Class / Patent application number | Description | Number of patent applications / Date published |
427960200 | Protective coating (e.g., encapsulating, etc.) | 24 |
20080248193 | Viscous Fluid Application Device - The present invention aims to provide a viscous fluid application device which allows improving manufacturing efficiency of semiconductor packages without deteriorating application position accuracy and decreasing designing flexibility. The device includes: an application unit ( | 10-09-2008 |
20080260940 | APPARATUS AND METHOD FOR INTEGRATED SURFACE TREATMENT AND DEPOSITION FOR COPPER INTERCONNECT - A method and system for depositing films on a substrate for copper interconnect in an integrated system is provided. The method includes moving the substrate into a processing chamber having a plurality of proximity heads. Selected ones of the proximity heads is configured to perform at least one of surface treatments and atomic layer depositions (ALDs). The processing chamber is part of the integrated system. Within the processing chamber, barrier layer deposition is performed over a surface of the substrate using one of the plurality of proximity heads functioning to perform barrier layer ALD. In addition, the method includes moving the substrate from the processing chamber, through a transfer module of the integrated system and into a processing module for performing copper seed layer deposition. The processing module for performing copper seed layer deposition is part of the integrated system. Within the processing module for performing copper seed layer deposition, copper seed layer deposition is performed over the surface of the substrate. The integrated system enables controlled-ambient transitions within the integrated system to limit exposure of the substrate to uncontrolled ambient conditions outside of the integrated system. | 10-23-2008 |
20090017195 | CURABLE ENCAPSULANT COMPOSITION AND ASSOCIATED METHOD - An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. | 01-15-2009 |
20090035454 | Assembly of Encapsulated Electronic Components to a Printed Circuit Board - Electrical components | 02-05-2009 |
20090092748 | ELECTRONIC DEVICE PACKAGING AND CURABLE RESIN COMPOSITION - A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent, (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent. | 04-09-2009 |
20090117262 | METHOD OF FABRICATING CIRCUIT BOARD - A method of fabricating a circuit board includes the following steps. First, a patterned metal board is provided. The patterned metal board includes a patterned circuit having at least a pad. Next, a dielectric layer is formed on the patterned metal board to cover the patterned circuit. Thereafter, a processing treatment is preformed on a surface of the patterned metal board in which the surface is opposite to the patterned circuit, such that at least a conductive joint column disposed on the pad and a circuit layer having the patterned circuit are formed. Afterwards, a solder mask layer is formed on the dielectric layer to cover the circuit layer, such that the solder mask layer is in contact with the conductive joint column, the conductive joint column passes through the solder mask layer, and a height of the conductive joint column exceeds a thickness of the solder mask layer. | 05-07-2009 |
20090191329 | SURFACE TREATMENT PROCESS FOR CIRCUIT BOARD - A surface treatment process for a circuit board is provided. The circuit board includes a substrate, a first circuit layer disposed on an upper surface of the substrate, and a second circuit layer disposed on a lower surface of the substrate. The first circuit layer is electrically connected to the second circuit layer. In the surface treatment process for the circuit board, a first oxidation protection layer and a second oxidation protection layer are respectively formed on a portion of the first circuit layer and a portion of the second circuit layer by immersion. Afterwards, the first circuit layer exposed by the first oxidation protection layer is subjected to black oxidation to form a black oxide layer. The thickness of the first oxidation protection layer is thinner than or equal to the thickness of the black oxide layer. | 07-30-2009 |
20090291200 | Environmental Protection Coating System and Method - A method includes providing a circuit board having an outer surface, the outer surface configured with a plurality of discrete electrical components that are each manufactured independently of one another, and coating the outer surface and the plurality of discrete electrical components with a first protective dielectric layer. The method further includes coating the first protective dielectric layer with a second dielectric layer. The second dielectric layer includes a dielectric material having a modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 2.7, a dielectric loss less than 0.002, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 3000 Celsius, a defect densities less than 0.5/centimeter, a pinhole free in films greater than 50 Angstroms, and is capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%. | 11-26-2009 |
20090304910 | Packaging Board and Manufacturing Method Therefor, Semiconductor Module and Mobile Apparatus - An advantage of the present invention is to suppress moisture infiltrating from a pad electrode portion from spreading over the surface of a wiring pattern and improve the reliability of a packaging board. The wiring pattern of the packaging board is formed on an insulating substrate and includes a wiring region, an electrode region (pad electrode) connected with a semiconductor device, and a boundary region provided between the wiring region and the electrode region. A gold plating layer is provided on the surface of the electrode region of the wiring pattern. The top surface of the boundary region of the wiring pattern is so formed as to be dented from the top surface of the wiring region of the wiring pattern, and there is provided a stepped portion in the boundary region. A solder resist is formed in such a manner as to cover part of the gold plating layer and the wiring pattern corresponding to the boundary region and the wiring region, and the solder resist has a predetermined opening through which to connect to the semiconductor device. A conductive member is connected to the gold plating layer in the electrode region, and a molded resin layer seals the entire semiconductor module. | 12-10-2009 |
20100015329 | METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH THIN METAL CONTACTS - Methods and arrangements are described for forming an array of contacts for use in packaging one or more integrated circuit devices. In particular, various methods are described for forming contacts having thicknesses less than approximately 10 μm, and in particular embodiments, between 0.5 to 2 μm. | 01-21-2010 |
20100075025 | METHOD OF CONTROLLING SATELLITE DROPS FROM AN ENCAPSULANT JETTER - A method of jetting drops of encapsulant from an encapsulant jetter, the drops including primary drops and satellite drops that are much smaller than the primary drops. The method has the steps of providing a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, jetting the drops of encapsulant from the jetter and, inducing a gas flow with a velocity sufficient to draw the satellite drops in a predetermined direction away from the series of wire bonds while having negligible effect on the primary drops. | 03-25-2010 |
20100215840 | METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR Sn - This invention teaches deposition of a corrosion-barrier layer onto a copper substrate, which minimizes copper corrosion even if the final immersion top layer is not without pinholes. Such barrier layer can comprise a copper conversion coating, corrosion resistant immersion deposited metal coatings such as palladium, gold, etc. The deposition of a barrier layer is generally followed by immersion deposition of a metal plate such as for example silver, tin, or others, designed to promote solderability. | 08-26-2010 |
20110171367 | METHOD FOR IMPROVING THE CORROSION RESISTANCE OF AN ELECTRONIC COMPONENT, PARTICULARLY OF CONDUCTORS OF A PRINTED CIRCUIT BOARD - In a method for improving the corrosion resistance of an electronic component, particularly of conductors of a printed circuit board, wherein after the conductors are produced out of copper a further treatment follows, the conductors are subjected to a pretreatment prior to the further treatment, wherein ions or ion impurities present on the surface of the conductors are removed by a purifying treatment and/or treated with at least one complexing composition, whereby the production of conductors and/or printed circuit boards having improved corrosion resistance, particularly when used in surroundings having higher moisture and optionally higher temperatures, becomes possible. | 07-14-2011 |
20120183679 | METHOD FOR MAKING AN ELECTROCHEMICAL SENSOR STRIP - A method for making an electrochemical sensor strip is provided which comprises the following steps: forming a circuit layer on a first substrate; forming a protective film on the first substrate such that the protective film covers a first portion of the circuit layer on the first substrate; forming an electrode layer on a second portion of the circuit layer; and coating a reagent on at least a portion of the electrode layer or the first substrate and disposing a second substrate on the first substrate. | 07-19-2012 |
20120321780 | METHOD OF PREVENTING OXIDATION OF MULTILAYER WIRINGS IN ULTRA LARGE SCALE INTEGRATED CIRCUITS AFTER ALKALINE POLISHING - A method of preventing oxidation of multilayer wirings in ultra large scale integrated circuits after alkaline polishing, the method including: a) mixing between 0.5 and 1 wt. % of a surfactant, between 0.05 and 0.5 wt. % of a chelating agent, between 1 and 10 wt. % of a corrosion inhibitor, and deionized water, and stirring to yield a water soluble antioxidant solution with pH value of between 6.8 and 7.5; and b) washing the multilayer wirings in the ultra large scale integrated circuits using the antioxidant solution after alkaline CMP under following conditions: between 1000 and 2000 Pa pressure; between 2000 and 5000 mL/min flow rate; and at least between 0.5 and 1 min washing time. | 12-20-2012 |
20130029031 | METHOD FOR MANUFACTURING INTERPOSER - A method for manufacturing an interposer includes forming a via hole in an insulation plate including a resin or a ceramic; simultaneously forming resists for a first upper redistribution layer on the top surface of the insulation plate, and a resistor for a lower redistribution layer on the bottom surface of the insulation plate; plating copper to fill the via hole and simultaneously forming the first upper redistribution layer and the lower redistribution layer along a designed circuit pattern; and forming a first upper protection layer and a lower protection layer to expose a portion of the first upper redistribution layer and a portion of the lower redistribution layer. | 01-31-2013 |
20140272113 | GUM ROSIN PROTECTIVE COATING AND METHODS OF USE - A rosin composition includes a gum rosin, an emulsifier, and a randomizing additive. The rosin composition may be applied to circuit cards for protection of the circuit card during storage. The rosin composition is solderable and is also easily removed for the soldering of components. | 09-18-2014 |
20140377453 | Insulating Adhesive Composition for Metal-Based Copper Clad Laminate (MCCL), Coated Metal Plate Using Same, and Method for Manufacturing Same - The present invention relates to an insulating adhesive composition for metal printed circuit board, an adhesive-coated metal plate using the same, and a method for manufacturing the adhesive-coated metal plate. The adhesive composition according to the present invention forms an adhesive layer that is excellent in terms of adhesion to a copper foil, electrical insulating properties, and thermal resistance. The composition contains a specific epoxy resin, a curing agent and alumina. According to the present invention, in coating the metal plate with the solvent type adhesive, a roll coating method is used to perform a continuous coating process on the metal plate, thereby improving productivity when compared to the general method using a sheet type adhesive film. | 12-25-2014 |
20160096962 | METHOD AND COMPOSITION FOR PROTECTING AN ELECTRONIC CIRCUIT BOARD FROM CONTAMINATION AND CORROSION - A method for protecting an electronic circuit board by covering the board with a composition comprising rosin and a carrier and allowing the composition to dry. The coating may be provided by spraying over all or selected parts of an assembled board, or as an underfill by microdispensing under one or more components. | 04-07-2016 |
427960400 | Conformal (e.g., thin film | 4 |
20090136656 | Method of manufacturing printed circuit board - A method of manufacturing a printed circuit board is disclosed. The method may include: stacking an anti-plating layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove, by removing a portion of the anti-plating layer and a portion of the copper clad laminate; stacking a seed layer over a surface of the intaglio groove; forming a plating layer, by plating an inside of the intaglio groove; and removing the anti-plating layer and the copper foil. | 05-28-2009 |
20090202709 | THIN LINE CONFORMAL COATING METHOD - A coating system with an applicator that has an air cylinder with a needle valve. A control has a timer that provides a string of electrical pulses to a solenoid. With each pulse, the solenoid applies pressurized air to a cylinder piston, thereby opening the needle valve and permitting coating material to flow past the needle valve. The needle valve is closed for durations of time between pulses, and the coating material is ejected from a dispensing needle in response to closings of the needle valve. | 08-13-2009 |
20100196593 | METHOD OF MANUFACTURING CARDS THAT INCLUDE AT LEAST ONE ELECTRONIC UNIT - The invention relates to a method for manufacturing boards that comprises depositing a liquid resin ( | 08-05-2010 |
20100215841 | PROCESS FOR INHIBITING OXIDE FORMATION ON COPPER SURFACES - This invention provides processes for inhibiting the formation of copper oxides on substantially oxide-free copper surfaces by contacting a substantially oxide-free copper surface with a bifunctional ligand that contains both a metal-coordinating group and a tertiary amine group in an aqueous solution of pH about 2 to about 5.5. A thin layer of the bifunctional ligand formed by coordination of the dialkylaminoacetonitrile to the copper surface can be removed by heating under vacuum to re-generate a substantially oxide-free copper surface. | 08-26-2010 |
427960600 | Barrier to diffusion of specific fluid (e.g., silicone rubber, selectively permeable membrane which excludes water or moisture, etc.) | 1 |
20090280237 | Coating Mass - The present invention relates to coating compositions for flat assemblies, hybrids, SMD assemblies, comprising at least one binder or binder mixtures which are curable at 60° C.-120° C., preferably at 70° C.-110° C., more particularly at 80° C.-90° C., and also to a process for preparing them and to their use for flat assemblies in electronics, hybrids, SMD assemblies and assembled printed circuit boards. | 11-12-2009 |