Class / Patent application number | Description | Number of patent applications / Date published |
428607000 | Composite | 37 |
20080199719 | Data recording medium for data storage and method of recording or erasing data using the same - Provided is a data recording medium having improved data recording/storage characteristics and with an improved structure to have a higher data storage capacity, and a method of recording and/or easing data using the same. The data recording medium may include a Cu electrode layer on a substrate, and a data recording layer formed of a compound including a metal and at least one non-metal selected from the group consisting of S, Se, and Te, on the Cu electrode layer. Data is recordable to or erasable from the data recording layer by changing the resistance of the data recording layer by diffusing Cu ions from the Cu electrode layer to the data recording layer or by erasing Cu ions from the data recording layer by diffusing Cu ions from the data recording layer back to the Cu electrode layer, according to a voltage pulse applied to the data recording layer. | 08-21-2008 |
20080274367 | RECOVERED HIGH STRENGTH MULTI-LAYER ALUMINUM BRAZING SHEET PRODUCTS - A multi-layer metallurgical product comprising a core aluminum alloy, purposefully tailored through chemistry and processing route to resist recrystallization during the brazing cycle to intentionally exploit the higher strengths immediately after brazing of a deformed and recovered microstructure, the core aluminum alloy being positioned on one side to an aluminum alloy interliner designed to be resistant to localized erosion, which, in turn, is adjacent to a 4xxx cladding alloy. The multi-layer product can be fabricated at least in part via any multi-alloy ingot casting processes such as the Simultaneous Multi-Alloy Casting process or the Unidirectional Solidification of Castings process. | 11-06-2008 |
20080299410 | METHOD FOR FABRICATING LARGE DIMENSION BONDS USING REACTIVE MULTILAYER JOINING - A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies. | 12-04-2008 |
20090011271 | ULTRA-THIN COPPER FOIL WITH CARRIER AND PRINTED WIRING BOARD USING ULTRA-THIN COPPER FOIL WITH CARRIER - To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultra-fine width such that line/space is 15 mum or less, and the microscopic line and a wiring board have large peel strength even after line of 15 mum is etched. An ultra-thin copper foil wherein a carrier foil, a peeling layer, an ultra-thin copper foil are laminated in this order, the ultra-thin copper foil (before roughening treatment is performed) is an electrolytic copper foil that surface roughness of 2.5 mum as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 mum or more. Moreover, the surface of the ultra-thin copper foil is performed roughening treatment. | 01-08-2009 |
20090029186 | SURFACE-TREATED COPPER FOIL, MANUFACTURING METHOD OF THE SURFACE-TREATED COPPER FOIL, AND SURFACE-TREATED COPPER FOIL COATED WITH VERY THIN PRIMER RESIN LAYER - It is an object of the present invention to provide a surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. To achieve this object, a surface-treated copper foil comprising an rust-proofing layer and a silane coupling agent layer formed on the bonding surface of an electrodeposited copper foil to an insulating resin substrate, wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m | 01-29-2009 |
20090047539 | SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME - It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density. | 02-19-2009 |
20090291319 | COPPER FOIL WITH CARRIER SHEET, METHOD FOR MANUFACTURING COPPER FOIL WITH CARRIER SHEET, SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET AND COPPER-CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET - An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300° C. is applied in the production of a printed wiring board. In order to achieve the object, a copper foil with physically releasable carrier sheet having a copper foil layer on the surface of the carrier sheet through a bonding interface layer, characterized in that the bonding interface layer is composed of a metal layer and a carbon layer. It is preferable for the bonding interface layer to be composed of a metal layer of 1 nm to 50 nm thick and a carbon layer of 1 nm to 20 nm thick. | 11-26-2009 |
20090305076 | FOIL BASED SEMICONDUCTOR PACKAGE - The present inventions relate to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. In one embodiment, a foil carrier structure is formed by ultrasonically bonding portions of a conductive foil to a metallic carrier. The bonded portions define panels in the foil carrier structure. In some embodiments, the foil carrier structure is cut to form multiple isolated panels that are sealed along their peripheries. Each isolated panel may be approximately the size of a conventional leadframe strip or panel. As a result, existing packaging equipment may be used to add dice, bonding wires and molding material to the panel. The ultrasonic welding helps prevent unwanted substances from penetrating the foil carrier structure during such processing steps. After the carrier portion of the molded foil carrier structure is removed, the structure is singulated into integrated circuit packages. Some embodiments relate to methods that utilize some or all of the aforementioned operations. Other embodiments relate to arrangements used in the above processes. | 12-10-2009 |
20090324988 | COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND APPARATUS FOR PRODUCTION OF SAME, AND HIGH FREQUENCY CIRCUIT USING COPPER FOIL - A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same. | 12-31-2009 |
20100261033 | Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board - Provided is a copper foil for a printed circuit board comprising a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to a “nickel zinc layer”) on a roughened surface of a copper foil, and a chromate film layer on the nickel zinc layer, wherein the zinc add-on weight per unit area of the nickel zinc layer is 180 μg/dm | 10-14-2010 |
20100316884 | COPPER-CLAD LAMINATE - A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ≧500 N/m and the polyimide film shows a light transmittance of ≧40% for a light of wavelength of 600 nm and a haze of ≦30% [the light transmittance and haze are values measured after the copper foil is removed by etching]. | 12-16-2010 |
20100330390 | STRUCTURAL MEMBER TO BE USED IN APPARATUS FOR MANUFACTURING SEMICONDUCTOR OR FLAT DISPLAY, AND METHOD FOR PRODUCING THE SAME - A structural member for a manufacturing apparatus has a metal base member mainly composed of aluminum, a high-purity aluminum film formed on the surface of the metal base member, and a nonporous amorphous aluminum oxide passivation film which is formed by anodizing the high-purity aluminum film. A method for producing a structural member for a manufacturing apparatus, includes forming a high-purity aluminum film on the surface of a metal base member mainly composed of aluminum, and anodizing the high-purity aluminum film in a chemical conversion liquid having a pH of 4-10 and containing a nonaqueous solvent, which has a dielectric constant lower than that of water and dissolves water, thereby converting at least a surface portion of the high-purity aluminum film into a nonporous amorphous aluminum oxide passivation film. | 12-30-2010 |
20110123822 | NANOSIZE STRUCTURES COMPOSED OF VALVE METALS AND VALVE METAL SUBOXIDES AND PROCESS FOR PRODUCING THEM - A strip-like or sheet-like valve metal or valve metal suboxide structure which has a transverse dimension of from 5 to 100 nm. | 05-26-2011 |
20110171486 | COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND APPARATUS FOR PRODUCTION OF SAME, AND HIGH FREQUENCY CIRCUIT USING COPPER FOIL - A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same. | 07-14-2011 |
20110189499 | SURFACE TREATED COPPER FOIL AND COPPER CLAD LAMINATE - To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni—Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)×100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm | 08-04-2011 |
20110293960 | Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same - Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a heat resistance layer composed of zinc or zinc alloy or its oxide formed on an etching side of the rolled copper foil or electrolytic copper foil, and a layer of nickel or nickel alloy, which is a metal or alloy with a lower etching rate than copper, formed on the heat resistance layer. This invention aims to prevent sagging caused by the etching, to form a uniform circuit having the intended circuit width, and to shorten the time of forming a circuit by etching as much as possible, when forming a circuit by etching a copper foil of the copper-clad laminate; and also aims to make the thickness of the nickel or nickel alloy layer as thin as possible, to inhibit oxidation when exposed to heat, to prevent tarnish (discoloration) known as “YAKE”, to improve the etching properties in pattern etching, and to prevent the occurrence of short circuits and defects in the circuit width. | 12-01-2011 |
20110300401 | Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same - A rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, characterized in comprising a layer of metal of one or more types among a platinum group, gold and silver with an etching rate that is lower than the copper formed on an etching surface side of the rolled copper foil or the electrolytic copper foil, or alternatively comprising a layer of an alloy having the above-described metal as its main component. This invention aims to achieve the following upon forming a circuit by etching a copper foil of a copper clad laminate; specifically, to prevent sagging caused by the etching; to form a uniform circuit of the intended circuit width; to shorten the time of forming a circuit by etching as much as possible; to improve the etching properties in pattern etching; and to prevent the occurrence of short circuits and defects in the circuit width. | 12-08-2011 |
20120107637 | Copper Foil for Semiconductor Package Substrate and Substrate for Semiconductor Package - A copper foil for a semiconductor package substrate comprising a chromate treatment layer or a coating layer made of zinc or zinc oxide and chromium oxide formed on a roughened surface of a copper foil to serve as an adherend surface with resin, and a silane coupling agent layer. With this copper foil for a semiconductor package substrate, the amount of Cr in the chromate coating layer is 25 to 150 μg/dm | 05-03-2012 |
20120148862 | Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board - A copper foil for a printed circuit board is provided. The copper foil includes a layer including nickel, zinc, a compound of nickel and that of zinc (hereinafter referred to as a “nickel zinc layer”) on a roughened surface of a copper foil and a chromate film layer on the nickel zinc layer. The zinc add-on weight per unit area of the nickel zinc layer is 180 μg/dm | 06-14-2012 |
20120164470 | SILVER-NICKEL CORE-SHEATH NANOSTRUCTURES AND METHODS TO FABRICATE - Embodiments of the invention generally provide core-sheath nanostructures and methods for forming such nanostructures. In one embodiment, a method for forming core-sheath nanostructures includes stirring an aqueous dispersion containing silver nanostructures while adding a catalytic metal salt solution to the aqueous dispersion and forming catalytic metal coated silver nanostructures during a galvanic replacement process. The method further includes stirring an organic solvent dispersion containing the catalytic metal coated silver nanostructures dispersed in an organic solvent while adding a nickel salt solution to the organic solvent dispersion, and thereafter, adding a reducing solution to the organic solvent dispersion to form silver-nickel core-sheath nanostructures during a nickel coating process. In one embodiment, the core-sheath nanostructures are silver-nickel core-sheath nanowires, wherein each silver-nickel core-sheath nanowire has a sheath layer of nickel disposed over and encompassing a catalytic metal layer of palladium disposed on a nanowire core of silver. | 06-28-2012 |
20120196144 | ULTRA THIN COPPER FOIL WITH VERY LOW PROFILE COPPER FOIL AS CARRIER AND ITS MANUFACTURING METHOD - The present invention relates to an ultra thin copper foil with a very low profile copper foil as a carrier, comprising a carrier foil | 08-02-2012 |
20130040162 | SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD - Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 μm or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 μm, a height of 0.6-1.8 μm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 μm. The aforesaid Ni—Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dm | 02-14-2013 |
20130065074 | GRAPHITE OXIDE-CONTAINING RESIN FORMULATION, COMPOSITION, AND COMPOSITE THEREOF - The present disclosure is related to a carbon-nanomaterial-supported catalyst, including: a carbon nanomaterial, and a polymer grafted onto the carbon nanomaterial, wherein the polymer has a repeat unit containing a phosphonium salt and its molecular weight is 1,000-200,000. The disclosure is also related to a method of preparing carbonate, which includes using the carbon nanomaterial-supported catalyst for the cycloaddition reaction of carbon dioxide into the epoxy group. | 03-14-2013 |
20130216854 | Vacuum Insulated Panels of Arbitrary Size and Method for Manufacturing the Panels - The present invention is a vacuum insulated panel (VIP) for increasing the thermal insulation surrounding a structure or volume, and a novel method for manufacturing the VIP. The VIP comprises at least two pieces of thin metal foil welded together adjacent the edges of said metal foil, said thin metal foil material defining the exterior of a sealed and gas evacuated vacuum enclosure; and a vacuum insulation panel core located between said at least two pieces of welded thin metal foil material, said vacuum insulation panel core located inside said sealed and gas evacuated vacuum enclosure. | 08-22-2013 |
20130216855 | CARRIER-ATTACHED COPPER FOIL - The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm | 08-22-2013 |
20130236737 | METAL FOIL FOR BASE MATERIAL - A metal foil including: a steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and a thickness of the alloy layer is 0.1 to 8 μm and the alloy layer contains an Al | 09-12-2013 |
20130260171 | CHARGE COLLECTION TAPE - A charge collection tape is disclosed that includes a foil substrate and an adhesive layer laminated on the foil substrate. The foil substrate is constructed of an aluminum base foil having a conductive metal coating overlying and in direct contact with a non-oxidized surface of the aluminum base foil. A method of making the charge collection tape is also disclosed. | 10-03-2013 |
20130295407 | SURFACE-TREATED COPPER FOIL - An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/m | 11-07-2013 |
20140272450 | NEAR EUTECTIC COMPOSITION NICKEL BASE SANDWICH BRAZE FOIL - A braze foil ( | 09-18-2014 |
20140287259 | STEEL FOIL AND METHOD FOR MANUFACTURING THE SAME - A steel foil according to an aspect of the present invention includes a rolled steel foil; and a Ni having <111>//RD texture plated on an outermost layer of the rolled steel foil. Regarding the steel foil, a <111> pole density in an inverse pole figure of a rolling direction may be 3.0 or more and 6.0 or less. | 09-25-2014 |
20140308538 | SURFACE TREATED ALUMINUM FOIL FOR ELECTRONIC CIRCUITS - The surface of an aluminum substrate is modified to enhance the adhesion of the metal to polymeric materials. Intermediate layers, such as Zn/Sn, Co/Ni, and a Cu strike are applied before depositing a nodular Cu layer for bond enhancement. The surface treated aluminum substrate can be used in printed circuit boards, leadframes, or any electrical/electronic devices where Cu is typically used to reduce the cost and weight of the devices. | 10-16-2014 |
20140349133 | HOT-DIP GALVANIZED STEEL SHEET HAVING EXCELLENT ADHESIVENESS AT ULTRA-LOW TEMPERATURES AND METHOD MANUFACTURING THE SAME - Provided is a hot-dip galvanized steel sheet having excellent adhesiveness at ultra-low temperatures as well as fine spangles, and a method of manufacturing the same. According to the present invention, a hot-dip galvanized steel sheet having excellent adhesiveness at ultra-low temperatures includes a base steel sheet, a composite layer formed on the base steel sheet and including transition metal, an inhibition layer formed on the composite layer and including a iron-aluminum (Fe—Al) based intermetallic compound, and a zinc (Zn)-plated layer formed on the inhibition layer, in which an average diameter of spangles in the zinc-plated layer is 150 μm or less, and a method of manufacturing the hot-dip galvanized steel sheet is provided. | 11-27-2014 |
20150064493 | COPPER FOIL COMPOSITE, FORMED PRODUCT AND METHOD OF PRODUCING THE SAME - A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f | 03-05-2015 |
20150086806 | Carrier-Attached Copper Foil - The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm | 03-26-2015 |
20150104667 | CLADDING MATERIAL FOR STAINLESS STEEL CLAD STEEL PLATE, STAINLESS STEEL CLAD STEEL PLATE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME - A cladding material for stainless steel clad steel plate, includes, by mass %, 0.03% or less carbon, 1.5% or less silicon, 2.0% or less manganese, 0.04% or less phosphorus, 0.03% or less sulfur, 22.0% to 25.0% nickel, 21.0% to 25.0% chromium, 2.0% to 5.0% molybdenum, 0.15% to 0.25% nitrogen, and the balance being iron and incidental impurities, wherein critical pitting temperature (CPT) after normalization as determined in accordance with ASTM G48-03 Method E is 45° C. or higher, and corrosion loss at a welded zone as determined by a corrosion test in accordance with NORSOK Standard M-601 is 1.0 g/m | 04-16-2015 |
20150352673 | COMPONENT REPAIR USING BRAZED SURFACE TEXTURED SUPERALLOY FOIL - A superalloy component such as a gas turbine engine blade ( | 12-10-2015 |
20160035452 | ALUMINUM ELECTRODE, METHOD OF FORMING AN ALUMINUM ELECTRODE AND ELECTRONIC DEVICE THEREWITH - The present disclosure relates to an aluminum electrode, a method of forming an aluminum electrode and an electronic device therewith. An aluminum electrode according to one aspect of the present disclosure comprises: a bottom layer consisting of molybdenum; a top layer consisting of molybdenum; and an aluminum layer located between the bottom layer and the top layer, wherein the bottom layer, the top layer and the aluminum layer are formed at a temperature below 120° C. An aluminum electrode according to one embodiment of the present disclosure eliminates the mouse bite phenomenon. An aluminum electrode according to another aspect of the present disclosure comprises: a bottom layer consisting of a metal or metal-alloy nitride; a top layer consisting of molybdenum; and an aluminum layer located between the bottom layer and the top layer, wherein the bottom layer, the top layer and the aluminum layer are formed at a temperature below 120° C. An aluminum electrode according to another embodiment of the present disclosure eliminates both of the mouse bite phenomenon and the undercut phenomenon, and can further arrive at a desired profile angle by controlling the content of nitrogen. | 02-04-2016 |