Class / Patent application number | Description | Number of patent applications / Date published |
420485000 | Nickel containing | 7 |
20090257909 | Copper alloy strip material for electrical/electronic equipment and process for producing the same - A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C comprising Ni and Si in a total amount of 50 mass % or more are contained. The intermetallic compound A has a compound diameter of 0.3 μm to 2 μm, the intermetallic compound B has a compound diameter of 0.05 μm to less than 0.3 μm, and the intermetallic compound C has a compound diameter of more than 0.001 μm to less than 0.05 μm. | 10-15-2009 |
20100329923 | FORGED BERYLLIUM-COPPER BULK MATERIAL - The present invention provides a forged beryllium-copper bulk material, wherein the hardness of the central portion is 0 to 10% higher than that of the front surface, the Vickers hardness of the central portion is 240 or more, the tensile strength is 800 N/mm | 12-30-2010 |
420486000 | Aluminum containing | 2 |
20080279718 | Metal Alloy - A metal alloy is primarily formed of copper, nickel, magnesium and iron. The main constituents are copper and nickel. The contents of magnesium and iron are increased considerably in comparison with the prior art conventional alloys. The novel alloy has the following constituents in the following proportions (in % by mass and/or % by weight): copper (40% to 61%), nickel (35% to 45%), manganese (3.9% to 10%), iron (0.1% to 5%); and other materials, such as carbon, silicon, aluminum, magnesium, titanium, chromium, rare earths, molybdenum, and/or yttrium (at most 2% in total), with the sum of the components amounting to 100% by mass or, respectively, to 100% by weight. | 11-13-2008 |
20100092334 | Metal Alloy - A metal alloy is primarily formed of copper, nickel, magnesium and iron. The main constituents are copper and nickel. The contents of magnesium and iron are increased considerably in comparison with the prior art conventional alloys. | 04-15-2010 |
420487000 | Iron or manganese containing | 2 |
20120148440 | COPPER BRAZING FILLER METAL - A copper brazing filler metal includes Ni in an amount of from 20 or more to 36% or less by mass, Mn in an amount from 19 or more to 30% or less by mass, Fe in an amount of from 0 or more to 16% or less by mass, Si in an amount of from more than 0 (not inclusive) to 2% or less by mass, B in an amount of from 0.1 or more to 0.5% or less by mass, and the balance being copper (Cu) as well as inevitable impurities and/or a modifying element, when the entirety is taken as 100% by mass. Moreover, the copper brazing filler metal exhibits a ratio of the Ni content with respect to the Mn content (i.e., (Ni Content)/(Mn Content)) that falls in a range of from 1.1 or more to 2 or less when being free from Fe. | 06-14-2012 |
20160115570 | RESISTOR ALLOY, COMPONENT PRODUCED THEREFROM AND PRODUCTION METHOD THEREFOR - The invention relates to a resistor alloy ( | 04-28-2016 |
420488000 | Refractory metal containing | 1 |
20130136650 | THIN FILM OF COPPER-NICKEL-MOLYBDENUM ALLOY AND METHOD FOR MANUFACTURING THE SAME - A Cu—Ni—Mo alloy thin film, including Ni as a solution element and Mo as a diffusion barrier element. Ni and Mo are co-doped with Cu. The enthalpy of mixing between Mo and Cu is +19 kJ/mol, and the enthalpy of mixing between Mo and Ni is −7 kJ/mol. The atomic fraction of Mo/Ni is within the range of 0.06-0.20 or the weight faction of Mo/Ni within the range of 0.10-0.33. The total amount of Ni and Mo additions is within the range of 0.14-1.02 at. % or wt. %. A method for manufacturing the alloy thin film is also provided. | 05-30-2013 |