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IMAGING AFFECTING PHYSICAL PROPERTY OF RADIATION SENSITIVE MATERIAL, OR PRODUCING NONPLANAR OR PRINTING SURFACE - PROCESS, COMPOSITION, OR PRODUCT

Subclass of:

430 - Radiation imagery chemistry: process, composition, or product thereof

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
430270100 Radiation sensitive composition or product or process of making 1668
430322000 Forming nonplanar surface 690
430311000 Making electrical device 464
430300000 Making printing plates 147
430320000 Making named article 133
430296000 Electron beam imaging 106
430327000 Processing feature prior to imaging 13
430331000 Finishing or perfecting composition or product 10
430329000 Removal of imaged layers 5
20110200951METHOD FOR REMOVING PHOTORESIST PATTERN - Disclosed is a method of removing a photoresist pattern, which includes radiating light onto a substrate having a photoresist pattern formed thereon and implanted with a predetermined dopant so that the temperature of the substrate is increased to be equal to or higher than a temperature able to remove the photoresist pattern, and by which the photoresist pattern formed on the substrate can be almost completely removed using a simple process for radiating light onto the substrate so that the temperature of the substrate is increased to be equal to or higher than a temperature able to the photoresist pattern.08-18-2011
20080241766METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - To overcome the limitations to development of photosensitive layers in a lithography process using a light source such as KrF, ArF, VUV, EUV, E-beam, ion beam, etc., and a patterning process of a large circuit board or a bending substrate, the invention provides a method for manufacturing a semiconductor device in which the photosensitive layer comprises a thermal acid generator that is reacted with heat to form an acid, and a masking process in a lithography process using a light source is performed as a heat conduction process using a thermally conductive pattern so that a patterning process is performed easily without limiting the size and shape of a semiconductor substrate.10-02-2008
20080280235Non-Aqueous Photoresist Stripper That Inhibits Galvanic Corrosion - Photoresist strippers and cleaning compositions of this invention are provided by non-aqueous, non-corrosive cleaning compositions that resist galvanic corrosion when used on stacked layer structures of different types of metals at a surface of an electronic device. Such non-aqueous photoresist strippers and cleaning compositions comprise: (a) at least one polar organic solvent, (b) at least one di or polyamine having both at least one primary amine group and one or more secondary and/or tertiary amine groups, and having the formula wherein R11-13-2008
20080286701METHOD FOR KINETICALLY CONTROLLED ETCHING OF COPPER - An etching composition, particularly for kinetically controlled etching of copper and copper alloy surfaces; a process for etching copper and copper alloys, particularly for etching at high rates to provide uniform and smooth, isotropic surfaces; an etched copper or copper alloy surface obtained by the process; and a process for generating copper or copper alloy electrical interconnects or contact pads. The etching composition and etching processes provide a smooth, isotropic fast etch of copper and copper alloys for semiconductor fabrication and packaging.11-20-2008
20120077132PROCESSESS AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES - Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.03-29-2012
430290000 Light scattering or refractive index image formation 4
20100003619SYSTEMS AND METHODS FOR FABRICATING THREE-DIMENSIONAL OBJECTS - Systems and methods for fabricating three-dimensional objects. The system includes an optical imaging system providing a light source; a photosensitive medium adapted to change states upon exposure to a portion of the light source from the optical imaging system; a control system for controlling movement of the optical imaging system, wherein the optical imaging system moves continuously above the photosensitive medium. The method includes moving a maskless optical imaging system providing the light beam in a continuous sequence; presenting the light beam on a portion of the photosensitive medium; lowering a plate upon which the photosensitive medium resides; and applying a new layer of the photosensitive medium.01-07-2010
20090269702METHOD FOR INTRODUCING INCLUSION IMAGE INTO GEMSTONE - A gemstone having an image formed by a manufactured color inclusion and method for making same. The gemstone is of a type that is heat sensitive and undergoes a color phase transformation upon heat treatment. The image is formed by tracing a focused laser beam along a linear trail within the interior of the gemstone so as to heat the linear trail for precipitating the color phase transformation and creating the color inclusion. The image is formed by the newly formed color inclusion.10-29-2009
20090111055METHOD OF FORMING AN IMAGE HAVING MULTIPLE PHASES - A method of forming an image having multiple phases is disclosed herein. The method includes forming exposed and unexposed areas, the exposed areas comprising a first polymer network exhibiting first and second phases that are chemically connected and have different refractive indices, the first phase being continuous, and the second phase comprising a plurality of structures dispersed within the first phase, and the unexposed areas comprising a second polymer network comprising third and fourth phases that are chemically connected and have different refractive indices, the third phase being continuous, and the fourth phase comprising a plurality of structures dispersed within the third phase. The first and second polymer networks are chemically connected, and morphology formed by the first and second phases is different than that formed by the third and fourth phases.04-30-2009
20110091813DYNAMIC PROJECTION METHOD FOR MICRO-TRUSS FOAM FABRICATION - A system for fabricating a radiation-cured component is provided. The system includes a radiation-sensitive material configured to at least one of initiate, polymerize, crosslink and dissociate with exposure to radiation, and at least one radiation source configured to project a radiation beam with a vector that does not intersect the radiation-sensitive material. The system further includes a radiation directing device that is selectively positionable to reflect the radiation beam in a desired direction and exposure the radiation-sensitive material to the radiation beam. A method for fabricating the radiation-cured components is also provided.04-21-2011
430330000 Including heating 1
20110143289SUBSTRATE PROCESSING METHOD, COMPUTER-READABLE STORAGE MEDIUM AND SUBSTRATE PROCESSING SYSTEM - A PEB unit has a first heat plate and a second heat plate. After an exposure process for a resist film for EUV on a wafer and before a development process, the PEB unit heats the wafer through the first heat plate at a first heating temperature. A heating time through the first heat plate is not less than 10 seconds and not more than 30 seconds. Thereafter, the PEB unit heats the wafer through the second heat plate at a second heating temperature lower than the first heating temperature. A temperature difference between the first heating temperature and the second heating temperature is not less than 20° C. and not more than 60° C.06-16-2011
Entries
DocumentTitleDate
20110183257LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - In an immersion lithographic apparatus, bubble formation in immersion liquid is reduced or prevented by reducing a gap size or area on a substrate table and/or covering the gap.07-28-2011

Patent applications in all subclasses IMAGING AFFECTING PHYSICAL PROPERTY OF RADIATION SENSITIVE MATERIAL, OR PRODUCING NONPLANAR OR PRINTING SURFACE - PROCESS, COMPOSITION, OR PRODUCT