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Metal coating

Subclass of:

427 - Coating processes

427058000 - ELECTRICAL PRODUCT PRODUCED

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
427125000 Silver, gold, platinum, or palladium 33
427124000 Vapor deposition or utilizing vacuum 9
Entries
DocumentTitleDate
20090123643Electronic Device and Method for Manufacturing the Same - An electronic device is provided using wiring comprising aluminum to prevent hillock or whisker from generating, wherein the wiring contains oxygen atoms at a concentration of 8×1005-14-2009
20100151121POSITIVE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY AND METHOD OF PREPARING SAME - Disclosed in a positive active material for a lithium secondary battery including a compound represented by formula 1 and having a 10% to 70% ratio of diffracted intensity of diffraction lines in 2θ=53° (104 plane) with respect to diffracted intensity of diffraction lines in the vicinity of 2θ=22° (003 plane) in X-ray diffraction patterns using a CoKα-ray,06-17-2010
20100119701Method For Preparing a Conductive Strain Sensor on the Surface of a Device - The invention provides a method for preparing a conductive strain sensor on the surface of a device to measure strain at the surface of the device, which method comprises the steps of 05-13-2010
20100075027CAP METAL FORMING METHOD - A cap metal forming method capable of obtaining a uniform film thickness on the entire surface of a substrate is provided. The method for forming a cap metal on a copper wiring formed on a processing target surface of a substrate includes: holding the substrate so as to be rotatable; rotating the substrate in a processing target surface direction of the substrate; locating an end portion of an agitation member so as to face the processing target surface of a periphery portion of the substrate with a preset gap maintained therebetween; supplying a plating processing solution onto the processing target surface; and stopping the supply of the plating processing solution and moving the agitation member such that the end portion of the agitation member is separated away from the processing target surface of the substrate.03-25-2010
20110059233Method For Preparing Stabilized Metal Nanoparticles - A process for preparing stabilized metal nanoparticles, the process comprising reacting a metal compound with a reducing agent in the presence of a stabilizer in a reaction mixture comprising the metal compound, the reducing agent, and the stabilizer, wherein the reaction mixture is substantially free of solvent, to form a plurality of metal-containing nanoparticles during the solvent-free reduction process with molecules of the stabilizer on the surface of the metal-containing nanoparticles.03-10-2011
20120225198CONDUCTIVE METAL INK COMPOSITION AND METHOD FOR FORMING A CONDUCTIVE PATTERN - The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern with improved conductivity, and the method of preparing a conductive pattern using the same.09-06-2012
20130064971METHOD FOR MAKING A CURRENT-PERPENDICULAR-TO-THE-PLANE (CPP) MAGNETORESISTIVE (MR) SENSOR WITH AN ANTIPARALLEL FREE (APF) STRUCTURE FORMED OF AN ALLOY REQUIRING POST-DEPOSITION HIGH TEMPERATURE ANNEALING - A method for making a current-perpendicular-to-the plane magnetoresistive (CPP-MR) sensor with an antiparallel-free APF structure having the first free layer (FL1) formed of an alloy, like a Heusler alloy, that requires high-temperature or extended-time post-deposition annealing includes the step of annealing the Heusler alloy material before deposition of the antiparallel coupling layer (APC) of the APF structure. In a modification to the method, a protection layer, for example, a layer of Ru, Ta, Ti, Al, CoFe, CoFeB or NiFe, may deposited on the layer of Heusler alloy material prior to annealing, and then etched away to expose the underlying Heusler alloy layer as FL1.03-14-2013
20090238958Methods of Forming Electrically Conductive Structures - Some embodiments include methods of forming conductive material within high aspect ratio openings and low aspect ratio openings. Initially, the high aspect ratio openings may be filled with a first conductive material while the low aspect ratio openings are only partially filled with the first conductive material. Additional material may then be selectively plated over the first conductive material within the low aspect ratio openings relative to the first conductive material within the high aspect ratio openings. In some embodiments, the additional material may be activation material that only partially fills the low aspect ratio opening, and another conductive material may be subsequently plated onto the activation material to fill the low aspect ratio openings.09-24-2009
20090047423Formation of layers on substrates - A liquid composition for forming an activator-containing layer on a substrate, for activating a chemical reaction to produce a solid layer on the substrate, comprises activator, surfactant and solvent and/or binder. The liquid composition is deposited on a surface of a substrate, desirably by inkjet printing. The layer is used to activate a chemical reaction to produce a solid layer on the substrate surface, e.g. a layer of conductive metal. The surfactant in the liquid composition has beneficial effects on the behaviour of the liquid composition when applied to certain substrates.02-19-2009
20120237671METHOD AND ARRANGEMENT FOR APPLICATION OF ELECTRICALLY CONDUCTIVE LAYERS WITH A HIGH CURRENT CARRYING CAPABILITY FOR MAKING INTERNAL CONTACT WITH CHANNELS - A method applies layers to channels of a resistance heating element, where the channels are arranged in a honeycomb structure and receive a medium to be heated. Adjacent layers communicate with electrically conducting end-face metallizations of the resistance heating element and have, at an opposite end, an insulation region in relation to another respective end-face metallization. To apply the layers, a miniature lance is immersed into the channel to be coated. The miniature lance is hollow, closed at a lower end, has an upper end communicating with a reservoir of metal paste, and includes outlets in a lower region that are directed to inner walls. Metal paste is uniformly applied to the inner walls of the channel by pressure while simultaneously moving the miniature lance. The miniature lance is inserted into an adjacent channel for coating inner walls of the adjacent channel from the other end-face metallization side.09-20-2012
20110293820METAL-POLYMER COMPOSITES COMPRISING NANOSTRUCTURES AND APPLICATIONS THEREOF - Metal-polymer composites, and methods of making and use thereof, said composites comprising a thermally-cured dense polyaniline substrate; an acid dopant; and, metal nanostructure deposits wherein the deposits have a morphology dependent upon the acid dopant.12-01-2011
20110033611TRANSFER MEDIUM MANUFACTURING METHOD, TRANSFER METHOD, TRANSFER MEDIUM MANUFACTURING APPARATUS, AND TRANSFER APPARATUS - A transfer medium manufacturing method for manufacturing a transfer medium in which a foil forming recording material containing metallic particles capable of being transferred onto a target has been applied to a base material includes: applying the foil forming recording material to the base material; and smoothing the surface of the foil forming recording material applied to the base material in the applying, the foil forming recording material being in a partially-melted state.02-10-2011
20110177236MOLECULAR SELF-ASSEMBLY IN SUBSTRATE PROCESSING - Methods for sealing a porous dielectric are presented including: receiving a substrate, the substrate including the porous dielectric; exposing the substrate to an organosilane, where the organosilane includes a hydrolysable group for facilitating attachment with the porous dielectric, and where the organosilane does not include an alkyl group; and forming a layer as a result of the exposing to seal the porous dielectric. In some embodiments, methods are presented where the organosilane includes: alkynyl groups, aryl groups, flouroalkyl groups, heteroarlyl groups, alcohol groups, thiol groups, amine groups, thiocarbamate groups, ester groups, ether groups, sulfide groups, and nitrile groups. In some embodiments, method further include: removing contamination from the porous dielectric and a conductive region of the substrate prior to the exposing; and removing contamination from the conductive region after the forming.07-21-2011
20100119700METHOD FOR FORMING METAL LINE OF IMAGE SENSOR - Disclosed is a method for forming a metal line. The method includes preparing a semiconductor substrate having a first metal line, performing an oxidation process with respect to the first metal line, performing an oxide removal process to remove an oxide generated in the oxidation process, forming an etch stop layer on the metal line, forming an interlayer dielectric layer on the first metal line, and forming a damascene pattern on the interlayer dielectric layer, and forming a second metal line, which is connected with the first metal line, in the damascene pattern. The oxidation process for the first metal line can include a hydrogen peroxide treatment process using a solution including oxygen. The oxide removal process can be performed by using an oxalic acid (HOOC-COOH) solution.05-13-2010
20100080893METHOD OF FORMING METAL FILM - A method of forming a metal film, the method including: (a) forming a primer layer on a substrate by applying a first polymer including a unit having a cyano group in a side chain; (b) forming a polymer layer on the surface of the primer layer by applying a second polymer, the second polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof and a polymerizable group; (c) applying the electroless plating catalyst or the precursor thereof to the polymer layer; and (d) forming a metal film on the polymer layer by performing electroless plating.04-01-2010
20090263570Plating method for processing electrical connector - A plating method is adapted for applying a layer of metal to an electrical connector (10-22-2009
20110171372PREPARATION OF METALLURGIC NETWORK COMPOSITIONS AND METHODS OF USE THEREOF - The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.07-14-2011
20100279003Free standing nanostructured metal and metal oxide anodes for lithium-ion rechargeable batteries - The nanoscale architecture of anode materials and the process for forming an anode for a lithium ion battery is provided along with an apparatus. The anodes comprise aligned nanorods of metals which are formed on metallic substrates. When used as the anodes in a lithium-ion battery, the resulting battery demonstrates higher energy storage capacity and has greater capability to accommodate the volume expansion and contraction during repeated charging and discharging.11-04-2010
20080241364CONDUCTIVE METAL PASTE AND METHOD OF FORMING METAL FILM - A conductive metal paste contains metal particles dispersed as a conductive medium in a thermosetting resin composition, an organic solvent, and a reducing agent of an alcohol having one or more reductive hydroxyl groups in the molecule and having a boiling point of 200° C. or lower.10-02-2008
20080286449Template for Nano Imprint Lithography Process and Method of Manufacturing Semiconductor Device Using the Same - A method of manufacturing a template for nano imprint lithography process may include: forming a chrome layer, an intermediate film, and a photoresist film sequentially over a substrate. The method may further include forming a photoresist film pattern; forming an intermediate film pattern with the photoresist film pattern as an etching mask; and forming a spacer at a sidewall of the intermediate film pattern. The intermediate film pattern may be removed using an etching selectivity between the intermediate film pattern and the spacer. Finally, the chrome layer and the substrate may be etched using the spacer as an etching mask to form the template.11-20-2008
20120196032Electronic Device and Method for Manufacturing the Same - A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.08-02-2012
20090004370Metal Inks, Methods of Making the Same, and Methods for Printing and/or Forming Metal Films - Printable metal formulations, methods of making the formulations, and methods of coating or printing thin films from metal ink precursors are disclosed. The metal formulation generally includes one or more Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal salts or metal complexes, one or more solvents adapted to facilitate coating and/or printing of the formulation, and one or more optional additives that form (only) gaseous or volatile byproducts upon reduction of the metal salt or metal complex to an elemental metal and/or alloy thereof. The formulation may be made by combining the metal salt(s) or metal complex(es) and the solvent(s), and dissolving the metal salt(s) or metal complex(es) in the solvent(s) to form the formulation. Thin films may be made by coating or printing the metal formulation on a substrate; removing the solvents to form a metal-containing precursor film; and reducing the metal-containing precursor film.01-01-2009
20110223321Methods of making multilayered structures - The present invention relates to a multilayered structure including at least one diamond layer and methods of making the multilayered structures. The multilayered structure includes a diamond layer having a top surface and a bottom surface, a first thin adhesion layer on the top surface, a second thin adhesion layer on the bottom surface, a first metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the first metal layer is deposited on the first thin adhesion layer, and a second metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the second metal layer is deposited on the second thin adhesion layer.09-15-2011
20090220683Method of manufacturing electronic part and electronic part - The present invention relates to a method of manufacturing an electronic part in which on that side of an insulating member sandwiched between conductor film and a lower conductor layer which is adjacent to the conductor film, a conductor portion connected from the lower conductor layer is exposed. In this method, an opening portion having the lower conductor layer as a bottom is formed on the formed area of the conductor portion from the conductor film side, and metal plating is grown from the bottom of the opening portion with the lower conductor layer as an electrode. After this metal plating has reached the conductor film to thereby form a conductor portion in the opening portion, the metal plating is grown on the upper surfaces of the conductor film and the conductor portion with the conductor film and the conductor portion as electrodes, to thereby form a thickness enough to form an upper conductive layer.09-03-2009
20090117264Method of Manufacturing a Lithium Battery - A method of preparing a lithium secondary battery comprising a negative electrode, a positive electrode, an electrolyte and an additive for improving the stability of the solid electrolyte interface (SEI) film forming on the negative electrode, wherein at least part of said additive is applied to said negative electrode before the battery is assembled.05-07-2009
20090274833METALLIC INK - A metallic ink including a vehicle, a multiplicity of copper nanoparticles, and an alcohol. The conductive metallic ink may be deposited on a substrate by methods including inkjet printing and draw-down printing. The ink may be pre-cured and cured to form a conductor on the substrate.11-05-2009
20120244277Method for Balancing a Mass Component by Means of CMT Welding - A rotating mass component with high balancing quality is provided. The balancing is performed in a substantially automated manner and without chip formation. A method for balancing a rotating mass component, such as a rotor is achieved by deposition welding of welding points on the mass component. The mass symmetry respective to the rotation axis is improved. The deposition welding takes place through cold metal transfer welding, in particular of a plurality of individual mass points.09-27-2012
20120141667METHODS FOR FORMING BARRIER/SEED LAYERS FOR COPPER INTERCONNECT STRUCTURES - Methods for forming barrier/seed layers for interconnect structures are provided herein. In some embodiments, a method of processing a substrate having an opening formed in a first surface of the substrate, the opening having a sidewall and a bottom surface, the method may include forming a layer comprising manganese (Mn) and at least one of ruthenium (Ru) or cobalt (Co) on the sidewall and the bottom surface of the opening, the layer having a first surface adjacent to the sidewall and bottom surface of the opening and a second surface opposite the first surface, wherein the second surface comprises predominantly at least one of ruthenium (Ru) or cobalt (Co) and wherein a predominant quantity of manganese (Mn) in the layer is not disposed proximate the second surface; and depositing a conductive material on the layer to fill the opening.06-07-2012
20090142481AIR STABLE COPPER NANOPARTICLE INK AND APPLICATIONS THEREFOR - Low-cost copper nanoparticle inks that can be annealed onto paper substrate for RFID antenna applications, using substituted dithiocarbonates as stabilizers during copper nanoparticle ink production.06-04-2009
20100304016CONDUCTIVE MATERIAL FOR CONNECTING PART AND METHOD FOR MANUFACTURING THE CONDUCTIVE MATERIAL - There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at. %, and having an average thickness in a range of 0.1 to 3.0 μm, and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 μm, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%. The surface of the conductive material is subjected to a reflow process, and preferably, an arithmetic mean roughness Ra of the surface of the material, in at least one direction, is not less than 0.15 μm while the arithmetic mean roughness Ra thereof, in all directions, is not more than 3.0 μm, and the average thickness of the Cu—Sn alloy covering layer is preferably not less than 0.2 μm. The conductive material is fabricated by a method whereby the surface of the base material is subjected to roughening treatment, an Ni plating layer, a Cu plating layer, and an Sn plating layer are formed, as necessary, over the surface of the base material, and subsequently, a reflow process is applied.12-02-2010
20100068376METHOD OF PREPARING COBALT AND LITHIUM ION-COATED NICKEL AND MANGANESE-BASED CATHODE MATERIAL - A method of preparing a cobalt and lithium ion-coated nickel and manganese-based cathode material, including at least: (a) coating a layer of cobalt hydroxide on a substrate of Ni03-18-2010
20110070362BATTERY ELECTRODE SUBSTRATE, AND ELECTRODE EMPLOYING THE SAME - An electrode substrate for a battery has nickel applied as a coat on the surface of a base constituted of crossing of a plurality of fibers including a core formed of synthetic resin and a coating of synthetic resin having a softening temperature lower than the softening temperature of the synthetic resin forming the core. The electrode substrate has the fibers of the base fusion-bonded at a cross point by heat treatment. The ratio of the coating occupying a II-II cross section of the fiber cross point is larger than the ratio of the coating occupying a fiber cross section (III-III cross section) at a site other than at the cross point.03-24-2011
20110256309MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.10-20-2011
20100330269Titanium-Based High-K Dielectric Films - This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on titanium oxide, to suppress the formation of anatase-phase titanium oxide and (b) related devices and structures. A metal-insulator-metal (“MIM”) stack is formed using an ozone pretreatment process of a bottom electrode (or other substrate) followed by an ALD process to form a TiO12-30-2010
20110262631Method For Manufacturing One-Layer Type Capacitive Touch Screen - Disclosed herein is a method for manufacturing a one-layer type capacitive touch screen. The method for manufacturing a one-layer type capacitive touch screen includes: forming a plurality of electrode wirings made of metal in an inactive region of a base substrate; forming a plurality of first electrode patterns made of a conductive polymer and including a first sensing unit and a first connection unit in an active region of the base substrate to connect the electrode wirings; forming an insulating pattern on the plurality of first connection units of the first electrode patterns; and forming a plurality of second electrode patterns including a second sensing unit and a second connection unit and made of the conductive polymer in the active region of the base substrate to connect the electrode wirings and position the second connection unit on the insulating pattern.10-27-2011
20110135814FUNCTIONING SUBSTRATE WITH A GROUP OF COLUMNAR MICRO PILLARS AND ITS MANUFACTURING METHOD - A functioning substrate with a group of columnar micro pillars characterized in that a first matrix of organic polymer and a group of columnar micro pillars of organic polymer extending from this matrix are provided. This group of columnar micro pillars has an equivalent diameter of 10 nm through 500 μm and a height of 50 nm through 5000 μm; and the ratio (H/D) of the equivalent diameter (D) to the height (H) of the group of columnar micro pillars is 4 or more.06-09-2011
20100098842PROCESS FOR CORROSION-PROOFING METALLIC SUBSTRATES - The invention relates to a process for corrosion-proofing metallic substrates that involves in a first stage (I) coating the substrate by electroless immersion into an aqueous bath of an anticorrosion agent K1 with a pH of between 1 and 5, comprising at least one compound having as its cation a lanthanide metal and/or a d-block element metal, bar chromium, and/or having as its anion a d-block element metallate, bar chromium-containing metallates, and at least one oxidation-capable acid, bar phosphorus and/or chromium acids, a conversion being effected on the substrate surface, and in a concluding stage (III) carrying out further coating by deposition of a cathodic electrocoat material.04-22-2010
20120148733METHOD FOR ELECTROLESS PLATING OF TIN AND TIN ALLOYS - The invention relates to a method for electroless (immersion) plating of tin and tin alloys having a thickness of≧1 μm as a final finish in the manufacture of printed circuit boards, IC substrates, semiconductor wafers and the like. The method utilizes an electroless plated sacrificial layer of copper between the copper contact pad and the electroless plated tin layer which is dissolved completely during tin plating. The method compensates the undesired loss of copper from a contact pad during electroless plating of thick tin layers.06-14-2012
20120003383MANUFACTURING METHOD OF ENERGY STORAGE DEVICE - A manufacturing method of an energy storage device capable of increasing the discharge capacity or an energy storage device capable of suppression of degradation of an electrode due to repetitive charge and discharge is provided. In the manufacturing method, a crystalline silicon layer including a group of whiskers in which the whiskers are tightly formed is formed as an active material layer over a current collector by a low pressure chemical vapor deposition method using a gas containing silicon as a source gas and nitrogen or helium as a dilution gas.01-05-2012
20120058257LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.03-08-2012
20120207918CONDUCTIVE METAL INK COMPOSITION AND METHOD FOR FORMING A CONDUCTIVE PATTERN - The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern, and the method of preparing a conductive pattern using the same.08-16-2012
20100173068METHODS FOR FORMING MAGNETICALLY MODIFIED ELECTRODES AND ARTICLES PRODUCED THEREBY - The present invention is directed to methods for making magnetically modified electrodes and electrodes made according to the method. Such electrode are useful as electrodes in batteries, such as Ni-MH batteries, Ni—Cd batteries, Ni—Zn batteries and Ni—Fe batteries.07-08-2010
20120219703Method for Manufacturing Conductive Metal Thin Film Using Carboxylic Acid - The present invention relates to a method for manufacturing a conductive metal thin film, including: preparing a conductive metal coating solution by adding carboxylic acid to a dispersion including a conductive metal particle having a core/shell structure; coating the conductive metal coating solution on a top portion of a substrate, heat-treating it, and removing an metal oxide layer of the surface of the conductive metal particle having the core/shell structure; and forming a thin film of the conductive metal particle from which the metal oxide layer is removed.08-30-2012
20100009071BIMODAL METAL NANOPARTICLE INK AND APPLICATIONS THEREFOR - A bimodal metal nanoparticle composition includes first metal nanoparticles having an average diameter of from about 50 nm to about 1000 nm, and second stabilized metal nanoparticles having an average diameter of from about 0.5 nm to about 20 nm, the second stabilized metal nanoparticles including metal cores having a stabilizer attached to the surfaces thereof, wherein the stabilizer is a substituted dithiocarbonate.01-14-2010
20120263869Methods for Forming a Barrier Layer with Periodic Concentrations of Elements and Structures Resulting Therefrom - A method is provided which includes dispensing and removing different deposition solutions during an electroless deposition process to form different sub-films of a composite layer. Another method includes forming a film by an electroless deposition process and subsequently annealing the microelectronic topography to induce diffusion of an element within the film. Yet another method includes reiterating different mechanisms of deposition growth, namely interfacial electroless reduction and chemical adsorption, from a single deposition solution to form different sub-films of a composite layer. A microelectronic topography resulting from one or more of the methods includes a film formed in contact with a structure having a bulk concentration of a first element. The film has periodic successions of regions each comprising a region with a concentration of a second element greater than a set amount and a region with a concentration of the second element less than the set amount.10-18-2012
20080299301Pretreatment method of substrate of organic EL element and manufacturing method for organic EL element - The present invention discloses a method for processing a substrate on which transparent electrode made of metal oxide is formed before forming an organic EL element on the transparent electrode. According to the method, the substrate is accommodated in a bake chamber provided with a heater. The substrate is heated while mixed gas of oxygen and nitrogen is introduced into the bake chamber so as to replace the gas in the bake chamber. The mixed gas is introduced into the bake chamber in an amount that is 1/60 or more and 1/15 or less of a whole volume of the bake chamber per minute. According to this method, moisture is removed and an appropriate surface treatment is performed for the transparent electrode of metal oxide at the same time.12-04-2008
20120288621POLYIMIDE FILM AND WIRING BOARD - A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film.11-15-2012
20100124604METHOD OF THINNING A BLOCK TRANSFERRED TO A SUBSTRATE - The invention relates to a method of thinning a block transferred to a substrate. According to the invention, the method includes depositing a stop layer at least onto the substrate and in a way adjacent to and contiguous with the transferred block. The stop layer is made out of material of greater resistance or hardness than the material of the transferred block and of smaller thickness than that of the transferred block. The method further includes actuating the thinning of the transferred block. The thinning time is pre-programmed as a function of a predetermined speed of thinning the transferred block, the thinning time being selected so that the thinning also attacks the stop layer.05-20-2010
20080248194METHOD FOR PRODUCING A COPPER LAYER ON A SUBSTRATE IN A FLAT PANEL DISPLAY MANUFACTURING PROCESS - Methods and apparatus for producing a copper layer on substrate in a flat panel display manufacturing process, where the copper is electrodelessly deposited on a substrate to form a copper interconnection layer. A copper solution containing: CuSO10-09-2008
20080226816Method of manufacturing an electrode active material particle for a rechargeable battery - A method of manufacturing an electrode active material particle for a rechargeable battery wherein a layer of an active material capable of being alloyed with Li is formed on a surface of a metal particle incapable of being alloyed with Li and then a heat treatment is conducted to diffuse the active material into the metal particle so that the resulting active material particle has a concentration profile in which a concentration of a metal element of the metal particle decreases from an interior toward the surface.09-18-2008
20110262632Magnetoresistive Effect Element, Thin-Film Magnetic Head, Method for Manufacturing Magnetoresistive Effect Element, and Method for Manufacturing Thin-Film Magnetic Head - A magnetoresistive effect (MR) element, a thin-film magnetic head having the MR element, a method for manufacturing the MR element, and a method for manufacturing the thin-film magnetic head are disclosed. The MR element, which uses electric current in a direction perpendicular to layer planes, includes a lower electrode layer, a MR multilayered structure formed on the lower electrode layer, a magnetic domain controlling bias layer that is disposed on both sides of the MR multilayered structure along the track-width direction and is made of a material at least partially including an hcp structure, a metal layer made of a material having a bcc structure formed on the magnetic domain controlling bias layer and the MR multilayered structure to cover the magnetic domain controlling bias layer and the MR multilayered structure, and an upper electrode layer formed on the metal layer.10-27-2011
20130149439ELECTRODE FORMING METHOD RELATING TO HEAT GENERATING FIXING BELT, HEAT GENERATING FIXING BELT AND FIXING APPARATUS - The method of forming an electrode in a heat generating fixing belt entails supplying a colloid liquid where metal nano-particles are dispersed in a liquid medium, on the surface of an electrically resistant heat generating layer and forming a plated film by an electroless plating method using the metal nano-particles as a catalyst. The electrically resistant heat generating layer is composed of a resin. In this manner, a pair of electrodes are formed on the surface of the electrically resistant heat generating layer. The electrodes supply electric current to the electrically resistant heat generating layer. The heat generating fixing belt can maintain an initial conduction resistance for a long period of time.06-13-2013

Patent applications in class Metal coating

Patent applications in all subclasses Metal coating