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Capacitive

Subclass of:

381 - Electrical audio signal processing systems and devices

381150000 - ELECTRO-ACOUSTIC AUDIO TRANSDUCER

381369000 - Microphone capsule only

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DocumentTitleDate
20130028450LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY - A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon, respectively, wherein a through cavity extends through the first board and the first and second metal layers; a second board with opposite third and fourth surfaces; an adhesive layer sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess; and a first conductor layer coating the bottom and the side surfaces of the recess.01-31-2013
20090129612ELECTRETIZATION METHOD OF CONDENSER MICROPHONE, ELECTRETIZATION APPARATUS, AND MANUFACTURING METHOD OF CONDENSER MICROPHONE USING IT - A new electretization technology for a silicon microphone capable of reasonably electretizing a dielectric film of a condenser microphone formed by micromachining a silicon substrate and also capable of taking measures against variations in the microphone sensitivity caused by manufacturing variations and characteristic variations in parts is provided.05-21-2009
20090190782Vibration transducer - A vibration transducer includes a substrate, a diaphragm formed using deposited films having conductive property, which has a plurality of arms extended from the center portion in a radial direction, a plate formed using deposited films having conductive property, and a plurality of diaphragm supports formed using deposited films, which join the arms so as to support the diaphragm above the substrate with a prescribed gap therebetween. A plurality of bumps is formed in the arms of the diaphragm so as to prevent the diaphragm from being attached to the substrate or the plate. When the diaphragm vibrates relative to the plate, an electrostatic capacitance therebetween is varied so as to detect variations of pressure applied thereto. In addition, a plurality of diaphragm holes is appropriately aligned in the arms of the diaphragm so as to improve the sensitivity while avoiding the occurrence of adherence.07-30-2009
20100158280INTEGRATED ACOUSTIC TRANSDUCER IN MEMS TECHNOLOGY, AND MANUFACTURING PROCESS THEREOF - A MEMS acoustic transducer, for example, a microphone, includes a substrate provided with a cavity, a supporting structure, fixed to the substrate, a membrane having a perimetral edge and a centroid, suspended above the cavity and fixed to the substrate the membrane configured to oscillate via the supporting structure. The supporting structure includes a plurality of anchorage elements fixed to the membrane, and each anchorage element is coupled to a respective portion of the membrane between the centroid and the perimetral edge of the membrane.06-24-2010
20100124343CONDENSER MICROPHONE - A condenser microphone is disclosed. The condenser microphone includes a substrate having a cavity, a supporting member connected to the substrate, and a diaphragm isolated to the supporting member. The supporting member has a periphery portion and a plurality of stationary electrodes extending from the periphery portion to a center of the supporting member. The diaphragm has a vibrating member and a sustaining member connected to the vibrating member and the vibrating member defines a plurality of movable electrodes protruding from a periphery of the vibrating member. Each of the movable electrodes is located between two adjacent stationary electrodes and each of the stationary electrodes is located between two adjacent two movable electrodes.05-20-2010
20100002895CONDENSER MICROPHONE AND MEMS DEVICE - An air gap is formed between a first film having a first electrode film and a second film having a second electrode film. The first film has a stopper protruding toward the second film, and a recess communicating with the air gap is provided in the center of the stopper.01-07-2010
20130058509MEMS MICROPHONE WITH A BUILT-IN TEXTILE MATERIAL PROTECTING SCREEN - A MEMS microphone with a built-in textile material protecting screen comprises a microphone body having an opening thereat is arranged a textile material protecting screen which is built-in in the microphone body, during the production phase of the MEMS device called “packaging”.03-07-2013
20110058695CAPACITOR MICROPHONE - A capacitor microphone includes: a capacitor microphone unit; a microphone casing that incorporates the microphone unit and is provided with an opening communicating with a rear acoustic terminal of the microphone unit; and a shield plate that covers the opening in the microphone casing from inside of the microphone casing. The shield plate has a projection extending towards axial direction of the microphone casing at least on microphone unit side in the axial direction of the microphone casing. The projection is folded to be pressed firmly against the outer surface of a casing of the capacitor microphone unit. The shield plate is rolled into a cylindrical shape and is in contact with the inner surface of the microphone casing with pressure.03-10-2011
20110013788Electret Condenser Microphone - An electret condenser microphone includes a conductive capsule including an opening formed in a top member, a capacitor section including a diaphragm, a back electrode plate arranged to face either surface of the diaphragm, and a electret layer provided on the diaphragm or the back electrode plate, which are housed in the capsule, and a cap member provided between the capacitor section and the top member of the capsule and including an acoustic hole formed in a portion exposed to the outside through the opening, wherein the cap member further includes a suctioned portion formed in a central portion thereof to be drawn by a suction-type transporting device, the acoustic holes being arranged along the circumference of the suctioned portion.01-20-2011
20110013787MEMS MICROPHONE PACKAGE AND MEHTOD FOR MAKING SAME - An exemplary micro-electro-mechanical systems (MEMS) microphone package includes a first substrate, a second substrate opposite to the first substrate, and a microphone chip disposed on the second substrate. First through holes are defined in the first substrate. Conductive material is disposed in each first through hole. A through hole is defined in the second substrate. Contact pads are disposed on the second substrate. Each contact pad connects the corresponding electrically conductive material in each first through hole. The microphone chip is surrounded by the contact pads. When sound waves transmit through the through hole in the second substrate to the microphone chip, the microphone chip converts sound into an electrical signal.01-20-2011
20090268930ELECTRET CONDENSER MICROPHONE - The present invention provides an electret condenser microphone including a diaphragm, a frame adapted to affix the diaphragm to, and a backplate positionable inside the frame and opposite the diaphragm with a space reserved therebetween.10-29-2009
20120224726MEMS-MICROPHONE - A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.09-06-2012
20130064400SILICON MICROPHONE WITH INTEGRATED BACK SIDE CAVITY - An integrated circuit containing a capacitive microphone with a back side cavity located within the substrate of the integrated circuit. Access holes may be formed through a dielectric support layer at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity. The back side cavity may be etched after a fixed plate and permeable membrane of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate.03-14-2013
20090232334Micromechanical Component and Method for its Production - A cost-effective technology for implementing a micromechanical component is provided, whose layer construction includes at least one diaphragm on the upper side and at least one counter-element, a hollow space being formed between the diaphragm and the counter-element, and the counter-element having at least one through hole to a back volume. This back volume is formed by a sealed additional hollow space underneath the counter-element and is connected to the upper-side of the layer construction by at least one pressure equalization opening. This component structure permits the integration of the micromechanical sensor functions and evaluation electronics on one chip and is additionally suitable for mass production.09-17-2009
20090232335CONDENSER MICROPHONE - A condenser microphone comprising: a mic capsule in which a capacitor is composed of a diaphragm and a counter electrode, and which effects electroacoustic conversion; a FET for impedance-converting audio signals output from the mic capsule; and a CR circuit composed of a resistor and a capacitor, and connected to the FET to adjust a signal level in a low frequency range, and in the condenser microphone, an output terminal may be drawn out from a drain of the FET; and the CR circuit may be connected in between a source of the FET and the ground, furthermore, in the condenser microphone, there may be provided a changeover switch for switching a mode in which the CR circuit is connected in between the source of the FET and the ground into another mode in which the CR circuit is short-circuited to connect the source of the FET to the ground.09-17-2009
20110280418ELECTRET CONDENSER MICROPHONE - An electret condenser microphone includes a microphone capsule having a diaphragm, a fixed electrode and an extraction electrode. The extraction electrode includes a closed-bottomed cylinder composed of a conductive material. The fixed electrode has holes extending from an air chamber between the diaphragm and the fixed electrode to an air chamber within the extraction electrode, and is fixed to a shoulder of the extraction electrode to form the air chamber that serves as acoustic capacitor within the extraction electrode.11-17-2011
20120099744Condenser microphone - There is provided a condenser microphone including a microphone capsule having a diaphragm and a capsule mounting, and a sound guide unit for guiding sound. The sound guide unit is provided at at least one side of the capsule mounting.04-26-2012
20090279719CAPACITIVE TRANSDUCER CIRCUIT AND METHOD - A capacitive transducer circuit includes a capacitive transducer having first and second electrodes. The first and second electrodes are biased by respective first and second bias voltages. An amplifier is connected to receive a first analog signal on an input terminal, the first analog signal being generated by the capacitive transducer, and to generate a second analog signal on an output terminal. A digital feedback circuit is connected between the output terminal of the amplifier and the input terminal of the amplifier. The digital feedback circuit is configured to provide one of said first or second bias voltages. A switched capacitor filter circuit may be arranged between the voltage source and the transducer and may be arranged to filter the output of the voltage source.11-12-2009
20110261979DIAPHRAGM AND CONDENSER MICROPHONE USING SAME - A diaphragm is disclosed. The diaphragm includes a vibrating member, a projection extruding from a periphery of the vibrating member, a supporting member surrounding the vibrating member. A first gap is formed between the vibrating member and the supporting member. The supporting member includes a supporting girder surrounding and separated from the projection. A torsion girder is connected to the projection and a fixing girder is parallel to the torsion girder. A second gap is defined between the fixing girder and the torsion girder.10-27-2011
20100080405SILICON CONDENSER MICROPHONE PACKAGE - A silicon condenser microphone package includes a printed circuit board, a cover mounted on the printed circuit board, and a transducer unit and a controlling circuit both attached to the printed circuit board. An inner board is located in the cover. The sensitivity and frequency response of the silicon condenser microphone package is desirable.04-01-2010
20110200212TEMPERATURE COMPENSATED VOLTAGE PUMP - The present invention relates to an integrated circuit voltage pump with temperature compensation circuitry providing improved DC output voltage accuracy over an operational temperature range. The compensation circuitry is operative to eliminate or reduce temperature induced changes of voltage drops across semiconductor diodes of the integrated circuit voltage pump.08-18-2011
20090086999Acoustic Transducer and Microphone Using the Same - An acoustic transducer comprises a substrate, a membrane configured to move relative to the substrate, a number of supports configured to suspend the membrane over the substrate, a first group of projections extending from the membrane, and a second group of projections extending from the substrate, the second group of projections being interweaved with and movable relative to the first group of projections, wherein each projection of one group of the first group of projections and the second group of projections is composed of a first conductive layer, a second conductive layer and a dielectric layer between the first conductive layer and the second conductive layer, and each projection of the other one group of the first group of projections and the second group of projections is composed of a third conductive layer.04-02-2009
20120269367Condenser Microphone Unit and Condenser Microphone - A condenser microphone includes multiple condenser microphone units. Each unit includes an impedance converter. The condenser microphone units are connected in series such that outputs of the impedance converter in one of the condenser microphone units drive another of the condenser microphone units. A polarization voltage is accumulated to a DC voltage supplied from a DC voltage supply through a voltage adjuster to be applied to one of a diaphragm and a fixed electrode, and a voltage applied to the one of the diaphragm and the fixed electrode is adjusted by the voltage adjuster.10-25-2012
20090161894CARD TYPE MEMS MICROPHONE - It is an object of the invention to provide an MEMS microphone having a directionality.06-25-2009
20090202089Microphone with Reduced Parasitic Capacitance - A MEMS microphone has an SOI wafer, a backplate formed in a portion of the SOI wafer, and a diaphragm adjacent to and movable relative to the backplate. The backplate has at least one trench that substantially circumscribes a central portion of the backplate.08-13-2009
20090285419MICROELECTROMECHANICAL SYSTEM MICROPHONE - A microelectromechanical system microphone is provided. The microelectromechanical system microphone includes a first electrode, a second electrode and a first dielectric layer. The first electrode is disposed on a substrate and has a first flexible portion. The second electrode is disposed between the first electrode. A material of the second electrode includes polysilicon or polycide. The first dielectric layer is at least partially disposed between the first and second electrodes so as to suspend the first flexible portion.11-19-2009
20100061572Capacitve Sound Transducer Having a Perforated Attenuation Disk - A capacitive sound transducer provided with a perforated attenuation disk. The invention further relates to a capacitive sound transducer and a condenser microphone having such a sound transducer. The sound transducer comprises a diaphragm and a counterelectrode which is disposed at a short distance from the diaphragm and provided with first perforations. In order to attenuate natural oscillations of the diaphragm at high frequencies, a capacitive sound transducer is proposed in which a sound-permeable attenuation disk provided with second perforations is disposed at a short distance from the diaphragm and opposite the counterelectrode. In this arrangement, the first perforations and the second perforations are also offset in relation to each other.03-11-2010
20090003631Condenser Microphone - A condenser microphone comprises a casing body formed from a combination of a first plate member defining a top surface, a second plate member defining a bottom surface and an intermediate member provided between the first plate member and the second plate member, the top surface having an acoustic hole formed therein, a capacitor section including a diaphragm electrode, a fixed electrode, and an electret membrane provided in the diaphragm electrode or the fixed electrode, a converting circuit section for converting variations of capacitance of the capacitor section into electric signals for output, a conductive section for making the capacitor section electrically conductive with the converting circuit section, and conductive surface terminal elements extending from the top surface through side surfaces to the bottom surface among outer surfaces of the casing body to be conductive with the converting circuit section. The capacitor section, the converting circuit section and the conductive section are mounted inside the casing body.01-01-2009
20080205673Electro Acoustic Transducer - Condenser microphone capsule (08-28-2008
20110206221Condenser microphone having a flexible neck - In an integral type condenser microphone having a flexible pipe, noise is prevented from being generated even if a cellular phone that radiates strong electromagnetic waves is used at close range. In the gooseneck condenser microphone configured so that a microphone body M in which a microphone unit 08-25-2011
20080304681Microphone with Aligned Apertures - A MEMS microphone has a backplate with a given backplate aperture, and a diaphragm having a diaphragm aperture. The given backplate aperture is substantially aligned with the diaphragm aperture.12-11-2008
20090180647Microphone with Backside Cavity that Impedes Bubble Formation - A MEMS microphone has a backplate, a diaphragm movable relative to the backplate, and a backside cavity adjacent to the backplate or the diaphragm. The backside cavity has sidewalls with at least one rib protruding inward toward a center of the backside cavity.07-16-2009
20090136064Vibration transducer and manufacturing method therefor - A vibration transducer is constituted of a substrate, a diaphragm having a conductive property, a plate having a conductive property, and a plurality of first spacers having pillar shapes which are formed using a deposited film having an insulating property joining the plate so as to support the plate relative to the diaphragm with a gap therebetween. It is possible to introduce a plurality of second spacers having pillar shapes support the plate relative to the substrate with a gap therebetween, and/or a plurality of third spacers having pillar shapes which support the diaphragm relative to the substrate with a gap therebetween. When the diaphragm vibrates relative to the plate, an electrostatic capacitance formed therebetween is varied so as to detect vibration with a high sensitivity. The diaphragm has a plurality of arms whose outlines are curved so that the intermediate regions thereof are reduced in width.05-28-2009
20090185700Vibration transducer and manufacturing method therefor - A vibration transducer (or a pressure transducer) is constituted of a cover, a plate, a diaphragm, and a substrate having a back cavity. The diaphragm is positioned above the substrate so as to cover the opening of the back cavity. The plate has a radial gear-like shape constituted of a center portion positioned just above the diaphragm and a plurality of joints. The cover horizontally surrounds the plate with slits therebetween so that the cover is electrically separated from the plate and is positioned above the periphery of the diaphragm. A plurality of pillar structures joins the plurality of joints of the plate so as to support the plate above the diaphragm with a gap layer therebetween. By reducing the widths of slits, it is possible to prevent foreign matter from entering into the air layer between the plate and the diaphragm.07-23-2009
20090041270Mems Microphone And Method For Producing Said Microphone - An MEMS microphone is bonded onto the surface of an IC component containing at least one integrated circuit suitable for the conditioning and processing of the electrical signal supplied by the MEMS microphone. The entire component is simple to produce and has a compact and space-saving construction. Production is accomplished in a simple and reliable manner.02-12-2009
20090245543AMPLIFYING ELEMENT AND MANUFACTURING METHOD THEREOF - An amplifier integrated circuit element or J-FET is used for impedance conversion and amplification of ECM. The amplifier integrated circuit element has advantages of allowing an appropriate gain to be set by adjusting a circuit constant, and of producing a higher gain than the J-FET; but also has a problem of having a complicated circuit configuration and requiring high costs. Using only the J-FET has also problems of outputting a voltage insufficiently amplified and producing a low gain. Against this background, provided is a discrete element in which: a J-FET and a bipolar transistor are integrated on one chip; a source region of the J-FET is connected to a base region of the bipolar transistor; and a drain region of the J-FET is connected to a collector region of the bipolar transistor. Accordingly, an ECM amplifying element with high input impedance and low output impedance can be achieved.10-01-2009
20090116669MEMS MICROPHONE PACKAGE HAVING SOUND HOLE IN PCB - Provided is a MEMS microphone package having a sound hole in a PCB, which can ground-connect a metal case to a main board using an assembly process including bending and clamping an end of the case. The MEMS microphone package includes a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a printed circuit board (PCB) substrate to which a MEMS microphone chip and an application specific integrated circuit (ASIC) chip are mounted, the PCB substrate being inserted into the metal case and having a sound hole for introducing an external sound, and a support configured to support the PCB substrate in the curling operation and define a space between the metal case and the PCB substrate.05-07-2009
20100183174Microphone package - In one exemplary embodiment, an apparatus includes: a first substrate having an aperture adapted to receive an acoustic signal; a microphone comprising a plate connected to the first substrate and a movable member connected to the first substrate, where the microphone is adapted to transduce the received acoustic signal into an electrical signal; a second substrate connected to the first substrate; at least one wall connected to the first substrate and the second substrate such that the at least one wall, the first substrate, the second substrate and the microphone define an interior cavity; and an electrical component on the second substrate and electrically coupled to the microphone, where the electrical component is configured to generate an output based on the electrical signal.07-22-2010
20100290648Condenser Microphone - A condenser microphone is disclosed. The condenser microphone includes a substrate having a cavity, a backplate connected to the substrate, a diaphragm facing to the backplate, and an anchor supporting the diaphragm. A first gap is formed between the diaphragm and the backplate. A groove is arranged on the anchor and the diaphragm partially covers the groove. The diaphragm and the groove forms a second gap communicating with the first gap.11-18-2010
20110103622Support Apparatus for Microphone Diaphragm - A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is spaced from the at least one carrier. An insulator (or separate insulators) between the substrate and the at least one carrier electrically isolates the diaphragm and the substrate.05-05-2011
20130216068SILICON BASED CAPACITIVE MICROPHONE - A silicon based capacitive microphone includes a printed circuit board, a shell mounted on the printed circuit board and forming a receiving space together with the printed board, a chamber support located on top of the printed circuit board and received in the receiving space, a transducer unit and a controlling chip respectively mounted on the chamber support, wherein the chamber support forms a first chamber together with the printed board, the chamber support includes an opening, the transducer unit is provided with a second chamber and covers the opening, the second chamber communicates with the first chamber via the opening.08-22-2013
20090141913MICROELECTROMECHANICAL SYSTEM - A microelectromechanical system comprises a carrier substrate. A semiconductor chip is fitted in the carrier substrate or on the carrier substrate. In addition, a microelectromechanical component is fitted to the carrier substrate. The microelectromechanical component is arranged at least partly above the semiconductor chip.06-04-2009
20100119087MEMS MICROPHONE DEVICE - The invention provides a MEMS microphone device capable of improving the S/N ratio of output signals in the MEMS microphone and obtaining flat frequency characteristics up to a high range, for which reflow mounting is enabled. The MEMS microphone of the present invention includes a MEMS chip for converting an acoustic signal to an electric signal, a shield for covering the MEMS chip, and a deemphasis circuit for applying a deemphasis process to a signal output from the MEMS chip, wherein the shield is configured so as to apply a preemphasis process to the signal input to the MEMS chip.05-13-2010
20090074211CAPACITOR MICROPHONE AND METHOD FOR MANUFACTURING CAPACITOR MICROPHONE - A capacitor microphone includes a plate that has a fixed electrode, a diaphragm that has a variable electrode, the plate that vibrates by sound waves, and a spacer that insulates and supports the plate and the diaphragm forming airspace between the fixed electrode and the variable electrode, wherein at least either of the plate or the diaphragm is a semiconductor single-layered film or a metal single-layered film whose specific resistance in a nearby edge close to the spacer is higher than that in a central unit away from the spacer.03-19-2009
20110026742METHOD OF FABRICATING INTEGRATED SEMICONDUCTOR DEVICE AND STRUCTURE THEREOF - A method of fabricating an integrated semiconductor device, comprising: providing a substrate having a first region and a second region; and forming a semiconductor unit on the first region and forming a micro electro mechanical system (MEMS) unit on the second region in one process.02-03-2011
20130129118MICRO-ELECTRO-MECHANICAL MICROPHONE AND METHOD FOR MANUFACTURING THE SAME - A micro-electro-mechanical microphone and manufacturing method thereof are provided in the invention. The micro-electro-mechanical microphone comprises: a diaphragm, which is formed on a surface of one side of a semiconductor substrate, exposed to the outside surroundings, and can vibrate freely by sensing the pressure generated by sound waves; an electrode plate with air holes, which is under the diaphragm; an isolation structure for fixing the diaphragm and the electrode plate; an air gap cavity between the diaphragm and the electrode plate, and a back cavity under the electrode plate and in the semiconductor substrate; a second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner; the air gap cavity is connected with the back cavity through the air holes of the electrode plate; the back cavity is connected with the second cavity through an air groove formed in the semiconductor substrate. The micro-electro-mechanical microphone in the invention is formed on the surface of one side of the semiconductor substrate, and the manufacturing method thereof is compatible with CMOS technics, therefore the device is easy to be miniaturized and integrated into a semiconductor chip.05-23-2013
20110235829DIAPHRAGM AND SILICON CONDENSER MICROPHONE USING SAME - Disclosed is a diaphragm includes a vibrating member, a plurality of supporting members extending from a periphery of the vibrating member along a direction away from a center of the diaphragm, and a plurality of separating portions each located between two adjacent supporting members. Each of the supporting members defines a first beam, a second beam, and at least one slit between the first and second beams.09-29-2011
20110044480ELECTRET CONDENSER - An electret condenser includes a fixed film 02-24-2011
20110044479CONDENSER MICROPHONE - The present invention provides a condenser microphone. In one embodiment, the condenser microphone comprises: a frame of the microphone formed of a circuit board substrate and a casing, and an amplifier device, an elastic holding component and capacitance components provided inside the microphone. One or more sound holes are provided on the circuit board substrate or the casing. The capacitance components are provided on the side with the sound holes. The amplifier device is provided on the side opposite to the side with the sound holes. The elastic holding component is provided on the side with the amplifier device or on the side with the capacitance components. The amplifier device and the capacitance components are both electrically connected to the circuit board substrate; and one or more auxiliary supporting parts are provided on the elastic holding component with the vertical height thereof being greater than that of the amplifier device and less than the distance between the capacitance components and the opposite inner wall of the microphone. When the microphone according to the present invention is sharply accelerated or under an impact, a collision between the amplifier device and the backplate caused by excessive deformation of the elastic holding component and a reduction in the resilience of the elastic holding component can be prevented with the help of the auxiliary supporting parts.02-24-2011
20110075865Dual Single-Crystal Backplate Microphone System and Method Of Fabricating Same - A dual backplate MEMS microphone system includes a flexible diaphragm sandwiched between two single-crystal silicon backplates. Such a MEMS microphone system may be formed by fabricating each backplate in a separate wafer, and then transferring one backplate from its wafer to the other wafer, to form two separate capacitors with the diaphragm.03-31-2011
20090214061Miniature Microphone Assembly With Solder Sealing Ring - The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.08-27-2009
20090208037Silicon microphone without dedicated backplate - Various embodiments of a silicon microphone sensing element without dedicated backplate are disclosed. The microphone sensing element has a circular or polygonal diaphragm with a plurality of perforated springs suspended above the front side of a conductive substrate. The diaphragm is aligned above one or more back holes in the substrate having a front opening smaller than the diaphragm. In one embodiment, a continuous perforated spring surrounds the diaphragm and has a shape that conforms to the diaphragm. A plurality of perforated beams connects the spring to rigid pads that anchor the movable diaphragm and spring. In another embodiment, there is a plurality of perforated springs having double or triple folding configurations and a plurality of perforated beams connecting the diaphragm to rigid pads. Also disclosed is a scheme to integrate the silicon microphone sensing element with CMOS devices on a single chip.08-20-2009
20110075866Microphone with Backplate Having Specially Shaped Through-Holes - A MEMS microphone has 1) a backplate with a backplate interior surface and a plurality of through-holes, and 2) a diaphragm spaced from the backplate. The diaphragm is movably coupled with the backplate to form a variable capacitor. At least two of the through-holes have an inner dimensional shape (on the backplate interior surface) with a plurality of convex portions and a plurality of concave portions.03-31-2011
20110158439Silicon Microphone Transducer - A capacitive microphone transducer integrated into an integrated circuit includes a fixed plate and a membrane formed in or above an interconnect region of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches through the fixed plate to a region defined for the back cavity, filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit.06-30-2011
20110150246CAPACITOR MICROPHONE - A capacitor microphone includes: a capacitor microphone unit including a diaphragm that vibrates upon receiving sound waves and a fixed electrode arranged opposite to the diaphragm with a space therebetween; and a polarization voltage generating circuit that generates polarization voltage to be applied across the diaphragm and the fixed electrode. The polarization voltage generating circuit includes an oscillating circuit that alternately turns on and off DC power, coils to boost the voltage of the power alternately turned on and off, and a DC boosting circuit including a rectifying circuit that rectifies the boosted voltage. The coils are formed of two inductors that are electromagnetically coupled and are provided with an electromagnetic coupling adjusting unit with which the level of electromagnetic coupling between the two inductors is adjusted to adjust the polarization voltage.06-23-2011
20090022341Extreme Low Frequency Acoustic Measurement System - The present invention is an extremely low frequency (ELF) microphone and acoustic measurement system capable of infrasound detection in a portable and easily deployable form factor. In one embodiment of the invention, an extremely low frequency electret microphone comprises a membrane, a backplate, and a backchamber. The backchamber is sealed to allow substantially no air exchange between the backchamber and outside the microphone. Compliance of the membrane may be less than ambient air compliance. The backplate may define a plurality of holes and a slot may be defined between an outer diameter of the backplate and an inner wall of the microphone. The locations and sizes of the holes, the size of the slot, and the volume of the backchamber may be selected such that membrane motion is substantially critically damped.01-22-2009
20090262958COMB SENSE MICROPHONE - A miniature microphone, comprising a diaphragm, supported for displacement in response to acoustic waves, from which a plurality of projections extend; a plurality of projections extending from a surface; a body, supporting the surface to maintain the plurality of projections from the diaphragm and the plurality of projections from the surface in close proximity; and an electromagnetic sensor adapted to sense an electromagnetic interaction between the plurality of projections from the diaphragm and the plurality of projections from the surface and produce an electrical signal in response thereto. The interaction may be detected substantially without inducing a force which tends to substantially displace the diaphragm, since the electrostatic force is substantially parallel to the diaphragm surface.10-22-2009
20110255716DIAPHRAGM AND CONDENSER MICROPHONE USING SAME - A diaphragm is disclosed. A diaphragm includes a vibrating member capable of vibrating relative to the backplate and suspended by the supporting member extending from the vibrating member. The supporting member extends from a periphery of the vibrating member along a direction away from the centre of the diaphragm. The supporting member defines a first surface, a second surface facing to the first surface, a side wall connecting the first surface and the second surface. And the side wall defines a first side wall and a second side wall facing to the first side wall. The supporting member defines a first groove, a second groove. Along a direction parallel to the vibrating member, the first groove extends from the second side wall to the first side wall, with a first placket in the first side wall, and the second groove extends from the first side wall to the second side wall, with a second placket in the second side wall.10-20-2011
20100284553ASSEMBLY OF A CAPACITIVE ACOUSTIC TRANSDUCER OF THE MICROELECTROMECHANICAL TYPE AND PACKAGE THEREOF - A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.11-11-2010
20100329487PREAMPLIFIER CIRCUIT FOR A MICROELECTROMECHANICAL CAPACITIVE ACOUSTIC TRANSDUCER - Described herein is a preamplifier circuit for a capacitive acoustic transducer provided with a MEMS detection structure that generates a capacitive variation as a function of an acoustic signal to be detected, starting from a capacitance at rest; the preamplifier circuit is provided with an amplification stage that generates a differential output signal correlated to the capacitive variation. In particular, the amplification stage is an input stage of the preamplifier circuit and has a fully differential amplifier having a first differential input (INP) directly connected to the MEMS detection structure and a second differential input (INN) connected to a reference capacitive element, which has a value of capacitance equal to the capacitance at rest of the MEMS detection structure and fixed with respect to the acoustic signal to be detected; the fully differential amplifier amplifies the capacitive variation and generates the differential output signal.12-30-2010
20110135122Microphone - A microphone has a housing (06-09-2011
20100166235SILICON CONDENSER MICROPHONE - A silicon condenser microphone includes a silicon substrate defining an opening, a diaphragm supported above the substrate, a backplate opposite to the diaphragm for forming a capacitor together with the diaphragm. The diaphragm includes a central vibrating portion and a plurality of arms extending from an edge of the vibrating portion. Each of the arms includes a first end connecting to the edge of the vibrating portion and a linking portion extending along a path having the same outline as that of the vibrating portion.07-01-2010
20100158279INTEGRATED ACOUSTIC TRANSDUCER OBTAINED USING MEMS TECHNOLOGY, AND CORRESPONDING MANUFACTURING PROCESS - A MEMS acoustic transducer provided with a substrate having cavity, and a membrane suspended above the cavity and fixed peripherally to the substrate, with the possibility of oscillation, through at least one membrane anchorage. The membrane comprises at least one spring arranged in the proximity of the anchorage and facing it, and is designed to act in tension or compression in a direction lying in the same plane as said membrane.06-24-2010
20110216922SILICON CONDENSER MICROPHONE - Disclosed is a silicon condenser microphone including a backplate having a plurality of perforations therethrough, a diaphragm opposed from the backplate for forming a capacitor. The diaphragm includes a first part and a second part received in the first part, the second part being capable of vibrating relative to the backplate. The first part is connected to the ground and the second part is connected to a bias voltage.09-08-2011
20100189289CAPACITOR MICROPHONE CHIP, CAPACITOR MICROPHONE, AND MANUFACTURING METHOD THEREOF - An object of the invention is to design microminiaturization and higher sensitivity of a capacitor microphone chip formed by micromachining a silicon substrate and a wafer is diced so that a silicon substrate of a microphone chip is shaped almost like a hexagon, preferably a regular hexagon, and a back air chamber is shaped like a circle or a regular hexagon.07-29-2010
20110116661SHIELD CASE AND MEMS MICROPHONE HAVING IT - To provide a shield case and an MEMS microphone having the shield case which can secure on a top plate the minimum distance for adhering with a gasket in a view point of airtightness.05-19-2011
20110116660Condenser microphone - There is provided a condenser microphone in which even if strong electromagnetic waves are applied from a cellular phone or the like, the balance between a filter circuit for a No. 2 pin on the hot side and a filter circuit for a No. 3 pin on the cold side is maintained. The condenser microphone includes a printed wiring board 05-19-2011
20110085683FULLY DIFFERENTIAL LOW-NOISE CAPACITOR MICROPHONE CIRCUIT - A microphone circuit includes a capacitor capsule and first and second impedance converters connected differentially to the capacitor capsule. The microphone circuit includes first and second output buffer amplifiers connected differentially to the first and second impedance converters.04-14-2011
20090169034CONDENSER MICROPHONE MOUNTABLE ON MAIN PCB - A condenser microphone mountable on a main PCB includes a cylinder-shaped case having opened and closed sides; a first metal ring inserted into the case; a disk-shaped back plate having a sound hole to be connected electrically to the case through the first metal ring; a spacer; an insulating ring to provide electrical insulation and mechanical support. A diaphragm is inserted into the insulating ring and faces the back plate while interposing the spacer between the diaphragm and the back plate. A second metal ring is connected electrically to the diaphragm and mechanically supports the diaphragm, and a PCB is mounted and forms with a sound hole. The PCB is connected to the back plate through the second metal ring and the case, and the PCB includes connection terminals.07-02-2009
20120045078MEMS MICROPHONE - A MEMS microphone has a support surface, a microphone substrate over the support surface and an assembly of a microphone membrane and spaced back electrode supported over the substrate. The substrate has an opening beneath the assembly. The interface between the support surface and the substrate comprises a plurality of discrete spaced portions. This structure provides some resilience to differential expansion and contraction that can arise during processing. The support surface can then be a different material to the substrate, for example a PCB laminate as the support surface and silicon as the substrate.02-23-2012
20120057729MEMS MICROPHONE PACKAGE - A microelectromechanical system microphone package has at least one sensitive diaphragm provided in the front side of a microphone component. The microphone component and a cap wafer are connected to one another with their front sides facing one another. The cap wafer functions as an intermediate wafer for installing the microelectromechanical system microphone package. The cap wafer is provided with feedthroughs so that the microphone component is electrically contactable via the cap wafer.03-08-2012
20120114146CONDENSER MICROPHONE - A condenser microphone includes a plurality of condenser microphone units, each unit including a diaphragm and a fixed electrode one of which has an electret layer thereon. The condenser microphone units include respective sensitivity controllers changing sensitivities of the units. The sensitivity controllers include respective variable resistors connected between a power source and a ground. Each of the variable resistors has a slidable terminal connected to one, opposed to the electret layer, of the diaphragm and the fixed electrode, of the corresponding condenser microphone unit.05-10-2012
20120014542Narrow directional condenser microphone - There is provided a narrow directional condenser microphone having an acoustic tube, in which a condenser microphone unit having a large effective diaphragm area is arranged on the rear end portion side of the acoustic tube to achieve high sensitivity without an increase in the diameter of the acoustic tube. In a narrow directional condenser microphone in which a unidirectional condenser microphone unit configured by arranging a diaphragm and a backplate opposedly via a spacer is arranged on the rear end side of an acoustic tube 01-19-2012
20120250909ACOUSTIC TRANSDUCER WITH GAP-CONTROLLING GEOMETRY AND METHOD OF MANUFACTURING AN ACOUSTIC TRANSDUCER - A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.10-04-2012
20120027235MEMS CAPACITIVE MICROPHONE - The present invention discloses an MEMS capacitive microphone, which comprises a supporting portion and a diaphragm, wherein the supporting portion supports the central portion of the diaphragm to facilitate releasing the residual stress of the diaphragm generated in the thermal fabrication process. Thereby is maintained the flatness of the diaphragm and promoted the precision of sensing capacitance.02-02-2012
20100172521Electret Assembly For A Microphone Having A Backplate With Improved Charge Stability - The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.07-08-2010
20100290649POWER SUPPLY DEVICE FOR A MICROPHONE - The present invention concerns a feed device for feeding a microphone with a dc voltage. The feed device has first, second and third terminals (a, b, c), a resistor arrangement having at least a one resistor (R11-18-2010
20120213390CONDENSER MICROPHONE - To provide a condenser microphone having a removable head unit on the microphone body, wherein the head unit can be attached and detached to and from the microphone body through one connection at a low impedance. A second pin 08-23-2012
20110182448SPACER-INTEGRATED DIAPHRAGM FOR CONDENSER MICROPHONE - The present invention relates to a spacer-integrated diaphragm, in which spacers are integrated with the diaphragm, in order to reduce the number of components and manufacturing processes needed and remove parasitic capacitance. A characterizing feature of the spacer-integrated diaphragm of the present invention is that it has an integrated structure comprising a diaphragm of a flat conductive film, and thermally insulative spacers formed so as to protrude on peripheral portions of the diaphragm through a PSR (Photo Solder Resist) printing process. The spacers are formed with a plurality of holes to remove parasitic capacitance, the diaphragm has a rectangular flat shape with round edges, and the spacers are formed near the four edges of the rectangular flat shape. In the spacer-integrated diaphragm of the present invention, because the spacers are formed of a PSR (Photo Solder Resist) material and are also formed with a plurality of holes, the present invention can prevent unnecessary parasitic capacitance from occurring and improve sound quality, and, because the diaphragm and the spacers are integrally formed, the present invention can reduce the number of processes needed when a condenser microphone is assembled and reduce the number of components required, thereby reducing manufacturing costs.07-28-2011
20120163635Helical Antenna Apparatus and Method of Forming Helical Antenna - An antenna assembly and method of forming an antenna is disclosed. The antenna comprises a dielectric core wrapped with an antenna tape having a conductive portion. A printed circuit board extends from a chassis, and a ground element secures the printed circuit board to the chassis at a point located away from the chassis. The printed circuit board can be secured to the conductive portion on the tape through a wire or flex cable connection. The dielectric core can be formed of a shock absorbing material and is configured to extend into the chassis. The antenna assembly can be provided with an antenna cover placed over the dielectric core and a shock-absorbing material can be located between the dielectric core and the antenna cover.06-28-2012
20120170777Condenser Microphone and Head Thereof - A head of a condenser microphone includes: a condenser microphone unit; a housing supporting the condenser microphone unit; a first circuit board arranged adjacent to the condenser microphone unit in the housing; a second circuit board arranged remote from the condenser microphone unit and separated from the first circuit board in the housing; and a magnetic sheet arranged between and separated from the first circuit board and the second circuit board in the housing, the first circuit board including a circuit for processing an audio signal from the condenser microphone unit; the second circuit board including a DC-DC converter circuit unit for generating a polarization voltage to be applied to the condenser microphone unit.07-05-2012
20120076329COMB SENSE MICROPHONE - A miniature microphone, comprising a diaphragm, supported for displacement in response to acoustic waves, from which a plurality of projections extend; a plurality of projections extending from a surface; a body, supporting the surface to maintain the plurality of projections from the diaphragm and the plurality of projections from the surface in close proximity; and an electromagnetic sensor adapted to sense an electromagnetic interaction between the plurality of projections from the diaphragm and the plurality of projections from the surface and produce an electrical signal in response thereto. The interaction may be detected substantially without inducing a force which tends to substantially displace the diaphragm, since the electrostatic force is substantially parallel to the diaphragm surface.03-29-2012
20120189143Micromechanical Microphone Device and Method for Producing a Micromechanical Microphone Device - A micromechanical microphone device includes a membrane that is mounted in an elastically deflectable manner above a substrate and that has at least one gate electrode. The device further includes a source region and a drain region provided in or on the substrate with a channel region therebetween. The channel region is at least partly covered by the gate electrode and is spaced apart from the gate electrode by a gap. The membrane is deflectable under the influence of sound in such a way that the gap is variable.07-26-2012
20120189144Packaged Microphone with Reduced Parasitics - A packaged microphone has a base with a top face, a lid coupled to the base and forming an interior, and a MEMS microphone (i.e., a die or chip) secured to the top face of the base within the interior. The packaged microphone also includes a circuit chip secured to the top face of the base within the interior. The circuit chip has a top surface with a top pad, a bottom surface with a bottom pad, and a via. The bottom pad is electrically connected to the base, and the via electrically connects the top pad with the bottom pad. A wire bond is connected between the MEMS microphone and the top pad on the circuit chip. The MEMS microphone is electrically connected to the bottom pad and the base through the via.07-26-2012
20120082325CONDENSER MICROPHONE ARRAY CHIP - A plurality of structures of condenser microphones is fabricated in a single condenser microphone array chip. The condenser microphone array chip includes a substrate having a plurality of openings serving as air cavities, a first insulating layer formed in the outer periphery of the openings, a first electrode layer stretched over each of the openings, a second insulating layer formed above the first electrode layer in the outer periphery of the openings, a second electrode layer formed above the second insulating layer relative to the first electrode layer via an air gap therebetween. The structures are connected via a plurality of bridges and separated via a plurality of channels therebetween. The channels circumvent the bridges so that at least the second insulating layer is partially removed from the channels. The bridges are formed using the second electrode layer serving as wiring for electrically connecting the structures of condenser microphones.04-05-2012
20110123052MICROPHONE - A microphone and a method for manufacturing the same. The microphones includes a substrate die; and a microphone and an accelerometer formed from the substrate die. The accelerometer is adapted to provide a signal for compensating mechanical vibrations of the substrate die.05-26-2011
20120230523ELECTRO ACOUSTIC TRANSDUCER - The invention relates to a condenser microphone element (09-13-2012
20120230522Electroacoustic Sound Transducer - The electroacoustic transducer according to the invention has at least one diaphragm and at least one counterelectrode. In that case the diaphragm and/or the counterelectrode each have at least two electrically mutually insulated segments. In that arrangement the segments are so adapted that different electric signals are supplied or that different electric signals are delivered in response to exposure to sound of the sound transducer.09-13-2012
20120321111ELECTRET CONDENSER MICROPHONE - The present invention relates to an electret condenser microphone which comprises an exterior sidewall structure attached to a carrier. The exterior sidewall structure comprises a non-conductive base material carrying first and second electrical wiring patterns electrically connected to first and second electrical traces, respectively, of the carrier. A diaphragm holder, carrying a conductive microphone diaphragm is attached to the sidewall structure to establish electrical connection between a conductive microphone diaphragm and one of the first and second electrical wiring patterns of the sidewall structure. A conductive perforated backplate is arranged in spaced relationship to the conductive microphone diaphragm. The conductive perforated backplate is electrically connected to another one of the first and second wiring patterns of the sidewall structure. The sidewall structure may therefore be utilized to provide electrical connectivity from the conductive microphone diaphragm and from the backplate to a microphone preamplifier arranged on the carrier.12-20-2012
20120087521Microphone Package with Embedded ASIC - A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base. Apertures in the base and integrated circuit are aligned to form an aperture from the exterior of the package to the interior.04-12-2012
20120328132Perforated Miniature Silicon Microphone - This invention relates to a miniature silicon capacitive microphone having a perforated backplate supported on a substrate, a shallowly corrugated and perforated diaphragm that is suspended above said backplate and said suspended shallowly corrugated and perforated diaphragm is fully clamped and anchored on the said substrate at the edge of said diaphragm. Said perforated backplate is isolated electrically from said substrate by a layer of dielectric material. Said suspended shallowly corrugated diaphragm has a plurality of perforation holes to allow the passage of slow varying ambient pressure, and to equalize the barometric pressure in and out of the back cavity.12-27-2012
20090060232Condenser microphone - A condenser microphone includes a substrate having an opening in a back cavity, a diaphragm including a center portion and a plurality of arms extended in the radial direction from the center portion, a plate positioned opposite the diaphragm, and a support structure for supporting the periphery of the diaphragm and the periphery of the plate above the substrate while insulating the diaphragm and the plate both having conductive properties from each other. The support structure forms gaps between the substrate, the diaphragm, and the plate. Projections having insulating properties are formed in the center portion and the arms of the diaphragm so as to project towards the substrate and are separated from each other in the circumferential direction of the diaphragm. This prevents the diaphragm from being unexpectedly adhered and fixed to the substrate, thus improving the sensitivity of the condenser microphone.03-05-2009
20130010989COMPONENT HAVING A MICROMECHANICAL MICROPHONE STRUCTURE, AND METHOD FOR MANUFACTURING SAME - Measures for improving the acoustic properties of a microphone component produced in sacrificial layer technology. The micromechanical microphone structure of such a component is implemented in a layered structure, and includes at least one diaphragm, which is deflectable by sound pressure and which is implemented in a diaphragm layer, and a stationary acoustically permeable counterelement for the diaphragm which is implemented in a thick functional layer above the diaphragm layer and which is provided with through openings for introducing sound. The through openings for introducing sound are situated above the middle region of the diaphragm, while perforation openings which are largely acoustically passive are provided in the counterelement, above the edge region of the diaphragm.01-10-2013
20130016859MEMS MICROPHONE OVERTRAVEL STOP STRUCTURE - A MEMS microphone. The MEMS microphone includes a membrane, a spring, and a first layer having a backplate, and a first OTS structure. The spring has a first end coupled to the membrane, and a second end mounted to a support. The first OTS structure is released from the backplate and coupled to a structure other than the backplate, and is configured to stop movement of the membrane in a first direction after the membrane has moved a predetermined distance.01-17-2013
20110142265CAPACITOR MICROPHONE UNIT AND CAPACITOR MICROPHONE - The present invention relates to a capacitor microphone unit including a diaphragm, a fixed electrode that is arranged opposite to the diaphragm with a space provided between the diaphragm and the fixed electrode so that a capacitor is formed between the diaphragm and the fixed electrode, an insulating base that is disposed on a rear side of the fixed electrode and supports the fixed electrode, and a ring-shaped acoustic resistance material that is disposed on a front side of the insulating base, all of which are incorporated in a unit casing. A skin layer is formed on at least one of a front side and a rear side of the acoustic resistance material, and the skin layer has a higher density than that inside the acoustic resistance material, whereby acoustic resistance can be readily controlled.06-16-2011
20110142264Condenser microphone and method for manufacturing the same - There is provided a gooseneck condenser microphone that is further strengthened the shield structure of a support pipe and is less prone to causing a trouble. This condenser microphone has a support pipe 06-16-2011
20080247573Miniature capacitive acoustic sensor with stress-relieved actively clamped diaphragm - An acoustic sensor is disclosed which can be fabricated on a single chip with an electronic detection circuit by modular integration of the fabrication processes. An advantage of the disclosed acoustic sensor with on-chip signal detection circuit is smaller overall device size and lower sensitivity to electromagnetic interference and vibration. A second advantage of the disclosed acoustic sensor is the combined stress-relief and electrostatic clamping design of the diaphragm, which allows for further reduction of the diaphragm size, and hence device size, without compromising the microphone acoustic sensitivity, and at same time eliminates issues with diaphragm bow normally associated with stress-relief techniques.10-09-2008
20080247572Micro-Electro-Mechanical System (Mems) Capacitor Microphone and Method of Manufacturing Thereof - The invention relates to a method of manufacturing a MEMS capacitor microphone and further to such MEMS capacitor microphone. With the method a MEMS capacitor microphone can be manufactured by stacking pre-processed foils (10-09-2008
20080232615CONDENSER MICROPHONE CHIP - Disclosed is a condenser microphone chip, comprising: a substrate (09-25-2008
20130177180MEMS Microphone with Springs and Interior Support - A MEMS microphone has a stationary portion with a backplate having a plurality of apertures, and a diaphragm spaced from the backplate and having an outer periphery. As a condenser microphone, the diaphragm and backplate form a variable capacitor. The microphone also has a post extending between, and substantially permanently connected with, both the backplate and the diaphragm, and a set of springs securing the diaphragm to at least one of the post and the stationary portion. The post is positioned to be radially inward of the outer periphery of the diaphragm.07-11-2013
20110274300SPACER FOR A CAPACITIVE MICROPHONE AND CAPACITIVE MICROPHONE WITH THE SAME - The present invention relates to a spacer for a capacitive microphone and a capacitive microphone with such spacer, in which the spacer is mounted between polar plates and vibrating diaphragm of the microphone and the spacer comprises at least one insulating layer and at least one conductive layer bonded with the insulating layer. With the above-mentioned structure, static electricity is effectively prevented from occurring or storing during manufacturing process of the spacer and meanwhile, disadvantages such as difficult processing, high cost and tendency to increase parasitic capacitance while making spacer with metal sheet are overcome.11-10-2011
20110274299ENCAPSULATED MICRO-ELECTRO-MECHANICAL DEVICE, IN PARTICULAR A MEMS ACOUSTIC TRANSDUCER - An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a chamber surrounding the MEMS chip, and the third substrate is bonded to the second substrate and upwardly closes the chamber. A grid or mesh structure of electrically conductive material is formed in or on the third substrate and overlies the MEMS chip; the second substrate has a conductive connection structure coating the walls of the chamber, and the first substrate incorporates an electrically conductive region, which forms, together with the conductive layer and the grid or mesh structure, a Faraday cage.11-10-2011
20110274298MEMS MICROPHONE - A MEMS microphone includes a silicon substrate defining an opening, a diaphragm being supported above the substrate and a backplate opposite from the diaphragm for forming a capacitor together with the diaphragm. The diaphragm includes a central vibrating portion and a plurality of serpentine segments extending from an edge of the vibrating portion. Each of the serpentine segments includes a first spring and a second spring symmetric to the first spring about an axis extending from a center of the vibrating portion. Each spring includes a first end connecting to the edge of the vibrating portion, a bending portion and a second end extending from the bending portion for anchoring the diaphragm to the substrate. The bending portion extends along a path having the same outline as that of the vibrating portion.11-10-2011
20110311080Very Low Power MEMS Microphone - A MEMS microphone is capable of operating with less-than-one-volt bias voltage. An exemplary MEMS microphone can operate directly from a power rail (i.e., directly from VDD), i.e., without a DC-to-DC step-up voltage converter or other high bias voltage generator. The MEMS microphone has high mechanical and electrical sensitivity due, at least in part, to having high-compliance, i.e. low stiffness, springs and a relatively small gap between its diaphragm and its parallel conductive plate. In some embodiments, a diode-based voltage reference or a bandgap voltage reference supplies the bias voltage.12-22-2011
20080219483SMALL-FOOTPRINT MICROPHONE MODULE WITH SIGNAL PROCESSING FUNCTIONALITY - An acoustic processing module receives an acoustic signal, and outputs an analog output signal. Microphone sensors are provided for generating a corresponding electrical signal in response to the acoustic signal. A signal processing circuit is connected to the microphone sensors, and processes the electrical signals according to one or more analog signal processing functions to generate the analog output signal. An integrated casing encapsulates the microphone sensors and the analog processing circuit, and prevents external interference from affecting any electrical signals within the integrated casing.09-11-2008
20080219482Condenser microphone - An electroacoustic transducer includes a condenser microphone, which includes a package having a cavity and a through-hole, a plate whose thickness is thinner than the length of the through-hole and which has a sound hole overlapping with the through-hole in plan view, and an electroacoustic transducer die, which is stored in the cavity of the package. The electroacoustic transducer die includes a fixed electrode and a diaphragm electrode, which are positioned opposite to each other and which are supported by and enclosed inside of a support. The sound hole of the plate is reduced in dimensions realizing a small sectional area and a small depth, thus realizing a high resonance frequency higher than the audio frequency range.09-11-2008
20120250910PROGRAMMABLE MICROPHONE - A semiconductor die with an integrated electronic circuit, configured so as to be mounted in a housing with a capacitive transducer e.g. a microphone. A first circuit is configured to receive an input signal from the transducer at an input node and to provide an output signal at a pad of the semiconductor die. The integrated electronic circuit comprises an active switch device with a control input, coupled to a pad of the semiconductor die, to operatively engage or disengage a second circuit interconnected with the first circuit so as to operate the integrated electronic circuit in a mode selected by the control input. That is, a programmable or controllable transducer. The second circuit is interconnected with the first circuit so as to be separate from the input node. Thereby less noise is induced, a more precise control of the circuit is obtainable and more advanced control options are possible.10-04-2012
20130094676Electret Condenser Microphone - An electret condenser microphoneelectret condenser microphone includes a capsule, diaphragm ring with attached diaphragm, back electrode plate having an electret-dielectric-film-coated surface facing the diaphragm, insulating spacer with space between the back electrode plate and the diaphragm, impedance converter, flexible printed circuit board in which a hollow cylinder, a flange projecting radially from an edge of the hollow cylinder on one end face facing the back electrode plate, and a rear plate blocking the other end face of the hollow cylinder are integrally formed, in which the impedance converter is placed on a surface of the rear plate facing the back electrode plate, and gate ring electrically connecting the back electrode plate to wiring on the flexible printed circuit board. An edge on an open side of the capsule bends inwardly to fit against the flange of the flexible printed circuit board.04-18-2013
20130094675MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.04-18-2013
20130094674COMPACT, HIGHLY INTEGRATED MICROPHONE ASSEMBLY - A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.04-18-2013
20110268296CONDENSER MICROPHONE ASSEMBLY WITH FLOATING CONFIGURATION - A condenser microphone assembly without electrets formed on a rear pole plate, and having an electrically floating diaphragm and improved capacitance. The condenser microphone assembly includes a sounding body in which a floating bias voltage is applied between a diaphragm and a rear pole plate facing one another and electrically separated by a small space therebetween, where capacitance changes when the diaphragm vibrates according to sound pressure from an external sound source; a printed circuit board (PCB) assay having an output terminal and ground terminal formed on an outer surface thereof, connected to an external circuit through the output terminal and ground terminal, having a buffer integrated circuit (IC) mounted on an inner surface thereof to boost an input voltage applied to a voltage pump built into the buffer IC, applying an electrically floating bias voltage to the sounding body, and outputting an amplified electric signal by the buffer IC, of a change in capacitance of the sounding body, through the output terminal and ground terminal; and a cylindrical case of metal material with one open surface, coated with an insulation material on the inside thereof except for around the end of the open surface, electrically insulated from the sounding body, including the sounding body within a compartment thereof, curling-coupled to the PCB assay, and coupled to the ground terminal to electrically shield the sounding body11-03-2011
20110222713Condenser Microphone - A condenser microphone has an output circuit comprising an emitter-follower circuit; an impedance converter comprising an FET and at least one transistor of the emitter-follower circuit provided next to the FET; and the transistor having an emitter terminal provided with a constant-voltage circuit. The FET included in the impedance converter is operated by a voltage supplied from the constant-voltage circuit.09-15-2011
20110235830Condenser microphone and output connector therefor - There is provided an output connector for a condenser microphone which has a function of shielding electromagnetic waves more reliably. In an output connector 09-29-2011
20130101143MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE CHIP WITH AN EXPANDED BACK CHAMBER - A MEMS microphone chip with an expanded chamber comprises a base plate, and the base plate has a main chamber and a secondary chamber. The secondary chamber is formed beside the main chamber, and is connected to the main chamber. A vibration membrane is suspended above the main chamber for receiving external sound waves, and the vibration membrane vibrates in corresponding to the chambers. The MEMS microphone chip has a higher sensitivity because of the expanded chamber, and therefore has a more ideal audio frequency response curve.04-25-2013
20130156234PREVENTING ELECTROSTATIC PULL-IN IN CAPACITIVE DEVICES - A microphone system including an audio sensor with a first electrode and a second electrode. A voltage source is coupled to the first electrode and the second electrode. A high-impedance bias network is coupled between the voltage source and the first electrode of the audio sensor. Additional electronics operate based on a state of the first electrode of the electromechanical device. A feedback system is configured to maintain an electrical potential across the high-impedance bias network at approximately zero volts. Maintaining the electrical potential across the high-impedance bias network at approximately zero volts reduces the tendency of electrostatic pull-in occurring.06-20-2013
20130156235Acoustic Apparatus And Method Of Manufacturing - A microphone assembly comprising includes a base, at least one side wall, and a cover. The side wall is disposed on the base. The cover is coupled to the at least one side wall. The base, the side wall, and the cover form a cavity and the cavity has a MEMS device disposed therein. A top port extends through the cover and a first channel extends through the side wall. The first channel is arranged so as to communicate with the top port. A bottom port extends through the base. The MEMS device is disposed over the bottom port. A second channel is formed and extends along a bottom surface of the base. The second channel extends between and communicates with the first channel and the bottom port. Sound received by the top port is received at the MEMS device.06-20-2013
20090296963Diaphragm for condenser microphone, method for manufacturing the same, and condenser microphone - The adsorption stability with respect to a fixed pole is increased while the low frequency response of a diaphragm is improved especially in an electret condenser microphone. In a diaphragm 12-03-2009
20080310657ELECTRET CONDENSER MICROPHONE - An electret condenser microphone is provided that allows a reduction in the thickness of an electronic device to which it is installed. The electret condenser microphone has a circuit board (12-18-2008
20110311081MEMS MICROPHONE AND MANUFACTURING METHOD THEREOF - A micro electro mechanical system (MEMS) microphone capable of preventing a membrane and a back plate from being contacting each other by an overvoltage, an external shock, and the like, and a method of manufacturing the MEMS microphone. The MEMS microphone includes a silicon substrate in which a back chamber is to be formed; a back plate which is formed on the silicon substrate and has formed therein a plurality of sound holes; a membrane which is formed on the silicon substrate at a predetermined distance apart from the back plate to form an air gap; and a contact-preventing electrode unit which is formed on the silicon substrate and applies a repulsive force to the membrane.12-22-2011
20130195291FAST POWER-UP BIAS VOLTAGE CIRCUIT - The present invention relates to a DC bias voltage circuit comprising a DC bias voltage generator adapted to supply a first DC voltage. A low-pass filter has an input operatively coupled to the first DC voltage to produce a second DC voltage at a low-pass filter output. The low-pass filter comprises an adjustable switched capacitor resistor setting a cut-off frequency of the low-pass filter and a controller is adapted to controlling a resistance of the adjustable switched capacitor resistor.08-01-2013
20120294464MEMS Microphone - A MEMS microphone includes a silicon substrate, a diaphragm connected to the silicon substrate, a backplate opposed from the diaphragm for forming an air gap. The backplate defines a plurality of first through holes and a plurality of second through holes surrounded by the first through holes, each of the first through holes being formed by a straight boundary and an arc boundary, the radius of the second boundary being greater than half the width of the first boundary.11-22-2012
20130202136CHIP WITH INTEGRATED CIRCUIT AND MICRO-SILICON CONDENSER MICROPHONE INTEGRATED ON SINGLE SUBSTRATE AND METHOD FOR MAKING THE SAME - A method for integrating an IC and a MEMS component includes the following steps: S1) providing a SOI base (08-08-2013
20120093346MEMS MICROPHONE - A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the −3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.04-19-2012

Patent applications in class Capacitive