Class / Patent application number | Description | Number of patent applications / Date published |
430315000 | Material deposition only | 34 |
20080213702 | METHOD FOR PATTERNING CONDUCTIVE POLYMER - A method for patterning a conductive polymer that adheres well to an oxide layer is presented. The method includes forming a self-assembled monolayer on a substrate, patterning the self-assembled monolayer, forming a catalyst layer on the self-assembled monolayer, and forming a conductive polymer layer on the self-assembled monolayer. | 09-04-2008 |
20080220375 | Methods of reworking a semiconductor substrate and methods of forming a pattern in a semiconductor device - In a method of reworking a substrate, an organic anti-reflection coating (ARC) layer is formed on the substrate having an amorphous carbon pattern. A photoresist pattern is formed on the organic ARC layer. The photoresist pattern is entirely exposed when the photoresist pattern has a selected level of defects, and then the photoresist pattern is removed by a developing process. The substrate may be reworked without damaging the organic ARC layer, and the amorphous carbon pattern may include an alignment key and/or an overlay key. | 09-11-2008 |
20080241759 | METHOD OF MANUFACTURING WIRING CIRCUIT BOARD - A conductor circuit ( | 10-02-2008 |
20090092928 | COMPONENT FABRICATION USING THERMAL RESIST MATERIALS - A method for producing a patterned material for electronic or photonic circuits, comprising the steps of: | 04-09-2009 |
20090104566 | Process of multiple exposures with spin castable film - Methods of multiple exposure in the fields of deep ultraviolet photolithography, next generation lithography, and semiconductor fabrication comprise a spin-castable methodology for enabling multiple patterning by completing a standard lithography process for the first exposure, followed by spin casting an etch selective overcoat layer, applying a second photoresist, and subsequent lithography. Utilizing the etch selectivity of each layer, provides a cost-effective, high resolution patterning technique. The invention comprises a number of double or multiple patterning techniques, some aimed at achieving resolution benefits, as well as others that achieve cost savings, or both resolution and cost savings. These techniques include, but are not limited to, pitch splitting techniques, pattern decomposition techniques, and dual damascene structures. | 04-23-2009 |
20090117493 | Anti-Reflective Coating Forming Composition Containing Reaction Product of Isocyanuric Acid Compound with Benzoic Acid Compound - There is provided anti-reflective coating forming composition containing a reaction product of an isocyanuric acid compound having two or three 2,3-epoxypropyl groups with a benzoic acid compound. The anti-reflective coating obtained from the composition has a high preventive effect for reflected light, causes no intermixing with photoresists, can form a photoresist pattern having no footing at the lower part, and can use in lithography process by use of a light such as ArF excimer laser beam and F2 excimer laser beam, etc. | 05-07-2009 |
20090155726 | METHODS OF FORMING ELECTRONIC DEVICES BY ION IMPLANTING - A method of forming an electronic device is provided that includes forming a resist layer over a substrate having a first region, a second region, and a third region. The method further includes directing radiation through a reticle, wherein the reticle comprises different radiation zones having significantly different transmission values with respect to each other, and the first region is exposed to a significantly different amount of radiation as compared to the second region. The method also includes removing part of the resist layer to leave a remaining portion such that the second region of the resist layer is significantly thinner than the third region of the resist layer, and then ion implanting the substrate while the remaining portion of the resist layer overlies the substrate to form a first implant region and a second implant region having different depths. | 06-18-2009 |
20090305168 | Techniques for Marking Product Housings - Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface. | 12-10-2009 |
20090325105 | PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS THEREIN, AND PROCESS FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO | 12-31-2009 |
20100028810 | ETCHING METHOD FOR USE IN DEEP-ULTRAVIOLET LITHOGRAPHY - In a lithography process using an ultraviolet process, the applied ultraviolet resist can be removed by intentionally condensing the ultraviolet resist before removing the ultraviolet resist. | 02-04-2010 |
20100099045 | METHODS FOR PERFORMING PHOTOLITHOGRAPHY USING BARCS HAVING GRADED OPTICAL PROPERTIES - Photolithography methods using BARCs having graded optical properties are provided. In an exemplary embodiment, a photolithography method comprises the steps of depositing a BARC overlying a material to be patterned, the BARC having a refractive index and an absorbance. The BARC is modified such that, after the step of modifying, values of the refractive index and the absorbance are graded from first values at a first surface of the BARC to second values at a second surface of the BARC. The step of modifying is performed after the step of depositing. | 04-22-2010 |
20100143848 | PATTERNING METHODS FOR STRETCHABLE STRUCTURES - Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser ablation patterning methods utilized herein allow for efficient manufacture of large area (e.g., up to 1 mm | 06-10-2010 |
20100173249 | Method for Manufacturing a Semiconductor Device - Disclosed herein is a composition for removing an immersion lithography solution. The composition includes an organic solvent and an acid compound. Also disclosed is a method for manufacturing a semiconductor device including an immersion lithography process. When a photoresist pattern is formed by the immersion lithography process, an exposure process is performed on a photoresist film formed over an underlying layer with an immersion lithography exposer. Then, the composition is dripped over the wafer to remove residual immersion lithography solution on the photoresist film, thereby improving a water mark defect phenomenon. | 07-08-2010 |
20100285409 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A reverse pattern is formed once by combining a negative exposure mask having a wiring pattern with a positive resist, and then a positive wiring pattern is formed by use of the reverse pattern. That is, a positive resist applied on a semiconductor substrate is exposed by use of the exposure mask having an opening part in a region corresponding to the wiring pattern, and then the exposed part is removed by development to form a resist pattern, thereby forming the wiring pattern in the region corresponding to the opening part of the resist pattern. Consequently, it is hardly affected by flare during EUV exposure, thereby fabricating a fine wiring pattern with higher exposure latitude. | 11-11-2010 |
20100323297 | METHOD OF MANUFACTURING OPTICAL WAVEGUIDE LAMINATED WIRING BOARD - A via hole is formed in a first cladding layer laminated on a wiring board. A conductive material is filled in the via hole so as to form a first conductor portion (a portion of a conductive via) having a mushroom-like shape projecting from a surface of the first cladding layer. Then, a second cladding layer is formed to cover the first conductor portion, the first cladding layer and a core layer, and a via hole is formed in the second cladding layer. A conductive material is filled in the via hole so as to form a second conductor portion (a remaining portion of the conductive via) connected to the first conductor portion. | 12-23-2010 |
20110014574 | METHOD OF FORMING PITCH MULTIPLED CONTACTS - Methods of forming electrically conductive and/or semiconductive features for use in integrated circuits are disclosed. Various pattern transfer and etching steps can be used, in combination with pitch-reduction techniques, to create densely-packed features. The features can have a reduced pitch in one direction and a wider pitch in another direction. Conventional photo-lithography steps can be used in combination with pitch-reduction techniques to form elongate, pitch-reduced features such as bit-line contacts, for example. | 01-20-2011 |
20110117501 | RESIST UNDERLAYER POLYMER, RESIST UNDERLAYER COMPOSITION INCLUDING THE SAME, AND METHOD OF PATTERNING USING THE SAME - A resist underlayer polymer, a resist underlayer composition including the same, and a method of patterning using the same, the resist underlayer polymer including a repeating unit represented by at least one of Chemical Formula 1 and Chemical Formula 2: | 05-19-2011 |
20110159444 | METHOD FOR MANUFACTURING PROBE SHEET - An embodiment of the invention provides a method for manufacturing a probe sheet in which a probe tip can be arranged at a predetermined accurate position without the need for troublesome positional adjustment operations of the probe tip in coupling operations of each contactor and a probe sheet main body. It is a method for manufacturing a probe sheet comprising a probe sheet main body having conductive paths and a plurality of contactors formed to be protruded from one surface of the probe sheet main body and connected to the conductive paths. The manufacturing method comprises the steps of forming a plurality of the contactors on a base table by sequentially depositing on the base table metal materials for a plurality of contactors from their respective probe tips toward base portions with use of a photolithographic technique, forming on the base table the probe sheet main body to be coupled with the base portion of each contactor held on the base table, and separating the contactors from the base table integrally with the probe sheet main body. | 06-30-2011 |
20110183267 | METHOD OF PRODUCING MULTILAYER PRINTED WIRING BOARD AND PHOTOSENSITIVE DRY FILM USED THEREFOR - A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist. The photosensitive dry film has a nitrogen-containing heterocyclic compound layer on a first surface thereof. | 07-28-2011 |
20110183268 | PROCESS FOR MAKING CONTAINED LAYERS AND DEVICES MADE WITH SAME - There is provided a process for forming a contained second layer over a first layer, including the steps:
| 07-28-2011 |
20110229822 | METHODS FOR PROTECTING A DIE SURFACE WITH PHOTOCURABLE MATERIALS - In a first aspect of the present invention, a method for manufacturing a flip chip package is provided comprising the steps of a) providing a chip having electrically conductive pads on an active surface thereof, b) coating at least a portion the chip with a protectant composition comprising a polymerizable component comprising a thermosetting epoxy resin, at least 50 weight percent of a substantially transparent filler having a coefficient of thermal expansion of less than 10 ppm/° C., a photoinitator, and a solvent carrier, wherein the protectant composition comprises a thixotropic index of less than 1.5, c) masking the coated chip to mask areas where vias through the protectant are desired, d) exposing the masked chip to a light source sufficient to partially crosslink the protectant composition in the unmasked areas, e) removing the uncured portions of the protectant composition thereby creating vias through the protectant composition to the electrically conductive pads on the surface of the chip, f) applying an electrically conductive material to the chip through the vias, wherein the electrically conductive material protrudes from the surface of the protectant composition, and g) heating the chip to a temperature sufficient to reflow the electrically conductive material and thermoset the protectant composition. | 09-22-2011 |
20110229823 | FUEL CELL FABRICATION USING PHOTOPOLYMER BASED PROCESSES - A method for fabricating a fuel cell component includes the steps of providing a mask having a plurality of radiation transparent apertures, a radiation-sensitive material having a sensitivity to the plurality of radiation beams, and a flow field layer. The radiation-sensitive material is disposed on the flow field layer. The radiation-sensitive material is then exposed to the plurality of radiation beams through the radiation transparent apertures in the mask to form a diffusion medium layer with a micro-truss structure. | 09-22-2011 |
20110236834 | Electrode, electronic device and method for manufacturing the same - Example embodiments relate to an electrode having a transparent electrode layer, an opaque electrode layer formed on the transparent electrode layer and catalyst formed on an open surface on the transparent electrode layer, which open surface is not covered by the opaque electrode layer. | 09-29-2011 |
20110236835 | Silsesquioxane Resins - Antireflective coatings produced from silsesquioxane resin comprises the units (Ph(CH | 09-29-2011 |
20110300488 | Antireflective Coating Composition and Process Thereof - The invention related to an antireflective coating comprising a mixture of a first polymer and a second polymer, and a thermal acid generator, where the first polymer comprises at least one fluoroalcohol moiety, at least one aliphatic hydroxyl moiety, and at least one acid moiety other than fluoroalcohol with a pKa in the range of about 8 to about 11; where the second polymer is a reaction product of an aminoplast compound with a compound comprising at least one hydroxyl and/or at least one acid group. The invention further relates to a process for using the novel composition to form an image. | 12-08-2011 |
20110300489 | Method For Providing A Conductive Material Structure On A Carrier - An exemplary method for providing a conductive material structure on a carrier generally includes applying a photo sensitive material on the carrier and applying a mask on the photo sensitive material. The mask defines a conductive material structure to be formed on the carrier. The method also includes irradiating the defined structure on the carrier in order to prepare for metallization, and metalizing the defined structure for forming the conductive material structure. | 12-08-2011 |
20120015304 | METHOD FOR FABRICATING AN INTERPOSER - Method for fabricating an interposer is provided. A substrate is provided having thereon at least a conductive via and at least a flange. The flange is bonded on the substrate and shades a portion of the via. A photoresist layer is formed on the interior surface of the via, on a contact surface of the flange and on an inner surface of the flange opposite to the contact surface. An opening is formed in the photoresist layer to expose a portion of the contact surface of the flange, while the photoresist layer still covers the interior surface of the via and the inner surface of the flange. A plating layer is formed on the exposed contact surface of the flange. The photoresist layer is then removed. | 01-19-2012 |
20120219918 | METHOD FOR FORMING A WIRING PATTERN BY LASER IRRADIATION - A method for forming a wiring pattern by laser irradiation includes the steps of coating a light-sensitive material on a substrate to form a light-sensitive layer, irradiating a laser beam on the light-sensitive material of the substrate to form a pattern including an exposed region exposed to laser irradiation and an unexposed region unexposed to laser irradiation, and forming a metallic wiring pattern by immersing the substrate into a solution having a plurality of metallic nano-particles. The metallic nano-particles are easily bonded to the straighter molecular structure of the light-sensitive material in the exposed region for forming a conducting wiring pattern. The laser irradiation method has advantages such as high-power, high-density, high-directionality and monochromaticity, such that product quality can be effectively controlled. Moreover, the laser irradiated light-sensitive material can form a molecular structure that is easily bonded to the metallic particles. As a result, the chemical wastes are substantially reduced. | 08-30-2012 |
20130316291 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer. | 11-28-2013 |
20150017587 | COMPOSITION FOR FORMING FINE RESIST PATTERN AND PATTERN FORMING METHOD USING SAME - [Object] To provide a composition enabling to form a fine negative photoresist pattern free from troubles, such as, surface roughness, bridge defects, and resolution failure; and also to provide a pattern formation method using that composition. | 01-15-2015 |
20160064768 | SUBSTRATE FOR THIN FILM MICROBATTERIES - A method for fabricating electrical storage cell including providing a photopolymer; providing a pre-patterned mask wherein the pre-patterned mask includes masked regions and unmasked regions; attaching the pre-patterned mask on top of the photopolymer; applying collimated ultraviolet radiation on the masked substrate wherein areas of the photopolymer underneath of the unmasked regions are solidified or cross linked and areas of the photopolymer underneath the masked are not solidified or cross linked to form an imaged substrate with perforated holes; developing the imaged substrate; cleaning residual material from the perforated holes; forming a thin film over the surface of a substrate area to define an anode, a cathode; and forming a solid electrolyte disposed between the anode and the cathode, wherein the thin film comprising a final layer which is formed so as to fill the perforated holes. | 03-03-2016 |
20160077427 | METHOD OF MANUFACTURING A BIOSENSOR - A method for manufacturing a biosensor includes forming an electrode layer on a flexible foil. An adhesive layer is positioned on the foil layer, and a first photo-definable hydrogel membrane is positioned over the electrode layer and the adhesive layer. A second photo-definable hydrogel membrane with an immobilized bio-recognition element is positioned over the first hydrogel membrane in contact with the electrode layer through an opening in the first hydrogel membrane. | 03-17-2016 |
20160077435 | METHODS OF FORMING PATTERNS - A method of forming patterns includes: forming guide patterns on an underlying layer, forming a self-assembling block copolymer (BCP) layer on the guide patterns and the underlying layer, annealing the self-assembling BCP layer to form first polymer block domains and second polymer block domains which are alternately and repeatedly arrayed, and selectively removing the first polymer block domains. The guide patterns are formed of a developable antireflective material. In addition, the guide patterns are spaced apart from each other such that a width of each of the guide patterns is less than a distance between the guide patterns. | 03-17-2016 |
20160133275 | METHODS OF FORMING NEAR FIELD TRANSDUCERS (NFTS) AND PORTIONS THEREOF - A method of forming a peg of a NFT, the peg having a tapered portion, the method including depositing a layer of dielectric material; forming a three dimensional shape from at least a portion of the dielectric material the three dimensional shape having two side surfaces and two end surfaces; and depositing plasmonic material on at least one side surface of the three dimensional shape of dielectric material, wherein the plasmonic material deposited on the at least one side surface forms the tapered portion of the peg. | 05-12-2016 |