Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Including metal layer

Subclass of:

428 - Stock material or miscellaneous articles

428098000 - STRUCTURALLY DEFINED WEB OR SHEET (E.G., OVERALL DIMENSION, ETC.)

428195100 - Discontinuous or differential coating, impregnation or bond (e.g., artwork, printing, retouched photograph, etc.)

Patent class list (only not empty are listed)

Deeper subclasses:

Entries
DocumentTitleDate
20090214839PROCESS FOR PREPARING LIGHT TRANSMISSIVE ELECTROMAGNETIC WAVE SHIELDING MATERIAL, LIGHT TRANSMISSIVE ELECTROMAGNETIC WAVE SHIELDING MATERIAL AND DISPLAY FILTER - The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method.08-27-2009
20120244326DECORATED ENAMELLED PART - The invention relates to an enamelled part (09-27-2012
20090155552IC CHIP PACKAGE SUBSTRATE HAVING OUTERMOST GLASS FIBER REINFORCED EPOXY LAYERS AND RELATED METHOD - An IC chip package having a glass reinforced outermost epoxy layers and related method are disclosed. In one embodiment, the IC chip package includes an IC chip; and a substrate coupled to the IC chip, the substrate including a glass fiber reinforced epoxy core, a plurality copper circuitry containing, particle reinforced epoxy layers symmetrically-oriented to each surface of the glass fiber reinforced epoxy core, and an outermost glass fiber reinforced epoxy layer on each surface of the plurality of layers, wherein the IC chip is coupled to copper circuitry bonded to one of the outermost glass fiber reinforced epoxy layer.06-18-2009
20090155553Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition - The present invention provides a method of manufacturing capable of readily obtaining a surface metal film material that has excellent adhesiveness of a metal film, reduced variability of adhesion due to humidity changes and excellent heat resistance and flexibility, and a method of manufacturing capable of readily obtaining a patterned metal material excellent in insulation reliability of a region where a patterned metal is not formed, and excellent in heat resistance and flexibility.06-18-2009
20100104834Foam-like structures based on reactive composite materials - Articles having porous or foam-like elements are provided. The design, fabrication and structures of the articles exploit properties of reactive composite materials (RCM) and their reaction products. In particular, fluids generated by reacting RCM are utilized to create or fill voids in the porous or foam-like elements.04-29-2010
20130089719EXTERIOR PANEL FOR IMPLEMENTING EXTERIOR OF STAINLESS STEEL AND HOME APPLIANCE INCLUDING THE SAME - Provided are an exterior panel for implementing the exterior of stainless steel and a home appliance including the external panel. The exterior panel includes a transparent layer, a first surface treatment layer, a deposition layer, and a base material layer. The transparent layer transmits light. The first surface treatment layer is formed by reforming a rear surface of the transparent layer to increase deposition characteristics. The deposition layer is formed by depositing stainless steel over the rear surface of the first surface treatment layer. The base material layer is disposed under the deposition layer.04-11-2013
20090305010LOW TEMPERATURE AMORPHOUS SILICON SACRIFICIAL LAYER FOR CONTROLLED ADHESION IN MEMS DEVICES - Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.12-10-2009
20090041994Multilayer Printed Circuit Board Structure Comprising an Integrated Electrical Component, and Production Method Therefor - The invention relates to a multilayer printed circuit board structure comprising a stack of plurality of electrically insulating and/or electroconductive layers and at least one passive or active electrical component arranged inside the stack of layers, the component extending laterally only in part of the surface extension of the stack of layers. The invention also relates to a passive or active electrical component mounted on the stack, to an associated wiring, and to a corresponding production method. According to the invention, the insert is embedded between two electrically insulating liquid resin layers or prepreg layers extending over the entire surface and covering the insert on both sides, the insert being surrounded by a resin material that is liquefied by compression or lamination of the structure. The invention structure can be used in printed circuit board technology.02-12-2009
20090291275Methods For Improving Selectivity of Electroless Deposition Processes - Methods for improving selective deposition of a capping layer on a patterned substrate are presented, the method including: receiving the patterned substrate, the patterned substrate including a conductive region and a dielectric region; forming a molecular masking layer (MML) on the dielectric region; preparing an electroless (ELESS) plating bath, where the ELESS plating bath includes: a cobalt (Co) ion source: a complexing agent: a buffer: a tungsten (W) ion source: and a reducing agent; and reacting the patterned substrate with the ELESS plating bath for an ELESS period at an ELESS temperature and an ELESS pH so that the capping layer is selectively formed on the conductive region. In some embodiments, methods further include a pH adjuster for adjusting the ELESS pH to a range of approximately 9.0 pH to 9.2 pH. In some embodiments, the pH adjuster is tetramethylammonium hydroxide (TMAH). In some embodiments, the MML is hydrophilic.11-26-2009
20090269561METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL - A method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, at least one of the polymer or the monomer having a non-dissociative functional group that interacts with a plating catalyst or a precursor thereof, forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer.10-29-2009
20090029127Method of Manufacturing Electromagnetic-Wave Shielding Plate, Electromagnetic-Wave Shielding Plate Manufactured Thereby, and Filter Display Using the Same - To provide an electromagnetic-wave shielding plate superior in an electromagnetic-wave shielding property, a light-transmitting property and non-visibility of a mesh pattern at low cost. A pattern of a resin layer is printed on a metal layer of a transparent substrate by a printing method. After that, the metal layer is over-etched with the resin layer used as an etching mask, and a part of the resin layer protruding from the remaining metal layer in a plate-surface direction is removed. As a result, an electromagnetic-wave shielding plate superior in an electromagnetic-wave shielding property and non-visibility and having, for example, a pattern line width of 3 μm or more and 25 μm or less.01-29-2009
20110281089AQUEOUS INK COMPOSITION AND RECORDED ARTICLE FORMED BY USING THE SAME - In an advantage of embodiments of the invention, there is provided an aqueous ink composition at least containing water, silver particles, and a humectant, and the humectant is at least one member selected from glycerols, glycols, and saccharide.11-17-2011
20090017277PHOTOSENSITIVE MATERIAL, METHOD OF MANUFACTURING CONDUCTIVE METAL FILM, CONDUCTIVE METAL FILM AND LIGHT-TRANSMITTING FILM SHIELDING ELECTROMAGNETIC WAVE FOR PLASMA DISPLAY PANEL - A photosensitive material includes a support and an emulsion layer containing a silver salt emulsion, the photosensitive material is capable of forming a conductive metal film by exposing and developing the emulsion layer, wherein the emulsion layer has a swelling rate of 150% or more.01-15-2009
20090061177METHOD OF PRINTING USING HIGH PERFORMANCE TWO-COMPONENT REACTIVE INKS AND COATINGS WITH FLEXOGRAPHIC PRINTING PROCESSES - A printed article prepared by a flexographic printing process by applying a coating or ink that contains materials that are highly reactive with hydroxyl groups to an article substrate using a flexographic roller or plate made of non-polar polymers and optionally impregnated with silicone. In addition, a flexographic process for preparing a printed article by pattern applying more than one type of coating onto an article substrate. Unique patterns are laser engraved onto non-polar polymeric flexographic rollers/plates that may be impregnated with silicone, to preferably each coat different portions of the article substrate surface.03-05-2009
20110293907LASER PARAMETER ADJUSTMENT - A method is provided for removing a substrate from a component with a laser. The method includes the steps of: applying a laser to a component at different locations with different power or different laser speed levels so as to remove a portion of a substrate from the component and thereby yield a number of markings on the component; measuring the different markings and generating a collection of data associated with different power or speed levels for the laser based on the markings; and adjusting at least one operating parameter of the laser based on the collection of data from the markings. Optionally, the method may be automated.12-01-2011
20090081426Flexible Laminate Board, Process for Manufacturing of the Board, and Flexible Print Wiring Board - A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.03-26-2009
20100028632INK COMPOSITION FOR INKJET PRINTING BY THE CONTINUOUS DEFLECTED JET TECHNIQUE - An ink composition for inkjet printing by the continuous deflected jet technique, which is liquid at ambient temperature, comprising: a) a binder; b) one or more dyes and/or pigments; and c) a solvent, in which: said solvent comprises at least 10% by weight—relative to the total weight of the ink composition—of at least one noncyclic acetal, and at least 5% by weight of one or more other organic compounds capable of dissociating the ionizable species that are found in the ink.02-04-2010
20090136725PROCESS FOR PRODUCING COPPER WIRING POLYIMIDE FILM, AND COPPER WIRING POLYIMIDE FILM - There is disclosed a copper wiring polyimide film having wiring with ultra fine pitch and excellent in the linearity. The copper wiring polyimide film is produced by a process for producing a copper wiring polyimide film having a 20 to 45 μm-pitch copper wiring part by a semi-additive method using a copper foil laminated polyimide film with carrier. The process comprises (a) a step of providing a copper foil laminated film comprising a copper foil having a film side surface roughness Rz of not more than 1.0 μm and a thickness in the range of 0.5 to 2 μm laminated on a surface of a polyimide film, (b) a step of forming a plating resist pattern layer in which a wiring pattern having 20 to 45 μm pitch can be formed on the upper surface of the copper foil, (c) a step of conducting copper plating on the copper foil part exposed from the resist, (d) a step of removing the plating resist, and (e) a step of removing the copper foil exposed on the plating resist-removed part to expose a polyimide film.05-28-2009
20090291276SYNTHETIC CERAMIC TILE AND METHOD FOR PRODUCING THE SAME - A method for producing synthetic ceramic tile, including at least providing a ceramic tile, coating a coating on the ceramic tile, the coating containing at least an aluminum pigment and/or at least a titanium-mica pearlescent pigment, and drying a liquid coating deposited on the ceramic tile, or melt-quenching or melt-curing a powder coating deposited on the ceramic tile. The synthetic ceramic tile has a metallic or pearl color, which improves its decorative effect.11-26-2009
20100209680METHODS FOR PRODUCING PATTERN-FORMING BODY - A method of producing a pattern-forming body with high accuracy with no need for a post-exposure treatment and without allowing any photocatalyst to remain in the resultant pattern-forming body and whereby any problematic effect of the photocatalyst in the pattern-forming body is eliminated. The method includes providing a photocatalyst-containing layer-sided substrate and a pattern-forming body substrate having a characteristic-changeable layer, which is changed by the effect of the photocatalyst in the photocatalyst-containing layer, and a light-shading part formed as a pattern in such a manner that the photocatalyst-containing layer and the characteristic-changeable layer are brought into contact with each other, followed by exposure on the side of the pattern-forming body substrate to change the characteristics of the characteristic-changeable layer of the exposed part, followed by removing the photocatalyst-containing layer-sided substrate.08-19-2010
20090148678FLEXIBLE PRINTED CIRCUIT, DISPLAY DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF - A flexible printed circuit film includes a film including a first region of an adhesion region and a second region outside of the adhesion region, a signal wire formed on the second region, and reinforcement wiring connected to the signal wire and formed on the first region and the second region. The reinforcement wiring includes a bent portion having a plurality of inner corners and a plurality of outer corners, and the inner corners of the reinforcement wiring are spaced apart from a boundary between the first region and the second region. Accordingly, even though an external force is applied to the flexible printed circuit film, the reinforcement wiring may be prevented from being easily damaged.06-11-2009
20090148677HIGH ASPECT RATIO ELECTROPLATED METAL FEATURE AND METHOD - Disclosed are embodiments of an improved high aspect ratio electroplated metal structure (e.g., a copper or copper alloy interconnect, such as a back end of the line (BEOL) or middle of the line (MOL) contact) in which the electroplated metal fill material is free from seams and/or voids. Also, disclosed are embodiments of a method of forming such an electroplated metal structure by lining a high aspect ratio opening (e.g., a high aspect ratio via or trench) with a metal-plating seed layer and, then, forming a protective layer over the portion of the metal-plating seed layer adjacent to the opening sidewalls so that subsequent electroplating occurs only from the bottom surface of the opening up.06-11-2009
20100080970IN MOLD LAMINATION OF DECORATIVE PRODUCTS - A method of manufacturing decorative plastic composites having a decorative layer, a backing layer and a clear outer layer which provides exceptional “depth of image” is disclosed. Decorative or protective appliqués' having a wide range of decorative patterns may be formed by injection molding a backing layer behind and a clear outer layer on the top surface of a decorative layer, the decorative layer comprising a relatively thin metal foil, film, fabric, veneer or sheet of paper having a digital image from an inkjet printer deposited on a front surface thereof. In one exemplary embodiment, the appearance of a wood veneer may be modified by digitally printing a burl pattern over the wood grain surface of the veneer prior to injection molding.04-01-2010
20110171439LAMINATE AND COMPOSITE LAYER COMPRISING A SUBSTRATE AND A COATING, AND A PROCESS AND APPARATUS FOR PREPARATION THEREOF - The invention relates to a laminate comprising two plastic films and (optionally in between a metal or metal oxide layer and) a layer of an organic compound other than triazine, the laminate having a lamination strength of about 2 N/inch or more as measured in a 90 degree tensile testing at 30 mm/min. The invention further relates to a composite layer, suitable for said laminate. The invention further relates to laminate having a crystalline organic compound other than triazine to improve the barrier properties.07-14-2011
20080206530METHOD OF FORMING LOW-RESISTANCE METAL PATTERN, PATTERNED METAL STRUCTURE, AND DISPLAY DEVICES USING THE SAME - Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same.08-28-2008
20090286056COATING METHODS AND APPARATUS USING PRE-FORMED CERAMIC MASK - A method for coating a part includes applying a ceramic mask to a first surface portion of the part. A coating is applied to a second surface portion of the part and at least partially contacting the mask. The mask is destructively removed.11-19-2009
20120295083PATTERNED POLYMER LAYER WITH HIGH ASPECT RATIO - The present invention relates to a device comprising a patterned polymer layer with high aspect ratio to be used in contact with biological solutions or fluids, as well as the method of production of said layer, comprising a phase of polymerization moulding, that uses an acrylic and/or epoxy polymerizable material with a mold of organic or inorganic nature.11-22-2012
20110206912LIQUID BARRIER AND METHOD FOR MAKING A LIQUID BARRIER - A method for making a liquid barrier includes forming a liquid barrier layer on a substrate, forming a mask layer on the liquid barrier layer such that part of the liquid barrier remains exposed, forming a contact layer on the exposed liquid barrier layer, and removing the mask layer to expose the part of the liquid barrier layer which was covered by the mask layer. A liquid wetting boundary is formed when the wettability on the liquid barrier surface area is less than the wettability of the contact surface area.08-25-2011
20080241491METHOD OF PREPARING A SUBSTRATE HAVING A LAYER OR PATTERN OF METAL ON IT - A method and associated substrate is provided for applying a layer or pattern of metal on a substrate. The method includes providing a target substrate, immobilizing a layer of polymeric material on the target substrate, and applying and immobilizing a layer or pattern of metal on the layer of polymeric material on the target substrate using a stamp onto which the layer or pattern of metal has previously been applied, by bringing the stamp into conformal contact with the target substrate.10-02-2008
20080286538Polyimide-Metal Laminated Body and Polyimide Circuit Board - A polyimide-metal laminated body obtained by forming a metal conductive layer on a polyimide film, which has been ceramic-modified or pseudoceramic-modified on at least the surface, by a wet plating process capable of accomplishing metal plating on ceramic. A polyimide-metal laminated body and polyimide circuit board having satisfactory cohesion in wet plating steps, maintain practical cohesion even after high temperature aging treatment, and exhibiting satisfactory electrical insulating reliability, can be obtained.11-20-2008
20090081427METHOD FOR PRODUCING AN IMMOBILIZATION SUBSTRATE AND IMMOBILIZATION SUBSTRATE PRODUCED BY THE METHOD - The present invention provides a method for preparing an immobilization substrate for a biosensor, the immobilization substrate having a measurement surface having a physiologically active substance immobilized thereon, and a reference surface not having a physiologically active substance immobilized thereon, the biosensor measuring an interaction, in terms of a change in refractive index, between the physiologically active substance and a test substance in a solution which is supplied to both the measurement surface and the reference surface, the method comprising: performing an activation treatment on a part of the substrate surface by using an organic solvent and an activating agent, thereby forming, on the substrate, a first surface which is activated such that it can immobilize the physiologically active substance, and forming a second surface which has not been subjected to the activation treatment; forming a flow channel which includes both the first surface and the second surface by attaching a flow channel member to the substrate; and supplying the physiologically active substance to the flow channel to bring the first surface into contact with the physiologically active substance, and thereby prepare the measurement surface and the reference surface within the same flow channel; and an immobilization substrate produced by the above method for producing an immobilization substrate.03-26-2009
20090061175METHOD OF FORMING THIN FILM METAL CONDUCTIVE LINES - Provided is a method of forming thin film metal conductive lines, the method including the steps of: forming a seed metal layer on a substrate; forming a first photoresist (PR) layer on the seed metal layer, and forming a metal conductive line pattern using the first PR layer as a mask; removing the first PR layer, and then forming a second PR layer which is spaced at a predetermined distance from the metal conductive line pattern; forming a protective film surrounding the metal conductive line pattern by electroplating; and performing etching to remove the second PR layer and an exposed portion of the seed metal layer.03-05-2009
20090297801Heat radiation substrate having metal core and method of manufacturing the same - Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.12-03-2009
20090297802Process for making self-patterning substrates and the product thereof - The present invention relates to a process for making self-patterning substrates comprising the steps of providing electrically conductive traces on a substrate; pre-coating the substrate with at least a layer of complementary reactant electrically resistant reactant formulations; altering the conductivity of complementary reactant formulation selectively upon application of external source of energy and a self-patterning substrate using the said process.12-03-2009
20090208712METHOD TO DECREASE WARPAGE OF MULTI-LAYER SUBSTRATE AND STRUCTURE THEREOF - Disclosed is a method to decrease warpage of a multi-layer substrate, comprises a first metal layer and a second metal layer. First area of the first metal layer is larger than second area of the second metal layer. In the same layer of the second metal layer, a redundant metal layer can be set to make a redundant metal layer area plus the second area considerably equivalent to the first area. Alternatively, a redundant space can be set in the first metal layer to achieve the same result. When the multi-layer substrate comprises a first dielectric layer with an opening and a second dielectric layer, a redundant opening positioned corresponding to the opening can be set in the second dielectric layer. The present invention employs a method of balancing the multi-layer substrate stress, i.e. to homogenize the multi-layer structure composed of different metal layers and dielectric layers to decrease warpage thereof.08-20-2009
20090053486WEAR AND CORROSION RESISTANT COATING - A method for treating a substrate (such as the gears of a gear set) to provide the substrate with both wear protection and corrosion resistance is disclosed. The method comprises providing the substrate with a wear protection layer and providing corrosion resistant layer. The wear protection layer can be applied to the gear and then the corrosion resistant layer can be applied over the wear resistant layer. Alternatively, the corrosion resistant lay can be provided and then the wear resistant layer can be formed over the corrosion resistant layer.02-26-2009
20090081428SECURITY ELEMENT AND METHOD FOR PRODUCING THE SAME - The invention relates to a security element for security papers, bank notes, ID cards or the like, having at least one plastic layer on which at least two metal layers of different color are so disposed side by side and on the same side of the plastic layer that the different colors are visually checkable.03-26-2009
20090081425PRECIOUS METAL JEWELRY AND PROCESS FOR PRODUCING THE SAME - This Invention concerns a ring (03-26-2009
20090075041Heat shield - A heat shield for shielding an object against heat and/or noise has at least one metal layer having a first and a second surface, beyond at least one of which a plurality of embossments projects. At least a part of the embossments differ from the remaining embossments in their size.03-19-2009
20090252938Substrate structure and method of forming the same - Provided are a substrate structure and method of forming the same. The method of forming the substrate structure may include etching a substrate to form an etched portion having a vertical surface, forming a diffusion material layer on the whole substrate or in part of the substrate; annealing the diffusion material layer to form a seed layer diffused downward toward the surface of the etched portion, and forming a metal layer on the seed layer. Accordingly, surface characteristics of the etched portion of the substrate may be enhanced by the seed layer, and therefore, a metal layer with improved adhesion and a uniform thickness may be formed on the vertical surface of the etched portion.10-08-2009
20100260984MICRODEVICES CONTAINING PHOTORECOGNIZABLE CODING PATTERNS AND METHODS OF USING AND PRODUCING THE SAME - This invention relates generally to the field of moiety or molecule analysis, isolation, detection and manipulation and library synthesis. In particular, the invention provides a microdevice, which microdevice comprises: a) a substrate; and b) a photorecognizable coding pattern on said substrate. Preferably, the microdevice does not comprise an anodized metal surface layer. Methods and kits for isolating, detecting and manipulating moieties, and synthesizing libraries using the microdevices are also provided. The invention further provides two-dimensional optical encoders and uses thereof. In certain embodiments, the invention provides a microdevice, which microdevice comprises: a) a magnetizable substance; and b) a photorecognizable coding pattern, wherein said microdevice has a preferential axis of magnetization. Systems and methods for isolating, detecting and manipulating moieties and synthesizing libraries using the microdevices are also provided.10-14-2010
20090117352Component fabrication - Component fabrication and in particular fabrication by deposition processes for large components is made more convenient by initially depositing a masking deposition layer 05-07-2009
20100215926ALUMINUM ALLOY SUBSTRATES HAVING A MULTI-COLOR EFFECT AND METHODS FOR PRODUCING THE SAME - Aluminum alloy products having multi-color effects and methods of producing the same are disclosed. In one embodiment, the aluminum alloy product may be produced from high purity aluminum alloys. In some embodiments, the high purity aluminum alloys may be bright-rolled and/or mechanically polished to produce intended viewing surfaces having high image clarity.08-26-2010
20100227133PULSED LASER MICRO-DEPOSITION PATTERN FORMATION - A method of forming patterns on transparent substrates using a pulsed laser is disclosed. Various embodiments include an ultrashort pulsed laser, a substrate that is transparent to the laser wavelength, and a target plate. The laser beam is guided through the transparent substrate and focused on the target surface. The target material is ablated by the laser and is deposited on the opposite substrate surface. A pattern, for example a gray scale image, is formed by scanning the laser beam relative to the target. Variations of the laser beam scan speed and scan line density control the material deposition and change the optical properties of the deposited patterns, creating a visual effect of gray scale. In some embodiments patterns may be formed on a portion of a microelectronic device during a fabrication process. In some embodiments high repetition rate picoseconds and nanosecond sources are configured to produce the patterns.09-09-2010
20090169842Printed wiring board and printed circuit board unit - A printed wiring board includes a body made of resin. Woven glass fiber yarns are impregnated in the resin of the body. An electrically-conductive wiring pattern is formed on the surface of the body. The wiring pattern extends in parallel with the glass fiber yarns. The width of the wiring pattern is set equal to or larger than the interval between the centerlines of the adjacent ones of the glass fiber yarns extending in parallel. The wiring pattern is reliably located in a region containing both the glass fiber and the resin. The proportion of the glass fiber to the resin is equalized on the wiring patterns. This results in a suppression of the influence resulting from a difference in the permittivity between the glass fiber and the resin on the wiring pattern. A variation of characteristic impedance is suppressed with such a simplified structure.07-02-2009
20080292852PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME - The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.11-27-2008
20100310840ON-PRESS DEVELOPMENT OF IMAGED ELEMENTS - Images can be provided using a method comprising thermally imaging a negative-working imageable element to provide an imaged element with exposed regions and non-exposed regions, the exposed regions consisting essentially of coalesced core-shell particles, and developing the imaged element on-press to remove only the non-exposed regions using a lithographic printing ink, fountain solution, or both. The imageable element comprises a single thermally-sensitive imageable layer consisting essentially of an infrared radiation absorbing compound and core-shell particles that coalesce upon thermal imaging. The core of the core-shell particles is composed of a hydrophobic thermoplastic polymer, the shell of the core-shell particles is composed of a hydrophilic polymer that is covalently bonded to the core hydrophobic thermoplastic polymer, and the thermally-sensitive imageable layer comprises less than 10 weight % of free polymer.12-09-2010
20110008595METHOD FOR PRODUCING A LENS PATTERN ON ROLL AND ROLL FOR PRODUCING OPTICAL FILM WITH THE LENS PATTERN THEREFROM - The present disclosure generally relates to a method for producing lens patterns on a roll which is used to produce optical films wherein the method comprises forming a resin film on a roll comprising a plated layer which has been surface-plated with copper (Cu) or nickel (Ni); producing a preliminary lens pattern by striking the surface of the resin film on the roll with a chisel; etching with an etching solution the roll having the preliminary lens pattern formed thereon; and removing the resin film, and a roll for producing optical films comprising lens patterns formed thereon by the same method.01-13-2011
20090035541Metal laminate, method for manufacturing same and use thereof - The present invention relates to a polyimide metal laminate which is a metal laminate comprising a stainless steel layer/a conductor layer/a polyimide resin layer/a metal layer, wherein the conductor layer is interposed between the stainless steel layer and the polyimide resin layer as a ground, and having a strong adhesion between the conductor layer and the polyimide resin layer, thus being able to be processed and used as a hard disk suspension. Specifically, the metal laminate of the present invention is characterized in that a surface of the conductor layer in contact with the polyimide resin layer is not smooth (preferably its 10-point average surface roughness is 0.5 μm or more).02-05-2009
20110045258LAMINATE AND COMPOSITE LAYER COMPRISING A SUBSTRATE AND A COATING, AND A PROCESS AND APPARATUS FOR PREPARATION THEREOF - The invention relates to a laminate comprising two plastic films and in between a metal or metaloxide layer and a crystalline triazine layer, the laminate having a lamination strength of about 2 N/inch or more as measured in a 90 degree tensile testing at 30 mm/min. The invention further relates to a composite layer, comprising a metal or metal oxide, and a triazine layer comprising a triazine compound suitable for said laminate. The invention further relates to a process for the preparation of a composite layer, comprising the step of applying a triazine layer on a substrate with a metal or metal oxide layer by vapour deposition of the triazine compound, wherein the process comprises (a) applying to the metal or metal oxide layer a compound other than a triazine compound, (b) vapour depositing the triazine compound on the metal or metal oxide layer while the compound is at least in part in a liquid state.02-24-2011
20100003475Metal Films, Methods for Production Thereof, Methods for Production of Laminated Electronic Components, and Laminated Electronic Components - A metal film containing Ni as a main component and Mn and at least one element selected from the group consisting of the elements of Groups 301-07-2010
20100040847METHODS UTILIZING SCANNING PROBE MICROSCOPE TIPS AND PRODUCTS THEREFOR OR PRODUCED THEREBY - The invention provides a lithographic method referred to as “dip pen” nanolithography (DPN). DPN utilizes a scanning probe microscope (SPM) tip (e.g., an atomic force microscope (AFM) tip) as a “pen,” a solid-state substrate (e.g., gold) as “paper,” and molecules with a chemical affinity for the solid-state substrate as “ink.” Capillary transport of molecules from the SPM tip to the solid substrate is used in DPN to directly write patterns consisting of a relatively small collection of molecules in submicrometer dimensions, making DPN useful in the fabrication of a variety of microscale and nanoscale devices. The invention also provides substrates patterned by DPN and kits for performing DPN.02-18-2010
20100040848NANO MATERIAL CLUSTER STRUCTURE - There is provided a novel nano material cluster structure. The nano material cluster structure comprises a conductor block and a plurality of first nano material strands protruding from a surface of the conductor block. The first nano material strands extend from the conductor block in a coplanar relationship. A novel method of preparing a nano material cluster structure is also provided. The method comprises providing a layered structure having multiple layers on a substrate. The multiple layers comprise a layer having nano material strands therein. The method also comprises patterning the layered structure to define one or more recesses. The nano material strands are partially exposed through said one or more recesses. The method further comprises filling the one or more recesses with a conductive material to enclose the partially exposed nano material strands.02-18-2010
20100055423Machine Readable Code Comprising Ultra-Violet Curable Gellant Inks - A method for embedding information on a substrate including converting information to machine readable code, wherein the code comprises a set of intended printed markings, wherein each intended printed marking of the set has a predetermined height on a substrate and represents a predetermined value, wherein intended printed markings having a same predetermined height represent a same data value, and wherein intended printed markings representing different data values have different heights; and printing the machine readable code on the substrate by depositing an ultra-violet curable phase change ink comprising an optional colorant and a phase change ink vehicle comprising a radiation curable monomer or prepolymer; a photoinitiator; a reactive wax; and a gellant and curing the deposited ink, such that each of the intended printed markings is formed as a printed marking with the predetermined height.03-04-2010
20100055422Electroless Deposition of Platinum on Copper - Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices.03-04-2010
20100055424PRINTING APPARATUS, PRINTING METHOD, PROGRAM AND PRINTED PRODUCT - A printing apparatus, a printing method, an application program and a printing medium are disclosed. The printing apparatus is coupled to a control circuit which with the help of the application program, controls the operation of the printing apparatus. The printing apparatus contains at least two kinds of glossy recording materials with different concentrations. The printing apparatus performs glossy printing on a printing medium by controlling the usage of the two kinds of glossy recording materials.03-04-2010
20090214838METHOD OF APPLYING A PATTERN OF METAL, METAL OXIDE AND/OR SEMICONDUCTOR MATERIAL ON A SUBSTRATE - The present application relates to a method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate, to a pattern created by such method and to uses of such pattern. Furthermore, the present invention relates to an assembly of layers that can be used for printing.08-27-2009
20110097560DEVICE HOUSING AND METHOD FOR MAKING THE SAME - A device housing comprises a transparent substrate, a paint coating, and a metallic coating. The paint coating is formed on portions of one surface of the transparent substrate. The metallic coating is formed on other portions of the surface of the transparent substrate having the paint coating. A method for making the device housing is also described there.04-28-2011
20110151213LABELS - There is described a multi-layer film. The film comprises a biodegradable layer and a metallised layer, wherein the biodegradable layer comprises a biopolymer selected from the group consisting of carbohydrates, polysaccharides, gums, proteins, colloids, polyorganic acids and mixtures thereof.06-23-2011
20090011202METHOD FOR PRODUCING A METAL PART - The invention relates to a method for producing a metal part. Said method comprises the steps of supplying a strand of metal material and applying a coating from a fluxing agent composition to a surface of the strand of material by means of an application device (01-08-2009
20100255274DEEP ANODIZATION - A method of anodizing comprising anodizing at least a portion of a valve metal base to a depth of at least 200 μm.10-07-2010
20080248266METHOD OF MANUFACTURING LAMINATED MATERIAL FOR SECURITY TAG - A laminated material suitable for fabricating miniaturized security tags which have the uniform resonance frequency, and security tags obtained by using the laminated material, are provided. A manufacturing method of a laminated material for security tags characterized in that metal foils are laminated on both sides of a previously formed synthetic resin film, and security tags obtained by using the laminated material by the manufacturing method, are provided. Because the lamination is performed on the previously formed resin film, the amount of variation in thickness of the resin film is small, and the thin resin film can be precisely manufactured. Further, because the oriented film has a relatively high strength even for a thin film, the laminated material is easy to be etched for forming a circuit. The security tag obtained by using a previously formed resin film can satisfy both uniformizing the resonance frequency and miniaturizing the security tag simultaneously, and has an excellent performance.10-09-2008
20090317609CURABLE RESIN FILMS - A curable resin with at least one electrically conductive metal region on its surface formed by depositing on the surface a composition comprising activator, contacting the activator with a solution of a reducing agent and a solution of a metal ion, the reducing agent and metal ion undergoing chemical reaction activated by the activator to form an electrically conductive metal region on the surface, and method of forming is provided.12-24-2009
20110151211METHOD FOR MAKING A DESIRED PATTERN OF A METALLIC NANOSTRUCTURE OF A METAL - A method for making a desired pattern of a metallic nanostructure of a metal includes: (a) forming the desired pattern of a self-assembled monolayer matrix of a first organic compound on a substrate, the first organic compound having a tail group selected to be active toward deposition of the metal on the self-assembled monolayer matrix; (b) forming an inert layer of a second organic compound on the substrate by contacting an assembly of the substrate and the self-assembled monolayer matrix with a solution containing the second organic compound, the second organic compound having a tail group selected to be inactive toward the deposition of the metal on the inert layer; and (c) depositing the metal on the self-assembled monolayer matrix by contacting an assembly of the substrate, the self-assembled monolayer matrix and the inert layer with a solution containing metal ions, followed by reducing the metal ions.06-23-2011
20090029126METAL MATERIAL, AND COATING FILM AND WIRING FOR SEMICONDUCTOR INTEGRATED CIRCUITRY UTILIZING THE METAL MATERIAL - When metallic material is employed for various metallic films, it is possible to improve at least one of the mechanical strength, the durability against abrasion, and the uniformess as a film while keeping unchanged the chemical property and the electric property of the metallic material. Due to the gel three-dimensional mesh structure 01-29-2009
20110256363SURFACE METAL FILM MATERIAL, METHOD OF PRODUCING SURFACE METAL FILM MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL - A surface metal film material including, in this order, a substrate, a polymer layer that receives a plating catalyst or a precursor thereof, and a metal film formed by plating, wherein, when x μm represents surface roughness (Ra) at the interface between the substrate and the polymer layer, and y μm represents surface roughness (Ra) at the interface between the polymer layer and the metal film, x>y and 5 μm>x>0.1 μm, and wherein, when T μm represents a thickness of the polymer layer, T and x satisfy the relationship 2x≦T.10-20-2011
20080213551Metallization process and product produced thereby - A layered structure produced by metallizing a substrate including: (a) providing a transfer film including film layer and metal layer bonded together by a cured breakaway layer; (b) providing a substrate; (c) applying electron beam curable transfer adhesive to a portion of the substrate; (d) securing the transfer film to the substrate, where the transfer adhesive is between the metal layer and substrate, forming an intermediate product; (e) passing the intermediate product through an electron beam curing apparatus to cure the transfer adhesive; and (f) removing the transfer film. In the metallized product, the cured breakaway coating is bonded only to the metal. The cured breakaway layer preferably has a cured elongation at break, in tension, of less than about 20%. Precise metallized edges are produced, e.g., edge variation of about ±0.010 in., or better. The process can be utilized with total or selective metal transfer.09-04-2008
20100323175Paper Board and Making Method Thereof - The present invention relates to a paper board and making method thereof. The paper board comprises a kraft paper, a glue layer located on the kraft paper, and an aluminium plating film located on the glue layer. The method of making a paper board comprises: step 1, providing a kraft paper; step 2, providing an aluminium plating film; step 3, compounding the aluminium plating film to the kraft paper via glue. In step 3, the aluminium plating film is closely attached to the kraft paper with glue through pressing, so as to form a composite paper board. The method of making the paper board of the present invention is simple and reduces the cost. The paper board has a reliable quality, a long endurance, a beautiful appearance, and a low cost.12-23-2010
20100196681METHOD OF FORMING METAL WIRING AND METAL WIRING FORMED USING THE SAME - Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.08-05-2010
20090197061PRODUCTION OF A MATERIAL MULTILAYER MICROCOMPONENTS BY THE SACRIFICIAL THICK LAYER METHOD SACRIFICIELLE - The invention relates to the preparation of multilayer microcomponents which comprise one or more films, each consisting of a material M selected from metals, metal alloys, glasses, ceramics and glass-ceramics.08-06-2009
20110151214METAL COMPOSITIONS, THERMAL IMAGING DONORS AND PATTERNED MULTILAYER COMPOSITIONS DERIVED THEREFROM - Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.06-23-2011
20110151212METHOD FOR MAKING DEVICE HOUSING, AND DEVICE HOUSING - An exemplary method for making a device housing includes the following steps. Providing a substrate, and then forming a decorative coating on the substrate by paint jet printing. A device housing made by the method includes a substrate and a decorative coating formed on the substrate.06-23-2011
20100021705Laminated Decorative Strip and Method for the Producion of a Laminated Decorative Strip - The invention relates to a laminated strip, in particular a decorative strip, comprising an upper layer (01-28-2010
20100021704Organic silver complex compound used in paste for conductive pattern forming - Disclosed is an organic silver complex compound in which an organic ligand, containing an amine group (—NH01-28-2010
20100080969METHOD FOR METALLIZING A COMPONENT - The invention relates to a method for metallizing a component comprising a first part constituted of a polyester comprising thermoplastic composition first material, and a second part constituted by a polyamide comprising thermoplastic composition, wherein a metallizing seed layer is applied, the component is exposed to an discriminating etching liquid, and thereafter exposed to a metallizing environment The invention also relates to a metallized component obtainable by said method.04-01-2010
20090092803SELF-ASSEMBLY TECHNIQUE APPLICABLE TO LARGE AREAS AND NANOFABRICATION - The present invention provides articles and methods for affecting the self-assembly of materials. In some cases, the invention provides an approach for facilitating the self-assembly of various materials, including polymeric materials (e.g., block polymers), nanoparticles, other materials capable of self-assembly, and the like, over relatively large surface areas. Some embodiments of the invention provide articles (e.g., substrates) which, when contacted with a material capable of self-assembly, may produce greater control of self-assembly through the bulk of the material.04-09-2009
20110305888RECYCLING PROGRAM AND METHOD OF ENCOURAGING RECYCLING OF TARGET WASTE MATERIALS BY USE OF PRECIOUS METALS - A recycling program provides a monetary incentive to encourage recycling of target waste materials, such as paper, glass and plastic products. A precious metal, such as gold, silver, platinum or palladium, is incorporated into the target waste material during manufacturing to provide an incentive for recycling the target material. A visual marking is placed on the target material to distinguish from other waste items that do not contain a precious metal. A deposit is collected from consumers when purchasing the target material, and the deposit is paid back when the target material is delivered to a recycling collection point. Recycling of the target material is encouraged by efforts to reclaim the precious metal.12-15-2011
20090202796OUTCASE OF REFRIGERATOR AND METHOD FOR MANUFACTURING THE SAME - The present invention discloses an outer casing of a refrigerator with various designs expressed thereon, and a method for manufacturing the same. The outer casing of the refrigerator includes a layer (08-13-2009
20120301688FLEXIBLE ELECTRONICS WIRING - Devices are formed that combine low resistance for circuit needs with high flexibility for application needs. Embodiments include forming a low resistance layer on a substrate and forming a high flexibility conductive layer on the low resistance layer, wherein the high flexibility conductive layer provides for continuous conductivity of the low resistance layer. Embodiments include forming a pattern in the low resistance and high flexibility conductive layers simultaneously, or forming a pattern in the low resistance layer prior to forming the high flexibility conductive layer.11-29-2012
20100143675INKS AND COATINGS FOR THE PRODUCTION OF OXYGEN SENSITIVE ELEMENTS WITH IMPROVED PHOTOSTABILITY - An oxygen sensitive ink or coating with enhanced photostability, comprising an oxygen sensitive indicator, a photostabilizer, an oxygen permeable binder and a solvent mixture is provided. The oxygen sensitive indicator is selected from, but not limited to [Ru(L1)(L2)(L3)]06-10-2010
20100183855THIN FILMS OF CONJUGATED POLYMERS CONTAINING INORGANIC NANOPARTICLES AND PROCESS FOR THE MANUFACTURE THEREOF - The invention relates to a process for the non-covalent coating of a support by a hybrid organic/inorganic film, characterized in that it comprises the steps of: —depositing a conjugated organic polymer comprising organic groups of X type onto the support; depositing nanoparticles comprising one or more organic groups of Y type onto the support, and in that the groups of X and Y types are capable of developing hydrogen-type bonds between themselves. Typically, the deposition steps are repeated, generally alternately, until the desired thickness for the film is obtained. The deposition may be carried out on the whole of the support or on one part of the latter only.07-22-2010
20100035032DECORATIVE FOIL - A decorative foil which can be applied to any support, wherein the foil is composed of a polymeric carrier foil that is provided with a metallic layer and/or print and at least one, protective lacquer layer.02-11-2010
20120003444ALUMINUM-PLASTIC COMPOSITE STRUCTURE - An aluminum-plastic composite structure includes an aluminum portion and a plastic portion. The aluminum portion defines a plurality of micro grooves by ultraviolet lithography. The plastic portion is integrally formed on the aluminum portion and substantially filling in the micro grooves. A width of each micro groove is in a range from 0.02 millimeters to 0.05 millimeters. A depth of each micro groove is in a range from 0.2 millimeters to 0.25 millimeters.01-05-2012
20090202797APPLYING DISCONTINUOUS THIN LAYER ON A SUBSTRATE - A rigid or flexible substrate (08-13-2009
20100323174METHODS FOR PREPARING METAL FILM-CARRYING SUBSTRATES, METAL FILM-CARRYING SUBSTRATES, METHODS FOR PREPARING METAL PATTERN MATERIALS, AND METAL PATTERN MATERIALS - There are provided a metal film-carrying substrate including a substrate and a metal film with good adhesion to the substrate and being less dependent on temperature or humidity, and a method for preparation thereof. There are also provided a metal pattern material having a patterned metal portion with good adhesion to a substrate, being less dependent on temperature or humidity, and providing highly reliable insulation for a region where the patterned metal portion is not formed, and a method for preparation thereof. The method for preparing the metal film-carrying substrate includes: (a1) forming a polymer layer on a substrate, the polymer layer including a polymer that has a non-dissociating multidentate functional group capable of interacting with a plating catalyst or a precursor thereof and is directly and chemically bonded to the substrate; (a2) applying a multidentate plating catalyst or a precursor thereof to the polymer layer; and (a4) performing plating on the multidentate plating catalyst or precursor thereof; and (a3) optionally adding a metal to the polymer layer after the step (a2), the metal being different from the multidentate plating catalyst or precursor thereof.12-23-2010
20090029125PHOTOSENSITIVE MATERIAL FOR FORMING CONDUCTIVE FILM, CONDUCTIVE FILM, LIGHT TRANSMITTING ELECTROMAGNETIC WAVE SHIELDING FILM AND METHOD FOR MANUFACTURING THE SAME - To provide a conductive film forming photosensitive material from which a conductive film having high electromagnetic wave shielding properties and high transparency simultaneously can be manufactured and which is reduced with respect to pressure properties.01-29-2009
20110165391DYEING METHOD OF ALUMINUM-BASED MEMBER, AND ALUMINUM-BASED MEMBER - In a dyeing method of an aluminum-based member, a first color forming material is held in a hole of a first region of an anodized film, a second color forming material is held in holds of a second region that is smaller than the first region by diagonally spraying, When the second colored layer is formed, a gradation region is formed in a boundary with the first region and the second region, and the hole are closed.07-07-2011
20120070639PRODUCTION METHOD OF WORKPIECE AND WORKPIECE WITH THREE-DIMENSIONAL PATTERN - A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.03-22-2012
20110091697SOLDER PAD STRUCTURE FOR PRINTED CIRCUIT BOARDS AND FABRICATION METHOD THEREOF - A method for fabricating a solder pad structure. A circuit board having thereon at least one copper pad is provided. A solder resist is formed on the circuit board and covers the copper pad. A solder resist opening, which exposes a portion of the copper pad, is formed in the solder resist by laser. The laser also creates a laser activated layer on sidewalls of the solder resist opening. A chemical copper layer is then grown from the exposed copper pad and concurrently from the laser activated layer.04-21-2011
20120107582Metal-coated vertically aligned carbon nanofibers - The present invention provides electrodes comprised of metal-coated vertically aligned carbon nanofibers. Arrays of vertically aligned carbon nanofibers provide highly accessible, high density templates having large electrochemically active surface areas that may be modified to further increase the surface area of the nanofibers. The methods of the present invention involve functionalizing the surface of the nanofibers and coating the functionalized surface with metal using electroless deposition. The resulting metal-coated nanofibers form highly stable and highly reproducible electrodes having very high surface areas. The electrodes of the present invention are expected to be useful in a variety of applications, including high-density energy storage, i.e., supercapacitors and fuel cells.05-03-2012
20100092740MONOLITHIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MONOLITHIC ELECTRONIC COMPONENT - A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating.04-15-2010
20100092739COATING FOR MICROWAVABLE FOOD PRODUCT - The invention relates to an aqueous composition for preparing an edible coating on a microwavable food, which composition comprises at least one prolamin and at least one hydrocolloid or gelling agent. The invention further relates to a microwavable food comprising an edible coating, which coating comprises at least one prolamin and at least one hydrocolloid or gelling agent.04-15-2010
20100092741MICROPARTS AND APPARATUS FOR SELF-ASSEMBLY AND ALIGNMENT OF MICROPARTS THEREOF - A first hydrophilic area, a second hydrophilic area, and a hydrophobic area are provided on one surface of a micropart. The first hydrophilic area surrounds the hydrophobic area, and the hydrophobic area surrounds the second hydrophilic area. The pattern of the hydrophobic area has at most a symmetrical line.04-15-2010
20120315451Metal-Containing Compositions and Method of Making Same - The present invention relates to a process for forming metal-containing films by applying a photosensitive metal-containing composition on a substrate, drying the photosensitive metal-containing composition, exposing the photosensitive metal-containing composition to a source of actinic radiation and applying a post-treatment to the metal-containing composition. The process also includes exposing the photosensitive metal-containing composition to a source of actinic radiation through a mask or mold and developing the unexposed portion of the composition. Another embodiment of the invention is a metal-containing film, three-dimensional object or article formed by the process. The invention is useful in producing a directly patterned metal-containing film and a microdevice.12-13-2012
20100247879SUBSTRATE WARPAGE-REDUCING STRUCTURE - The subject matter disclosed herein relates to methods to reduce warpage of a substrate.09-30-2010
20100247880NOVEL COPOLYMER, NOVEL COPOLYMER-CONTAINING COMPOSITION, LAMINATE BODY, METHOD OF PRODUCING METAL FILM-COATED MATERIAL, METAL FILM-COATED MATERIAL, METHOD OF PRODUCING METALLIC PATTERN-BEARING MATERIAL AND METALLIC PATTERN-BEARING MATERIAL - There is provided a polymer containing a unit represented by the following Formula (1), and a unit represented by following Formula (2). In Formula (1) and Formula (2), R09-30-2010
20120219771Photolithographic Patterning of Polymeric Materials - The invention comprises methods for the photolithographic patterning of features in a photo-curable polymer composition coated onto a plastic substrate. In one embodiment of this invention, the plastic substrate is coated with a reflective film such as a metallic barrier. In another embodiment, the plastic substrate is coated or co-extruded with a polymer barrier layer containing an additive that absorbs the photo-curing radiation. In yet another embodiment the plastic substrate contains an intrinsic additive that absorbs the photo-curing radiation. Combinations of these embodiments are also within the scope of this invention.08-30-2012
20120171439THIN FILM DEPOSITION METHOD - The subject of the invention is a process for obtaining a substrate coated on at least part of its surface with at least one film of oxide of a metal M the physical thickness of which is 30 nm or less, said oxide film not being part of a multilayer comprising at least one silver film, said process comprising the following steps: 07-05-2012
20100009142METHOD FOR THE PRODUCTION OF STRUCTURED LAYERS OF TITANIUM AND NICKEL - A method for the production of a structured metal layer (01-14-2010
20090142559METHOD OF FORMING CONDUCTIVE TRACKS FOR FLEXIBLE ELECTRONIC CIRCUITS - Conductive tracks are formed on a support by providing a coated support where the coating is susceptible to forming a latent image upon pressure-exposure (e.g. a coating of a silver halide emulsion in gelatin), pressure exposing said coated support according to a desired track pattern to form a latent image of the track pattern and developing the latent image to form a conductive metal track pattern corresponding to the latent image. The latent image may be formed, for example, by applying pressure using a stylus or scalpel, an engraved stamp or a roller carrying a relief pattern. The method is capable of forming conductive tracks at very high resolution (e.g. 10 μm or less), optionally on a flexible support.06-04-2009
20090068425DECORATED RESIN MOLDED ARTICLE AND METHOD FOR PRODUCING THE SAME - A decorated resin molded article that can secure a high durability and can represent a sufficiently realistic metal texture in appearance is provided as follows. A metal thin film is directly formed on a design surface of a substrate by either a physical vapor deposition method or a chemical vapor deposition method to provide a metallic decoration. Additionally, a topcoat layer is formed with a thickness of 10 to 40 μm on the metal thin film. The topcoat layer comprises a transparent coating film having an adhesive property to both of the substrate and the metal thin film.03-12-2009
20090068426MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, a ceramic laminate is defined by a ceramic base layer and ceramic auxiliary layers arranged on both main surfaces of the ceramic base layer, the ceramic base layer and the ceramic auxiliary layers being co-fired. The ceramic base layer and the ceramic auxiliary layers are made of ferrite materials having substantially the same compositional system and have substantially the same crystal structure. The linear expansion coefficient of the ceramic auxiliary layers is less than the linear expansion coefficient of the ceramic base layer.03-12-2009
20090061176HOUSING WITH A SOFT SURFACE - A housing with a soft surface device (03-05-2009
20080299360METHOD FOR MANUFACTURING TAG INTEGRATED CIRCUIT FLEXIBLE BOARD AND STRUCTURE OF THE SAME - In a method for manufacturing a tag integrated circuit flexible board, first a copper foil, an insulating heat-conductive material and a base material coated with an adhesive layer are prepared. After being treated by a hot-pressing process, the copper foil, the insulating heat-conductive material and the base material are combined together to form a continuous band-like or sheet-like copper foil flexible board. A photo-etching process is performed to etch the cooper foil. The surface of the insulating heat-conductive material is formed with a conductive circuit layer formed of a plurality of sections of circuits. The surface of the plurality of sections of circuits is plated with a silver metallic layer. Electronic components are soldered on the circuits and an outer covering body is packaged thereon. Finally, the copper foil flexible board is cut, so that the base material has a plurality of integrated circuit flexible boards thereon.12-04-2008
20120276349ANTI-CORROSION TREATMENT PROCESS FOR ALUMINUM OR ALUMINUM ALLOY AND ALUMINUM OR ALUMINUM ALLOY ARTICLE THEREOF - An aluminum or aluminum alloy article is described. The aluminum or aluminum alloy article includes an aluminum or aluminum alloy substrate, a barrier layer formed on the substrate, a color layer formed on the barrier layer, and an insulation layer formed on the color layer. The barrier layer and the color layer are formed by vacuum sputtering. The barrier layer is a layer of chromium-oxygen-nitrogen, aluminum-oxygen-nitrogen, or titanium-oxygen-nitrogen. The insulation layer is an external layer of the aluminum or aluminum alloy article.11-01-2012
20080311360Thick film circuit component and method for manufacturing the same - A thick film circuit component has a thick film electrode interconnect which allows an electrode on a semiconductor chip and an aluminum wire to be directly bonded to each other with a sufficient bonding strength. The thick film circuit component has an insulated substrate 12-18-2008
20100167027MOBILE PHONE SHELL AND METHOD OF MANUFACTURING THE SAME - An outer shell of a mobile phone, the outer shell comprises a substrate, a semi-transparent coating formed on the substrate, and an opaque layer partially formed on the opposite side from the semi-transparent coating, wherein the substrate includes at least two sub-areas, a first sub-area overlaps a second sub-area to form a first overlapping area showing a mixture of colors between a first color and a second color.07-01-2010
20080248265PATTERNED INORGANIC FILM, PIEZOELECTRIC DEVICE, AND PROCESS FOR PRODUCING THE SAME - An inorganic film formed of an inorganic material on a metal film having a surface including surface-oxidized areas. The surface-oxidized areas are surface oxidized to different degrees. For example, the surface-oxidized areas are one or more lowly-surface-oxidized areas and one or more highly-surface-oxidized areas. The inorganic film includes regions which are respectively formed on the surface-oxidized areas, and the regions have different crystal structures according to the different degrees of surface oxidation. For example, a patterned inorganic film constituted by one or more protruding portions arranged on one or more lowly-surface-oxidized areas of the surface of the metal film can be produced by removing the portions of the inorganic film formed on highly-surface-oxidized areas.10-09-2008
20080226882Glazing Provided with a Stack of Thin Films Acting on the Sunlight - The subject of the invention is a transparent substrate, especially a glass substrate, provided with a thin-film multilayer acting on solar radiation, the multilayer being deposited by magnetron sputtering, characterized in that it includes at least a lubricating film of high optical index n, this lubricating film being associated with at least one sublayer, which is based on silicon nitride or oxynitride or carbonitride, or based on aluminum and/or zirconium nitride or oxynitride or carbonitride, or a mixture of at least two of these compounds (mixed Si—Al or Si—Zr nitrides or oxynitrides or carbonitrides).09-18-2008
20080220229Method for Structured Application of Molecules to a Strip Conductor and Molecular Memory Matrix - The invention relates to a method for a structured application of molecules on a strip conductor and to a molecular memory matrix. The inventive method makes it possible, for the first time, to economically and simply apply any number of molecular memory elements on the strip conductor in a structured and targeted way, thereby making available, also for the first time, a memory matrix at a molecular level.09-11-2008
20130143013METHOD AND APPARATUS FOR RELIABLY LASER MARKING ARTICLES - The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, and laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds.06-06-2013
20130177749NANOSTRUCTURES - A method for producing a matrix containing nanostructures. The method includes obtaining a layer having a thickness of 10 nm-100 μm, wherein the layer contains organic macromolecules arranged in a nanopattern, staining the layer with a solution containing a salt so that a portion of the salt is retained in the layer, and removing the organic mcaromolecules from the layer to form a matrix containing nanostructures. Also within the scope of this invention are nanostructures prepared by this method.07-11-2013
20130101815LAYERED PRODUCT FOR METAMATERIAL TRANSFER AND METAMATERIAL TRANSFERRED SUBSTRATE - Disclosed is a layered product for metamaterial transfer for transferring a metamaterial layer onto a substrate, including: a resin mold having a fine convex-concave structure on a surface; and an inorganic layer as a metamaterial layer including at least one dielectric layer and at least one metal layer deposited on a surface of the resin mold, wherein resin of the resin mold contains fluorine, and a ratio between an average elemental fluorine concentration Eb of the resin and an elemental fluorine concentration Es of the surface of the resin mold satisfies the following equation: 200≧Es/Eb≧5.0.04-25-2013
20130129996Method of Preparing a Substrate with a Composition Including an Organoborane Initiator - A method of preparing a substrate with a composition comprising (i) an organoborane initiator and (ii) a radical curable component disposed thereon includes the step of depositing the composition onto the substrate wherein at least one of (i) the organoborane initiator and (ii) the radical curable component is deposited onto the substrate in the form of a gradient pattern. An article comprises the substrate and the gradient pattern formed on the substrate. The gradient pattern is formed from a developed composition comprising the reaction product of (i) the organoborane initiator and (ii) the radical curable component. By forming the gradient pattern on the substrate, combinatorial and high-throughput methods of generating and testing the developed composition are possible, which enable characterization of the developed composition for various physical and chemical properties.05-23-2013
20130129995ASSIST LAYERS FOR EUV LITHOGRAPHY - The present invention provides novel methods of fabricating microelectronics structures, and the resulting structures formed thereby, using EUV lithographic processes. The method involves utilizing an assist layer immediately below the photoresist layer. The assist layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate. The preferred assist layers are formed from spin-coatable, polymeric compositions. The inventive method allows reduced critical dimensions to be achieved with improved dose-to-size ratios, while improving adhesion and reducing or eliminating pattern collapse issues.05-23-2013
20080199665Method of Forming Flexible Electronic Circuits - A multiple layer photosensitive element having at least three differently sensitised photosensitive layers on one side of a support, such as a, transparent flexible support, is imagewise exposed according to a desired circuit pattern and developed to form two layers of conductive track patterns from each photosensitive layer, which may then be connected together by forming vias by drilling or in situ generation. The resulting multiple layer conductive element has application in the field of printed circuit board manufacture or as the backplane electronic element of a flexible display device.08-21-2008
20130149510USE OF AQUEOUS POLYURETHANE DISPERSIONS FOR COMPOSITE FOIL LAMINATION - The use of aqueous polyurethane dispersions is described for composite foil lamination, where at least 10% by weight of the polyurethane derives from at least one amorphous polyester polyol.06-13-2013
20110274898Method for Producing Sintered Magnet and alloy for sintered magnet - The present invention provides a method for producing a sintered magnet, which can have a sufficient sintered density even when the magnet has a low-R composition. The method is for producing a sintered magnet comprising R (R: one or more rare-earth elements), T (T: one or more transition metal elements essentially comprising Fe, or Fe and Co) and B (boron) as the main components, wherein a starting alloy prepared by strip casting is pulverized to a given particle size to form a fine powder, where the starting alloy comprises discolored deposit 11-10-2011
20120282445MASK STICK AND METHOD OF ASSEMBLING A MASK FRAME ASSEMBLY BY USING THE MASK STICK - A mask stick including a main body part having a pattern formed therein, one or more side clamping parts extending from a side of the main body part, and a slant clamping part disposed adjacent an outermost one of the one or more side clamping parts, wherein an angle (θ) between the slant clamping part and the outermost side clamping parts is greater than 0° and less than 90° (0°<θ<90°).11-08-2012
20110311790CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS USING THE CONDUCTIVE CONNECTING MATERIAL, AND METHOD FOR PRODUCING A CONNECTING TERMINAL - The present invention provides a conductive connecting material for electrically connecting terminals of electronic members, which has a layered structure comprising: a curable resin composition containing a resin component and a compound having a flux function; and a metal foil selected from a solder foil and a tin foil. Further, the present invention provides a method for connecting terminals comprising: a placement step in which the conductive connecting material is placed between opposed terminals; a heating step in which the conductive connecting material is heated at a temperature, which is equal to or higher than the melting point of the metal foil, and at which the resin composition is not completely cured or the resin composition is softened; and a curing step/solidifying step in which the resin composition is cured or solidified.12-22-2011
20110318552SOLVENTLESS LAMINATING ADHESIVE FOR FLEXIBLE PACKAGING LAMINATIONS AND LAMINATED STRUCTURES MADE WITH THE ADHESIVE - Two-component solventless adhesive compositions for lamination applications and laminated structures, including flexible laminated packaging, comprising at least two substrates, including structures comprising reverse printed ink films and/or metalized films. The adhesive comprises a prepolymer having one or more oligomers with a relatively high molecular weight.12-29-2011
20080311361ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - An organic light emitting diode (OLED) display device and a method of fabricating the same are disclosed. In one embodiment, the method includes: i) preparing a support and a flexible layer, ii) forming a first metal layers on one side of a support and a second metal layer on one side of a flexible layer, iii) performing a cleaning process to the first metal layer and the second metal layer, iv) forming a first radical layer on the first metal layer and a second radical layer on the second metal layer and v) joining the first and second radial layers to each other. At least one embodiment of the invention enhances process convenience and manufacturing yield, and reduces manufacturing costs and time for a flat panel display device having a flexible substrate.12-18-2008
20130196128COMPOSITIONS, METHODS AND DEVICES FOR GENERATING NANOTUBES ON A SURFACE - A method for modifying a surface by generating nanotubes at one or more selected sites on the surface, the surface including a first metal. The method includes the steps of positioning at least one cathode and at least one anode relative to the surface in an electrolyte solution including a fluoride salt of a second metal, and applying a voltage between the at least one anode and the at least one cathode sufficient to generate nanotubes at one or more selected sites on the surface and to inhibit nanotube formation at one or more of the other selected sites, wherein the nanotubes include the first metal and the second metal.08-01-2013
20120088081COATED ARTICLE AND METHOD OF MAKING THE SAME - A coated article includes a substrate and a pattern layer formed on the substrate. The pattern layer includes a plurality of strips. Each area of these strips is in a range of about 0.001 mm04-12-2012
20120088080PAINT FINISH INCORPORATING DECORATIVE EFFECTS - The present invention relates to a paint finish that incorporates decorative effects such as a laser effect, a splash effect, or a cloud effect, and to a paint process to obtain a paint finish that incorporates decorative effects.04-12-2012
20130209760ALKYL SULFONATED TETRAZOLE COMPOUND, PREPARING METHOD THEREOF, AND EPOXY RESIN CONTAINING THE SAME, AND SUBSTRATE PRODUCED THEREFROM - The present invention provides an alkyl sulfonated tetrazole compound, a method of preparing the same, an epoxy resin containing the same and a substrate produced therefrom. The epoxy resin is usefully used as a raw material of printed circuit boards, and has high adhesion to metal.08-15-2013

Patent applications in class Including metal layer