Class / Patent application number | Description | Number of patent applications / Date published |
428473500 | Of polyimide | 40 |
20080213605 | Multi-functional circuitry substrates and compositions and methods relating thereto - The invention is directed to substrates for electronic circuitry. The substrates of the invention have a first polyimide layer having a functional filler and a second polyimide layer having a functional filler. The first layer is non-identical to the second layer, and a surface of the first layer is in contact with and is directly bonded to a surface of the second layer. Filler from each layer extends into the interface between the two layers, and a plurality of covalent bonds are present between the first and second functional layers that chemically bond the two layers together to provide a reliable, predictable multifunctional substrate for electronic circuitry with improved performance relative to polyimide layers bonded together by an adhesive. | 09-04-2008 |
20080299402 | Polyimide film, polyimide metal laminate and process for producing the same - The present invention relates to a polyimide-metal laminate that ensures a high adhesion of a metal layer and suitable for use as a material of a high density circuit board. In particular, it provides a polyimide film characterized by having undergone a surface treatment with an alkaline aqueous solution containing a permanganate. The alkaline aqueous solution preferably contains a hydroxide. It also provides a polyimide-metal laminate characterized in that on a surface of the polyimide film a thermoplastic polyimide layer and a metal layer are formed, and a method of producing the polyimide-metal laminate. | 12-04-2008 |
20080305346 | Adhesive Film and Use Thereof - Disclosed in an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a highly heat resistant polyimide and an adhesive layer which is formed on at least one surface of the heat-resistant layer and contains a thermoplastic polyimide. In this adhesive film, the thermal shrinkage ratio in the TD direction is not less than +0.01%, and the thermal shrinkage ratio in the MD direction is not more than −0.02%. Consequently, when a metal layer and the adhesive film are bonded together by heat roll lamination and the resulting laminate is subjected to a treatment with heating, occurrence of dimensional changes can be sufficiently suppressed. | 12-11-2008 |
20090011262 | THERMALLY CURABLE COMPOSITE RESIN COMPOSITION, PREPREG, COMPOSITE FILM AND LAMINATED MATERIAL FOR CIRCUIT HAVING THE SAME - The present invention relates to a prepreg, a composite film, and a laminated material for circuit used for thermosetting composite resin compositions and printed circuit boards, and particularly to a thermosetting composite resin composition mixed with COP (Cyclo Olefin Polymer) and thermally cross-linkable resin, wherein the COP having excellent electrical characteristics at a high frequency and thermally cross-linkable resin are blended to allow having a less dielectric constant and a less dielectric loss than those of the conventional composite resin composition, and inorganic fillers such as ceramic material, metal material, carbon black are added to allow having dielectric characteristics covering from a low dielectric constant to a high dielectric constant. | 01-08-2009 |
20090068482 | POLYIMIDE RESIN, POLYIMIDE FILM, AND POLYIMIDE LAMINATE - A polyimide resin composed of a repeating unit represented by the following formula (1): | 03-12-2009 |
20090104465 | Process for Producing Multilayered Polyimide Film - It is an object of the present invention to provide a method for manufacturing a multilayer polyimide film, uniform in film thickness and rate of dimensional change in the width direction of the film, which has a thermoplastic polyimide layer or the like serving as an adhesive layer. The object is attained by a method for manufacturing a multilayer polyimide film by width-spreading and flow-casting at least two types of polyimide resin solutions or polyimide precursor resin solutions fed into a multilayer coextrusion die including a plurality of flow channels, the method being characterized in that the thickness of each layer of the multilayer film is controlled by adding a solvent to the resin solutions to be fed into at least one of the flow channels and by adjusting, independently of the amounts of the resin solutions to be fed, the amount of the solvent to be added. | 04-23-2009 |
20090155610 | Heat-resistant adhesive sheet - It is an object of the present invention to provide a heat-resistant adhesive sheet for suppressing fluctuation in dimensional stability of a flexible printed board or, in particular, of a two-layer flexible printed board which has recently been increasingly demanded and which is required to be more highly heat-resistant and reliable. The foregoing problems can be solved by a heat-resistant adhesive sheet having a heat-resistant adhesive layer, containing a thermoplastic polyimide, which is provided on at least one surface of an insulating layer containing a non-thermoplastic polyimide, the heat-resistant adhesive sheet having a stretching of not more than 10 mm at one side thereof. | 06-18-2009 |
20090169905 | COMPOSITION CONTAINING FLUORINE-CONTAINING AROMATIC POLYMER AND LAMINATED BODY CONTAINING FLUORINE-CONTAINING AROMATIC POLYMER - A composition comprises a fluorine-containing aromatic polymer, an epoxy compound and an initiator. Its use as film, laminate with polyimide or copper foils, copper-clad laminated board and adhesive film. The fluorine-containing aromatic polymer is preferably a fluorine-containing aryl ether polymer. The initiator is preferably a cationic initiator. | 07-02-2009 |
20090197105 | NANOPARTICULATE WAX DISPERSIONS, PROCESS FOR PREPARING THEM AND METHOD OF HYDROPHOBICIZING MATERIALS USING THEM - The invention provides nanoparticulate wax dispersions comprising wax solids having a solidification point of greater than 40 to 150° C., a process for preparing them, and a method of hydrophobicizing materials produced using fibres, chips or strands comprising or consisting of lignocelluloses and/or celluloses, by contacting them with the wax dispersions. | 08-06-2009 |
20100062272 | TRANSPARENT PART - A transparent component, which comprises the following subcomponents:
| 03-11-2010 |
20100062273 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME - A photosensitive resin composition includes an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate [A] (%) at 250° C. to a cyclization rate [B] (%) at 300° C. of 0.70 or more. According to the present invention, a photosensitive resin composition which is highly sensitive and has high productivity in the manufacture of semiconductor devices, a cured film, a protective film, an insulating film, and a semiconductor device and a display device using the cured film can be provided. | 03-11-2010 |
20100167073 | ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME - The present invention relates to an adhesive film comprising a polyimide resin (A) and a thermosetting resin (B), wherein the polyimide resin (A) comprises a polyimide resin having a repeating unit represented by a formula (I) shown below, and the storage elastic modulus of the adhesive film at 250° C., following heat treatment at a temperature of 150 to 230° C. for a period of 0.3 to 5 hours, is not less than 0.2 MPa: | 07-01-2010 |
20100196729 | Autoclave Cure Cycle Design Process and Curing Method - Method includes forming a preform utilizing a polyimide resin-impregnated fiber-reinforced layers; removing solvent from the system at initial vacuum, pressure, and temperature conditions for an initial time interval sufficient to remove substantially all the solvent; imidizing the polyimide resin system under second vacuum, pressure, and temperature conditions for a second time interval sufficient to substantially completely imidize the polyimide resin; consolidating the preform following imidization under third vacuum, pressure, and temperature conditions and including applying pressure to the preform when the preform is at a predetermined temperature; and solidifying the preform under fourth vacuum, pressure, and temperature conditions to provide a cured laminate structure having a shape of a turbine engine component. A method is provided for designing the polyimide resin overall cure cycle dependent on the desired outcome at the solvent removal stage, the imidization stage, the consolidation stage, and the solidification stage. | 08-05-2010 |
20100221563 | Metal Covered Polyimide Composite, Process for Producing the Composite, and Process for Producing Electronic Circuit Board - Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. The provided metal covered polyimide composite can effectively prevent peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), particularly can effectively inhibit peeling from the interface of a copper layer and tin plating. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board. | 09-02-2010 |
20100255325 | PLASTIC ARTICLES, OPTIONALLY WITH PARTIAL METAL COATING - Disclosed herein is a type of two-shot molded article, comprising a metallizable composition and a less-metallizable composition, that can be partially coated with metal, as well as methods of making the articles. | 10-07-2010 |
20100279131 | POLYIMIDE FILM WITH IMPROVED THERMAL STABILITY - Disclosed is a polyimide film having superior thermal stability, in which the degree of change depending on variation in temperature is minimized. | 11-04-2010 |
20100297456 | Diamine, Polyamic Acid and Polyimide - Disclosed is a diamine represented by a general formula of: | 11-25-2010 |
20110183149 | OPTICAL FILM AND METHOD OF PREPARING SAME - The present invention relates to an optical film and method of manufacturing the same. The optical film of the present invention includes an acrylic resin and a core-shell type graft copolymer wherein the core includes a conjugate diene rubber, and the shell includes an acrylic monomer, an aromatic vinyl monomer, and a maleimide monomer. | 07-28-2011 |
20110195262 | METHOD FOR FORMING A MULTILAYER PAINT FILM - An object of the present invention is to provide a method of forming a multilayer coating film having excellent smoothness, distinctness of image, water resistance and chipping resistance. The present invention provides a method of forming a multilayer coating film by successively applying an aqueous intermediate coating composition, an aqueous base coating composition and a clear coating composition to a substrate; and simultaneously heat-curing the resulting intermediate coating, base coating, and clear coating, wherein the aqueous intermediate coating composition comprises as a resin component a hydroxy- and carboxy-containing polyester resin (A) having a hydroxy value in the range of 60 to 200 mgKOH/g, an acid value in the range of 10 to 60 mgKOH/g, and a number average molecular weight in the range of 700 to 5,000; a melamine resin (B) having a weight average molecular weight in the range of 500 to 4,000; and a polycarbodiimide compound (C). | 08-11-2011 |
20120028060 | MULTILAYER BACKSHEET FOR PHOTOVOLTAIC MODULES, AND ITS PRODUCTION AND USE IN THE PRODUCTION OF PHOTOVOLTAIC MODULES - A multilayer backsheet ( | 02-02-2012 |
20120028061 | POLYIMIDE FILM FOR METALLIZING, METHOD FOR PRODUCING SAME, AND METAL-LAMINATED POLYIMIDE FILM - The present invention provides a polyimide film for metallizing, which has an anisotropic thermal expansion coefficient, and comprises a polyimide layer (b) and a polyimide layer (a) on one side or both sides of the polyimide layer (b); wherein
| 02-02-2012 |
20120034479 | ENDLESS BELT FOR ELECTROPHOTOGRAPHIC DEVICE - An endless belt for an electrophotographic device having high degrees of flexibility and wear resistance in a surface portion of the elastic layer is provided. The endless belt for an electrophotographic device, includes a base layer, and an elastic layer which is formed on a surface of the base layer, by using a rubber composition including at least one rubber material and at least one inorganic filler in which the elastic layer has 40-75% by mass of a total organic component, and a product P of an indentation Young's modulus (MPa) α and a fracture strain (%) β that is within a range of 6000-50000. | 02-09-2012 |
20120171503 | CARRIER FOR HOLDING NUCLEIC ACID - A solid support for maintaining a uniform spot shape while improving the capacity for immobilization of nucleic acids upon spotting of nucleic acids onto a solid support is provided. A substrate has a base material, an electrostatic layer formed on the base material in order to electrostatically attract nucleic acids, and carboxyl groups formed on the electrostatic layer, wherein the ratio, (COO peak intensity)/(C—C peak intensity) in the C1s spectra obtained by X-ray photoelectron spectrometry (XPS) performed for the surface of the substrate ranges from 0.10 to 0.20. The solid support for immobilizing nucleic acids is produced by active esterification of carboxyl groups of the substrate. | 07-05-2012 |
20120202081 | LIGHT-BLOCKING MEMBER FOR OPTICAL INSTRUMENT - A light-blocking member for optical instruments having improved abrasion resistance and adhesiveness while having high sliding properties and maintaining physical properties of a light-shielding layer, such as light-shielding properties and delustering properties, is provided. A light-blocking member for optical instruments can include a film substrate | 08-09-2012 |
20120315498 | LAMINATE STRUCTURE, METHOD FOR MANUFACTUING LAMINATE STRUCTURE, ELECTRONIC ELEMENT ARRAY, IMAGE DISPLAYING MEDIUM, IMAGE DISPLAYING APPARATUS, DIAMINE, POLYAMIC ACID, AND POLYIMIDE - Disclosed is a laminate structure including a substrate, a wettability changing layer, and an electrical conductor layer, wherein the wettability changing layer and the electrical conductor layer are laminated on the substrate in order, wherein the wettability changing layer contains a polyimide, wherein the polyimide is obtainable by dehydrating and ring-opening a polyamic acid, wherein the polyamic acid is obtainable by ring-opening and addition-polymerizing a diamine and a tetracarboxylic acid dianhydride, wherein the diamine includes a compound represented by a general formula of: | 12-13-2012 |
20130029166 | MATTE FINISH POLYIMIDE FILMS AND METHODS RELATING THERETO - The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent having a density from 1.3 to 1.5 g/cc and either a non-carbon black pigment or a dye. The particulate polyimide matting agent is present in an amount from 1.6 to 20 weight percent of the base film. | 01-31-2013 |
20130115473 | PRODUCTION PROCESS OF POLYIMIDE FILM LAMINATE, AND POLYIMIDE FILM LAMINATE - A process for producing a polyimide film laminate includes a substrate and a polyimide film, which includes forming a coating film including a polyamic acid solution composition on the surface of a substrate to produce a laminate composed of the substrate and the polyamic acid solution composition, heating the laminate composed of the substrate and the polyamic acid solution composition at a temperature ranging from at least 150 to 200° C. for 10 minutes or longer, and then heating the heated laminate at a temperature up to 400 to 550° C. | 05-09-2013 |
20130202901 | PRINTABLE ELECTRONICS SUBSTRATE - Technologies are generally described for a structure, and method and system effective to print a metallic conductor on a substrate. In some examples, the method may include providing a substrate. The method may further include attaching a first layer including at least one metal oxide to the substrate. The method may further include attaching a second layer including a first ink to the first layer, where the first ink includes a metal. The method may further include attaching a third layer including a second ink to the second layer. The method may further include sintering the third layer to form the metallic conductor. | 08-08-2013 |
20130244046 | POLYMERIC CONTACT MEDIA - The present invention includes a polymer composition comprising a substrate comprising at least a top layer and a bottom layer in contact at one or more regions and a thermoplastic compound that impregnates the corrugated fibrous sheet material. The thermoplastic compound may have between 1-35 weight percent PVC; 1-20 weight percent PAN; 1-60 weight percent PMA; 1-20 weight percent PAI; and 2-25 weight percent PBA. For example, the composition may have about 2 weight percent PVC; 18 weight percent PAN; 45 weight percent PMA; 15 weight percent PAI; and 20 weight percent PBA. | 09-19-2013 |
20140050935 | POLYIMIDE FILM INCORPORATING POLYIMIDE POWDER DELUSTRANT, AND MANUFACTURE THEREOF - A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films. | 02-20-2014 |
20140099510 | METHODS OF MANUFACTURE OF BIS(PHTHALIMIDE)S AND POLYETHERIMIDES, AND BIS(PHTHALIMIDE)S, AND POLYETHERIMIDES FORMED THEREFROM - A method of manufacture of a bis(phthalimide) composition includes reacting, in the presence of a solvent and a catalytically active amount of an imidization catalyst selected from quaternary ammonium salts, quaternary phosphonium salts, and combinations thereof, a substituted phthalic anhydride with an organic diamine, wherein conversion to the bis(phthalimide) is 99% complete in less than 6 hours. | 04-10-2014 |
20140134445 | POLYMERIC CONTACT MEDIA - The present invention includes a polymer composition comprising a substrate comprising at least a top layer and a bottom layer in contact at one or more regions and a thermoplastic compound that impregnates the corrugated fibrous sheet material. The thermoplastic compound may have between 1-35 weight percent PVC; 1-20 weight percent PAN; 1-60 weight percent PMA; 1-20 weight percent PAI; and 2-25 weight percent PBA. For example, the composition may have about 2 weight percent PVC; 18 weight percent PAN; 45 weight percent PMA; 15 weight percent PAI; and 20 weight percent PBA. | 05-15-2014 |
20140162076 | PHOTOALIGNING MATERIAL - The present invention relates to a copolymer for the photoalignment of liquid crystals comprising a photoreactive group as given below in formula (I), compositions thereof, and its use for optical and electro optical devices, especially liquid crystal devices (LCDs). | 06-12-2014 |
20140363687 | AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION AND METHOD FOR PRODUCING AQUEOUS POLYIMIDE PRECURSOR SOLUTION - An aqueous polyimide precursor solution composition in which a polyamic acid which is obtained by reacting a tetracarboxylic acid component and a diamine component is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 moles or more per mole of the tetracarboxylic acid component of the polyamic acid. | 12-11-2014 |
20150044487 | ORIENTED-FILM-FORMING COMPOSITION - Provided is an oriented-film-forming composition that can give a laminated body which has a substrate, an oriented film and an optically anisotropic film and which is excellent in heat resistance and light resistance. The oriented-film-forming composition is a composition including an oriented-film-forming material and an antioxidant. The antioxidant is preferably a phenolic antioxidant. The oriented-film-forming material preferably contains at least one selected from the group consisting of polyimides, polyamides and polyamic acids. The composition preferably satisfies Mw(A)/Mw(B)>0.85 wherein Mw(B) represents the weight-average molecular weight of the oriented-film-forming material after the composition is heated at 100° C. for 1 hour, and Mw(A) represents that of the same material before the heating. | 02-12-2015 |
20150072162 | Methods for preparation of concentrated graphene ink compositions and related composite materials - A rapid, scalable methodology for graphene dispersion and concentration with a polymer-organic solvent medium, as can be utilized without centrifugation, to enhance graphene concentration. | 03-12-2015 |
20150086798 | COATING COMPOSITION - An endless belt comprising a polyimide-based substrate layer. The polyimide-based substrate layer is made by curing a mixture comprising a polyimide precursor and a polyalkylene glycol silicone phosphate. A method of making the polyimide-based substrate layer and a coating composition for making the endless belt are also disclosed. | 03-26-2015 |
20150292086 | LAMINATE, GAS BARRIER FILM, AND MANUFACTURING METHOD THEREFOR - A laminate ( | 10-15-2015 |
20160089831 | METHOD FOR MANUFACTURING DISPLAY APPARATUS, DISPLAY APPARATUS, AND FILM DEVICE - Prepared is a film device (FD) in which a first thermoplastic film ( | 03-31-2016 |
20180022882 | RESIN MOLDED BODY AND METHOD FOR PRODUCING SAME | 01-25-2018 |