Class / Patent application number | Description | Number of patent applications / Date published |
427990500 | Immersion metal plating from solution (e.g., electroless plating, etc.) | 12 |
20080254205 | SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPOSITION FOR THIN CO-BASED AND NI-BASED ALLOYS - A method and composition for electrolessly depositing a layer of a metal alloy onto a surface of a metal substrate in manufacture of microelectronic devices. The composition comprises a source of metal deposition ions, a borane-based reducing agent, and a two-component stabilizer, wherein the first stabilizer component is a source of hypophosphite and the second stabilizer component is a molybdenum (VI) compound. | 10-16-2008 |
20100003399 | ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD - Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. | 01-07-2010 |
20100233360 | METHOD OF FORMING ELECTRONIC MATERIAL LAYER AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE METHOD OF FORMING ELECTRONIC MATERIAL LAYER - A method of transferring an electronic material and a method of manufacturing an electronic device using the method of transferring the electronic material. The method of transferring the electronic material includes dipping a template, on which an electronic material layer is formed, into a liquid medium, separating the electronic material layer from the template, and floating the electronic material layer on a surface of the liquid medium; raising up the electronic material layer floated on the surface of the liquid medium by using a target substrate and transferring the electronic material layer on the target substrate; and fixing the electronic material layer to the target substrate. | 09-16-2010 |
20110014361 | ELECTROLESS DEPOSITION SOLUTIONS AND PROCESS CONTROL - One embodiment of the present invention is a method of electroless deposition of cap layers for fabricating an integrated circuit. The method includes controlling the composition of an electroless deposition bath so as to substantially maintain the electroless deposition properties of the bath. Other embodiments of the present invention include electroless deposition solutions. Still another embodiment of the present invention is a composition used to recondition an electroless deposition bath. | 01-20-2011 |
20110039019 | Solution and Process for Improving the Solderability of a Metal Surface - The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface. | 02-17-2011 |
20120244276 | METHOD FOR DEPOSITING A PALLADIUM LAYER SUITABLE FOR WIRE BONDING ON CONDUCTORS OF A PRINTED CIRCUIT BOARD, AND PALLADIUM BATH FOR USE IN SAID METHOD - A method for generating a surface that can be bonded with gold wire. The surface is obtained by first depositing an exchange palladium layer made of the electrolyte on conductors of printed circuit boards, in particular on conductors made of copper or conductive paste. The exchange palladium layer is then reinforced with a palladium layer, deposited from a chemical palladium electrolyte. In order to protect the palladium, an exchange gold layer is then applied. An exchange palladium bath is used, comprising an organic brightener. | 09-27-2012 |
20130344235 | AUTOCATALYTIC ELECTROLESS COPPER USING HYPOPHOSPHITE REDUCER - This invention discloses compositions and methods that afford sustainable deposition of electroless copper coatings, using aqueous hypophosphite compositions as opposed to formaldehyde (FA) | 12-26-2013 |
20140099433 | BASKET JIG FOR ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD - The present invention relates to a basket jig for an electroless plating apparatus and an electroless plating method. A basket jig for an electroless plating apparatus in accordance with the present invention includes a basket loaded thereon a plurality of printed circuit boards, a rotating structure coupled to top portions of both sides of the basket and a tube in a shape of a rectangular plate coupled to bottom portions of the basket. | 04-10-2014 |
20140242264 | FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION - The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a source of glyoxylic acid as reducing agent, and at least one polyamino disuccinic acid or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid as complexing agent, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates. | 08-28-2014 |
20140242265 | ELECTROLESS PALLADIUM PLATING BATH COMPOSITION - The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions. | 08-28-2014 |
20160122876 | ELECTROLESS COPPER PLATING COMPOSITIONS - Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths. | 05-05-2016 |
20160198577 | LIQUID IMMERSION TRANSFER OF ELECTRONICS | 07-07-2016 |