Class / Patent application number | Description | Number of patent applications / Date published |
427980400 | Nonuniform or patterned coating | 68 |
20080241360 | RESIN FILM FORMING METHOD, RESIN FILM FORMING APPARATUS, AND ELECTRONIC CIRCUIT BOARD MANUFACTURING METHOD - A method forms a resin film on a substrate by depositing droplets of resin liquid by an inkjet method. The method includes: a first resin liquid arrangement step of arranging a plurality of droplets of a first resin liquid separately from each other on a substrate in such a manner that the droplets do not make contact with each other; a first resin liquid curing step of curing at least a surface of each of the droplets of the first resin liquid arranged on the substrate; a second resin liquid arrangement step of arranging a plurality of droplets of a second resin liquid at substantially central positions between the droplets of the first resin liquid on the substrate, after the at least the surface of each of the droplets of the first resin liquid is cured; and a second resin liquid curing step of curing the droplets of the second resin liquid arranged on the substrate. | 10-02-2008 |
20080280033 | Droplet Discharge Device, and Method for Forming Pattern, and Method for Manufacturing Display Device - It is an object of the present invention to improve the usability of a material, and to provide a display device which can be manufactured by simplifying the manufacturing process and a manufacturing technique thereof. It is also an object of the invention to provide a technique in which a pattern of a wiring or the like constituting these display devices can be formed to have a desired shape with favorable controllability. One feature of a droplet discharge device of the invention comprises: a discharge means for discharging a composition including a pattern forming material; and a shape means for shaping the shape of the composition before the composition is attached to a formation region, in which the shape means is provided between the discharge means and the formation region. | 11-13-2008 |
20090004368 | Systems and methods for curing a deposited layer on a substrate - Curing systems are provided that include a planar support surface for supporting a substrate having at least one layer deposited thereon, at least one curing device for curing the at least one deposited layer, and a control system for controlling the overall curing process. The curing device includes at least one laser, a lens module, and an optional modulator. During curing, the beam of light emitted from the laser may be directed onto the deposited layer by 1) controlling the position of an X-Y beam deflecting module to direct the focused beam of laser light onto a desired illumination area of the deposited layer; 2) controlling the position of the laser via an X-Y table, or 3) controlling the position of the substrate via an X-Y table. | 01-01-2009 |
20090029038 | Method of Forming Wiring Patterns Using Nano-Ink Comprising Metals Having Low Melting Point - Disclosed is a method of forming a wiring pattern using nano-ink, including providing a mixture solution of at least one first metal selected from the group consisting of gold, silver, and copper and at least one second metal selected from the group consisting of lead, zinc, tin, indium, cadmium, gallium, and alloys thereof, having an average particle size ranging from 5 nm to 1 μm in a reducing atmosphere; forming a wiring pattern on a base layer using the mixture solution; and thermally treating the wiring pattern at 150˜300° C. in a reducing atmosphere. Even when metal having low electrical conductivity is used, a wiring pattern having high electrical conductivity can be formed. The use of the second metal having a low melting point enables thermal treatment at low temperatures, thus preventing damage to a base layer on which a wiring pattern is formed and preventing a reaction between the metal and the base layer. | 01-29-2009 |
20090047421 | METHOD FOR PLATING FLEXIBLE PRINTED CIRCUIT BOARD - A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board. | 02-19-2009 |
20090053400 | INK JET PRINTABLE COMPOSITIONS FOR PREPARING ELECTRONIC DEVICES AND PATTERNS - In jet printable compositions that include nano particles in a liquid carrier. | 02-26-2009 |
20090087548 | Method of forming circuit pattern - A method of forming a circuit pattern is disclosed. The method of forming a circuit pattern may include providing a substrate that has a porous layer formed on one side, ejecting a thermosetting metal ink using an inkjet head into the porous layer in correspondence to a circuit pattern, and applying heat to the ink and the porous layer to cure the ink and remove the porous layer. With this method, a fine-line circuit pattern can be implemented, and a desired thickness of the circuit pattern can be obtained, by using a porous layer in printing and by applying heat to cure the ink and remove the coating layer. | 04-02-2009 |
20090130299 | GALVANIC PROCESS FOR MAKING PRINTED CONDUCTIVE METAL MARKINGS FOR CHIPLESS RFID APPLICATIONS - A process for printing a metal wire pattern on a substrate, including: printing a first salt solution including a metal ion that will undergo a reduction half-reaction; printing a second salt solution containing an oxidizing agent that will undergo an oxidation half-reaction in contact with the first salt solution, resulting in the reduction of the metal ions of the first salt solution; and allowing the first and second salt solutions to react by a galvanic reaction, causing reduced metal ions of the first salt solution to precipitate as a solid, on the substrate. | 05-21-2009 |
20090214764 | METAL NANOPARTICLES STABILIZED WITH A BIDENT AMINE - A metal nanoparticle composition includes a bident amine stabilizer associated with an external surface of the metal nanoparticle. A method of forming conductive features on a substrate, providing a solution of dispersed bident amine-stabilized metal nanoparticles, depositing the bident amine-stabilized metal nanoparticle dispersion onto a substrate, and heating the printed substrate to form conductive features on the surface of the substrate. | 08-27-2009 |
20090232971 | SELF-ENCAPSULATED SILVER ALLOYS FOR INTERCONNECTS - Alloys of silver and an alloying element that diffuses to the surface of the high conductivity metal and is oxidizable to form an alloying element oxide such as beryllium are provided along with electronic structures employing the alloys and methods of fabrication. | 09-17-2009 |
20090280238 | METHOD FOR SEPARATING HIGH ASPECT RATIO MOLECULAR STRUCTURES - A method for moving high aspect ratio molecular structures (HARMS), which method comprises applying a force upon a dispersion comprising one or more bundled and individual HARM-structures, wherein the force moves the bundled and/or the individual HARM-structure based on one or more physical features and/or properties for substantially separating the bundled and individual HARM-structures from each other. | 11-12-2009 |
20090285980 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress. | 11-19-2009 |
20100055302 | REDUCING AGENT FOR LOW TEMPERATURE REDUCING AND SINTERING OF COPPER NANOPARTICLES, AND METHOD FOR LOW TEMPERATURE SINTERING USING THE SAME - The present invention relates to a reducing agent for low temperature reducing and sintering of copper nanoparticles and a method for low temperature sintering using the same. The reducing agent includes formic acid or acetic acid and C1 to C3 alcohol or ether which allows reducing and sintering at a low temperature of less than 250° C. The sintered copper nanoparticles provide excellent electrical properties and are suitable for forming fine wirings patterns. | 03-04-2010 |
20100112195 | METHOD FOR THE FABRICATION OF CONDUCTIVE ELECTRONIC FEATURES - Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes. | 05-06-2010 |
20100143582 | LIQUID FILMS CONTAINING NANOSTRUCTURED MATERIALS - The present invention generally relates to liquid films containing nanostructured materials, and, optionally, the use of this arrangement to organize nanostructures and to transfer the nanostructures to a surface. Liquid films containing nanostructures, such as nanoscale wires, can be formed in a gas such as air. By choosing an appropriate liquid, a liquid film can be expanded, for example to form a “bubble” having a diameter of at least about 5 cm or 10 cm. The size of the bubble can be controlled, in some cases, by controlling the viscosity of the liquid film. In some embodiments, the viscosity can be controlled to be between about 15 Pa s and about 25 Pa s, or controlled using a mixture of an aqueous liquid and an epoxy. In some cases, the film of liquid may be contacted with a surface, which can be used to transfer at least some of the nanostructures to the surface. In some cases, the nanostructures may be transferred as an orderly or aligned array. Once on the surface, the nanostructures may be reacted, etched, layered, etc., e.g., for use in an electric circuit. | 06-10-2010 |
20100291289 | Bump printing apparatus and method of controlling the same - There is provided a bump printing apparatus and a method of controlling the same that can increase the printability of solder bumps being printed on a board. The bump printing apparatus may include a printing table onto which a board is mounted; a mask making close contact with the board and printing solder bumps on the board by separating the mask from the board after a printing operation; and air nozzles provided within the printing table and providing air suction to bring the board into close contact with the printing table and spraying air to separate the mask from the board. | 11-18-2010 |
20100310761 | PROCESS FOR PRODUCING TRANSPARENT ELECTROCONDUCTIVE MEMBER - [PROBLEMS] To provide a method for forming a high-definition electroconductive thin line free from blurring at low cost. | 12-09-2010 |
20110244117 | Additive for Robust Metal Ink Formulations - A composition that may be an electronic circuit element includes a metal nanoparticle, a silicone modified polyacrylate compound and a solvent. The silicone modified polyacrylate compound may be a silicone modified polyacrylate compound with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, a silicone modified polyacrylate compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100° C. to about 200° C. | 10-06-2011 |
20110262627 | METHOD OF DISPENSING CONDUCTIVE MATERIAL WITH ACTIVE Z-AXIS CONTROL - A method for printing a conductive trace on a plastic panel comprising: locating a nozzle proximate to a surface of a panel; moving the nozzle relative to the surface of the panel; sensing the surface of the panel relative to the height of the nozzle off of the panel; determining the speed at which the nozzle is being moved across the surface of the panel; adjusting at least one of the height of the nozzle relative to the surface of the panel and a flow rate of conductive ink out of the nozzle; and dispensing a conductive ink from the nozzle onto the surface of the panel to form the conductive trace. The conductive trace is formed with a predetermined width. | 10-27-2011 |
20110318481 | Method for Preparing Metallic Thin Film - Provided is a method for manufacturing a metal film, including: coating or printing a metal ink containing an organic metal complex on a substrate; and necessrily parallel-performing a pressure process during a procedure of forming metal particles by firing the metal ink, thereby forming a conductive metal film. The present invention can provide a method for manufacturing a metal film capable of improving film characteristics such as conductivity, reflectance, and uniformity in thickness, and the like, as well as remarkably shortening the time for forming the metal film, thereby efficiently manufacturing a superior-quality metal film. | 12-29-2011 |
20120082780 | WIRING MATERIAL, METHOD OF MANUFACTURING WIRING, AND NANO-PARTICLE DISPERSION - A wiring material contains copper, nitrogen, and a dopant which is more readily oxidized than copper in an Ellingham diagram, the dopant being added to the wiring material at a rate of not less than 0.5 at. % and not more than 10 at. %. | 04-05-2012 |
20120121799 | Method For Segregating The Alloying Elements And Reducing The Residue Resistivity Of Copper Alloy Layers - Methods for forming interconnect or interconnections on a substrate for use in a microelectric device are disclosed. In one or more embodiments, the method includes depositing an alloy layer comprising Cu and an alloying element, for, example, Mn, in a dielectric layer and segregating or diffusing the alloying element from the bulk Cu portion of the alloy layer. In one or more embodiments, the method includes annealing the alloy layer in an atomic hydrogen atmosphere. After annealing, the alloy layer exhibits a resistivity that is substantially equivalent to the resistivity of a pure Cu layer. | 05-17-2012 |
20120135136 | CIRCUIT BOARD INCLUDING ALIGNED NANOSTRUCTURES - Method of fabricating a circuit board are generally disclosed. The method of fabricating a circuit board may include, for example, providing a substrate, forming one or more channels having linear nanostructures on the substrate, and forming a first electrode and a second electrode on the substrate, where the one or more channels facilitate to electrically couple the first electrode to the second electrode | 05-31-2012 |
20120201956 | METHOD AND APPARATUS FOR FABRICATING OR ALTERING MICROSTRUCTURES USING LOCAL CHEMICAL ALTERATIONS - A method and apparatus for fabricating or altering a microstructure use means for heating to facilitate a local chemical reaction that forms or alters the submicrostructure. | 08-09-2012 |
20120207917 | CONDUCTIVE PATTERN-FORMING COMPOSITION AND METHOD - A conductive pattern-forming composition is obtained by loading a silicone rubber composition comprising a curable organopolysiloxane and a curing agent with conductive submicron particles. | 08-16-2012 |
20120231156 | FLEXURE, METHOD OF MANUFACTURING FLEXURE, AND HEAD SUSPENSION WITH FLEXURE | 09-13-2012 |
20120269959 | SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD - There are provided a screen printing apparatus and a screen printing method which can realize an increase in conversion efficiency of a solar cell by forming a circuit pattern having a large aspect ratio of a sectional shape by increasing the thickness of the circuit pattern. A screen printing apparatus | 10-25-2012 |
20130115369 | APPARATUS FOR FORMING CIRCUIT PATTERN ON PCB AND METHOD FOR FORMING CIRCUIT PATTERN USING THE SAME - Disclosed herein is a method for forming a pattern on a printed circuit board (PCB), including: printing a metallic material on a board through a plurality of nozzles; and sintering the metallic material with extra power from power for driving the plurality of nozzles to form a circuit pattern, whereby the circuit pattern can be easily formed. | 05-09-2013 |
20130129916 | CONDUCTIVE PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING SYSTEM - According to a mode of the present invention, since a conductive pattern having a graded composition structure in which a content ratio of a conductive polymer decreases while a content ratio of metal microparticles increases from a base material is formed with respect to a thickness direction, adhesion with the base material is secured at a bonding portion between the base material and the conductive pattern due to the high content ratio of the conductive polymer and, at the same time, favorable electrical performance is produced by increasing the content ratio of the metal microparticles. | 05-23-2013 |
20130177702 | MATERIAL DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIALS ON A SUBSTRATE - A material deposition system includes a frame, a support coupled to the frame to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and a deposition head coupled to the gantry. The deposition head is movable over the support by movement of the gantry. The deposition head includes a chamber to hold material, an actuator to push a volume of material out of the chamber, a needle extending from the chamber and terminating in a needle orifice, and at least two air jets located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets produce a timed pulse of air to create a micro-droplet from the desired volume and to accelerate the micro-droplet to high velocity. | 07-11-2013 |
20130230642 | METHOD OF MANUFACTURING ACTIVE RETARDER AND METHOD OF MANUFACTURING DISPLAY APPARATUS HAVING THE SAME - A method of manufacturing an active retarder includes forming a first substrate, forming a second substrate, and forming a liquid crystal layer between the first substrate and the second substrate. The forming of the first and second substrates is performed by a roll-to-roll process. | 09-05-2013 |
20130236637 | PROCESS FOR MANUFACTURING COPPER HYDRIDE FINE PARTICLE DISPERSION, ELECTROCONDUCTIVE INK, AND PROCESS FOR MANUFACTURING SUBSTRATE EQUIPPED WITH CONDUCTOR - The present invention relates to a process for manufacturing a copper hydride fine particle dispersion, the process including: reducing a copper(II) salt with a hydrido-based reducing agent in the following solvent (A) in the presence of the following alkylamine (B): solvent (A): a solvent having a solubility parameter (SP value) of from 8 to 12 and being inert to the hydrido-based reducing agent and alkylamine (B): an alkylamine having an alkyl group which has 7 or more carbon atoms and having a boiling point of 250° C. or lower. | 09-12-2013 |
20130251892 | METHOD OF FORMING A WIRING PATTERN - A method of forming a wiring pattern is provided. In the method, an adhesive material is coated on a substrate to form an adhesive layer, and then a patterned mask is provided on the adhesive layer, wherein the patterned mask has an opening defining a wiring pattern, and then an electrically conductive paste is filled in the opening, and subsequently the patterned mask is removed so as to form the wiring pattern on the substrate. In the method of the present invention, a wiring pattern is formed by using a screen printing method, but not by using an etching method. As a result, there are no etching contamination issues. Furthermore, the difficulty in etching the finer wiring patterns from the copper foil can be alleviated. | 09-26-2013 |
20130287936 | SUBSTRATE FOR AN ORGANIC ELECTRONIC ELEMENT AND A PRODUCTION METHOD THEREFOR - The present invention relates to a substrate for an organic electronic element that enables surface resistance to be reduced and light-extraction efficiency improved, the substrate including: a base substrate; a scattering layer which is formed on the base substrate and includes an conductive pattern for reducing the surface resistance of an electrode, scattering particles for scattering light and a binder, and which forms an uneven structure in the surface opposite the base substrate; and a planarizing layer which is formed on the scattering layer and flattens the surface undulations caused by the uneven structure of the scattering layer, wherein the refractive index (Na) of the scattering particles and the refractive index (Nb) of the planarizing layer satisfy the relationship in formula 1 below. [Formula 1] |Na—Nb|≧0.3. In the formula as used herein, Na signifies the refractive index of the scattering particles and Nb signifies the refractive index of the planarizing layer. | 10-31-2013 |
20130295276 | METHOD FOR FORMING A COPPER WIRING PATTERN - There is provided a method wherein a surface treating agent, which is essential for making copper particles antioxidative and dispersing the copper particles in the prior art, is hardly used, but copper particles, which cause little electromigration and are small in the price rate of material itself, are used to form a low-resistance copper wiring pattern while the generation of cracks therein is restrained. The method includes the step of using a dispersion slurry wherein copper based particles having a copper oxide surface are dispersed to form any pattern over a substrate, and the step of reducing the copper oxide surface of the copper based particles in the pattern with atomic form hydrogen to return the oxide to copper, and sintering particles of the copper metal generated by the reduction and bonding the particles to each other. | 11-07-2013 |
20130323408 | SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE SHIELDING FOR INTEGRATED CIRCUIT MODULES - Systems and methods disclose maintaining paint thickness uniformity over the surface of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern achieves paint thickness control. A uniform coating of conductive paint provides a more effective EMI or RFI shield during the operation of the IC modules. | 12-05-2013 |
20130323409 | SYSTEMS AND METHODS FOR CONTROLLING ELECTROMAGNETIC INTERFERENCE FOR INTEGRATED CIRCUIT MODULES - Systems and methods disclose reduction of conductive paint overspray while maintaining paint thickness uniformity over the perimeter of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern reduces paint waste and achieves edge uniformity. The reduction in paint overspray reduces paint waste, which in turn, reduces production costs. With the reduced amount of paint needed for coating a panel, the cost per unit can be significantly reduced. | 12-05-2013 |
20130337155 | MANUFACTURING METHOD OF CIRCUIT PATTERN - This instant disclosure provides a manufacturing method of circuit pattern. The method comprising, forming a substrate; forming a protection layer on the substrate for making the protection layer to be a curved surface along the surface of the substrate; executing a pattern processing for the protection layer to make the protection layer to form a first pattern on the substrate, wherein a slot region is obtained according to the inner side of the first pattern; coating a macromolecule coating to the slot region for forming an activated metal layer on the substrate, wherein the activated metal layer forms a circuit pattern respective to the slot region, the macromolecule coating includes at least a kind of metal material; removing the protection layer for exposing the activated metal layer with the circuit pattern. The manufacturing quality of the circuit pattern can be improved and the associated cost can be saved. | 12-19-2013 |
20140072701 | COMPOSITION FOR AN FPCB COVERLAY AND METHOD FOR PRODUCING THE SAME - A composition for a coverlay having superior thermal resistance, flexibility, and electrical properties, as well as a method of producing the coverlay and a method of forming the coverlay on a PCB are provided. The composition for a coverlay according to an embodiment of the invention may include 10.0˜45.0 wt % of polyimide, 0.01˜5.0 wt % of a defoaming agent, 0.01˜5.0 wt % of a leveling agent, 0.01˜5.0 wt % of a dispersing agent, 0.1˜15.0 wt % of modified polyimide, and a remainder of a solvent. Also provided is a method for producing a composition for a coverlay for an FPCB that includes: placing amine and an acid anhydride in a reaction solvent and subjecting to first polymerization; placing an acid anhydride in a separate reaction solvent subjecting to second polymerization; forming a polyamic acid by mixing a product of the first polymerization with a product of the second polymerization; and adding a defoaming agent, a leveling agent, a dispersing agent, and modified polyimide to the polyamic acid. Also provided is a method of forming a polyimide coverlay on an FPCB that includes: preparing a mask over a circuit of an FPCB, the mask having a desired printing pattern; applying the liquid polyimide composition of claim | 03-13-2014 |
20140134326 | METHOD FOR FUNCTIONAL PRINTING SYSTEM - A method for forming a conductive pattern on a substrate ( | 05-15-2014 |
20140134327 | WATER-BASED CONDUCTIVE INK FOR INKJET RECORDING - There is provided a water-based conductive ink for inkjet recording, the water-based conductive ink enabling formation of highly conductive circuit wiring even by low-temperature firing. A water-based conductive ink for inkjet recording contains metal nanoparticles (X), a polyhydric alcohol (A), and water (B), wherein a polyhydric alcohol represented by the following general formula is used as the polyhydric alcohol (A) | 05-15-2014 |
20140134328 | APPARATUS AND METHOD FOR MANUFACTURING A TOUCH SCREEN PANEL - The apparatus for manufacturing the touch screen panel according to the present invention includes: a first roll by which a wound film is unwound; a second roll around which a film having an electrode pattern is wound; a guide roll disposed between the first and second rolls to guide the transfer of the film; a resin applying part applying a resin on the film to form a resin layer; a pattern molding part including a mold having a relief pattern and pressing the mold onto the resin layer to form an intaglio pattern on the resin layer; an electrode material applying part applying an electrode material on a surface of the resin; an electrode material sweeping part removing the electrode material from the surface of the resin layer; and a hardening part hardening the electrode material filled in the intaglio pattern of the resin surface. | 05-15-2014 |
20140141155 | METHOD OF FORMING ELECTRIC WIRING USING INKJET PRINTING AND INKJET PRINTING APPARATUS - A method of forming an electric wiring includes forming a trench on a substrate and ejecting first ink and second ink into the trench. The second ink contains a conductive material. The method includes heating the substrate to sinter the second ink such that a tunnel is formed in a lower portion of the trench by evaporation of the first ink, and the conductive material forms the electric wiring in an upper portion of the trench. | 05-22-2014 |
20140178573 | LOW FIRING TEMPERATURE COPPER COMPOSITION - An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m | 06-26-2014 |
20140199473 | APPARATUS AND METHOD FOR PROVIDING AN EMBEDDED STRUCTURE AND FOR PROVIDING AN ELECTRO-OPTICAL DEVICE INCLUDING THE SAME - An apparatus for providing a patterned structure includes a deposition facility for depositing an electrically conductive material on a cylindrical surface of a transfer roll, a supply facility for providing a flexible substrate with a carrier layer, a press-roll for pressing the flexible substrate with the carrier layer against the surface of the transfer roll, the press-roll being positioned in the rotation direction of the transfer roll with respect to a position where the first deposition facility deposits the substance on the transfer roll, and being arranged for embedding the deposited substance in said carrier layer, wherein the adhesion between the printed substance and the cylindrical surface of the transfer roll is less than the adhesion between the printed substance and said carrier layer, a transport facility for releasing the flexible substrate with the carrier layer embedding the substance as the patterned structure from the transfer roll. | 07-17-2014 |
20140295064 | PRINTHEAD WITH NANOTIPS FOR NANOSCALE PRINTING AND MANUFACTURING - A nanoprinthead including an array of nanotip cantilevers, where each nanotip cantilever includes a nanotip at an end of a cantilever, and a method for forming the nanoprinthead. Each nanotip may be individually addressable through use of an array of piezoelectric actuators. Embodiments for forming a nanoprinthead including an array of nanotip cantilevers can include an etching process from a material such as a silicon wafer, or the formation of a metal or dielectric nanotip cantilever over a substrate. The nanoprinthead may operate to provide uses for technologies such as dip-pen nanolithography, nanomachining, and nanoscratching, among others. | 10-02-2014 |
20140377454 | METHOD OF IMPROVING SHEET RESISTIVITY OF PRINTED CONDUCTIVE INKS - A method of forming a printed pattern on a substrate includes printing a pattern onto the substrate with a conductive ink including a conductive material, a thermoplastic binder and a solvent, curing the printed pattern, and fusing the printed pattern by feeding the printed pattern through a fusing system operated at a temperature of about 20° C. to about 130° C. above the glass transition temperature of the thermoplastic binder and at least 120° C. at a minimum, a pressure of from about 50 psi to about 1500 psi, and a feed rate through the fusing system of about 1 m/min to about 100 m/min. The method may be done continuously. The method improves the sheet resistivity of the printed ink. | 12-25-2014 |
20140377455 | Method for Fabricating Blackened Conductive Patterns - The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate. | 12-25-2014 |
20150024120 | CONDUCTIVE-PATTERN FORMING METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN BY PHOTO IRRADIATION OR MICROWAVE HEATING - Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper. | 01-22-2015 |
20150322276 | FLEXIBLE CONDUCTIVE INK - This invention is a flexible conductive ink composition comprising (A) a resin binder, (B) silver-plated core conductive particles, and (C) conductive particles having a surface area at least 1.0 m | 11-12-2015 |
20160014906 | APPARATUS AND METHOD FOR PRINTING CIRCUITRY | 01-14-2016 |
20160143151 | SELECTIVE VACUUM PRINTING MACHINE - A system that may include a apertured structure that is configured to support a substrate and a vacuum supply unit that is configured to (i) prevent a supply of vacuum to a first area of the substrate during a first processing period during which the first area is processed and a second area of the substrate is not processed; (ii) provide vacuum to the second area during the first processing period; (iii) prevent the supply of vacuum to the second area during a second processing period during which the second area is processed and the first area is not processed; and (iv) provide vacuum to the first area during the second processing period. | 05-19-2016 |
20170238425 | Method of Fabricating Highly Conductive Features with Silver Nanoparticle Ink at Low Temperature | 08-17-2017 |
427980500 | With pretreatment of substrate | 15 |
20090022885 | METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME - The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that interacts with an electroless plating catalyst or a precursor thereof; (b) imparting the electroless plating catalyst or precursor thereof onto the polymer layer; and (c) forming a metallic film in the pattern form by subjecting the substrate having the polymer layer to electroless plating using an electroless plating solution, wherein the substrate is treated using a solution comprising a surface charge modifier or 1×10 | 01-22-2009 |
20090123642 | EPOXY RESIN COMPOSITION, CONDUCTIVE FILM FORMING METHOD, CONDUCTIVE PATTERN FORMING METHOD, AND MULTILAYERED WIRING BOARD MANUFACTURING METHOD - The present invention discloses a thermosetting epoxy resin composition containing an epoxy resin having two or more epoxy groups in one molecule, a hardener having two or more functional groups that reacts with the epoxy groups in one molecule, and a photopolymerization initiator, and a method of forming a conductive film, a method of forming a conductive pattern, and a method of manufacturing a multilayered wiring board using the epoxy resin composition. | 05-14-2009 |
20090142479 | Method of Manufacturing Semiconductor Device-Fabrication Wafer Holder - Wafer holder and semiconductor manufacturing equipment in which the holder is installed, the wafer holder having a wafer-carrying surface, wherein incidence of warping and cracking when the wafer holder is heated is slight. In the wafer holder having a wafer-carrying surface, electrical circuitry consisting of one or more sinter laminae is formed on the face or in the interior of the wafer holder; and by rendering pores present in the circuitry, the incidence of warping and cracking can be made very slight. The electrical circuitry is preferably any of an electrode circuit for an electrostatic chuck, a resistive-heating-element circuit, an RF-power electrode circuit, and a high-voltage-generating electrode circuit. | 06-04-2009 |
20090238956 | MANUFACTURING METHOD OF A WIRING BOARD CONTAINING A SEED LAYER HAVING A ROUGHENED SURFACE - A seed layer is formed on a top surface of an insulating layer so that a top surface of the seed layer has a predetermined roughness. A resist film is formed on the top surface of the seed layer, the resist film having an opening part through which a portion of the top surface of the seed layer corresponding to an area where a wire is formed is exposed. The wire is formed on the top surface of the seed layer by an electrolytic plating method using the seed layer as an electric supply layer. The resist film is removed after forming the wire. A portion of the seed layer on which the wire is not formed is removed. | 09-24-2009 |
20090246358 | CONDUCTIVE SILVER DISPERSIONS AND USES THEREOF - Silver particles having controlled and predetermined properties of size, morphology and size distribution for use in manufacturing of conductive inks, conductive fillers and/or conductive coatings are provided by forming a dispersion of silver halide particles in a carrier medium such as gelatin and treating the dispersion such that the silver halide particles are converted into the desired silver particles. | 10-01-2009 |
20090280239 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - First, a catalyst for performing electroless plating in a subsequent step is caused to adhere to surfaces of uneven portions of a matrix. Next, an insulating layer made of a resin material is prepared. Then, the insulating layer is heated to be softened while the uneven portions of the matrix are pressed against one surface of the insulating layer. Thus, grooves corresponding to shapes of the uneven portions of the matrix are formed in the insulating layer while the catalyst is transferred to bottom surfaces and side surfaces of the grooves. The insulating layer is then subjected to electroless plating. In this case, metal is deposited by reduction reaction on portions of the insulating layer where the catalyst exists. Accordingly, conductor traces are formed in the grooves of the insulating layer. | 11-12-2009 |
20100151120 | Method for making conductive wires - A method for making conductive wires is provided. Firstly, an ink having carbon nanotubes is provided. Secondly, a baseline is formed using the ink on a substrate. Thirdly, the baseline is electroless plated. | 06-17-2010 |
20100221413 | METHOD OF FORMING PATTERN AND METHOD OF PRODUCING ELECTRONIC ELEMENT - A method of forming a pattern and a method of producing an electronic element are characterized by including a first step of forming an electrically conductive film (D) by applying a liquid composition onto a first plate ( | 09-02-2010 |
20100279002 | Systems and Methods Affecting Profiles of Solutions Dispensed Across Microelectronic Topographies During Electroless Plating Processes - A method is provided which includes dispensing a deposition solution at a plurality of locations extending different distances from a center of a microelectronic topography each at different moments in time during an electroless plating process. An electroless plating apparatus used for the method includes a substrate holder, a moveable dispense arm, and a storage medium comprising program instructions executable by a processor for positioning the moveable dispense arm. Another method and accompanying electroless deposition chamber are configured to introduce a gas into an electroless plating chamber above a plate which is suspended above a microelectronic topography and distribute the gas to regions extending above one or more discrete portions of the microelectronic topography. An exemplary microelectronic topography resulting from the aforementioned methods and apparatuses includes a layer having distinct regions each including a comparatively different thickness and comparatively different concentrations of one of the one or more elements. | 11-04-2010 |
20110014360 | Increasing Exposure Tool Alignment Signal Strength for a Ferroelectric Capacitor Layer - An improved alignment structure for photolithographic pattern alignment is disclosed. A topographical alignment mark in an IC under a low reflectivity layer may be difficult to register. A reflective layer is formed on top of the low reflectivity layer so that the topography of the alignment mark is replicated in the reflective layer, enabling registration of the alignment mark using common photolithographic scanners and steppers. The reflective layer may be one or more layers, and may be metallic, dielectric or both. The reflective layer may be global over the entire IC or may be local to the alignment mark area. The reflective layer may be removed during subsequent processing, possibly with assist from an added etch stop layer, or may remain in the completed IC. The disclosed alignment mark structure is applicable to an IC with a stack of ferroelectric capacitor materials. | 01-20-2011 |
20110027466 | Boron-containing hydrogen silsesquioxane polymer, integrated circuit device formed using the same, and associated methods - A composition includes a boron-containing hydrogen silsesquioxane polymer having a structure that includes: silicon-oxygen-silicon units, and oxygen-boron-oxygen linkages in which the boron is trivalent, wherein two silicon-oxygen-silicon units are covalently bound by an oxygen-boron-oxygen linkage therebetween. | 02-03-2011 |
20120121800 | METHOD OF MODIFYING SURFACE OF SUBSTRATE FOR INKJET PRINTING - A method may include providing a surface modification inkjet head and a target inkjet head to be movable on a substrate, and forming a surface modification printed pattern by moving the surface modification inkjet head and ejecting surface modification ink onto the substrate. A target printed pattern may be formed by ejecting a target ink from the target inkjet head to the surface modification printed pattern and a metal wiring pattern may be formed on the substrate by removing the surface modification printed pattern. | 05-17-2012 |
20120171362 | HYDROCARBON ADHESIVE COMPOSITION AND METHOD FOR TREATING SUBSTRATE SURFACE USING SAME - Disclosed are a non-fluorine and non-silicon hydrocarbon-based adhesive composition for substrate surface treatment for inkjet printing, a substrate surface-treated by the composition, and a method for modifying the surface of the substrate by using the composition so as to form fine lines by means of inkjet nano ink. The disclosed composition includes only an epoxy resin, or includes an epoxy resin and an acrylic compound, so as to hydrophobically modify the substrate. The composition can achieve better properties such as an increase in an ink contact angle, an ink spreadability inhibiting effect, and a wiring adhesive strength, as compared to a conventional silicon-based and/or fluorinated adhesive. Furthermore, since a conventional silicon-based and fluorinated adhesive component is not used, it is possible to perform substrate surface treatment in terms of environmental safety, thereby improving the productivity and the economic efficiency. | 07-05-2012 |
20140087063 | METHOD FOR MANUFACTURING ION OPTICAL DEVICE - The present invention provides a method for preparing an ion optical device. A substrate is fabricated with a hard material adapted for a grinding process, the substrate at least including a planar surface, and including at least one insulating material layer. Next, one or more linear grooves are cut on the planar surface, to form multiple discrete ion optical electrode regions on the planar surface separated by the linear grooves. Then, conductive leads are fabricated on other substrate surfaces than the planar surface and in a through hole inside the substrate, to provide voltages required on ion optical electrodes. By using high-hardness materials in cooperation with high-precision machining, higher precision and a desired discrete electrode contour can be obtained. | 03-27-2014 |
20160379923 | INTEGRATED CIRCUIT PACKAGE SUBSTRATE - Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one embodiment a method includes depositing a first lamination layer on a first side of a package substrate and a first surface finish on one or more electrical contacts disposed on a second side of the package substrate; removing the first lamination layer from the first side of the package substrate; depositing a second lamination layer on the second side of the package substrate and a second surface finish on the one or more electrical contacts disposed on the first side of the package substrate; and removing the second lamination layer from the second side of the package substrate. Other embodiments may be described and/or claimed. | 12-29-2016 |