Class / Patent application number | Description | Number of patent applications / Date published |
420555000 | GALLIUM, INDIUM, OR THALLIUM BASE | 7 |
20090148338 | Alloy for a Fusible Plug and a Fusible Plug - Problems: A conventional alloy for a fusible plug contained harmful elements such as Cd and Pb, and there was a concern of pollution by these harmful elements. The present invention provides a fusible plug which does not contain the harmful elements Cd and Pb, with which the alloy is not forced out of the fusible plug even when used for long periods as a safety device for refrigeration equipment, and which has a strong mechanical strength such as creep strength. | 06-11-2009 |
20090196789 | SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP - To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C. | 08-06-2009 |
20100015004 | LEAD-FREE LOW-TEMPERATURE SOLDER - A conventional low-temperature solder containing Pb or Cd had problems with respect to environmental pollution. A conventional low-temperature lead-free solder had a liquidus temperature which was too high for low heat resistance parts having a heat resistance temperature of 130° C., or it was brittle or had low mechanical strength. A lead-free low-temperature solder according to the present invention comprises 48-52.5 mass % of In and a balance of Bi, and most of the structure is constituted by a BiIn | 01-21-2010 |
20100221142 | REMOVAL OF A SHEET FROM A PRODUCTION APPARATUS - A melt of a material is cooled and a sheet of the material is formed in the melt. This sheet is transported, cut into at least one segment, and cooled in a cooling chamber. The material may be Si, Si and Ge, Ga, or GaN. The cooling is configured to prevent stress or strain to the segment. In one instance, the cooling chamber has gas cooling. | 09-02-2010 |
20100290946 | METHODS OF MAKING AN ARTICLE OF SEMICONDUCTING MATERIAL ON A MOLD COMPRISING SEMICONDUCTING MATERIAL - The invention relates to methods of making articles of semiconducting material on a mold comprising semiconducting material and semiconducting material articles formed thereby, such as articles of semiconducting material that may be useful in making photovoltaic cells. | 11-18-2010 |
20130336837 | Lead-Free Solder Alloy for Vehicle Glass - A lead-free solder alloy for a vehicle glass according to the present invention contains 26.0 to 56.0 mass % of In, 0.1 to 5.0 mass % of Ag, 0.002 to 0.05 mass % of Ti, 0.001 to 0.01 mass % of Si and the balance being Sn. The lead-free solder alloy may optionally contain 0.005 to 0.1 mass % of Cu and 0.001 to 0.01 mass % of B. This solder alloy can suitably be applied vehicle glasses and show good joint strength to glass materials and high acid resistance, salt water resistance and temperature cycle resistance. | 12-19-2013 |
20140271343 | LEAD-FREE SOLDER COMPOSITION - A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. | 09-18-2014 |