| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 438021000 | MANUFACTURE OF ELECTRICAL DEVICE CONTROLLED PRINTHEAD | 46 |
| 20100075446 | METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD - A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface. | 03-25-2010 |
| 20130084662 | METHODS FOR FABRICATING PLANAR HEATER STRUCTURES FOR EJECTION DEVICES - Methods and apparatus teach a substrate wafer having a plurality of plugs configured there within. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures. | 04-04-2013 |
| 20130029437 | METHOD OF MANUFACTURING LIQUID EJECTION HEAD SUBSTRATE - A liquid ejection head substrate including a silicon substrate having a liquid supply port as hollow and slots as through holes connecting the hollow and a liquid channel arranged opposite sides of the substrate. The method includes etching the substrate to form the hollow; forming a first resist on the hollow; etching the first resist on the bottom of the hollow under conditions of securing an equal etching rate to both the silicon substrate and the first resist; forming a second resist on the hollow; patterning the second resist into an etching mask; and etching the substrate using the etching mask to form the through holes. | 01-31-2013 |
| 20090233386 | METHOD FOR FORMING AN INK JETTING DEVICE - A method for forming an ink jetting device includes providing a silicon substrate having a first surface having formed thereon a plurality of electrical heater elements to form a first upper exposed surface; depositing a polymer over the first upper exposed surface to form a sacrificial polymer layer; patterning the sacrificial polymer layer to form a second exposed upper surface; depositing a conformal material over the second exposed upper surface to form a conformal nozzle layer; patterning the conformal nozzle layer to form a plurality of nozzle holes located over the electrical heater elements; patterning a mask layer to form an exposed region of the second surface of the silicon substrate that defines a location of a central ink via; etching the exposed region to form the central ink via; and removing a portion of a remainder of the polymer layer to form ink ejection chambers. | 09-17-2009 |
| 20130115724 | METHOD OF FABRICATING AN INTEGRATED ORIFICE PLATE AND CAP STRUCTURE - In an embodiment, a method of fabricating an integrated orifice plate and cap structure includes forming an orifice bore on the front side of a product wafer, coating side walls of the orifice bore with a protective material, grinding the product wafer from its back side to a final thickness, forming a first hardmask for subsequent cavity formation, forming a second hardmask over the first hardmask for subsequent descender formation, forming a softmask over the second hardmask for subsequent convergent bore formation, etching a latent convergent bore using the softmask as an etch delineation feature, etching a descender using the second hardmask as an etch delineation feature, and anisotropic etching of convergent bore walls and cavities using the first hardmask as an etch delineation feature. | 05-09-2013 |
| 20110300648 | SUBSTRATE PROCESSING METHOD AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD - A substrate processing method including the steps of disposing a substrate having a recess in such a manner that the face having the recess is upward in the gravity direction, and applying a resist to the recess and face having the recess to form a resist film thereon, and disposing the substrate having the resist film formed thereon in such a manner that the face having the recess is downward in the gravity direction, and applying a liquid capable of dissolving the resist to the resist film to adjust the thickness of the resist film. A method for manufacturing a liquid ejection head is also provided. | 12-08-2011 |
| 20110287562 | METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD SUBSTRATE, METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD, AND METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD ASSEMBLY - A method of manufacturing a liquid discharge head substrate, includes forming an etching mask layer having an opening in a shape corresponding to a plurality of second portions on a second plane of the substrate, forming a recess to be a first portion by etching the substrate through the opening of the etching mask layer from a second plane side of the substrate, and forming the plurality of second portions by etching a portion from a bottom of a first portion to a first plane using the etching mask layer as a mask from the second plane side of the substrate to forma liquid supply port passing through the substrate. | 11-24-2011 |
| 20110217797 | METHOD OF MANUFACTURING AN INK JET PRINT HEAD - In a method of manufacturing an ink jet print head that includes a number of aligned modules, an alignment mark is foamed on a first and a second adjacent module, wherein the alignment mark is positioned on a boundary between the first and the second adjacent module along which the wafer is to be separated. In a separating step the wafer is separated into separate modules such that the alignment mark is divided over said first and second adjacent module. At least one of said first and second module is aligned by reference to the divided alignment mark. The method improves the accuracy, with which the modules can be aligned. | 09-08-2011 |
| 20120088317 | PROCESSING METHOD OF SILICON SUBSTRATE AND PROCESS FOR PRODUCING LIQUID EJECTION HEAD - A processing method of a silicon substrate, including forming on a back surface of a silicon substrate an etching mask layer having an opening portion, measuring a thickness of the silicon substrate, irradiating the opening portion in the etching mask layer with laser from the back surface of the silicon substrate to form in the silicon substrate a modified layer with a thickness that is varied according to the measured thickness of the silicon substrate, carrying out anisotropic etching with regard to the silicon substrate having the modified layer formed therein to form in the back surface a depressed portion which does not pass through the silicon substrate and which has a bottom surface in the silicon substrate, and carrying out dry etching in the depressed portion to form a through-hole passing from the bottom surface of the depressed portion to a front surface of the silicon substrate. | 04-12-2012 |
| 20110020964 | METHOD OF FABRICATING INKJET PRINTHEAD ASSEMBLY HAVING BACKSIDE ELECTRICAL CONNECTIONS - A method of fabricating an inkjet printhead assembly having backside electrical connections. The method comprises the steps of: (a) providing printhead integrated circuits, each having a backside recessed edge portion and connectors extending through the integrated circuit, each connector having a head connected to frontside drive circuitry and a base in the recessed edge portion; (b) positioning a connection end of a connector film in the recessed edge portion; (c) connecting each film contact to the base of a corresponding connector; and (d) attaching the backside of each printhead integrated circuit together with the connector film to an ink supply manifold so as to provide the inkjet printhead assembly having backside electrical connections. | 01-27-2011 |
| 20110020965 | METHOD OF FABRICATING PRINTHEAD INTEGRATED CIRCUIT WITH BACKSIDE ELECTRICAL CONNECTIONS - A method of fabricating a printhead integrated circuit configured for backside electrical connections. The method comprises the steps of: (a) providing a wafer comprising a plurality of partially-fabricated nozzle assemblies on a frontside of the wafer and through-silicon connectors extending from the frontside towards a backside of the wafer; (b) depositing a conductive layer on the frontside of said wafer and etching to form an actuator for each nozzle assembly and a frontside contact pad over a head of each through-silicon connector; (c) performing further MEMS processing steps to complete formation of nozzle assemblies ink supply channels through-silicon connectors; and (d) dividing the wafer into individual printhead integrated circuits. Each printhead integrated circuit thus formed is configured for backside-connection to the drive circuitry via the through-silicon connectors the contact pads. | 01-27-2011 |
| 20090275151 | Method Of Forming Printhead By Removing Sacrificial Material Through Nozzle Apertures - A method of fabricating an inkjet printhead by forming a plurality of actuators on a monolithic substrate, covering the actuators with a sacrificial material, covering the sacrificial material with a printhead surface layer, defining a plurality of nozzle apertures in the printhead surface layer such that each of the actuators corresponds to one of the nozzle apertures and then, removing at least some of the sacrificial material on each of the actuators through the nozzle aperture corresponding to each of the actuators. | 11-05-2009 |
| 20080274571 | Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device - In a method of manufacturing a semiconductor thin film piece device, a plurality of semiconductor thin film pieces ( | 11-06-2008 |
| 20080274570 | Inkjet head, method for producing inkjet head, inkjet recorder and inkjet coater - A method for producing an inkjet head for jetting an ink from a nozzle that is formed on a nozzle main body formed of a metal material, the method includes smoothening a surface of the nozzle main body, applying a silica sol solution to the nozzle main body so as to form a silica sol film, wherein the silica sol solution has a concentration that is controlled to avoid a nozzle clogging in the nozzle main body, heating the silica sol film formed on the nozzle main body to thereby convert the silica sol film into an SiO | 11-06-2008 |
| 20100003773 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - A method for manufacturing a liquid discharge head provided with a substrate which has a layer made of silicon nitride and with a discharge port forming member which is disposed above the layer made of silicon nitride and has a discharge port for discharging liquid. The method includes providing a photosensitive layer that is to be the discharge port forming member above the layer made of silicon nitride, and forming the discharge port by exposing the photosensitive layer to i-line. The layer made of silicon nitride has a refractive index of 2.05 or more to light of a wavelength of 633 nm and irradiation with the i-line is performed in the exposure. | 01-07-2010 |
| 20080318352 | METHOD OF BONDING MEMS INTEGRATED CIRCUITS - A method of bonding an integrated circuit to a substrate is provided. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to a film frame tape supported by a wafer film frame. The method comprises the steps of: (a) positioning a substrate at a backside of the integrated circuit; (c) positioning a bonding tool on a zone of the film frame tape, the zone being aligned with the integrated circuit; and (c) applying a bonding force from the bonding tool, through the film frame tape and the integrated circuit, onto the substrate. | 12-25-2008 |
| 20080213927 | METHOD FOR MANUFACTURING AN IMPROVED RESISTIVE STRUCTURE - Provided, in one embodiment, is a method for manufacturing a resistive structure. This method, without limitation, includes forming a substrate, and forming a tantalum-aluminum-nitride resistive layer over the substrate. Moreover, a bulk resistivity of the tantalum-aluminum-nitride resistive layer may be adjusted by varying at least one deposition condition selected from the group consisting of a flow rate ratio of nitrogen to argon, power, pressure, temperature and radio frequency (RF) bias voltage. | 09-04-2008 |
| 20110059558 | PROCESS OF PRODUCING LIQUID DISCHARGE HEAD BASE MATERIAL - A process includes preparing a base material having a first surface provided with an element generating energy that is used for discharging a liquid and an electrode layer that is connected to the element; forming a hollow on a second surface, which is the surface on the opposite side of the first surface, of the base material, wherein part of the electrode layer serves as the bottom face of the hollow; covering the surface of the base material and the bottom face forming the inner face of the hollow with an insulating film; and partially exposing the electrode layer by removing part of the insulating film covering the bottom face using laser light. | 03-10-2011 |
| 20100151600 | METHOD OF BONDING SELECTED INTEGRATED CIRCUIT TO ADHESIVE SUBSTRATE - A method of bonding an integrated circuit to an adhesive substrate. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to a film frame tape supported by a wafer film frame. The method includes the steps of: (a) selecting one of the integrated circuits for bonding to the adhesive substrate; (b) positioning the adhesive substrate at a backside of the selected integrated circuit; (c) positioning a bonding tool on a zone of the film frame tape, the zone being aligned with the selected integrated circuit; and (d) applying a bonding force from the bonding tool through the film frame tape and the selected integrated circuit onto the adhesive substrate, so as to bond the backside of the selected integrated circuit to the substrate. | 06-17-2010 |
| 20100216264 | METHOD OF MANUFACTURING A SUBSTRATE FOR A LIQUID DISCHARGE HEAD - A method of manufacturing a substrate for a liquid discharge head, the substrate being a silicon substrate having a first surface opposed to a second surface, the method comprising the steps of providing a layer on the second surface of the silicon substrate, wherein the layer has a lower etch rate than silicon when exposed to an etchant of silicon, partially removing the layer so as to expose part of the second surface of the silicon substrate, wherein the exposed part surrounds at least one part of the layer; and wet etching the layer and the exposed part of the second surface of the silicon substrate, using the etchant of silicon, to form a liquid supply port extending from the second surface to the first surface of the silicon substrate. | 08-26-2010 |
| 20080227229 | METHOD OF FABRICATION MEMS INTEGRATED CIRCUITS - A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said method comprising the steps of:
| 09-18-2008 |
| 20100323463 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - A method for manufacturing a substrate for a liquid discharge head provided with a silicon substrate and a supply port, including: providing the silicon substrate having an insulating layer on a first surface and an etching mask layer having a plurality of apertures on a second surface which is a rear surface of the first surface, wherein the insulating layer is provided in a region ranging from a position opposing the apertures to a position opposing a portion between the adjacent apertures of the mask layer; and forming holes by etching a silicon part of the silicon substrate so that an etched region reaches a portion of the insulating layer opposing the apertures, wherein the silicon wall provided between the adjacent holes is etched so that the portion in the first surface side thereof can be thinner than the portion in the second surface side thereof. | 12-23-2010 |
| 20100317130 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - A method for manufacturing a liquid discharge head includes providing a first layer containing a metal nitride to at least a portion on one surface of a silicon substrate corresponding to a supply port; providing a second layer on the first layer, the second layer including any one of aluminum, copper, and gold, or an alloy thereof; etching a portion of the silicon substrate corresponding to the supply port by reactive ion etching in a direction from the reverse surface towards the one surface so that the etched region reaches the first layer; and removing a portion of the first layer corresponding to the supply port and then removing a portion of the second layer corresponding to the supply port, thus forming the supply port. | 12-16-2010 |
| 20110086446 | METHOD OF FORMING THERMAL BEND ACTUATOR WITH CONNECTOR POSTS CONNECTED TO DRIVE CIRCUITRY - A method of forming a thermal bend actuator in an inkjet nozzle assembly. The method includes: depositing sidewalls and a roof layer to define a nozzle chamber; defining first and second vias in one sidewall to reveal first and second electrodes; filling the vias with a conductive material using electroless plating to provide first and second connector posts; depositing an active beam material onto the roof layer; etching the active beam material to define a planar active beam member comprising a bent or serpentine beam element; and etching the roof layer to define the thermal bend actuator. | 04-14-2011 |
| 20110151598 | METHOD FOR MANUFACTURING A SUBSTRATE FOR LIQUID-EJECTING HEADS AND A LIQUID-EJECTING HEAD - A method for manufacturing a substrate for liquid-ejecting heads includes etching a surface of a silicon substrate using a first etchant, with a silicon oxide layer as a mask, to form a depression as a part of a liquid supply port, and subsequently etching at least the silicon oxide layer and the thickness sandwiched between the depression and the etched surface of the silicon substrate with a second etchant to form the liquid supply port. | 06-23-2011 |
| 20080199981 | METHOD FOR FORMING A FLUID EJECTION DEVICE - A method of forming a fluid ejection device includes forming a pair of first glass layers and forming a second glass layer. Each first glass layer includes a first side and a second side with the second side defining a first fluid flow structure. The second glass layer includes a first side and a second side opposite the first side, with each respective first side and second side defining a second fluid flow structure. The second glass layer is bonded in a sandwiched position between the respective first glass layers with each respective second fluid flow structure of the second glass layer in fluid communication with the respective first fluid flow structure of the respective first glass layers to define a fluid flow pathway for ejecting a fluid. | 08-21-2008 |
| 20110020966 | METHOD FOR PROCESSING SILICON SUBSTRATE AND METHOD FOR PRODUCING SUBSTRATE FOR LIQUID EJECTING HEAD - A method for processing a silicon substrate includes preparing a first silicon substrate including an etching mask layer including first and second opening portions; forming a first recess in a portion of the silicon substrate corresponding to a region in the first opening portion; etching the silicon substrate by crystal anisotropic etching through the etching mask layer with an etching apparatus and an etchant, the etching proceeding in the first and second opening portions to form a through hole in a position corresponding to the first opening portion and to form a second recess in a position corresponding to the second opening portion; calculating an etching rate of the silicon substrate in terms of the etchant by using the second recess; and determining, by using the calculated etching rate, an etching condition for etching another silicon substrate with the etching apparatus after the etching of the first silicon substrate. | 01-27-2011 |
| 20100285617 | LIQUID DISCHARGE HEAD SUBSTRATE, LIQUID DISCHARGE HEAD USING THE SUBSTRATE, AND MANUFACTURING METHOD THEREFOR - Provided is a liquid discharge head substrate including: a substrate; a heating resistor layer formed on the substrate; a flow path for a liquid; a wiring layer stacked on the heating resistor layer and having an end portion which forms a step portion on the heating resistor layer; and a protective layer covering the heating resistor layer and the wiring layer including the step portion, and formed between the heating resistor layer and the flow path, in which the protective layer is formed by a Cat-CVD method. | 11-11-2010 |
| 20090176322 | METHOD FOR FABRICATING AN INK JETTING DEVICE - A method for forming an ink jetting device includes providing a silicon chip including a silicon substrate having a first surface and a second surface opposite to the first surface, the first surface having formed thereon a plurality of electrical heater elements and a silicon oxide ink ejection chamber layer configured to define a plurality of ink ejection chambers; providing a silicon nozzle plate having a silicon nozzle layer having a third surface and a fourth surface opposite to the third surface, the fourth surface having formed thereon a silicon oxide layer; aligning the silicon nozzle plate with the silicon chip; fusion bonding the silicon oxide layer of the silicon nozzle plate to the silicon oxide ink ejection chamber layer of the silicon chip; and forming a plurality of nozzle holes through the silicon nozzle plate respectively located over the plurality of electrical heater elements. | 07-09-2009 |
| 20110318854 | METHOD OF MOUNTING MEMS INTEGRATED CIRCUITS DIRECTLY FROM WAFER FILM FRAME - A method mounting a MEMS integrated circuit on a substrate. The method includes the steps of: (a) providing a film frame tape supported by a wafer film frame, the film frame tape having the plurality of MEMS integrated circuits releasably attached via respective frontsides to the film frame tape; (b) treating a backside surface oxide layer of each MEMS integrated circuit with liquid ammonia; (c) positioning a substrate at the backside of one of said MEMS integrated circuits; (d) positioning a bonding tool on a zone of the film frame tape aligned with the MEMS integrated circuit; and (e) applying a bonding force from the bonding tool so as to bond the backside of the MEMS integrated circuit to the substrate. | 12-29-2011 |
| 20110318853 | METHOD FOR FORMING NOZZLE CHAMBER OF INKJET PRINTHEAD - A method for forming a nozzle chamber of an inkjet printhead includes the steps of depositing a sacrificial layer on a wafer substrate; etching the sacrificial layer to define a deposition area for forming sidewalls of the nozzle chamber; depositing a structural layer over the sacrificial layer and into the deposition area; etching the structural layer to define an ink ejection port and a plurality of etchant holes, the etchant holes being etched to a dimension for facilitating the establishment of sufficient surface tension across the etchant hole to restrict egress of ink therethrough from the nozzle chamber; and etching away the sacrificial layer using a sacrificial etchant, the sacrificial etchant being applied to the sacrificial layer via the etchant holes. | 12-29-2011 |
| 20120058578 | METHOD OF MANUFACTURING A SUBSTRATE FOR LIQUID EJECTION HEAD - Provided is a method of manufacturing a substrate for liquid ejection head, including: forming a groove portion by etching on one surface side of a silicon substrate, the groove portion being formed so as to surround a portion at which a liquid supply port is to be formed on an inner side of the groove portion; forming a protective layer on the one surface side of the silicon substrate, the protective layer being formed inside the groove portion and on an outer side of the groove portion; and forming the liquid supply port by subjecting the silicon substrate to crystal anisotropic etching treatment with use of the protective layer as a mask. | 03-08-2012 |
| 20120028384 | METHOD FOR MANUFACTURING A LIQUID-EJECTION HEAD - A method for manufacturing a liquid-ejection head having a plurality of nozzles arranged to eject liquid includes: preparing a substrate having a first layer, a second layer, and a third layer stacked in this order, the second layer more resistant than the third layer to etching by an etching method to be used on the third layer; partially etching the third layer by the etching method to expose the second layer; and removing the exposed second layer at least in part to expose some area on the top surface of the first layer, opening a first one of the nozzles down from the exposed area of the top surface, and opening a second one of the nozzles down from the top surface of the third layer. | 02-02-2012 |
| 20120028383 | PROCESSING METHOD OF SILICON SUBSTRATE AND LIQUID EJECTION HEAD MANUFACTURING METHOD - A processing method of a silicon substrate including forming a second opening in a bottom portion of a first opening using a patterning mask having a pattern opening by plasma reactive ion etching. The reactive ion etching is performed with a shield structure formed in or on the silicon substrate, the shield structure preventing inside of the first opening from being exposed to the plasma. | 02-02-2012 |
| 20120064647 | METHOD OF FABRICATING MICROELECTROMECHANICAL SYSTEMS DEVICES - A method of fabricating microelectromechanical systems devices is disclosed. A silicon substrate having a plurality of microelectromechanical systems elements formed on a first surface thereof is provided. A guard layer defining a plurality of recesses is applied to the silicon substrate such that respective microelectromechanical systems elements are located within respective recesses. The silicon substrate is then segmented into discrete parts and an adhesive layer is bonded to a second surface of the silicon substrate. The guard layer is next segmented into discrete parts corresponding to the discrete parts of the silicon substrate, thereby forming individual microelectromechanical systems devices. Finally, the adhesive layer is selectively exposed to a light source allowing removal of individual microelectromechanical systems devices. | 03-15-2012 |
| 20110183448 | LIQUID COMPOSITION, METHOD OF PRODUCING SILICON SUBSTRATE, AND METHOD OF PRODUCING LIQUID DISCHARGE HEAD SUBSTRATE - A liquid composition used to carry out crystal anisotropic etching of a silicon substrate provided with an etching mask formed of a silicon oxide film with the silicon oxide film used as a mask includes cesium hydroxide, an alkaline organic compound, and water. | 07-28-2011 |
| 20090124029 | METHOD OF FABRICATING RESISTOR AND PROXIMATE DRIVE TRANSISTOR FOR A PRINTHEAD - A method of fabricating a resistor-drive transistor architecture for a printhead of a printer, by depositing printer communication and drive electronics on the printhead. The drive electronics are positioned within a range of one to sixty microns from correlated resistors. | 05-14-2009 |
| 20100291715 | MOUNTED STRUCTURE, LIQUID DROPLET EJECTION HEAD, LIQUID DROPLET EJECTION APPARATUS AND MANUFACTURING METHOD - A liquid droplet ejection head includes: a first substrate having a pressurizing chamber with a nozzle aperture that ejects liquid droplets, and a first surface on which is formed a first wiring electrically connected to the drive element; a second substrate disposed on the first surface of the first substrate and covering the driven element, the second substrate having a second surface and a side surface, the second surface facing in a same direction as the first surface of the first substrate and on which is formed a second wiring, the side surface on which is formed a third wiring that combines the first wiring and the second wiring; a semiconductor element disposed on the second surface of the second substrate, and which drives the driven element; and plating that electrically connects the first wiring, the second wiring, the third wiring, and a connection terminal of the semiconductor element. | 11-18-2010 |
| 20120258556 | METHOD FOR MANUFACTURING LIQUID EJECTING HEAD - A method for manufacturing an ink jet recording head is employed which has a metal mask formation process for forming a metal mask having a predetermined shape containing a silicide film formed by silicidation of the surface of a flow path forming substrate wafer containing a silicon substrate and a liquid flow path formation process for forming a liquid flow path by anisotropically etching the flow path forming substrate wafer using the metal mask as a mask. | 10-11-2012 |
| 20120231565 | PROCESS FOR PRODUCING A SUBSTRATE FOR A LIQUID EJECTION HEAD - Provided is a process for producing a substrate for a liquid ejection head, including forming a liquid supply port in a silicon substrate, the process including the steps of (a) forming an etch stop layer at a portion of a front surface of the silicon substrate at which portion the liquid supply port is to be formed; (b) performing dry etching using a Bosch process from a rear surface side of the silicon substrate up to the etch stop layer with use of an etching mask formed on a rear surface of the silicon substrate to thereby form the liquid supply port; and (c) simultaneously removing the etch stop layer and a deposition film formed inside the liquid supply port. | 09-13-2012 |
| 20110003405 | Surface Micromachining Process of MEMS Ink Jet Drop Ejectors On Glass Substrates - Method and device for forming a membrane includes providing a glass substrate, and depositing a thin layer of chromium on the glass substrate. The thin layer of chromium is patterned to form a deflection electrode and interconnect leads. A sacrificial layer of aluminum is deposited on top of the patterned chromium layer, then the sacrificial layer is patterned to define anchor regions. On top of the sacrificial layer, a thick layer of chromium is deposited, and the thick layer of chromium is patterned to form a membrane. The sacrificial layer is then etched to release the membrane. | 01-06-2011 |
| 20120270344 | INK JET PRINT HEAD FRONT FACE HAVING A TEXTURED SUPEROLEOPHOBIC SURFACE AND METHODS FOR MAKING THE SAME - An ink jet print head front face or nozzle plate having a textured superoleophobic surface that prevents undesirable drooling, wetting and/or adhesion of the ink on the print head. The textured surface includes a rim formed around the nozzle. Also described are methods for forming the textured superoleophobic ink jet print head front face or nozzle plate from silicon having the textured, oleophobic surface. | 10-25-2012 |
| 20100233833 | Method for Producing Ink-Jet Head - There is provided a method for producing an ink jet head. The method includes: first oxidizing in which, in an SOI substrate having a first SiO | 09-16-2010 |
| 20120282715 | STRUCTURE MANUFACTURING METHOD AND LIQUID DISCHARGE HEAD SUBSTRATE MANUFACTURING METHOD - A method for processing a silicon substrate includes providing a combination of a first silicon substrate, a second silicon substrate, and an intermediate layer including a plurality of recessed portions, which is provided between the first silicon substrate and the second silicon substrate, forming a first through hole that goes through the first silicon substrate by executing etching of the first silicon substrate on a surface of the first silicon substrate opposite to a bonding surface with the intermediate layer by using a first mask, and exposing a portion of the intermediate layer corresponding to the plurality of recessed portions of the intermediate layer, forming a plurality of openings on the intermediate layer by removing a portion constituting a bottom of the plurality of recessed portions, and forming a second through hole that goes through the second silicon substrate by executing second etching of the second silicon substrate by using the intermediate layer on which the plurality of openings are formed as a mask. | 11-08-2012 |
| 20120329181 | METHOD FOR PRODUCING LIQUID-DISCHARGE-HEAD SUBSTRATE - A method for producing a liquid-discharge-head substrate includes a step of preparing a silicon substrate including, at a front-surface side of the silicon substrate, an energy generating element; a step of forming a first etchant introduction hole on the front-surface side of the silicon substrate; a step of supplying a first etchant into the first etchant introduction hole formed on the front-surface side of the silicon substrate, and supplying a second etchant to a back-surface side of the silicon substrate; a step of stopping the supply of the second etchant; and a step of, after the supply of the second etchant has been stopped, forming a liquid supply port extending through front and back surfaces of the silicon substrate by the supply of the first etchant. | 12-27-2012 |
| 20100167433 | PIEZOELECTRIC INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - A piezoelectric inkjet printhead including an upper substrate formed of a single crystal silicon substrate or an SOI substrate and having an ink inlet therethrough, and a lower substrate formed of an SOI substrate having a sequentially stacked structure with a first silicon layer, an intervening oxide layer, and a second silicon layer in which a manifold, pressure chambers, and dampers are formed in the second silicon layer by wet or dry etching, and nozzles are formed through the intervening oxide layer and the first silicon layer by dry etching, and a method of manufacturing the same. | 07-01-2010 |
