Entries |
Document | Title | Date |
20080205864 | Heat processing furnace and vertical-type heat processing apparatus - The present invention is a heat processing furnace comprising: a processing vessel for accommodating an object to be processed and performing thereto a heat process; and a cylindrical heater disposed to surround a circumference of the processing vessel, for heating the object to be processed; wherein: the heater includes a cylindrical heat insulating member, ribbed shelf sections that are axially formed in a tier-like manner on an inner circumference of the heat insulating member, and heating resistance wires of a helical pattern that are placed along the respective shelf sections; and pin members are arranged in the heat insulating member at suitable intervals therebetween, the pin members holding the heating resistance wires such that the heating resistance wires are movable in a radial direction of the heater, while preventing dropout of the heating resistance wires from the shelf sections. | 08-28-2008 |
20080232787 | Heat processing furnace and vertical-type heat processing apparatus - There is provided a heat processing furnace capable of quickly increasing and decreasing a temperature, while achieving improvement in durability. A heat processing furnace | 09-25-2008 |
20080247739 | Lamp heating apparatus and method for producing semiconductor device - A lamp heating apparatus has: a chamber having a transparent window and housing a substrate; a heating lamp for heating the substrate by radiant heat of a heating lamp through the transparent window; a radiation thermometer that optically detects the temperature of the substrate and has a sensing portion provided in the chamber; a radical generating portion for generating a radical outside the chamber and supplying the radical into the chamber; and a light quantity sensor for determining the time for cleaning the inside of the chamber from a cloudy state of the transparent window and the surface of the sensing portion. This lamp heating apparatus enables a series of operations including heat annealing of the substrate and cleaning of the inside of the chamber. According to this invention, a lamp heating apparatus that has good temperature uniformity and reproductivity of heat processing conditions is obtained. | 10-09-2008 |
20080267598 | Heat Treating Apparatus - [Problems] To prevent both slips caused by damage from projections, and slips caused by adhesive force occurring due to excessive smoothing. | 10-30-2008 |
20080273867 | IRRADIANCE PULSE HEAT-TREATING METHODS AND APPARATUS - A method of heat-treating a workpiece includes generating an initial heating portion and a subsequent sustaining portion of an irradiance pulse incident on a target surface area of the workpiece. A combined duration of the initial heating portion and the subsequent sustaining portion is less than a thermal conduction time of the workpiece. The initial heating portion heats the target surface area to a desired temperature and the subsequent sustaining portion maintains the target surface area within a desired range from the desired temperature. Another method includes generating such an initial heating portion and subsequent sustaining portion of an irradiance pulse, monitoring at least one parameter indicative of a presently completed amount of a desired thermal process during the irradiance pulse, and modifying the irradiance pulse in response to deviation of the at least one parameter from an expected value. | 11-06-2008 |
20090010626 | PROCESSING MULTILAYER SEMICONDUCTORS WITH MULTIPLE HEAT SOURCES - A method of adjusting the heat transfer properties within a processing chamber is presented. Chamber properties may be determined and adjusted by adjusting the thermal mass of an edge ring disposed in the processing chamber. | 01-08-2009 |
20090016706 | Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devices - A heating apparatus comprises a wall for surrounding and defining a heating space, a heating element mounted on the inner side of the wall, reflecting members for reflecting the heat emitted from the heating element. Also, a moving unit joined to one end of each of the reflecting members for moving the reflecting members. Moreover, pivotal members joined to the reflecting members beside more their respective other side than one side of the reflecting members for controlling as pivots the movement of the reflecting member driven by the moving unit. | 01-15-2009 |
20090034948 | Light emitting type heat treatment apparatus - A light emitting type heat treatment apparatus includes relatively low rated power density filament lamps and relatively high rated power density filament lamps, in which a heat treatment including a temperature raising heat process for raising a work piece quickly to a predetermined heat treatment temperature by light emitted from the filament lamps, and a constant temperature heating process succeeding the temperature raising heating process in which the work piece is heated while the predetermined heat treatment temperature is maintained, and a control unit which controls lighting state of the filament lamps so that while at least filament lamps with relatively high rated power density are lighted in the temperature raising heating process, in the constant temperature heating process, only filament lamps with relatively low rated power density are lighted. | 02-05-2009 |
20090060480 | METHOD AND SYSTEM FOR CONTROLLING BAKE PLATE TEMPERATURE IN A SEMICONDUCTOR PROCESSING CHAMBER - A method of operating a bake plate disposed in a semiconductor processing chamber having a face plate opposing the bake plate includes providing a temperature control signal to the bake plate and measuring a face plate temperature associated with the face plate. The method also includes determining a difference between the face plate temperature and a predetermined temperature and modifying the temperature control signal provided to the bake plate in response to the determined difference. | 03-05-2009 |
20090123139 | SYSTEM, METHOD AND APPARATUS FOR CONTROLLING DRIFT OF A MAIN MAGNETIC FIELD IN AN MRI SYSTEM - An apparatus for controlling the temperature of a warm bore of a superconducting magnet in a magnetic resonance imaging (MRI) includes a plurality of warm bore thermal sensors positioned on a surface of the warm bore and a plurality of heater elements positioned on the surface of the warm bore. A heater element thermal sensor is coupled to each of the plurality of heater elements and configured to monitor the temperature of the corresponding heater element. A controller is coupled to the plurality of warm bore thermal sensors and the plurality of heater element thermal sensors. The controller is configured to control each of the plurality of heater elements to maintain a predetermined temperature of the warm bore. | 05-14-2009 |
20090162040 | HEAT RADIATING PLATE STORAGE TRAY - A heat radiating plate storage tray has a plate main body, and a plurality of first projection portions provided on a first surface of the plate main body. A heat radiating plate having a rectangular recessed portion on a surface thereof is capable of being mounted on the first surface of the plate main body, a top face of the first projection portion supports a bottom face of the recessed portion of the heat radiating plate, and a height of the first projection portion is larger than a depth of the recessed portion of the heat radiating plate. | 06-25-2009 |
20090175605 | HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY EXPOSING SUBSTRATE TO FLASH LIGHT - A semiconductor wafer to be treated is placed in a horizontal position on a holding plate held by a susceptor. Six bumps are mounted upright on the upper surface of the holding plate. The semiconductor wafer is supported by the six bumps in point contacting relationship, and is held at a distance ranging from 0.5 mm to 3 mm from the upper surface of the holding plate. Light is directed from halogen lamps onto the semiconductor wafer held by the holding plate to preheat the substrate until the temperature of the semiconductor wafer is increased up to a predetermined temperature. Thereafter, flash light is directed from flash lamps onto the semiconductor wafer. A thin gas layer lying between the back surface of the semiconductor wafer and the upper surface of the holding plate acts as a resistance to suppress the motion of the semiconductor wafer, thereby preventing a crack in the semiconductor wafer. | 07-09-2009 |
20090190908 | APPARATUS FOR HEAT-TREATING SUBSTRATE AND METHOD FOR HEAT-TREATING SUBSTRATE - In an apparatus for heat-treating a substrate, a substrate holder unit including a substrate stage which is made of carbon or a carbon-covered material having high radiation ratio is arranged in a vacuum chamber to be vertically movable. A heating unit including a heat dissipation surface which opposes the substrate stage is provided above the substrate stage in the vacuum chamber. The substrate stage is moved close to the heat dissipation surface to heat the substrate in noncontact with it with radiation heat from the heat dissipation surface. The substrate holder unit includes a radiation plate and a reflection plate. | 07-30-2009 |
20090196588 | Oven for Semiconductor Wafer - An oven is described that can more evenly heat the semiconductor wafer, even though the wafer may warp during heating. The oven may provide relatively uniform heating even though the type and location of warping may be unpredictable for any given wafer. The oven may have a heating surface divided into a plurality of heating zones that may each independently provide a given amount of heat to the wafer. The amount of heat provided by each zone may be determined using signals from sensors that sense the warping of the wafer. | 08-06-2009 |
20090202231 | HEATING APPARATUS, HEATING METHOD, AND SEMICONDUCTOR DEVICE MANUFCATURING METHOD - A heating apparatus including a filament arranged in a vacuum heating vessel comprises a base plate arranged in the vacuum heating vessel to fix the filament at a predetermined position with respect to a conductive heater forming one surface of the vacuum heating vessel. The base plate comprises a plate body having a carbon fiber. | 08-13-2009 |
20090245761 | LIGHT-EMITTING HEAT TREATMENT APPARATUS - Annular reflecting rings are removably mounted on the upper and lower sides of a chamber side portion of a chamber. An annular recessed portion is formed sandwiched between the lower end face of the upper reflecting ring and the upper end face of the lower reflecting ring to surround a holding part for holding a semiconductor wafer. The outer peripheral surface of the recessed portion communicates with a transport opening. The formation of the recessed portion prevents the light emitted from halogen lamps and flash lamps from being non-uniformly reflected around the holding part to enter a semiconductor wafer, thus improving the uniformity of the in-plane temperature distribution in the semiconductor wafer during heat treatment. | 10-01-2009 |
20090245762 | Oven with light emitting diode and/or laser diode as heating devices - The present invention provides an oven that utilizes light emitting diode (LED) and or laser diode (LD) as heating devices. Such heating devices will enable a wide variety of heating modalities. | 10-01-2009 |
20090274454 | SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES - Embodiments of the present invention provide apparatus and method for reducing non uniformity during thermal processing. One embodiment provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to rotate the substrate, a sensor assembly configured to measure temperature of the substrate at a plurality of locations, and one or more pulse heating elements configured to provide pulsed energy towards the processing volume. | 11-05-2009 |
20090279879 | RADIANT HEATER - A radiant heater includes a heater body having a box-like configuration, the body defining an inner cavity and including a base wall and an open end opposite the base wall. The body is fabricated from a ceramic material. The body also includes a heating element extending a length of the body and positioned to direct energy through the open end of the body. | 11-12-2009 |
20100003020 | APPARATUS AND METHOD FOR MEASURING RADIATION ENERGY DURING THERMAL PROCESSING - Embodiments of the present invention provide apparatus and method for reducing heating source radiation influence in temperature measurement during thermal processing. In one embodiment of the present invention, background radiant energy, such as an energy source of a thermal processing chamber, is marked within a selected spectrum, a characteristic of the background is then determined by measuring radiant energy at a reference wavelength within the selected spectrum and a comparing wavelength just outside the selected spectrum. | 01-07-2010 |
20100008656 | RAPID THERMAL PROCESSING CHAMBER WITH SHOWER HEAD - Apparatus and methods for thermally processing a substrate are provided. A chamber containing a levitating support assembly configured to position the substrate at different distances from a plate during the heating and cooling of a substrate. In one embodiment a plurality of openings on the surface of the plate are configured to evenly distribute gas across a radial surface of the substrate. The distribution of gas may couple radiant energy not reflected back to the substrate during thermal processing with an absorptive region of the plate to begin the cooling of the substrate. The method and apparatus provided within allows for a controllable and effective means for thermally processing a substrate rapidly. | 01-14-2010 |
20100054720 | Method and Apparatus for Extended Temperature Pyrometry - Embodiments of the invention are directed to methods and apparatus for rapid thermal processing of a substrate over an extended temperature range, including low temperatures. Systems and methods for using an extended temperature pyrometry system employing a transmitted radiation detector system are disclosed. Systems combining transmitted radiation detector systems and emitted radiation detector systems are also described. | 03-04-2010 |
20100067886 | IR LASER OPTICS SYSTEM FOR DIELECTRIC TREATMENT MODULE - A system for curing a low dielectric constant (low-k) dielectric film on a substrate is described, wherein the dielectric constant of the low-k dielectric film is less than a value of approximately 4. The system comprises one or more process modules configured for exposing the low-k dielectric film to electromagnetic (EM) radiation, such as infrared (IR) radiation and ultraviolet (UV) radiation. | 03-18-2010 |
20100111512 | HEATING PROCESS APPARATUS - An object of the present invention is to provide a heating process apparatus capable of being controlled to a constant temperature and to temperatures in a high-temperature range higher than or equal to a 1850 degrees. A heating process apparatus includes: a process chamber; a heat-processed object support member provided in the process chamber; a heater provided inside the heat-processed object support member; and temperature measuring means for measuring the temperature of the heat-processed object support member; wherein the temperature measuring means is provided outside a transmissive window provided in a peripheral wall of the process chamber and through which infrared energy radiated from the heat-processed object support member can be transmitted; and the temperature measuring means comprises a collector collecting infrared energy radiated from the heat-processed object support member and a calculating unit calculating temperature based on the ratio between the intensities of two wavelengths in the infrared. | 05-06-2010 |
20100150534 | HEAT TREATING DEVICE - A heat treating device including a treatment room for accommodating therein a substrate, a plurality of light sources, which is disposed above the treatment room, for irradiating the substrate, a first reflector, whose inner surface is a reflective surface of a dome shape, for reflecting and directing a part of light emitted from each light source to the substrate, and a plurality of second reflectors, each of which is provided for each light source, for reflecting and focusing light emitted from each light source and directing it to the substrate. The reflective surface of each of the second reflectors is a part of a spheroidal surface or a curved surface approximate to it surrounding a first focal point in such a manner that the first focal point is formed at a position near each light source and a second focal point is formed on a side of the substrate. | 06-17-2010 |
20100166397 | Wire Mesh Thermal Radiative Element and Use in a Radiative Oven - A high speed cooking apparatus employing a low voltage high current system for heating foods employing a novel wire mesh heating element. The system herein described providing the benefits of high speed cooking like that further described by U.S. Provisional Application 60/822,028 filed on Aug. 10, 2006, but yet providing significant cost benefit and simplicity over said system. | 07-01-2010 |
20100172637 | OVEN - The present invention relates to an oven which could heat food with light waves. In the oven of the present invention, the chamber is disposed in the housing, and both the chamber and the housing have an opening in the same direction; a first heat unit is disposed between the chamber and the housing; a gate is disposed on the openings of the housing and the chamber; the chamber has an arc surface; an interior pot with an arc surface is disposed in the chamber; the light waves, and the light waves generated and radiated by the first heat unit are reflected many times between the chamber and the interior pot, so the light waves could be absorbed by the interior pot so as to heat the food stuff by the heat which is conducted by the interior pot and the light waves which is radiated by the interior pot more efficient. | 07-08-2010 |
20100195992 | Walking beam type heat treatment apparatus - A walking beam type heat treatment apparatus including a heating furnace having a heating body to heat a substrate by radiation, a pair of first beams that are rod-like and provided in the heating furnace and a second beam disposed between the pair of the first beams, one of the pair of the first beams and the second beam relatively moving alternately in longitudinal and vertical directions repeatedly to the other of the pair of the first beams and the second beam, to cause to deliver and receive the substrate between the pair of the first beams and the second beam, and accordingly, to convey the substrate through the heating furnace, includes a side edge support protrusion that protrudes from each of the pair of the first beams such that the side edge support protrusion can horizontally support the substrate in abutting contact with a side edge of the substrate; and a front edge support protrusion and a rear edge support protrusion that protrude from the second beam such that the front edge support protrusion and the rear edge support protrusion can horizontally support the substrate in abutting contact with a front edge and a rear edge of the substrate. | 08-05-2010 |
20100226630 | APPARATUS FOR HEAT-TREATING SUBSTRATE AND SUBSTRATE MANUFACTURING METHOD - In a substrate annealing apparatus, a substrate holder unit including a substrate stage made of carbon with a high emissivity or a material coated with carbon is accommodated in a vacuum chamber to be liftable. Also, a heating unit having a heat radiating surface facing the substrate stage is disposed above the substrate holder unit within the vacuum chamber. The substrate annealing apparatus brings the substrate stage close to the heat radiating surface so that a substrate mounted on the substrate stage can be heated by radiant heat from the heat radiating surface while the heat radiating surface is not in contact with the substrate. The substrate holder unit includes a radiating plate and a reflecting plate made of one of a metal carbide, a metal nitride, and a nickel alloy. | 09-09-2010 |
20100272422 | RETORT FURNACE FOR HEAT AND/OR THERMOCHEMICAL TREATMENT - A retort furnace designed for heat and heat and chemical treatment in protective gas atmosphere, process gas atmosphere or in vacuum, equipped with a retort with a lid, made of steel or heat-resisting or creep-resisting alloys, separating the process atmosphere from the ambient atmosphere, with heating elements and thermal insulation outside the retort and with a cooling system. The radiation screens, in the form of at least two metal boards, are installed at supports located at the lid inside the retort; the heating elements are located behind the radiation screens, on the retort side and are separated with the metal screen. A few radiation sealing rings are placed in the extreme area of the brackets. The radiation screens and sealing rings, as well as the circumferential sealing rings permanently fixed in the casing of retort make up the system of reducing heat losses through radiation at the wall of the retort. | 10-28-2010 |
20100322601 | ELECTRIC BROIL ELEMENT - A radiant energy electric broil element for a food heating unit, including a cross-sectional geometrical configuration having a planar flattened portion with a length greater than a planar length of any other planar portion, the planar flattened portion oriented in a direction of a food product to be heated to maximize a radiant energy produced by the broiler element toward the food product. | 12-23-2010 |
20100322602 | Continuous Media Web Heater - A radiant heating unit is selectively operated to move radiant heating panels to regulate heating of a continuous web of media as the web moves along a media pathway in an imaging device. The radiant heating panels in a radiant heating unit may be moved to any one of a plurality of positions between and including a fully open position and a retracted position in the housing. A panel driver is operated to move the radiant heating panels to one of the positions in the plurality of positions in response to a variable view factor signal. | 12-23-2010 |
20100329649 | Infra-red heater assembly - An infra-red heater assembly takes on the conditions that afflict buildings: bed bugs, termites, other insects, molds, bacteria, and the like, and their resulting odors, and other contaminants. The assembly includes a portable electric infra-red emitting panel system with vertically stacked panels that distribute heat energy to the entire height of a wall. Removable panel covers over the infra-red heating elements protect them from damage during transport and when opened, act as deflectors, to direct, the radiant energy, widthwise, to restrict the line of site energy transferred to a wall. The heating panels are regulated by room air and wall temperature sensors to prevent structural damage and fire during usage of the invention. The infra-red heater may be pivotally mounted within its supporting structure so as to direct heat in various angular directions within the building being treated. | 12-30-2010 |
20110002677 | METHOD AND SYSTEM FOR DIGITAL NARROWBAND, WAVELENGTH SPECIFIC COOKING, CURING, FOOD PREPARATION, AND PROCESSING - A system for direct injection of selected thermal-infrared (IR) wavelength radiation or energy into food items for a wide range of processing purposes is provided. These purposes may include heating, raising or maintaining the temperature of the food articles. The system is especially applicable to operations that require or benefit from the ability to irradiate at specifically selected wavelengths or to pulse or inject the radiation. The system is particularly advantageous when functioning at higher speeds and in a non-contact environment with the target. | 01-06-2011 |
20110008027 | COOKER AND CONTROLLING METHOD FOR THE SAME - A cooker and a controlling method for the same are provided. A carbon heater has a wavelength bandwidth of 1.5˜2.5 μm where a radiant energy is maximum, and the carbon heater provides the radiant energy into a cavity in order to heat food disposed therein. | 01-13-2011 |
20110008028 | LAMP AND HEATING DEVICE - Provided are a lamp and a heating device which are capable of effectively preventing a seal portion from being overheated with a simple structure. A lamp includes: a tube portion in which a filament including a coil portion is contained; a seal portion filled with a metal foil connected to an end of the filament; and an overheat preventing portion covering a part of an outer surface of the tube portion. | 01-13-2011 |
20110019981 | ROTARY FURNACE FOR RADIATIVE HEAT TREATMENT OF SOLIDS - A rotary furnace ( | 01-27-2011 |
20110019982 | Rapid thermal processing apparatus and method of manufacture of semiconductor device - A rapid thermal processing apparatus comprises a processing chamber which subjects a semiconductor substrate to rapid thermal processing. A substrate support part is arranged in the processing chamber and supports the substrate. A lamp part optically irradiates the substrate supported by the substrate support part and heats the substrate. A thermo sensor is provided to measure a temperature of the substrate. A temperature computing part computes the temperature of the substrate based on an output signal of the thermo sensor. A control part controls an irradiation intensity of the lamp part according to the temperature computed by the temperature computing part. In this apparatus, the control part is provided to correct a control parameter of the irradiation intensity of the lamp part based on a measured reflectivity of a surface of the substrate. | 01-27-2011 |
20110064393 | OVEN - An oven is provided for re-baking welding consumables in an efficient and improved heat distribution manner. The oven includes a first chamber having a plurality of first chamber vents positioned on at least one sidewall of the first chamber and a heating source in a second chamber, the second chamber being in fluid communication with the first chamber, and one or more third chambers situated on a sidewall of the first chamber, wherein heat energy from the heating source flows through the third chamber into the first chamber, and wherein the heat energy from the heating source is substantially and evenly distributed inside the first chamber. | 03-17-2011 |
20110081137 | MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD - There are provided a manufacturing apparatus and a manufacturing method for manufacturing a substrate having a dielectric film, including a heat treatment apparatus that subjects a substrate on which a raw material containing composite oxide is applied, to heat treatment and crystallization in an atmosphere containing oxygen in a volume ratio of 20% or above under pressure of an atmospheric pressure or above. The manufacturing apparatus may manufacture a substrate having a ferroelectric film used as an optical control device. The heat treatment apparatus may include: a chamber that keeps, in the atmosphere, the substrate on which the raw material is applied; and a pressure adjusting section that adjusts a pressure of the atmosphere in the chamber to a predetermined value for a predetermined time period during heat treatment. | 04-07-2011 |
20110091189 | BROILER FOR COOKING APPLIANCES - A broiler assembly for a cooking appliance, the cooking appliance having an oven cavity and the broiler assembly is disposed within the oven cavity. The broiler assembly includes a reflector having first and second sides, side retainers coupled to a respective one of the first and second sides, and at least one carbon emitter heating element mounted to the side retainers. The at least one carbon emitter heating element includes a carbon filament disposed within a lamp. | 04-21-2011 |
20110123178 | Apparatus and Method for Enhancing the Cool Down of Radiatively Heated Substrates - The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a dynamic heat sink that is substantially transparent to light from a radiant heat source, the dynamic heat sink being positioned near the substrate so the two are coupled. Additional embodiments of the invention are directed to methods of processing a substrate using the apparatuses described. | 05-26-2011 |
20110135288 | Furnace for Conditioning Preforms - A furnace for conditioning preforms with several heating chambers rotating in a circle for heating one preform each with infrared radiation, and having holding devices for holding the preforms during heating, so that a section of the preform to be conditioned is essentially arranged in the heating chamber, and a section not to be conditioned is arranged outside the heating chamber. Accordingly, the section to be conditioned can be heated in a controlled and effective manner, and the section not to be conditioned can be protected from undesired heating. | 06-09-2011 |
20110170845 | DECOY SYSTEM, NOTABLY FOR IMPROVISED EXPLOSIVE DEVICES - The decoy system, notably for terrestrial mines or improvised explosive devices, includes: a means of producing heat energy including an air or water boiler, a means of emitting radiation in the infrared spectrum including a chamber that is fed with fluid by the production means, the chamber being provided with internal fins able to promote a build-up of heat energy inside said chamber, at least one detection means for determining the temperature of the chamber or the temperature of the fluid between the production means and the emission means, and a control unit able to control the operation of the heat energy production means at least according to the determined temperature. | 07-14-2011 |
20110211817 | METHOD FOR HEATING PART IN PROCESSING CHAMBER OF SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS - There is provided a method for heating a part within a processing chamber of a semiconductor manufacturing apparatus having a substrate in the processing chamber and performing a process on the substrate. The heating method includes generating heating lights which is generated by a heating light source provided outside the processing chamber and has a wavelength band capable of passing through a first part in the processing chamber and being absorbed into a second part in the processing chamber made of a material different from that of the first part, and heating the second part in the processing chamber by passing the heating lights through the first part in the processing chamber and irradiating the heating lights to the second part in the processing chamber. | 09-01-2011 |
20110229112 | Heating apparatus - A heating apparatus contains a chamber that has a space for placing a work piece, a filament lamp that has an arc tube, and a sealing portion provided at an end of the arc tube. The heating apparatus further contains a glass tube extending through the chamber. A cooling fluid is introduced into the glass tube. An end of the glass tube extends to an outside of the chamber. A sealing member seals the glass tube and the chamber. The filament lamp is arranged inside the glass tube. | 09-22-2011 |
20110262117 | Heat Treatment Apparatus and Heat Treatment Method - An object is to provide a method of activating impurity elements added to a semiconductor film, and a method of gettering, in a process of manufacturing a semiconductor device using a substrate having a low resistance to heat, such as glass, without changing the shape of the substrate, by using a short time heat treatment process. Another object is to provide a heat treatment apparatus that makes this type of heat treatment process possible. A unit for supplying a gas from the upstream side of a reaction chamber, a unit for heating the gas in the upstream side of the reaction chamber, a unit for holding a substrate to be processed in the downstream side of the reaction chamber, and a unit for circulating the gas from the downstream side of the reaction chamber to the upstream side are prepared. The amount of electric power used in heating the gas can be economized by circulating the gas used to heat the substrate to be processed. A portion of the circulating gas may be expelled, and can be utilized as a heat source in order to preheat a newly introduced gas. | 10-27-2011 |
20110286726 | Warmers for scented oils - A warmer for scented oil is provided. The warmer includes a base, a cover removably positioned on the base, and a warming device. The cover has a substantially spherical shape with an opening at an upper apex and an open channel formed in the cover at the upper apex around an outer periphery of the opening. The open channel is configured to receive the scented oil. The warming device is in a heat conductive relationship with the cover so that scented oil in the open channel is warmed by the warming device. The warming device can be one or more of a lighting device with an incandescent light bulb, a resistance heater with or without a lighting device such as a light emitting diode, or a candle. | 11-24-2011 |
20120008925 | TEMPERATURE SENSING DEVICE AND HEATING DEVICE - A technology to control temperature of a large substrate to be heated. A temperature sensing device is disposed lateral to a region where a radiation heater faces a substrate to be heated inside a heating chamber. A heating device has the heating chamber, the radiation heater, a power-supply device, a substrate-holding device, a control device, and the temperature sensing device. A control program is built into the control device, according to which the power-supply device controls the power applied to the radiation heater to generate heat such that the temperature of the temperature measurement substrate detected by a thermocouple of the temperature sensing device becomes a set temperature. Furthermore, a circulation passage is disposed in close contact with the temperature-sensing device, and with a coolant flowing through the circulation passage, the temperature of the temperature measurement substrate can be cooled from the set temperature to an initial temperature. | 01-12-2012 |
20120057856 | Apparatus and Methods for Vacuum-Compatible Substrate Thermal Management - One embodiment relates to an apparatus for vacuum-compatible substrate thermal management. The apparatus includes a load-lock chamber coupled to a vacuum chamber, a light-emitting diode array, and a substrate stage. The load-lock chamber is configured to hold a substrate prior to the substrate being transferred into the vacuum chamber, and a substrate stage is configured to hold the substrate in the vacuum chamber. The light-emitting diode array is configured to warm the substrate while the substrate is in the load-lock chamber. Other features, aspects and embodiments are also disclosed. | 03-08-2012 |
20120063752 | CORNER-CUBE IRRADIATION CONTROL - A system and method for utilizing corner-cube reflector technology for irradiation control in direct radiant heating systems is described. The system and method has application in many types of direct irradiation heating systems and is applicable to both narrowband or broadband directed irradiation heating systems. The purpose and result of the implementation is to improve the overall system efficiency through the redirection of photons back to a targeted item which is being heated or treated with the irradiation energy. | 03-15-2012 |
20120063753 | COOKWARE AND COOK-PACKS FOR NARROWBAND IRRADIATION COOKING AND SYSTEMS AND METHODS THEREOF - A methodology and product or system configurations are provided which allow food to be directly irradiated for cooking applications which involve the impingement of direct radiant energy on food or comestible items. Cooking vessels or cook-packs are used that are optically transmissive in visible or infrared narrow wavelength bands emitted in suitable narrowband cooking or heating systems. | 03-15-2012 |
20120070136 | Transparent Reflector Plate For Rapid Thermal Processing Chamber - The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a ceramic reflector plate, which may be optically transparent. The reflector plate may include a reflective coating and be part of a reflector plate assembly in which the reflector plate is assembled to a baseplate. | 03-22-2012 |
20120076476 | HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD FOR HEATING SUBSTRATE BY IRRADIATING SUBSTRATE WITH FLASHES OF LIGHT - A photodiode excellent in responsivity receives flashes of light emitted from flash lamps in the process of heating a semiconductor wafer by irradiation with flashes of light, and the waveform of the intensity of the flashes of light versus time is acquired using voltage data obtained from an output from the photodiode. Then, a temperature calculating part performs a heat conduction simulation using the acquired data to calculate the temperature of the semiconductor wafer irradiated with the flashes of light from the flash lamps. The temperature of the semiconductor wafer is computed using data corresponding to the intensity of the flashes of light obtained from the output from the photodiode. This allows the determination of the surface temperature of the semiconductor wafer irradiated with the flashes of light, irrespective of the waveform of the emission intensity of the flash lamps. | 03-29-2012 |
20120076477 | HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD FOR HEATING SUBSTRATE BY IRRADIATING SUBSTRATE WITH FLASHES OF LIGHT - Radiant energy from a semiconductor wafer which is determined from the theoretical value of black body radiation and the actually measured result of an output from a photodiode are brought into correspondence with each other, and a table showing a correlation therebetween is acquired and stored on a magnetic disk. When a semiconductor wafer to be treated is irradiated with flashes of light from flash lamps, the photodiode receives radiant light emitted from the semiconductor wafer. A controller determines, from the output from the photodiode, the radiant energy emitted per unit time from the semiconductor wafer irradiated with flashes of light, based on the acquired table. The controller further determines the surface temperature of the semiconductor wafer from the determined radiant energy. | 03-29-2012 |
20120128336 | HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - A semiconductor wafer in which a carbon thin film is formed on a surface of a silicon substrate implanted with impurities is irradiated with flash light emitted from flash lamps. Absorbing the flash light causes the temperature of the carbon thin film to increase. The surface temperature of the silicon substrate implanted with impurities is therefore increased to be higher than that in a case where no thin film is formed, and the sheet resistance value can be thereby decreased. When the semiconductor wafer with the carbon thin film formed thereon is irradiated with flash light in high concentration oxygen atmosphere, since the carbon of the thin film is oxidized to be vaporized, removal of the thin film is performed concurrently with flash heating. | 05-24-2012 |
20120148219 | OVEN FOR FOOD USE AND METHOD FOR BAKING A CEREAL-BASED DOUGH - The present invention relates particularly to an oven ( | 06-14-2012 |
20120163780 | RADIANT OVEN WITH STORED ENERGY DEVICES AND RADIANT LAMPS - An oven is configured with a cooking cavity for receiving a cooking load, a circuit for current supplied by one or more stored energy devices such as rechargeable batteries, and a heater comprising one or more radiant lamps to be driven by the current, the one or more radiant lamps being sized and positioned for heating the cooking load. The lamps are driven by current discharged from the batteries to radiantly heat a cooking load. An application of this stove configuration is in a toaster which is capable of toasting slices of bread in a matter of seconds. | 06-28-2012 |
20120213500 | EDGE RING FOR A THERMAL PROCESSING CHAMBER - Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more surface area increasing structures formed on an energy receiving surface of the edge ring. | 08-23-2012 |
20120213501 | APPARATUS FOR AND METHOD OF HEAT-TREATING FILM FORMED ON SURFACE OF SUBSTRATE - The back surface of a substrate having a front surface coated with a resist film is irradiated with flashes of light emitted from flash lamps. Heat conduction from the back surface of the substrate abruptly raised in temperature by the irradiation with flashes of light toward the front surface thereof occurs to heat the resist film formed on the front surface of the substrate, so that a post-applied bake process is performed. After the completion of the post-applied bake process, a cooling plate cools down the substrate. Regardless of the type of resist film formed on the front surface of the substrate, the substrate has a constant absorptance of flashes of light to allow the resist film to be heated to a constant treatment temperature, because the back surface of the substrate is irradiated with flashes of light. | 08-23-2012 |
20120263441 | Modular Paint Oven Using Radiant and Convection Heat - An oven apparatus | 10-18-2012 |
20120263442 | Modular Paint Oven Using Radiant and Convection Heat - An oven apparatus | 10-18-2012 |
20120281975 | SURFACE HEATING DEVICE FOR A SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT DEVICE - A surface heating device for a substrate treatment device with increased power density and improved homogeneity of heat radiation includes a jacket tube heater with straight tube sections and bent tube sections in which straight tube sections are arranged parallel to each other in a main plane and straight tube sections are connected to each other by bent tube sections, so that at least part of the bent tube sections are aligned sloped relative to the main plane. | 11-08-2012 |
20120288261 | HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY IRRADIATING SUBSTRATE WITH LIGHT - A photodetector element for receiving radiated light from a surface of a semiconductor wafer loses a detection function because the intensity of the received light exceeds a detection limit while a flash lamp emits light. Measurement is not performed during the above-mentioned period, and the intensity of the radiated light from the surface of the semiconductor wafer is measured after the flash lamp stops emitting light and the photodetector element restores the detection function. Then, the temperature of the surface of the semiconductor wafer heated by irradiation with a flash of light is calculated based on the measured intensity of the radiated light. Accordingly, even in a case where intense irradiation is performed in an extremely short period of time, such as flash irradiation, the flash of light does not act as ambient light, which enables to obtain the surface temperature of the semiconductor wafer. | 11-15-2012 |
20120294595 | Conveyor Oven with Varying Emitted Infrared Profiles - A conveyor oven has several heating zones. Each heating zone is comprised of one or more infrared emitters that are configured to emit a spectrum of infrared wavelengths that varies in intensity and spectrum over time. The spectra of emitted infrared wavelengths in each zone can have the same or different profile. Zones are regions wherein infrared emitters are configured and operated to emit the same or substantially the same infrared energy wavelengths and intensity levels across an IR spectrum. Access to the infrared emitters and the conveyor is provided by one or more access or maintenance ports formed into a side of the conveyor oven. Temperature control inside the oven is effectuated by venting hot air through air vents formed into the oven sides and/or top. | 11-22-2012 |
20120294596 | Conveyor Oven with Adjustable Air Vents - A conveyor oven has several heating zones. Each heating zone is comprised of one or more infrared emitters that are configured to emit a spectrum of infrared wavelengths that varies in intensity and spectrum over time. The spectra of emitted infrared wavelengths in each zone can have the same or different profile. Zones are regions wherein infrared emitters are configured and operated to emit the same or substantially the same infrared energy wavelengths and intensity levels across an IR spectrum. Access to the infrared emitters and the conveyor is provided by one or more access or maintenance ports formed into a side of the conveyor oven. Temperature control inside the oven is effectuated by venting hot air through air vents formed into the oven sides and/or top. | 11-22-2012 |
20120308215 | DETECTION OF SUBSTRATE WARPING DURING RAPID THERMAL PROCESSING - Apparatus and methods for detecting substrate warping during RTP processing are provided. In one embodiment, one or more beams of light are provided above and across the substrate being processed. In this embodiment, the amount of beam blockage correlates to the amount of substrate warping. In another embodiment, a beam of light is reflected off of a substrate during processing. In this embodiment, the amount of movement of the beam correlates to the amount of substrate warping. In yet another embodiment, a region of a substrate is illuminated during processing. In this embodiment, images of the illuminated region are analyzed to determine the amount of substrate warping. | 12-06-2012 |
20120328272 | COATED FILM DRYING FURNACE - A coated film drying furnace for drying a coated film inside a furnace body by conveying the coated film therein, the coated film having an absorption spectrum for electromagnetic waves of 3.5 μm or less and having hydrogen bonds, such as an electrode coated film for lithium ion battery. Infrared heaters provided inside a furnace body have outer circumferences of filaments concentrically covered by tubes that function as a low pass filter, and have a structure in which a fluid flow passage is formed at 16 between the plurality of tubes. Due to this, a temperature rise in the furnace is controlled so as to prevent explosion of an organic solvent vapor, and the coated film is efficiently heated and dried by intensively radiating near infrared rays of 3.5 μm or less that have superior ability to cut off the intermolecular hydrogen bonds onto a work. | 12-27-2012 |
20130058636 | Edge Ring For A Thermal Processing Chamber - Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more fins formed on an energy receiving surface of the edge ring. The fins may have at least one sloped side relative to a main body of the edge ring. | 03-07-2013 |
20130129329 | DEVICE FOR THERMALLY TREATING SUBSTRATES - The invention relates to a heat treatment inner chamber ( | 05-23-2013 |
20130148948 | HEAT TREATMENT APPARATUS AND METHOD FOR HEATING SUBSTRATE BY LIGHT-IRRADIATION - A light-emission output of a flash lamp for performing a light-irradiation heat treatment on a substrate in which impurities are implanted is increased up to a target value L | 06-13-2013 |
20130259457 | HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY IRRADIATING SUBSTRATE WITH FLASH OF LIGHT - Three support members made of silicon carbide are provided fixedly on an inner periphery of the support ring. The support members are inclined at an angle in the range of 15 to 30 degrees with respect to a horizontal plane. With an outer peripheral edge of a semiconductor wafer supported by the three support members, a heating treatment is performed by irradiating the semiconductor wafer with halogen light from halogen lamps. Silicon carbide absorbs the halogen light better than quartz. The support members support the outer peripheral edge of the semiconductor wafer in point contacting relationship, so that the contact between a holder and the semiconductor wafer is minimized. This minimizes the disorder of the temperature distribution of the semiconductor wafer due to the support members to achieve the uniform heating of the semiconductor wafer. | 10-03-2013 |
20130308929 | EQUIPMENT FOR SUBSTRATE SURFACE TREATMENT - A substrate surface treatment equipment includes a chamber, a ultraviolet ray lamp, an infrared heating element, a blackbody radiation plate and a vacuum extractor. The equipment can do the substrate surface treatment. The substrate surface treatment equipment can wash or modify the substrate surface. Therefore, after the washing and modifying of the substrate surface, the substrate surface can include a better adhesion when processing a thin film deposition or a colloid suspension coating. | 11-21-2013 |
20130315576 | HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD FOR MEASURING PARTICLE CONCENTRATION - A heat treatment apparatus includes a chamber for receiving a substrate therein, and a measurement part for measuring an air particle concentration in a processing space provided in the chamber. An air particle concentration in the processing space provided in the chamber is measured by the measurement part. The air particle concentration is correlated with the number of particles attached to a substrate received in the chamber. Accordingly, by conducting a particle test after the air particle concentration in the processing space is lowered to an air particle concentration corresponding to the number of particles existing on the substrate which can pass the particle test, the number of times the particle test should be conducted after maintenance of the heat treatment apparatus can be reduced. | 11-28-2013 |
20140003800 | PROCESSING MULTILAYER SEMICONDUCTORS WITH MULTIPLE HEAT SOURCES | 01-02-2014 |
20140079376 | THERMAL REACTOR WITH IMPROVED GAS FLOW DISTRIBUTION - Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume. | 03-20-2014 |
20140099085 | MULTISTAGE FURNACE - The invention provides a compact multistage furnace of which the installation area in a factory is decreased. A multistage furnace is configured by piling up a plurality of furnace units in the vertical direction. Each of the furnace units includes an upper heater and a lower heater layered in the vertical direction and holding a heat insulator therebetween, a support pipe disposed on one end of the upper heater and extending in the horizontal direction, a support pipe disposed on other end of the upper heater and extending in the horizontal direction, and a plurality of work support bars mounted over the support pipes. The back surface of a work supported by the work support bars is opposed to the upper heater and the front surface of the work is opposed to the lower heater of the adjacent furnace unit disposed above. | 04-10-2014 |
20140105582 | MINIMAL CONTACT EDGE RING FOR RAPID THERMAL PROCESSING - Embodiments of edge rings for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, an edge ring for a semiconductor process chamber may include an annular body having a central opening, an inner edge, an outer edge, an upper surface, and a lower surface, an inner lip disposed proximate the inner edge and extending downward from the upper surface, and a plurality of protrusions extending upward from the inner lip and disposed along the inner edge of the annular body, wherein the plurality of protrusions are arranged to support a substrate above the inner lip and over the central opening, wherein the inner lip is configured to substantially prevent light radiation from travelling between a first volume disposed above the edge ring and a second volume disposed below the edge ring when a substrate is disposed on the plurality of protrusions. | 04-17-2014 |
20140105583 | APPARATUS FOR PROVIDING AND DIRECTING HEAT ENERGY IN A PROCESS CHAMBER - Apparatus for providing heat energy to a process chamber are provided herein. The apparatus may include a process chamber body of the process chamber, a solid state source array having a plurality of solid state sources, disposed on a first substrate, to provide heat energy to the process chamber to heat a target component disposed in the process chamber body, and at least one reflector disposed on the first substrate proximate to one or more of the plurality of solid state sources to direct heat energy provided by the one or more of the plurality of solid state sources towards the target component. | 04-17-2014 |
20140161429 | THERMAL PROCESSING APPARATUS AND THERMAL PROCESSING METHOD FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - A susceptor that holds a semiconductor wafer placed thereon is capable of moving up and down inside a chamber. For preheating with a halogen lamp, the susceptor moves to a preheating position. The preheating position is a height of the susceptor that achieves the most uniform in-plane illumination distribution of light emitted from the halogen lamp and applied to the semiconductor wafer. After the preheating is finished, the susceptor moves to a flash heating position for irradiation with a flash from a flash lamp. The flash heating position is a height of the susceptor that achieves the most uniform in-plane illumination distribution of a flash emitted from the flash lamp and applied to the semiconductor wafer. | 06-12-2014 |
20140199056 | QUARTZ UPPER AND LOWER DOMES - Embodiments of the invention relate to a dome assembly. The dome assembly includes an upper dome comprising a central window, and an upper peripheral flange engaging the central window at a circumference of the central window, wherein a tangent line on an inside surface of the central window that passes through an intersection of the central window and the upper peripheral flange is at an angle of about 8° to about 16° with respect to a planar upper surface of the peripheral flange, a lower dome comprising a lower peripheral flange and a bottom connecting the lower peripheral flange with a central opening, wherein a tangent line on an outside surface of the bottom that passes through an intersection of the bottom and the lower peripheral flange is at an angle of about 8° to about 16° with respect to a planar bottom surface of the lower peripheral flange. | 07-17-2014 |
20140233929 | EDGE RING FOR A THERMAL PROCESSING CHAMBER - Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more surface area increasing structures formed on an energy receiving surface of the edge ring. | 08-21-2014 |
20140270734 | LIGHT IRRADIATION TYPE HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD - Four wafer pins are fixed in a chamber and spaced at intervals of 90 degrees. Four support pins are provided in a wafer pocket of a susceptor and spaced at intervals of 90 degrees. The four wafer pins and the four support pins are disposed concyclically in an alternating manner at intervals of 45 degrees. When halogen lamps irradiate a semiconductor wafer with light to heat the semiconductor wafer, the susceptor is moved upwardly and downwardly, so that the semiconductor wafer is shifted between the wafer pins and the support pins. This eliminates the occurrence of a problem such that the quartz pins which are relatively low in temperature are continuously kept in contact with particular places of the semiconductor wafer to improve the uniformity of the in-plane temperature distribution of the semiconductor wafer. | 09-18-2014 |
20140270735 | HIGH DENSITY SOLID STATE LIGHT SOURCE ARRAY - Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include: a process chamber body of the semiconductor process chamber; one or more solid state source arrays providing pulsed or continuous energy to the process chamber, wherein each of the one or more solid state source arrays include a substrate having a plurality of solid state light sources disposed on a first surface of the substrate, wherein the plurality of solid state light sources are connected in series and in a recursive pattern on the first surface of the substrate, and a heat sink coupled to a second surface of the substrate configured to remove heat from the substrate; and a power source coupled to the one or more solid state source arrays to electrically power the plurality of solid state sources. | 09-18-2014 |
20140270736 | EDGE RING FOR A THERMAL PROCESSING CHAMBER - Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more fins formed on an energy receiving surface of the edge ring. The fins may have at least one sloped side relative to a main body of the edge ring. | 09-18-2014 |
20140308028 | SUBSTRATE HEAT TREATMENT APPARATUS - An apparatus includes a C-shaped susceptor including a first substrate placement portion capable of placing the substrate, and an opening portion, a substrate stage including a second substrate placement portion capable of placing the substrate, and a susceptor support portion configured to support the susceptor, and a complementary portion formed separately from the susceptor support portion, engaged with the susceptor support portion, and configured to complement an opening portion of the susceptor to form the susceptor into an annular shape in a state in which the susceptor support portion supports the susceptor. When the substrate is placed on the second substrate placement portion and the second substrate placement portion is located at a predetermined distant position with respect to the heat radiation surface, the susceptor forms the annular shape together with the complementary portion to surround the substrate. | 10-16-2014 |
20140334806 | DOME COOLING USING COMPLIANT MATERIAL - Embodiments described herein generally relate to apparatus for processing substrates. The apparatus generally include a process chamber including a lamp housing containing lamps positioned adjacent to an optically transparent window. Lamps within the lamp housing provide radiant energy to a substrate positioned on the substrate support. Temperature control of the optically transparent window is facilitated using cooling channels within the lamp housing. The lamp housing is thermally coupled to the optically transparent window using compliant conductors. The compliant conductors maintain a uniform conduction length irrespective of machining tolerances of the optically transparent window and the lamp housing. The uniform conduction length promotes accurate temperature control. Because the length of the compliant conductors is uniform irrespective of machining tolerances of chamber components, the conduction length is the same for different process chambers. Thus, temperature control amongst multiple process chambers is uniform, reducing chamber-to-chamber variation. | 11-13-2014 |
20140376896 | INTERNAL CHAMBER ROTATION MOTOR, ALTERNATIVE ROTATION - Embodiments of the present invention generally relate to a rotation device in an RTP chamber. The rotation device includes a cylindrical inner race, a plurality of thrust bearings and a plurality of radial bearings. During operation, the bearings create a gas cushion preventing the rotating parts from contacting the stationary parts. | 12-25-2014 |
20140376897 | LIGHT PIPE WINDOW STRUCTURE FOR THERMAL CHAMBER APPLICATIONS AND PROCESSES - A processing chamber is described. The processing chamber includes a chamber having an interior volume, a light pipe window structure coupled to the chamber, the light pipe window structure having a first transparent plate disposed within the interior volume of the chamber, and a radiant heat source coupled to a second transparent plate of the light pipe window structure in a position outside of the interior volume of the chamber, wherein the light pipe window structure includes a plurality of light pipe structures disposed between the first transparent plate and the second transparent plate. | 12-25-2014 |
20150010294 | DEVICE FOR HEAT TREATMENT - Known devices for heat treatment comprise a process space surrounded by a furnace lining made of quartz glass, a heating facility, and a reflector. In order to provide, on this basis, a device for heat treatment having a furnace lining that can be manufactured easily and in variable shapes and enables rapid heating and cooling of the material to be heated and short process times and is characterised by its long service life, the invention proposes that the furnace lining comprises multiple wall elements having a side facing the process space and a side facing away from the process space, and that at least one of the wall elements comprises multiple quartz glass tubes that are connected to each other by means of an SiO | 01-08-2015 |
20150037017 | SUBSTRATE SUPPORT WITH SURFACE FEATURE FOR REDUCED REFLECTION AND MANUFACTURING TECHNIQUES FOR PRODUCING SAME - Methods and apparatus are provided for reducing the thermal signal noise in process chambers using a non-contact temperature sensing device to measure the temperature of a component in the process chamber. In some embodiments, a susceptor for supporting a substrate in a process chamber includes a first surface comprising a substrate support surface; and a second surface opposite the first surface, wherein a portion of the second surface comprises a feature to absorb incident radiant energy. | 02-05-2015 |
20150306808 | APPARATUS AND METHOD FOR HEATING PLASTIC PARISONS - An apparatus for heating plastic parisons includes a transport device which transports the plastic parisons along a predetermined transport path (T), and with at least one heating device, which is disposed stationary with respect to the transport path of the plastic parisons. The heating device has at least one first radiation source which emits thermal radiation as well as at least one reflector device which reflects at least a proportion of the thermal radiation emitted by the radiation source in the direction of the plastic parisons. The reflector device has a first section with a substantially parabolically curved configuration as well as a second section with a curved configuration, of which the curvature progression differs from the curvature progression of the first section. | 10-29-2015 |
20150334775 | HIGH SPEED OVEN INCLUDING WIRE MESH HEATING ELEMENTS - A radiant oven including multiple wire-mesh elements and a method of heating with the same is described. The radiant oven including: a cooking cavity configured to receive a cooking load; a circuit configured to current supplied by one or more stored energy devices; and a main heater comprising a multiple of wire mesh heating elements to be driven by the current, the multiple wire mesh heating elements being sized and positioned to heat the cooking load, and a gap between each of the multiple wire mesh heating elements. | 11-19-2015 |
20150340257 | LIGHT PIPE WINDOW STRUCTURE FOR LOW PRESSURE THERMAL PROCESSES - Embodiments disclosed herein relate to a light pipe structure for thermal processing of semiconductor substrates. In one embodiment, a light pipe window structure for use in a thermal process chamber includes a transparent plate, and a plurality of light pipe structures formed in a transparent material that is coupled to the transparent plate, each of the plurality of light pipe structures comprising a reflective surface and having a longitudinal axis disposed in a substantially perpendicular relation to a plane of the transparent plate. | 11-26-2015 |
20150348809 | RETENTION AND INSULATION FEATURES FOR LAMP - Embodiments of the present disclosure generally relate to an improved retention and insulation features for lamps used as a source of heat radiation in a thermal processing chamber. In one embodiment, a process chamber is provided. The process chamber includes a lamp assembly for thermal processing of semiconductor substrates, the lamp assembly has a lamp electrical connector and a first laterally operative element, a lamp assembly housing having a passage for receiving the lamp assembly, a power distribution assembly having a receptacle for receiving the lamp electrical connector and delivering power to the lamp electrical connector, and a spacer plate disposed between the lamp assembly housing and the power distribution assembly, wherein the spacer plate has a passage contoured to allow passage of the lamp electrical connector therethrough, and the spacer plate has a retention feature configured to engage or disengage the first laterally operative element. | 12-03-2015 |
20150357228 | SUBSTRATE TEMPERATURE CONTROL APPARATUS INCLUDING OPTICAL FIBER HEATING, SUBSTRATE TEMPERATURE CONTROL SYSTEMS, ELECTRONIC DEVICE PROCESSING SYSTEMS, AND METHODS - Substrate temperature control apparatus including optical fiber temperature control are described. Substrate temperature control apparatus includes a base, a thermal contact member proximate to the base, and a plurality of optical fibers adapted to provide light-based heating extending laterally between the base and thermal contact member. Substrate temperature control systems and electronic device processing systems and methods including optical fiber temperature control are described, as are numerous other aspects. | 12-10-2015 |
20150359044 | TUBULAR LIGHT SOURCE HAVING OVERWIND - Embodiments of the present invention generally relate to a tubular lamp with a coiled filament having an overwind wrapped around the coil. In one embodiment, the tubular lamp has a coiled coil filament, and the coiled coil has an overwind wrapped around the coiled coil. | 12-10-2015 |
20150382404 | INFRARED HEATER APPLIANCE, PARTICULARLY SUITABLE FOR USE IN AREAS AT RISK OF EXPLOSION - An infrared heater appliance with airtight chamber, includes a bulb housed in a shell ( | 12-31-2015 |
20160010239 | APPARATUS AND METHODS FOR ALIGNMENT OF A SUSCEPTOR | 01-14-2016 |
20160027671 | LIGHT PIPE ARRAYS FOR THERMAL CHAMBER APPLICATIONS AND THERMAL PROCESSES - A processing chamber is described. The processing chamber includes a chamber having an interior volume, a light pipe array coupled to the chamber, the light pipe array comprising a wall member that defines a boundary of the interior volume of the chamber, wherein the light pipe array includes a plurality of non-metallic light pipe structures, and a radiant heat source comprising a plurality of energy sources in optical communication with each of the plurality of light pipe structures. | 01-28-2016 |
20160057812 | VACUUM PROCESSING DEVICE - A vacuum processing apparatus according to this invention includes a heating unit arranged to face a processing surface of a substrate supported by a substrate support unit in a vacuum chamber, a cooling unit arranged to face a reverse surface of the substrate supported by the substrate support unit, a temperature correction unit configured to correct a temperature of a periphery of the substrate in order to reduce a temperature difference between a central portion and the periphery of the substrate by being arranged in a predetermined position between the substrate and the cooling unit when the heating unit heats the substrate, and a correction unit moving device configured to retract the temperature correction unit from the predetermined position. | 02-25-2016 |
20160111306 | OPTICAL SYSTEM - Implementations of the present disclosure generally relate to an improved lamphead assembly for use in a thermal processing chamber. In one implementation, a lamphead assembly comprises a lamp housing tube comprising a lamp disposed therein, the lamp housing tube having an open end facing towards the substrate support, and an insert tube disposed within the lamp housing tube, the insert tube surrounds at least a portion of the lamp and has a constant inner diameter throughout the entire length of the insert tube, wherein the insert tube collimates radiant energy from the lamp toward the substrate support. The insert tube comprises a cylindrical lower portion disposed adjacent to the open end of the lamp housing tube, and a tapered upper portion integrated with the cylindrical lower portion as one body. | 04-21-2016 |
20160379854 | Vacuum Compatible LED Substrate Heater - A system for heating substrates within a chamber, which may be maintained at vacuum conditions, is disclosed. The LED substrate heater comprises a base having a recessed portion surrounded by sidewalls. A plurality of light emitting diodes (LEDs) are disposed within the recessed portion. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon or a coating on the silicon, thus efficiently and quickly heating the substrate. A transparent window is disposed over the recessed portion, forming a sealed enclosure in which the LEDs are disposed. A sealing gasket may be disposed between the sidewalls and the window. | 12-29-2016 |