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READ/WRITE CIRCUIT

Subclass of:

365 - Static information storage and retrieval

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
365191000 Signals 611
365189050 Having particular data buffer or latch 417
365203000 Precharge 250
365201000 Testing 239
365200000 Bad bit 233
365207000 Differential sensing 204
365222000 Data refresh 184
365189090 Including reference or bias voltage generator 176
365189070 Including signal comparison 171
365189150 Particular read circuit 133
365189110 Including level shift or pull-up circuit 129
365189160 Particular write circuit 118
365189020 Multiplexing 89
365189140 Common read and write circuit 71
365205000 Flip-flop used for sensing 70
365225700 Having fuse element 67
365189170 Data transfer circuit 46
365189060 Including signal clamping 28
365218000 Erase 27
365189040 Simultaneous operations (e.g., read/write) 26
365189200 Using different memory types 18
365189030 Plural use of terminal 16
365189080 Including specified plural element logic arrangement 16
365206000 Noise suppression 15
365190000 For complementary information 13
365219000 SiPo/PiSo 13
365189180 Bidirectional bus 8
365189120 With shift register 8
365221000 Serial read/write 6
365215000 Optical 4
20090010089APPARATUS AND METHOD TO STORE INFORMATION IN A HOLOGRAPHIC DATA STORAGE MEDIUM - A method is disclosed to store information in a holographic data storage medium. The method supplies a holographic data storage medium and provides information. The method defines an Active storage portion for the holographic data storage medium and establishes a threshold access interval. The method determines if the information was last accessed within the threshold access interval. If the information was last accessed within said threshold access interval, the method then stores that information as one or more holograms encoded in said Active storage portion of the holographic data storage medium.01-08-2009
20090175110Non-volatile memory element and method of operation therefor - A very small magnetic tunnel junction is formed on a semiconductor p-i-n diode. Spin-polarized current which is generated by circular polarized light or elliptically-polarized light, is injected into a free layer of the magnetic tunnel junction so that magnetization direction (two opposite directions) in the free layer is changed based on the information, whereby information is stored in the memory element.07-09-2009
20120063253OPTICAL MEMORY DEVICE AND METHOD OF RECORDING/REPRODUCING INFORMATION BY USING THE SAME - An optical memory device and a method of recording/reproducing information by using the optical memory device. The optical memory device includes a substrate; a first barrier layer formed on the substrate; a quantum well layer; a second barrier layer; a quantum dot layer; and a third barrier layer. The quantum well layer has an energy band gap which is wider than that of the quantum dot layer, and the second barrier layer has an energy band gap which is wider than that of the quantum well layer, so that electrons in excitons which are generated in the quantum dot layer by light of a certain wavelength are captured by the quantum well layer to record information, and then, recorded information may be erased or reproduced by irradiating light of a certain wavelength to the optical memory device.03-15-2012
20110038221SEMICONDUCTOR MEMORY DEVICES, CONTROLLERS, AND SEMICONDUCTOR MEMORY SYSTEMS - A semiconductor memory system includes a controller and a memory device that are optical-interconnected. The controller includes a control logic configured to generate a control signal for controlling the memory device and a transmitter configured to convert the control signal into an optical signal, and output the optical signal. The memory device includes a receiving unit filter configured to convert the optical signal into an electric signal, and the electric signal based on a supply voltage corresponding to a period of the optical signal or the electric signal.02-17-2011
365202000 Complementing/balancing 4
20110267912DIGIT LINE EQUILIBRATION USING ACCESS DEVICES AT THE EDGE OF SUB ARRAYS - A method of equilibrating digit lines, a memory array, device, system and wafer for digit lines configured in an open digit line architecture. The digit lines are equilibrated by coupling a terminated end of a first digit line to an equilibration reference and coupling an unterminated end of a second digit line to the terminated end of the first digit line. The memory array is configured with the first and second digit lines arranged directly adjacent to each other.11-03-2011
20100322025DIGIT LINE EQUILIBRATION USING ACCESS DEVICES AT THE EDGE OF SUB-ARRAYS - A method of equilibrating digit lines, a memory array, device, system and wafer for digit lines configured in an open digit line architecture. The digit lines are equilibrated by coupling a terminated end of a first digit line to an equilibration reference and coupling an unterminated end of a second digit line to the terminated end of the first digit line. The memory array is configured with the first and second digit lines arranged directly adjacent to each other.12-23-2010
20090080274MEMORY CONTROL CIRCUIT AND SEMICONDUCTOR DEVICE - A semiconductor device includes plural switching transistors configured to perform trimming for characteristic adjustment of the semiconductor device, and a nonvolatile memory connected to the plural switching transistors and configured to store data for determining ON and OFF of the plural switching transistors. When the semiconductor device is in operation, ON and OFF of the switching transistors are determined by the data.03-26-2009
20120250439Degradation Equalization for a Memory - In an embodiment, an integrated circuit includes a memory and a control circuit configured to cause an inversion of at least a portion of the data stored in the memory to more evenly balance the amount of time that a given memory cell in the memory stores a binary one or a binary zero. In some implementations, the inversion may be controlled for the memory as a whole via a global indication. In other implementations, data may be inverted on a row-by-row or column-by-column basis. In other embodiments, the global indication may be changed at each boot of a device including the integrated circuit.10-04-2012
365220000 Parallel read/write 4
20100054069MEMORY SYSTEM - The present invention provides a memory system which contributes to improvement in efficiency of a data process accompanying a memory access. A memory system has a rewritable nonvolatile memory, a buffer memory, and a controller. The controller controls, in response to an access request from an external apparatus, first data transfer between the controller and the external apparatus, second data transfer between the controller and the nonvolatile memory, and third data transfer between the controller and the buffer memory, controls transfer from the controller to the buffer memory in the third data transfer and transfer from the buffer memory to the controller in a time sharing manner, and enables the first data transfer or the second data transfer to be performed in parallel with the transfer carried out in the time sharing manner.03-04-2010
20090185442MEMORY SYSTEM AND METHOD WITH SERIAL AND PARALLEL MODES - Methods and systems are provided that allow the method of access to one or more memory banks to be performed using serial access, or using parallel access. In serial mode, each link operates as an independent serial link. In contrast, during serial mode, the links operate in common as a parallel link. Where input and output controls are received independently for each link for serial mode, a single set of input and output controls is used in common by all of the links during parallel mode.07-23-2009
20090027988Memory device, memory controller and memory system - An image memory, image memory system, and memory controller that are capable of efficiently accessing a rectangular area of two-dimensionally arrayed data are provided. The memory device has: a memory cell array that has a plurality of memory unit areas, each of which is selected by addresses; a plurality of input/output terminals; and an input/output unit provided between the memory cell array and the plurality of input/output terminals. Each of the memory unit areas stores therein data of a plurality of bytes or bits corresponding to the plurality of input/output terminals respectively, and the memory cell array and the input/output unit access a plurality of bytes or bits stored in a first memory unit area corresponding to the input address and in a second memory unit area adjacent to the first memory unit on the basis of the input address and combination information of the bytes or bits in response to a first operation code, and then, from the plurality of bytes or bits within the accessed first and second memory unit areas, associate a combination of the plurality of bytes or bits based on the combination information, with the plurality of input/output terminals.01-29-2009
20080219074Abbreviated Burst Data Transfers for Semiconductor Memory - An integrated circuit having a nominal minimum burst length defined by a nominal data prefetch size transfers data by accepting an abbreviated burst data read request directed to a first bank, prefetching less than the nominal data prefetch size, and providing the data in an abbreviated burst data transfer less than the nominal minimum burst length.09-11-2008
365204000 Accelerating charge or discharge 2
20120182819RECYCLING CHARGES - A circuit includes a first node; a second node; a first PMOS transistor having a source coupled to the first node, a drain coupled to a first control transistor, and a gate driven by a first voltage; and a first NMOS transistor having a source coupled to the second node, a drain coupled to the first control transistor, and a gate driven by a second voltage. The first PMOS transistor is configured to automatically turn off based on the first voltage and a first node voltage at the first node. The first NMOS transistor is configured to automatically turn off based on the second voltage and a second node voltage at the second node. When the first PMOS transistor, the control transistor, and the first NMOS transistor are on, the first node voltage is lowered while the second voltage is raised.07-19-2012
20110286293METHOD OF FORMING A UNIQUE NUMBER - A unique number is formed with logic states from a static random access memory (SRAM), which is laid out to be balanced so that memory cells within the SRAM assume a non-random logic state when power is applied to the SRAM. The unique number is formed by grounding the word lines and bit lines before power is applied to the memory cells, applying power to the memory cells to assume the non-random logic state, reading the non-random logic states held by the memory cells, and forming the unique number from the logic states read from the memory cells.11-24-2011
365223000 Bridge 1
20080266993Serial connection external interface from printed circuit board translation to parallel memory protocol - A translator of an apparatus in an example through a serial connection external interface of a printed circuit board (PCB) communicates between a serial memory protocol within the PCB and a parallel memory protocol outside the PCB.10-30-2008
365225500 Including magnetic element 1
20110149670Spin valve device including graphene, method of manufacturing the same, and magnetic device including the spin valve device - Provided are a spin valve device including graphene, a method of manufacturing the spin valve device, and a magnetic device including the spin valve device. The spin valve device may include at least one of a graphene sheet or a hexagonal boron nitride (h-BN) sheet between a lower magnetic layer and an upper magnetic layer. The graphene sheet may have a single layer structure or a multilayer structure. The spin valve device may further include a spacer between the lower magnetic layer and the graphene sheet. The spin valve device may further include a spacer between the graphene sheet and the upper magnetic layer.06-23-2011
Entries
DocumentTitleDate
20110280089DATA BUS POWER-REDUCED SEMICONDUCTOR STORAGE APPARATUS - In one or more of the disclosed embodiments, the number of times toggle operations of a data bus are performed at the time of a data transmission in a semiconductor storage apparatus is reduced, thereby reducing the power consumption. For example, a semiconductor storage apparatus according to one embodiment of the present invention comprises a DRF bus, a DR11F bus, a GDRF bus and a GDR11F bus. The DRF bus and DR11F bus, and the GDRF bus and GDR11F bus, are placed in parallel for the purpose of reducing the number of times toggle operations of a data bus are performed at the time of a data transmission. The DR11F bus is added to make the DRF11F bus perform a toggle operation only when the DRF buses on both sides are made to perform a toggle operation if the data transmission were performed in a conventional system.11-17-2011
20130028030PROGRAMMABLE KEEPER FOR SEMICONDUCTOR MEMORIES - A method includes receiving a memory code identifying a number of logic zeroes and logic ones to be stored in a semiconductor memory, determining a number of bit cells of a first type that are to be coupled to a first bit line of the semiconductor memory from the memory code, and selecting a first keeper circuit from a plurality of keeper circuits based on the number of bit cells of the first type that are to be coupled to the first bit line. An electronic representation of a layout of the semiconductor memory is stored in a non-volatile machine readable storage medium.01-31-2013
20110194363SEMICONDUCTOR MEMORY CELL AND ARRAY USING PUNCH-THROUGH TO PROGRAM AND READ SAME - An integrated circuit device (for example, logic or discrete memory device) comprising a memory cell including a punch-through mode transistor, wherein the transistor includes a source region, a drain region, a gate, a gate insulator, and a body region having a storage node which is located, at least in part, immediately beneath the gate insulator. The memory cell includes at least two data states which are representative of an amount of charge in the storage node in the body region. First circuitry is coupled to the punch-through mode transistor of the memory cell to: (1) generate first and second sets of write control signals, and (2a) apply the first set of write control signals to the transistor to write a first data state in the memory cell and (2b) apply the second set of write control signals to the transistor to write a second data state in the memory cell. In response to the first set of write control signals, the punch-through mode transistor provides at least the first charge in the body region via impact ionization. The transistor may be disposed on a bulk-type substrate or SOI-type substrate.08-11-2011
20130083610ENERGY EFFICIENT MEMORY WITH RECONFIGURABLE DECODING - A sacrificial memory bank is added to a block of regular banks in a memory to reduce dynamic power consumption of the memory. The sacrificial bank is accessed by a set of bit lines that is substantially shorter than corresponding bit lines extending through all of the regular memory banks. Memory read and write operations, which are addressed to one of the regular banks, are deliberately redirected to the sacrificial bank having the short bit lines. Tracking circuitry identifies the regular bank that was addressed for each location in the sacrificial bank. Data is moved from the sacrificial bank to a regular bank only when a new write operation does not match the bank of the previous write operation. Dynamic power is reduced because locality of reference causes access to the sacrificial bank without having to access a regular bank for most memory read and write operations.04-04-2013
20130051162CODED DIFFERENTIAL INTERSYMBOL INTERFERENCE REDUCTION - Encoder and decoder circuits that encode and decode a series of data words to/from a series of code words. The data words include L symbols. The code words include M symbols, where M is larger than L. A set of tightly coupled M links to convey respective symbols in each of the series of code words. The code words are selected such that between every two consecutive code words in a series of code words, an equal number of transitions from low to high and high to low occur on a subset of the M-links.02-28-2013
20090303805SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device has a nonvolatile memory cell to which data writing operation is limited to a predetermined logic value. In the case of rewriting data “10101010” written in a first memory core to data “01010101”, since the data writing operation includes writing of a logic value “1” opposite to the predetermined logic value, an erasing operation is needed and the data writing is regulated. By rewriting a pointer value stored in a pointer memory in place of performing the erasing operation, an operation of switching a memory core to be selected to a second memory core (data “11111111”) is performed. Data is newly written into the second memory core selected by the rewritten pointer value.12-10-2009
20090040839READING MULTI-CELL MEMORY DEVICES UTILIZING COMPLEMENTARY BIT INFORMATION - Providing differentiation between overlapping memory cell bits in multi-cell memory devices is described herein. By way of example, select groups of memory cells of the multi-cell memory devices can be iteratively disabled to render state distributions of remaining, non-disabled memory cells, non-overlapped. System components can measure distributions rendered non-overlapped to uniquely identify states of such distributions. Identified state distributions can subsequently be disabled to render other state distributions non-overlapped, and therefore identifiable. In such a manner, read errors associated with overlapped bit states of multi-cell memory devices can be mitigated.02-12-2009
20090091990Apparatus and method of multi-bit programming - Disclosed are a multi-bit programming apparatus and a multi-bit programming method. The multi-bit programming apparatus may include a first control unit that may generates 204-09-2009
20130058173SEMICONDUCTOR APPARATUS - A semiconductor apparatus according to an aspect of the present invention includes first and second bus-interface circuits, a mode information storage unit that stores first and second mode information, the first and second mode information being able to be set through the first bus-interface circuit, a first memory core that operates based on the first mode information, the first memory core being connected to the first bus-interface circuit and supplied with a first clock signal, a second memory core, the second memory core being supplied with a second clock signal and a select circuit that selectively connects the second memory core to the first or second bus-interface circuit based on predetermined switching information, in which the second memory core operates based on the second mode information when the second memory core is connected to the second bus-interface circuit.03-07-2013
20130064022Method and Apparatus for Memory Access - An interleaver or deinterleaver comprises a memory having M logical memory units arranged in groups of N memory units such that accesses to memory units within a group are faster after a first access to a memory in that group using first access. An address generator is arranged to write consecutive data items a number of memory units apart that is less than the size of groups N of memory units so that two or more data items are written within groups. The arrangement provides fast interleaving without increasing memory size.03-14-2013
20090238012CONTROLLING SLEW RATE PERFORMANCE ACROSS DIFFERENT OUTPUT DRIVER IMPEDANCES - Embodiments are provided including one directed to an output driver system, having an adjustable pre-driver configured to maintain a generally constant slew rate of an output driver across a plurality of output driver impedances. Other embodiments provide a method of operating a memory device, including determining an output driver strength of an output driver and configuring the pre-driver based on the determined output driver strength.09-24-2009
20120113730RAM MEMORY ELEMENT WITH ONE TRANSISTOR - A memory element includes a MOS transistor having a drain, a source and a body region covered by an insulated gate, wherein the thickness of the body region is divided into two distinct regions separated by a portion of an insulating layer extending parallel to the plane of the gate.05-10-2012
20080291751SCR MATRIX STORAGE DEVICE - One of the simplest forms of data storage devices is the diode array storage device. However, a problem with diode array storage devices is that as the size of the array increases, the number of non-addressed diodes connected between a given selected row or column of the array and the non-addressed columns or rows of the array, respectively, also becomes very large. While the leakage current through any one non-addressed diode on the selected row or column will have little impact on the operation of the device, the cumulative leakage through multiple thousands of non-addressed diodes can become significant. This aggregate leakage current can become great enough that the output voltage can be shifted such that the threshold for distinguishing between a one state and a zero state of the addressed diode location can become obscured and can result in a misreading of the addressed diode location. The present invention is a means to manage the leakage currents in a diode array storage device. This is accomplished by actively changing the forward voltage of the diodes in the storage array such that a diode connected to the selected row line but that is not connected to the selected column line is in its high impedance state and a diode connected to the selected column line but that is not connected to the selected row line is in its high impedance state; only a diode that is connected to both the selected row line and the selected column line will switch to its low impedance state. The present invention is an enhancement to all types of arrays of diodes or arrays of other nonlinear conducting elements including: storage devices, programmable logic devices, display arrays, sensor arrays, and many others.11-27-2008
20120081976SEMICONDUCTOR MEMORY DEVICE HAVING AN ELECTRICALLY FLOATING BODY TRANSISTOR - A method for performing a holding operation to a semiconductor memory array having rows and columns of memory cells, includes: applying an electrical signal to buried regions of the memory cells, wherein each of the memory cells comprises a floating body region defining at least a portion of a surface of the memory cell, the floating body region having a first conductivity type; and wherein the buried region of each memory cell is located within the memory cell and located adjacent to the floating body region, the buried region having a second conductivity type.04-05-2012
20110286290DRIVING METHOD OF SEMICONDUCTOR DEVICE - A period (inverted period) in which a high negative potential is applied to a gate of the transistor is provided between a writing period and a retention period. In the inverted period, supply of positive electric charge from the drain of the transistor to the oxide semiconductor layer is promoted. Thus, accumulation of positive electric charge in the oxide semiconductor layer or at the interface between the oxide semiconductor layer and a gate insulating film can converge in a short time. Therefore, it is possible to suppress a decrease in the positive electric charge in the node electrically connected to the drain of the transistor in the retention period after the inverted period. That is, the temporal change of data stored in the semiconductor device can be suppressed.11-24-2011
20130163349PROGRAMMING PULSE GENERATION CIRCUIT AND NON-VOLATILE MEMORY APPARATUS HAVING THE SAME - A program pulse generation circuit includes: a set pulse generator configured to apply a set pulse to an output node in response to a driving signal, a set pulse control signal, and a first switching signal, and a current controller configured to control step reductions forming the set pulse in response to the driving signal and a second switching signal.06-27-2013
20120002490SEMICONDUCTOR STORAGE DEVICE - According to the embodiments, a semiconductor storage device includes a memory cell array, a plurality of word lines, a plurality of bit lines, and a row selector that multiply-selects the word lines, wherein the semiconductor storage device satisfies N01-05-2012
20110299345Early Read After Write Operation Memory Device, System And Method - A memory device, system and method for allowing an early read operation after one or more write operations is provided according to an embodiment of the present invention. The memory device comprises an interface for providing a first write address, a first write data, and a read address. A memory core is coupled to the interface and includes a first memory section having a first data path and a first address path and a second memory section having a second data path and a second address path. In an embodiment of the present invention, the first data and first address path is independent of the second data and second address path. The first write data is provided on the first data path responsive to the first write address being provided on the first address path while a read data is provided on the second data path responsive to the read address being provided on the second address path.12-08-2011
20100091586TECHNIQUES FOR SIMULTANEOUSLY DRIVING A PLURALITY OF SOURCE LINES - Techniques for simultaneously driving a plurality of source lines are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for simultaneously driving a plurality of source lines. The apparatus may include a plurality of source lines coupled to a single source line driver. The apparatus may also include a plurality of dynamic random access memory cells arranged in an array of rows and columns, each dynamic random access memory cell including one or more memory transistors. Each of the one or more memory transistors may include a first region coupled to a first source line of the plurality of source lines, a second region coupled to a bit line, a body region disposed between the first region and the second region, wherein the body region may be electrically floating, and a gate coupled to a word line and spaced apart from, and capacitively coupled to, the body region.04-15-2010
20100277991SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell having a circuit configuration in which a potential supplied to sources of load transistors 11-04-2010
20120294097SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF - A semiconductor memory device includes a plurality of wordlines and a driver configured to, when an wordline of the plurality of wordlines is activated by an active command, drive at least one non-activated wordline neighboring the activated wordline and remaining non-activated wordlines with different wordline driving voltage levels during a period of time that the activated wordline is driven to a high voltage level.11-22-2012
20080304338SEMICONDUCTOR MEMORY DEVICE - To provide a semiconductor memory device capable of increasing its drive capability at operating time while reducing a leak current at standby time without the s need to make a significant change to the design of an existing semiconductor memory device a semiconductor memory device having a memory cell comprises: a latch section that includes a transistor having a back gate to which a back gate voltage is supplied; a memory cell that includes a transfer gate constituting the memory cell the transfer gate being subjected to switching control by a word line signal and having a lo back gate to which a back gate voltage is supplied; and a back gate voltage control circuit that controls the back gate voltage based on an address signal.12-11-2008
20090262589SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR OPERATING THE SAME - A semiconductor memory device and a method for operating the same can improve a refresh characteristic of the semiconductor memory device by physically writing only logic low data in memory cells, irrespective of logic level of input data, either high or low. The semiconductor memory device includes a positive word line configured to control a first memory cell connected to a positive bit line, a negative word line configured to control a second memory cell connected to a negative bit line, and a word line control circuit configured to enable one of the positive word line and the negative word line according to a logic level of data in a write operation.10-22-2009
20090296498Memory access method and semiconductor memory device - A semiconductor memory device includes a memory cell array provided with blocks each having a plurality of memory cells arranged in columns and rows, a column selection circuit selecting a column via bit lines based on a column section signal, a word line driver circuit selecting a row via a word line based on a row selection signal and the column selection signal, and a write/read circuit writing data to and reading data from a selected memory cell via the bit lines based on a write and read switching signal. The selected memory cell is arranged at a position determined by the column selected by the column selection circuit and the row selected by the word line driver circuit within one block. Rows corresponding to the blocks are provided in common with the same number of word lines as the columns, and the memory cells arranged in one row within one block are coupled to mutually different word lines.12-03-2009
20110205816Vertical type semiconductor device, method of manufacturing a vertical type semiconductor device and method of operating a vertical semiconductor device - A vertical pillar semiconductor device includes a substrate, a single crystalline semiconductor pattern, a gate insulation layer structure and a gate electrode. The substrate may include a first impurity region. The single crystalline semiconductor pattern may be on the first impurity region. The single crystalline semiconductor pattern has a pillar shape substantially perpendicular to the substrate. A second impurity region may be formed in an upper portion of the single crystalline semiconductor pattern. The gate insulation layer structure may include a charge storage pattern, the gate insulation layer structure on a sidewall of the single crystalline semiconductor pattern. The gate electrode may be formed on the gate insulation layer structure and opposite the sidewall of the single crystalline semiconductor pattern. The gate electrode has an upper face substantially lower than that of the single crystalline semiconductor pattern.08-25-2011
20090141565SEMICONDUCTOR STORAGE DEVICE - A bit line potential monitor circuit is provided in a bit line, and a step-down circuit of the bit line is controlled base on information from the monitor circuit. As a result, the bit line is easily stepped down to an optimal potential level in accordance with a potential and a load capacity thereof without being affected by variability in devices or operation conditions.06-04-2009
20110222356TECHNIQUES FOR PROVIDING A SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell including a first region, a a second region, and a body region capacitively coupled to at least one word line and disposed between the first region and the second region. Each memory cell also including a third region, wherein the third region may be doped differently than the first region, the second region, and the body region.09-15-2011
20100157696SEMICONDUCTOR MEMORY APPARATUS AND A METHOD FOR READING DATA STORED THEREIN - A semiconductor memory apparatus includes a data bus inversion (DBI) section configured to receive a plurality of input data and decide whether to invert or output, without an inversion, the plurality of input data depending upon logic levels of the plurality of data, and further configured to generate a plurality of inversion data based on the decision; and a data output section configured to receive the plurality of inversion data, invert or output, without an inversion the plurality of inversion data in response to a mode signal, and generate a plurality of output data.06-24-2010
20100188908Setting Memory Device VREF in a Memory Controller and Memory Device Interface in a Communication Bus - A memory device is connected through an interface to a memory controller. The memory device's reference voltage is set based on a driver's impedance of the memory device and the controller driver drive strength during driver training. The voltage is applied to a reference resistor pair at the memory device and changed until the voltage level switches. The voltage is then set at the reference resistor pair of the memory device.07-29-2010
20090316499Semiconductor memory device operational processing device and storage system - A thin film magnetic memory includes a size-variable Read Only Memory (ROM) region and a size-variable Random Access Memory (RAM) coupled to different ports for parallel access to the ports, respectively. A memory system allowing fast and efficient data transfer can be achieved.12-24-2009
20100226186PARTIAL WRITE-BACK IN READ AND WRITE-BACK OF A MEMORY - An integrated circuit having a functional memory and methods of operating and reducing an operating power of the integrated circuit are provided. The functional memory includes an array of memory cells connected to row and column periphery units and organized in corresponding rows and columns. The memory also includes a word line that provides row access to a memory cell. The memory further includes at least one bit line that provides column access to the memory cell. The memory still further includes a partial write-back module, connected to the at least one bit line, that establishes a bit line bias to maintain a current state of the memory cell when in a half-selected condition based on a read of the current state and during a write cycle to a selected memory cell in the array.09-09-2010
20100246285METHODS, DEVICES, AND SYSTEMS RELATING TO A MEMORY CELL HAVING A FLOATING BODY - Methods, devices, and systems are disclosed for a memory cell having a floating body. A memory cell may include a transistor over an insulation layer and including a source, and a drain. The memory cell may also include a floating body including a first region positioned between the source and the drain, a second region positioned remote from each of the source and drain, and a passage and extending through the insulation layer and coupling the first region to the second region. Additionally, the memory cell includes a bias gate at least partially surrounding the second region and configured for operably coupling to a bias voltage. Furthermore, the memory cell may include a plurality of dielectric layers, wherein each outer vertical surface of the second region has a dielectric layer of the plurality adjacent thereto.09-30-2010
20090073784MULTI-LEVEL MEMORY CELL UTILIZING MEASUREMENT TIME DELAY AS THE CHARACTERISTIC PARAMETER FOR LEVEL DEFINITION - A memory array and computer program product for operating a memory cell and memory array. An embodiment of the invention entails receiving a binary value to be stored by a memory cell. A determining operation determines a target discharge time corresponding to the binary value. The target discharge time being the time needed to discharge a pre-charged circuit through the said memory cell to a predetermined level. A storing operation stores a characteristic parameter in the memory cell such that an electron discharge time through an electronic circuit formed, at least partially, by the memory cell, is substantially equal to the target discharge time.03-19-2009
20090073783MULTI-LEVEL MEMORY CELL UTILIZING MEASUREMENT TIME DELAY AS THE CHARACTERISTIC PARAMETER FOR LEVEL DEFINITION - A memory array and computer program product for operating a memory cell and memory array. An embodiment of the invention entails receiving a request to read a binary value stored in the memory cell. A pre-charging operation pre-charges a bit-line capacitor in an electronic circuit formed by the memory cell to a pre-charge voltage. A word-line in the electronic circuit is then activated. A discharging operation discharges the bit-line capacitor through the said memory cell in the electronic circuit to the word-line. Additionally, an electron discharge time measurement is started when the word-line is activated. The electron discharge time measurement is stopped when the voltage level in the bit-line falls below a pre-defined reference voltage. A determining operation determines the binary value from the measured electron discharge time.03-19-2009
20090109765Single via structured IC device - A configurable logic array may include a multiplicity of logic components, which may contain customizable look-up tables, and layers of fixed metal segments all of which may be customizable using a single custom via layer. The integrated circuit containing the configurable logic array may also include a multiplicity of customizable register files, customizable RAM blocks; a ROM block with customizable contents; or test logic With customizable test options and configurations to separately test logic and the PLLs.04-30-2009
20100309736SRAM WITH READ AND WRITE ASSIST - A memory includes an SRAM bitcell including a pair of cross-coupled inverters, wherein a first inverter of the pair includes a first device having a body and a second inverter of the pair includes a second device having a body. A first selection circuit has a first input coupled to a first supply voltage terminal, a second input coupled to a second supply voltage terminal, and an output coupled to a first current electrode of the first device and to a first current electrode of the second device. A second selection circuit has a first input coupled to the first supply voltage terminal, a second input coupled to the second supply voltage terminal, and an output coupled to the body of each of the first and second devices. A word line coupled to the SRAM bitcell is driven by a word line driver coupled to the first supply voltage terminal.12-09-2010
20120230128Integrated Circuitry, Switches, and Methods of Selecting Memory Cells of a Memory Device - Some embodiments include switches that have a graphene structure connected to a pair of spaced-apart electrodes. The switches may further include first and second electrically conductive structures on opposing sides of the graphene structure from one another. The first structure may extend from one of the electrodes, and the second structure may extend from the other of the electrodes. Some embodiments include the above-described switches utilized as select devices in memory devices. Some embodiments include methods of selecting memory cells.09-13-2012
20100142290OUTPUT CIRCUIT FOR A SEMICONDUCTOR MEMORY DEVICE AND DATA OUTPUT METHOD - An outputting transistor circuit of a push-pull structure has an outputting PMOS transistor and an outputting NMOS transistor connected in series between a first power supply and a grounded power supply. In a standby state, a voltage level of a gate terminal of the outputting PMOS transistor is set to a voltage level of a second power supply higher than a voltage level of the first power supply. In an active state, a voltage level of the gate terminal of the outputting PMOS transistor is changed to a voltage level of the first power supply in response to an active command or a read command, or in response to the state of a semiconductor memory device changing to the active state or a read state, and either the outputting PMOS transistor or the outputting NMOS transistor is turned ON in response to a data read signal from a memory cell.06-10-2010
20100054053Integrated Circuit Memory Devices Including Mode Registers Set Using A Data Input/Output Bus - An integrated circuit memory device may include a memory cell array and a plurality of data input/output pins. The plurality of data input/output pins may be configured to receive data from a memory controller to be written to the memory cell array during a data write operation, and the data input/output pins may be further configured to provide data to the memory controller from the memory cell array during a data read operation. A mode register may be configured to store information defining an operational characteristic of the memory device, and the mode register may be configured to be set using the data input/output bus. Related methods, systems, and additional devices are also discussed.03-04-2010
20120243345OUTPUT DRIVER CIRCUIT, OUTPUT DRIVER SYSTEM AND SEMICONDUCTOR MEMORY DEVICE - The output driver circuit includes a plurality of pull-up sub-drivers that pull up a voltage at the output terminal according to a pull-up signal based on the output data. The output driver circuit includes a plurality of pull-down sub-drivers that pull down the voltage at the output terminal according to a pull-down signal based on the output data. Selection from among the pull-up sub-drivers is made by an assigned pull-up calibration signal and selection from among the pull-down sub-drivers by an assigned pull-down calibration signal so as to make a pull-up current drivability and a pull-down current drivability for the voltage at the output terminal equal. A timing of turning on of the pull-up sub-drivers is calibrated by the pull-down calibration signal. A timing of turning on of the pull-down sub-drivers is calibrated by the pull-up calibration signal.09-27-2012
20100208530Two Bits Per Cell Non-Volatile Memory Architecture - A memory circuit for holding a single binary value. A first bit cell holds one of a logical high value and a logical low value, and a second bit cell also holds one of a logical high value and a logical low value. Circuitry is provided for placing a logical high value in the first bit cell when the binary value in the memory circuit is to be a logical high value, and circuitry is provided for placing a logical high value in the second bit cell when the binary value in the memory circuit is to be a logical low value. In this manner, a logical high value exists within the memory circuit, whether the single binary value within the memory circuit is a logical high value or a logical low value. The difference between the two values of the binary value is which of the two bit cells holds the logical high value. Thus, this memory circuit can be sensed without the use of a sense amplifier.08-19-2010
20100128541INTEGRATED CIRCUIT HAVING MEMORY WITH CONFIGURABLE READ/WRITE OPERATIONS AND METHOD THEREFOR - An integrated circuit having a memory and a method for operating the memory are provided. The method for operating the memory comprises: accessing a first portion of the memory, the first portion having a first access margin; detecting an error in the first portion of the memory; changing the first access margin to a second access margin, the second access margin being different than the first access margin; determining that the error is corrected with the first portion having the second access margin; and storing an access assist bit in a first storage element, the access assist bit corresponding to the first portion, wherein the assist bit, when set, indicates that subsequent accesses to the first portion are accomplished at the second access margin.05-27-2010
20090213668ADJUSTABLE PIPELINE IN A MEMORY CIRCUIT - A technique for operating a memory circuit that improves performance of the memory circuit and/or power consumption for at least some operating points of the memory circuit includes adjusting a number of operational pipeline stages at least partially based on an operating point of the memory. In at least one embodiment of the invention, a method for operating a memory circuit includes selecting a mode of operating the memory circuit at least partially based on a feedback signal generated by the memory circuit. The technique includes operating the memory circuit using a number of pipeline stages based on the selected mode of operation of the memory circuit. In at least one embodiment of the invention, the technique includes sensing a timing margin associated with an individual pipeline stage and generating the feedback signal based thereon.08-27-2009
20110069564SEMICONDUCTOR DEVICE AND METHOD OF CONTROLLING THE SAME - A semiconductor device may include, but is not limited to: a first insulating film; first and second impurity layers on the first insulating film; a semiconductor layer on the first insulating film; a second insulating film covering the semiconductor layer; a first electrode on the second insulating film over the semiconductor layer; and a second electrode on the second insulating film over the semiconductor layer. The first and second impurity layers have a first conductive type. The first impurity layer is separated from the second impurity layer. The semiconductor layer is positioned between the first and second impurity layers. The semiconductor layer has a second conductive type which is different from the first conductive type. The first electrode is electrically insulated from the second electrode. The second electrode at least partially overlaps the first electrode in plan view.03-24-2011
20110002178VERTICAL NON-VOLATILE MEMORY DEVICE, METHOD OF FABRICATING THE SAME DEVICE, AND ELECTRIC-ELECTRONIC SYSTEM HAVING THE SAME DEVICE - Provided is a vertical non-volatile memory device having a metal source line. The vertical non-volatile memory device includes cell string units that are formed on first portions of a semiconductor substrate and are vertically arranged with respect to a surface of the semiconductor substrate, impurity regions formed on second portions of the semiconductor substrate between the cell string units, conductive lines formed on the impurity regions, and spacers that are formed on the sidewalls of the cell string units and insulate the conductive lines from the cells string units.01-06-2011
20100277990INTEGRATED CIRCUIT HAVING MEMORY REPAIR INFORMATION STORAGE AND METHOD THEREFOR - A storage unit on an integrated circuit stores information that identifies a circuit on the integrated circuit, a selected operating condition, and a required operating configuration for the circuit for the selected operating condition. The manner of operating the circuit is changed to the required operating configuration in response to an operating condition of the circuit changing to the selected operating condition. This allows for efficiently identifying the few circuits that do not meet specified requirements based on a reduction in, for example, operating voltage, and altering their operation in order to meet the specified requirements relative to the reduced operating voltage without having to do so for the vast majority of the circuits that are able to meet the requirements at the lowered operating voltage.11-04-2010
20110211399METHOD OF MANUFACTURING A VERTICAL-TYPE SEMICONDUCTOR DEVICE AND METHOD OF OPERATING A VERTICAL-TYPE SEMICONDUCTOR DEVICE - In a vertical-type semiconductor device, a method of manufacturing the same and a method of operating the same, the vertical-type semiconductor device includes a single-crystalline semiconductor pattern having a pillar shape provided on a substrate, a gate surrounding sidewalls of the single-crystalline semiconductor pattern and having an upper surface lower than an upper surface of the single-crystalline semiconductor pattern, a mask pattern formed on the upper surface of the gate, the mask pattern having an upper surface coplanar with the upper surface of the single-crystalline semiconductor pattern, a first impurity region in the substrate under the single-crystalline semiconductor pattern, and a second impurity region under the upper surface of the single-crystalline semiconductor pattern. The vertical-type pillar transistor formed in the single-crystalline semiconductor pattern may provide excellent electrical properties. The mask pattern is not provided on the upper surface of the single-crystalline semiconductor pattern in the second impurity region, to thereby reduce failures of processes.09-01-2011
20090021991MEMORY DEVICE, CONTROL METHOD FOR THE SAME, CONTROL PROGRAM FOR THE SAME, MEMORY CARD, CIRCUIT BOARD AND ELECTRONIC EQUIPMENT - A memory device having a single or a plurality of memory chips includes a memory part (control register, SPD memory unit) inside each memory chip, which memory part stores control data concerning the memory chip. The memory device enables writing-in or readout of the control data stored on the memory part to be able to set any desired control data for each memory chip, and, when the memory device has the plurality of memory chips, enables separate use of each of the memory chips.01-22-2009
20100329043Two-Transistor Floating-Body Dynamic Memory Cell - Embodiments relate to a two-transistor (2T) floating-body cell (FBC) for embedded-DRAM applications. Further embodiments pertain to a floating-body/gate cell (FBGC), which yields reduction in power dissipation, in addition to better signal margin, longer data retention, and higher memory density.12-30-2010
20110019488DOUBLE-GATE FLOATING-BODY MEMORY DEVICE - A memory device is provided comprising a transistor having a floating body positioned between source and drain regions, the floating body being sandwiched between first and second insulated gates each comprising a gate electrode. A control circuit is arranged to program the state of said floating body to have an accumulation or depletion of majority carriers by applying one of first and second voltage levels between the first gate and at least one of the source and drain regions, and to retain the programmed state of said floating body by applying a third voltage level to the second gate. The voltages are switched over a time duration shorter than 100 ns.01-27-2011
20100067313MEMORY DEVICE - A memory device that can include a power-supply voltage detector that detects power-supply voltage values and that outputs a detection result indicating which power-supply voltage value is detected; a data-rate setter that sets data rates corresponding to the detection result of the power-supply voltage detector, in synchronization with a rising edge or falling edge of a clock signal; and a memory cell array that performs reading/writing at the data rates set by the data-rate setter.03-18-2010
20100027355PLANAR DOUBLE GATE TRANSISTOR STORAGE CELL - A semiconductor device suitable for use as a storage cell includes a semiconductor body having a top surface and a bottom surface, a top gate dielectric overlying the semiconductor body top surface, an electrically conductive top gate electrode overlying the top gate dielectric, a bottom gate dielectric underlying the semiconductor body bottom surface, an electrically conductive bottom gate electrode underlying the bottom gate dielectric, and a charge trapping layer. The charge trapping layer includes a plurality of shallow charge traps, adjacent the top or bottom surface of the semiconductor body. The charge trapping layer may be of aluminum oxide, silicon nitride, or silicon nanoclusters. The charge trapping layer may located positioned between the bottom gate dielectric and the bottom surface of the semiconductor body.02-04-2010
20100182853Semiconductor Memory Device Having a Floating Storage Bulk Region Capable of Holding/Emitting Excessive Majority Carriers - A semiconductor memory device includes: a semiconductor layer formed on an insulating layer; a plurality of transistors formed on the semiconductor layer and arranged in a matrix form, each of the transistors having a gate electrode, a source region and a drain region, the electrodes in one direction constituting word lines; source contact plugs connected to the source regions of the transistors; drain contact plugs connected to the drain regions of the transistors; source wirings each of which commonly connects the source contact plugs, the source wirings being parallel to the word lines; and bit lines formed so as to cross the word lines and connected to the drain regions of the transistors via the drain contact plugs. Each of the transistors has a first data state having a first threshold voltage and a second data state having a second threshold voltage.07-22-2010
20120147680SEMICONDUCTOR MEMORY DEVICE - A power supply control circuit which can cut off a power supply independently is provided for each column in a memory cell array. The power supply control circuit is controlled by a circuit which is provided for each column and determines whether or not it is necessary to hold information, whereby a power supply for a memory cell which does not need to hold information is cut off.06-14-2012
20120147681METHODS, DEVICES, AND SYSTEMS RELATING TO A MEMORY CELL HAVING A FLOATING BODY - Methods, devices, and systems are disclosed for a memory cell having a floating body. A memory cell may include a transistor over an insulation layer, the transistor including a source, and a drain. The memory cell may also include a floating body including a first region positioned between the source and the drain, a second region positioned remote from each of the source and drain, and a passage extending through the insulation layer and coupling the first region to the second region. Additionally, the memory cell may include a bias gate at least partially surrounding the second region and configured for operably coupling to a bias voltage. Furthermore, the memory cell may include a plurality of dielectric layers, wherein each outer vertical surface of the second region has a dielectric layer of the plurality adjacent thereto.06-14-2012
20110063926Write Through Speed Up for Memory Circuit - A method of performing a write-through operation with a memory circuit having a write enable line, a write address line, a data in line, a read address line, a data out line, a bit array, a comparator, and a mux. A write address is received on the write address line, a read address is received on the read address line, data is received on the data in line. The comparator determines as a first condition whether the write address is identical to the read address, and determines as a second condition whether the write enable line is enabled. When both the first condition and the second condition are met, the comparator signals the mux to directly output the data receiving on the data in line on the data out line without writing the data to the bit array. In this manner, the memory circuit checks to determine whether a write-through operation is called for. If it is, then the mux sends the data on the data in line directly to the data out line, instead of retrieving data from the bit array of the memory, such as through the read decoder, which would take much longer.03-17-2011
20110317500SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME - Disclosed is a semiconductor device having a memory cell which comprises a transistor having a control gate and a storage gate. The storage gate comprises an oxide semiconductor and is able to be a conductor and an insulator depending on the potential of the storage gate and the potential of the control gate. Data is written by setting the potential of the control gate to allow the storage gate to be a conductor, supplying a potential of data to be stored to the storage gate, and setting the potential of the control gate to allow the storage gate to be an insulator. Data is read by supplying a potential for reading to a read signal line connected to one of a source and a drain of the transistor and detecting the change in potential of a bit line connected to the other of the source and the drain.12-29-2011
20120044775Semiconductor integrated circuit device - The invention provides a semiconductor integrated circuit device provided with an SRAM that satisfies the requirements for both the SNM and the write margin with a low supply voltage. The semiconductor integrated circuit device include: multiple static memory cells provided in correspondence with multiple word lines and multiple complimentary bit lines; multiple memory cell power supply lines that each supply an operational voltage to each of the multiple memory cells connected to the multiple complimentary bit lines each; multiple power supply circuits comprised of resistive units that each supply a power supply voltage to the memory cell power supply lines each; and a pre-charge circuit that supplies a pre-charge voltage corresponding to the power supply voltage to the complimentary bit lines, wherein the memory cell power supply lines are made to have coupling capacitances to thereby transmit a write signal on corresponding complimentary bit lines.02-23-2012
20120008429SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor memory device includes a data coding logic for generating converted data groups and a inverted flag data from original data groups received by the semiconductor memory device. The number of zeros in the converted data groups is less than or equal to the number of zeros in the original data groups. The semiconductor memory device also includes data decoding logic for generating the original data groups from the converted data groups and the inverted flag data. A peripheral circuit may be enabled to program the converted data groups and the inverted flag data into the memory cells and read the converted data groups and the inverted flag data from the memory cells. A control logic may be enabled to generate control signals for the data coding logic, the data decoding logic, and the peripheral circuit.01-12-2012
20100172194Dual-threshold-voltage two-port sub-threshold SRAM cell apparatus - The invention relates to a dual-threshold-voltage two-port sub-threshold SRAM cell apparatus. The above-mentioned apparatus comprises a first inverter, a second inverter, an access transistor and a read buffer. The first inverter and the second inverter include a plurality of first operating elements and a plurality of second operating elements for storing data. The access transistor is coupled to the first inverter and the second inverter, wherein the first operating elements and the second operating elements are high threshold voltage operating elements and the access transistor is low threshold voltage operating transistor. The read buffer is used for performing a read operation.07-08-2010
20110103159Degradation Equalization for a Memory - In an embodiment, an integrated circuit includes a memory and a control circuit configured to cause an inversion of at least a portion of the data stored in the memory to more evenly balance the amount of time that a given memory cell in the memory stores a binary one or a binary zero. In some implementations, the inversion may be controlled for the memory as a whole via a global indication. In other implementations, data may be inverted on a row-by-row or column-by-column basis. In other embodiments, the global indication may be changed at each boot of a device including the integrated circuit.05-05-2011
20100091585STATIC RANDOM ACCESS MEMORIES AND ACCESS METHODS THEREOF - A static random access memory device capable of preventing stability issues during a write operation is provided, in which a memory cell is coupled to a read word line, a write word line, a read bit line, a write bit line and a complementary write bit line, and a multiplexing unit is coupled to the read bit line, the write bit line and the complementary write bit line. The multiplexing unit applies first and second logic voltages representing a logic state stored in the memory cell to the write bit line and the complementary write bit line, respectively, when the memory cell is not selected to be written by an input signal from a data driver and the read word line is activated, in which the first and second logic voltages are opposite to each other.04-15-2010
20100254201MEMORY DEVICE, HOST CIRCUIT, CIRCUIT BOARD, LIQUID RECEPTACLE, METHOD OF TRANSMITTING DATA STORED IN A NONVOLATILE DATA MEMORY SECTION TO A HOST CIRCUIT, AND SYSTEM INCLUDING A HOST CIRCUIT AND A MEMORY DEVICE DETACHABLY ATTACHABLE TO THE HOST CIRCUIT - A memory device is electrically connectable to a host circuit. The memory device includes a nonvolatile data memory section, a read/write control section, and a data transmission section. The read/write control section reads a first data from the nonvolatile data memory section where the first data has a prescribed data amount. The data transmission section transmits to the host circuit the first data together with second data, wherein the second data is different from the first data and has prescribed correlation with content of the first data. The second data having an identical data amount to the data amount of the first data.10-07-2010
20120218836SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device comprises a first silicon pillar including a first pair of columnar portions and a first connection portion, a second silicon pillar including a second pair of columnar portions and a second connection portion in the shunt region, the second silicon pillar being adjacent to the first silicon pillar, a first interconnection connected to one of the first pair of columnar portions of the first silicon pillar, a second interconnection connected to one of the second pair of columnar portions of the second silicon pillar. The first interconnection is connected to a dummy bit line. The first interconnection and the second interconnection are connected on the same level.08-30-2012
20120213013MEMORY BUILDING BLOCKS AND MEMORY DESIGN USING AUTOMATIC DESIGN TOOLS - The memory building blocks can be used in conjunction with ASIC automatic design tools to generate a memory macro (e.g., a memory array) using a known ASIC design flow including, for example, register transfer level (RTL), synthesis, automatic place and route (APR) and timing analysis.08-23-2012
20120250429SECURITY-PROTECTION OF A WAFER OF ELECTRONIC CIRCUITS - A process is provided for fabricating a wafer including a plurality of chips separated by scribe lines. The method includes locking at least one chip on the wafer using a secret key, and writing the secret key into at least one memory present on the wafer.10-04-2012
20120250428MEMORY DEVICE, RECORDING METHOD, AND RECORDING AND REPRODUCING METHOD - A memory device, includes a recording medium; a probe to write a plurality of the signals; a first driving portion to vibratory drive the recording medium; a detecting unit which, when the first driving portion changes a frequency to vibratory drive the recording medium, detects a change in an amplitude of the resonance drive, detects the frequency at which the amplitude becomes maximum as a resonance frequency; and a calculating unit which calculates a timing when the probe writes a plurality of the signals using the resonance frequency; wherein, the first driving portion vibratory drives the recording medium and the probe writes a plurality of the signals.10-04-2012
20100008164MEMORY - A memory capable of suppressing reduction of data determination accuracy is provided. This memory includes a memory cell connected to a bit line for holding data and a bipolar transistor whose base is connected to the bit line. In data reading, the memory reads the data by amplifying a current, corresponding to the data of the memory cell, appearing on the bit line with the bipolar transistor.01-14-2010
20100008163MEMORY ARCHITECTURE AND CELL DESIGN EMPLOYING TWO ACCESS TRANSISTORS - An improved memory array architecture and cell design is disclosed in which the cell employs two access transistors. In one embodiment, the two access transistors in each cell are coupled at one of their channel terminals to a memory element, which in turn is connected to a bit line. The other of the channel terminals are effectively tied together via reference lines. The word lines (i.e., gates) of the two access transistors are also tied together. The result in a preferred embodiment is a cell having two access transistors wired and accessed in parallel. With such a configuration, the widths of the access transistors can be made one-half the width of more-traditional one-access-transistor designs, saving layout space in that (first) dimension. Moreover, because the word lines of adjacent cells will be deselected, the improved design does not require cell-to-cell isolation (e.g., trench isolation) in the other (second) dimension. The result, when applied to a phase change memory, comprises about a 37% reduction in layout area from previous cell designs.01-14-2010
20120218837VOLTAGE REGULATOR - A voltage regulator may include an input terminal for receiving an input voltage and an output terminal for providing a respective output voltage, a regulation transistor having a first conduction terminal coupled to the input terminal for receiving the input voltage, a second conduction terminal coupled to the output terminal, and a control terminal coupled to the output of a first operational amplifier. The first operational amplifier may have a non-inverting input terminal for receiving a first reference voltage, and an inverting input terminal coupled to a first terminal of a divider circuit for receiving a second reference voltage.08-30-2012
20120224438SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a fin formed on a semiconductor substrate, a gate electrode provided on both sides of the fin via a gate dielectric film, a depletion layer that forms a potential barrier, which confines a hole in a body region between channel regions of the fin, in the fin, and a source/drain layer formed in the fin to sandwich the gate electrode are included.09-06-2012
20120081977SEMICONDUCTOR MEMORY DEVICE HAVING AN ELECTRICALLY FLOATING BODY TRANSISTOR - A method for performing a holding operation to a semiconductor memory array having rows and columns of memory cells, includes: applying an electrical signal to buried regions of the memory cells, wherein each of the memory cells comprises a floating body region defining at least a portion of a surface of the memory cell, the floating body region having a first conductivity type; and wherein the buried region of each memory cell is located within the memory cell and located adjacent to the floating body region, the buried region having a second conductivity type.04-05-2012
20120230130Memory Cell System and Method - A memory cell system/method incorporating reduced transistor counts and/or improved design-for-manufacturability (DFM) is disclosed. The system/method incorporates cross-coupled feedthru (09-13-2012
20120230129Method of altering distribution of a chosen characteristic of a plurality of memory cells forming a memory device - A method is provided for altering distribution of a chosen characteristic of a plurality of memory cells forming a memory device. The method comprises identifying a subset of the memory cells whose value of the chosen characteristic is within a predetermined end region of the distribution, and then performing a burn-in process during which one or more operating parameters of the memory device are set to induce aging of the memory cells. During the burn-in process, for each memory cell in the subset, the value stored in that memory cell is fixed to a selected value which exposes that memory cell to a stress condition. In contrast, for each memory cell not in the subset, the value stored in that memory cell is alternated during the burn-in process in order to alleviate exposure of that memory cell to the stress condition. Such an approach allows a tightening of the distribution of the chosen characteristic, thus improving the worst case memory cells.09-13-2012
20100238743FAST EMBEDDED BiCMOS-THYRISTOR LATCH-UP NONVOLATILE MEMORY - This disclosure describes a new semiconductor non-volatile memory that can be potentially faster than DRAM and FLASH, and the manufacturing cost can be lower than SRAM, which is volatile. It is possible to fabricate an ULSI microprocessor and this type of new memory array in the same chip—realizing the “embedded” process. There are a CMOS transistor and latched-up Bipolar transistors (A thyristor) in the device. The fast read, write and erase operations are done by charging the MOS gate capacitor interface and sensing the latch-up voltage of the thyristor. The latch-up voltage of the thyristor is reduced for the additional MOSFET current during the write process, causing early avalanche breakdown and the latch-up of the bipolar transistors. The semiconductor memory can be fabricated as a planar device or a vertical device.09-23-2010
20120327725CIRCUIT DEVICES AND METHODS HAVING ADJUSTABLE TRANSISTOR BODY BIAS - Circuits, integrated circuits devices, and methods are disclosed that may include biasable transistors with screening regions positioned below a gate and separated from the gate by a semiconductor layer. Bias voltages can be applied to such screening regions to optimize multiple performance features, such as speed and current leakage. Particular embodiments can include biased sections coupled between a high power supply voltage and a low power supply voltage, each having biasable transistors. One or more generation circuits can generate multiple bias voltages. A bias control section can couple one of the different bias voltages to screening regions of biasable transistors to provide a minimum speed and lowest current leakage for such a minimum speed.12-27-2012
20110235443VOLTAGE STABILIZATION CIRCUIT AND SEMICONDUCTOR MEMORY APPARATUS USING THE SAME - A voltage stabilization circuit of a semiconductor memory apparatus includes an operation speed detecting unit configured to detect an operation speed of the semiconductor memory apparatus to generate a detection signal, and a voltage line controlling unit configured to interconnect a first voltage line and a second voltage line in response to the detection signal.09-29-2011
20130010548METHOD OF OPERATING SEMICONDUCTOR DEVICE - A semiconductor device is operated by, inter alia: programming selected memory cells by applying a first program voltage which is increased by a first step voltage to a selected word line and by applying a first pass voltage having a constant level to unselected word lines, and when a voltage difference between the first program voltage and the first pass voltage reaches a predetermined voltage difference, programming the selected memory cells by applying a second program voltage which is increased by a second step voltage lower than the first step voltage to the selected word line and by applying a second pass voltage which is increased in proportion to the second program voltage to first unselected word lines adjacent to the selected word line among the unselected word lines.01-10-2013
20130010549METHODS OF OPERATING SEMICONDUCTOR DEVICE - A method of operating a semiconductor device according to an embodiment of the present invention includes programming selected memory cells by applying a first program voltage, which gradually rises, to a selected word line and applying a first pass voltage, which is constant, to remaining unselected word lines; and programming the selected memory cells while applying a second program voltage, which is constant, to the selected word line and applying a second pass voltage, which gradually rises, to first unselected word lines adjacent to the selected word line, when a difference between the first program voltage and the first pass voltage reaches a critical voltage difference.01-10-2013
20090073785MULTI-LEVEL MEMORY CELL UTILIZING MEASUREMENT TIME DELAY AS THE CHARACTERISTIC PARAMETER FOR LEVEL DEFINITION - A method for operating a memory cell. Memory cells represent binary values by storing a characteristic parameter. The method of memory cell operation entails receiving a binary value to be stored by a memory cell. A determining operation determines a target discharge time corresponding to the binary value. The target discharge time being the time needed to discharge a pre-charged circuit through the said memory cell to a predetermined level. A storing operation stores a characteristic parameter in the memory cell such that an electron discharge time through an electronic circuit formed, at least partially, by the memory cell, is substantially equal to the target discharge time.03-19-2009
20120243346Control Method for Memory Cell - A control method for at least one memory cell. The memory cell includes a transistor and a resistor. The resistor is connected to the transistor in series between a first node and a second node. In a programming mode, the memory cell is programmed. When it is determined that the memory cell has been successfully programmed, impedance of the memory cell is in a first state. When it is determined that the memory cell has not been successfully programmed, a specific action is executed to reset the memory cell. The impedance of the memory cell is in a second state after the step resetting the memory cell. The impedance of the memory cell in the second state is higher than that of the memory cell in the first state.09-27-2012
20130201771Volatile Memory with a Decreased Consumption - A volatile memory including volatile memory cells adapted to the performing of data write and read operations. The memory cells are arranged in rows and in columns and, further, are distributed in separate groups of memory cells for each row. The memory includes a first memory cell selection circuit configured to perform write operations and a second memory cell selection circuit, different from the first circuit, configured to perform read operations. The first circuit is capable of selecting, for each row, memory cells from one of the group of memory cells for a write operation. The second circuit is capable of selecting, for each row, memory cells from one of the groups of memory cells for a read operation.08-08-2013
20090323439MEMORY FOR STORING A BINARY STATE - A memory cell for storing a binary state, the memory cell being adapted for storing a binary state based on a write indication and a binary write masking value and for storing a complementary binary state based on the write indication and a complementary binary write masking value.12-31-2009
20130176796SEMICONDUCTOR MEMORY DEVICE AND METHOD OF WRITING INTO SEMICONDUCTOR MEMORY DEVICE - The semiconductor memory device includes a memory cell, a pair of bit lines and a cell power line connected to the memory cell, a first switch connected to the bit lines and a power voltage line, a second switch connected to the cell power line and a write assist cell power line, and a write control circuit configured to control the bit lines, the first switch and the second switch, wherein the write control circuit applies a first voltage of a high level to one bit line and a second voltage of a low level to the other bit line, connects one bit line to the power voltage line and disconnects the other bit line from the power voltage line by the first switch, and then connects the cell power line to the write assist cell power line lower which is than the first voltage by the second switch.07-11-2013
20080219063SYSTEM AND METHOD OF SELECTIVE ROW ENERGIZATION BASED ON WRITE DATA - A system and method of selective row energization based on write data, with a selective row energization system including a storage array 09-11-2008
20130100747SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor memory device includes a memory cell array having memory cells coupled to a plurality of word lines and a peripheral circuit group configured to supply a pass voltage to unselected word lines among the plurality of word lines, wherein the peripheral circuit group stepwise raises the pass voltage supplied to the unselected word lines to a target level.04-25-2013
20130100749NANO-SENSE AMPLIFIER - A sense amplifier for a series of cells of a memory, including a writing stage comprising a CMOS inverter, the input of which is directly or indirectly connected to an input terminal of the sense amplifier, and the output of which is connected to an output terminal of the sense amplifier intended to be connected to a local bitline addressing the cells of the series, and a reading stage that includes a sense transistor, the gate of which is connected to the output of the inverter and the drain of which is connected to the input of the inverter.04-25-2013
20130100750SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device which is intended to reduce the total number of storage element blocks that constitute a desired logic circuit. The semiconductor device includes N address lines (N is an integer equal to two or more), N data lines, and a plurality of storage sections. Each of the storage sections includes an address decoder for decoding an address supplied via the N address lines to output a word select signal to word lines; and a plurality of storage elements which are connected to the word lines and the data lines, each store data that constitute a truth table, and input or output the data via the data lines in accordance with the word select signal supplied via the word lines. The semiconductor device is adapted such that the N address lines for the storage sections are connected to the respective data lines of other N ones of the storage sections, while the N data lines for the storage sections are connected to the respective address lines of other N ones of the storage sections.04-25-2013
20130100748SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING THE SAME - In a conventional DRAM, data read errors are more likely to occur along with miniaturization of DRAM. A small change in the potential of a first bit line is inverted by a first inverter constituted by an n-channel transistor and a p-channel transistor, and is output to a second bit line through a first selection transistor, which is a first switch. Since the potential of the second bit line is the inverse of the potential of the first bit line, the potential difference between the first bit line and the second bit line is increased. The increased potential difference is amplified by a known sense amplifier, a flip-flop circuit composed of the first inverter and a second inverter (constituted by an n-channel transistor and a p-channel transistor), or the like.04-25-2013
20130114354NONVOLATILE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A memory device comprises a nonvolatile memory device and a controller. The nonvolatile memory comprises a first memory area comprising single-bit memory cells and a second memory area comprising multi-bit memory cells. The controller is configured to receive a first unit of write data, determine a type of the first unit of write data, and based on the type, temporarily store the first unit of write data in the first memory area and subsequently migrate the temporarily stored first unit of write data to the second memory area or to directly store the first unit of write data in the second memory area, and is further configured to migrate a second unit of write data temporarily stored in the first memory area to the second memory area where the first unit of write data is directly stored in the second memory area.05-09-2013
20110267903SEMICONDUCTOR MEMORY DEVICE HAVING DRAM CELL MODE AND NON-VOLATILE MEMORY CELL MODE AND OPERATION METHOD THEREOF - A semiconductor memory device may have a DRAM cell mode and a non-volatile memory cell mode without a capacitor, including multiple transistors arranged in an array and having floating bodies, word lines connected to gate electrodes of the transistors, bit lines at a first side of the gate electrodes connected to drains of the transistors, source lines at a second side of the gate electrodes, different from the first side, and connected to sources of the transistors on the semiconductor substrate, and charge storage regions between the gate electrodes and the floating bodies.11-03-2011
20130128677DYNAMIC RANDOM ACCESS MEMORY DEVICE WITH IMPROVED CONTROL CIRCUITRY FOR THE WORD LINES - A dynamic random access memory device may include DRAM memory cells including several lines of memory cells, and line selection circuitry associated with each line. The line selection circuitry may include a first voltage-elevator stage configured to receive two initial control logic signals each having an initial voltage level corresponding to a first logic state, and to deliver two intermediate control logic signals each having an intermediate voltage level above the initial level and corresponding to the first logic state. The line selection circuitry may also include a control circuit to be supplied by PMOS transistors with a supply voltage having a second voltage level greater than the intermediate voltage level, and configured to, in the presence of the two intermediate control logic signals have their first logic state deliver to the gates of the memory cell transistors, a selection logic signal having the second voltage level.05-23-2013
20110273941TECHNIQUES FOR REFRESHING A SEMICONDUCTOR MEMORY DEVICE - Techniques for refreshing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell may include a first region coupled to a source line and a second region coupled to a carrier injection line. Each memory cell may also include a body region capacitively coupled to at least one word line and disposed between the first region and the second region and a decoupling resistor coupled to at least a portion of the body region.11-10-2011
20100277989INCREASED CAPACITY HETEROGENEOUS STORAGE ELEMENTS - Providing increased capacity in heterogeneous storage elements including a method for storing data including a write process writing to a memory and a read process reading from the memory. Physical characteristics of memory cells in the memory support different sets of data levels. The write process takes into account the different sets of data levels when writing to the memory. The read process first obtains data in the memory and subsequently determines how to interpret the data.11-04-2010
20130155790STORAGE DEVICE - Noise attributed to signals of a word line, in first and second bit lines which are overlapped with the same word line in memory cells stacked in a three-dimensional manner is reduced in a storage device with a folded bit-line architecture. The storage device includes a driver circuit including a sense amplifier, and first and second memory cell arrays which are stacked each other. The first memory cell array includes a first memory cell electrically connected to the first bit line and a first word line, and the second memory cell array includes a second memory cell electrically connected to the second bit line and a second word line. The first and second bit lines are electrically connected to the sense amplifier in the folded bit-line architecture. The first word line, first bit line, second bit line, and second word line are disposed in this manner over the driver circuit.06-20-2013
20130148441RAM MEMORY CELL COMPRISING A TRANSISTOR - The invention relates to a memory cell consisting of an isolated MOS transistor having a drain (06-13-2013
20130148440METHOD FOR OPERATING MEMORY SYSTEM IN RING TOPOLOGY - A method for operating a memory system includes providing a memory system including a memory controller, and first and second memory devices constituting a ring topology. The memory controller is connected to the first memory device through first and second links. The second memory device is disposed on the first link. The first memory device starts a first operation. The first link is used as a communication path between the first memory device and the memory controller. The second memory device starts a second operation before the first memory device completes the first operation. The communication path between the first memory device and the memory controller is changed into the second link. The first link is used as a communication path between the second memory device and the memory controller.06-13-2013
20130148442MEMORY CONTROL CIRCUIT AND MEMORY CIRCUIT - A memory circuit includes a plurality of divided memory cell blocks, a write circuit and a read circuit which connect via a pair of bit lines to each of the divided memory cell blocks. The output of write data to one of the bit line of the write circuit is made to be performed by one system. It is possible to achieve an increase of speed by bit lien division while reducing increase in the memory circuit area accompanying the bit line division.06-13-2013
20100315889SRAM MEMORY CELL WITH DOUBLE GATE TRANSISTORS PROVIDED WITH MEANS TO IMPROVE THE WRITE MARGIN - A random access memory cell including: two double-gate access transistors respectively arranged between a first bit line and a first storage node and between a second bit line and a second storage node, a word line, a first double-gate load transistor and a second double-gate load transistor, a first double-gate driver transistor and a second double-gate driver transistor, a mechanism to apply a given potential to at least one electrode of each of the load or driver transistors, and a mechanism to cause the given potential to vary.12-16-2010
20130155788DDR 2D VREF TRAINING - A method is provided for performing memory operations in response to instructions to perform a double data rate (DDR) memory reference voltage training in the voltage domain by a processing device and determining a DDR memory reference voltage and a DDR memory delay time based upon the memory operation. Computer readable storage media are also provided. A circuit is provided that includes a communication interface portion coupled to a memory and to a processing device. The circuit also includes a circuit portion, coupled to the communication interface portion that has a hardware state machine or an algorithm. The state machine or algorithm provides instructions to the processing device to perform a double data rate (DDR) reference voltage training in the voltage domain.06-20-2013
20110310680Interleave Memory Array Arrangement - A memory array includes a plurality of memory cells, wherein each cell of the plurality of memory cells is defined by a row and a column, wherein each row includes a unique identifying address, and wherein each column is associated with one of two sets, the columns arranged such that a column associated with a first set is adjacent to a column of a second set.12-22-2011
20120026808Integrated Circuit With Low Power SRAM - An integrated circuit containing a SRAM memory with SRAM bits optimized to have a lower minimum read voltage than the minimum write voltage. A method for reading a SRAM memory bit using a read voltage that is lower than the write voltage.02-02-2012
20130201770MEMORY WITH DEFERRED FRACTIONAL ROW ACTIVATION - Row activation operations within a memory component are carried out with respect to subrows instead of complete storage rows to reduce power consumption. Further, instead of activating subrows in response to row commands, subrow activation operations are deferred until receipt of column commands that specify the column operation to be performed and the subrow to be activated.08-08-2013
20130201772LOW VOLTAGE EFUSE PROGRAMMING CIRCUIT AND METHOD - A circuit for programming a fuse is disclosed. The circuit includes a voltage supply terminal (Vf) and a semiconductor controlled rectifier (08-08-2013
20130201769NONVOLATILE MEMORY APPARATUS, PROGRAM METHOD THEREOF, AND DATA PROCESSING SYSTEM USING THE SAME - A nonvolatile memory apparatus includes: a memory cell area including a plurality of memory cells connected to a word line and a bit line; a program time controller configured to determine a program voltage application time for a selected word line, as the selected word line is selected in response to a program command and an address signal; and a controller configured to apply a program voltage to the selected word line according to the program voltage application time determined by the program time controller.08-08-2013
20130208551SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR ACCESSING THE SAME - A semiconductor memory device and a method for accessing the same are disclosed. The semiconductor memory device includes an oxide heterojunction transistor which includes: an oxide substrate; an oxide film on the oxide substrate, wherein an interfacial layer between the oxide substrate and the oxide film behaves like two-dimensional electron gas; a source electrode and a drain electrode being located on the oxide film and electrically connected with the interfacial layer; a front gate on the oxide film; and a back gate on a lower surface of the oxide substrate, wherein the source electrode and the drain electrode of the oxide heterojunction transistor are respectively connected with a first word line and a first bit line for reading operation, and wherein the front gate and the back gate are respectively connected with a second word line and a second bit line for writing operation.08-15-2013

Patent applications in class READ/WRITE CIRCUIT

Patent applications in all subclasses READ/WRITE CIRCUIT