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Radiation sensitive composition comprising ethylenically unsaturated compound

Subclass of:

430 - Radiation imagery chemistry: process, composition, or product thereof

430269000 - IMAGING AFFECTING PHYSICAL PROPERTY OF RADIATION SENSITIVE MATERIAL, OR PRODUCING NONPLANAR OR PRINTING SURFACE - PROCESS, COMPOSITION, OR PRODUCT

430270100 - Radiation sensitive composition or product or process of making

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
430285100 Polyester 296
430286100 Resin or prepolymer containing ethylenical unsaturation 189
430283100 Amide 98
430288100 Plural, terminal unsaturation 3
20130029271PHOTOSENSITIVE COMPOSITION AND COMPOUND FOR USE IN THE PHOTOSENESITIVE COMPOSITION - Disclosed are a photosensitive composition and a compound used in the same. If the composition provided through the present application is used, it is possible to form a thin film having improved adhesion strength of a pattern.01-31-2013
20080286693Sulfonate derivatives and the use thereof as latent acids - Chemically amplified photoresist compositions comprising,11-20-2008
20100173247SUBSTRATE PLANARIZATION WITH IMPRINT MATERIALS AND PROCESSES - The present invention relates to planarization materials and methods of using the same for substrate planarization in photolithography. A planarization layer of a planarization composition is formed on a substrate. The planarization composition contains at least one aromatic monomer and at least one non-aromatic monomer. A substantially flat surface is brought into contact with the planarization layer. The planarization layer is cured by exposing to a first radiation or by baking The substantially flat surface is then removed. A photoresist layer is formed on the planarization layer. The photoresist layer is exposed to a second radiation followed by development to form a relief image in the photoresist layer. The relief image is then transferred into the substrate.07-08-2010
430282100 N-vinylidene 3
20080274424Positive photosensitive element comprising vinyl polymers - A positive-working photosensitive composition for use in making an imageable element comprises one or more vinyl copolymers wherein said vinyl copolymer are homopolymer or copolymer containing monomers comprising at least two functional groups such as HOOC—C═C—CONH—R, and may further comprise a converter substance for converting radiation into heat. The converter substance may be selected to have an absorption spectrum that is optimized to absorb at the wavelength of imaging radiation. The composition may be coated onto a suitable substrate to create a lithographic printing precursor. The precursor may be imagewise irradiated with radiation and optionally developed with a developer liquid to produce a lithographic printing master. A positive-working lithographic printing precursor may be prepared using the composition.11-06-2008
20100248143ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, AND PATTERN-FORMING METHOD USING THE SAME - Provided is an actinic ray-sensitive or radiation-sensitive resin composition, a resist film formed with the composition, and a pattern-forming method using the same. The actinic ray-sensitive or radiation-sensitive resin composition includes (P) a resin that contains the following repeating units (A), (B) and (C); and a solvent having a boiling temperature of 150° C. or less, 09-30-2010
20100291483RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING BRANCHED POLYHYDROXYSTYRENE - There is provided a resist underlayer film which does not intermix with a photoresist coated and formed as the overlying layer and which dissolves in an alkaline developer and can be developed and removed at the same time as the photoresist; and a resist underlayer film-forming composition for forming such a resist underlayer film. A resist underlayer film-forming composition for use in a lithographic process for manufacturing a semiconductor device, containing: (A) a branched polyhydroxystyrene in which an ethylene repeating unit on a polyhydroxystyrene moiety is bonded to a benzene ring on a different polyhydroxystyrene moiety; (B) a compound having at least two vinyl ether groups; and (C) a photoacid generator.11-18-2010
Entries
DocumentTitleDate
20130045444POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS - There is disclosed a positive resist composition comprising (A) a resin having repeating units shown by the following general formulae (1) and (2) as repeating units that contain acid labile groups and being capable of increasing its alkaline solubility by an acid, (B) a photoacid generator, (C) a compound shown by the following general formula (3), and (D) a solvent. There can be a positive resist composition having high resolution, and at the same time giving an excellent pattern profile; and a patterning process in which an immersion lithography is carried out using a formed top coat.02-21-2013
20120171615CYCLIC COMPOUND, PROCESS FOR PRODUCTION OF THE CYCLIC COMPOUND, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMATION OF RESIST PATTERN - A cyclic compound represented by formula (1):07-05-2012
20090191479RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME - The present invention provides a resin composition for laser engraving containing at least an acetylene compound and a binder polymer, a relief printing plate precursor for laser engraving using the same, a relief printing plate, and a method for producing a relief printing plate.07-30-2009
20100159388LITHOGRAPHIC PRINTING PLATE PRECURSOR - A lithographic printing plate precursor comprising an image-recording layer, said image-recording layer being photopolymerizable upon exposure to light having a wavelength of from 300 to 500 nm and containing a mixture of sensitizers.06-24-2010
20100119974Resist composition, method of forming resist pattern, novel compound, and acid generator - A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) including a compound represented by (b1-1), a compound represented by (b1-1′) and/or a compound represented by (b1-1″) (R05-13-2010
20100119973POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM FORMING METHOD USING THE SAME - A positive photosensitive resin composition, includes: (A) a resin containing an acid-dissociable group having a specific acetal structure as defined in the specification, which is alkali-insoluble or sparingly alkali-soluble and becomes alkali-soluble when the acid-dissociable group is dissociated; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a crosslinking agent; and (D) an adhesion aid, and a cured film forming method uses the same.05-13-2010
20100119972COATING COMPOSITION - Developable bottom antireflective coating compositions are provided.05-13-2010
20130078572RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition used in a method of forming a resist pattern including applying a resist composition comprising a base component that exhibits increased solubility in an alkali developing solution and a photo-base generator component to a substrate to form a resist film; subjecting the resist film to exposure; baking after subjecting the resist film to exposure, wherein at an exposed portion of the resist film, the base generated from the photo-base generator component upon exposure and an acid provided to the resist film in advance are neutralized, and at an unexposed portion of the resist film, the solubility of the base component in an alkali developing solution is increased by the action of acid provided to the resist film in advance; and subjecting the resist film to alkali development, thereby forming a negative-tone resist pattern.03-28-2013
20100075254OXIME ESTER COMPOUND AND PHOTOPOLYMERIZATION INITIATOR CONTAINING THE SAME - Disclosed is an oxime ester compound represented by the general formula (I). (I) wherein R03-25-2010
20100075253RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING LOW MOLECULAR WEIGHT DISSOLUTION ACCELERATOR - There is provided a resist underlayer film forming composition that is used in a lithography process for the production of semiconductor devices and that can be developed with an alkaline developer for photoresists, and a method of forming a photoresist pattern by using the resist underlayer film forming composition. The resist underlayer film forming composition used in a lithography process for a production of a semiconductor device comprising: an alkali-soluble resin (a); a polynuclear phenol (b); a compound (c) having at least two vinylether groups; and a photoacid generator (d). The alkali-soluble resin (a) may be a polymer containing a unit structure having a carboxyl group, and the polynuclear phenol (b) may be a compound having 2 to 30 phenolic hydroxyl groups in the molecule.03-25-2010
20120244471PHOTORESIST RESIN COMPOSITION AND METHOD OF FORMING PATTERNS BY USING THE SAME - A method for forming a pattern includes forming a photosensitive film by coating a photosensitive resin composition on a substrate, exposing the photosensitive film to light through a mask that includes a light transmission region and a non-light transmission region, coating a developing solution on the photosensitive film, and forming a photosensitive film pattern by baking the photosensitive film, wherein the photosensitive resin composition includes an alkali soluble base resin, a photoacid generator and a photoactive compound.09-27-2012
20130034813CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION FOR ArF IMMERSION LITHOGRAPHY AND PATTERN FORMING PROCESS - A chemically amplified positive resist composition comprising (A) a sulfonium salt of 3,3,3-trifluoro-2-hydroxy-2-trifluoromethylpropionic acid, (B) an acid generator, (C) a base resin, and (D) an organic solvent is suited for ArF immersion lithography. The carboxylic acid sulfonium salt is highly hydrophobic and little leached out in immersion water. By virtue of controlled acid diffusion, a pattern profile with high resolution can be constructed.02-07-2013
20130034814SILANE-BASED COMPOUNDS AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME - The present application relates to a new silane-based compound, a photosensitive resin composition including the same, and a photosensitive material including the same. The photosensitive resin composition including the silane-based compound according to the exemplary embodiment of the present application increases adhesion strength to a substrate, such that a developing property is excellent and there are no surface stains or defects during a subsequent process. Accordingly, a photosensitive material, a color filter and the like having excellent quality may be manufactured by using the photosensitive resin composition according to the exemplary embodiment of the present application.02-07-2013
20130157195CALIXARENE COMPOUND AND PHOTORESIST COMPOSITION COMPRISING SAME - A molecular glass compound includes (A) a tetrameric reaction product of a specific aromatic compound having at least one hydroxy group, and a specific polycyclic or fused polycyclic aromatic aldehyde; and (B) an acid-removable protecting group as an adduct with the hydroxy group of the aromatic compound and/or a hydroxy group of the polycyclic or fused polycyclic aromatic aldehyde. A photoresist composition including the molecular glass compound, and a coated substrate including a layer of the photoresist composition are also disclosed.06-20-2013
20100104980LITHOGRAPHIC PRINTING PLATE PRECURSOR - A lithographic printing plate precursor comprising an image-recording layer, said image-recording layer being photo-polymerizable upon exposure to actinic light and containing a mixture of sensitizers characterized in that said mixture of sensitizers has in 1-methoxy-2-propanol at 80° C. a solubility of at least 30 wt. %. and preferably a MetaStable Zone Width (MSZW) of at least 8.5° C., said MSZW measured at a cooling and heating rate of 0.2° C./minute.04-29-2010
20100104978COMPOSITION FOR ANTIREFLECTION FILM FORMATION AND METHOD OF FORMING RESIST PATTERN WITH THE SAME - A composition for forming an anti-reflection film on a resist film is provided, which is superior in handling characteristics, and is not accompanied by generation of deposits and the like after forming the film. A composition for forming an anti-reflection film to be provided on a resist film is provided, which includes at least a certain fluorochemical surfactant, and a certain water soluble film forming component. The composition for forming an anti-reflection film can be easily handled, has no adverse effect on health or the environment, and also avoids the generation of deposits and the like even after forming an anti-reflection film.04-29-2010
20100040975POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE POSITIVE RESIST COMPOSITION - A positive resist composition comprises: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under action of an acid; and (C) a compound capable of decomposing under action of an acid to generate an acid.02-18-2010
20130084526PHOTO-RESIST AND METHOD OF PHOTOLITHOGRAPHY - A photo-resist and a method for performing photolithography using the photo-resist are described. The photo-resist comprises a matrix resin, a first component and a second component. The first component is configured to produce a chemical amplification action and generates a first chemical substance when exposed to a light of a first wavelength band. The first chemical substance will react with the matrix resin to form a latent image. The second component is configured to generate a second chemical substance when exposed to a light of a second wavelength band. The second chemical substance reacts with the first chemical substance to reduce a mass concentration of the first chemical substance.04-04-2013
20130029267FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR THERMAL DEVELOPMENT, AND PROCESS FOR MAKING A FLEXOGRAPHIC PRINTING PLATE - A flexographic printing plate precursor for thermal development is provided that comprises a relief-forming layer on/above a support; the relief-forming layer comprising (Component A) a polymer having a glass transition temperature (Tg) of at least 25° C., (Component B) a photopolymerization initiator, and (Component C) an ethylenically unsaturated compound having a molecular weight of no greater than 3,000.01-31-2013
20120164575CYCLIC COMPOUND, MANUFACTURING METHOD THEREFOR, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMING A RESIST PATTERN - A cyclic compound represented by formula (1):06-28-2012
20120164574ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM AND PATTERN FORMING METHOD USING THE SAME - Provided is an actinic-ray-sensitive or radiation-sensitive resin composition that is excellent in depth of focus and density distribution dependency, and an actinic-ray-sensitive or radiation-sensitive film and a pattern forming method using the same.06-28-2012
20090233226PHOTOPATTERNABLE DIELECTRIC MATERIALS FOR BEOL APPLICATIONS AND METHODS FOR USE - Compositions, a method, and a photopatternable blend. The compositions include a blend of a first and a second polymer. The first polymer is a substituted silsesquioxane copolymer. The second polymer is a substituted silsesquioxane polymer. The second polymer is configured to undergo chemical crosslinking with the first polymer, the second polymer, or a combination thereof, upon exposure to light, thermal energy, or a combination thereof. The compositions include a photosensitive acid generator. The method includes forming a film. The film is patternwise imaged, and at least one region is exposed to radiation. After the imaging, the film is baked, wherein at least one exposed region is rendered substantially soluble. After the baking, the film is developed, wherein a relief pattern remains. The relief pattern is exposed to radiation. The relief pattern is baked. The relief pattern is cured. A chemically amplified positive-tone photopatternable blend is also described.09-17-2009
20090042128Salt suitable for an acid generator and a chemically amplified positive resist composition containing the same - The present invention provides a salt represented by the formula (I):02-12-2009
20090042127PHOTORESIST COMPOSITION AND METHOD OF FORMING A PHOTORESIST PATTERN USING THE SAME - A photoresist composition comprises about 0.5 to about 20 parts by weight of a photo-acid generator, about 10 to about 70 parts by weight of a novolac resin containing a hydroxyl group, about 1 to about 40 parts by weight of a cross-linker that comprises an alkoxymethylmelamine compound, and about 10 to about 150 parts by weight of a solvent.02-12-2009
20090269700POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition, including a resin component (A) which exhibits increased solubility in an alkali developing solution under action of an acid, and an acid generator component (B) which generates an acid upon exposure, wherein the component (A) includes a structural unit (a1) derived from a hydroxystyrene, and a structural unit (a2) containing an acid dissociable, dissolution inhibiting group; and the component (B) includes an acid generator (B1) composed of a compound represented by the general formula (b1) shown below:10-29-2009
20090269699ON-PRESS DEVELOPABLE ELEMENTS AND METHODS OF USE - A negative-working imageable element has an imageable layer that includes an infrared radiation absorbing dye that upon exposure to thermal irradiation, changes from colorless to a visible color or from one visible color to another visible color, providing a ΔE of at least 5 between the exposed and non-exposed regions of the imageable layer within 3 hours of its exposure to 300 mJ/cm10-29-2009
20090233228POSITIVE PHOTOSENSITIVE RESIN COMPOSITION - The present invention provides a positive photosensitive resin composition, characterized by comprising 1 to 50 parts by mass of a photo-acid generator and 0.01 to 70 parts by mass of a terpene compound in combination with 100 parts by mass of a hydroxypolyamide having repeating units. A terpene compound can be combined with a hydroxypolyamide having a particular structure to provide a positive photosensitive resin composition excellent in positive lithography performance such as sensitivity and resolution.09-17-2009
20090233227NEGATIVE-WORKING IMAGEABLE ELEMENTS WITH IMPROVED ABRASION RESISTANCE - Negative-working imageable elements are prepared with radiation-sensitive imageable layers that contain surface-modified silica particles such as fumed silica particles and sol-gel silica particles, that are present in an amount of from about 1 to about 40 weight %, have an average particle size of from about 1 to about 500 nm, have surface hydroxy groups, and have a carbon content of from about 0.5 to about 15 weight % that is derived from surface hydrophobic groups having 1 to 30 carbon atoms. The presence of the surface-modified silica particles provides improved abrasion resistance, reduced tackiness, and various other desired properties.09-17-2009
20080286687CHEMICALLY AMPLIFIED RESIST MATERIAL, TOPCOAT FILM MATERIAL AND PATTERN FORMATION METHOD USING THE SAME - A resist film made of a chemically amplified resist material including a polymer; a photo-acid generator and carbamoyl oxime is formed on a substrate. Subsequently, pattern exposure is performed by selectively irradiating the resist film with exposing light. After the pattern exposure, the resist film is baked, and the baked resist film is developed, so as to form a resist pattern made of the resist film.11-20-2008
20120115084CROSSLINKING AGENT, NEGATIVE RESIST COMPOSITION, AND PATTERN FORMING METHOD USING THE NEGATIVE RESIST COMPOSITION - Disclosed are a negative resist composition which shows excellent sensitivity and resolution in pattern formation by exposure to electron beams or EUV, a novel crosslinking agent suitable for the resist composition, and a pattern forming method using the resist composition.05-10-2012
20090011364POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART - Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.01-08-2009
20120237874Actinic-Ray- or Radiation-Sensitive Resin Composition, Compound and Method of Forming Pattern Using the Composition - According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes any of the compounds (A) of general formula (I) below that when exposed to actinic rays or radiation, generates an acid and a resin (B) whose rate of dissolution into an alkali developer is increased by the action of an acid. (The characters used in general formula (I) have the meanings mentioned in the description.)09-20-2012
20120270153PHOTORESIST COMPOSITION AND METHOD FOR PRODUCING PHOTORESIST PATTERN - A photoresist composition comprising 10-25-2012
20130017489FLUORINE-FREE FUSED RING HETEROAROMATIC PHOTOACID GENERATORS AND RESIST COMPOSITIONS CONTAINING THE SAME - The present invention relates to a fluorine-free photoacid generator (PAG) and a photoresist composition containing the same. The PAG is characterized by the presence of an onium cationic component and a fluorine-free fused ring heteroaromatic sulfonate anionic component containing one or more electron withdrawing substituents. The onium cationic component of the PAG is preferably a sulfonium or an iodonium cation. The photoresist composition further contains an acid sensitive imaging polymer. The photoresist composition is especially useful for forming material patterns on a semiconductor substrate using 193 nm (ArF) lithography.01-17-2013
20090181321Photoresist Compositions and Methods of Use in High Index Immersion Lithography - The present invention relates to a composition comprising a photoresist polymer and a fluoropolymer. In one embodiment, the fluoropolymer comprises a first monomer having a pendant group selected from alicyclic bis-hexafluoroisopropanol and aryl bis-hexafluoroisopropanol and preferably a second monomer selected from fluorinated styrene and fluorinated vinyl ether. The invention composition has improved receding contact angles with high refractive index hydrocarbon fluids used in immersion lithography and, thereby, provides improved performance in immersion lithography.07-16-2009
20080241745NEGATIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A negative resist composition, includes: (A) an alkali-soluble polymer containing a specific repeating unit as defined in the specification; (B) a crosslinking agent capable of crosslinking with the alkali soluble polymer (A) under an action of an acid; (C) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (D) a specific quaternary ammonium salt as defined in the specification; and (E) an organic carboxylic acid, and a pattern forming method uses the composition.10-02-2008
20090186299Methods for imaging and processing negative-working imageable elements - An imaged and developed element, such as a lithographic printing plate, is provided by infrared radiation imaging of a negative-working imageable element having a free radically polymerizable component, a free radical initiator composition, an infrared radiation absorbing compound, and adhesion promoter that is an organic compound having an ethylenically unsaturated carbon-carbon double bond that is connected to an alkoxysilyl or hydroxysilyl group. The use of the adhesion promoter provides increased printing durability for the imaged and developed element, especially those having sulfuric acid-anodized aluminum substrates.07-23-2009
20080220370POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition, includes: (A) a resin having a repeating unit represented by formula (A) as defined in the specification, which decomposes under an action of an acid to increase a solubility of the resin (A) in an alkali developer; and a pattern forming method uses the composition.09-11-2008
20130022916RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), and an acid generator represented by the formula (II),01-24-2013
20130022926RADIATION-SENSITIVE RESIN COMPOSITION - A radiation-sensitive resin composition includes a polymer and a photoacid generator. The polymer includes a first structural unit shown by a formula (a1), a second structural unit shown by a formula (a2), and a third structural unit having a lactone structure. A content of the first structural unit in the polymer being 50 mol % or more based on total structural units included in the polymer. The first structural unit is preferably a structural unit shown by a formula (a1-1).01-24-2013
20130022925RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), and an acid generator,01-24-2013
20110300484SULFONIUM DERIVATIVES AND THE USE THEROF AS LATENT ACIDS - Compounds of the formula (I), wherein Ar12-08-2011
20110287364LITHOGRAPHIC PRINTING PLATE PRECURSOR - A lithographic printing plate precursor comprising a coating provided on a support having a hydrophilic surface, the coating containing thermoplastic polymer particles and an IR-dye characterized in that the IR-dye contains a structural element according to Formula I11-24-2011
20090047599NEGATIVE-WORKING IMAGEABLE ELEMENTS AND METHODS OF USE - A negative-working imageable element has an imageable layer that includes an initiator composition including an iodonium cation and a boron-containing anion at a molar ratio of at least 1.2:1, an infrared radiation absorbing compound, a primary polymeric binder, and a spirolactone or spirolactam colorant precursor. The imaged element exhibits improved print-out.02-19-2009
20100221662HEAT-SENSITIVE IMAGING ELEMENT - A heat-sensitive imaging element includes an IR dye having a structure according to Formula I,09-02-2010
20090098482METHODS FOR IMAGING AND PROCESSING NEGATIVE-WORKING IMAGEABLE ELEMENTS - An imaged and developed element, such as a lithographic printing plate, is provided by infrared radiation imaging of a negative-working imageable element having an outermost imageable layer that includes a free radically polymerizable component, a free radical initiator composition comprising a diaryliodonium borate, and an infrared radiation absorbing compound. The imageable layer also includes a polymeric binder that is represented by the following Structure (I):04-16-2009
20090081585FUNCTIONALIZED CARBOSILANE POLYMERS AND PHOTORESIST COMPOSITIONS CONTAINING THE SAME - Linear or branched functionalized polycarbosilanes having an absorbance less than 3.0 μm03-26-2009
20080311514SILSESQUIOXANE COMPOUND MIXTURE, HYDROLYZABLE SILANE COMPOUND, MAKING METHODS, RESIST COMPOSITION, PATTERNING PROCESS, AND SUBSTRATE PROCESSING - In a mixture of silsesquioxane compounds comprising silsesquioxane units having a side chain including a direct bond between a silicon atom and a norbornane skeleton and having a degree of condensation of substantially 100%, a dimethylene chain of the norbornane skeleton remote from the silicon bonded side is substituted with at least one substituent group other than hydrogen, and an isomer having a bulkier substituent group on the dimethylene chain at an exo position is present in a higher proportion.12-18-2008
20090142697PHOTOSENSITIVE RESIN, AND PHOTOSENSITIVE COMPOSITION - To provide a photosensitive resin which realizes formation of a pattern having a good shape, without involving a problem in terms of poor compatibility between an acid generator and a photoresist primary-component polymer having an acid dissociable group, and a photosensitive composition containing the photosensitive resin.06-04-2009
20090087782PHOTOACTIVE COMPOUNDS - The present application relates to a compound of formula A-X—B, where (i) A-X—B form an ionic compound Ai Xi Bi where Ai and Bi are each individually an organic onium cation; and Xi is anion of the formula Q-R04-02-2009
20090087781IMAGE-FORMING METHOD AND LITHOGRAPHIC PRINTING PLATE PRECURSOR - An image-forming method includes: exposing a negative type image-forming material including a support and an image-recording layer containing a binder polymer containing at least one group capable of being converted to a sulfonate upon a reaction with an aqueous solution containing at least one of a sulfite and a bisulfite, a sensitizing dye, a polymerization initiator, and a compound having an ethylenically unsubstituted bond; and removing an unexposed area of the image-recording layer with an aqueous solution containing at least one of a sulfite and a bisulfite.04-02-2009
20100086873POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including: a base component (A) which includes a polymeric compound (A1) containing a structural unit (a0) represented by the general formula (a0-1) and a structural unit (a1) derived from an acrylate ester having an acid dissociable, dissolution inhibiting group; and an acid generator component (B) which includes an acid generator (B1) containing an anion moiety represented by the general formula (I):04-08-2010
20120107743LITHOGRAPHY USING PHOTORESIST WITH PHOTOINITIATOR AND PHOTOINHIBITOR - Technologies are generally described for a photoresist and methods and systems effective to form a pattern in a photoresist on a substrate. In some examples, the photoresist includes a resin, a photoinitiator and a photoinhibitor. The photoinitiator may be effective to generate a first reactant upon the absorption of at least one photon of a particular wavelength of light. The first reactant may be effective to render the resin soluble or insoluble in a photoresist developer. The photoinhibitor may be effective to generate a second reactant upon the absorption of at least one photon of the particular wavelength of light. The second reactant may be effective to inhibit the first reactant.05-03-2012
20090263745POLYIMIDE PRECURSOR, RESIN COMPOSITION COMPRISING THE POLYIMIDE PRECURSOR, PATTERN FORMING METHOD USING THE RESIN COMPOSITION, AND ARTICLES PRODUCED BY USING THE RESIN COMPOSITION - It is a main object of the present invention to provide a polyimide precursor and a polyimide precursor resin composition, which precursor being easy to synthesize, available at low cost, excellent in storage and capable of giving polyimide that is low in impurities after imidization, irrespective of the chemical structure of the finally-obtained polyimide.10-22-2009
20090263744ETHYLENICALLY UNSATURATED COMPOUND, LIGHT SENSITIVE COMPOSITION, LIGHT SENSITIVE PLANOGRAPHIC PRINTING PLATE MATERIAL AND PRINTING PROCESS EMPLOYING THE SAME - The present invention provides a novel ethylenically unsaturated compound which is highly sensitive to scanning exposure due to an ultraviolet to near-infrared laser and is cured to give good physical properties; a light sensitive composition providing good developability and high sensitivity and forming a high strength layer; a planographic printing plate material having advantages that good developability, high sensitivity and high strength layer are obtained, particularly a planographic printing plate material requiring no developing machine which are mounted on a printing press without any development, followed by printing and which provides excellent developability on a printing press and printing durability; and a printing process. The ethylenically unsaturated compound has in the molecule a photo-oxidation group and a polymerizable ethylenically unsaturated bond, and has a predetermined solubility in water or an aqueous alkali solution. The planographic printing plate material is characterized in that it comprises a support and provided thereon, a light sensitive layer containing the ethylenically unsaturated compound, a polyhalogen compound as a photopolymerization initiator, a water-soluble polymer binder as a polymer binder and an infrared absorbing agent.10-22-2009
20110200940SALT AND PHOTORESIST COMPOSITION COMPRISING THE SAME - The present invention provides a salt represented by the formula (I):08-18-2011
20080206674Dual-Layer Heat-Sensitive Imageable Elements with a Polyvinyl Acetal Top Layer - Thermally imagable elements are described comprising on a substrate with hydrophilic surface (a) a first layer comprising a first polymer soluble or swellable in aqueous alkaline developer and insoluble in organic solvents with low polarity and (b) a second layer comprising a second polymer soluble or swellable in aqueous alkaline developer, wherein the first polymer is different from the second polymer and the second polymer comprises vinyl acetal repeating units and pendant acidic groups selected from COOH, —SO08-28-2008
20080206676THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION - An etch resistant thermally curable Underlayer composition for use in a multiplayer lithographic process for producing a photolithographic bilayer coated substrate, the composition being a composition of: 08-28-2008
20120295201COMPOUND, RESIN, PHOTORESIST COMPOSITION, AND METHOD FOR PRODUCING PHOTORESIST PATTERN - A compound represented by formula (I):11-22-2012
20080241744CURABLE COMPOSITION AND PLANOGRAPHIC PRINTING PLATE PRECURSOR - The present invention provides a curable composition containing at least one species selected from polymerizable monomers represented by the following formulas (I) to (III) and a polymerization initiator, and a planographic printing plate precursor including the same. The curable composition can be cured with high sensitivity due to laser light exposure or the like, and the inhibition of polymerization due to oxygen is controlled. The composition has excellent solubility in a developer or a solvent.10-02-2008
20080241743POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition, includes: (B) a resin containing a repeating unit represented by formula (Ia) or (Ib) as defined in the specification, which decomposes under an action of an acid to increase a solubility of the resin (B) in an aqueous alkali solution; and (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation, and a pattern forming method uses the composition.10-02-2008
20080292987Antireflective Coating Composition Comprising Fused Aromatic Rings - The present invention relates to an organic spin coatable antireflective coating composition comprising a polymer comprising at least one unit with 3 or more fused aromatic rings in the backbone of the polymer and at least one unit with an aliphatic moeity in the backbone of the polymer. The invention further relates to a process for imaging the present composition.11-27-2008
20080311513PHOTOSENSITIVE METAL NANOPARTICLE AND METHOD OF FORMING CONDUCTIVE PATTERN USING THE SAME - A photosensitive metal nanoparticle and a method of forming a conductive pattern using the same, wherein a self-assembled monolayer of a thiol compound or isocyanide compound having a terminal reactive group is formed on a surface of the metal nanoparticle and a photosensitive group is introduced to the terminal reactive group. The photosensitive metal nanoparticles can easily form a conductive film or pattern having excellent conductivity upon exposure to UV, and thus can be applied for antistatic washable sticky mats or shoes, conductive polyurethane printer rollers, electromagnetic interference shielding, etc.12-18-2008
20080305431PRETREATMENT COMPOSITIONS - A pretreatment composition of: 12-11-2008
20090311626RADIATION-SENSITIVE COMPOSITIONS AND ELEMENTS WITH SOLVENT RESISTANT POLY(VINYL ACETAL)S - A radiation-sensitive composition can be used to prepare positive-working imageable elements having improved solvent resistance and is useful for making lithographic printing plates. The composition includes an alkaline soluble polymeric binder that is a specific poly(vinyl acetal) that exhibits improved resistance to press chemicals, and a radiation absorbing compound.12-17-2009
20080206675PLANOGRAPHIC PRINTING PLATE PRECURSOR - A planographic printing plate precursor including: a support; a hydrophilic layer including a hydrophilic polymer chemically bonded to a surface of the support, where the hydrophilic polymer has a positively-charged substituent and at least one reactive group selected from the group consisting of a reactive group capable of directly chemically bonding to a surface of the support and a reactive group capable of chemically bonding to a surface of the support via a crosslinked structure; and an image forming layer, wherein the hydrophilic layer and the image forming layer are provided in that order on the support.08-28-2008
20080206677Planographic printing plate material - An objective is to provide a planographic printing plate material capable of being exposed to infrared laser, which exhibits excellent printing durability and storage property (specifically at high humidity). Also disclosed is a planographic printing plate material comprising a hydrophilic support and provided thereon, a lower layer and an upper layer each possessing an alkali soluble resin, wherein the upper layer possesses a compound represented by Formula 1:08-28-2008
20080248423Chemically amplified resist composition - A chemically amplified resist composition comprising:10-09-2008
20080268375Positive Resist Composition and Method for Resist Pattern Formation - A positive-working resist composition of a wide level of DOF and a method for resist pattern formation are provided. This composition is a positive-working resist composition comprising a resin component (A) which, upon action by an acid, increases alkali solubility and an acid generating agent component (B) which produces an acid upon exposure. The component (A) is a copolymer comprising n (n=an integer of 4 to 6) types of constitutional units different from each other in structure, and the proportion of each constitutional unit in the copolymer is more than 0% by mole and not more than 100/(n−1)% by mole.10-30-2008
20130022923RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), and an acid generator represented by the formula (II),01-24-2013
20130022924RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), and an acid generator,01-24-2013
20090023096POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD - A positive resist composition, includes: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under an action of an acid, the resin containing 80 mol % or more of an aromatic group-free copolymerization component; and (C) a compound capable of decomposing under an action of an acid to generate an acid, wherein an absolute value of difference in pKa between the acid generated from the component (A) and the acid generated from the component (C) is 2 or less, and an absolute value of difference in molecular weight between the acid generated from the component (A) and the acid generated from the component (C) is 50 or less.01-22-2009
20090181320FLUORINE-FREE HETEROAROMATIC PHOTOACID GENERATORS AND PHOTORESIST COMPOSITIONS CONTAINING THE SAME - Fluorine-free photoacid generators and photoresist compositions containing fluorine-free photoacid generators are enabled as alternatives to PFOS/PFAS photoacid generator-containing photoresists. The photoacid generators are characterized by the presence of a fluorine-free heteroaromatic sulfonate anionic component. The photoacid generators preferably contain an onium cationic component, more preferably a sulfonium cationic component. The photoresist compositions preferably contain an acid sensitive imaging polymer. The compositions are especially useful for forming material patterns using 193 nm (ArF) imaging radiation.07-16-2009
20090181322Photoresist Compositions and Methods of Use in High Index Immersion Lithography - The present invention relates to a composition comprising a photoresist polymer and a fluoropolymer. In one embodiment, the fluoropolymer comprises a first monomer having a pendant group selected from alicyclic bis-hexafluoroisopropanol and aryl bis-hexafluoroisopropanol and preferably a second monomer selected from fluorinated styrene and fluorinated vinyl ether. The invention composition has improved receding contact angles with high refractive index hydrocarbon fluids used in immersion lithography and, thereby, provides improved performance in immersion lithography.07-16-2009
20090181319AROMATIC FLUORINE-FREE PHOTOACID GENERATORS AND PHOTORESIST COMPOSITIONS CONTAINING THE SAME - Fluorine-free photoacid generators and photoresist compositions containing fluorine-free photoacid generators are enabled as alternatives to PFOS/PFAS photoacid generator-containing photoresists. The photoacid generators are characterized by the presence of a fluorine-free aromatic sulfonate anionic component having one or more electron withdrawing groups. The photoacid generators preferably contain a fluorine-free onium cationic component, more preferably a sulfonium cationic component. The photoresist compositions preferably contain an acid sensitive imaging polymer having a lactone functionality. The compositions are especially useful for forming material patterns using 193 nm (ArF) imaging radiation.07-16-2009
20090162783RADIATION-SENSITIVE ELEMENTS WITH DEVELOPABILITY-ENHANCING COMPOUNDS - Positive-working imageable elements can be imaged and developed to prepare imaged elements such as lithographic printing plates. The imageable elements including an imageable layer that has one or more alkaline soluble polymeric binders and a developability-enhancing compound that is represented by Structure (DEC) or (DEC06-25-2009
20120070781BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME - An object of the present invention is to provide a base generator which has sensitivity and is applicable to a wide range of applications, and a photosensitive resin composition which is applicable to a wide range of applications due to the structure of a polymer precursor in which reaction into a final product is promoted by a basic substance or by heating in the presence of a basic substance. The base generator generates a base by exposure to electromagnetic radiation and heating. The photosensitive resin composition comprises a polymer precursor in which reaction into a final product is promoted by the base generator and a basic substance or by heating in the presence of a basic substance.03-22-2012
20120094233ON-PRESS DEVELOPABLE LITHOGRAPHIC PRINTING PLATE PRECURSORS - On-press developable, negative-working, infrared radiation-sensitive lithographic printing plate precursors have an imageable layer on a substrate. The imageable layer includes a free radically polymerizable component, an initiator composition capable of generating free radicals upon exposure to infrared radiation, a polymeric binder, a first infrared radiation absorbing compound that has a tetraaryl pentadiene chromophore, and a second infrared radiation absorbing compound that is different than the first infrared radiation absorbing compound. The first IR absorbing compound absorbs in both the IR and visible regions of the electromagnetic spectrum and provides coloration for visual inspection of the lithographic printing plates.04-19-2012
20100183980ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - An actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (B) a resin capable of increasing a dissolution rate of the resin (B) in an alkali developer by an action of an acid, the resin (B) containing a specific repeating unit having a lactone structure; and (D) a low molecular compound having a group capable of leaving by an action of an acid, and a pattern forming method uses the composition.07-22-2010
20110129778OXIME ESTER COMPOUND AND PHOTOPOLYMERIZATION INITIATOR CONTAINING THE SAME - The invention provides a novel compound useful as a highly-sensitive photopolymerization initiator that has excellent stability, low sublimability, excellent developability, and high transmittance in the visible region and that efficiently absorbs, and is activated by, near-ultraviolet rays such as at 365 nm. Also provided are a photopolymerization initiator and a photosensitive composition using the above-described compound. Specifically, the invention provides an oxime ester compound represented by the following general formula (I), a photopolymerization initiator containing the same, and a photosensitive composition containing the photopolymerization initiator and a polymerizable compound having an ethylenically unsaturated bond:06-02-2011
20080213697UNDERLAYER COMPOSITIONS CONTAINING HETEROCYCLIC AROMATIC STRUCTURES - A composition suitable for use as a planarizing underlayer in a multilayer lithographic process is disclosed. The inventive composition comprises a polymer containing heterocyclic aromatic moieties. In another aspect, the composition further comprises an acid generator. In yet another aspect, the composition further comprises a crosslinker. The inventive compositions provide planarizing underlayers having outstanding optical, mechanical and etch selectivity properties. The present invention also encompasses lithographic structures containing the underlayers prepared from the compositions of the present invention, methods of making such lithographic structures, and methods of using such lithographic structures to pattern underlying material layers on a substrate.09-04-2008
20100239980NEGATIVE-WORKING RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - The object of the present invention is to provide a negative-working resist composition that forms a well-shaped pattern with no decrease in resolution at high sensitivity, and a pattern forming method using the negative-working resist composition.09-23-2010
20120141937Photosensitive Composition and Photoresist - A photosensitive composition and a photoresist are provided. The photoresist is formed by compounding a photosensitive composition. The photosensitive composition comprises a binder agent, a photomonomer and a photoinitiator. The binder agent is formed by polymerizing a binder composition. The binder composition comprises a lactic oligomer. The photomonomer has an amount of about 25-95 parts by weight relative to 100 parts by weight of a solid content of the binder agent. The photo initiator has an amount of about 0.5-15 parts by weight relative to 100 parts by weight of the solid content of the binder agent.06-07-2012
20090075200Negative-working photosensitive resin composition and photosensitive resin plate using the same - A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula:03-19-2009
20100221663LIGHT SENSITIVE PLANOGRAPHIC PRINTING PLATE MATERIAL, AND IMAGE FORMATION METHOD EMPLOYING THE SAME - The present invention provides a light sensitive planographic printing plate material which excels in printing durability and tone reproduction property in high resolution printing as in FM screening, and an image formation method employing the light sensitive planographic printing plate material. The light sensitive planographic printing plate material is characterized in that a light sensitive layer containing a light sensitive composition containing an addition polymerizable ethylenic double bond-containing compound, a bisimidazole compound as a photopolymerization initiator, a polymer binder and a photosensitizing dye is provided on a support obtained by subjecting one surface of an aluminum plate to (1) chemically etching treatment in an aqueous alkali solution, (2) electrochemically roughening treatment in an aqueous nitric acid solution, (3) chemically etching treatment in an aqueous alkali solution, (4) electrochemically roughening treatment in an aqueous hydrochloric acid solution, (5) chemically etching treatment in an aqueous alkali solution, and (6) anodizing treatment.09-02-2010
20090208868Positive photosensitive resin composition and method for forming pattern - A positive photosensitive resin composition containing 100 parts by weight of a polyimide precursor (A) having a constituent unit represented by the formula (1), 15 to 25 parts by weight of a crosslinking agent (B) represented by the formula (2), and 2 to 5 parts by weight of a photosensitizer (C) generating acid upon irradiation of an actinic ray:08-20-2009
20090004598Resist Composition And Method For Forming Resist Pattern - A resist composition is obtained by dissolving a resin component (A) that exhibits changed alkali solubility under the action of acid, an oxime sulfonate-based acid generator (B), an amine compound (D) containing at least one alkyl group of 5 to 12 carbon atoms, and an organic acid (E), in an organic solvent (C) containing methyl n-amyl ketone, wherein the component (E) is a dibasic acid.01-01-2009
20110111344PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound having an ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a polymerization inhibitor, wherein the content of the (D) polymerization inhibitor is 20-100 ppm by mass based on the total solid content of the composition.05-12-2011
20130130176ALKALI-SOLUBLE RESIN AND NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME - An alkali-soluble resin is provided. The alkali-soluble resin is prepared using a polyfunctional thiol compound as a chain transfer agent. The alkali-soluble resin has a lower viscosity than a resin having the same molecular weight. Further provided is a negative-type photosensitive resin composition comprising the alkali-soluble resin as a binder resin. The use of the alkali-soluble resin lowers the overall viscosity of the photosensitive resin composition to effectively reduce the height of a stepped portion of a photoresist pattern using a small amount of the photosensitive resin composition.05-23-2013
20090035696PHOTORESIST COMPOSITION - Disclosed are a photoresist composition characterized by containing a polymer (A) containing a carboxyl group or a hydroxyl group, a polyfunctional alkenyl ether (B) represented by the general formula (I) below, and a photoacid generator (C) and the like. (In the formula, R02-05-2009
20100015552RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR - A resist composition including: a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid; and an acid-generator component (B) which generates acid upon exposure, wherein said acid-generator component (B) comprises an acid generator (B1) including a compound represented by general formula (b1-11) shown below:01-21-2010
20100227273POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS - A positive resist composition comprising as a base resin a polymer having carboxyl groups whose hydrogen is substituted by an acid labile group of acenaphthene structure exhibits a high contrast of alkaline dissolution rate before and after exposure, a high resolution, a good pattern profile and minimal LER after exposure, a significant effect of suppressing acid diffusion rate, and improved etching resistance.09-09-2010
20100015553POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A positive resist composition including a resin component (A) having a structural unit (a0) represented by general formula (a0-1) (R represents a hydrogen atom, a C01-21-2010
20100047713CURABLE COMPOSITION CONTAINING HYDROXYTHIOL COMPOUND, AND CURED PRODUCTS THEREOF - Curable compositions have high sensitivity and excellent developability, and further have good storage properties as required. The compositions include a hydroxythiol compound represented by Formula (1) below and a compound with an ethylenically unsaturated double bond:02-25-2010
20100055612Nagative-working photosensitive resin composition and photosensitive resin plate using the same - A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula:03-04-2010
20110177454RESIST MATERIAL AND PATTERN FORMATION METHOD USING THE RESIST MATERIAL - First, a resist film is formed on a substrate from a resist material including cyclic oligomer which does not contain any acid-labile group, is soluble in alkali, and is a trimer or a higher multimer; a molecular compound containing an acid-labile group; a photoacid generator; and no polymer. Then, pattern exposure is performed by selectively irradiating the formed resist film with exposure light of extreme ultraviolet. The resist film after the pattern exposure is heated, and then, the heated resist film is developed to form a resist pattern from the resist film.07-21-2011
20090214981PHOTORESISTS AND METHODS FOR OPTICAL PROXIMITY CORRECTION - Photolithography compositions and methods. A first layer of a first photoresist is formed on a substrate. A second layer of a second photoresist is formed directly onto the first layer. The second polymer of the second photoresist includes an absorbing moiety. The second layer is patternwise imaged and developed, resulting in removal of base-soluble regions. A relief pattern from the second layer remains. The relief pattern and the first layer are exposed to a second dose of the radiation. The polymer in the relief pattern absorbs a portion of the second dose. A fraction of the second dose passes through the at least one region of the relief pattern and exposes at least one region of the first layer. The relief pattern and base-soluble regions of the first layer are removed. A relief pattern from the first layer remains. A second photolithography method and a photoresist composition are also included.08-27-2009
20110097669PHOTOCURABLE COMPOSITION - The present invention provides a photocurable composition which contains a photobase generator capable of generating a satisfactory amount of a base in a high quantum yield when irradiated even with a small quantity of light for a short time, and contains a curable compound that is rapidly cured by the generated base such that the composition is cured into a cured product. The photocurable composition comprises: a photobase generator (A) which is a salt of a carboxylic acid (a1-1) represented by the following formula (1-1) with a basic compound (a2), and a curable compound (B) which has, in one molecule thereof, at least two functional groups selected from among epoxy group, (meth)acryloyl group, isocyanato group, acid anhydride group, and alkoxysilyl group,04-28-2011
20110076618LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PLATE MAKING METHOD THEREOF - A lithographic printing plate precursor includes an aluminum support subjected to a surface roughening treatment, and an image-recording layer, the image-recording layer contains an infrared absorbing agent, a radical polymerization initiator, a radical polymerizable compound and an inorganic particle which has, on a surface of the inorganic particle, an acrylic polymer as a graft chain and an unexposed area of the image-recording layer is capable of being removed with at least one of oily ink and dampening water.03-31-2011
20110076617PHOTORESIST COMPOSITION - The present invention provides a photoresist composition comprising a resin having an acid-labile group and being insoluble or poorly soluble in an aqueous alkali solution but becoming soluble in an aqueous alkali solution by the action of an acid, an acid generator and a compound represented by the formula (I):03-31-2011
20110065046Photosensitive resin compositions and photosensitive dry films using the same - It is disclosed a photosensitive resin composition comprising (a) a binder polymer based on a copolymer containing benzyl (meth)acrylate as a building block, (b) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule and (c) a photopolymerization initiator based on a hexarylbisimidazole compound, with a light-initiated color former being optionally contained as component (d). The composition has long-term keeping quality, exhibits particularly high resistance to plating and dry etching, as well as assuring improvement in resolution and adhesion; the composition may be used to form a photosensitive dry film.03-17-2011
20110065047PHOTORESIST COMPOSITION - The present invention provides a photoresist composition comprising a resin, an acid generator and a compound represented by the formula (I):03-17-2011
20090023095NOVEL COMPOUND, MANUFACTURING METHOD THEREOF, ACID GENERATOR, RESIST COMPOSITION AND METHOD OF FORMING A RESIST PATTERN - There are provided a novel compound represented by a general formula (b1-1) shown below, which is useful as an acid generator for a resist composition and a manufacturing method thereof, a compound useful as a precursor of the novel compound and a manufacturing method thereof, an acid generator, a resist composition and a method of forming a resist pattern.01-22-2009
20090004599RADIATION-SENSITIVE COMPOSITIONS AND ELEMENTS WITH SOLVENT RESISTANT POLY(VINYL ACETAL)S - A radiation-sensitive composition can be used to prepare positive-working imageable elements having improved solvent resistance and is useful for making lithographic printing plates. The composition includes an alkaline soluble polymeric binder that is a specific poly(vinyl acetal) that exhibits improved resistance to press chemicals, and a radiation absorbing compound.01-01-2009
20080248422RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR - A resist composition including a base component (A) and an acid-generator component (B), the acid-generator component (B) including an acid generator (B1) including a compound represented by general formula (b1-8) shown below (wherein R10-09-2008
20080248419POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - A positive resist composition, includes: (A) a resin that has a group having absorption at 248 nm at a main chain terminal of the resin (A), and a pattern forming method uses the composition.10-09-2008
20090317745POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - Provided are a novel positive resist composition that includes a low molecular weight material as a base material component, and a method of forming a resist pattern using the positive resist composition.12-24-2009
20080292988RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - This resist composition according to the present invention includes a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid, and an acid generator component (B) which generates an acid upon exposure, wherein the acid generator component (B) includes an acid generator (B1) represented by a general formula (b1-6-1) shown below and an acid generator (B2) represented by a general formula (b1-6-2) shown below:11-27-2008
20080213696Negative Working, Heat-Sensitive, Lithographic Printing Plate Precursor - A heat-sensitive negative-working lithographic printing plate precursor includes on a grained and anodized aluminum support a coating including hydrophobic thermoplastic polymer particles, a hydrophilic binder, and an organic compound, wherein the organic compound includes at least one phosphonic acid group or at least one phosphoric acid group or a salt thereof.09-04-2008
20080213695Chemically amplified resist composition - The present invention provides a chemically amplified resist composition comprising: (A) a salt represented by (I):09-04-2008
20080254384PHOTOSENSITIVE COMPOSITION, LITHOGRAPHIC PRINTING PLATE PRECURSOR, LITHOGRAPHIC PRINTING METHOD, AND NOVEL CYANINE DYES - A photosensitive composition includes a cyanine dye that has, on a methine chain thereof, a substituent which is a cation moiety of an onium salt structure.10-16-2008
20110027717PHOTORESIST COMPOSITION - A photoresist composition contains a polyol compound and a vinyl ether compound, which polyol compound having an aliphatic group and an aromatic group bound alternately, and which aromatic group has an aromatic ring and two or more hydroxyl groups on the aromatic ring. The polyol compound can be prepared, for example, through an acid-catalyzed reaction, such as a Friedel-Crafts reaction, between an aliphatic polyol and an aromatic polyol. The aliphatic polyol is preferably an alicyclic polyol, whereas the aromatic polyol is preferably hydroquinone.02-03-2011
20120122032SALT AND PHOTORESIST COMPOSITION COMPRISING THE SAME - The present invention provides a salt represented by the formula (I):05-17-2012
20100167206PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A DISPLAY SUBSTRATE USING THE PHOTORESIST COMPOSITION - A photoresist composition includes a novolac resin, a benzophenone photosensitizer and an ethylidyne tris phenol photosensitizer, and an organic solvent. Thus, a micropattern having a higher resolution than the resolution of an exposure apparatus is formed to decrease an amount of exposure and/or exposure time, thereby improving manufacturing reliability and productivity.07-01-2010
20120208126NOVEL CYANINE DYES AND LITHOGRAPHIC PRINTING PLATE PRECURSORS COMPRISING SUCH DYES - A lithographic printing plate precursor includes a cyanine dye, characterized in that the cyanine dye includes two different chromophoric groups, a chromophoric group that has its main absorption in the infrared region and another chromophoric group that has its main absorption in the visible light region. The cyanine dye has preferably a structure according to Formula I:08-16-2012
20090197201FLUOROSURFACTANTS - The present invention relates to the use of end groups Y, where Y stands for (formula I), where Rf stands for CF08-06-2009
20090176174MULTIPLE EXPOSURE PHOTOLITHOGRAPHY METHODS AND PHOTORESIST COMPOSTIONS - A method and a composition. The composition includes a polymer and a photosensitive acid generator capable of generating a first amount of acid upon exposure to a first dose of radiation and a second amount of acid upon exposure to a second dose of radiation. The second amount of acid is greater than said first amount of acid. The second dose is greater than the first dose. The composition includes a photosensitive base generator capable of generating a first amount of base upon exposure to the first dose and a second amount of base upon exposure to the second dose, where the first amount of base is greater than the first amount of acid and the second amount of base is less than the second amount of acid. A method for exposing to radiation a film of a photoresist on a substrate is included.07-09-2009
20090176175PHOTOACID GENERATORS FOR EXTREME ULTRAVIOLET LITHOGRAPHY - A photoacid generator P07-09-2009
20100028805POSITIVE PHOTOSENSITIVE RESIN COMPOSITION - It is an object of the present invention to provide a positive photosensitive resin composition capable of easily forming an image having high water repellency and high oil repellency on a surface of a cured film thereof even after a treatment with oxygen plasma or the like, and also having an insulating property with high precision and high throughput; and a cured film suitable for a film material of various displays obtained using the positive photosensitive resin composition.02-04-2010
20100021846NEGATIVE WORKING, HEAT-SENSITIVE LITHOGRAPHIC PRINTING PLATE PRECURSOR - A heat-sensitive negative-working lithographic printing plate precursor comprising: 01-28-2010
20100021845NEGATIVE WORKING, HEAT-SENSITIVE LITHOGRAPHIC PRINTING PLATE PRECURSOR - A heat-sensitive negative-working lithographic printing plate precursor comprising: 01-28-2010
20130011789FLUORINE-FREE FUSED RING HETEROAROMATIC PHOTOACID GENERATORS AND RESIST COMPOSITIONS CONTAINING THE SAME - The present invention relates to a fluorine-free photoacid generator (PAG) and a photoresist composition containing the same. The PAG is characterized by the presence of an onium cationic component and a fluorine-free fused ring heteroaromatic sulfonate anionic component containing one or more electron withdrawing substituents. The onium cationic component of the PAG is preferably a sulfonium or an iodonium cation. The photoresist composition further contains an acid sensitive imaging polymer. The photoresist composition is especially useful for forming material patterns on a semiconductor substrate using 193 nm (ArF) lithography.01-10-2013
20120156615CYCLIC COMPOUND, PROCESS FOR PRODUCTION OF THE CYCLIC COMPOUND, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMATION OF RESIST PATTERN - A cyclic compound represented by formula (1):06-21-2012
20110318689LIGHT-SENSITIVE LITHOGRAPHIC PRINTING PLATE MATERIAL - An object of the present invention is to provide a light-sensitive lithographic printing plate material having high sensitivity, generating no background stain even when development is carried out by using a neutral developing solution having a pH of less than 9, or an alkali developing solution having a pH in the range of 9 to 12, generating no background stain even when the plate is allowed to stand after developing treatment or during printing for a long period of time, and having excellent in printing endurance and ink transfer property,12-29-2011
20120231392SALT, RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A salt represented by the formula (I) and a resist composition containing the salt are provided,09-13-2012
20090023094PHOTOSENSITIVE LAMINATED ORIGINAL PRINTING PLATE FOR LETTERPRESS PRINTING AND PROCESS FOR PRODUCING LETTERPRESS PRINTING PLATE USING THE PHOTOSENSITIVE LAMINATED ORIGINAL PRINTING PLATE - A photosensitive laminated original printing plate for letterpress printing that does not contaminate developers, being capable of suppressing a cost increase due to developer replacement and is of high quality; and a process for producing a letterpress printing plate using the photosensitive laminated original printing plate for letterpress printing. There is provided a photosensitive laminated original printing plate for letterpress printing, comprising a support and, at least sequentially superimposed thereon, a photosensitive resin layer which is sensitive to ultraviolet radiation and is developable with water or a mixture of water and alcohol and a mask material layer which contains at least a nonultraviolet-absorbing organic dye and ultraviolet-absorbing organic dye and a binder soluble or dispersible in water or a mixture of water and alcohol and is removable by means of water or a mixture of water and alcohol, wherein the nonultraviolet-absorbing and ultraviolet-absorbing materials are of compositions having compatibility with the binder.01-22-2009
20120208125RESIST COMPOSITION AND PATTERNING PROCESS - A resist composition comprising a complex of a β-diketone with a metal selected from magnesium, chromium, manganese, iron, cobalt, nickel, copper, zinc, silver, cadmium, indium, tin, antimony, cesium, zirconium, and hafnium, and a solvent is improved in film uniformity when coated, and exhibits a high resolution, high sensitivity, and minimal LER when processed by the EB or EUV lithography.08-16-2012
20120009521RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR - A resist composition including: a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid; and an acid-generator component (B) which generates acid upon exposure, wherein said acid-generator component (B) comprises an acid generator (B1) including a compound represented by general formula (b1-11) shown below: 01-12-2012
20100104979ALPHA-HYDROXYKETONES - Compounds of the Formula (I) wherein x is an integer from 1-4; p is an integer from 1-3; q is an integer from 0-3; Ar is phenyl, naphthyl, anthryl or phenanthryl each of which optionally is substituted by one or more Cl, CN, OR04-29-2010
20110165518 LITHOGRAPHIC PRINTING PLATE PRECURSOR - A lithographic printing plate precursor includes a coating provided on a support having a hydrophilic surface, the coating containing thermoplastic polymer particles and an infrared radiation absorbing dye characterized in that the dye contains a substituent selected from bromo and iodo.07-07-2011
20120070782SELF-FORMING TOP ANTI-REFLECTIVE COATING COMPOSITIONS AND, PHOTORESIST MIXTURES AND METHOD OF IMAGING USING SAME - A composition of matter. The composition of matter includes a polymer having an ethylenic backbone and comprising a first monomer having an aromatic moiety, a second monomer having a base soluble moiety or an acid labile protected base soluble moiety, and a third monomer having a fluoroalkyl moiety. Also a photoresist formulation including the composition of matter and a method of imaging using the photoresist formulation including the composition of matter.03-22-2012
20120156614Novel Phenol Compounds and Positive Photosensitive Resin Composition Including the Same - Disclosed are a novel phenol compound comprising a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof, and a positive photosensitive resin composition including the same.06-21-2012
20120156613ANTI-REFLECTIVE COATINGS USING VINYL ETHER CROSSLINKERS - Novel, wet developable anti-reflective coating compositions and methods of using those compositions are provided. The compositions comprise a polymer and/or oligomer having acid functional groups and dissolved in a solvent system along with a crosslinker and a photoacid generator. The preferred acid functional group is a carboxylic acid, while the preferred crosslinker is a vinyl ether crosslinker. In use, the compositions are applied to a substrate and thermally crosslinked. Upon exposure to light, the cured compositions will decrosslink, rendering them soluble in typical photoresist developing solutions (e.g., alkaline developers).06-21-2012
20120164576CYCLIC COMPOUND, PROCESS FOR PREPARATION THEREOF, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMATION OF RESIST PATTERN - A cyclic compound represented by formula (1):06-28-2012
20120164573ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME - An actinic-ray-sensitive or radiation-sensitive resin composition capable of forming a pattern having excellent critical dimension uniformity (CDU) in the line width, and a pattern forming method using the same are provided.06-28-2012
20090130596Lithographic printing plate comprising alkaline soluble and alkaline insoluble polymeric binders - Negative lithographic printing plate having on a substrate a photosensitive layer comprising an alkaline soluble polymeric binder, an alkaline insoluble polymeric binder, a polymerizable monomer, and an initiator is described. The photosensitive layer is imagewise exposed with a radiation to cause hardening in the exposed areas, and then developed to remove the non-hardened areas. The combination of both alkaline soluble polymeric binder and alkaline insoluble polymeric hinder in a photosensitive layer can give excellent combined durability, developability, and coatability.05-21-2009
20100248142LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PLATE MAKING METHOD THEREOF - A lithographic printing plate precursor includes, in the following order: a support; an image-recording layer which is capable of being removed with at least one of printing ink and dampening water and contains a polymerizable compound represented by the formula (1) as defined herein, a polymer particle containing a structural unit represented by the formula (2) as defined herein and a structural unit represented by the formula (3) as defined herein, an infrared absorbing agent and a polymerization initiator; and an overcoat layer.09-30-2010
20120129099Method For Producing Pigments - Process for preparing pigments of the formula (I)05-24-2012
20120129100ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME - An actinic ray-sensitive or radiation-sensitive resin composition including: (PA) a compound having a proton acceptor functional group and undergoing decomposition upon irradiation with an actinic ray or radiation to generate a compound reduced in or deprived of proton acceptor property or changed to be acidic from being proton acceptor-functioning, wherein a molar extinction coefficient ε of the compound (PA) at a wavelength of 193 nm as measured in acetonitrile solvent is 55,000 or less, and a pattern forming method using the composition are provided.05-24-2012
20120129098METHOD OF PREPARING A SUBSTRATE FOR LITHOGRAPHY, A SUBSTRATE, A DEVICE MANUFACTURING METHOD, A SEALING COATING APPLICATOR AND A SEALING COATING MEASUREMENT APPARATUS - A substrate for use in a lithographic projection apparatus. The substrate includes a sealing coating that covers at least a part of a first interface between two layers on the substrate, or between a layer and the substrate, and does not extend to a central portion of the substrate.05-24-2012
20120129097Photopolymer Printing Plates with In Situ Non-Directional Floor Formed During Extrusion - A photocurable relief image printing element is provided. The relief image printing element comprises at least a backing layer and at least one photocurable layer on the backing layer. The photocurable layer comprises at least one binder, at least one ethylenically unsaturated monomer, at least one photoinitiator, and an effective amount of a syndiotactic 1,2-polybutadine. The presence of the syndiotactic 1,2-polybutadiene results in a photocurable layer that exhibits minimal cold flow and good storage stability.05-24-2012
20120219907RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition contains (A) a resin having a structural unit represented by the formula (I), (B) an acid generator and (D) a compound represented by the formula (II),08-30-2012
20120219906RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition of the invention includes: (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and (B) an acid generator represented by the formula (II),08-30-2012
20120135348ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, AND PATTERN FORMING METHOD - Provided are an actinic-ray-sensitive or radiation-sensitive resin composition which has improved development defect and is capable of forming a good pattern shape, an actinic-ray-sensitive or radiation-sensitive film formed using the composition, and a pattern forming method using the composition.05-31-2012
20120219910PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING SAME - A photosensitive composition comprises (A) a resin whose solubility in an alkali developer is increased by the action of an acid, and (B) a compound that generates an acid when exposed to actinic rays or radiation, wherein the resin (A) contains two or more repeating units respectively having acid-decomposable groups that are different from each other in the acid decomposition ratio at an image formation sensitivity.08-30-2012
20120219909RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition containing; (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, (B) an acid generator, and (D) a salt having an anion represented by the formula (IA),08-30-2012
20120219908RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition of the present invention has (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, (B) an acid generator and (D) a compound represented by the formula (II).08-30-2012
20120251946PHOTORESIST COMPOSITION - The present invention provides a photoresist composition comprising the following components (A), (B) and (X): 10-04-2012
20120178023(METH)ACRYLATE DERIVATIVE, POLYMER AND PHOTORESIST COMPOSITION HAVING LACTONE STRUCTURE, AND METHOD FOR FORMING PATTERN BY USING IT - Photoresist material for lithography using a light of 220 nm or less comprising at least a polymer represented by following formula (2) and a photo-acid generator for generating an acid by exposure:07-12-2012
20080305430PHOTO-SENSITIVE COMPOUND AND PHOTORESIST COMPOSITION INCLUDING THE SAME - Disclosed are a photo-sensitive compound and a photoresist composition containing the same, for forming ultra-fine photoresist patterns. The photo-sensitive compound is resented by following Formula 1,12-11-2008
20120258403SALT AND PHOTORESIST COMPOSITION COMPRISING THE SAME - The present invention provides a salt represented by the formula (I):10-11-2012
20120189960Hydrophilic Monomer, Hydrophilic Photoresist Composition Containing the same, and Resist Pattern Formation Method - The present invention is to provide a hydrophilic monomer, and hydrophilic photoresist composition containing the same. The photoresist composition further comprises a hydrophilic resin. The hydrophilic monomer and the hydrophilic resin respectively have a hydrophilic group which is used to react to H2O for the purpose of solving them in pure water. The present invention is also to provide a resist pattern formation method comprising spin coating a hydrophilic photoresist composition on a surface of a substrate to limit a photoresist layer. As a result, the photoresist layer can be developed by pure water. The present invention seeks to overcome the deficiencies in prior art which result in pollution of the environment and cost of photolithography by using basic developing solvent.07-26-2012
20120189961PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE MATERIAL COMPRISING THE SAME - The present invention relates to a photosensitive resin composition and a photosensitive material comprising the same. The photosensitive resin composition according to an exemplary embodiment of the present invention may comprise two multi-functional monomers where structures of side chains comprising unsaturated double bonds are different from each other while a composition ratio is changed. Accordingly, in the exemplary embodiment of the present invention, processability is excellent, and it is possible to decrease defects by a rupture when a LCD substrate is sealed and substrate separation defects due to an impact to the LCD products by improving an adhesion property to a lower substrate after a hard baking process.07-26-2012
20120264057PATTERNING PROCESS AND PHOTORESIST WITH A PHOTODEGRADABLE BASE - A resist material and methods using the resist material are disclosed herein. An exemplary method includes forming a resist layer over a substrate, wherein the resist layer includes a polymer, a photoacid generator, an electron acceptor, and a photodegradable base; performing an exposure process that exposes portions of the resist layer with radiation, wherein the photodegradable base is depleted in the exposed portions of the resist layer during the exposure process; and performing an developing process on the resist layer.10-18-2012
20120264056METHOD OF MAKING RADIATION-SENSITIVE SOL-GEL MATERIALS - Radiation-sensitive sol-gel compositions are provided, along with methods of forming microelectronic structures and the structures thus formed. The compositions comprise a sol-gel compound and a base generator dispersed or dissolved in a solvent system. The sol-gel compound comprises recurring monomeric units comprising silicon with crosslinkable moieties bonded to the silicon. Upon exposure to radiation, the base generator generates a strong base, which crosslinks the sol-gel compound in the compositions to yield a crosslinked layer that is insoluble in developers or solvents. The unexposed portions of the layer can be removed to yield a patterned sol-gel layer. The invention can be used to form patterns from sol-gel materials comprising features having feature sizes of less than about 1 μm.10-18-2012
20090017398METHOD FOR MAKING A LITHOGRAPHIC PRINTING PLATE - A method for making a lithographic printing plate includes the steps of providing a heat-sensitive lithographic printing plate precursor including on a support having a hydrophilic surface or which is provided with a hydrophilic layer, a heat-sensitive coating; image-wise exposing the precursor with IR-radiation or heat; and developing the image-wise exposed precursor with an alkaline developing solution, wherein an anti-sludge agent is present in the precursor or in the developing solution or in the precursor and the developing solution, and wherein the anti-sludge agent is a 5-membered heteroaromatic compound, including a —NH— group wherein the hydrogen is capable of being deprotonated in the alkaline developing solution, selected from the group consisting of an optionally substituted benztriazole, 1,2,3-triazole, tetrazole, or indazole compound. According to the above method, the formation of sludge is inhibited or reduced.01-15-2009
20110123929OXIME COMPOUND, PHOTOSENSITIVE COMPOSITION, COLOR FILTER, PRODUCTION METHOD FOR THE COLOR FILTER, AND LIQUID CRYSTAL DISPLAY ELEMENT - Provided are an oxime compound represented by General Formula (1), a photosensitive composition containing the oxime compound as a photopolymerization initiator, a production method for a color filter using the photosensitive composition, and a color filter obtained by the production method:05-26-2011
20110039206NOVEL RESINS AND PHOTORESIST COMPOSITIONS COMPRISING SAME - Provided are new resins that comprise multi-ring, aromatic and/or multi-cyclic ester unit which preferably are photoacid-labile. Also provided are chemically-amplified positive photoresist that comprise such resins as well as multi-ring, aromatic and/or multi-cyclic ester monomers.02-17-2011
20110045408Color-forming photosensitive composition, lithographic printing plate precursor and novel cyanine dye - A color-forming photosensitive composition contains: a cyanine dye having at least two polymerizable groups selected from an acryloyl group, a methacryloyl group and a vinyl group; a radical generator; and a monomer having an ethylenically unsaturated group.02-24-2011
20110217658PHOTOPOLYMERISABLE LAYERED COMPOSITE FOR PRODUCING FLEXO PRINTING ELEMENTS - Laminate comprising 09-08-2011
20100233621PHOTOACID GENERATOR AND PHOTOREACTIVE COMPOSITION - An object of the present invention is to provide photoacid generator, which shows very high sensitivity in the near ultraviolet range of about 300 to 400 nm, and also can remarkably increase a reaction rate of a photoreactive composition using the same, and to provide a photoreactive composition which can initiate the reaction even by irradiation with near ultraviolet light within a short time and also can obtain a desired reaction product. More particularly, the present invention provides a dithienyl sulfide disulfonium salt represented by the formula (A1):09-16-2010
20090176173IONIC, ORGANIC PHOTOACID GENERATORS FOR DUV, MUV AND OPTICAL LITHOGRAPHY BASED ON PERACEPTOR-SUBSTITUTED AROMATIC ANIONS - A photoacid generator compound P07-09-2009
20120088190SALT AND PHOTORESIST COMPOSITION COMPRISING THE SAME - The present invention provides a salt represented by the formula (I):04-12-2012
20100203449METHOD OF FABRICATING THIN FILM TRANSISTOR SUBSTRATE AND NEGATIVE PHOTORESIST COMPOSITION USED THEREIN - A method of fabricating a thin film transistor substrate and a negative photoresist composition used therein are provided, which can reduce pattern inferiority. The method of fabricating a thin film transistor substrate includes forming a conductive film composed of a conductive material on a substrate, forming an etch pattern composed of a negative photoresist composition on the conductive film, and forming a conductive pattern by etching the conductive film using the etch pattern as an etching mask, wherein the negative photoresist composition includes 10-50 parts by weight of novolak resin including a hydroxyl group that is soluble in an alkali developing solution, 0.5-10 parts by weight of a first photo acid generator represented by the following formula (1), 0.5-10 parts by weight of a second photo acid generator represented by the following formula (2), 1-20 parts by weight of a cross-linking agent, and 10-90 parts by weight of a solvent:08-12-2010
20130011790FLUORINE-FREE FUSED RING HETEROAROMATIC PHOTOACID GENERATORS AND RESIST COMPOSITIONS CONTAINING THE SAME - The present invention relates to a fluorine-free photoacid generator (PAG) and a photoresist composition containing the same. The PAG is characterized by the presence of an onium cationic component and a fluorine-free fused ring heteroaromatic sulfonate anionic component containing one or more electron withdrawing substituents. The onium cationic component of the PAG is preferably a sulfonium or an iodonium cation. The photoresist composition further contains an acid sensitive imaging polymer. The photoresist composition is especially useful for forming material patterns on a semiconductor substrate using 193 nm (ArF) lithography.01-10-2013
20130011788FLUORINE-FREE FUSED RING HETEROAROMATIC PHOTOACID GENERATORS AND RESIST COMPOSITIONS CONTAINING THE SAME - The present invention relates to a fluorine-free photoacid generator (PAG) and a photoresist composition containing the same. The PAG is characterized by the presence of an onium cationic component and a fluorine-free fused ring heteroaromatic sulfonate anionic component containing one or more electron withdrawing substituents. The onium cationic component of the PAG is preferably a sulfonium or an iodonium cation. The photoresist composition further contains an acid sensitive imaging polymer. The photoresist composition is especially useful for forming material patterns on a semiconductor substrate using 193 nm (ArF) lithography.01-10-2013
20130011786FLUORINE-FREE FUSED RING HETEROAROMATIC PHOTOACID GENERATORS AND RESIST COMPOSITIONS CONTAINING THE SAME - The present invention relates to a fluorine-free photoacid generator (PAG) and a photoresist composition containing the same. The PAG is characterized by the presence of an onium cationic component and a fluorine-free fused ring heteroaromatic sulfonate anionic component containing one or more electron withdrawing substituents. The onium cationic component of the PAG is preferably a sulfonium or an iodonium cation. The photoresist composition further contains an acid sensitive imaging polymer. The photoresist composition is especially useful for forming material patterns on a semiconductor substrate using 193 nm (ArF) lithography.01-10-2013
20130011787FLUORINE-FREE FUSED RING HETEROAROMATIC PHOTOACID GENERATORS AND RESIST COMPOSITIONS CONTAINING THE SAME - The present invention relates to a fluorine-free photoacid generator (PAG) and a photoresist composition containing the same. The PAG is characterized by the presence of an onium cationic component and a fluorine-free fused ring heteroaromatic sulfonate anionic component containing one or more electron withdrawing substituents. The onium cationic component of the PAG is preferably a sulfonium or an iodonium cation. The photoresist composition further contains an acid sensitive imaging polymer. The photoresist composition is especially useful for forming material patterns on a semiconductor substrate using 193 nm (ArF) lithography.01-10-2013
20130017491FLUORINE-FREE FUSED RING HETEROAROMATIC PHOTOACID GENERATORS AND RESIST COMPOSITIONS CONTAINING THE SAME - The present invention relates to a fluorine-free photoacid generator (PAG) and a photoresist composition containing the same. The PAG is characterized by the presence of an onium cationic component and a fluorine-free fused ring heteroaromatic sulfonate anionic component containing one or more electron withdrawing substituents. The onium cationic component of the PAG is preferably a sulfonium or an iodonium cation. The photoresist composition further contains an acid sensitive imaging polymer. The photoresist composition is especially useful for forming material patterns on a semiconductor substrate using 193 nm (ArF) lithography.01-17-2013
20130017490FLUORINE-FREE FUSED RING HETEROAROMATIC PHOTOACID GENERATORS AND RESIST COMPOSITIONS CONTAINING THE SAME - The present invention relates to a fluorine-free photoacid generator (PAG) and a photoresist composition containing the same. The PAG is characterized by the presence of an onium cationic component and a fluorine-free fused ring heteroaromatic sulfonate anionic component containing one or more electron withdrawing substituents. The onium cationic component of the PAG is preferably a sulfonium or an iodonium cation. The photoresist composition further contains an acid sensitive imaging polymer. The photoresist composition is especially useful for forming material patterns on a semiconductor substrate using 193 nm (ArF) lithography.01-17-2013
20130022921RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having; a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), an acid generator, and a salt having an anion represented by the formula (IA).01-24-2013
20130022920RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), and an acid generator represented by the formula (II),01-24-2013
20130022922RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), and an acid generator represented by the formula (II),01-24-2013
20130022917RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), and an acid generator represented by the formula (II),01-24-2013
20130022918RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), and an acid generator,01-24-2013
20130022919RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), and an acid generator represented by the formula (II),01-24-2013
20130171561ADDITIVE FOR RESIST AND RESIST COMPOSITION COMPRISING SAME - A resist additive represented by Formula 1 below and a resist composition including the additive are disclosed. The resist additive improves hydrophobicity of the surface of the resist film to prevent materials from being leached in water during exposure of immersion lithography and is converted to have hydrophilicity by deprotection reaction during development. As a result, a micropattern of a resist film with excellent sensitivity and high resolution is formed.07-04-2013
20080248421POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD - A positive photosensitive composition comprises: (A) a resin that has an acid decomposable repeating unit represented by formula (I) and increases its solubility in an alkali developer by action of an acid: (B) a compound generating an acid upon irradiation with actinic light or radiation; (C) a hydrophobic resin insoluble in an alkali developer and having at least either one of a fluorine atom and a silicon atom; and (D) a solvent,10-09-2008
20080248420POSITIVE RESIST COMPOSITION AND PATTERN-FORMING METHOD - A positive resist composition includes: (A) a resin capable of increasing the solubility in an alkali developing solution by the action of an acid, including: (a1) a repeating unit selected from repeating units represented by following formulae (a1-1) to (a1-3); (a2) a repeating unit represented by a following formula (a2); and (a3) a repeating unit selected from repeating units represented by following formulae (a3-1) to (a3-4); (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom, and being insoluble in an alkali developing solution; and (D) a solvent, wherein the formulae above are defined in the specification.10-09-2008
20080227032ENVIRONMENTAL FRIENDLY PHOTOACID GENERATORS (PAGs) WITH NO PERFLUOROOCTYL SULFONATES - Novel classes of ionic photoacid generator (PAGs) compounds having relatively environmentally friendly anions with no perfluorooctyl sulfonate (no-PFOS) are provided and photoresist composition that comprise such compounds. The new PAGs produce a photoacid having a short or no perfluoro alkyl chain (i.e., no-PFOS) attached to a variety of functional groups. The PAGs of the invention are useful as photoactive component in the chemically amplified resist compositions used for microfabrication.09-18-2008
20080227031Phenolic polymers and photoresists comprising same - The present invention relates to new polymers that contain phenolic groups spaced from a polymer backbone and photoacid-labile group. Preferred polymers of the invention are useful as a component of chemically-amplified positive-acting resists.09-18-2008
20080227030Use of Mixed Bases to Enhance Patterned Resist Profiles on Chrome or Sensitive Substrates - Resist compositions having good footing properties even on difficult substrates are obtained by using a combination of base additives including a room temperature solid base, and a liquid low vapor pressure base. The compositions are especially useful on metal substrates such as chromium-containing layers commonly used in mask-making.09-18-2008
20080220372Photosensitive resin composition for black matrix - The present invention discloses a photosensitive resin composition for black matrix, which shows no undercut after development. The photosensitive resin composition comprises (A) an alkali-soluble resin, (B) a photopolymerizable monomer, (C) a photoinitiator, (D) a solvent, and (E) a black pigment; wherein the alkali-soluble resin (A) comprises a functional group having a general formula (a-1);09-11-2008
20080220371PHOTOSENSITIVE COMPOSITION, COMPOUND USED FOR PHOTOSENSITIVE COMPOSITION AND PATTERN-FORMING METHOD USING PHOTOSENSITIVE COMPOSITION - A photosensitive composition comprises: (A) a compound capable of generating an acid represented by formula (I) upon irradiation with actinic ray or radiation; and (B) a resin that decomposes by the action of an acid to its increase solubility in an alkali developer09-11-2008
20080220369CHEMICALLY AMPLIFIED RESIST COMPOSITION - The present invention provides a chemically amplified resist composition containing: 09-11-2008
20080220368PHOTOSENSITIVE PASTE COMPOSITION, BARRIER RIB PREPARED USING THE COMPOSITION AND PLASMA DISPLAY PANEL COMPRISING THE BARRIER RIB - Photosensitive paste compositions, barrier ribs of plasma display panels (PDPs) including the same, and PDPs including the barrier ribs are provided. More particularly, a photosensitive paste composition includes an organic component and an inorganic component, where the organic component and the inorganic component each have an average refractive index of less than 1.5. The organic component used in the photosensitive paste composition is not harmful to the human body, is inexpensive, is generally easily obtained, and succumbs readily to thermal decomposition. Accordingly, using such an organic component, barrier ribs of PDPs having high resolution and high compactness by exposure to light only once can be prepared.09-11-2008
20120251947CYCLIC COMPOUND, METHOD OF PRODUCING THE SAME, RADIATION SENSITIVE COMPOSITION, AND METHOD OF FORMING RESIST PATTERN - This invention addresses problems to provide a cyclic compound having a high solubility in safety solvents and a high sensitivity and being good in the shape of the resulting resist pattern, a method of producing the same, a radiation sensitive composition comprising the same, and a method of forming a resist pattern using the radiation sensitive composition. As means for solving the problem, there are provided a cyclic compound having a specific structure, a radiation sensitive composition comprising the compound, and a method of forming a resist pattern using the composition.10-04-2012
20090233229LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF LITHOGRAPHIC PRINTING - A lithographic printing plate precursor is provided that, using laser exposure, exhibits an excellent capacity for plate inspection, an excellent on-press development performance or gum development performance, and an excellent scumming behavior, while maintaining a satisfactory printing durability. There is also provided a method of lithographic printing that uses this lithographic printing plate precursor. The lithographic printing plate precursor comprises an image recording layer having (A) a nonionic polymerization initiator that contains at least two cyclic imide structures, and (B) a compound that has at least one addition-polymerizable ethylenically unsaturated bond.09-17-2009
20080213694COMPOSITION CONTAINING A PHOTOACID GENERATOR MONOMER, SUBSTRAT COATED WITH THE COMPOSITION, METHOD FOR SYNTHESIZING A COMPOUND ON A SUBSTRATE USING THE COMPOSITION, AND MICROARRAY PRODUCED ACCORDING TO THE METHOD - A composition containing a photoacid generator monomer and surfactant, and a method for synthesizing a compound on a substrate using the composition are provided. The method includes bonding a layer of first molecules having an acid labile protecting group to a solid substrate; coating a layer of the photoacid generator monomer composition according to the present invention on the layer of first molecules; exposing the composition layer to light and then heat-treating to remove the acid labile protecting group from the first molecules corresponding to the exposed portion; washing and removing the composition layer from the exposed and unexposed portions; and bonding second molecules to the exposed first molecules.09-04-2008
20130122423COMPOUND, RADIATION-SENSITIVE COMPOSITION AND RESIST PATTERN FORMATION METHOD - The object is to provide a compound having high dissolvability in a safe solvent and high sensitivity, and also capable of obtaining a good resist pattern shape, a radiation-sensitive composition containing the same, and a resist pattern formation method using the composition. For this purpose, a compound (B) obtained by reaction between a polyphenol based cyclic compound (A) and a compound (C) having a particular structure, a radiation-sensitive composition containing the same, and a resist pattern formation method using the composition are provided.05-16-2013
20130122421HYBRID PHOTORESIST COMPOSITION AND PATTERN FORMING METHOD USING THEREOF - The present invention relates to a hybrid photoresist composition for improved resolution and a pattern forming method using the photoresist composition. The photoresist composition includes a radiation sensitive acid generator, a crosslinking agent and a polymer having a hydrophobic monomer unit and a hydrophilic monomer unit containing a hydroxyl group. At least some of the hydroxyl groups are protected with an acid labile moiety having a low activation energy. The photoresist is capable of producing a hybrid response to a single exposure. The patterning forming method utilizes the hybrid response to form a patterned structure in the photoresist layer. The photoresist composition and the pattern forming method of the present invention are useful for printing small features with precise image control, particularly spaces of small dimensions.05-16-2013
20130122422Photosensitive Resin Composition and Color Filter Using the Same - Disclosed are photosensitive resin composition that includes a dye including a methine-based compound represented by the following Chemical Formula 1, wherein each substituent of Chemical Formula 1 is the same as defined in the detailed description, and a metal complex, and a color filter using the same.05-16-2013
20120258404RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition of the invention includes: (A) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, (B) an acid generator represented by the formula (II), and (D) a compound represented by the formula (I),10-11-2012
20120258402PHOTORESIST COMPOSITION, RESIST-PATTERN FORMING METHOD, POLYMER, AND COMPOUND - A photoresist composition includes a polymer that includes a structural unit shown by the following formula (1), and a photoacid generator. R10-11-2012
20120282546CYCLIC COMPOUND, PRODUCTION PROCESS THEREOF, RADIATION-SENSITIVE COMPOSITION AND RESIST PATTERN FORMATION METHOD - Disclosed are: a cyclic compound which has high solubility in a safe solvent, is highly sensitive, enables the formation of a resist pattern having a good shape, and rarely causes resist pattern collapse; a process for producing the cyclic compound; a radiation-sensitive composition containing the cyclic compound; and a resist pattern formation method using the composition. Specifically disclosed are: a cyclic compound having a specific structure; a process for producing the cyclic compound; a radiation-sensitive composition containing the compound; and a resist pattern formation method using the composition.11-08-2012
20090075199Photosensitive element having reinforcing particles and method for preparing a printing form from the element - The invention provides a photosensitive element and a method for preparing a printing form from the element. The photosensitive element includes a layer of a photosensitive composition containing a binder, a monomer, and a Norrish type II photoinitiator, wherein the photosensitive layer has a transmittance to actinic radiation of less than 20% and contains reinforcing particles of graphene and/or carbon nanotubes.03-19-2009
20110311917RESIST COMPOSITION FOR IMMERSION EXPOSURE AND METHOD OF FORMING RESIST PATTERN USING THE SAME - A resist composition for immersion exposure, including a base component (A) that exhibits changed solubility in an alkali developing solution under action of acid, an acid generator component (B) that generates acid upon exposure, and a fluorine-containing compound (C) represented by general formula (c-1) (in formula (c-1), R12-22-2011
20120015296PHOTOSENSITIVE RESIN COMPOSITION FOR FLEXOGRAPHIC PRINTING HAVING EXCELLENT SOLVENT RESISTANCE - A photosensitive resin composition for flexographic printing having excellent resistance to an ink comprising an organic solvent and an emulsion ink used in flexographic printing, for example, a UV-curable ink or an ink using a vegetable oil or light naphtha and having excellent suitability for printing applications such as image reproducibility and print durability. The photosensitive resin composition for flexographic printing includes, at least, (a) one or more thermoplastic elastomers, (b) an acrylic-terminated liquid polybutadiene containing 1,2-bonds in an amount of 80% or more, (c) a photopolymerizable unsaturated monomer having at least one or more ethylenically unsaturated groups, and (d) a photopolymerization initiator.01-19-2012
20120015295INFRARED-SENSITIVE COMPOSITION FOR PRINTING PLATE PRECURSORS - A lithographic printing plate precursor has a substrate and an infrared radiation-sensitive composition comprising a polymeric binder, a free radical polymerizable system consisting of at least one polymerizable component, a compound capable of absorbing infrared radiation, and an initiator system comprising an iodonium salt that is capable of producing free radicals; and at least 1% and up to and including 10% by weight, based on the infrared-sensitive composition, of at least one mono- or polycarboxylic acid having an aromatic moiety.01-19-2012
20120028188PHOTORESIST COMPOSITION - The present invention provides a photoresist composition comprising02-02-2012
20130095425PHOTORESIST COMPOSITION - A photoresist composition which comprises 04-18-2013

Patent applications in class Radiation sensitive composition comprising ethylenically unsaturated compound

Patent applications in all subclasses Radiation sensitive composition comprising ethylenically unsaturated compound