| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 365182000 | Insulated gate devices | 78 |
| 20120163072 | NON-VOLATILE SEMICONDUCTOR MEMORY CELL WITH DUAL FUNCTIONS - A non-volatile semiconductor memory cell with dual functions includes a substrate, a first gate, a second gate, a third gate, a charge storage layer, a first diffusion region, a second diffusion region, and a third diffusion region. The second gate and the third gate are used for receiving a first voltage corresponding to a one-time programming function of the dual function and a second voltage corresponding to a multi-time programming function of the dual function. The first diffusion region is used for receiving a third voltage corresponding to the one-time programming function and a fourth voltage corresponding to the multi-time programming function. The second diffusion region is used for receiving a fifth voltage corresponding to the multi-time programming function. | 06-28-2012 |
| 20090316477 | NONVOLATILE SEMICONDUCTOR MEMORY CIRCUIT UTILIZING A MIS TRANSISTOR AS A MEMORY CELL - A memory circuit includes a latch having a first node and a second node to store data such that a logic level of the first node is an inverse of a logic level of the second node, a MIS transistor having a gate node, a first source/drain node, and a second source/drain node, the first source/drain node coupled to the first node of the latch, and a control circuit configured to control the gate node and second source/drain node of the MIS transistor in a first operation such that a lingering change is created in transistor characteristics of the MIS transistor in response to the data stored in the latch, wherein the MIS transistor includes a highly-doped substrate layer, a lightly-doped substrate layer disposed on the highly-doped substrate layer, diffusion regions formed in the lightly-doped substrate layer, a gate electrode, sidewalls, and an insulating film. | 12-24-2009 |
| 20130064012 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a first transistor, formed in a substrate, that includes a first gate insulating film, a source and a drain region, a first gate electrode, and a first sidewall, and a second transistor that includes a second gate insulating film, a second gate electrode, a source and a drain region, and a second sidewall. The first transistor includes a portion of a logic circuit. The second transistor includes a transistor included in a memory cell of a DRAM, or includes a portion of a peripheral circuit that performs writing and erasing with respect to the DRAM. The first gate insulating film has a same thickness as that of the second gate insulating film. The first gate electrode has the same thickness as that of the second gate electrode. A layer structure of the first sidewall is a same as a layer structure of the second sidewall. | 03-14-2013 |
| 20120195115 | SEMICONDUCTOR DEVICE - A first field-effect transistor provided over a substrate in which an insulating region is provided over a first semiconductor region and a second semiconductor region is provided over the insulating region; an insulating layer provided over the substrate; a second field-effect transistor that is provided one flat surface of the insulating layer and includes an oxide semiconductor layer; and a control terminal are provided. The control terminal is formed in the same step as a source and a drain of the second field-effect transistor, and a voltage for controlling a threshold voltage of the first field-effect transistor is supplied to the control terminal. | 08-02-2012 |
| 20090046504 | DRAM TUNNELING ACCESS TRANSISTOR - In one embodiment, a first transistor is comprised of a first p+ source region doped in an n-well in the substrate and a first n+ drain region doped on one side at the top of the pillar. A second transistor is comprised of a second p+ source region doped into the second side of the top of the pillar and serially coupled to the top drain region for the first transistor. A second n+ drain region is doped into the substrate adjacent the pillar. Ultra-thin body layer run along each pillar sidewall between their respective active regions. A gate structure is formed along the pillar sidewalls and over the body layers. The transistors operate by electron tunneling from the source valence band to the gate bias-induced n-type channels, along the ultra-thin silicon bodies, thus resulting in a drain current. | 02-19-2009 |
| 20090010055 | One-transistor type DRAM - A one-transistor type DRAM comprises a floating body storage element configured to store data in a floating body in a SOI wafer, a plurality of access transistors each connected between a bit line and one end of the floating body storage element, a word line configured to control the floating body storage element, and a plurality of port word lines each configured to select one of the plurality of access transistors. | 01-08-2009 |
| 20090010054 | SEMICONDUCTOR MEMORY DEVICE WITH FERROELECTRIC DEVICE - A semiconductor memory device includes a one-transistor (1-T) field effect transistor (FET) type memory cell connected between a pair of bit lines, and controlled by a word line, where a different channel resistance is induced to a channel region depending on a polarity state of a ferroelectric layer. The device comprises a plurality of word lines arranged in a row direction, a plurality of bit lines arranged in a column direction, a pair of clamp dummy lines arranged in the column direction, a pair of reference dummy lines arranged in the column direction, a cell array including the memory cell and formed in a region where the word line and the bit line are crossed, a dummy cell array including the memory cell and formed where the word line, the pair of claim dummy lines and the pair of reference dummy lines are crossed, and a sense amplifier and a write driving unit connected to the bit line and configured to receive a clamp voltage and a reference voltage. | 01-08-2009 |
| 20090010053 | COMBO MEMORY CELL - A combo memory cell comprising a SRAM cell and a mask-ROM code programmer. The SRAM cell comprises first and second inverters. The first inverter comprises a first PMOS transistor and a first NMOS transistor. Gates of the first PMOS and NMOS transistors are commonly connected to a first input node and drains thereof commonly connected to a first output node. The second inverter comprises a second PMOS transistor and a second NMOS transistor. Gates of the second PMOS and NMOS transistors are commonly connected to a second input node and drains thereof commonly connected to a second output node. The first input node and the second output node are connected, as are the second input node and the first output node. The mask-ROM code programmer is coupled to the sources of the first and second PMOS transistors or the first and second NMOS transistors. | 01-08-2009 |
| 20120236634 | MEMORY DEVICE AND ELECTRONIC DEVICE - A selection operation is performed for individual memory cells. A device includes a first memory cell and a second memory cell provided in the same row as the first memory cell, each of which includes a field-effect transistor having a first gate and a second gate. The field-effect transistor controls at least data writing and data holding in the memory cell by being turned on or off. The device further includes a row selection line electrically connected to the first gates of the field-effect transistors included in the first memory cell and the second memory cell, a first column selection line electrically connected to the second gate of the field-effect transistor included in the first memory cell, and a second column selection line electrically connected to the second gate of the field-effect transistor included in the second memory cell. | 09-20-2012 |
| 20110128781 | SEMICONDUCTOR MEMORY CIRCUIT - A semiconductor memory circuit includes a memory cell array having a plurality of memory cells arranged in a row direction and a column direction; a row selecting unit for selecting the memory cells of the memory cell array aligned in the row direction; a column selecting unit for selecting the memory cells of the memory cell array aligned in the column direction; a plurality of main bit lines for outputting data of the memory cells; a data reading unit for reading data of one of the memory cells selected with the row selecting unit and the column selecting unit; a first multiplexer for connecting one of the main bit lines connected to the memory cell to the data reading unit; and a second multiplexer for connecting an adjacent main bit line situated adjacently outside the main bit line to a charging/discharging voltage source for setting at a specific voltage. | 06-02-2011 |
| 20120294082 | Semiconductor Device - A semiconductor device comprises a transistor comprising a gate, a source, a drain, and a gate insulating layer, and an auxiliary line formed over the drain and electrically insulated from the drain. During a turn-off operation of the transistor, voltage to increase a resistance of the drain is supplied to the auxiliary line. | 11-22-2012 |
| 20110170344 | SEMICONDUCTOR DEVICE INCLUDING SUB WORD LINE DRIVER - A semiconductor device includes a sub word line driver. A first sub word line and a second sub word line transmit an operation signal to a memory cell. A main word line optionally sends the operation signal to the first sub word line and the second sub word line. A switching transistor is disposed between the first sub word line and the second sub word line. A gate of the switching transistor is connected the main word line. | 07-14-2011 |
| 20080310220 | 3-D SRAM ARRAY TO IMPROVE STABILITY AND PERFORMANCE - A three-dimensional memory circuit provides reduction in memory cell instability due to half-select operation by reduction of the number of memory cells sharing a sense amplifier and, potentially, avoidance of half-select operation by placing some or all peripheral circuits including local evaluation circuits functioning as a type of sense amplifier on an additional chips or chips overlying the memory array. Freedom of placement of such peripheral circuits is provided with minimal increase in connection length since word line decoders may be placed is general registration with ant location along the word lines while local evaluation circuits and/or sense amplifiers can be placed at any location generally in registration with the bit line(s) to which they correspond. | 12-18-2008 |
| 20100085806 | TECHNIQUES FOR REDUCING A VOLTAGE SWING - Techniques for reducing a voltage swing are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for reducing a voltage swing comprising: a plurality of dynamic random access memory cells arranged in arrays of rows and columns, each dynamic random access memory cell including one or more memory transistors. The one or more memory transistors of the apparatus for reducing a voltage swing may comprise: a first region coupled to a source line, a second region coupled to a bit line, a first body region disposed between the first region and the second region, wherein the first body region may be electrically floating, and a first gate coupled to a word line spaced apart from, and capacitively coupled to, the first body region. The apparatus for reducing a voltage swing may also comprise a first voltage supply coupled to the source line configured to supply a first voltage and a second voltage to the source line, wherein a difference between the first voltage and the second voltage may be less than 3.5V. | 04-08-2010 |
| 20120294080 | MEMORY DEVICE AND METHOD FOR DRIVING MEMORY DEVICE - A memory device according to the invention can be operated with a single potential, by which the use of a voltage converter can be excluded, leading to the reduction of power consumption. Such an operation can be achieved by utilizing capacitive coupling of a capacitor connected to a gate of a transistor for data writing. That is, the capacitive coupling is induced by inputting a signal, which is supplied by a delay circuit configured to delay a write signal having a potential equal to the power supply potential, to the capacitor. Increase in the potential of the gate by the capacitive coupling allows the transistor to be turned on in association with the power supply potential applied to the gate from a power supply. Data is written by inputting a signal having a potential equal to the power supply potential or a grounded potential to a node through the transistor. | 11-22-2012 |
| 20120294081 | SEMICONDUCTOR DEVICE - In a sense circuit for DRAM memory cell a switch is provided between the bit line BL and local bit line LBL connected to the memory cells for isolation and coupling of these bit lines. The bit line BL is precharged to the voltage of VDL/2, while the local bit line LBL is precharged to the voltage of VDL. VDL is the maximum amplitude voltage of the bit line BL. A sense amplifier SA comprises a first circuit including a differential MOS pair having the gate connected to the bit line BL and a second circuit connected to the local bit line LBL for full amplitude amplification and for holding the data. When the bit line BL and local bit line LBL are capacitance-coupled via a capacitor, it is recommended to use a latch type sense amplifier SA connected to the local bit line LBL. | 11-22-2012 |
| 20080304315 | Semiconductor memory device, method of writing data therein, and method of reading data therefrom - A semiconductor memory device ( | 12-11-2008 |
| 20090080244 | Refreshing Data of Memory Cells with Electrically Floating Body Transistors - A semiconductor device along with circuits including the same and methods of operating the same are described. The device comprises a memory cell including one transistor. The transistor comprises a gate, an electrically floating body region, and a source region and a drain region adjacent the body region. Data stored in memory cells of the device can be refreshed within a single clock cycle. | 03-26-2009 |
| 20120243309 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - When performing a data erase operation, the control circuit generates positive holes at least at any one of the drain side select transistor and the source side select transistor, and supply the positive holes to a body of the memory string to raise a voltage of the body of the memory string to a first voltage. Then, it applies a voltage smaller than the first voltage to a first word line among the plurality of the word lines during a first time period. In addition, it applies a voltage smaller than the first voltage to a second word line different from the first word line during a second time period. The second time period is different from the first time period. | 09-27-2012 |
| 20110019469 | SEMICONDUCTOR MEMORY - A semiconductor memory includes a memory cell array area having a memory cell, a word line contact area adjacent to the memory cell array area, a word line arranged straddling the memory cell array area and the word line contact area, a contact hole provided on the word line in the word line contact area, and a word line driver connected to the word line via the contact hole. A size of the contact hole is larger than a width of the word line, and the lowest parts of the contact hole exist on a position lower than a top surface of the word line and higher than a bottom surface of the word line. | 01-27-2011 |
| 20110116310 | SEMICONDUCTOR DEVICE AND DRIVING METHOD THEREOF - A semiconductor device includes: a source line; a bit line; a word line; a memory cell connected to the bit line and the word line; a driver circuit which drives a plurality of second signal lines and a plurality of word lines so as to select the memory cell specified by an address signal; a potential generating circuit which generates a writing potential and a plurality of reading potentials to supply to a writing circuit and a reading circuit; and a control circuit which selects one of a plurality of voltages for correction on a basis of results of the reading circuit comparing a potential of the bit line with the plurality of reading potentials. | 05-19-2011 |
| 20120134205 | OPERATING METHOD FOR MEMORY UNIT - An operating method for a memory unit is provided, wherein the memory unit includes a well region, a select gate, a first gate, a second gate, an oxide nitride spacer, a first diffusion region, and a second diffusion region. The operating method for the memory unit comprises the following steps. During a programming operation, a breakdown voltage is coupled to the second diffusion region through a first channel region formed under the select gate. A programming voltage is sequentially or simultaneously applied to the first gate and the second gate to rupture a first oxide layer and a second oxide layer, wherein the first oxide layer is disposed between the first gate and the well region, and the second oxide layer is disposed between the second gate and the well region. | 05-31-2012 |
| 20100054035 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device with low power consumption and improved transfer rate of an input/output buffer at reduced manufacturing cost is provided. Thick-film transistors are used for a memory cell array | 03-04-2010 |
| 20080205132 | Memory Element and Semiconductor Device, and Method for Manufacturing the Same - It is an object to solve inhibition of miniaturization of an element and complexity of a manufacturing process thereof. It is another object to provide a nonvolatile memory device and a semiconductor device having the memory device, in which data can be additionally written at a time besides the manufacturing time and in which forgery caused by rewriting of data can be prevented. It is further another object to provide an inexpensive nonvolatile memory device and semiconductor device. A memory element is manufactured in which a first conductive layer, a second conductive layer that is beside the first conductive layer, and conductive fine particles of each surface which is covered with an organic film are deposited over an insulating film. The conductive fine particles are deposited between the first conductive layer and the second conductive layer. | 08-28-2008 |
| 20110096596 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes: a memory cell array provided with a plurality of memory cells in a matrix; and a power supply circuit configured to supply an intermediate voltage between a power supply voltage and a ground voltage to each of the plurality of memory cells. The power supply circuit includes: a first intermediate voltage generating circuit configured to generate a first intermediate voltage between the power supply voltage and the ground voltage; a second intermediate voltage generating circuit configured to generate a second intermediate voltage between the power supply voltage and the ground voltage; a first output node to which the first intermediate voltage is supplied; a second output node to which the second intermediate voltage is supplied; and a connection control circuit provided between the first output node and the second output node. The first intermediate voltage generating circuit supplies the first intermediate voltage in response to a first control signal, and the second intermediate voltage generating circuit stops its operation in response to the first control signal. The connection control circuit connects the first output node and the second output node when the second intermediate voltage generating circuit stops its operation. | 04-28-2011 |
| 20110317486 | Methods for Operating a Semiconductor Device - Multi-gate metal-oxide-semiconductor (MOS) transistors and methods of operating such multi-gate MOS transistors are disclosed. In one embodiment, the multi-gate MOS transistor comprises a first gate associated with a first body factor and comprising a first gate electrode for applying a first gate voltage, and a second gate associated with a second body factor greater than or equal to the first body factor and comprising a second gate electrode for applying a second gate voltage. The multi-gate MOS transistor further comprises a body of semiconductor material between the first dielectric layer and the second dielectric layer, where the semiconductor body comprises a first channel region located close to the first dielectric layer and a second channel region located close to the second dielectric layer. The multi-gate MOS transistor still further comprises a source region and a drain region each having a conductivity type different from a conductivity type of the body. | 12-29-2011 |
| 20110317485 | STRUCTURE AND METHOD FOR SRAM CELL CIRCUIT - The present disclosure provides a static random access memory (SRAM) cell. The SRAM cell includes a first and a second pull-up devices; a first and a second pull-down devices configured with the first and second pull-up devices to form two cross-coupled inverters for data storage; and a first and second pass-gate devices configured with the two cross-coupled inverters to form a port for data access, wherein the first and second pull-down devices each includes a first channel doping feature of a first doping concentration, and the first and second pass-gate devices each includes a second channel doping feature of a second doping concentration greater than the first doping concentration. | 12-29-2011 |
| 20120002467 | SINGLE TRANSISTOR MEMORY CELL - A semiconductor device along with circuits including same and methods of operating same are disclosed. In one particular embodiment, the device may comprise a memory cell including a transistor. The transistor may comprise a gate, an electrically floating body region, and a source region and a drain region adjacent the body region. Data stored in memory cells of the device may be refreshed during hold operations. | 01-05-2012 |
| 20120014178 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF REUSING SAME - A nonvolatile semiconductor memory device and a method of reusing the same that allow a good use of the semiconductor device without degrading characteristics even when reused. The semiconductor memory device comprises information holding means for holding information that indicates an operation mode of said memory cell array, a decoder for generating, to said memory cell array, a selection signal to designate at least a read address of said memory cell array in accordance with an address signal that comprises plural bits; and mode setting means for fixing a logical value of at least one bit of said plural bits of said address signal in accordance with the information held by said information holding means, and supplying said address signal, on which fixing of the logical value is effected, to said decoder. | 01-19-2012 |
| 20120113712 | METHOD OF OPERATING SEMICONDUCTOR MEMORY DEVICE WITH FLOATING BODY TRANSISTOR USING SILICON CONTROLLED RECTIFIER PRINCIPLE - A method of maintaining the data state of a semiconductor dynamic random access memory cell is provided, wherein the memory cell comprises a substrate being made of a material having a first conductivity type selected from p-type conductivity type and n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type; a second region having the second conductivity type, the second region being spaced apart from the first region; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region having the first conductivity type; and a gate positioned between the first and second regions and adjacent the body region. | 05-10-2012 |
| 20110032756 | Compact Semiconductor Memory Device Having Reduced Number of Contacts, Methods of Operating and Methods of Making - An integrated circuit including a link or string of semiconductor memory cells, wherein each memory cell includes a floating body region for storing data. The link or siring includes at least one contact configured to electrically connect the memory cells to at least one control line, and the number of contacts in the string or link is the same as or less than the number of memory cells in the string or link. | 02-10-2011 |
| 20120250407 | MEMORY CIRCUIT, MEMORY UNIT, AND SIGNAL PROCESSING CIRCUIT - A memory circuit includes a transistor having a channel in an oxide semiconductor layer, a capacitor, a first arithmetic circuit, a second arithmetic circuit, a third arithmetic circuit, and a switch. An output terminal of the first arithmetic circuit is electrically connected to an input terminal of the second arithmetic circuit. The input terminal of the second arithmetic circuit is electrically connected to an output terminal of the third arithmetic circuit via the switch. An output terminal of the second arithmetic circuit is electrically connected to an input terminal of the first arithmetic circuit. An input terminal of the first arithmetic circuit is electrically connected to one of a source and a drain of the transistor. The other of the source and the drain of the transistor is electrically connected to one of a pair of electrodes of the capacitor and to an input terminal of the third arithmetic circuit. | 10-04-2012 |
| 20120224419 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device according to an embodiment includes wells in a semiconductor substrate, fins formed on the wells, gate electrodes provided on one side and another opposite side of each fin via a gate insulating film to form a channel region in the fin, impurity-diffused layers that each form a potential barrier that confines holes in a body region within the channel region, and source/drain layers each formed at the fin such that the channel region is sandwiched between the source layer and the drain layer. At the time of writing of data ‘1’, a gate voltage is set to a negative potential, a well bias voltage is set to a positive potential, and a drain voltage is set to a positive potential. | 09-06-2012 |
| 20110038201 | SEMICONDUCTOR INTEGRATED CIRCUIT - There is provided a semiconductor integrated circuit including a state detection enhancement circuit which includes an input terminal and an output terminal and has a function of generating an electric potential of a magnitude capable of performing nonvolatile memory writing into a nonvolatile memory circuit based on an electric potential input to the input terminal and outputting the electric potential of the magnitude to the output terminal, and the nonvolatile memory circuit has a nonvolatile memory function and an input terminal of the nonvolatile memory circuit is connected to the output of the state detection enhancement circuit. The state detection enhancement circuit is a positive or negative logical state detection enhancement circuit which includes a control signal terminal and a switch circuit which is turned on or off by a control signal applied to the control signal terminal, and has a function of either applying an output potential of the same logical state as or an inverse logical state of an input potential applied to the input terminal to the output terminal or completely breaking off a correlation between the input potential and the output potential when the switch circuit is in an OFF state, and has a function of applying an output potential which has the same logical state as or an inverse logical state of the input potential and has a larger highest-lowest potential range including a possible highest-lowest potential range of the input potential to the output terminal when the switch is in an ON state. | 02-17-2011 |
| 20100254186 | METHODS, DEVICES, AND SYSTEMS RELATING TO MEMORY CELLS HAVING A FLOATING BODY - Methods, devices, and systems are disclosed relating to a memory cell having a floating body. A memory cell includes a transistor comprising a drain and a source each formed in silicon and a gate positioned between the drain and the source. The memory cell may further include a bias gate recessed into the silicon and positioned between an isolation region and the transistor. In addition, the bias gate may be configured to be operably coupled to a bias voltage. The memory cell may also include a floating body within the silicon. The floating body may include a first portion adjacent the source and the drain and vertically offset from the bias gate and a second portion coupled to the first portion. Moreover, the bias gate may be formed adjacent to the second portion. | 10-07-2010 |
| 20120281469 | SEMICONDUCTOR DEVICE - Noise generated on a word line is reduced without increasing a load on the word line. A semiconductor device is provided in which a plurality of storage elements each including at least one switching element are provided in matrix; each of the plurality of storage elements is electrically connected to a word line and a bit line; the word line is connected to a gate (or a source and a drain) of a transistor in which minority carriers do not exist substantially; and capacitance of the transistor in which minority carriers do not exist substantially can be controlled by controlling a potential of a source and a drain (or a gate) the transistor in which minority carriers do not exist substantially. The transistor in which minority carriers do not exist substantially may include a wide band gap semiconductor. | 11-08-2012 |
| 20120092925 | VERTICAL CAPACITOR-LESS DRAM CELL, DRAM ARRAY AND OPERATION OF THE SAME - A vertical capacitor-less DRAM cell is described, including: a source layer having a first conductivity type, a storage layer disposed on the source layer and having a second conductivity type, an active layer disposed on the storage layer and having the first conductivity type, a drain layer disposed on the active layer and having the second conductivity type, an address gate disposed beside the active layer and separated from the same by a first gate dielectric layer, and a storage gate disposed beside the storage layer and separated from the same by a second gate dielectric layer. The DRAM cell can be written by turning on the MOSFET formed by the storage layer, the active layer, the drain layer, the first gate dielectric layer and the address gate to inject carriers into the storage layer from the active layer. | 04-19-2012 |
| 20130010534 | Memory Element and Semiconductor Device and Method for Manufacturing the Same - It is an object to solve inhibition of miniaturization of an element and complexity of a manufacturing process thereof. It is another object to provide a nonvolatile memory device and a semiconductor device having the memory device, in which data can be additionally written at a time besides the manufacturing time and in which forgery caused by rewriting of data can be prevented. It is further another object to provide an inexpensive nonvolatile memory device and semiconductor device. A memory element is manufactured in which a first conductive layer, a second conductive layer that is beside the first conductive layer, and conductive fine particles of each surface which is covered with an organic film are deposited over an insulating film. The conductive fine particles are deposited between the first conductive layer and the second conductive layer. | 01-10-2013 |
| 20080225588 | Capacitorless DRAM and method of manufacturing and operating the same - Provided are a capacitorless dynamic random access memory (DRAM) and a method of manufacturing and operating the capacitorless DRAM. The capacitorless DRAM includes a substrate having a first dopant region formed on the upper part thereof, a first protrusion unit formed on the substrate, a first gate and a second gate formed on the substrate on both sides of the first protrusion unit, having a height lower than the first protrusion unit, and an insulating material layer interposed between the substrate and the first and second gates and between the first protrusion unit and the first and second gates, wherein a second dopant region is formed on the upper part of the first protrusion unit. | 09-18-2008 |
| 20080225587 | Integrated Circuits, Methods for Manufacturing Integrated Circuits, Integrated Memory Arrays - The present invention relates generally to integrated circuits, to methods for manufacturing integrated circuits, and to integrated memory arrays. | 09-18-2008 |
| 20130121070 | Memory Device - A memory device includes first and second inverters cross-coupled between first and second nodes. The first inverter is configured to be supplied by a first supply voltage via a first transistor and the second inverter is configured to be supplied by the first supply voltage via a second transistor. A first control circuit is configured to control a gate node of the first transistor based on the voltage at the second node and at a gate node of the second transistor. A second control circuit is configured to control the gate node of the second transistor based on the voltage at the first node and at the gate node of the first transistor. | 05-16-2013 |
| 20080212366 | SEMICONDUCTOR MEMORY DEVICE - This disclosure concerns a semiconductor memory device comprising Fin semiconductors extending in a first direction; source layers provided in the Fin semiconductors; drain layers provided in the Fin semiconductors; floating bodies provided in the Fin semiconductors between the source layers and the drain layers, the floating bodies being in an electrically floating state and accumulating or discharging carries so as to store data; first gate electrodes provided in first grooves located between the Fin semiconductors adjacent to each other; second gate electrodes provided in second grooves adjacent to the first grooves and located between the Fin semiconductors adjacent to each other; bit lines connected to the drain layers, and extending in a first direction; word lines connected to the first gate electrodes, and extending in a second direction orthogonal to the first direction; and source lines connected to the source layers, and extending in the second direction. | 09-04-2008 |
| 365184000 | Variable threshold | 36 |
| 20110194344 | SEMICONDUCTOR DEVICE - To provide a semiconductor device that can suppress deterioration in transistors and has a small layout area. In a nonvolatile semiconductor memory device according to the present invention, a control voltage (4 V) between a write voltage (10 V) and a reference voltage (0 V) is applied to a gate of a P-channel MOS transistor of a memory gate drive circuit corresponding to a selected memory gate line and also the reference voltage (0 V) is applied to a gate of an N-channel MOS transistor, and the write voltage is applied to the memory gate line. Since the transistors are turned on with a gate-source voltage lower than the conventional one, deterioration in the transistors can be suppressed. | 08-11-2011 |
| 20120176835 | TEMPERATURE SENSOR, METHOD OF MANUFACTURING THE TEMPERATURE SENSOR, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF CONTROLLING THE SEMICONDUCTOR DEVICE - A disclosed temperature sensor includes a charge trap structure including a silicon oxide film formed on a substrate; an aluminum oxide film that is formed on the silicon oxide film, wherein oxygen is injected into the aluminum oxide film from an upper surface thereof; and an electrode formed on the aluminum oxide film, wherein a flat band voltage of the charge trap structure is temperature dependent. | 07-12-2012 |
| 20130077397 | SEMICONDUCTOR DEVICE - A semiconductor device according to an embodiment includes: a first transistor including a gate connected to a first interconnection, a first source, and a first drain, one of the first source and the first drain being connected to a second interconnection; and a second transistor including a gate structure, a second source, and a second drain, one of the second source and second drain being connected to a third interconnection and the other of the second source and second drain being connected to a fourth interconnection. The gate structure includes a gate insulation film, a gate electrode, and a threshold-modulating film provided between the gate insulation film and the gate electrode to modulate a threshold voltage, the other of the first source and first drain of the first transistor is connected to the gate electrode. | 03-28-2013 |
| 20130077398 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND PROGRAMMING METHOD - A nonvolatile semiconductor memory device of the charge trap type is initialized by reading the memory cells in the device to determine which charge traps hold less than a predetermined minimum charge and injecting charge into these charge traps until all of the charge traps in the device hold at least the predetermined minimum charge. The charge traps are then programmed selectively with data. The initialization procedure shortens the programming procedure by narrowing the initial distribution of charge in the charge traps, and leads to more reliable reading of the programmed data. | 03-28-2013 |
| 20130033932 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SAME - According to one embodiment, a nonvolatile semiconductor memory device includes a memory unit and a control unit. The memory unit includes a charge storage film and a memory cell transistor. The transistor is provided for each of storage regions configured to store charge in the film. The control unit sets the transistors to an erase threshold by setting erase information in the regions; subsequently sets the transistors to thresholds corresponding to information having n values by programming the information having the n values to at least one of the regions in which the erase information is set; and controls information of at least one storage region before being programmed adjacent to the regions programmed with the information to have a value providing a threshold of the transistor nearer than the erase threshold to the thresholds corresponding to the information having the n values in the state of the transistors provided in the regions being set to the thresholds corresponding to the information having the n values. | 02-07-2013 |
| 20130028016 | Memory Cells and Methods of Storing Information - Some embodiments include memory cells which have channel-supporting material, dielectric material over the channel-supporting material, carrier-trapping material over the dielectric material and an electrically conductive electrode material over and directly against the carrier-trapping material; where the carrier-trapping material includes gallium, indium, zinc and oxygen. Some embodiments include methods of storing information. A memory cell to is provided which has a channel-supporting material, a dielectric material over the channel-supporting material, a carrier-trapping material over the dielectric material, and an electrically conductive electrode material over and directly against the carrier-trapping material; where the carrier-trapping material includes gallium, indium, zinc and oxygen. It is determined if carriers are trapped in the carrier-trapping material to thereby ascertain a memory state of the memory cell. | 01-31-2013 |
| 20130058163 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a stacked body, a semiconductor pillar, a charge storage layer, a tunneling layer, a dividing trench and a first heating unit. The stacked body includes a plurality of first insulating films stacked alternately with a plurality of electrode films. The semiconductor pillar pierces the stacked body. The charge storage layer is provided between the electrode films and the semiconductor pillar. The tunneling layer is provided between the charge storage layer and the semiconductor pillar. The dividing trench is provided between the semiconductor pillars in one direction orthogonal to a stacking direction of the stacked body to divide the electrode films. The first heating unit is provided in an interior of the dividing trench. | 03-07-2013 |
| 20090010056 | Method and apparatus for capacitorless double-gate storage - A method and/or system and/or apparatus for a dual gate, capacitor less circuit that can act as a state storage device. Further embodiments describe fabrication methods and methods of operation of such a device. | 01-08-2009 |
| 20090303787 | NONVOLATILE MEMORIES WITH TUNNEL DIELECTRIC WITH CHLORINE - In a nonvolatile memory cell with charge trapping dielectric ( | 12-10-2009 |
| 20110280066 | SEMICONDUCTOR DEVICE HAVING A FIELD EFFECT SOURCE/DRAIN REGION - A semiconductor device includes an active region defined in a semiconductor substrate, and gate electrodes crossing over the active region. Source/drain regions are defined in the active region on two sides of the gate electrode. At least one of the source/drain regions is a field effect source/drain region generated by a fringe field of the gate. The other source/drain region is a PN-junction source/drain region having different impurity fields and different conductivity than the substrate. At least one of the source/drain regions is a field effect source/drain region. Accordingly, a short channel effect is reduced or eliminated in the device. | 11-17-2011 |
| 20110273931 | METHODS OF OPERATING MEMORY CELL HAVING ASYMMETRIC BAND-GAP TUNNEL INSULATOR USING DIRECT TUNNELING - Methods of operating dual-gate memory cells having asymmetric band-gap tunnel insulators using direct tunneling. The asymmetric band-gap tunnel insulators allow for low voltage direct tunneling programming and efficient erase with holes and/or electrons, while maintaining high charge blocking barriers and deep carrier trapping sites for good charge retention. | 11-10-2011 |
| 20110170345 | METHODS, DEVICES, AND SYSTEMS RELATING TO MEMORY CELLS HAVING A FLOATING BODY - Methods, devices, and systems are disclosed relating to a memory cell having a floating body. A memory cell includes a transistor comprising a drain and a source each formed in silicon and a gate positioned between the drain and the source. The memory cell may further include a bias gate recessed into the silicon and positioned between an isolation region and the transistor. In addition, the bias gate may be configured to be operably coupled to a bias voltage. The memory cell may also include a floating body within the silicon. The floating body may include a first portion adjacent the source and the drain and vertically offset from the bias gate and a second portion coupled to the first portion. Moreover, the bias gate may be formed adjacent to the second portion. | 07-14-2011 |
| 20090147568 | Memory Elements and Methods of Using the Same - In a first aspect, a first apparatus is provided. The first apparatus is a memory element that includes (1) one or more MOSFETs each including a dielectric material having a dielectric constant of about 3.9 to about 25; and (2) control logic coupled to at least one of the one or more MOSFETs. The control logic is adapted to (a) cause the memory element to operate in a first mode to store data; and (b) cause the memory element to operate in a second mode to change a threshold voltage of at least one of the one or more MOSFETs from an original threshold voltage to a changed threshold voltage such that the changed threshold voltage affects data stored by the memory element when operated in the first mode. Numerous other aspects are provided. | 06-11-2009 |
| 20090021979 | Gate stack, capacitorless dynamic random access memory including the gate stack and methods of manufacturing and operating the same - Provided are a gate stack, a capacitorless dynamic random access memory (DRAM) including the gate stack and methods of manufacturing and operating the same. The gate stack for a capacitorless DRAM may include a tunnel insulating layer on a substrate, a first charge trapping layer on the tunnel insulating layer, an interlayer insulating layer on the first charge trapping layer, a second charge trapping layer on the interlayer insulating layer, a blocking insulating layer on the second charge trapping layer, and a gate electrode on the blocking insulating layer. The capacitorless DRAM may include the gate stack on the substrate, and a source and a drain in the substrate on both sides of the gate stack. | 01-22-2009 |
| 20120069650 | SUB-THRESHOLD MEMORY CELL CIRCUIT WITH HIGH DENSITY AND HIGH ROBUSTNESS - A high-density and high-robustness sub-threshold memory cell circuit, having two PMOS transistors P | 03-22-2012 |
| 20090097309 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE, AND METHOD FOR CONTROLLING NONVOLATILE SEMICONDUCTOR STORAGE DEVICE - According to an aspect of the present invention, there is provided, a nonvolatile semiconductor storage device including: a substrate; a stacked portion that includes a plurality of conductor layers and a plurality of insulation layers alternately stacked on the substrate, at least one layer of the plurality of conductor layers and the plurality of insulation layers forming a marker layer; a charge accumulation film that is formed on an inner surface of a memory plug hole that is formed in the stacked portion from a top surface to a bottom surface thereof; and a semiconductor pillar that is formed inside the memory plug hole through the charge accumulation film. | 04-16-2009 |
| 20090103355 | Nonvolatile semiconductor memory and data programming/erasing method - A nonvolatile semiconductor memory comprises: a semiconductor substrate; a first gate electrode formed on a surface of the semiconductor substrate through a first gate insulating film; a second gate electrode formed on the surface of the semiconductor substrate through a second gate insulating film and being adjacent to the first gate electrode through an insulating film; a charge trapping film formed at least in a trap region surrounded by the semiconductor substrate, the first gate electrode and the second gate electrode; and a tunnel insulating film formed between the charge trapping film and the second gate electrode. In one of programming and erasing, electrons are injected into the charge trapping film from the second gate electrode through the tunnel insulating film by Fowler-Nordheim tunneling. | 04-23-2009 |
| 20090213649 | Semiconductor processing device and IC card - A semiconductor processing device according to the invention includes a first non-volatile memory ( | 08-27-2009 |
| 20100208518 | MIS-TRANSISTOR-BASED NONVOLATILE MEMORY CIRCUIT WITH STABLE AND ENHANCED PERFORMANCE - A memory circuit includes a latch having a first node and a second node, a MIS transistor having a gate node, a first source/drain node coupled to the first node of the latch, and a second source/drain node, and a control circuit configured to control the gate node and second source/drain node to make a lingering change in a threshold voltage of the MIS transistor in a first operation and to cause the latch in a second operation to store data responsive to whether a lingering change in the threshold voltage is present, wherein the MIS transistor includes diffusion regions, a gate electrode, and sidewalls, wherein a metallurgical junction of each of the diffusion regions is positioned under the gate electrode, and a lateral boundary of a depletion layer in the diffusion region serving as a drain is positioned under a corresponding one of the sidewalls in the first operation. | 08-19-2010 |
| 20110242888 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The semiconductor device includes the nonvolatile memory cell in the main surface of a semiconductor substrate. The nonvolatile memory cell has a first insulating film over the semiconductor substrate, a conductive film, a second insulating film, the charge storage film capable of storing therein charges, a third insulating film over the charge storage film, a first gate electrode, a fourth insulating film in contact with the set of stacked films from the first insulating film to the foregoing first gate electrode, a fifth insulating film juxtaposed with the first insulating film over the foregoing semiconductor substrate, a second gate electrode formed over the fifth insulating film to be adjacent to the foregoing first gate electrode over the side surface of the fourth insulating film, and source/drain regions with the first and second gate electrodes interposed therebetween. The conductive film and the charge storage film are formed to two-dimensionally overlap. | 10-06-2011 |
| 20090323411 | METHOD INCLUDING SELECTIVE TREATMENT OF STORAGE LAYER - Method including selective treatment of storage layer. One embodiment includes the formation of a material layer on a topology with protruding portions, which may be assigned to active areas, and with recessed portions, which may be assigned to isolation structures. A mask material is deposited that grows selectively above the protruding portions and that forms a mask which covers first portions of the material layer wrapping around at least portions of the protruding portions. Openings in the mask are formed above second portions of the material layer above the recessed portions. Then the material layer is treated in the second portions in a self-aligned manner. | 12-31-2009 |
| 20090213650 | MIS-TRANSISTOR-BASED NONVOLATILE MEMORY - A nonvolatile semiconductor memory device includes a latch circuit including a first inverter and a second inverter cross-coupled to each other, a source node of a MIS transistor of the first inverter and a source node of a MIS transistor of the second inverter being both coupled to a plate line, and a control circuit configured to apply a first potential to the plate line in a store mode to cause a change in threshold voltage to one of the MIS transistors, and configured to apply a second potential to the plate line in a power-on mode to cause the latch circuit to latch data responsive to the change in threshold voltage generated in the store mode, such that the data latched by the latch circuit in the power-on mode is automatically output to outside the nonvolatile semiconductor memory device upon power-on thereof. | 08-27-2009 |
| 20090016101 | Reading Technique for Memory Cell With Electrically Floating Body Transistor - A semiconductor device along with circuits including the same and methods of operating the same are described. The device comprises a memory cell consisting essentially of one transistor. The transistor comprises a gate, an electrically floating body region, and a source region and a drain region adjacent the body region. The device includes data sense circuitry coupled to the memory cell. The data sense circuitry comprises a word line coupled to the gate region and a bit output coupled to the source region or the drain region. | 01-15-2009 |
| 20090021978 | Multi-bit flash memory and reading method thereof - A multi-bit flash memory and a reading method thereof. Multiple reference memory cells for saving reserved data are provided to operate together with multiple data memory cells. Before the data memory cells are read, data stored in the reference memory cell is sensed based on a present reference current. Then, a value of a new reference current for reading the data memory cells is determined according to a difference between the sensed data and the reserved data. | 01-22-2009 |
| 20110085377 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE, AND METHOD FOR CONTROLLING NONVOLATILE SEMICONDUCTOR STORAGE DEVICE - According to an aspect of the present invention, there is provided, a nonvolatile semiconductor storage device including: a substrate; a stacked portion that includes a plurality of conductor layers and a plurality of insulation layers alternately stacked on the substrate, at least one layer of the plurality of conductor layers and the plurality of insulation layers forming a marker layer; a charge accumulation film that is formed on an inner surface of a memory plug hole that is formed in the stacked portion from a top surface to a bottom surface thereof; and a semiconductor pillar that is formed inside the memory plug hole through the charge accumulation film. | 04-14-2011 |
| 20110134691 | SCALABLE MULTI-FUNCTION AND MULTI-LEVEL NANO-CRYSTAL NON-VOLATILE MEMORY DEVICE - A multi-functional and multi-level memory cell comprises a tunnel layer formed over a substrate. In one embodiment, the tunnel layer comprises two layers such as HfO | 06-09-2011 |
| 20110134690 | METHOD OF CONTROLLING A DRAM MEMORY CELL ON THE SeOI HAVING A SECOND CONTROL GATE BURIED UNDER THE INSULATING LAYER - The invention relates to a method of controlling a DRAM memory cell of an FET transistor on a semiconductor-on-insulator substrate that includes a thin film of semiconductor material separated from a base substrate by an insulating layer or BOX layer, the transistor having a channel and two control gates, a front control gate being arranged on top of the channel and separated from the latter by a gate dielectric and a back control gate being arranged in the base substrate and separated from the channel by the insulating layer (BOX). In a cell programming operation, the front control gate and the back control gate are operated jointly by applying a first voltage to the front control gate and a second voltage to the back control gate, with the first voltage being lower in amplitude than the voltage needed to program the cell when no voltage is applied to the back control gate. | 06-09-2011 |
| 20120155165 | MEMORY - An embodiment of the invention relates to a memory comprising a strained double-heterostructure having an inner semiconductor layer which is sandwiched between two outer semiconductor layers, wherein the lattice constant of the inner semiconductor layer differs from the lattice constants of the outer semiconductor layers, the resulting lattice strain in the double-heterostructure inducing the formation of at least one quantum dot inside the inner semiconductor layer, said at least one quantum dot being capable of storing charge carriers therein, and wherein, due to the lattice strain, the at least one quantum dot has an emission barrier of 1.15 eV or higher, and provides an energy state density of at least three energy states per 1000 nm | 06-21-2012 |
| 20120044760 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF - A nonvolatile semiconductor memory device has a first select transistor having a gate electrode connected to a first select word line, a source connected to a first sub bit line, and a drain connected to a first main bit line, and a second select transistor having a gate electrode connected to a second select word line, a source connected to a second sub bit line, and a drain connected to a second main bit line. The first sub bit lines are controlled by the first select transistor so as to be electrically isolated from each other between memory cell groups each formed by the memory cells to be erased simultaneously. On the other hand, the second sub bit lines are connected in common to the memory cells of memory cell groups to be erased separately, by the second select transistor. | 02-23-2012 |
| 20120044759 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF - A nonvolatile semiconductor memory device has a first select transistor having a gate connected to a first select word line extending in a column direction, a source connected to a first sub bit line, and a drain connected to a first main bit line extending in a row direction, and a second select transistor having a gate connected to a second select word line extending in the column direction, a source connected to a second sub bit line, and a drain connected to a second main bit line extending in the row direction. The second select transistor has a lower breakdown voltage than the first select transistor. | 02-23-2012 |
| 20120206960 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE USING MIS TRANSISTOR - A nonvolatile semiconductor memory device includes an MIS transistor having nodes, a control circuit configured to apply a first set of potentials to the nodes to cause an irreversible change in transistor characteristics, to apply a second set of potentials to the nodes to cause a first current to flow through the MIS transistor in a first direction, and to apply the second set of potentials to the nodes to cause a second current to flow through the MIS transistor in a second direction opposite the first direction, and a sense circuit configured to produce a signal responsive to a difference between the first current and the second current. | 08-16-2012 |
| 20120134206 | MULTILEVEL MEMORY DEVICE - A memory device comprising:
| 05-31-2012 |
| 20120075928 | SEMICONDUCTOR MEMORY DEVICE - In a semiconductor layer, information is written by applying a first potential to a first electrode, applying a second potential that is lower than the first potential to all of back gate electrodes, applying a third potential that is higher than the first potential to the first to (i−1) | 03-29-2012 |
| 20120262985 | MULIT-BIT CELL - A method for forming a device is disclosed. The method includes providing a substrate prepared with a primary gate and forming a charge storage layer on the substrate over the primary gate. A secondary gate electrode layer is formed on the substrate over the charge storage layer. The charge storage and secondary gate electrode layers are patterned to form first and second secondary gates on first and second sides of the primary gate. | 10-18-2012 |
| 20130010535 | NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT, NONVOLATILE SEMICONDUCTOR MEMORY, AND METHOD FOR OPERATING NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT - According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory element including: a semiconductor substrate including: a source region; a drain region; and a channel region; a lower insulating film that is formed on the channel region; a charge storage film that is formed on the lower insulating film and that stores data; an upper insulating film that is formed on the charge storage film; and a control gate that is formed on the upper insulating film, wherein the upper insulating film includes: a first insulting film; and a second insulating film that is laminated with the first insulating film, and wherein the first insulating film is formed to have a trap level density larger than that of the second insulating film. | 01-10-2013 |
| 20130148422 | Semiconductor Memory Having Both Volatile and Non-Volatile Functionality and Method of Operating - Semiconductor memory having both volatile and non-volatile modes and methods of operation. A semiconductor memory cell includes a substrate having a first conductivity type; a first region embedded in the substrate at a first location of the substrate and having a second conductivity type; a second region embedded in the substrate at a second location the substrate and have the second conductivity type, such that at least a portion of the substrate having the first conductivity type is located between the first and second locations and functions as a floating body to store data in volatile memory; a floating gate or trapping layer positioned in between the first and second locations and above a surface of the substrate and insulated from the surface by an insulating layer; the floating gate or trapping layer being configured to receive transfer of data stored by the volatile memory and store the data as nonvolatile memory in the floating gate or trapping layer upon interruption of power to the memory cell; and a control gate positioned above the floating gate or trapping layer and a second insulating layer between the floating gate or trapping layer and the control gate. | 06-13-2013 |
