Class / Patent application number | Description | Number of patent applications / Date published |
428670000 | Platinum group metal-base component | 17 |
20090202861 | Copper-based deposited alloy strip for contact material and process for producing the same - A copper-based deposited alloy strip for a contact material has a maximum value of a difference not larger than 100 MPa among three of tensile strengths, that are a tensile strength in a rolling direction thereof, a tensile strength in a direction crossing the rolling direction with an angle of 45 degrees, and a tensile strength in a direction crossing the rolling direction with an angle of 90 degrees. A process for producing the copper-based deposited alloy strip for a contact material includes the steps of: performing a solution heated treatment on a copper alloy strip; and performing an aging heat treatment on the copper alloy strip. | 08-13-2009 |
20100098970 | CONTACTS ON DIAMOND - A diamond substrate having a contact, wherein the contact comprises a diamond-like-carbon (DLC) layer on at least part of a surface of the diamond substrate; and at least one metal layer on at least part of the surface of the DLC layer. Methods for producing the same and devices comprising such a substrate are also described. | 04-22-2010 |
20100255342 | Metal Plating Using Seed Film - A seed film and methods incorporating the seed film in semiconductor applications is provided. The seed film includes one or more noble metal layers, where each layer of the one or more noble metal layers is no greater than a monolayer. The seed film also includes either one or more conductive metal oxide layers or one or more silicon oxide layers, where either layer is no greater than a monolayer. The seed film can be used in plating, including electroplating, conductive layers, over at least a portion of the seed film. Conductive layers formed with the seed film can be used in fabricating an integrated circuit, including fabricating capacitor structures in the integrated circuit. | 10-07-2010 |
20110123827 | LATHE MACHINING MEMBER - A cylindrical core portion, at least a part of which is made of a noble metal alloy and which has a diameter larger than a maximum diameter of a shape obtained by lathe machining, and a hollow-cylindrical peripheral portion, which is made of a material different from the material of the core portion, are included. The core portion is arranged in a hollow portion of the peripheral portion with no space. The material applied to the peripheral portion is a free-cutting material selected from a group of, for example, free-cutting brass, free-cutting phosphor bronze, free cutting nickel silver, and free-cutting beryllium copper. The noble metal alloy applied to the core portion is, for example, alloy mainly consisting of silver, palladium, gold, platinum, zinc, copper, iron, and nickel, alloy mainly consisting of palladium, silver, and copper, or alloy mainly consisting of silver, platinum, zinc, gold, and copper. | 05-26-2011 |
20110135957 | PLATINUM WELD STRUCTURES AND METHODS - A platinum welded structures are provided with a first oxide dispersion strengthened platinum or platinum alloy portion and a second oxide dispersion strengthened platinum or platinum alloy portion welded to the first platinum or platinum alloy portion. The second portion is welded to the first portion with a weld joint including a platinum or platinum alloy weld bead. The weld bead further includes at least one member selected from the group consisting of Zr, ZrO | 06-09-2011 |
20110229734 | Immersion platinum plating solution - A platinum plating solution for immersion plating a continuous film of platinum on a metal structure. The immersion platinum plating solution is free of a reducing agent. The plating process does not require electricity (e.g., electrical current) and does not require electrodes (e.g., anode and/or cathode). The solution includes a platinum source and a complexing agent including Oxalic Acid. The solution enables immersion plating of platinum onto a metal surface, a metal substrate, or a structure of which at least a portion is a metal. The resulting platinum plating comprises a continuous thin film layer of platinum having a thickness not exceeding 300 Å. The solution can be used for plating articles including but not limited to jewelry, medical devices, electronic structures, microelectronics structures, MEMS structures, nano-sized or smaller structures, structures used for chemical and/or catalytic reactions (e.g., catalytic converters), and irregularly shaped metal surfaces. | 09-22-2011 |
20110229735 | HIGH-TEMPERATURE COATINGS WITH PT METAL MODIFIED GAMMA-NI+GAMMA'-NI3AL ALLOY COMPOSITIONS - An alloy including a Pt-group metal, Ni and Al in relative concentration to provide a γ-Ni+γ′-Ni | 09-22-2011 |
20110229736 | HIGH-TEMPERATURE COATINGS WITH PT METAL MODIFIED GAMMA-NI+GAMMA'-NI3AL ALLOY COMPOSITIONS - An alloy including a Pt-group metal, Ni and Al in relative concentration to provide a γ-Ni+γ′-Ni | 09-22-2011 |
20110236720 | NOBLE METAL-CONTAINING LAYER SEQUENCE FOR DECORATIVE ARTICLES - The present invention is directed at a decorative article which has a particular noble metal-containing outer layer sequence. The invention further relates to a coating process suitable for this purpose. The layer sequence is characterized in that a palladium-containing bottom layer is followed by an electrolytically deposited alloy of ruthenium and an element of the group consisting of platinum and rhodium. | 09-29-2011 |
20120070688 | COATED ARTICLES AND METHODS - Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process. | 03-22-2012 |
20120315503 | IMMERSION PLATINUM PLATING SOLUTION - A platinum plating solution for immersion plating a continuous film of platinum on a metal structure. The immersion platinum plating solution is free of a reducing agent. The plating process does not require electricity (e.g., electrical current) and does not require electrodes (e.g., anode and/or cathode). The solution includes a platinum source and a complexing agent including Oxalic Acid. The solution enables immersion plating of platinum onto a metal surface, a metal substrate, or a structure of which at least a portion is a metal. The resulting platinum plating comprises a continuous thin film layer of platinum having a thickness not exceeding 300 Å. The solution can be used for plating articles including but not limited to jewelry, medical devices, electronic structures, microelectronics structures, MEMS structures, nano-sized or smaller structures, structures used for chemical and/or catalytic reactions (e.g., catalytic converters), and irregularly shaped metal surfaces. | 12-13-2012 |
20130260176 | COATED ARTICLES AND METHODS - Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process. | 10-03-2013 |
20150010777 | ELECTRODEPOSITION OF PLATINUM/IRIDIUM (PT/IR) ON PT MICROELECTRODES WITH IMPROVED CHARGE INJECTION PROPERTIES - Aspects of the present disclosure are directed to electrochemical approaches for synthesis of platinum-iridium alloys with selected platinum-iridium ratio content and subsequently predetermined mechanical properties and electrochemical impedance properties. Such can provide a simple and cost-effective process for preparing these electrodes, as compared to conventional thin film processing techniques. A three-electrode electrochemical electrodeposition system is described including an electrochemical cell with a working electrode on which the electrodeposited film is deposited, a counter electrode to complete the electrochemical circuit and a reference electrode to measure and control surface potential. Mixed layers of platinum atoms and iridium atoms can be deposited from electrolyte solution onto the working electrode surface to create an electrically conductive surface with material properties related to the composition of the as-deposited film. The mechanical properties and electrochemical properties of the film can be tuned by adjusting the electrodeposition parameters. | 01-08-2015 |
20150079421 | ELECTRICAL COMPONENT AND METHOD FOR FABRICATING SAME - An electrical component includes an interior layer that includes an exterior surface. The electrical component includes an intermediate layer that includes at least one platinum group metal (PGM). The intermediate layer extends on the exterior surface of the interior layer. The intermediate layer has an exterior PGM surface. The electrical component includes a silver layer that includes silver. The silver layer extends on the exterior PGM surface such that the intermediate layer extends between the interior layer and the silver layer. | 03-19-2015 |
20150360316 | COATED WIRE FOR BONDING APPLICATIONS - The invention is related to a bonding wire which contains a core having a surface and a coating layer which is at least partially superimposed over the surface of the core. The core contains a core main component selected from copper and silver. The coating layer contains a coating component selected from palladium, platinum, gold, rhodium, ruthenium, osmium and iridium in an amount of at least 10% and further contains the core main component in an amount of at least 10%. | 12-17-2015 |
20160101433 | LASER PRE-PROCESSING TO STABILIZE HIGH-TEMPERATURE COATINGS AND SURFACES - Laser pre-processing to stabilize high-temperature coatings and surfaces. One method involves melting a surface of a metal substrate ( | 04-14-2016 |
20160145746 | PALLADIUM PLATE COATED MATERIAL AND METHOD OF PRODUCING PALLADIUM PLATE COATED MATERIAL - There is provided a palladium plate coated material ( | 05-26-2016 |