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COPPER BASE

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420 - Alloys or metallic compositions

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Class / Patent application numberDescriptionNumber of patent applications / Date published
420470000 Tin containing 82
420477000 Zinc containing 22
420485000 Nickel containing 6
420489000 Aluminum, gallium, indium, or thallium containing 2
20130183194Copper Alloy - Alloys are demonstrated based on copper, which have additions of manganese and sulfur and/or calcium as well as additional elements. The copper alloys are free from tellurium and lead, and are distinguished by high electrical conductivity and good machinability.07-18-2013
20100172791ALUMINUM-BRONZE ALLOY AS RAW MATERIALS FOR SEMI SOLID METAL CASTING - An aluminum-bronze alloy as raw materials for Semi Solid Metal casting has a component composition containing Al of 5 to 10 mass %, Zr of 0.0005 to 0.04 mass %, and P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing Si of 0.5 to 3 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass % as needed.07-08-2010
420492000 Titanium, zirconium or hafnium containing 2
20080240974Age-hardenable copper alloy - An age-hardenable copper alloy made of 1.2 to 2.7% cobalt, which is able to be partially replaced by nickel, 0.3 to 0.7% beryllium, 0.01 to 0.5% zirconium, optionally 0.005 to 0.1% magnesium and/or iron and in some instances up to a maximum of 0.15% of at least one element from the group including niobium, tantalum, vanadium, hafnium, chromium, manganese, titanium and cerium. The remainder is copper and includes production-conditioned impurities and usual processing-additives. This copper alloy is used as the material for producing mold blocks for the side dams of continuous strip-casting installations.10-02-2008
20120148441COPPER ALLOY WIRE AND METHOD FOR PRODUCING THE SAME - The zirconium content of the alloy composition of a copper alloy wire is 3.0 to 7.0 atomic percent; and the copper alloy wire includes copper matrix phases and composite phases composed of copper-zirconium compound phases and copper phases. The copper matrix phases and the composite phases form a matrix phase-composite phase fibrous structure and are arranged alternately parallel to an axial direction as viewed in a cross-section parallel to the axial direction and including a central axis. The copper-zirconium compound phases and the copper phases in the composite phases also form a composite phase inner fibrous structure and are arranged alternately parallel to the axial direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double fibrous structure presumably makes the copper alloy wire densely fibrous to provide a strengthening mechanism similar to the rule of mixture for fiber-reinforced composite materials.06-14-2012
420493000 Manganese containing 1
20130094989COPPER-BASED ALLOYS, PROCESSES FOR PRODUCING THE SAME, AND PRODUCTS FORMED THEREFROM - Copper-manganese alloys, optionally with potentially other alloying elements, whose compositions are at or sufficiently near the congruent (minimum) melting point of the Cu—Mn system to substantially avoid dendritic growth during solidification. Processes for producing such alloys are also provided, as well as products produced from such alloys.04-18-2013
420499000 Phosphorus, arsenic, antimony, or bismuth containing 1
20110123389High Purity Copper and Method of Producing High Purity Copper Based on Electrolysis - High purity copper having a purity of 6N or higher, wherein content of each of the respective components of P, S, 0, and C is 1 ppm or less, and nonmetal inclusions having a particle size of 0.5 μm or more and 20 μm or less contained in the copper are 10,000 inclusions/g or less. As a result of using high purity copper or high purity copper alloy as the raw material from which harmful P, S, C, 0-based inclusions have been reduced and controlling the existence form of nonmetal inclusions, it is possible to reduce the occurrence of rupture of a bonding wire and improve the reproducibility of mechanical properties, or reduce the percent defect of a semiconductor device wiring formed by sputtering a high purity copper target with favorable reproducibility.05-26-2011
Entries
DocumentTitleDate
20100111752COMPOSITION OF MATTER TAILORING: SYSTEM IA - The present invention relates to tailored materials, particularly metals and alloys, and methods of making such materials. The new compositions of matter exhibit long-range ordering and unique electronic character.05-06-2010
20100028198Process for Copper Electrowinning and Electrorefining - A method of electrowinning or electrorefining copper from a copper electrolyte solution which contains chloride ions, the method comprising the steps of: (a) forming a polyacrylamide solution by dissolving polyacrylamide, having a molecular weight range of 5,000 to 20,000,000 Daltons, in an acidic medium and under conditions to form a polyacrylamide block copolymer having blocks of carboxyl groups dispersed along the polymer backbone; (b) introducing the polyacrylamide solution into an electrolytic cell containing the copper electrolyte solution at a polyacrylamide concentration of 0.01-10 mg/L; and (c) electroplating copper from the copper electrolyte solution to form a copper cathode.02-04-2010
20090035173Electrically Conductive Material - An electrically conductive material includes: a supersaturated solid solution of a polycrystalline copper alloy having a composition represented by the formula: Cu02-05-2009
20120148438NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies relative to previous methods. Such materials are useful in electronic applications.06-14-2012
20120301349NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES - Methods of preparing metal nanowire are disclosed that employ quaternary phosphonium salts. Such processes can produce long and thin nanowires. Compositions and articles comprising such nanowires are useful in electronics applications.11-29-2012
20120301348NOVEL SOLVENTS FOR METAL ION REDUCTION METHODS, COMPOSITIONS, AND ARTICLES - Methods employing novel solvents are disclosed for making metal nanostructures including metal nanowires. Such methods can be carried out at lower temperatures and higher production rates than those employing ethylene glycol. The products of these methods are useful for electronics applications.11-29-2012
20120114521STABILIZED METAL NANOPARTICLES AND METHODS FOR PRODUCTION THEREOF - Processes for synthesizing metal nanoparticles, particularly copper nanoparticles, are described. The processes can involve reacting an insoluble complex of a metal salt with a reducing agent in a reaction mixture containing a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant. More specifically, processes for forming copper nanoparticles can involve forming a first solution containing a copper salt, a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant; allowing an insoluble complex of the copper salt to form from the first solution; combining a second solution containing a reducing agent with the insoluble complex; and forming copper nanoparticles from the insoluble complex. Such copper nanoparticles can be about 10 nm or smaller in size, more particularly about 3 nm to about 6 nm in size, and have a fusion temperature of about 200° C. or lower.05-10-2012
20110103999METAL COATING FORMING METHOD AND AEROSPACE STRUCTURAL MEMBER - Provided are a method for forming a metal coating at high speed by using a simple cold spray apparatus, and an aerospace structural member on which a metal coating is formed by the cold spray method. In the metal coating forming method, nonspherical heteromorphous particles made of metal are projected onto a base material surface by the cold spray method to form a metal coating on the base material surface.05-05-2011
20120251381ARTICLES CONTAINING COPPER NANOPARTICLES AND METHODS FOR PRODUCTION AND USE THEREOF - Articles containing a matrix material and plurality of copper nanoparticles in the matrix material that have been at least partially fused together are described. The copper nanoparticles are less than about 20 nm in size. Copper nanoparticles of this size become fused together at temperatures and pressures that are much lower than that of bulk copper. In general, the fusion temperatures decrease with increasing applied pressure and lowering of the size of the copper nanoparticles. The size of the copper nanoparticles can be varied by adjusting reaction conditions including, for example, surfactant systems, addition rates, and temperatures. Copper nanoparticles that have been at least partially fused together can form a thermally conductive percolation pathway in the matrix material.10-04-2012
20120219452COPPER ALLOY AND COPPER ALLOY MANUFACTURING METHOD - A copper alloy having an electrical resistivity lower than those of current copper alloys and a tensile strength higher than those of current copper alloys and a method of manufacturing such a copper alloy are provided.08-30-2012
20120328468PROCESSED HIGH-PURITY COPPER MATERIAL HAVING UNIFORM AND FINE CRYSTALLINE STRUCTURE, AND PROCESS FOR PRODUCTION THEREOF - This worked high-purity copper material includes Cu having a purity of 99.9999% by mass or more, wherein an average crystal grain size is in a range of 20 μm or less, and in a grain size distribution of crystal grains, an area ratio of crystal grains having grain sizes that exceed 2.5 times the average crystal grain size is in a range of less than 10% of an area of the entire crystal grains. This method for producing a worked high-purity copper material includes: subjecting an ingot composed of high-purity copper having a Cu purity of 99.9999% by mass or more to hot forging at an initial temperature of 550° C. or higher, and then water-cooling the ingot; subsequently, subjecting the ingot to warm forging at an initial temperature of 350° C. or higher, and then water-cooling the ingot; subsequently, subjecting the ingot to cold cross-rolling at a total reduction ratio of 50% or more; and subsequently, subjecting the ingot to stress relief annealing at a temperature of 200° C. or higher.12-27-2012
20130177471COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR PRODUCING SAME - There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.07-11-2013
20130156631METHOD OF REMOVING OXIDE FILM ON SURFACE OF COPPER OR COPPER-BASE ALLOY AND COPPER OR COPPER-BASE ALLOY RECOVERED USING THE METHOD - A pickling solution, including: 50 g/L to 400 g/L of sulfuric acid; 1 g/L to 100 g/L of at least one oxidant selected from a group consisting of nitric acid, hydrogen peroxide, peroxodisulfate ions, and iron (III) ions; 0.01 g/L to 10 g/L of at least one additive selected from a group consisting of aromatic sulfonic acid, aromatic sulfonate, alkylamine, aromatic carboxylic acid, and aromatic carboxylate; 0.005 g/L to 10 g/L of at least one surfactant selected from a group consisting of alkylbenzene sulfonic acid and alkylbenzene sulfonate; and 10 g/L to 300 g/L of copper sulfate, is used to remove oxide film, and then reused by being electrolyzed and adding the oxidant, the additive and the surfactant in amounts equivalent to consumed amounts.06-20-2013
20120093680METHOD FOR OBTAINING COPPER POWDERS AND NANOPOWDERS FROM INDUSTRIAL ELECTROLYTES INCLUDING WASTE INDUSTRIAL ELECTROLYTES - The method for obtaining copper powders and nanopowders from industrial electrolytes including waste industrial electrolytes through electrochemical deposition of metallic copper on a cathode consists in using potentiostatic pulse electrolysis without the current direction change or with the current direction change, using the cathode potential value close to the plateau or on the plateau of the current voltage curve on which the plateau of the current potential range is from −0.2 V÷−1 V, and a moveable or static ultramicroelectrode or an array of ultramicroelectrodes made of gold, platinum or stainless steel wire or foil is used as a cathode, whereas metallic copper is used as an anode and the process is carried out at temperature from 18-60° C., and the electrolysis lasts from 0.005 to 60 s. Said method can be used to obtain nanopowders and powders characterised by particle structure and dimension repeatability and purity from 99%+ to 99.999% from waste industrial electrolytes and wastewaters from copper industry and electroplating plants without additional treatment.04-19-2012

Patent applications in class COPPER BASE

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