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Radiation sensitive composition comprising oxirane ring containing component

Subclass of:

430 - Radiation imagery chemistry: process, composition, or product thereof

430269000 - IMAGING AFFECTING PHYSICAL PROPERTY OF RADIATION SENSITIVE MATERIAL, OR PRODUCING NONPLANAR OR PRINTING SURFACE - PROCESS, COMPOSITION, OR PRODUCT

430270100 - Radiation sensitive composition or product or process of making

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
430280100 Radiation sensitive composition comprising oxirane ring containing component 89
20100112478WATER-DEVELOPABLE PHOTOSENSITIVE LITHOGRAPHIC PRINTING PLATE MATERIAL - The present invention provides a highly sensitive photosensitive lithographic printing plate material capable of being used in a CTP system, which allows on-press development and/or development with water and has superior printability. More specifically, the present invention provides a water-developable photosensitive lithographic printing plate material comprising a support; on the support, a hydrophilic layer containing a water-soluble polymer, a crosslinking agent which forms a cross-linking network with the water-soluble polymers, and colloidal silica, wherein the weight ratio of the water-soluble polymer to the colloidal silica is within the range of 1:1 to 1:3; and, on the hydrophilic layer, a photocurable photosensitive layer containing a polymer having a sulfonic acid group and a vinylphenyl group in a side chain wherein the vinylphenyl group is attached to a main chain through a linking group containing a hetero ring, a photopolymerization initiator, and a compound which sensitizes the photopolymerization initiator.05-06-2010
20100075252LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PLATE MAKING METHOD THEREOF - A lithographic printing plate precursor includes: a support; and an image-recording layer containing (A) an infrared absorbing agent, (B) a radical polymerization initiator, (C) a polymerizable compound and (D) an epoxy compound having a molecular weight of 1,000 or less.03-25-2010
20130034812POLYMERIZABLE COMPOSITION FOR SOLDER RESIST, AND SOLDER RESIST PATTERN FORMATION METHOD - The present invention provides a polymerizable composition for a solder resist, including an infrared ray shielding material, a polymerization initiator, and a polymerizable compound, and a solder resist pattern forming method using the polymerizable composition for a solder resist.02-07-2013
20090155717Photosensitive Resin Composition with Good Stripper-Resistance for Color Filter and Color Filter Formed Using the Same - The present invention relates to a photosensitive resin composition for a color filter, which has an excellent stripper-resistance and is developed by an alkali aqueous solution, and a color filter formed of the photosensitive resin composition. The photosensitive resin composition includes: (A) a carboxyl-containing acryl-based binder resin; (B) a double bond-containing acryl carboxylate resin represented by the following Formula 1; (C) an acryl-based photopolymerization monomer; (D) a photopolymerization initiator; (E) a pigment; and (F) a solvent. The photosensitive resin composition has excellent stripper resistance, and thus can be used when a color filter is fabricated on a TFT array substrate in order to ensure a high aperture ratio.06-18-2009
20130071787POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING CURED FILM USING THE SAME - The present invention provides a positive photosensitive resin composition including: a resin containing a specific acrylic acid-based constituent unit capable of undergoing dissociation of an acid-dissociable group to produce a carboxyl group, and a constituent unit having a functional group capable of reacting with the carboxyl group to form a covalent bond, the resin being alkali-insoluble or sparingly alkali-soluble and becoming alkali-soluble when the acid-dissociable group dissociates; and a compound capable of generating an acid upon irradiation with an actinic ray or radiation. The present invention also provides a method for forming a cured film using the composition. The positive photosensitive composition is excellent in the sensitivity, film residual ratio and storage stability and by the method for forming a cured film using the positive photosensitive resin composition, a cured film excellent in the heat resistance, adhesion, transmittance and the like can be provided.03-21-2013
20130059251MICRO/NANO PHOTOCONDUCTOR - The present invention discloses a method for fabricating and integrating a micro/nano photoconductor using a photoconductor formulation especially suitable for thick film patterning. The photoconductor formulation comprises: an organic component including a photosensitive polymer and a photoinitiator, and an inorganic component including an activated photoconducting powder comprising cadmium sulfide, copper, and chlorine. The present invention provides low-cost, thick film optical sensors having extremely fine geometries (<100 μm) and high sensitivity.03-07-2013
20080268374Photosensitive Composition, Pattern Forming Material, Photosensitive Laminate, Pattern Forming Apparatus, and Pattern Forming Process - A photosensitive composition having an extremely constant photosensitivity distribution relative to an exposure light having a wavelength of 400 nm to 410 nm, and excelling in pattern reproductivity, suppressing variations in pattern formation; a pattern forming material and a photosensitive laminate with the photosensitive composition laminated thereon; and a pattern forming apparatus and a pattern forming process.10-30-2008
20120225385SALT AND PHOTORESIST COMPOSITION COMPRISING THE SAME - The present invention provides a salt represented by the formula (I):09-06-2012
20090233225Low chlorine epoxy resin formulations - This invention relates to the need to improve the corrosion resistance of very low total chlorine epoxy resins which contain very low contents of organically bound chlorine. The invention relates to the improvement of corrosion resistance of such epoxy resins for electronic applications by the addition of specific additives acceptable to the electronics industry. The use of these low chlorine resins in combination with said additives has been shown to be corrosion-free on highly corrosive surfaces such as aluminum and copper, which are frequently encountered in electronic applications.09-17-2009
20130164679INORGANIC FILLER AND ORGANIC FILLER-CONTAINING CURABLE RESIN COMPOSITION, RESIST FILM COATED PRINTED WIRING BOARD, AND METHOD FOR PRODUCING THE SAME - A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 v, wherein a content weight ratio of the components (II) and (III) is 1 to 41.06-27-2013
20130164680PHOTORESIST COMPOSITION FOR NEGATIVE DEVELOPMENT AND PATTERN FORMING METHOD USING THEREOF - The present invention relates to a photoresist composition capable of negative development and a pattern forming method using the photoresist composition. The photoresist composition includes an imaging polymer and a radiation sensitive acid generator. The imaging polymer includes a first monomeric unit having a pendant acid labile moiety and a second monomeric unit containing a reactive ether moiety, an isocyanide moiety or an isocyanate moiety. The patterning forming method utilizes an organic solvent developer to selectively remove unexposed regions of a photoresist layer of the photoresist composition to form a patterned structure in the photoresist layer. The photoresist composition and the pattern forming method are especially useful for forming material patterns on a semiconductor substrate using 193 nm (ArF) lithography.06-27-2013
20130164678Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - Disclosed are a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter includes (A) a dye-polymer composite including a structural unit derived from a compound represented by the following Chemical Formula 1; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; and (D) a solvent.06-27-2013
20100035182PHOTOSENSITIVE RESIN COMPOSITION - The present invention relates to a positive type photosensitive polyimide resin composition comprising a phenolic hydroxy group-containing soluble polyimide resin (A) formed from a tetrabasic acid dianhydride (a), an aminophenol compound having at least two amino groups and at least one phenolic hydroxy group in one molecule (b), and a diamino compound (c); a diazo-based positive type photosensitizer (B); and an epoxy resin (C). Using the positive type photosensitive polyimide resin composition of the present invention, a resin composition which allows easy patterning, satisfies various properties such as flame retardancy, heat resistance, mechanical properties and flexibility, and is capable of coping with high functionalization of various electronic devices, and a cured product thereof can be provided.02-11-2010
20120237873POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED FROM THE SAME, AND DEVICE HAVING CURED FILM - Disclosed is a positive photosensitive resin composition which contains a polisiloxane, a naphthoquinone diazide compound, and a solvent. The positive photosensitive resin composition is characterized in that the polysiloxane has: an organosilane-derived structure represented by the general formula (1):09-20-2012
20120219905RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition contains (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, (B) an acid generator, and (D) at least one compound selected from the group consisting of a compound represented by the formula (II1) and a compound represented by the formula (II2),08-30-2012
20110104613Antireflective Composition for Photoresists - The invention relates to an antireflective coating composition for a photoresist layer comprising a polymer, a crosslinking agent and an acid generator, where the polymer comprises at least one unit of structure 1,05-05-2011
20130022915RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition having a resin having a structural unit represented by the formula (I), a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid and not including the structural unit represented by the formula (I), an acid generator, and a compound represented by the formula (II),01-24-2013
20110294068Self-Segregating Multilayer Imaging Stack With Built-In Antireflective Properties - A coating process comprises forming a patterned material layer on a substrate using a self-segregating polymeric composition comprising a polymeric photoresistive material and an antireflective coating material contained in a single solution. When depositing this solution on a substrate and removing the solvent, the two materials self-segregate into two layers. This produces a coated substrate having a uniaxial bilayer coating oriented in a direction orthogonal to the substrate with a top photoresistive coating layer and a bottom antireflective coating layer. Pattern-wise exposing the coated substrate to imaging radiation and contacting the coated substrate with a developer, produces the patterned material layer. Any optional top coat material and a portion of the photoresist layer can be simultaneously removed from the coated substrate to form a patterned photoresist layer on the substrate.12-01-2011
20110294067PHOTOSENSITIVE RESIN COMPOSITION - A photosensitive resin composition is disclosed. The photosensitive resin composition includes an alkali soluble resin with an epoxy structure, a photopolymerizable compound having an ethylenically unsaturated bond, a photoinitiator, and a thermal curing agent. The photosensitive resin composition provides great surface hardness, adhesion and transmittance to meet industrial requirements.12-01-2011
20090092923MODIFIED SILICA PARTICLES, AND PHOTOSENSITIVE COMPOSITION AND PHOTOSENSITIVE LITHOGRAPHIC PRINTING PLATE EACH CONTAINING THE PARTICLES - An object of the present invention is to satisfactorily maintain adhesion between a photosensitive layer and a substrate after the exposure of the photosensitive lithographic printing plate.04-09-2009
20110200939POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME AND DRY FILM MANUFACTURED BY THE SAME - The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.08-18-2011
20110200938Antireflective Compositions and Methods of Using Same - A novel antireflective coating composition is provided, said antireflective coating composition comprising a) a compound of formula 1, b) a thermal acid generator, (c) at least one polymer,08-18-2011
20120295199LONG-CHAIN ALKYLENE-CONTAINING CURABLE EPOXY RESIN COMPOSITION - A curable composition that maintains good handleability in the liquid form and that can be photo- or heat-cured to form a cured product having physical properties including both high transparency and high flexural strength. A curable composition includes, an epoxy compound of (1):11-22-2012
20100279227Composition for forming underlayer coating for litography containing epoxy compound and carboxylic acid compound - There is provided an underlayer coating forming composition for lithography that is used in lithography process of manufacture of semiconductor device; and an underlayer coating having a high dry etching rate compared with photoresist. Concretely, it is a composition for forming an underlayer without use of crosslinking reaction by an strong acid catalyst, and an underlayer coating forming composition containing a component having an epoxy group (a polymer, a compound) and a component having a phenolic hydroxyl group, a carboxyl group, a protected carboxyl group or an acid anhydride structure (a polymer, a compound).11-04-2010
20120295200PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION AND PRINTED CIRCUIT BOARDS MADE BY USING THE SAME - A photocurable and thermosetting composition comprises (A) a carboxyl group-containing resin having at least one carboxyl group in its molecule, (B) a photopolymerization initiator having an oxime linkage represented by the following general formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in its molecule. The above-mentioned photopolymerization initiator (B) is incorporated into a formulation which is different from at least a formulation into which the above-mentioned carboxyl group-containing resin (A) and the above-mentioned reactive diluent (C) are incorporated to formulate a system comprising at least two parts.11-22-2012
20080311512PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PATTERN FORMING - A photosensitive resin composition, which displays superior adhesion with substrates when forming a film and can form fine resin patterns with larger film thicknesses and higher aspect ratios, and a method for forming a pattern using the same are provided. Diphenyl sulfone or derivatives thereof are included into the photosensitive resin composition as an adhesion enhancer. Preferably, the diphenyl sulfone derivative is derived by substituting at least one hydrogen atom of diphenyl sulfone with an amino group, a nitro group, hydroxyl group, carboxyl group, fluorine atom, chlorine atom or acid anhydride.12-18-2008
20110223539PHOTOSENSITIVE RESIN COMPOSITION FOR PROTECTIVE FILM OF PRINTED WIRING BOARD FOR SEMICONDUCTOR PACKAGE - The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.09-15-2011
20090075198Photosensitive Polyimide Resin Composition - The developability of a photosensitive polyimide resin composition with a weakly alkaline aqueous solution is improved without reduction in the solubility in general-purpose organic solvents even when a part of the diamine component is replaced with a diaminopolysiloxane-based compound or a bis(aminobenzoate)-based compound in order to reduce the warpage characteristics of the photosensitive polyimide resin composition by reducing its modulus of elasticity. The photosensitive polyimide resin composition is capable of being developed in a positive manner with a weakly alkaline aqueous solution and is soluble in an organic solvent. The photosensitive polyimide resin composition contains: a polyimide resin including a polyimide unit represented by formula (1) and a polyimide unit represented by one of formulas (2) and (3); an analogue of melamine cyanurate; and an analogue of diazonaphthoquinone. The amount of the analogue of melamine cyanurate is in the range of from 5 to 50 parts by weight with respect to 100 parts by weight of the polyimide resin.03-19-2009
20090246691Antireflective Coating Composition - The present invention relates to an antireflective composition comprising a thermal acid generator and an epoxy polymer comprising at least one unit of structure 1, at least one unit of structure 2.10-01-2009
20100015550DUAL DAMASCENE VIA FILLING COMPOSITION - Compositions for use in dual damascene process are disclosed.01-21-2010
20090017397PHOTOSENSITIVE RESIN COMPOSITION AND MICROLENS FORMED WITH USE THEREOF - A photosensitive resin composition according to the present invention includes: a copolymer having a repeating unit having a thermal crosslinking group; and a photosensitive agent. As such, the photosensitive resin composition according to the present invention can form a resin with improved heat resistance. Further, a microlens-forming photosensitive resin composition according to the present invention includes: a copolymer having a repeating unit having a thermal crosslinking group; and a photosensitive agent, the copolymer having a mass-average molecular weight of 10,000 to 30,000. As such, the microlens-forming photosensitive resin composition according to the present invention can form a resin with improved heat resistance.01-15-2009
20090042126Photosensitive resin composition and cured article thereof - A photosensitive resin composition which is excellent in photosensitivity and excellent in flame resistance, flexibility, adhesiveness, pencil hardness, resistance to solvent, acid resistance, heat resistance, resistance to gold plating and the like and a cured article thereof are provided.02-12-2009
20090075197PHOTORESIST COMPOSITION, METHOD OF FORMING PATTERN USING THE PHOTORESIST COMPOSITION AND INKJET PRINT HEAD - A photoresist composition including an oxetane-containing compound represented by Formula 1 or 2, an oxirane-containing compound represented by Formula 3 or 4, a photoinitiator, and a solvent, a method of forming a pattern using the photoresist composition, and an inkjet print head including a polymerization product of the photoresist composition.03-19-2009
20100221661METHODS FOR PRODUCING PHOTOSENSITIVE MICROPARTICLES - Described are various methods of producing non-aqueous dispersions of photosensitive polymeric microparticles, comprising: (a) preparing one or more aqueous dispersions of a polymerizable component, at least one of which contains a photosensitive material and, wherein the polymerizable components comprise at least one hydrophilic functional group and/or at least one hydrophobic functional group; (b) subjecting the dispersion of (a) to conditions sufficient to form microparticles; (c) at least partially polymerizing the polymerizable component; (d) combining the dispersion with an organic continuous phase comprising an organic solvent; (e) removing water from the dispersion such that the final water content of the non-aqueous dispersion is less than 30 percent by weight; wherein e) is performed before or after d); and (f) reacting any acid functional groups on the surface of the microparticles with a reactive material having at least one epoxy functional group, at least one thiocarbonylthio functional group, at least one alkoxyamine functional group, or at least one halide functional group.09-02-2010
20100196822PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT OF THE COMPOSITION, AND METHOD OF PRODUCING INSULATING FILM - A photosensitive insulating resin composition includes (A) an alkali-soluble resin that contains (a1) a structural unit derived from a crosslinkable monomer and (a2) a structural unit having a phenolic hydroxyl group, (B) a crosslinking agent, (C) a photosensitive compound, and (D) a solvent.08-05-2010
20090239175Stereolithographic Resins Containing Selected Oxetane Compounds - A liquid radiation-curable composition that comprises 09-24-2009
20110033802METHOD FOR PREPARING A PHOTO-CROSSLINKABLE COMPOSITION - The invention relates to a photo-crosslinkable composition that can be obtained by a method including the following steps: (a) the hydrolysis and condensation reaction of a [(epoxycycloalkyl)alkyl]thalkoxysilane in solution in an organo-aqueous medium containing water in an initial water/monomer molar ratio of between 3 and 15, with at least one water-soluble solvent, at a pH of between 1.6 and 4.0, by heating the solution to a temperature of between 50 and 70° C. for a duration of between 180 and 350 minutes in order to obtain a solution of an organo-mineral hybrid prepolymer, in which the totality or quasi-totality of the alkoxysilane groups has been hydrolysed, and which comprises in average at least 4 (epoxycycloalkyl)alkyl groups; (b) cooling the polyepoxide prepolymer composition thus obtained down to a temperature of between 15 and 25° C.; (c) adding to said composition at least one cationic-polymerisation photo-primer and at least one photosensitiser having a maximum absorption at a wavelength of between 300 and 420 nm, and optionally adding a surfactant; (d) agitating the composition thus obtained for a duration of between 10 and 120 minutes at a temperature of between 15 and 25° C.; (e) filtering the composition thus obtained with a filter comprising pores with an average size of between 1 and 5 μm; and (f) storing the liquid filtrate thus obtained at a temperature lower than 0° C., preferably between −20 and −10° C. The invention also relates to the use of such a photocrosslinkable composition as a negative photosensitive resin in a photolithography process.02-10-2011
20090029287PHOTOSENSITIVE RESIN COMPOSITION - The present invention provides a photosensitive resin composition and a resin film obtained from the photosensitive resin particularly useful for a buffer coating material for LSI chips. For this purpose, there are used a photosensitive resin composition, comprising: 100 parts by weight of a polycondensate obtained by condensation-polymerizing compounds represented by specific chemical formulas in a specific mixing ratio, 0.01 to 5 parts by weight of a photopolymerization initiator and 1 to 30 parts by weight of a specific organosilane, and a resin film obtained by coating the photosensitive resin composition on a silicon wafer surface, exposing the coated film, developing the exposed film, and curing the developed film.01-29-2009
20100009290Photosensitive Polybenzoxazines and Methods of Making the Same - Photosensitive polybenzoxazine compositions include a photosensitive additive such as an o-diazoquinone and a polymer comprising a repeating unit represented by the following formula (I) wherein R01-14-2010
20100068649PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMATION METHOD USING THE SAME - A photosensitive resin composition is provided that is highly safe, provides a coating film having superior uniformity, can improve the curing density of the cured resin pattern, and is capable of forming a micro resist pattern having a large film thickness and a high aspect ratio with high sensitivity and high resolving ability. According to a photosensitive resin composition including, in addition to an onium fluorinated alkyl fluorophosphate based cation polymerization initiator having a specific structure, a specified solvent or a specified sensitizing agent as essential components, a coating film having superior uniformity, can improve the curing density of the cured resin pattern, and also is capable of forming a micro resist pattern having a large film thickness and a high aspect ratio with high sensitivity and high resolving ability.03-18-2010
20100055611RESIST COMPOSITION AND METHOD FOR FORMING A PATTERN USING THE SAME - The present invention relates to a resist composition with a hardener and a solvent, and a method for forming a pattern using the resist composition. The hardener has a thermal-decomposable core part, and a first photosensitive bond art. The solvent has a low-molecular resin, and a second photosensitive bond part.03-04-2010
20110065045EPOXY-FUNCTIONALIZED PERFLUOROPOLYETHER POLYURETHANES - Disclosed are epoxy-functionalized perfluoropolyether polyurethane compounds having the following general structure (R03-17-2011
20110086311BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION - A photosensitive resin composition which is excellent in resolution, low in cost, and usable in a wide range of structures of polymer precursors each of which is reacted into a final product by a basic substance or by heating in the presence of a basic substance. The photosensitive resin composition includes a base generator which has a specific structure and generates a base by exposure to electromagnetic radiation and heating, and a polymer precursor which is reacted into a final product by the base generator and by a basic substance or by heating in the presence of a basic substance.04-14-2011
20100015551NOVEL EPOXY COMPOUND, ALKALI-DEVELOPABLE RESIN COMPOSITION, AND ALKALI-DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION - An novel epoxy compound is represented by the general formula (I) and has a benzo- or naphtho-cycloalkane skeleton:01-21-2010
20110070543Aqueous Base-Developable Negative-Tone Films Based On Functionalized Norbornene Polymers - Embodiments in accordance with the present invention encompass negative-tone, aqueous base developable, self-imageable polymer compositions useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays.03-24-2011
20100068648PHOTOSENSITIVE RESIN COMPOSITION, AND RESIST PATTERN FORMATION METHOD USING THE SAME - A photosensitive resin composition capable of controlling occurrence of defects and capable of forming a resist pattern having a favorable configuration, and a method for forming a resist pattern using the same are provided. According to a photosensitive resin composition including, as component (a), a polyfunctional epoxy resin, and, as component (b), a cation polymerization initiator, in which the concentration of propylene carbonate in the photosensitive resin composition is no greater than 10% by mass, the occurrence of defects can be controlled, and a resist pattern having a favorable shape can be formed.03-18-2010
20110117498PHOTOSENSITIVE RESIN COMPOSITION - Disclosed herein is a photosensitive resin composition which exhibits proper optical density and hydrophobicity when it is formed into a light-shielding film, and which is useful in preventing the color mixing or position deviation of color ink when the color ink is charged in a region defined by a light-shielding film.05-19-2011
20100151386PHOTOBASE GENERATOR AND PHOTOCURABLE RESIN COMPOSITION - Disclosed is a photobase generator comprising a compound having a nitrogen atom and a conjugated multiple bond.06-17-2010
20110097668NEGATIVE TONE MOLECULAR GLASS RESISTS AND METHODS OF MAKING AND USING SAME - The various embodiments of the present disclosure relate generally to resists and, more particularly, to negative tone molecular glass resists, and their associated methods of fabrication and use. In one embodiment of the present invention, a negative tone molecular glass-based resist comprises: a molecular glass, comprising, a molecular glass core, wherein the molecular glass core is not a polymer chain, and a functional group bound to the molecular glass core and configured to provide a decrease in solubility of the molecular glass; and an initiating component configured to produce a reactive species upon exposure to radiation, wherein the reactive species facilitates the decrease in solubility of the molecular glass.04-28-2011
20120308930PATTERNING PROCESS AND RESIST COMPOSITION - A negative pattern is formed by applying a resist composition onto a substrate, prebaking, exposing to high-energy radiation, baking (PEB), and developing the exposed resist film in an organic solvent developer to dissolve the unexposed region of resist film. The resist composition comprising a polymer comprising recurring units having an acid labile group-substituted carboxyl group and/or hydroxy group and recurring units having an oxirane or oxetane ring, an acid generator, and an organic solvent displays a high dissolution contrast in organic solvent development and controlled acid diffusion. A fine hole pattern featuring good size control can be formed.12-06-2012
20130224656RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition including a base component which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, and an organic solvent component, the base component containing a resin component having a structural unit which generates acid, and the organic solvent component containing an organic solvent component including a compound represented by general formula (s-1) shown below in which X represents a single bond or an alkylene group of 1 to 3 carbon atoms; and n represents an integer of 0 to 3.08-29-2013
20110076616LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PLATE MAKING METHOD OF LITHOGRAPHIC PRINTING PLATE - A lithographic printing plate precursor, comprising a support having thereon an image-recording layer containing (A) an infrared absorbing agent, (B) a radical polymerization initiator, (C) a radical polymerizable compound, (D) a polymer compound containing a polyoxyalkylene structure and (E) an ultraviolet absorbing agent and being capable of forming an image by supplying at least one of printing ink and dampening water on a printing machine after imagewise exposure to remove an unexposed area of the image-recording layer.03-31-2011
20100129753ALKALI-DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION AND BETA-DIKETONE COMPOUND - An alkali developable photosensitive resin composition contains (J) a photopolymerizable unsaturated compound having a structure resulting from the addition reaction of (B) a compound having a β-diketone moiety or a compound having a β-ketoester group to the (meth)acryloyl group of (A) a compound having at least two (meth)acryloyl groups and a hydroxyl group and subsequent esterification of the hydroxyl group of the resulting addition product with (C) a polybasic acid anhydride. The compound having a β-diketone moiety is preferably a novel β-diketone compound represented by general formula (I):05-27-2010
20120122031PHOTORESIST COMPOSITION FOR NEGATIVE DEVELOPMENT AND PATTERN FORMING METHOD USING THEREOF - The present invention relates to a photoresist composition capable of negative development and a pattern forming method using the photoresist composition. The photoresist composition includes an imaging polymer and a radiation sensitive acid generator. The imaging polymer includes a first monomeric unit having a pendant acid labile moiety and a second monomeric unit containing a reactive ether moiety, an isocyanide moiety or an isocyanate moiety. The patterning forming method utilizes an organic solvent developer to selectively remove unexposed regions of a photoresist layer of the photoresist composition to form a patterned structure in the photoresist layer. The photoresist composition and the pattern forming method are especially useful for forming material patterns on a semiconductor substrate using 193 nm (ArF) lithography.05-17-2012
20100068650POSITIVE-WORKING RADIATION-SENSITIVE COMPOSITION AND METHOD FOR RESIST PATTERN FORMATION USING THE COMPOSITION - A method of patterning using double exposure patterning in a liquid immersion lithographic process is provided. The patterning method comprises a step of forming a first pattern on a substrate using a first resist layer forming composition, a step of making the first pattern inactive, a step of forming a second pattern on a substrate on which a pattern has been formed using a second resist layer forming composition and exposing the second resist layer to radiation, and a step of developing the exposed resist layer to form a second pattern in the space area of the first pattern. The first resist layer forming composition contains a cross-linking agent which accelerates conversion of the first layer from positive-working to negative-working.03-18-2010
20110104614Self-imageable film forming polymer, compositions thereof and devices and structures made therefrom - Embodiments in accordance with the present invention encompass self-imageable film forming compositions that comprise norbornene-type polymers and that can be formulated to be either positive tone imaging or negative tone. The films formed thereby are useful in the forming of microelectronic and optoelectronics devices.05-05-2011
20100248139PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PRINTING PLATE, AND METHOD FOR PRODUCING PRINTING PLATE - A printing plate precursor for laser engraving, including a relief forming layer including a cured resin material formed by thermally crosslinking a resin composition including at least (A) non-porous inorganic particles, (B) a binder polymer having a glass transition temperature (Tg) of 20° C. or higher, and (C) a crosslinking agent.09-30-2010
20100248141LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PLATE MAKING METHOD THEREOF - A lithographic printing plate precursor includes a support and an image-recording layer, a non-image area of the image-recording layer is capable of being removed by supplying printing ink and dampening water, and the image-recording layer contains (A) a compound containing two or more isocyanuric acid skeletons each having at least one substituent containing a hydroxy group, (B) an infrared absorbing agent, (C) a radical initiator and (D) a radical polymerizable compound.09-30-2010
20100248140LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PLATE MAKING METHOD THEREOF - A lithographic printing plate precursor includes an aluminum support subjected to a roughening treatment and an image-recording layer containing an infrared absorbing agent, a radical polymerization initiator, a radical polymerizable monomer, a compound having two or more mercapto group-containing groups per molecule and a polymer particle containing a polyalkylene oxide segment.09-30-2010
20100209847COPOLYMER, RESIN COMPOSITION, SPACER FOR DISPLAY PANEL, PLANARIZATION FILM, THERMOSETTING PROTECTIVE FILM, MICROLENS, AND PROCESS FOR PRODUCING COPOLYMER - Without the use of a third monomer, no copolymer practicable as a base polymer for a radiation-sensitive resin composition has been obtained by copolymerizing two ingredients, i.e., a carboxylated monomer and an epoxidized monomer. A carboxylated monomer is reacted with a specific nonpolymerizable compound, and this reaction mixture is then copolymerized with an epoxidized monomer. A radiation-sensitive resin composition and a thermosetting resin composition each containing the resultant copolymer have satisfactory storage stability and are useful as a spacer for liquid-crystal display panels, etc., a planarization film for TFT elements, and a protective film for color filters.08-19-2010
20120219904RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition contains (A1) a resin having a structural unit represented by the formula (I), (A2) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, and (B) an acid generator represented by the formula (II).08-30-2012
20120171614Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a dissolution controlling agent including the compound represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, and a photosensitive resin film prepared by using the same.07-05-2012
20120251945PHOTORESIST COMPOSITION - The present invention provides a photoresist composition containing: a resin which contains a structural unit derived from a compound having an acid-labile group and which is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid; an acid generator and a compound represented by the formula (I):10-04-2012
20100009289RESIST SENSITIZER - Methods and compositions for enhancing the sensitivity of a resist composition are disclosed. In one aspect, compositions for use with a matrix material (e.g., a lithographically sensitive polymeric material) can be formulated with an acid generator and a sensitizer, where the sensitizer can be present in a relatively small amount. The sensitizer can include a compound with one or more silicon-silicon bonds, and can act to enhance the efficiency of acid generation when the resist is impinged by a selected lithographic radiation. The methods of the present invention can be especially useful in performing short wavelength (e.g., less than 200 nm) lithography, or for processes such as e-beam lithography, which traditionally suffer from low throughput.01-14-2010
20120258401RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resist composition contains (A) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, (B) an acid generator represented by the formula (II), and (D) a compound represented by the formula (I),10-11-2012
20120264054PATTERN FORMING METHOD, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM - Provided is a pattern forming method that is excellent in resolving power such as pre-bridging dimension, a roughness performance such as line edge roughness, and development time dependency, and an actinic-ray-sensitive or radiation-sensitive resin composition and a resist film used for the pattern forming method.10-18-2012
20110123928Photosensitive Resin Composition and Pattern Forming Method Using the Same - Problem: Providing a photosensitive resin composition that has high sensitivity, sustains a slight shrinkage in volume when cured under heating and can form resist patterns having high-aspect profiles, and a pattern forming method using such a composition.05-26-2011
20080311511PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND METHOD FOR PATTERN FORMING - A photosensitive resin composition, a photosensitive resin laminate, and a method for forming a pattern capable of realizing high hardness while using an epoxy group-containing acrylic resin are provided. In a photosensitive resin composition including (A) an epoxy group-containing acrylic resin, (B) a photopolymerization initiator, and (C) a sensitizer, an onium salt having a specific structure is used as the component (B), and at least one kind selected from 1,5-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and 2,6-dihydroxynaphthalene is used as the component (C).12-18-2008
20120264055PHOTORESIST COMPOSITION - The present invention provides a photoresist composition comprising a salt represented by the formula (I):10-18-2012
20130017488Self-Imageable Layer Forming Polymer and Compositions Thereof - Copolymers and compositions thereof useful for forming self-imageable films encompassing such copolymers are disclosed. Such copolymers encompass norbornene-type repeating units and maleic anhydride-type repeating units where at least some of such and maleic anhydride-type repeating units have been ring-opened. The films formed from such copolymer compositions provide self imageable, low-k, thermally stable layers for use in microelectronic and optoelectronic devices.01-17-2013
20080241742SURFACE-TREATING AGENT FOR PATTERN FORMATION AND PATTERN-FORMING METHOD USING THE SURFACE-TREATING AGENT - A surface-treating agent for forming a resist pattern, includes: a compound represented by formula (1) as defined in the specification, wherein the surface-treating agent is used in a step between a formation of a first resist pattern on a first resist film and a formation of a second resist film on the first resist pattern to form a second resist pattern, and a pattern-forming method uses the surface-treating agent.10-02-2008
20080233515RADIATION SENSITIVE RESIN COMPOSITION FOR FORMING A PROTECTIVE FILM, METHOD OF FORMING A PROTECTIVE FILM FROM THE COMPOSITION, LIQUID CRYSTAL DISPLAY DEVICE AND SOLID-STATE IMAGE SENSING DEVICE - A radiation sensitive resin composition for forming a protective film, comprising: 09-25-2008
20130177849EPOXY RESIN COMPOSITION HAVING MONOCYCLIC ALIPHATIC HYDROCARBON RING - There is provided a curable composition having a low viscosity and high cationic curability. A curable composition including an epoxy compound of Formula (1):07-11-2013
20130143158Photosensitive Resin Composition for Color Filter and Color Filter Including the Same - Disclosed is a photosensitive resin composition for a color filter that includes (A) an acrylic-based copolymer including a structural unit represented by the following Chemical Formula 1, wherein R06-06-2013
20130101936POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS - A positive resist composition comprising (A) a polymer comprising recurring units containing an acid labile group, recurring units having a lactone ring, and recurring units having an oxirane ring, the polymer being adapted to increase alkaline dissolution under the action of an acid, (B) a photoacid generator, and (C) a solvent forms a fine pattern with improved LWR, improved MEF, rectangular profile, and collapse resistance.04-25-2013
20130101937MODIFIED NOVOLAK PHENOLIC RESIN, MAKING METHOD, AND RESIST COMPOSITION - A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.04-25-2013
20110236830Lithographic printing plate for in-solidus development on press - A printing plate having a substrate and a radiation sensitive, negative working, organic, polymerizable, photosensitive (PS) resin coating non-ionically adhered to the substrate such that the cohesion of the PS coating exceeds the adhesion of the PS coating to the substrate. The PS coating contains active components that participate in radiation induced polymerization, all of which active components are soluble in non-aqueous solvents and none of which active components are soluble or dispersible in any of the group of fluids consisting of water, fountain solution, ink, and press ink. The PS coating has sufficient cohesion and surface tack to adhere to and be mechanically pulled off the substrate by press ink as particulates without dissolution or dispersion into the press ink.09-29-2011
20130149645CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM - A chemically amplified negative resist composition is provided comprising (A) a resin having a crosslinking group, (B) a crosslinker, (C) a photoacid generator capable of generating an acid upon exposure to light of wavelength 190-500 nm, (D) a solvent, and (E) an isocyanuric acid. The resist composition overcomes the stripping problem that the film is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates.06-13-2013
20100203448METHOD FOR MANUFACTURING PRINTING PLATE AND PRINTING PLATE-FORMING PHOTOCURABLE LIQUID FOR MANUFACTURING - A method for manufacturing a printing plate includes applying a printing plate-forming photocurable liquid containing an epoxy-modified fatty acid ester and/or an acrylic-modified fatty acid ester and a photopolymerization initiator onto a printing original plate to form an uncured coating, selectively irradiating the uncured coating with UV light to cure part of the coating, and removing the uncured portion of the coating.08-12-2010
20130244177PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER AND LIQUID CRYSTAL DISPLAY DEVICE - A photosensitive resin composition is provided, which comprises an alkali-soluble resin (A), a polysiloxane polymer (B), a compound containing vinyl unsaturated group(s) (C), a photoinitiator (D), a solvent (E), a black pigment (F) and a light stabilizer (G). The alkali-soluble resin (A) includes a resin having unsaturated group(s) (A-1), which is obtained by reacting an epoxy compound having at least two epoxy groups (a-1) with a compound having at least one vinyl unsaturated group and carboxyl group (a-2). The light stabilizer (G) includes a UV absorber (G-1) and/or a hindered amine (G-2). Therefore, the photosensitive resin composition has an excellent temporal stability, and a black matrix formed by such composition has a better heat resistance.09-19-2013
20130244176RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN - A resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid, an acid-generator component (B) which generates acid upon exposure and an organic solvent component (S), the organic solvent component (S) containing an organic solvent (S1) including a compound represented by general formula (s-1) shown below and the acid-generator component (B) being an onium salt (in the formula, X represents a single bond or an alkylene group of 1 to 3 carbon atoms; and n represents an integer of 0 to 3).09-19-2013
20130244175LITHOGRAPHIC PRINTING PLATE PRECURSORS AND METHODS OF USE - Lithographic printing plates are prepared from lithographic printing plate precursors that have an imageable layer comprising hydrophobic thermosetting particles that comprise a curable composition having certain properties. Upon exposure to imaging radiation such as infrared radiation, the hydrophobic thermosetting particles are cured and fused to each other and to the substrate. Such particles can be readily removed in the non-exposed regions of the imageable layer by dry rubbing or other simple processes without the use of alkaline developers or gumming solutions.09-19-2013
20130189624NOVEL PHOTOSENSITIVE RESIN COMPOSITION PRODUCTION KIT, AND USE THEREOF - The object of the present invention is to provide a photosensitive resin composition which is excellent in: storage stability in a long-term storage; microfabricability; developability; low-temperature curability; flexibility in a cured film; electrical insulation reliability; solder heat resistance; resistance to an organic solvent; and flame retardancy and low in post-curing warpage when processed into a substrate. The object can be attained by use of a photosensitive resin composition production kit which includes at least two or more components including an A component and a B component. The A component contains a (A) compound having a carboxyl group. The B component contains a (B) compound having a reactive group which is reactive to a carboxyl group, a (C) oxime ester photopolymerization initiator, and a (D) compound having a photosensitive group but no carboxyl group.07-25-2013
20100173246POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING CURED FILM USING THE SAME - The present invention provides a positive photosensitive resin composition including: a resin containing a specific acrylic acid-based constituent unit capable of undergoing dissociation of an acid-dissociable group to produce a carboxyl group, and a constituent unit having a functional group capable of reacting with the carboxyl group to form a covalent bond, the resin being alkali-insoluble or sparingly alkali-soluble and becoming alkali-soluble when the acid-dissociable group dissociates; and a compound capable of generating an acid upon irradiation with an actinic ray or radiation. The present invention also provides a method for forming a cured film using the composition. The positive photosensitive composition is excellent in the sensitivity, film residual ratio and storage stability and by the method for forming a cured film using the positive photosensitive resin composition, a cured film excellent in the heat resistance, adhesion, transmittance and the like can be provided.07-08-2010
20120070780PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM SOLDER RESIST, AND CIRCUIT BOARD - The present invention relates to a photosensitive resin composition including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, and a thioxanthone compound, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist.03-22-2012
20120082933FORMULATIONS FOR ENVIRONMENTALLY FRIENDLY PHOTORESIST FILM LAYERS - Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.04-05-2012
20120088189CONDUCTIVE COMPOSITION, TRANSPARENT CONDUCTIVE FILM, DISPLAY ELEMENT AND INTEGRATED SOLAR BATTERY - To provide a conductive composition including: a binder, a photosensitive compound, metal nanowires, and a solvent, wherein the solvent has a solubility parameter value of 30 MPa04-12-2012
20100167205THERMALLY CURABLE SOLDER RESIST COMPOSITION - A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R07-01-2010
20100167204RADIATION-SENSITIVE INSULATION RESIN COMPOSITION, CURED ARTICLE, AND ELECTRONIC DEVICE - A radiation-sensitive insulation resin composition contains (A) an alkali-soluble resin, (B) a crosslinking agent, (C) a radiation-sensitive acid generator, (D) an inorganic filler, and (E) crosslinked rubber particles. The composition can be developed using an alkali developer, does not incur damages in insulating properties and resolution properties, suppresses thermal deformation, and can produce a layer exhibiting excellent adhesion to conductor wiring layers.07-01-2010

Patent applications in class Radiation sensitive composition comprising oxirane ring containing component