavity covers each light-emitting diode chip. The package gel is solidified. The mold cavities are separated from the package gel. The metal frames are separated from each other, forming the light-emitting diode devices.04-07-2011
20100304514EFFICIENT LIGHT COUPLER FROM OFF-CHIP TO ON-CHIP WAVEGUIDES - In an embodiment, light from a single mode light source may be deflected into a low index contrast (LIC) waveguide in an opto-electronic integrated circuit (OEIC) (or “opto-electronic chip”) by a 45 degree mirror. The mirror may be formed by polishing an edge of the die at a 45 degree angle and coating the polished edge with a metal layer. Light coupled into the LIC waveguide may then be transferred from the LIC waveguide to a high index contrast (HIC) waveguide by evanescent coupling.12-02-2010
20080254558Side-emitting LED package and method of manufacturing the same - The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.10-16-2008
20080254557Method for manufacturing lens for led package - A method for manufacturing a lens for a light emitting diode (LED) package is disclosed. The method for manufacturing a lens for an LED package includes: forming a dome lens on each of a plurality of LED packages placed on a fixing plate, the dome lens made of silicon; forming a concave groove in the dome lens by using a jig for pressing the dome lens; curing the dome lens; and removing the LED packages from the fixing plate.10-16-2008
20110256646METHOD FOR MANUFACTURING LED PACKAGE AND SUBSTRATE THEREOF - In a method for manufacturing a LED package, a substrate of the LED package is formed by thermally pressing at least one insulating plate over an electrode plate and then grinding the insulating plates to expose the electrode plate.10-20-2011
20110053299LIGHT EMITTING DEVICE AND DISPLAY - A method for manufacturing a light emitting device comprises: preparing a light emitting component having an active layer of a semiconductor, the active layer comprising a gallium nitride based semiconductor containing indium and being capable of emitting a blue color light; preparing a phosphor capable of absorbing a part of the blue color light emitted from the light emitting component and emitting a yellow color light, wherein selection of the phosphor is controlled based on an emission wavelength of the light emitting component; and combining the light emitting component and the phosphor so that the blue color light from the light emitting component and the yellow color light from the phosphor are mixed to make a white color light.03-03-2011
20110053298VERTICAL NITRIDE SEMICONDUCTOR LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME - A vertical nitride-based semiconductor LED comprises a structure support layer; a p-electrode formed on the structure support layer; a p-type nitride semiconductor layer formed on the p-electrode; an active layer formed on the p-type nitride semiconductor layer; an n-type nitride semiconductor layer formed on the active layer; an n-electrode formed on a portion of the n-type nitride semiconductor layer; and a buffer layer formed on a region of the n-type nitride semiconductor layer on which the n-electrode is not formed, the buffer layer having irregularities formed thereon. The surface of the n-type nitride semiconductor layer coming in contact with the n-electrode is flat.03-03-2011
20100285620LED PACKAGING METHODS AND LED-BASED LIGHTING PRODUCTS - A method of packaging a light-emitting diode (LED) chip includes coupling the LED chip to a printed circuit board (PCB) and forming a conductor on a cover plate. Conductive epoxy is applied to at least one of the LED chip and the conductor. The cover plate is coupled to the PCB such that the conductive epoxy forms a circuit connection between the LED chip and the conductor. An LED-based lighting product includes a PCB with one or more LED chips mounted directly thereon. A cover plate has conductors that couple at least to the one or more LED chips and to the PCB, such that the conductors form electrical connections between the one or more LED chips and the PCB.11-11-2010
20100285619METHOD FOR MANUFACTURING A SOLID STATE LASER HAVING A PASSIVEQ-SWITCH, - A method for manufacturing a laser-active solid having a bonded passive Q-switch is provided, which is particularly suitable for large quantities.11-11-2010
20110256647METHODS OF MANUFACTURING ELONGATED LENSES FOR USE IN LIGHT EMITTING APPARATUSES - A method of manufacturing an elongated lens for a light emitting apparatus includes forming an elongated lens having an exterior surface, and applying a photoluminescent material to the exterior surface of the lens.10-20-2011
20110086448Flip-chip light emitting diodes and method of manufacturing thereof - Provided are a flip-chip nitride-based light emitting device having an n-type clad layer, an active layer and a p-type clad layer sequentially stacked thereon, comprising a reflective layer formed on the p-type clad layer and at least one transparent conductive thin film layer made up of transparent conductive materials capable of inhibiting diffusion of materials constituting the reflective layer, interposed between the p-type clad layer and reflective layer; and a process for preparing the same. In accordance with the flip-chip nitride-based light emitting device of the present invention and a process for preparing the same, there are provided advantages such as improved ohmic contact properties with the p-type clad layer, leading to increased wire bonding efficiency and yield upon packaging the light emitting device, capability to improve luminous efficiency and life span of the device due to low specific contact resistance and excellent current-voltage properties.04-14-2011
20100323466LIGHT EMITTING DIODE LAMP WITH PHOSPHOR COATED RELECTOR - A light emitting apparatus includes a lamp reflector having phosphor, wherein the lamp reflector further includes an aperture, and an LED light source arranged with the lamp reflector to excite the phosphor and to emit light through the aperture of the lamp reflector.12-23-2010
20100323465MOLDED CHIP FABRICATION METHOD AND APPARATUS - A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.12-23-2010
20100112735CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.05-06-2010
20090197361Method for Producing an LED Light Source Comprising a Luminescence Conversion Element - The invention describes a method for producing a light-emitting-diode (LED) light source, particularly comprising mixed-color LEDs, wherein at least a portion of primary radiation emitted by a chip is transformed by luminescence conversion. Said chip comprises a front-side (i.e., the side facing in the direction of radiation) electrical contact to whose surface a luminescence conversion material is applied in the form of a thin layer. Prior to coating, the front-side electrical contact is raised by the application of an electrically conductive material to the electrical contact surface. The method enables specific color coordinates to be adjusted selectively by monitoring the color coordinates (IEC chromaticity diagram) and thinning the layer of luminescence conversion material. In addition, the method is suited in particular for simultaneously producing a plurality of LED light sources from a multiplicity of similar chips in a wafer composite.08-06-2009
20100190279LIGHT EMITTING DEVICE - Methods of making a light emitter are disclosed herein. An embodiment of a method comprises fabricating a line of first leads, the line of first leads comprising a plurality connected individual first leads; fabricating a line of second leads, the line of second leads comprising a plurality of connected individual second leads; physically connecting the line of first leads to the line of second leads, wherein a first individual first lead is adjacent a first individual second lead; attaching a light emitting device to the first individual first lead; electrically connecting the light emitting device to the first individual second lead; encapsulating a portion of the individual first lead and a portion of the individual second lead as a single unit; and separating the encapsulated first individual lead and the second individual lead from the first line of leads and the second line of leads.07-29-2010
20100317132Printed Assemblies of Ultrathin, Microscale Inorganic Light Emitting Diodes for Deformable and Semitransparent Displays - Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.12-16-2010
20100304513METHOD FOR FORMING AN ORGANIC LIGHT EMITTING DIODE DEVICE - A method for sealing an organic light emitting diode (OLED) device is disclosed wherein the OLED device comprises a color filter. A color filter is deposited on a first glass plate or substrate and a glass-based frit is then deposited in a loop around the color filter, The deposited fit loop is then heated by electromagnetic energy to evaporate organic constituents and to sinter the fit in a pre-sintering step. An OLED device may then be assembled by positioning a second glass plate comprising an organic light emitting material deposited thereon in overlying registration with the first glass plate, with the color filer and the organic light emitting material positioned between the plates. The fit is then heated with a laser to form a hermetic seal between the first and second glass plates.12-02-2010
20120009701METHOD OF FABRICATING LIGHT EMITTING DEVICE - A method of fabricating a light emitting device includes forming a plurality of light emitting elements on light emitting element mounting regions, respectively, of a substrate, forming lens supports on the light emitting element mounting regions, respectively, are raised relative to isolation regions of the substrate located between neighboring ones of the light emitting element mounting regions, and forming lenses covering the light emitting elements on the lens support patterns, respectively.01-12-2012
20120009699WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASE LIGHT-EMITTING EFFICIENCY AND METHOD FOR MAKING THE SAME - A wafer level LED package structure for increasing light-emitting efficiency includes: a light-emitting unit, an insulating unit, two first conductive units and two second conductive units. The light-emitting unit has a light-emitting body, a positive conductive layer, a negative conductive layer, and a reflecting insulating layer formed between the positive conductive layer and the negative conductive layer. The light-emitting body has a bottom material layer and a top material layer. The insulating unit is formed around an outer area of a top surface of the bottom material layer and formed on a top surface of the reflecting insulating layer. One first conductive unit is formed on one part of the positive conductive layer and the insulating unit, and another first conductive unit is formed on one part of the negative conductive layer and the insulating unit. The two second conductive units are respectively formed on the two first conductive units.01-12-2012
20110165708ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE AND FABRICATION METHOD THEREOF - An organic electroluminescent display device and fabrication method thereof is provided. The device includes a first substrate having at least one thin film transistor; an electroluminescent unit formed on the first substrate and electrically connect to the thin film transistor; a first protective layer formed on the electroluminescent unit; a second protective layer formed on the first protective layer; and a third protective layer formed on the second protective layer and in contact with the first protective layer. The device further comprises a second substrate sealed to the first substrate to form the electroluminescent unit between the first substrate and second substrate. In the device, the first protective layer comprising inorganic material, the second protective layer comprising organic material and the third protective layer comprising inorganic material are formed on the electroluminescent unit to reduce oxidation of electrodes by preventing infiltration of moisture.07-07-2011
20110165707METHOD FOR ATTACHING OPTICAL COMPONENTS ONTO SILICON-BASED INTEGRATED CIRCUITS - Hybrid integration of vertical cavity surface emitting lasers (VCSELs) and/or other optical device components with silicon-based integrated circuits. A multitude of individual VCSELs or optical devices are processed on the surface of a compound semiconductor wafer and then transferred to a silicon-based integrated circuit. A specific sacrificial or removable separation layer is employed between the optical components and the mother semiconductor substrate. The transfer of the optical components to a carrier substrate is followed by the elimination of the sacrificial or separation layer and simultaneous removal of the mother substrate. This is followed by the attachment and interconnection of the optical components to the surface of, or embedded within the upper layers of, an integrated circuit, followed by the release of the components from the carrier substrate. It is possible to place and interconnect VCSELs directly within the physical structure of the integrated circuit, thus greatly reducing the power requirements, the distance of interconnecting lines, and the resultant operational speed. A variation allows the selective placement of groups of physically-connected VCSELs, and the collection and placement of large numbers of fabricated VCSELs onto foreign substrates using a vacuum plating tool.07-07-2011
20120028388METHOD FOR PRODUCING LIGHT-EMITTING DIODE DEVICE - A method for producing a light-emitting diode device includes a step of preparing a sealing layer by sealing in a light-emitting diode with a sealing material; a step of preparing a fluorescent layer by allowing a phosphor-containing resin composition containing phosphor and silicone resin to reach its B-stage; and a step of bonding the fluorescent layer to the surface of the sealing layer.02-02-2012
20120058580Surface-Textured Encapsulations for Use With Light Emitting Diodes - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon the light emitting diode and having a surface texture configured to extract light. In an aspect, a method includes encapsulating a light emitting diode with an encapsulation having a surface texture configured to extract light. In an aspect, a light emitting diode lamp is provided that includes a package, at least one light emitting diode disposed within the package, and an encapsulation formed upon the at least one light emitting diode having a surface texture configured to extract light. In another aspect, a method includes determining one or more regions of an encapsulation, the encapsulation configured to cover a light emitting diode, and surface-texturing each region of the encapsulation with one or more geometric features that are configured to extract light.03-08-2012
20120058579METHOD FOR PACKAGING LED CHIP MODULES AND MOVING FIXTURE THEREOF - A method for packaging LED chip modules is provided. First, a first sacrificial layer is disposed on a substrate. Afterwards, LED chips are synchronously disposed on the first sacrificial layer before the first sacrificial layer cures. Next, a first material, a second sacrificial layer, and a second material are used to form a support layer on the first sacrificial layer. The first sacrificial layer and the second sacrificial layer are then removed, so that LED chip modules are obtained, wherein each LED chip module has a corresponding support layer. Furthermore, a moving fixture is provided to synchronously remove chips from a wafer and dispose them on the sacrificial layer.03-08-2012
20120070922METHOD FOR FORMING LIGHT EMITTING DEVICE - The invention provides a method for forming a light emitting device. A first substrate is provided. A plurality of patterned masks is formed on the first substrate, or on a semiconductor epitaxial layer grown on the first substrate, or the first substrate is etched to form a plurality of trenches, followed by performing an epitaxial lateral overgrowth process to grow an epitaxy layer over the first substrate. A light emitting structure is formed on the epitaxy layer. A first electrode layer is formed on the light emitting structure. The light emitting structure is wafer bonded to a second substrate. A photoelectrochemical etching process is performed to lift off the first substrate from the epitaxy layer.03-22-2012
20120156813ORGANIC LIGHT EMITTING DISPLAY DEVICE AND FABRICATING METHOD THEREOF - An organic light emitting display includes a substrate, a semiconductor layer arranged on the substrate, an organic light emitting diode arranged on the semiconductor layer, an encapsulant arranged on an top surface periphery of the substrate, which is an outer periphery of the semiconductor layer and the organic light emitting diode, an encapsulation substrate bonded to the encapsulant, and a bonding agent arranged on an under surface of the substrate which is opposite to the encapsulant.06-21-2012
20110092003PHOSPHOR LAYER ARRANGEMENT FOR USE WITH LIGHT EMITTING DIODES - Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation.04-21-2011
20110104834Light emitting device including a sealing portion, and method of making the same - A method of making a light emitting device, includes a mounting and a light emitting element on a substrate; hot-pressing a glass material on the light emitting element to form a glass sealing portion for sealing the light emitting element; and forming a phosphor layer on a surface of the glass sealing portion.05-05-2011
20120315713METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing an LED package, comprising steps of: providing a substrate, the substrate forming a plurality of spaced rough areas on a surface thereof, each of the rough areas forming a rough structure thereon, a block layer being provided on a remaining part of the surface of the substrate relative to the rough areas; forming a metal layer on a top surface of each rough structure; forming a reflector on the substrate, the reflector defining a cavity and surrounding two adjacent metal layers; arranging an LED chip in the cavity, the LED chip electrically connecting to the two adjacent metal layers; forming an encapsulation layer in the cavity to seal the LED; and separating the substrate from the metal layers, the encapsulation layer and the reflector.12-13-2012
20120122254WHITE LIGHT-EMITTING DIODE PACKAGE STRUCTURE FOR SIMPLIFYING PACKAGE PROCESS AND METHOD FOR MAKING THE SAME - A white light-emitting diode package structure for simplifying package process includes a substrate unit, a light-emitting unit, a phosphor unit and a conductive unit. The light-emitting unit is disposed on the substrate, and the light-emitting unit has a positive conductive layer and a negative conductive layer. The phosphor unit has a phosphor layer formed on the light-emitting unit and at least two openings for respectively exposing one partial surface of the positive electrode layer and one partial surface of the negative electrode layer. The conductive unit has at least two conductive wires respectively passing through the two openings in order to electrically connect the positive electrode layer with the substrate unit and electrically connect the negative electrode layer with the substrate unit.05-17-2012
20120122255WHITE LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME - Provided is a white LED including a reflector cup; an LED chip mounted on the bottom surface of the reflector cup; transparent resin surrounding the LED chip; a phosphor layer formed on the transparent resin; and a light transmitting layer that is inserted into the surface of the phosphor layer so as to form an embossing pattern on the surface, the light transmitting layer transmitting light, incident from the phosphor layer, in the upward direction.05-17-2012
20120164768Light-Emitting Diode Package and Wafer-Level Packaging Process of Light-Emitting Diode - A wafer-level packaging process of a light-emitting diode is provided. First, a semiconductor stacked layer is formed on a growth substrate. A plurality of barrier patterns and a plurality of reflective layers are then formed on the semiconductor stacked layer, wherein each reflective layer is surrounded by one of the barrier patterns. A first bonding layer is then formed on the semiconductor stacked layer to cover the barrier patterns and the reflective layers. Thereafter, a carrying substrate having a plurality of second bonding layers and a plurality of conductive plugs electrically insulated from each other is provided, and the first bonding layer is bonded with the second bonding layer. The semiconductor stacked layer is then separated from the growth substrate. Next, the semiconductor stacked layer is patterned to form a plurality of semiconductor stacked patterns. Next, each semiconductor stacked pattern is electrically connected to the conductive plug.06-28-2012
20120164767METHOD OF MANUFACTURING A LIGHT EMISSION DEVICE BASED ON LIGHT EMITTING DIODES - A method of manufacturing a device based on LEDs includes the growth of semiconducting nanowires on a first electrode produced on an insulating face, and encapsulation thereof in planarising material; the formation, on the planarising material, of a second electrode with contact take-up areas. LEDs are formed by releasing a band of the first electrode around each take-up area, including forming a mask defining the bands on the second electrode, chemically etching the planarising material, stopped so as to preserve planarising material, chemically etching the portion of nanowires thus released, and then chemically etching the remaining planarising material. A trench is formed along each of the bands as far as the insulating face and the LEDs are placed in series by connecting the take-up areas and bands of the first electrode.06-28-2012
20120129282WAFER LEVEL CONFORMAL COATING FOR LED DEVICES - Provided is a method of fabricating a light-emitting diode (LED) device. The method includes providing a wafer. The wafer has light-emitting diode (LED) devices formed thereon. The method includes immersing the wafer into a polymer solution that has a surface tension lower than that of acetic acid. The polymer solution contains a liquid polymer and phosphor particles. The method includes lifting the wafer out of the polymer solution at a substantially constant speed. The method includes drying the wafer. The above processes form a conformal coating layer at least partially around the LED devices. The coating layer includes the phosphor particles. The coating layer also has a substantially uniform thickness.05-24-2012
20120214264MANUFACTURING METHOD FOR LED PACKAGE - The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element.08-23-2012
20110177634Edge-Emitting Semiconductor Laser Chip - A method for manufacturing an edge emitting semiconductor laser chip, which has a carrier substrate, an interlayer arranged between the carrier substrate and a component structure of the edge emitting semiconductor laser chip. The interlayer is adapted to provide adhesion between the carrier substrate and the component structure. The component structure has an active zone provided for generating radiation.07-21-2011
20100173433LIQUID CRYSTAL DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - The present invention provides a liquid crystal display panel and a method of manufacturing the liquid crystal display panel capable of reducing or eliminating metal erosion in an area in which a conductive dot is formed. In some embodiments, a display panel comprises a common electrode formed on an upper substrate, a first electrode formed on a lower substrate opposing the upper substrate and configured to receive a common voltage, a conductive dot formed between the upper substrate and the lower substrate and positioned to supply the common electrode with the common voltage, an insulating layer having a contact hole exposing the first electrode, and a second electrode formed on the insulating layer to connect the conductive dot and the first electrode, wherein a cross sectional area of the conductive dot between the upper substrate and the lower substrate is greater than a cross sectional area of an opening of the contact hole.07-08-2010
20120077293Light-Emitting Diode Package Assembly - An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of a LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections.03-29-2012
20120077292METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE - An exemplary method of manufacturing an LED package includes providing a base, the base having a reflecting cup with a receiving recess defined therein; an LED chip is then mounted on the base and secured in a bottom of the receiving recess; thereafter, a dispensing nozzle is used to apply an encapsulating material into the receiving recess to encapsulate the LED chip; finally, the encapsulating material is baked to form an encapsulating layer. The dispensing nozzle moves relative to the receiving recess during the application of the encapsulating material. A depth of the receiving recess is varied. Parameters of the application of the encapsulating material into the receiving recess by the dispensing nozzle vary in response to a change of the depth of the receiving recess.03-29-2012
20100047941HIGH POWER LED PACKAGE AND FABRICATION METHOD THEREOF - An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.02-25-2010
20100047940METHOD OF MANUFACTURING LIGHT EMITTING DIODE DEVICE - A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.02-25-2010
20120178193METHOD FOR MANUFACTURING LED WITH TRANSPARENT CERAMICS - A method for manufacturing an LED (light emitting diode) with transparent ceramic is provided, which includes: adding quantitative fluorescent powder into transparent ceramic powder, wherein the doped ratio of the fluorescent powder is 0.01-100 wt %; preparing the fluorescent transparent ceramic using ceramic apparatus and process, after fully mixing the raw material; assembling the prepared fluorescent transparent ceramic and a semiconductor chip to form the LED device. The method assembles the fluorescent transparent ceramic and a semiconductor chip to form the LED device by replacing the fluorescent powder layer and the epoxy resin package casting of the traditional LED with fluorescent transparent ceramic. The fluorescent transparent ceramic is used as the package cast and fluorescent material, and the LED device manufactured through the method has more excellent performance.07-12-2012
20120178192SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - A semiconductor light emitting device, includes: a substrate including a first major surface and a second major surface, the first major surface including a recess and a protrusion, the second major surface being formed on a side opposite to the first major surface; a first electrode provided on the first major surface; a semiconductor light emitting element provided on the first electrode and electrically connected to the first electrode; a second electrode provided on the second major surface; and a through-electrode provided to pass through the substrate at the recess and electrically connect the first electrode and the second electrode.07-12-2012
20090061550LED PACKAGE AND FABRICATING METHOD THEREOF - The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.03-05-2009
20120083057METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing a light emitting diode package, includes: providing a light emitting chip structure comprising a substrate and a light emitting layer; treating the light emitting layer to form at least two spaced light emitting chips on the substrate, the light emitting chips each comprising a first surface away from the substrate and a second surface; forming a first carbon nanotube layer covering the first surfaces of the at least two spaced light emitting chips; removing the substrate; forming a second carbon nanotube layer on the second surfaces of the light emitting chips, thus obtaining a first carbon nanotube layer and a second carbon nanotube layer on opposite sides of the at least two spaced light emitting chips; and packaging the light emitting chip structure to obtain the light emitting diode package.04-05-2012
20120083056LIGHT EMITTING DIODE SEALING MEMBER AND METHOD FOR PRODUCING LIGHT EMITTING DIODE DEVICE - A light emitting diode sealing member includes a light emitting diode sealing layer, and a lens mold layer laminated on the light emitting diode sealing layer.04-05-2012
20120231566METHOD OF FABRICATING LIGHTWEIGHT AND THIN LIQUID CRYSTAL DISPLAY DEVICE - A method of fabricating a liquid crystal display device includes forming a first adhesive pattern on a first auxiliary substrate; forming a first process panel by attaching a first substrate to the first auxiliary substrate using the first adhesive pattern; forming an array element on the first substrate; forming a second adhesive pattern on a second auxiliary substrate; forming a second process panel by attaching a second substrate to the second auxiliary substrate using the second adhesive pattern; forming a color filter element on the second substrate; attaching the first and second process panels with a liquid crystal panel between the first and second process panels; weakening an adhesive strength of the first and second adhesive patterns; and detaching the first and second auxiliary substrates from the first and second substrates, respectively.09-13-2012
20110003411METHOD OF MANUFACTURING COLOR PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a color printed circuit board. The method includes non-consecutively printing a conductive ink on a flexible insulation board in a piezoelectric inkjet manner to form an electrically conductive pattern, applying an electrically conductive bonding agent to a light emitting chip mounting portion of the electrically conductive pattern for mounting a light emitting chip, forming a waterproof layer on an overall surface of a resultant after mounting the light emitting chip on the light emitting chip mounting portion of the electrically conductive pattern to which the electrically conductive bonding agent is applied, and forming a color pattern on an overall surface of the light emitting diode using a color ink.01-06-2011
20110003410METHOD OF MANUFACTURING A LIGHT EMITTING DIODE ELEMENT - A method of manufacturing a light emitting diode element is provided. A first patterned semi-conductor layer, a patterned light emitting layer, and a second patterned semi-conductor layer are sequentially formed on an epitaxy substrate so as to form a plurality of epitaxy structures, wherein the first patterned semi-conductor layer has a thinner portion in a non-epitaxy area outside the epitaxy structures. A passivation layer covering the epitaxy structures and the thinner portion is formed. The passivation layer covering on the thinner portion is partially removed to form a patterned passivation layer. A patterned reflector is formed directly on each of the epitaxy structures. The epitaxy structures are bonded to a carrier substrate. A lift-off process is performed to separate the epitaxy structures from the epitaxy substrate. An electrode is formed on each of the epitaxy structures far from the patterned reflector.01-06-2011
20120322179METHOD FOR PACKAGING LIGHT EMITTING DIODES - A method for packaging LEDs includes steps of: forming a substrate with a rectangular frame, a plurality of first and second electrode strips received within the frame and alternately arranged along a width direction of the frame; forming a carrier layer on each pair of the first and second electrode strips, the carrier layer defining a plurality of recesses; arranging an LED die in each recess and electrically connecting the LED die with first and second electrodes; forming an encapsulation in each recess to cover the LED die; and cutting the first and second electrode strips along the width direction of the frame to obtain a plurality of separated LED packages each including the first and second electrodes, the LED die, the encapsulation and a part of the carrier layer.12-20-2012
20120322180LIGHT EMITTING DIODE AND MANUFACTURING METHOD OF THE SAME - A light emitting diode comprises a permanent substrate having a chip holding space formed on a first surface of the permanent substrate; an insulating layer and a metal layer sequentially formed on the first surface of the permanent substrate and the chip holding space, wherein the metal layer comprises a first area and a second area not being contacted to each other; a chip having a first surface attached on a bottom of the chip holding space, contacted to the first area of the metal layer; a filler structure filled between the chip holding space and the chip; and a first electrode formed on a second surface of the chip. The chip comprises a light-emitting region and an electrical connection between the first area of the metal layer and the light emitting region is realized by using a chip-bonding technology.12-20-2012
20110039359Light emitting device and method of manufacturing the same - A method of manufacturing a light emitting device. The method includes: mounting a light emitting chip on a substrate; forming a transparent resin portion and a phosphor layer by using a liquid droplet discharging apparatus, the transparent resin portion being formed in a shape of a dome and covering the light emitting chip to fill an exterior thereof on the substrate, a phosphor layer containing phosphor and being formed on an exterior of the transparent resin portion close to at least a top side thereof; and forming a reflecting layer at a position exterior of the transparent resin portion and the phosphor layer close to the substrate.02-17-2011
20110039358Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure - A method for forming a layer of phosphor material on an LED encapsulant structure includes forming a layer of a phosphor material on a first surface, disposing the first surface to cause the phosphor material to be in contact with a surface of the LED encapsulant structure, applying a pressure between the first surface and the surface of the LED encapsulant structure, and causing the layer of the phosphor material to be attached to the LED encapsulant structure.02-17-2011
20100203658Method of manufacturing light-emitting device - A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material after the sealing, producing a concave portion partially on the glass material by partially contacting and pressing a die against an upper surface of the glass material such that a part of the upper surface being not in contact with the die is deformed and forms a curved surface.08-12-2010
20110212555FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES AND TRACES - A method of manufacturing an electronic device (09-01-2011
20120094404METHOD FOR DISTRIBUTING FLUORESCENCE ONTO LED CHIP - A method for distributing fluorescence onto a light emitting diode chip includes steps: providing a base; mounting the LED chip having a light-emergent face on the base; disposing a baffle sleeve on the base whereby the baffle sleeve surrounds the LED chip; disposing a solid fusible block with the fluorescence mixed therein on the LED chip; heating the solid fusible block to be in a liquid state, and the fusible block flowing over the light-emergent face of the LED chip; and cooling the fusible block to be in a solid state again.04-19-2012
20120329184CASTING COMPOSITION AS DIFFUSION BARRIER FOR WATER MOLECULES - The invention relates to a casting composition based on a transparent epoxy or silicone resin (12-27-2012
20120100646METHOD FOR DISTRIBUTING PHOSPHOR PARTICULATES ON LED CHIP - A method for distributing phosphor particulates on an LED chip, includes steps of: providing a substrate having an LED chip mounted thereon; dispensing an adhesive on the chip, wherein the adhesive have positively charged phosphor particulates doped therein; providing an upper mold and a lower mold for producing an electric field through the adhesive and moving the upper mold to press the adhesive, wherein the phosphor particulates are driven by the electric field to move to a top face of the chip; and curing the adhesive and removing the upper mold and the lower mold.04-26-2012
20100167439METHOD OF MANUFACTURING PRINTING PLATE AND METHOD OF MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME - A method of manufacturing a precise printing plate, and a method of manufacturing an LCD device using the same are disclosed, the method of manufacturing the precise printing plate comprising forming a mask layer of a predetermined pattern on a substrate; etching the substrate with an etchant including an anionic surfactant by using the mask layer of the predetermined pattern, to thereby form a trench; and removing the mask layer.07-01-2010
20100167440Light Emissive Device - An organic light emissive device including 07-01-2010
20130011946LED PACKAGE WITH EFFICIENT, ISOLATED THERMAL PATH - Packages for containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed with an efficient, isolated thermal path. In one embodiment, LED package can include a thermal element and at least one electrical element embedded within a body. The thermal element and electrical element can have the same and/or substantially the same thickness and can extend directly from a bottom surface of the LED package such that they are substantially flush with or extend beyond the bottom surface of the LED package. The thermal and electrical element have exposed portions which can be substantially flush with lateral sides of the body such that the thermal and electrical element do not have a significant portion extending beyond an outermost edge of the lateral sides of the body.01-10-2013
20100129943Thin film light emitting diode - Light emitting LEDs devices comprised of LED chips that emit light at a first wavelength, and a thin film layer over the LED chip that changes the color of the emitted light. For example, a blue LED chip can be used to produce white light. The thin film layer beneficially consists of a florescent material, such as a phosphor, and/or includes tin. The thin film layer is beneficially deposited using chemical vapor deposition.05-27-2010
20100129945METAL SUBSTRATE HAVING ELECTRONIC DEVICES FORMED THEREON - A method of forming an electronic device on a metal substrate deposits a first seed layer of a first metal on at least one master surface with a roughness less than 400 nm. A supporting metal layer is bonded to the first seed layer to form the metal substrate 05-27-2010
20100129944GLASS PLATE, PROCESS FOR PRODUCING IT, AND PROCESS FOR PRODUCING TFT PANEL - To provide a glass plate which has a low B05-27-2010
20130171753PROGRESSIVE-REFRACTIVITY ANTIREFLECTION LAYER AND METHOD FOR FABRICATING THE SAME - The present invention discloses a progressive-refractivity antireflection layer and a method for fabricating the same to eliminate light reflection occurring in an interface. The present invention is characterized in being fabricated via depositing a first material and a second material, and having a refractivity (n07-04-2013
20130143338METHODS OF FABRICATION OF HIGH-DENSITY LASER DIODE STACKS - A method of fabricating a high-density laser diode stack is disclosed. The laser diode bars each have an emitter surface and opposing surfaces on either side of the emitter surface. Each laser diode bar has metallization layers on the opposing surfaces and a solder layer on at least one of the metallization layers. The solder layer is applied to a semiconductor wafer prior to cleaving the wafer to create the laser diode bars. The laser diode bars are arranged in a stack such that the emitter surfaces of the bars are facing the same direction. The stack of laser diode bars is placed in a vacuum chamber. An anti-reflection coating is deposited on the emitter surfaces of the laser diode bars in the chamber. The laser diode bars are joined by applying a temperature sufficient to reflow the solder layers in the chamber.06-06-2013
20130143339FORMATION OF UNIFORM PHOSPHOR REGIONS FOR BROAD-AREA LIGHTING SYSTEMS - In accordance with certain embodiments, phosphor arrangements are formed via adhering phosphors to activated regions on a substrate and transferring them to a different substrate.06-06-2013
20130178002METHOD AND APPARATUS FOR FABRICATING A LIGHT-EMITTING DIODE PACKAGE - Method and apparatus for fabricating a light-emitting diode package Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.07-11-2013
20130178003METHOD FOR PACKAGING LIGHT EMITTING DIODE - A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively define a receiving space among the fluorescent film, the mold and the supporting board, the substrate and the LED dies being received in the receiving space; exhausting air in the receiving space to attach the gelatinous-state fluorescent film on the LED dies; solidifying the gelatinous-state fluorescent film and removing the mold; forming an encapsulation on the substrate to cover the LED dies; cutting the substrate and removing the supporting board to obtain several individual LED packages.07-11-2013
20130095583METHOD FOR MANUFACTURING LED - A method for manufacturing an LED is disclosed. Firstly, a base with two leads is provided. The base has a cavity defined in a top face thereof and two holes defined in two lateral faces thereof. The two holes communicate the cavity with an outside environment. A chip is fixed in the cavity and electrically connected to the two leads. A cover is placed on the top face of the base to cover the cavity. An encapsulation liquid is filled into the cavity through one hole until the encapsulation liquid joins a bottom face of the cover. Finally, the encapsulation liquid is cured to form an encapsulant. A top face of the cover functions as a light emergent face of the LED.04-18-2013
20130095584LIGHT EMITTING DISPLAY AND METHOD OF MANUFACTURING THE SAME - The present invention is to provide an organic light emitting display and a method of manufacturing the same, the light emitting display including: a first substrate on which a plurality of light emitting devices are formed; a second substrate disposed to face the first substrate; a dam member disposed between the first substrate and the second substrate to surround the plurality of light emitting devices; an inorganic sealing material disposed between the first substrate and the second substrate on an outward side of the dam member and attaching the first substrate and the second substrate; and a filling material provided between the first substrate and the second substrate on an inward side of the dam member and formed of at least one inert liquid selected from the group consisting of perfluorocarbon and fluorinert.04-18-2013
20130130419NIGHT VISION IMAGING SYSTEM (NVIS) COMPATIBLE LIGHT EMITTING DIODE - The present disclosure is directed to a LED assembly that is compatible for use with a night vision imaging system, Such LEDs may emit energy between 400 and 600 nm of the electromagnetic spectrum while limiting energy emissions between 600 and 1200 nanometers. Near infrared photochemistry is incorporated directly into the lens or encapsulant of an LED with an opaque package that limits transmission of visible and near infrared energy.05-23-2013
20110237007PHOSPHOR, METHOD OF COATING THE SAME, AND METHOD OF MANUFACTURING LIGHT EMITTING APPARATUS - A phosphor, a method of coating a phosphor, and a method of manufacturing a light emitting apparatus including a coated phosphor are provided. The method may include mixing the phosphor core in a first mixture including a first polymer and a first solvent, aging the first mixture, adding a second polymer and a second solvent to the first mixture to produce a second mixture and stirring the second mixture, and drying the second mixture to produce a polymer coated phosphor.09-29-2011
20100317133METHOD FOR MANUFACTURING A REFLECTIVE SURFACE SUB-ASSEMBLY FOR A LIGHT-EMITTING DEVICE - A method for manufacturing a reflective surface sub-assembly for a light-emitting device, comprising a substrate, at least one area reserved for placement of a light-emitting device assembly on the substrate, and a diffusive reflective layer applied on selected regions on the substrate, wherein if the light-emitting device assembly were placed onto the at least one area then the diffusive reflective layer would reflect photons emitted by the light-emitting device assembly is disclosed.12-16-2010
20130157394LIGHT EMITTING SYSTEM WITH ADJUSTABLE WATT EQUIVALENCE - A light emitting diode assembly and method of manufacturing the same. The light emitting diode assembly has a heat sink. The assembly additionally has a platform assembly with a substrate having driving elements including a plurality of light emitting diode elements disposed thereon. The driving elements and light emitting diode elements are in electric communication with an AC input to produce an initial light output. The plurality of light emitting diodes emit an initial light output that is a first predetermined amount of lumens in a first lumen range and emit an initial light output that is a second predetermined amount of lumens in a second lumen range current is changed without the need to change the manufacturing process.06-20-2013
20130157395Light-Emitting Diode (LED) Package Systems - A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.06-20-2013
20110312109LIGHT EMITTING DIODE PACKAGE HAVING ANODIZED INSULATION LAYER AND FABRICATION METHOD THEREFOR - An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.12-22-2011
20130189803Molded Nanoparticle Phosphor For Light Emitting Applications - A molded nanoparticle phosphor for light emitting applications is fabricated by converting a suspension of nanoparticles in a matrix material precursor into a molded nanoparticle phosphor. The matrix material can be any material in which the nanoparticles are dispersible and which is moldable. The molded nanoparticle phosphor can be formed from the matrix material precursor/nanoparticle suspension using any molding technique, such as polymerization molding, contact molding, extrusion molding, injection molding, for example. Once molded, the molded nanoparticle phosphor can be coated with a gas barrier material, for example, a polymer, metal oxide, metal nitride or a glass. The barrier-coated molded nanoparticle phosphor can be utilized in a light-emitting device, such as an LED. For example, the phosphor can be incorporated into the packaging of a standard solid state LED and used to down-convert a portion of the emission of the solid state LED emitter.07-25-2013
20120009700METHOD OF MANUFACTURING A LED CHIP PACKAGE STRUCTURE - A method of manufacturing a LED chip package structure includes the steps of: providing a substrate unit including a strip substrate body; electrically connecting a plurality of LED chips to the strip substrate body; and placing a strip package colloid body on the strip substrate body to cover the LED chips, wherein the strip package colloid body has an exposed top surface and an exposed surrounding peripheral surface connected between the exposed top surface and the strip substrate body, and the strip package colloid body has at least one exposed lens portion projected upwardly from the exposed top surface thereof and corresponding to the LED chips. Hence, light beams generated by the LED chips pass through the strip package colloid body to form a strip light-emitting area on the strip package colloid body.01-12-2012
20120015463METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE - The present invention relates to a method for manufacturing a light-emitting device, the method including applying resin encapsulation to a lead frame having mounted and packaged thereon a plurality of light-emitting elements, in which the following lead frame portion (A) is used as the lead frame portion: (A) a lead frame portion that is obtained by cutting and separating a lead frame, in which the lead frame has a lattice form including a plurality of rows and a plurality of columns with a plurality of intersection points formed thereby and has a plurality of light-emitting elements disposed and packaged between the adjacent intersection points in each row, into individual column to produce a lead frame portion for each column, and that is passed a light emission test performed by flowing a current to the lead frame portion.01-19-2012
20120021543LIGHT EMITTING DEVICES WITH IMPROVED LIGHT EXTRACTION EFFICIENCY - Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent lens having a refractive index for light emitted by the active region preferably greater than about 1.5, more preferably greater than about 1.8. A method of bonding a transparent lens to a light emitting device having a stack of layers including semiconductor layers comprising an active region includes elevating a temperature of the lens and the stack and applying a pressure to press the lens and the stack together. Bonding a high refractive index lens to a light emitting device improves the light extraction efficiency of the light emitting device by reducing loss due to total internal reflection. Advantageously, this improvement can be achieved without the use of an encapsulant.01-26-2012
20120021542METHOD OF PACKAGING LIGHT EMITTING DEVICE - A method of packaging a light emitting device includes the following steps: providing a base; forming a mask on the base, the mask defining a plurality of holes therein; positioning a certain amount of glue in each of the holes; securing a film on the mask, a plurality of light emitting elements being positioned on the film, and each of the light emitting elements being positioned in a corresponding hole and adhered by the glue in the corresponding hole; separating the light emitting elements from the film and removing the film from the mask; and removing the mask from the base.01-26-2012
20130196460Light-Emitting Diode (LED) Devices Comprising Nanocrystals - The present invention provides light-emitting diode (LED) devices comprises compositions and containers of hermetically sealed luminescent nanocrystals. The present invention also provides displays comprising the LED devices. Suitably, the LED devices are white light LED devices.08-01-2013
20120295375PEELING METHOD AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE PEELING METHOD - The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a first adhesive and to cure a second adhesive at the same time in a peeling process, thereby to simplify a manufacturing process. In addition, the present invention is to devise the timing of transcribing a peel-off layer in which up to an electrode of a semiconductor are formed to a predetermined substrate. In particular, a feature is that peeling is performed by using a pressure difference in the case that peeling is performed with a state in which plural semiconductor elements are formed on a large-size substrate.11-22-2012
20120088321Efficient LED Array - An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.04-12-2012
20120088320Method of forming polymer-dispersed liquid crystal film including dichroic dye - In a method of forming a polymer-dispersed liquid crystal (PDLC) film, the presence of dichroic dye in a polymer may be prevented or reduced by diffusing dichroic dye into a PDLC layer, and a PDLC display device having improved visibility may be formed.04-12-2012
20120088319Light source with hybrid coating, device including light source with hybrid coating, and/or methods of making the same - Certain example embodiments of this invention relate to techniques for improving the performance of Lambertian and non-Lambertian light sources. In certain example embodiments, this is accomplished by (1) providing an organic-inorganic hybrid material on LEDs (which in certain example embodiments may be a high index of refraction material), (2) enhancing the light scattering ability of the LEDs (e.g., by fractal embossing, patterning, or the like, and/or by providing randomly dispersed elements thereon), and/or (3) improving performance through advanced cooling techniques. In certain example instances, performance enhancements may include, for example, better color production (e.g., in terms of a high CRI), better light production (e.g., in terms of lumens and non-Lambertian lighting), higher internal and/or external efficiency, etc.04-12-2012
20120094407WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME - A wafer level LED package structure includes a light-emitting unit, a reflecting unit, a first conductive unit and a second conductive unit. The light-emitting unit has a substrate body, a light-emitting body disposed on the substrate body, a positive and a negative conductive layers formed on the light-emitting body, and a light-emitting area formed in the light-emitting body. The reflecting unit has a reflecting layer formed between the positive and the negative conductive layers and on the substrate body for covering external sides of the light-emitting body. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive structure formed on the first positive conductive layer and a second negative conductive structure formed on the first negative conductive layer.04-19-2012
20120094406FABRICATION OF PHOSPHOR DOTS AND APPLICATION OF PHOSPHOR DOTS TO ARRAYS OF LIGHTING ELEMENTS - In accordance with certain embodiments, arrays of phosphor dots are formed and associated with arrays of light-emitting elements to form lighting systems.04-19-2012
20120094405METHOD FOR MANUFACTURING LED PACKAGE - A method for manufacturing an LED package includes following steps: providing a substrate, wherein the substrate includes a plurality of package carriers and each package carrier includes two lead frames. Each package carrier includes a first surface and a recession surrounded by a bottom wall and a sidewall is defined on the first surface. Mount an LED chip on the bottom wall and electrical connecting the LED chip and the two lead frames, form an encapsulation in the recession; form a hydrophobic layer on the package carrier and the encapsulation; cut the substrate into a plurality of LED package structure.04-19-2012
20130210178LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting device and method for manufacturing the same are described. A method for manufacturing a light-emitting device comprising the steps of: providing a substrate; forming a light-emitting structure on the substrate, wherein the light-emitting structure comprising a plurality of chip areas and a plurality of street areas; forming a conductive structure between the substrate and the light-emitting structure; removing a part of the light-emitting structure in the street areas to expose a sidewall in the chip areas; forming a first passivation layer on the light-emitting structure in the chip areas; and forming a second passivation layer in the street areas, the sidewalls of the light-emitting structure, and the sidewalls of the first passivation layer.08-15-2013

Patent applications in class Having additional optical element (e.g., optical fiber, etc.)