Class / Patent application number | Description | Number of patent applications / Date published |
381172000 | Light modifying | 9 |
20110038492 | OPTICAL SENSING IN A DIRECTIONAL MEMS MICROPHONE - A microphone having an optical component for converting the sound-induced motion of the diaphragm into an electronic signal using a diffraction grating. The microphone with inter-digitated fingers is fabricated on a silicon substrate using a combination of surface and bulk micromachining techniques. A 1 mm×2 mm microphone diaphragm, made of polysilicon, has stiffeners and hinge supports to ensure that it responds like a rigid body on flexible hinges. The diaphragm is designed to respond to pressure gradients, giving it a first order directional response to incident sound. This mechanical structure is integrated with a compact optoelectronic readout system that displays results based on optical interferometry. | 02-17-2011 |
20110194711 | Optical Microphone Packaging - An optical microphone that may include a first substrate with one or more acoustic entry ports and a die over the one or more acoustic entry ports. The die may include a sensing structure for detecting acoustic vibrations received via the acoustic entry port(s) and may form a first cavity between the first substrate and the sensing structure. The microphone may include a light source within the first cavity, which may transmit laser light. The optical microphone may include photo detector(s) within the first cavity. The one or more photodetectors may be configured to receive the laser light after reflection from the sensing diaphragm to measure the acoustic vibrations of the sensing diaphragm. The microphone may also include a circuit and a lid, where the die, light source, photo detectors, and circuit are comprised within the cavity of the microphone. The circuit may perform signal processing signals from the photodetector(s). | 08-11-2011 |
20120321110 | POROUS SILICA MATERIAL AND OPTICAL MICROPHONE USING THE SAME - A porous silica material in which silica particles are connected to one another three-dimensionally, wherein: the porous silica material includes a through hole including first pores smaller than a mean free path of an air, and second pores larger than the first pores; the porous silica material has a density of 100 kg/m | 12-20-2012 |
20150319540 | Method and Apparatus for Recovering Audio Signals from Images - A method of recovering audio signals and corresponding apparatus according to an embodiment of the present invention using video or other sequence of images enables recovery of sound that causes vibrations of a surface. An embodiment method includes combining representations of local motions of a surface to produce a global motion signal of the surface. The local motions are captured in a series of images of features of the surface, and the global motion signal represents a sound within an environment in which the surface is located. Some embodiments compare representations of local motions of a surface to determine which motions are in-phase or out-of-phase with each other, enabling visualization of surface vibrational modes. Embodiments are passive, as compared to other forms of remote audio recovery that employ active sensing, such as laser microphone systems. Example applications for the embodiments include espionage and surveillance. | 11-05-2015 |
20150358742 | TRANSDUCER SYSTEM - Transducers and methods for converting acoustic signals into electrical signals. A device ( | 12-10-2015 |
20150365753 | OPTICAL MICROPHONE AND METHOD USING THE SAME - An optical microphone and a method using the same are described. The optical microphone comprises a light source configured to emit a light beam and an acoustic sensor configured to reflect the light beam. The acoustic sensor includes single-wall nanotubes and deflects in response to pressure waves. An optional reflector of the optical microphone is configured to re-reflect the light beam from the acoustic sensor. A detector is configured to detect the light beam from the acoustic sensor or the reflector, and thus measures the pressure waves. | 12-17-2015 |
20150365770 | MEMS Device With Optical Component - A micro electro mechanical system (MEMS) microphone includes a lid, at least one wall coupled to the lid, a substrate, and a MEMS die. The substrate is coupled to the at least one wall and a port extending through the substrate. The MEMS die is disposed on the substrate, and the MEMS die including a movable diaphragm and back plate. The optical sub-assembly is coupled to the lid, and the optical sub-assembly is configured and arranged to sense a position of the diaphragm. | 12-17-2015 |
20160007125 | OPEN TOP BACK PLATE OPTICAL MICROPHONE - A micro-electro-mechanical system (MEMS) optical sensor and method of manufacturing a MEMS optical sensor. The MEMS optical sensor may be a MEMS optical microphone including a compliant membrane configured to vibrate in response to an acoustic wave, the compliant membrane having a grating suspended therein. The optical sensor further including a back plate positioned above the compliant membrane, the back plate having a reflector suspended within a center portion of the back plate and aligned with the grating. The optical sensor further including a light emitter positioned below the compliant membrane and configured to transmit a laser light toward the grating and the reflector. The optical sensor also including a light detector configured to detect an interference pattern of the laser light after reflection from the reflector, wherein the interference pattern is indicative of an acoustic vibration of the compliant membrane. Other embodiments are also described and claimed. | 01-07-2016 |
20160150327 | Photosensitive Microphone - A microphone includes a base; a micro electro mechanical system (MEMS) device disposed on the base, the MEMS device configured to convert sound into a first electrical signal; an integrated circuit disposed on the base and coupled to the MEMS device; a photo diode disposed on the base, the photo diode configured to convert light into a second electrical signal. At least one of the first electrical signal and the second electrical signal is processed by the integrated circuit. | 05-26-2016 |