Entries |
Document | Title | Date |
20080205747 | DEFECT DETECTING DEVICE, DEFECT DETECTING METHOD, IMAGE SENSOR DEVICE, IMAGE SENSOR MODULE, DEFECT DETECTING PROGRAM, AND COMPUTER-READABLE RECORDING MEDIUM - A defect detecting device | 08-28-2008 |
20080219546 | METHOD, APPARATUS AND SYSTEM FOR DETECTING ANOMALIES IN MIXED SIGNAL DEVICES - An embodiment relates generally to a method of testing a mixed signal device. The method includes monitoring multiple parameters of the mixed signal device and scanning the mixed signal device with an optical source. The method also includes forming multiple windows, where each window is assigned to a respective parameter. The method further includes comparing an image from a respective image to a reference image to determine an existence of an anomaly. | 09-11-2008 |
20080219547 | METHOD OF ANALYZING A WAFER SAMPLE - In a method of analyzing a wafer sample, a first defect of a photoresist pattern on the wafer sample having shot regions exposed with related exposure conditions is detected. A first portion of the pattern includes the shot regions exposed with an exposure condition corresponding to a reference exposure condition and a tolerance error range of the reference exposure condition. The first defect repeatedly existing in at least two of the shot regions in a second portion of the pattern is set up as a second defect of the pattern. A first reference image displaying the second defect is obtained. The first defect of the shot regions in the first portion corresponding to the second defect is set up as a third defect corresponding to weak points of the pattern. The exposure conditions of the shot region having no weak points are set up as an exposure margin of an exposure process. | 09-11-2008 |
20080226158 | Data Processor and Data Processing Method - There is provided a data processor and a data processing method for displaying feature quantities for facilitating classification of defects extracted by an appearance checking device, receive defect checking information including at least coordinates of a plurality of defects transmitted from the appearance checking device for extracting defects of a sample via a communication line and defect review information including at least feature quantities transmitted from a reviewing device for acquiring images of the defects and giving the feature quantities of the defects via the communication line, displaying a graph field where at least two of the feature quantities which are plotted along axes on a display, and displaying the defects on positions of the graph field corresponding to the given feature quantities. | 09-18-2008 |
20080232674 | METHOD AND APPARATUS FOR INSPECTING PATTERN DEFECTS - An apparatus for inspecting pattern defects, the apparatus including: a defect candidate extraction unit configured to perform a defect candidate extraction process by comparing a detected image signal with a reference image signal; and a defect detection unit configured to perform a defect detection process and a defect classification process based on a partial image containing a defect candidate that is extracted by the defect candidate extraction unit, wherein the processes performed by the defect candidate extraction unit and/or the defect detection unit are performed asynchronously with an image acquisition process. | 09-25-2008 |
20080232675 | SYSTEM FOR SEARCH AND ANALYSIS OF SYSTEMATIC DEFECTS IN INTEGRATED CIRCUITS - Disclosed is a method of locating systematic defects in integrated circuits. The invention first performs a preliminary extracting and index processing of the circuit design and then performs feature searching. When performing the preliminary extracting and index processing the invention establishes a window grid for the circuit design and merges basis patterns with shapes in the circuit design within each window of the window grid. The invention transforms shapes in a each window into feature vectors by finding intersections between the basis patterns and the shapes in the windows. Then, the invention clusters the feature vectors to produce an index of feature vectors. After performing the extracting and index processing, the invention performs the process of feature searching by first identifying a defect region window of the circuit layout and similarly merging basis patterns with shapes in the defect region window. This merging process can include rotating and mirroring the shapes in the defect region. The invention similarly transforms shapes in the defect region window into defect vectors by finding intersections between basis patterns and the shapes in the defect region. Then, the invention can easily find feature vectors that are similar to the defect vector using, for example, representative feature vectors from the index of feature vectors. Then, the similarities and differences between the defect vectors and the feature vectors can be analyzed. | 09-25-2008 |
20080240545 | Inspection Assistance System, Data Processing Equipment, and Data Processing Method - To provide a device that analyzes the matching data upon determining conditions for the inspection using data processing equipment and that analyzes differences between inspection tools, thereby significantly improving and upgrading the operability of data importing and improving the usability, the present invention comprises data processing equipment connected through a communication line to a plurality of appearance inspection tools for detecting defects in a plurality of samples and a plurality of review tools for acquiring images of the defects to acquire features of the defects, wherein inspection data related to the defects in the plurality of samples from the plurality of appearance inspection tools and review data acquired by the plurality of review tools with respect to the defects are displayed on a display of the data processing equipment, and, in response to an instruction for acquiring data other than the inspection data or the review data displayed on the display, the data processing equipment acquires inspection data or review data and displays the data on the display. | 10-02-2008 |
20080247634 | SYSTEM AND METHOD FOR DETECTING DEFECTS IN CAMERA MODULES - A method for detecting defects in camera modules is provided. The method includes the following: an image is acquired from the camera module; a comparison formula and a standard value of defect luminance are set; the image is divided into many test regions; the corresponding reference regions are then plotted out; a test region is selected, and a reference region is confirmed correspondingly; averages of gray scale values of the selected test region and the confirmed reference region are calculated; a defect luminance of the selected test region is calculated; the calculated defect luminance is compared with the standard value for confirming whether the camera module is of satisfactory quality. A related system is also disclosed. | 10-09-2008 |
20080253644 | Range pattern matching for hotspots containing vias and incompletely specified range patterns - One embodiment of the present invention provides a system that identifies hotspot areas in a layout. The system receives the layout and a via range pattern which indicates one or more vias and performs range-pattern matching (RPM) on the layout based on a via-free range pattern derived from the via range pattern. The system further identifies at least one candidate area and determines whether via(s) in the candidate area matches the via(s) in the via range pattern. The system can also receives a range pattern with don't care regions. The system determines a core pattern from the range pattern, performs RPM based on the core pattern, and identifies a candidate area. The system then determines whether areas surrounding the candidate area match a non-core effective pattern of the range pattern. The system further determines if the areas surrounding the candidate area satisfy the constraints associated with any vias and the don't care regions. | 10-16-2008 |
20080279445 | Pattern defect inspection method and apparatus - The pattern defect inspection apparatus is operable to detect defects by comparing a detection image, which is obtained through scanning by an image sensor those patterns that have the identical shape and are continuously disposed on the object under tested at equal intervals in row and column directions, with a reference image obtained by scanning neighboring identical shape patterns in the row and column directions. This apparatus has a unit for generating an average reference image by statistical computation processing from the images of identical shape patterns lying next to the detection image including at least eight nearest chips on the up-and-down and right-and-left sides and at diagonal positions with the detection image being intermediately situated. The apparatus also includes a unit that detects a defect by comparing the detection image to the average reference image thus generated. | 11-13-2008 |
20080285841 | IMAGE PROCESSING UNIT FOR WAFER INSPECTION TOOL - An image processing apparatus for wafer inspection tool that is able to perform continuously cell to cell comparison inspection, die to die comparison inspection, and cell-to-cell and die-to-die hybrid comparison inspection, employing a plurality of processors. This image processing apparatus for wafer inspection tool comprises a plurality of processors for performing parallel processing, means for cutting out image data including a forward end overlap and a rear end overlap at partition boundaries in order to cut serial data into a predetermined image size, means for distributing the cutout image data to the plurality of processors, and means for assembling results of processing performed by the plurality of processors. The forward end overlap is set greater than a pitch of the cell subject to cell to cell comparison inspection. | 11-20-2008 |
20080298670 | Method and its apparatus for reviewing defects - As a result of the improvement in throughput of review SEMs, the volume of defect image data which are collected in a semiconductor mass production line becomes larger. In order to achieve efficiency in management (deletion, search, display, and the like) of the image data in response to the above circumstance, a review SEM according to the present invention is configured to judge the importance levels of defect images taken and the like from information such as the classification results of the defect images, the defect feature computed from the defect images, and the imaging states of the defect images and to provide each of the defect images with the importance level and the like as supplementary information so that a large quantity of image data is managed on the basis of the supplementary information. | 12-04-2008 |
20080317329 | Visual Inspection Method and Apparatus and Image Analysis System - An image feature is calculated based on the image of a detected defect, a coordinate feature is calculated based on position coordinates of the detected defect, and false alarm judgment is performed according to a decision tree constructed by threshold processing to the image feature or the coordinate feature. | 12-25-2008 |
20080317330 | CIRCUIT-PATTERN INSPECTING APPARATUS AND METHOD - A circuit pattern inspection apparatus and inspection method facilitate the creation of a recipe and the confirmation of a defect. The apparatus and method employ a dialogue-based operation for the creation of a recipe and the confirmation of a defect. Input items (such as contrast, calibration, etc.) for the recipe creation and their purposes are clarified. Input items (such as clustering, filtering, etc.) for the defect confirmation and their purposes are also clarified. The results obtained on the basis of these inputs are registered in the recipe. | 12-25-2008 |
20090003684 | Defect analysis - In one embodiment, a method to analyze a semiconductor wafer comprises extracting inline defect data from a data source, counting a total number of inline defects and end-of-line defects, terminating the analysis when the total number of inline defects and end-of-line defects exceeds a threshold, and mapping the inline defects onto the end-of-line defects when the total number of inline defects and end-of-line defects is less than a threshold. | 01-01-2009 |
20090003685 | METHOD AND APPARATUS FOR INSPECTION AND FAULT ANALYSIS - Apparatus for inspection and fault analysis of semiconductor chip includes stage on which to mount LSI chip, and test pattern generator supplying test pattern via stage to LSI chip. Apparatus also includes optical system having function of modulating laser beam. This optical system operates so that LSI chip is scanned and illuminated by modulated laser beam. IR-OBIRCH controller performs image processing of taking out only signal of preset frequency from signal from LSI chip via lock-in amplifier, and correlates signal taken out with scanning points. Lock-in amplifier is adapted to take out only signal of preset frequency from signal from LSI chip. A display section displays image based on image signal from IR-OBIRCH controller which confirms presence or absence of abnormal current route in LSI chip based on image signal. | 01-01-2009 |
20090010526 | TUNGSTEN PLUG DEPOSITION QUALITY EVALUATION METHOD BY EBACE TECHNOLOGY - A first embodiment of the invention relates to a method for evaluating the quality of structures on an integrated circuit wafer. Test structures formed on either on the integrated or on a test wafer are exposed to an electron beam and an electron-beam activated chemical etch. The electron-beam activated etching gas or vapor etches the test structures, which are analyzed after etching to determine a measure of quality of the test structures. The measure of quality may be used in a statistical process control to adjust the parameters used to form device structures on the integrated circuit wafer. The test structures are formed on an integrated circuit wafer having two or more die. Each die has one or more integrated circuit structures. The test structures are formed on scribe lines between two or more adjacent die. Each test structure may correspond in dimensions and/or composition to one or more of the integrated circuit structures. | 01-08-2009 |
20090010527 | Defect Inspection Method - The present invention relates to a defect detection or observation method that detects fine defects in the course of defect inspection and observation, does not detect locations not constituting defects, or classifies a defect candidate as a grain phenomenon or other phenomenon that does not affect a product. In one embodiment, a method for inspecting defects of a product having a plurality of product units formed repetitively at different locations comprises obtaining an image of the product units on the product having an appearance to be observed; detecting regions of the image each having an appearance which differs from an expected appearance by greater than a preset threshold; calculating feature amounts for the detected regions; classifying the detected regions into groups of defect candidates; forming an aggregate of the feature amounts of the detected regions in the different product units, for each of the groups of defect candidates; and determining for each product unit attributes for the detected regions by comparing the feature amounts of the detected regions belonging to each group of defect candidates with a distribution of the aggregate of the feature amounts for the group of defect candidates. | 01-08-2009 |
20090016597 | SIGNAL PROCESSING FAULT DETECTION SYSTEM - A fault detection system designed to evaluate the structural integrity of a material employs an array of sensors disposed over the material being evaluated. The sensors detect vibrations in the material and the sensor signals are fed to a data processor. The processor employs a method to analyze the linear and nonlinear characteristics of the sensor signals and then determines whether to proceed with a linear signal processing analysis or a nonlinear signal processing analysis of the sensor signals. Once the analysis is completed, the results are compared to baseline results to determine what if any divergence exists between the results and the baseline results. A significant divergence indicates a potential material failure. The fault detection system will indicate such a potential failure through a visual alarm on a graphical user interface. | 01-15-2009 |
20090028422 | Systems and Methods for Detecting Watermark Formations on Semiconductor Wafers - Systems and methods for detecting watermark formations on semiconductor wafers are described. In one embodiment, a method comprises providing a semiconductor wafer having at least one watermark sensitive region fabricated thereon, subjecting the wafer to a wet processing step, enhancing a susceptibility to detection of at least one watermark formation created on the at least one watermark sensitive region, and detecting the at least one watermark formation. In another embodiment, a method comprises growing a first oxide layer on a surface of a semiconductor wafer, patterning a watermark sensitive structure on the first oxide layer, depositing a silicon layer over the first oxide layer, doping a region of the silicon layer over the watermark sensitive structure with an impurity to create a watermark sensitive region that is prone to retaining watermark formations as result of a wet processing step, and growing a second oxide layer over the silicon layer. | 01-29-2009 |
20090028423 | METHOD AND APPARATUS FOR MURA DETECTION AND METROLOGY - The invention addresses the lack of comprehensive and quantitative methods for measurements of unwanted visual “mura” effects in displays and image sensors. Mura is generated by errors that are significantly smaller than what is needed for the function of the device, and sometimes smaller than the random variations in the patterns or structures. Capturing essentially all mura defects in a workpiece in a short time requires a daunting combination of sensitivity, statistical data reduction and speed. The invention devices an inspection method, e.g. optical, which maximizes the sensitivity to mura effects and suppresses artifacts from the mura inspection hardware itself and from noise. It does so by scanning the sensor, e.g. a high-resolution camera, creating a region of high internal accuracy across the mura effects. One important example is for mura related to placement errors, where a stage with better than 10 nanometer precision within a 100 mm range is created. A sampling scheme reduces the data volume and separates between instrument errors and real defects based on their different geometrical signatures. The high-resolution camera scans sparse lines at an angle to the dominating directions of expected mura defects, creating extended sensor fields with high internal precision, and quantifying edge placements in small windows in said extended fields. The mura is classified and presented as type, location and severity. | 01-29-2009 |
20090034833 | EXPOSURE APPARATUS AND EXPOSURE METHOD - Any defect of a board fabricated via a drawing process executed by a drawing device attributed to Gerber data is prevented. Gerber data of vector form representing a wiring pattern drawn directly on a board is loaded before it is expanded into drawing raster data by a RIP processing ( | 02-05-2009 |
20090041334 | PATTERN INSPECTION METHOD, PATTERN INSPECTION APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A pattern inspection method includes scanning a substrate on which patterns are formed with a charged beam, detecting a charged particle generated from the surface of the substrate, and then acquiring an image of the patterns; comparing the image of the patterns with CAD data for the patterns to inspect the patterns; measuring the dimensions of an arbitrary pattern using the image; calculating a statistic of a dimensional value of the arbitrary pattern obtained by the measurement; judging the necessity of a correction on the basis of the calculated statistic; and performing correction processing when the correction is judged to be necessary. | 02-12-2009 |
20090041335 | PATTERN DEFECT INSPECTION METHOD AND APPARATUS - The pattern defect inspection apparatus is operable to detect defects by comparing a detection image, which is obtained through scanning by an image sensor those patterns that have the identical shape and are continuously disposed on the object under tested at equal intervals in row and column directions, with a reference image obtained by scanning neighboring identical shape patterns in the row and column directions. This apparatus has a unit for generating an average reference image by statistical computation processing from the images of identical shape patterns lying next to the detection image including at least eight nearest chips on the up-and-down and right-and-left sides and at diagonal positions with the detection image being intermediately situated. The apparatus also includes a unit that detects a defect by comparing the detection image to the average reference image thus generated. | 02-12-2009 |
20090046922 | Surface Inspecting Apparatus - A wafer to be inspected W is placed on an XY stage | 02-19-2009 |
20090052765 | PATTERN SHAPE EVALUATION METHOD, PATTERN SHAPE EVALUATION DEVICE, PATTERN SHAPE EVALUATING DATA GENERATION DEVICE AND SEMICONDUCTOR SHAPE EVALUATION SYSTEM USING THE SAME - A pattern shape evaluation method and semiconductor inspection system having a unit for extracting contour data of a pattern from an image obtained by photographing a semiconductor pattern, a unit for generating pattern direction data from design data of the semiconductor pattern, and a unit for detecting a defect of a pattern, through comparison between pattern direction data obtained from the contour data and pattern direction data generated from the design data corresponding to a pattern position of the contour data. | 02-26-2009 |
20090052766 | Method for the optical inspection and visualization of optical measuring values obtained from disk-like objects - The present invention relates to a method for optically inspecting and visualizing optical measuring values from at least one image of a disk-like object, including the steps of recording said at least one image of said at least one disk-like object, wherein a plurality of optical measuring values are produced from said at least one recorded image; generating a resulting image, wherein an area of the surface of said disk-like object having optical measuring values within a predetermined interval, is associated with a colour or brightness value selected from a predetermined range; and varying at least one imaging parameter as a function of the detected and evaluated optical measuring values and/or as a function of a visual inspection of the resulting image by an operator. | 02-26-2009 |
20090060317 | MASK DEFECT REPAIR THROUGH WAFER PLANE MODELING - Methods and apparatus relating to repair of mask defects through wafer plane modeling are described. In an embodiment, an updated edge location for a photomask is determined based on an image of the photomask and a comparison of contour of a corresponding wafer to physical design data of a corresponding device design. Other embodiments are also described. | 03-05-2009 |
20090067703 | Memory cell and page break inspection - A method of inspecting an array having memory blocks with page breaks disposed between them. The memory array is imaged with a sensor at a magnification such that the memory cell size is a whole integer pixel multiple within the sensor. This creates an array image that is divided into sections. Those sections that include at least a portion of the memory blocks are selected into a candidate image. Pixels of the image within a boundary distance of a horizontal single line of pixels are inspected to determine horizontal edges of the memory blocks to an accuracy of a single pixel. Pixels of the image within a boundary distance of a vertical single line of pixels are inspected to determine vertical edges of the memory blocks to an accuracy of a single pixel. An image of a first memory block is compared on a pixel by pixel basis to an image of a second memory block to determine differences between pixel values in the first and second memory blocks, where the images are created at the same magnification using the imaging sensor. The differences are flagged as potential memory block defects. Images of the page breaks are compared to determine differences between pixel values of the images of the page breaks, and the differences are flagged as potential page break defects. | 03-12-2009 |
20090080763 | METHOD AND SYSTEM FOR THE VISUAL CLASSIFICATION OF DEFECTS - A method and system for the classifying of defects in a device is disclosed. The method and system comprises directly classifying samples based upon a feature space; and creating knowledge from the samples of a feature group within the feature space for a supervised classifier. Finally, the method and system includes selecting features to create a best feature group from the feature space for a particular classification of defects. A visual classifier in accordance with the present invention is utilized in three different ways to improve speed and accuracy of the classification. First, the visual classifier directly classifies data. Second, the visual classifier can help to create knowledge about the defects quickly and correctly. Third, a feature selection process is also performed by the visual classifier in accordance with the present invention. | 03-26-2009 |
20090116727 | Apparatus and Method for Wafer Edge Defects Detection - A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system a image processor to automatically detect and characterize defects on the wafer's edge. | 05-07-2009 |
20090123060 | INSPECTION SYSTEM - An inspection system ( | 05-14-2009 |
20090129663 | Method and circuit for correcting defect pixels in image signal - The invention discloses a method and circuit for correcting defect pixels in an image signal. First, the invention generates a luminance histogram for all pixels in the image signal and then selects N candidate defect pixels from all pixels according to the luminance histogram and a first threshold. Afterward, the invention sets a window for each candidate defect pixel and then calculates N averaged luminance corresponding to the N windows. Further, the invention judges whether an absolute difference between the luminance of each candidate defect pixel and the corresponding averaged luminance is larger than a second threshold. If it is YES, the candidate defect pixel is recorded as a real defect pixel. Finally, the invention utilizes at least one non-defect pixel around the real defect pixel to correct the real defect pixel. The invention not only compensates the defect pixels accurately and effectively but also reduces required time in correction. | 05-21-2009 |
20090129664 | PATTERN INSPECTION APPARATUS AND METHOD - A pattern inspection apparatus includes a stage configured to mount thereon a target workpiece to be inspected where patterns are formed, at least one sensor configured to move relatively to the stage and capture optical images of the target workpiece to be inspected, a first comparing unit configured to compare first pixel data of an optical image captured by one of the at least one sensor with first reference data at a position corresponding to a position of the first pixel data, and a second comparing unit configured to compare second pixel data of an optical image captured by one of the at least one sensor at a position shifted by a sub-pixel unit from the position where the optical image of the first pixel data is captured, with second reference data at a position corresponding to the position of the second pixel data. | 05-21-2009 |
20090136120 | LED INSPECTION APPARATUS AND LED INSPECTION METHOD USING THE SAME - Disclosed are a light emitting diode (LED) inspection apparatus, which can determine whether an LED has a defect such as leakage current, without making physical contact with the LED being inspected, and an LED inspection method thereof. The LED inspection apparatus includes an ultraviolet emission unit emitting UV light to an LED, an image generation unit generating an image of the LED to which the UV light is emitted, and a control unit obtaining color or intensity information of the LED from the image of the LED and determining, based on the color information, whether the LED is defective | 05-28-2009 |
20090136121 | Defect review method and apparatus - A candidate-defect classification method includes the steps of acquiring a scanning electron microscope (SEM) image of a candidate defect detected in an inspection from a sample including a pattern formed thereon, the inspection being preliminarily performed by an other inspection device; computing a feature value of the candidate defect by processing the SEM image; executing defect classification of the candidate defect as any one of a pattern shape defect and an other defect by using the computed feature value; acquiring positional information contained in design data of the pattern with respect to a candidate defect classified as the pattern shape defect; and extracting a systematic defect from among candidate defects classified as the pattern shape defects by performing a comparison of the positional information contained in the design data of the acquired candidate defect to positional information of a portion that has a high probability of causing a pattern formation failure and that has been obtained from the design data of the pattern, the systematic defect being caused due to a layout shape of the pattern, properties of a processor for forming the pattern, or the like. | 05-28-2009 |
20090148033 | OPTICAL INSPECTION APPARATUS FOR SUBSTRATE DEFECT DETECTION - A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein. | 06-11-2009 |
20090154790 | Wiring Pattern Inspection Method and Inspection Apparatus for Flexible Printed Wiring Board - In a method for inspecting a wiring pattern on a flexible printed wiring board, light is illuminated from a front surface side of the TAB tape T while a drum is provided on the rear surface side of the TAB tape T such that a reflection method becomes main and a transmission method becomes subordinate, and when imaging a wiring pattern image of an inspection part D on the front surface side, it becomes possible to determine the quality of a wiring pattern taking advantage of the reflection method. Furthers by utilizing the indirect transmission light, defects of a short-circuiting type on the light permeable insulating film that are difficult to be detected with the reflection method can be detected as darker defects than the light permeable insulating film by the transmission method. | 06-18-2009 |
20090161943 | INSPECTION APPARATUS AND INSPECTION METHOD - The invention is directed to find a false defect from defect candidates and obtain a threshold with which the false defect can be eliminated by the smallest number of review times. Defect candidates are reviewed and selected as a defect or a false defect. By deleting a defect candidate having a characteristic quantity equal to or less than that of the false defect from a map or displaying it in another sign, the false defect can be determined visually. Since the defect candidate having the characteristic quantity equal to or less than that of the selected false defect is deleted from the map or displayed in another sign, the defect candidates unnecessary to set a threshold are not reviewed. The number of defect candidates to be reviewed can be largely reduced as compared with that in the conventional technique. Further, by repeating the above work, the threshold is automatically calculated, and an inspection result map with the threshold is displayed, so that a re-inspection is unnecessary. | 06-25-2009 |
20090169094 | SYSTEM AND METHOD FOR INSPECTING CHIPS IN A TRAY - A system for inspecting chips in a tray comprises a three-dimensional sensor, a focus computing unit, an image sensor and a focusing device. The three-dimensional sensor is used to obtain the height signals of surfaces of the chips. The focus computing unit calculates the focusing positions of chips. The surface inspection sensor is used to inspect the surfaces of the chips. The focusing device is used to bring the images of the surfaces of the chips into the focus of the image sensor. | 07-02-2009 |
20090196490 | DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS - A method, of inspecting a semiconductor device for defects, includes: acquiring an observation image of the semiconductor device, the observation image including a defect inspection object area which has a repetitive pattern; superposing a reference on the observation image thereby to form a test-mule image representing a version of the observation image in which signals have been removed from a given area, including the defect inspection area, masked with the reference ; and inspecting for defects in the test-mule image thereby to identify corresponding defects in the observation image. | 08-06-2009 |
20090208090 | METHOD AND APPARATUS FOR INSPECTING DEFECT OF PATTERN FORMED ON SEMICONDUCTOR DEVICE - In the inspection apparatus for a defect of a semiconductor and the method using it for automatically detecting the defect on a semiconductor wafer and presuming the defect occurrence factor using the circuit design data, a plurality of shapes are formed from the circuit design data by deforming the design data with respect to shape deformation items stipulated for respective defect occurrence factor for comparison with the inspection object circuit pattern. The defect is detected by comparison of the group of shapes formed and the actual pattern. Further, the occurrence factors of these defects are presumed, and the defects are classified according to respective factor. | 08-20-2009 |
20090208091 | INSPECTION APPARATUS FOR INSPECTING PATTERNS OF SUBSTRATE - A degradation in throughput is prevented even in cases where it is necessary to reduce a pixel size during inspection according to a finer circuit pattern. In an inspection method and an inspection apparatus in which an inspected sample having a circuit pattern is irradiated with a charged particle beam to generate a signal, an image is obtained from the signal, and in which a defect of the circuit pattern is detected from the image, the inspection is performed while an inspected pixel size in a direction in which the charged particle beam is scanned relative to the inspected sample and an inspected pixel size in a stage moving direction are separately set. The stage is moved while the inspected sample is placed thereon. | 08-20-2009 |
20090208092 | APPERANCE INSPECTION APPARATUS WITH SCANNING ELECTRON MICROSCOPE AND IMAGE DATA PROCESSING METHOD USING SCANNING ELECTRON MICROSCOPE - The present invention provides an appearance inspection apparatus that allows a user to give precedence to either defect detection performance or throughput. The appearance inspection apparatus allows a user to select the frequency of a digital image signal or the ratio of the frequency of the digital image signal to a sampling rate. Further, a user is allowed to select either throughput improvement or S/N improvement to prioritize. | 08-20-2009 |
20090220142 | LINEAR PATTERN DETECTION METHOD AND APPARATUS - The present invention provides a linear pattern detection method which can extract and detect linear patterns distinguished by a microscopic defect distribution profile even if skipped measurements are taken. The linear pattern detection method acquires a defect map created based on results of defect inspection of a wafer; divides the defect map into a plurality of first segments; calculates a correlation coefficient of a point sequence in each of the first segments, the point sequence corresponding to a defect group contained in the first segments; calculates a total number of those first segments in which the correlation coefficient is equal to or larger than a first threshold; and determines that the wafer contains a linear pattern if the total number is equal to or larger than a second threshold. | 09-03-2009 |
20090226077 | DEFECT INSPECTION METHOD AND COMPUTER-READABLE STORAGE MEDIUM - The present invention includes an illuminance adjustment step of setting an optimum illuminance of the illumination; and a defect inspection step of picking up the image of the substrate illuminated with the illumination at the optimum illuminance, wherein the illuminance adjustment step has: a first step of applying illuminations at different illuminances to a plurality of measurement regions on a front surface of the substrate and picking up an image of each of the measurement regions, while moving the substrate; a second step of making a luminance of the picked up image of each of the measurement regions into a histogram to find a reference luminance where an integral value from a maximum luminance side of the histogram is a predetermined value; and a third step of calculating a correlation between each of the reference luminances and the illuminance, and setting based on the correlation an illuminance at which the reference luminance coincides with a predetermined luminance, as the optimum illuminance. | 09-10-2009 |
20090238444 | OPTICAL IMAGING APPARATUS AND METHOD FOR INSPECTING SOLAR CELLS - An optical imaging apparatus for inspecting a solar cell includes a power supply configured to apply a reverse biased voltage to the solar cell such that shunt defects in the solar cell will generate heat, a thermal imaging device configured to obtain the thermal image of the solar cell, a computing unit including a thermal image analysis module configured to identify hot spots in the thermal image, a locating module configured to locate the center positions of the hot spots, a visible image analysis module configured to identify the defect features of the hot spots, and a visible light imaging device configured to acquire visible images of the hot spots. | 09-24-2009 |
20090238445 | Method of detecting a defect on an object - In a method of detecting a defect on an object, a preliminary reference image can be obtained from a plurality of comparison regions defined on the object. The preliminary reference image is divided into reference zones by a similar brightness. Each of the reference zones is provided with substantially the same gray level, respectively, to obtain a reference image. Whether a defect exists in an inspection region in the comparison regions is determined using the reference image. Thus, defects in the inspection regions having different brightnesses can be detected using the properly obtained reference image. | 09-24-2009 |
20090252403 | METHOD AND ITS APPARATUS FOR REVIEWING DEFECTS - A method for reviewing a defect on a sample involves the steps of imaging a defect image containing the defect in first magnification by using an image acquisition unit, synthesizing a reference image not containing the defect from the defect image, comparing the defect image acquired with the reference image synthesized to detect a defect applicant, executing a processing for classifying the defect applicant into a defect and a normal portion and imaging only the portion identified as the detect in second magnification. The method makes it possible to specify a defect position without error from the image taken in the first magnification and to image the defect in the second magnification when a large number of defects are observed within a short time by using the image acquisition unit. | 10-08-2009 |
20090257646 | APPARATUS AND METHOD FOR DETECTING DEFECTS IN WAFER USING LINE SENSOR CAMERA - An apparatus and method for detecting defects in a wafer are provided. An optical part is disposed under an inspection stage and radiates infrared light onto the wafer disposed on an inspection region formed of a transmissive material on the inspection stage. An image obtaining part detects the infrared light transmitted through the wafer disposed on the inspection stage to output an image signal. A conveying part conveys the image obtaining part or the inspection stage in a short side direction of a photographing region of a line sensor included in the image obtaining part, and outputs a pulse signal having a predetermined period corresponding to a relative straight moving distance between the image obtaining part and the inspection stage. A controller counts the pulse signal and outputs a photographing instruction signal controlling the image obtaining part to photograph the wafer whenever the wafer is conveyed in the short side direction of the photographing region of the line sensor toward the image obtaining part by a distance corresponding to the length of short sides of the photographing region. A defect detection part combines each image signal to generate an inspection image corresponding to the wafer, and detects positions of defects existing in the wafer. Each of the line sensors transmits charges accumulated therein to an adjacent line sensor when a photographing instruction signal is input, and then detects the infrared light transmitted through the wafer, and the line sensor positioned at an end in an opposite direction of the conveyance direction outputs charges accumulated therein as the image signal from a time when the number of input photographing signals exceeds the number of line sensors. | 10-15-2009 |
20090257647 | Method and Apparatus for Inspecting Defects - A two-dimensional sensor is installed inclining at a predetermined angle to a moving direction of a stage on which an object to be inspected is mounted and, in synchronism with the movement of the stage, a picked up image is rearranged so that there can be obtained an image in high-density sampling with a picture-element size or less of the two-dimensional sensor with respect to a wafer. Thus, interpolation calculation during position alignment becomes unnecessary, and size calculation and classification of a defect can be performed with high accuracy. | 10-15-2009 |
20090268959 | METHOD AND APPARATUS FOR REVIEWING DEFECTS - Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method. | 10-29-2009 |
20090279776 | Microscopic inspection apparatus for reducing image smear using a pulsed light source and a linear-periodic superpositioned scanning scheme to provide extended pulse duration, and methods useful therefor - An automated optical inspection system includes a pulsed light source illuminating an article to be inspected thereby to generate at least one image thereof, at least one camera having a field of view, and a relative motion provider operative to provide relative motion between the camera and at least one image of at least a portion of the article. The relative motion provider may include a first continuous motion provider and a second, velocity-during-imaging-lessening motion provider. The relative motion is a superposition of a first continuous component of motion provided by the first motion provider and a second, smaller component of motion provided by the second motion provider which lessens the velocity of the at least one image relative to the camera, during imaging. | 11-12-2009 |
20090290783 | Defect Inspection Method and Apparatus Therefor - The invention relates to a defect inspection apparatus in which images of mutually corresponding areas in identically formed patterns on a sample are compared to detect mismatched portions of the images as defects. The defect inspection apparatus includes an image comparator that creates a feature space with the use of feature quantities calculated from pixels of images acquired under different optical conditions and detects outlier values in the feature space as defects. Thus, the defect inspection apparatus can detect various defects with high sensitivity even if there are luminance differences between images of identical patterns which are attributable to the difference in wafer pattern thickness. | 11-26-2009 |
20090290784 | METHODS AND SYSTEMS FOR BINNING DEFECTS DETECTED ON A SPECIMEN - Methods and systems for binning defects detected on a specimen are provided. One method includes comparing a test image to reference images. The test image includes an image of one or more patterned features formed on the specimen proximate to a defect detected on the specimen. The reference images include images of one or more patterned features associated with different regions of interest within a device being formed on the specimen. If the one or more patterned features of the test image match the one or more patterned features of one of the reference images, the method includes assigning the defect to a bin corresponding to the region of interest associated with the reference image. | 11-26-2009 |
20090290785 | APPARATUS AND METHOD FOR INSPECTING LIQUID CRYSTAL DISPLAY - A liquid crystal display (LCD) inspection apparatus and method are provided. The inspection apparatus and method are capable of automatically and accurately detecting defects of an LCD panel, and providing information of the automatically-detected defects of the LCD panel to the operator, thereby enabling the operator to easily recognize the defects. | 11-26-2009 |
20090304260 | INSPECTION SYSTEM AND A METHOD FOR DETECTING DEFECTS BASED UPON A REFERENCE FRAME - A wafer inspection system and a method for inspecting a wafer. The method includes: acquiring multiple frames that cover a first area that comprises a die and a first surrounding area that surrounds the die; wherein the frames partially overlap to provide overlap areas; and processing a sequence of decomposed images of overlap areas such as to align mutually misaligned frames and generating a die reference image. | 12-10-2009 |
20090304261 | DEFECT INSPECTION APPARATUS, DEFECT INSPECTION METHOD, AND MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE - A distinguishing size for distinguishing a pseudo defect from a defect caused by a process trouble is stored in a first storage area. Defect data are stored in a second storage area. A processing unit detects a defect on a wafer surface, and stores the defect data in the second storage area. Before a defect detection process is completed for all areas of the wafer surface, a size of a defect detected in a partial area is compared with the distinguishing size stored in the first storage area. If the detected defect has a size equal to or larger than the distinguishing size, an alarm is output through an output unit, whereas if a defect having a size equal to or larger than the distinguishing size is not detected, the defect detection process is executed for the area still not subjected to the defect detection process. | 12-10-2009 |
20090310849 | Defective pixel processing device and defective pixel processing method - In order to determine a defective pixel speedily and accurately, a defective pixel processing device includes: first determination means that determines whether or not each of pixels outputted from an imaging device is a defective pixel candidate by comparing pixel data of the pixel with a threshold value; and second determination means that determines whether or not the defective pixel candidate determined by the first determination means is a defective pixel by comparing the pixel data of the defective pixel candidate with the pixel data of the pixels around the defective pixel candidate. | 12-17-2009 |
20090316980 | METHOD AND APPARATUS FOR MATCHING DEFECT DISTRIBUTION PATTERN - A comparison system is provided with a defect inspection unit, a reference pattern storage unit, a pattern comparison unit, a comparison result processing unit and an output unit. The inspection unit inspects an object processed by a processing system, such as a semiconductor wafer, and obtains the distribution pattern of defects occurring on the surface of the object. The storage unit previously stores a reference pattern indicating a characteristic configuration of a specific portion of the processing system, which comes into contact with or approaches the object. The comparison unit compares the defect distribution pattern obtained by the defect inspection unit with the reference pattern stored in the storage unit. The comparison result processing unit obtains the degree of coincidence between the two patterns based on the comparison performed by the pattern comparison unit. The output unit outputs the obtained degree of coincidence to a display or the like. | 12-24-2009 |
20090316981 | Method and device for inspecting a disk-shaped object - In order to improve the detectability of defects in structures incorporated beneath the surface of a wafer, it is suggested to acquire an IR subimage of the illuminated wafer with an IR image acquisition device and a VIS subimage with a VIS image acquisition device. The acquisition is performed simultaneously and is controlled such that the same area of the wafer is imaged sharply by both image acquisition devices. An image processor is used to determine whether a detected defect is attributable to a defect on the surface or to a defect of the structures located beneath the surface. | 12-24-2009 |
20090324057 | Optical Inspection Tools Featuring Parallel Post-Inspection Analysis - An optical inspection tool can automatically perform analysis/operations that after the tool has generated data identifying defects (e.g. a defect list) from an inspection run of an object such as a semiconductor wafer. The tool can decouple post-inspection tasks from performing inspection runs so that one or more post-inspection tasks are performed on defect data from a previous inspection run while another inspection run is in progress. This can significantly improve the throughput of the tool when multiple inspections are performed, since the inspection run time effectively is shortened to include only the time the tool is actually used to acquire defect data. One or more post-inspection tasks can be performed, including, but not limited to, merging inspection runs, removing duplicate defects, removing straight-line false alarms, and characterizing defects. | 12-31-2009 |
20100002932 | PHOTOVOLTAIC DEVICES INSPECTION APPARATUS AND METHOD OF DETERMINING DEFECTS IN PHOTOVOLTAIC DEVICE - A photovoltaic devices inspection apparatus and method of determining defects in photovoltaic devices that uses electroluminescence can find both the quality of the photovoltaic devices from the state of electroluminescence and the possibility of the photovoltaic devices becoming defective in the future by applying constant electric current to the photovoltaic devices causing electroluminescence of the photovoltaic devices (S | 01-07-2010 |
20100008563 | Section processing method and its apparatus - a section processing method of the invention is the section processing method including a mark portion forming step of forming a mark portion capable of being processed by the removal processing and capable of identifying a mark shape in the section for observation within a range of capable of forming the section for observation at a vicinity of the observation target section, a section forming step of forming the section for observation by subjecting the sample and the mark portion to the removal processing within a range of including the mark portion formed by the mark portion forming step, and an observation image acquiring step of acquiring an observation image of the section for observation in the midst of being formed or after having been formed by the section forming step. | 01-14-2010 |
20100008564 | INSPECTION APPARATUS FOR INSPECTING PATTERNS OF A SUBSTRATE - A pattern inspection apparatus has a setting unit of a plurality of cell areas A and B of different cell comparison pitches and inspects the plurality of cell areas of the different cell comparison pitches in accordance with settings of the setting unit. As information to read out image data for an inspection image and a reference image from an image memory, in addition to position information of a defective image, identification information showing either a cell comparison or a die comparison and relative position information of the reference image can be set. The apparatus also has a unit for setting a plurality of inspection threshold values every inspection area and inspects a plurality of inspection areas by the plurality of inspection threshold values. | 01-14-2010 |
20100014748 | METHOD AND APPARATUS FOR REAL TIME FAULT DETECTION IN HIGH SPEED SEMICONDUCTOR PROCESSES - An apparatus for collecting data during processing of a structure, such as a semiconductor wafer, which includes data collection devices or sensors positioned in a processing chamber for processing the wafer. The data collection sensors may operate at speeds of about 10 Hertz (Hz). A controller communicates and receives data from the data collection sensors. A data processing device communicates with the controller for receiving and processing the data, and the data processing device analyzes the data and determines at least one process response. | 01-21-2010 |
20100021048 | Fault Detection of a Printed Dot-Pattern Bitmap - Embodiments of the present invention enable fault detection in a printed dot-pattern image. Certain applications of the present invention are its use in various embodiments of a system for inspection of a printed circuit board (“PCB”) substrate. In embodiments, a generated distortion map is based on a comparison of a reconstructed dot-pattern image, a simulated reference bitmap, and an error map representing differences between the reconstructed dot-pattern image and the reference bitmap. In embodiments, the pixels of the distortion map are color coded to identify the locations and types of aberrations that were discovered as a result of the comparison. | 01-28-2010 |
20100021049 | Method and apparatus for failure analysis of semiconductor integrated circuit devices - A method of analyzing of a semiconductor integrated circuit includes inspecting a physical defect in a semiconductor wafer, subjecting the semiconductor integrated circuit chip to a logic test and extracting a malfunctioning chip, analyzing a detected signal observed from the malfunctioning chip by an analyzer, obtaining the layer and coordinates of a circuit related the detected signal, collating the physical defect with the circuit, and identifying the physical defect associated with the circuit. The layer and coordinates of the circuit is extracted using design data. An inspection step identifying information is collated with the layer of the circuit, and an in-chip coordinates of the physical defect is collated with the coordinated of the circuit. | 01-28-2010 |
20100067780 | DEFECT DETECTING APPARATUS, DEFECT DETECTING METHOD, INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM THEREFOR - A defect detecting apparatus captures images of a protein chip formed on each die of a wafer at a plurality of different focal positions, with respect to every division region obtained by dividing each die in plurality; stores inspection target images for every division region at every focal position together with an ID for identifying each division region; creates a model image for every division region at every focal position by calculating an average luminance value of pixels of each inspection target image having the corresponding ID; extracts a difference between the model image and each inspection target image as a difference image; extracts a Blob having an area larger than a preset value from each difference image as a defect; and classifies the kind of the defect based on a feature point of the extracted Blob. | 03-18-2010 |
20100067781 | Process Excursion Detection - A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected. | 03-18-2010 |
20100074515 | Defect Detection and Response - To increase inspection throughput, the field of view of an infrared camera can be moved over the sample at a constant velocity. Throughout this moving, a modulation (such as optical or electrical) can be provided to the sample and infrared images can be captured using the infrared camera. Moving the field of view, providing the modulation, and capturing the infrared images can be synchronized. The infrared images can be filtered to generate the time delay lock-in thermography, thereby providing defect identification. In one embodiment, this filtering accounts for the number of pixels of the infrared camera in a scanning direction. For the case of optical modulation, a dark field region can be provided for the field of view throughout the moving, thereby providing an improved signal-to-noise ratio during filtering. Localized defects can be repaired by a laser integrated into the detection system or marked by ink for later repair in the production line. | 03-25-2010 |
20100074516 | DEFECT DETECTING APPARATUS, DEFECT DETECTING METHOD, INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM THEREFOR - A defect detecting apparatus captures an image of a protein chip formed on each die of a wafer with a low magnification for every first division region obtained by dividing each die in plurality; stores each obtained image as an inspection target image together with an ID for identifying each first division region; creates a model image for every first division region by calculating an average luminance value of pixels of each inspection target image; extracts a difference between the model image and each inspection target image as a difference image; determines presence of a defect by extracting a Blob having an area larger than a preset value from the difference image; captures a high-magnification image of every second division region; creates a model image again and extracts a Blob; and determines the kind of the defect based on a feature point of the defect. | 03-25-2010 |
20100080446 | INLINE LOW-DAMAGE AUTOMATED FAILURE ANALYSIS - A system and method for failure analysis of devices on a semiconductor wafer is disclosed. The present invention comprises the use of an inline focused ion beam milling tool to perform milling and image capturing of cross sections of a desired inspection point. The inspection points are located by identifying at least one fiducial that corresponds to an X-Y offset from the desired inspection point. The fiducials are recognized by a computer vision system. By automating the inspection process, the time required to perform the inspections is greatly reduced. | 04-01-2010 |
20100119144 | METHODS AND SYSTEMS FOR UTILIZING DESIGN DATA IN COMBINATION WITH INSPECTION DATA - Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium. | 05-13-2010 |
20100128970 | METHOD AND APPARATUS FOR REVIEWING DEFECTS - An apparatus for reviewing defects including an image processing section (defect classification device section) with a function of estimating a non-defective state (reference image) of a portion in which the defect exists by use of a defect image, and a function of judging criticality or non-flat state of the defect by use of the estimation result. It becomes possible to establish both of a high-throughput image collecting sequence in which any reference image is not acquired and high-precision defect classification, and then to realize both of a high performance classifying function and a high-throughput image collecting function in a defect reviewing apparatus which automatically collects and classifies images of defects existing on a sample of a semiconductor wafer or the like. | 05-27-2010 |
20100135570 | TEST FAIL ANALYSIS ON VLSI CHIPS - Compact graphical representations of common test fail signatures and process related test fails are provided through methods of selecting, calculating and/or presenting information. The input may be a list of failing tests on a sample of devices under test from chip and/or wafer process fails. The failing tests are identified and then other tests that fail at the same time may be identified. Several graphical outputs are provided, including all possible combinations between test fails and between test fails and process fails. The dependencies are printed as sorted two dimensional bitmaps that are compact representations of the results using color codes. Subtraction of two independent bitmaps is provided, which eliminates common properties and emphasizes differences between multiple bitmaps which allows for quick identification of differences of process fails potentially different between the two different bitmaps indicating potential root causes for the selected one of the test fails. | 06-03-2010 |
20100142800 | METHODS AND SYSTEMS FOR DETECTING DEFECTS ON A RETICLE - Methods and systems for detecting defects on a reticle are provided. One method includes printing a single die reticle in first areas of a wafer using different values of a parameter of a lithography process and at least one second area using a nominal value of the parameter. The method also includes acquiring first images of the first areas and second image(s) of the at least one second area. In addition, the method includes separately comparing the first images acquired for different first areas to at least one of the second image(s). The method further includes detecting defects on the reticle based on first portions of the first images in which variations in the first images compared to the at least one second image are greater than second portions of the first images and the first portions that are common to two or more of the first images. | 06-10-2010 |
20100150429 | E-BEAM DEFECT REVIEW SYSTEM - The present invention relates to a defect review system, and/or particularly, to an apparatus and method of defect review sampling, review method and classification on a semiconductor wafer or a pattern lithography reticle during integrated circuit fabrication. These objects are achieved in comparing a reviewed image with a reference image pick-up through a smart sampling filter. A clustering computer system base on high speed network will provide data cache and save operation time and memory. A smart review sampling filter automatically relocate abnormal pattern or defects and classify the device location extracted from design database and/or from golden die image on the same substrate. The column of the present defect review system is comprised of the modified SORIL type objective lens. This column provides solution of improving throughput during sample review, material identification better image quality, and topography image of defect. One embodiment of the present invent adopts an optical auto focusing system to compromise micro height variation due wafer surface topography. And another embodiment adopts surface charge control system to regulate the charge accumulation due to electron irradiation during the review process. | 06-17-2010 |
20100150430 | VISUAL INSPECTION APPARATUS AND VISUAL INSPECTION METHOD FOR SEMICONDUCTOR LASER CHIP OR SEMICONDUCTOR LASER BAR - With a semiconductor laser chip that is an inspection object being pushed up from the back surface of an adhesive sheet by a push-up member and the semiconductor laser chip being positioned above the other semiconductor laser chips, the images of both light-emitting end surfaces of the semiconductor laser chip are taken with CCD cameras. Then, on the basis of information of an image taken by the CCD cameras, an visual inspection unit built in a computer determines the goodness or badness of the appearance of the semiconductor laser chip. | 06-17-2010 |
20100158346 | METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER - Method of classifying the defects on a wafer having some same chips and corresponding system. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method. | 06-24-2010 |
20100158347 | METHOD FOR DETECTING THE LINE BROKEN FAULT OF COMMON ELECTRODE LINES OF LCD - A method for detecting line broken faults of common electrode lines of liquid crystal display comprising: loading detection picture to the liquid crystal display, wherein said detection picture comprises at least one detection picture for line broken of common electrode lines, wherein, in the detection picture of same frame, the voltage difference of storage capacitor corresponding to pixel electrode with one polarity is larger than voltage difference of a storage capacitor corresponding to pixel electrode with another polarity; when the detection picture for line broken of common electrode line is displayed on the liquid crystal display, detecting whether there is black line or white line gradually changed in horizontal direction in said detection picture for line broken of common electrode line, and determining line broken fault of common electrode line exists in the liquid crystal display when there is a black line or white line gradually changed in horizontal direction. | 06-24-2010 |
20100158348 | INSPECTION SYSTEM AND INSPECTION METHOD - The inspection system arbitrarily selects from among a plurality of optical conditions to change a distribution of reflected or diffracted light component from an object being inspected. The inspection system has a one- or two-dimensional optoelectric conversion image sensor, optically acquires an image of the object by scanning a stage on which the object is mounted or scanning the image sensor, and processes the image to check for defects in the object. Under each optical condition (illumination optical system, detection optical system, scan direction, etc.) the object being inspected is imaged and, based on the brightness distribution and contrast in the detection field of the image sensor, image sensor output correction data is generated to correct the output of the image sensor. | 06-24-2010 |
20100166290 | DIE DEFECT INSPECTING SYSTEM WITH A DIE DEFECT INSPECTING FUNCTION AND A METHOD OF USING THE SAME - A die defect inspecting system with a die defect inspecting function includes a wafer-positioning module, an image-capturing module, a die-sucking module, a die defect analyzing module, a die-classifying module and a control module. The image-capturing module is disposed beside one side of the wafer-positioning module in order to capture an image of each die. The die-sucking module is disposed above the wafer-positioning module and the image-capturing module in order to suck each die from the wafer-positioning module to a position above the image-capturing module for capturing a back image of a back surface of each die. The die defect analyzing module is electrically connected to the image-capturing module in order to judge whether the back image of the back surface of each die passes inspection standard. | 07-01-2010 |
20100166291 | APPARATUS FOR MEASURING AND CALIBRATING ERROR OF WAFER PROBER - Provided is an error measurement and correction device of a stage of a wafer prober. The error measurement and correction device includes a jig member, a vision module, a central processing unit, and an interface unit. The jig member is disposed on a chuck on the stage, and the vision module is disposed on an upper plate of the wafer prober disposed at a position facing the jig member to enable the camera of the vision module to acquire images of the patterns of the jig member and transmits the acquired images to the central processing unit. The central processing unit acquires images of the patterns of the jig member disposed on the chuck by using the vision module to extract reference position information, moves the stage at a unit interval of the pattern, acquires images of the patterns of the jig member again to extract measured position information, and generates and stores mapping data by calculating difference between the measured position information and the reference position information. The central processing unit corrects the movement position information on the stage to be moved by using the mapping data when the stage is moved, so that irrespective of physical deterioration of the stage, the stage can be moved to an accurate position. | 07-01-2010 |
20100166292 | WAFER HOLDING MECHANISM - A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates. | 07-01-2010 |
20100195896 | METHOD AND APPARATUS FOR DETECTING PATTERN DEFECTS - With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects. | 08-05-2010 |
20100208979 | USE OF DESIGN INFORMATION AND DEFECT IMAGE INFORMATION IN DEFECT CLASSIFICATION - Defects observed by imaging tools may be classified by automatic comparison of features observed in a defect image with design information relating to corresponding portions of the image. Defect information may be generated from a defect image from a defect imaging tool. Design information relating to one or more structures to be formed on the substrate in a vicinity of the defect may be retrieved. The defect may be classified based on a combination of the defect information from the defect image and design information relating to one or more structures to be formed on the substrate in the vicinity of the defect. | 08-19-2010 |
20100208980 | APPARATUS AND METHOD FOR DETECTING DEFECTS IN WAFER MANUFACTURING - Apparatus for inspecting a semiconductor wafer ( | 08-19-2010 |
20100215247 | System And Method For A Semiconductor Lithographic Process Control Using Statistical Information In Defect Identification - A system and method is described for evaluating a wafer fabrication process for forming patterns on a wafer based upon data. Multiple inspection regions are defined on the wafer for analysis. For each inspection region, images of patterns within the inspection region are captured, edges are detected, and lines are registered to lines of a reference pattern automatically generated from the design data. Line widths are determined from the edges. Measured line widths are analyzed to provide statistics and feedback information regarding the fabrication process. In particular embodiments defects are identified as where measured line widths lie outside boundaries determined from the statistics. In particular embodiments, lines of different drawn width and/or orientation are grouped and analyzed separately. Measured line widths may also be grouped for analysis according to geometry such as shape or proximity to other shapes in the inspection region to provide feedback for optical proximity correction rules. | 08-26-2010 |
20100226562 | COMPUTER-IMPLEMENTED METHODS FOR DETECTING AND/OR SORTING DEFECTS IN A DESIGN PATTERN OF A RETICLE - Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing. | 09-09-2010 |
20100246936 | LED TESTING APPARATUS AND TESTING METHOD THEREOF - There is provided an LED testing apparatus. An LED testing apparatus according to an aspect of the invention may include: a first lighting unit generating first light and irradiating the first light onto an LED having an encapsulant including a fluorescent material excited by the first light to emit light having a longer wavelength than the first light; a second lighting unit generating second light having a longer wavelength than the first light to irradiate the second light onto the LED; an image acquisition unit receiving the light emitted from the fluorescent material and the second light reflected off the LED to acquire images of the LED; and an LED state determination unit determining whether the LED is acceptable or defective using the images of the LED acquired by the image acquisition unit. | 09-30-2010 |
20100266195 | DEFECT INSPECTING METHOD, DEFECT INSPECTING APPARATUS, AND STORAGE MEDIUM STORING DEFECT INSPECTION PROGRAM - There is provided a database storing reference data including a plurality of reference image data, which are obtained by imaging reference substrates, respectively, wherein each of the reference substrates lacks only one of the films of different kinds but includes remainder of the films of different kinds, and wherein in the reference substrates the lacking films are different from each other, and wherein the plurality of reference image data is classified into categories according to the kinds of the films. Difference degrees between color information of a defect area extracted from an image data of an inspection target substrate and color information of corresponding areas of the reference substrates are calculated. Based on the difference degree, the defective film is identified. | 10-21-2010 |
20100266196 | PHOTOVOLTAIC DEVICES INSPECTION APPARATUS AND METHOD OF DETERMINING DEFECTS IN PHOTOVOLTAIC DEVICES - A photovoltaic devices inspection apparatus and a method of determining defects in photovoltaic devices using electroluminescence of the photovoltaic devices. The apparatus and method can not only determine whether the photovoltaic devices are defective or non-defective at the moment, but also whether the devices have a possibility to become defective in the future. | 10-21-2010 |
20100296722 | FORMATION OF PRESCRIBED PATTERN ON WAFER FOR USE IN SEM DEFECT OFFSET - A prescribed pattern is formed at a plurality of known locations on a semiconductor wafer. The plurality of known locations are incorporated into a defect map that includes a location of at least one defect detected by an in-line inspection of the wafer. The defect map including the plurality of known locations and the location of the at least one defect is transmitted to a scanning electron microscope (SEM). The SEM uses the known locations to calculate a defect offset for use in imaging the at least one defect in the SEM. | 11-25-2010 |
20100310151 | ELECTRONIC DEVICE HANDLING APPARATUS AND ELECTRONIC DEVICE POSITION DETECTION METHOD - An electronic device handling apparatus, wherein an image of terminals of an electronic device to be tested having the terminals at its end edge portions held by a conveyor device is taken, edges of terminals arranged in the X-axis direction are extracted from data of an taken image and binarization processing is performed on the data, while edges of terminals arranged in the Y-axis direction are extracted from data of the taken image and binarization processing is performed on the data, so that positions of edges of respective terminals are located from the obtained two binary images. Then, a positional deviation amount of the electronic device is calculated by comparing with reference positional information of edges of terminals of a reference electronic device and, based thereon, a posture of the electronic device to be tested is corrected. | 12-09-2010 |
20100322506 | INSPECTION PARAMETER SETTING METHOD, INSPECTION PROPERTY EVALUATION METHOD AND INSPECTION SYSTEM - An inspection system is disclosed, which inspects a wiring pattern on a high multilayer printed wiring board while determining a calibration position with a smaller number of error reports, and predicts the verification work time by evaluating the inspection property. Based on the CAD data of each layer of the printed wiring board to be inspected and the layer structure information, an intensity composition map viewed through the inspection surface is generated. A plurality of sets of the intensity components of the inspection surface are determined, and after determining at least one intensity evaluation region covering all the sets, the intensity evaluation region is imaged by an inspection unit and the statistical intensity value corresponding to each intensity component is determined and substituted into the intensity composition map. The inspection is conducted by determining the optimal calibration position for determining an inspection threshold value in this way. | 12-23-2010 |
20100329540 | METHODS FOR GENERATING A STANDARD REFERENCE DIE FOR USE IN A DIE TO STANDARD REFERENCE DIE INSPECTION AND METHODS FOR INSPECTING A WAFER - Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step. | 12-30-2010 |
20110007961 | DEFECT CLASSIFICATION METHOD, COMPUTER STORAGE MEDIUM, AND DEFECT CLASSIFICATION APPARATUS - A defect classification apparatus of the present invention includes a design unit and a diagnosis unit. In the design unit, a model creation unit combines a defect template in a template storage unit with a teaching image to create a defect model, and a classification class setting unit calculates feature amounts of a defect in the defect model and sets a classification class of the defect. The relation between the feature amounts of the defect and the classification class is stored in a storage unit. In the diagnosis unit, a feature amount calculation unit calculates feature amounts of defects from a captured inspection object image of the substrate, and a classification unit classifies the defects of the substrate into classification classes from the relations between the feature amounts of the defects and the classification classes in the storage unit based on the calculated feature amounts of the defects. | 01-13-2011 |
20110013824 | INSPECTION AREA SETTING METHOD, INSPECTION AREA SETTING APPARATUS, AND COMPUTER PROGRAM PRODUCT - To provide an inspection area setting method including: extracting patterns from a plurality of sampling positions in a design layout data of a die of a semiconductor integrated circuit; classifying the extracted patterns into a plurality of types fewer than number of the extracted patterns, based on similarity of geometric feature attributes; and fixing a plurality of candidate areas smaller than a size of the die, and setting a candidate area including the largest number of types of the patterns classified at classifying, among the fixed candidate areas, as an inspection area in defect inspection. | 01-20-2011 |
20110013825 | Method and Apparatus for Analyzing Defect Data and a Review System - In a process for manufacturing a semiconductor wafer, defect distribution state analysis is performed so as to facilitate identification of the defect cause including a device cause and a process cause by classifying the defect distribution state according to the defect position coordinates detected by the inspection device, into one of the distribution characteristic categories: repeated defects, clustered defects, arc-shaped regional defects, radial regional defects, line type regional defects, ring and blob type regional defects, and random defects. | 01-20-2011 |
20110013826 | TEST STRUCTURE FOR CHARGED PARTICLE BEAM INSPECTION AND METHOD FOR DEFECT DETERMINATION USING THE SAME - A test structure and method thereof for determining a defect in a sample of semiconductor device includes at least one transistor rendered grounded. The grounded transistor is preferably located at least one end of a test pattern designed to be included in the sample. When the test structure is inspected by charged particle beam inspection, the voltage contrast (VC) of the transistors in the test pattern including the grounded transistor is observed for determination of the presence of defect in the sample. | 01-20-2011 |
20110123093 | SYSTEMS AND METHODS FOR DETECTING DEFECTS IN COATINGS UTILIZING COLOR-BASED THERMAL MISMATCH - A method of analyzing a thermal image of a coated substrate to determine the presence of defects includes determining a defect temperature range based on a color of the coated substrate and the maximum temperature of the coated substrate in the thermal image. Thereafter, the thermal image is processed by determining a signal value of a pixel of interest based on a temperature of the pixel of interest, temperatures of pixels in a kernel of pixels surrounding the pixel of interest, and the color of the coated substrate. The signal value of the pixel of interest is then compared to the lower temperature threshold of the defect temperature range, wherein the pixel of interest is a defect location when the signal value of the pixel of interest is greater than or equal to the lower temperature threshold. | 05-26-2011 |
20110123094 | SYSTEM AND METHOD FOR SUPPORTING DISCOVERY OF DEFECT INCLUDED IN INSPECTION SUBJECT - A system, and methods of operation thereof, is presented that permits determination of a defect in an inspection subject by means of processing an image of said inspection subject, which system avoids exhaustion of bandwidth in a communication line connected to the image processing unit. The system includes a unit to receive an image, a transmission queue and a buffer to store the image, an image processing unit to determine whether the image includes a defect image, a unit that generates defect information when the presence of a defect image is determined, an image extraction unit that extracts the defect image based on the defect information, and a storage unit for storing such defect image. | 05-26-2011 |
20110129140 | DEFECT REVIEW DEVICE, DEFECT REVIEW METHOD, AND DEFECT REVIEW EXECUTION PROGRAM - Provided is a defect review device enabling identification of a defect and a defect coordinate | 06-02-2011 |
20110129141 | CIRCUIT PATTERN EXAMINING APPARATUS AND CIRCUIT PATTERN EXAMINING METHOD - Provided is an examination technique to detect defects with high sensitivity at an outer-most repeative portion of a memory mat of a semiconductor device and even in a peripheral circuit having no repetitiveness. | 06-02-2011 |
20110129142 | DEFECT REVIEW SYSTEM AND METHOD, AND PROGRAM - A system is provided that realizes both reduction in coordinate error and improvement in throughput and allows observation of a micro-defect. The system includes: a function of measuring an amount of displacement between preliminarily calculated coordinates and an actual specimen position; a function of optimizing a coordinate correction formula so as to minimize the amount of displacement from the measured amount of displacement; and a function of calculating variation of displacement between the preliminarily calculated coordinates and the actual specimen position by statistical processing. When a value of coordinate variation is sufficiently small with respect to the field of view of an image for observation, which is to be a defect observation image, the system acquires only the image for observation without performing acquisition of an image for search, which is to be a defect search image. | 06-02-2011 |
20110135188 | APPARATUS AND METHOD FOR INSPECTING SUBSTRATE INTERNAL DEFECTS - A method for inspecting substrate internal defects is disclosed. The method provides at least one light source disposed on a lateral side of a substrate and configured to emit a light beam to the lateral side for correspondingly penetrating the substrate. The method also provides an image capturing module for retrieving an image of the upper surface, wherein an incident angle of the light beam to the respective lateral side is limited within a first predetermined angle to allow the light beam to have a total reflection in the substrate. Thus, the light beam is blocked by internal defects when transmitting within the substrate to generate bright spots to be detected by the image capturing module for locating the defect position. The method provides a better image definition of internal defects images. The present invention further provides an apparatus based on the method for inspecting substrate internal defects. | 06-09-2011 |
20110142326 | PATTERN INSPECTION METHOD, PATTERN INSPECTION APPARATUS AND PATTERN PROCESSING APPARATUS - In a defect judgment operation using tolerance to allow a high-speed operation, the amount of deformation is obtained from an image pickup pattern image, and tolerance including the deformation is generated by deforming a reference pattern image as the basis of the tolerance according to the deformation, and only a disconnection or a contact is judged as an abnormality even if deformation exists in an image pickup pattern. | 06-16-2011 |
20110142327 | METHODS FOR ACCURATE IDENTIFICATION OF AN EDGE OF A CARE AREA FOR AN ARRAY AREA FORMED ON A WAFER AND METHODS FOR BINNING DEFECTS DETECTED IN AN ARRAY AREA FORMED ON A WAFER - Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area. | 06-16-2011 |
20110150318 | DATA PROCESSING SYSTEM, DATA PROCESSING METHOD, AND INSPECTION ASSIST SYSTEM - Provided is a tool that can easily analyze a number of defects detected by an inspection system under a plurality of inspection conditions. The data processing system includes a storage device configured to acquire from an inspection system coordinates of a plurality of defects obtained by inspecting an inspection object under a plurality of inspection conditions and store the coordinates while correlating the coordinates with the inspection conditions, an arithmetic unit configured to perform coordinate matching to detect the presence or absence of coordinates that are common to at least two inspection conditions of the plurality of inspection conditions, and a display device configured to display on a plurality of defect coordinate maps the defects obtained under the at least two inspection conditions. | 06-23-2011 |
20110164808 | TECHNIQUES PROVIDING FIDUCIAL MARKERS FOR FAILURE ANALYSIS - A semiconductor die includes a group of spacer cells within the semiconductor die. The spacer cells include fiducial markings therein. The fiducial markings can be located within a metal layer, a diffusion layer, a polysilicon layer, and/or a Shallow Trench Isolation (STI) structure. | 07-07-2011 |
20110164809 | Method And Apparatus For Detecting Pattern Defects - With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects. | 07-07-2011 |
20110170766 | Adaptive Signature Detection - A processor-based method for detecting defects in an integrated circuit, by creating an image of at least a portion of the integrated circuit with a sensor, grouping pixels of the image into bins based at least in part on a common characteristic of the pixels that are grouped within a given bin, creating a histogram of the pixels in each of the bins, calculating a mean value of the histogram for each of the bins, comparing the mean value for each of the bins to a threshold value, flagging as defect candidates those bins where the mean value of the bin varies from the threshold value by more than a predetermined amount, and performing signature detection on the bins that are flagged as defect candidates, where the image of the integrated circuit is not directly compared to any other image of an integrated circuit. | 07-14-2011 |
20110176719 | INSPECTION SYSTEM AND METHOD - Optical image data of a mask is acquired. Reference image data associated with the optical images is created from design pattern data. Regional image data that includes pixel values denoted by multi-valued resolution based on importance level information of the patterns is created from region data including at least one portion of the patterns defined in the design pattern data. Defect determination is conducted on a pixel-by-pixel basis by comparing the optical image data with the reference image data, by means of either a plurality of threshold values determined by each pixel value within the regional image data or a plurality of defect determination methods. Image data of a section whose Mask Error Enhancement Factor (MEEF) is equal to or greater than a predetermined value is created from the region data including at least one portion of the patterns defined in the design pattern data. | 07-21-2011 |
20110188733 | Photovoltaic Cell Manufacturing - Disclosed is a method ( | 08-04-2011 |
20110188734 | DEFECT ESTIMATION DEVICE AND METHOD AND INSPECTION SYSTEM AND METHOD - Acquired mask data of a defect portion is sent to a simulated repair circuit | 08-04-2011 |
20110188735 | METHOD AND DEVICE FOR DEFECT INSPECTION - Provided are a method and a device for defect inspection, wherein, in a state where a few DOIs exist in a large number of nuisances, a classification performance can be improved by a few appropriate defect instructions and a high classification performance is ensured while mitigating the burden of user's defect instructions. The method and device for defect inspection is characterized by repeating extraction of one or more defects from a plurality of defects detected by imaging a sample, instruction of a classification class of the extracted defects, and calculation of a classification criterion and a classification performance from the image information and classification class of the defects, and determining, based on the finally obtained classification criterion, the classification class of the unknown defects. This makes it possible to improve a classification performance by a few appropriate defect instructions and ensure a high classification performance while mitigating the burden of user's defect instructions. | 08-04-2011 |
20110194752 | Extending the Field of View of a Mask-Inspection Image - A technique for determining photo-mask defect disposition is described. In this technique, a target mask pattern is used to expand an initial region in a photo-mask that is included in an initial mask-inspection image. In particular, a revised mask-inspection image that includes the initial region and a region surrounding the initial region is generated based on the initial mask-inspection image and the target mask pattern. Then a corresponding simulated mask pattern is calculated in an inverse optical calculation using the revised mask-inspection image and an optical model of the mask-inspection system. This simulated mask pattern is used to simulate a wafer pattern in a photo-lithographic process, and disposition of a possible defect in the initial region is subsequently determined based on the simulated wafer pattern and a target wafer pattern. | 08-11-2011 |
20110194753 | IMAGE DATA PROCESSING METHOD AND IMAGE CREATING METHOD - [Problem] Provided is a method of processing image data capable of, at the time of measuring a wafer in a circumferential direction thereof using a surface inspection device employing a laser scattering method to create a Haze map, reducing or removing occurrence of a noise resulting from change in detection sensitivity of the device. Further, provided is a method of creating an image by using the method of processing an image data. | 08-11-2011 |
20110255774 | METHOD AND SYSTEM FOR DEFECT DETECTION - A system, method and computer program product for defect detection, the method includes: (i) retrieving a second pixel of a second image that corresponds to a tested pixel of a first image of the object; wherein the first and second images were obtained using different acquisition methods; (ii) searching a third pixel of the second image such that a neighborhood of the second pixel is similar to a neighborhood of the third pixel; (iii) retrieving a fourth pixel of the first image that corresponds to the third pixel; and (iv) comparing between the tested pixel and the fourth pixel. | 10-20-2011 |
20110268345 | DEFECT CLASSIFIER USING CLASSIFICATION RECIPE BASED ON CONNECTION BETWEEN RULE-BASED AND EXAMPLE-BASED CLASSIFIERS - In apparatuses for automatically acquiring and also for automatically classifying images of defects present on a sample such as a semiconductor wafer, a classifying system is provided which are capable of readily accepting even such a case that a large number of classification classes are produced based upon a request issued by a user, and also even such a case that a basis of the classification class is changed in a high frequency. When the user defines the classification classes, a device for designating attributes owned by the respective classification classes is provided. The classifying system automatically changes a connecting mode between an internally-provided rule-based classifier and an example-based classifier, so that such a classifying system which is fitted to the classification basis of the user is automatically constructed. | 11-03-2011 |
20110274342 | DEFECT INSPECTION METHOD AND DEVICE THEREOF - The invention provides a defect inspection method and a defect inspection device which enable a defect to be inspected regardless of optical conditions. The invention comprises the steps of setting a target local region and a plurality of corresponding local regions in the image signals, the target local region including a target pixel and an area surrounding the target pixel, the corresponding local regions including pixels corresponding to the target pixel and areas surrounding the corresponding pixels; searching similarities between the image signal of the target local region and the image signals of the plurality of corresponding local regions; determining a plurality of image signals that represent corresponding local regions and are similar to the image signal of the target local region; and comparing the image signal of the target local region with the image signals that represent the corresponding local regions. | 11-10-2011 |
20110280469 | Run-Time Correction Of Defect Locations During Defect Review - One embodiment relates to a method for run-time correction of defect locations on a substrate during defect review. The substrate is loaded into a stage of a review apparatus, and coordinates for the defect locations on the substrate is received. The defect locations are grouped, and at least one local reference site in proximity to each group of defect locations is determined. The local reference site(s) is (are) used to determine a positional offset for the defect locations in each group. Another embodiment relates to an apparatus for reviewing defect locations on a substrate which provides for run-time correction of the defect locations. Other embodiments and features are also disclosed. | 11-17-2011 |
20110280470 | WAFER DEFECT INSPECTION APPARATUS AND METHOD FOR INSPECTING A WAFER DEFECT - It is an object to obtain an image of a wafer that is suitable for a defect inspection in an efficient manner. | 11-17-2011 |
20110280471 | Image processing apparatus, image processing method, defect detection method, semiconductor device manufacturing method, and program - An image processing apparatus which compresses an image, the apparatus includes: a storage unit which stores a code book, the code book being prepared by allocating identification codes to code blocks, the code blocks being formed by executing quantization processing regarding a plurality of first image blocks as multidimensional vectors, the plurality of first image blocks being generated by cutting, in preset sizes, first regions out of a code book preparation image containing a first edge, each of the first regions surrounding and including an edge point of the first edge, the first edge being detected from the code book preparation image; an edge detection unit which detects a second edge from a compression target image containing the second edge; an image block generation unit which cuts, in preset sizes, second regions out of the compression target image to generate a plurality of second image blocks, each of the second regions surrounding and including an edge point of the detected second edge; a search unit which searches the code book stored in the storage unit for code blocks similar to the second image blocks; and an output unit which outputs information on the identification codes of the similar code blocks which have been searched for and information on coordinates of the edge points of the second image blocks. | 11-17-2011 |
20110286657 | DEFECT ANALYSIS METHOD, DEFECT ANALYSIS APPARATUS, AND RECORDING MEDIUM - According to the embodiments, a plurality of positional relationships between a coordinate system for indicating a defect position on a wafer that is used by an inspection device and a coordinate system that is used in design data on a pattern is set, the defect position output by the inspection device and the design data are aligned by using each of the set positional relationships, and a local pattern of a portion in which the defect position is aligned is extracted from the design data for each positional relationship. Then, the extracted local pattern is classified based on a degree of matching of graphical feature. The number of classification patterns is calculated for each positional relationship. Then, a pattern dependence degree of the detected defect group is calculated by using the calculated number of classification patterns of each positional relationship. | 11-24-2011 |
20110286658 | PATTERN INSPECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - In one embodiment, a pattern inspection method is disclosed. The method can include predicting an edge shape at a given future time with respect to the same inspection target pattern, setting a threshold corresponding to a required specification of the inspection target pattern, and predicting the time when the inspection target pattern fails to meet the required specification from the predicted edge shape and the threshold. The method can further include taking a plurality of images concerning the inspection target pattern at different times by use of an imaging apparatus, detecting edges of the obtained images, respectively, matching the detected edges of different imaging times, and obtaining a difference between corresponding edges to generate a difference vector after the matching. The edge shape of the future time can be predicted based on the generated difference vector and an interval between the imaging times. | 11-24-2011 |
20110293167 | DEFECT INSPECTING METHOD, DEFECT INSPECTING APPARATUS, AND RECORDING MEDIUM - According to one embodiment, a defect inspecting method includes: separately detecting an amount of first secondary electrons emitted from a semiconductor substrate at a first elevation angle and an amount of second secondary electrons emitted at a second elevation angle different from the first elevation angle; creating potential contrast images respectively from the detected amounts of the first and second secondary electrons; determining a combination ratio of the created respective potential contrast images; combining the potential contrast images respectively created from the first and second secondary electrons at the determined combination ratio; and extracting a defect based on the combined potential contrast image. The determining a combination ratio includes: calculating the luminance of the bottom between the wires; determining whether the calculated luminance exceeds a predetermined reference value; and changing the combination ratio when the calculated luminance does not exceed the predetermined reference value. | 12-01-2011 |
20110311125 | OBSERVATION CONDITION DETERMINATION SUPPORT DEVICE AND OBSERVATION CONDITION DETERMINATION SUPPORT METHOD - Provided is an observation condition determination support device which can improve the defect classification accuracy. The observation condition determination support device includes: a means ( | 12-22-2011 |
20110311126 | DEFECT INSPECTING APPARATUS AND DEFECT INSPECTING METHOD - A defect inspecting apparatus provide with an illumination optical system and a detection optical system is further provided with an image processing section, which has: a feature calculating section, which calculates a feature based on the inputted design data of the object to be inspected, and calculates a feature quantity based on a plurality of pieces of image data, which are acquired by the detection optical system and have different optical conditions or image data acquisition conditions; a defect candidate detecting section which integrates the feature obtained from the calculated design data and the feature quantity obtained from the plurality of pieces of image data and detects candidates; and a defect extracting section which extracts a highly critical defect from the detected defect candidates, based on the feature of the design data calculated by the feature calculating section. | 12-22-2011 |
20120002860 | METHOD AND APPARATUS FOR INSPECTING PATTERNS FORMED ON A SUBSTRATE - In a pattern inspection apparatus, influences of pattern brightness variations that is caused in association with, for example, a film thickness difference or a pattern width variation can be reduced, high sensitive pattern inspection can be implemented, and a variety of defects can be detected. Thereby, the pattern inspection apparatus adaptable to a broad range of processing steps is realized. In order to realize this, the pattern inspection apparatus of the present invention performs comparison between images of regions corresponding to patterns formed to be same patterns, thereby determining mismatch portions across the images to be defects. The apparatus includes multiple sensors capable of synchronously acquiring images of shiftable multiple detection systems different from one another, and an image comparator section corresponding thereto. In addition, the apparatus includes means of detecting a statistical offset value from the feature amount to be a defect, thereby enabling the defect to be properly detected even when a brightness difference is occurring in association with film a thickness difference in a wafer. | 01-05-2012 |
20120002861 | Method and Apparatus For Inspecting Defect Of Pattern Formed On Semiconductor Device - An apparatus and method for inspecting a defect of a circuit pattern formed on a semiconductor wafer includes a defect classifier have a comparison shape forming section for forming a plurality of comparison shapes corresponding to an SEM image of an inspection region by deforming the shape of the circuit pattern in accordance with a plurality of shape deformation rules using design data corresponding to the circuit pattern within the inspection region and a shape similar to the SEM image of the inspection region out of the plurality of comparison shapes formed and selected as the comparison shape, and a shape comparing and classifying section for classifying the SEM image using information of the comparison shape selected in the comparison shape forming section and the inspection shape of the circuit pattern of the SEM image of the inspection region. | 01-05-2012 |
20120027285 | DEFECT CLASSIFICATION WITH OPTIMIZED PURITY - A method for defect analysis includes identifying single-class classifiers for a plurality of defect classes, the plurality of defect classes characterized by respective ranges of inspection parameter values. Each single-class classifier is configured for a respective class to identify defects belonging to the respective class based on the inspection parameter values, while identifying the defects not in the respective class as unknown defects. A multi-class classifier is identified that is configured to assign each defect to one of the plurality of the defect classes based on the inspection parameter values. Inspection data is received, and both the single-class and multi-class classifiers are applied to the inspection data to assign the defect to one of the defect classes. | 02-02-2012 |
20120027286 | Methods, Systems and Apparatus for Defect Detection and Classification - Aspects of the present invention are related to systems, methods and apparatus for image-based automatic detection of a defective area in a flat panel display and classification of the defect type and the cause of the detected defect. | 02-02-2012 |
20120027287 | METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER - A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method. | 02-02-2012 |
20120045115 | DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD - Although there is a method for optimizing a threshold for each of regions to be inspected of an acquired detected image, only a single threshold is applied to a single detected image. Thus, when being included in a single image, an insignificant defect is detected at the same sensitivity level as that for a significant defect. The invention proposes a mechanism in which multiple sensitivity regions are set in a single inspection region, and thereby a defect only in a region where a DOI (Defect of interesting) is present in the single inspection region can be detected while being discriminated from the other ones. Specifically, the multiple sensitivity regions are set based on features of an image in the inspection region, and set sensitivities for the respective sensitivity regions are applied to a detected image, a difference image or a determination threshold for a defect determination unit. | 02-23-2012 |
20120082367 | METHOD OF FORMING IMAGE OF SEMICONDUCTOR DEVICE, AND METHOD OF DETECTING A DEFECT OF THE SEMICONDUCTOR DEVICE BY USING THE IMAGE FORMING METHOD - A method forms an ultimate or final image of a sample by selecting some of a plurality of image frames and integrating the selected frames. The method includes providing a semiconductor device including a region of interest and a peripheral region; obtaining a plurality of image frames each including a region of interest image and a peripheral region image respectively corresponding to the region of interest and the peripheral region; selecting at least some of the plurality of image frames based on a contrast between the region of interest image and the peripheral region image; and obtaining an image of the semiconductor device by integrating the selected image frames. | 04-05-2012 |
20120087568 | REGISTERING MEASURED IMAGES TO LAYOUT DATA - A system and method for registering a layout to a measured image includes generating a predictive reference image from a layout design or portion thereof. The predictive reference image is correlated to a measured image obtained from a device having a corresponding structure for the layout design or the portion thereof. A best match transformation is computed between the predictive reference image and the measured image. The layout design or portion thereof is correlated with the measured image based upon the best match transformation. | 04-12-2012 |
20120087569 | AUTOMATED WAFER DEFECT INSPECTION SYSTEM AND A PROCESS OF PERFORMING SUCH INSPECTION - An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects. | 04-12-2012 |
20120093392 | REVIEWED DEFECT SELECTION PROCESSING METHOD, DEFECT REVIEW METHOD, REVIEWED DEFECT SELECTION PROCESSING TOOL, AND DEFECT REVIEW TOOL - The present invention relates to semiconductor inspection and provides a technology capable of efficiently detecting a systematic defect. In the present system, with regard to the process (S | 04-19-2012 |
20120106827 | WAFER INSPECTION METHOD - A wafer inspection method comprises: performing an exposure process on a wafer partitioned into fields, wherein the exposure process is performed on a first plurality of the fields in a first scan direction and wherein the exposure process is performed on a second plurality of the fields in a second scan direction; storing scan direction information for the first plurality of fields and the second plurality of fields corresponding to whether the exposure process is performed in the first scan direction or in the second scan direction; obtaining image information on the surface of the wafer subjected to the exposure process; determining whether a repetitive defect pattern is present in the image information; and determining whether the repetitive defect pattern is dependent on scan direction by identifying a correlation between the presence of repetitive defect patterns on the wafer and the scan direction information. | 05-03-2012 |
20120114221 | PATTERN DEFECT ANALYSIS EQUIPMENT, PATTERN DEFECT ANALYSIS METHOD AND PATTERN DEFECT ANALYSIS PROGRAM - A data processing unit acquires a review image including a pattern defect on a substrate, compares the review image with a reference image thereby to extract a defect image, the reference image including no pattern defect, and performs an alignment between the review image and a self-layer design pattern image which is generated from design data belonging to the identical layer in a region corresponding to the review image. The data processing unit, then, based on result of the alignment, generates an another-layer design pattern image which is generated from design data belonging to another layer in the region corresponding to the review image, and, based on a synthesized image of the defect image and the another-layer design pattern image, determines the relative position relationship between the pattern defect and a pattern belonging to another layer, and judges the criticality based on the relative position relationship. | 05-10-2012 |
20120114222 | METHOD AND APPARATUS FOR VISUAL INSPECTION - In the case of die-to-die comparison, threshold processing units process the differential image between the image of a sample chip and the images of left and right adjacent chips using a second threshold value lower than a first threshold value thereby to determine a defect candidate for the sample chip. Further, threshold processing units process the differential image using the first threshold value. The defect candidates which develops a signal not smaller than the first threshold is detected as a defect. Also in the cell-to-cell comparison, the differential image is first processed by the second threshold value to determine a defect candidate, and the differential image is further processed by the first threshold value. The defect candidates which develops a signal not smaller than the first threshold value is detected as a defect. | 05-10-2012 |
20120128232 | METHOD FOR DETECTING A BRIDGE CONNECTING FAILURE - A method for detecting a bridge connecting failure to detect a bridge shorting terminals of a component includes acquiring a 2D image and height-based information through lights irradiated on a board, acquiring rotation information of the component using at least one of the 2D image and the height-based information, establishing an inspection region for detection of the bridge connecting failure using the rotation information, extracting a first bridge region within the inspection region using the 2D image, extracting a second bridge region within the inspection region using the height-based information, and judging whether the bridge connecting failure of the component occurs by using at least one of the first and second bridge regions. Thus, the method may inspect more precisely the bridge connecting failure through the first bridge region extracted from the 2D image and the second bridge region extracted from the height-based information. | 05-24-2012 |
20120128233 | DEFECT CLASSIFIER USING CLASSIFICATION RECIPE BASED ON CONNECTION BETWEEN RULE-BASED AND EXAMPLE-BASED CLASSIFIERS - In apparatuses for automatically acquiring and also for automatically classifying images of defects present on a sample such as a semiconductor wafer, a classifying system is provided which are capable of readily accepting even such a case that a large number of classification classes are produced based upon a request issued by a user, and also even such a case that a basis of the classification class is changed in a high frequency. When the user defines the classification classes, a device for designating attributes owned by the respective classification classes is provided. The classifying system automatically changes a connecting mode between an internally-provided rule-based classifier and an example-based classifier, so that such a classifying system which is fitted to the classification basis of the user is automatically constructed. | 05-24-2012 |
20120141010 | IMAGE ANALYSIS DEVICE AND METHOD - An image analysis device reads a reference image and a real-time image of a printed circuit board (PCB), determines feature points and feature information of the feature points in the reference image; and creates two 1×N matrices based on the feature points. Furthermore, a mapping matrix is determined based on the two 1×N matrices. The device then reads coordinates of base points designated in the reference image, and determines matching points in the real-time image based on the coordinates of base points and the mapping matrix. A reference region in the reference image is determined based on all the base points, and a matching region is determined in the real-time image based on all the matching points. The reference region and the matching region are compared to determine existence of any surface feature defects of the PCB. | 06-07-2012 |
20120141011 | DEFECT IMAGE PROCESSING APPARATUS, DEFECT IMAGE PROCESSING METHOD, SEMICONDUCTOR DEFECT CLASSIFYING APPARATUS, AND SEMICONDUCTOR DEFECT CLASSIFYING METHOD - A defect image processing apparatus uses a normalized cross correlation to image-match a layout image ( | 06-07-2012 |
20120141012 | APPARATUS AND METHOD FOR INSPECTING DEFECT - A defect inspection apparatus includes an illumination optical system which irradiates an inspection subject under a predetermined optical condition, a detection optical system which obtains image data by detecting a scattered light from the inspection subject irradiated by the illumination optical system, and an image processing unit provided with a defect candidate detection unit which detects defect candidates with respect to plural image data obtained by the detection optical system under different conditions, and a post-inspection processing unit which executes a defect determination by integrating the defect candidates with respect to the plural image data. | 06-07-2012 |
20120141013 | REGION BASED VIRTUAL FOURIER FILTER - The present invention includes searching imagery data in order to identify one or more patterned regions on a semiconductor wafer, generating one or more virtual Fourier filter (VFF) working areas, acquiring an initial set of imagery data from the VFF working areas, defining VFF training blocks within the identified patterned regions of the VFF working areas utilizing the initial set of imagery data, wherein each VFF training block is defined to encompass a portion of the identified patterned region displaying a selected repeating pattern, calculating an initial spectrum for each VFF training block utilizing the initial set of imagery data from the VFF training blocks, and generating a VFF for each training block by identifying frequencies of the initial spectrum having maxima in the frequency domain, wherein the VFF is configured to null the magnitude of the initial spectrum at the frequencies identified to display spectral maxima. | 06-07-2012 |
20120155740 | METHOD OF DETECTING DEFECT IN PATTERN AND APPARATUS FOR PERFORMING THE SAME - A method and apparatus for detecting a defect in a pattern are provided. The method includes: obtaining a pattern image from a pattern in a region of interest on a semiconductor substrate and obtaining a reference image are obtained; matching the obtained pattern image and the obtained reference image to select a pixel group including pixels indicating defect information of the pattern image; adjusting a defect detection threshold of the selected pixel group; comparing the obtained pattern image and the obtained reference image to detect a pattern defect in a detection region corresponding to the selected pixel group of the pattern image, according to the adjusted defect detection threshold. | 06-21-2012 |
20120155741 | Visual Inspection Method And Apparatus And Image Analysis System - A visual inspection method and apparatus detecting a defect with the use of a detected signal obtained by illuminating one of a light and an electron beam onto a substrate to be inspected. The visual inspection method and apparatus includes calculation of an image feature based on an image of the detected defect, calculation of a coordinate feature based on position information of the detected defect, and outputting of real defect information by performing false alarm judgment by processing with respect to one of the image feature and the coordinate feature. | 06-21-2012 |
20120170830 | METHOD AND SYSTEM FOR SYSTEMATIC DEFECT IDENTIFICATION - A method and apparatus for identifying suspect layout features from a plurality of layout features of an integrated circuit (IC) layout. A plurality of snippet images is generated, each of which depicts at least a portion of a suspect layout feature which is different from suspect layout features depicted in others of the plurality of snippet images. The suspect layout features are determined based on the diagnosis of a plurality of defective ICs manufactured in accordance with the IC layout. A plurality of clusters is generated, and each of the clusters contains a group of the plurality of snippet images based on similarities between the snippet images. | 07-05-2012 |
20120189189 | OPTICAL INSPECTION OPTIMIZATION - A method of optimizing an optical inspection and fabrication process is herein disclosed. Images, preferably color digital images, of an object are obtained and multiple filter space representations of these images are created. Each of the representations and the channels or data that define them are analyzed separately or in combination with one another to determine which representations, combination of representations, channels, combinations of channels, data or combinations of data provide the most optimal data for analysis by optical inspection algorithms. The process may be automated in terms of the creation of image representations and/or single or multivariate analysis. | 07-26-2012 |
20120195490 | METHOD AND SYSTEM FOR WAFER REGISTRATION - A method for wafer registration, the method may include: moving a wafer by an X-Y stage and acquiring wafer edge area images; and processing the wafer edge area images to locate an edge of the wafer. A system that includes a camera, an X-Y stage for moving a wafer; wherein the camera is arranged to acquire wafer edge area images; and a processor that is arranged to process the wafer edge area images to locate an edge of the wafer. | 08-02-2012 |
20120207382 | FAULT INSPECTION METHOD - A fault inspection method and apparatus in which the scattergram is separated or objects of comparison are combined in such a manner as to reduce the difference between an inspection object image and a reference image. As a result, the difference between images caused by the thickness difference in the wafer can be tolerated and the false information generation prevented without adversely affecting the sensitivity. | 08-16-2012 |
20120237110 | IMAGE CREATION METHOD, SUBSTRATE INSPECTION METHOD, NON-TRANSITORY RECORDING MEDIUM HAVING PROGRAM RECORDED THEREON FOR EXECUTING IMAGE CREATION METHOD OR SUBSTRATE INSPECTION METHOD, AND SUBSTRATE INSPECTION APPARATUS - An image creation method of creating a filter image for removing a pseudo defect to inspect presence/absence of a defect on a substrate includes a filter image creation step of creating the filter image by replacing a picture element value of any one of picture elements located on a circumference of a circle about a center position of a registered image with a maximum value of picture element values of a plurality of picture elements selected from among the picture elements located on the circumference. | 09-20-2012 |
20120243773 | Design-Based Inspection Using Repeating Structures - Systems and methods for design-based inspection using repeating structures are provided. | 09-27-2012 |
20120294507 | DEFECT INSPECTION METHOD AND DEVICE THEREOF - Disclosed is a defect inspection device that can highly accurately distinguish between true defects and noise/nuisance defects by means of integrating inspection results from different lighting conditions or detection conditions. Further disclosed is a method thereof. The defect inspection device—which is provided with: a lighting optical system that illuminates an inspected object under predetermined optical conditions; and a detection optical system that detects scattered light from the inspected object under predetermined detection conditions, and acquires image data—is characterized by being provided with: a defect candidate detection arbitrary unit that detects defect candidates from a plurality of image data acquired by the aforementioned detection optical system under differing optical conditions or image data acquisition conditions; and a post-inspection processing unit that integrates information about defect candidates detected from said plurality of image data, and differentiates defects from noise. | 11-22-2012 |
20120308112 | EXTRACTION OF SYSTEMATIC DEFECTS - In one embodiment, a method for extracting systematic defects is provided. The method includes inspecting a wafer outside a process window to obtain inspection data, defining a defect pattern from the inspection data, filtering defects from design data using a pattern search for the defined defect pattern within the design data, inspecting defects inside the process window with greater sensitivity than outside the process window, and determining systematic defects inside the process window. A computer readable storage medium, and a system for extracting systematic defects are also provided. | 12-06-2012 |
20120308113 | METHOD AND SYSTEM FOR EVALUATING AN OBJECT - A method, system and a computer program product for evaluating a object; the method includes: (i) obtaining an image of an area of the object; wherein the area comprises multiple arrays of repetitive structural elements that are at least partially surrounded by at least one group of non-repetitive regions; wherein non-repetitive regions that belong to a single group of non-repetitive regions are ideally identical to each other; wherein the non-repetitive regions are arranged in a repetitive manner; and | 12-06-2012 |
20130004057 | METHOD AND APPARATUS FOR INSPECTING PATTERN DEFECTS - A method of detecting a defect, including the steps of: illuminating step for illuminating a sample with a light; detecting step for detecting light from the specimen which is illuminated by the light and forming an image by processing the detected light; processing step for extracting a defect candidate by processing the image of the sample formed in the detecting step and determining an inspection condition by using images including the image of the sample acquired in the detecting step, a partial image including the extracted defect candidate and a reference image which corresponds to the partial image including the defect candidate. | 01-03-2013 |
20130016895 | METHOD AND SYSTEM FOR DEFECT-BITMAP-FAIL PATTERNS MATCHING ANALYSIS INCLUDING PERIPHERAL DEFECTSAANM Song; ZhigangAACI Hopewell JunctionAAST NYAACO USAAGP Song; Zhigang Hopewell Junction NY USAANM Ouyang; XuAACI Hopewell JunctionAAST NYAACO USAAGP Ouyang; Xu Hopewell Junction NY USAANM Song; YunshengAACI Hopewell JunctionAAST NYAACO USAAGP Song; Yunsheng Hopewell Junction NY US - A system and method for fail pattern analysis for a memory device is disclosed. The peripheral circuits of a memory device are divided into different zones based on circuit design and layout. Defects are detected by inline inspection of multiple SRAM devices at various stages in the manufacturing process and saved into a database. When the devices are fabricated, electrical tests are then performed. Electrical failure patterns are also recorded and saved in the database. A correlation between the zone in which a visual defect resides and an electrical failure is recorded in computer storage. Visual defects found during inline inspection are then associated with an electrical failure in the memory device. | 01-17-2013 |
20130044937 | METHOD OF INSPECTING ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE - A method of inspecting an organic electroluminescence (EL) display device which includes pixels each of which includes an organic electroluminescence (EL) element includes: imaging the pixels for a predetermined time with a reverse bias voltage being applied to the pixels; identifying light emitting points which produce, in the imaging, light leakage that is greater than or equal to threshold intensity, the light emitting points being located within the pixels; and determining that a pixel including one light emitting point is a defective pixel when, after plural iterations of the imaging and the identifying, the light emitting point is identified in twice or more in the plural iterations of the identifying. | 02-21-2013 |
20130058559 | METHOD AND APPARATUS FOR CHARACTERIZING DISCONTINUITIES IN SEMICONDUCTOR DEVICES - An approach is provided for characterizing discontinuities in semiconductor devices, for example in a metal silicide. An image of an integrated circuit is caused, at least in part, to be received. The image is analyzed for at least one discontinuity in the integrated circuit structure. A relative measure of the at least one discontinuity is determined in comparison to the integrated circuit structure based on analyzing the image. | 03-07-2013 |
20130064442 | Determining Design Coordinates for Wafer Defects - Methods and systems for determining design coordinates for defects detected on a wafer are provided. One method includes aligning a design for a wafer to defect review tool images for defects detected in multiple swaths on the wafer by an inspection tool, determining a position of each of the defects in design coordinates based on results of the aligning, separately determining a defect position offset for each of the multiple swaths based on the swath in which each of the defects was detected (swath correction factor), the design coordinates for each of the defects, and a position for each of the defects determined by the inspection tool, and determining design coordinates for the other defects detected in the multiple swaths by the inspection tool by applying the appropriate swath correction factor to those defects. | 03-14-2013 |
20130077850 | METHOD FOR OPTIMIZING OBSERVED IMAGE CLASSIFICATION CRITERION AND IMAGE CLASSIFICATION APPARATUS - A first object is to use both ADC (automatic defect classification) and MDC (manual defect classification) and reduce the amount of MDC operation. A second object is to prevent a DOI (defect of interest) from being missed. | 03-28-2013 |
20130094752 | DEFECT ESTIMATION DEVICE AND METHOD AND INSPECTION SYSTEM AND METHOD - Acquired mask data of a defect portion is sent to a simulated repair circuit | 04-18-2013 |
20130108147 | INSPECTION METHOD AND DEVICE THEREFOR | 05-02-2013 |
20130114880 | METHOD AND APPARATUS FOR INSPECTING DEFECT - In inspecting a substrate having a transparent oxide film or a metal film formed on a surface thereof by using a dark field type inspection apparatus installing a laser light source, an illuminating beam having a high coherence causes variations in reflection strength due to multiple interferences within the transparent oxide film or an interference of scattered beams due to the surface roughness of the metal film occurs and which leads to degradation in the sensitivity of defect detection. The present invention solves the problem by providing a low-coherence but high-brightness illumination using a highly directive broadband light source, and a system in which the conventional laser light source is simultaneously employed to selectively use the light sources, thereby enabling a highly sensitive inspection according to the condition of a wafer. | 05-09-2013 |
20130114881 | METHOD AND APPARATUS FOR REVIEWING DEFECTS - Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method. | 05-09-2013 |
20130163851 | SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR CLASSIFICATION WITHIN INSPECTION IMAGES - In accordance with an aspect of the presently disclosed subject matter, there is provided an analysis system for classifying possible defects identified within an inspection image of an inspected object, the system comprising a pattern matcher configured to determine an anchor location with respect to the inspection image, based on a matching of a template and a portion of the inspection image; wherein an accuracy of the determining of the anchor location exceeds a resolution of the inspection image; a distribution analysis module configured to determine, based on the anchor location and a mask which defines different segments within an area, a distribution of a potential defect with respect to one or more of the segments; and a classifier, configured to classify the potential defect based on the distribution. | 06-27-2013 |
20130163852 | ROTATIONAL MULTI-LAYER OVERLAY MARKS, APPARATUS, AND METHODS - In one embodiment, a semiconductor target for determining overlay error, if any, between two or more successive layers of a substrate or between two or more separately generated patterns on a single layer of a substrate is disclosed. The target comprises at least a plurality of first structures that are invariant for a plurality of first rotation angles with respect to a first center of symmetry (COS) of the first structures and a plurality of second structures that are invariant for a plurality of second rotation angles with respect to a second COS of the second structures. The first rotation angles differ from the second rotation angles, and first structures and second structures are formed on different layers of the substrate or separately generated patterns on a same layer of the substrate. | 06-27-2013 |
20130170733 | METHOD FOR BUILDING RULE OF THUMB OF DEFECT CLASSIFICATION, AND METHODS FOR CLASSIFYING DEFECT AND JUDGING KILLER DEFECT BASED ON RULE OF THUMB AND CRITICAL AREA ANALYSIS - A method for building a rule of thumb of defect classification is illustrated. Multiple defect classification images with killer defects of examples and all material information of processes associated with the defect, the pattern, and the background are input into the fab tool. The fab tool obtains image characteristics, process characteristics, and image relativity characteristics of the defects, the pattern, and the background in each of the input images, wherein the input images comprises the defect classification images with killer defects of examples. The rule of thumb of the defect classification is built based on the process characteristics, the image characteristics, and the image relativity characteristics of the defects, the pattern, and the background in each of the input images. | 07-04-2013 |
20130170734 | Visual Inspection Device, Visual Inspection Method, And Computer Program - Inputs of a plurality of images constituting a group of images of items regarded as non-defective items are previously accepted and stored, and a defect threshold for detecting a defective portion of an inspection object is set based on the plurality of stored images. A defect amount to be compared with a determination threshold for making a non-defective/defective determination on the inspection object is calculated with respect to each of the plurality of stored images based on the set defective threshold, and whether or not each of the calculated defect amounts is an outlier is tested by use of at least one of a parametric technique and a non-parametric technique. Outlier information for specifying an image whose defect amount has been tested to be the outlier is displayed and outputted. | 07-04-2013 |
20130182941 | APPEARANCE INSPECTION APPARATUS AND METHOD - An appearance inspection apparatus comprises an inspection part for detecting a defect of a pattern on the basis of an image of a surface of a substrate on which the pattern is formed, which is captured by an imaging part. The inspection part comprises an image transfer part for transferring image data which is obtained by imaging a region to be inspected on the substrate and stored in an image storing memory by the imaging part to a plurality of image processing memories and a plurality of GPUs for taking image data corresponding to respective regions to be processed out of transferred image data which are transferred to the image processing memories by the image transfer part and performing an inspection process for defect detection on the image data. The inspection part further comprises an image processing control part for acquiring inspection tasks each prescribing inspection details from an inspection task holding part and controlling the plurality of GPUs in accordance with the inspection tasks, respectively, independently of the image transfer by the image transfer part. | 07-18-2013 |
20130188859 | Segmentation for Wafer Inspection - Methods and systems for segmenting pixels for wafer inspection are provided. One method includes determining a statistic for individual pixels based on a characteristic of the individual pixels in an image acquired for a wafer by an inspection system. The method also includes assigning the individual pixels to first segments based on the statistic. In addition, the method includes detecting one or more edges between the first segments in an image of the first segments and generating an edge map by projecting the one or more edges across an area corresponding to the image for the wafer. The method further includes assigning the individual pixels to second segments by applying the first segments and the edge map to the image for the wafer thereby segmenting the image. Defect detection is performed based on the second segments to which the individual pixels are assigned. | 07-25-2013 |
20130202187 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR CAD-BASED REGISTRATION - A system for location based wafer analysis, the system comprising: (i) a first input interface; (ii) a second input interface; (iii) a correlator; and (iv) a processor, configured to generate inspection results for the inspected wafer, with the help of at least one frame run-time displacement. | 08-08-2013 |
20130202188 | DEFECT INSPECTION METHOD, DEFECT INSPECTION APPARATUS, PROGRAM PRODUCT AND OUTPUT UNIT - A defect inspection method has the following steps. An irradiation step of irradiating illumination light on an object. A detection step of detecting scattered light from the object. A defect detection step having the following steps. A first pixel-value information acquisition step of dividing an image based on the scattered light into multiple areas and obtaining first pixel value information, information of the pixel value about each of the multiple areas. A second pixel-value information acquisition step of acquiring second pixel value information, information of the pixel value about all the areas by processing the first pixel value information obtained. A similarity calculation step of calculating the similarity between each image of the multiple areas and the image of all the areas by comparing the first and the second pixel value information. A defect extraction step of extracting a defect of the object using the calculated similarity. | 08-08-2013 |
20130202189 | DEFECT CLASSIFICATION METHOD AND APPARATUS, AND DEFECT INSPECTION APPARATUS - A defect classification method to classify defects by using a classifier having a binary tree structure based on features of defects extracted from detected signals acquired from a defect inspection apparatus includes a classifier construction process for constructing the classifier by setting a branch condition including defect classes respectively belonging to groups located on both sides of the branch point, a feature to be used for branching, and a discriminant reference, for each branch point in the structure based on instruction of defect classes and feature data respectively associated therewith beforehand. The process includes a priority order specification process for previously specifying target classification performance of purity and accuracy for each defect class, whole and in worst case, with priority order, and an evaluation process for evaluating whether the specified target classification performance under the branching condition is satisfied and displaying a result of evaluation, every item. | 08-08-2013 |
20130208974 | IMAGE PROCESSING DEVICE AND IMAGE PROCESSING METHOD - According to one embodiment, a condition judging unit judges whether a target pixel corresponds to a defect condition based on a signal of the target pixel and a signal of a horizontal peripheral pixel. A signal substituting unit performs signal substitution on the target pixel corresponding to the defect condition. When the condition judging unit judges that at least one of a vertical peripheral pixel and an oblique peripheral pixel corresponds to the defect condition, the signal substituting unit stops the signal substitution on the target pixel. | 08-15-2013 |
20130216122 | SCRATCH DETECTION METHOD AND APPARATUS - A method of identifying discontinuities in the surface of a substrate is herein disclosed. An object plane of an imaging system is positioned at a focal position associated with a discontinuity and an image is captured, the discontinuity having a relatively higher contrast with respect to the remainder of the surface of the substrate. The discontinuity is thereby more readily discernable than when the focal plane is positioned at the surface of the substrate. Analysis of discontinuities may include the extraction of discontinuity characteristics. | 08-22-2013 |
20130236086 | Method of Inspecting Chip Defects - The present invention provides a method for inspecting chip defects. A raw image of a chip is used to extract a chip image. A binary chip edge image obtained from the chip image is used for inspecting defects, coordinated with statistics of edge pixels. During packaging the chip, defects that exceed inspection criteria and affect chip quality are quantitatively and accurately inspected out. The present invention has a simple procedure with high performance on inspecting defect modes and defect sizes. Thus, the present invention greatly improves performance and accuracy of inspections on chip defects for further saving a great amount of labor, time and cost. | 09-12-2013 |
20130236087 | TESTING METHOD AND TESTING DEVICE FOR LASER DIODE DIE - In a testing method for a laser diode (LD) die, a sequence of current values of electric current increasing with a fixed increment is calculated. Then, control parameters are obtained. The electric current is applied to the LD die according to the control parameters. A sequence of voltage values across the LD die and a sequence of power values of light emitted form the LD die are measured according to the control parameters. A table and a graph are generated using the sequence of current values, the sequence of voltage values, and the sequence of power values. Both of the table and the graph indicate an electro-optical property of the LD die. Next, whether the LD die is qualified is determined based upon the table, the graph, and a predetermined electro-optical property. | 09-12-2013 |
20130236088 | PROCESS MONITORING DEVICE AND PROCESS MONITORING METHOD IN SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS - Provide is a process monitoring device in a semiconductor manufacturing apparatus that can readily and reliably monitor the process in the semiconductor manufacturing apparatus. The process monitoring device includes a storage unit that stores a normal state moving image data indicating a normal state of the process; an image capturing unit that captures an image of a state of the process to be monitored to acquire a moving image data; an abnormality level calculation unit configured to extract a feature amount for each frame of the moving image data and the normal state moving image data, and calculate an abnormality level based on the extracted feature amount; and a display unit that displays the abnormality level calculated by the abnormality level calculation unit in association with a frame position of the moving image data. | 09-12-2013 |
20130243304 | ARRAY TESTING METHOD AND DEVICE - A method for testing an array, by using an array testing device for detecting a voltage distribution formed on an array substrate, includes resetting pixel voltages of a plurality of pixel circuits formed on the array substrate with a predetermined voltage, detecting the voltage distribution of the array substrate, generating a correction value for correcting the voltage distribution of the array substrate, and measuring a threshold voltage of a driving transistor included in the plurality of pixel circuits formed on the array substrate by applying the correction value. | 09-19-2013 |
20130259358 | SYSTEM AND METHOD FOR ALIGNMENT IN SEMICONDUCTOR DEVICE FABRICATION - A method of determining overlay error in semiconductor device fabrication includes receiving an image of an overlay mark formed on a substrate. The received image is separated into a first image and a second image, where the first image includes representations of features formed on a first layer of the substrate and the second image includes representations of the features formed on a second layer of the substrate. A quality indicator is determined for the first image and a quality indicator is determined for the second image. In an embodiment, the quality indicators include asymmetry indexes | 10-03-2013 |
20130279794 | INTEGRATION OF AUTOMATIC AND MANUAL DEFECT CLASSIFICATION - A method for defect classification includes storing definitions of defect classes in terms of a classification rules in a multi-dimensional feature space. Inspection data associated with defects detected in one or more samples under inspection is received. A plurality of first classification results is generated by applying an automatic classifier to the inspection data based on the definitions, the plurality of first classification results comprising a class label and a corresponding confidence level for a defect. Upon determining that a confidence level for a defect is below a predetermined confidence threshold, a plurality of second classification results are generated by applying at least one inspection modality to the defect. A report is generated comprising a distribution of the defects among the defect classes by combining the plurality of first classification results and the plurality of second classification results. | 10-24-2013 |
20130279795 | OPTIMIZATION OF UNKNOWN DEFECT REJECTION FOR AUTOMATIC DEFECT CLASSIFICATION - A method for defect classification includes storing, in a computer system, a definition of a region in a feature space. The definition is associated with a class of defects and comprises a kernel function comprising a parameter. The parameter determines a shape of the region. A confidence threshold for automatic classification of at least one defect associated with the class is received. A value of the parameter associated with the confidence threshold is selected. Inspection data for a plurality of defects detected in one or more samples under inspection is received. The plurality of defects for the class are automatically classified using the kernel function and the selected value of the parameter. | 10-24-2013 |
20130279796 | CLASSIFIER READINESS AND MAINTENANCE IN AUTOMATIC DEFECT CLASSIFICATION - A method for classification includes receiving inspection data associated with a plurality of defects found in one or more samples and receiving one or more benchmark classification comprising a class for each of the plurality of defects. a readiness criterion for one or more of the classes is evaluated based on the one or more benchmark classification results, wherein the readiness criterion comprises for each class, a suitability of the inspection data for training an automatic defect classifier for the class. A portion of the inspection data is selected corresponding to one or more defects associated with one or more classes that satisfy the readiness criterion. One or more automatic classifiers are trained for the one or more classes that satisfy the readiness criterion using the selected portion of the inspection data. | 10-24-2013 |
20130294680 | IMAGE CLASSIFICATION METHOD AND IMAGE CLASSIFICATION APPARATUS - In an apparatus for automatically classifying an image picked up of a defect on a semiconductor wafer according to user defined class, when images picked up by a plurality of different observation apparatuses are inputted in a mixed manner, the defect image classification accuracy rate decreases due to image property differences corresponding to differences in the observation apparatuses. In an automatic image classification apparatus supplied with defect images picked up by a plurality of observation apparatuses, when preparing a recipe, image process parameters are adjusted and a classification discriminating surface is prepared for each observation apparatus. When classifying an image, the observation apparatus that picked up a defect image is identified based on accompanying information or the like of the image, and an image process and a classification process are performed by using the image process parameters and the classification discriminating surface corresponding to the observation apparatus that picked up the image. In order to efficiently adjust the image process parameters for each observation apparatus, appropriate image process parameters are automatically adjusted on the basis of an exemplified defect area. The image process parameters adjusted in a given observation apparatus may be used for setting the image process parameters for another observation apparatus. | 11-07-2013 |
20130322736 | METHOD AND APPARATUS FOR EFFICIENT DEFECT INSPECTION - A method of inspecting fabricated articles includes receiving a fabricated article to be inspected for defects, the fabricated article having a pattern thereon, and the pattern being based on a pattern design and creating a rule set for defining critical regions of the pattern as represented in the pattern design, the critical regions being regions in which defects are more likely to be found during inspection. The method also includes applying the rule set to the pattern design to identify a critical region of the pattern on the fabricated article and a non-critical region of the pattern on the fabricated article. Further, the method includes inspecting the non-critical region of the pattern on the fabricated article for defects at first resolution and inspecting the critical region of the pattern on the fabricated article for defects at a second resolution higher than the first resolution. | 12-05-2013 |
20130322737 | DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS - A defect inspection method comprising: picking up an image of a subject under inspection to thereby acquire an inspection image; extracting multiple templates corresponding to multiple regions, respectively from design data of the subject under inspection; finding a first misregistration amount between the inspection image and the design data using a first template as any one template selected from among the plural templates; finding a second misregistration amount between the inspection image and the design data using a second template other than the first template, the second template being selected from among the plural templates, and the first misregistration-amount; and converting the design data, misregistration thereof being corrected using the first misregistration-amount, and the second misregistration-amount, into a design data image, and comparing the design data image with the inspection image to thereby detect a defect of the subject under inspection. | 12-05-2013 |
20130336575 | SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR DETECTION OF DEFECTS WITHIN INSPECTION IMAGES - An analysis system for detection of defects within an inspection image of an inspected object, the inspection image comprising a plurality of pixels, the system including: a computerized segmentation module configured to segmentize the inspection image based on multiple anchor locations and on a mask which defines multiple mask-segments, by assigning each part out of multiple parts of the inspection image to a respective image-segment selected out of a multiple image segments, wherein the multiple image segments correspond to at least one mask-segment of said multiple mask-segments; and a defect detection processor configured to determine a presence of a defect in the inspection image based on the segmentation at least by assessing each pixel out of a plurality of pixels of the inspection image. | 12-19-2013 |
20130343632 | DEFECT INSPECTION METHOD AND APPARATUS - A pattern inspection apparatus is provided to compare images of regions, corresponding to each other, of patterns that are formed so as to be identical and judge that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer. | 12-26-2013 |
20140016854 | PATTERN MATCHING DEVICE AND COMPUTER PROGRAM - The present invention aims at providing a pattern matching device that conducts pattern matching on an image including a plurality of regions having different features with high precision, such as a pattern image including a plurality of layers. | 01-16-2014 |
20140037187 | Inspecting a Wafer and/or Predicting One or More Characteristics of a Device Being Formed on a Wafer - Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step. | 02-06-2014 |
20140037188 | DEFECT REVIEW METHOD AND APPARATUS - A candidate-defect classification method, including acquiring a scanning electron microscope image of a candidate defect detected on a sample including a pattern; computing a feature value of the candidate defect by processing the image; executing defect classification of the candidate defect as a pattern shape defect or another defect, by using the computed feature value; acquiring positional information contained in design data of the pattern regarding the candidate defect; and extracting a systematic defect from candidate defects classified as pattern shape defects, by comparing the positional information contained in the design data of the acquired candidate defect to positional information of a portion having a high probability of causing pattern formation failure, and that has been obtained from the design data of the pattern, or a systematic defect caused due to a layout shape of the pattern, or properties of a processor for forming the pattern. | 02-06-2014 |
20140050389 | Automated Inspection Scenario Generation - Methods and systems for determining inspection scenarios without input from a user are presented. Inspection scenarios include at least one acquisition mode, defect detection parameter values, and classification parameter values. In one example, a number of defect events are determined by a hot inspection of a wafer surface. The defect events are classified and attributes associated with each defect event are identified. The defect events are labeled with this information. Based on the identified attributes and classification, inspection scenarios are determined. The inspection scenarios are solutions in a mathematical space formed by the identified attributes. In some examples, a plurality of inspection scenarios are determined and a desired inspection scenario is selected from the plurality based on the number of defects of interest and the number of nuisance events captured by the selected inspection scenario. | 02-20-2014 |
20140064600 | Optical Proximity Correction Modeling Method and System - An optical proximity correction modeling method for predicting a topography effect due to a pattern stack structure that includes a first material pattern, a second material pattern, and a boundary region between the first material pattern and the second material pattern. The method includes generating a first region filter that corresponds to the first material pattern, a second region filter that corresponds to the second material pattern, and an edge function corresponding to the boundary region; generating a bulk image signal from a layout using the first region filter and the second region filter; generating an edge image signal from the layout using the edge function, a characteristic kernel that represents characteristics of the boundary region, the first region filter, and the second region filter; and generating a final model signal from the bulk image signal and the edge image signal. | 03-06-2014 |
20140072203 | Selecting Parameters for Defect Detection Methods - Computer-implemented methods, computer-readable media, and systems for selecting one or more parameters for a defect detection method are provided. One method includes selecting one or more parameters of a defect detection method using an optimization function and information for a set of classified defects, which includes defects of interest and nuisance defects, such that the one or more parameters satisfy an objective for the defect detection method. | 03-13-2014 |
20140072204 | DEFECT CLASSIFICATION METHOD, AND DEFECT CLASSIFICATION SYSTEM - In automatic defect classification, a classification recipe must be set for each defect observation device. If a plurality of devices operate at the same stage, the classification class in the classification recipes must be the same. Problems have arisen whereby differences occur in the classification class in different devices when a new classification recipe is created. This defect classification system has a classification recipe storage unit; an information specification unit, the stage of a stored image, and device information. A corresponding defect specification unit specifies images of the same type of defect from images obtained from different image pickup devices at the same stage. An image conversion unit converts the images obtained from the different image pickup devices at the same stage into comparable similar images; and a recipe update unit records the classification classes in the classification recipes corresponding to the specified images of the same type of defect. | 03-13-2014 |
20140093157 | WAFER IDENTIFICATION FAULT RECOVERY - Described are computer-based methods and apparatuses, including computer program products, for wafer identification fault recovery. A digital image is received that includes a data symbol comprising a message encoded in a set of data cells. The digital image is processed to form a set of classified data cells, wherein one or more classified data cells from the set of classified data cells comprises an error. User interface data is transmitted comprising the digital image and interactive graphics, the interactive graphics including at least one data cell control. Interaction data is received from the interactive graphics that modifies a data cell location, a data cell state, or both, of at least one classified data cell from the set of classified data cells to form a modified set of classified data cells. An error free decoded message string is generated based on the modified set of classified data cells. | 04-03-2014 |
20140105482 | Detecting Defects on a Wafer Using Defect-Specific Information - Methods and systems for detecting defects on a wafer using defect-specific information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest formed on the wafer and a known DOI occurring proximate to or in the pattern of interest. The information includes an image of the target on the wafer. The method also includes searching for target candidates on the wafer or another wafer. The target candidates include the pattern of interest. The target and target candidate locations are provided to defect detection. In addition, the method includes detecting the known DOI in the target candidates by identifying potential DOI locations in images of the target candidates and applying one or more detection parameters to images of the potential DOI locations. | 04-17-2014 |
20140126805 | OPTICAL INSPECTION METHOD - An optical inspection method including the following steps is disclosed. A tester is utilized to obtain an image of an inspection object. A target image region of the image is determined. Multiple central coordinates of multiple inspection ranges of a target image region are obtained. The central coordinates are filled to an array, and then the central coordinates are reordered according to relative relationships of the central coordinates to obtain a reordered coordinate array. The reordered coordinate array is compared with an original coordinate array to inspect whether parts of the inspection object corresponding to the inspection ranges are missed. | 05-08-2014 |
20140133736 | SYSTEM AND METHOD FOR DEFECT ANALYSIS OF A SUBSTRATE - The present disclosure provides a method including providing a first image and a second image. The first image is of a substrate having a defect and the second image is of a reference substrate. A difference between the first image and the second image is determined. A simulation model is used to generate a simulation curve corresponding to the difference and the substrate dispositioned based on the simulation curve. In another embodiment, the scan of a substrate is used to generate a statistical process control chart. | 05-15-2014 |
20140133737 | Unbiased Wafer Defect Samples - Methods and systems for generating unbiased wafer defect samples are provided. One method includes selecting the defects detected by each of multiple scans performed on a wafer that have the most diversity in one or more defect attributes such that a diverse set of defects are selected across each scan. In addition, the method may include selecting the defects such that any defect that is selected and is common to two or more of the scans is not selected twice and any defects that are selected are diverse with respect to the common, selected defect. Furthermore, no sampling, binning, or classifying of the defects may be performed prior to selection of the defects such that the sampled defects are unbiased by any sampling, binning, or classifying method. | 05-15-2014 |
20140153814 | Method and System for Mixed Mode Wafer Inspection - Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells. | 06-05-2014 |
20140153815 | INSPECTION TOOL AND METHODOLOGY FOR THREE DIMENSIONAL VOLTAGE CONTRAST INSPECTION - A system and method for improved voltage contrast inspection is disclosed. In one embodiment the temporal response to voltage contrast is considered to find an optimal acquisition time. In another embodiment, multiple optimal acquisition times are identified. The identified acquisition times are used in voltage contrast inspection of semiconductor fabrication, and are well-suited to SOI technology. | 06-05-2014 |
20140177940 | RECIPE GENERATION APPARATUS, INSPECTION SUPPORT APPARATUS, INSPECTION SYSTEM, AND RECORDING MEDIA - A desired area is extracted by directly analyzing information recorded in a design layout, an inspection recipe is generated by using this extraction method, and an efficient inspection is realized. The invention makes it easy to extract an area of a desired circuit module such as a memory mat by analyzing hierarchy information of design layout data, calculating reference frequency of each one cell in the design layout data that is its internal data, sorting the cells in order of increasing reference frequency, searching the object, and tracing its upper cell. | 06-26-2014 |
20140185919 | Detecting Defects on a Wafer - Methods and systems for detecting defects on a wafer are provided. One method includes identifying one or more characteristics of first raw output generated for a wafer that correspond to one or more geometrical characteristics of patterned features formed on the wafer and assigning individual output in second raw output generated for the wafer to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different. | 07-03-2014 |
20140193065 | Detecting Defects on a Wafer Using Template Image Matching - Various embodiments for detecting defects on a wafer are provided. Some embodiments include matching a template image, in which at least some pixels are associated with regions in the device having different characteristics, to output of an electron beam inspection system and applying defect detection parameters to pixels in the output based on the regions that the pixels in the output are located within to thereby detect defects on the wafer. | 07-10-2014 |
20140198973 | TERAHERTZ TEMPORAL AND SPATIAL RESOLUTION IMAGING SYSTEM, IMAGING METHOD AND APPLICATION THEREOF - A terahertz temporal and spatial resolution imaging system is provided. The system includes: a sample placing rack; a detection crystal, located on the exit side of the sample placing rack; a pump light generating device, for generating a pump light to irradiate the test sample; a terahertz light generating device, for generating a terahertz light to irradiate the test sample, irradiate the detection crystal after obtaining information about the test sample, and modulate an index ellipsoid of the detection crystal; a detection light generating device, for generating a detection light to irradiate the detection crystal to detect the index ellipsoid of the detection crystal, thereby indirectly obtaining the information about the test sample; and an imaging apparatus, located in an optical path after the detection light passes through the detection crystal, for collecting terahertz images of the test sample. | 07-17-2014 |
20140198974 | SEMICONDUCTOR DEVICE DEFECT INSPECTION METHOD AND SYSTEM THEREOF - Provided are a semiconductor device defect inspection method and system thereof, with which predetermined hot spots are inspected using a SEM, and with which the frequency of defects occurring at the hot spot is estimated statistically and with reliability. An inspection point is designated in design data by the defect type. A plurality of pre-designated inspection points is selected by the defect type from the designated inspection points. The plurality of pre-designated inspection points by defect type thus selected are image captured by the inspection points. A defect ratio, which is a ratio of the plural inspection points which are image captured by the defect type to the plural defects detected, and a reliability interval of the defect ratio which is computed by the defect type is compared with a preset reference value. A defect type having a defect occurrence ratio which exceeds the reference value is derived. | 07-17-2014 |
20140198975 | REGION-OF-INTEREST DETERMINATION APPARATUS, OBSERVATION TOOL OR INSPECTION TOOL, REGION-OF-INTEREST DETERMINATION METHOD, AND OBSERVATION METHOD OR INSPECTION METHOD USING REGION-OF-INTEREST DETERMINATION METHOD - The present invention aims at efficiently determining the partial regions to be inspected with high sensitivity and measured with high accuracy. | 07-17-2014 |
20140205180 | METHOD, APPARATUS AND DEVICE FOR INSPECTING CIRCUIT PATTERN DEFECT - A method for inspecting a defect of a circuit pattern includes obtaining an image containing the circuit pattern, expanding or contracting the circuit pattern contained in the image in one direction, so that a defective first portion of the circuit pattern contained in the image is overlapped after expanding the circuit pattern contained in the image, and so that a second portion formed between defective segments of the circuit pattern contained in the image is eliminated after contracting the circuit pattern contained in the image, and generating an inspection data that is associated with a position of a defect of the circuit pattern based on a position of the first portion or a position of the second portion. | 07-24-2014 |
20140212021 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR PATCH-BASED DEFECT DETECTION - A system capable of inspecting an article for defects, the system including: a patch comparator, configured to determine with respect to each of a plurality of reference patches in a reference image a similarity level, based on a predefined patch-similarity criterion and on a source patch defined in the reference image; an evaluation module, configured to rate each inspected pixel out of multiple inspected pixels of the inspection image with a representative score which is based on the similarity level of a reference patch associated with a reference pixel corresponding to the inspected pixel; a selection module, configured to select multiple selected inspected pixels based on the representative scores of the multiple inspected pixels; and a defect detection module, configured to determine a presence of a defect in the candidate pixel based on an inspected value of the candidate pixel and inspected values of the selected inspected pixels. | 07-31-2014 |
20140212022 | METHOD OF DESIGN-BASED DEFECT CLASSIFICATION AND SYSTEM THEREOF - There is provided an inspection method capable of classifying defects detected on a production layer of a specimen. The method comprises: obtaining input data related to the detected defects; processing the input data using a decision algorithm associated with the production layer and specifying two or more classification operations and a sequence thereof; and sorting the processed defects in accordance with predefined bins, wherein each bin is associated with at least one classification operation, wherein at least one classification operation sorts at least part of the processed defects to one or more classification bins to yield finally classified defects, and wherein each classification operation, excluding the last one, sorts at least part of the processed defects to be processed by one or more of the following classification operations. | 07-31-2014 |
20140212023 | PATTERN INSPECTION METHOD AND PATTERN INSPECTION APPARATUS - In accordance with an embodiment, a pattern inspection method includes applying a light to a substrate including an inspection target pattern in a plurality of optical conditions, detecting a reflected light from the substrate to acquire a pattern image for each of the optical conditions, outputting a gray value difference between the pattern image and a reference image for each of the optical conditions, and specifying a position of the defect in a stacking direction of the stacked film from a relation of the obtained gray value difference between the optical conditions. The pattern is formed by a stacked film, the optical conditions includes at least a first optical condition for detection of a defect on a surface of the stacked film. | 07-31-2014 |
20140212024 | CONTOUR-BASED ARRAY INSPECTION OF PATTERNED DEFECTS - One embodiment relates to a method of inspecting an array of cells on a substrate. A reference image is generated using a cell image that was previously determined to be defect free. A reference contour image which includes contours of the reference image is also generated. The reference contour image is used to detect defects in the array of cells on the substrate. Another embodiment relates to a system for detecting defects in an array on a substrate. Other embodiments, aspects and features are also disclosed. | 07-31-2014 |
20140219543 | Defect Determination in Integrated Circuit Manufacturing Process - A method includes inspecting a wafer to find a first potential defect having a first wafer coordinate, and capturing a patch image of the first potential defect from the wafer. The patch image is compared with patterns of a wafer representation to find a first layout coordinate of a location in the wafer representation, wherein the location in the wafer representation corresponds to a location of the first potential defect in the wafer. A reference feature in the wafer representation is selected, wherein the reference feature in the wafer representation has a second layout coordinate. A coordinate difference between the first layout coordinate and the second layout coordinate is calculated. The coordinate difference is subtracted from the first wafer coordinate to calculate a second wafer coordinate of a reference feature in the wafer, wherein the reference feature in the wafer representation corresponds to the reference feature in the wafer. | 08-07-2014 |
20140219544 | Detecting Defects on a Wafer Using Defect-Specific and Multi-Channel Information - Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different. | 08-07-2014 |
20140219545 | SEMICONDUCTOR INSPECTION SYSTEM - When the lengths of FEM wafers are automatically measured, not only the sizes of targets, the lengths of which are to be measured, are often varied from those in registration, but also the patterns of the targets are often deformed. Therefore, it is difficult to automatically determine whether the length measurement is possible or not. Therefore, the following are executed with a semiconductor inspection system: (1) a process of identifying the position of the contour line of an inspected image using a distance image calculated from a reference image, (2) a process of calculating a defect size image based on the position of the contour line with respect to the identified distance image, and detecting a defect candidate from the defect size image, and (3-1) a process of, upon detection of the defect candidate, calculating the size of the detected defect candidate, or (3-2) a process of detecting a portion different between the first and second contour lines as the defect candidate. | 08-07-2014 |
20140219546 | Method and Apparatus for Reviewing Defect - A method for reviewing defect, comprising the steps of: as an image acquisition step, imaging a surface of a sample using arbitrary image acquisition condition selected from a plurality of image acquisition conditions and obtaining a defect image; as a defect position calculation step, proceeding the defect image obtained by the image acquisition step and calculating a defect position on the surface of the sample; as a defect detection accuracy calculation step, obtaining a defect detection accuracy of the defect position calculated by the defect position calculation step; and as a conclusion determination step, determinating whether the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined requirement or not; wherein until it is determined that the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined in the conclusion determination step, the image acquisition condition is selected from the plurality of image acquisition conditions once again and the image acquisition step, the defect position calculation step, the defect detection accuracy calculation step and the conclusion determination step are repeated. | 08-07-2014 |
20140233844 | SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR DEFECT DETECTION BASED ON MULTIPLE REFERENCES - A defect detection system for computerized detection of defects, the system including: an interface for receiving inspection image data including information of an analyzed pixel and of a plurality of reference pixels; and a processor, including: a differences analysis module, configured to: (a) calculate differences based on an inspected value representative of the analyzed pixel and on multiple reference values, each of which is representative of a reference pixel among the plurality of reference pixels; wherein the differences analysis module is configured to calculate for each of the reference pixels a difference between the reference value of the reference pixel and the inspected value; and (b) compute a representative difference value based on a plurality of the differences; and a defect analysis module, configured to determine a presence of a defect in the analyzed pixel based on the representative difference value. | 08-21-2014 |
20140241610 | Generalized Virtual Inspector - Generalized virtual inspectors are provided. One system includes two or more actual systems configured to perform one or more processes on specimen(s) while the specimen(s) are disposed within the actual systems. The system also includes one or more virtual systems coupled to the actual systems to thereby receive output generated by the actual systems and to send information to the actual systems. The virtual system(s) are configured to perform one or more functions using at least some of the output received from the actual systems. The virtual system(s) are not capable of having the specimen(s) disposed therein. | 08-28-2014 |
20140241611 | PATTERN INSPECTION METHOD AND PATTERN INSPECTION APPARATUS - A pattern inspection method includes acquiring an image of a pattern in a stripe region concerned, regarding each of stripe regions of the first group each not including an adjacent stripe region in plural stripe regions obtained by virtually dividing an inspection region of a target object on which patterns have been formed into the plural stripe regions each partially overlapping an adjacent stripe region, wherein the acquiring is performed using laser lights or electron beams, in a longitudinal direction of the stripe region of the first group, and acquiring an image of a pattern in a stripe region concerned, regarding each of stripe regions of the second group each not including an adjacent stripe region, in remaining stripe regions other than the first group stripe regions, wherein the acquiring is performed using laser lights or electron beams, in the longitudinal direction of the stripe region of the second group. | 08-28-2014 |
20140270474 | Detecting Defects on a Wafer - Methods and systems for detecting defects on a wafer are provided. One method includes determining difference values for pixels in first output for a wafer generated using a first optics mode of an inspection system and determining other values for pixels in second output for the wafer generated using a second optics mode of the inspection system. The first and second optics modes are different from each other. The method also includes generating a two-dimensional scatter plot of the difference values and the other values for the pixels in the first and second output corresponding to substantially the same locations on the wafer. The method further includes detecting defects on the wafer based on the two-dimensional scatter plot. | 09-18-2014 |
20140270475 | Single Die Inspection on a Dark Field Inspection Tool - Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with a dark field inspection system. The method also includes generating first image data for the wafer using the output and a first cell size and second image data for the wafer using the output and a second cell size. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data. | 09-18-2014 |
20140301629 | High Accuracy Design Based Classification - Systems and methods for classifying defects on a wafer are provided. One method includes dilating an extended bounding box (EBB) surrounding a defect position on a wafer in two dimensions in proportion to a width and height of a pattern of interest (POI) for a hot spot closest to the defect position. The method also includes determining if polygons in the POI match polygons in the dilated bounding box. If the polygons in the POI do not match the polygons in the dilated bounding box, the defect is classified as a non-hot spot defect. If the polygons in the POI match the polygons in the dilated bounding box, the defect is classified as a hot spot defect if the area of the EBB intersects the area of interest associated with the hot spot and a non-hot spot defect if the EBB area does not intersect the area of interest. | 10-09-2014 |
20140301630 | Adaptive Sampling for Semiconductor Inspection Recipe Creation, Defect Review, and Metrology - Methods and systems for adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology are provided. The embodiments provide image processing and pattern recognition algorithms and an adaptive sampling method for extracting critical areas from SEM image patches for use in a wafer inspection system when design data for a semiconductor chip is not available. The embodiments also provide image processing and pattern recognition algorithms for efficiently discovering critical defects and significant deviations in the normal manufacturing process, using the output from a wafer inspection system and an adaptive sampling method to select wafer locations to be examined on a high resolution review or metrology tool. | 10-09-2014 |
20140307944 | PANEL INSPECTION METHOD AND APPARATUS - Provided are a panel inspection method and apparatus, the panel inspection method including: (a) determining if a variance value of luminance of a captured image of a panel is greater than a reference value, and searching for an original image and at least one secondary reflective image of a defect of the panel if it is determined that the variance value is greater than the reference value; and (b) determining whether the defect is an actual defect or an impurity disposed on the panel based on at least one of a difference in a luminance characteristic between the original image and the secondary reflective image and a number of the searched secondary reflective image. | 10-16-2014 |
20140307945 | INSPECTION METHOD AND INSPECTION APPARATUS - An inspection method and inspection apparatus comprising, acquiring an optical image of a pattern formed in a sample, generating a reference image corresponding to the optical image, comparing the optical image and the reference image using a die-to-database method to detect a defect in the optical image and storing information on the defect; regenerating a reference image by reflecting a dimension distribution of a pattern in the surface of the sample on the reference image, and re-comparing an optical image in which a defect is detected by the comparison using the die-to-database method and the regenerated reference image which corresponds to the optical image using the die-to-database method to detect the defect in the optical image in which the defect has been detected, storing information on the defect when the defect is redetected, and determining that the optical image has no defect. | 10-16-2014 |
20140307946 | OBSERVATION DEVICE AND OBSERVATION METHOD - A plurality of images is captured, and the plurality of images is integrated and displayed after one or more ROIs included in the captured images are extracted and classified. At integration, an integration method is controlled according to a classification result of the ROI. | 10-16-2014 |
20140307947 | Design Based Sampling and Binning for Yield Critical Defects - Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree. | 10-16-2014 |
20140314305 | TEMPLATE INSPECTION DEVICE - According to one embodiment, a template inspection device used in imprint lithography, comprises an inspection image data acquisition unit configured to acquire inspection image data of an inspection target replica template pattern based on a master template pattern; a comparison data generation unit configured to generate comparison data by comparing the inspection image data of the inspection target replica template pattern with corrected reference image data, and a defect determination unit configured to determine a defect in the inspection target replica template pattern based on the comparison data generated by the comparison data generation unit. | 10-23-2014 |
20140321730 | METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER - A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method. | 10-30-2014 |
20140328534 | DETECTION OF DEFECTS ON WAFER DURING SEMICONDUCTOR FABRICATION - Among other things, systems and techniques are provided for detecting defects on a wafer based upon non-correctable error data yielded from a scan of the wafer to determine a topology of the wafer. The non-correctable error data is reconstructed to generate a non-correctable error image map, which is transformed to generate a projection. In some embodiments, the non-correctable error image map is transformed via a feature extraction transform such as a Hough transform or a Radon transform. In some embodiments, the projection is compared to a set of rules to identify a signature in the non-correctable error image map indicative of a defect. | 11-06-2014 |
20140341462 | MACHINE LEARNING METHOD AND APPARATUS FOR INSPECTING RETICLES - Apparatus and methods for inspecting a photolithographic reticle are disclosed. A reticle inspection tool is used at one or more operating modes to obtain images of a plurality of training regions of a reticle, and the training regions are identified as defect-free. Three or more basis training images are derived from the images of the training regions. A classifier is formed based on the three or more basis training images. The inspection system is used at the one or more operating modes to obtain images of a plurality of test regions of a reticle. Three or more basis test images are derived from to the test regions. The classifier is applied to the three or more basis test images to find defects in the test regions. | 11-20-2014 |
20140355867 | SYSTEM AND METHOD FOR IDENTIFYING SYSTEMATIC DEFECTS IN WAFER INSPECTION USING HIERARCHICAL GROUPING AND FILTERING - A number of wafers of a same semiconductor device are inspected to generate a plurality of candidate defect lists for identifying systematic defects. Each candidate defect list comprises a plurality of candidate defects obtained from inspecting one of the wafers. Each candidate defect is represented by a plurality of defect attributes including a defect location. The candidate defects in every one or more candidate defect lists are processed as a set by stage one grouping and filtering to generate a stage one defect list for each set. The candidate defects in all the stage one defect lists are then processed together by stage two grouping and filtering to generate a final defect lists for systematic defects. The defect attributes of each defect and a design pattern clip extracted from a design database based on the defect location are used in the hierarchical grouping and filtering. | 12-04-2014 |
20140376802 | Wafer Inspection Using Free-Form Care Areas - Methods and systems for detecting defects on a wafer are provided. One method includes determining characteristics of care areas for a wafer based on wafer patterns. Determining the characteristics includes determining locations of care areas, identifying at least one pattern of interest (POI) in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, allowing the care areas to be larger than frame images and selecting two or more POIs for at least one of the care areas. The method also includes searching for POIs in images generated for the wafer using an inspection system. In addition, the method includes detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images. | 12-25-2014 |
20150016708 | PATTERN CHARACTERISATION METHOD - A method of characterizing a pattern includes determining an image of the contour of the pattern to be characterized with an imagining instrumentation; processing the image, the processing including determining a plurality of points located along the contour and sampled according to a given sampling interval; for each point, identifying a point located on a reference contour and corresponding to the same sampling interval number and determining a dimensionless intermediate coefficient representative of the deviation between the point and the corresponding point on the reference contour; determining a final dimensionless coefficient on the basis of the set of intermediate coefficients corresponding to the plurality of points, the final coefficient being representative of the deviation between the contour of the pattern to be characterized and the reference contour. | 01-15-2015 |
20150016709 | Pattern Sensing Device and Semiconductor Sensing System - An object of the invention is to provide a pattern measuring device for generating appropriate reference pattern data while suppressing an increase in the manufacturing cost that would occur when manufacturing conditions are finely changed. A pattern measuring device has an arithmetic processing unit for measuring a pattern formed on a sample. The arithmetic processing unit, on the basis of signals obtained with a charged particle beam device, acquires or generates image data or contour line data on a plurality of circuit patterns created under different manufacturing conditions of a manufacturing apparatus, and generates reference data to be used for measurement of a circuit pattern from the image data or contour line data. | 01-15-2015 |
20150016710 | Image Processing Architecture - An inspection system that receives image data corresponding to an image and processes the image data to produce a report corresponding to characteristics of the image. Interface cards receive the image data in a flow, where each interface card receives image data corresponding to a different portion of the image. Process nodes connect to the interface cards, and receive the image data from the interface cards. A host computer is connected to the process nodes, and job managers implemented in the host computer manage the flow of image data to and from the process nodes. The job managers remain operable during a crash of one of the process nodes. Process node programs are implemented in the process nodes, and analyze a portion of the image data and produce the report corresponding to the characteristics of the analyzed portion of the image data. At least one process node program is implemented in each process node. The process node programs rapidly analyze the image. The process node programs are isolated from the job managers so that a crash of a process node program does not crash the job manager. | 01-15-2015 |
20150030230 | SUBSTRATE INSPECTION METHOD, SUBSTRATE MANUFACTURING METHOD AND SUBSTRATE INSPECTION DEVICE - A method for inspecting a substrate having a plurality of holes formed on a plate-shaped material so as to extend over front and rear surfaces thereof. The method comprises picking-up an image of a plurality of holes formed on the substrate by imaging from one surface side of the substrate and obtaining a hole image of each hole (S | 01-29-2015 |
20150036914 | METHOD FOR ESTIMATING SHAPE BEFORE SHRINK AND CD-SEM APPARATUS - In the present invention, at the time of measuring, using a CD-SEM, a length of a resist that shrinks when irradiated with an electron beam, in order to highly accurately estimate a shape and dimensions of the resist before shrink, a shrink database with respect to various patterns is previously prepared, said shrink database containing cross-sectional shape data obtained prior to electron beam irradiation, a cross-sectional shape data group and a CD-SEM image data group, which are obtained under various electron beam irradiation conditions, and models based on such data and data groups, and a CD-SEM image of a resist pattern to be measured is obtained (S | 02-05-2015 |
20150036915 | Inspection Method - The invention relates to a method for the inspection of flat objects, in particular wafers ( | 02-05-2015 |
20150043803 | Phase-controlled model-based overlay measurement systems and methods - Overlay measurement systems and methods are disclosed that control the relative phase between the scattered and specular components of light to amplify weak optical signals before detection. The systems and methods utilize model-based regressional image processing to determine overlay errors accurately even in the presence of inter-pattern interference. | 02-12-2015 |
20150043804 | Adaptive Local Threshold and Color Filtering - Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a. wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects. | 02-12-2015 |
20150063677 | Scratch Filter for Wafer Inspection - Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer. | 03-05-2015 |
20150093014 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR CAD-BASED REGISTRATION - A system for location based wafer analysis, the system comprising: (i) a first input interface; (ii) a second input interface; (iii) a correlator; and (iv) a processor, configured to generate inspection results for the inspected wafer, with the help of at least one frame run-time displacement. | 04-02-2015 |
20150098643 | DEVICE FOR MEASURING CRITICAL DIMENSION OF PATTERN AND METHOD THEREOF - A device and method for measuring a critical dimension of a pattern on a display substrate is disclosed. In one aspect, the device includes a region of interest (ROI) setting unit setting a region of interest in image data, determining whether the region of interest is larger than a reference region, and generating a pattern image based on the region of interest. The device also includes a design file memory storing a plurality of design patterns, a matching unit matching the pattern image to one of design patterns, and a measurement unit measuring the critical dimension of the pattern in the pattern image. The ROI setting unit selects the image data as the pattern image and outputs the pattern image to the matching unit when the region of interest is larger than the reference region. | 04-09-2015 |
20150104094 | DEFECT DETECTION SYSTEM FOR EXTREME ULTRAVIOLET LITHOGRAPHY MASK - A defect detection system for an extreme ultraviolet lithography mask comprises an extreme ultraviolet light source ( | 04-16-2015 |
20150110384 | IMAGE INSPECTION METHOD OF DIE TO DATABASE - An image inspection method of die to database is provided, and the positions in the to-be-inspected chips within one wafer may be selected. In the method, a plurality of inspection areas in a plurality of positions in the to-be-inspected chips within a wafer are selected, a plurality of raw images of the inspection areas are obtained, and a plurality of locations of the raw images are then decoded. After that, an image extraction is performed on the raw images to obtain a plurality of image contours. Thereafter, the image contours are compared with a design database of the chip in order to obtain a result of a defect inspection, and execute the same thing in whole wafer. | 04-23-2015 |
20150125063 | METHOD OF OPTICAL PROXIMITY CORRECTION - A calculation method of optical proximity correction includes providing at least a feature pattern to a computer system. At least a first template and a second template are defined so that portions of the feature pattern are located in the first template and the rest of the feature pattern is located in the second template. The first template and the second template have a common boundary. Afterwards, a first calculation zone is defined to overlap an entire first template and portions of the feature pattern out of the first template. Edges of the feature pattern within the first calculation zone are then fragmented from the common boundary towards two ends of the feature pattern so as to generate at least two first beginning segments respectively at two sides of the common boundary. Finally, positions of the first beginning segments are adjusted so as to generate first adjusted segments. | 05-07-2015 |
20150125064 | Decision Tree Construction for Automatic Classification of Defects on Semiconductor Wafers - Methods and systems for decision tree construction for automatic classification of defects on semiconductor wafers are provided. One method includes creating a decision tree for classification of defects detected on a wafer by altering one or more floating trees in the decision tree. The one or more floating trees are sub-trees that are manipulated as individual units. In addition, the method includes classifying the defects detected on the wafer by applying the decision tree to the defects. | 05-07-2015 |
20150125065 | Method and System for Correlating Optical Images with Scanning Electron Microscopy Images - The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image. | 05-07-2015 |
20150125066 | MEASURING APPARATUS - A measuring apparatus includes an input unit to input optical image data of a figure pattern obtained by a pattern inspection apparatus which inspects a defect of a pattern on a target object to be inspected by scanning an inspection region of the target object, from the pattern inspection apparatus, and to input reference image data generated from design data of the pattern by the pattern inspection apparatus to be compared with the optical image data, from the pattern inspection apparatus, a positional deviation distribution generation unit to generate positional deviation distribution by measuring positional deviation of the pattern on the target object, by using the optical image data and the reference image data input from the pattern inspection apparatus, and an output unit to output generated positional deviation distribution of the pattern on the target object, wherein the measuring apparatus is arranged independently from the pattern inspection apparatus. | 05-07-2015 |
20150125067 | MEASURING APPARATUS - A measuring apparatus includes an optical image input unit to input optical image data of a figure pattern obtained by a pattern inspection apparatus, which inspects defects of a pattern on a target object to be inspected by scanning an inspection region of the target object, from the pattern inspection apparatus, a design data input unit to input design data of the pattern on the target object, a reference image generation unit to generate reference image data to be compared with the optical image data, by performing image development of the design data, a positional deviation distribution generation unit to generate positional deviation distribution by measuring a positional deviation amount of the pattern on the target object, by using the optical image data obtained from the pattern inspection apparatus and the reference image data having been generated, and an output unit to output generated positional deviation distribution of the pattern. | 05-07-2015 |
20150125068 | DEFECT ANALYZING APPARATUS, SUBSTRATE PROCESSING SYSTEM, DEFECT ANALYZING METHOD AND COMPUTER-READABLE STORAGE MEDIUM - A potential trouble can be in advance suppressed by analyzing a defect of a wafer. A defect analyzing apparatus of analyzing a defect of a substrate includes an imaging unit configured to image target substrates; a defect feature value extracting unit configured to extract a defect feature value in a surface of the substrate based on the substrate image; a defect feature value accumulating unit configured to calculate an accumulated defect feature value with respect to the substrates to create an accumulation data AH; a defect determination unit configured to determine whether the accumulated defect feature value exceeds a preset critical value; and an output display unit configured to output a determination result from the defect determination unit. | 05-07-2015 |
20150139530 | APPARATUS AND METHOD FOR DETECTING DEFECT OF IMAGE HAVING PERIODIC PATTERN - Disclosed is a defect detection apparatus. The defect detection apparatus includes an angle extractor configured to extract a slope angle of a pattern from an original image in which a plurality of the patterns are formed at periodic intervals, a pattern period extractor configured to extract a pattern period at which the patterns are separated from each other, by using the slope angle, and an image shifter configured to shift the original image by the pattern period in a direction perpendicular to the slope angle to form the shifted image. The present invention shifts an image by using the slope angle and pattern period of the periodic pattern, thus easily extracting a defect of the original image. | 05-21-2015 |
20150139531 | DEFECT ANALYSIS ASSISTANCE DEVICE, PROGRAM EXECUTED BY DEFECT ANALYSIS ASSISTANCE DEVICE, AND DEFECT ANALYSIS SYSTEM - Conventionally, there was no method for automatically selecting the layers to be overlaid, so when the number of layers to be overlaid was large, there was a problem that much time was required for selecting the layers. It is an object of the present invention to provide a defect image analysis method capable of specifying patterns and layers in which a defect occurs by overlaying defect images to be analysis targets and design layout data, and a defect image analysis system capable of improving the efficiency to select the layers from the design layout data. The present invention is characterized in dividing analysis target images for each hierarchy corresponding to a manufacturing process and generating a plurality of layers; calculating a degree of matching between each of the layer division images and each design layer of the design layout data; and specifying a design layer with a highest degree of matching of the each design layer as a design layer corresponding to the layer division image. | 05-21-2015 |
20150146968 | SYSTEM AND METHOD FOR DEFECT ANALYSIS OF A SUBSTRATE - The present disclosure provides a method including providing a first image and a second image. The first image is of a substrate having a defect and the second image is of a reference substrate. A difference between the first image and the second image is determined. A simulation model is used to generate a simulation curve corresponding to the difference and the substrate dispositioned based on the simulation curve. In another embodiment, the scan of a substrate is used to generate a statistical process control chart. | 05-28-2015 |
20150302568 | Defect Observation Method and Defect Observation Device - Cases in which defects are analyzed in a manufacturing process stage in which a pattern is not formed or in a manufacturing process in which a pattern formed on a lower layer does not appear in the captured image are increasing. However, in these cases, there is a problem of not being able to synthesize a favorable reference image and failing to detect a defect when a periodic pattern cannot be recognized in the pattern. In the present invention, a defect occupation rate, which is the percentage of an image being inspected occupied by a defect region, is found, it is determined whether the defect occupation rate is higher or lower than a threshold, and, in accordance with the determination results, it is determined whether to create, as the reference image, an image comprising pixels having the average luminance value of the luminance values of a plurality of pixels contained in the image being inspected. In particular, when the defect occupation rate is low, an image comprising pixels having the average luminance value of the luminance values of a plurality of pixels contained in the image being inspected is used as the reference image. | 10-22-2015 |
20150317783 | Inspection Apparatus - An apparatus for inspecting flat objects, in particular wafers, containing an object holder, a camera arrangement having a camera for recording an image of at least one part of the object; and a drive arrangement for producing a relative movement between the camera arrangement and the object from a first recording position to at least one further recording position; is characterized in that the camera arrangement has at least one further camera; the object areas imaged in different cameras are at least partially different, wherein all cameras together simultaneously record only part of the total inspection area of the object; and each object point of the entire inspection area can be imaged at least once in one of the cameras as a result of the relative movement between the camera arrangement and the object, as produced with the drive arrangement. | 11-05-2015 |
20150332445 | DEFECT OBSERVATION METHOD AND DEFECT OBSERVATION DEVICE - The purpose of the present invention is to easily extract, from samples to be observed, defect candidates that can be labeled as a defect or “nuisance” (a part for which a manufacturing tolerance or the like is erroneously detected) and to allow parameters pertaining to observation processing to be easily adjusted. This defect observation method comprises: an imaging step to image, on the basis of defect information from an inspection device, an object to be inspected and obtain a defect image and a reference image corresponding to the defect image; a parameter determining step to determine a first parameter to be used in the defect extraction by using a first feature set distribution acquired from the reference image and the defect image captured in the imaging step and a second feature net distribution acquired from the reference image; and an observing step to observe using the first parameter determined in the parameter determining step. The present invention can be applied to a method of observing defects generated during the manufacturing of semiconductor wafers. | 11-19-2015 |
20150332451 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR FITTING BASED DEFECT DETECTION - A system configured to detect defects in an inspection image generated by collecting signals arriving from an article, the system comprising a tangible processor which includes: (i) a distribution acquisition module, configured to acquire a distribution of comparison values, each of the comparison values being indicative of a relationship between a value associated with a pixel of the inspection image and a corresponding reference value; (ii) a fitting module, configured to fit to the distribution an approximation function out of a predefined group of functions; and (iii) a defect detection module, configured to: (a) set a defect detection criterion based on a result of the fitting; and to (b) determine a presence of a defect in the inspection image, based on the defect detection criterion. | 11-19-2015 |
20150356719 | METHOD OF DESIGN-BASED DEFECT CLASSIFICATION AND SYSTEM THEREOF - There is provided an inspection method capable of classifying defects detected on a production layer of a specimen. The method comprises: obtaining input data related to the detected defects; processing the input data using a decision algorithm associated with the production layer and specifying two or more classification operations and a sequence thereof; and sorting the processed defects in accordance with predefined bins, wherein each bin is associated with at least one classification operation, wherein at least one classification operation sorts at least part of the processed defects to one or more classification bins to yield finally classified defects, and wherein each classification operation, excluding the last one, sorts at least part of the processed defects to be processed by one or more of the following classification operations. | 12-10-2015 |
20150356726 | INSPECTION APPARATUS, INSPECTION METHOD, EXPOSURE SYSTEM, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD - In order to inspect each processing condition among a plurality of processing conditions with high accuracy using a substrate having a pattern processed under the plurality of processing conditions, an inspection apparatus is provided with: a stage which is capable of holding a wafer having a pattern formed thereon under a plurality of exposure conditions; an illumination system which illuminates the surface of the wafer with polarized light; an imaging device and an image processing section which receive light emitted from the surface of the wafer, and detect a condition for prescribing the polarization state of the light; and a computing section which determines an apparatus condition for determining the exposure condition of the pattern on the basis of the condition for prescribing the polarization state of light emitted from a condition-parameterizing wafer having a pattern formed thereon under a known exposure condition. | 12-10-2015 |
20150356727 | DEFECT INSPECTION METHOD AND DEFECT INSPECTION DEVICE - In order to achieve highly precise alignment of inspection images when integrating a plurality of inspection images having different imaging conditions to improve inspection performance, and in order to achieve highly precise alignment of images acquired at different inspection angles and different polarization states, an inspection device is configured to comprise: an image acquiring unit that acquires image data, under a plurality of imaging conditions, for a sample; a feature extracting unit that extracts at least one feature point; a position correction calculating unit that calculates, on the basis of the feature point, the amount of position correction for the plurality of image data sets; a position correcting unit that corrects the position of the plurality of image data sets with the amount of position correction; and an integrating unit that detects defects by integrating a plurality of data sets for which position correction is done. | 12-10-2015 |
20160005157 | Pattern-Measuring Apparatus and Semiconductor-Measuring System - An object of the present invention is to provide a pattern-measuring apparatus and a semiconductor-measuring system which are able to obtain an evaluation result for suitably selecting processing with respect to a semiconductor device. In the present invention for attaining the object described above, there is proposed a pattern-measuring apparatus including an arithmetic device which compares a circuit pattern of an electronic device with a reference pattern, in which the arithmetic device classifies the circuit pattern in processing unit of the circuit pattern on the basis of a comparison of a measurement result between the circuit pattern and the reference pattern with at least two threshold values. | 01-07-2016 |
20160012579 | APPARATUS AND METHODS FOR PREDICTING WAFER-LEVEL DEFECT PRINTABILITY | 01-14-2016 |
20160019682 | DEFECT INSPECTION METHOD AND DEFECT INSPECTION DEVICE - In order to reduce the amount of time it takes to collect images of defects, this defect inspection device is provided with the following: a read-out unit that reads out positions of defects in a semiconductor wafer that have already been detected; a first imaging unit that takes, at a first magnification, a reference image of a chip other than the chip where one of the read-out defects is; a second imaging unit that takes, at the first magnification, a first defect image that contains the read-out defect; a defect-position identification unit that identifies the position of the defect in the first defect image taken by the second imaging unit by comparing said first defect image with the reference image taken by the first imaging unit; a third imaging unit that, on the basis of the identified defect position, takes a second defect image at a second magnification that is higher than the first magnification; a rearrangement unit that rearranges the read-out defects in an order corresponding to a path that goes through each of the read-out defects exactly once; and a stage-movement-path generation unit that selects the chip where the reference image corresponding to each defect is to be taken and generates a stage-movement path by determining stage-movement positions for the first and second imaging units. | 01-21-2016 |
20160019689 | MASK INSPECTION APPARATUS AND MASK INSPECTION METHOD - In a mask inspection apparatus, a defect detection unit includes a first memory region, a second memory region, an inspection condition reconfiguring unit, and a comparison unit. The inspection condition reconfiguring unit obtains a difference between gray scales of an optical image stored in the second memory region and a reference image stored in the first memory region. The existence of the defect is determined in the case where the difference is larger than a first threshold value. Further in the case where the number of defects is larger than a second threshold value, an inspection condition is re-estimated and configured and the reference image is regenerated. A comparison unit compares the stored reference image with the stored optical image in the case where the inspection condition is not reconfigured, and compares the regenerated reference image with the stored optical image in the case where the inspection condition is reconfigured. | 01-21-2016 |
20160027165 | Detecting Defects on a Wafer Using Defect-Specific and Multi-Channel Information - Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different. | 01-28-2016 |
20160035076 | REGISTRATION OF CAD DATA WITH SEM IMAGES - A method for image processing includes providing a microscopic image of a structure fabricated on a substrate and computer-aided design (CAD) data used in fabricating the structure. The microscopic image is processed by a computer so as to generate a first directionality map, which includes, for a matrix of points in the microscopic image, respective directionality vectors corresponding to magnitudes and directions of edges at the points irrespective of a sign of the magnitudes. The CAD data are processed by the computer so as to produce a simulated image based on the CAD data and to generate a second directionality map based on the simulated image. The first and second directionality maps are compared by the computer so as to register the microscopic image with the CAD data. | 02-04-2016 |
20160055631 | DEFECT DIAGNOSIS - A method for diagnosing a defect is provided. A first candidate pair comprises a first defect candidate and a second defect candidate. A first pattern is generated to distinguish one or more faults of the first defect candidate from one or more faults of the second defect candidate. The first defect candidate is removed responsive to determining that the first pattern does not detect the first defect candidate and determining that an automatic test equipment (ATE) failure log associates the first pattern with failure. Removing the first candidate pair, as well as additional candidate pairs when possible, promotes diagnosis efficiency by reducing a number of computations required. | 02-25-2016 |
20160071256 | Detecting Defects on a Wafer Using Defect-Specific Information - Methods and systems for detecting defects on a wafer using defect-specific information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest formed on the wafer and a known DOI occurring proximate to or in the pattern of interest. The information includes an image of the target on the wafer. The method also includes searching for target candidates on the wafer or another wafer. The target candidates include the pattern of interest. The target and target candidate locations are provided to defect detection. In addition, the method includes detecting the known DOI in the target candidates by identifying potential DOI locations in images of the target candidates and applying one or more detection parameters to images of the potential DOI locations. | 03-10-2016 |
20160071261 | PATTERN ANALYSIS METHOD OF A SEMICONDUCTOR DEVICE - A pattern analysis method of a semiconductor device includes extracting a contour image of material layer patterns formed on a wafer, calculating an individual density value (DV) representing an area difference between the contour image and a target layout image, scoring the material layer patterns on the wafer using the individual DV, identifying a failure pattern among the scored material layer patterns, calculating coordinates of the identified failure pattern and displaying the coordinates on a critical dimension-scanning electron microscopy (CD-SEM) image, inputting a reference DV in the computer and automatically sorting the material layer patterns into material layer patterns having a hotspot and material layer patterns not having a hotspot, and reviewing the sorted material layer patterns having the hotspot. | 03-10-2016 |
20160078608 | RETICLE INSPECTION APPARATUS AND METHOD - A reticle inspection apparatus includes a reticle, an image generator to generate images of a surface of the reticle, and an image processor to compare first and second images generated by the image generator. The first image is generated when a pellicle is not on the reticle and the second image is generated when the pellicle is on the reticle. | 03-17-2016 |
20160078626 | ALIGNMENT APPARATUS AND SUBSTRATE PROCESSING APPARATUS - An alignment apparatus for aligning a wafer includes a mounting unit, an imaging unit, an elevation unit, and a controlling unit. The control unit outputs a control signal for controlling the elevation unit such that a luminance variation between the outer side and the inner side of the wafer obtained by the imaging unit becomes the same as a luminance variation obtained when the imaging unit is focused, for estimating a warpage state of the wafer based on an amount of relative movement of the imaging unit and the mounting unit with respect to a relative height position of the imaging unit and the mounting unit obtained when the imaging unit is focused on a reference wafer having no warpage, and for detecting the alignment mark of the wafer by the imaging unit by rotating the mounting unit in a state where the imaging unit is focused. | 03-17-2016 |
20160093040 | Integrated Multi-Pass Inspection - Methods and systems for integrated multi-pass reticle inspection are provided. One method for inspecting a reticle includes acquiring at least first, second, and third images for the reticle. The first image is a substantially high resolution image of light transmitted by the reticle. The second image is a substantially high resolution image of light reflected from the reticle. The third image is an image of light transmitted by the reticle that is acquired with a substantially low numerical aperture. The method also includes detecting defects on the reticle using at least the first, second, and third images for the reticle in combination. | 03-31-2016 |
20160110857 | Dynamic Binning for Diversification and Defect Discovery - Methods and systems for generating a defect sample for a wafer are provided. One method includes separating defects detected on a wafer into bins having diversity in values of a first set of one or more first attributes of the defects. The method also includes selecting, independently from one or more of the bins, defects within the bins based on diversity in a second set of one or more second attributes of the defects. The selected defects are then used to create a defect sample for the wafer. In this manner, defects having diverse values of multiple attributes can be easily selected. | 04-21-2016 |
20160110858 | CRITICAL DIMENSION UNIFORMITY ENHANCEMENT TECHNIQUES AND APPARATUS - Disclosed are methods and apparatus for inspecting a photolithographic reticle. Modeled images of a plurality of target features of the reticle are obtained based on a design database for fabricating the reticle. An inspection tool is used to obtain a plurality of actual images of the target features of the reticle. The modelled and actual images are binned into a plurality of bins based on image properties of the modelled and actual images, and at least some of the image properties are affected by one or more neighbor features of the target features on the reticle in a same manner. The modelled and actual images from at least one of the bins are analyzed to generate a feature characteristic uniformity map for the reticle. | 04-21-2016 |
20160110859 | INSPECTION METHOD FOR CONTACT BY DIE TO DATABASE - An inspection method for contact by die to database is provided. In the method, a plurality of raw images of contacts in a wafer is obtained, and a plurality of locations of the raw images is then recoded to obtain a graphic file. After that, the graphic file is aligned on a design database of the chip. An image extraction is then performed on the raw images to obtain a plurality of image contours of the contacts. Thereafter, a difference in critical dimension between the image contours of the contacts and corresponding contacts in the design database are measured in order to obtain the inspection result for contacts in the wafer. | 04-21-2016 |
20160117812 | Image Based Signal Response Metrology - Methods and systems for measuring overlay error between structures formed on a substrate by successive lithographic processes are presented herein. Two overlay targets, each having programmed offsets in opposite directions are employed to perform an overlay measurement. Overlay error is measured based on zero order scatterometry signals and scatterometry data is collected from each target at two different azimuth angles. In addition, methods and systems for creating an image-based measurement model based on measured, image-based training data are presented. The trained, image-based measurement model is then used to calculate values of one or more parameters of interest directly from measured image data collected from other wafers. The methods and systems for image based measurement described herein are applicable to both metrology and inspection applications. | 04-28-2016 |
20160150191 | Virtual Inspection Systems for Process Window Characterization - Methods and systems for detecting defects on a specimen are provided. One system includes a storage medium configured for storing images for a physical version of a specimen generated by an inspection system. At least two dies are formed on the specimen with different values of one or more parameters of a fabrication process performed on the specimen. The system also includes computer subsystem(s) configured for comparing portions of the stored images generated at locations on the specimen at which patterns having the same as-designed characteristics are formed with at least two of the different values. The portions of the stored images that are compared are not constrained by locations of the dies on the specimen, locations of the patterns within the dies, or locations of the patterns on the specimen. The computer subsystem(s) are also configured for detecting defects at the locations based on results of the comparing. | 05-26-2016 |
20160163035 | Automatic Defect Classification Without Sampling and Feature Selection - Systems and methods for defection classification in a semiconductor process are provided. The system includes a communication line configured to receive a defect image of a wafer from the semiconductor process and a deep-architecture neural network in electronic communication with the communication line. The neural network has a first convolution layer of neurons configured to convolve pixels from the defect image with a filter to generate a first feature map. The neural network also includes a first subsampling layer configured to reduce the size and variation of the first feature map. A classifier is provided for determining a defect classification based on the feature map. The system may include more than one convolution layers and/or subsampling layers. A method includes extracting one or more features from a defect image using a deep-architecture neural network, for example a convolutional neural network. | 06-09-2016 |
20160163038 | ITERATIVE DEFECT FILTERING PROCESS - A method for classifying defects of a wafer, the method is executed by a computerized system, the method may include obtaining defect candidate information about a group of defect candidates, wherein the defect candidate information comprises values of attributes per each defect candidate of the group; selecting, by a processor of the computerized system, a selected sub-group of defect candidates in response to values of attributes of defect candidates that belong to at least the selected sub-group; classifying defect candidates of the selected sub-group to provide selected sub-group classification results; repeating, until fulfilling a stop condition: selecting an additional selected sub-group of defect candidates in response to (a) values of attributes of defect candidates that belong to at least the additional selected sub-group; and (b) classification results obtained from classifying at least one other selected sub-group; and classifying defect candidates of the additional selected sub-group to provide additional selected sub-group classification results. | 06-09-2016 |
20160171674 | INSPECTION METHOD AND INSPECTION APPARATUS | 06-16-2016 |
20160180513 | Method of Automatic Defect Classification | 06-23-2016 |
20160189369 | METHOD AND SYSTEM FOR DETECTING DEFECTS - A defect detecting method includes generating an actual image of a pattern on a sample based on irradiation of an electron beam onto the sample, performing a contrast conversion of the actual image to generate a conversion image representing a normal pattern, matching the conversion image and a design image for the pattern, and detecting a defective pattern in the actual image based on matching of the conversion image and the design image. The contrast conversion may be performed for gray levels of pixels in the actual image. | 06-30-2016 |
20170237396 | Technique for detecting a defect in a multi-junction solar cell | 08-17-2017 |
20190147577 | DEVICE FOR DETECTING DEFECT AND METHOD OF DRIVING THE SAME | 05-16-2019 |
20190147579 | INSPECTION METHOD AND SYSTEM | 05-16-2019 |
20220138930 | METHOD FOR DETERMINING AN ABNORMALITY AND SUBSTRATE PROCESSING SYSTEM - A method for a substrate processing system includes: imaging a substrate before start and after completion of a series of proces sings on the substrate; specifying a first processing apparatus estimated as having a potential abnormality among a plurality of processing apparatuses; performing a first process on a first inspection substrate under a selected processing condition using the first processing apparatus specified in the specifying, and imaging the first inspection substrate before and after the performing the first process to acquire a first imaging result; performing a second process on a second inspection substrate using a second processing apparatus, and imaging the second inspection substrate for comparison before and after the performing the second process to acquire a second imaging result; and determining whether an actual abnormality exists in the first processing apparatus, based on the first imaging result and the second imaging result. | 05-05-2022 |