Class / Patent application number | Description | Number of patent applications / Date published |
425116000 | Opposed registering coacting female molds | 24 |
20080311236 | Wedge-Lock System For Injection Molds - A wedge-lock system for injection molds, using a protrusion on one side of the mold and a mating opening and sets of wedges which act together upon mold closing to provide and maintain accurate centering of the core and cavity halves in reference to each other, to prevent core shifts and compensate for uneven thermal expansion of mold components. | 12-18-2008 |
20080317892 | MOLD FOR A GOLF BALL - A golf ball mold having a non-planar parting surface that is formed a computerized modeling system such as CAD or CAE in combination with a CNC machine tool. The mold is comprised of hemispherical upper and lower mold halves being removably mated along the non-planar parting line that is distinct from the position corresponding to an equator line of the spherical cavity. Each mold half having an interior cavity detail for creating a pattern of dimples on the cover of the golf ball, wherein at least one dimple lies across an equator of the ball and the parting line passes around and between interdigitated dimples without intersecting them, therein creating a “seamless” golf ball. The non-planar surface of the upper mold half comprising at least three true sprues for venting of air and excess material; and at least three false sprues for the placement of tabs on the cover for use in aligning the golf ball as it is spun in a buffing machine. | 12-25-2008 |
20090011061 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A die for encapsulating an IC structural body having bonding wires with a molten resin is provided with at least one first half having an ejector-pin-through-hole and at least one second half coupled together to form a cavity therebetween. An ejector pin having a mirror-finished surface at a tip end thereof is inserted into the ejector-pin-through-hole and positioned at a position where a surface of the tip end of the ejector pin coincides with an intermediate surface height of a satin-finished surface formed on an upper inner wall of the cavity of the first half. The IC structural body is then encapsulated with a molten resin, and the mirror-finished surface of the ejector pin and the satin-finished surface of the upper inner wall surface of the cavity are stamped on the semiconductor package in substantially the same plane. | 01-08-2009 |
20090041881 | Mold Device and Mirror Plate - An object is to prevent internal stress from remaining in a molded product to thereby improve the quality of the molded product. A mold apparatus ( | 02-12-2009 |
20090136609 | APPARATUS FOR IN-MOLD-DECORATION MOLDING - An apparatus for an in-mold-decoration molding includes a female mold and a male mold. The female mold has an enclosing portion protruding therefrom. The male mold has a protrusion protruding therefrom. The protrusion is step-shaped and includes a receiving portion and a protruding portion protruding from the receiving portion. The receiving portion is configured for fitting with the enclosing portion and allowing a foil to attach thereto, therefore the male mold and the female mold cooperate to define a molding space with an end thereof being covered by the foil. | 05-28-2009 |
20090136610 | Device for Manufacturing Injection Moulding Pieces | 05-28-2009 |
20090252820 | COMBINATION SCOOP AND MOLD PRESS FOR DOUGH FISHING BAIT - A combination scoop and mold press includes two generally cup-shaped half-mold members, which engage one another at mold member edges in mirror-image alignment to form a generally enclosed mold. The half-mold members of the scoop and mold press are carried on opposite ends of a unitary piece of injection molded polymeric material, which has a live hinge joint equidistantly spaced between the mold members. Either of the half-mold members may be utilized to scoop out an appropriate mass of bait dough having at least the volume of the closed mold. At least one of the half-mold members is equipped with a notch or slit through which the shank of a fish hook, or the line which is tied to the fish hook, may pass. Finger pressure is used to bring the mold half-members together, compressing the bait dough around the hook. | 10-08-2009 |
20100003357 | GOLF BALL MOLD - An improved mold for making a golf ball comprises a pair of mold cups which are assembled together along mating surfaces that form a parting line. The mold cups are completely without sprues (vents). A lower mold cup has an undercut section of p to 360° in the rim area of the mating surface that allows for a very restricted but controlled flow at the parting line. The undercut section is of a depth of about 0.002 inch or less. This provides for a significant increase in the shear strength that results in a golf ball having less delamination, smaller voids, and a significant increase in impact cover durability. | 01-07-2010 |
20100047376 | NERVE CUFF INJECTION MOLD AND METHOD OF MAKING A NERVE CUFF - A mold for a nerve cuff having a first molding body defining a first molding cavity and a second molding body defining second molding cavity. The first and second molding bodies being mountable to one another thereby providing for the first and second molding cavities to interface. When interfacing the first and second molding cavities and injecting moldable material therebetween provides the nerve cuff following curing of the moldable material. An industrial mold including interfacing first and second cavities is also disclosed. A removable cassette for interposing between a first and a second molding cavity is also disclosed. Methods of making a nerve cuff are disclosed herein. Nerve cuffs produced by the foregoing molds, cassettes, industrial molds and methods are also disclosed. | 02-25-2010 |
20100092593 | Blow molding device - A blow molding device capable of securely closing a lower end of a parison to prevent the parison from being crushed. The blow molding device includes a blow mold and a parison holding unit. The parison holding unit includes an inner holding plate adapted to be inserted in an interior of the lower end of the parison, and an outer holding plate adapted to hold an outer surface of the lower end of the parison, and the outer holding plate has a recess conforming to a configuration of the inner holding plate and is split into a plurality of holding plate members such that each of the split holding plate members is capable of sliding to hold the lower end of the parison. | 04-15-2010 |
20100247697 | RESIN SEALING APPARATUS - There are provided a first mold | 09-30-2010 |
20100272842 | MOLD ASSEMBLY - A mold assembly includes an upper mold and a lower mold. The upper mold defines an upper mold cavity. A plurality of punch pins are movably mounted in the upper mold. A channel is defined in the upper mold and in communication with the upper mold cavity. The lower mold is closed with the upper mold. The lower mold defines a lower mold cavity together with which the upper mold cavity forms a closed cavity. The closed cavity receives a work piece located therein. The mold assembly is movable between a first position and a second position. In the first position, the punch pins of the upper mold are punched into the work piece to from the work piece into predetermined shape. In the second position, the punch pins are moved out of the upper mold cavity. Molten plastic flows in the closed cavity via the channel to from plastic ornaments on the work piece. | 10-28-2010 |
20100303944 | MOLD ASSEMBLY - A mold assembly includes an upper mold cavity, a base plate, and a flow element. The upper mold cavity defines a primary runner and a plurality of sub-runners on a top surface in communication with the upper mold cavity. A gate is defined in the primary runner for injecting liquefied plastic into the upper mold cavity. The base plate defines an outlet thereon corresponding to the gate for outputting the liquefied plastic. The upper mold cavity and the base plate corporately form a closed cavity therebetween. The flow element is received in the closed cavity and movable between a first position and a second position. In the first position, the flow element is engaged with the primary runner and plurality of sub-runners. In the second position, the flow element is separated with the primary runner and plurality of sub-runners. | 12-02-2010 |
20100330218 | SHAPING MOLD OF AIR FILTER - A shaping mold of an air filter includes an upper mold base and a lower mold base, and a filter material having a corresponding shape is placed and fixed at a partition plate of the lower mold base to reduce manufacturing time and material cost of the mold, and also achieve the effects of providing a higher precision of positioning the filter material and improving the production efficiency, quality and reliability of the product. | 12-30-2010 |
20110097432 | INJECTION MOLD - An exemplary injection mold for manufacturing a fiber optic connector includes a first mold, a second mold, an insert, two first positioning bar, and four second positioning bars. The first mold and the second mold cooperatively define a mold cavity. The mold cavity includes two lens molding recesses. The two inserts are attached to the second mold and located in the mold cavity. A dimension of each second bar in cross section is substantially smaller than that of each first positioning bar. One first positioning bar and two second positioning bars are arranged around each insert to position the insert, such that the inserts is suspended in the mold cavity and precisely aligns with the respective molding recesses. | 04-28-2011 |
20110293765 | NONCONFORMING ANTI-SLICE BALL - A non-conforming golf ball has a plurality of dimples formed on the outer surface of the ball in a predetermined dimple pattern, the outer surface comprising one or more first areas which include a plurality of first dimples which together have a first dimple volume and at least one second area having a dimple volume less that the first dimple volume, the first and second areas being configured to establish a preferred spin axis. The second area may be a hand around the equator which has a lower dimple volume or no dimples, with the polar regions have a higher volume of dimples, creating a preferred spin axis through the poles. | 12-01-2011 |
20120171317 | MOLD ASSEMBLY - A mold assembly for insert-molding a heterogeneous object includes an upper mold and a lower mold. The upper mold includes a cavity for accommodating an insert object. The lower mold includes a rigid body and a resilient contact member for resting the insert object. The resilient contact member absorbs dimensional variations of the insert object during the insert molding process. | 07-05-2012 |
20130071505 | MOLDING DEVICE FOR SEMICONDUCTOR CHIP PACKAGE - A molding device for a semiconductor chip package includes a first molding die, a second molding die opposite to the first molding die and a plurality of pistons. The second molding die defines a plurality of cylinders for receiving the corresponding pistons. The first molding die and the second molding die collectively form a molding cavity to accommodate a substrate. The first molding die includes a protruding portion defining a groove opening towards the second molding die. The protruding portion and the second molding die collectively form an entrance and an exit on two sides of the groove. Each of the plurality of pistons is compressed to force a molding compound flowing through the entrance, the groove and the exit to fill into the molding cavity so as to encapsulate the substrate. | 03-21-2013 |
20140004217 | MOLD FRAMES AND CAVITIES FOR MAKING DIMPLED GOLF BALLS | 01-02-2014 |
20140154348 | MOLD ASSEMBLY - A mold assembly for insert-molding a heterogeneous object includes an upper mold and a lower mold. The upper mold includes a cavity for accommodating an insert object. The lower mold includes a rigid body and a resilient contact member for resting the insert object. The resilient contact member absorbs dimensional variations of the insert object during the insert molding process. | 06-05-2014 |
20140295013 | APPARATUS FOR MOLDING ELECTRONIC COMPONENT - A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin. | 10-02-2014 |
20150086666 | SEMICONDUCTOR MANUFACTURING APPARATUS - A lower mold ( | 03-26-2015 |
20160176088 | SEMICONDUCTOR MANUFACTURING APPARATUS | 06-23-2016 |
20160375617 | Device for Producing Plastics Parts Having Inserts - A device for producing plastics parts having at least one rod-shaped metal insert, and comprising first and second mould half elements. At least one of the mould half elements is movable along a closure direction (Z). The mould half elements together can form a closed cavity for moulding a plastics part, the insert projecting at least in portions into the cavity in order to be overmoulded with plastics material, and being substantially arranged between the two mould half elements in a dividing plane which comprises a longitudinal direction (X) and a width direction (Y). At least one of the mould half elements has at least one fixing means wherein the insert can be fixed in the width direction. A positioning means can be arranged at a proximal end of the insert, allowing the insert to be moved along the longitudinal direction (X) into an injection position. | 12-29-2016 |