Class / Patent application number | Description | Number of patent applications / Date published |
382150000 | Faulty soldering | 15 |
20080232676 | FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - In the fabrication of a semiconductor integrated circuit device, a 2D-3D inspection technique for solder printed on a substrate is provided which permits easy preparation of data and easy visual confirmation of a defective portion. In a substrate inspecting step, first, a 3D inspection is performed, followed by execution of 2D inspection, whereby a 2D picked-up image of the portion of a pad determined to be defective can be displayed on a larger scale simultaneously with the end of inspection, thereby providing an environment for efficient visual confirmation of the defect. Further, by subjecting a raw substrate to measurement at the time of preparing inspection data, a relation between an original height measurement reference generated automatically by the inspection system and the height of a pad upper surface is checked, whereby it is possible to measure the height and volume of printed solder based on the pad upper surface. | 09-25-2008 |
20090080764 | X-RAY INSPECTION OF SOLDER REFLOW IN HIGH-DENSITY PRINTED CIRCUIT BOARD APPLICATIONS - According to one embodiment, a method for processing one or more X-ray images includes: receiving at least one image of the one or more X-ray images, the one or more X-ray images being of an assembly extending along a plane; based on the at least one image, autonomously determining a respective displacement value for each of portions of the assembly with respect to one or more directions of the plane, each of the displacement values being determined relative to a respective actual value; storing the displacement values; and applying a rule to the stored displacement values, the rule being for determining a defect status of the assembly. | 03-26-2009 |
20090097738 | APPARATUS FOR INSPECTING SOLDER PRINTING - An apparatus for inspecting solder printing includes a memory medium, an ideal solder information generation unit, and an image processing unit. Design data are stored in the memory medium. The ideal solder information generation unit generates “ideal solder position information” and “ideal solder sizes” from the ideal solder regions in the design data. The image processing means extracts the actual solder regions of solder on the printed board K from image data imaged by the CCD camera and generates “actual solder position information” from the actual solder regions. The image processing unit generates “position misalignment amounts” between the “ideal solder position information” and “actual solder position information,” generates “print misalignment rates” indicating the extents of the “position misalignment amounts” relative to the “ideal solder sizes,” calculates a correction value relating to print position based on the “print misalignment rates,” and outputs a correction value signal to the solder printing machine. | 04-16-2009 |
20090202142 | CIRCUIT BOARD, METHOD FOR TESTING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD - A circuit board according to the present invention comprises an insulating layer, a first electronic component mounted on the insulating layer, and a solder marker provided on the insulating layer. A first solder having a first melting point constitutes the solder marker. The first electronic component is mounted on the insulating layer via a second solder having a second melting point lower than the first melting point. | 08-13-2009 |
20090202143 | SOLDER PRINTING INSPECTION APPARATUS AND COMPONENT MOUNTING SYSTEM - A component mounting system includes a solder printing inspection apparatus and a component mounting apparatus. The solder printing inspection apparatus includes an ideal solder position generation unit, an ideal loading position generation unit, an image processing unit, and an ideal solder inspection standard generation unit. The ideal solder position generation unit generates ideal solder position information, and the ideal loading position generation unit generates ideal loading position information. The image processing unit generates actual solder position information and loading estimate position information. The ideal solder inspection standard generation unit generates ideal solder inspection position information. A calculation apparatus inspects a solder included in a solder group based on actual inspection standard information obtained by shifting of the ideal solder inspection standard information by just the actual position adjustment information, and the calculation apparatus outputs mounting position adjustment information to the component mounting apparatus. | 08-13-2009 |
20100021050 | INSPECTING APPARATUS - The shape of a cream solder is accurately detected, irrespective of a cream solder composition. An illumination setting section ( | 01-28-2010 |
20110103678 | SYSTEM AND METHOD FOR ALIGNMENT AND INSPECTION OF BALL GRID ARRAY DEVICES - A system and method for high-speed alignment and inspection of components, such as BGA devices, having non-uniform features is provided. During training time of a machine vision system, a small subset of alignment significant blobs along with a quantum of geometric analysis for picking granularity is determined. Also, during training time, balls may be associated with groups, each of which may have its own set of parameters for inspection. | 05-05-2011 |
20110262029 | System and method for detecting solder paste printing - A system and a method detect solder paste printing. The system includes a detecting device for detecting solder paste when a scraping blade pushes the solder paste to spread over a template to obtain information associated with the rolling speed of the solder paste, and a state-indicating device for generating a printing-state indication based on the information associated with the rolling speed of the solder paste. The method includes detecting the solder paste during rolling to obtain the information associated with the rolling speed of the solder paste, and generating a printing-state indication based on said information associated with the rolling speed of the solder paste. By detecting the solder paste during rolling to obtain the printing state, it is possible to monitor the printing state in real time, discover an abnormal condition in time, and reduce costs to the maximum extent. | 10-27-2011 |
20120014589 | METHOD FOR ANALYZING PERIPHERAL COMPONENT INTERCONNECT SOCKETS - A method uses a time domain reflectometer (TDR) to determine unqualified clasps of a peripheral component interconnect (PCI) socket. A scanning electron microscope (SEM) captures an image of an unqualified clasp and magnifies the image from a nanometer scale to view the unqualified clasp. An electron spectroscopy for chemical analysis (ESCA) obtains a degree of oxidation at each position of the unqualified clasp in response to a determination that the unqualified clasp is oxidated. A Fourier transform infrared spectroscopy (FTIR) displays a position of the soldering flux using in response to the determination that the unqualified clasp comprises the soldering flux. | 01-19-2012 |
20120294508 | INSPECTION APPARATUS - A substrate surface detection unit performs image analysis of cross-sectional images of an object to be inspected including a substrate and an electronic component and specifies a surface image on which the surface of the substrate is photographed. A pseudo cross-sectional image creation unit specifies a region of the solder for joining the substrate and the electronic component, the solder being photographed on the cross-sectional images, and creates a pseudo cross-sectional image in which an imaged region is made to have a thickness in a pseudo manner by piling up the cross-sectional images on which the solder is photographed. An inspection unit estimates whether the joint state of the solder is good or bad by performing image analysis on the region of the solder photographed on the surface image and the pseudo cross-sectional image. | 11-22-2012 |
20130114882 | SYSTEM, DEVICE, AND METHOD FOR ASSISTING VISUAL CHECK OPERATION OF INSPECTION RESULT - With regard to a target (board) to which an automatic appearance inspection is completed, an image used in the inspection is stored, measurement data obtained by measurement processing in the inspection is stored in association with positional information of a measurement target region, and by using these pieces of stored information, an image for assisting an operation of visually checking an actual state of a specific inspection target region is displayed. This image corresponds to an area equivalent to a part of the board, and includes the checking target component. For the checking target component in the image, marking by a frame UW and lines L | 05-09-2013 |
20130182942 | METHOD FOR REGISTERING INSPECTION STANDARD FOR SOLDERING INSPECTION AND BOARD INSPECTION APPARATUS THEREBY - Performing an inspection based on a shape of a solder fillet and setting a standard of the inspection. In order to set the standard of the inspection by a method for determining whether the solder fillet of a component mounted on a board is proper by obtaining a calculation of a numerical parameter indicating a three-dimensional shape of the solder fillet, a setting screen including an image display region indicating an image of a component of a setting target and an inspection standard list is displayed to receive a user manipulation. A list in which an item name of each of plural inspection items is correlated with an input field of a standard value of a numerical parameter measured by the inspection item is displayed in the inspection standard list. | 07-18-2013 |
20130259359 | JOINT INSPETION APPARATUS - Disclosed herein is a joint inspection apparatus for judging whether an electronic component mounted on a board is appropriately soldered to the board capable of increasing accuracy in judging a state of a joint by combining at least two joint features with each other and capable of allowing a user to intuitively and easily change a reference for judging the state of the joint. The joint inspection apparatus includes: a three-dimensional shape measuring device measuring joint features; a classifying device judging a state of a joint by at least two joint features transmitted by the three-dimensional shape measuring device; and a user interface device displaying the state of the joint, wherein the state of the joint is displayed in a joint space graph in which a user may easily adjust a judgment reference. | 10-03-2013 |
20140133738 | METHOD OF INSPECTING A SOLDER JOINT - A method of inspecting a solder joint through which a lead of a semiconductor device is mounted on a printed circuit board is disclosed. The method includes setting an estimated solder joint region at an outside of an end of the lead of the semiconductor device, capturing an image of the estimated solder joint region, calculating a height of solder joint in the estimated solder joint region by using the captured image of the estimated solder joint region, and determining whether the solder joint is defective by comparing the height of the solder joint in the estimated solder joint region with a reference height of a solder joint, which is previously set. According to the method, reliability of inspection is enhanced regardless of environmental noises. | 05-15-2014 |
20140307948 | SOLDER PRINT INSPECTING DEVICE - A solder print inspecting device includes three-dimensional measurement lighting unit that directs a specific light at a printed substrate, a CCD camera for imaging the printed substrate that is illuminated by the light, three-dimensional calculating unit that performs a three-dimensional measurement of cream solder based on image data, etc., and displaying unit that displays a three-dimensional image showing a three-dimensional shape of the cream solder, along with displaying an arrow image showing an operating direction of a squeegee in a solder printing machine, an arrow image showing a conveying direction of the printed substrate, etc. | 10-16-2014 |