| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 420507000 | GOLD BASE | 13 |
| 20090074608 | PROCESS FOR MERCURY CONTROL DURING PRESSURE OXIDATION - A method for suppressing mercury dissolution during pressure oxidation of precious metal-containing materials in the presence of halogens and halides is provided. Pressure oxidation is performed under controlled oxidative conditions to maintain the mercury predominantly in the solid residue. | 03-19-2009 |
| 20100143184 | METHOD FOR MANUFACTURING METAL NANORODS AND USE THEREOF - A method for manufacturing metal nanorods includes: a step of adding a reducing agent to a metallic salt solution; a step of radiating light into the metallic salt solution containing the reducing agent; and a step of leaving the light-radiated metallic salt solution containing the reducing agent stationary in a dark place so as to grow metal nanorods. Metal nanorods can be also grown by forming a mixed solution by fractionating the above light-radiated metallic salt solution and mixing the fractionated metallic salt solution into a non-radiated metallic salt solution containing the reducing agent, or mixing a non-radiated metallic salt solution and the reducing agent into the above light-radiated metallic salt solution; and leaving the mixed solution stationary in a dark place so as to grow metal nanorods. | 06-10-2010 |
| 20090022621 | BONDING WIRE - The invention relates to a gold alloy containing 99 wt. %, preferably 99.9 wt. % gold, and 1 to 1000 ppm, preferably 10 to 100 ppm calcium, and 1 to 1000 ppm, preferably 10 to 100 ppm ytterbium or europium or a mixture of ytterbium and europium, as well as a method for producing a homogeneous gold alloy containing europium and/or ytterbium. | 01-22-2009 |
| 20080304999 | Au-Sn Alloy Bump Having no Trapped-In Large Void and Process for Producing the Same - An Au—Sn alloy bump that does not include large voids and a method of producing the same are provided. The An Au—Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix. | 12-11-2008 |
| 20100226816 | GOLD ALLOY WIRE FOR BALL BONDING - There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu). | 09-09-2010 |
| 20110076183 | Au-Ga-In Brazing Material - A brazing material which can be melted at a suitable temperature at which damage is not given to a device inside a package upon sealing, and besides the brazing material is not remelted, e.g., upon mounting to a board, and which has a low temperature difference between a liquid and a solid. The brazing material is made of a Au—Ga—In ternary alloy, wherein weight concentrations of the elements lie within a region of a polygon with a point A (Au: 90%. Ga: 10%, In: 0%), a point B (Au: 70%, Ga: 30%, In: 0%), a point C (Au: 60%. Ga: 0%. In: 40%) and a point D (Au: 80%, Ga: 0%. In: 20%) as vertexes. excluding lines on which In and Ga become 0%, in a Au—Ga—In ternary phase diagram. | 03-31-2011 |
| 20120134873 | METHOD FOR FABRICATING A GOLD NANOPARTICLE - The present invention is directed to a method for fabricating a gold nanoparticle, the method comprising the steps of contacting a gold ion with a protein, wherein the protein has an inner cavity that can accommodate the gold ion, separating the protein with the encapsulated gold ion(s) from non-encapsulated gold ions, contacting the protein-encapsulated gold ion with a first reductant to reduce the gold ion and form a gold nanocluster seed in the inner cavity of the protein, wherein the first reductant is a strong reductant, and contacting the gold nanocluster seed in the inner cavity of the protein with a second reductant to mineralize and grow the gold nanoparticle. | 05-31-2012 |
| 420508000 | Palladium containing | 4 |
| 20110058979 | BONDING WIRE - [Issues to be Solved] Second bonding failures caused by attached oxide of additive elements on high purity Au bonding wire are to be resolved. | 03-10-2011 |
| 20120114522 | GRAY GOLD ALLOY FREE OF NICKEL AND COPPER - The present invention relates to a white gold alloy free of nickel and copper having a hardness that is suitable in particular for watchmakers and jewellers. Said alloy consists of (in wt %): more than 75% of Au; more than 18% to less than 24% of Pd; more than 1% to less than 6% of at least one element selected from among Mn, Hf, Nb, Pt, Ta, V, Zn and Zr; optionally, no more than 0.5% of at least one element selected from among Si, Ga and Ti; and optionally, no more than 0.2% of at least one element selected from among Ru, Ir and Re. The invention also relates to a method for preparing said alloy. | 05-10-2012 |
| 420509000 | Platinum containing | 2 |
| 20090232695 | GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, HIGH RESIN FLOWABILITY RESISTANCE, AND LOW SPECIFIC RESISTANCE - There are provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance. The gold alloy wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance contains one or more of Pt and Pd of 500 to less than 1000 ppm in total, Ir of 1 to 100 ppm, Ca of more than 30 to 100 ppm, Eu of more than 30 to 100 ppm, Be of 0.1 to 20 ppm, if necessary, one or more of La, Ba, Sr, and Bi of 30 to 100 ppm in total, if necessary, and a balance being Au and inevitable impurities. | 09-17-2009 |
| 20120039744 | GOLD-BASED ALLOY, FREE OF SILVER AND TIN, FOR DENTAL COPINGS OR ABUTMENTS - Alloys and dental copings or abutments formed of alloys include 50-60 wt % gold, 5-14 wt % platinum, 0.1-3.0 wt % iridium and the remainder palladium. Other alloys and dental copings or abutments formed of alloys include 58 wt % gold, 10 wt% platinum, 1.0 wt % iridium, and 31 wt % palladium. The alloys are capable of withstanding temperature profiles during casting and multiple high temperature exposures of porcelain firing without excessive softening. The alloys also exhibit advantageous shear strain properties giving the alloys improved manufacturability characteristics. | 02-16-2012 |
| 420511000 | Silver containing | 2 |
| 20090191089 | Gold alloy compositions formed by environmentally friendly process - Rose-color and yellow-color gold alloys are formed from a gold-base alloy containing silver and copper. Mining these elements is usually highly detrimental to the environmental. Environmentally friendly alloys are obtained through the use of recycled elements and elements recovered from mines utilizing specific guidelines. Jewelry manufactured from these environmentally friendly alloys may be more receptive to a consumer, resulting in a competitive advantage. | 07-30-2009 |
| 20080206091 | Novelty in the Method for the Combination of Gold and the Other Minerals - The invention relates to a method for combining the different minerals used for the jewels comprising the process steps of thinning and fixing to each other the bottom and the top layers ( | 08-28-2008 |
