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INTEGRATED OPTICAL CIRCUIT

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385 - Optical waveguides

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DocumentTitleDate
20090214157Optical module and optical waveguide - An optical module includes an optical waveguide including a plurality of waveguide cores through which light propagates, a clad configured to trap the light in the waveguide cores, a plurality of fiber guide grooves in which optical fibers are inserted, the fiber guide grooves being arranged in parallel, and an adhesive spread groove configured to connect the fiber guide grooves and provided at leading ends of the fiber guide grooves with which the optical fibers contact; and a fixing member fixed to the optical waveguide with an adhesive while covering the fiber guide grooves. The fiber guide grooves have side walls including support projections configured to support, align, and optical couple the optical fibers to the waveguide cores, and adhesive recesses configured to define gaps between outer peripheral surfaces of the optical fibers and the fiber guide grooves so that the adhesive spreads in the gaps.08-27-2009
20120170887WAVEGUIDE STRUCTURES FOR SIGNAL AND/OR POWER TRANSMISSION IN A SEMICONDUCTOR DEVICE - A device is described which includes a waveguide structure for signal transmission and power/ground delivery The waveguide structure includes a signal transmission part for transmitting an optical signal from an illuminant device to a detector. The signal transmission part may include transparent polymer, diamond or glass. The signal transmission part is used for a waveguide. The waveguide structure further includes a power/ground delivery part surrounding the signal transmission part. The power/ground delivery part is composed of at least one metal layer. Thus, the waveguide structure can provide an optical-signal transmission with high speed and high volume through the signal transmission part, while a stable power or ground reference can be provided to multiple units through the power/ground delivery part.07-05-2012
20090196548SEMICONDUCTOR DEVICE HAVING OPTICAL SIGNAL INPUT-OUTPUT MECHANISM - A semiconductor device has printed wiring board (08-06-2009
20090196547Low-Loss Optical Interconnect - A low-loss optical interconnect is disclosed and may include an optical interconnect system with narrow and wide waveguides joining optical devices. The system may also comprise mode converters and waveguide bends. The waveguides may be made of silicon. Other exemplary aspects of the invention may comprise a continuous optical bend, whose radius of curvature at its endpoints is infinity and at its internal points is finite. The bend may be made of silicon. The width of the bend may vary along the bend. The system may comprise narrow and wide waveguides and a continuous bend.08-06-2009
20090196546Optical Integrated Circuit, Opto-Electronic Integrated Circuit and Manufacturing Method Thereof - In the opto-electronic integrated circuit, an optical waveguide in which a sapphire substrate for an SOS substrate is formed as a lower clad and a silicon film is formed as a core, an electronic integrated circuit formed in the silicon film, and grooves for fixing optical fibers are formed monolithically. Further, a photodiode array and a laser diode array are mounted on a hybrid basis. Since the lower clad of the optical waveguide is used as the sapphire substrate and the core is used as the silicon film, a difference in refractive index can be made large sufficiently, thus resulting in thinning of the silicon film. It is therefore possible to shorten the time required to process the core and the like. Further, since the electronic integrated circuit is formed on the sapphire substrate, the high-frequency characteristics are enhanced.08-06-2009
20090196545OPTICAL-ELECTRICAL COMPOSITE TRANSMISSION DEVICE AND ELECTRONIC EQUIPMENT - An optical-electrical composite cable as an example of an optical-electrical composite transmission device has a flexible board as an electrical signal transmission member having an electric wiring section, and an optical fiber as an optical signal transmission member. The optical fiber is passed through a plurality of holes formed in a resin base section of the flexible board so as to thread through the resin base section. The flexible board and the optical fiber are integrated so as not to be separated from each other, so that even when the characteristics (tensile strength, thermal expansion coefficient) of the transmission lines respectively embodied by the flexible board and the optical fiber are different, the optical-electrical composite cable has stable flexibility as a whole.08-06-2009
20100067847TUNABLE OPTOFLUIDIC DEVICE AND METHOD OF ITS FABRICATION - An integrated structure and method of its fabrication are presented. The integrated structure comprises at least one waveguide; at least one fluid chamber; and an electrode assembly. The fluid chamber is associated with said at least one waveguide and configured and operable to selectively allow one or more droplets of said fluid from the fluid chamber to access at least a portion of the waveguide thereby selectively creating one or more fluid-waveguide interfaces and affecting the effective refractive index of the waveguide and light coupling at said one or more interface. The electrode assembly is configured and operable to induce an electric field within said at least one fluid chamber to affect the fluid-waveguide interface, thereby affecting light propagation in said waveguide and accordingly affecting optical properties of the integrated structure.03-18-2010
20110194809Suspension board with circuit - A suspension board with circuit includes a circuit board and an optical waveguide provided in the circuit board. The optical waveguide is provided with a first optical waveguide having a curved portion and a secondary optical waveguide having a linear portion. The first optical waveguide includes a first under clad layer, a first core layer formed on the first under clad layer and included in the first under clad layer when projected in the thickness direction, and a first over clad layer formed on the first under clad layer so as to cover the first core layer. The secondary optical waveguide includes a secondary under clad layer, a secondary core layer formed on the secondary under clad layer, and a secondary over clad layer formed on the secondary core layer and included in the secondary core layer when projected in the thickness direction.08-11-2011
20110194808OPTICAL CONNECTOR AND OPTICAL LINK APPARATUS INCLUDING THE SAME - Provided is an optical connector that can improve coupling efficiency and coupling reliability. The optical connector includes an optical fiber guiding pad configured to guide an optical fiber connected to an optical waveguide that is disposed on an optoelectronic device IC, or includes a ferrule guiding pad and a ferrule guiding bar that guide a ferrule coupled to the optoelectronic device IC.08-11-2011
20090190879MANUFACTURING METHOD OF OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC HYBRID BOARD OBTAINED THEREBY - A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A resist layer is formed on a core-forming resin layer, and is then formed into a predetermined pattern. Resultant portions of the core-forming resin layer serve as cores (optical interconnect lines) 07-30-2009
20090190878OPTICAL/ELECTRICAL HYBRID SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An optical/electrical hybrid substrate is provided. The optical/electrical substrate includes: a wiring substrate; an optical waveguide disposed on the wiring substrate and configured to transmit an optical signal; a mirror support bonded onto the wiring substrate with an adhesive and being made of glass or silicon; and a mirror which reflects the optical signal and which is formed on an inclined surface of the mirror support.07-30-2009
20090123113SHARED SLAB AWG CIRCUITS AND SYSTEMS - Planar AWG circuits and systems are disclosed that use air trench bends and shared MMI slabs to increase planar circuit compactness.05-14-2009
20100119191METHOD FOR PRODUCING PHOTOELECTRIC COMPOSITE SUBSTRATE, PHOTOELECTRIC COMPOSITE SUBSTRATE PRODUCED BY THE METHOD, AND PHOTOELECTRIC COMPOSITE MODULE USING THE SUBSTRATE - The present invention provides a production process for a photoelectric composite substrate having an excellent productivity, comprising a step in which a sheet-like adhesive is stuck to an optical waveguide, a step in which a supporting base material of the above sheet-like adhesive is peeled off to prepare the optical waveguide provided with the adhesive, a step in which the above optical waveguide provided with the adhesive is adhered to an electric wiring board to prepare the electric wiring board provided with the optical waveguide and a step in which an optical path conversion mirror is formed in the optical waveguide of the above electric wiring board provided with the optical waveguide, a photoelectric composite substrate produced by using the above production process and a photoelectric composite module produced by using the above photoelectric composite substrate.05-13-2010
20100074576Optical Connections And Methods Of Forming Optical Connections - In one embodiment, method of forming fibers is provided. The method includes modifying a first exposed edge of at least one core of a first fiber. The first fiber has a first end, a second end, and a length between the first end and the second end. The second end has the first exposed edge of the core, and the first exposed edge has a first diffusion state. The first fiber may transmit light along the core. The modification of the first exposed edge includes modifying the first diffusion state of the first exposed edge of the core to a second diffusion state such that light exiting the first exposed edge in the second diffusion state is spread over a greater number of angles relative to angles of the light exiting the first exposed edge in the first diffusion state.03-25-2010
20100074575OPTICAL MODULE AND METHOD FOR MANUFACTURING THE SAME - An optical waveguide includes three cores formed within a single cladding, and each of the cores embed therein a light source and a light-receiving section, whose respective optical axes are aligned to each other. The light-receiving section includes a tapered reflective side surface, a light blocking section, and a light-receiving body. The tapered reflective side surface guides, among lights that propagate through the cores, only a light having an incidence angle within a range whose upper limit of is an angle θ03-25-2010
20100074573OPTICAL MODULE, OPTICAL TRANSMISSION DEVICE, AND SURFACE OPTICAL DEVICE - An optical module includes a mounted member, a surface optical device and a positioning portion. The mounted member includes an inserted portion. The surface optical device includes a substrate, an optical axis, and an insertion portion. The optical axis is provided in a direction perpendicular to the substrate. The insertion portion has a step surface that is inserted into the inserted portion of the mounted member in a direction perpendicular to the optical axis so as to position the optical axis. The positioning portion is provided in the mounted member and positions an optical transmission member so that the optical transmission member is optically coupled to the surface optical device.03-25-2010
20100074574OPTICAL TRANSCEIVER AND PROJECTION COVERING MEMBER - Provided are an optical transceiver and a projection covering member that can suppress EMI noise radiated from a pig-tail part. An elastic covering member for covering a projection which includes an optical coupler of an optical sub assembly is made of a conductive elastic material having predetermined resistivity. At least a part of an outer circumference surface of the elastic covering member comes into intimate contact with an outer periphery of a conductive opening part of a case while an inner circumference surface of the elastic covering member contacts with the projection.03-25-2010
20130039617Optoelectronic Component and Method for Producing an Optoelectronic Component - An optoelectronic component (02-14-2013
20130034325TRANSPARENT OPTICAL INTERPOSER - An optical interposer comprising a transparent substrate having first and second sides, at least one OED mounted to the first side, at least one reflective surface and at least one groove defined on the second side, and an optical conduit disposed in the groove optically coupled to the OED by the reflective surface02-07-2013
20130077913FLEXIBLE OPTICAL CIRCUIT - A process of manufacturing an optical flexible circuit comprising: (a) disposing an adhesive layer on at least a portion of a carrier film, said adhesive layer having a downward adhesive face and an upward adhesive face, said downward adhesive face and said carrier film being configured such that said carrier film is removable from said downward adhesive face without disruption of said downward adhesive face; (b) routing one or more fibers on said upward adhesive layer; (c) coating said fibers to define an optical circuit; and (d) optionally parting said carrier film to separate said optical circuit from other optical circuits on said carrier film.03-28-2013
20120207428METHODS AND SYSTEMS FOR REDUCING POLARIZATION DEPENDENT LOSS - A photonics integrated circuit for processing radiation includes a first-dimensional grating coupler for coupling in radiation, a second two-dimensional grating coupler for coupling out radiation and a waveguide structure having two distinct waveguide arms for splitting radiation received from the first grating coupler and recombining radiation in the second grating coupler. A phase shifting means furthermore is provided for inducing an additional phase shift in at least one of the two distinct waveguide arms thereby inducing a relative phase shift of π between the two distinct waveguide arms so as to provide a TE/TM polarization switch for radiation between the first grating coupler and the second grating coupler.08-16-2012
20130039616Optical Fibers Functionalized with Photonic Crystal Resonant Optical Structures - A photonic crystal (PC) device including one or more resonant optical structures defined by the photonic crystal structure is affixed to the end face of an optical fiber. The PC device is fabricated on a separate substrate, and then affixed to the fiber end face. This transfer can be facilitated by device templates which are laterally supported by tabs after an undercut etch. The tabs can be designed to break during transfer to the fiber, thereby facilitating transfer. Registration marks and/or the use of device templates having the same diameter as the fiber can be used to provide lateral alignment of the fiber to the resonant optical structures. Such alignment may be needed to provide optical coupling between the fiber and the resonant optical structures.02-14-2013
20130039614ULTRA-COMPACT PHOTODETECTOR ON AN OPTICAL WAVEGUIDE - An integrated circuit is described. This integrated circuit includes an optical waveguide defined in a semiconductor layer, and an optical detector disposed on top of the optical waveguide. Moreover, the optical waveguide has an end with a reflecting facet. For example, the reflective facet may be defined using an anisotropic etch of the semiconductor layer. This reflecting facet reflects light propagating in a plane of the optical waveguide out of the plane into the optical detector, thereby providing a photodetector with high optical responsivity, including an extremely low dark current (and, thus, high photosensitivity) and an extremely small capacitance (and, thus, high electrical bandwidth).02-14-2013
20130039615THREE DIMENSIONALLY INTEGRATED SEMICONDUCTOR SYSTEMS INCLUDING PHOTOACTIVE DEVICES AND SEMICONDUCTOR-ON-INSULATOR SUBSTRATES, AND METHODS OF FORMING SUCH THREE DIMENSIONALLY INTEGRATED SEMICONDUCTOR SYSTEMS - Three dimensionally integrated semiconductor systems include a photoactive device operationally coupled with a current/voltage converter on a semiconductor-on-insulator (SeOI) substrate. An optical interconnect is operatively coupled to the photoactive device. A semiconductor device is bonded over the SeOI substrate, and an electrical pathway extends between the current/voltage converter and the semiconductor device bonded over the SeOI substrate. Methods of forming such systems include forming a photoactive device on an SeOI substrate, and operatively coupling an waveguide with the photoactive device. A current/voltage converter may be formed over the SeOI substrate, and the photoactive device and the current/voltage converter may be operatively coupled with one another. A semiconductor device may be bonded over the SeOI substrate and operatively coupled with the current/voltage converter.02-14-2013
20080292239Adiabatic Waveguide Transitions - The invention relates to waveguiding structures in planar lightwave circuit devices that include a transition region between a slab waveguide and channel waveguides to reduce optical coupling loss. In particular star couplers and arrayed waveguide gratings incorporating the transition region of the present invention demonstrate reduced insertion loss. By creating a transition region composed of transverse rows intersecting the output waveguide array, where the rows have equal dimensions and the effective refractive index is controlled by increasing the spacing width gradually from row to row, an adiabatic transition is created from slab waveguide to channel waveguide array. This structure provides low insertion loss within practical manufacturing tolerances. In addition, the present invention has found that by incorporating the transition region of the present invention into an AWG, the reduced insertion loss can be controlled as uniform insertion loss across the channels.11-27-2008
20120183254OPTICAL 90-DEGREE HYBRID - An optical 90-degree hybrid includes a 90-degree hybrid circuit which mixes signal light and local oscillation light (LO light), separates the signal light into orthogonal components I, Q to output. The 90-degree hybrid circuit includes a first and a second coupler that branch signal light and LO light, a first and a second path through which signal light propagates, a third and a fourth path through which LO light propagates, and a third and a fourth coupler that combine signal light and LO light. A phase difference of 90 degrees is given between the beams of LO light propagating through the third and fourth paths. The second coupler, the third path, and the fourth path are formed between the first path and the second path. The overall size of the 90-degree hybrid circuit is reduced and downsizing of the PLC chip is enabled.07-19-2012
20120183253PHOTOELECTRIC CONVERSION MODULE - A photoelectric conversion module includes: an IC chip and a photoelectric conversion element mounted on one surface of a circuit board having a light transmitting property and flexibility; an optical fiber having a tip portion disposed in a holding groove formed in a resin layer provided on another surface of the circuit board; a reinforcing member covering the holding groove; and an optical element optically coupling a tip of the optical fiber and the photoelectric conversion element via the circuit board. The holding groove has an open end at an end of the resin layer, the end of the resin layer being located on the IC chip side in terms of an arrangement direction of the IC chip and the photoelectric conversion element, and at least part of the tip portion of the optical fiber extends along the IC chip.07-19-2012
20090103856OPTICAL RECEPTION AND TRANSMISSION MODULE - An optical waveguide film of an optical reception and transmission module guides light. A first optical path converting part of an optical transmission unit guides light. A mirror surface of a first optical path converting part bends light which is emitted from a light emitting element and which enters the first optical path converting part. A first holding member holds the light emitting element and the first optical path converting part. A second optical path converting part of an optical reception unit guides light. A mirror surface of a second optical path converting part bends the guided light. A second holding member holds the light receiving element and the second optical path converting part. A first supporting member supports the first end portion of the optical waveguide film. A second supporting member supports the second end portion of the optical waveguide film.04-23-2009
20100104239OPTICAL TRANSMISSION APPARATUS - An optical transmission apparatus includes an optical element that has at least one of a light emitting part and a light receiving part on a surface opposed to a mounting surface of the optical element, an optical waveguide that is made of a polymer material, and has an optical path deflecting part in a through hole or an opening, wherein the optical path deflecting part deflects an optical path of the optical with respect to the at least one of the light emitting part and the light receiving part of the optical element, and a substrate that has a mounting region on which the mounting surface of the optical element is mounted, and a plurality of waveguide holding parts, each holding the optical waveguide so that the optical path deflecting part of the optical waveguide is arranged opposite to the at least one of the light emitting part and the light receiving part of the optical element.04-29-2010
20100104240PACKAGE MANUFACTURING METHOD, PACKAGE, OPTICAL MODULE AND DIE FOR INTEGRAL MOLDING - An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.04-29-2010
20090154872ELECTRONIC DEVICE PACKAGE AND METHOD OF FORMATION - Provided are electronic device packages and their methods of formation. The electronic device packages include a sealed volume enclosing an electronic device and a feedthrough into the sealed volume for electrical connection of the electronic device. Provided are optoelectronic device packages and their methods of formation. The optoelectronic device packages include a first substrate and lid attached to the first substrate forming an enclosed volume. An optoelectronic device is disposed within the enclosed volume and a wick stop for preventing solder flow is provided. Provided are prism-coupled optical assemblies which allow for the coupling of light between an optical component, such as a laser, and an integrated optical waveguide through a prism.06-18-2009
20090154871SEMICONDUCTOR INTEGRATED CIRCUITS INCLUDING GRATING COUPLER FOR OPTICAL COMMUNICATION AND METHODS OF FORMING THE SAME - Provided are semiconductor integrated circuits including a grating coupler for optical communication and methods of forming the same. The semiconductor integrated circuit includes: a cladding layer disposed on a semiconductor substrate; a grating coupler including an optical waveguide on the cladding layer and a grating on the optical waveguide; and at least one reflector formed in the cladding layer below the grating.06-18-2009
20100040324OPTICAL ELEMENT AND METHOD FOR ITS MANUFACTURE - An optical element includes a substrate having a passive waveguide and a laser waveguide disposed therein. The laser waveguide is in direct contact with the passive waveguide over a surface of contact so as to provide a butt coupling between the passive waveguide and the laser waveguide. A step extends between an upper edge of the passive waveguide and an upper edge of the laser waveguide. A covering is disposed on the passive waveguide so that the covering and the substrate together provide a cladding of lower refractive index around the passive waveguide and so that a hollow space is disposed between a lower edge of the covering and the upper edge of the laser waveguide.02-18-2010
20100040323SUPER-LUMINESCENT LIGHT EMITTING DIODE - To provide a super luminescent light emitting diode comprising an optical waveguide structure which supplies particularly-high optical output. The super-luminescent light emitting diode includes: a first optical waveguide, of which one end is optically connected to one end of a multimode interference optical waveguide, and of which the other end forms a first light emitting edge; and a second optical waveguide, of which one end is optically connected to the other end of the multimode interference optical waveguide, and of which the other end forms a second light emitting edge. Each of the first and second optical waveguides has a width smaller than the width of the multimode interference optical waveguide.02-18-2010
20130084038Optical Waveguide Device - An optical waveguide device that uses a thin substrate having an electro-optical effect and a thickness of 10 μm or less, in which slab propagation light that is reflected from an end face of the device is removed and thus deterioration in an operational characteristic is suppressed. The optical waveguide device includes: a thin substrate which has an electro-optical effect and thickness of 10 μm or less, and in which an optical waveguide is formed; and a supporting substrate that is adhered to the thin substrate through an adhesion layer. An antireflective film is formed on a part of a side surface of the optical waveguide device.04-04-2013
20130051725OPTICAL DEVICE, OPTICAL MODULE, AND METHOD FOR MANUFACTURING OPTICAL DEVICE - An optical device includes a substrate and a first optical waveguide including a mesa. The mesa includes a first lower clad layer portion, a first core layer portion, and a first upper clad layer portion. The first lower clad layer portion, the first core layer portion, and the first upper clad layer portion are disposed in this order from the substrate side. The optical device also includes a first etch stop layer configured to stop etching when the first optical waveguide is formed. The first etch stop layer being laminated over the substrate. The first optical waveguide is laminated on the first etch stop layer.02-28-2013
20130051724TERAHERTZ INTERACTION CIRCUIT - A terahertz interaction circuit includes a waveguide through which electromagnetic waves pass, the waveguide having a folded shape and including a narrow open cavity portion; and an electron beam tunnel through which an electron beam passes, the electron beam tunnel penetrating through the waveguide.02-28-2013
20090304326ETCHED-FACET SEMICONDUCTOR OPTICAL COMPONENT WITH INTEGRATED END-COUPLED WAVEGUIDE AND METHODS OF FABRICATION AND USE THEREOF - An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having an off-normal device end face; and a low-index planar optical waveguide integrally formed on the semiconductor substrate at the device end face. The device and waveguide are non-collinear, and the waveguide is end-coupled at its proximal end to the optical device by refraction at the device end face. The apparatus further includes a reflective coating between the waveguide and substrate, an etched end face curved in the horizontal dimension, or an etched end face with a lower portion that protrudes beneath a proximal portion of the waveguide.12-10-2009
20090304323Optical coupling structure and substrate with built-in optical transmission function, and method of manufacturing the same - To provide an optical coupling structure that can transmit signal light efficiently and change the light paths, and thereby increase the coupling efficiency of the optical coupling between an optical semiconductor device and optical waveguides.12-10-2009
20090304324Optical waveguide and optical printed circuit board having the same - An optical waveguide, an optical printed circuit board equipped with the optical waveguide, and methods of manufacturing the optical waveguide and the optical printed circuit board are disclosed. The optical waveguide can include: a first cladding layer; a core formed on the first cladding layer; an alignment pattern, having a predefined positional relationship to the core, formed on the first cladding layer; a target mark formed on the alignment pattern to indicate a position of the alignment pattern; and a second cladding layer formed on the first cladding layer to cover the core, the alignment pattern, and the target mark. In such an optical waveguide, circuit patterns, etc., formed over the second cladding layer may be precisely and efficiently aligned with the core.12-10-2009
20100272390Integrated optical transceiver - An optical transceiver includes at least one light source and at least one detector mounted on the same surface of the same substrate. The detector is to receive light from other than a light source on the surface. At least one of the light source and the detector is mounted on the surface. An optics block having optical elements for each light source and detectors is attached via a vertical spacer to the substrate. Electrical interconnections for the light source and the detector are accessible from the same surface of the substrate with the optics block attached thereto. One of the light source and the detector may be monolithically integrated into the substrate.10-28-2010
20120219251OPTICAL WAVEGUIDE SUBSTRATE AND METHOD FOR MANUFACTURING SAME - According to a manufacturing method of an optical waveguide substrate including a core (08-30-2012
20120219250Integration of optoelectronics with waveguides using interposer layer - Improved integration of optoelectronic devices is provided by a spacer layer laterally sandwiched between distinct regions that are monolithically fabricated onto the same substrate (e.g., by selective epitaxy). An optical waveguide in one of the regions can optically couple to an optoelectronic device in another of the regions through the spacer layer, thereby providing a monolithically integrated form of butt-coupling. Preferably, the spacer layer thickness is less than about 50 nm, and is more preferably less than about 20 nm, to reduce optical loss. The spacer layer is preferably electrically insulating, to prevent shorting of devices grown by selective epitaxy.08-30-2012
20120219249OPTICAL PRINTED CIRCUIT BOARD, A METHOD OF MAKING AN OPTICAL PRINTED CIRCUIT BOARD AND AN OPTICAL WAVEGUIDE - An optical printed circuit board, including at least one optical waveguide for carrying optical signals on the optical printed circuit board; and a trench formed adjacent the at least one optical waveguide, wherein the trench contains a light absorptive material to absorb light that strays from the at least one waveguide.08-30-2012
20090041406INTEGRATED CIRCUIT INCLUDING NON-PLANAR STRUCTURE AND WAVEGUIDE - One embodiment provides an integrated circuit including a first non-planar structure and a waveguide configured to provide electromagnetic waves to the first non-planar structure. The first non-planar structure provides a first signal in response to at least some of the electromagnetic waves.02-12-2009
20130136392Vertically coupled wavelength tunable photo-detector/optoelectronic devices and systems - A system concept is provided for optical and/or optoelectronic integration that is based on coupling two or more waveguide detectors that are tunable to the same optical waveguide. This common optical waveguide can be regarded as an optical bus. The detectors each have two waveguide ends that are coupled to the optical bus, and light in the detectors that is not absorbed can propagate from the waveguide detectors to the optical bus. A preferred approach for implementing such coupling of detectors to the optical bus is the use of 3-D waveguide tapers between the detectors and the optical bus. Tuning the detectors in such a configuration can provide numerous useful functions.05-30-2013
20130136391OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device includes an optical semiconductor element and an optical waveguide butt-joined to the optical semiconductor element. The optical semiconductor element has a mesa structure including an active layer and a burying layer coating side faces of the active layer. The optical waveguide has a mesa structure including an optical waveguide layer having a layer structure different from the active layer, and a burying layer coating side faces of the optical waveguide layer. Mesa width of the optical waveguide is narrower than mesa width of the optical semiconductor element.05-30-2013
20090092353Method of making circuitized substrate with internal optical pathway - A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.04-09-2009
20130058606Electro-optice device comprising a ridge waveguide and a PN junction and method of manufacturing said device - An electro-optic device, comprising an insulating layer and a layer of light-carrying material adjacent the insulating layer. The layer of light-carrying material, such as silicon, comprises a first doped region of a first type and a second doped region of a second, different type abutting the first doped region to form a pn junction. The first doped region has a first thickness at the junction, and the second doped region has a second thickness at the junction, the first thickness being greater than the second thickness, defining a waveguide rib in the first doped region for propagating optical signals. Since the position of the junction coincides with the sidewall of the waveguide rib a self-aligned process can be used in order to simplify the fabrication process and increase yield.03-07-2013
20120308177PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT COMPRISING AT LEAST ONE COPLANAR WAVEGUIDE - An integrated circuit includes a silicon-on-insulator wafer and interconnect layer providing a support for a coplanar waveguide formed above a top side of the support. A through-silicon via is formed from a back side of the support and passing through the silicon-on-insulator wafer to reach the interconnect layer. A trench is formed from the back side of the support underneath the coplanar waveguide. The trench extends over at least an entire length of the coplanar waveguide. The trench passes through the silicon-on-insulator wafer to reach the interconnect layer and may have a substantially same depth as the through-silicon via.12-06-2012
20110013866FLEXIBLE OPTICAL INTERCONNECT - A flexible optical interconnect and method of forming the interconnect is disclosed. The optical interconnect includes a waveguide base formed from a flexible dielectric material. A three-sided channel is formed in the flexible material. Each side of the channel is coated with a reflective metallic coating. A cover piece is formed from the flexible material and coated with a reflective metallic coating on an underside. The cover piece is coupled to the waveguide base to form a flexible optical bus having at least one hollow metallized waveguide. The hollow metallized waveguide is configured to carry an optical signal. A transverse slot is formed in the cover piece and the waveguide base to form an aperture bisecting the hollow metallized waveguide to enable the optical signal to be detected and/or redirected.01-20-2011
20110013865METHOD OF MANUFACTURING WIRING BOARD, METHOD OF MANUFACTURING OPTOELECTRIC COMPOSITE MEMBER, AND METHOD OF MANUFACTURING OPTOELECTRIC COMPOSITE BOARD - A method for producing a circuit board, contains, in this order, a step A of forming a circuit on a first substrate; a step B of laminating a first support on a surface of the first substrate having the circuit formed, through a first releasing layer; and a step C of forming a second substrate or circuit on a surface of the first substrate opposite to the surface having the circuit formed, and a method for producing an optoelectronic composite member, contains, in this order, a step of laminating an electric circuit board on a second support; a step of laminating a first support; a step of releasing the second support; and a step of forming an optical waveguide on a surface where the second support is released.01-20-2011
20090297090Illumination Unit Comprising Luminescence Diode Chip and Optical Waveguide, Method for Producing an Illumination Unit and LCD Display - An illumination unit comprising a luminescence diode chip mounted on a chip carrier and comprising an optical waveguide is specified. The optical waveguide is joined together from at least two separate parts, wherein the luminescence diode chip is encapsulated by one of the parts of the optical waveguide. A method for producing a luminescence diode chip of this type and also an LCD display comprising an illumination unit of this type are furthermore specified.12-03-2009
20090269004OPTIC CABLE AND SENDING AND RECEIVING SUB-ASSEMBLY - To provide the sending and receiving sub-assembly in which the design has high degree of freedom and the optic cable has high light coupling factor. In the sending and receiving sub-assembly 10-29-2009
20130163919OPTOELECTRONIC CHIPS INCLUDING COUPLER REGION AND METHODS OF MANUFACTURING THE SAME - An optoelectronic chip, and/or a method of manufacturing the same, include a substrate; a coupler region surrounded by the substrate. The coupler region includes a total reflection surface. The total reflection surface is configured to totally reflect a first light incident through a surface of the substrate such that the reflected first light travels within the substrate, or the total reflection surface is configured to totally reflect a second light guided in the substrate and incident on the total reflecting surface such that the reflected second light travels through the surface of the substrate.06-27-2013
20130163918INTEGRATED CIRCUIT COUPLING SYSTEM WITH WAVEGUIDE CIRCUITRY AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit coupling system includes: forming a waveguide assembly, having a top clad over an open end of an optical core; forming a first photoresist having a base photoresist pattern shape with sloped photoresist sidewalls tapered down to expose a portion of the top clad; forming a recess having clad sidewalls from the portion of the top clad exposed by the base photoresist pattern shape, the clad sidewalls having a shape replicating a shape of the base photo resist pattern shape; and forming an optical vertical insertion area, from the clad sidewalls forming the recess, having a pocket trench, a horizontal step, and a mirror with a reflective material selectively applied to a section of the clad sidewalls and exposing the open end opposite to the mirror, the horizontal step between the mirror and the pocket trench.06-27-2013
20130163917OPTICAL SUBASSEMBLY WITH AN EXTENDED RF PIN - An optical subassembly (OSA) with an extended radio frequency (RF) pin. In one example embodiment, an OSA includes a header, a metallic ring, an RF insulator eyelet, and an RF pin. The header defines an insulator opening and includes an internal header surface. The metallic ring extends above the internal header surface and includes a metallic ring inner diameter substantially equivalent to a diameter of the insulator opening. The RF insulator eyelet is positioned partially in the insulator opening and partially in the metallic ring and defines an RF pin opening. The RF pin is positioned in the RF pin opening and extends through the insulator opening and the metallic ring.06-27-2013
20130163916OPTICAL WAVEGUIDE PLATFORM WITH HYBRID-INTEGRATED OPTICAL TRANSMISSION DEVICE AND OPTICAL ACTIVE DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed are an optical waveguide platform with integrated active transmission device and monitoring photodiode. The optical waveguide platform with hybrid integrated optical transmission device and optical active device includes an optical waveguide region formed by stacking a lower cladding layer, a core layer and an upper cladding layer on a substrate; a trench region formed by etching a portion of the optical waveguide region; and a spot expanding region formed on the core layer in the optical waveguide region, in which the optical transmission device is mounted in the trench region and the optical active device is flip-chip bonded to the spot expanding region. The monitoring photodiode is flip-chip bonded to the spot expanding region of the core layer of the optical waveguide, thereby monitoring output light including an optical coupling loss that occurs during flip-chip bonding.06-27-2013
20130064499PHOTOELECTRIC CONVERSION MODULE - A photoelectric conversion module includes a substrate, a photoelectric conversion element optically coupled to an optical fiber, and a conductor pattern that is provided on a surface of the substrate and includes an electrode pattern mounting the photoelectric conversion element and a restriction pattern for restricting a position of the optical fiber.03-14-2013
20130064498OPTICAL SUB-ASSEMBLY MODULE AND INTERMEDIATE OPTICAL MECHANISM - An optical sub-assembly module comprises a fiber for delivering optical signals; a transmitter; a receiver; and an intermediate optical mechanism optically coupled to the fiber, the transmitter and the receiver. The intermediate optical mechanism includes a fiber-end interface for receiving the optical signals from the fiber or outputting the optical signals generated by the transmitter to the fiber; a transmission-end interface for receiving the optical signals from the transmitter; a reception-end interface or outputting the optical signals from the fiber to the receiver; and a filtering interface in the inside of the intermediate optical mechanism for realizing the optical signal delivery from the transmitter to the fiber and from the fiber to the receiver. The fiber-end interface, the transmission-end interface and the reception-end interface are parts of an integral whole while the filtering interface is a part of the same integral whole or an independent filter.03-14-2013
20130064497INTEGRATED OPTICAL DEVICE AND MANUFACTURING METHOD OF THE SAME - Provided is an optical integrated device comprising a first waveguide that is formed on a substrate and includes a first optical path; an electrode formed on the first waveguide; a second waveguide that is formed on the substrate and includes a second optical path; and a transparent waveguide that is formed on the substrate between the first waveguide and the second waveguide, and includes a transparent core that serves as an optical path and is formed of a material having higher bandgap energy than the first optical path. The electrode is formed above the first waveguide and is not formed above the transparent waveguide, and elements including the first waveguide are optically active elements that operate according to current injected thereto.03-14-2013
20130064496OPTICAL LINKS, MANUFACTURING METHODS THEREOF, AND MEMORY SYSTEMS HAVING THE SAME - An optical link may include a main optical waveguide; N sub-optical waveguides, where N is a natural number; N mode couplers, each configured to perform a mode coupling operation between the main optical waveguide and a respective one of the N sub-optical waveguide; and an optical wavelength filter connected to an output terminal of the main optical waveguide and an output terminal of each of the N sub-optical waveguides. A memory system may include a memory device, a memory controller, and the optical link. A data processing system may include the memory system and a central processing unit connected to the memory system through a bus.03-14-2013
20130064495BEND-LIMITED FLEXIBLE OPTICAL INTERCONNECT DEVICE FOR SIGNAL DISTRIBUTION - The invention relates to a bend limiting structure for preventing a flexible optical circuit from being bent too sharply. More particularly, the invention involves adding a bend limiting layer or layers to the flexible optical circuit and/or any housing or other structure within which it is enclosed or to which it is attached. The bend-limiting layer may comprise a plurality of blocks arranged in a line or plane and joined by a flexible film that is thinner than the blocks with the blocks positioned close enough to each other so that, if that plane of blocks is bent a predetermined amount, the edges of the blocks will interfere with each other and prevent the plane from being bent any further. The blocks may be resilient also to provide a less abrupt bend-limiting stop.03-14-2013
20130064494ENCAPSULATION OF A TEMPERATURE COMPENSATIONING STRUCTURE WITHIN AN OPTICAL CIRCUIT PACKAGE ENCLOSURE - An optical circuit package comprising a substrate having a planar surface and an interferometric planar lightwave circuit located on the planar surface of the substrate. A refractive-index-compensation material is incorporated into a portion of the planar lightwave circuit such that an optical path through the planar lightwave circuit passes through the refractive-index-compensation material. The package also comprises a moisture or organic vapor sensitive electro-optic device located on the substrate. An inner hermetic can is located on the substrate, wherein the inner hermetic can encapsulates the portion of the planar lightwave circuit incorporating the refractive-index-compensation material. An outer hermetic can is located on or around the substrate, wherein the outer hermetic can encloses the planar lightwave circuit, the moisture or organic vapor sensitive electro-optic device and the inner hermetic can.03-14-2013
20090208165WAVEGUIDE TYPE OPTICAL ISOLATOR AND MAGNET HOLDER USED IN WAVEGUIDE TYPE OPTICAL ISOLATOR - A waveguide type optical isolator comprises a substrate, a waveguiding layer provided with waveguides, a magnetic garnet, magnetic field applying means, and a package substrate, wherein a first magnet and a second magnet is provided as the magnetic field applying means, and the first magnet and the second magnet are housed and fixed within a magnet holder.08-20-2009
20090232444THREE-DIMENSIONAL PERIODIC STRUCTURE INCLUDING ANTI-REFLECTION STRUCTURE AND LIGHT-EMITTING DEVICE - The three-dimensional structure includes first and second waveguides, a resonator, a first region. The waveguides cause light to propagate therein in a first guide mode. The second waveguide and the first region are mutually connected such that at least part of the light propagating in the second waveguide is coupled with light propagating in the first region in a guide mode different from the first guide mode. Light present in the resonator is coupled with the lights respectively propagating in the waveguides. A condition of −1≦cos(φ)<0 is satisfied, where φ represents a phase difference between one of first and second lights whose intensity is higher than that of the other and third light. The first light is light reflected at a connection region between the first waveguide and the resonator. The second and third lights are lights coupled with the light present in the resonator and propagate in the waveguides.09-17-2009
20090232443CONNECTION STRUCTURE OF TWO-DIMENSIONAL ARRAY OPTICAL ELEMENT AND OPTICAL CIRCUIT - Optical elements (light sources 09-17-2009
20120230630HIGH CONFINEMENT WAVEGUIDE ON AN ELECTRO-OPTIC SUBSTRATE - The invention relates to an optical device including a passive high confinement waveguide, such as of silicon-rich silicon nitride, on an electro-optic substrate, like lithium niobate, optically coupled to a waveguide in the electro-optic substrate. A wide range of electro-optic devices are enabled by this high confinement waveguide structure, including: directional couplers, compact tap couplers, folded electro-optic devices, electro-optic modulators including ring resonators, electro-optic gratings. Further applications enabled by the present invention include hybrid passive planar lightwave circuits (PLC) integrated with electro-optically active waveguides, using the high confinement waveguide as an intermediary waveguide to transfer optical power between the passive and active components.09-13-2012
20090010594OPTICAL AND ELECTRICAL CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An optical and electrical circuit board includes a patterned electrical wiring and a micro convex lens. The micro convex lens is provided in at least one hole formed in the optical and electrical circuit board.01-08-2009
20090010593LIGHT RECEIVING DEVICE AND OPTICALLY INTERCONNECTED LSI - A light receiving device includes a first receiving structure and a second receiving structure. The first receiving structure has a first concentric coupling periodic structure provided in a first surface of a conductive thin film formed on a substrate, a first opening located at a center of the first concentric coupling periodic structure, and a first light receiving section located at an opening end of the first opening. The second receiving structure has a second concentric coupling periodic structure provided in the first surface of the conductive thin film, a second opening located at a center of the second concentric coupling periodic structure, and a second light receiving section located at an opening end of the second opening. The second light receiving section is electrically isolated from the first light receiving section.01-08-2009
20090010591PHOTOELECTRIC CIRCUIT BOARD - A photoelectric circuit board includes a substrate, an optical waveguide and a core exposure surface. The substrate has an inspection opening. The optical waveguide includes a core and a clad formed around the core. The optical waveguide is formed on one surface side of the substrate, is exposed to the inspection opening, and has a portion curved toward the inspection opening. The core exposure surface is formed in the curved portion of the optical waveguide so that the core is exposed out of the clad.01-08-2009
20090010590METHOD AND APPARATUS FOR COUPLING OPTICAL SIGNALS ONTO A SEMICONDUCTOR CHIP - A first optical coupler is configured to direct optical signals from an optical fiber onto one or more first optical channels located on a semiconductor chip, wherein the one or more first optical channels have dimensions that are within a specified tolerance of the dimensions of the optical fiber. One or more second optical couplers are configured to direct the optical signals from the one or more first optical channels to one or more second optical channels located on the semiconductor chip, wherein the one or more second optical channels have a specified sub-micron size.01-08-2009
20120237160Enhanced Low Inductance Interconnections Between Electronic and Opto-Electronic Integrated Circuits - A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.09-20-2012
20120237159OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREFOR - Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.09-20-2012
20120237158OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREFOR - Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes fitting holes which are formed in a surface of an overcladding layer and are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes protruding portions which fit into the fitting holes and are located and formed at predetermined locations with respect to the optical element.09-20-2012
20130163920OPTICAL TRANSMISSION BOARD, OPTICAL TRANSMISSION MODULE, AND METHOD FOR MANUFACTURING OPTICAL TRANSMISSION BOARD - An optical transmission board includes a substrate being provided with a through hole formed in a thickness direction of the substrate so as to penetrate from top to bottom of the substrate; a cladding member at least part of which locates inside the through hole, having an optical waveguide hole being inside the through hole and penetrating the cladding member in the thickness direction thereof, and having an upper surface having a surface roughness smaller than that of an upper surface of the substrate; a core member disposed inside the optical waveguide hole; an electrically conductive body disposed on the upper surface of the cladding member; and an optical element electrically connected to the electrically conductive body, having a light-receiving surface or a light-emitting surface opposed to an upper surface of the core member.06-27-2013
20110026876NANO/MICRO-PATTERNED OPTICAL DEVICE AND FABRICATION METHOD THEREOF - A nano/micro-patterned optical device includes a soft film substrate and nano/micro thin wires. A surface of the soft film substrate includes a nano/micro-pattern formed through a lithography process, and the nano/micro-pattern includes a plurality of depressed grooves. The nano/micro thin wires are placed in the depressed grooves, and used to form a plurality of optical waveguides, in which the optical waveguides include at least one optical coupling region, and the optical coupling region is located on a joining position of the optical waveguides. A fabrication method of the nano/micro-patterned optical device is also provided.02-03-2011
20100215314Apparatus Having an Embedded 3D Hybrid Integration for Optoelectronic Interconnects - An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.08-26-2010
20090304325OPTICAL WIRING MODULE - Provided is an optical wiring module. The optical wiring module includes a light source mounted on a surface of a substrate, a metal optical waveguide coupled to a transverse magnetic mode of light emitted from the light source and using a long-range surface palsmon polariton, and a photodetector. The optical wiring module has a simple structure enabling it to be further miniaturized and its yield to be increased.12-10-2009
20110280512OPTICAL DEVICE - In an optical device 11-17-2011
20110280513OPTICAL CONNECTOR INTERCONNECTION SYSTEM AND METHOD - A method for connecting adjacent computing board devices. A source computing board may be provided. An optical engine attaches to the source computing board. A plurality of source optical connectors couples to the optical engine. A first optical connector may be positioned at a location on the source computing board for a first preset type of computing component on an adjacent computing board. A second optical connector may be positioned at a fixed coordinate related to the first optical connector on the source computing board.11-17-2011
20110280511BONDING SYSTEM FOR OPTICAL ALIGNMENT - A bonding system and a bonding method for alignment are provided. An optical semiconductor includes a light source and a plurality of protruded elements on a surface thereof. A semiconductor bench includes a light receiving element and a plurality of recess elements on a surface thereof. A sidewall of the protruded elements or a sidewall of the recess elements is slanted. A first metallized layer is disposed on a bonding surface of each protruded element and a second metallized layer is disposed on a bottom surface of each recess element, wherein the first metallized layer is used for bonding with the second metallized layer.11-17-2011
20090324166Electro-optic device packages - A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.12-31-2009
20090310904Optical Transmission Substrate, Method for Fabricating the Same, and Optoelectronic Hybrid Substrate - An optical transmission substrate includes an optical transmission body provided in a through hole which has excellent and uniform propagation characteristics. The optical transmission substrate includes: a substrate 12-17-2009
20100266236 OPTICAL COMMUNICATIONS DEVICE HAVING A MOUNTING CORE AND METHOD - A parallel optical communications device is provided that has a mounting core that functions as a mounting system for mounting core components of the parallel optical communications device. In addition, the mounting core functions as a heat dissipation system for the core components of the parallel optical communications device, and also protects the core components and other elements of the communications device from dust and damage that can be caused by handling and other factors. In addition to performing the aforementioned functions, the mounting core is configured to enable the parallel optical communications device to be made extremely small in size while also protecting signal integrity.10-21-2010
20100266235PLANAR LIGHTWAVE APPARATUS - A planar lightwave apparatus includes a planar lightwave circuit (PLC) chip, a fiber array block (FAB) assembled to one face of the PLC chip, and a casing with one opening, wherein one end of the FAB extends out of the opening of the casing. The PLC chip includes an input optical waveguide, a plurality of output optical waveguides and a beam splitter for connecting the input optical waveguide and the output optical waveguides. The input optical waveguide and the output optical waveguides are arranged on the same face of the PLC chip. Therefore, the PLC chip needs only one-time coupling process with the FAB. The coupling process can be simplified and the packaging cost is reduced.10-21-2010
20090016670System and method for the fabrication of an electro-optical module - A system and method for fabricating an electro-optical hybrid module (01-15-2009
20100014805ZINC OXIDE DIODES FOR OPTICAL INTERCONNECTIONS - The present disclosure includes methods, devices, and systems for zinc oxide diodes for optical interconnections. One system includes a ZnO emitter confined within a circular geometry in an oxide layer on a silicon substrate. An optical waveguide is formed in the oxide layer and has an input coupled to the ZnO emitter. A detector is coupled to an output of the optical waveguide.01-21-2010
20090087139Photonic guiding device - A photonic guiding device and methods of making and using are disclosed. The photonic guiding device comprises a large core hollow waveguide configured to interconnect electronic circuitry on a circuit board. A reflective coating covers an interior of the hollow waveguide to provide a high reflectivity to enable light to be reflected from a surface of the reflective coating. A collimator is configured to collimate multi-mode coherent light directed into the hollow waveguide.04-02-2009
20120189244OPTICAL INTERPOSER - An optical interposer comprising: (a) a substrate having a planar surface: (b) at least one groove defined in the planar surface and extending from an edge of the substrate to a terminal end, the groove having side walls and a first facet at the terminal end perpendicular to side walls, the facet having a first angle relative to the planar surface, the first angle being about 45 degrees; and (c) a reflective coating on the first facet.07-26-2012
20120189243TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY - An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.07-26-2012
20120189246ELECTROMAGNETIC WAVE ISOLATOR AND INTEGRATED OPTICS DEVICE - An electromagnetic wave isolator (07-26-2012
20110299808Optical Waveguide and Optical Waveguide Module - An optical waveguide module which satisfies highly-accurate and stable optical connection between optical elements and optical waveguides and can be easily fabricated is provided. As means for it, in an optical waveguide module having: an optical waveguide surrounded by a cladding layer and provided with a mirror part formed of a tapered surface on a first end side; an optical element having a concave part in a first surface of a semiconductor substrate; and a convex member provided on the cladding layer so as to be planarly overlapped with the mirror part, the convex member is mated with the concave part of the optical element.12-08-2011
20120002916Optical Module, and Optical Printed Circuit Board and Method of Manufacturing the Same - Provided are an optical module, and an optical printed circuit board and a method of manufacturing the same. The optical module includes an optical fiber, a first ferrule coupled to one end of the optical fiber, and a second ferrule coupled to the other end of the optical fiber. The optical printed circuit board includes a first board, an optical transmitter module and an optical receiver module, which are disposed on the first board, an optical fiber passing through the first board, the optical fiber extending integrally from a lower side of the optical transmitter module to a lower side of the optical receiver module, first and second ferrules coupled to one end and the other end of the optical fiber, respectively, the first and second ferrules being supported by the first board, and a second board through which the optical fiber passes, the second board being disposed below the first board.01-05-2012
20110299809Optical Clock Signal Distribution Using Through-Silicon Vias - An integrated circuit structure includes a semiconductor chip including a front surface and a back surface; a via extending from the back surface of the semiconductor chip into the semiconductor chip, wherein the via is light transparent; and a photon detector in the semiconductor chip and exposed to the via.12-08-2011
20110286690OPTICAL PACKAGE AND RELATED METHODS - A package for an electronic chip including an optical component protects the chip and the component, while allowing for an optical connection of the component with another optical device. This is achieved, in various embodiments, by forming a well in a protective material deposited over the chip to expose the optical component, and by providing alignment features in the protective material to align and connect the optical component with another optical device.11-24-2011
20110293217WAVELENGTH FILTER - A wavelength filter includes a first waveguide with a transmission band of a predetermined basic mode and a second waveguide, arranged in at least one location of the first waveguide, with a transmission band whose cutoff frequency corresponds to a finite value included in the transmission band of the basic mode. A pair of optical couplers constituting a Mach-Zehnder interferometer is connected to the opposite ends of a filter unit including the first waveguide and the second waveguide. When a plurality of wavelength filters is cascaded, the wavelength filters can be each varied in terms of the cutoff frequency of the second waveguide.12-01-2011
20110293216SEMICONDUCTOR HIGH-SPEED INTEGRATED ELECTRO-OPTIC DEVICES AND METHODS - Novel integrated electro-optic structures such as modulators and switches and methods for fabrication of the same are disclosed in a variety of embodiments. In an illustrative embodiment, a device includes a substrate with a waveguide and an optical resonator comprising polycrystalline silicon positioned on the substrate. First and second doped semiconducting regions also comprise polycrystalline silicon and are positioned proximate to the first optical resonator. The first optical resonator is communicatively coupled to the waveguide.12-01-2011
20090274411EVANESCENT III-V SILICON PHOTONICS DEVICE WITH SPIN COAT BONDING - Briefly, in accordance with one or more embodiments, a hybrid photonics device comprises a silicon portion having one or more features formed therein, a non-silicon portion comprising one or more photonics devices proximate to the one or more features of the silicon portion, and a bonding layer coupling the silicon portion with the non-silicon portion, the non-silicon portion being bonded to the silicon portion via the bonding layer prior to patterning of the one or more photonics devices.11-05-2009
20090169153METHOD AND APPARATUS PROVIDING AN OPTICAL GUIDE IN IMAGE SENSOR DEVICES - A device and method for providing an optical guide of a pixel to guide incoming light to/from a photo-conversion device of the pixel to improve the optical crosstalk immunity. The optical guide includes an optically reflecting barrier formed as a trench filled with a material which produces reflection. The trench fill material may have an index of refraction that is less than the index of refraction of the material used for the trench surrounding layers to provide a light reflective structure or the trench fill material may provide a reflection surface.07-02-2009
20110286693OPTICAL WAVEGUIDE DEVICE AND RESIN COMPOSITION FOR USE IN FORMATION OF OVER CLADDING LAYER THEREOF - An optical waveguide device capable of preventing a light-receiving element from malfunctioning when used in environments where the illuminance of disturbance light such as sunlight is high, and a resin composition for use in the formation of an over cladding layer of the optical waveguide device are provided. The optical waveguide device includes an optical waveguide, and the light-receiving element optically coupled to one end portion of the optical waveguide. The over cladding layer has a surface serving as an entrance surface which receives the disturbance light. The over cladding layer includes a hardened body of a resin composition having an ultraviolet curable resin as a main component and containing a dye that absorbs the disturbance light, and has a thickness of not less than 100 μm as measured from the top surface of cores provided in the optical waveguide to the surface of the over cladding layer.11-24-2011
20110286692OPTICAL WAVEGUIDE DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an optical waveguide device, includes obtaining an optical waveguide by forming sequentially a first cladding layer, a core layer, and a second cladding layer on a substrate, forming a groove portion including a light path conversion inclined surface and a sidewall surface which intersects with it, and the groove portion dividing the second cladding layer and the core layer, on both end sides of the optical waveguide respectively, forming selectively a metal layer on the light path conversion inclined surface and the sidewall surface of the groove portion, forming a protection insulating layer sealing the metal layer on the optical waveguide, and obtaining a light path conversion mirror that the metal layer is formed on the light path conversion inclined surface, by forming a concave portion which penetrates the core layer from the protection insulating layer to remove the metal layer formed on the sidewall surface of the groove portion.11-24-2011
20110286691DATA STORAGE SYSTEM, A MODULAR PRINTED CIRCUIT BOARD, A BACKPLANE AND A BACKPLANE COMPONENT - The invention provides a component electro-optical printed circuit board backplane for assembly in a modular electro-optical backplane, the component electro-optical printed circuit board backplane comprising: optical channels for the propagation and transmission of optical data signals and electrical channels for the propagation and transmission of power and control signals; connectors for connection in-plane to at least one other component electro-optical printed circuit board; and, at least one socket for receiving, in use, a user circuit. The invention also provides a modular backplane made up of plural such component backplanes.11-24-2011
20100014803METHOD FOR MANUFACTURING OPTICAL INTERFACE MODULE AND OPTICAL INTERFACE MODULE - An optical interface module and a method for manufacturing an optical interface module. One method includes forming a lower clad layer on a first surface of a substrate, forming a core layer on the lower clad layer and forming two grooves in part of the core layer to form a first core part between the two grooves having one end and another end. Also included is forming an upper clad layer on the core layer and in the grooves, mounting a light-emitting element on the first surface and mounting a light-receiving element on the first surface of the substrate. A second core part is optically coupled to the light-emitting element and the first core part, and a third core part is optically coupled to the light-receiving element and the other end of the first core part.01-21-2010
20090154873ELECTRO-OPTIC INTEGRATED CIRCUITS WITH CONNECTORS AND METHODS FOR THE PRODUCTION THEREOF - An electro-optic integrated circuit including an integrated circuit substrate, at least one optical signal providing element and at least one discrete reflecting optical element, mounted onto the integrated circuit substrate, cooperating with the at least one optical signal providing element and being operative to direct light from the at least one optical signal providing element. An electro-optic integrated circuit including an integrated circuit substrate, at least one optical signal receiving element and at least one discrete reflecting optical element mounted onto the integrated circuit substrate and cooperating with the at least one optical signal receiving element and being operative to direct light to the at least one optical signal receiving element.06-18-2009
20100272386OPTICALLY AND ELECTRICALLY ACTUATABLE DEVICES - Disclosed herein are optically and electrically actuatable devices. The optically and electrically actuatable device includes an insulating substrate, two electrodes, an active region, and a concentrator. At least one of the two electrodes is established on the insulating substrate, and another of the two electrodes is established a spaced distance vertically or laterally from the at least one of the two electrodes. The other of the two electrodes is an optical input electrode. The active region is established between or beneath the two electrodes. The concentrator is optically coupled to the optical input electrode for concentrating incident light such that a predetermined portion of the active region is optically actuatable.10-28-2010
20100008621MANUFACTURING METHOD OF OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC HYBRID BOARD OBTAINED THEREBY - A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A plurality of protruding cores (optical interconnect lines) 01-14-2010
20100034497Flexible Optical Pillars for an Optical Assembly - An optical assembly is provided that includes a substrate. The substrate has a set of one or more optical waveguides. A component is coupled to and spaced apart from the substrate by at least one or more mechanical supports. The component has one or more photodetectors. A set of one or more flexible optical pillars is disposed to be positioned between the set of optical waveguides and the photodetectors. The set of flexible optical pillars is optically transmissive and configured to transmit light from the set of optical waveguides to the photodetectors.02-11-2010
20090263073Optical waveguide film, method for manufacturing thereof, electrical and optical hybrid circuit film including the waveguide film, and electronic device including thereof - The present invention relates to an optical waveguide film that has a high optical coupling efficiency at a light input portion and an excellent flexibility at least a part of the film. Specifically, the present invention provides an optical waveguide film that has a core and a clad comprising a resin and has a light input portion, wherein there is a portion having a thickness smaller than that of the light input portion. Further, the present invention provides an electrical and optical hybrid film in which an electrical wiring board is joined to the optical waveguide film or an electronic device in which these films are built in.10-22-2009
20090190880MANUFACTURING METHOD OF OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC HYBRID BOARD OBTAINED THEREBY - A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A plurality of protruding cores (optical interconnect lines) 07-30-2009
20100142883Printed circuit board for optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board for an optical waveguide, including: a substrate; an insulation layer having a through hole and formed on the substrate; a lower clad layer formed on a bottom of the through hole; core part formed on the lower clad layer; and an upper clad layer formed on the lower clad layer and the core part and thus covering an exposed surface of the core part.06-10-2010
20100111469SEMICONDUCTOR INTEGRATED CIRCUITS INCLUDING GRATING COUPLER FOR OPTICAL COMMUNICATION AND METHODS OF FORMING THE SAME - Provided are semiconductor integrated circuits including a grating coupler for optical communication and methods of forming the same. The semiconductor integrated circuit includes: a cladding layer disposed on a semiconductor substrate; a grating coupler including an optical waveguide on the cladding layer and a grating on the optical waveguide; and at least one reflector formed in the cladding layer below the grating.05-06-2010
20110007999Printed circuit board - A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.01-13-2011
20090052834OPTICAL INTEGRATED DEVICE - An optical integrated device includes an optical waveguide structure formed on a semiconductor substrate and including a plurality of first channel optical waveguide portions, an optical coupler portion and a second channel optical waveguide portion, a burying layer formed from a semi-insulating semiconductor material and burying the optical waveguide structure therein such that an upper portion thereof forms a flat face and a side portion thereof forms an inclined face having a predetermined angle with respect to the semiconductor substrate, and a plurality of dummy structure bodies provided over a desired region in the proximity of at least an output side of the optical coupler portion so that radiation light from the optical coupler portion is spatially separated from signal light propagating along the second channel optical waveguide portion. The plural dummy structure bodies are provided discretely so as to be buried flat by the burying layer.02-26-2009
20090310905PRINTED CIRCUIT BOARD ELEMENT INCLUDING AN OPTOELECTRONIC COMPONENT AND AN OPTICAL WAVEGUIDE - The invention relates to a printed circuit board element (12-17-2009
20080267556Flexible Printed Circuits Capable of Transmitting Electrical and Optical Signals - A flexible printed circuit capable of transmitting electrical and optical signals is disclosed. The flexible printed circuit includes a set of optical waveguides for transmitting optical signals and a set of conductors for transmitting electrical signals. Each of a subset of the optical waveguides is enclosed by a respectively one of the conductors. The optical waveguide is made of glass or plastic. The conductors are formed within a first building block constructed by a first dielectric layer and a first substrate layer, and a second building block constructed by a second dielectric layer and a second substrate layer.10-30-2008
20100119192WAVEGUIDE PATH COUPLING-TYPE PHOTODIODE - In a waveguide path coupling-type photodiode, a semiconductor light absorbing layer and an optical waveguide path core are adjacently arranged. An electrode formed of at least one layer is installed in a boundary part of the semiconductor light absorbing layer and the optical waveguide path core. The electrodes are arranged at an interval of (1/100)λ to λ [λ: wavelength of light transmitted through optical waveguide path core]. At least a part of the electrodes is embedded in the semiconductor light absorbing layer. Embedding depth from a surface of the semiconductor light absorbing layer is a value not more than λ/(2ns) [ns: refractive index of semiconductor light absorbing layer]. At least one layer of the electrode is constituted of a material which can surface plasmon-induced.05-13-2010
20090310908Suspension board with circuit - A suspension board with circuit includes a circuit board, and an optical waveguide formed on the circuit board. The circuit board is provided with a pedestal for supporting a slider. The pedestal allows the optical waveguide to be disposed so as to overlap the slider in a thickness direction of the circuit board.12-17-2009
20090310909Suspension board with circuit and producing method thereof - A suspension board with circuit includes a circuit board formed with an opening, and having a mounting portion defined by the opening for mounting thereon a slider on which a magnetic head is mounted, and an optical waveguide disposed on the circuit board so as to traverse the opening. The optical waveguide is slack in the opening.12-17-2009
20090310907MOUNTING CONFIGURATION AND METHOD OF OPTICAL WAVEGUIDE HOLDING MEMBER - An article of manufacture is applied to an optical waveguide holding member including a contact surface on the bottom face, which is to be in contact with a printed circuit board; a connection surface on the back face; an optical waveguide connecting the contact surface and the connection surface; and a lens unit disposed at an end of the optical waveguide. A light curing adhesive is applied to a part of the contact surface, adjacent to the lens unit so that the part is bonded to the printed circuit board. A two-component mixed adhesive is applied to, along peripheries of the contact surface in contact with the printed circuit board, outer edges of lateral-side peripheries adjacent to the lens unit and an outer edge of a back-side periphery close to the back face so that the lateral-side peripheries and the back-side periphery are bonded to the printed circuit board.12-17-2009
20090310906Optical device and producing method thereof - An optical device includes: a crystal substrate; an optical waveguide formed in the crystal substrate; and an amorphous area formed in the crystal substrate, adjacent to a curved waveguide of the optical waveguide. The amorphous area is formed by irradiation of an ultrashort pulse laser.12-17-2009
20100124390HIGH FREQUENCY CIRCUIT MODULE - The invention provides a high frequency circuit module according to the present invention includes: a circuit component having a plurality of terminals arranged on an outer side thereof, and a circuit board of a multilayered construction or a single-layered construction. A first outer face of the circuit board serves as a component mounting face for mounting the circuit component. The circuit board includes a ground conductor layer; a plurality of electrode pads provided on the component mounting face, the electrode pads being configured for connection with the associated terminals of the circuit component; and a plurality of waveguides provided on the first outer face or a second outer face, or in an inner portion of the circuit board. The waveguides are electrically connected with the associated electrode pads. Routing directions of all or some of adjacent waveguides are opposite from each other.05-20-2010
20080260326Optical Coupling Device - The object of the invention is an optical coupling device between at least one waveguide embedded in a printed circuit, for conveying an optical beam (F), and an external waveguide, the circuit including, starting from an exterior surface of the circuit, at least one insulating first layer and at least one internal layer incorporating at least one core of embedded waveguide forming said optical path, the device including a coupling element, positioned in a cut, hollowed out in the circuit and cutting the embedded waveguide, the coupling element being furnished with means of refocusing of the optical beam between the embedded waveguide and the external waveguide and at least one lower positioning surface on a reference surface of the cut in relation to the axis of the embedded waveguide.10-23-2008
20090022452MONOLITHIC TRANSMITTER PHOTONIC INTEGRATED CIRCUIT (TXPIC) WITH A TRANSVERSELY DISPOSED OUTPUT - A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.01-22-2009
20120189245OPTICAL INTERPOSER FOR WAVEGUIDES - An optical interposer comprising: (a) a substrate having a planar surface: (b) at least one groove defined in the planar surface and extending from an edge of the substrate to a terminal end, the groove having side walls and a first facet at the terminal end perpendicular to side walls, the facet having a first angle relative to the planar surface, the first angle being about 45 degrees; (c) a reflective coating on the first facet, and (d) a optical conduit disposed in the groove for optically coupling the first facet with a waveguide.07-26-2012
20100129026OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREOF - An opto-electric hybrid board in which a new alignment mark having an identifying mark that is easy to recognize is formed in addition to a conventional alignment mark, and a method of manufacturing the opto-electric hybrid board. The opto-electric hybrid board includes an optical waveguide portion 05-27-2010
20100119190MULTITHICKNESS LAYERED ELECTRONIC-PHOTONIC DEVICES - An apparatus comprising an electronic-photonic device. The device includes a planar substrate having a top layer on a middle layer, active electronic components and active photonic waveguide components. The active electronic components are located on first lateral regions of the top layer, and the active photonic waveguide components are located on second lateral regions of the top layer. The second-region thickness is greater than the first-region thickness. The top layer has a higher refractive index than the middle layer.05-13-2010
20120033913OPTICAL WAVEGUIDE-FORMING EPOXY RESIN COMPOSITION, OPTICAL WAVEGUIDE-FORMING CURABLE FILM, OPTICAL-TRANSMITTING FLEXIBLE PRINTED CIRCUIT, AND ELECTRONIC INFORMATION DEVICE - An optical waveguide of excellent flex resistance which is to be formed on the surface of a flexible printed circuit is obtained by using an epoxy resin composition includes (A) a liquid epoxy compound, (B) a solid epoxy compound, and (C) a cationic curing initiator, wherein as the liquid epoxy compound (A), (A1) a liquid epoxy compound represented by general formula (I) below is included:02-09-2012
20090087138THERMAL CONTROL OF OPTICAL COMPONENTS - A linearized thermal and optical model of an optical integrated circuit can be used to temperature-stabilize one or more optical elements of the circuit using active temperature regulation. To stabilize a single optical element, a temperature sensor and a heater can be provided proximate to the grating. Thermal and optical coefficients can be then used to select an appropriate temperature set-point for the temperature controller that receives readings from the sensor and determines the power dissipated in the heater. Multiple optical elements can be stabilized individually, using the same process and lumping cross-heating factors together with other environmental factors. Alternatively, multiple AWG's can be stabilized using fewer sensors than optical elements, by stabilizing one of the optical elements in the same manner as in the case of a single optical elements, and determining power dissipated in the heaters of the remaining optical elements based on the linearized model.04-02-2009
20090087137PLANAR LIGHTWAVE CIRCUITS WITH AIR FILLED TRENCHES - An air filled trench is formed underneath the waveguide to reduce propagation loss, which in turn allowing the waveguide to be in the close proximity of on-chip devices, such as a photodetector. The air filled trench is formed from the back side of the substrate; hence it would not disturb the integration and the formation of components on the front side of the substrate. In another embodiment, for silicon-on-insulator (SOI) based device, with an air filled trench and a metal electrode, a back gate is formed. In yet another embodiment, air filled trench also reduces the substrate loss of RF passive components and passive antenna operating in Giga Hertz range. Air filled trenches can be used for both photonic and electronic circuits in a planar lightwave circuit. Finally, another embodiment is for the trench to effectively guide gases and fluids to pass through the detection area.04-02-2009
20100080506SEMICONDUCTOR OPTICAL FUNCTION DEVICE - A semiconductor optical function device includes a semiconductor substrate having a substrate edge surface; an optical waveguide formed on the semiconductor substrate; a non-waveguide region formed on the semiconductor substrate between the optical waveguide and the substrate edge surface; and an insulation region disposed around the optical waveguide and having a semiconductor interface contacting with the non-waveguide region on a side of the substrate edge surface. The semiconductor interface extends not in parallel to the substrate edge surface, and is inclined relative to the substrate edge surface by a specific angle.04-01-2010
20120294565POLARIZATION INDEPENDENT OPTICAL ISOLATOR - Provided is a polarization independent optical isolator including: wedge-shaped birefringent crystal plates each being made of a YVO11-22-2012
20100080507OPTICAL DEVICE AND METHOD RELATED THERETO - An optical device includes an electrooptic crystal substrate, a polarization-inverted region formed in a part of the electrooptic crystal substrate, an optical waveguide formed in the electrooptic crystal substrate, and a groove for relaxing stress disposed between a domain wall of the polarization-inverted region and the optical waveguide.04-01-2010
20090263075Temperature Insensitive Arrayed Waveguide Grating Multiplexer for Optical Property Compensation and the Manufacturing Method Thereof - Two methods are presented in order to properly compensate the changes of the optical characteristics, which are caused by the optical path length change. First, a path length compensation method in which the additional optical path length, equivalent to the dicing kerf width of the substrate, is added onto the diced-to-be waveguide part of the AWG chip during the waveguide design process and fabrication process so that the compensated optical path length is maintained even after dicing. In addition, a position compensation method is provided in which an additional waveguide is added at the position shifted by a distance equivalent to the kerf width of the substrate such that the additional waveguide undergoes the minimized path length change after dicing is performed.10-22-2009
20090208167MANUFACTURING METHOD OF OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC HYBRID BOARD OBTAINED THEREBY - A method of manufacturing an opto-electric hybrid board capable of optically coupling light-emitting and light-receiving elements mounted on an electrical wiring board and an optical waveguide provided in an optical wiring board to each other easily with high accuracy. An opto-electric hybrid board obtained thereby. Guide pins have end portions fitted in alignment openings of an electrical wiring board and end portions fitted in alignment openings of an optical wiring board to accomplish alignment therebetween. The electrical wiring board is configured such that a conductor layer having pads for mounting light-emitting and light-receiving elements thereon and interconnect lines is formed on a metal substrate, and the alignment openings are formed in the metal substrate. The optical wiring board is configured such that an optical waveguide is formed on a metal substrate, and optical coupling openings for the optical waveguide and the alignment openings are formed in the metal substrate.08-20-2009
20090003765IMAGING SYSTEM AND RELATED TECHNIQUES - A method and apparatus for imaging using a double-clad fiber is described.01-01-2009
20120106890SYSTEM AND METHOD FOR MODULATOR-BASED OPTICAL INTERCONNECTIONS - Systems and methods for modulator-based optical interconnections are disclosed. An optical interconnect system comprises a substrate, a wave path, a coupling structure, and a modulator. The wave path may be a waveguide disposed on the substrate. The coupling structure is coupled to the substrate and disposed within the wave path. The modulator is positioned between the substrate and the coupling structure. An optical interconnect method comprises the steps of transmitting light through a wave path, redirecting the light onto a modulator with a coupling structure, modulating the light from the coupling structure with the modulator; and redirecting modulated light from the modulator into the wave path with the coupling structure.05-03-2012
20090263077Flexible optical interconnection structure and method for fabricating same - A flexible optical interconnection structure has a plurality of layers including an optical waveguide made of a core and a clad. The core is disposed to include a neutral surface that is not affected by expansion or contraction by bending. Alternatively, when the neutral surface is position outside the core, the core is disposed to satisfy Δy≦0.03×R, in which Δy is a distance between the neutral surface and a surface of the core at a side near the neutral surface, and R is a curvature radius of an innermost surface of the flexible optical interconnection structure in the bent state.10-22-2009
20090274412OPTICAL MODULE, METHOD OF PRODUCING OPTICAL MODULE, OPTICAL TRANSMISSION MODULE, AND ELECTRONIC APPARATUS - An optical module comprising has a support board, an optical transmission path, and at least a single optical element having a light receiving function or a light emitting function provided on the support board. A light emission surface of said optical transmission path or a light incidence surface of the optical transmission path is arranged such that said optical element and said optical transmission path are optically coupled to each other, with respect to a light receiving surface or a light emitting surface of said optical element. Said optical element is sealed by a sealing agent. A gap is provided between said optical transmission path and the surface of said sealing agent on the light receiving surface or the light emitting surface of said optical element.11-05-2009
20090202198OPTICAL WAVEGUIDE DEVICE - An optical waveguide device including a dielectric substrate and a folded waveguide formed on the substrate, including a first waveguide and a second waveguide, one part of the first waveguide being connected to one end of the second waveguide at a first coupling portion, the other end of the second waveguide connected to another part of the first waveguide at a second coupling portion, the first waveguide being straight or curved with a radius of curvature larger than or equal to a first curvature radius, and the second waveguide being straight or curved with a radius of curvature smaller than the first curvature radius. An outer groove is formed on the substrate along an outer peripheral of the folded waveguide, an input-side inner groove is formed on the substrate near a first coupling portion, and an output-side inner groove is formed on the substrate near a second coupling portion.08-13-2009
20090202197Monolithically integrated optoelectronic subassembly - A monolithically integrated optoelectronic subassembly having a waveguide layer stack which is applied on a substrate and has a fibre light-receiving waveguide layer in which at least one photodiode is waveguide-integrated is proposed. A plurality of photodiodes is integrated in the waveguide which is structured laterally and/or vertically in such a manner that there is connected to a coupling waveguide an optical distribution network which in turn feeds the plurality of waveguide-integrated photodiodes in parallel via waveguide parts, which photodiodes are connected electrically in series. All the components are integrated on one chip and conversion of an optical input power into an electrical power is undertaken for current supply purposes. A photodiode can be configured as a signal diode which is supplied from the remaining of the plurality of diodes, as a result of which a self-supplied photodetector is formed. With an antenna which is integrated in addition on the chip, a monolithically integrated antenna circuit which radiates into free space is made available.08-13-2009
20100272389SEMICONDUCTOR OPTICAL ELEMENT AND METHOD FOR MANUFACTURING THE SAME - A semiconductor optical element having a mesa structure formed by wet etching, includes a mesa structure having a ridge-type mesa structure or a high-mesa-type mesa structure, the mesa structure being disposed on a semiconductor substrate, and an extended mesa on the semiconductor substrate, the extended mesa being connected to a corner of the mesa structure and being the same material as the mesa structure.10-28-2010
20090290833Optical device including at least one replicated surface and associated methods - An optical device includes a substrate. a non-planar transparent structure on a first surface of the substrate, the non-planar transparent structure being made of a first material, and a molded refractive surface on the first surface of the substrate adjacent the non-planar transparent structure, the molded refractive surface being made of a second material, different from the first material.11-26-2009
20090290832Printed circuit board including optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method of the present invention creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption.11-26-2009
20090274414LIGHT EMITTING DEVICE USING THREE-DIMENSIONAL PHOTONIC CRYSTAL - In a light emitting device, efficiency and stability are improved. A light emitting device 11-05-2009
20090274413Photonic interconnects for computer system devices - Various embodiments of the present invention are directed to photonic interconnects that can be used for on-chip as well as off-chip communications between computer system components. In one embodiment of the present invention, a photonic interconnect comprises a plurality of on-chip waveguides. Additionally, the photonic interconnect may include a plurality of off-chip waveguides, and at least one optoelectronic converter. The at least one optoelectronic converter can be photonically coupled to a portion of the plurality of on-chip waveguides, can be photonically coupled to a portion of the plurality of off-chip waveguides, and is in electronic communication with at least one computer system component.11-05-2009
20090279827OPTICAL TRANSMISSION MODULE - An optical module has an optical element which transmits or receives an optical signal, an optical transmission line optically coupled to the optical element to transmit the optical signal, and a board to which at least one end portion including an incident and outgoing port of the optical signal in the optical transmission line and the optical element are fixed. A wall facing a side surface of the optical transmission line is provided in the board. A first space is provided between the board and the optical transmission line, and a second space is provided between the side surface of the optical transmission line and the wall. The first and second spaces are filled with a bonding agent.11-12-2009
20090285522OPTICAL WAVEGUIDE, OPTICAL DEVICE, AND OPTICAL COMMUNICATION DEVICE - There is provided an optical device and an optical waveguide composed of a photonic crystal in which two optical waveguide modes that are orthogonal to a light propagation direction can be used, whereby design latitude is increased.11-19-2009
20090285524Suspension board with circuit - A suspension board with circuit includes a metal supporting board including a board trench portion, an insulating base layer formed on a surface of the metal supporting board, a conductive pattern formed on a surface of the insulating base layer, and an optical waveguide provided to overlap the board trench portion when projected in a thickness direction of the metal supporting board. At least a part of the optical waveguide is positioned closer to the conductive pattern than to a back surface of the metal supporting board.11-19-2009
20090285523HOLLOW CORE WAVEGUIDE FOR LASER GENERATION OF ULTRASONIC WAVES - A laser transmission system.11-19-2009
20100278477SEMICONDUCTOR INTEGRATED CIRCUITS INCLUDING OPTOELECTRONIC DEVICE FOR CHANGING OPTICAL PHASE - Provided is a semiconductor integrated circuit. The semiconductor integrated circuit includes a semiconductor pattern disposed on a substrate and including an optical waveguide part and a pair of recessed portions. The optical waveguide part has a thickness ranging from about 0.05 m to about 0.5 μm. The recessed portions are disposed on both sides of the optical waveguide part and have a thinner thickness than the optical waveguide part. A first doped region and a second doped region are disposed in the recessed portions, respectively. The first and second doped regions are doped with a first conductive type dopant and a second conductive type dopant, respectively. An intrinsic region is formed in at least the optical waveguide part to contact the first and second doped regions.11-04-2010
20090103860Printed circuit board and manufacturing method thereof - A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.04-23-2009
20090103857OPTICAL RECEPTION AND TRANSMISSION MODULE - An optical transmission unit of an optical reception and transmission module holds a first end portion of the optical waveguide film on the first holding member so that light emitted from the light emitting device is coupled to an incident end surface of the optical waveguide. An optical reception unit holds a second end portion of the optical waveguide film on the second holding member so that light emitted from an emitting end surface of the optical waveguide is received by the light receiving device. At least the optical waveguide film is covered with flame-retardant resin having flame retardancy of HB or higher according to a UL-94 test and a minimum bending radius of the optical waveguide film covered with the flame-retardant resin and having a flame-retardant resin layer formed on its surface is from 1 mm to 3 mm.04-23-2009
20090103859FIBER-BASED ELECTRIC DEVICE - A fiber-based electric apparatus includes an elongate, flexible fiber core. The apparatus also includes an electric device layered on the fiber core.04-23-2009
20090103854Photonic interconnects for computer system devices - Various embodiments of the present invention are directed to photonic interconnects that can be used for on-chip as well as off-chip communications between computer system components. In one embodiment of the present invention, a photonic interconnect comprises a plurality of on-chip waveguides. Additionally, the photonic interconnect may include a plurality of off-chip waveguides, and at least one optoelectronic converter. The at least one optoelectronic converter can be photonically coupled to a portion of the plurality of on-chip waveguides, can be photonically coupled to a portion of the plurality of off-chip waveguides, and is in electronic communication with at least one computer system component.04-23-2009
20090297096OPTO-ELECTRIC HYBRID MODULE AND MANUFACTURING METHOD THEREOF - An opto-electric hybrid module capable of reducing the propagation loss of light beams, and a manufacturing method thereof. An opto-electric hybrid module in which a light-emitting element and a light-receiving element are mounted on the front surface side of an electric circuit board E, and an optical waveguide W12-03-2009
20090297095PLANAR OPTICAL WAVEGUIDE ARRAY MODULE AND METHOD OF FABRICATING THE SAME - The optical element array and an optical waveguide array are optically connected on the substrate. The optical waveguide array includes optical waveguide channels which are the outermost optical waveguide channels on both sides of optical waveguide array channels and each of which is provided with a mirror structure for light redirection. With the optical element array driven by a bias applied thereto, the optical waveguide array is brought near the optical element array. The optical axes of the optical waveguide array channels and the optical element array are aligned while monitoring optical signals outputted from the outermost optical waveguide channels on both sides of the optical waveguide array channels via the mirror structures for light redirection. The optical waveguide array is fixed to the substrate in such a position that the optical signals have a desired output value.12-03-2009
20090297093Low index, large mode field diameter optical coupler - An optical coupler is formed of a low index material and exhibits a mode field diameter suitable to provide efficient coupling between a free space optical signal (of large mode field diameter) and a single mode high index waveguide formed on an optical substrate. One embodiment comprises an antiresonant reflecting optical waveguide (ARROW) structure in conjunction with an embedded (high index) nanotaper coupling waveguide. Another embodiment utilizes a low index waveguide structure disposed in an overlapped arrangement with a high index nanotaper coupling waveguide. The low index waveguide itself includes a tapered region that overlies the nanotaper coupling waveguide to facilitate the transfer of the optical energy from the low index waveguide into an associated single mode high index waveguide. Methods of forming these devices using CMOS processes are also disclosed.12-03-2009
20090297092THERMO-OPTIC PHASE SHIFTER AND METHOD FOR MANUFACTURING SAME - The thermo-optic phase shifter (12-03-2009
20090297091Techniques for Three-Dimensional Circuit Integration - Integrated circuits having complementary metal-oxide semiconductor (CMOS) and photonics circuitry and techniques for three-dimensional integration thereof are provided. In one aspect, a three-dimensional integrated circuit comprises a bottom device layer and a top device layer. The bottom device layer comprises a digital CMOS circuitry layer; and a first bonding oxide layer adjacent to the digital CMOS circuitry layer. The top device layer comprises a substrate; an analog CMOS and photonics circuitry layer formed in a silicon-on-insulator (SOI) layer adjacent to the substrate, the SOI layer having a buried oxide (BOX) with a thickness of greater than or equal to about one micrometer; and a second bonding oxide layer adjacent to a side of the analog CMOS and photonics circuitry layer opposite the substrate. The bottom device layer is bonded to the top device layer by an oxide-to-oxide bond between the first bonding oxide layer and the second bonding oxide layer.12-03-2009
20120294566Waveguide Structure - According to embodiments of the present invention, a waveguide structure is provided. The waveguide structure includes a silicon-on-insulator layer, and a semiconductor waveguide disposed on the silicon-on-insulator layer, wherein the semiconductor waveguide includes a tapering region.11-22-2012
20100111468OPTICAL INTEGRATED CIRCUIT AND OPTICAL INTEGRATED CIRCUIT MODULE - An optical integrated circuit includes a planar lightwave circuit, and a semiconductor element, which are fixed at one contact surface. A semiconductor optical amplifier (SOA) and a turnaround waveguide having a turnaround portion are formed on a semiconductor substrate. The turnaround waveguide is turned around on the second substrate and is connected to an output port of the SOA. An input port and an output port of the turnaround waveguide are optically coupled at the contact surface with an input port and an output port of the optical waveguides respectively.05-06-2010
20080212919Optical Waveguide Chip And Method Of Manufacturing The Same - The present invention relates to an optical waveguide chip, etc., having a structure for effectively avoiding or suppressing peeling of an optical waveguide layer in a process of cutting a wafer. The optical waveguide chip comprises a substrate having a main surface, and an optical waveguide layer formed on the main surface of the substrate. The optical waveguide layer comprises a cladding portion and a core portion that is disposed inside the cladding portion and that has a higher refractive index than the cladding portion, and at least one of side surfaces of the optical waveguide layer is positioned at a predetermined distance toward a center of the main surface from an edge of the main surface. This arrangement includes an arrangement having a thin film portion at a peripheral region that includes the edge of the main surface. In the case that the optical waveguide layer has the thin film portion at its periphery, the optical waveguide layer has a side surface that coincide with the side surface of the substrate including the edge of the main surface and a side surface that is separated by a predetermined distance from edge of the main surface. By this arrangement, when cutting a wafer into chip units, even if chipping occurs at an edge of the main surface of the substrate to be cut, peeling of the optical waveguide layer, formed on the substrate, is suppressed effectively.09-04-2008
20080212920Optical Circuits and Circuit Elements and Methods of Forming Same - Circuits and circuit elements adapted to function at optical or infrared frequencies are made from plasmonic and/or nonplasmonic particles disposed on a substrate, where the plasmonic and nonplasmonic particles have respective dimensions substantially smaller than a wavelength of an applied optical or infrared signal. Such particles are deposited on a substrate in a variety of shapes and sizes from a variety of plasmonic and/or nonplasmonic materials so as to form resistors, capacitors, inductors and circuits made from combinations of these elements.09-04-2008
20100061679OPTICAL WAVEGUIDE MEMBER, OPTICAL WIRING BOARD, OPTICAL WIRING MODULE AND METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE MEMBER AND OPTICAL WIRING BOARD - The present invention provides a method for manufacturing an optical waveguide. The inventive method includes steps of providing a transfer member comprising a transfer sheet and a first metal film. The transfer sheet and the first metal film are detachable from each other. A laminated body made of a core layer disposed between two clad layers is formed on the transfer member. The invention also relates to optical waveguides produced by the inventive process and devices incorporating the optical waveguides of the invention.03-11-2010
20100135610STITCHED WAVEGUIDE FOR USE IN A FIBER-OPTIC GYROSCOPE - Methods and systems for improved fiber optic gyroscopes for operation in non-atmospheric environments are provided. In one embodiment, an integrated optical circuit for an interferometer subject to non-atmospheric conditions comprises: a first section of waveguide within a Lithium crystalline structure that is exposed to an electrical field, the first section of waveguide being a Titanium-diffused waveguide region; a second section of waveguide within the Lithium crystalline structure that is not within the first section of the waveguide, the second section of waveguide being a proton-exchange waveguide region; a stitch coupling the first section of waveguide to the second section of waveguide; and a third section of waveguide configured to combine reciprocal light beams to produce an interference pattern, wherein at least one of the reciprocal light beams pass through the first section of waveguide and the second section of waveguide prior to producing the interference pattern.06-03-2010
20090003761Optoelectronic Integrated Circuit Device and Communications Equipment Using Same - A photoelectric integrated circuit device, in which photonic devices provided on the same substrate as the LSI are densely arranged along the four sides of the LSI, and characteristic degradation of the laser diode or photo detector due to heat generation can be prevented, furthermore optical wiring is easily performed on the board. A quadrilateral package substrate 01-01-2009
20100135611MULTILAYER PRINTED CIRCUIT BOARD - A multilayer printed circuit board according to the present invention is a multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, wherein the above described optical circuit is formed between the above described insulating layers.06-03-2010
20080240648Photoelectric conversion module for direct optical interconnection and method of manufacturing the same - Provided are a photoelectric conversion module for direct optical interconnection and a method of manufacturing the same, wherein an optical element array is bonded to a side surface of an IC board having a semiconductor chip mounted thereon and an optical waveguide array is bonded to one end of the optical element array having the other end bonded to the IC board to be optically connected to the optical element array, thereby improving the efficiency of optical coupling between optical elements and optical waveguides, and wherein since the optical coupling between the optical elements and the optical waveguides is realized on the same plane between the optical waveguides having the same array as the optical elements, multi-channel optical coupling can be facilitated to enable easy implementation of an optical design.10-02-2008
20080240645OPTICAL INTEGRATED CIRCUIT AND OPTICAL INTEGRATED CIRCUIT MODULE - An optical integrated circuit 10-02-2008
20080240646OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF - An optical device includes: a substrate side waveguide formed on a substrate; and a plurality of optical elements fixed on the substrate. The substrate side waveguide and an optical element side waveguide formed in each of the plurality of optical elements forms a continuous optical waveguide path.10-02-2008
20110206315Method of Fabricating an Optical Transformer - A method of fabricating an optical transformer is provided. A substrate is provided first, wherein the substrate includes a first region and a second region. Then a first material layer is formed on the substrate, and the portion of the first material layer other than in the first region is removed. Then a second material layer is formed on the substrate, and the portion of the second material in the first region and the second region is removed. Lastly, a first conductive layer is formed on the substrate and the portion of the first conductive layer other than in the second region is removed to make the first material layer, the second material layer and the first conductive layer have the same height such that the first material layer becomes a part of the optical transformer.08-25-2011
20100135609APPARATUS COMPRISING A CYLINDRICAL SUBSTRATE AND AN INTEGRATED OPTICAL CIRCUIT - Apparatus (06-03-2010
20080273831Optical Logic Gate - An optical logic gate (11-06-2008
20080273830SYSTEM, METHOD AND APPARATUS FOR IMPROVED ELECTRICAL-TO-OPTICAL TRANSMITTERS DISPOSED WITHIN PRINTED CIRCUIT BOARDS - The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (11-06-2008
20090148096OPTICAL INTERCONNECTION DEVICE - An optical interconnection device is provided. The optical interconnection device includes an optical component and a substrate on which the optical component is surface-mounted. The substrate includes: an optical waveguide which is formed in the substrate and which includes a core layer, and a cladding layer covering the core layer; and an optical path changing portion provided adjacent to one end portion of the optical waveguide to change an optical path of light transmitted through the optical waveguide or an optical path of light communicated by the optical component. A width of the core layer is broadened toward the optical path changing portion, when viewed from a plane which is parallel with a surface of the substrate.06-11-2009
20090169154Multiple Channel Optical Tranceiver Modules with Compatibility Features - Optical transceiver modules with multiple channel connection with connectors on a motherboard of a line card for network devices, such as a switch, router, crossconnect and the like, are presented. The modules have staggered electronic boards which can engage the connectors which are laterally displaced on the motherboard. The connectors are also arranged so that one of them can engage an optical transceiver module in an SFP connection so that the motherboard connectors are compatible with multiple channel and single channel (SFP) connections.07-02-2009
20090169152Manufacturing of Optical Waveguides - Optical waveguide and manufacturing of an optical waveguide comprising embossing at least one groove into a first substrate by rolling, applying at least a second substrate into the groove and covering at least the groove with a third substrate such that the groove constitutes an optical waveguide for optical signal transmission.07-02-2009
20080285910PHOTOELECTRIC CIRCUIT BOARD AND DEVICE FOR OPTICAL COMMUNICATION - The photoelectric circuit board according to the present invention is a photoelectric circuit board, wherein a rigid portion where at least a conductor circuit and an insulating layer are formed and layered and one or more flex portions that are bendable are integrated, external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed in above-described rigid portion, and an optical circuit is formed in at least one of above-described flex portions.11-20-2008
20080285911OPTICAL/ELECTRICAL HYBRID SUBSTRATE - In an optical/electrical hybrid substrate 11-20-2008
20080310793OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION - A device for optical communication comprising; 12-18-2008
20080240647OPTICAL MODULE - An optical module includes a circuit board mounted with a light receiving element, and a waveguide board in which a waveguide is formed. The circuit board is made of a flexible material, and has transmissivity for light having a wavelength received by the light receiving element. A circuit pattern part is formed on a surface on one side of the circuit board, and the light receiving element is mounted on the circuit pattern part. An optical filter part that transmits the light having the wavelength received by the light receiving element and that reflects light having other wavelengths, is formed on a surface on the other side of the circuit board by depositing a dielectric multilayer film. The waveguide board is connected to the optical filter part. In the light receiving element, a light receiving layer is disposed at a position outside from a region where the circuit pattern part is formed. An end portion of the waveguide of the waveguide board is optically connected to the light receiving layer of the light receiving element through the optical filter part and the circuit board.10-02-2008
20110206316OPTICAL INTERCONNECT DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optical interconnect device includes a first substrate, a second substrate, an optical waveguide, an electrical wiring and a switching device. The first substrate has an electrical wiring circuit, an electrical-optical converter for converting an electrical signal to an optical signal, and a light emitting device for emitting a light. The second substrate has an electrical wiring circuit, an optical-electrical converter for converting the optical signal to the electrical signal, and a light receiving device for receiving the light from the light emitted device. The optical waveguide optically connects the light emitting and light receiving devices. The electrical wiring electrically connects the electrical wiring circuits of the first and second substrates. The switching device determines a fast signal of data to be transmitted via the optical substrate and a slow signal of data to be transmitted via the electrical wiring.08-25-2011
20080279500Method for Producing J Aggregates - The invention relates to a method for producing special supramolecular assemblies of colorants, in particular cyanine dyes, called J aggregates. The inventive method consists in depositing a monolayer of dendrimers on a support and subsequently in deposing cyanines in solution for forming the organised monolayer of J aggregates. Said method can be used for producing a secondary light source (11-13-2008
20120033912Planar Waveguide with Patterned Cladding and Method for Producing Same - Integrated optical waveguides and methods for the production thereof which have a patterned upper cladding with a defined opening to allow at least one side or at least one end of a light transmissive element to be air clad. The at least one side or at least one end is, for preference, a lens structure unitary with the waveguide or a bend. Also provided is a method of fabricating an optical waveguide with a patterned cladding.02-09-2012
20130216177METHOD OF FABRICATION POLYMER WAVEGUIDE - A method of fabricating a waveguide device is disclosed. The method includes providing a substrate having an elector-interconnection region and a waveguide region and forming a patterned dielectric layer and a patterned redistribution layer (RDL) over the substrate in the electro-interconnection region. The method also includes bonding the patterned RDL to a vertical-cavity surface-emitting laser (VCSEL) through a bonding stack. A reflecting-mirror trench is formed in the substrate in the waveguide region, and a reflecting layer is formed over a reflecting-mirror region inside the waveguide region. The method further includes forming and patterning a bottom cladding layer in a wave-tunnel region inside the waveguide region and forming and patterning a core layer and a top cladding layer in the waveguide region.08-22-2013
20080247708Optical waveguide device - The present invention has an object to provide an optical device capable of leading out a light propagated through an optical waveguide to a desired substrate side face while maintaining the sufficient power of the light, within a range of limited substrate size. To this end, according to the optical device of the present invention, a groove is formed in the vicinity of an end portion on the optical output side of the optical waveguide, on the substrate on which the optical waveguide is formed, a side wall of the groove is used as a reflecting plane, the light output from the optical waveguide is reflected by the reflecting plane, and the reflected light is emitted from the desired substrate side face.10-09-2008
20080232736Optical Functional Circuit - The present invention provides an optical functional circuit where a holographic wave propagation medium is applied and a circuit property is excellent such as small transmission loss and crosstalk. The optical functional circuit where a plurality of circuit elements are formed on a substrate includes the wave propagation medium for converting an optical path of a leakage light so that the leakage light that is not emitted from a predetermined output port of the circuit element is not coupled to a different circuit element. This wave propagation medium is constituted by an optical waveguide that is provided with a clad layer formed on the substrate and a core embedded in the clad layer, and a part of the optical waveguide is formed in accordance with a refractive index distribution which is multiple scattered.09-25-2008
20080273832PHOTONIC CRYSTAL OPTICAL DEVICE - An active area includes a photonic-crystal optical waveguide formed by periodically arranging a plurality of holes in a primary plane direction of an active-area core layer in an active-area growth portion. A passive area includes a passive optical waveguide formed in a passive-area growth portion. An effective refractive index of a growth structure of the active-area growth portion is larger than an effective refractive index of a growth structure of the passive-area growth portion, and an active layer has a gain at a zero group-velocity point positioned on a high-frequency side of a dispersion curve of the photonic-crystal optical waveguide.11-06-2008
20090003762CHIP TO CHIP OPTICAL INTERCONNECT - An apparatus for optical communication is provided. The apparatus includes a first waveguide formed on a first surface and a second waveguide formed on a second surface. The first and second surfaces are bonded together to form an air gap between the first and second surfaces and diffraction gratings of the first and second waveguides are facing each other01-01-2009
20090003764Method of Making Optical Probes for Non-Invasive Analyte Measurements - An optical probe for non-invasively measuring an analyte property in a biological sample of a subject, comprises a plurality of illumination fibers that deliver source light from an optical probe input to a sample interface, a plurality of collection fibers that deliver light returned from the sample interface to an optical probe output, and wherein the illumination and collection fibers are oriented substantially perpendicular to the sample interface and the illumination and collection fibers are stacked in a plurality of linear rows to provide a stack of fibers arranged in a rectangular pattern. The optical probe is amenable to manufacturing on a scale consistent with a commercial product. Methods of making such probes are described.01-01-2009
20100142882OPTOELECTRONIC SURFACE-MOUNTED DEVICE AND METHOD FOR FORMING AN OPTOELECTRONIC SURFACE-MOUNTED DEVICE - An optoelectronic surface-mounted device is provided comprising a premolded casing having a first cavity and a second cavity and a leadframe to which a first electrooptical element and a second electrooptical element are mounted. The leadframe is embedded in the premolded casing. The first cavity is adapted for providing a first electromagnetic radiation path between a first waveguide and the first electrooptical element, wherein the second cavity is adapted for providing a second electromagnetic radiation path between a second waveguide and the second electrooptical element. The first cavity and the second cavity are formed in the premolded casing to decouple electromagnetic radiation propagating along the first electromagnetic radiation path from electromagnetic radiation propagating along the second electromagnetic radiation path.06-10-2010
20090034904SEMICONDUCTOR OPTICAL MODULATOR - There is provided a semiconductor optical modulator capable of performing a stable operation and having an excellent voltage-current characteristic to an electric field while exhibiting the characteristic of a semiconductor optical modulator with an n-i-n structure. The semiconductor optical modulator includes a waveguide structure that is formed by sequentially growing an n-type InP clad layer (02-05-2009
20100272385OPTICAL WAVEGUIDE DEVICE AND METHOD OF MANUFACTURING OPTICAL WAVEGUIDE DEVICE - Residue is prevented from being generated in a groove on a substrate. An optical waveguide device is provided with the substrate (10-28-2010
20090074351Optical Fiber, and Optical Access Network, Local Area Network and Optical Parts for Communication, Which Use the Optical Fiber - An optical fiber, and an optical access network, a local area network and optical parts for communication, which uses the optical fiber, are disclosed. The optical fiber whose core diameter is 10 μm˜40 μm has at least two propagation modes in a wavelength over 1200 nm. The optical fiber according to the present invention can reduce packaging costs for optical components, since cross-sectional area of the core is large, compared with the prior art technique adopting a single mode optical fiber, and can transmit ultra-high speed data a relatively long distance, since the mode number and modal dispersion effect of the optical fiber is relatively small, compared with the prior art multimode optical fiber. Also, when using the optical fiber according to the present invention, the optical subscriber network and the local area network can be cost-effectively implemented. In addition, when adopting the optical fiber according to the present invention, productivity of optical components for communication can be improved, costs for an optical component can be reduced and quality of the optical component can be improved.03-19-2009
20100142885OPTICAL MODULE - The first and second optical waveguide device portions are optically coupled by 45-degree total reflection mirrors integrally formed in the respective device portions. The light generated by the first optical waveguide device portion is bent upward by the total reflection mirror of the first optical waveguide device portion. The light is totally reflected by the 45-degree total reflection mirror of the second optical waveguide device portion, and coupled to the second optical waveguide device portion. The first optical waveguide device portion has a lens device for focusing the emitted light onto a light emitting portion. The second optical waveguide device portion has a lens device for focusing the incident light onto a light receiving portion.06-10-2010
20090180732Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical Module - The present invention provides a junction structure between an optical element and a substrate. The junction structure is formed by supplying an under-fill resin not containing a filler to a portion functioning as a light path for light emitted from or incoming into the optical element on the substrate, then jointing a conductive bump of the optical element to electric wiring on the substrate, and then thermally hardening the under-fill resin not containing a filler to bond the resin not containing a filler to the optical element and to the substrate so that the under-fill resin containing a filler will not enter a space between the optical element and the substrate when the under-fill resin containing a filler is filled in portions other than the light path between the optical element and the substrate.07-16-2009
20120063718MINIATURIZED HIGH SPEED OPTICAL MODULE - The present disclosure relates to an optical module comprising a carrier substrate including first electrical connection terminals on a first surface and second electrical connection terminals on a second surface electrically connected to the first electrical connection terminals. The second electrical connection terminals are connectable to a circuit carrier. The optical module further comprises an optically transparent carrier including first electrical connection terminals, and an optical element electrically connected to the optically transparent carrier. The optically transparent carrier is mechanically attached and electrically connected to the carrier substrate trough corresponding first electrical connection terminals, and the optical element is connected on a first surface of the optically transparent carrier and is adapted to emit/receive light through the optically transparent carrier to/from an optical coupling element facing a second surface of the optically transparent carrier opposing the first surface.03-15-2012
20100142884OPTICAL COMMUNICATION DEVICE INCLUDING DIGITAL OPTICAL SWITCH - Provided is an optical communication device including an optical switch. The optical communication device a main core including an optical input part and a transmission output part and a reflection output part disposed on a side of the main core. An optical signal is outputted through the reflection output part or the transmission output part according to an operation of a heater.06-10-2010
20100142881OPTICAL LINK CIRCUIT AND METHOD OF MAKING SAME - A circuit includes a flexible circuit having an optical waveguide embedded therein, a first device attached to the flexible circuit and configured to convert a first electrical signal to an optical signal, the first device positioned to emit the optical signal to an input end of the optical waveguide, and a second device attached to the flexible circuit and configured to convert the optical signal into a second electrical signal, the second device positioned to receive the optical signal from an output end of the optical waveguide.06-10-2010
20090162006Holding Member for Holding a Plurality of Circuit Boards and Module Utilizing This Holding Member - The object of the present invention is to provide a technique for accurately transmitting information, wherein optical signals are the medium of information, between circuit boards.06-25-2009
20120093456Coupling Methods and Systems Using a Taper - Disclosed are optical devices for coupling radiation between an optical waveguide and an external medium. In one embodiment, an optical device is disclosed comprising a semiconductor die comprising an integrated optical waveguide core and an overlying optical waveguide comprising a waveguide taper and a waveguide facet. The overlying optical waveguide at least partially overlies the integrated optical waveguide core, and the waveguide facet is between about 1 μm and 200 μm from an edge of the semiconductor die. In another embodiment, a method is disclosed comprising providing a substrate comprising an integrated semiconductor waveguide and forming on the substrate an overlying waveguide comprising a waveguide taper and a waveguide facet. The overlying waveguide at least partially overlies the integrated semiconductor waveguide. The method further includes cutting the substrate about 1 μm and 200 μm from the waveguide facet.04-19-2012
20090129725SFP Active fiber patch cord with over-molded strain relief and conductive housing - The device includes a first optical fiber, a second optical fiber, a first transmitting optical subassembly, a second transmitting optical subassembly, a first receiving optical subassembly, a second receiving optical subassembly, a first circuit board, a second circuit board, a first amount of over-molding material, and a second amount of over-molding material.05-21-2009
20090162004OPTICAL PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD - The invention provides a method of manufacturing an optical printed circuit board and an optical printed circuit board. The method comprises providing a support layer; on the support layer, providing an optical core layer; forming optical channels from the optical core layer and surrounding the optical channels with cladding thereby forming optical waveguides; and during said step of forming the optical channels, forming one or more alignment features, e.g. projections, on the optical printed circuit board.06-25-2009
20090162007OPTICAL DEVICE, OPTICAL COUPLER AND INTEGRATED CIRCUIT - The present invention provides an MMI optical device that can prevent a possible decrease in transmission rate in spite of miniaturization and integration. The optical device includes a rectangular multimode waveguide and an electromagnetic wave absorber of a light source wavelength. The electromagnetic wave absorber is located on at least one side surface of the rectangular multimode waveguide and is located at a predetermined gap from a core of the rectangular multimode waveguide.06-25-2009
20090162005Wafer based optical interconnect - In general, in one aspect, a method includes forming conductive layers on a wafer. A through cavity is formed in alignment with the conductive layers. The through cavity is to permit an optical signal from an optical waveguide within an optical connector to pass therethrough. Alignment holes are formed on each side of the through cavity to receive alignment pins. The wafer having the conductive layers, the through cavity in alignment with the conductive layers, and the alignment holes on each side of the through cavity forms an optical-electrical (O/E) interface. An O/E converter is mounted to the metal layers in alignment with the through cavity. The alignment pins and the alignment holes are used to passively align the optical waveguide and the O/E converter.06-25-2009
20110268386PHOTONIC WAVEGUIDE - The system (11-03-2011
20090129723PROGRAMMABLE OPTICAL ARRAY - An apparatus having a topology that allows building complicated optical programmable arrays useful for manipulating the phase and/or amplitude of an optical signal. Sophisticated filtering and other optical signal processing functionality can be programmed into the array after a chip containing the array has been fabricated. This programming capability is analogous to that of electronic field programmable gate arrays (FPGA's). Apparatus described herein will provide a powerful tool for processing optical signals or very broadband electrical signals.05-21-2009
20090136173Integrated lateral mode converter - The invention describes method and apparatus for a mode converter enabling an adiabatic transfer of a higher order mode into a lower order optical mode within a photonic integrated circuit exploiting integrated semiconductor ridge waveguide techniques. As disclosed by the invention, such a mode conversion is achievable by using an asymmetric coupler methodology. In an exemplary embodiment of the invention, the invention is used to provide a low insertion loss optical connection between laterally-coupled DFB laser operating in first order mode and passive waveguide operating in the zero order optical mode. The integrated arrangement fabricated by using one-step epitaxial growth allows for a launch of the laser's light into the waveguide circuitry operating in the zero order lateral mode or efficiently coupling it to single-mode fiber, an otherwise high loss interface due to the difference in laser and optical fiber modes.05-28-2009
20090136174PHOTOELECTRIC CONVERSION DEVICE AND FABRICATION METHOD THEREFOR - A photoelectric conversion device comprises a high-refractive-index portion at a position close to a photoelectric conversion element therein. And, the high-refractive-index portion has first and second horizontal cross-section surfaces. The first cross-section surface is at a position closer to the photoelectric conversion element rather than the second cross-section surface, and is larger than an area of the second cross-section surface, so as to guide an incident light into the photoelectric conversion element without reflection.05-28-2009
20120070113OPTICAL MODULE AND MANUFACTURING METHOD THEREOF - An optical module includes a substrate including interferometers and a carrier which is connected to a joining area which is a part area of a bottom surface of the substrate, wherein the bottom surface area corresponding to an area on the substrate which the interferometer occupies is not included in the joining area.03-22-2012
20080317403Optical device - According to an aspect of the embodiment, an optical device having a light output device, a lens array and an angle changing device. The angle changing device is inputted a plurality of light from the lens array and outputs the plurality of light in predetermined output angle.12-25-2008
20080317402OPTICAL/ELECTRICAL COMPOSITE WIRING BOARD AND A MANUFACTURING METHOD THEREOF - The optical/electrical composite wiring board comprises a lower insulating layer that also serves as a lower clad; a upper insulating layer that also serves as an upper clad; a core that is placed between the lower insulating layer and the upper insulating layer and has a predetermined optical wiring pattern; and a conductor layer that is placed along with the core between the lower insulating layer and the upper insulating layer and has a predetermined electrical wiring pattern. Herein, the core and the conductor layer are formed via a short manufacturing method, whereby the concave portion for optical wiring and the concave portion for electrical wiring are formed on the lower insulating layer by press process, and a core material and conductor material are filled into each of the concave portions, and afterward, the core material and conductor material are ground until they are flush with the upper surface of the lower insulating layer.12-25-2008
20090185774Optical integrated device and method of manufacturing the same - An optical integrated device comprises a substrate and a waveguide formed on a surface of the substrate. The waveguide includes a lower clad layer, a core layer formed on the lower clad layer and having a refractive index greater than that of the lower clad layer, and an upper clad layer formed on the core layer and having a refractive index smaller than that of the core layer. The waveguide further includes a straight waveguide part and a bending waveguide part curved in a plane parallel to the surface of the substrate. The lower clad layer in the bending waveguide part projects from the substrate by a projection height greater than that of the lower clad layer in the straight waveguide part.07-23-2009
20090052833OPTICAL COUPLER FOR A LIGHT EMITTING DEVICE WITH ENHANCED OUTPUT BRIGHTNESS - A light source is described where the light emitted by a solid-state light emitting device such as an LED is coupled into an optical waveguide such as an optical fiber. A highly reflective coupler (reflector) is disposed around the LED and a segment of the waveguide adjacent the LED. Light emitted from the LED that falls outside of the numerical aperture of the waveguide leaks out of the waveguide, but is reflected back to the waveguide by the reflector. The reflected light is re-reflected or scattered by the LED or the substrate the LED is mounted on, and the re-reflected or scattered light that falls within the numerical aperture of the waveguide is coupled into the waveguide. As a result, light coupling efficiency is increased and the output brightness of the light at the other end of the fiber is enhanced.02-26-2009
20120128292Photoelectric Composite Wiring Module and Method for Manufacturing Same - A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided.05-24-2012
20120128290OPTICAL MODULES - Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.05-24-2012
20110222816WAVEGUIDE FOR EXTRACTION OF LIGHT AT LOW LEVELS OF REFLECTION - A waveguide for the extraction of light at low levels of reflection arranged to guide light from an electro-optical component on a chip to a facet on the chip for extraction includes a first part and a second part. The first part (09-15-2011
20110222815OPTICAL TRANSMISSION MODULE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING OPTICAL TRANSMISSION MODULE - This invention provides an optical transmission module that is of low cost and that can be mounted even in a narrow space. An optical transmission module of the present invention includes a light reception processing section for converting an optical signal transmitted by an optical wiring to an electric signal, a reception side substrate part including an electric wiring for transmitting the electric signal, and a reception side connector section for providing the electric signal to the light reception processing section and the reception side substrate part. The light reception processing section and the reception side connector section are mounted on a same substrate surface of the reception side substrate part, and the reception side substrate part includes a bending portion bent so that the substrate surfaces oppose each other at the back in the normal direction.09-15-2011
20090080830OPTOELECTRONIC INTEGRATED CIRCUIT BOARD AND COMMUNICATIONS DEVICE USING THE SAME - In the optical connection between multi-layered optical waveguides and photoelectric converting elements or optical waveguide array connectors formed on a substrate, the optical coupling efficiency is to be prevented from degrading due to deviation of the optical axis positions between optical elements and the optical waveguide layers that is caused by a radiation due to a beam expansion or by a deviation of positioning layers in producing the optical waveguides. There are stacked, on a substrate, optical waveguide layers, each of which comprises a clad layer and a core having a higher refractive index than the clad layer, and optical elements formed on the uppermost optical waveguide layer. The optical elements are positioned such that they correspond to the optical path conversion mirrors of the cores of the underlaying optical waveguide layer. The light transmission/reception between the optical elements and the optical path conversion mirrors of the cores of the underlaying optical waveguide layer is performed via the cores of overlying optical waveguide layer.03-26-2009
20090257706Polarization Component Processor, Method of Processing Polarization Components and Integrated Photonic Circuit Employing the Same - An apparatus and a method by which polarization components may be processed separately, for example, to enable a polarization beam splitter (PBS) or a switch. In one embodiment, the apparatus includes: first and second Mach-Zehnder interferometers, each Mach-Zehnder interferometer having input and output optical couplers and two internal optical arms, each optical arm connecting one output of the input optical coupler to a corresponding input of the output optical coupler, the output optical coupler of the first Mach-Zehnder interferometer being the input optical coupler of the second Mach-Zehnder interferometer, wherein the input optical coupler of the first Mach-Zehnder interferometer is configured to transmit one polarization component of the light to two of the outputs thereof and to transmit a different polarization of the light to substantially only one of the outputs thereof in response to receiving said light at an input thereof.10-15-2009
20090052836Optical Fiber Data Link - A data link for transmitting data between first and second optically active devices, such as in articulated electronic devices. A coupling unit is mounted above each optically active device. Each coupling unit has a convexly tapered well extending between a top surface and a bottom surface, with a larger opening in the top surface and a smaller opening at the bottom surface. The tapered well receives one end of the optical fiber and aligns the end with the corresponding optically active device. The smaller opening of the well may have a circular cross-section or a keyhole cross-section. A groove may be disposed near a top surface of each coupling unit, with the groove extending between the tapered well and a sidewall of the coupling unit. A segment of the optical fiber disposed near an end curves along the contour of the convexly tapered sidewalls when the optical fiber is inserted into the groove. A pair of opposed lips retain the optical fiber in the groove.02-26-2009
20090080832Quasi-waveguide printed circuit board structure - In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of a quasi-waveguide, and printed circuit board material is laminated to the plated channel using thermoset adhesive. Other embodiments are described and claimed.03-26-2009
20090080831Optical Module and Method of Producing Optical Module - An optical module where breaking of an optical fiber is avoided to improve ease of handling in the assembly process of the module and mechanical reliability of the module including resistance to impact. The optical module has a PD (03-26-2009
20110229073Optoelectronic Devices - The present invention relates integrated optoelectronic devices comprising light emitting field-effect transistors. We describe an optoelectronic device comprising a light-emitting field effect transistor (LFET) with an organic semiconductor active layer and a waveguide integrated within the channel of the light-emitting field effect transistor, wherein said waveguide comprises a material which has a higher refractive index than said organic semiconductor. We also describe a light-emitting organic field transistor integrated with a ridge or rib waveguide incorporated within the channel of the LFET; and a similar light-emitting organic field effect transistor in which the waveguide incorporates an optical feedback mechanism.09-22-2011
20090232445OPTICAL WAVEGUIDE DEVICE, OPTICAL INTEGRATED DEVICE AND OPTICAL TRANSMISSION DEVICE - An optical waveguide device including a first waveguide, a plurality of second waveguides, and a tapered waveguide including a first end connected to the first waveguide and a second end connected to the plurality of second waveguides and configured to receive input of single-mode light from the first waveguide, the tapered waveguide widening as the tapered waveguide extends from the first end toward the second end.09-17-2009
20090041408CONNECTION STRUCTURE OF PHOTOELECTRIC FLEXIBLE WIRING BOARD, CONNECTOR AND PHOTOELECTRIC FLEXIBLE WIRING BOARD - [Problems to be Solved] The present invention provides a longer optical transmission line in an photoelectric flexible wiring board to downsize the photoelectric flexible wiring board and obtaining high flexibility and good optical transmission characteristics.02-12-2009
20090202196METHOD OF TUNING OPTICAL COMPONENTS INTEGRATED IN A MONOLITHIC PHOTONIC INTEGRATED CIRCUIT (PIC) - An optical transmitter comprises a monolithic transmitter photonic integrated circuit (TxPIC) chip that includes an array of modulated sources formed on the PIC chip and having different operating wavelengths approximating a standardized wavelength grid and providing signal outputs of different wavelengths. A wavelength selective combiner is formed on the PIC chip having a wavelength grid passband response approximating the wavelength grid of the standardized wavelength grid. The signal outputs of the modulated sources optically coupled to inputs of the wavelength selective combiner to produce a combined signal output from the combiner. A first wavelength tuning element coupled to each of the modulated sources and a second wavelength tuning element coupled to the wavelength selective combiner. A wavelength monitoring unit is coupled to the wavelength selective combiner to sample the combined signal output. A wavelength control system coupled to the first and second wavelength tuning elements and to said wavelength monitoring unit to receive the sampled combined signal output. The wavelength control system adjusts the respective wavelengths of operation of the modulated sources to approximate or to be chirped to the standardized wavelength grid and for adjusting the optical combiner wavelength grid passband response to approximate the standardized wavelength grid.08-13-2009
20110229072OPTICAL WAVEGUIDE DEVICE AND OPTICAL RECEIVER EQUIPPED WITH SAME - An optical waveguide device includes a plurality of input channels, a plurality of output channels, and a multi-mode interference coupler having one end part coupled to the plurality of input channels and another end part coupled to the plurality of output channels, the multi-mode interference coupler includes a first part gradually narrowing in width from the one end part to the other end part, a second part coupling to the first part and extending from the one end part to the other end part while keeping the width of a coupling part between the first part and the second part, and a third part coupling to the second part and gradually thickening in width from the one end part to the other end part.09-22-2011
20090208168CONNECTOR, OPTICAL TRANSMISSION MODULE AND OPTICAL-ELECTRICAL TRANSMISSION MODULE - A connector, including: a receptacle including a projecting terminal electrically connected to an external terminal; and a plug including a contact point with an elastic section to elastically deform when the projecting terminal is inserted therein to be electrically connected to the projecting terminal by resilience.08-20-2009
20130121634Planar Optical Waveguide With Core of Low-Index-Of-Refraction Interrogation Medium - An apparatus for illuminating a sample includes a planar waveguide. The planar waveguide includes a first substrate, including a first outer surface and a first inner surface, and a second substrate, including a second outer surface and a second inner surface. The first and second inner surfaces of the first and second substrates, respectively, are spaced apart from each other and partly define a volume for confining the sample therein. The apparatus also includes a light source for providing light directed toward the planar waveguide, such that the light is optically coupled to and contained within the planar waveguide between the outer surfaces of the first and second substrates, while illuminating at least a portion of the sample confined within the volume.05-16-2013
20090110345METHODS FOR PASSIVE MICROMETER-RANGE ALIGNMENT OF COMPONENTS USING REMOVABLE REFERENCE STRUCTURES - A method for passive alignment of adapters, enabling high-precision connection between components on a rigid or flexible substrate as part of a printed circuit board (PCB) is provided. Removable alignment structures are positioned in an alignment area on a PCB, where the alignment structures are in accordance with a patterned layer. Alignment pins of a two-part connector are inserted into the holes of the alignment structures such that the two-part connector is aligned with the alignment structures on the substrate, and the two-part connector is a component that comprises an integrated adapter part and ferrule part. The ferrule part of the two-part connector is fixed on the substrate in the alignment area. The adapter part of the two-part connector is removed from the ferrule part of the two-part connector such that the ferrule part remains on the substrate. The alignment structures are removed from the substrate.04-30-2009
20090003763Forming a surface-mount opto-electrical subassembly (SMOSA) - In one embodiment, the present invention includes an apparatus having a three-dimensional (3D) interconnect with a first cavity and a second cavity, and an integrated device formed of an electronic integrated circuit (IC) bonded to at least one optoelectronic (OE) die. The integrated device is bonded to the 3D interconnect and at least partially extends into the second cavity. Other embodiments are described and claimed.01-01-2009
20090220191PHOTONIC INTEGRATED CIRCUIT EMPLOYING OPTICAL DEVICES ON DIFFERENT CRYSTAL DIRECTIONS - Consistent with the present disclosure, various optical components are preferably arranged on the surface of a semiconductor substrate such that light propagates in certain components at a direction that is perpendicular to a direction of propagation in other components in order to improve performance and component density.09-03-2009
20110142392ON-CHIP OPTICAL WAVEGUIDE - Systems and methods according to these exemplary embodiments provide for on-chip optical waveguides, methods of making on-chip optical waveguides, and devices including such on-chip optical waveguides. A dielectric layer formed from, e.g., transparent spacer dielectric material, forms a waveguide core and can be surrounded or substantially surrounded by a metal cladding layer. The metal cladding layer can be formed in the chip using backend metallization techniques, e.g., Damascene processing.06-16-2011
20090245725MANUFACTURING METHOD OF OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE AND OPTICAL RECEPTION/TRANSMISSION APPARATUS - A manufacturing method of an optical waveguide, the optical waveguide including a first clad layer; a core layer formed on the first clad layer and configured to propagate light; a second clad layer formed on the first clad layer so as to cover the core layer; and a light propagation direction changing part configured to change a propagation direction of the light propagating in the core layer; the manufacturing method of the optical waveguide includes the steps of forming a concave part penetrating the first clad layer and the core layer; and inserting the light propagation direction changing part into the concave part so that a light propagation direction changing surface of the light propagation direction changing part forms a predetermined inclination angle to a predetermined reference plane.10-01-2009
20090245724MODULE SUBSTRATE INCLUDING OPTICAL TRANMISSION MECHANISM AND METHOD OF PRODUCING THE SAME - A module substrate is provided. The module substrate includes: a core portion; a build-up layer formed on the core portion and including a wiring pattern and an insulating layer; an optical transmission mechanism including: an optical transmission component including an optical waveguide, and a mounting portion on which a semiconductor element is to be mounted. The mounting portion is electrically connected to the optical transmission mechanism via the wiring pattern. The mounting portion includes a first mounting portion and a second mounting portion, and the optical transmission mechanism is disposed between the first mounting portion and the second mounting portion.10-01-2009
20090245723OPTICAL WAVEGUIDE CIRCUIT AND MULTI-CORE CENTRAL PROCESSING UNIT USING THE SAME - An optical waveguide circuit includes: a lower cladding layer formed on a substrate; a first optical waveguide formed on the lower cladding layer so as to partition the lower cladding layer into a first portion and a second portion; a second optical waveguide formed on the first portion, the second optical waveguide including a tip end portion directed toward a side face of the first optical waveguide, the tip end portion being narrowed in a tapered manner; and a third optical waveguide formed on the second portion, the third optical waveguide including a tip end portion directed toward the tip end portion of the second optical waveguide, a tip end portion of the third optical waveguide being narrowed in a tapered manner.10-01-2009
20090245720OPTICAL ELEMENT MOUNTING BOARD, OPTICAL CIRCUIT BOARD AND OPTICAL ELEMENT MOUNTING BOARD - A substrate on which an optical element is mounted is provided, including: an optical element; an optical circuit substrate which is formed by an optical waveguide layer having a core portion and cladding portions; and an electrical circuit substrate on which is provided a mounting portion that is used for mounting the optical element, wherein the optical element is mounted on the electrical circuit substrate via the optical circuit substrate and wherein the optical circuit substrate has an optical element mounted thereon and is provided with a receptor structure having a conductive portion that conducts electricity between an electrode of the optical element and an electrode of the electrical circuit substrate.10-01-2009
20110142393LOW-COST FAST VARIABLE OPTICAL ATTENUATOR FOR OPTICAL WAVELENGTH TRACKING - Variable optical attenuator (VOA) formed by disposing upon a substrate a waveguide, a p-type region and an n-type region about the waveguide, and an epi-silicon region disposed upon the waveguide, the VOA responsive to a bias current to controllably inject carriers into the waveguide to attenuate thereby optical signal propagating through the waveguide.06-16-2011
20080260327INTEGRATED CIRCUIT HAVING COMPACT HIGH-SPEED BUS LINES FOR OPTICAL SIGNAL - An integrated circuit having compact high-speed bus lines consists of VCSEL Array providing optical fiber holes, PIN Array providing optical fiber holes, and multi-mode optical fiber with great diameter optical core, wherein the VCSEL Array providing optical fiber holes and the PIN Array providing optical fiber holes both utilize the microelectromechanical system (MEMC) technology to form optical fiber holes as a concentric cylinder shape with diameter 100 μm, height 30 μm and diameter 130 μm, height 80-100 μm in the VCSEL light emitting area and the PIN light receiving area, respectively. An integrated package can be easily accomplished by mechanically performing focusing package of fixed optic-insertion to complete a glued integrated package, and thereby the package cost as a majority of the prime cost can be greatly reduced.10-23-2008
20090245726OPTICAL WAVEGUIDE HAVING AN OPTICAL TRANSMISSION DIRECTION CHANGING PART - An optical waveguide includes: a first clad layer; a core layer formed on the first clad layer; a second clad layer formed on the core layer; and an optical transmission direction changing part. The optical transmission direction changing part is configured and arranged to change a transmission direction of a light transmitting through the core layer. The optical transmission direction changing part penetrates through the core layer. An optical transmission direction changing surface of the optical transmission direction changing part inclines relative to a predetermined reference plane by a predetermined angle.10-01-2009
20090245721THREE-DIMENSIONAL STACKED OPTICAL DEVICE - A three-dimensional stacked optical device includes a transparent substrate having at least one interconnect member, and an optical device mounted to the at least one interconnect member on the transparent substrate. The optical device includes a first surface coupled to the at least one interconnect member that extends to a second surface through an intermediate portion. An insulating layer encapsulates the optical device. The insulating layer includes a first surface that extends to a second surface. The first surface abuts the transparent substrate. A communication path extends between the first surface of the optical device and the second surface of the insulating layer. An electronic chip is mounted to the second surface of the insulating layer. The electronic chip includes a first surface and a second surface. The first surface is coupled to the communication path so as to form the three-dimensional stacked optical device.10-01-2009
20090245719REFLECTION SUPPRESSION IN A PHOTONIC INTEGRATED CIRCUIT - Embodiments of the present invention provide systems, devices and methods in which optical reflections are reduced in a photonic integrated circuit. These embodiments include reflection suppression elements which operate to dissipate optical energy that would otherwise provide a source for optical reflections which may impact the operation of one or more devices within the photonic integrated circuit. In particular, within photonic integrated circuits incorporating semiconductor optical amplifiers, embodiments of the present invention include reflection suppression elements which operate to dissipate optical energy preventing the semiconductor optical amplifiers from operating in a gain-clamped mode.10-01-2009
20100014804Method for Fabricating Selectively Coupled Optical Waveguides on a Substrate - A method for fabricating selectively coupled optical waveguides on a substrate is disclosed. Initially, a first layer of waveguide material is deposited on a substrate. The first layer of waveguide material is then etched to form multiple level one waveguides and fill shapes. A dielectric layer is deposited on top of the level one waveguides and fill shapes. The surface profile of the dielectric layer deposition tracks the pattern density of the fill shapes. After the surface of the dielectric layer has been polished, a second layer of waveguide material is deposited on the substrate. At least one optically coupled waveguide structure, which is formed by a first level one waveguide and a first level two waveguide, is located adjacent to at least one non-optically coupled waveguide structure, which is formed by a second level one waveguide and a second level two waveguide.01-21-2010
20120195545PHOTOELECTRIC CONVERSION MODULE AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION MODULE - A photoelectric conversion module includes: a photoelectric conversion element and an IC chip mounted on a mounting surface of a substrate; and an electrode provided on a side surface of the substrate, electrically connected to the IC chip, and having a concave shape sunk deeper than other portions of the side surface of the substrate.08-02-2012
20120195546WAVELENGTH CONVERSION DEVICE AND METHOD OF FABRICATING THE SAME - A wavelength conversion device includes a base substrate having a transparent electrode on one surface thereof and a ferroelectric single crystal substrate provided with an optical waveguide. The ferroelectric single crystal substrate has an insulating film formed on one surface and is bonded to the base substrate such that the insulating film faces the transparent electrode.08-02-2012
20090317033INTEGRATED CIRCUIT AND PHOTONIC BOARD THEREOF - An integrated circuit (IC) including at least a first and a second logical blocks and a photonic board is provided. The photonic board connects with the first and the second logical blocks through a eutectic bonding technology, and communicates at least a logical signal of the first logical block to the second logical block by light conduction.12-24-2009
20100002989POLARIZATION ROTATOR AND METHOD FOR MANUFACTURING THE SAME - An optical circuit comprises a first waveguide; a second waveguide; and a third waveguide that converts mode field and direction of polarization of light of said first waveguide at the same time to perform wave guiding to said second waveguide; wherein large aspect ratio directions of corresponding ends of a core of said first waveguide and a core of said second waveguide differ from each other.01-07-2010
20100002987OPTICAL MODULE MOUNTED WITH WDM FILTER - A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.01-07-2010
20100002986Suspension board with circuit and producing method thereof - A suspension board with circuit includes a metal supporting board; an insulating base layer formed on the metal supporting board; a conductive pattern formed on the insulating base layer; an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and an optical waveguide. The optical waveguide is adhered on the metal supporting board, the insulating base layer, or the insulating cover layer.01-07-2010
20100002984OPTICAL WAVEGUIDE DEVICE - An optical waveguide device having a high impact resistance and which can prevent bending and disconnection of an optical fiber, includes a substrate formed with an optical waveguide; an optical fiber connected to both of end portions of the optical waveguide; and a case housing the substrate and holding the optical fiber through a flexible member. Since the optical fiber is held to the case with the flexible member therebetween, thermal stress caused by a difference of the linear expansion coefficient of the optical fiber and that of the case is absorbed by the flexible member, and bending and disconnection of the optical fiber can be prevented. The optical fiber is locked to the case by a stopper such that a tensile force applied to the optical fiber is not propagated to a connection section between the optical fiber and the optical waveguide, and thus, impact resistance is improved.01-07-2010
20100002985Suspension board with circuit and producing method thereof - A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.01-07-2010
20120141063OPTICAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME, AND OPTICAL WAVEGUIDE DEVICE - A method of manufacturing an optical waveguide, includes preparing a light path conversion component including a structure in which a protruding portion having a light path conversion inclined surface is covered with a metal layer and the metal layer serves as a light path conversion mirror, and a structural body in which a core layer is formed on a first cladding layer and an opening portion is provided in an end side of a light path of the core layer, arranging the light path conversion mirror of the light path conversion component in the opening portion of the core layer, and forming a second cladding layer covering the core layer, wherein a light path of a light that propagates through the core layer is converted toward a first cladding layer side by the light path conversion mirror.06-07-2012
20090116784LARGE TOLERANCE FIBER OPTIC TRANSMITTER AND RECEIVER - An optical transmitter relaxes the tolerance between a source assembly and a fiber receptacle to facilitate passive alignment. The source assembly includes a light source and a lens. The lens is held at a fixed distance away from the light source using precise support structures typically formed by photolithographic processes. The fiber receptacle includes an optical element. The fiber receptacle is adapted to hold an optical fiber at a fixed distance from the optical element. The lens substantially collimates light from the light source into the form of collimated light. The optical element focuses the collimated light onto the aperture of the optical fiber.05-07-2009
20090103855Three-dimensional die stacks with inter-device and intra-device optical interconnect - Examples of a computer system packaged in a three-dimensional stack of dies are described. The package includes an electrical die and an optical die coupled to and stacked with the electrical die. The electrical die includes circuitry to process and communicate electrical signals, and the optical die includes structures to transport optical signals. The electrical die has a smaller area than the optical die so that the optical die includes an exposed mezzanine which is configured with optical input/output ports. Additionally, the packaging can be configured to provide structural support against insertion forces for external optical connections.04-23-2009
20110129182OPTICAL WAVEGUIDE DEVICE AND METHOD OF MANUFACTURING THE SAME - An optical waveguide device includes a wiring substrate, an optical waveguide bonded on the wiring substrate and having a light path conversion inclined surface on both ends, and a light path conversion mirror formed to contact the light path conversion inclined surface of the optical waveguide and formed of a light reflective resin layer or a metal paste layer. In case the light reflective resin layer is used as the light path conversion mirror, the light reflective resin layer may be formed partially only on the side of the light path conversion inclined surface, or may be formed on the whole of the wiring substrate to coat the optical waveguide.06-02-2011
20130216178NANOTUBE ELECTRO-OPTICAL COMPONENT, OPTRONIC OR OPTICAL LINK-BASED HYBRID INTEGRATED CIRCUIT INTEGRATING THIS COMPONENT, AND METHOD OF FABRICATION - A photonic component is provided including at least one linear optical waveguide, of which an active portion is surrounded over all or part of its periphery by a grouping of one or more essentially semiconducting nanotubes. These nanotubes interact with their exterior environment in an active zone extending on either side of the optical waveguide, to thus induce an optical coupling between an electrical or optical signal applied to the nanotubes and on the other hand an optical signal in the active portion of the waveguide. Such a component can carry out bipolar electro-optical functions as light source, or modulator or detector, inside the optical guide, for example with an electro-optical coupling between on the one hand an electrical signal applied between the electrodes, and on the other hand an optical signal emitted or modified in the active portion of the optical waveguide towards the remainder of the optical guide.08-22-2013
20130216179OPTICAL MODULE - An optical module has a circuit board, a photoelectric conversion element mounted on a mount surface of the circuit board, an optical coupling member for holding an optical fiber and optically coupling the optical fiber and the photoelectric conversion element, a semiconductor circuit element mounted on the mount surface of the circuit board and electrically connected to the photoelectric conversion element, and a plate-shaped supporting substrate arranged to sandwich the optical coupling member between the supporting substrate and the circuit board. An electrically conductive metal foil which extends in a thickness direction of the supporting substrate is provided integrally with a side surface of the supporting substrate, and the metal foil is connected at one end thereof to an electrode provided on a non-mount surface of the circuit board.08-22-2013
20100209042METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE AND OPTICAL WAVEGUIDE MANUFACTURED BY THE METHOD - The present invention relates to a production process for an optical waveguide comprising a step for forming a photosensitive resin layer comprising a photosensitive resin composition on a substrate, a step for exposing a desired pattern and a step for carrying out development in an alkaline developer containing a divalent or higher-valent metal ion and a production process for an optical waveguide comprising a step for forming a photosensitive resin layer comprising a photosensitive resin composition on a substrate, a step for exposing a desired pattern, a step for carrying out development in an alkaline developer and a step for carrying out washing with a cleaning liquid containing a divalent or higher-valent metal ion or an acid aqueous solution.08-19-2010
20100209041PHOTOELECTRIC COMPOSITE WIRING MODULE AND METHOD FOR MANUFACTURING THE SAME - A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.08-19-2010
20100254651OPTOELECTRONIC RECEIVER - An optoelectronic receiver and associated method of operation.10-07-2010
20100247028PHOTONIC INTEGRATED CIRCUIT WITH IMPROVED SIGNAL QUALITY AND ELECTROSTATIC DISCHARGE THRESHOLD - Embodiments of the present invention provide for enhanced monitoring of optical signal characteristics of an optical signal propagating in a signal channel of a photonic integrated circuit. The optical signal characteristics can be obtained with minimal signal loss in the optical signal path and reduced RF crosstalk, while the electrostatic discharge threshold for the photonic integrated circuit is increased, due to the inclusion of a second electro-optic element electrically coupled to a first electro-optic element as part of the signal channel.09-30-2010
20120141064INTEGRATED CIRCUIT FOR FACILITATING OPTICAL COMMUNICATION BETWEEN ELECTRONIC DEVICES - Active optical cable assemblies, and systems, methods, and adapter modules and integrated circuits for facilitating communication between a host and a client device over a fiber optic cable are disclosed. In one embodiment, an active optical cable assembly includes a fiber optic cable having at least one optical fiber, a host active circuit, a client active circuit, a host connector, and a client connector. Upon a connection between the host active circuit and a host device, the client termination switch closes to couple the client termination impedance to the ground reference potential. Upon a connection between the client active circuit and a client device, the host termination switch closes to the couple the host termination impedance to the ground reference potential. In another embodiment, a method includes enabling a host termination impedance upon a connection of an active optical cable to a client device.06-07-2012
20100080503OPTICAL INTERFACE ASSEMBLY - An optical device includes a first waveguide having an end portion configured to receive an optical signal, the optical signal having a fundamental mode; a second waveguide having an end portion spaced from the end portion of the first waveguide; and a cladding layer surrounding the first and second waveguides. The first waveguide is configured such that the optical signal undergoes multimode interference to focus the fundamental mode at the end portion of the second waveguide.04-01-2010
20090279828WAVELENGTH LOCKING AND POWER CONTROL SYSTEMS FOR MULTI-CHANNEL PHOTONIC INTEGRATED CIRCUITS (PICs) - A transmissive active channel element is provided in each signal channel of a monolithic multi-channel TxPIC where each channel also includes a modulated source. The active channel element functions both as a power control element for both monitoring and regulating the output channel signal level of each signal channel and as a modulator for channel wavelength tagging or labeling to provide for wavelength locking the modulated sources. The power regulating function is also employed to control the channel signal power outputs of each channel to be uniform across the channel signal array. All of these functions are carried out by a feedback loop utilizing digital signal processing.11-12-2009
20090041409 ELECTRO-OPTICAL PRINTED CIRCUIT BOARD AND A METHOD OF MAKING AN ELECTRO-OPTICAL PRINTED CIRCUIT BOARD - An electro-optical printed circuit board and a method of making an electro-optical printed circuit board are provided. The method comprises: forming a trench or groove on an outer surface of an electrical printed circuit board; providing optical material in the trench thereby to form an optical waveguide.02-12-2009
20090041407Integrated chip - An integrated chip for data communication, telecommunication and optical analysis for at least one, two or more wavelengths where the chip can be used not only to emit light but also to detect light. The invention is characterised in that the chip (02-12-2009
20090074354OPTICAL WAVEGUIDE MOUNTED SUBSTRATE AND METHOD OF PRODUCING THE SAME - A lower cladding layer is formed on a surface of an electrical circuit substrate. A UV curable resin layer is stacked on the lower cladding layer. The resin layer is partly cured, and the other uncured resin layer is removed, thereby forming resin projections. The resin projections are processed so as to have an inclined face. Metal reflecting layers are formed on the inclined faces. A core layer is stacked on the lower cladding layer and the metal reflecting layers, and an upper cladding layer is stacked on the core layer.03-19-2009
20090074353OPTICAL WAVEGUIDE MOUNTED SUBSTRATE AND METHOD OF PRODUCING THE SAME - Openings are disposed in an insulating layer to expose a conductor layer. A lower cladding layer is formed, and a resist layer is formed on an insulating layer and the lower cladding layer. Electrolytic plating is performed with using the conductor layer which is connected to the external, as an electrode, to fill openings passing through the lower cladding layer and the resist layer with Cu. The resist layer is removed away to form projections configured by the filled Cu. The projections are processed to have an inclined face. Au layers are formed on the inclined faces of the projection. A core layer and an upper cladding layer are stacked.03-19-2009
20090074352BIDIRECTIONAL OPTICAL TRANSMISSION DEVICE - In a bidirectional optical transmission device, a light-emitting element and a light-receiving element are mounted on one side of a base material and are sealed with an optically permeable resin section. The resin section includes a light emitting side resin section and a light receiving side resin section, and a slit is provided between these resin sections. The device further includes a light-blocking receptacle having a claw, and the claw of the receptacle is disposed in the slit between the light emitting side resin section and the light receiving side resin section. The claw of the receptacle prevents leakage of light from the light-emitting element between the light-emitting element and the light-receiving element.03-19-2009
20090074350Electrically pluggable optical interconnect - An optical interconnect is provided which may allow flexible high-bandwidth interconnection between chips, eliminate the need for optical alignment between the optoelectrical (OE) die and waveguide during assembly because the OE die is at least partially embedded inside the waveguide (lower cladding layer, upper cladding layer, and core layer), eliminate the need for handling the optical interconnect at OEM, and not impact current substrate and motherboard technology03-19-2009
20090324162CMOS COMPATIBLE INTEGRATED DIELECTRIC OPTICAL WAVEGUIDE COUPLER AND FABRICATION - An optoelectronic circuit fabrication method and integrated circuit apparatus fabricated therewith. Integrated circuits are fabricated with an integral optical coupling transition to efficiently couple optical energy from an optical fiber to an integrated optical waveguide on the integrated circuit. Layers of specific materials are deposited onto a semiconductor circuit to support etching of a trench to receive an optical coupler that performs proper impedance matching between an optical fiber and an on-circuit optical waveguide that extends part way into the transition channel. A silicon based dielectric that includes at least a portion with a refractive index substantially equal to a section of the optical fiber is deposited into the etched trench to create the optical coupler. Silicon based dielectrics with graded indices are also able to be used. Chemical mechanical polishing is used finalize preparation of the optical transition and integrated circuit.12-31-2009
20090185775MANUFACTURING METHOD OF OPTICAL WAVEGUIDE DEVICE, OPTICAL WAVEGUIDE DEVICE OBTAINED THEREBY, AND OPTICAL WAVEGUIDE CONNECTING STRUCTURE USED FOR THE SAME - A method of manufacturing optical waveguide device, comprising steps of: preparing optical waveguide including under cladding layer and protruding core pattern formed on the under cladding layer; preparing mold having protrusions for shaping recesses for fitting with predetermined portions of the core pattern; preparing board provided with light-receiving/emitting element mounted thereon; placing the mold around the light-receiving/emitting element for positioning top surfaces of the protrusions of the mold over light-receiving/emitting portions of the light-receiving/emitting element; filling the mold with sealing resin material and hardening the material in the mold to form sealing resin layer having recesses for fitting with the core pattern; after removing the sealing resin layer from the mold, the core pattern are fitted with the recesses of the resin layer to optically couple the light-receiving/emitting portions and the optical waveguide; and forming an over cladding layer for covering the remaining portion of the core pattern.07-23-2009
20110026875OPTICAL FIBER INTERCONNECT DEVICE - A fiber optic interconnect device includes a silicon substrate having at least one groove formed therein. The groove includes a pair of sidewalls and a first end disposed at an end of the pair of sidewalls. The device also includes an optical fiber disposed in the groove, the optical fiber having a cylindrical body, an endface formed on an end of the cylindrical body, and a multi-faceted mirror formed on the endface, and a light source adapted to transmit light to the multifaceted mirror to launch light through the optical fiber to a detector.02-03-2011
20090180733SYSTEM PACKAGE USING FLEXIBLE OPTICAL AND ELECTRICAL WIRING AND SIGNAL PROCESSING METHOD THEREOF - A system package using flexible optical waveguides and electrical wires, and a signal processing method thereof are disclosed. Several rigid substrates having highly integrated electronic elements and optical elements mounted thereon can be electrically and optically connected by using flexible substrates that are electrically wired and optically connected. The package can be variously changed when configuring the package by the flexible substrate and the heat dissipation device and the electromagnetic shielding device are installed in the inside of the package, making it possible to solve electromagnetic wave interference problems and thermal problems occurring in the inside of the package.07-16-2009
20090324164Waveguide photodetector device and manufacturing method thereof - Embodiments of the present invention describe a waveguide-based photodetector device and its methods of fabrication. The waveguide photodetector device comprises a substrate having a cladding structure formed thereon. A waveguide element for receiving optical signals is disposed within the cladding structure. A portion of the waveguide element is encapsulated by a photodetector element that detects the optical signal received by the waveguide element and generates an electrical signal based on the optical signal. Encapsulating the waveguide element in the photodetector element improves coupling efficiency and enables a waveguide photodetector device with higher speeds and higher responsivity.12-31-2009
20090324163High confinement waveguide on an electro-optic substrate - The invention relates to an optical device including a passive high confinement waveguide, such as of silicon-rich silicon nitride, on an electro-optic substrate, like lithium niobate, optically coupled to a waveguide in the electro-optic substrate. A wide range of electro-optic devices are enabled by this high confinement waveguide structure, including: directional couplers, compact tap couplers, folded electro-optic devices, electro-optic modulators including ring resonators, electro-optic gratings. Further applications enabled by the present invention include hybrid passive planar lightwave circuits (PLC) integrated with electro-optically active waveguides, using the high confinement waveguide as an intermediary waveguide to transfer optical power between the passive and active components.12-31-2009
20090208164Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board.08-20-2009
20090129724Organic Electroluminescent Optocouplers - An optocoupler including: a substrate comprising a photodetector; a transparent electrically-insulating layer disposed over the photodetector; and an organic electroluminescent device having an organic electroluminescent layer disposed between a first and a second electrode disposed over the transparent electrically-insulating layer; the photodetector arranged to detect light emitted from the organic electroluminescent device; wherein the optocoupler comprises a second current path between the first and second electrodes in addition to a first current path between the first and second electrode which in operation causes the organic electroluminescent layer to emit light.05-21-2009
20090110346Diffusion And Laser Photoelectrically Coupled Integrated Circuit Signal Line - A diffusion and laser photoelectrically coupled integrated circuit signal line, wherein photoelectrically coupled pairs are formed on integrated circuit chips utilizing a diffusion light or a laser light emitted by LED or the photoelectrically coupled pairs are arranged in an array to form photoelectrically coupled matrixes on the chips are used as signal lines connecting integrated circuits; furthermore a light emission is made to hollow light emitter and placed on the integrated circuit chip; a hollow reflective sheet is located on the bottom surface of the chip and under the light emitting body where a send-receiving photosensitive module is disposed around and a hollow reflective sheet or a semitransparent diffusion sheet is placed over; and the same processed chips are stacked up. The present invention solves the problem of signal transmission bandwidth between the computer chips, increasing the present arithmetic capability and reducing the volume of the supercomputer.04-30-2009
20080304789Plasmon photocatalysis - Plasmons on a waveguide may deliver energy to photocatalyze a reaction.12-11-2008
20100303406OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION - A device for optical communication including a conductor circuit and an insulating layer formed and laminated, an optical circuit and an optical path for transmitting an optical signal, and an optical element or a package substrate on which an optical element is mounted. An optical path converting member is disposed at the optical path for transmitting an optical signal so as to transmit an optical signal between the optical element and the optical circuit. The optical path converting member comprises a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface. The lens is provided at either the entrance surface or the exit surface on the side facing the optical circuit.12-02-2010
20130136393OPTICAL COMPONENT - In an optical component configured to fix to a mount an optical device chip in which a plurality of waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component (05-30-2013
20110150387Low Switching Voltage, Fast Time Response Digital Optical Switch - Disclosed herein is a digital electro-optical switch (06-23-2011
20100310208Photonic crystal band-shifting device for dynamic control of light transmission - An active device for dynamic control of lightwave transmission properties has at least one photonic crystal waveguide that has anti-reflection photonic crystal waveguides with gradually changed group refractive indices at both input and output side. An alternating voltage or current signal applied to two electrically conductive regions changes the refractive indices of the photonic crystal materials, introducing a certain degree of blue-shift or red-shift of the transmission spectrum of the photonic crystal waveguide. The output lightwave with frequency close to the band-edge of the photonic crystal waveguide is controlled by the input electric signal. Devices having one or more such active photonic crystal waveguides may be utilized as an electro-optic modulator, an optical switch, or a tunable optical filter.12-09-2010
20100303405OPTICAL MODULE AND METHOD FOR MANUFACTURING SAME - An optical module includes: an optical semiconductor section including a first lead, a second lead with one end portion opposed to one end portion of the first lead, an optical semiconductor element bonded onto the first lead, and a first molded body in which the optical semiconductor element, the one end portion of the first lead, and the one end portion of the second lead are embedded; and an optical element section including a third lead, a fourth lead with one end portion opposed to one end portion of the third lead, and a second molded body in which the one end portion of the third lead and the one end portion of the fourth lead are embedded and which can change the optical path of at least one of emitted light from the optical semiconductor element and incident light on the optical semiconductor element. The other end portion of the first lead and the other end portion of the second lead protrude from the first molded body in directions opposite to each other. The other end portion of the third lead and the other end portion of the fourth lead protrude from the second molded body in directions opposite to each other. The protruding first lead and the protruding third lead are joined to form a metal junction. The protruding second lead and the protruding fourth lead are joined to form a metal junction. And at least one of the first and second leads and the third and fourth leads have a bent portion which is convex outward.12-02-2010
20100329603STRUCTURE AND METHOD FOR ALIGNING AN OPTICAL FIBER AND A SUBMICRONIC WAVEGUIDE - An integrated optical circuit including an operational submicronic waveguide associated with an operational grating intended for the coupling with an optical fiber, further including an alignment grating, identical to the operational grating, associated with a blind waveguide and arranged at a known distance from the operational grating.12-30-2010
20100322552OPTICAL CONNECTIONS AND METHODS OF FORMING OPTICAL CONNECTIONS - In one embodiment, a system comprises a plurality of electronic circuit boards and at least one optical fiber in optical communication with at least one circuit board of the plurality of electronic circuit boards, wherein at least one optical fiber comprises at least one core having at least one end surface, and wherein at least one end surface comprises a light dispersing geometry.12-23-2010
20090010592MOUNTING STRUCTURE OF SEMICONDUCTOR OPTICAL ELEMENT - To provide a mounting structure of a semiconductor optical element, in which structure the turning of a refractive index matching gel is prevented. There is provided a mounting structure of a light emitting element, in which structure signal light emitted from one end of an SOA 01-08-2009
20110129181TURNING MIRROR FOR PHOTONIC INTEGRATED CIRCUITS - An optical device comprising a substrate having a planar surface and an optical waveguide located on and parallel to the planar surface and having an end located and oriented to emit or receive light propagating substantially parallel to the planar surface. The device also comprises a crystalline turning mirror bound to the planar surface, the crystalline turning mirror having a bottom surface along the planar surface and having a reflecting surface that is slanted relative to said planar surface. The crystalline turning mirror and the substrate are formed of different materials.06-02-2011
20110110622HYBRID INTEGRATED OPTICAL MODULE - The present invention provides a hybrid integrated optical module having a high coupling efficiency by suppressing a connection loss between waveguides. A hybrid integrated optical module according to an embodiment of the present invention is an optical module which integrates a semiconductor chip and a PLC chip. The semiconductor chip has a semiconductor waveguide and is mounted on a Si bench. The PLC chip includes a PLC substrate and an optical waveguide formed on the PLC substrate. An end face of the semiconductor chip protrudes from an end face of the Si bench toward the PLC chip side by a protrusion amount X. Gap adjustment (adjustment of a distance D) between the semiconductor waveguide and the optical waveguide becomes possible by setting a position where the end face of the semiconductor chip is brought into contact with an end face of the PLC chip to be a reference position (zero point).05-12-2011
20110019959Printed circuit board for optical waveguides and method of manufacturing the same - The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides.01-27-2011
20110019960Integrated Optical Transmission Board and Optical Module - An integrated optical transmission board in accordance with one embodiment of the invention includes: a first optical transmission board having a first optical transmission line; a second optical transmission board having a second optical transmission line; and an optical coupling structure which is disposed between the first optical transmission board and the second optical transmission board and has a third optical transmission line for providing optical connection between the first optical transmission line and the second optical transmission line. The first optical transmission board further has a first engagement portion provided in an area thereof opposed to the optical coupling structure. The optical coupling structure further has a second engagement portion provided in an area thereof opposed to the first optical transmission board so as to make engagement with the first engagement portion.01-27-2011
20100080504Method and Apparatus for High Speed Silicon Optical Modulation Using PN Diode - A method and apparatus for high speed silicon optical modulation is described using a PN diode. In one example, an optical waveguide has adjoining first and second doped semiconductor regions. The first and second regions have opposite doping types and the first doped region extends in two perpendicular directions through the waveguide.04-01-2010
20090034905Microresonantor systems and methods of fabricating the same - Various embodiments of the present invention are related to microresonator systems and to methods of fabricating the microresonator systems. In one embodiment, a microresonator system comprises a substrate having a top surface layer and at least one waveguide embedded in the substrate and positioned adjacent to the top surface layer of the substrate. The microresonator system also includes a microresonator having a top layer, an intermediate layer, a bottom layer, a peripheral region, and a peripheral coating. The bottom layer of the microresonator is attached to and in electrical communication with the top surface layer of the substrate. The microresonator is positioned so that at least a portion of the peripheral region is located above the at least one waveguide. The peripheral coating covers at least a portion of the peripheral surface and has a relatively lower index of refraction than the top, intermediate, and bottom layers of the microresonator.02-05-2009
20110033150OPTICAL TAPS FOR CIRCUIT BOARD-MOUNTED OPTICAL WAVEGUIDES - A method for installing an optical tap into an optical waveguide formed in a printed circuit board which comprises obtaining a printed circuit board having an optical waveguide formed therein, cutting a transverse groove that has a front plane and a back plane into the optical waveguide, such that the back plane of the groove forms an oblique angle relative to the incident beam of light, and inserting a pre-fabricated beamsplitter into the groove so that the beamsplitter is positioned at the oblique angle of incidence relative to the beam of light to enable a predetermined portion of the beam of light to be directed out of the waveguide.02-10-2011
20090028497OPTOELECTRONIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING THE OPTICAL COMMUNICATION DEVICE - An optoelectronic wiring board includes a rigid, a flexible flex section made of an optical wiring, a flex rigid substrate section provided with an electric wiring, and optical wiring means. In the rigid section, a lamination which is formed of a conductive circuit and an insulating layer is formed on both sides of a substrate. The flexible flex section is made of an optical wiring. The flex rigid substrate section is provided with an electric wiring. The optical wiring means has an end face substantially perpendicular to the optical wiring means. The end face is arranged facing an optical element mounting region provided on the rigid section, and at least a part of the flex section is fixed on the rigid section.01-29-2009
20110243496NARROW SURFACE CORRUGATED GRATING - Narrow surface corrugated gratings for integrated optical components and their method of manufacture. An embodiment includes a grating having a width narrower than a width of the waveguide on which the grating is formed. In accordance with certain embodiments of the present invention, masked photolithography is employed to form narrowed gratings having a desired grating strength. In an embodiment, an optical cavity of a laser is formed with a reflector grating having a width narrower than a width of the waveguide. In another embodiment an integrated optical communication system includes one or more narrow surface corrugated gratings.10-06-2011
20110116737OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a flexible optical waveguide layer, selectively forming a reinforcing clad on one surface of the optical waveguide layer and forming a mirror groove on the other surface of the optical waveguide layer in accordance with where the reinforcing clad is formed. Thus, the clad can be formed thick only on the place where the mirror groove is to be formed, and thus a flexible optical wiring board having flexibility can be manufactured even though the optical wiring board is generally made thin.05-19-2011
20110116736OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having an optical waveguide layer with a mirror groove formed on one surface thereof and a first insulation layer stacked on one surface of the optical waveguide layer and having a through-hole connected with the mirror groove formed thereon, forming a metal mirror layer connected from the mirror groove to an inner wall of the through-hole and forming an electrode pad on a side of the other surface of the optical waveguide layer, in which the electrode pad is disposed in accordance with the position of the metal mirror layer.05-19-2011
20090214158Optical Printed Circuit Board and An Optical Module Connected to the Optical Printed Circuit Board - An optical printed circuit board having an optical waveguide of at least one channel formed therein is provided. The optical waveguide of the at least one channel is stacked in the optical printed circuit board, and has both ends exposed on a surface of the optical printed circuit board and a predetermined length. An optical module is provided which can be optically aligned with the optical printed circuit board or another optical component through guide pins inserted into guide holes.08-27-2009
20090214159METAL WAVEGUIDE DEVICE AND NANO PLASMONIC INTEGRATED CIRCUITS AND OPTICAL INTEGRATED CIRCUIT MODULE USING THE SAME - Disclosed is a metal waveguide device, and nano plasmonic integrated circuits and an optical integrated circuit module using the same. The nano plasmonic integrated circuit module includes an input coupling unit, an input focusing unit, a surface plasmon polariton waveguide for guiding surface plasmon polaritons, a signal sensing/processing unit, an output defocusing unit, and an output coupling unit for converting surface plasmon polariton signals into optical signals. The optical integrated circuit module includes the nano plasmonic integrated circuit module, thus realizing highly integrated photonic circuits having a micro structure, low power consumption and low price.08-27-2009
20090214156Optical module and optical waveguide - An optical module includes an optical waveguide including a waveguide core through which light propagates and a clad configured to trap the light in the waveguide core, and a circuit board on which a surface-type optical element is mounted. The optical waveguide further includes a reflective surface from which an end face of the waveguide core is exposed, the reflective surface being provided on an inclined face at one end face of the optical waveguide core in an extending direction of the waveguide core, and an element mount opening provided in the clad such as to be opposite from the reflective surface, the element mount opening having a size such as to contain the optical element. The optical waveguide is mounted on the circuit board while the optical element is contained in the element mount opening and is aligned with the reflective surface of the optical waveguide.08-27-2009
20110116738ELEMENT MOUNTED DEVICE AND METHOD FOR MANUFACTURING ELEMENT MOUNTED DEVICE - An element mounted device comprising a substrate with a pedestal and a convex portion whose height is lower than the pedestal on the surface, and a first element mounted on the pedestal and fixed to the substrate by a first AuSn solder.05-19-2011
20090208166THREE-DIMENSIONAL PERIODIC STRUCTURE INCLUDING ANTI-REFLECTION STRUCTURE AND LIGHT-EMITTING DEVICE - The three-dimensional structure includes a first waveguide (line defect) in a three-dimensional photonic crystal formed by periodically arranging first and second media, which causes light to propagate therein in a first guide mode, a second waveguide (line defect) in the three-dimensional photonic crystal, which causes light to propagate therein in a second guide mode, reflective portions provided in the first and second waveguides to reflect parts of the lights propagating in the first and second waveguides, and 08-20-2009
20110243495METHOD FOR FORMING MIRROR-REFLECTING FILM IN OPTICAL WIRING BOARD, AND OPTICAL WIRING BOARD - An aspect of the present invention is directed to a method for forming a mirror-reflecting film on a waveguide in an optical wiring board, characterized in that a multilayer film, in which a base, a metal layer and an adhesive layer are layered in this order, is used, and the metal layer is transferred and bonded to an inclined face for mirror-reflecting film formation provided on the waveguide, with the adhesive layer of the multilayer film intervening. The present invention provides a method which, when forming a mirror-reflecting film on a waveguide in an optical wiring board, enables inexpensive and easy formation of the mirror-reflecting film, using the smallest quantity of metal possible and employing comparatively simple facilities and techniques.10-06-2011
20110243494SEMICONDUCTOR OPTICAL AMPLIFIER MODULE - Included are a semiconductor device unit in which a semiconductor optical amplifier and a first semiconductor photo detector being configured to monitor a part of an input light input to the semiconductor optical amplifier or a part of an output light output from the semiconductor optical amplifier are integrated on a mutually same substrate, and a passive waveguide unit connected to the semiconductor device unit and in which a first passive waveguide being configured to cause the input light to be input to the semiconductor optical amplifier or to cause the output light to be output from the semiconductor optical amplifier and a second passive waveguide branching from the first passive waveguide and being configured to cause a part of the input light or a part of the output light to be input to the first semiconductor photo detector are provided on a mutually same substrate.10-06-2011
20120243824OPTICAL RECEIVER - A tapered waveguide is provided for connection between an input waveguide and a photodiode. The width of the tapered waveguide increases as it extends from the input end that is connected to the input waveguide towards the output end that is connected to the photodiode. The tapered waveguide has an optimum half spread angle to cause higher-order mode excitation when receiving optical signal from the input waveguide. The photodiode either has a constant width or increases in width as it extends away from the output end of the tapered waveguide, its half spread angle being equal to or less than the half spread angle of the tapered waveguide.09-27-2012
20100142886OPTICAL ELEMENT MODULE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an optical element module 06-10-2010
20100220952MONITORING OF A LASER SOURCE WITH FRONT AND REAR OUTPUT PHOTODETECTORS TO DETERMINE FRONTAL LASER POWER AND POWER CHANGES OVER LASER LIFETIME - A power monitoring and correction to a desired power level of a laser or group of lasers utilizes two photodetectors which are employed to accurately determine the amount of output power from the front end or “customer” end of a laser or a plurality of such lasers. During power detection, which may be accomplished intermittently or continuously, the laser is modulated with a tone of low frequency modulation. One photodetector at the rear of the laser is employed to detect the DC value of the frequency tone, i.e., a value or number representative of the AC peak-to-peak swing, amplitude or modulation depth of the tone. Also, the rear photodetector may be employed to determine the optical modulation index (OMI). In either case, these values may be employed in a closed loop feedback system to adjust or otherwise calibrate the value of the low tone frequency relative to the total desired bias current applied to the laser. A front photodetector is employed to receive a portion of the total output of the laser, or of each laser, and the average output power of the laser, or of each laser, is determined from already knowing the optical modulation index (OMI) via the rear photodetector. Thus, by measuring and/or calibrating the laser OMI with the use of a rear photodetector, the average output power from the front end output can be unambiguously determined from detection of the AC peak-to-peak swing or amplitude of the low frequency tone received via the front photodetector.09-02-2010
20090092355Optical devices with multiple wafers containing planar optical wavequides - A method for fabricating an optical device wherein the device comprises a first substrate wafer with at least one buried optical waveguide on an approximately flat planar surface of the substrate and a second substrate wafer with at least a second buried optical waveguide. The waveguides so formed may be straight or curved along the surface of the wafer or curved by burying the waveguide at varying depth along its length. The second wafer is turned (flipped) and bonded to the first wafer in such a manner that the waveguides, for example, may form an optical coupler or may cross over one another and be in proximate relationship along a region of each. As a result, three-dimensional optical devices are formed avoiding the convention techniques of layering on a single substrate wafer.04-09-2009
20090214155Integrated optical modulator - An integrated optical modulator comprising: an insulating substrate (08-27-2009
20090052835MULTILAYER WIRING BOARD - The present invention provides a multilayer wiring board in which warpage during reflow soldering can be reduced even if there is no sufficient space for disposing a dummy pattern or if a dummy pattern cannot be disposed. A difference between the ratios of copper remaining in wiring layers causes a difference between the amounts of thermal expansion of the wiring layers. The fiber bundle content of at least one resin base material layer is made different from that of the other resin base material layers, to cause a difference between the amounts of thermal expansion of the resin base material layers. This difference between the amounts of thermal expansion of the resin base material layers is used to cancel the difference between the amounts of thermal expansion of the wiring layers. Thus, warpage of the board during reflow soldering is reduced.02-26-2009
20090257707Optical/Electrical Mixed Mounting Substrate - The present invention provides a hybrid optical/electrical circuit board in which an optical waveguide prepared by an exposing and developing step is combined with an electric circuit, wherein a printed wiring board containing an inorganic filler and a light absorber is used, and it has an optical waveguide core pattern having a high resolution and makes it possible to raise a density of optical wiring.10-15-2009
20090263076Charge-Based Memory Cell For Optical Resonator Tuning - An optical resonator configured to be tuned using a charge-based memory cell includes an optical cavity configured to transmit light and receive injected charge carriers; a charge-based memory cell in proximity to or within the optical cavity, the memory cell containing a number of trapped charges which influence the resonant optical frequency of the optical resonator. A method of tuning an optical resonator includes applying a voltage or current to a charge-based memory cell to generate a non-volatile charge within the memory cell, the nonvolatile charge changing a resonant frequency of the optical resonator.10-22-2009
20120243825OPTICAL DEVICE - An optical device (09-27-2012
20100054658Bi-Rate Adaptive Optical Transfer Engine - One embodiment of the present invention provides a system for the transmission of data between an optical bus and an electronic component at a speed independent from a clock speed of the electrical component; the system comprising an optical data storage component communicating with both the optical bus and the electrical component; the optical data storage component being configured to hold data transmitted on the optical bus until said electrical component is available.03-04-2010
20110176765OPTICAL INTERCONNECTION APPARATUS AND METHOD - The present invention relates to the apparatus and method for optical interconnection. The present invention provides an optical interconnection structure comprising: a substrate on which double side perforated multi-hole through a predetermined region is formed; bottom hole which is etched and tapered for optical fiber array is bigger than upper hole which is etched for the optical devices. The present invention provides the optical interconnection structure that can facilitate the optical interconnection between the active optoelectronic devices that transmit/receive the optical signals and the optical fiber array, making it possible to align easily and acutely between the optical devices and optical fiber array.07-21-2011
20090028495ELECTRO-OPTICAL HYBRID CONNECTION ASSEMBLY - An electro-optical hybrid connection assembly provides an optical connection of at least a first optical fiber and a second optical fiber that define a fiber axis and an electrical connection of at least a first electrical conductor and a second electrical conductor. The assembly includes a first connector and a second connector. The first connector includes a first ferrule that encloses the first optical fiber, a centering sleeve surrounding the first ferrule and projecting beyond at least one end of the first ferrule, and at least one electrical plug-in contact connected to the first electrical conductor. The second connector includes a second ferrule enclosing the second optical fiber, and at least one electrical plug-in contact connected to the second electrical conductor. Each of the two optical fibers has a plane fiber end aligned at right angles to the fiber axis and provided with an anti-reflection coating.01-29-2009
20090028494Optical waveguide, package board having the same, and manufacturing method thereof - An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.01-29-2009
20090028493Plasmon-enhanced electromagnetic-radiation-emitting devices and methods for fabricating the same - Various embodiments of the present invention are directed to surface-plasmon-enhanced electromagnetic-radiation-emitting devices and to methods of fabricating these devices. In one embodiment of the present invention, an electromagnetic-radiation-emitting device comprises a multilayer core, a metallic device layer, and a substrate. The multilayer core has an inner layer and an outer layer, wherein the outer layer is configured to surround at least a portion of the inner layer. The metallic device layer is configured to surround at least a portion of the outer layer. The substrate has a bottom conducting layer in electrical communication with the inner layer and a top conducting layer in electrical communication with the metallic device layer such that the exposed portion emits surface-plasmon-enhanced electromagnetic radiation when an appropriate voltage is applied between the bottom conducting layer and the top conducting layer.01-29-2009
20090028491INTERCONNECT STRUCTURE - An interconnect structure includes an insulative web having a first surface and a second surface; a logic device secured to the second surface of the insulative web; a frame panel assembly including a frame base having a first surface and a second surface, a first frame insulative layer disposed between the frame base first surface and the insulative web second surface, an aperture extending through the frame base and first frame insulative layer, wherein at least a portion of the logic device is disposed within the aperture, and a first frame connector disposed between a first electrically conductive layer located on the frame base first surface, and a second electrically conductive layer located on a surface of the first frame insulative layer; a device connector disposed between an I/O contact on a surface of the logic device and a third electrical conductor located on a surface of the insulative web; and an insulative layer connector that is disposed between the third electrical conductor located on a surface of the insulative web and the second electrically conductive layer located on a surface of the first frame insulative layer.01-29-2009
20110085760OPTICAL DEVICES AND METHODS OF FABRICATING THE SAME - Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer and an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.04-14-2011
20110075965Channeled Substrates For Integrated Optical Devices Employing Optical Fibers - A channeled substrate for forming integrated optical devices that employ optical fibers and at least one active optical component is disclosed. The channeled substrate includes a substrate member having an upper surface one or more grooves formed therein, and a transparent sheet. The transparent sheet, which is preferably made of thin glass, is fixed to the substrate member upper surface to define, in combination with the one or more grooves, one or more channels. The channels are each sized to accommodate an optical fiber to allow for optical communication through the transparent sheet between the active optical component and the optical fibers. Channeled substrates formed by molding and by drawing are also presented. Integrated optical devices that employ the channeled substrate are also disclosed.03-31-2011
20110075966Optical Interconnect - An optical interconnect has first and second substantially perpendicular optical waveguides and an optical grating disposed between and evanescently coupled to the waveguides. The optical grating includes a plurality perforated rows that are oriented at an angle of approximately 45 degrees with respect to the first and second optical waveguides.03-31-2011
20110069925MACRO-CHIP INCLUDING A SURFACE-NORMAL DEVICE - A multi-chip module (MCM) is described. This MCM includes two substrates having facing surfaces. Disposed on a surface of a first of these substrates, there is an optical waveguide, having an eigenmode in the plane of the surface, and an optical coupler, which redirects optical signals to and/or from the optical waveguide and a direction normal to the surface. Furthermore, disposed on a surface of a second of the substrates, which faces the surface of the first substrate, and which overlaps the optical coupler, there is an optoelectronic device. This optoelectronic device, which has an eigenmode in a direction perpendicular to the surface of the second substrate, selectively receives or provides the optical signal to and/or from the optical coupler. For example, the selective receiving or providing may be controlled by selectively applying a potential to the quantum-well device, thereby changing the optical properties of the optoelectronic device.03-24-2011
20120201492OPTICAL BRANCHING ELEMENT AND OPTICAL BRANCHING CIRCUIT, AND MANUFACTURING METHOD THEREOF - Provided are an optical branching element and an optical branching circuit and a manufacturing method thereof, which have high production tolerance and capability of setting an optional optical branching rate, and are suitable for use in optical integrated circuits.08-09-2012
20110255822LOW-POWER, BROADBAND OPTICAL SWITCH - An optical switch is described that includes two optical waveguides, which are defined in a semiconductor layer, positioned proximate to an intermediate component, such as a micro-resonator or a directional coupler. Material underneath a portion of either or both optical waveguides is removed so that the portion of either or both optical waveguides is free standing, and a group of electrodes is proximate to the free-standing portion of either or both optical waveguides. During operation of the optical switch, a spacing-control circuit applies an electrical signal to the group of electrodes. An electrostatic force associated with the electrical signal modifies a spacing between the free-standing portion of either or both optical waveguides and the intermediate component, thereby substantially increasing optical coupling between either or both optical waveguides and the intermediate component to convey a broadband optical signal between the optical waveguides.10-20-2011
20100080505ARRANGEMENT FOR THE ELECTRO-OPTICAL CONTROL AND FAST MODULATION OF THz TRANSMITTERS AND THz MEASURING SYSTEMS - An inexpensive and compact arrangement for the electrical control and fast modulation of THz transmitters and THz measuring systems is proposed, wherein said arrangement is stable, requires no mechanical movements and operates with a purely electric control, consumes little power and also has a high speed potential for the phase modulation. This is achieved by replacing the components known from the state of the art, namely two lasers, the beam splitters, the couplers and the mechanically moved delay line, with a compact monolithic or hybrid integrated chip (04-01-2010
20100098374OPTOELECTRONIC COMPONENT BASED ON PREMOLD TECHNOLOGY - An optoelectronic component, arrangement and method are provided. The optoelectronic component comprises a premold casing having a mounting opening adapted for mounting an optical element, particularly a waveguide, an electromagnetic radiation source and/or detector adapted for generating and/or detecting electromagnetic radiation and being mounted in the premold casing, an electromagnetic radiation deflecting element mounted in the premold casing and adapted for deflecting electromagnetic radiation between the waveguide and the electromagnetic radiation source and/or detector, and a transparent medium filling at least a part of optical spaces within the premold casing.04-22-2010
20080247705Hermaphroditic u-guide alignment structures and method thereof - An integrated optical waveguide circuit apparatus having an optical processing area, waveguide ports for optical processing, and at least one waveguide structure, the at least one waveguide structure going around the optical processing area. Methods for making the integrated optical waveguide circuit apparatus are also disclosed.10-09-2008
20080247704PACKAGE SUBSTRATE AND DEVICE FOR OPTICAL COMMUNICATION - A package substrate according to an embodiment of the present invention comprises: 10-09-2008
20080247707OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF CONTROLLING THE SAME - An optical semiconductor device includes a waveguide and a refractive index control portion. The waveguide has one or more first segments, one or more second segments and a plurality of third segments. The first segment has a region that includes a diffractive grating and another region that is a space region combined to the region. The second segment has a region that includes a diffractive grating and another region that is a space region combined to the region. A length of the second segment is different from that of the first segment. The third segment has a region that includes a diffractive grating and another region that is a space region combined to the region. A length of the third segment is shown as L10-09-2008
20080247706OPTO-ELECTRONIC BOARD - An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.10-09-2008
20090324165MANUFACTURING METHOD OF OPTICAL DEVICE AND OPTICAL DEVICE - A method of manufacturing an optical device involves forming patterns on a dielectric substrate. The patterns include a waveguide pattern having a folded part, a conductor pattern positioned on an outer peripheral side of the folded part, and a dummy pattern that connects the folded part and the conductor pattern. The method further involves performing heat diffusion processing on the dielectric substrate on which the patterns have been formed at the forming, to make the waveguide pattern into an optical waveguide.12-31-2009
20090310903Optical Element, Integrated Optic Device and Optical Information Transmission System - In a compact formed by subjecting an ultrafine particle brittle material supplied on a substrate to mechanical impact force as a load, whereby the ultrafine particle brittle material is crushed and joined to each other, manganese is added into the ultrafine particle brittle material to form the compact.12-17-2009
20110150386PHOTONIC INTEGRATED CIRCUIT HAVING A WAVEGUIDE-GRATING COUPLER - A photonic integrated circuit (PIC) having a waveguide-grating coupler with two evanescently coupled waveguides. The first waveguide is fabricated using materials suitable for manufacturing active optical elements in the PIC. The second waveguide is fabricated using materials capable of providing a relatively high index-of-refraction contrast for the constituent waveguide grating. The waveguide-grating coupler is compatible with the III-V semiconductor technology while being relatively easy to fabricate on an industrial scale.06-23-2011
20120201491Grating Assisted Surface Emitter Laser Coupling For Heat Assisted Magnetic Recording - An apparatus includes a waveguide, a laser diode positioned adjacent to the waveguide and having an active region producing light in a plane substantially parallel to a plane of the waveguide, a first grating positioned to couple light out of the laser diode and to direct the light toward the waveguide, a reflective layer positioned adjacent to a side of the first grating opposite to the waveguide, and a second grating having the same period as the first grating and positioned to couple light into the waveguide. A data storage device that includes the apparatus is also provided.08-09-2012
20080304788Broadband Light Source Having a Microstructured Optical Fiber for Endoscopic and Fluorescence Microscopic Examination Devices, in Particular for Special Devices for Optical Biopsy - The invention relates to an arrangement for generating a broadband spectrum that can be used in particular as a light source for short coherence interferometry and confocal microscopy as well as endoscopic short coherence interferometry and endoscopic confocal microscopy. The arrangement comprises a laser, in particular a laser diode, for generating a short light pulse of wavelength λ12-11-2008
201102558243-D WAVEGUIDE COUPLING DEVICE CAPABLE OF TWO-STEP COUPLING AND MANUFACTURE METHOD THEREOF - The present invention relates to a 3-D waveguide coupling device capable of two-step coupling and a manufacture method thereof, the 3-D waveguide coupling device comprises: a first substrate, at least one waveguide layer, at least one assisting grating, at least one coupling material layer, and at least one 3-D tapered structure layer, wherein 3-D waveguide coupling device is able to couple the light into the waveguide layer by way of two-step coupling through the 3-D tapered structure layer, the coupling material layer and the assisting grating. Moreover, the light can also be coupled out from the waveguide layer through the assisting grating, the coupling layer, and the 3-D tapered structure. The manufacture method is adapted to fabricate the 3-D waveguide coupling device capable of two-step coupling via the present semiconductor process technology without increasing any other new equipment.10-20-2011
20120201493Optical Printed Circuit Board and Method for Manufacturing the Same - Provided are an optical printed circuit board and a method for manufacturing the same. The optical printed circuit board includes a printed circuit board and an optical connecting module. The printed circuit board is provided with at least one or more inner layers, and a circuit pattern electrically connecting the inner layers. The optical connecting module is embedded in the printed circuit board and includes an optical transmitting portion, an optical receiving portion, and an optical waveguide connecting the optical transmitting portion and the optical receiving portion. The printed circuit board defines an align pattern region, such that tops of the optical transmitting portion and the optical receiving portion are formed lower than a surface of the printed circuit board.08-09-2012
20110007998OPTICAL WAVEGUIDE, OPTO-ELECTRONIC CIRCUIT BOARD, AND METHOD OF FABRICATING OPTO-ELECTRONIC CIRCUIT BOARD - An optical waveguide includes first cores provided on a first clad layer, second cores provided on a second clad layer, and a common clad layer interposed between the first and second clad layers and opposing the first and second cores, and the first cores are separated from the second cores.01-13-2011
20110026877SEMICONDUCTOR DEVICE ASSEMBLY - A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.02-03-2011
20110026878Optical I/O Array Module and Its Fabrication Method - In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.02-03-2011
20110026874Surface state gain - A gain medium may be arranged to provide energy to a surface state.02-03-2011
20100284647Optical ribbon cable attachment mechanism for the backside of a circuit board - A low-profile, mass-producible, unitary injection molded optical ribbon attachment structure includes a ribbon retaining portion, a light reflecting portion, and a plurality of lens portions. An end portion of a fiber optic ribbon cable is disposed in a ribbon retaining groove in the ribbon retaining portion. The unitary structure is fixed onto a bottom major surface of a circuit board. In a transmit application, light emitted from an optoelectronic component disposed on a top major surface of the circuit board passes down through a hole or slit in the circuit board, into one of the lens portions, then reflects off a planar light reflecting surface of the light reflecting portion and is redirected approximately ninety degrees, and then passes substantially parallel to the bottom major surface of the circuit board and enters the end of the fiber optic ribbon cable. In a receive example, light passes the opposite direction.11-11-2010
20110110623OPTICAL WAVEGUIDE FILM, LAMINATED TYPE OPTICAL WAVEGUIDE FILM, OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE ASSEMBLY, OPTICAL WIRING LINE, OPTICAL/ELECTRICAL COMBINATION SUBSTRATE AND ELECTRONIC DEVICE - An optical waveguide film includes at least one optical waveguide area having an X-direction and a Y-direction orthogonal to the X-direction. Such an optical waveguide film includes a plurality of core portions arranged side by side within the same layer so as to extend along the X-direction, each of the core portions having side surfaces, and the core portions adjoining to each other in the Y-direction being arranged through a gap therebetween; and a plurality of cladding portions provided so as to cover the side surfaces of each of the core portions, each of the cladding portions formed of a resin having an optical refractive index smaller than that of each of the core portions, and the cladding portion between the adjoining core portions providing each gap. In the optical waveguide film, a size of the gap between the adjoining core portions varies along the X-direction in at least a part of the optical waveguide area. This makes it possible to precisely match a gap between core portions in a cut end surface with a desired value by selection of cutting positions of the optical waveguide film even when the optical waveguide film is shrunken.05-12-2011
20090297094All-optical modulation and sdwitching with patterned optically absorbing polymers - All-optical processing devices that include patterned optically active polymers. The devices that are constructed according to principles of the invention include at least one optical input port and at least one optical output port, respectively configured to accept optical input signals and provide optical output signals. The devices include optically active material such as organic polymers that interact with illumination at a first wavelength to change at least one optical property in a non-linear manner. The optically active polymer can be placed adjacent one or more waveguides that allow the input illumination to propagate. As the optical property of the optically active material is changed by the incident illumination, the propagating illumination undergoes a modulation or change in phase, thereby providing an optical output signal having a desired relation to the optical input signal, such as the result of a logical or a computational operation.12-03-2009
20110064353METHOD OF MANUFACTURING OPTICAL PATH CHANGE OPTICAL CONNECTOR, AND OPTICAL PATH CHANGE OPTICAL CONNECTOR - A method of manufacturing an optical path change optical connector, the method including: resin-molding a core part, the core part including an optical-fiber-hole-formed portion having an optical fiber hole, and a positioning structure portion for positioning the core part with respect to the circuit board; inserting an optical fiber into the optical fiber hole; and over-molding the core part with light-transmitting resin, covering a front end face of the optical-fiber-hole-formed portion and forming an inclined internal reflective surface opposite to the front end face of the optical-fiber-hole-formed portion, such that the inclined internal reflective surface is positioned to reflect light between the optical fiber inserted into the optical fiber hole and an optical element disposed on a circuit board on which the core part is mounted.03-17-2011
20110135251WAVELENGTH-TUNABLE OPTICAL TRANSMITTER - A first exemplary aspect of the present invention is a wavelength-tunable optical transmitter including: a semiconductor substrate (06-09-2011
20110135250MANUFACTURING METHOD OF OPTO-ELECTRIC HYBRID MODULE AND OPTO-ELECTRIC HYBRID MODULE OBTAINED THEREBY - A manufacturing method of an opto-electric hybrid module which is capable of suppressing losses in cost, and an opto-electric hybrid module obtained thereby. An optical waveguide portion W06-09-2011
20110135249OPTICAL TRANSMISSION MODULE, ELECTRONIC INSTRUMENT, METHOD FOR ASSEMBLING OPTICAL TRANSMISSION MODULE, AND OPTICAL TRANSMISSION METHOD - An optical transmission module has an optical transmission path in which optical transmission is performed between a first circuit board and a second circuit board disposed opposite the first circuit board. The optical transmission path has a folded structure having a bending radius. A circumferential portion drawn by the bending radius is provided substantially perpendicular to board surfaces of the first circuit board and the second circuit board.06-09-2011
20110052118Fabrication Method of Optical Wiring Board and Optical Printed Circuit Board - The fabrication of an optical wiring board is performed in the following manner: A core member 03-03-2011
20110052117INTEGRATED CIRCUIT WITH PINS AT MULTIPLE EDGES OF A CHIP - An improved integrated circuit (IC) layout is described that provides conductive pads on opposite sides of a substrate. The conductive pads provide for connectivity to the chip in different chip orientations. Accordingly, multiple chips having the same layout can be provided in a package, instead of providing each chip with a different layout. Since the same layout may be used for each chip, manufacturing costs are reduced.03-03-2011
20110097035BROADBAND WAVELENGTH MULTIPLEXING AND DEMULTIPLEXING FILTER AND OPTICAL SPLITTER WITH OPTICAL SIGNAL MULTIPLEXING AND DEMULTIPLEXING FUNCTION - Two Mach-Zehnder optical interferometer circuits 04-28-2011
20110097034MOUNTING STRUCTURE - A mounting structure includes an optoelectronic interconnection module that includes electrical interconnection lines, optical interconnection lines, optical semiconductor device and electrical connection terminals, a mounting board that includes electrical interconnection lines and electrical connection terminals on a main surface and on which the optoelectronic interconnection module is mounted, and a connection member that electrically connects, adheres and fixes the electrical connection terminals and the electrical connection terminals. The optoelectronic interconnection module comprises a circuit area on which the optical semiconductor device is mounted and electrical connection terminals are formed and an interconnection area that is formed in a region other than the circuit area and in which the optical interconnection lines and electrical interconnection lines are formed, and the electrical connection terminals are formed on the interconnection area side rather than the optical semiconductor device.04-28-2011
20110097033FOCUSING MEMBER AND OPTOELECTRONIC DEVICE - A focusing member and an optoelectronic device having the same are provided. The focusing member includes multiple levels of conductive plugs and multiple levels of conductive layers that together form an inversed half-boat shape. The optoelectronic device includes a bottom layer, an optical waveguide above the bottom layer, a dielectric layer covering the optical waveguide, and the above focusing member disposed at an edge of the optoelectronic device and located in the dielectric layer above the optical waveguide. A wider end of the inversed half-boat shape of the focusing member faces the outside of the optoelectronic device. The refractive indexes of the bottom layer and the dielectric layer are smaller than that of the optical waveguide.04-28-2011
20100215313OPTICAL INTERCONNECTION ASSEMBLED CIRCUIT - An optical interconnection assembled circuit capable of reducing the number of parts and components, as well as the number of manufacturing processes and capable of mounting those parts and components at a high density in an optical module, thereby realizing a low price. The optical interconnection assembled circuit includes a substrate including plural optical waveguides having partial tapered surfaces respectively, as well as an optical element array facing each of the tapered surfaces. In the optical interconnection assembled circuit, the tapered surfaces and the optical element array are fastened so that they face each other and the optical elements of the optical element array are staggered in disposition.08-26-2010
20100215312OPTICAL CONNECTOR - An optical connector includes an optical element to be optically connected to an optical fiber; and an optical component. The optical component includes an element fixation part configured to fix the optical element to the optical component; a ferrule attachment part to which a ferrule having the optical fiber connected thereto is to be attached; and a lens to face the optical fiber when the ferrule is attached to the ferrule attachment part. The optical element is positioned relative to the optical fiber in response to attachment of the ferrule to the ferrule attachment part.08-26-2010
20110176764INTEGRATED PLANAR POLYMER WAVEGUIDE FOR LOW-LOSS, LOW-CROSSTALK OPTICAL SIGNAL ROUTING - The present invention provides a planar waveguide. In one embodiment, the planar waveguide includes first and third layers formed above a substrate and adjacent each other. The first and third layers are formed of a first material having a first index of refraction. The planar waveguide also includes a second layer formed between the first and third layers of a second material having a second index of refraction that is larger than the first index of refraction. The planar waveguide further includes a plurality of organo-functional siloxane based resin or polymer waveguides formed in the second layer. Each organo-functional siloxane based resin or polymer waveguide has an input on one edge of the second layer and an output on one edge of the second layer so that the input and output are on different line-of-sight paths. The plurality of organo-functional siloxane based resin or polymer waveguides is formed such that intersections of the plurality of organo-functional siloxane based resin or polymer waveguides occur at approximately right angles.07-21-2011
20100166364INTEGRATED SILICON-BASED NONLINEAR PHOTODETECTOR - Disclosed is a system including an integrated silicon-based structure including a microcavity configured to receive optical energy from an input beam carrying an optical signal and absorb the optical energy by a nonlinear multi-photon absorption process. For example, the multi-photon absorption process can be two-photon absorption (TPA). The integrated silicon-based structure further includes electrodes responsive to the nonlinear multi-photon absorption process in the microcavity for producing an electronic signal indicative of the optical signal. A related method is also disclosed.07-01-2010
20100166361BURIED DUAL TAPER WAVEGUIDE FOR PASSIVE ALIGNMENT AND PHOTONIC INTEGRATION - A buried dual taper waveguide has a flat surface after taper processing thus facilitating further processing with more complex photonic integrated circuits. This allows for light coupling between a large core size fiber and a small waveguide photonic integrated circuit. The taper structure disclosed enables monolithic integration of silicon photonic components and passive alignment for low-cost packaging.07-01-2010
20100166360ACID BLOCK FOR HYBRID SILICON DEVICE PROCESSING COMPATIBLE WITH LOW-LOSS WAVEGUIDES - An acid-stop structure for a rib waveguide comprises a fin structure formed between the sidewalls in each rib channel of the rib waveguide, thereby preventing acids and other etchants from flowing down the rib channel and under a die that has been bonded to a wafer.07-01-2010
20100166362OPTICAL WAVEGUIDE, OPTICAL MODULE, METHOD OF PRODUCING OPTICAL MODULE, AND METHOD OF PRODUCING OPTICAL WAVEGUIDE - An optical waveguide comprising: a waveguide core through which light propagates; a cladding that surrounds the waveguide core and has a refractive index that is less than the refractive index of the waveguide core; a metal layer that is formed on a surface of at least one end of the optical waveguide in a longitudinal direction, the surface being inclined so as not to be perpendicular to the longitudinal direction; and a channel that is formed at a portion of an outer surface of the cladding, the outer surface forming an acute angle with the inclined surface, and the channel being positioned such that light entering the optical waveguide adjacent the channel is reflected by the inclined surface into the waveguide core.07-01-2010
20100158437CHANNEL ASSEMBLIES - A method of forming a waveguide is disclosed, as well as the waveguide itself. A multilayer stack of light guiding layers is formed, and the multilayer stack is delaminated between light guiding layers to form a waveguide between the light guiding layers. The multilayer stack is delaminated in a patterned region between light guiding layers. Here a new approach is described, wherein hollow microchannels forming a Bragg waveguide assembly are fabricated by controlled formation of thin film delamination buckles within a multilayer stack. A hollow waveguide is formed by alternating layers of the multilayer stack forming light guiding surfaces. The hollow waveguide is formed between layers that delaminate from each other, as for example under applied stress to one or more of the layers. The multi-layer stack may be formed of alternating layers of low and high index of refraction materials, as for example forming omni-directional dielectric reflectors. Metal cladding of the waveguiding layers is also provided in one embodiment, as for example by providing a metal base layer and a cap layer. Methods of assembly are disclosed, as well as the assemblies themselves.06-24-2010
20100158436LOW STRESS PACKAGE - Consistent with the present disclosure, a package is provided in which the PLC substrate, for example, is bonded to the underlying carrier though a limited contact area. The rest of the substrate is detached from the carrier so that stresses are applied to a limited portion of the PLC substrate. The PLC itself, however, is provided over that portion of the substrate that is detached from the carrier, and thus experiences reduced stress. Accordingly, high modulus adhesives, as well as solders, may be used to bond the PLC substrate to the carrier, thereby resulting in a more robust mechanical structure.06-24-2010
20100195953OPTICAL WAVEGUIDE DEVICE, MANUFACTURING METHOD THEREFOR, OPTICAL MODULATOR, POLARIZATION MODE DISPERSION COMPENSATOR, AND OPTICAL SWITCH - An optical waveguide device includes: a substrate which has an electro-optical effect; an optical waveguide which is formed on the substrate and/or inside the substrate; and an in-substrate electrode which is formed of a metal and provided inside the substrate.08-05-2010
20100195951MULTI-LAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A multi-layer structure and a method for manufacturing the multi-layer structure are provided. The multi-layer structure includes: a waveguide including one or more light coupling regions having a refractive index gradient; at least one organic material based active optical element disposed above the waveguide; wherein the one or more light coupling regions is configured to change characteristics of light propagating in the waveguide; wherein at least one of the one or more light coupling regions is configured to enhance light coupling between the waveguide and the active optical element.08-05-2010
20100195954MULTILAYER PRINTED CIRCUIT BOARD - A multilayer printed circuit board including insulating layers, conductor circuits formed between the insulating layers, and optical circuits formed between the insulating layers and including a first optical circuit. The first optical circuit is positioned on a first outermost insulating layer of the insulating layers, and the insulating layers, conductor circuits and optical circuits are layered to form a multilayer structure having a first surface and a second surface on an opposite side of the first surface such that the multilayer structure is structured to mount optical elements on the first surface and second surface of the multilayer structure, respectively.08-05-2010
20100067848FABRICATION METHOD OF OPTICAL MODULE AND OPTICAL MODULE USING THE SAME METHOD - A fabrication method of an optical module comprises a mixed/hybrid optical alignment method, and an optical module uses the same fabrication method using an optical element chip such as a light source chip or a photodetector chip, etc. on an optical wiring substrate and making it possible to simultaneously secure mass productivity that is the advantage of the passive alignment method according to the related art and alignment accuracy that is the advantage of the active alignment method.03-18-2010
20100067846OPTICAL CONVERTER AND METHOD FOR MANUFACTURING THE SAME - An optical converter comprises: a first waveguide, a second waveguide, and a tapered waveguide arranged between both the waveguides, wherein heights of a core of the first waveguide and a core of the second waveguide are different; both ends in a direction of wave guiding of a core of the tapered waveguide are respectively connected to the core of the first waveguide and the core of the second waveguide; cross-sectional shapes and refractive indexes of cores of two waveguides that are connected change continuously or in a stepwise manner at each connection part; and a cross-sectional shape and refractive index of the core of the tapered waveguide change continuously or in a stepwise manner along a direction of wave guiding.03-18-2010
20110188802OPTICAL WAVEGUIDE BOARD - An optical waveguide board includes: an optical waveguide configured to transmit an optical signal to and from a light receiving element and a light emitting element; wiring patterns that are electrically connected with the light receiving and emitting elements, respectively; and supporting members disposed on the wiring patterns on sides of end parts of the optical waveguide, the supporting members supporting the light receiving and emitting elements, respectively; wherein each of the supporting members includes: a conduction portion that electrically connects a corresponding one of the light receiving and emitting elements and the wiring pattern; and a smooth surface configured to reflect the optical signal appearing between the corresponding one of the light receiving and emitting elements and the optical waveguide.08-04-2011
20090175573Photonic Integrated Circuits having Chirped Elements - Consistent with the present disclosure, optical devices are provided along different optical paths in a photonic integrated circuit (PIC). The optical components have different optical losses associated therewith so that optical signals propagating in the optical paths have desired power levels, which may be uniform, for example.07-09-2009
20090175572Photonic crystal having heterostructure and optical device using the photonic crystal - The present invention has been made for providing a photonic crystal capable of multiplexing or demultiplexing light within a wavelength band having a certain width. It includes a slab-shaped body 07-09-2009
20100166363OPTICAL WAVEGUIDE SUBSTRATE AND SUBSTRATE MOUNTING PHOTOELECTRIC HYBRID CIRCUIT - There are provided a substrate mounted with a photoelectric hybrid circuit having an optical path conversion mirror structure and optical waveguide wiring by reducing the number of parts and the number of fabrication steps, as well as most effectively implement high-density wiring for an optical connection between the optical waveguide and the photoelectric conversion element or optical waveguide array connector that are formed on the substrate, and a device. An optical waveguide layer 07-01-2010
20110188801SEMICONDUCTOR HOLLOW-CORE WAVEGUIDE USING PHOTONIC CRYSTAL GRATINGS - A semiconductor hollow-core waveguide using high-contrast gratings or photonic crystal claddings and a method of manufacturing the same includes providing a layered semiconductor structure; creating an etching mask pattern over the layered semiconductor structure; performing a combined cycled directional etching process on the layered semiconductor structure in one sequence and in one lithography level to create a 3-dimensional waveguide structure; and creating a hollow air core in the layered semiconductor structure by removing to define a shape of the waveguide. The etching process comprises vertically etching a series of deep trenches on the layered semiconductor structure with precise control and varying the width of the trench. Furthermore, the hollow air core is created by removing a portion of the sacrificial material located in the center of the waveguide and under the waveguide.08-04-2011
20110135248PRINTED CIRCUIT BOARD ELEMENT AND METHOD FOR THE PRODUCTION THEREOF - The invention relates to a printed circuit board element (06-09-2011
20120027339OPTICAL BUS FOR OPTICAL SIGNAL BROADCASTING - An optical bus is described for optical signal broadcasting. The optical bus can include a substrate and input optical waveguides formed on the substrate. First and second sets of output optical waveguides can also be formed on the substrate. Optical power splitters on the substrate can have an input and multiple outputs. The optical power splitters can be optically coupled to an input optical waveguide and can split an input optical beam into multiple output optical beams. The optical bus can include a waveguide shuffle network formed on the substrate. The waveguide shuffle network can include intersecting optical waveguides and can optically couple outputs from each of the optical power splitters to the first set of output optical waveguides and optically couple different outputs from each of the optical power splitters to the second set of output optical waveguides.02-02-2012
20100021107Optical device - An optical device includes: a multilayer structure substrate on which plural insulating layers are stacked and a wiring pattern is formed between layers; a recessed part for exposing the wiring pattern between the layers by cutting off a part of the multilayer structure substrate; an optical element mounted within the recessed part in electric conduction to the wiring pattern exposed by the recessed part; and an optical waveguide member forming an optical path for the optical element and guiding light along a surface of the multilayer structure substrate.01-28-2010
20110216999OPTICAL PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An optical printed circuit board is provided. The optical printed circuit board includes an insulation member, an optical fiber disposed in the insulation member and having opposite end portions exposed to a side of the insulation member, and at least one supporting member provided with a guide portion coupled to the opposite end portions of the optical fiber and guiding bending of the optical fiber.09-08-2011
20110216998OPTICAL SUB-ASSEMBLY - Described is a new wafer scale optical sub-assembly (OSA) and a method of production of such an OSA. Also described are optical wafers which form the central building block for the OSAs. The optical wafers comprise embedded optical features, which are positioned with reference to a single reference fiducial so as to avoid stacking of alignment errors. The embedded optical features may include refractive and/or waveguide optical channels. Cross-talk reduction features may also be provided between the embedded optical features. Embedding the optical features within the optical wafers protects the optical features from damage or contamination. The design of the optical features allows both transmit and receive functionality and arrays of optical devices to be packaged together.09-08-2011
20110216997Sub-Micron Planar Lightwave Devices Formed on an SOI Optical Platform - A set of planar, two-dimensional optical devices is able to be created in a sub-micron surface layer of an SOI structure, or within a sub-micron thick combination of an SOI surface layer and an overlying polysilicon layer. Conventional masking/etching techniques may be used to form a variety of passive and optical devices in this SOI platform. Various regions of the devices may be doped to form the active device structures. Additionally, the polysilicon layer may be separately patterned to provide a region of effective mode index change for a propagating optical signal.09-08-2011
20100322551Silicon based optical vias - Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.12-23-2010
20120308176Thermally Compensated Arrayed Waveguide Grating Assemblies - Arrayed waveguide grating can have one or both slab waveguides with relatively sharply folded optical paths and a mirror that provides the folding of the path. The folded optical paths through the slab waveguides can result in a more compact geometry of the waveguides through the device as well as smaller slab waveguides such that the device can be formed with a significantly smaller overall footprint. Also, arrayed waveguide gratings that cooperate with pivotable mirrors can adjust light passage through the waveguide in response to temperature changes to provide for thermally compensated operation of the device. Thus, very compact planar lightwave circuits filters are described that provide thermally compensated operation.12-06-2012
20090263074DISTRIBUTED FEEDBACK LASER ARRAY - The present invention provides a low-cost, high-bandwidth optical laser array where subsequent streams of data are injected in a serial fashion. The invention permits the creation of multiple channels of data on a single optical substrate without the use of costly multiplexer arrays to consolidate various optical signals. Further, the serial array eliminates the need for the parallel alignment of optical data sources, such as lasers, and instead allows for the serial alignment of the optical data sources, resulting in decreased footprint applications.10-22-2009
20100002988Optical Isolator - Various optical isolator embodiments are disclosed. Embodiments comprise a waveguide section utilizing materials that induce a propagation constant shift that is propagation-direction-dependent. Embodiments are characterized by a cutoff frequency for forward propagating waves that is different than the cutoff frequency for reverse waves; the dimensions and direction of magnetization of the waveguide can be tailored so that, in a particular embodiment, the cutoff frequency for forward propagating waves is lower than the cutoff frequency for reverse waves. A particular embodiment is constructed as a single-mode waveguide on a substrate. The cross-section of the waveguide is inhomogeneous in terms of materials. At least one part of the cross-section is a non-reciprocal magneto-optic medium, which has nonzero off-diagonal permittivity tensor components. This inhomogeneity induces a propagation constant shift, which is propagation-direction-dependent. This device works as an optical isolator from the cut-off frequency of the lowest forward wave (lower frequency) to one for the lowest reverse wave (higher frequency). Various configurations consistent with the principles of the invention are disclosed.01-07-2010
20120039565Beam Combiner - A beam combiner is disclosed that comprises a planar lightwave circuit that is based on undoped silicon nitride-based surface waveguides, wherein the planar lightwave circuit comprises a plurality of input ports, a mixing region, and an output port, and wherein the mixing region comprises a plurality of directional couplers that are arranged in a tree structure. Embodiments of the present invention are capable of combining a plurality of light signals characterized by disparate wavelengths on irregular spacings with low loss. Further, the present invention enables high-volume, low cost production of beam combiners capable of combining three or more light signals into a single composite output beam.02-16-2012
20120039564Photoelectric Integrated Circuit Devices And Methods Of Forming The Same - A photoelectric integrated circuit device may include a substrate including an electronic device region and an on die optical input/output device region, the substrate having a trench in the on die optical input/output device region; a lower clad layer provided in the trench, the lower clad layer having an upper surface lower than a surface of the substrate; a core provided on the lower clad layer; an insulating pattern provided on the core; an optical detection pattern provided on the insulating pattern, the optical detection pattern having at least a portion provided in the trench; and at least one transistor provided on the substrate of the electronic device region.02-16-2012
20120039563METHOD FOR PRODUCING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE, AND PHOTOELECTRIC COMPOSITE WIRING BOARD - (1) A method for producing a flexible optical waveguide, containing: a step of forming a first cladding layer; a step of forming a first core layer by laminating a resin film for forming a core layer on at least one end portion of the first cladding layer; a step of forming a second core layer by laminating a resin film for forming a core layer on an entire surface of the first core layer and the first cladding layer; a step of forming a core pattern by patterning the first and second core layers; and a step of embedding the core pattern by forming a second cladding layer on the core pattern and the first cladding layer, (2) a flexible optical waveguide containing a lower cladding layer, a core part and an upper cladding layer, the upper cladding layer having a width that is smaller than a width of the lower cladding layer at least in a bent portion, and is equal to or smaller than a width of the lower cladding layer in an end portion, and the lower cladding layer having a width in a bent portion that is equal to or smaller than a width thereof in an end portion, and a method for producing the same. A flexible optical waveguide that is excellent in bending durability and has small optical loss, and a method for producing the same.02-16-2012
20120039562Proximity Free Space Optical Interconnect - A system employs a flexible optical media, two connectors, and a mechanism such as a magnet that brings the connector together when the connectors are close to each other. The optical media is able to guide optical signals, and one connector is attached to an end of the optical media. Each connector also has alignment features and provides paths for the optical signals. The alignment features of each connector are shaped to mate with the alignment features of the other connector and to shift the connectors relative to each other as the mechanism pushes the connector together. The alignment features further have seated positions at which the paths in one connector are aligned with the paths in the other connector and separated by a free space gap.02-16-2012
20120148187INTEGRATED CIRCUIT PACKAGE CONNECTED TO A DATA TRANSMISSION MEDIUM - An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L06-14-2012
20120148185RECEPTACLE-TYPE BI-DIRECTIONAL OPTICAL MODULE AND ELECTRONIC APPARATUS THEREOF - A receptacle-type bi-directional optical module includes an optical connector, a bi-directional optical sub-assembly (BOSA), and a flexible printed circuit board. The bi-directional optical sub-assembly is detachably coupled to the optical connector. The bi-directional optical sub-assembly includes a transmitter end and a receiver end. The flexible printed circuit board includes a board body, a first connection part, and a second connection part. A first end of the board body is electrically connected to a printed circuit board. The first connection part is connected to a second end of the board body for electrically connecting to the transmitter end. The second connection part is connected to the edge of the first connection part for electrically connecting to the receiver end.06-14-2012
20120148186PROCESS FOR FABRICATING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES - A process for fabricating semiconductor devices provides a wafer of integrated circuits, permanently attaches an optical wafer to the wafer of integrated circuits, and temporarily attached a supporting wafer to the optical wafer. The supporting wafer provides structural support during further fabrication processes where a back side of the wafer of integrated circuits is thinned and through silicon vias are formed. The supporting wafer is then removed and the wafer of integrated circuits with the optical wafer is singulated into individual integrated-circuit chips.06-14-2012
20100195952MULTI-LAYER STRUCTURE - A multi-layer structure is provided. The multi-layer structure includes: a waveguide including a light coupling arrangement, wherein the light coupling arrangement is substantially non-wavelength selective; at least one light source disposed above the waveguide; and at least one photo detector disposed above the waveguide; wherein the at least one light source, the at least one photo detector and the waveguide include organic material, and wherein the waveguide, the light coupling arrangement, the at least one light source and the at least one photo detector are monolithically integrated.08-05-2010
20080273829Planar Lightwave Circuit, Design Method for Wave Propagation Circuit, and Computer Program - A planar lightwave circuit is provided which can be easily fabricated by an existing planar-lightwave-circuit fabrication process, which can lower the propagation loss of signal light and which can convert inputted signal light so as to derive desired signal light. A planar lightwave circuit having a core and a clad which are formed on a substrate, has input optical waveguide(s) (11-06-2008
20090142016PLASMONIC OPTICS FOR PLASMONIC CIRCUITS - According to one embodiment, a circuit element for a plasmonic circuit is formed using a dielectric layer having two portions, each characterized by a different electric permittivity. The dielectric layer is adjacent to a metal layer, with the interface between the layers defining a conduit for propagation of surface plasmons. A dielectric boundary between the two portions of the dielectric layer is shaped to enable the circuit element to change one or more of propagation direction, cross-section, spectral composition, and intensity distribution for a beam of surface plasmons received by the circuit element.06-04-2009
20110064354OPTO-ELECTRIC HYBRID MODULE AND METHOD OF MANUFACTURING THE SAME - An opto-electric hybrid module capable of shortening the distance between a light-emitting section or a light-receiving section of a semiconductor chip and a reflecting surface formed in a core to reduce optical losses between an opto-electric conversion substrate section and an optical waveguide section, and a method of manufacturing the same. A recessed portion (03-17-2011
20110064355WAVEGUIDE DEVICE AND MODULE - Excess optical power in a waveguide device is appropriately terminated. According to one embodiment of the present invention, the waveguide device comprises a termination structure filled with a light blocking material for terminating light from the end section of a waveguide. This termination structure can be formed by forming a groove on an optical waveguide by removing the clad and core, and filling the inside of that groove with a material attenuating the intensity of the light (light blocking material). In this manner, light that enters into the termination structure is attenuated by the light blocking material, and influence on other optical devices as a crosstalk component can be suppressed. With such termination structure, not only the influence on optical devices integrated on the same substrate, but also the influence on other optical devices directly connected to that substrate can be suppressed.03-17-2011
20090175574Optical device - An optical device wherein an optical waveguide is formed on a dielectric substrate, the optical device includes an input part and an output part where the optical waveguide and corresponding optical fibers are connected. A stress layer is provided for at least one of the input part and the output part. The stress layer applies a stress to the optical waveguide so that an index of refraction of the optical waveguide is reduced.07-09-2009
20110317957Optical flexible printed circuit board with optical waveguides and method manufacturing the same - The present invention provides an optical flexible printed circuit board comprising: a base layer; an optical waveguide pattern disposed on a partial region of the base layer; an insulating layer which is disposed on the base layer with the optical waveguide pattern and has a surface profile bent by the optical waveguide pattern; and circuit wires disposed on one surface of the base layer.12-29-2011
20110317958Vent Structures For Encapsulated Components On An SOI-Based Photonics Platform - An silicon-on-insulator (SOI)-based photonics platform is formed to including a venting structure for encapsulating the active and passive optical components formed on the SOI-based photonics platform. The venting structure is used to allow for the encapsulated components to “breathe” such that water vapor and gasses will pass through the package and not condensate on any of the encapsulated optical surfaces. The venting structure is configured to also to prevent dust, liquids and other particulate material from entering the package.12-29-2011
20120045168FLEXIBLE OPTOELECTRONIC INTERCONNECTION BOARD AND FLEXIBLE OPTOELECTRONIC INTERCONNECTION MODULE - According to one embodiment, a flexible optoelectronic interconnection board includes a flexible electrical wiring board having electrical wires, reinforcing boards mounted on the flexible electrical wiring board and having flexibility lower than that of the flexible electrical wiring board, and a flexible optical interconnection board mounted on the flexible electrical wiring board and having optical interconnection lines. The flexible electrical wiring board includes a fixed portion whose flexibility is lowered by mounting the reinforcing boards and a movable portion other than the fixed portion and the flexible optical interconnection board is fixed on the fixed portions.02-23-2012
20120045167Multi-Tier Micro-Ring Resonator Optical Interconnect System - Systems and methods according to these exemplary embodiments provide for optical interconnection using dual micro-ring resonators in a multilayer structure. Multi-wavelength optical signals can be redirected on a wavelength-by-wavelength basis, or larger, from input ports on a first layer to output ports on a second layer of an optical device.02-23-2012
20120045166OPTICAL RIBBON AND METHOD OF FORMING SAME - An optical ribbon (02-23-2012
20120269480LASER MODULE MANUFACTURING METHOD AND LASER MODULE - An optical semiconductor element is held in a junction-up state at an approach start position that is isolated from a mount face of a planar lightwave circuit, and the top-face height of the optical semiconductor element and the surface height of the planar lightwave circuit are aligned by bringing the optical semiconductor element closer towards the mount face. Further, the height of the active layer of the optical semiconductor element is aligned with the height of a waveguide of the planar lightwave circuit by bringing the optical semiconductor element towards the mount face for an amount of a difference between a reference value of a distance on design from the surface of the planar lightwave circuit to the center of the waveguide and a reference value of a distance on design from the top face of the optical semiconductor element to the center of the active layer.10-25-2012
20120308175OPTICAL ISOLATOR USING PHASE MODULATORS - Various exemplary embodiments relate to an optical isolator in an integrated optical circuit including: a first optical modulator configured to provide a first periodic phase modulation on an input optical signal; a second optical modulator configured to provide a second periodic phase modulation on the modulated optical signal; and an optical waveguide having a length L connecting the first optical modulator to the second optical modulator; wherein the phase difference between the first and second periodic phase modulation is π/2, and wherein the length L of the optical waveguide causes a phase delay of π/2 on an optical signal traversing the optical waveguide.12-06-2012
20120002914RING RESONATOR BASED OPTICAL ISOLATOR AND CIRCULATOR - By introducing magneto-optical garnets with high Faraday rotation and low optical loss in a ring resonator, a nonreciprocal phase shift is generated to split the resonance wavelengths of clockwise and counter-clockwise modes under magnetic field. There are three main applications based on this nonreciprocal effect, optical isolators, optical circulators, and tunable optical filters. The concept of the tunable filters and the design of optical isolators for TE and TM modes are described in the paper. With proper optical ring isolator configurations, optical circulators can be realized.01-05-2012
20120002915Optical module and fabrication method - An optical module includes an optical waveguide that transmits and outputs signal light; a circuit board that transmits the signal light output from the optical waveguide, and includes a low refractive-index portion that neighbors and surrounds a transmissive portion and has a lower refractive index than the transmissive portion, which transmits the signal light; and a light-receiving element that includes, on a side toward the circuit board, a light-receiving portion that receives the signal light that has transmitted through the circuit board, where the signal light is reflected toward the light-receiving element at a boundary surface between the transmissive portion and the low refractive-index portion.01-05-2012
20120008897Single Mode Photonic Circuit Architecture and a New Optical Splitter Design Based on Parallel Waveguide Mode Conversion - The new single mode circuit (SMC) architecture is invented for photonic integrated circuits (PIC). This architecture allows using multimode waveguides or structures to construct a single mode operated PIC. The multimode sections used in such SMC based PIC possess strong lateral confinement so that the PIC can have high circuit density and high optical performance at the same time. A parallel mode converter structure is also invented here. Based on this parallel mode converter, a low loss optical splitter can be constructed for high index contrast waveguide system.01-12-2012
20120008896INTEGRATED OPTICS MODULE FOR MULTIPLEX TRANSCEVIER - The present invention relates to an integrate optics for multiplexer transceiver module, comprising: a substrate, a multiplexer, a first waveguide coupling device, a second waveguide coupling device and a third waveguide coupling device. In the present invention, the semiconductor materials and the semiconductor process are used to integrate variety of optical devices on a single semiconductor substrate (chip) by way of modular design and miniaturization, so as to carry out an integrated optics communication framework with high efficiency and low cost. Moreover, in the present invention, a plurality of optical receivers are integrated on the substrate by means of flip-chip bonding, so that, not only the objective of integrating the optical devices is accomplished but also the intensity of laser optical signal is increased.01-12-2012
20130011096OPTICAL WAVEGUIDE LAMINATED WIRING BOARD - A via hole is formed in a first cladding layer laminated on a wiring board. A conductive material is filled in the via hole so as to form a first conductor portion (a portion of a conductive via) having a mushroom-like shape projecting from a surface of the first cladding layer. Then, a second cladding layer is formed to cover the first conductor portion, the first cladding layer and a core layer, and a via hole is formed in the second cladding layer. A conductive material is filled in the via hole so as to form a second conductor portion (a remaining portion of the conductive via) connected to the first conductor portion.01-10-2013
20090092354RECEIVER PHOTONIC INTEGRATED CIRCUIT (RXPIC) CHIP UTILIZING COMPACT WAVELENGTH SELECTIVE DECOMBINERS - A monolithic receiver photonic integrated circuit (RxPIC) chip includes a plurality of optical signal channels together with other active elements integrated on a semiconductor chip, which chips further include a wavelength selective decombiner comprising a supergrating or an Echelle grating which provides for a more compact chip compared to an integrated on-chip arrayed waveguide grating (AWG) functioning as a wavelength selective decombiner.04-09-2009
20120014641OPTICAL-ELECTRICAL WIRING BOARD AND OPTICAL MODULE - The invention relates to an optical-electrical wiring board (01-19-2012
20120014639PACKAGED MULTICORE FIBER OPTICAL TRANSCEIVER MODULE - A method and structure for coupling to a plurality of multicore optical fiber strands. A first plurality of optoelectronic devices is provided on a surface of a substrate, the first optoelectronic devices being arranged in a 2D array pattern that corresponds to a 2D array pattern corresponding to different light cores of a first multicore optical fiber. A second plurality of optoelectronic devices is provided on the surface of the substrate, the second optoelectronic devices being arranged in a 2D array pattern that corresponds to a 2D array pattern corresponding to different light cores of a second multicore optical fiber. Each optoelectronic device on the substrate surface provides one of a receive function and a transmit function for interacting with a corresponding core of a multicore optical fiber strand.01-19-2012
20120014640METHOD OF MANUFACTURING OPTICAL WAVEGUIDE CORE, METHOD OF MANUFACTURING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE, AND OPTOELECTRIC COMPOSITE WIRING BOARD - In order to provide a method of efficiently manufacturing an optical waveguide core having an endface inclined at a predetermined angle, the following method of manufacturing an optical waveguide core is employed. The method includes: a core material layer forming step of forming a core material layer formed of a photosensitive material on a surface of a cladding layer that has been formed on a substrate; a high refractive index substance covering step of covering a surface of the core material layer with a substance having a refractive index higher than 1 by bringing the high refractive index substance into close contact with the core material layer surface; an exposure step of pattern exposing the core material layer in a predetermined core-forming shape to from a core by irradiating the core material layer on a side covered with the high refractive index substance with exposure light inclined at a predetermined angle with respect to the cladding layer surface; a high refractive index substance removing step of removing the high refractive index substance from the surface of the core material layer exposed in the exposure step; and an development step of developing the core material layer from which the high refractive index substance has been removed in the high refractive index substance removing step so as to form the core having an inclined endface.01-19-2012
20120057816METHOD AND SYSTEM FOR HETEROGENEOUS SUBSTRATE BONDING OF WAVEGUIDE RECEIVERS - A composite integrated optical device includes a substrate including a silicon layer and a waveguide disposed in the silicon layer. The composite integrated optical device also includes an optical detector bonded to the silicon layer and a bonding region disposed between the silicon layer and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region. The metal-assisted bond includes an interface layer positioned between the silicon layer and the optical detector. The bonding region also includes a direct semiconductor-semiconductor bond at a second portion of the bonding region.03-08-2012
20120114281SYSTEM AND METHOD FOR FREE-SPACE OPTICAL INTERCONNECTIONS - Optical interconnect systems and methods are disclosed. An optical interconnect system includes a substrate, a first waveguide, and a free-space coupling structure. The first waveguide is disposed on the substrate. The free-space coupling structure is adjacent the first waveguide. The free-space coupling structure redirects light propagating through the first waveguide in a first direction out of the first waveguide in a second direction different from the first direction. An optical interconnect method comprises transmitting light through a first waveguide in a first direction; and redirecting the light out of the first waveguide in a second direction different from the first direction with a free-space coupling structure disposed in the first waveguide.05-10-2012
20120114280OPTICAL PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING AN OPTICAL PRINTED CIRCUIT BOARD - A method of manufacturing an optical printed circuit board and an optical printed circuit board. The method includes providing a support layer having one or more optical waveguides formed on the support layer, the waveguides having exposed interfaces. A film is provided on one or more of the exposed interfaces, wherein the film has a smoother outer surface than the waveguide interface.05-10-2012
20120020612OPTICAL INTERCONNECT - An optical interconnect device including a first printed wiring board, a second printed wiring board facing the first printed wiring board, a light-emitting device positioned on the first printed wiring board and electrically connected to the first printed wiring board, a light-receiving device positioned on the second printed wiring board and electrically connected to the second printed wiring board such that the light-receiving device faces the light-emitting device and receives an optical signal transmitted in a direct line from the light-emitting device, and an electrical-connection device mounted on the first printed wiring board and the second printed wiring board such that the first printed wiring board is electrically connected to the second printed wiring board.01-26-2012
20120155797PHOTONIC INTEGRATED CIRCUIT HAVING A PLURALITY OF LENSES - Disclosed is a photonic integrated circuit having a plurality of lenses and a method for making the same. The photonic integrated circuit is comprised of optical circuitry fabricated over an underlying circuitry layer. In some embodiments, the optical circuitry includes a dielectric material having recesses disposed within, layers of a light waveguide material deposited within the recesses, and lenses disposed over each layer of waveguide material. The underlying circuitry layer may include, for example, a semiconductor wafer as well as circuitry fabricated during front end of line (FEOL) semiconductor manufacturing such as, for example, sources, gates, drains, interconnects, contacts, resistors, and other circuitry that may be manufactured during FEOL processes. The underlying circuitry layer may also include circuitry manufactured during back end of line semiconductor manufacturing processes such as, for example, interconnect structures, metallization layers, and contacts.06-21-2012
20120155799Silicon-Based Opto-Electronic Integrated Circuit With Reduced Polarization Dependent Loss - A silicon-based opto-electronic circuit is formed to exhibit reduced polarization-dependent loss by strategically placing the photodetecting device as close as possible to the entry point of the optical signal into the opto-electronic circuit arrangement. While the incoming optical signal will include both TE and TM modes, by minimizing the length of the optical waveguide path along which the signal must propagate before reaching a photodetector, the attenuation associated with TM mode signal will be negligible.06-21-2012
20120155798INTEGRATED OPTICAL DEVICE INCLUDING SUBSTRATES STACKED ALONG AN OPTICAL AXIS THEREOF - An optical device includes a first substrate having a first top surface and a first bottom surface, a second substrate having a second top surface and a second bottom surface, and a spacer substrate between substantially planar portions of the second top surface and the first bottom surface. The spacer, first, and second substrates seal an interior space between the second top surface of the second substrate and the first bottom surface of the first substrate. At least two of the first, second, and spacer substrates are aligned and secured on a wafer level. An optoelectronic element is within the interior space. An optical axis of the optical device extends through one of the first top and bottom surfaces and the second top and bottom surfaces. An electrical interconnection extends from the optoelectronic element to outside the interior space.06-21-2012
20120301073INTEGRATED SILICON PHOTONIC ACTIVE OPTICAL CABLE COMPONENTS, SUB-ASSEMBLIES AND ASSEMBLIES - Integrated silicon photonic active optical cable assemblies (ACOAs), as well as sub-assemblies and components for AOCAs, are disclosed. One component is a multifiber ferrule configured to support multiple optical fibers in a planar array. The multifiber ferrule is combined with a flat top to form a ferrule sub-assembly. Embodiments of a unitary fiber guide member that combines the features of the multifiber ferrule and the flat top is also disclosed. The ferrule sub-assembly or the fiber guide member is combined with a photonic light circuit (PLC) silicon substrate with transmitter and receiver units to form a PLC assembly. The PLC assembly is combined with a printed circuit board and an electrical connector to form an ACOA. An extendable cable assembly that utilizes at least one ACOA is also described.11-29-2012
20090028496ELECTRO-OPTICAL PRINTED CIRCUIT BOARD, A BLANK AND A METHOD OF MAKING AN ELECTRO-OPTICAL PRINTED CIRCUIT BOARD - The invention provides a method of making an electro-optical printed circuit board, the method comprising: providing a support layer having thereon surface mounted electric components within a region of the support layer; forming one or more surface mounted optical components on the surface of the electro-optical printed circuit board; and during formation of the one or more surface mounted optical components shielding the region of the electro-optical printed circuit board where the surface mounted electric components are formed.01-29-2009
20090028492OPTICAL WAVEGUIDE RING RESONATOR WITH AN INTRACAVITY ACTIVE ELEMENT - An optical resonator, a photonic system and a method of optical resonance employ optical waveguide segments connected together with total internal reflection (TIR) mirrors to form a closed loop. The optical resonator includes the optical waveguide segments, an intracavity active element coupled to a designated one of the optical waveguide segments, the TIR mirrors and a photo-tunneling input/output (I/O) port. The photo-tunneling I/O port includes one of the TIR mirrors. The method includes propagating and reflecting the optical signal, or a portion thereof, in the optical resonator, transmitting a portion of the optical signal through the I/O port, and influencing the optical signal. The photonic system includes the optical resonator with optical gain and a source of an optical signal.01-29-2009
20120063717METHOD OF PRODUCING A PHOTONIC DEVICE AND CORRESPONDING PHOTONIC DEVICE - Method of producing a photonic device including at least one light source and at least one photodetector on a structure including a waveguide layer, this method comprising the following steps: a) growing successively on a substrate (03-15-2012
20120251037OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREFOR - Provided are an opto-electric hybrid board and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes notch portions for locating the electric circuit unit, which is formed in portions of at least one of an undercladding layer and an overcladding layer, and the notch portions are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions, which fit into the notch portions, and the bent portions are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other under a state in which the bent portions fit into the notch portions.10-04-2012
20120251036OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREFOR - Provided are an opto-electric hybrid board and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit using coupling pins. The optical waveguide unit includes fitting holes for fitting the coupling pins thereinto, which are formed in a surface of an overcladding layer, located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes fitting through holes for fitting the coupling pins therethrough, located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the coupling pins fit through the fitting through holes and fit into the fitting holes.10-04-2012
20120251039LASER DEVICE, METHOD OF MANUFACTURING THE SAME, LASER DEVICE ARRAY, LIGHT SOURCE AND LIGHT MODULE - Provided is a laser device comprising a substrate, an active layer, and a current confinement layer. The current confinement layer includes an oxide layer that is formed extending from a edge of the current confinement layer in a parallel plane parallel to a surface of the substrate, toward a center of the current confinement layer along the parallel plane, and that does not have an inflection point between the edge and a tip portion formed closer to the center or has a plurality of inflection points formed between the edge and the tip portion.10-04-2012
20090162008POLARIZATION-INDEPENDENT TWO-DIMENSIONAL PHOTONIC CRYSTAL MULTIPLEXER/DEMULTIPLEXER - The present invention is aimed at providing a two-dimensional photonic crystal wavelength multiplexer/demultiplexer capable of multiplexing and demultiplexing both TE and TM-polarized lights. In the wavelength multiplexer/demultiplexer, first and second resonators and having the same resonance wavelength λr are provided between first and second waveguides and which are separately provided in a two-dimensional photonic crystal having a photonic band gap for the TE polarization. A first polarization converter for converting a TM-polarized light to a TE-polarized light is provided on the first waveguide 06-25-2009
20110069926Communication Methods, Methods of Forming an Interconnect, Signal Interconnects, Integrated Circuit Structures, Circuits, and Data Apparatuses - Some embodiments include communication methods, methods of forming an interconnect, signal interconnects, integrated circuit structures, circuits, and data apparatuses. In one embodiment, a communication method includes accessing an optical signal comprising photons to communicate information, accessing an electrical signal comprising electrical data carriers to communicate information, and using a single interconnect, communicating the optical and electrical signals between a first spatial location and a second spatial location spaced from the first spatial location.03-24-2011
20090103858OPTICAL WAVEGUIDE FILM, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL TRANSMISSION AND RECEPTION MODULE - An optical waveguide film includes an optical waveguide film main body having an optical waveguide core through which light is propagated, and a cladding portion that encloses the optical waveguide core and has a lower refractive index than that of the optical waveguide core; and an electric wiring layer formed on at least a part of a principal surface of the optical waveguide film main body.04-23-2009
20110091152Suspension board with circuit and producing method thereof - A suspension board with circuit includes a circuit board including a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive layer formed on the insulating layer; and an optical waveguide provided in the circuit board. The optical waveguide is provided with a positioning portion for positioning the optical waveguide and a near-field light generation portion for generating a near-field light by a light applied from the optical waveguide.04-21-2011
20110091151INTEGRATED SEMICONDUCTOR OPTICAL DEVICE - An integrated semiconductor optical device includes first and second semiconductor optical devices. The first semiconductor optical device includes a first core layer, a first upper cladding layer including a first ridge portion, a first buried layer surrounding the first ridge portion, and a first adjusting layer provided between the first buried layer and the first ridge portion. The second semiconductor optical device includes a second core layer, a second upper cladding layer including a second ridge portion. The first semiconductor optical device and the second semiconductor optical device are arranged next to each other in a predetermined axis direction. The first core layer is joined to the second core layer by a butt joint method at a joint boundary between the first and second semiconductor optical devices. The first adjusting layer has a refractive index lower than a refractive index of the first core layer and higher than a refractive index of the first buried layer. The first adjusting layer extends in the predetermined axis direction. The first adjusting layer has a constant width from one end facet to the joint boundary.04-21-2011
20120207427OPTICAL MODULE CONNECTION DEVICE - A printed circuit board is pinched between end faces of a metal receptacle support member and a metal backup member in an optical-module plug portion, the flexible wiring board having a light emitting/receiving element unit, a reception chip portion, a driver element, and the like on a common planar surface thereof, such that the end face of the metal receptacle support member is in contact with a surface of the printed circuit board and that the driver element is in contact with the metal backup member.08-16-2012
20120207426FLIP-CHIP PACKAGING FOR DENSE HYBRID INTEGRATION OF ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS - A chip system and method includes a photonics chip and an electrical integrated circuit (IC) flip-chip coupled to the photonics chip to form an optochip. The IC or the photonics chip includes an array of bond pads for attachment to the other. The optochip has an array of bond pads for subsequent attachment to a carrier where the photonics chip includes an exposed edge to connect with at least one waveguide.08-16-2012
20100172610WAVEGUIDE DEVICES USING EVANESCENT COUPLING BETWEEN WAVEGUIDES AND GROOVES - An optical waveguide device (07-08-2010
20100172608OPTICAL DEVICE, OPTICAL SYSTEM, AND METHOD OF MANUFACTURING OPTICAL DEVICE - An optical device to be connected to an optical fiber and an optical system in which the optical fiber is fixed to the optical device are provided, which optical device and optical system can restrict variations in a distance between inclined surfaces for supporting the optical fiber, and can enhance a productivity of the optical device and system. The optical system according to the present invention is, for example an optical multiplexer/demultiplexer having an optical device according to the present invention, which device has a substrate (07-08-2010
20100172609METHOD AND DEVICE TO IMPROVE SIGNAL-TO-NOISE RATIO IN HIGH-SPEED OPTICAL DATA COMMUNICATIONS - There is described an opto-electronic Integrated Circuit Board (ICB) comprising an ICB substrate; a linear array of cells positioned on the ICB substrate, for optical connection to an array of optical fibers, each one of the cells comprising: a die bond pad and one of a Vertical Cavity Surface Emitting Laser (VCSEL) and a Photodetector; a number of ICB bond pads on the ICB substrate, the number of ICB bond pads corresponding at least to a number of cells in the linear array, wherein each successive ICB bond pad along the linear array is located on alternate sides of the linear array; and wirebonds each connecting, in a one-to-one relationship, each one of the ICB bond pads to a corresponding die bond pad of one of the cells of the linear array.07-08-2010
20110103738OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a first through-hole formed therein and the first through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer has a second through-hole formed therein and the second through-hole corresponds to the first through-hole, and forming a second clad layer by filling a second clad substance in the second through-hole, in which the second clad layer covers the core unit.05-05-2011
20110103737OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a through-hole formed therein and the through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, forming a second clad layer by filling a second clad substance in the through-hole, in which the second clad layer covers the core unit, and stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer covers the second clad layer.05-05-2011
20130170787OPTICAL COMMUNICATION SYSTEM HAVING TUNABLE SOURCES - Consistent with one example of the disclosed implementations, a photonic integrated circuit (PIC) may be provided that includes s group of lasers and an arrayed waveguide grating (AWG) disposed on a substrate. Each laser in the group may supply an optical signal, such that each optical signal has a different wavelength. Each laser may be tunable to at least two designated wavelengths, which are separated from one another by a free spectral range (FSR) of the AWG. As a result, the optical signals provided from each laser may be combined by the AWG, regardless of which designated wavelength the optical signals have. Accordingly, a PIC may be provided that has a relatively simple construction but can supply optical signals having tunable wavelengths.07-04-2013
20100290736OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE - Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide that has good thermal isolation from its surroundings. In particular, a portion of a semiconductor in the optical device, which includes the optical waveguide, is free standing above a gap between the semiconductor layer and the substrate. By reducing the thermal coupling between the optical waveguide and the external environment, the optical device can be thermally tuned with significantly less power consumption.11-18-2010
20100290735PHOTONIC INTEGRATED CIRCUIT HAVING BENT ACTIVE COMPONENTS - Consistent with the present disclosure, the number of passive waveguides in a PIC are reduced by directly connecting active components to one another. Accordingly, optical signals propagating in the PIC may experience less loss, and, thus, improved performance may be achieved. In addition, active components may be bent or curved in order to obtain a more compact layout with greater device density. Reduced manufacturing costs can therefore be realized.11-18-2010
20100092128Optical Transceiver module - An optical transceiver module includes a semiconductor laser that emits light along a first optical axis. A grating coupler, located in a plane including the first optical axis, diffracts the emitted light out of the plane and into an external optical system. A photodetector receives incoming light from the external optical system on a second optical axis that passes through the grating coupler at an angle to the plane. The photodetector can be placed parallel to the plane, directly above or below the grating coupler, to create an extremely compact optical transceiver module.04-15-2010
20120314991SEMICONDUCTOR DEVICES HAVING OPTICAL TRANSCEIVER - Semiconductor devices having an optical transceiver include a cladding on a substrate, a protrusion vertically extending trough the cladding and materially in continuity with the substrate, and a coupler on the cladding and the protrusion.12-13-2012
20120314992ELECTRONIC DEVICE HAVING OPTICAL COMMUNICATING PART - An electronic device includes a substrate having a first surface and a second surface, a semiconductor device disposed on a first region on the first surface of the substrate, a via structure penetrating the substrate, and including a conductor, an optical channel disposed in the via structure, and an optical-electrical converting device disposed at an end of the via structure, electrically connected to the semiconductor device through the conductor of the via structure, and optically connected to the optical channel.12-13-2012
20120121218PHOTONICS CHIP AND OPTICAL APPARATUS INCLUDING THE SAME - Provided are a photonics chip and an optical apparatus including the same. The chip may include a substrate, an optical waveguide, an optical coupler, and a plurality of alignment units. The optical waveguide is formed on the substrate. The optical coupler is formed at the optical waveguide. The alignment units align an optical connector which fixes at least one optical fiber coupled to the optical coupler, on the substrate.05-17-2012
20120257851OPTICAL LOGIC GATES USING SLOW-LIGHT BASED COUPLED PHOTONIC CRYSTAL WAVEGUIDES - An optical logic gate may be composed of a host material having air holes disposed therein and having parallel optical waveguides formed therein.10-11-2012
20100172611COMPACT PHOTONIC INTEGRATED CIRCUITS - According to this disclosure, embodiments of the present invention include photonic integrated circuits having active and passive geometric regions geometrically arranged to provide for more compact integrated photonic integrated circuits which, in turn, leads to higher chip yields and lower fabrication costs.07-08-2010
20100247033OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device in which light having a wavelength of 1.25 μm or greater is waveguided, includes: a first waveguide of embedded type that includes a semiconductor and is lattice-matched with InP, the first waveguide having a region having a first constant width equal to or greater than 1.50 μm and a first region narrower than the region; and a second waveguide of embedded type that includes another semiconductor having a refractive index different from that of the first waveguide, the second waveguide having a region having a second constant width smaller than 1.50 μm and a second region wider than said region. The first waveguide and the second waveguide are joined at an intermediate waveguide portion. The intermediate waveguide portion includes the first region and the second region and a joining plane on which the first region and the second region are joined. The joining plane has a width equal to or smaller than 1.35 μm.09-30-2010
20100247030OPTOELECTRONIC WIRING BOARD INCLUDING OPTICAL WIRING AND ELECTRICAL WIRING AND METHOD OF MANUFACTURING OPTOELECTRONIC WIRING DEVICE USING THE SAME - An optoelectronic wiring board includes an optical wiring, an electrical wiring, an optical input/output portion, a dummy optical input portion, and a dummy optical waveguide. The optical wiring includes an optical waveguide. The electrical wiring includes an electrically conductive material. The optical input/output portion transmits and detects optical signal with and from the optical waveguide, an optical semiconductor device or an external light guide being disposed on the optoelectronic wiring board. The dummy optical input portion provided adjacent to the optical input/output portion. The dummy optical waveguide is connected to the dummy optical input portion and has an optical end portion which is provided at an end opposite to the dummy optical input portion and absorbs or scatters light which is incident on the dummy optical input portion.09-30-2010
20100247032CAN TYPE OPTICAL MODULE - A CAN type optical module according to the present invention includes a stem (09-30-2010
20100247029THERMAL TUNING OF AN OPTICAL DEVICE - Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide with a high thermal resistance to the surrounding external environment and a low thermal resistance to a localized heater. In particular, the thermal resistances associated with thermal dissipation paths from a heater in the optical device to an external environment via electrodes and via the substrate are increased, while the thermal resistance between the optical waveguide and the heater is decreased.09-30-2010
20100247031OPTICAL WAVEGUIDE DEVICE, ITS MANUFACTURE METHOD, LASER MODULE AND OPTICAL TRANSMISSION SYSTEM - A first optical waveguide of a convex shape is formed over a substrate. A second optical waveguide of a convex shape is formed over the substrate. A multimode interference waveguide of a convex shape is formed over the substrate for optically coupling the first optical waveguide to the second optical waveguide. Either side of the first optical waveguide is filled with a filling material, but either side of the second optical waveguide is not filled with the filling material.09-30-2010
20100247034Passive Alignment Using Elastic Averaging In Optoelectronics Applications - In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.09-30-2010
20120213470OPTICAL WAVEGUIDE SUBSTRATE HAVING POSITIONING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING OPTO-ELECTRIC HYBRID SUBSTRATE - In the optical waveguide board, simultaneously with pattern formation of mirror members at arbitrary positions on a clad layer 08-23-2012
20120213468POLYSILICON PHOTODETECTOR, METHODS AND APPLICATIONS - A silicon photonic photodetector structure, a method for fabricating the silicon photonic photodetector structure and a method for operating a silicon photonic photodetector device that results from the photonic photodetector structure each use a strip waveguide optically coupled with a polysilicon material photodetector layer that may be contiguous with a semiconductor material slab to which is located and formed a pair of electrical contacts separated by the polysilicon material photodetector layer. Within the foregoing silicon photonic photodetector structure and related methods the polysilicon material photodetector layer includes defect states suitable for absorbing an optical signal from the strip waveguide and generating an electrical output signal using at least one of the electrical contacts when the optical signal includes a photon energy less than a band gap energy of a polysilicon material from which is comprised the polysilicon material photodetector layer.08-23-2012
20120213467OPTICAL DEVICE WITH ENHANCED MECHANICAL STRENGTH - An optical device implemented on a substrate (such as silicon) is described. This optical device includes a wavelength-sensitive optical component with a high thermal resistance to a surrounding external environment and a low thermal resistance to a localized thermal-tuning mechanism (such as a heater), which modifies a temperature of the wavelength-sensitive optical component, thereby specifying an operating wavelength of the wavelength-sensitive optical component. In particular, the thermal resistance associated with a thermal dissipation path from the thermal-tuning mechanism to the external environment via the substrate is increased by removing a portion of the substrate to create a gap that is proximate to the thermal-tuning mechanism and the wavelength-sensitive optical component. Furthermore, the optical device includes a binder material mechanically coupled to the substrate and proximate to the gap, thereby maintaining a mechanical strength of the optical device.08-23-2012
20120213466Optocoupler Circuit - An optocoupler device facilitates on-chip galvanic isolation. In accordance with various example embodiments, an optocoupler circuit includes a silicon-on-insulator substrate having a silicon layer on a buried insulator layer, a silicon-based light-emitting diode (LED) having a silicon p-n junction in the silicon layer, and a silicon-based photodetector in the silicon layer. The LED and photodetector are respectively connected to galvanically isolated circuits in the silicon layer. A local oxidation of silicon (LOCOS) isolation material and the buried insulator layer galvanically isolate the first circuit from the second circuit to prevent charge carriers from moving between the first and second circuits. The LED and photodetector communicate optically to pass signals between the galvanically isolated circuits.08-23-2012
20120213469OPTICAL BACKPLANE INTERCONNECTION SYSTEM AND COMMUNICATION DEVICE - Embodiments of the present invention provide an optical backplane interconnection system and a communication device. The optical backplane interconnection system includes a backplane, a front board, a rear board and a connector. The front board and the rear board locate on two sides of the backplane and are orthogonal to each other. The front board and the rear board are both disposed with an optical waveguide path which is interconnected through a connector connected to the backplane to form an optical path, so that optical signals can be transmitted through the optical path.08-23-2012
20120128291FORMATION OF REFLECTIVE SURFACES IN PRINTED CIRCUIT BOARD WAVEGUIDES - The present invention relates to an apparatus and method for creating an printed circuit board including one or more waveguides having one or more reflective surfaces. Waveguides are embedded within a printed circuit board. A reflective surface is formed within the embedded waveguides by mechanically milling the printed circuit board. The reflective surfaces enable intra chip, chip-to-chip, or chip-to-component optical interconnections through the waveguides embedded within the printed circuit board.05-24-2012
20120163752Method for manufacturing printed circuit board with optical waveguides - Disclosed herein is a method for manufacturing a printed circuit board with optical waveguides capable of reducing light loss by forming a bent portion having a changing pattern shape on a core layer and attaching a reflective member thereto to increase reflectivity. The method for manufacturing a printed circuit board with optical waveguides includes; (a) forming a lower clad layer on a base substrate; (b) applying a core material onto the lower clad layer; (c) performing exposure on the core material using a photo mask having a pattern; (d) performing development on the core material subjected to the exposure and forming a bent portion having a changing pattern shape to form a core layer; (e) applying an upper clad layer onto the lower clad layer having the core layer formed thereon; (f) performing exposure and development on the upper clad layer to expose a reflective portion of the machined bent portion to the outside; and (g) attaching a reflective member to the reflective portion exposed to the outside. Therefore, the bent portion having the changing pattern shape is machined to have a curved shape or an oblique shape and the reflective member is attached thereto, thereby making it possible to minimize light loss.06-28-2012
20100067849MANUFACTURING METHOD OF OPTICAL WAVEGUIDE DEVICE AND OPTICAL WAVEGUIDE DEVICE OBTAINED THEREBY - A manufacturing method of an optical waveguide device and an optical waveguide device obtained thereby. An under cladding layer is formed on the front surface of a colored-layer-coated PET substrate including a PET substrate portion and a colored layer of a color that absorbs irradiation light and formed on the back surface of the PET substrate portion, and then a photosensitive resin layer for the formation of cores is formed thereon. In forming the cores, when the irradiation light reaches the bottom surface of the PET substrate portion, most of the irradiation light is absorbed by the colored layer, so that there is little irradiation light reflected from the bottom surface of the PET substrate portion. This significantly reduces the irradiation light reflected diffusely from the PET substrate portion and reaching the photosensitive resin layer to thereby effectively suppress the surface roughening of the side surfaces of the cores.03-18-2010
20120314993BURIED-TYPE OPTICAL INPUT/OUTPUT DEVICES AND METHODS OF MANUFACTURING THE SAME - Optical input/output (I/O) devices, which include a substrate including a trench, a waveguide within the trench of the substrate; and a photodetector within the trench and optically connected to the waveguide. An upper surface of the photodetector is at a same level as an upper surface of the waveguide.12-13-2012
20120314994Process for Enhanced 3D Integration and Structures Generated Using the Same - An enhanced 3D integration structure comprises a logic microprocessor chip bonded to a collection of vertically stacked memory slices and an optional set of outer vertical slices comprising optoelectronic devices. Such a device enables both high memory content in close proximity to the logic circuits and a high bandwidth for logic to memory communication. Additionally, the provision of optoelectronic devices in the outer slices of the vertical slice stack enables high bandwidth direct communication between logic processor chips on adjacent enhanced 3D modules mounted next to each other or on adjacent packaging substrates. A method to fabricate such structures comprises using a template assembly which enables wafer format processing of vertical slice stacks.12-13-2012
20120314990OPTICAL WAVEGUIDE AND A METHOD OF FABRICATING AN OPTICAL WAVEGUIDE - There is provided an optical waveguide comprising an optical core having transverse sides, the optical core extending along a curved path; an optical cladding on the transverse sides of the optical core, wherein the distribution of the optical cladding on the transverse sides of the optical core is asymmetric about the centre of the core.12-13-2012
20120251041OPTICAL WAVEGUIDE DEVICE AND MODULE - In a waveguide device, unnecessary optical power is appropriately terminated. According to an embodiment of the present invention, the waveguide device has a termination structure filled with a light blocking material to terminate light from a waveguide end. In the termination structure, a cladding and a core are removed to form a groove on an optical waveguide. The groove is filled with a material (light blocking material) that attenuates the intensity of light. Thus, light input to the termination structure is attenuated by the light blocking material, suppressing crosstalk which possibly effects on other optical devices. Thus, such a termination structure can restrain crosstalk occurred in optical devices integrated in the same substrate and can also suppress crosstalk which possibly effects on any other optical device connected directly to the substrate.10-04-2012
20120170886OPTICAL FIBER COMMUNICATION APPARATUS - An optical fiber communication apparatus includes a laser diode, a light directing member, and an optical fiber. The laser diode is configured for emitting a laser beam along a first direction. The light directing member includes a converging lens portion and a reflecting surface. The converging lens portion is optically aligned with the laser diode and configured for converging the laser beam. The reflecting surface is obliquely oriented relative to a second direction and configured for reflecting the converged laser beam toward. The second direction is perpendicular to the first direction. The optical fiber is oriented along the second direction and configured for receiving the reflected converged laser beam.07-05-2012
20120224804SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device (and method thereof) includes an LSI chip, a package substrate, an optical element chip, and a flexible optical waveguide substrate. The LSI chip and the optical element chip are mounted on an upper surface of the package substrate. The optical element chip is electrically connected to the LSI chip through the package substrate. One end of the flexible optical waveguide substrate is optically coupled to the optical element chip, and the other end is arranged on a bottom surface side of the package substrate.09-06-2012
20120076454OPTICAL MODULE AND METHOD FOR MANUFACTURING THE SAME - A an optical module includes a circuit board provided with an optical element selected from a light-receiving element and/or a light-emitting element; a lens where light from the optical element passes through; an alignment mark serving as an indicator for alignment with the optical element; and an optical waveguide formed to input/output light into/from the optical element through the lens.03-29-2012
20100046882LOW LOSS LATERAL OPTICAL WAVEGUIDE INTERSECTIONS - A geometrically shaped optical waveguide crossing with minimal transmission loss is described. A symmetrically tapered waveguide intersection is used to minimize loss in the intersecting region where at least two optical waveguides cross one another. The present invention embodies a waveguide crossing that includes tapering the width of the waveguides as they approach the intersecting region, forcing the field of light to contract, reducing asymmetric field distortions, and thus reducing transmission loss and effectively minimizing crosstalk. This is accomplished by focusing light through a perpendicular or near perpendicular intersection by simple linear tapering rather than by the use of a lens or other previously used devices.02-25-2010
20080205817INTERCONNECTING (MAPPING) A TWO-DIMENSIONAL OPTOELECTRONIC (OE) DEVICE ARRAY TO A ONE-DIMENSIONAL WAVEGUIDE ARRAY - For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.08-28-2008
20080205816Integrating electrical layer on optical sub-assembly for optical interconnects - Briefly, in accordance with one or more embodiments, an optical/electrical interconnect may comprise an optical/electrical assembly having a flex panel formed thereon. The flex panel may include one or more electrical traces and/or contact pads to couple electrical traces on a substrate of the optical/electrical interconnect with an optoelectronic die disposed on the optical/electrical assembly. The flex panel may be formed on a molded sub-assembly panel via lamination, or the sub-assembly panel may be formed on the flex panel via an over-molding process, to form laminated sub-assembly panels. The laminated sub-assembly panels may be diced into one or more optical/electrical assemblies.08-28-2008
20100272388PHOTOELECTRIC CONVERSION MODULE - There is provided a photoelectric conversion module in which an optical device and an optical waveguide are arrayed in a horizontal direction, thereby improving the optical coupling efficiency and therefore, reducing light loss. To this end, the present invention provides a photoelectric conversion module comprising: a printed circuit board; an integrated circuit board mounted on the printed circuit board, wherein an optical waveguide array is positioned within the integrated circuit board so as to pass from one side to the other side of the integrated circuit board, and first and second electrode pads are positioned at one sidewall of the integrated circuit board; an optical device array wherein first and second electrode bumps to be respectively connected to the first and second electrode pads are positioned at one sidewall of the optical device array facing the integrated circuit board and an optical device is positioned in a middle part of the optical device array; and a semiconductor chip mounted on the is integrated circuit board.10-28-2010
20100272387Photonic crystal circuit comprising a guided mode adapter and optical system including said circuit coupled with an optical fiber - The invention relates to a photonic crystal circuit comprising a guide produced in a photonic crystal membrane on the surface of a substrate and a mode adapter coupled to said guide, wherein the membrane includes a central point constituting the mode adapter having a section gradient as termination of said guide, said point being suspended so as to allow the propagation of modes in a symmetrical manner.10-28-2010
20120251034MONOLITHIC INTEGRATION OF DIELECTRIC WAVEGUIDES AND GERMANIUM-BASED DEVICES - Various exemplary embodiments relate to an integrated optical device including: a semiconductor waveguide on a substrate; a dielectric waveguide on a substrate optically coupled to the semiconductor waveguide; and a germanium device on the semiconductor waveguide optically coupled to the semiconductor waveguide.10-04-2012
20100008620Optical Clock Signal Distribution Using Through-Silicon Vias - An integrated circuit structure includes a semiconductor chip including a front surface and a back surface; a via extending from the back surface of the semiconductor chip into the semiconductor chip, wherein the via is light transparent; and a photon detector in the semiconductor chip and exposed to the via.01-14-2010
20100008622OPTICAL WAVEGUIDE DEVICE AND MANUFACTURING METHOD THEREOF - An optical waveguide device includes: a substrate; an optical element arranged on the substrate; and an optical circuit part having an optical waveguide formed on the substrate. The optical circuit part includes: a core whose optical axis is matched with the optical element; and a dummy core arranged on a same layer to the core and exposed on a side being not opposed to the optical element when the optical element is arranged on the substrate. The relative position between the optical waveguide and the optical element can be recognized by observing the dummy core. The planar shape of the optical circuit has a convex portion. The width of the convex portion and the width of the optical element are same in the opposing edge face where the optical element and the core is opposed to one another.01-14-2010
20090067779FLEXIBLE OPTOELECTRIC INTERCONNECT AND METHOD FOR MANUFACTURING SAME - A flexible optoelectric interconnect includes: an optoelectric film, a driving IC, an optical semiconductor device, a heat dissipation plate and a thermally conductive material. The optoelectric film has an electrical interconnect layer made of a single layer and an optical interconnect layer including an optical waveguide core and an optical waveguide clad. The optoelectric film has a through hole extending from a major surface thereof to a rear surface opposite to the major surface. The driving IC is provided on the major surface of the optoelectric film and electrically connected to the electrical interconnect layer, and provided above the through hole in the optoelectric film. The optical semiconductor device is provided on the major surface of the optoelectric film and driven by the driving IC. The heat dissipation plate is provided on the rear surface of the optoelectric film and covering the through hole such that a part of the through hole is protruded from an outer edge of the driving IC in a view perpendicular to the major surface. The thermally conductive material is provided in the through hole and in contact with the driving IC and the heat dissipation plate.03-12-2009
20120314989OPTICAL TRANSCEIVER MODULE - An optical transceiver module includes a circuit board, at least two optical sub-assemblies, and an interface. The optical sub-assembly electrically connects with the circuit board and includes an optoelectronic component and an integrally-formed optical fiber. The interface electrically connects with the circuit board including a plurality of pins penetrating through the circuit board.12-13-2012
20090060414OPTICAL WAVEGUIDE DEVICE, OPTICAL MODULE AND METHOD OF ALIGNING OPTICAL AXES THEREOF - An optical waveguide device includes: a channel waveguide which is positioned at a predetermined height relative to a bottom surface of a substrate; and a slab waveguide having a cross-sectional shape wider than that of the channel waveguide, being positioned at a predetermined height relative to the channel waveguide. Initially, an input end face of the optical waveguide device is vertically scanned with a light beam to achieve optical coupling with the slab waveguide, followed by transversely scanning to achieve optical coupling with the channel waveguide, hence, alignment of an optical axis with a minute channel waveguide can be effected easily and quickly.03-05-2009
20090060415Fiber optic cavity - A novel Fabry-Perot resonance cavity has been recognized. This cavity is formed by simple planar and concave mirrors that attached at the fiber ends. The concave mirror is precisely aligned to the core of the fiber. The concave lens is fabricated on the thin polymer film by making an indentation of correct geometry and smoothness. The concave mirror has multiple dielectric layers applied on the concave lens to achieve the final, desired optical characteristics.03-05-2009
20120224803IMAGING LASER DIODES WITH A LIGHTWAVE CIRCUIT - A method for imaging light from a plurality of laser diodes (09-06-2012
20120224802IMAGING LASER DIODES WITH A LIGHTWAVE CIRCUIT - An apparatus for imaging light from a plurality of laser diodes (09-06-2012
20120082411HIGH VOLTAGE PHOTO SWITCH PACKAGE MODULE - A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces, and at least one light-input surface. First metallic layers are formed on the electrode-interface surfaces, and one or more optical waveguides having input and output ends are bonded to the substrate so that the output end of each waveguide is bonded to a corresponding one of the light-input surfaces of the photo-conductive substrate. This forms a waveguide-substrate interface for coupling light into the photo-conductive wafer. A dielectric material such as epoxy is then used to encapsulate the photo-conductive substrate and optical waveguide so that only the metallic layers and the input end of the optical waveguide are exposed. Second metallic layers are then formed on the first metallic layers so that the waveguide-substrate interface is positioned under the second metallic layers.04-05-2012
20120082412Communication Methods, Methods of Forming an Interconnect, Signal Interconnects, Integrated Circuit Structures, Circuits, and Data Apparatuses - Some embodiments include communication methods, methods of forming an interconnect, signal interconnects, integrated circuit structures, circuits, and data apparatuses. In one embodiment, a communication method includes accessing an optical signal comprising photons to communicate information, accessing an electrical signal comprising electrical data carriers to communicate information, and using a single interconnect, communicating the optical and electrical signals between a first spatial location and a second spatial location spaced from the first spatial location.04-05-2012
20120257852OPTICAL MODULE, MANUFACTURING METHOD OF OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE - An optical module includes: a substrate provided with a through hole for inserting an optical fiber from a second principal surface side of the substrate; an optical device provided on a first principal surface side of the substrate; a first electrode provided in the substrate for connecting an electric fiber from the second principal surface side; a second electrode formed on the first principal surface side of the substrate for connecting to the optical device; and a third electrode provided on a side surface of the substrate and electrically connected to the second electrode.10-11-2012
20120263410Device with multiple light sensors receiving light signals from a waveguide - The device includes a main waveguide on a base. The main waveguide is configured to guide a light signal through a light-transmitting medium. The device also includes multiple transition waveguides on the base. Each of the transition waveguide intersects a terminal end of the main waveguide such that each transition waveguide receives a different portion of the light signal from the main waveguide. The device also includes one or more light sensors positioned on the base. Each transition waveguide guides the received light portions to the one or more light sensors such that each of the light signal portions is received at the one or more light sensors.10-18-2012
20120263411OPTICAL CONNECTOR AND OPTICAL DEVICE HAVING THE SAME - Provided are an optical connector capable of improving optical alignment efficiency and an optical device having the same. The connector may include a body having a top surface and a bottom surface facing each other, through holes penetrating the body to connect the top and bottom surfaces, and alignment keys provided on at least side surface of the body to be parallel to the through holes.10-18-2012
20120263412Optical Printed Circuit Board and Method of Fabricating the Same - Provided are a photovoltaic apparatus and a manufacturing method thereof. The photovoltaic apparatus includes: substrate; a back electrode layer disposed on the substrate; a plurality of first intermediate layers disposed on the back electrode layer; a plurality of second intermediate layers disposed on the back electrode layer and each disposed between the first intermediate layers; light absorbing layers disposed on the first intermediate layers and the second intermediate layers; and a front electrode layer disposed on the light absorbing layer.10-18-2012
20090016672Producing Fluidic Waveguides - Fluidic waveguides have inward surfaces or areas that face each other, separated by a channel region that can be covered. For example, an integrally formed channel component can include two walls parts and a connecting part, with inward surfaces on the wall parts and, extending between them, a base surface; a covering component's lower surface can also extend between the inward surfaces, bounding the channel region; other fluidic, electrical, and optical components can also be attached. In a stack, the covering component can cover the first channel component, and the lower base surface of each preceding channel component can cover the following channel component. An integrally formed body of light-transmissive material can have a surface that includes a waveguide's inward areas and a base area between them; a covering component can be mounted on areas adjacent the inward areas, providing an enclosed channel region.01-15-2009
20090016674SILICON STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a silicon structure, includes: forming an on-substrate structure on a processed layer to have a continuously changing width on a parallel plane to the processed layer; and gradually removing a target portion of the processed layer on a silicon substrate, which is located directly beneath the on-substrate structure, by isotropic etching. The processed layer may be a surface layer of the silicon substrate, or a sacrifice layer formed on the silicon substrate.01-15-2009
20090016673OPTICAL COUPLING DEVICE AND METHOD FOR THE PRODUCTION THEREOF - An optical coupling device for the transmission of a signal from an input circuit to an output circuit. The optical coupling device comprises a transmission element connected to the input circuit to emit a signal, a reception element connected to the output circuit to receive the light signal and at least one printed circuit board for forming at least the input or the output circuit. The printed circuit board is provided between the transmission element and the reception element to electrically insulate the output circuit and the input circuit from each other. The light signal is transmitted from the transmission element to the reception element through the printed circuit board. Since commercially available printed circuit boards usually have a high dielectric strength, the resulting optocoupler is suitable for the electrical isolation of very high voltages such as those that frequently occur in electromedical devices.01-15-2009
20090016671MULTILAYER PRINTED CIRCUIT BOARD - The multilayer printed circuit board according to the present invention is a multilayer printed circuit board where at least one insulating layer, a conductor circuit and a plurality of optical circuits are formed and layered, wherein the optical circuits are formed and layered so as to be located in different layers.01-15-2009
20110123147OPTICAL TRANSMISSION MODULE, METHOD FOR MANUFACTURING OPTICAL TRANSMISSION MODULE, AND ELECTRONIC DEVICE - An optical transmission module has an optical wiring for transmitting light, and an optical element for irradiating a light incidence plane of the optical wiring with light and a control circuit component for driving light emission of the optical element based on an externally input electric signal, or an optical element for receiving light emitted from a light emitting surface of the optical wiring and converting to an electric signal and a control circuit component for amplifying the electric signal output from the optical element and outputting to the outside. A plurality of boards overlapped and stacked so as to form a step with each other is arranged. A first board stacked at one end in a stacking direction of the plurality of boards is mounted with the optical wiring and the optical element so as to sandwich both surfaces in the stacking direction, and a board surface on the first board side of a second board stacked at another end is mounted with the control circuit component.05-26-2011
20110123146Nano-wire Optical Block Devices For Amplifying, Modulating, And Detecting Optical Signals - A nano-wire optical block device for amplifying, modulating, and detecting an optical signal in a large-core hollow metallized waveguide. The nano-wire optical block device comprises a substrate with a plurality of nano-wires coupled to the substrate to form the nano-wire optical block. Each properly formed nano-wire is comprised of a p-doped region, an intrinsic region, and an n-doped region. The nano-wire optical block is operable to be inserted into the large-core hollow metallized waveguide to provide at least one of amplifying, modulating, and detecting the optical signal.05-26-2011
20110123145Suspension board with circuit - A suspension board with circuit includes a circuit board including a metal supporting board, an insulating layer formed on the metal supporting board, a conductive layer formed on the insulating layer, and an optical waveguide disposed on the circuit board. The optical waveguide includes an under clad layer, a core layer formed on the under clad layer, and an over clad layer formed on the core layer and included in the core layer when projected in the thickness direction of the core layer. The optical waveguide is provided with a positioning portion to position the optical waveguide and a near-field light generating unit for generating near-field light by a light emitted from the optical waveguide, and a protective layer to cover the positioning portion.05-26-2011
20110123144UNIVERSAL SERIAL BUS (USB) CONNECTOR HAVING AN OPTICAL-TO-ELECTICAL/ELECTRICAL-TO-OPTICAL CONVERSI0N MODULE (OE MODULE) AND HIGH-SPEED ELECTRICAL CONNECTIONS INTEGRATED THEREIN - A USB connector is provided that has an OE module and high-speed electrical connections integrated therein. The OE module includes an optical module, at least one laser diode, at least one photodiode, an optical transceiver IC, and a PCB. The optical module, the laser diode, the photodiode, and the IC are mounted on a surface of the PCB. The OE module is secured within the USB connector. The PCB includes conductive traces and electrical contact pads. The conductive traces electrically connect the IC with the contact pads. The contact pads are electrically connected via through holes formed in the PCB to the high-speed electrical connections, which, in turn, are electrically connected to conductive traces of a motherboard or a computer.05-26-2011
20080298743Microsplitter module for optical connectivity - A compact optical splitter module is disclosed. One type of compact optical splitter module is a planar attenuated splitter module that includes a branching waveguide network having j≧1 50:50 splitters that form up to n≦212-04-2008
20080298742Modular array computer with optical intercell communications pathways - The present invention provides an array of computer cells in which adjacent computer cells communicate over optical pathways.12-04-2008
20120328237OPTICAL DEVICE AND METHOD FOR MANUFACTURING OPTICAL DEVICE - An object of the invention is to provide an optical device and an optical device manufacturing method wherein provisions are made to be able to substantially prevent misalignment from occurring in an optical element and prevent shifting from occurring in the optical waveguide characteristics of the optical element. The optical device includes a first optical element, a second optical element optically coupled to the first optical element, and a first silicon substrate on which the first optical element and the second optical element are mounted, wherein the second optical element includes a second silicon substrate and a waveguide substrate laminated to the second silicon substrate, and the second optical element is mounted on the first silicon substrate in such a manner that the waveguide substrate faces the first silicon substrate.12-27-2012
20120328235MODULAR CHIP LAYOUT FOR ACTIVE OPTICAL LINKS - The present invention relates to a flexible method of provide chips for optical interconnect with different number of channels.12-27-2012
20110002582SEMICONDUCTOR OPTICAL INTERCONNECTION DEVICE AND SEMICONDUCTOR OPTICAL INTERCONNECTION METHOD - Provided is a semiconductor optical interconnection device capable of transmitting signals between laminated semiconductor chips in a structure where semiconductor chips highly functionalized by being bonded to an optical interconnection chip are laminated. The semiconductor optical interconnection device includes a semiconductor chip 01-06-2011
20110002581OPTICAL SWITCH AND METHOD OF MANUFACTURING THE SAME - Provided is an optical switch that can be operated efficiently and a method of manufacturing the same. The optical switch according to the present invention is an optical switch of Mach-Zehnder interferometer type formed by a line-defect waveguide of a photonic crystal. Further, the optical switch includes a branch 01-06-2011
20120269479OPTICAL MODULE - An optical module includes a metallic stem a lead pin penetrating through the metallic stem and electrically insulated from the metallic stem, an optical semiconductor element on the metallic stem and connected to a first end of the lead pin, and a flexible substrate including first and second signal lines. A first end of the first signal line is connected to a second end of the lead pin. A second end of the first signal line is connected to a first end of the second signal line. The lead pin has a penetrating portion penetrating through the metallic stem. Each of the penetrating portion and the second signal line has a smaller impedance than the impedance of the first signal line.10-25-2012
20100226606SUBSTRATE FOR MOUNTING AN OPTICAL ELEMENT, OPTICAL CIRCUIT SUBSTRATE, AND SUBSTRATE ON WHICH AN OPTICAL ELEMENT IS MOUNTED - A substrate on which an optical element is mounted is provided, including: an optical element; an optical circuit substrate which is formed by an optical waveguide layer having a core portion and cladding portions; and an electrical circuit substrate on which is provided a mounting portion that is used for mounting the optical element, wherein the optical element is mounted on the electrical circuit substrate via the optical circuit substrate and wherein the optical circuit substrate has an optical element mounted thereon and is provided with a receptor structure having a conductive portion that conducts electricity between an electrode of the optical element and an electrode of the electrical circuit substrate.09-09-2010
20100226605WAVEGUIDE ELEMENT AND METHOD OF PRODUCTION THEREOF - There is provided a method of producing a waveguide element comprising steps of forming a lower cladding layer having a refractive index n09-09-2010
20110235965SEMICONDUCTOR DEVICE - Improvement of signal integrity, a size reduction of a device, and the like are realized. A semiconductor integrated circuit section 09-29-2011
20110235964OPTICAL WAVEGUIDE, OPTO-ELECTRIC HYBRID BOARD, AND OPTICAL MODULE - The present invention relates to an optical waveguide comprising a lower cladding layer, a patternized core layer and an upper cladding layer, wherein a striking part for positioning is provided in one end part thereof, and an optical path turning mirror face is formed in a position different from a striking part-forming end part in the above core layer.09-29-2011
20110235963FIBER-COUPLED OPTOELECTRONIC DEVICE MOUNTED ON A CIRCUIT BOARD - An optical apparatus comprises: an optical fiber, an optoelectronic device on a substrate, a circuit board, and an electrical connection therebetween. A substrate groove positions the fiber for optical coupling with the device. The substrate is mounted on the circuit board; a proximal fiber segment is secured in the substrate groove; a distal fiber segment is secured to the circuit board. The circuit board includes vias providing electrical connections between contacts on its top and bottom surfaces. A method comprises: mounting on the circuit board the substrate and optoelectronic device; establishing the electrical connection; securing proximal and distal fiber segments to the substrate groove and circuit board, respectively. Multiple substrates can be secured to a single piece of circuit board material, which can be divided into individual circuit boards after establishing electrical connections and securing optical fibers to the corresponding substrates and circuit board material.09-29-2011
20110235962OPTICAL DEVICE WITH HIGH THERMAL TUNING EFFICIENCY - An optical device with high thermal tuning efficiency is described. This optical device may be implemented using a tri-layer structure (silicon-on-insulator technology), including: a substrate, a buried-oxide layer and a semiconductor layer. In particular, a thermally tunable optical waveguide may be defined in the semiconductor layer. Furthermore, a portion of the substrate under the buried-oxide layer and substantially beneath a location of the thermally tunable optical waveguide is fabricated so that a portion of the buried-oxide layer is exposed. In this way, the thermal impedance between the thermally tunable optical waveguide and an external environment is increased, and power consumption associated with thermal tuning of the optical waveguide is reduced.09-29-2011
20110158582STRUCTURE OF A SEMICONDUCTOR DEVICE HAVING A WAVEGUIDE AND METHOD OF FORMING THE SAME - A method of forming the structure of the semiconductor device having a waveguide. Firstly, a SOI substrate including a bulk silicon, an insulating layer, and a silicon layer is provided and a device region and a waveguide region are defined on the SOI substrate. Afterwards, a protection layer and a patterned shielding layer are formed to cover the waveguide region and expose the device region. Subsequently, a recess is formed by etching the protection layer, the silicon layer and the insulating layer and thereby the bulk silicon is exposed. After that, an epitaxial silicon layer is formed in the recess and a semiconductor device is subsequently formed on the epitaxial silicon layer. Also, the present invention conquers the poor electrical performance of the semiconductor device integrated into the SOI substrate.06-30-2011
20110158581OPTOELECTRONIC DEVICE AND METHOD OF FORMING THE SAME - An optoelectronic device including a substrate, a half-boat-shaped material layer, a deep trench isolation structure, and an optical waveguide is provided. The substrate has a first area. The half-boat-shaped material layer is disposed in the substrate within the first area. The refractive index of the half-boat-shaped material layer is lower than that of the substrate. A top surface of the half-boat-shaped material layer is coplanar with the surface of the substrate. The deep trench isolation structure is disposed in the substrate within the first area and located at one side of a bow portion of the half-boat-shaped material layer. The optical waveguide is disposed on the substrate within the first area. The optical waveguide overlaps a portion of the deep trench isolation structure and at least a portion of the half-boat-shaped material layer.06-30-2011
20100232744SUBSTRATE FOR MOUNTING IC CHIP, MANUFACTURING METHOD OF SUBSTRATE FOR MOUNTING IC CHIP, DEVICE FOR OPTICAL COMMUNICATION, AND MANUFACTURING METHOD OF DEVICE FOR OPTICAL COMMUNICATION - A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.09-16-2010
20100232743OPTICAL-PATH TURNING MEMBER AND OPTICAL-PATH TURNING OPTICAL CONNECTOR - In a light path converting member (09-16-2010
20100232742OPTICAL WAVEGUIDE - A waveguide structure comprises a core (09-16-2010
20100232741Optical interconnection system using optical waveguide-integrated optical printed circuit board - An optical interconnection system is provided. The optical interconnection system includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, an one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB. The upper surfaces of the respective optical interconnection blocks are substantially aligned with the upper surface of the PCB09-16-2010
20120087621NANOPHOTONIC OPTICAL DUPLEXER - An optical duplexer intended to receive light at a first optical wavelength and to transmit back light at a second optical wavelength, including, on a substrate, successive layers forming a photoreceptor of the first optical wavelength, a selective filter letting through the first optical wavelength, and a waveguide having a surface including a grating which is transparent for the first optical wavelength and diffracting for the second optical wavelength.04-12-2012
20120087620OPTICAL TRANSMITTER WITH FLIP-CHIP MOUNTED LASER OR INTEGRATED ARRAYED WAVEGUIDE GRATING WAVELENTH DIVISION MULTIPLEXER - An optical communication system comprising first and second planar substrates and an alignment assembly. The first substrate of a semiconductor material, is located on a planar surface of a sub-mount and having a planar first edge. The second substrate of a different second material, is located on said planar surface of said sub-mount and having a planar second edge. The alignment assembly is located on said sub-mount, said alignment assembly including rigid standoff structures configured to fixedly vertically align said first and second edges above said sub-mount such that each optical output of one of said lasers is vertically aligned with the end of one of said light-guiding structures.04-12-2012
20120328236PLANAR LIGHTWAVE CIRCUIT - In an integrated optical receiver or transmitter, both the displacement of an optical axis caused by thermal changes and the property degradation of an optical functional circuit are inhibited. A planar lightwave circuit having a substrate and a waveguide-type optical functional circuit formed thereon composed of a material different from that of the substrate, and includes a waveguide region formed only of an optical wavelength that is in contact with a side forming an emission-end face of the optical waveguide for propagating the light emitted from the optical functional circuit or an incident-end face of an optical waveguide for propagating the light incident on the optical functional circuit. The planar lightwave circuit is fixed to a fixing mount only at the bottom of the substrate where the waveguide region is formed.12-27-2012
20120328234Low-loss Optical Coupling Apparatus - A low-loss optical coupling apparatus includes a silicon-on-insulator wafer, a silicon dioxide layer, a taper waveguide, a channel waveguide and a thick-film silicon dioxide layer. The silicon-on-insulator wafer is formed with a silicon substrate. The silicon dioxide layer is provided on the silicon substrate. The taper waveguide comprises a slab region formed on the silicon dioxide layer and a waveguide region formed on the slab region. An end of a chip is connected to an end of the waveguide region. The channel waveguide is formed on the slab region and connected to another end of the waveguide region. The thick-film silicon dioxide layer extends on the taper waveguide and covers the entire waveguide region.12-27-2012
20120321245SILICA-ON-SILICON WAVEGUIDES AND RELATED FABRICATION METHODS - A method of manufacturing a waveguide eliminates a prior art reflow step and introduces certain new steps that permit fabricating of an ultra-low loss waveguide element on a silicon chip. The ultra-low loss waveguide element may be adapted to fabricate a number of devices, including a wedge resonator and a ultra-low loss optical delay line having an extended waveguide length.12-20-2012
20120321244OPTICAL SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF - The optical semiconductor device includes a spot-size converter formed on a semiconductor substrate. The spot-size converter has a multilayer structure including a light transition region. The multilayer structure includes a lower core layer, and an upper core layer having a refractive index higher than that of the lower core layer. The width of the upper core layer is gradually decreased and the width of the lower core layer is gradually increased in the light transition region. Both sides and an upper side of the multilayer structure are buried by a semi-insulating semiconductor layer in the light transition region. Light incident from one end section of the spot-size converter is propagated to the upper core layer. The light transits from the upper core layer to the lower core layer in the light transition region, is propagated to the lower core layer, and exits from the other end section thereof.12-20-2012
20120321246ASYMMETRIC SLOTTED WAVEGUIDE AND METHOD FOR FABRICATING THE SAME - An asymmetric slotted waveguide and method for fabricating the same. The slotted waveguide is constructed in silicon-on-insulator using a Complementary metal-oxide-semiconductor (CMOS) process. One or more wafers can be coated with a photo resist material using a photolithographic process in order to thereby bake the wafers via a post apply bake (PAB) process. An anti-reflective coating (TARC) can be further applied on the wafers and the wafers can be exposed on a scanner for the illumination conditions. After a post exposure bake (PEB), the wafers can be developed in a developer using a puddle develop process. Finally, the printed wafers can be processed using a shrink process to reduce the critical dimension (CD) of the slot and thereby achieve an enhanced asymmetric slotted waveguide that is capable of guiding the optical radiation in a wide range of optical modulation applications using an electro-optic polymer cladding.12-20-2012
20110305415OPTICAL COMMUNICATION MODULE AND OPTICAL COMMUNICATION CONNECTOR - A single-core bidirectional optical communication module and a single-core bidirectional optical communication connector are provided which can decrease in size without greatly changing the structure of the past optical connector housing. An optical communication module 12-15-2011
20120288228OPTICAL ELEMENT - Disclosed is a silicon optical waveguide having a small optical loss and no polarization dependency. The silicon optical waveguide is formed on a silicon substrate with an embedded oxide film therebetween, the plane orientation of the surface of the silicon optical waveguide is the (110) plane, the plane orientation of the side wall is the (111) plane, and the recesses and projections of the side wall are planarized at an atomic level.11-15-2012
20100202729OPTOELECTRONIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING THE OPTICAL COMMUNICATION DEVICE - An optoelectronic wiring board includes a flex-rigid substrate and an optical communication unit. The flex-rigid substrate includes a flexible substrate provided with an electric wiring, and a pair of rigid sections provided on both sides of the flexible substrate. The pair of rigid sections each include a lamination formed of a conductive circuit and an insulating layer. The optical communication unit is made of a flexible material and has both end faces substantially perpendicular to its optical path of transmitting light. Both end portions of the optical communication unit are disposed and fixed on the rigid sections so that both end faces of the optical communication unit face an optical element mounting region provided on the rigid sections of the flex-rigid substrate.08-12-2010
20100202728SURFACE-PLASMON-ASSISTED OPTICAL FREQUENCY CONVERSION - An optical frequency converter that uses a nonlinear optical process to transfer energy between a surface-plasmon (SP) wave that is guided along an electrically conducting strip and a light beam that is guided along an optical waveguide whose core is adjacent to the electrically conducting strip. The optical frequency converter has a periodic structure that spatially modulates the nonlinear susceptibility of the waveguide core with a spatial period that is related to a momentum mismatch in the nonlinear optical process. The spatial modulation provides quasi-phase matching for the SP wave and the light beam and enables efficient energy transfer between them.08-12-2010
20130011095OPTICAL COMPONENT - In an optical component, a part of a waveguide type optical device is fixed to a convex portion of a mount. The optical component includes an optical support base, a pressure member and a pressure support base. The optical device support base is interposed between the mount and the presser member enough to be slidable in a direction parallel to surfaces of the mount and the presser member.01-10-2013
20130016943OPTICAL ISOLATOR - Various optical isolator embodiments are disclosed. Embodiments comprise a waveguide section utilizing materials that induce a propagation constant shift that is propagation-direction-dependent. Embodiments are characterized by a cutoff frequency for forward propagating waves that is different than the cutoff frequency for reverse waves. A particular embodiment is constructed as a single-mode waveguide on a substrate. The cross-section of the waveguide is inhomogeneous in terms of materials. This inhomogeneity induces a propagation constant shift, which is propagation-direction-dependent. This device works as an optical isolator from the cut-off frequency of the lowest forward wave (lower frequency) to one for the lowest reverse wave (higher frequency). Various configurations consistent with the principles of the invention are disclosed.01-17-2013
20130016941ARBITRATED OPTICAL NETWORK USING TUNABLE DROP FILTERSAANM Koka; PranayAACI AustinAAST TXAACO USAAGP Koka; Pranay Austin TX USAANM McCracken; Michael O.AACI AustinAAST TXAACO USAAGP McCracken; Michael O. Austin TX USAANM Schwetman, JR.; Herbert D.AACI AustinAAST TXAACO USAAGP Schwetman, JR.; Herbert D. Austin TX USAANM Zheng; XuezheAACI San DiegoAAST CAAACO USAAGP Zheng; Xuezhe San Diego CA USAANM Krishnamoorthy; Ashok V.AACI San DiegoAAST CAAACO USAAGP Krishnamoorthy; Ashok V. San Diego CA US - In a multi-chip module (MCM), integrated circuits are coupled by optical waveguides. These integrated circuits receive optical signals from a set of light sources which have fixed carrier wavelengths. Moreover, a given integrated circuit includes: a transmitter that modulates at least one of the optical signals when transmitting information to at least another of the integrated circuits; and a receiver that receives at least one modulated optical signal having one of the carrier wavelengths when receiving information from at least the other of the integrated circuits. Furthermore, the MCM includes tunable drop filters optically coupled to the optical waveguides and associated integrated circuits, wherein the tunable drop filters pass adjustable bands of wavelengths to receivers in the integrated circuits. Additionally, control logic in the MCM provides a control signal to the tunable drop filters to specify the adjustable bands of wavelengths.01-17-2013
20130016942Adiabatic Mode-Profile Conversion by Selective Oxidation for Photonic Integrated Circuit - Waveguide designs and fabrication methods provide adiabatic waveguide eigen mode conversion and can be applied to monolithic vertical integration of active and passive elements in PICs. An advantage of the designs and methods is a simple fabrication procedure with only a single etching step in combination with subsequent well-controllable selective oxidation. As a result, improved manufacturability and reliability can be achieved.01-17-2013
20130016944LOW-COST FAST VARIABLE OPTICAL ATTENUATOR FOR OPTICAL WAVELENGTH TRACKING - Variable optical attenuator (VOA) formed by disposing upon a substrate a waveguide, a p-type region and an n-type region about the waveguide, and an epi-silicon region disposed upon the waveguide, the VOA responsive to a bias current to controllably inject carriers into the waveguide to attenuate thereby optical signal propagating through the waveguide.01-17-2013
20130022309OPTO-ELECTRONIC COMMUNICATION MODULE HAVING RETAINER FOR ALIGNING OPTICAL PORTS - An opto-electronic communication module includes a housing, an electro-optical assembly, and a retainer that helps maintain alignment of an optical port. The electro-optical assembly includes a circuit substrate, an opto-electronic communication device mounted on the circuit substrate, and an optics module having an optical connection portion extending into the opening of the housing to define the optical port. The retainer can be, for example, a clip that contacts the housing and fits over the optical connection portion of the optics module to maintain the optical connection portion in alignment with the opening of the housing.01-24-2013
20130170788OPTICAL FIBER CONNECTOR - An optical fiber connector includes a substrate and an optical-electrical convertor. The substrate includes a loading surface and a sidewall. The loading surface defines a first and a second receiving grooves. The sidewall receives a first light channel passing through the sidewall and extending to the first receiving groove, and a second light channel passing through the sidewall and extending to the second receiving groove. The optical-electrical convertor includes a first coupling lens received in the first receiving groove, a second coupling lens received in the second receiving groove, a main body, a light emitting module, and a light receiving module. The main body has a top surface away from the substrate, and defines a first and a second through holes. The light emitting module and the light receiving module are positioned on the top surface, and are aligned with the first through hole and the second through hole respectively.07-04-2013
20130170789OPTICAL FIBER ARRAY STRUCTURE - An optical fiber array structure includes a substrate covered with a cover plate and defining therebetween a longitudinal rectangular groove with a bottom wall and two opposite lateral contact walls, an optical fiber cable consisting of multiple optical fiber layers arranged in an array in the longitudinal rectangular groove in such a manner that the optical fibers of each two adjacent optical fiber layers are arranged in a staggered manner so that the center of one optical fiber of one optical fiber layer is kept in alignment with the contact area between two adjacent optical fibers of one adjacent optical fiber layer. This design effectively reduces light loss, phase noise and crosstalk, improves yield rate for mass production and assures a high level of optical signal transmission quality and reliability.07-04-2013
20120243823Gap-Mode Waveguide - In a gap-mode waveguide embodiment, an interior gap in a tubular waveguide principally condenses a dominant gap mode near the interior gap, and an absorber dissipates electromagnetic energy away from the gap mode. In this manner, the gap mode may dissipate relatively little power in the absorber compared to other modes and propagate with lesser attenuation than all other modes. A gap mode launched into a gap-mode waveguide may provide for low-loss, low-dispersion propagation of signals over a bandwidth including a multimode range of the waveguide. Gap-mode waveguide embodiments of various forms may be used to build guided-wave circuits covering broad bandwidths extending to terahertz frequencies.09-27-2012
20080253713Optical crossover in thin silicon - An arrangement for providing optical crossovers between waveguides formed in an SOI-based structure utilize a patterned geometry in the SOI structure that is selected to reduce the effects of crosstalk in the area where the signals overlap. Preferably, the optical signals are fixed to propagate along orthogonal directions (or are of different wavelengths) to minimize the effects of crosstalk. The geometry of the SOI structure is patterned to include predetermined tapers and/or reflecting surfaces to direct/shape the propagating optical signals. The patterned waveguide regions within the optical crossover region may be formed to include overlying polysilicon segments to further shape the propagating beams and improve the coupling efficiency of the crossover arrangement.10-16-2008
20080247703SUBSTRATE FOR MOUNTING IC CHIP AND DEVICE FOR OPTICAL COMMUNICATION - The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.10-09-2008
20080232737Optical block reinforcing member, optical block and optical module - An optical module includes a circuit board, an optical element mounted on the circuit board, an electronic parts for driving the optical element, an optical block optically coupled with the optical element and adapted to be connected to an optical connector, wherein the optical block includes a protrusion including a guide pin for connecting the optical block to the optical connector, and a receiving portion formed nearly cylindrical around a root of the guide pin and having a receiving surface on which the optical block abuts the optical connector, an optical block reinforcing member including an upper lid for covering the optical block, and sidewalls for covering both sides of the optical block arranged perpendicular to a width direction of the optical connector, wherein the optical block reinforcing member includes a separate body from the optical block and is adapted to be attached on the optical block, and a casing for housing the circuit board, the optical element, the electronic parts, the optical block and the optical block reinforcing member.09-25-2008
20080226224OPTICAL JUNCTION APPARATUS AND METHODS EMPLOYING OPTICAL POWER TRANSVERSE-TRANSFER - An optical apparatus comprises an optical device formed on a device substrate, a first optical waveguide formed on the substrate or on the optical device, and a second, mechanically discrete optical waveguide assembled with the device substrate, optical device, or first optical waveguide. The first optical waveguide is arranged for transferring an optical signal between the optical device and the first optical waveguide. The first and second optical waveguides are arranged, when the second optical waveguide is assembled with the device substrate, optical device, or first optical waveguide, for transferring the optical signal therebetween via optical transverse coupling.09-18-2008
20080226223METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device has a two-dimensional slab photonic crystal structure in which a substrate supports a sheet-like slab layer including, sequentially stacked, a lower cladding layer, an active layer, and an upper cladding layer. A periodic refractive index profile structure, in surfaces of the stacked layers, introduces a linear defect region that serves as a waveguide. A p-type region and an n-type region in the slab layer define a pn junction surface at a predetermined angle with respect to the surfaces of the stacked layers in the slab layer.09-18-2008
20080226222OPTO-ELECTRIC BUS MODULE AND METHOD OF MANUFACTURING THE SAME - Provided are an opto-electric bus module and a method of manufacturing the opto-electric bus module. The opto-electric bus module includes an opto-electric interconnection unit where a concave-shaped micro structure is formed on a lower surface of a polymer structure and an optical bench where a convex-shaped micro structure is formed in a position corresponding to the concave-shaped micro structure, at least one second electric interconnection for electric connection with a semiconductor chip is formed, and the semiconductor chip and an opto-electric device can be mounted. Thus, automatic, efficient, high-speed, and high-integration optical communication and electric communication between multi-chips can be completed at the same time by using the opto-bus module which provides low-speed electric communication while manually maintaining solid optical coupling.09-18-2008
20080226221INTEGRATED REFLECTOR FOR PLANAR LIGHTWAVE CIRCUITS - A reflector chip of the present invention integrates a planar lightwave circuit (PLC) waveguide wafer and an active component, such as a photo-detector or laser, e.g. vertical cavity surface emitting laser. Typically, the PLC waveguide wafer includes a waveguide core region bound by upper and lower cladding layers. An end of the waveguide core region is mounted within a channel, trench, notch or recess within the bottom surface of the body of the reflector chip. A V-notch is also formed in the bottom surface of the body of the reflector, including a reflective surface, which redirects the light between the active component and the waveguide core region.09-18-2008
20080226220Zinc oxide diodes for optical interconnections - The present disclosure includes methods, devices, and systems for zinc oxide diodes for optical interconnections. One system includes a ZnO emitter confined within a circular geometry in an oxide layer on a silicon substrate. An optical waveguide is formed in the oxide layer and has an input coupled to the ZnO emitter. A detector is coupled to an output of the optical waveguide.09-18-2008
20080226219Zinc oxide optical waveguides - The present disclosure includes methods, devices, and systems having zinc oxide waveguides for optical signal interconnections. One optical signal interconnect system includes an oxide layer on a semiconductor substrate. A ZnO waveguide can be provided in the oxide layer and connected to a silicon detector to receive optical signals having a wavelength, for example, between 500 and 375 nanometers (nm).09-18-2008
20130177274STRUCTURES FORMED USING MONOCRYSTALLINE SILICON AND/OR OTHER MATERIALS FOR OPTICAL AND OTHER APPLICATIONS - An interposer includes grooves (07-11-2013
20130177275APPARATUS AND METHOD FOR GENERATING FEMTOSECOND PULSES VIA TEMPORAL SOLITON COMPRESSION IN PHOTONIC CRYSTALS - Exemplary embodiments of an apparatus, method, and computer readable medium are provided for producing a radiation. For example, a radiation having at least one pulse with a pulse-width of less than approximately 30 picoseconds can be produced using a photonic crystal waveguide arrangement which is (i) specifically structured and sized so as to be placed on an integrated circuit, and (ii) configured to produce the radiation having at least one pulse with a pulse-width of less than approximately 30 picoseconds.07-11-2013
20130170790OPTICAL BOARD, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL MODULE STRUCTURE - An optical board including a substrate including a plate-shaped resin including a first main plane and a second main plane facing each other, and a slit-shaped optical fiber receiving portion which penetrates between the first main plane and the second main plane in a thickness direction, a metal layer provided on the second main plane, and a wiring pattern consisting of metal and provided on the first main plane. An inclined plane is provided at an end of the optical fiber receiving portion in the substrate, a tilt angle of the inclined plane with respect to the first main plane is an obtuse angle, and a reflective layer is provided on the inclined plane for reflecting a light output from an optical fiber received in the optical fiber receiving portion toward the first main plane.07-04-2013
20110274389OPTO-ELECTRIC COMBINED CIRCUIT BOARD AND ELECTRONIC DEVICES - The present invention relates to a flexible opto-electric combined circuit board in which an optical waveguide film provided with a core and a clad is bonded to a flexible electric wiring board, wherein a reinforcing material is provided to at least a part of an optical waveguide film side in a bent part and electronic devices prepared by using the above flexible opto-electric combined circuit board.11-10-2011
20110274388OPTOELECTRONIC COMPOSITE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an optoelectronic composite substrate, includes forming a first cladding layer in an area except the connection pad on a wiring substrate including a connection pad on an upper surface, forming a belt-like core layer on the first cladding layer, and obtaining an optical waveguide having a structure in which the core layer is surrounded by the first cladding layer and the second cladding layer, by forming a second cladding layer which covers the core layer. A thickness of the first cladding layer is set identically to a thickness of the connection pad, and thus a level difference caused by the connection pad is eliminated.11-10-2011
20090263078Optical device - Plural p-n junctions are formed in a waveguide such that they have junction interfaces in a normal direction to a surface of a substrate (to an extending direction of the substrate). Accordingly, a doping concentration changes in only a horizontal direction in the substrate, and it is possible to fabricate using the same processes as those for silicon electronic devices and to perform device fabricating at a low cost. Moreover, two or more junction interfaces are formed in the waveguide and thus an occupied area of the waveguide in a refractive index modulation region expands. Therefore, the efficiency of the refractive index modulation can be improved and a low-voltage operation is possible.10-22-2009
20120251040OPTICAL WAVEGUIDE - An optical waveguide includes a substrate, an upper clad layer arranged on the substrate; and an optical waveguide structure that is disposed in the upper clad layer so as to be parallel to a surface of the substrate. The optical waveguide structure includes a flat optical waveguide, channel optical waveguides that are each connected with a first edge face of the flat optical waveguide and extend radially therefrom, the channel optical waveguides each respectively have lateral sides parallel to the substrate surface that have a width therebetween which increases as the distance from the first edge face increases, and an input optical waveguide connected with a second edge face that is arranged at an side of the flat optical waveguide opposite to the first edge face.10-04-2012
20120251038OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREFOR - Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.10-04-2012
20120251035CIRCULAR PHOTONIC CRYSTAL STRUCTURE, LIGHT EMITTING DIODE DEVICE AND PHOTOELECTRIC CONVERSION DEVICE - A method applying a circular photonic crystal structure to improve optical properties of a photoelectric conversion device such as a light emitting diode device, an organic light emitting diode device or a solar cell is provided, wherein the circular photonic crystal structure is configured on a junction surface between two different mediums where passes a light emitted or received by the photoelectric conversion device. The circular photonic crystal structure provides isotropic photonic band gap which conduces high light extraction efficiency.10-04-2012
20080212921OPTICAL INTERCONNECT DEVICES AND STRUCTURES BASED ON METAMATERIALS - Improved optical interconnect devices, structures, and methods of making and using the devices and structures are provided herein. The optical interconnect devices, which can be used to connect components or route signals in an integrated-circuit or circuits, generally include an optical element having a metamaterial with a negative index of refraction. The optical element is configured to receive an optical signal from a first component and transmit the optical signal to a second component. Each interconnect device or structure can be fabricated to have a small size and complex functionalities integrated therein. Other embodiments are also claimed and described.09-04-2008
20130136390Thermally Compensated Arrayed Waveguide Grating Assemblies - Arrayed waveguide grating can have one or both slab waveguides with relatively sharply folded optical paths and a mirror that provides the folding of the path. The folded optical paths through the slab waveguides can result in a more compact geometry of the waveguides through the device as well as smaller slab waveguides such that the device can be formed with a significantly smaller overall footprint. Also, arrayed waveguide gratings that cooperate with pivotable mirrors can adjust light passage through the waveguide in response to temperature changes to provide for thermally compensated operation of the device. Thus, very compact planar lightwave circuits filters are described that provide thermally compensated operation.05-30-2013
20130094799OPTOELECTRONIC INTERFACE - An optoelectronic interface includes an optically transparent substrate; and an alignment layer comprising a pattern of alignment features disposed on said optically transparent substrate.04-18-2013
20130094800OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE OPTICAL DEVICE - The invention provides an optical device and an optical device manufacturing method wherein provisions are made to be able to precisely align an optical fiber relative to a substrate without heating the substrate and to maintain the optimum alignment condition for an extended period of time. More specifically, the invention provides an optical device manufacturing method which includes the steps of forming a first metallic film on a portion of a substrate, forming a second metallic film on a portion of the outer circumference of an optical fiber, and bonding together the first metallic film and the second metallic film by surface activated bonding,, and an optical device manufactured by such a manufacturing method.04-18-2013
20130094801OPTICAL SPLITTER ARRAY - An optical splitter array can include a single branched waveguide core situated on a planar substrate and having an input optically connected to n outputs via n−1 splitters, where n is an integer of at least 2. The array can also include a single cladding layer overlying the single branched waveguide core from the input to the outputs, and a plurality of alignment channels aligned with the input and the outputs.04-18-2013
20130209028ELECTRICAL OPTICAL CIRCUIT-BOARD, CIRCUIT-BOARD APPARATUS, AND PHOTOELECTRIC COMPOSITE DEVICE - An electrical optical circuit-board (08-15-2013
20130114925OPTICAL COMMUNICATION MODULE - Provided is a compact optical communication module which is configured and structured so as to be suitable for high-speed transmission and which facilitates the fixing and positioning of optical elements and prevents misalignment of the optical axis during temperature change. An optical communication module is constituted so as to have a transceiver circuit as the circuit substrate, a submount unit, a fiber stub as an optical connector member, and an optical fiber coupling member. The optical communication module is configured as a modular component in which the optical axis of an optical element mounted on the submount unit is roughly parallel to the mounting surface of the transceiver circuit.05-09-2013
20130114924Optical Arrangement and a Method of Forming the Same - According to embodiments of the present invention, an optical arrangement is provided. The optical arrangement includes a support substrate; at least one optical fiber arranged on the support substrate; at least one waveguide arranged on the support substrate and adjacent to the at least one optical fiber; the at least one waveguide defining a light propagation direction; and at least one grin index lens arranged asymmetrically relative to the light propagation direction such that light is coupled from the at least one optical fiber through the at least one grin index lens to the at least one waveguide.05-09-2013
20130101250Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assemblies - An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.04-25-2013
20130101249OPTICAL FILTER OR MULTIPLEXER/DEMULTIPLEXER - An optical filter or multiplexer/demultiplexer, including a plurality of optical waveguides forming a planar structure. Each optical waveguide has a total length including one or more first segments with a first width and at least one or more second segments with a second width, the first width being larger than the second width. The sum of lengths of the one or more first segments in each optical waveguide is larger than half the total length of the waveguide.04-25-2013
20130121633SYSTEMS AND METHODS FOR TUNING A CAVITY - The present disclosure describes an integrated opto-mechanical and electro-mechanical system. The opto-mechanical and electro-mechanical system can be made of photonic crystals configured to move based on electrical voltages and/or back action effects from electromagnetic waves, thus changing the resonance of the system.05-16-2013
20130129277INTEGRATED SEMICONDUCTOR DEVICE - An integrated semiconductor device includes a substrate including a first portion, a second portion, and a third portion; a first waveguide provided on the first portion, the first waveguide including a base portion and a ridge portion provided on the base portion, the base portion containing a first core layer; a second waveguide provided on the second portion, the second waveguide including a first stripe-shaped mesa containing a second core layer; and a third waveguide provided on the third portion, the third waveguide including a second stripe-shaped mesa containing a third core layer. The first stripe-shaped mesa is connected to the base portion and the ridge portion. The first stripe-shaped mesa is connected to the second stripe-shaped mesa. The second core layer is formed integrally with the first core layer. The third core layer is joined to the second core layer by a butt-joint method.05-23-2013
20130129278INTEGRATED SEMICONDUCTOR DEVICE - An integrated semiconductor device includes a substrate including first, second and third portions; a first waveguide provided on the first portion, the first waveguide including a first base portion containing a first core layer, and a first ridge portion provided on the first base portion; a second waveguide provided on the second portion, the second waveguide including a second base portion containing a second core layer and a second ridge portion provided on the second base portion; and a third waveguide provided on the third portion, the third waveguide including a stripe-shaped mesa containing a third core layer. The second base portion is connected to the first base portion. The second ridge portion is connected to the first ridge portion and the stripe-shaped mesa. The second core layer is formed integrally with the third core layer and is joined to the first core layer by a butt-joint method.05-23-2013
20130129276OPTICAL ENGINE ASSEMBLY AND OPTOELECTRONIC PACKAGE - There is provided an optical engine assembly including a bench, at least one optoelectronic unit, at least one optical waveguide and a mount. At least one support groove and a positioning groove are formed on the bench and connected with each other, and the support groove perpendicularly extends outward from one side of the positioning groove. The optoelectronic unit is disposed at the other side of the positioning groove and aligned with the support groove. One end of the optical waveguide is placed inside the support groove and the other end thereof penetrates through at least one through hole of the mount.05-23-2013
20130142478METHOD AND APPARATUS FOR ALIGNING A LASER DIODE ON A SLIDER STRUCTURE - An apparatus includes a slider structure having a top surface and a bottom surface opposite from the top surface. The apparatus includes a waveguide with an input facet at the top surface and an output proximate the bottom surface. A laser having an output facet is positioned proximate the input facet of the waveguide and include a second plurality of pads facing a first plurality of pads on the top surface of the slider. A bonding material is disposed between individual ones of the first and second plurality of pads such that a reflow of the bonding material induces relative movement between the laser and the top surface to align the input and output facets.06-06-2013
20130142479CHIP PACKAGE - A chip package includes a substrate, an electrical module, an optical module and a transmission module. The electrical module and the optical module are positioned on the substrate and electrically connect with each other. The optical module is used for converting optical signals to electrical signals, and vice versa. The optical module includes an optical emitting element and optical receiving element. The transmission module is positioned on the substrate. The transmission module includes an optical wave guide array having a reflection surface and a plurality of optical fibers that are optically coupled with the optical wave guide array. The optical signals emitted by the optical module are reflected by the reflection surface and reach the optical fibers to be transmitted; the optical module is capable of receiving optical signals from the optical fibers.06-06-2013
20130156365Fiber to Wafer Interface - An interface device includes a body portion having a single-mode waveguide portion including a substantially optically transparent material, a cladding portion defined by channels contacting the waveguide portion, the cladding portion including a substantially optically transparent polymer material, an engagement feature operative to engage a portion of a wafer, and a guide portion operative to engage a portion of an optical fiber ferrule.06-20-2013
20080199128Semiconductor integrated optical element - Aiming at realizing a semiconductor integrated optical element comprising a single semiconductor substrate, and first and second optical waveguides differed in the equivalent refractive index from each other on the semiconductor substrate, allowing light signal to propagate from the first optical waveguide to the second optical waveguide, in which the first and second optical waveguides are provided side-by-side on the semiconductor substrate to form a directional coupler allowing optical coupling between the first and second optical waveguides, and a first-guiding-mode optical signal in the first optical waveguide is output after being converted into a second-guiding-mode optical signal in second optical waveguide, which makes possible to suppress generation of reflection loss and emission loss in optical coupling, and obtain extremely desirable optical coupling characteristics, without causing reflection of optical signal, between different types of optical waveguides differed from each other in the equivalent refractive index.08-21-2008
20110255823SLOTTED OPTICAL WAVEGUIDE WITH ELECTRO-OPTIC MATERIAL - An optical waveguide is described. This optical waveguide may be defined in a semiconductor layer, and may include a vertical slot that includes an electro-optic material having an electric-field-dependent index of refraction, and the electro-optic material may be other than a semiconductor in the semiconductor layer. Alternatively, the optical waveguide may include a vertical stack with two semiconductor layers that surround and partially overlap an intermediate layer, which includes the electro-optic material.10-20-2011
20130148922Optical Module Manufacturing Method and Optical Module - An optical module manufacturing method includes: forming a first waveguide layer and a second waveguide layer on a first substrate and a second substrate respectively, or forming a first waveguide layer and a second waveguide layer on a first surface of a first substrate and a second surface of the first substrate respectively; disposing the first substrate on the second substrate; disposing a filter at an end of the first waveguide layer and the second waveguide layer, so that the filter is aligned with the second waveguide layer; and disposing a prism on the filter, so that a first reflective surface of the prism is aligned with the first waveguide layer, and a second reflective surface is aligned with the second waveguide layer. Embodiments of the present application further disclose an optical module.06-13-2013
20090245722THREE-DIMENSIONAL STACKED OPTICAL DEVICE - A three-dimensional stacked optical device includes a transparent substrate, and an optical device having a main body mounted to the transparent substrate. The optical device includes a plurality of vias that extend into the main body and do not extend into the transparent substrate. A conductive member is provided in each of the plurality of vias to form backside contacts. An electronic chip including a plurality of vias is mounted to the backside contacts on the optical device. Another conductive member is deposited in each of the plurality of vias formed in the electronic chip. The another conductive member forms additional backside contacts on the electronic chip.10-01-2009
20120275742OPTICALLY-COUPLED DEVICE AND METHOD OF FIXING THE SAME - According to one embodiment, an optically-coupled device includes a substrate and an optical fiber. The substrate is inclined from a first direction has a first width including a first surface optical device. The optical fiber is arranged in a second direction An end face has a second angle with respect to the first direction and has a radius of a second length. An outer edge of the end face of the optical fiber is it chamfered. A difference between the first angle and the second angle is not smaller than the difference with which the first surface optical device is protected from the end face of the optical fiber.11-01-2012
20090067778HYBRID INTEGRATED STRUCTURE OF ONE OR MORE OPTICAL ACTIVE DEVICES AND PLC DEVICE USING OPTICAL FIBER ARRAY - A hybrid integrated structure of an optical active device and a Planar Lightwave Circuit (PLC) device using an optical fiber array is provided, in which one or more photodiodes are integrated on an upper cladding layer above one or more planar optical waveguides. A section located on a boundary surface between output optical waveguides, that is, an end of the PLC device in the direction of propagation of light, and the input end of an output optical fiber array is ground to be inclined at a predetermined angle with respect to an optical axis. Further, one or more optical fibers and one or more reflection mirrors are alternately arranged, inserted, and disposed in a plurality of V-shaped trenches formed in the output optical fiber array.03-12-2009
20100296773METHOD AND APPARATUS TO GENERATE AND MONITOR OPTICAL SIGNALS AND CONTROL POWER LEVELS THEREOF IN A PLANAR LIGHTWAVE CIRCUIT - Embodiments of an optical detection apparatus are disclosed which may include one or more of a waveguide, a trench formed in the waveguide, a reflective surface, and a photodetector. The waveguide may be formed in a semiconductor substrate to propagate an optical signal received at a first end of the waveguide. The trench may also be formed in the waveguide having a first sidewall and a second sidewall, the first and second sidewalls forming first and second angles with the waveguide's propagation direction. The second sidewall may include a reflective surface formed thereon. The photodetector may be configured to receive an optical signal propagated in the waveguide, through the first sidewall and reflected from the reflective surface on the second sidewall.11-25-2010
20100316330PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDES AND METHOD OF MANUFACTURING SAME - Disclosed herein is a printed circuit board for an optical waveguide, including: a lower substrate; an insulation layer which has a through-hole and is formed on the lower substrate; an optical waveguide which is formed in the through-hole such that a clearance is present between the optical wave guide and an inner wall of the through-hole; and an adhesive material which is charged in the clearance. The printed circuit board for an optical waveguide is advantageous in that a lower clad material, a core material and an upper clad material are sequentially applied on the lower substrate partially, not entirely, based on the region in which a core is formed, and is then patterned to form an optical waveguide, so that the amounts of the lower and upper clad materials and the core material, which are used to form the optical waveguide, can be greatly decreased.12-16-2010
20100316329OPTICAL ELEMENT PACKAGE AND SUBSTRATE COMPRISING THE SAME - Disclosed herein is an optical element package substrate configured such that electric wiring substrates having a cavity are layered on both sides of an optical waveguide, an optical element package is mounted in the electric wiring substrates, and an optical element mounted on the surface of the optical element package is housed in the cavity, so that the distance between the optical element and the optical waveguide is decreased, thereby increasing optical connection efficiency.12-16-2010
20130156367System for managing thermal conduction on optical devices - The system includes an optical device having both optical components and one or more waveguides on a base. The system also includes a heat sink and a zone definer contacting the base and the heat sink. The zone definer is configured to conduct thermal energy from the optical device to the heat sink. The zone definer includes a thermal insulator having a lower thermal conductivity than both the heat sink and the base. The zone definer also includes a thermal via that extends through the thermal insulator. A via medium is positioned in the thermal via and has a higher thermal conductivity than the thermal insulator. The via medium is located under one of the optical components.06-20-2013
20130156368System for managing thermal conduction on optical devices - The system includes an optical device having both optical components and one or more waveguides on a base. The system also includes a heat sink and a zone definer contacting the base and the heat sink. The zone definer is configured to conduct thermal energy from the optical device to the heat sink. The zone definer includes a thermal insulator having a lower thermal conductivity than both the heat sink and the base. The zone definer also includes a thermal via that extends through the thermal insulator. A via medium is positioned in the thermal via and has a higher thermal conductivity than the thermal insulator. The via medium is located under one of the optical components.06-20-2013
20130156369RING RESONATORS HAVING Si AND/OR SiN WAVEGUIDES - Provided is a ring resonator including first and second waveguides disposed spaced apart from each other, on a substrate, and at least one channel including at least one ring waveguide arranged in a row between the first and second waveguides. The first and second waveguides and the ring waveguide may be formed of silicon, a width of the ring waveguide may range from 0.7 μm to 1.5 μm, a height of the ring waveguide may range from 150 nm to 300 nm, and a space between the first and second waveguides and the ring waveguide most adjacent thereto may range from 250 nm to 1 mm.06-20-2013
20130156370OPTICAL COUPLING DEVICES AND SILICON PHOTONICS CHIPS HAVING THE SAME - Provided are optical coupling devices and silicon photonics chips having the same. the optical coupling device may include a lower layer having a first region and a second region, a first core layer disposed on the lower layer, the first core layer including first and second waveguides disposed on the first and second regions, respectively, a clad layer covering the first waveguide, and a second core layer interposed between the clad layer and the lower layer to cover the second waveguide. The second waveguide has a width decreasing with increasing distance from the first region and a vertical thickness greater than that of the first waveguide.06-20-2013
20130156371OPTICAL TRANSMISSION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, AND OPTICAL TRANSMISSION MODULE - Provided are an optical transmission structure having a high degree of flexibility in the design of an optical waveguide and a method for manufacturing the optical transmission structure, and also an optical transmission module. An optical transmission structure includes a main substrate (06-20-2013
20130156364ELECTRONIC/PHOTONIC INTEGRATED CIRCUIT ARCHITECTURE AND METHOD OF MANUFACTURE THEREOF - A device includes a passive photonic layer located over a substrate and including at least one passive photonic element configured to propagate an optical signal therein. An electronic layer located between said substrate and said passive photonic layer includes at least one electronic device configured to propagate an electrical signal therein. An active photonic layer located over said passive photonic layer includes an active photonic device optically coupled to said passive photonic element and configured to convert between said electrical signal and said optical signal.06-20-2013
20130156366EFFICIENT INTER-CHIP OPTICAL COUPLING - In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to a first optical coupler. This first optical coupler redirects the optical signal out of the plane of the optical waveguide. Then, an optical interposer guides the optical signal between the first optical coupler and a second optical coupler on a surface of a second substrate, thereby reducing spatial expansion of the optical signal between the optical couplers. Moreover, the second optical coupler redirects the optical signal into a plane of an optical waveguide disposed on a surface of the second substrate, which then conveys the optical signal.06-20-2013
20130182994OPTICAL INTERPOSER WITH NINETY DEGREE LIGHT BENDING - An optical interposer comprising: (a) a crystalline substrate having a top planar surface and a crystalline plane angle; (b) a groove defined in the top planar surface and extending from an edge of the substrate to a terminal end, the groove having side walls and a first facet at the terminal end, the facet having a first angle relative to the top planar surface, the first angle being about the crystalline plane angle, the first angle having a delta from 45°; (c) a reflective coating on the first facet; and (d) an optical conduit having an optical axis and an end face optically coupled with the first facet, the end face having a second angle with respect to the optical axis such that the angle of refraction at the end face compensates for the delta such that the end face and the first facet cooperate to bend light about 90°.07-18-2013
20130182995OPTICAL TRAPPING APPARATUS, METHODS AND APPLICATIONS USING PHOTONIC CRYSTAL RESONATORS - A plurality of photonic crystal resonator optical trapping apparatuses and a plurality optical trapping methods using the plurality of photonic crystal resonator optical trapping apparatuses include located and formed over a substrate a photonic waveguide that is coupled (i.e., either separately coupled or integrally coupled) with a photonic crystal resonator. In a particular embodiment, the photonic waveguide and the photonic crystal resonator comprise a monocrystalline silicon (or other) photonic material absent any chemical functionalization. In another particular embodiment, the photonic waveguide and the photonic crystal resonator comprise a silicon nitride material which when actuating the photonic crystal resonator optical trapping apparatus with a 1064 nanometer resonant photonic radiation wavelength (or other resonant photonic radiation wavelength in a range from about 700 to about 1200 nanometers) provides no appreciable heating of an aqueous sample fluid that is analyzed by the photonic crystal resonator optical trapping apparatus.07-18-2013
20130182996Releasable Fiber Connector For Opto-Electronic Assemblies - An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.07-18-2013
20130182997OPTICAL WAVEGUIDE MODULE, METHOD FOR PRODUCING OPTICAL WAVEGUIDE MODULE, AND ELECTRONIC APPARATUS - An object of the present invention is to provide an optical waveguide module which has a small optical coupling loss between the light element and the optical waveguide and can perform high-quality optical communication, a method for producing the optical waveguide module with high efficiency, and an electronic apparatus which includes the optical waveguide module and can perform high-quality optical communication, and the present invention provides an optical waveguide module including: an optical waveguide including a core portion, a clad portion that is provided to cover a side surface of the core portion, and an optical path-converting unit that is provided partway along the core portion or on an extended line of the core portion and that converts an optical path of the core portion to the outside of the clad portion; an optical element that is provided over the clad portion; a circuit board that is provided between the optical waveguide and the optical element and has a through-hole formed along an optical path connecting between the optical path-converting unit and the optical element; and a sealing portion that is transparent and is formed in a gap between the optical element and the circuit board; wherein a part of the sealing portion is inserted into the through-hole, and an inserted portion of the sealing portion functions as a lens for converging signal light passing though the optical path.07-18-2013
20110286695OPTICAL COUPLER MODULE HAVING OPTICAL WAVEGUIDE STRUCTURE - The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.11-24-2011
20110286694OPTICAL TRANSMISSION MODULE - An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.11-24-2011
20110311181Optical Isolator - Various optical isolator embodiments are disclosed. Embodiments comprise a waveguide section utilizing materials that induce a propagation constant shift that is propagation-direction-dependent. Embodiments are characterized by a cutoff frequency for forward propagating waves that is different than the cutoff frequency for reverse waves; the dimensions and direction of magnetization of the waveguide can be tailored so that, in a particular embodiment, the cutoff frequency for forward propagating waves is lower than the cutoff frequency for reverse waves. A particular embodiment is constructed as a single-mode waveguide on a substrate. The cross-section of the waveguide is inhomogeneous in terms of materials. At least one part of the cross-section is a non-reciprocal magneto-optic medium, which has nonzero off-diagonal permittivity tensor components. This inhomogeneity induces a propagation constant shift, which is propagation-direction-dependent. This device works as an optical isolator from the cut-off frequency of the lowest forward wave (lower frequency) to one for the lowest reverse wave (higher frequency). Various configurations consistent with the principles of the invention are disclosed.12-22-2011
20110311180Glassy Surface Smoothing Layer for Integrated Waveguide - An integrated optical waveguide includes a substrate, a waveguide under-cladding layer disposed on the substrate, and a waveguide core, having top and sidewall surfaces, disposed on the under-cladding layer. A glassy surface smoothing layer disposed on the waveguide core top surface and sidewall surfaces and has a refractive index, relative to a refractive index of the waveguide core, that enables guided optical transmission through the waveguide core and the glassy surface smoothing layer. In fabrication of the optical waveguide, a waveguide under-cladding layer is formed on a substrate and a waveguide core having sidewall surfaces and a top surface is formed on the under-cladding layer. A liquid suspension comprising particles of a glassy material is applied on the top and sidewall surfaces of the waveguide core. The applied liquid glassy particle suspension is heated to form a glassy surface smoothing layer on the waveguide core top surface and sidewall surfaces.12-22-2011
20130188906OPTICAL MODULE AND METHOD FOR PRODUCING THE SAME - An optical module includes a substrate, an optical device of a surface-emitting element or a surface-receiving element mounted on a surface of the substrate with a light-emitting portion or a light-receiving portion located to face the surface of the substrate, an optical fiber disposed parallel to the surface of the substrate and in a longitudinal direction of the substrate, a mirror provided to face the light-emitting portion or the light-receiving portion of the optical device and a tip of the optical fiber, and optically connect the optical device and the optical fiber, and an optical fiber receiving groove provided in the surface of the substrate to receive the optical fiber. A width of the mirror is greater than a width of the optical fiber receiving groove. Reflecting portions are provided on edges, respectively, of a mirror side end of the optical fiber receiving groove, and the reflecting portions reflect incident light from the mirror facing the edges, again back to the facing mirror.07-25-2013
20130188907OPTICAL MODULE AND METHOD FOR PRODUCING THE SAME - An optical module includes a substrate, an optical device including a surface-emitting or -receiving element mounted on a surface of the substrate with a light-emitting or -receiving portion, an optical fiber disposed parallel to the surface of the substrate and in a longitudinal direction of the substrate, a damming member provided between the optical device and the substrate to extend in a width direction of the substrate and dividing a gap between the optical device and the substrate in the longitudinal direction of the substrate into a first portion and a second portion, and a mirror provided at one side surface of the damming member a tip of the optical fiber. The first portion provided on an opposite side to the optical fiber is filled with an underfill resin, and the second portion provided on a side close to the optical fiber is filled with an optical fiber fixing resin.07-25-2013
20130188908OPTICAL TRANSMISSION BODY, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL TRANSMISSION MODULE - An optical transmission body includes a substrate having a through hole penetrating therethrough in a thickness direction thereof; a cladding member at least a part of which is positioned to be filled in the through hole, and which has an optical waveguide hole which is positioned inside the through hole and penetrates through the cladding member in a thickness direction thereof and a guide hole portion which is positioned away from the optical waveguide hole and is concave in the thickness direction; and a core member disposed inside the optical waveguide hole.07-25-2013
20130188903PHOTONIC DEVICE AND METHODS OF FORMATION - A photonic device and methods of formation that provide an area providing reduced optical coupling between a substrate and an inner core of the photonic device are described. The area is formed using holes in the inner core and an outer cladding. The holes may be filled with materials which provide a photonic crystal. Thus, the photonic device may function as a waveguide and as a photonic crystal.07-25-2013
20130188904HYBRID LASER LIGHT SOURCES FOR PHOTONIC INTEGRATED CIRCUITS - A light source for a photonic integrated circuit may comprise a reflection coupling layer formed on a substrate in which an optical waveguide is provided, at least one side of the reflection coupling layer being optically connected to the optical waveguide; an optical mode alignment layer provided on the reflection coupling layer; and/or an upper structure provided on the optical mode alignment layer and including an active layer for generating light and a reflection layer provided on the active layer. A light source for a photonic integrated circuit may comprise a lower reflection layer; an optical waveguide optically connected to the lower reflection layer; an optical mode alignment layer on the lower reflection layer; an active layer on the optical mode alignment layer; and/or an upper reflection layer on the active layer.07-25-2013
20130188905Optical Module and Optical Transmission Module - An optical module is provided in which at least one of a surface light emitting device and a surface light receiving device is mounted on a positioning component on which optical fibers are positioned and mounted. The positioning component is made of an insulating resin and a plurality of lead frames that provide electrical connection are molded integrally with the positioning component. Each of the lead frames is flat plate and the plate surface of each of the lead frames serves as a first electrical connection surface and an edge face of each of the lead frames serves as a second electrical connection surface. The interconnection structure is simple and linear and is advantageous in high-frequency signal transmission.07-25-2013
20120020613METHOD OF MANUFACTURING OPTICAL WAVEGUIDE HAVING MIRROR FACE, AND OPTOELECTRONIC COMPOSITE WIRING BOARD - In order to provide a method of manufacturing an optical waveguide, which enables the formation of a smooth mirror face, the following method of manufacturing an optical waveguide having a mirror face is used. The method includes: a photocurable resin sheet laminating step of laminating an uncured photocurable resin sheet for forming a core on a surface of a first cladding layer that has been formed on a substrate; a mirror face forming step of forming a mirror face for guiding light to the core by pressing a die provided with a blade having, in a cross-section, a 45° inclined plane into the photocurable resin sheet; a core forming step of forming a core having the mirror face positioned at an end thereof by selectively exposing to light, and developing, the photocurable resin sheet; and a cladding layer forming step of forming a second cladding layer so as to bury the core.01-26-2012
20120020611OPTICAL DEVICE PROVIDING ALIGNMENT SUBSTRATE FOR EMITTING WHITE LIGHT - An optical device that emits white light by mixing three or four light each having a specific color is disclosed. The optical device includes the alignment substrate having a first type of grooves each setting an optical fiber therein and a second type of a groove setting all fibers collectively. Between two type of grooves, all fibers are free from grooves to facilitate the assemble of the fibers.01-26-2012
20120020610Optoelectronic Modules and a Method for Manufacturing an Array of Optical Devices - An array of optical devices includes singlets diced or separated from a first diced surface and a second diced surface of a semiconductor wafer. Each singlet includes a single optical emitter or a single photosensitive semiconductor device. The singlets are identified as operationally fit before being arranged in corresponding features in a receiving region of a submount. The corresponding features of the submount are arranged to align and precisely control the pitch or separation distance between optical portions of a desired number of singlets. The use of operationally fit singlets dramatically increases production efficiency as it is no longer necessary to identify N contiguous operational optical devices in a semiconductor wafer to produce a precisely aligned array of N operational optical devices.01-26-2012
20120020609OPTICAL WIRING ARRANGEMENT AND OPTICAL TRANSMISSION MODULE - An optical wiring mounted on an electronic device has a light transmission path for transmitting an optical signal. A function layer that reduces friction generated when coming in contact with a structural body in the electronic device to lower than when the light transmission path comes in contact with the structural body, and that bends according to deformation of the light transmission path, is arranged.01-26-2012
20120027342CATION-POLYMERIZABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF - Provided is a cationically polymerizable resin composition which has a low viscosity, is easy to work, and is extremely rapidly cured upon irradiation with light to give a cured product excellent in optical transparency, flexibility, thermal stability, and post-heating bendability.02-02-2012
20120027341LIGHT EMITTING DEVICE AND OPTICAL TRANSMISSION SYSTEM - According to one embodiment, a light emitting device includes a substrate, a light emitting layer, a first conductivity type layer, a first and a second distributed Bragg reflector layer. The first conductivity type layer is provided between the substrate and the light emitting layer. The first reflector layer is provided between the first conductivity type layer and the substrate. First and second layers are alternately stacked therein. The second layers have refractive index different from that of the first layers. The first reflector layer has a center wavelength substantially same as emission wavelength of emission light. The second reflector layer is provided between the light emitting layer and the first reflector layer. Third and fourth layers are alternately stacked therein. The fourth layers have refractive index different from that of the third layers. The second reflector layer has a center wavelength longer than the center wavelength of the first reflector layer.02-02-2012
20120027340Semiconductor Through-Wafer Electrical Signal-Carrying Waveguide - A through-wafer electrical signal communication apparatus and method utilize a semiconductor substrate having first and surfaces and a continuous peripheral edge. The first surface supports active integrated circuit components. An electromagnetic waveguide supports data communication through the semiconductor substrate. The waveguide has an electrically conductive waveguide boundary structure surrounding a waveguide interior region formed by a portion of the semiconductor substrate. The waveguide is sized and configured to propagate electromagnetic waves of selected wavelength and propagation mode from a first waveguide end to a second waveguide end. A signal launching structure radiates electromagnetic waves into the first waveguide end. A signal pickup structure receives electromagnetic waves from the second waveguide end. The apparatus and method may utilize one or more of the waveguides. The waveguides may include a real waveguide, one or more virtual waveguide formed using light energy, and/or a hybrid waveguide comprising real and virtual waveguide structures.02-02-2012
20130195398Optical component having reduced dependency on etch depth - An optical device includes an active component on a base. The active component is a light sensor and/or a light modulator. The active component is configured to guide a light signal through a ridge of an active medium extending upwards from slab regions of the active medium. The slab regions are on opposing sides of the ridge. The active medium includes a doped region that extends into a lateral side of the ridge and also into one of the slab regions. The depth that the doped region extends into the slab region is further than the depth that the doped region extends into the ridge.08-01-2013
20130195400OPTICAL WAVEGUIDE DEVICE - An optical waveguide device is provided which can efficiently guide undesired light to the outside of a substrate or the outside of the overall optical waveguides even when optical waveguides are integrated. In the optical waveguide device, an optical waveguide is formed on a substrate, the optical waveguide includes a main waveguide in which signal light propagates and an undesired-light waveguide for removing undesired light from the main waveguide, and the undesired-light waveguide is separated by the main waveguide interposed therebetween at an intersection in which the undesired-light waveguide and the main waveguide intersect each other.08-01-2013
20130195396OPTICAL PHYSICAL INTERFACE MODULE - An optical physical interface module is provided which includes a first optical physical interface, a second optical physical interface and one or more optical components. The first optical physical interface is configured to plug into a first connector and communicate optical signals toward the first connector. The second optical physical interface is configured to receive a second connector and communicate optical signals toward the second connector. The one or more optical components are operable to process optical signals between the first and second optical physical interfaces. The optical physical interface module may be provided at the edge of a circuit board so that the circuit board has an optical interface for external communication. The optical physical interface module may be a stand-alone module or integrated into a connector of an optical cable, among other configurations.08-01-2013
20130195397Optical component having reduced dependency on etch depth - An optical device includes an active component on a base. The active component is a light sensor and/or a light modulator. The active component is configured to guide a light signal through a ridge of an active medium extending upwards from slab regions of the active medium. The slab regions are on opposing sides of the ridge. The active medium includes a doped region that extends into a lateral side of the ridge and also into one of the slab regions. The depth that the doped region extends into the slab region is further than the depth that the doped region extends into the ridge.08-01-2013
20130195399SYSTEMS, MATERIALS, AND METHODS FOR A MECHANICAL STRESS ACTIVATED INTERFACE USING PIEZO-OPTICAL COMPONENTS - A mechanical stress activated interface and system comprising piezo-optical elements is described. The piezo-optical elements are fabricated from waveguides each having a core surrounded by a cladding material. The waveguides are supported on a substrate, thereby forming a thin sheet. The interface may take advantage of ambient light for illumination. Activation of the cores, such as by a user pressing the interface, may result in changes to their indices of refraction. More ambient light will be conducted along the lengths of the cores under stressed conditions than under non-stressed conditions. The output at the ends of the piezo-optical elements may be detected by light receiving elements. The output of the light receiving elements may be used by electronics coupled to a computer to determine which waveguides have been stressed, thereby determining the location of the touch on the interface. Methods for fabricating and using the interface are also described.08-01-2013
20130195401Integrated Microtoroids Monolithically Coupled with Integrated Waveguides - A photonic apparatus comprises an integrated waveguide, an integrated resonator in the form of a microtoroid and a thermally reflowable film. The reflowable film comprises a first film area and a second film area. The reflowable film is one of a thin film and a stack of thin films. The first film area is thermally reflown, the microtoroid is formed in the thermally reflown first film area. The second film area is not reflown in the immediate vicinity of the microtoroid. The microtoroid is optically coupled to the integrated waveguide located on or located within one of or both of the first or second film areas. The first and second film areas are directly connected to each other. The microtoroid has an edge extending along a circumference. The microtoroid can be a non-inverted or an inverted microtoroid, wherein the second film area is inside or outside of the circumference.08-01-2013
20130101251Optical Module and Multilayer Substrate - In first and second electrode pads adjacent to each other formed over a multilayer substrate, the first electrode pad is connected with a first conductive via and a first internal layer conductive line successively. The second electrode pad is connected with a surface layer conductive line, third electrode pad, second conductive via, and second internal layer conductive line of the multilayer substrate. A ground conductive via or a power source conductive via is disposed between the first internal layer conductive line and the surface layer conductive line. A ground conductive line layer or power source conductive line layer is disposed between a first formation layer where the first internal layer conductive line is formed and a second formation layer where the second internal layer conductive line is formed. The first and second electrode pads are connected with the electrode pads formed on the surface of first and second optical devices.04-25-2013
20130202250INTEGRATED OPTICAL CIRCUIT WITH AN OFF-CENTER GROOVE - An integrated optical circuit includes a substrate having an input face, an output face, a lower face and an upper face, an optical waveguide extending between a first end located on the input face of the substrate and a second waveguide end located on the output face of the substrate. The integrated optical circuit further includes at least one off-center groove, the off-center groove extending from the lower face to the inside of the substrate, the at least one off-center groove being located at a non-zero distance d from the median plane, the off-center groove replacing a central groove and the at least one off-center groove being capable of attenuating the non-guided optical beam transmitted by the substrate between the first end and the second end.08-08-2013
20130202249ATTENUATED PRIMARY REFLECTION INTEGRATED OPTICAL CIRCUIT - An integrated optical circuit includes a substrate having an input face, an output face, a lower face and an upper face, at least one optical waveguide having a first waveguide end located on the input face of the substrate and a second waveguide end located on the output face of the substrate. The lower face of the substrate includes a first part that is planar and parallel to the upper face and an optical block, the optical block being positioned in the median plane and in the incidence plane, the optical block forming a protrusion at least at the primary reflection point of the integrated optical circuit with respect to the first planar part of the lower face and the optical block being capable of receiving and attenuating at least one non-guided optical beam propagating on the optical path of a primary reflection.08-08-2013
20130202248OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device includes: a waveguide unit which is formed on a semiconductor substrate including a (100) plane and includes a core layer which propagates light; a spot size converting unit which is formed on the semiconductor substrate, is optically connected to the waveguide unit, and converts diameter of light propagated; and a pair of terraces which are formed on the semiconductor substrate and are opposed to each other while sandwiching the spot size converting unit. Interval between opposed units which are opposed to each other while sandwiching the spot size converting unit in the pair of terraces changes, and each of the opposed units includes a part whose orientation tilts to a [0-11] direction with respect to a [011] direction, and position of an upper end of the spot size converting unit is higher than that of an upper end of the waveguide unit.08-08-2013
20130202247OPTICAL MODULE FABRICATED ON FOLDED PRINTED CIRCUIT BOARD - An optical interface module includes a single flexible Printed Circuit Board (PCB) including conductive traces. An electrical connector, one or more opto-electronic transducers and ancillary circuitry are disposed on the flexible PCB. The electrical connector is configured to mate with a corresponding connector on a substrate. The opto-electronic transducers are configured to be coupled to optical fibers carrying optical signals. The ancillary circuitry is coupled by the traces to the opto-electronic transducers and the electrical connector so as to convey electrical signals corresponding to the optical signals between the opto-electronic transducers and the electrical connector.08-08-2013
20130202246ACTIVE ALIGNMENT OF OPTICAL FIBER TO CHIP USING LIQUID CRYSTALS - Devices and systems to perform optical alignment by using one or more liquid crystal layers to actively steer a light beam from an optical fiber to an optical waveguide integrated on a chip. An on-chip feedback mechanism can steer the beam between the fiber and a grating based waveguide to minimize the insertion loss of the system.08-08-2013
20120076455OPTOCOUPLER - An optocoupler having an optical transmitter die, an optical receiver die, a light guide, a limiting element and a body is disclosed. The light guide is confined to upper portion of the body by using the limiting element. In one embodiment, the limiting element is a dielectric tape. In yet another embodiment, the limiting element is a pre-molded plastic attached to the lead frame via non-conductive epoxy. The use of the limiting element yields light guides having consistent shape.03-29-2012
20120093457OPTICAL 90-DEGREE HYBRID CIRCUIT - An optical 90-degree hybrid circuit includes a first demultiplexing optical coupler having two or more first input ports and two or more first output ports, a second demultiplexing optical coupler having two or more second input ports and two or more second output ports, two first arm waveguides connected to the first output ports, two second arm waveguides connected to the second output ports, a 90-degree phase shift section installed in one of the four arm waveguides, a first optical coupler and a second optical coupler connected to the first arm waveguides and the second arm waveguides, a first optical waveguide for connecting an optical splitter and the first input ports, and a second optical waveguide for connecting the optical splitter and the second input ports, wherein an optical length of the first optical waveguide is different from that of the second optical waveguide.04-19-2012
20130209025INTEGRATED OPTICAL INTERCONNECT - A method for fabricating an integrated optical interconnect includes disposing a layer over a substrate on which at least one optoelectronic transducer has been formed. A groove is formed in the layer in alignment with the optoelectronic transducer. A slanted mirror is formed in the layer at an end of the groove adjacent to the optoelectronic transducer to direct light between the optoelectronic transducer and an optical fiber placed in the groove.08-15-2013
20130209026THROUGH-SUBSTRATE OPTICAL COUPLING TO PHOTONICS CHIPS - An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements.08-15-2013
20130209027PHOTOELECTRIC COMPOSITE WIRING MODULE - A photoelectric composite wiring module includes a flexible first substrate including a conductive line and an optical fiber mounted thereon along a longitudinal direction thereof, a second substrate including a recessed portion formed thereon to receive the conductive line and the optical fiber that protrude from an end portion of the first substrate, and an optical device mounted on the second substrate and optically coupled to the optical fiber. The recessed portion includes an opening on a mounting surface side of the second substrate to mount the optical device.08-15-2013