Class / Patent application number | Description | Number of patent applications / Date published |
428646000 | Sn-base component | 69 |
20100119868 | PLATED MEMBER AND METHOD FOR MANUFACTURING THE SAME - According to the present invention, in order to suppress whisker formation on a plated member having a plated layer comprising a lead-free material, the orientation index of the plane ( | 05-13-2010 |
20100203353 | Pb-Free Sn-Ag-Cu-Mn Solder - A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees C. A solder joint and solder process embody the solder alloy as well as solder balls and solder paste made therefrom to provide a solidified joint that includes three different intermetallic phases and a Sn metal phase. An exemplary Sn—Ag—Cu—Mn alloy consists essentially of about 3 to about 4 weight % Ag, about 0.80 to about 1.0 weight % Cu, and about 0.05 to about 0.15 weight % Mn, and balance consisting essentially of Sn. | 08-12-2010 |
20100266870 | SOLDER JOINT - A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions. | 10-21-2010 |
20100297470 | Lead-free solder alloy - A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy. | 11-25-2010 |
20110003171 | STRONG, LIGHTWEIGHT ARTICLE CONTAINING A FINE-GRAINED METALLIC LAYER - Articles for automotive, manufacturing and industrial applications including shafts or tubes used, for example, as golf club shafts, ski and hiking poles, fishing rods or bicycle frames, skate blades and snowboards are at least partially electroplated with fine-grained layers of selected metallic materials. Parts with complex geometry can be coated as well. Alternatively, articles such as conical or cylindrical golf club shafts, hiking pole shafts or fishing pole sections, plates or foils and the like can also be electroformed of fine-grained metallic materials on a suitable mandrel or temporary substrate to produce strong, ductile, lightweight components exhibiting a high coefficient of restitution and a high stiffness for use in numerous applications including sporting goods. | 01-06-2011 |
20110206946 | METHOD FOR PRODUCING A CARBON NANOTUBE-, FULLERENE- AND/OR GRAPHENE-CONTAINING COATING - A method for producing a carbon nanotube-, fullerene- and/or graphene-containing coating on a substrate includes the steps of applying carbon nanotubes, fullerenes and/or graphenes onto a tin-containing coating and introducing carbon nanotubes, fullerenes and/or graphenes into the coating by mechanical and/or thermal treatment. A coated substrate produced by this method and the use of the coated substrate as an electromechanical component or lead frame are also described. | 08-25-2011 |
20110293962 | SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE - Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed. | 12-01-2011 |
20120021247 | Refrigeration Circuit-Forming Member - Disclosed is a refrigeration circuit-forming member which has a metal surface and is used for a refrigeration circuit in which HFO-1234yf that is a refrigerant configured of molecules having a double bond is used. The metal surface, which comes into contact with the HFO-1234yf, is covered with a coating layer that is not reactive with the HFO-1234yf within the range of temperature at which the HFO-1234yf is used. The coating layer is formed of any of a coating film that is firmly fixed to the metal surface, a coating layer that is formed by adhesion of a specific component added into the lubricant oil, and a coating layer that is formed by modification of the metal surface layer itself that forms the metal surface. Consequently, the chemical instability that is caused when the refrigerant HFO-1234yf comes into contact with the metal can be eliminated. | 01-26-2012 |
20120135270 | Layer System with Improved Corrosion Resistance - The present invention relates to a layer system for coating a substrate surface and to a method for coating a substrate surface with a corresponding layer system, the layer system comprising at least two layers. One layer is a metal-nickel-alloy layer with a metal of the group comprising tin, copper, iron, tungsten and cobalt or an alloy of at least one of said metals, and the other layer is a layer of a metal of the group comprising nickel, copper, tin, molybdenum, niobium, cobalt, chromium, vanadium, manganese, titanium and magnesium, or an alloy of at least one of said metals. The layer system according to the invention is characterized by a high mechanical stability and great corrosion resistance. | 05-31-2012 |
20120321909 | Multilayered bearing shell - The invention relates to a multilayered bearing shell ( | 12-20-2012 |
20130004792 | MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND ASSOCIATED METHODS - Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned. | 01-03-2013 |
20130029178 | ACTIVE SOLDER - An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided. | 01-31-2013 |
20130260174 | ELECTROCONDUCTIVE MATERIAL FOR CONNECTION COMPONENT - An electroconductive material for a connection component have a base member made of a copper alloy plate, a Ni coating layer, a Cu—Sn alloy coating layer, and a Sn coating layer. A surface of the material is subjected to reflow treatment. The base member surface is roughened. The Cu—Sn alloy coating layer is partially exposed from the outside surface of the Sn coating layer. Regions of the Cu—Sn alloy coating layer exposed to the outside surface of the Sn coating layer have random microstructures distributed irregularly between portions of the Sn coating layer and streak microstructures extending in parallel to a rolled direction of the base member. The streak microstructures having a length of 50 μm or more and a width of 10 μm or less are contained in a number of 35 or more per 1 mm | 10-03-2013 |
20130323530 | ACTIVE SOLDER - An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided. | 12-05-2013 |
20140134457 | CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME - A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu | 05-15-2014 |
20140141277 | COATED METALLIC PRODUCTS AND METHODS FOR MAKING THE SAME - The present invention relates generally to jewelry articles comprising a substrate and a metallic, external coating. | 05-22-2014 |
20140141278 | MULTI-COATED METALLIC PRODUCTS AND METHODS OF MAKING THE SAME - The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating. | 05-22-2014 |
428647000 | Next to Group IB metal-base component | 35 |
20090053553 | CONDUCTIVE MATERIAL FOR A CONNECTING PART - Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 μm; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [D | 02-26-2009 |
20090092851 | Heat-Resistant Sn-Plated Cu-Zn Alloy Strip with Suppressed Whiskering - In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film from the surface to the alloy strip, the Zn concentration of the surface of the Sn phase is adjusted to a range of 0.1 to 5.0 mass %. The alloy may further contain 0.005 to 3.0 mass % in total of an arbitrary constituent selected from Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti. Moreover, the alloy may be a copper base alloy containing 15 to 40 mass % of Zn, 8 to 20 mass % of Ni, 0 to 0.5 mass % of Mn and a balance of Cu and unavoidable impurities, and may further contain 0.005 to 10 mass % in total of the above arbitrary constituent. There is provided a Cu/Ni double layer base reflowed Sn-plated Cu—Zn alloy strip in which generation of whiskers is suppressed. | 04-09-2009 |
20090130480 | Sn-Plated Copper Alloy Strip Having Improved Fatigue Characteristics - The object of the invention is to provide a reflow Sn-plated copper alloy strip having improved fatigue characteristics by preventing the degradation of fatigue characteristics caused by reflow Sn plating. The invention provides a copper alloy strip having an Sn or Sn alloy plating film formed thereon by electroplating and reflowing treatment, wherein average hydrogen concentration in the strip being about 2 mass ppm or less. | 05-21-2009 |
20090176125 | Sn-Plated Cu-Ni-Si Alloy Strip - In a Sn-plated strip in which a copper base alloy contains 1.0 to 4.5 mass % of Ni, 0.2 to 1.0 mass % of Si and a balance of Cu and unavoidable impurities, an S concentration and a C concentration in a boundary between a plating layer and the base alloy are adjusted to 0.05 mass % or less, respectively. The base alloy may further contain 0.005 to 3.0 mass % in total of at least one selected from the group consisting of Sn, Zn, Mg, Fe, Mn, Co, Ti, Cr, Zr, Al and Ag. There is provided a Cu—Ni—Si base alloy Sn-plated strip in which the resistance to thermal peel of Sn plating has been improved. | 07-09-2009 |
20090197114 | MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS - A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 to 2.0% by weight Sb or Bi, and 0.5 to 3.0% Ag. Formation of voids at an interface between the solder and the solder capture pad is suppressed, by including Zn. Interlayer dielectric delamination is suppressed, and electromigration characteristics are greatly improved. Methods for forming solder joints using the solders. | 08-06-2009 |
20090197115 | TIN-SILVER COATINGS - The present invention relates to improved coatings for electrical or electronic connectors such as contacts or terminals used in automotive applications. Coatings in accordance with the present invention preferably comprise binary tin-silver coatings consisting of more than 1.0 wt % to about 20 wt %, preferably from 2.0 wt % to 15 wt %, and most preferably from 3.0 wt % to 10 wt %, silver and the balance essentially tin. The coating is preferably applied by immersing the substrate material in a molten tin-silver bath. | 08-06-2009 |
20090239094 | Cu-Zn Alloy Strip Superior in Thermal Peel Resistance of Sn Plating and Sn Plating Strip Thereof - A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and Bi is regulated to 100 ppm by mass or less, the total concentration of Ca and Mg is regulated to 100 ppm by mass or less, and the concentrations of O and S are each regulated to 30 ppm by mass or less. | 09-24-2009 |
20090291321 | Whisker-free lead frames - A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region. | 11-26-2009 |
20090297879 | Structure and Method for Reliable Solder Joints - A solder joint ( | 12-03-2009 |
20090317657 | SLIDING BEARING - The present invention refers to a sliding bearing ( | 12-24-2009 |
20100183896 | TIN-SILVER BONDING AND METHOD THEREOF - A Sn—Ag bonding and a method thereof are revealed. By means of a bonding layer formed by tin and silver between wafers, the stress released by diffusion and bonding between tin (Sn) and silver (Ag) is larger than the stress released by diffusion and bonding of conventional gold-silver bonding. Moreover, a Sn—Ag bonding method of the present invention forms Sn—Ag bonding at low temperature and releases more stress so as to reduce thermal stress generated during wafer bonding effectively. And after wafer bonding, the high temperature processes can be performed. | 07-22-2010 |
20100203354 | FLATTED MATERIAL - Disclosed is a flatted material produced by conducting cold flatting of copper alloy including 0.1-1.0 mass % of Cu, 0.05-1.5 mass % of Sn, and 0.05-1.5 mass % of Zn, and comprising residue Cu and unavoidable impurities. In the flatted material, both of the stress relaxation rates in a direction parallel to the flatting direction and a direction perpendicular to the flatting direction are 50% or less as measured by an insertion type stress relaxation test at 150° C. after 1,000 hours. | 08-12-2010 |
20100247955 | JOINT WITH FIRST AND SECOND MEMBERS WITH A JOINING LAYER LOCATED THEREBETWEEN CONTAINING SN METAL AND ANOTHER METALLIC MATERIAL; METHODS FOR FORMING THE SAME - The present invention relates to a joint ( | 09-30-2010 |
20110097597 | IMMERSION TIN SILVER PLATING IN ELECTRONICS MANUFACTURE - A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick. | 04-28-2011 |
20110111253 | LEAD-FREE TIN PLATED MEMBER AND METHOD OF FORMING PLATING LAYER - In a plated member ( | 05-12-2011 |
20120114971 | WEAR RESISTANT LEAD FREE ALLOY SLIDING ELEMENT METHOD OF MAKING - A sliding element | 05-10-2012 |
20120208044 | TIN-CONTAINING ALLOY PLATING BATH, ELECTROPLATING METHOD USING SAME, AND SUBSTRATE WITH THE ELECTROPLATING DEPOSITED THEREON - Provided are a tin-containing alloy plating bath being capable of manufacturing a tin-containing alloy plated product suitable for electric and electronic members with excellent anti-oxidation performance, and an electroplating method using the bath. Specifically the bath is a plating bath to deposit a tin-containing alloy on the surface of a substrate, which plating bath contains: (a) a tin compound containing 99.9% by mass to 46% by mass of tin based on entire metal mass in the plating bath; (b) a gadolinium compound containing 0.1% by mass to 54% by mass of gadolinium based on entire metal mass in the plating bath; (c) at least one complexing agent; and (d) a solvent, and the electroplating method uses the tin-containing alloy bath, thus can manufacture a tin-containing alloy plated product having excellent anti-oxidation performance. | 08-16-2012 |
20120282486 | REFLOW SN PLATED MATERIAL - A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less. | 11-08-2012 |
20130196174 | HIGH TEMPERATURE RESISTANT SILVER COATED SUBSTRATES - A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures. | 08-01-2013 |
20130330572 | WINDSCREEN WIPER DEVICE - The invention relates to a layered composite material for sliding elements, comprising a base layer, applied to the surface of a sliding element, made of an alloy comprising copper or aluminum and a sliding layer situated over said layer, wherein the sliding layer comprises 90.99.6 wt % of tin or tin alloy having a tin ratio of greater than 60 wt % and 0.2-6 wt % solid lubricant particles having a Mohs hardness of ≦3 and a particle size of ≦10 μm. The invention further relates to the production of said layered composite material and to use thereof for sliding bearings. | 12-12-2013 |
20140065440 | SN-COATED COPPER ALLOY STRIP HAVING EXCELLENT HEAT RESISTANCE - A Sn-coated copper alloy strip including a surface coating layer containing a Ni layer, a Cu—Sn intermetallic compound layer, and a Sn layer formed in this order over the surface of a base material containing a copper alloy strip, in which an average thickness of the Ni layer is from 0.1 to 3.0 μm, an average thickness of the Cu—Sn intermetallic compound layer is from 0.02 to 3.0 μm, an average thickness of the Sn layer is from 0.01 to 5.0 μm, and the Cu—Sn intermetallic compound layer contains only an η-phase or the η-phase and an ε-phase. | 03-06-2014 |
20140170436 | TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSERTION/EXTRACTION PERFORMANCE - Tin-plated copper-alloy material for terminal in which: a Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer is an alloy layer containing Cu | 06-19-2014 |
20140178711 | CORROSION RESISTANT BARRIER FORMED BY VAPOR PHASE TIN REFLOW - A copper substrate for use as a contact having Sn plating, nickel plating and Au plating overlying the substrate. A combination of Sn plating is applied over a copper substrate; nickel plating is applied over the Sn plating; and Au plating is applied over the nickel plating to form a stack. The stack is then processed by a vapor phase Sn reflow step that results in the formation of intermetallics and eliminates stannous oxide layers that may otherwise form on the tin layer. The intermetallic layers provide excellent corrosion resistance, and serve as diffusion barriers to prevent the further migration of either Ni atoms or Cu atoms into the Sn, and Sn atoms outwardly into either the Ni or the Cu. Regardless of the thickness, the interfaces are substantially free of oxides, in particular tin oxide, and not prone to delamination. | 06-26-2014 |
20140287262 | TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSERTION/EXTRACTION PERFORMANCE - Tin-plated copper-alloy terminal material in which Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer contains Cu | 09-25-2014 |
20140308540 | PLATED CONTACT AND PROCESS OF MANUFACTURING PLATED CONTACT - Plated contacts and processes of manufacturing plated contacts are disclosed. The processes include providing a metallic substrate, applying tin-containing plating over the metallic substrate, applying corrosion-prevention plating over the first tin-containing plating, applying a second tin-containing plating over the first corrosion-prevention plating, applying a second corrosion-prevention plating over the second tin-containing plating, and applying a gold plating over the second corrosion-prevention plating to form the plated contact. One or both of the first corrosion-prevention plating and the second corrosion-prevention plating includes nickel, a nickel-based alloy, copper, a copper containing alloy, or a combination thereof. The plated contacts include a metallic substrate, a first tin-containing plating over the metallic substrate, a first corrosion-prevention plating over the first tin-containing plating, a second tin-containing plating over the first corrosion-prevention plating, a second corrosion-prevention plating over the second tin-containing plating, and a gold plating over the second corrosion-prevention plating to form the plated contact. | 10-16-2014 |
20140370328 | Tin Whisker Mitigation Material Using Thin Film Metallic Glass Underlayer - The present invention relates to a tin whisker mitigation material using thin film metallic glass underlayer, which is a thin film metallic glass (TFMG) formed between a metal substrate and a tin layer. Particularly, the TFMG can be a Zr | 12-18-2014 |
20150010774 | METHODS AND APPARATUSES FOR MITIGATING TIN WHISKER GROWTH ON TIN AND TIN-PLATED SURFACES BY DOPING TIN WITH GERMANIUM - The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films and tin-plated surfaces by doping the tin with germanium. | 01-08-2015 |
20150056466 | TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSERTION/EXTRACTION PERFORMANCE - A tin-plated copper-alloy terminal material wherein: a Sn-based surface layer formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer/a Ni—Sn alloy layer/a Ni or Ni alloy layer are formed in sequence from the Sn-based surface layer between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer is a compound-alloy layer containing Cu | 02-26-2015 |
20150118515 | TIN-PLATED COPPER-ALLOY TERMINAL MATERIAL - Tin-plated copper-alloy terminal material including a base material made of Cu alloy; a Sn-based surface layer formed on a surface of the base material and having an average thickness of 0.2 μm or larger and 0.6 μm or smaller; a Cu—Sn alloy layer generated between the Sn-based surface layer and the base material; and a Ni-based coating layer, formed of Ni or Ni—Sn alloy having a coating thickness of 0.005 μm or larger and 0.05 μm or smaller, in which an oil-sump depth Rvk of the Cu—Sn alloy layer measured when the Cu—Sn alloy layer is appeared on a surface by fusing and removing the Sn-based surface layer is 0.2 μm or larger; a part of the Cu—Sn alloy layer is exposed from the Sn-based surface layer; the Ni-based coating layer is formed on the exposed Cu—Sn alloy layer; and dynamic friction coefficient of the surface is 0.3 or less. | 04-30-2015 |
20150325326 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE,CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL - The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002≦Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.1011-12-2015 | |
20150325327 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL - A copper alloy for an electric and electronic devices comprises 23 mass % to 36.5 mass % of Zn; 0.1 mass % to 0.9 mass % of Sn; 0.15 mass % to less than 1.0 mass % of Ni; 0.001 mass % to less than 0.10 mass % of Fe; 0.005 mass % to 0.1 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002≦Fe/Ni<0.7, 3<(Ni+Fe)/P<15, and 0.311-12-2015 | |
20150348665 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL - The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device comprises more than 2.0 mass % and less than 23.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002≦Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.1012-03-2015 | |
20160078976 | Corrosion Resistant Barrier Formed by Vapor Phase Tin Reflow - A copper substrate for use as a contact having tin plating, nickel plating and gold plating overlying the substrate. A combination of tin plating is applied over a copper substrate; nickel plating is applied over the tin plating; and gold plating is applied over the nickel plating to form a stack. The stack is then processed by a vapor phase tin reflow step that results in the formation of intermetallics and eliminates stannous oxide layers that may otherwise form on the tin layer. The intermetallic layers provide excellent corrosion resistance, and serve as diffusion barriers to prevent the further migration of either nickel atoms or copper atoms into the tin, and tin atoms outwardly into either the nickel or the copper. Regardless of the thickness, the interfaces are substantially free of oxides, in particular tin oxide, and not prone to delamination. | 03-17-2016 |
20160111179 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL - A copper alloy for electric and electronic devices includes: Zn from more than 2 mass % to less than 23 mass %; Sn at 0.1 mass % or more and 0.9 mass % or less; Ni at 0.05 mass % or more and less than 1.0 mass %; Fe at 0.001 mass % or more and less than 0.10 mass %; P at 0.005 mass % or more and 0.1 mass % or less; and a balance including Cu and unavoidable impurities, wherein a ratio Fe/Ni satisfies 0.002≦Fe/Ni<1.5 by atomic ratio, a ratio (Ni+Fe)/P satisfies 3<(Ni+Fe)/P<15 by atomic ratio, a ratio Sn/(Ni+Fe) satisfies 0.304-21-2016 | |
20160194735 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL | 07-07-2016 |
428648000 | Next to Group VIII metal-base component | 17 |
20080233426 | Steel sheeting for use in room size radio frequency shielded enclosures and method for making improved steel sheeting - A radio-frequency shield comprised of a sheet of steel and tin-plating on at least one side of said sheet of steel. In addition, a method of making a radio-frequency shielding consisting of tin-plating at least one side of at least one sheet of steel. In addition, a backer material can be added to the back side the steel sheet which allows tin-plated steel sheets to be overlayed and attached to one another. | 09-25-2008 |
20080261071 | Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components - A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating. | 10-23-2008 |
20090047542 | Hot-Dip Sn-Zn Coated Steel Sheet Having Excellent Corrosion Resistance - An exemplary embodiment of a hot-dip Sn—Zn coated steel sheet is provided which can include a steel sheet and a hot-dip coating layer which is formed on a surface of the steel sheet. The coating layer can contain between about 1 mass % and about 8.8 mass % of Zn, and a remainder including between about 91.2 mass % and about 99.0 mass % of Sn and inevitable impurities. A ratio of an endothermic value of melting heat generated by Sn—Zn eutectic crystals and an endothermic value of melting heat generated by Sn primary crystals in the hot-dip coating layer can satisfy the following relationship: (endothermic value of melting heat generated by Sn primary crystals)/{(endothermic value of melting heat generated by Sn primary crystals)+(endothermic value of melting heat generated by Sn—Zn eutectic crystals)}≧about 0.3. Further, a temperature of an endothermic peak generated by melting of the Sn primary crystals can be between about 200° C. and about 230° C., and a temperature of an endothermic peak generated by melting of the Sn—Zn eutectic crystals may be between about 198° C. and about 200° C. | 02-19-2009 |
20090155621 | Tin-Plated Steel Sheet and Method for Manufacturing the Same - A tin-plated steel sheet includes a plating layer containing tin on at least one surface of a steel sheet, and a chemical conversion coating containing P and tin on the plating layer is provided. In the steel sheet, a coated amount of the chemical conversion coating per surface is 1.0 to 50 mg/m | 06-18-2009 |
20100104890 | HOT DIP PLATED HIGH STRENGTH STEEL SHEET FOR PRESS FORMING USE SUPERIOR IN LOW TEMPERATURE TOUGHNESS AND METHOD OF PRODUCTION OF THE SAME - The present invention provides hot dip plated high strength steel sheet for press forming use having a tensile strength of 380 MPa to less than 540 MPa, having a press formability able to be used for the automobile field, in particular fuel tank applications, and having superior secondary work embrittlement resistance and superior seam weld zone low temperature toughness and further superior plateability and a method of production of the same and provides
| 04-29-2010 |
20100203355 | ENVIRONMENTALLY-FRIENDLY STEEL SHEET FOR A CAN OR A CONTAINER AND PRODUCTION METHOD THEREOF AS WELL AS LAMINATED AND PRE-COATED STEEL SHEET BY USING IT - Laminated steel sheet for a container material with a small environmental load container material and coating pre-coated steel sheet for a container material characterized by comprising steel sheet having on it a tin layer or iron-tin alloy layer which has on it a tin oxide layer of a thickness measured by an electric stripping method of 0 mC/cm | 08-12-2010 |
20100310898 | PLATED STEEL SHEET FOR CANS AND METHOD FOR PRODUCTION OF THE SAME - Plated steel sheet comprised of steel sheet having a tin alloy layer on it, which is characterized by (i) having free tin distributed on the tin alloy layer in a 5 to 97% area rate and further (ii) having a chemically treated layer having phosphate in an amount of 1.0 to 5.0 mg/m | 12-09-2010 |
20110091741 | METHOD FOR PRODUCING TINNED STEEL SHEET, TINNED STEEL SHEET, AND CHEMICAL CONVERSION SOLUTION - A chemical conversion solution contains greater than 18 to 200 g/L or less of aluminum phosphate monobasic and has a pH of 1.5 to 2.4. A method for producing a tinned steel sheet includes forming an Sn-containing plating layer on at least one surface of a steel sheet such that the mass per unit area of Sn is 0.05 to 20 g/m | 04-21-2011 |
20110104514 | METHOD FOR PRODUCING TINNED STEEL SHEET AND TINNED STEEL SHEET - A method for producing a tinned steel sheet includes forming an Sn-containing plating layer on at least one surface of a steel sheet such that mass per unit area of Sn is 0.05 to 20 g/m | 05-05-2011 |
20120064365 | SLIDE MEMBER - A slide member is disclosed. The slide member includes a bearing alloy layer, a Ni-based intermediate layer provided over the bearing alloy layer, and a Sn-based overlay provided over the Ni-based intermediate layer. The Sn-based overlay comprises at least one layer, the Sn-based overlay including a first layer or region having a sliding surface and a second layer or region placed in contact with the Ni-based intermediate layer. The first layer or region contains Sn and 3 mass % or more of Cu and the second layer or region contains Sn and 8 mass % or less of Cu. | 03-15-2012 |
20120288731 | ELECTRONIC COMPONENT - A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively. | 11-15-2012 |
20130089751 | STEEL SHEET FOR CONTAINER AND METHOD OF MANUFACTURING THE SAME - The present invention provides a steel sheet for a container including a cold-rolled steel sheet and a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing: at least one metal ion of an Sn ion, an Fe ion, and an Ni ion; Zr ion; a nitric acid ion: and an ammonium ion, in which the composite film contains at least one element of: Zr of 0.1 to 100 mg/m | 04-11-2013 |
20130323531 | BONDED BODY OF ELECTRICALLY CONDUCTIVE MATERIALS - A bonded body of electrically conductive materials including a bonding interface structure in which paired bonded members ( | 12-05-2013 |
20140162087 | METHOD FOR ENHANCING A METALLIC COATING ON A STEEL STRIP - The invention relates to a method for enhancing a metallic coating on a steel strip or steel plate, the coating being melted by heating to a temperature above the melting temperature of the material of the coating, the heating taking place by irradiation of the surface of the coating with electromagnetic radiation having a high power density over a limited irradiation time of not more than 10 μs, and the mandated irradiation time and the energy density introduced into the coating by the electromagnetic radiation being selected such that the coating melts completely over its entire thickness down to the boundary layer with the steel strip, thereby forming a thin alloy layer at the boundary layer between the coating and the steel strip. The invention further relates to a steel strip or steel plate having a metallic coating, more particularly a coating of tin, zinc or nickel, in which, at the boundary layer between the steel and the coating, an alloy layer which is thin—compared with the thickness of the coating—and at the same time is dense, and is composed of iron atoms and atoms of the coating material, is formed, the thickness of the alloy layer corresponding to an alloy-layer add-on of less than 0.3 g/m | 06-12-2014 |
20150017469 | SHEET STEEL FOR USE AS PACKAGING STEEL AND METHOD FOR PRODUCING PACKAGING STEEL - The invention relates to sheet steel for use as packaging steel, made of a non-alloy or low-alloy and cold-rolled steel having a carbon content of less than 0.1%. According to the invention, in order to use such sheet steel for packaging steel that has good formability and can be produced in a cost-effective way, the sheet steel contains less than 0.4 wt % of manganese, less than 0.04 wt % of silicium, less than 0.1 wt % of aluminum, and less than 0.1 wt % of chromium and is provided with a multi-phase structure, comprising ferrite and at least one of the structure constituents martensite, bainite, and/or residual austenite. The invention further relates to a method for producing such packaging steel from cold-rolled sheet steel. | 01-15-2015 |
20160008930 | LEAD-FREE SOLDER AND ELECTRONIC COMPONENT BUILT-IN MODULE | 01-14-2016 |
20160138178 | METHOD FOR MANUFACTURING CHROMIUM-CHROMIUM OXIDE COATED SUBSTRATES - A method for manufacturing a chromium metal-chromium oxide coated substrate by electrolytically depositing the chromium metal-chromium oxide coating on an electrically conductive substrate from an electrolyte solution that includes a trivalent chromium compound and a chelating agent, wherein the electrolyte solution is free of chloride ions and of a boric acid buffering agent, the electrically conductive substrate acts as a cathode and an anode including a catalytic coating of iridium oxide or a mixed metal oxide is chosen for reducing or eliminating the oxidation of Cr(III)-ions to Cr(VI)-ions. | 05-19-2016 |