Class / Patent application number | Description | Number of patent applications / Date published |
427124000 | Vapor deposition or utilizing vacuum | 17 |
20080317948 | Method for Producing a Stimulation Electrode - A stimulation electrode is provided having an electrically conducting electrode base member which is partially covered with an electrically insulating ceramic layer. The ceramic layer is formed of an oxide and/or an oxynitride of at least one metal of the group of titanium, niobium. tantalum, zirconium, aluminum and silicon. Various methods are provided for production of the stimulation electrode, including methods in which the ceramic layer is formed in situ by a thermal, chemical or electrochemical oxidation or oxynitridation process. The stimulation electrode may be used as a cardiac pacemaker electrode, a neuro-stimulation electrode, or another human implant. | 12-25-2008 |
20090053404 | METHOD FOR MANUFACTURING ORGANIC TRI-STABLE DEVICE - A method for manufacturing an organic tri-stable device on a substrate includes forming a first metal layer on the substrate. A first organic mixture layer is formed over the first metal layer, and a diffusion barrier layer is formed over the first metal layer. A second organic mixture layer is formed on the diffusion barrier layer, and a second metal layer is formed over the second organic mixture layer. | 02-26-2009 |
20090136657 | METHODS AND SYSTEMS FOR FORMING FLEXIBLE MULTILAYER STRUCTURES - Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure. | 05-28-2009 |
20090191330 | Antimony Precursors for GST Films in ALD/CVD Processes - The present invention is a process of making a germanium-antimony-tellurium alloy film using a process selected from the group consisting of atomic layer deposition and chemical vapor deposition, wherein a silylantimony precursor is used as a source of antimony for the alloy film. Novel silylantimony compounds are also disclosed. | 07-30-2009 |
20090304914 | Self assembled monolayer for improving adhesion between copper and barrier layer - The embodiments fill the need enabling deposition of a thin and conformal barrier layer, and a copper layer in the copper interconnect with good electro-migration performance and with reduced risk of stress-induce voiding of copper interconnect. Electromigration and stress-induced voiding are affected by the adhesion between the barrier layer and the copper layer. A functionalization layer is deposited over the barrier layer to enable the copper layer being deposit in the copper interconnect. The functionalization layer forms strong bonds with barrier layer and with copper to improve adhesion property between the two layers. An exemplary method of preparing a substrate surface of a substrate to deposit a functionalization layer over a metallic barrier layer of a copper interconnect to assist deposition of a copper layer in the copper interconnect in order to improve electromigration performance of the copper interconnect is provided. The method includes depositing the metallic barrier layer to line the copper interconnect structure in the integrated system, and oxidizing a surface of the metallic barrier layer. The method also includes depositing the functionalization layer over the oxidized surface of the metallic barrier layer, and depositing the copper layer in the copper interconnect structure after the funcationalization layer is deposited over the metallic barrier layer. | 12-10-2009 |
20100092659 | CONDUCTIVE INK AND CONDUCTOR - Ink is manufactured by mixing unoxidized metallic particles to a binder. The ink is printed on an object ( | 04-15-2010 |
20100209598 | IN SITU GENERATION OF RuO4 FOR ALD OF Ru AND Ru RELATED MATERIALS - Apparatus and method for generating ruthenium tetraoxide in situ for use in vapor deposition, e.g., atomic layer deposition (ALD), of ruthenium-containing films on microelectronic device substrates. The ruthenium tetraoxide can be generated on demand by reaction of ruthenium or ruthenium dioxide with an oxic gas such as oxygen or ozone. In one implementation, ruthenium tetraoxide thus generated is utilized with a strontium organometallic precursor for atomic layer deposition of strontium ruthenate films of extremely high smoothness and purity. | 08-19-2010 |
20110287175 | CYCLOOCTATETRAENETRICARBONYL RUTHENIUM COMPLEX, METHOD OF PRODUCING THE SAME, AND METHOD OF PRODUCING FILM USING THE COMPLEX AS RAW MATERIAL - To provide a ruthenium compound suitable for a chemical vapor deposition method (CVD method). A liquid cyclooctatetraenetricarbonyl ruthenium complex represented by the following Formula (1) is obtained by irradiating a solution mixture of dodecacarbonyl triruthenium and a cyclooctatetraene with light. | 11-24-2011 |
20120171365 | FILM FORMING APPARATUS, FILM FORMING METHOD AND STORAGE MEDIUM - The film forming apparatus includes a chamber | 07-05-2012 |
20140272117 | LOW COST VEHICLE ELECTRICAL AND ELECTRONIC COMPONENTS AND SYSTEMS MANUFACTURED FROM CONDUCTIVE LOADED RESIN-BASED MATERIALS - Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention. | 09-18-2014 |
20140329005 | SUPERCRITICAL DEPOSITION OF PROTECTIVE FILMS ON ELECTRICALLY CONDUCTIVE PARTICLES - A method for depositing a thin film of a coating material onto an electrically conductive particle surface via supercritical fluid deposition includes providing electrically conductive particles, providing a precursor of a coating material, dissolving the precursor of the coating material into a supercritical fluid solvent to form a supercritical solution of the precursor and subsequently exposing the conductive particles to the supercritical solution in a reactor under conditions at which supercritical fluid deposition of a thin film of the coating material onto surfaces of the conductive particles occurs. | 11-06-2014 |
20140329006 | OPTICAL DEVICE FABRICATION - Transparent conductive coatings are polished using particle slurries in combination with mechanical shearing force, such as a polishing pad. Substrates having transparent conductive coatings that are too rough and/or have too much haze, such that the substrate would not produce a suitable optical device, are polished using methods described herein. The substrate may be tempered prior to, or after, polishing. The polished substrates have low haze and sufficient smoothness to make high-quality optical devices. | 11-06-2014 |
20150086709 | PASSIVATING ULTRA-THIN AZO WITH NANO-LAYER ALUMINA - A method of making an electrical conductor includes depositing an ultra-thin layer including aluminum-doped zinc oxide layer on a surface and using atomic layer deposition to deposit a nano-layer including alumina in contact and conformal with a surface of the ultra-thin layer including aluminum-doped zinc oxide. | 03-26-2015 |
20150093500 | Corrosion-Resistant Silver Coatings with Improved Adhesion to III-V Materials - The electrical and optical performance of silver LED reflective contacts in III-V devices such as GaN LEDs is limited by silver's tendency to agglomerate during annealing processes and to corrode on contact with silver-reactive materials elsewhere in the device (for example, gallium or aluminum). Agglomeration and reaction are prevented, and crystalline morphology of the silver layer may be optimized, by forming a diffusion-resistant transparent conductive layer between the silver and the source of silver-reacting metal, (2) doping the silver or the diffusion-resistant transparent conductive layer for improved adhesion to adjacent layers, or (3) doping the silver with titanium, which in some embodiments prevents agglomeration and promotes crystallization of the silver in the preferred <111> orientation. | 04-02-2015 |
20150140206 | HIGH ENERGY MATERIALS FOR A BATTERY AND METHODS FOR MAKING AND USE - A method of forming an electrode active material by reacting a metal fluoride and a reactant. The method includes a coating step and a comparatively low temperature annealing step. Also included is the electrode formed following the method. | 05-21-2015 |
20160093873 | PHASE CHANGE MATERIAL SOURCE FOR PHYSICAL VAPOR DEPOSITION - A method and apparatus for manufacturing electrochemical cells. The apparatus and method includes the modification of solid phase material used in electrochemical cells, such as batteries, into a viscous phase for ease of metering and dispensing onto a hot wall reactor to create a substantially uniform cloud of vapor to be deposited on a substrate or other stacks of cells in a continuous or semi-continuous process and having the useful advantage of depositing large volumes of materials for economical manufacturing. | 03-31-2016 |
20160141601 | HIGH ENERGY MATERIALS FOR A BATTERY AND METHODS FOR MAKING AND USE - A method of forming an electrode active material by reacting a metal fluoride and a reactant. The method includes a coating step and a comparatively low temperature annealing step. Also included is the electrode formed following the method. | 05-19-2016 |