Class / Patent application number | Description | Number of patent applications / Date published |
381173000 | Piezoelectric or ferroelectric | 15 |
20080267431 | Mems Microphone - A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm. | 10-30-2008 |
20090052699 | MICROPHONE COMPONENT AND A METHOD FOR ITS MANUFACTURE - A microphone component that may be used in many types of enclosures for making contact with a living body for picking up body sounds. Piezoelectric transflexural diaphragm elements ( | 02-26-2009 |
20090129611 | Microphone Membrane And Microphone Comprising The Same - The invention relates to a microphone membrane (M | 05-21-2009 |
20090154734 | METHOD FOR FABRICATING MICRO SPEAKER AND MICRO SPEAKER FABRICATED BY THE SAME - A method for fabricating a micro speaker is provided, including forming a package wafer and a device wafer by batch processing, bonding the package wafer and the device wafer to each other, and forming a diaphragm by isotropic-etching a back surface of the device wafer using a xenon difluoride (XeF | 06-18-2009 |
20090285418 | ACOUSTIC-ELECTRIC TRANSDUCER, ELECTRONIC DEVICE, METHOD, AND COMPUTER PROGRAM PRODUCT - An acoustic-electric transducer for a microphone may include a cavity delimited by a wall and having an opening; a diaphragm having an outer boundary, said diaphragm extending across said opening so that an air gap is provided transversely outwards of the diaphragm between said outer boundary of said diaphragm and said cavity wall; and an actuator configured to adjust a size of said air gap. | 11-19-2009 |
20120269366 | RIBBON MICROPHONE - To suppress the transverse displacement of a ribbon due to an impact to a level smaller than that achieved by electromagnetic damping. The switch | 10-25-2012 |
20130329920 | PIEZOELECTRIC MEMS MICROPHONE - A piezoelectric MEMS microphone comprising a multi-layer sensor that includes at least one piezoelectric layer between two electrode layers, with the sensor being dimensioned such that it provides a near maximized ratio of output energy to sensor area, as determined by an optimization parameter that accounts for input pressure, bandwidth, and characteristics of the piezoelectric and electrode materials. The sensor can be formed from single or stacked cantilevered beams separated from each other by a small gap, or can be a stress-relieved diaphragm that is formed by deposition onto a silicon substrate, with the diaphragm then being stress relieved by substantial detachment of the diaphragm from the substrate, and then followed by reattachment of the now stress relieved diaphragm. | 12-12-2013 |
20140294209 | EMBEDDED DIELECTRIC AS A BARRIER IN AN ACOUSTIC DEVICE AND METHOD OF MANUFACTURE - A microphone base includes a plurality of metal layers and a plurality of core layers. Each of the plurality of core layers is disposed between selected ones of the metal layers. A dielectric membrane is disposed between other selected ones of the plurality of metal layers. A port extends through the metal layers and the core layers but not through the dielectric membrane. The dielectric membrane has a compressed portion and an uncompressed portion. The uncompressed portion extends across the port and the compressed portion is in contact with the other selected ones of the metal layers. The compressed portion of the membrane is effective to operate as a passive electronic component and the uncompressed portion is effective to act as a barrier to prevent at least some external debris from traversing through the port. | 10-02-2014 |
20140369534 | SOUND PICKUP SYSTEM AND TERMINAL DEVICE USING THE SAME - A sound pickup system is disclosed. The sound pickup system includes a screen, an accelerometer attached to the screen, and a pre-processing module electrically connecting with the accelerometer. The screen is configured to detect a vibration caused by sound waves, the accelerometer is configured to receive the vibration detected by the screen and convert the vibration into an acceleration signal, and the pre-processing module is configured to receive the acceleration signal, and process the acceleration signal then convert the processed acceleration signal into a voice signal. | 12-18-2014 |
20150117680 | ACOUSTIC SENSOR - Provided are an acoustic sensor and a method of manufacturing the same. The acoustic sensor includes a substrate including an acoustic chamber, a first hole, and a second hole, penetrating the substrate, a lower electrode pad extended onto a top surface of the substrate while covering a sidewall of the first hole, a diaphragm pad extended onto the top surface of the substrate while covering a sidewall of the second hole, a lower electrode provided on the acoustic chamber and connected to the lower electrode pad, and a diaphragm above the lower electrode while being separated from the lower electrode and connected to the diaphragm pad. | 04-30-2015 |
20150131819 | MICROPHONE PACKAGE AND METHOD FOR GENERATING A MICROPHONE SIGNAL - A microphone package for providing a modified microphone signal includes a microphone and an equalizer device coupled to the microphone. | 05-14-2015 |
20160088401 | MICROPHONE AND METHOD OF MANUFACTURING THE SAME - A microphone and method of manufacturing the microphone are provided. The microphone includes a substrate that has a penetration aperture, a vibration film disposed on the substrate that covers the penetration aperture, and a first electrode disposed on the vibration film. The first electrode includes a first portion and a second portion separated from each other. In addition, the microphone includes a piezoelectric layer disposed on the second portion of the first electrode, a second electrode disposed on the piezoelectric layer, and a fixed electrode. Further, the first portion of the first electrodes is disposed at a substantially center portion of the vibration film and the second portion of the first electrode is disposed at an edge portion of the vibration film. | 03-24-2016 |
20160142828 | MICRO PHONE SENSOR - A microphone, that increases sensitivity without a separate circuit is provided. The microphone includes an audio detection module having a vibration film that outputs capacitance signals by vibrating audio introduced from the exterior and a piezoresistive element that outputs a piezoresistive signal by a sound pressure of the audio. A semiconductor chip includes an amplifier electrically connected to the audio detection module to receive a capacitance signal and a piezoresistive signal from the audio detection module and amplifies the capacitance signal and piezoresistive signal to an electrical signal. The amplifier includes an input terminal that receives an input of the capacitance signal; a first resistor connected to the input terminal and the piezoresistive element; an output terminal that amplifies and outputs the capacitance signal and piezoresistive signal to an electrical signal; and a second resistor connected to the input terminal and the output terminal and connected to the piezoresistive element. | 05-19-2016 |
20160150321 | MICRO PHONE AND METHOD OF MANUFACTURING THE SAME - A microphone and method of manufacturing the microphone are provided. The method includes forming a first and second oxide film at an upper side and lower side of a substrate and sequentially forming a membrane and a first photosensitive layer pattern over the first oxide film. A vibrating membrane and fixed membrane are formed as a comb finger shape by etching the membrane with the first photosensitive layer pattern as a mask. A second photosensitive layer pattern is also formed at the second oxide. A penetration aperture is formed by etching the substrate with the second photosensitive layer pattern as a mask. Lastly, the first and second film are removed. | 05-26-2016 |
20220141596 | MEMS DEVICE AND MANUFACTURING METHOD THEREOF - A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure. | 05-05-2022 |