Class / Patent application number | Description | Number of patent applications / Date published |
374057000 | Of susceptibility to thermally induced deteriouration, flaw, or failure | 34 |
20080285616 | System for testing the durability of objects under thermally hard circumstances - A system for testing objects such as electronic devices and mechanical components to see how they can withstand thermally hard circumstances created by a thermal agent supplied from a supplying system communicating with a testing section by and through an inlet flow path and an outlet flow path, wherein heat exchange is effected between the incoming agent and the outgoing agent, so that the remaining heat content, worm or cold, is taken and utilized for later uses. | 11-20-2008 |
20090052495 | THERMAL TESTING APPARATUS - A thermal testing apparatuses for a server system ( | 02-26-2009 |
20090080491 | METHOD FOR EVALUATING THE DETERIORATION OF MAGNETO-RESISTIVE EFFECT DEVICE - The estimation method of the invention for estimating the deteriorations of a magneto-resistive effect device by heat shocks involves applying heat shocks by laser irradiation to a structure including a thin-film magnetic head comprising a magneto-resistive effect device to propagate them to the magneto-resistive effect device, thereby causing the deteriorations of the magneto-resistive effect device. Thus, (1) the deterioration mode phenomenon of “local overheating plus vibration” can be imitated in a simple yet very approximate state so that a device likely to undergo characteristics deteriorations due to the thermal asperity problem can be detected early at an initial fabrication process stage, and (2) what specifications a head device structure less likely to offer the thermal asperity problem is in can be judged at a product development stage. | 03-26-2009 |
20090097526 | RELIABILITY TESTING OF SUB-MINIATURE INTERCONNECTS - The invention concerns a method and apparatus for performing an accelerated simulation of mechanical stresses and strains to evaluate the reliability of a sub-miniature interconnect. The method can begin by determining at least one characteristic of at least one thermal cycle to which a sub-miniature interconnect having a predetermined configuration will be exposed. The at least one characteristic can be selected to include a temperature change during the at least one thermal cycle. Thereafter, at least one value is calculated which represents a dimensional variation in a substrate ( | 04-16-2009 |
20100040107 | TESTING DEVICE AND TESTING METHOD OF SEMICONDUCTOR DEVICES - A testing device of semiconductor devices includes a temperature detector detecting temperatures of semiconductor devices, and a temperature control unit controlling the temperatures of the semiconductor devices based on a detected temperature, in which the temperature control unit includes thermal heads cooling or heating the semiconductor devices, solution pipes through which solutions set to different temperatures flow, and a channel switching part switching whether or not to make the solution flow through the thermal head, and when a test is conducted, the solution flown through the thermal head is switched according to heating amount of the semiconductor device. | 02-18-2010 |
20100046575 | Flexible Thermal Cycle Test Equipment for Concentrator Solar Cells - A system and method for performing thermal stress testing of photovoltaic solar cells is presented. The system and method allows rapid testing of photovoltaic solar cells under controllable thermal conditions. The system and method presents a means of rapidly applying thermal stresses to one or more photovoltaic solar cells in a consistent and repeatable manner. | 02-25-2010 |
20100080261 | Simulation test system for thermal impact ageing of power transmission insulator - The present invention relates to a simulation test system for thermal impact ageing of a power transmission insulator which simulation tests an influence of a forest fire on the power transmission insulator. The present invention provides a simulation test system of thermal impact ageing for a power transmission insulator, which includes a heating chamber provided with a flame supplying part and electric heating parts in fireproof walls and a partition wall having an opening/closing door in a lower part thereof; a cooling chamber placed under the heating chamber and provided with a cooling nozzle in a fireproof wall; a sample lifting device for selectively lifting a test sample up and down through the heating chamber and the cooling chamber; a door transporting device for slidingly moving the opening/closing door; and a central control part for controlling the flame supplying part, the electric heating part, the opening/closing door, the cooling nozzle, the sample lifting device and the door transporting device independently and respectively. Therefore, since the heating chamber and the cooling chamber are configured independently from each other, heating and cooling tests for the test sample can be performed individually or together. | 04-01-2010 |
20100103977 | METHOD OF ANALYZING THERMAL STRESS ACCORDING TO FILLING FACTOR OF FILLER IN RESIN - A method of analyzing thermal stress includes calculating a distribution of the number of fillers in a composite integrally molded product by using physical property values of resin material containing fillers, and determining a coefficient of linear expansion of the resin material in the composite integrally molded product, that is used as an input condition of a thermal stress analysis, based on the distribution of the number of the fillers. | 04-29-2010 |
20100246632 | THERMAL FATIGUE TESTING DEVICE AND RECORDING MEDIUM RECORDED WITH A PROGRAM - A thermal fatigue testing device that includes a gas cooling component, a tube member, and a heat generating body is provided. The gas cooling component cools a blown gas to a predetermined temperature or less, and that is provided with a heat insulating member at an outer side surface thereof. The tube member has a gas flow path formed therein from a first end to a second end, is provided at an outer side surface thereof with a heat radiating portion from the second end to a first intermediate portion, and is connected with the gas cooling component at the first end side. A test body is arranged at the second end side. The heat generating body is provided in the gas flow path between the first end and a second intermediate portion and heats a gas flowing through the gas flow path. | 09-30-2010 |
20100278211 | METHOD AND SYSTEM OF TESTING A SEMICONDUCTOR DEVICE - The present disclosure provides a semiconductor device, the device includes a substrate, a front-end structure formed in the substrate, a back-end structure formed on the front-end structure, a heater embedded in the back-end structure and operable to generate heat, and a sensor embedded in the back-end structure and operable to sense a temperature of the semiconductor device. | 11-04-2010 |
20100329300 | METHOD AND ARRANGEMENT FOR MEASURING AT LEAST ONE PHYSICAL MAGNITUDE, SUCH AS TEMPERATURE, FLOW OR PRESSURE OF THE COOLING FLUID FLOWING IN AN INDIVIDUAL COOLING ELEMENT CYCLE OF A COOLING ELEMENT IN A METALLURGICAL FURNACE - The invention relates to a method and arrangement for measuring at least one physical magnitude, such as temperature, flow or pressure of the cooling fluid flowing in an individual cooling element cycle ( | 12-30-2010 |
20110128988 | TEMPERATURE CONTROL OF CONDUCTION-COOLED DEVICES DURING TESTING AT HIGH TEMPERATURES - A high temperature testing system for an electronic device may include a testing chamber in which the temperature of ambient air in the testing chamber may be maintained at a desired testing temperature and the surface temperature of the electronic device may be maintained at a second desired testing temperature, where the ambient air temperature and the surface temperature of the electronic device may be set to be equal to one another. In one implementation, a system may control operation of a fan based on the surface temperature of the electronic device. The system may further include a testing apparatus that includes a heat exchanger connected to an inlet hose such that blown air is passed over the heat exchanger to cool the heat exchanger. A temperature sensor may be attached to the heat exchanger and may generate the temperature signal. | 06-02-2011 |
20120082180 | Electrical Component Behavior Analysis Tools - Tools and methods for creating isolated or localized temperature changes on components in an electric circuit. By isolating temperature changes to individual components or small sets of components, the tools and methods allow greater control over the analysis of interactions within a board. This may allow clearer understanding of the effects of temperature on circuit component behavior. The tools and analysis advances analysis such as failure analysis and design testing. | 04-05-2012 |
20120106593 | THERMAL INTERLOCK FOR BATTERY PACK, DEVICE, SYSTEM AND METHOD - Faulty battery detecting and locating devices and methods are able to detect and locate a faulty battery cell. The device applies an energy to a sensing member, such as a polymeric tube containing at least two polymer-coated and twisted electric wires. Heat that is generated by a faulty battery triggers an electric communication between the two electric wires by melting at least a portion of the polymer. The resulting change in resistance between the two electric wires is used to detect and locate a faulty battery. | 05-03-2012 |
20120163408 | HIGH TEMPERATURE ELECTRONIC MONITORING SYSTEM - A system for monitoring performance parameters of an apparatus operating at an elevated temperature, such as a gas turbine engine. The system includes sensors for sensing the performance parameters and generating analog sensor outputs, at least one hub unit mounted sufficiently close to the apparatus so as to be subjected to a first temperature in excess of 125° C., a collector unit subjected to a second temperature of less than the first temperature, and a distributor computer unit subjected to a third temperature of less than the second temperature. The hub unit has control and signal conditioning circuit boards that operate together to condition the analog sensor outputs of the sensors and produce corresponding digital data. The collector unit transmits the digital data from the hub unit to the distributor computer unit, which processes the digital data to assess the performance parameters of the apparatus. | 06-28-2012 |
20120213246 | Method for Evaluating Life of Cable Insulating Coating Material - Disclosed is a method for estimating, within a short time, the life of a cable insulating coating material containing an antioxidant in a suitable concentration based on the rate of decrease of the antioxidant and on the critical concentration of the antioxidant at which oxidative degradation rapidly proceeds. The method tests the coating material to examine its life, the coating material including a base polymer, and an antioxidant having a functional group suppressing an oxidative deteriorative reaction of the base polymer. The method includes performing a thermal degradation test on the coating material; determining the degradation levels and degradation rates of the coating material at two or more time points in the thermal degradation test, based on the ratio of the absorbance of the functional group of the antioxidant to the absorbance of the base polymer; and thereby evaluating the life of the coating material. | 08-23-2012 |
20130034119 | VIA CHAIN TESTING STRUCTURE AND METHOD - A via chain testing structure includes: a substrate; a dielectric layer disposed on the substrate; a first via chain disposed on dielectric layer; a second via chain, being disposed on the dielectric on both sides of the first via chain and in thermal proximity with the first via chain; a first heating source disposed under the substrate, for providing thermal heat to the first via chain; and an electrical current source for heating the second via chain so the second via chain acts as a second heating source for the first via chain. | 02-07-2013 |
20130128918 | THERMAL RESISTANCE-BASED MONITORING OF COOLING OF AN ELECTRONIC COMPONENT - Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided. | 05-23-2013 |
20130156064 | SYSTEM AND METHOD FOR TESTING ELECTRONIC DEVICE - A system for testing electronic device includes an electronic device, a temperature detecting module, a testing instrument and a testing computer. The testing electronic includes a main board and a power supply. The main board includes a slot and a card inserted in the slot. A plurality of dummy loads is located on the card. The slot includes at least one voltage interface. The power supply includes at least one power wire electrically connected to the at least one voltage interface. The temperature detecting module detects temperature signals of the plurality of dummy loads. The testing instrument is electrically connected to the at least one power wire to test current signals or power signals of the at least one power wire. The testing computer receives and displays the temperature signals, the current signals and the power signals. | 06-20-2013 |
20130223475 | METHODS OF MEASURING AND CONTROLLING INNER TEMPERATURE OF A CHAMBER INCLUDED IN A TEST HANDLER - To measure an inner temperature of a chamber included in a test handler, self-refresh currents of semiconductor memory devices under test are measured. The semiconductor memory devices are disposed in the chamber and have a function of linear temperature compensated self-refresh (Li-TCSR). Local temperature values are generated based on the self-refresh currents, where each local temperature value indicates a temperature near the corresponding semiconductor memory device of the semiconductor memory devices under test. | 08-29-2013 |
20140079092 | METHOD AND APPARATUS FOR PRE-EMPTIVE POWER SEMICONDUCTOR MODULE FAULT INDICATION - A method and an apparatus for an arrangement including a power semiconductor module with a cooling interface which is connected to a cooling element. The method first measures a first temperature value of the cooling interface, and then changes an operating mode of the power semiconductor module, wherein the operating mode is selected from an active mode and an inactive mode. The method then waits a determined time, measures a second temperature value of the cooling interface, and determines a temperature difference between the first temperature value and the second temperature value. The method then determines a level of a fault risk on the basis of the temperature difference. The apparatus implements the method. | 03-20-2014 |
20140153609 | HIGH AND LOW TEMPERATURE TEST EQUIPMENT - The invention relates to the technical field of LDC fabrication and specifically to a high and low temperature test equipment. The high and low temperature test equipment comprises a housing, and further comprises a partition disposed in the interior of the housing. The partition divides the interior of the housing into a plurality of chambers and is provided with a Peltier effect sheet. The Peltier effect sheet is used for, when it is powered-on, cooling at least one of the chambers and meanwhile heating at least one chamber other than the at least one of the chambers. The high and low temperature test equipment may cool and heat at the same time in an efficient, power conserving way and have uniform heating function. | 06-05-2014 |
20140247857 | System and Method for Measuring Thermal Reliability of Multi-Chip Modules - Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature. | 09-04-2014 |
20140301425 | Backstrike Detection System for Laser Drilling Thin Materials - In accordance with one aspect of the disclosure, a drill and detection system is disclosed. The system may include a drill and a thermal detector spaced apart from the drill. The drill may be directed in a first direction and the thermal detector may be directed in a second direction opposite the first direction. | 10-09-2014 |
20140328369 | DETECTION OF THERMAL DAMAGE OF COMPOSITES USING MOLECULAR PROBES - Improved methods of detecting thermal exposure are provided herein. The provided methods utilize initially dormant luminescent probes incorporated into a matrix to form a composite. When exposed to heat over a period of time, the luminescent probes are “activated” through a molecular transformation initiated by thermal energy. The activated probes exhibit a luminescent profile based on the extent of thermal exposure, thereby providing an indicator of the thermal exposure experienced by the matrix. When the composite is used to produce a structural component of a vehicle (e.g., an aircraft), the methods provide a convenient, large-area indicator of thermal damage experienced by the structural component. | 11-06-2014 |
20140341253 | ANOMALY DETECTOR AND ENVIRONMENTAL TESTER INCLUDING THE SAME - A controlling section | 11-20-2014 |
20140369380 | SENSORS, SYSTEMS AND METHODS FOR COMPENSATING FOR THERMAL EMF - Embodiments relate to sensor systems and methods that can compensate for thermal EMF effects that can cause residual offset and other errors in sensor systems. In one embodiment, a sensor system comprises at least one temperature sensor arranged proximate a primary sensor element, e.g., a Hall plate in an embodiment in which the sensor system comprises a Hall-effect magnetic field sensing system, though other types of magnetic field and sensors more generally can be used in other embodiments. In another embodiment, a plurality of temperature sensors can be used, with each one arranged proximate a different sensor contact or element. In an example in which the Hall plate is operated according to a spinning operation scheme, the at least one temperature sensor can be configured to sense a temperature in each operating phase, and the individual sensed temperatures can be combined and used to provide a temperature-dependent compensation signal. | 12-18-2014 |
20150063410 | NONDESTRUCTIVE INSPECTION APPARATUS AND INSPECTION SYSTEM OF STRUCTURE - A nondestructive inspection apparatus of a structure includes: an inspection apparatus body | 03-05-2015 |
20150355074 | TYPE OF TESTING EQUIPMENT FOR DETECTING THE FAILURE PROCESS OF THERMAL BARRIER COATING IN A SIMULTED WORKING ENVIRONMENT - A type of testing equipment for detecting the failure process of thermal barrier coating in a simulated working environment; it belongs to the field of simulated special working environment equipment. Testing equipment includes testing platform equipped with static or dynamic specimen holding apparatus, simulated module of working environment, real-time detection module, control panel. This invention is capable of simulating a high temperature, erosive, corrosive working environment for thermal barrier coated turbine blade of aero-engines; simulate high speed spinning working environment for thermal coated blade, simulate static working environment for guiding blade; perform real-time testing of temperature field, 3-D displacement field, crack initiation and expansion, surface oxidation, etc. This invention has achieved complete integration of high temperature, erosive, corrosive working environment for thermal barrier coating and complete integration static or dynamic working environment, complete integration of simulated working environment and real-time testing, thus providing a crucial testing platform and reference data to properly understand the failure mechanism of thermal barrier coated blade and to improve relevant designs; strong applicability. | 12-10-2015 |
20160097685 | Method, system, and apparatus to prevent arc faults in electrical connectivity - A system for protection from fires and electrical shock of components used in construction of electrical systems is disclosed using a sensing degree of characteristic before an arc fault, with the purpose to detect, annunciate, and remove the hazard before an electrical arc occurs. | 04-07-2016 |
20160161384 | DEVICE AND METHOD FOR STORING SAMPLE BODIES - A storage device ( | 06-09-2016 |
20160187247 | DEVICES AND METHODS FOR CONDUCTING ACCELERATED AGING TESTS OF A COATING WITH SEVERAL TYPES OF STRESSES - A device for conducting accelerated aging tests of a coating, notably an outer coating for an aircraft, in particular allowing the testing of the durability of the coating after having been subject to all kinds of stresses, is desired. An object of the disclosure thus relates to such a device including test chambers subject to different and/or independently controllable test parameters, and including light for generating photo-oxidation, the device including a support for a sample of the coating, displaceable between the chambers for generating mechanical stresses by thermal shocks. The disclosure herein finds applications in many fields of industry, and preferentially in the field of aeronautics. | 06-30-2016 |
20170234849 | DETECTION OF THERMAL DAMAGE OF COMPOSITES USING MOLECULAR PROBES | 08-17-2017 |
20180024028 | HEAT EXCHANGER TESTING DEVICE | 01-25-2018 |