Class / Patent application number | Description | Number of patent applications / Date published |
428202000 | With outer strippable or release layer | 9 |
20080318010 | Release liner having print receptive surface and methods for manufacturing and using - A release liner having a print receptive surface is provided. The release liner includes a release liner substrate having a first surface and a second surface, and silicone coating provided on at least one of the release liner substrate first surface or second surface to provide a release surface. The silicone coating is provided in an amount sufficient to provide the release surface with release properties, and the silicone coating comprises sufficient print additive for enhancing the print receptiveness of the release surface while providing desired release properties. A method for manufacturing a release liner having a print receptive surface, and a method for using a release liner are provided. | 12-25-2008 |
20100086752 | Transfer Films for Firing and Method of Forming Substrate with Functional Pattern - Transfer films for firing which have the excellent property of transferring a functional pattern and enable a pyrolysis gas generated by the firing of organic substances to be released smoothly, and which can form on a substrate a functional pattern free from defects such as a shape or function failure. One of the transfer films for firing comprises a release film and a multilayered structure formed so as to be in contact with one of the surfaces of the release film. The multilayered structure includes both a pressure-sensitive adhesive layer for bonding the transfer film for firing to a surface of a substrate and a functional pattern formed between the release film and the pressure-sensitive adhesive layer. The functional pattern comprises inorganic particles and a first organic substance removable by firing, and the pressure-sensitive adhesive layer comprises a second organic substance removable by firing and different from the first organic substance. The heat decomposition temperature of the first organic substance (Tdb), the heat decomposition temperature of the second organic substance (Tda), and the fusion bonding temperature of the inorganic particles (Tw) each measured under the firing conditions to be used for firing the multilayered structure transferred to a surface of a substrate satisfy the relationship Tdb. | 04-08-2010 |
20110003124 | RESIN FOAM - The present invention relates to a resin foam including a foam layer and a surface layer, in which the foam layer has a same composition as the surface layer, and the surface layer has a surface coating ratio defined by the following formula (1) of 40% or more: | 01-06-2011 |
20110020620 | TRANSFER-FOIL RAW FABRIC HAVING NO FOIL FALL AND PEELING FILM THEREFOR - Disclosed is a transfer-foil raw fabric and a peeling film therefore having no printed layer for partially controlling peel property and having no foil fall when slitting a transfer-foil into proper width for transfer. The transfer-foil raw fabric is characterized in that a peeling layer is formed all over a peeling film, at least a pattern layer is laminated over the peeling layer, and in that the peeling face of the peeling film which corresponds to the slitting position of the transfer-foil raw fabric is subjected to an easy-adhesion treatment by a surface modification in a band-like shape. | 01-27-2011 |
20110159255 | TRANSFER FILM AND METHOD OF MANUFACTURING SAME - A transfer film includes a substrate, a decorative layer, and an adhering layer. The decorative layer is positioned by solidifying ultraviolet curing ink on the substrate. The adhering layer is positioned on the decorative layer. | 06-30-2011 |
20120164408 | FLEXIBLE SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAME - A flexible substrate structure includes a supporting carrier, a flexible substrate, and a release layer. The flexible substrate is disposed on the supporting carrier. The release layer is disposed between and in contact with the supporting carrier and the flexible substrate. The release layer includes a bonding region with adhesion property, the bonding region is for bonding the flexible substrate and the supporting carrier together, and a release region without adhesion property, the release region is for supporting the flexible substrate. | 06-28-2012 |
20120202020 | IMAGE TRANSFER SHEET - The present invention includes an article and method for transferring an image from one substrate to another. The method includes providing or obtaining an image transfer sheet that is comprised of a substrate layer, a release layer and an image-imparting layer that may comprise a low density polyethylene or other polymeric component having a melting temperature within a range of about 90 degrees C. to about 700 degrees C. An image is imparted to the low density polyethylene area with an image-imparting medium. A second image receiving substrate can be provided. The second image receiving substrate is contacted to the first image transfer sheet at the polymer, image-imparting layer. Heat is applied to the image transfer sheet so that the low density polyethylene encapsulates the image-imparting medium and transfers the encapsulates to the image receiving substrate, thereby forming a mirror image on the image receiving substrate. | 08-09-2012 |
20130004750 | ELECTRONICALLY CONDUCTIVE LAMINATE DONOR ELEMENT - A laminate donor element can be used to transfer a composite of a metal grid and an electronically conductive polymer to a receiver sheet for use in various devices. The laminate donor element has a donor substrate, a metal grid that is disposed over only portions of the donor substrate, leaving portions of the substrate uncovered by the metal grid, and an electronically conductive polymer that covers the portions of the donor substrate that are uncovered by the metal grid. The composite of metal grid and electronically conductive polymer exhibits a peel force of less than or equal to 40 g/cm for separation from the donor substrate at room temperature. | 01-03-2013 |
20130115433 | MICROMECHANICAL SYSTEM - High precision MEMESs can be manufactured in a large amount without requiring a vacuum process or a lithography process. A film is aligned with a die so as to contact with each other. The film has a functional layer and a releasing layer printed thereon. The die is configured to mold a structure which comprises a functional layer retention part retaining the functional layer and a frame supporting the functional layer retention part. The resin filled between the die and the film is cured. Then, the film is separated from the die so that the functional layer is released from the releasing layer and transferred on the resin cured in the die, thereby the structure is formed. | 05-09-2013 |