Entries |
Document | Title | Date |
20090011270 | Textile article for burner cover - The invention discloses a textile article for the usage of a burner cover. The textile article is weaved with a plurality of metal yarns, each of which is blended with a plurality of metal filaments or metal fibers. Particularly, the textile article comprises 100% by weight of the metal filaments. | 01-08-2009 |
20090017325 | ROLLED COPPER FOIL - A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200} | 01-15-2009 |
20090098405 | BENT ROD-SHAPED METAL PARTICLES, MANUFACTURING METHOD FOR THE SAME, COMPOSITION CONTAINING THE SAME, AND CONDUCTIVE MATERIAL - To provide bent rod-shaped metal particles having at least one bend point, wherein an average bend angle at the bend point is 5° to 175°. | 04-16-2009 |
20090142614 | Biodegradable Bags for Packing Foods Available in High Speed Production - It is an object of the present invention to provide a biodegradable bag for packing a food capable of storing a food such as a snack food which is required to have an oxygen barrier property and a water vapor barrier property, which can be produced at a high speed by a bag making and packaging machine, which can be degraded by naturally occurring microorganisms in soil or water finally to a non-hazardous degradation product, which can be biorecycled, and which is not accumulated in nature. | 06-04-2009 |
20090176121 | ELECTROCONDUCTIVE DIFFUSE REFLECTIVE FILM AND METHOD OF PRODUCING THE SAME - An electroconductive diffuse reflective film is made of an electroconductive metal, wherein the electroconductive diffuse reflective film has a porous structure in which crystal grains having an average grain diameter of 50 nm or more and 1,000 nm or less are separately arranged at intervals of 10 nm or more and 800 nm or less on average. | 07-09-2009 |
20090197109 | ELECTROCONDUCTIVE LAYER, LAMINATE USING THE SAME, AND PRODUCING PROCESSES THEREOF - The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm. | 08-06-2009 |
20090269609 | Degreasing method for aluminium hard foil, aluminium hard foil, aluminium hard foil electrode member, and lithium ion secondary battery using said member - An aluminum hard foil is degreased without reducing the hardness to improve the coating performance of coating material. A foil-rolled aluminum foil is subjected to a low-temperature heat treatment for holding the aluminum foil at 80 to 160° C. for 1 hour or more. The low-temperature heat treatment is preferably performed by subjecting the aluminum foil to batch processing with the aluminum foil coiled. | 10-29-2009 |
20090269610 | HIGH-ENERGY CAPACITORS FOR IMPLANTABLE DEFIBRILLATORS - Implantable defibrillators are implanted into the chests of patients prone to suffering ventricular fibrillation, a potentially fatal heart condition. A critical component in these devices is an aluminum electrolytic capacitor, which stores and delivers life-saving bursts of electric charge to a fibrillating heart. To reduce capacitor size, manufacturers have developed special aluminum foils, such as core-etched and tunnel-etched aluminum foils. Unfortunately, core-etched foils don't work well in multiple-anode capacitors, and tunnel-etched foils are brittle and tend to break when making some common types of capacitors. Accordingly, the inventors devised a new foil structure having perforations and cavities. In an exemplary embodiment, each perforation and cavity has a cross-sectional area, with the perforations having a larger, for example, 2 to 100 times larger, average cross-sectional area than the cavities. Other embodiments of the invention include foil assemblies, capacitors, and implantable defibrillators that benefit from properties of the new foil structure. | 10-29-2009 |
20100255334 | Production Apparatus for Electro-Deposited Metal Foil, Production Method of Thin Plate Insoluble Metal Electrode Used in Production Apparatus for Electro-Deposited Metal Foil, and Electro-Deposited Metal Foil Produced by Using Production Apparatus for Electro-Deposited Metal Foil - An object of the present invention is to provide a production apparatus for electro-deposited metal foil or the like that can reduce thickness fluctuation of electro-deposited metal foil. To achieve the object, a production apparatus for electro-deposited metal foil or the like in which a cathode and an insoluble anode apart from each other, supplying an electrolytic solution through a gap between the cathode and the anode, making the cathode move along to the insoluble anode, electrodepositing a metal component on an electro-deposition surface of the moving cathode is applied. Wherein the insoluble anode is a thin plate insoluble metal electrode provided with a conductive electrode material coating layer on a surface of a substrate made of a corrosion-resistant material, and detachably mounted to an electrode base by using predetermined fixing means, and the conductive electrode material coating layer of the thin plate insoluble metal electrode is provided with a conductive electrode material stripped belt in a direction perpendicular to a moving direction of the cathode, and the fixing means is provided in the conductive electrode material stripped belt. | 10-07-2010 |
20100291402 | ROLLED COPPER FOIL AND MANUFACTURING METHOD THEREOF - A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111} | 11-18-2010 |
20100323214 | Rolled copper foil - A rolled copper foil includes copper (Cu), an inevitable impurity, a first additive element that forms a solid solution in the copper, and a second additive element that is different from the first additive element, is contained in the copper, and forms a compound with the inevitable impurity. | 12-23-2010 |
20110003168 | REFLECTIVE FILM AND SEMI-TRANSMISSIVE REFLECTIVE FILM OF OPTICAL INFORMATION RECORDING MEDIUM, SPUTTERING TARGET FOR MANUFACTURING THEM, AS WELL AS OPTICAL INFORMATION RECORDING MEDIUM - The present invention provides an Ag-based alloy reflective film or semi-transmissive reflective film of an optical information recording medium having high reflectivity and excellent in the wet heat resistance and the light fastness. The invention relates to a reflective film or a semi-transmissive reflective film of an optical information recording medium comprising an Ag-based alloy comprising Hf in an amount of 0.05 to 0.8 atomic %. | 01-06-2011 |
20110039121 | Aluminum strip for lithographic printing plate carriers and the production thereof - A method for producing aluminum strips for lithographic printing plate supports, wherein the aluminum strip is produced from a rolling ingot, which after optional homogenizing is hot-rolled to a thickness of 2 mm to 7 mm and cold-rolled to a final thickness of 0.15 mm to 0.5 mm provides for an aluminum strip having a thickness of 0.15 mm to 0.5 mm and a printing plate support produced from the aluminum strip. | 02-17-2011 |
20110159312 | ALUMINUM FOIL FOR ALUMINUM ELECTROLYTIC CAPACITOR ELECTRODE AND METHOD FOR MANUFACTURING THE SAME - A fluid dispersion obtained by mixing oxide particles and water is sprayed to a raw aluminum foil from a direction opposite to a travelling direction of the raw aluminum foil while the raw aluminum foil is allowed to travel. In this way, a roll-pressed mark of the raw aluminum foil is eliminated, and thus aluminum foil for aluminum electrolytic capacitor electrode is produced. Pyramidal-shaped recesses each having an acute angle tip are present all over a surface of the aluminum foil. | 06-30-2011 |
20110281134 | SPUTTERING TARGET FOR FORMING WIRING FILM OF FLAT PANEL DISPLAY - A copper alloy wiring film of a flat panel display of the present invention and a sputtering target for forming the same have a composition including Mg: 0.1 to 5 atom %; either one or both of Mn and Al: 0.1 to 11 atom % in total; and Cu and inevitable impurities as the balance, and if necessary, may be further including P: 0.001 to 0.1 atom %. | 11-17-2011 |
20110311836 | ROLLED COPPER FOIL - A rolled copper foil consisted of at least either of silicon (Si) and iron (Fe), boron (B), silver (Ag), oxygen (O) of 0.002 mass % or less, and a balance consisted of copper (Cu) and inevitable impurities. | 12-22-2011 |
20110318599 | PROCESS FOR PRODUCING HIGH ETCH GAINS FOR ELECTROLYTIC CAPACITOR MANUFACTURING - Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a sulfate and a halide, such as sodium chloride. The anode foil is etched in the electrolyte bath composition by passing a charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor. | 12-29-2011 |
20110318600 | POROUS METAL FOIL AND PRODUCTION METHOD THEREFOR - A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner. | 12-29-2011 |
20120015206 | COPPER FOIL FOR CURRENT COLLECTOR OF LITHIUM SECONDARY BATTERY WITH IMPROVED WRINKLE CHARACTERISTICS - A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a ( | 01-19-2012 |
20120141817 | THIN METAL NANOWIRES PRODUCED BY BIOTEMPLATING - The present invention provides methods for the manufacturing of metal nanowires using protein fibrils as biotemplates. The methods comprise use of a solvent providing a dual effect by promoting the formation of protein fibrils of suitable size as well as acting as a reducing agent. The invention further provides metal nanowires. | 06-07-2012 |
20120148861 | NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies relative to previous methods. Such materials are useful in electronic applications. | 06-14-2012 |
20120164469 | SILVER NANOWIRES AND PREPARATION METHOD THEREOF - Silver nanowire with a diameter smaller than 100 nm and an aspect ratio from 150 to 300 is disclosed. The preparation method of the silver nanowires is also disclosed. | 06-28-2012 |
20120282484 | METAL AND CERAMIC NANOFIBERS - Provided herein are nanofibers and processes of preparing nanofibers. In some instances, the nanofibers are metal and/or ceramic nanofibers. In some embodiments, the nanofibers are high quality, high performance nanofibers, highly coherent nanofibers, highly continuous nanofibers, or the like. In some embodiments, the nanofibers have increased coherence, increased length, few voids and/or defects, and/or other advantageous characteristics. In some instances, the nanofibers are produced by electrospinning a fluid stock having a high loading of nanofiber precursor in the fluid stock. In some instances, the fluid stock comprises well mixed and/or uniformly distributed precursor in the fluid stock. In some instances, the fluid stock is converted into a nanofiber comprising few voids, few defects, long or tunable length, and the like. | 11-08-2012 |
20120301741 | NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of preparing nanowires having small diameters and large lengths are disclosed. Such nanowires are useful in electronics applications. | 11-29-2012 |
20120301742 | ZERO-VALENT CATALYSIS OF METAL ION REDUCTION METHODS, COMPOSITIONS, AND ARTICLES - Nanowire preparation methods, compositions, and articles are disclosed. Such methods, which reduce metal ions to metal nanowires in the presence of zero-valent metal atoms, are capable of producing long, narrow, nanowires useful for electronics and optical applications. | 11-29-2012 |
20130017409 | Apparatus And Method For The Production Of Semiconductor Material FoilsAANM Schoenecker; Axel GeorgAACI AlkmaarAACO NLAAGP Schoenecker; Axel Georg Alkmaar NLAANM De Jager; EricAACI Broek op LangedijkAACO NLAAGP De Jager; Eric Broek op Langedijk NLAANM Hoek; Eelko GelbertAACI Santpoort NoordAACO NLAAGP Hoek; Eelko Gelbert Santpoort Noord NLAANM Pichon; Pierre-YvesAACI AlkmaarAACO NLAAGP Pichon; Pierre-Yves Alkmaar NL - A casting device for producing semiconductor material foil includes a casting frame and a substrate band. The casting frame is arranged for holding a molten semiconductor material and includes sidewalls of which an exit sidewall is located at an output position for the semiconductor material foil. The exit side wall is provided with an exit slit. The casting device further includes a local force exerting means to exert at the location of the exit slit a locally enlarged external force on the molten semi-conductor material to enlarge an outer pressure on the molten material at the exit slit. | 01-17-2013 |
20130022831 | SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE - A soft dilute copper alloy wire is composed of a soft dilute copper alloy material containing an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Cu, V, Ni, Mn, and Cr, and balance comprising Cu. An average size of crystal grains lying from a surface of the soft dilute copper alloy wire at least to a depth of 20% of a wire diameter is not greater than 20 μm. | 01-24-2013 |
20130052475 | METHOD OF FABRICATING POROUS FILM STRUCTURE USING DRY PROCESSES AND POROUS FILM STRUCTURES FABRICATED BY THE SAME - Provided are a method of fabricating a porous thin film structure, by forming a thin film from at least two elements, followed by selectively removing the certain element using a dry etching process, and a porous thin film structure fabricated by the same. Because all processes of the method of fabricating a porous thin film structure are dry processes, process control is simply accomplished, environmental impact is low, and mass production is possible, in contrast to when using a typical wet process such as electrodeposition or dealloying. Also, since a level of porosity is easily controlled and maintained uniform, a mesoporous thin film structure showing a reproducible level of sensitivity when used as a sensor can be fabricated. | 02-28-2013 |
20130084463 | SURFACE-TREATED ROUGHENED COPPER FOIL AND COPPER CLAD LAMINATE - Disclosed is a surface-roughened copper foil that can show excellent adhesion to an anisotropic conductive resin (ACF) and a copper-clad laminate using same. Specifically disclosed is a surface-roughened copper foil which is surface-roughened by surface roughening on at least one surface of a base copper foil (untreated copper foil), wherein the roughening treated surface is finished so that a surface roughness (Ra) of 0.28 μm or more of the adhesion surface of a polyimide film to be adhered to the roughening treated surface. | 04-04-2013 |
20130108887 | COPPER FOIL FOR CURRENT COLLECTOR OF LITHIUM SECONDARY BATTERY WITH IMPROVED WRINKLE CHARACTERISTICS | 05-02-2013 |
20130171465 | METAL SILICIDE NANOWIRES AND METHODS OF THEIR PRODUCTION - The present invention provides metal silicide nanowires, including metallic, semiconducting, and ferromagnetic semiconducting transition metal silicide nanowires. The nanowires are grown using either chemical vapor deposition (CVD) or chemical vapor transport (CVT) on silicon substrates covered with a thin silicon oxide film, the oxide film desirably having a thickness of no greater than about 5 nm and, desirably, no more than about 2 nm (e.g., about 1-2 nm). The metal silicide nanowires and heterostructures made from the nanowires are well-suited for use in CMOS compatible wire-like electronic, photonic, and spintronic devices. | 07-04-2013 |
20130196172 | STAINLESS STEEL FOIL AND CATALYST CARRIER FOR EXHAUST GAS PURIFYING DEVICE USING THE FOIL - A stainless steel foil contains, in percent by mass, 0.05% or less of C, 2.0% or less of Si, 1.0% or less of Mn, 0.003% or less of S, 0.05% or less of P, 25.0% to 35.0% of Cr, 0.05% to 0.30% of Ni, 3.0% to 10.0% of Al, 0.10% or less of N, 0.02% or less of Ti, 0.02% or less of Nb, 0.02% or less of Ta, 0.005% to 0.20% of Zr, 0.02% or less of Ce, 0.03% to 0.20% of REM excluding Ce, 0.5% to 6.0% in total of at least one of Mo and W, and the balance being Fe and incidental impurities. | 08-01-2013 |
20130230737 | COPPER NANOWIRE PREPARATION METHODS AND COMPOSITIONS - Methods are disclosed for preparing copper nanowires that do not rely on highly reactive reagents, highly corrosive solutions, high temperatures, or long reaction times. Nanowires produced from such methods are free of large attached nanoparticles that have accompanied previously disclosed copper nanowires. Such nanowires are useful for electronics applications. | 09-05-2013 |
20130266817 | PROCESSING OF NICKEL-TITANIUM ALLOYS - Processes for producing a nickel-titanium alloy are disclosed. The processes are characterized by the production of nickel-titanium alloy articles having improved microstructure. A pre-alloyed nickel-titanium alloy is melted and atomized to form molten nickel-titanium alloy particles. The molten nickel-titanium alloy particles are cooled to form nickel-titanium alloy powder. The nickel-titanium alloy powder is consolidated to form a fully-densified nickel-titanium alloy preform that is hot worked to form a nickel-titanium alloy article. Any second phases present in the nickel-titanium alloy article have a mean size of less than 10 micrometers measured according to ASTM E1245-03 (2008) or an equivalent method. | 10-10-2013 |
20140011044 | STEEL FOIL FOR SOLAR CELL SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND SOLAR CELL SUBSTRATE, SOLAR CELL AND MANUFACTURING METHODS THEREFOR - A steel foil for a solar cell substrate includes 7% to 40% by mass of Cr and has a tensile strength of 930 MPa or more in a direction perpendicular to the rolling direction. | 01-09-2014 |
20140162084 | COPPER FOIL COMPOSITE, COPPER FOIL USED FOR THE SAME, FORMED PRODUCT AND METHOD OF PRODUCING THE SAME - A copper foil composite comprising a copper foil and a resin layer laminated, the copper foil containing at least one selected from the group consisting of Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si and Ag at a total of 30 to 500 mass ppm, a tensile strength of the copper foil having of 100 to 180 MPa, a degree of aggregation I200/I | 06-12-2014 |
20140162085 | ALUMINUM ALLOY FOIL FOR ELECTRODE COLLECTOR AND PRODUCTION METHOD THEREFOR - An object of the present invention is to provide an aluminum alloy foil for an electrode current collector, the foil having a high strength after the drying step while keeping a high electrical conductivity. Disclosed is a method for manufacturing an aluminum alloy foil for electrode current collector, including: maintaining an aluminum alloy ingot comprising 0.03 to 0.1% of Fe, 0.01 to 0.1% of Si, 0.0001 to 0.01% of Cu, 0.005% or less of Mn, with the rest being Al and unavoidable impurities, at 550 to 620° C. for 1 to 20 hours, and subjecting the resulting ingot under a hot rolling with a starting temperature of 500° C. or higher and an end-point temperature of 255 to 300° C. | 06-12-2014 |
20140178709 | ALUMINUM ALLOY FOIL FOR ELECTRODE COLLECTORS AND PRODUCTION METHOD THEREFOR - An object of the present invention is to provide an aluminum alloy foil for an electrode current collector, the foil having a high strength after the drying step while keeping a high electrical conductivity. Disclosed is a method for manufacturing an aluminum alloy foil for electrode current collector, including: maintaining an aluminum alloy ingot comprising 0.1 to 0.5% of Fe, 0.01 to 0.3% of Si, 0.01 to 0.2% of Cu, 0.01% or less of Mn, with the rest being Al and unavoidable impurities, at 550 to 620° C. for 1 to 20 hours, and subjecting the resulting ingot under a hot rolling with a starting temperature of 500° C. or higher and an end-point temperature of 255 to 300° C. | 06-26-2014 |
20140193660 | ELECTROLYTIC COPPER FOIL AND METHOD FOR PRODUCING THE SAME - An electrolytic copper foil is provided. The electrolytic copper foil has a shiny side and a matte side opposing to the shiny side, wherein the difference in roughness between the shiny side and the matte side is 0.5 μm or less. The electrolytic copper foil has a tensile strength of 45 kg/mm | 07-10-2014 |
20140220373 | COMPOSITE DUAL BLACKENED COPPER FOIL AND METHOD OF MANUFACTURING THE SAME - A composite dual blackened copper foil includes a copper foil and two blackened layers. The copper foil has a shiny side and a matte side. The blackened layers are formed on the shiny and matte sides respectively. The blackened layers are formed alloy by electroplating in a plating bath consisting essentially of copper, cobalt, nickel, manganese, magnesium and sodium ions. A rough layer is selectively formed between the blackened layer and the shiny side as well as the matte side. Both side of the copper foil is spotless, powder free, and good in etching quality. The copper foil is effective at blocking electromagnetic wave, near infrared, undesired light and the like. The copper foil exhibits strong light absorption and is applicable to direct gas laser drilling. A method of manufacturing the composite dual blackened copper foil is also provided. | 08-07-2014 |
20140255720 | ULTRATHIN ELECTROMAGNETIC STEEL SHEET - An electrical steel sheet has a component composition including, by mass %, C: 0.007% or less, Si: 4% to 10%, and Mn: 0.005% to 1.0%, the balance being Fe and incidental impurities, as well as a sheet thickness within a range of 0.01 mm or more to 0.10 mm or less, and a profile roughness. Pa of 1.0 μm or less. The electrical steel sheet exhibits excellent iron loss properties whereby the magnetic property is free from deterioration, and degradation of the stacking factor can be avoided, even when the steel sheet with a thickness of 0.10 mm or less has been subjected to siliconizing treatment to increase the Si content in the steel. | 09-11-2014 |
20140295208 | ROLL-TO-ROLL FABRICATION OF ORDERED THREE-DIMENSIONAL NANOSTRUCTURE ARRAY, RELATED TECHNIQUES, MATERIALS AND PRODUCTS - Roll-to-roll fabrication of predetermined or ordered three-dimensional nanostructure arrays is described. Provided methods can comprise imprinting a substrate with a two-dimensional (2-D) pattern by rolling a cylindrical pattern comprising a 2-D array of structures against a substrate. In addition, control or determination of nanostructure parameters via control of process parameters is provided. | 10-02-2014 |
20140322557 | METHOD FOR PRODUCING AN ALUMINUM FOIL WITH INTEGRATED SECURITY FEATURES - Method for producing an aluminum foil with integrated security features. An aluminum foil is rolled to a thickness of less than 150 μm in multiple cold rolling passes, and simultaneously a texture which runs in the rolling direction is produced on both faces of the foil. A loose composite formed from at least two of the aluminum foils, is fed into a pair of working rollers in a final cold rolling pass, wherein the relief-like surface structure which is produced in the rolling direction via a polishing process has been reduced by 10 to 50% with respect to the average roughness height in one region in a contrast- and motif-dependent manner on at least one roller surface in order to form a motif for a security feature. The security feature is transferred onto the aluminum foil face facing the roller surface, and the loose composite of aluminum foils is separated. | 10-30-2014 |
20140335372 | ROLLED COPPER FOIL - A rolled copper foil composed of crystal particles of copper or a copper alloy, wherein an average particle size of the crystal particles composing the outermost surface is not less than 0.2 μm and not greater than 6 μm; a ratio of the average particle size of the crystal particles composing the outermost surface to a thickness of the rolled copper foil is not less than 1% and not greater than 6%; and an intragranular distortion rate found by the following formula (1) when a cross-section perpendicular to a length direction of the rolled copper foil is analyzed by electron backscatter diffraction (EBSD) is not less than 0.5% and not greater than 10%. | 11-13-2014 |
20140342178 | ELECTROLYTIC COPPER FOIL, AND CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD USING THE ELECTROLYTIC COPPER FOIL - The present invention provides an electrodeposited copper foil for a flexible wiring board, wherein handling in manufacturing and processing lines is easy, good bending and flexing are provided with heating during a film adhesion step, small electric devices can be accommodated, excessive coarsening of a crystal grain structure is minimized, and excellent fine pattern characteristics are provided. The electrodeposited copper foil of the present invention having excellent bending and flexing characteristics is such that a crystal distribution before heating (unprocessed) is such that a number of crystal grains less than 2 μm in diameter within a range of 300 μm×300 μm is 10,000 or greater and 25,000 or less, and a crystal distribution after heating for 1 hr at 300° C. is such that the number of crystal grains less than 2 μm in diameter within a range of 300 μm×300 μm is 5,000 or greater and 15,000 or less. The electrodeposited copper foil of the present invention is characterized in that a crystal orientation ratio (%) as measured by EBSD before heating (unprocessed) to that after heating for 1 hr at 300° C. is such that ratios of change after heating relative to before heating for the following totals:
| 11-20-2014 |
20150010771 | FERRITIC STAINLESS STEEL FOIL - Provided is stainless steel foil that is suitably used for forming a catalyst carrier for an exhaust gas purifying facility, the catalyst carrier being installed in a vehicle that discharges exhaust gas having a temperature lower than the temperature of exhaust gas of a gasoline-powered automobile. The ferritic stainless steel foil contains, by mass %, C: 0.05% or less, Si: 2.0% or less, Mn: 1.0% or less, S: 0.005% or less, P: 0.05% or less, Cr: 11.0% to 25.0%, Ni: 0.05% to 0.30%, Al: 0.01% to 1.5%, Cu: 0.01% to 2.0%, N: 0.10% or less, and the balance being Fe and inevitable impurities. | 01-08-2015 |
20150030873 | ELECTROLYTIC COPPER FOIL - An electrolytic copper foil, which is particularly suitable for the application of a lithium ion secondary battery, has a shiny side and a matte side with a roughness of less than 2 μm. Based on the total sum of the texture coefficients of a ( | 01-29-2015 |
20150299833 | STAINLESS STEEL SHEET AND STAINLESS STEEL FOIL - Provided are an Fe—Cr—Al-based stainless steel sheet which has improved manufacturability by improving the toughness of a hot-rolled steel sheet and a cold-rolled steel sheet without deteriorating oxidation resistance at a high temperature and shape stability when used at a high temperature, and a stainless steel foil which is manufactured by rolling the stainless steel sheet. | 10-22-2015 |
20160049534 | FERRITIC STAINLESS STEEL FOIL FOR SOLAR CELL SUBSTRATE - Provided is a ferritic stainless steel foil for a solar cell substrate excellent in terms of threading performance with which it is possible to maintain sufficient hardness to suppress, for example, buckling during threading when a solar cell is manufactured using a roll-to-roll method. The ferritic stainless steel foil for a solar cell substrate has a chemical composition containing, by mass %, Cr: 14% or more and 18% or less, a Vickers hardness of Hv250 or more, and a Vickers hardness of Hv250 or more after the substrate has undergone an optical absorber layer growth process in which the substrate is held in a temperature range of 450° C. or higher and 600° C. or lower for a duration of 1 minute or more. | 02-18-2016 |
20160138135 | COPPER ALLOY FOR ELECTRONIC/ELECTRICAL EQUIPMENT, COPPER ALLOY THIN SHEET FOR ELECTRONIC/ELECTRICAL EQUIPMENT, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRICAL EQUIPMENT, AND TERMINAL - One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.005-19-2016 | |
20160160328 | FERRITIC STAINLESS STEEL FOIL - The ferritic stainless steel foil has a composition containing, by mass %, C: 0.050% or less, Si: 0.20% or less, Mn: 0.20% or less, P: 0.050% or less, S: 0.0050% or less, Cr: 10.5% or more and 20.0% or less, Ni: 0.01% or more and 1.00% or less, Al: more than 1.5% and less than 3.0%, Cu: 0.01% or more and 1.00% or less, N: 0.10% or less, and further contains one or more elements selected from Ti: 0.01% or more and 1.00% or less, Zr: 0.01% or more and 0.20% or less, and Hf: 0.01% or more and 0.20% or less, and the balance being Fe and inevitable impurities. This enables a composite layer of an Al oxide layer and a Cr oxide layer to be formed on the surface of the ferritic stainless steel foil in a high-temperature oxidizing atmosphere at 800° C. or more. | 06-09-2016 |
20160168675 | AMORPHOUS THIN METAL FILM | 06-16-2016 |
20160168746 | COPPER FILM WITH LARGE GRAINS, COPPER CLAD LAMINATE HAVING THE SAME AND MANUFACTURING METHOD OF COPPER CLAD LAMINATE | 06-16-2016 |
20170233856 | FEEDSTOCK FOR METAL FOIL PRODUCT AND METHOD OF MAKING THEREOF | 08-17-2017 |