Entries |
Document | Title | Date |
20080199982 | Fabrication Process for Package With Light Emitting Device On A Sub-Mount - A method of fabricating a package with a light emitting device includes depositing a first metallization to form a conductive pad on which the light emitting device is to be mounted and to form one or more feed-through interconnections extending through a semiconductor material that supports the conductive pad. Subsequently, a second metallization is deposited to form a reflective surface for reflecting light, emitted by the light emitting device, through a lid of the package. Deposition of the second metallization is de-coupled from deposition of the first metallization. | 08-21-2008 |
20080206910 | Luminescent sheet covering for LEDs - A lighting apparatus comprising at least one light emitting diode is disposed on an interconnect board to emit ultraviolet or blue radiation. A polymeric layer including a luminophor is disposed about the lighting apparatus to convert at least a portion of the radiation emitted from the LED into visible light. The polymeric layer is shrinkable to conform to a shape enclosing the light emitting diode. | 08-28-2008 |
20080213928 | METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE - A method for manufacturing a semiconductor light emitting device can result in a device that includes a housing having a cavity, a light emitting element on a bottom face of the cavity, and a wavelength conversion layer provided within the cavity. The wavelength conversion layer can include particles of a wavelength conversion material. The method includes forming the wavelength conversion layer within the cavity, which can include applying and hardening a first material to form a first wavelength conversion layer on the light emitting element, and applying and hardening a second material to substantially fill the remainder of the entire cavity, thereby forming a second wavelength conversion layer. The semiconductor light emitting device manufactured by the inventive method can achieve uniform light emitting characteristics without substantially any uneven color and can include high heat dissipation efficiency. | 09-04-2008 |
20080220548 | MULTI-CHIP SURFACE MOUNTED LED STRUCTURE AND A METHOD FOR MANUFACTURING THE SAME - A multi-chip surface mounted LED structure and a method for manufacturing the same, said LED structure comprises a plurality of equivalent lighting units, each lighting unit comprises an LED chip, a heat sink structure, two opposing electrodes, said plurality of equivalent lighting units are mutually connected by a supporting structure; said method comprises the steps of firstly cutting a metal material belt to form a basic shape and using plastic injection molding to form said supporting structure, and then using chip bonding and wire bonding to connect said two opposing electrodes, and connecting adjacent lighting units in series/parallel, and finally cutting off a spare region of said metal material belt and packaging sad LED structure to form said multi-chip surface mounted LED structure; furthermore, a plurality of multi-chip surface mounted LED structures can be mutually connected in series/parallel by directly cutting said metal material belt to form a connection area thereon to enable conductivity between adjacent multi-chip surface mounted LED structures. | 09-11-2008 |
20080220549 | Sealed light emitting diode assemblies including annular gaskets and methods of making same - An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device. | 09-11-2008 |
20080248602 | LIGHT EMITTING DEVICE PROCESSES - Light-emitting devices, and related components, processes, systems and methods are disclosed. | 10-09-2008 |
20080254556 | Semiconductor Light Emitting Device and Method of Manufacture - A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant. | 10-16-2008 |
20080261338 | Method For Manufacturing an Electronics Module Comprising a Component Electrically Connected to a Conductor-Pattern Layer - Method for manufacturing an electronic module, which electronic module includes a component ( | 10-23-2008 |
20080268559 | Mold for Forming a Molding Member and Method of Fabricating a Molding Member Using the Same - There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member. | 10-30-2008 |
20080280384 | SOLID-STATE LIGHT EMITTING DISPLAY AND FABRICATION METHOD THEREOF - A solid-state light emitting display and a fabrication method thereof are proposed. The light emitting display includes a metallic board formed with conductive circuits, and a plurality of luminous microcrystals disposed on a surface of the metallic board and electrically connected to the conductive circuits. The metallic board provides the features of lightness and thinness, and flexibility, and the luminous microcrystals are in the form of light emitting components, so as to improve the luminous efficiency of display and attain the effect of environmental protection and energy saving, thereby providing display technology with performance satisfactory for various display requirements. | 11-13-2008 |
20080299688 | METHOD OF BONDING A SOLDER TYPE LIGHT EMITTING DIODE CHIP - In a method of bonding a low-resistance solder type light emitting diode chip, a copper substrate is prepared; an insulating layer is coated on the copper substrate; a conductive layer is formed on the insulating layer; a solder paste is coated onto the conductive layer by silk screen printing; a the chip is placed on the conductive layer and heated to melt the solder paste coated between the conductive layer and the chip; and finally the copper substrate is cooled such that the solder paste forms a solder layer to mount the chip onto the conductive layer. | 12-04-2008 |
20080318353 | MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES HAVING INTEGRAL REFERENCE FEATURES AND METHODS FOR MANUFACTURING SUCH MICROELECTRONIC IMAGERS - Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors, integrated circuitry operatively coupled to the image sensors, and external contacts electrically coupled to the integrated circuitry. The assembly also includes optics supports on the workpiece. The optics supports have openings aligned with corresponding image sensors and first interface features at reference locations relative to corresponding image sensors. The assembly further includes optical devices having optics elements and second interface features seated with corresponding first interface features to position the optics elements at a desired location relative to corresponding image sensors. | 12-25-2008 |
20090011527 | PRODUCING A SURFACE-MOUNTABLE RADIATION EMITTING COMPONENT - A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light emitting diode chip. | 01-08-2009 |
20090017566 | Substrate Removal During LED Formation - A light emitting diode (LED) is fabricated using an underfill layer that is deposited on either the LED or the submount prior to mounting the LED to a submount. The deposition of the underfill layer prior to mounting the LED to the submount provides for a more uniform and void free support, and increases underfill material options to permit improved thermal characteristics. The underfill layer may be used as support for the thin and brittle LED layers during the removal of the growth substrate prior to mounting the LED to the submount. Additionally, the underfill layer may be patterned to and/or polished back so that only the contact areas of the LED and/or submount are exposed. The patterns in the underfill may also be used as a guide to assist in the singulating of the devices. | 01-15-2009 |
20090017567 | Method for manufacturing semiconductor device - An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated. | 01-15-2009 |
20090053838 | METHOD FOR MANUFACTURING SEMICONDUCTOR LASER DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR LASER BAR - A first conductivity type cladding layer, an active layer, a second conductivity type first cladding layer, and a second conductivity type second cladding layer are laminated in this order on a semiconductor substrate by crystal growth. The second conductivity type second cladding layer is processed into a plurality of stripe-shaped ridge structure portions, and a laser bar is formed by cleavage in a direction orthogonal to a longitudinal direction of the ridge structure portions. A plurality of columns of the ridge structure portions that are aligned in the longitudinal direction of the ridge structure portions at predetermined intervals are arranged. The arrangement is such that each of the columns is displaced from the adjacent column in the longitudinal direction of the ridge structure portions so that an end portion of each of the ridge structure portions and an end portion of the adjacent ridge structure portion overlap each other in the longitudinal direction of the ridge structure portions. A region where the end portion of each of the ridge structure portions and the end portion of the adjacent ridge structure portion overlap each other is cleaved. According to this method, it is possible to provide a method for manufacturing a semiconductor laser device and a method for inspecting a semiconductor laser bar in the manufacturing process, capable of determining for each chip whether or not a deviation of the resonator length is within the tolerance in a simple manner. | 02-26-2009 |
20090053839 | HIGH POWER LED HOUSING AND FABRICATION METHOD THEREOF - An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat. | 02-26-2009 |
20090061549 | PROCESS FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE - The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in the resin sheet A and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B; and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B. According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life. | 03-05-2009 |
20090068774 | LED Bonding Structures and Methods of Fabricating LED Bonding Structures - A method is disclosed for fabricating an LED The method includes providing an LED chip having an epitaxial region comprising at least a p-type layer and an n-type layer, an ohmic contact formed on at least one of the p-type layer or the n-type layer, and a bond pad formed on the ohmic contact. The bond pad has a total volume less than about 3×10 | 03-12-2009 |
20090087931 | METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE - Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die. | 04-02-2009 |
20090098672 | Method for making a heat dissipating device for LED installation - A method for making a heat dissipating device for LED installation, comprising the steps of a) preparing a thermal member having a metal surface, b) covering at least a part of the metal surface of the thermal member with a electrically insulative thermal conductivity layer, and c) providing multiple conducting layers at the electrically insulative thermal conductive layer for the installation of LED (light emitting diode) chips. | 04-16-2009 |
20090124031 | Flip-Chip Packaging Structure For Light Emitting Diode And Method Thereof - A packaging structure and method for a light emitting diode is provided. The present invention uses flip-chip and eutectic bonding technology to attach a LED to a thermal and electrical conducting substrate. The flip-chip packaging structure comprises a thermal and electrical conducting substrate having an insulating layer formed in an appropriate area on the top surface of the substrate and a bonding pad formed on top of the insulating layer; and a LED reversed in a flip-chip style and joined to the substrate by eutectic bonding. A first electrode of the LED is eutectically bonded to an appropriate area on the top surface of the substrate via a eutectic layer, while a second electrode of the LED is electrically connected to the bonding pad. | 05-14-2009 |
20090124032 | Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same - An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips. | 05-14-2009 |
20090137072 | LIGHT EMITTING DEVICE METHODS - Light-emitting device methods are disclosed. | 05-28-2009 |
20090155937 | METHOD FOR PACKAGING LED DEVICE - A method for packaging LED device comprises following steps: ( | 06-18-2009 |
20090162955 | LED DEVICE WITH IMPROVED LIFE PERFORMANCE - A light-emitting diode with an improved service life is provided. The diode is formed from a transparent outer shell that contains a heat-resistant encapsulant at least partially surrounding a light-emitting diode clip. The first encapsulant is compressed between the outer shell and a second encapsulant when it is sealed into the outer shell by the second encapsulant. | 06-25-2009 |
20090170226 | Package for a Semiconductor Light Emitting Device - A semiconductor light emitting device package includes a substrate with a core and a copper layer overlying the core. The light emitting device is connected to the substrate directly or indirectly through a wiring substrate. The core of the substrate may be, for example, ceramic, Al | 07-02-2009 |
20090170227 | MASK AND CONTAINER AND MANUFACTURING - The present invention provides a large mask with a high mask accuracy for conducting selective deposition on a substrate with a large surface area. In accordance with the present invention, the mask body is fixed in a fixing position disposed on a line passing through a thermal expansion center in the width of the mask frame. Further, in accordance with the present invention, the substrate and mask body are fixed and deposition is carried out by moving the deposition source in the X direction or Y direction. A method comprising moving the deposition source in the X direction or Y direction is suitable for deposition on large substrates. | 07-02-2009 |
20090176323 | PROCESS FOR PRODUCING LIGHT-EMITTING SEMICONDUCTOR DEVICE - A process for producing a light-emitting semiconductor device includes: (i) mixing at least one low-molecular silane or at least one silanol with an alcohol solution containing an alkoxysiloxane to prepare a mixture solution, the amount of the silane or silanol being from 10% by weight to 50% by weight based on the dry weight of an encapsulating material to be formed; (ii) applying the mixture solution to a light-emitting element; (iii) vaporizing the alcohol solvent in the mixture solution applied and drying the residual mixture to thereby form the encapsulating material; and (iv) curing the encapsulating material. | 07-09-2009 |
20090186433 | Method of making phosphor containing glass plate, method of making light emitting device - A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder, heating and softening the mixed powder to provide an integrated material, and subsequently solidifying the integrated material to provide a phosphor-dispersed glass, and fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light emitting element is mounted by hot pressing, and simultaneously sealing the light emitting element with the phosphor-dispersed glass on the mounting portion. | 07-23-2009 |
20090186434 | Led chip package structre with a plurality of thick guiding and a method for manufactruing the same - An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips. | 07-23-2009 |
20090197360 | LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF - An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip. | 08-06-2009 |
20090246897 | LED chip package structure and method for manufacturing the same - An LED chip package structure includes a substrate unit, a light-emitting unit, and a colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace is respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body for generating light, wherein each of the LED chips has a positive side and a negative side respectively electrically connected with the positive electrode trace and the negative electrode trace. The colloid unit is covered over the substrate unit and the light-emitting unit for guiding the light from the light-emitting unit to form a series of light-generating areas on the colloid unit. | 10-01-2009 |
20090258449 | FABRICATING METHOD OF LIGHT EMITTING DIODE PACKAGE - A method of fabricating a light emitting diode package structure is provided. First, a first circuit substrate having a first surface and a corresponding second surface and a second circuit substrate having a third surface and a corresponding fourth surface are provided. The second surface and the third surface respectively have a plurality of electrodes. Then, a plurality of N-type semiconductor materials and a plurality of P-type semiconductor materials alternatively arranged on the electrodes are formed. Then, the first circuit substrate and the second circuit substrate are assembled. The two type semiconductor materials are located between the electrodes of the first circuit substrate and the second circuit substrate. The two type semiconductor materials are electrically connected to the first circuit substrate and the second circuit substrate through the electrodes. Finally, an LED chip is arranged on the first surface and electrically connected to the first circuit substrate. | 10-15-2009 |
20090275153 | METHOD OF PRODUCTION OF SEMICONDUCTOR LIGHT EMISSION DEVICE AND METHOD OF PRODUCTION OF LIGHT EMISSION APPARATUS - A method of production of semiconductor light emission devices for forming stripes of two multilayers having different emission wavelengths on a substrate, including the steps of: depositing a first multilayer including an active layer on the substrate; selectively etching the first multilayer to form a plurality of adjoining pairs of stripes of the first multilayer; depositing a second multilayer including an active layer on the substrate and the stripes of the first multilayer; selectively etching the second multilayer to form a plurality of adjoining pairs of stripes of the second multilayer on the substrate between the stripes of the first multilayer; and dividing the substrate between adjoining pairs of stripes of the first multilayer and between adjoining pairs of stripes of the second multilayer to divide it into semiconductor light emission devices provided with a stripe of the first multilayer and the second multilayer having different emission wavelengths. | 11-05-2009 |
20090291516 | Peeling Method and Method of Manufacturing Semiconductor Device - There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact property between a first material layer ( | 11-26-2009 |
20090305443 | METHOD OF MAKING LIGHT EMITTING DIODES - A method of making a plurality of light emitting diodes simultaneously includes steps of: a) providing a wafer and a first bonding layer, and adhering the first bonding layer to a bottom side of the wafer; b) cutting the wafer to form a plurality of LED dies on the first bonding layer; c) adhering a second bonding layer on top sides of the plurality of LED dies; d) removing the first bonding layer; e) mounting the second bonding layer with the plurality of LED dies on a base having a plurality of recesses; f) removing the second bonding layer and letting the plurality of LED dies fall into the recesses of the base; g) electrically connecting the LED dies to electric poles in the base; h) encapsulating the LED dies; and i) cutting the base to form the plurality of LEDs. | 12-10-2009 |
20100015738 | Light emitting elements and methods of fabricating the same - Methods of fabricating light emitting elements and light emitting devices, light emitting elements and light emitting devices are provided. In some embodiments, the methods of fabricating a light emitting element includes forming a buffer layer on at least one first substrate, bonding the at least one first substrate on a second substrate, wherein the buffer layer is placed between each of the first substrate and the second substrate and the second substrate is larger than the first substrate, exposing the buffer layer, and sequentially forming a first conductive layer, a light emitting layer, and a second conductive layer on the exposed buffer layer. | 01-21-2010 |
20100041169 | Method of forming a resin cover lens of LED assembly - A method of forming the resin cover lens of LED assembly uses transparent materials, such as plastics, PP (Polypropylene), PET (Polyethylene teraphthalate), PC (Polycarbonate), PE (Polyethylene) or glass to produce the mold for making lens; and uses liquid transparent resin that can be quickly cured under EB (electron-beam) radiation, such as PU (Polyurethane), epoxy, silicon, acrylic resin or its copolymer et al., or the above resin added with photo initiator and curable under UV radiation; and fills in the mold cavity with the resin; and selects EB or UV to cure the liquid transparent resin inside the cavity to form lens. The new process in the invention is to reduce the curing time for making lens that helps LED assembly achieve high throughput rate and mass production. | 02-18-2010 |
20100041170 | Package-Integrated Thin Film LED - LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the LED die such that the LED layers are between the package substrate and the growth substrate. The package substrate provides electrical contacts and conductors leading to solderable package connections. The growth substrate is then removed. Because the delicate LED layers were bonded to the package substrate while attached to the growth substrate, no intermediate support substrate for the LED layers is needed. The relatively thick LED epitaxial layer that was adjacent the removed growth substrate is then thinned and its top surface processed to incorporate light extraction features. There is very little absorption of light by the thinned epitaxial layer, there is high thermal conductivity to the package because the LED layers are directly bonded to the package substrate without any support substrate therebetween, and there is little electrical resistance between the package and the LED layers so efficiency (light output vs. power input) is high. The light extraction features of the LED layer further improves efficiency. | 02-18-2010 |
20100047935 | LED PACKAGING METHOD USING A SCREEN PLATE - A LED packaging method includes a procedure of placing a screen plate having stepped holes on a substrate carrying LED chips, a procedure of reversing the screen plate with respect to the substrate, and a procedure of packaging the LED chips with a first packaging adhesive and a second packaging adhesive by means of applying the first packaging adhesive to the small diameter portion of each stepped hole when the first side of the screen plate is attached to the substrate and then applying the second packaging adhesive to the big diameter portion of each stepped hole after the screen plate is reversed. | 02-25-2010 |
20100047936 | METHOD FOR PACKAGING LIGHT-EMITTING DIODE - Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device. | 02-25-2010 |
20100047937 | LED PACKAGE - A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source. | 02-25-2010 |
20100047938 | FLAT PANEL DISPLAY DEVICE AND METHOD FOR FABRICATING SAME - Provided is a flat panel display device and a method for fabricating the same. The flat panel display device comprises a first substrate, a light emitting unit, a second substrate, and insulating films. The light emitting unit comprises thin film transistors positioned on the first substrate, a first electrode electrically connecting with the thin film transistors, a second electrode facing the first electrode, and an emission layer or a liquid crystal layer interposed between the first and second electrodes. The second substrate is sealed with the first substrate by an ultraviolet curing sealant, and has a greater thermal expansion coefficient than the first substrate. The insulating films are positioned on one or more surfaces of the first and/or second substrates. | 02-25-2010 |
20100055811 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A SUBSTRATE - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. | 03-04-2010 |
20100055812 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CONDUCTIVE TRACE - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 03-04-2010 |
20100062552 | SILICONE RESIN COMPOSITION FOR ENCAPSULATING LUMINESCENT ELEMENT AND PROCESS FOR PRODUCING OPTICAL-SEMICONDUCTOR ELECTRONIC PART WITH THE SAME THROUGH POTTING - The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method. | 03-11-2010 |
20100075448 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/CAP HEAT SPREADER - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a cap on the post, mounting a semiconductor device on a heat spreader that includes the post, the base and the cap, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 03-25-2010 |
20100087020 | SEMICONDUCTOR CHIP ASSEMBLY WITH COPPER/ALUMINUM POST/BASE HEAT SPREADER - A method of making a semiconductor chip assembly includes providing a post and a base that include a copper surface layer and an aluminum core, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 04-08-2010 |
20100136724 | METHOD FOR FABRICATING A NANOSTRUCTURED SUBSTRATE FOR OLED AND METHOD FOR FABRICATING AN OLED - Method for fabricating a substrate comprising a nanostructured surface for an organic light emitting diode OLED, in which a layer of an organic resin or of a mineral material having a first nanostructuration is prepared by nano-imprint; the organic resin or mineral material is heated to a temperature equal to or higher than its glass transition temperature Tg or its melting point, and the organic resin or the mineral material is maintained at this temperature for a time t | 06-03-2010 |
20100136725 | THERMAL MANAGEMENT FOR LED - A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED. | 06-03-2010 |
20100144072 | ORGANIC LIGHT EMITTING DISPLAY AND METHOD OF FABRICATING THE SAME - An organic light emitting display (OLED) and a method of fabricating the same are provided. The method includes forming the OLED having upper and lower substrates that emit different colors from each other, and coupling the upper and lower substrates together. | 06-10-2010 |
20100151601 | APPARATUS FOR HARDENING SEAL OF ELECTROPHORETIC DISPLAY DEVICE AND METHOD OF FABRICATING ELECTROPHORETIC DISPLAY DEVICE USING THEREOF - In an apparatus for curing a seal in an electrophoretic display device according to the present invention, a support having magnetism may be provided on a curing table to be loaded with an electrophoretic display device in order to support the electrophoretic display device while at the same time generating a magnetic force in a direction opposite to a stress caused by a seal material in the electrophoretic display device, thereby preventing the electrophoretic display device from being bent when the seal material is cured. | 06-17-2010 |
20100167436 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A SIGNAL POST - A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, the signal post and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 07-01-2010 |
20100167437 | PEELING METHOD AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE PEELING METHOD - The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a first adhesive and to cure a second adhesive at the same time in a peeling process, thereby to simplify a manufacturing process. In addition, the present invention is to devise the timing of transcribing a peel-off layer in which up to an electrode of a semiconductor are formed to a predetermined substrate. In particular, a feature is that peeling is performed by using a pressure difference in the case that peeling is performed with a state in which plural semiconductor elements are formed on a large-size substrate. | 07-01-2010 |
20100167438 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH AN ALUMINUM POST/BASE HEAT SPREADER AND A SILVER/COPPER CONDUCTIVE TRACE - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a copper layer on the adhesive including aligning the post with an aperture in the copper layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the copper layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a silver coating and a copper core that is a selected portion of the copper layer, mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 07-01-2010 |
20100184241 | METHOD FOR MANUFACTURING THIN TYPE LIGHT EMITTING DIODE ASSEMBLY - A method is applied to manufacture a thin type light emitting diode (LED) assembly, and comprises the steps of: pressing a light-transmissible conductive film onto a carrier; etching an etched circuit on the light-transmissible conductive film to form an etched light-transmissible conductive film; bonding a LED chip on the etched light-transmissible conductive film to make the LED chip electrically connected with the etched circuit; covering the LED chip and the etched light-transmissible conductive film with a light-transmissible encapsulation layer to encapsulate the LED chip therein; and cutting the carrier to make the carrier be removed from the etched light-transmissible conductive film, so as to manufacture the thin type LED assembly. | 07-22-2010 |
20100210045 | OPTO-ELECTRONIC DEVICE PACKAGE WITH A SEMICONDUCTOR-BASED SUB-MOUNT HAVING SMD METAL CONTACTS - Non-planar via designs for sub-mounts on which to mount a LED or other optoelectronic device include a continuous layer of metal to conduct the current from the front-side (e.g., LED side) to the backside (e.g., SMD side) through the via and to provide a sufficiently stable and reliable under bump metallization for SMD soldering. Each UBM can be structured so that it does not fully cover the sidewall surfaces of the via that forms the front-to-backside interconnect. In some implementations, each via structure for the feedthrough metallization extends to a respective side-edge of the sub-mount. | 08-19-2010 |
20100210046 | Light emitting diode chip, and methods for manufacturing and packaging the same - A light emitting diode chip includes a substrate, an epitaxial layer, two inclined plane units, and two electrode units. The substrate has top and bottom surfaces. The epitaxial layer is disposed on the top surface of the substrate. Each of the inclined plane units is inclined downwardly and outwardly from the epitaxial layer toward the bottom surface of the substrate, and includes an inclined sidewall formed on the epitaxial layer, and a substrate inclined wall formed on the substrate. Each of the electrode units includes an electrode disposed on the epitaxial layer, and a conductive portion extending from the electrode to the substrate inclined wall along corresponding one of the inclined plane units. | 08-19-2010 |
20100210048 | METHOD OF MOUNTING LED CHIP - A method of mounting an LED chip, which is intended to suppress void-generation inside an eutectic bonding without use of flux. This method includes a step of eutectically bonding a first metal layer (e.g., AuSn layer) on a rear surface of the LED chip, with a metal ground layer on a dielectric substrate (mounting member). This method includes a step of providing a second metal layer having the same metal component as the first metal layer, to the top surface of the metal ground layer on a dielectric substrate; and subsequently connecting the LED chip and the dielectric substrate by way of eutectically bond while the dielectric substrate is heated at its bottom surface remote from the metal ground layer to melt the second metal layer by heat source (heater or the like). | 08-19-2010 |
20100210049 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND DUAL ADHESIVES - A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer, providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then flowing a second adhesive into and downward in a gap between the post and the conductive trace, solidifying the second adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 08-19-2010 |
20100221853 | METHOD FOR GENERATING AN ELECTRODE LAYER PATTERN IN AN ORGANIC FUNCTIONAL DEVICE - A method for generating an electrode layer pattern in an organic functional device ( | 09-02-2010 |
20100227421 | METHOD OF BONDING A SEMICONDUCTOR DEVICE USING A COMPLIANT BONDING STRUCTURE - A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer. | 09-09-2010 |
20100227422 | METHOD FOR MANUFACTURING ORGANIC ELECTROLUMINESCENCE DEVICE - The present invention is intended to provide a method for manufacturing an organic EL device, which method can form a film having high barrier properties to water vapor or oxygen, while suppressing damage to an organic EL element, during formation of the film including inorganic layers for sealing the organic EL element. When an organic EL element ( | 09-09-2010 |
20100227423 | LED BACKLIGHT UNIT WITHOUT PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material. | 09-09-2010 |
20100227424 | LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - The present invention relates to a light emitting diode package and a manufacturing method thereof. | 09-09-2010 |
20100261299 | PACKAGING PROCESS OF LIGHT EMITTING DIODE - A packaging process of a light emitting diode (LED) is provided. First, an LED chip is bonded with a carrier to electrically connect to each other. After that, the carrier is heated to raise the temperature thereof. Next, an encapsulant is formed on the heated carrier by a dispensing process to encapsulate the LED chip, wherein the viscosity of the encapsulant before contacting the carrier is lower than that of the encapsulant after contacting the carrier. Thereafter, the encapsulant is cured. | 10-14-2010 |
20100279443 | LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF - A light emitting diode and its fabricating method are disclosed. A light emitting diode epitaxy structure is formed on a substrate, and then the light emitting diode epitaxy structure is etched to form a recess. The recess is then filled with a transparent dielectric material. An adhesive layer is utilized to adhere a conductive substrate and the light emitting diode epitaxy structure. Next, the substrate is removed. | 11-04-2010 |
20100330714 | MOLD FOR FORMING A MOLDING MEMBER AND METHOD OF FABRICATING A MOLDER MEMBER USING THE SAME - There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member. | 12-30-2010 |
20110003409 | LED CHIP PACKAGE STRUCTURE WITH AN EMBEDDED ESD FUNCTION AND METHOD FOR MANUFACTURING THE SAME - An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit. | 01-06-2011 |
20110014731 | METHOD FOR SEALING A PHOTONIC DEVICE - Methods for sealing a photonic device are disclosed. The photonic device may, for example, comprise a display device, a lighting device or a photovoltaic device. The device is sealed with a glass frit that is heated with a laser from both sides of the device (through both glass substrate plates), either sequentially or simultaneously. The methods can facilitate wider seal widths, and wider overall frit wall widths for increased device strength. | 01-20-2011 |
20110027921 | METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a method for manufacturing a semiconductor light emitting device includes forming a separation groove on a major surface of a substrate. A semiconductor layer including a light emitting layer is formed on the substrate. The separation groove separates the semiconductor layer into a plurality of elements. The method includes forming an insulating film on the major surface of the substrate. The insulating film covers the semiconductor layer and a bottom surface of the separation groove provided on the substrate. The method includes separating the substrate from the semiconductor layer by irradiating the semiconductor layer with laser light from an surface of the substrate opposite to the major surface. An edge portion of irradiation area of the laser light is positioned near an edge portion of the semiconductor layer neighboring the separation groove. | 02-03-2011 |
20110039357 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND AN ADHESIVE BETWEEN THE BASE AND A TERMINAL - A method of making a semiconductor chip assembly includes providing a thermal post, a signal post, a base and a terminal, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer and downward between the base and the terminal, solidifying the adhesive, providing a conductive trace that includes a pad, the terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 02-17-2011 |
20110053297 | SUBMOUNTS FOR SEMICONDUCTOR LIGHT EMITTING DEVICES AND METHODS OF FORMING PACKAGED LIGHT EMITTING DEVICES INCLUDING DISPENSED ENCAPSULANTS - A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed. | 03-03-2011 |
20110070672 | MANUFACTURING METHOD FOR ORGANIC LIGHT EMITTING DEVICE - A method for manufacturing an organic light emitting device is disclosed. In one embodiment, the method includes an organic light emitting diode comprising a first electrode, a light emission layer, and a second electrode on a substrate; forming a first protection film by loading the substrate on which the organic light emitting diode has been formed to an inkjet device in a first direction; and forming a second protection film by loading the substrate on which the first protection film has been formed in a second direction, the first and the second direction being formed differently from each other. | 03-24-2011 |
20110070673 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - The semiconductor device | 03-24-2011 |
20110081735 | PROCESS FOR FORMING ENCAPSULATED ELECTRONIC DEVICES - There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes. | 04-07-2011 |
20110092002 | METHOD FOR FABRICATING A LIGHT EMITTING DIODE PACKAGE STRUCTURE - The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess. | 04-21-2011 |
20110111536 | Method of mounting a LED module to a heat sink - A method of mounting a light emitting diode (LED) module ( | 05-12-2011 |
20110111537 | HIGH THERMAL CONDUCTIVITY SUBSTRATE FOR A SEMICONDUCTOR DEVICE - A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation. | 05-12-2011 |
20110129951 | PROCESS FOR MANUFACTURING SEALED ORGANIC ELECTROLUMINESCENCE DEVICES - A process for manufacturing sealed organic EL devices includes a step of forming an organic EL layer on a region of an anode-mounted substrate having a substrate and an anode, the region including at least a bonding region in which a sealing member will be bonded and a region which is found inward the bonding region; a step of removing a portion of the organic EL layer which is found at least on the bonding region by applying plasma by a remote plasma method to expose the bonding region; a step of forming a cathode on the organic EL layer to complete an organic EL device; and a step of bonding a sealing member to the exposed bonding region. | 06-02-2011 |
20110136273 | REFLECTIVE CONTACT FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE - A light emitting device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. A contact is formed on the semiconductor structure, the contact comprising a reflective metal in direct contact with the semiconductor structure and an additional metal or semi-metal disposed within the reflective metal. In some embodiments, the additional metal or semi-metal is a material with higher electronegativity than the reflective metal. The presence of the high electronegativity material in the contact may increase the overall electronegativity of the contact, which may reduce the forward voltage of the device. In some embodiments, an oxygen-gathering material is included in the contact. | 06-09-2011 |
20110151602 | METHOD OF MANUFACTURING TRANSFERABLE ELEMENTS INCORPORATING RADIATION ENABLED LIFT OFF FOR ALLOWING TRANSFER FROM HOST SUBSTRATE - Semiconductor material is formed on a host substrate of a material exhibiting optical transparency with an intervening radiation lift off layer. A transfer device, intermediate substrate or target substrate is brought into adhesive contact with the semiconductor material and the radiation lift off layer is irradiated to weaken it, allowing the semiconductor material to be transferred off the host substrate. Electronic devices may be formed in the semiconductor layer while it is attached to the host substrate or the intermediate substrate. | 06-23-2011 |
20110151603 | LIGHT EMITTING APPARATUS AND METHOD OF MANUFACTURING THE SAME - A light-emitting apparatus of the present invention includes: a first electrode formed on an insulating surface; a first insulating layer covering an end portion of the first electrode and having a tapered edge; a second insulating layer formed on the first electrode and the first insulating layer and formed of one kind or a plurality of kinds selected from the group consisting of silicon oxide, silicon nitride, and silicon oxynitride; an organic compound layer formed on the second insulating layer; and a second electrode formed on the organic compound layer. | 06-23-2011 |
20110159611 | METHOD FOR MANUFACTURING SOI SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A highly reliable semiconductor device capable of high speed operation is manufactured over a flexible substrate at a high yield. A separation layer is formed over an insulating substrate by a sputtering method; the separation layer is flattened by a reverse sputtering method; an insulating film is formed over the flattened separation layer; a damaged area is formed by introducing hydrogen or the like into a semiconductor substrate; an insulating film is formed over the semiconductor substrate in which the damaged area is formed; the insulating film formed over the insulating substrate is bonded to the insulating film formed over the semiconductor substrate, the semiconductor substrate is separated at the damaged area so that a semiconductor layer is formed over the insulating substrate; the semiconductor layer is flattened so as to form an SOI substrate; and the semiconductor device is formed over the SOI substrate. | 06-30-2011 |
20110159612 | Method for Fabricating LED Chip Comprising Reduced Mask Count and Lift-Off Processing - A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode. | 06-30-2011 |
20110159613 | Method for Fabricating LED Chip Comprising Reduced Mask Count and Lift-Off Processing - A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode. | 06-30-2011 |
20110159614 | Method for Fabricating LED Chip Comprising Reduced Mask Count and Lift-Off Processing - A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode. | 06-30-2011 |
20110165706 | Method for Fabricating LED Chip Comprising Reduced Mask Count and Lift-Off Processing - A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode. | 07-07-2011 |
20110177631 | METHOD OF FORMING A COMPOSITE SUBSTRATE AND GROWING A III-V LIGHT EMITTING DEVICE OVER THE COMPOSITE SUBSTRATE - A method according to embodiments of the invention includes providing a substrate comprising a host and a seed layer bonded to the host. The seed layer comprises a plurality of regions. A semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region is grown on the substrate. A top surface of a semiconductor layer grown on the seed layer has a lateral extent greater than each of the plurality of seed layer regions. | 07-21-2011 |
20110177632 | OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME - An optical device includes a semiconductor substrate ( | 07-21-2011 |
20110177633 | METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE - A method for manufacturing a resin-embedded semiconductor light-emitting device that is capable of preventing a semiconductor film from being damaged when a growth substrate is delaminated using a laser lift-off method, and that is capable of preventing foreign matter from adhering to the semiconductor film when a resin material is applied. A laser exposure step to delaminate the growth substrate from the semiconductor film comprises a first laser exposure step for performing laser exposure at an energy density at which the resin is broken down but the semiconductor film is not broken down, in a range including a portion adjacent to at least one section of the semiconductor film divided by dividing grooves and at least one section of resin, and a second exposure step for performing laser exposure at an energy density at which the semiconductor film can be broken down in a range including at least one section. | 07-21-2011 |
20110189800 | LED PACKAGING METHOD - A light emitting diode (LED) packaging method includes the steps of preparing a circuit board ( | 08-04-2011 |
20110189801 | METHOD FOR DEPOSITION OF CATHODES FOR POLYMER OPTOELECTRONIC DEVICES - Embodiments of the invention explore solution-based deposition of a cathode for an OLED structure. A typical embodiment of the invention may include a method performed according to the following steps: Glass substrates including deposited Indium Tin-Oxide (ITO) are prepared. The substrates are subjected to ultrasonic cleaning with deionized water and organic solvents. Features are etched into the ITO using high concentration HCl solution. A hole injecting layer is deposited by spin coater. The layer is annealed on a hot plate, then a polyphenylene vinylene (PPV) polymer is deposited by spin coater and annealed on a hot plate. Low work function cathode metal is then deposited in an electroless solution and annealed on a hot plate. The device is encapsulated. | 08-04-2011 |
20110201140 | LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system. The light emitting device includes a conductive support member, a light emitting structure layer including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on the conductive support member, and an electrode on the light emitting structure layer. The conductive support member has a curved lateral surface recessed inward. | 08-18-2011 |
20110207251 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - It is provided a contacting method when a plurality of films to be peeled are laminating. Reduction of total layout area, miniaturization of a module, weight reduction, thinning, narrowing a frame of a display device, or the like can be realized by sequentially laminating a plurality of films to be peeled which are once separately formed over a plastic film or the like. Moreover, reliable contact having high degree of freedom is realized by forming each layer having a connection face of a conductive material and by patterning with the use of a photomask having the same pattern. | 08-25-2011 |
20110217799 | METHOD OF SEPARATING SEMICONDUCTOR DIES - A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The stop electroplating material is obliterated, and a barrier layer is formed above the entire remaining structure. A sacrificial metal element is added above the barrier layer, and then the substrate is removed. After the semiconductor material between the individual dies is eradicated, any desired bonding pads and patterned circuitry are added to the semiconductor surface opposite the sacrificial metal element, a passivation layer is added to this surface, and then the sacrificial metal element is removed. Tape is added to the now exposed barrier layer, the passivation layer is removed, the resulting structure is flipped over, and the tape is expanded to separate the individual dies. | 09-08-2011 |
20110223696 | UNDERFILL PROCESS FOR FLIP-CHIP LEDS - An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable. | 09-15-2011 |
20110229991 | SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FLIP-CHIP TYPE ELECTRICAL CONNECTION WITHOUT USING WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME - A semiconductor chip package structure for achieving flip-chip electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a receiving groove. The semiconductor chip is received in the receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative layer is formed between the conductive pads to insulate the conductive pads. The first conductive layers are formed on the first insulative layer and the package unit, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative layer is formed between the first conductive layers in order to insulate the first conductive layers from each other. The second conductive layers are respectively formed on the other opposite sides of the first conductive layers. | 09-22-2011 |
20110237006 | ORGANIC LIGHT-EMITTING COMPONENT - An organic light-emitting component, having a substrate, a first electrode arranged on the substrate, a layer stack that is arranged on the first electrode and that has at least one organic layer and a second electrode arranged on the layer stack. The layer stack is suitable for emitting electromagnetic radiation during operation. The component also has a receiver device, which is suitable for drawing energy from an alternating electromagnetic field and for converting this energy at least partially into electrical energy and for making this energy available to the layer stack. | 09-29-2011 |
20110244606 | CHIP-TYPE LED AND METHOD FOR MANUFACTURING THE SAME - In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin. | 10-06-2011 |
20110244607 | ORGANIC LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed is an organic light emitting device which includes a substrate; a encapsulation substrate, an organic light emitting unit interposed between the substrate and the encapsulation substrate. A water vapor absorption material-containing transparent sealant layer covers the organic light emitting unit. The sealant layer includes a transparent sealant having a water vapor transmission rate (WVTR) of about 20 g/m | 10-06-2011 |
20110263054 | BOND PAD ISOLATION AND CURRENT CONFINEMENT IN AN LED USING ION IMPLANTATION - An improved method of creating LEDs is disclosed. Rather than using a dielectric coating to separate the bond pads from the top surface of the LED, this region of the LED is implanted with ions to increase its resistivity to minimize current flow therethrough. In another embodiment, a plurality of LEDs are produced on a single substrate by implanting ions in the regions between the LEDs and then etching a trench, where the trench is narrower than the implanted regions and positioned within these regions. This results in a trench where both sides have current confinement capabilities to reduce leakage. | 10-27-2011 |
20110287563 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/DIELECTRIC/POST HEAT SPREADER - A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, wherein the first post extends from the dielectric base in a first vertical direction into a first opening in the first adhesive and is aligned with a first aperture in the first conductive layer, the second post extends from the dielectric base in a second vertical direction into a second opening in the second adhesive and is aligned with a second aperture in the second conductive layer and the dielectric base is sandwiched between and extends laterally from the posts, then flowing the first adhesive in the first vertical direction and the second adhesive in the second vertical direction, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal and selected portions of the conductive layers, wherein the pad extends beyond the dielectric base in the first vertical direction and the terminal extends beyond the dielectric base in the second vertical direction, providing a heat spreader that includes the posts and the dielectric base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 11-24-2011 |
20110294241 | Method of using white resin in an electronic device - The coating agent of the invention is a coating agent to be used between conductor members, comprising a thermosetting resin, a white pigment, a curing agent and a curing catalyst, the coating agent to be used between conductor members having a white pigment content of 10-85 vol % based on the total solid volume of the coating agent, and a whiteness of at least 75 when the cured product of the coating agent has been allowed to stand at 200° C. for 24 hours. | 12-01-2011 |
20110300649 | PACKAGE FOR A LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME - A method for fabricating a LED includes: providing a metal substrate; etching the metal substrate to form a first terminal, a second terminal, and a gap between the first terminal and the second terminal, wherein the first terminal has at least one first etching concave and the second terminal has at least one second etching concave; placing at least one LED chip in the at least one first etching concave, wherein the at least one LED chip has a first electrode and a second electrode; electrically connecting the first electrode with the first terminal, and electrically connecting the second electrode with the second terminal; and then covering the at least one LED chip with synthetic polymer, wherein the synthetic polymer is filled into the at least one first etching concave, the at least one second etching concave and the gap to connect the first terminal with the second terminal. | 12-08-2011 |
20120003764 | METHOD OF PRODUCING ORGANIC LIGHT-EMITTING DEVICE - Produced is an organic light-emitting device with high reliability without causing any degradation in light emission characteristics by preventing the intrusion of moisture with respect to an organic light-emitting element. Provided is a method of producing an organic light-emitting device including a substrate | 01-05-2012 |
20120009697 | CHEMICAL VAPOR DEPOSITION APPARATUS AND METHOD OF FORMING SEMICONDUCTOR EPITAXIAL THIN FILM USING THE SAME - A chemical vapor deposition apparatus includes: a reaction chamber including an inner tube having a predetermined volume of an inner space, and an outer tube tightly sealing the inner tube; a wafer holder disposed within the inner tube and on which a plurality of wafers are stacked at predetermined intervals; and a gas supply unit including at least one gas line supplying an external reaction gas to the reaction chamber, and a plurality of spray nozzles communicating with the gas line to spray the reaction gas to the wafers, whereby semiconductor epitaxial thin films are grown on the surfaces of the wafers, wherein the semiconductor epitaxial thin film grown on the surface of the wafer includes a light emitting structure in which a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer are sequentially formed. | 01-12-2012 |
20120009698 | DISPLAY DEVICE, METHOD FOR MANUFACTURING THE SAME AND APPARATUS FOR MANUFACTURING THE SAME - The present inventions provides a method for manufacturing a film-type display device efficiently, and a method for manufacturing a large-size film-type display device, and an apparatus for manufacturing the film-type display device. An apparatus for manufacturing a film-type display device includes: transferring means for transferring a substrate over which an integrated circuit constituting the display device is provided; first separating means for separating the integrated circuit from the substrate by adhering a first sheet material to one surface of the integrated circuit; second separating means for separating the integrated circuit from the first sheet material by adhering a second sheet material to the other surface of the integrated circuit; processing means for forming one or both of a conductive film and an insulating film on the integrated circuit; and sealing means for sealing the processed integrated circuit with the second sheet material and a third sheet material. | 01-12-2012 |
20120015462 | METHOD OF MANUFACTURING LED MODULE - A method for manufacturing an LED module, including steps of: providing a heat conductive plate and an LED die, the heat conductive plate defining a concave groove therein; forming an electrode circuit layer on the heat conductive plate around the concave groove; plating one metal layer on a bottom of the concave groove of the heat conductive plate, and plating another metal layer on the LED die; eutectically bonding the metal layer of the heat conducting plate and the metal layer of the LED die together to form into an eutectic layer; forming electrodes on the LED die, and connecting the electrodes with the electrode circuit layer; and encapsulating the LED die in the concave groove. | 01-19-2012 |
20120021541 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - A method of fabricating a light emitting device initially forms a copper clad ceramic board of the light emitting device using hot-pressing technique at high temperature and photolithography process. Next, a circuit of the light emitting device is formed using die bonding and wire bonding/flipchip processes. Finally, the light emitting device is sealed using transfer molding or injection molding process. | 01-26-2012 |
20120040479 | LIGHT EMITTING ELEMENT, A LIGHT EMITTING DEVICE, A METHOD OF MANUFACTURING A LIGHT EMITTING ELEMENT AND A METHOD OF MANUFACTURING A LIGHT EMITTING DEVICE - The present invention provides a light-emitting element, a method of manufacturing the light-emitting element, a light-emitting device, and a method of manufacturing the light-emitting device. A method of manufacturing a light-emitting element includes: forming a first conductive layer of a first conductive type, a light-emitting layer, and a second conductive layer of a second conductive type on at least one first substrate, forming an ohmic layer on the second conductive layer and bonding the at least one first substrate to a second substrate. The second substrate being larger than the first substrate. The method further includes etching portions of the ohmic layer, the second conductive layer, and the light-emitting layer to expose a portion of the first conductive layer. | 02-16-2012 |
20120040480 | LIGHT EMITTING DEVICE AND THE MANUFACTURE METHOD THEREOF - This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device. | 02-16-2012 |
20120070920 | Method for mounting luminescent device - A method for mounting a luminescent device having a mount layer on a substrate, comprising the steps of coating a metallic nano-particle paste on the substrate, disposing the mount layer of the luminescent device on the metallic nano-particle paste, and heating the mount layer and the metallic nano-particle paste to form an alloy, thereby bonding the luminescent device and the substrate. | 03-22-2012 |
20120070921 | METHOD OF MAKING A LIGHT EMITTING DEVICE HAVING A MOLDED ENCAPSULANT - Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described. | 03-22-2012 |
20120088318 | Method for Fabricating a Vertical Light-Emitting Diode with High Brightness - A method for fabricating a vertical light-emitting diode comprises forming a stack including a plurality of epitaxial layers on a patterned first substrate, placing a second substrate on the stack, removing the first substrate to expose the first surface, planarizing a first surface of the stack that was in contact with the patterned first substrate and has a pattern corresponding to a pattern provided on the first substrate to form a planarized second surface, and forming a first electrode in contact with a side of the second substrate that is opposite to the stack, and a second electrode in contact with the second surface of the stack. A roughening step can be performed to form uneven surface portions on a region of the second surface for improving light emission through the second surface of the stack. | 04-12-2012 |
20120107973 | Method for Producing Lamps - A method for producing luminous means proposes providing a carrier serving as a heat sink, said carrier comprising a planar chip mounting region. The planar chip mounting region is structured for the purpose of producing a first partial region and at least one second partial region. In this case, the first partial region has a solder-repellent property after structuring. Afterward, a solder is applied to the planar chip mounting region, such that said solder wets the at least one second partial region. At least one optoelectronic body is fixed into the at least one second partial region with the solder at the carrier. Finally, contact-connections are formed for the purpose of feeding electrical energy to the optoelectronic luminous body. | 05-03-2012 |
20120115261 | METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE AND FRAME FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE - A method for manufacturing a light emitting device package includes: preparing a base frame including an annular base part, at least a pair of lead parts extending to an inner side of the base part, and at least one support part extending to the inner side of the base part in a direction different from that of the lead parts and having a step structure formed on at least one surface of an end thereof; forming a package main body such that the package main body is combined to the step structure of the support part; separating the lead parts from the base part; disposing a light emitting device on at least one of the lead parts; and separating the package main body from the support part. | 05-10-2012 |
20120115262 | LASER ASSISTED TRANSFER WELDING PROCESS - A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed. | 05-10-2012 |
20120115263 | CHIP-TYPE LED AND METHOD OF MANUFACTURING THE SAME - An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, where a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin. | 05-10-2012 |
20120129281 | RESIN DISPENSING APPARATUS FOR LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE USING THE SAME - There is provided a resin dispensing apparatus for a light emitting device package and a method of manufacturing a light emitting device package using the same. The resin dispensing apparatus includes a resin dispensing part including a resin storage portion filled with a resin therein and a resin discharge portion combined with the resin storage portion and discharging the resin therefrom; a supporting part having a light emitting device package disposed on an upper surface thereof and electrically connected to the light emitting device package; a voltage applying part having both terminals respectively connected to the resin dispensing part and the supporting part to apply a voltage thereto; and a sensing part electrically connected to the resin dispensing part and the supporting part individually and sensing a contact between the resin dispensing part and the light emitting device package with an electrical signal. | 05-24-2012 |
20120142126 | DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A display substrate includes a base substrate, a barrier pattern, a source electrode, a drain electrode, a semiconductor layer, an insulating layer, and a gate electrode. The barrier pattern protrudes from the base substrate. The source and gate electrodes are formed adjacent to opposite sides of the barrier pattern on the base substrate. The semiconductor layer is provided on the barrier pattern to connect the source electrode with the drain electrode, and the insulating layer covers the semiconductor layer, the source electrode, and the drain electrode. The gate electrode is provided on the insulating layer, and is overlapped with the semiconductor layer. | 06-07-2012 |
20120149138 | Method for Manufacturing Heat Dissipation Bulk of Semiconductor Device - A method for manufacturing a heat dissipation bulk of a semiconductor device including the following steps is described. An electrically conductive layer is formed to cover a surface of a temporary substrate. At least one semiconductor chip is connected to the electrically conductive layer by at least one metal bump, wherein the at least one metal bump is located between the at least one semiconductor chip and the electrically conductive layer. A metal substrate is formed on the electrically conductive layer, wherein the metal substrate fills up a gap between the at least one semiconductor chip and the electrically conductive layer. The temporary substrate is removed. | 06-14-2012 |
20120184056 | METHOD AND APPARATUS FOR MANUFACTURING WHITE LIGHT-EMITTING DEVICE - Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer. | 07-19-2012 |
20120190140 | Light-Emitting Diode Arrangement and Method for Producing the Same - A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side and which are fixed by their rear side—opposite the front side—on a first main face of a common carrier body, wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement. | 07-26-2012 |
20120208306 | METHOD FOR ENCAPSULATING AN ORGANIC LIGHT EMITTING DIODE - Methods for encapsulating OLED structures disposed on a substrate using a soft/polymer mask technique are provided. The soft/polymer mask technique can efficiently provide a simple and low cost OLED encapsulation method, as compared to convention hard mask patterning techniques. The soft/polymer mask technique can utilize a single polymer mask to complete the entire encapsulation process with low cost and without alignment issues present when using conventional metal masks. Rather than utilizing a soft/polymer mask, the encapsulation layers may be blanked deposited and then laser ablated such that no masks are utilized during the encapsulation process. | 08-16-2012 |
20120220059 | METHOD FOR PRODUCING LIGHT-EMITTING DIODE DEVICE - A method for producing a light-emitting diode device includes the steps of: preparing a light-emitting laminate including an optical semiconductor layer, and an electrode unit formed on the optical semiconductor layer; forming an encapsulating resin layer on the optical semiconductor layer so as to cover the electrode unit, the encapsulating resin layer containing a light reflection component; partially removing the encapsulating resin layer so as to expose the top face of the electrode unit, thereby producing a light-emitting diode element; and disposing the light-emitting diode element and a base substrate provided with terminals so that the light-emitting diode element and the base substrate face each other, and that the electrode unit and the terminals are electrically connected, thereby flip chip mounting the light-emitting diode element on the base substrate. | 08-30-2012 |
20120225505 | METHOD OF BONDING A SEMICONDUCTOR DEVICE USING A COMPLIANT BONDING STRUCTURE - A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer. | 09-06-2012 |
20120225506 | HERMETICALLY-SEALED PACKAGES FOR ELECTRONIC COMPONENTS HAVING REDUCED UNUSED AREAS - Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate ( | 09-06-2012 |
20120244651 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE - A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages. | 09-27-2012 |
20120252144 | METHOD FOR THERMALLY CONTACTING OPPOSING ELECTRICAL CONNECTIONS OF A SEMICONDUCTOR COMPONENT ARRANGEMENT - The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof. | 10-04-2012 |
20120276667 | PACKAGING METHOD OF LIGHT EMITTING DEVICE - A packaging method includes the following steps. A cover substrate is provided. A blocking dam having a first height is formed in the peripheral region of the cover substrate. The blocking dam has a second height after being hardened. A sealant surrounding the blocking dam and having a third height is formed. An encapsulation glue is filled in the active region of the cover substrate, and blocked by the blocking dam. A device substrate is provided, and a compression process is performed on the device substrate and the cover substrate. After the compression process, a buffer space is formed between the blocking dam and the sealant and between the cover substrate and the device substrate to accommodate the encapsulation glue spilling out of the active region of the cover substrate. The sealant is hardened, so that the cover substrate and the device substrate are bonded together through the sealant. | 11-01-2012 |
20120295373 | METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT - To provide a method of manufacturing a nitride semiconductor light emitting element, which has a small number of steps and thus, can improve productivity, the method of manufacturing a nitride semiconductor light emitting element including a nitride semiconductor light emitting element structure having an n-type nitride semiconductor layer and a p-side nitride semiconductor layer which are laminated on a substrate, an n-side pad electrode connecting surface and a p-side pad electrode connecting surface which are formed on the same plane of the substrate; a n-side pad electrode on the n-side pad electrode connecting surface; and a p-side pad electrode on the p-side pad electrode connecting surface, and in the manufacturing method, a pad electrode layer forming step, a resist pattern forming step, a pad electrode layer etching step, a protective layer forming step and a resist pattern removing step are sequentially performed. | 11-22-2012 |
20120295374 | LIGHT EMITTING DEVICE, PACKAGE, LIGHT EMITTING DEVICE MANUFACTURING METHOD, PACKAGE MANUFACTURING METHOD AND PACKAGE MANUFACTURING DIE - A light emitting device includes a resin molded body having a circular or an oval recessed section at the center suppresses generation of cracks. The device is provided with a light emitting element, a first resin molded body having a plurality of outer surfaces, and a recessed section at the center. First and second leads are electrically connected to the light emitting element, and a second resin molded body is applied in the recessed section. The light emitting element is placed on the first lead, and the surface of the second resin molded resin forms a light emitting surface. A gate notch is formed on an extended line of a normal line on one point on a circular cross-section of the recessed section in the normal line direction. | 11-22-2012 |
20120322178 | Method of Producing a Radiation-Emitting Optoelectronic Component - In a method for producing a radiation-emitting optoelectronic component, a semiconductor chip is mounted by a first main area onto a carrier body and is electrically conductively connected at a first contact area to a first connection region, and a transparent electrically insulating encapsulation layer is applied to the chip and the carrier body. A first cutout in the encapsulation layer for at least partly uncovering a second contact area of the chip is produced, and a second cutout in the encapsulation layer for at least partly uncovering a second connection region of the carrier body is produced. Finally, an electrically conductive layer, which electrically conductively connects the second contact area of the semiconductor chip and the second connection region of the carrier body, is applied. | 12-20-2012 |
20120329182 | SEMICONDUCTOR DEVICE MOUNTING METHOD - When metal junction between a first electrode and a second electrode is executed as ultrasonic bonding between metals including at least copper, the ultrasonic bonding is performed in a state that a contact interface between the first electrode and the second electrode is covered with a bonding auxiliary agent. As a result, formation of oxide at a bonding interface between the first electrode and the second electrode due to execution of the ultrasonic bonding can be suppressed. Therefore, while a desired bonding strength is ensured, ultrasonic bonding with copper used for the first electrode or the second electrode can be fulfilled and cost cuts in mounting of semiconductor devices can be achieved. | 12-27-2012 |
20120329183 | MANUFACTURING METHOD OF PRINTING CIRCUIT BOARD WITH MICRO-RADIATORS - The present invention relates to a manufacturing method of a printing circuit board. The manufacturing method mainly includes: forming one or more cylindrical micro-radiators by cutting a high conductive and electrical insulating substrate according to predetermined size; manufacturing one or more mounting holes in copper clad plates and prepregs; embedding the cylindrical micro-radiators into the mounting holes. The present invention combines the micro-radiator with high thermal conductivity and traditional stiffness printing circuit board. The printing circuit board with micro-radiators has the advantages of high thermal conductivity and stable heat transfer, and also has the advantages of routing flexibility and reliable electrical connections. | 12-27-2012 |
20130005057 | APPARATUS FOR ATOMIC LAYER DEPOSITION - An atomic layer deposition apparatus and a sealing method of an organic light emitting device using the same are disclosed. In one embodiment, the atomic layer deposition apparatus improves a structure of the purge gas injection nozzle so as to increase the exhaust efficiency of the purge gas in an atomic layer deposition process, which increases a speed of a purge process. As a result, it is possible to improve a deposition speed and a quality of a sealing film when a sealing process for sealing the organic light emitting device is implemented by using the atomic layer deposition. | 01-03-2013 |
20130017631 | METHOD OF MANUFACTURING LIGHT-EMITTING DEVICEAANM TAKEDA; ShigeoAACI Kiyosu-shiAACO JPAAGP TAKEDA; Shigeo Kiyosu-shi JPAANM ISHIDA; MakotoAACI Kiyosu-shiAACO JPAAGP ISHIDA; Makoto Kiyosu-shi JPAANM TERAKAMI; MitsushiAACI Kiyosu-shiAACO JPAAGP TERAKAMI; Mitsushi Kiyosu-shi JPAANM YAMAMORI; ShotaAACI Kiyosu-shiAACO JPAAGP YAMAMORI; Shota Kiyosu-shi JP - A method of manufacturing a light-emitting device includes providing a plate-shaped substrate, forming a lattice frame on a light-emitting element mounting surface of the plate-shaped substrate, mounting a light-emitting device in an opening of the lattice frame on the light-emitting element mounting surface, sealing the light-emitting element by supplying a sealing material into the opening of the lattice frame, and cutting the lattice frame and the plate-shaped substrate so as to split the lattice flame to obtain a plurality of light-emitting devices with a sidewall. | 01-17-2013 |
20130023071 | DONOR SUBSTRATE, METHOD OF MANUFACTURING A DONOR SUBSTRATE AND METHOD OF MANUFACTURING AN ORGANIC LIGHT EMITTING DISPLAY DEVICE USING A DONOR SUBSTRATE - A donor substrate may include a base substrate, an expansion layer positioned on the base substrate, a light-to-heat conversion layer on the expansion layer, an insulation layer located on the light-to-heat conversion layer, and an organic transfer layer on the insulation layer. The donor substrate may effectively and uniformly transfer the organic transfer layer onto a display substrate of an organic light emitting display device. | 01-24-2013 |
20130052764 | METHOD FOR PACKAGING LIGHT EMITTING DIODE - A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element. | 02-28-2013 |
20130065331 | MOUNTING METHOD FOR SEMICONDUCTOR LIGHT EMITTER - The present invention is a method for mounting, on a ceramic substrate ( | 03-14-2013 |
20130071961 | LARGE AREA HERMETIC ENCAPSULATION OF AN OPTOELECTRONIC DEVICE USING VACUUM LAMINATION - Apparatus for accurately picking and placing one or more optoelectronic devices for vacuum lamination of materials in a way that minimizes stress to the materials. | 03-21-2013 |
20130095581 | THICK WINDOW LAYER LED MANUFACTURE - A LED die and method for bonding, dicing, and forming the LED die are disclosed. In an example, the method includes forming a LED wafer, wherein the LED wafer includes a substrate and a plurality of epitaxial layers disposed over the substrate, wherein the plurality of epitaxial layers are configured to form a LED; bonding the LED wafer to a base-board to form a LED pair; and after bonding, dicing the LED pair, wherein the dicing includes simultaneously dicing the LED wafer and the base-board, thereby forming LED dies. | 04-18-2013 |
20130095582 | Method for Manufacturing Sealed Structure - A method for manufacturing a sealed structure in which few cracks are generated is provided. Scan with the laser beam is performed so that there is no difference in an irradiation period between the middle portion and the perimeter portion of the glass layer and so that the scanning direction is substantially parallel to the direction in which solidification of the glass layer after melting proceeds. More specifically, in a region where the beam spot is overlapped with the glass layer, scan is performed with a laser beam having a beam spot shape whose width in a scanning direction is substantially uniform. Further, as a laser beam with which the glass layer is irradiated, a laser beam (a linear laser beam) having a linear beam spot shape with a major axis and a minor axis which is orthogonal to the major axis. | 04-18-2013 |
20130130418 | METHOD FOR PRODUCING LARGE LIGHTING WITH POWER LED - The present invention relates to a method for manufacturing large lighting which uses a power LED, such as for large LED lighting for street lamps, which incorporates a heat dissipation device that has the ability to dissipate heat with natural convection to maintain ambient temperature. The disclosed method is novel applied technology for producing a large LED lighting, such as for street lamps, which has a power LED device with a unique, rear heat dissipation capability. In addition to maximum thermal efficiency by heat dissipation, the present LED lighting system also increases luminous efficiency by providing high light emission with only a small quantity of LED power. | 05-23-2013 |
20130137200 | Method of Manufacturing Sealed Body and Method of Manufacturing Light-Emitting Device - Methods of manufacturing a sealed body and a light-emitting device with high airtightness in which generation of a crack in a substrate and a frit glass in an overlap region where laser light irradiation is started and ended is prevented are provided. A high-reflectivity region having high reflectivity with respect to laser light and a low-reflectivity region having lower reflectivity than the high-reflectivity region are provided in a region which overlaps with the frit glass and is over a substrate facing a substrate on which the frit glass is formed. When scanning with laser light is started from the low-reflectivity region, a crack is less likely to be generated in the frit glass. | 05-30-2013 |
20130143337 | ORGANIC ELECTROLUMINESCENT DEVICE - The invention relates to OLED devices ( | 06-06-2013 |
20130149802 | METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT - Provided is a method of manufacturing a semiconductor element having at a cut portion with excellent quality, which minimizes a region on a silicon substrate necessary for cutting, and which prevents cutting water used when cutting by dicing is carried out from entering the semiconductor element. The method of manufacturing a semiconductor element includes: arranging, on the silicon substrate, multiple semiconductor element portions so as to be adjacent to one another; bonding the silicon substrate and a glass substrate together using the resin; and cutting the silicon substrate and the glass substrate, respectively, in a region in which the resin is provided, the cutting the silicon substrate and the glass substrate including: half-cutting the silicon substrate by dicing; cutting the glass substrate by scribing; and dividing the silicon substrate, the glass substrate, and the resin. | 06-13-2013 |
20130178001 | Method for Making LED LAMP - A method for making an LED lamp includes a first step of working a base plate, a second step of placing the base plate in a die cavity of an injection molding machine, and a third step of forming a housing in the die cavity of the injection molding machine to combine the housing with the base plate. The base plate is integrally combined with the housing completely by injection molding so that the base plate and the housing are combined closely and solidly and will not detach from each other. | 07-11-2013 |
20130183776 | UV-CURABLE ADHESIVE SILICONE COMPOSITION, UV-CURABLE ADHESIVE SILICONE COMPOSITION SHEET, OPTICAL SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME - A UV-curable adhesive silicone composition includes: (A) an organopolysiloxane having a resin structure consisting of R | 07-18-2013 |
20130210176 | METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DEVICE - Provided is a method of manufacturing an organic light emitting device capable of suppressing a patterning defect caused by a residue of a release layer, the method including: a first organic compound layer formation step; a first protective layer formation step; a second protective layer formation step; a second protective layer processing step; a first protective layer processing step; a first organic compound layer processing step; a second organic compound layer formation step; and a lift-off step in which the pattern of the second protective layer obtained in the second protective layer processing step is formed also in a second region. | 08-15-2013 |
20130210177 | METHOD FOR MANUFACTURING AN ORGANIC ELECTRONIC DEVICE - The invention relates to method for manufacturing an electronic device comprising an organic layer ( | 08-15-2013 |
20130252357 | THIN-FILM LED WITH P AND N CONTACTS ELECTRICALLY ISOLATED FROM THE SUBSTRATE - A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode. | 09-26-2013 |
20130260488 | CHEMICAL VAPOR DEPOSITION APPARATUS AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICES USING SAME - Provided are a CVD apparatus and a method of manufacturing a light emitting device using the same. The CVD apparatus includes a chamber body including a susceptor having at least one pocket part having a wafer stably mounted therein; a chamber cover provided with the chamber body to open or close the chamber body and having a reaction space between the susceptor and the chamber cover; a reactive gas supplier supplying the reactive gas into the reaction space to allow the reactive gas to flow across a surface of the susceptor; and a non-reactive gas supplier supplying a non-reactive gas into the reaction space to allow the non-reactive gas to flow across a surface of the chamber cover between the susceptor and the chamber cover so as to prevent the reactive gas from contacting the surface of the chamber cover. | 10-03-2013 |
20130267050 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE - Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire. | 10-10-2013 |
20130280833 | Reactor for Atomic Layer Deposition (ALD), Application to Encapsulation of an OLED Device by Deposition of a Transparent Al2O3 Film - The present invention relates to a reactor for atomic layer deposition (ALD), comprising a reaction chamber comprising a platen and bounded internally by surfaces; at least one inlet orifice and at least one outlet orifice, each emerging from one of the surfaces bounding the chamber. The reactor furthermore comprises, within it, at least one wall apertured with at least one orifice, the apertured wall extending around the platen and over at least most of the height between the lower surface and the upper surface, at least one orifice in at least one of the apertured walls not facing the inlet orifice so as to form chicanes in the flow of gaseous precursor from each inlet orifice to the platen. | 10-24-2013 |
20130316475 | METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY PANEL - A method of manufacturing an organic light emitting display panel forming a protective insulating film in a luminescent region without causing defects in a pattern is disclosed. The method of manufacturing an organic light emitting display panel includes forming a substrate having a luminescent region and a pad region, simultaneously forming a light emitting cell in the luminescent region and an organic pattern in the pad region, forming a protective insulating film over the substrate, bonding the substrate provided with the protective insulating film and the sealing substrate using an adhesive film formed in a region corresponding to the luminescent region, cutting the bonded substrate provided with the protective insulating film and the sealing substrate into a plurality of unit panels to expose the pad region, and removing the protective insulating film and the organic pattern in the exposed pad region. | 11-28-2013 |
20130316476 | Manufacturing method of a retaining wall of an LED - A method for manufacturing a retaining wall of an LED is disclosed. The method includes the steps of: providing a substrate and applying a photosensitive layer on the substrate; exposing the photosensitive layer for forming a pattern of the retaining wall of the LED; removing the exposed photosensitive layer by etching process for forming a recess with a shape corresponding to the pattern of the retaining wall; filling the recess with ceramic slurry by screen printing process; drying the left photosensitive layer and the ceramic slurry for hardening the ceramic slurry, and then removing the left photosensitive layer; and sintering the ceramic slurry for forming the ceramic retaining wall. | 11-28-2013 |
20130330852 | MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE - A manufacturing method of a light-emitting device includes: a die-bonding process in which a semiconductor light emitting element is placed on a bonding target member via an adhesive containing a silicone resin so that a surface opposite to an exposure surface faces the bonding target member, and the adhesive is heated to bond the semiconductor light emitting element to the bonding target member; and a wire-bonding process in which a wire is connected to the exposure surface. The semiconductor light emitting element includes a laminated semiconductor layer having a light emitting layer and an electrode including a metal layer containing Au and provided on the laminated semiconductor layer and a covering layer containing Ni or Ta and covering the metal layer, the thickness of the covering layer being set smaller than 100 nm and the exposure surface to expose the covering layer to the outside being formed. | 12-12-2013 |
20130337589 | FABRICATING METHOD FOR LIGHT EMITTING DIODE - A fabricating method for a light emitting diode, includes: providing a bonding substrate; providing an epitaxial structure having an epitaxial substrate and an epitaxial layer, in which the epitaxial layer has a first surface and a second surface opposite to each other, and the epitaxial substrate and the epitaxial layer are combined at the first surface; forming at least one gas discharge channel in the periphery of each single die structure on the epitaxial layer; applying an adhesive on the second surface of the epitaxial layer and the bonding substrate; vaporizing volatile organic gases in the adhesive, and bonding the epitaxial structure and the bonding substrate; removing the epitaxial substrate to expose the first surface of the epitaxial layer; forming electrodes on the exposed first surface of the epitaxial layer; and forming a plurality of light emitting diode dies through cutting along the periphery of each single die structure. | 12-19-2013 |
20130337590 | METHOD FOR FABRICATING SIDE BY SIDE LIGHT EMITTING DIODE (LED) HAVING SEPARATE ELECTRICAL AND HEAT TRANSFER PATHS - A method for fabricating a light emitting diode includes the steps of providing a thermal conductive substrate having an electrical isolation layer, forming an anode via and a cathode via side by side on a first side of the substrate part way through the substrate, forming an anode through interconnect in the anode via and a cathode through interconnect in the cathode via, thinning the substrate from a second side of the substrate to the anode through interconnect and the cathode through interconnect, and mounting a LED chip to the first side in electrical communication with the cathode through interconnect and the anode through interconnect. | 12-19-2013 |
20130344631 | METHOD OF MANUFACTURING LIGHT EMITTING DEVICE - A light emitting device is manufactured in which a cap having a frame portion is bonded to a package having a light emitting element mounted in a recess of the package to cover an opening of the recess. A method for manufacturing the light emitting device includes: partially disposing a metal bonding agent, having greater wettability to the frame portion than to the package, to one of the package and the frame portion; and bonding the package and the frame portion by extending the metal bonding agent along the frame portion so that ends of the metal bonding agent are joined to each other while defining a space at a joining portion where the ends of the metal bonding agent are joined. | 12-26-2013 |
20130344632 | Thermal Management Within an LED Assembly - This invention is directed to a method for applying a thermal management composition between an LED mounted circuit board and a heat sink, comprising the steps of; (a) applying a deposit of a thermal management composition onto either a second surface of the LED mounted circuit board or onto a surface of a heat sink, through a deposition tool the deposition tool having at least one aperture ( | 12-26-2013 |
20140024153 | PRODUCING METHOD OF SEMICONDUCTOR DEVICE - A method for producing a semiconductor device includes a preparing step of preparing a board formed with a concave portion, a terminal disposed in or around the concave portion, and a semiconductor element disposed in the concave portion; a wire-bonding step of connecting the terminal to the semiconductor element with a wire; a pressure-welding step of pressure-welding an encapsulating sheet to the board so as to be in close contact with the upper surface of a portion around the concave portion and to be separated from the upper surface of the concave portion under a reduced pressure atmosphere; and an atmosphere releasing step of releasing the board and the encapsulating sheet under an atmospheric pressure atmosphere. | 01-23-2014 |
20140030828 | METHOD FOR MANUFACTURING LED - An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber. A method for manufacturing the LED is also disclosed. | 01-30-2014 |
20140038323 | METHOD FOR MANUFACTURING LIGHT EMITTING CHIP - A method for making a light emitting chip package, comprises: providing a substrate; forming a plurality of recesses on the bottom surface of the substrate; forming an etch stop layer on the bottom surface; forming a step hole on the top surface; forming an insulation layer on the top surface; defining a plurality of first through holes in the insulation layer and a plurality of second through holes in the etch stop layer, the number of the first through holes being different from the number of the second through holes; filling the first through holes and the second through holes with metal to respectively form first electrical conductor portions and second electrical conductor portions; forming a patterned electric conductive layer on the insulation layer; arranging a light emitting chip on the electric conductive layer; and encapsulating the light emitting chip with an encapsulation. | 02-06-2014 |
20140051192 | METHOD AND CARRIER SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE - A method of manufacturing a display device, the method including forming a first layer on a rigid glass substrate, the first layer having a hydrophobic surface; forming a second layer to be bonded to a rigid thin glass substrate on the first layer to prepare a carrier substrate; bonding the rigid thin glass substrate onto the second layer; forming and encapsulating a display portion on an upper surface of the rigid thin glass substrate; and irradiating a laser beam to delaminate the first layer and detaching the rigid thin glass substrate from the rigid glass substrate. | 02-20-2014 |
20140065739 | METHOD FOR HYBRID ENCAPSULATION OF AN ORGANIC LIGHT EMITTING DIODE - Methods and apparatus for encapsulating organic light emitting diode (OLED) structures disposed on a substrate using a hybrid layer of material are provided. The encapsulation methods may be performed as single or multiple chamber processes. The processing parameters used during deposition of the hybrid layer of material allow control of the characteristics of the deposited hybrid layer. The hybrid layer may be deposited such that the layer has characteristics of an inorganic material in some sublayers of the hybrid layer and characteristics of an organic material in other sublayers of the hybrid layer. Use of the hybrid material allows OLED encapsulation using a single hard mask for the complete encapsulating process with low cost and without alignment issues present in conventional processes. | 03-06-2014 |
20140073071 | RFID INTEGRATED CIRCUITS WITH ANTENNA CONTACTS ON MULTIPLE SURFACES - Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other. | 03-13-2014 |
20140087496 | METHODS AND STRUCTURES FOR FORMING AND PROTECTING THIN FILMS ON SUBSTRATES - A method for forming of a thin film on a substrate is disclosed. The method includes cleaning a process chamber by flowing a first gas having fluorine. The method also includes coating the process chamber with a first encapsulating layer including amorphous silicon (A-Si) by flowing a second gas for a first duration, where the first encapsulating layer protects against fluorine contamination. The method further includes loading a substrate into the process chamber, depositing a thin film on the substrate by flowing a third gas into the process chamber and unloading the substrate from the process chamber. The thin film can include silicon nitride (SiN), the first gas can include nitrogen triflouride (NF | 03-27-2014 |
20140087497 | BARRIER FILM FOR ELECTRONIC DEVICES AND SUBSTRATES - Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θ | 03-27-2014 |
20140087498 | METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE - A method of manufacturing a light-emitting device includes mounting an LED chip on a bottom surface of a recessed portion of a case, and after mounting the LED chip, forming a highly-reflective sidewall so as to be in contact with side surfaces and the bottom surface of the recessed portion and to be spaced from the LED chip. The highly-reflective sidewall includes a higher light reflectance than the side surfaces of the recessed position of the case and an outwardly convex surface as a surface exposed in the recessed portion. | 03-27-2014 |
20140106484 | BONDING APPARATUS AND METHOD FOR DISPLAY DEVICE - A bonding apparatus for a display device includes a film bonding device for bonding an anisotropic conductive film to a display substrate; and a pressure device for bonding a driving chip to the anisotropic conductive film of the display substrate, wherein the pressure device includes a pressure head with a heat source, and a pressure tip attached to a lower surface of the pressure head and including a plurality of sub-pressure tips that are separated from each other. | 04-17-2014 |
20140106485 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODES - An LED manufacturing method includes following steps: providing an LED die; providing an electrode layer having a first section and a second section electrically insulated from the first section, and arranging the LED die on the second section wherein an electrically conductive material electrical connects a bottom of the LED die with second section; forming a transparent conductive layer to electrically connect a top of the LED die with the first section; providing a base and coating an outer surface of the base with a layer of electrically conductive material, defining a continuous gap in the electrically conductive material to divide the electrically conductive material into a first electrode part, and a second electrode part, arranging the electrode layer on the base so that the first section contacts the first electrode part, and the second section contacts the second electrode part. | 04-17-2014 |
20140134763 | METHOD OF CUTTING FLEXIBLE DISPLAY DEVICE AND METHOD OF FABRICATING FLEXIBLE DISPLAY DEVICE USING THE SAME - The present disclosure relates to a method of cutting a flexible display device, capable of preventing a generation of a defect at the time of cutting the flexible display device, the method including providing a glass mother substrate having a flexible substrate attached thereon and an insulating layer formed on the flexible substrate; melting the flexible substrate and the insulating layer on the mother substrate by irradiating with a first laser beam; and cutting the mother substrate exposed by the irradiation of the first laser beam using a cutting device. | 05-15-2014 |
20140141547 | METHOD OF MANUFACTURING FLEXIBLE DISPLAY APPARATUS - A method of manufacturing a flexible display apparatus, the method including forming a thin film transistor (TFT), a first electrode, and a pixel defining film on a flexible substrate by using a roll-to-roll device; separating the flexible substrate from the roll-to-roll device; attaching the flexible substrate to a support substrate; forming an organic light-emitting diode (OLED) and an encapsulating layer at the first electrode; and separating the flexible substrate from the support substrate. | 05-22-2014 |
20140141548 | METHOD OF MANUFACTURING A METAL CLAD CIRCUIT BOARD - A metal clad circuit board includes a metal substrate. A dielectric layer is applied to the metal substrate. A conductive seed layer is printed on the dielectric layer. A conductive circuit layer is plated onto the conductive seed layer. Optionally, the conductive seed layer may be inkjet printed on the dielectric layer. Alternatively, the conductive seed layer may be pad printed on the dielectric layer. Optionally, the dielectric layer may be powder coated to the metal substrate. The dielectric layer may include polymers and fillers compression molded to the metal substrate. Optionally, the conductive circuit layer may be electroplated to the conductive seed layer. Optionally, a solder mask may be applied over the conductive circuit layer. | 05-22-2014 |
20140141549 | Method for Producing an Electronic Component and Electronic Component - A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate with at least one functional layer, applying at least one first barrier layer on the functional layer via plasma enhanced atomic layer deposition (PEALD), and applying at least one second barrier layer on the functional layer by means of plasma-enhanced chemical vapor deposition (PECVD), where the at least one first barrier layer is applied at a temperature of less than 100° C. | 05-22-2014 |
20140154820 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY DEVICE - There is provided an organic light emitting display device including a first substrate; an organic light emitting unit formed on the first substrate; a second substrate disposed on the organic light emitting unit; and an adhesive unit for adhering the first substrate and the second substrate to each other, wherein the adhesive unit includes a sealant, and particles that are arranged in the sealant so as to block penetration of external impurities. There is further provided a method of manufacturing the organic light emitting display device. | 06-05-2014 |
20140162385 | DEPOSITION APPARATUS, METHOD OF FORMING THIN FILM USING THE SAME AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY APPARATUS - A deposition apparatus for performing a deposition process by using a mask with respect to a substrate, the deposition apparatus includes a chamber, a support unit in the chamber, the support unit including first holes and being configured to support the substrate, a supply unit configured to supply at least one deposition raw material toward the substrate, and movable alignment units through the first holes of the support unit, the alignment units being configured to support the mask and to align the mask with respect to the substrate. | 06-12-2014 |
20140170785 | MASK MANAGEMENT SYSTEM AND METHOD FOR OLED ENCAPSULATION - A system and method for encapsulating an organic light-emitting diode (OLED) device by enabling a substrate and a plurality of masks to be efficiently received into a vacuum processing environment, transferred between one or more process chambers for the deposition of encapsulating layers, and removed from the processing system. A method of encapsulating an organic light-emitting diode (OLED) device includes positioning one or more masks over a substrate to deposit encapsulating layers on an OLED device disposed on the substrate. A processing system for encapsulating an organic light-emitting diode (OLED) device includes one or more transfer chambers, one or more load lock chambers coupled to each transfer chamber and operable to receive a mask into a vacuum environment, and one or more process chambers coupled to each transfer chamber and operable to deposit an encapsulating layer on a substrate. | 06-19-2014 |
20140179034 | SEMICONDUCTOR PHOTONIC PACKAGE - A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion. | 06-26-2014 |
20140179035 | METHOD FOR DISPENSING GLUE ON LED CHIP - A method for dispensing glue on an LED chip includes following steps: providing a glue dispensing device which includes a syringe, a needle head communicating with the syringe, and a valve mounted on the needle head for controlling flowing of content in the syringe out of the syringe, wherein the valve has an aperture, and a diameter of the aperture is adjustable; providing glue and injecting the glue into the syringe; providing an LED chip which is mounted a circuit board and orientating the needle head of the glue dispensing device towards the LED chip, wherein the needle head is spaced from the LED chip, and the diameter of the aperture of the valve is adjusted to a predetermined size; squeezing the glue out of the syringe under a predetermined pressure and a predetermined time, wherein the glue dispensed on the LED chip forms an encapsulation structure. | 06-26-2014 |
20140179036 | METHOD AND SYSTEM FOR HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION - A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector. | 06-26-2014 |
20140193929 | Integrated Reflector and Thermal Spreader and Thermal Spray Fabrication Method - A low-cost integrated reflector and heat spreader for high-density high power solid-state (e.g., LED) lighting arrays includes a base structure onto which is applied a sacrificial material. A relatively thick thermal spray coating is applied over the base structure and sacrificial material. The sacrificial material is removed. A channel(s) is thereby provided within the thermal spray coating layer and in physical contact with the base structure. The channel may be filled with a cooling fluid. A pulsating heat pipe heat spreader may thereby be provided. A reflective material may be provided either over another surface of the base structure or alternatively over the thermal spray coating layer to provide a surface for reflecting and directing light emitted from a solid state light source that may be secured to the integrated reflector and heat spreader. | 07-10-2014 |
20140193930 | PROCESSES FOR MANUFACTURING AN LED PACKAGE WITH TOP AND BOTTOM ELECTRODES - An LED package with an extended top electrode and an extended bottom electrode is formed from a first metal and a second metal. An LED is on an inner end of the first metal. An outer end of the first metal has been bent upward twice 90 degrees to form a top flat as an extended top electrode of the package. An outer end of the second metal has been bent downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package. The LED and a bonding wire may be encapsulated with glue. | 07-10-2014 |
20140199795 | SEALING MEMBER, SEALING METHOD, AND METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE - A sealing member includes an elongated releasing film, and a plurality of sealing resin layers composed of a sealing resin, the plurality of sealing resin layers being laminated on the releasing film so that the plurality of sealing resin layers are arranged in a row along the longitudinal direction of the releasing film with a space provided therebetween. | 07-17-2014 |
20140213000 | GaN Based LED Having Reduced Thickness and Method for Making the Same - A device having a carrier, a light-emitting structure, and first and second electrodes is disclosed. The light-emitting structure includes an active layer sandwiched between a p-type GaN layer and an n-type GaN layer, the active layer emitting light of a predetermined wavelength in the active layer when electrons and holes from the n-type GaN layer and the p-type GaN layer, respectively, combine therein. The first and second electrodes are bonded to the surfaces of the p-type and n-type GaN layers that are not adjacent to the active layer. The n-type GaN layer has a thickness less than 1.25 μm. The carrier is bonded to the light emitting structure during the thinning of the n-type GaN layer. The thinned light-emitting structure can be transferred to a second carrier to provide a device that is analogous to conventional LEDs having contacts on the top surface of the LED. | 07-31-2014 |
20140220715 | THIN-FILM DEPOSITION MASK, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING AN ORGANIC LIGHT EMITTING DISPLAY APPARATUS USING THE SAME - A thin-film deposition mask includes a mask body, the mask body having a first surface and a second surface that is an opposite surface of the first surface, the mask body having a plurality of deposition holes therein, and a spacer near the deposition holes, the spacer protruding from the first surface of the mask body in a vertical direction. | 08-07-2014 |
20140234999 | METHOD FOR PROCESSING DEVICES INCLUDING QUANTUM DOTS AND DEVICES - A method of processing quantum dots is disclosed. The method comprises applying energy to excite the quantum dots to emit light and placing the quantum dots under vacuum after excitation of the quantum dots. Also disclosed is a method of processing a component including quantum dots comprising applying energy to the component including quantum dots to excite the quantum dots to emit light; and placing the component including quantum dots under vacuum after excitation. A method for processing a device is further disclosed, the method comprising applying energy to the device to excite the quantum dots to emit light; and placing the device under vacuum after excitation of the quantum dots. A method for preparing a device is also disclosed. Quantum dots, component, and devices of the methods are also disclosed. | 08-21-2014 |
20140242736 | MIXED METAL-SILICON-OXIDE BARRIERS - A method of forming a thin barrier film of a mixed metal-silicon-oxide is disclosed. For example, a method of forming an aluminum-silicon-oxide mixture having a refractive index of 1.8 or less comprises exposing a substrate to sequences of a non-hydroxylated silicon-containing precursor, activated oxygen species, and metal-containing precursor until a mixed metal-silicon-oxide film having a thickness of 500 Ångstroms or less is formed on the substrate. | 08-28-2014 |
20140256070 | PLASMA CURING OF PECVD HMDSO FILM FOR OLED APPLICATIONS - Methods for forming an OLED device are described. An encapsulation layer having a buffer layer sandwiched between barrier layers is deposited over an OLED structure. The buffer layer is deposited on the first barrier layer and is cured with a fluorine-containing plasma at a temperature less than 100 degrees Celsius. The second barrier layer is then deposited on the buffer layer. | 09-11-2014 |
20140273317 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer. | 09-18-2014 |
20140273318 | METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE THEREWITH - A method of forming a metal bonding layer includes forming a first bonding metal layer and a second bonding metal layer on surfaces of first and second bonding target objects, respectively. The second bonding target object is disposed on the first bonding target object to allow the first and second bonding metal layers to face each other. A eutectic metal bonding layer is formed through a reaction between the first and second bonding metal layers. At least one of the first and second bonding metal layers includes a reaction delaying layer formed of a metal for delaying the reaction between the first and second bonding metal layers. | 09-18-2014 |
20140302624 | DEPOSITION APPARATUS, METHOD OF FORMING THIN FILM USING THE SAME, AND METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY APPARATUS - A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening. | 10-09-2014 |
20140315338 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME - Disclosed is a light-emitting device comprising a light-emitting element ( | 10-23-2014 |
20140322837 | Method of Forming Nanocrystals and Method of Manufacturing an Organic Light-Emitting Display Apparatus Including a Thin Film Having Nanocrystals - A method of forming nanocrystals includes loading a substrate into a chamber, applying a first voltage to a first target to form a thin film including a first metal compound on the substrate by sputtering, and applying a second voltage to a second target and forming nanocrystals in the thin film by sputtering. | 10-30-2014 |
20140322838 | Semiconductor Optoelectronic Device And The Method Of Manufacturing The Same - A semiconductor optoelectronic device comprises an operating substrate; a semiconductor epitaxial stack unit disposed on the operating substrate comprising a first semiconductor material layer having a first electrical conductivity disposed on the operating substrate and a second semiconductor material layer having a second electrical conductivity disposed on the first semiconductor material layer; a transparent conductive layer disposed on the second semiconductor material layer, wherein the transparent conductive layer comprises a first surface, a directly contacting part disposed on the first surface and directly contacting with the second semiconductor material layer, a second surface substantially parallel with the first surface, and a directly contacting corresponding part disposed on the second surface corresponding to the directly contacting part; and a first electrode disposed on the operating substrate and electrically connected with the semiconductor epitaxial stack by the transparent conductive layer, wherein the first electrode is connected with the transparent conductive layer by an area excluding the directly contacting part and the directly contacting corresponding part. | 10-30-2014 |
20140329346 | ELEMENT CONNECTING BOARD, PRODUCING METHOD THEREOF, AND LIGHT EMITTING DIODE DEVICE - An element-connecting board is a lead frame for allowing a light emitting diode element to be connected to one side thereof in a thickness direction. The element-connecting board includes the lead frame which is provided with a plurality of leads disposed with spaces from each other and a first insulating resin portion which is light reflective and fills the spaces. | 11-06-2014 |
20140335634 | MOLD RELEASE FILM AND METHOD OF PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME - A mold release film, which is adapted to be disposed on the cavity surface of a mold to form a resin-encapsulated portion by encapsulating a semiconductor element of a semiconductor device with a curable encapsulation resin, has a tensile modulus of elasticity of from 10 to 24 MPa at 132° C. as measured in accordance with JIS K 7127, and a peak peel resistance of at most 0.8 N/25 mm. | 11-13-2014 |
20140342479 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS - A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure. | 11-20-2014 |
20140349422 | METHOD FOR HYBRID ENCAPSULATION OF AN ORGANIC LIGHT EMITTING DIODE - Methods and apparatus for encapsulating organic light emitting diode (OLED) structures disposed on a substrate using a hybrid layer of material are provided. The processing parameters used during deposition of the hybrid layer of material allow control of the characteristics of the deposited hybrid layer. The hybrid layer may be deposited such that the layer has characteristics of an inorganic material in some sublayers of the hybrid layer and characteristics of an organic material in other sublayers of the hybrid layer. Use of the hybrid material allows OLED encapsulation using a single hard mask for the complete encapsulating process with low cost and without alignment issues present in conventional processes. | 11-27-2014 |
20150017749 | FLEXIBLE PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF AND PACKAGING METHOD FOR OLED USING THE SAME - Provided herein is a flexible packaging substrate, comprising a first polymer layer; a metal foil layer disposed on the first polymer layer; a second polymer layer disposed on the metal foil layer; and wherein the surface area of the metal foil layer is larger than those of both the first and the second polymer layer. Also provided are a fabricating method for the same and a method for packaging an organic electroluminescent device using the same. The flexible packaging substrate according to the present invention is able to prevent oxygen and moisture from permeating effectively, allowing the service life of the packaged device prolonged. Additionally, the fabrication according to the examples of the present invention was performed through simple processes, and thereby the packaging process was simplified and the packaging performance was improved. | 01-15-2015 |
20150024522 | ORGANOMETAL MATERIALS AND PROCESS - Coating compositions are used to deposit films on electronic device substrates, which films are subjected to conditions that form an oxymetal precursor material layer on a matrix precursor material layer, and then such layers are cured to form a cured oxymetal layer disposed on a cured matrix layer. | 01-22-2015 |
20150024523 | A METHOD FOR PRODUCING AN RFID TRANSPONDER BY ETCHING - A method for producing a radio frequency identification transponder includes
| 01-22-2015 |
20150024524 | Methods for Manufacturing Isolated Deep Trench and High-Voltage LED Chip - A method for manufacturing a deep isolation trench ( | 01-22-2015 |
20150044790 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF - A negative photosensitive resin composition including an alkali-soluble resin (A), a photoacid generator (B), a basic compound (C), a cross-linking agent (D), and a solvent (E) is provided. The alkali-soluble resin (A) includes an acrylate resin (A-1) and a novolac resin (A-2). The acrylate resin (A-1) is synthesized by polymerizing a monomer for polymerization, wherein the monomer for polymerization includes an unsaturated carboxylic acid or unsaturated carboxylic acid anhydride monomer (a-1-1) and a monomer (a-1-2). The monomer (a-1-2) includes a compound (a-1-2-1) with a tricyclodecane or dicyclopentadiene structure, a compound (a-1-2-2) represented by formula (1), or a combination of both. The novolac resin (A-2) is synthesized by polymerizing an aldehyde compound with an aromatic hydroxy compound, wherein the aromatic hydroxy compound includes a xylenol compound. | 02-12-2015 |
20150044791 | ORGANIC LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING - Aspects of the present disclosure provide for manufacturing an organic light emitting diode (OLED) by forming two terminals of the OLED on two substrates of the display, and then depositing a plurality of layers of the OLED on one or both of the two terminals to form a first portion and a second portion of the OLED on each substrate. The two portions are joined together to form an assembled OLED. The deposition of the two portions can be stopped with each portion having approximately half of a common layer exposed. The two portions can then be aligned to be joined together and an annealing process can be employed to join together the two parts of the common layer and thereby form the OLED. | 02-12-2015 |
20150050759 | SUBMOUNT, OPTICAL MODULE PROVIDED WITH SUBMOUNT, AND SUBMOUNT MANUFACTURING METHOD - In manufacturing a submount, a first electrode layer ( | 02-19-2015 |
20150056729 | METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING APPARATUS AND SEMICONDUCTOR LIGHT EMITTING APPARATUS - A method for manufacturing a semiconductor light emitting apparatus having first semiconductor layer and second semiconductor layer sandwiching a light emitting layer, first and second electrodes provided on respective major surfaces of the first semiconductor and second semiconductor layers to connect thereto, stacked dielectric films having different refractive indexes provided on portions of the major surfaces not covered by the first and second electrodes, and a protruding portion erected on at least a portion of a rim of at least one of the first and second electrodes. The mounting member includes a connection member connected to at least one of the first and second electrodes. The method includes causing the semiconductor light emitting device and a mounting member to face each other, and causing the connection member to contact and join to the at least one of the first and second electrodes using the protruding portion as a guide. | 02-26-2015 |
20150072451 | Method for Producing an Electronic Component and Electronic Component - A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate ( | 03-12-2015 |
20150072452 | METHODS FOR MASKING AND APPLYING PROTECTIVE COATINGS TO ELECTRONIC ASSEMBLIES - One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed. | 03-12-2015 |
20150079707 | METHOD OF MANUFACTURING AN ORGANIC LIGHT EMITTING DISPLAY DEVICE - A manufacturing method of an organic light emitting diode (OLED) display is disclosed. The manufacturing method in accordance with an exemplary embodiment includes: preparing a flexible substrate and a display panel including a thin film encapsulation (TFE) layer for covering and protecting an OLED formed on the flexible substrate; attaching a first protection film to the TFE layer by using a first adhesive to be opposite to the TFE layer; heating a second protection film; and pressing and attaching a second protection film onto the flexible substrate by using a second adhesive. | 03-19-2015 |
20150079708 | METHOD FOR MANUFACTURING ELECTRONIC DEVICE - When a coating film | 03-19-2015 |
20150093842 | METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE - A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material. | 04-02-2015 |
20150099316 | METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME - A method of forming a metal bonding layer includes forming first and second bonding metal layers on one surfaces of first and second bonding objects, respectively. The second bonding object is disposed on the first bonding object such that the first bonding metal layer and the second bonding metal layer face each other. A eutectic metal bonding layer is formed through a reaction between the first and second bonding metal layers. At least one of the first bonding metal layer and the second bonding metal layer includes an oxidation prevention layer formed on an upper surface thereof. The oxidation prevention layer is formed of a metal having an oxidation reactivity lower than an oxidation reactivity of the bonding metal layer on the upper surface which the oxidation prevention layer is disposed. | 04-09-2015 |
20150104890 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF - A semiconductor light emitting device includes a substrate having first and second electrode patterns on at least one surface thereof, a light emitting structure on a surface of the substrate, a first electrode structure, a second electrode structure, an insulating layer, a first connection portion connecting the first electrode structure and the first electrode pattern, and a second connection portion connecting the second electrode structure extending outwardly from the light emitting structure and the second electrode pattern. | 04-16-2015 |
20150125974 | GaN Based LED Having Reduced Thickness and Method for Making the Same - A device having a carrier, a light-emitting structure, and first and second electrodes is disclosed. The light-emitting structure includes an active layer sandwiched between a p-type GaN layer and an n-type GaN layer, the active layer emitting light of a predetermined wavelength in the active layer when electrons and holes from the n-type GaN layer and the p-type GaN layer, respectively, combine therein. The first and second electrodes are bonded to the surfaces of the p-type and n-type GaN layers that are not adjacent to the active layer. The n-type GaN layer has a thickness less than 1.25 μm. The carrier is bonded to the light emitting structure during the thinning of the n-type GaN layer. The thinned light-emitting structure can be transferred to a second carrier to provide a device that is analogous to conventional LEDs having contacts on the top surface of the LED. | 05-07-2015 |
20150125975 | THIN FILM ENCAPSULATION OF ORGANIC LIGHT EMITTING DIODES - A low temperature, low cost method of encapsulating organic light emitting diodes (OLED) that avoids damage to the OLED device. One method comprises forming a metal passivation layer using a plasma, UV-ozone, or wet chemical treatment, wherein the metal passivation layer serves to encapsulate and protect the OLED from moisture and oxygen. Another method comprises forming a buffer layer and a metal layer onto the OLED and then treating the metal layer using a plasma, UV-ozone, or wet chemical treatment, to form a metal passivation layer that serves to encapsulate and protect the OLED from moisture and oxygen. | 05-07-2015 |
20150125976 | SELECTIVE SIDEWALL GROWTH OF SEMICONDUCTOR MATERIAL - A method of producing a bulk semiconductor material comprises the steps of providing a base comprising a substantially planar substrate having a plurality of etched nano/micro-structures located thereon, each structure having an etched, substantially planar sidewall, wherein the plane of each said etched sidewall is arranged at an oblique angle to the substrate, and selectively growing the bulk semiconductor material onto the etched sidewall of each nano/micro-structure using an epitaxial growth process. A layered semiconductor device may be grown onto the bulk semiconductor material. | 05-07-2015 |
20150125977 | ORGANIC EL LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREFOR, AND ORGANIC EL ILLUMINATION DEVICE - An organic EL light emitting device includes a transparent substrate, a transparent electrode film formed on the substrate, a positive electrode contact portion in contact with a part of the transparent electrode film and electrically connected therewith, an insulating layer formed on the transparent electrode film such that the an insulating layer covers a portion excluding a light emitting part, an organic light emitting layer formed on the transparent electrode film and on the insulating layer, a negative electrode film formed on the organic light emitting layer, a negative electrode contact portion in contact with at least a part of the negative electrode film and electrically connected therewith, and a protective layer for separating and electrically insulating the positive electrode contact portion and the transparent electrode film from the negative electrode contact portion. | 05-07-2015 |
20150132872 | DEVICE AND METHOD FOR THE SURFACE TREATMENT OF A SUBSTRATE AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT - Various embodiments may relate to a device for the surface treatment of a substrate, including a processing head, which is mounted rotatably about an axis of rotation, and which comprises multiple gas outlets, which are at least partially implemented on a radial outer edge of the processing head. | 05-14-2015 |
20150147832 | METHOD FOR PRODUCING LIGHT-EMITTING DIODE - A method for producing a light-emitting diode is provided, including the following steps. First, a carrier is provided, wherein the carrier comprises a die bonding surface. Then, a die bonding adhesive layer is formed on the die bonding surface, wherein the die bonding adhesive layer has a photoresist property. Next, at least one lighting chip is disposed on the die bonding adhesive layer, and an uncovered portion of the die bonding adhesive layer is not covered by the lighting chip. Finally, the uncovered portion of the die bonding adhesive layer is removed. | 05-28-2015 |
20150147833 | METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE - A method of manufacturing an OLED device is discussed. The method can include forming a gate electrode on a substrate; forming a gate insulation film on the substrate provided with the gate electrode; forming a channel layer, a source electrode and a drain electrode on the substrate provided with the gate insulation film; forming an organic light emitting diode which includes a first electrode connected to the drain electrode, an organic emission layer formed on the first electrode, and a second electrode formed on the organic emission layer; forming a passivation layer, which has a hydrogen content below 10%, on the substrate provided with the organic light emitting diode using an organic silicon compound; and forming a sealing layer on the substrate provided with the passivation layer. | 05-28-2015 |
20150303401 | METHOD FOR CURING UV-CURABLE RESIN AND METHOD FOR PACKAGING OLED - The present invention provides a method for curing a UV-curable resin and a method for packaging an OLED. The method for curing a UV-curable resin includes (1) providing a UV light source ( | 10-22-2015 |
20150333294 | DISPLAY PANEL AND MANUFACTURING METHOD OF THE SAME - In one aspect, a display panel and a manufacturing method of the same is provided. The display panel includes a non-emission region layer having a plurality of emission regions and a connection region that is open to connect adjacent emission regions; an organic emission layer formed in each of the plurality of emission regions; a counter electrode formed in the emission regions and the connection region; and an encapsulation layer formed on the counter electrode. | 11-19-2015 |
20150333476 | SOLDERABLE PAD FABRICATION FOR MICROELECTRONIC COMPONENTS - Two microelectronic components can be attached by flowing solder between solderable pads patterned on interfacing surfaces. According to one implementation, the microelectronic components can include the solderable pads patterned onto first respective surfaces and other surface features patterned onto second respective surfaces. In another implementation, the solderable pads can include an adhesion layer, a diffusion barrier layer, and a surface oxidation layer. | 11-19-2015 |
20150357534 | Atomic Layer Deposition (ALD) of TiO2 using (Tetrakis(dimethylamino)titanium) TDMAT as an Encapsulation and/or Barrier Layer for ALD PbS - A method of encapsulating PbS quantum dots is provided that includes depositing, using atomic layer deposition (ALD), a first layer of TiO | 12-10-2015 |
20150357572 | METHOD FOR PRODUCING ORGANIC ELECTROLUMINESCENCE DEVICE - A method for producing an organic electroluminescence device of the present invention includes a laminating step of laminating a belt-shaped sealing substrate | 12-10-2015 |
20150357601 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF - An OLED display according to an exemplary embodiment includes: a substrate; an organic light emitting diode formed on the substrate; an overcoat covering the organic light emitting diode; and a patterned metal sheet attached on the overcoat and having a plurality of protrusion and depression portions. A plurality of protrusions may be formed in a bottom surface of the patterned metal sheet where the protrusion and depression portions of the patterned metal sheet and the overcoat face each other. | 12-10-2015 |
20150372202 | REUSABLE ENCAPSULATION LAYER SUPPORT PLATE AND METHOD OF ENCAPSULATING OLED SUBSTRATE - The embodiments of the present invention disclose a reusable encapsulation layer support plate comprising: a support plate body, the top of the support plate body being arranged with at least one first opening for accommodating an encapsulation layer; a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one second opening; wherein the first opening is connected with and arranged opposite to the second opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening. The encapsulation layer support plate can avoid crash of OLED substrate, realize effective OLED encapsulation, and can be reused as far as possible. The embodiments of the present invention further disclose a method of encapsulating an OLED substrate using the encapsulation layer support plate. | 12-24-2015 |
20150380675 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present disclosure relates to an organic light emitting display device and a method for manufacturing the same. The present disclosure suggests an organic light emitting display device including an organic layer; a display element layer including a display area representing video data and a pad area extended from the display area, on the organic layer; film elements formed on the display element layer; a film type printed circuit board connected to the pad area; and a reinforcing adhesive filling a space between the film type printed circuit board and the film elements | 12-31-2015 |
20160006210 | OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE - An optical module includes an optical semiconductor device and a stem including a lead terminal configured to perform at least one of transmitting an electric signal to the optical semiconductor device or transmitting an electric signal output from the optical semiconductor device. The optical module also includes a substrate having a ground layer, a first opening through which the lead terminal passes, and a connecting portion configured to electrically connect the stem and the ground layer. The connecting portion is formed on one of an edge portion of the substrate and a surface of the substrate on a side on which the substrate is arranged on the stem. | 01-07-2016 |
20160013386 | MANUFACTURING METHOD OF A LIGHT-EMITTING DEVICE HAVING A PATTERNED SUBSTRATE | 01-14-2016 |
20160013615 | LASER SUBMOUNTS FORMED USING ETCHING PROCESS | 01-14-2016 |
20160020417 | FLEXIBLE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A flexible display device includes a flexible substrate including a display region and a peripheral region substantially surrounding the display region, the display region including a first display region and a second display region, a first display structure at the first display region of the flexible substrate, the first display structure including nanoparticles, and a second display structure at the second display region of the flexible substrate, the second display structure including silicon. | 01-21-2016 |
20160064595 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing a light emitting diode (LED) package, the method includes providing an LED chip and forming electrodes on a top surface of the LED chip; forming a first electric insulation layer on the top surface of the LED chip, the first electric insulation layer adapted to enclose the electrodes therein; etching the first electric insulation layer to define a plurality of second through holes; forming a substrate on a top surface of the first electric insulation layer, the substrate adapted to fill in the plurality of second through holes, the substrate directly contacting the electrodes; dividing the substrate into a plurality of spaced heat dissipation parts; and forming a packaging layer on a bottom surface of the substrate, the packaging layer adapted to enclose the LED chip therein. | 03-03-2016 |
20160064689 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS ENCAPSULATED WITH HYDROPHOBIC ORGANIC FILM AND MANUFACTURING METHOD THEREOF - An organic light emitting display apparatus is disclosed. The display apparatus includes a substrate, an organic light emitting unit on the substrate, and a film encapsulation layer on the organic light emitting unit. The film encapsulation layer includes a hydrophobic organic layer disposed at an outermost portion of the film encapsulation layer. | 03-03-2016 |
20160072021 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer. | 03-10-2016 |
20160072067 | PRODUCTION METHOD FOR ORGANIC ELECTROLUMINESCENT ELEMENT - The present invention aims at providing a method for producing an organic electroluminescent element, by which a non-light-emitting region can be formed without any accompanying discoloration of a resin substrate. The method for producing an organic electroluminescent element includes a stacking step, in which a first electrode, an organic functional layer and a second electrode are formed by stacking on a resin substrate, and a light irradiation step, in which a prescribed region of the organic functional layer is irradiated with light being free from wavelength components at 340 nm or less. | 03-10-2016 |
20160079505 | METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT HAVING THICK METAL BUMP - A manufacturing method of a flip-chip nitride semiconductor light emitting element includes a step of providing a nitride semiconductor light emitting element structure; a protective layer forming step; a first resist pattern forming step; a protective layer etching step; a first metal layer forming step; a first resist pattern removing step; a third metal layer forming step; a second resist pattern forming step; a second metal layer forming step; a second resist pattern removing step; and a third metal layer removing step. | 03-17-2016 |
20160087170 | METHOD AND SYSTEM FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE, PRODUCTION CONDITION DETERMINATION DEVICE AND PRODUCTION MANAGEMENT DEVICE - A method for producing an optical semiconductor device including a varnish production step of producing a varnish containing particles and a curable resin, a cover layer production step of producing an A-stage cover layer from the varnish, and a covering step of covering the optical semiconductor element with the A-stage covering layer. | 03-24-2016 |
20160104813 | METHOD FOR PROCESSING DEVICES INCLUDING QUANTUM DOTS AND DEVICES - A method of processing quantum dots is disclosed. The method comprises applying energy to excite the quantum dots to emit light and placing the quantum dots under vacuum after excitation of the quantum dots. Also disclosed is a method of processing a component including quantum dots comprising applying energy to the component including quantum dots to excite the quantum dots to emit light; and placing the component including quantum dots under vacuum after excitation. A method for processing a device is further disclosed, the method comprising applying energy to the device to excite the quantum dots to emit light; and placing the device under vacuum after excitation of the quantum dots. A method for preparing a device is also disclosed. Quantum dots, component, and devices of the methods are also disclosed. | 04-14-2016 |
20160104819 | METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR CHIP - A method for producing an optoelectronic semiconductor chip comprises the following steps: providing a substrate, depositing a sacrificial layer, depositing a functional semiconductor layer sequence, laterally patterning the functional semiconductor layer sequence, and oxidizing the sacrificial layer in a wet thermal oxidation process. | 04-14-2016 |
20160104862 | MASK, METHOD OF MANUFACTURING A MASK AND METHOD OF MANUFACTURING AN OLED PANEL - The present invention provides a mask, a method for manufacturing a mask, and a method for manufacturing an OLED panel. The method of manufacturing a mask includes: providing a metal plate; defining a first blocking area, a second blocking area and a coating area located between the first blocking area and the second blocking area; reducing a thickness of the coating area; and intervally hollowing the coating area to thereby form skeletons which are intervally disposed and connected between the first blocking area and the second blocking area and hollowing areas which are surrounded by the first blocking area, the second blocking area and the skeletons. Accordingly, the present invention can improve the production yield. | 04-14-2016 |
20160111681 | MASK ASSEMBLY, APPARATUS FOR MANUFACTURING DISPLAY APPARATUS, AND METHOD OF MANUFACTURING DISPLAY APPARATUS - Provided are a mask assembly, an apparatus for manufacturing a display apparatus, and a method of manufacturing the display apparatus. The mask assembly includes a mask comprising an opening having a pattern; and a self-assembled monolayer (SAM) that is coated on at least a portion of the mask. | 04-21-2016 |
20160111854 | SEMICONDUCTOR LASER DEVICE - A semiconductor laser device comprises a base, a first conductive layer, a second conductive layer, a third conductive layer, and a semiconductor laser chip in this order, each of which has a respective emitting-side end portion. The emitting-side end portion of the first conductive layer is in a common plane with the emitting-side end portion of the base. A thickness of the second conductive layer is greater than a thickness of the first conductive layer. The emitting-side end portion of the second conductive layer is disposed inward of the emitting-end portion of the first conductive layer. The emitting-side end portion of the third conductive layer is in a common plane with the emitting-side end portion of the second conductive layer. The emitting-side end portion of the semiconductor laser chip is disposed outward of the emitting-side end portion of the third conductive layer. | 04-21-2016 |
20160133795 | METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE - Provided is a method of manufacturing a light-emitting device, the method including: a step of providing a conductive material on both surfaces of a base material in which a plurality of light-emitting elements each including a first electrode and a second electrode facing each other are formed, and cutting out the light-emitting elements together with the conductive material from the base material, to thereby obtain the light-emitting elements in each of which the first electrode and the second electrode are provided with conductive members having substantially the same sizes as those of the first electrode and the second electrode; a step of mixing the light-emitting elements with a binder having an insulating property to obtain a coating liquid, and applying the coating liquid onto a first substrate having a conductive layer formed thereon, to thereby form a coating layer; a step of laminating a second substrate having a conductive layer formed thereon on the first substrate so that the coating layer is interposed between the first and second substrates; and a step of applying pressure in a lamination direction in which the first substrate and the second substrate are laminated on each other, and holding the substrates at a preset temperature for a preset period of time in a state where the pressure is applied. | 05-12-2016 |
20160133808 | METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT - A method of manufacturing an optoelectronic component includes providing a leadframe, wherein the leadframe has a first leadframe section and a second leadframe section, and the first leadframe section and the second leadframe section are physically separate from one another; embedding the leadframe into a plastic material by a molding process to form a casing body, wherein the first leadframe section and the second leadframe section are embedded into the plastic material at a physical interval; and reshaping of the plastic material to at least partially close a gap between the plastic material and the leadframe, wherein the plastic material is reshaped in a region arranged between the first leadframe section and the second leadframe section. | 05-12-2016 |
20160133838 | MANUFACTURING FLEXIBLE ORGANIC ELECTRONIC DEVICES - A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer. | 05-12-2016 |
20160155993 | Light-Emitting Device, Electronic Device, Lighting Device, and Method for Manufacturing the Light-Emitting Device | 06-02-2016 |
20160172548 | METHOD OF MANUFACTURING CHIP-ON-BOARD AND SURFACE MOUNT DEVICE LED SUBSTRATE | 06-16-2016 |
20160181216 | REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION | 06-23-2016 |
20160181574 | METHOD FOR MANUFACTURING FLEXIBLE OLED (ORGANIC LIGHT EMITTING DIODE) PANEL | 06-23-2016 |
20160181760 | SEMICONDUCTOR LASER DEVICE AND MANUFACTURING METHOD THEREOF, AND SUBMOUNT MANUFACTURING METHOD | 06-23-2016 |
20160204347 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | 07-14-2016 |
20160254641 | OPTICAL INTERCONNECT ON BUMPLESS BUILD-UP LAYER PACKAGE | 09-01-2016 |
20170236973 | PACKAGING METHOD FOR ULTRAVIOLET LIGHT EMITTING DIODE | 08-17-2017 |
20180026234 | METHODS OF FORMING A POLYMERIC THIN FILM LAYER ON AN ORGANIC LIGHT-EMITTING DIODE SUBSTRATE | 01-25-2018 |