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Fusible

Subclass of:

365 - Static information storage and retrieval

365094000 - READ ONLY SYSTEMS (I.E.. SEMIPERMANENT)

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DocumentTitleDate
20090122589ELECTRICAL FUSE SELF TEST AND REPAIR - A circuit for testing and repairing a fuse device having a plurality of fuse units and being able to serially input and output data is disclosed, the circuit comprises a first multiplexer configured to select either a true or an inverted data for being stored in the fuse device, a second multiplexer configured to select either a true or an inverted data being read out from the fuse device, a storage unit configured to store information of faulty fuse units, and an indication bit being programmed to reflect a comparison between the data intended to be stored in the fuse device and the stored faulty unit information, wherein when the indication bit is at a first state, the first and second multiplexers select the true data, and when the indication bit is at a second state, the first and second multiplexers select the inverted data.05-14-2009
20130039117ELECTRICAL FUSE BIT CELL - An electrical fuse (eFuse) bit cell includes a program transistor, a read transistor, and an eFuse. The program transistor has a first program terminal, a second program terminal, and a third program terminal. The read transistor has a first read terminal, a second read terminal, and a third read terminal. The eFuse has a first end and a second end. The first end, the first program terminal, and the second read terminal are coupled together. The read transistor is configured to be off and the program transistor is configured to be on when the eFuse bit cell is in a program mode. The program transistor is configured to be off and the read transistor is configured to be on when the eFuse bit cell is in a read mode.02-14-2013
20100046269Programmable read only memory - An array of memory cells is disclosed. The memory cell includes a fuse and at least one transistor. The transistor is used to control the programming or sensing of the fuse. A program voltage is applied to a stack of first and second conductive layers. A first portion of the stack couples the program voltage to a terminal of the transistor in a cell. A second portion of the stack couples the program voltage to a terminal of the transistor in another cell.02-25-2010
20090154217HIGH SPEED OTP SENSING SCHEME - A high speed sensing scheme for a non-volatile memory array is disclosed. The memory array includes non volatile memory cells arranged in a complementary bitline configuration includes precharge circuits for precharging the bitlines to a first voltage level such as VSS, a reference circuits for applying a reference charge on the reference bitlines of the complementary bitline pairs, and bitline sense amplifiers for sensing a voltage differential between the complementary bitline pairs. A voltage on the data bitline being changed when a programmed non-volatile memory cell connected to an activated wordline couples the wordline voltage to the data bitline.06-18-2009
20100091545ELECTICALLY PROGRAMMABLE FUSE BIT - One-time programmable (OTP) nonvolatile fuse memory cells are disclosed that do not require decoding or addressing for reading their data content. Each fuse memory cell has its content latched at its output and available at all times and can be used, for example, for code storage memories, serial configuration memories, and as individual fuse bits for ID (identification), trimming, and other post-fabrication System-on-Chip (SoC) customization needs. Means are also provided for temporary data storage for design testing, etc. In alternative embodiments, using two differentially programmed fuses in a single memory cell, the selection and programming circuitry are merged.04-15-2010
20100328987E-FUSE APPARATUS FOR CONTROLLING REFERENCE VOLTAGE REQUIRED FOR PROGRAMMING/READING E-FUSE MACRO IN AN INTEGRATED CIRCUIT VIA SWITCH DEVICE IN THE SAME INTEGRATED CIRCUIT - An electrically programmable fuse (e-fuse) apparatus includes an e-fuse macro and a switch device. The e-fuse macro is disposed in an integrated circuit, and has a plurality of e-fuse units. The switch device is disposed in the integrated circuit, and has an output node coupled to the e-fuse units and a first input node coupled to a first power source which supplies a first reference voltage acting as a programming voltage of the e-fuse macro. The switch device connects the first power source to the e-fuse units when the e-fuse macro is operated under a programming mode.12-30-2010
20090316466METHOD, APPARATUS AND SYSTEM, PROVIDING A ONE-TIME PROGRAMMABLE MEMORY DEVICE - Disclosed are apparatus, system and methods of programming and readout of a one-time programmable memory devise having an array of memory cells, where the cells include an anti-fuse element and an in-cell amplifier transistor. Circuitry configured for programming and correlated double sampling readout of the cells is also disclosed.12-24-2009
20090040804FUSE CIRCUIT - A fuse circuit in accordance with one embodiment of the present invention includes a first power supply liner a second power supply liner a current source connected between the first power supply line and an output terminal, a first transistor having a drain or a collector connected to the output terminal, the first transistor having a current supply capability or a current draw capability larger than that of the current source for the output terminal, a second transistor having a gate or a base connected in common with the gate or the base of the first transistor, a first resistive element and a fuse connected in series between the source or the emitter of either one of the first or second transistor and the second power supply line, and a second resistive element connected between the source or the emitter of the other one of the first or second transistor and the second power supply line.02-12-2009
20130058151NON-VOLATILE MEMORY WITH SPLIT WRITE AND READ BITLINES - Read and write operations of a non-volatile memory (NVM) bitcell have different optimum parameters resulting in a conflict during design of the NVM bitcell. A single bitline in the NVM bitcell prevents optimum read performance. Read performance may be improved by splitting the read path and the write path in a NVM bitcell between two bitlines. A read bitline of the NVM bitcell has a low capacitance for improved read operation speed and decreased power consumption. A write bitline of the NVM bitcell has a low resistance to handle large currents present during write operations. A memory element of the NVM bitcell may be a fuse, anti-fuse, eFUSE, or magnetic tunnel junction. Read performance may be further enhanced with differential sensing read operations.03-07-2013
20130058150OTP MEMORY - The present invention provides an OTP memory having higher confidentiality. A memory cell has a memory transistor forming a current path between first and second nodes, a selection transistor forming a current path between third and fourth nodes, the third node being coupled to the gate of the memory transistor via a line, and a capacitor coupled to the first node. By applying high voltage which does not break but deteriorates a gate oxide film and increases gate leak current to a memory transistor, data is written. Data can be read by the presence/absence of leak of charges accumulated in the capacitor. Since the position of deterioration in the gate oxide film cannot be discriminated by a physical analysis, confidentiality is high.03-07-2013
20120224406Circuit and System of Using Junction Diode as Program Selector for One-Time Programmable Devices - Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The OTP device has at least one OTP element coupled to at least one diode in a memory cell. The diode can be constructed by P+ and N+ active regions in a CMOS N well, or on an isolated active region as the P and N terminals of the diode. The isolation between P+ and the N+ active regions of the diode in a cell or between cells can be provided by dummy MOS gate, SBL, or STI/LOCOS isolations. The OTP element can be polysilicon, silicided polysilicon, silicide, metal, metal alloy, local interconnect, thermally isolated active region, CMOS gate, or combination thereof.09-06-2012
20090237975One-time programmable memory cell - A disclosed embodiment is a programmable memory cell having improved IV characteristics comprising a thick oxide spacer transistor interposed between a programmable thin oxide antifuse and a thick oxide access transistor. The spacer transistor separates a rupture site formed during programming the programmable antifuse from the access transistor, so as to result in the improved IV characteristics. The programmable antifuse is proximate to one side of the spacer transistor, while the access transistor is proximate to an opposite side of the spacer transistor. The source region of the access transistor is coupled to ground, and the drain region of the access transistor also serves as the source region of the spacer transistor. The access transistor is coupled to a row line, while the spacer transistor and the programmable antifuse are coupled to a column line. The rupture site is formed during programming by applying a programming voltage to the programmable antifuse.09-24-2009
20090237974Programmable memory cell - A disclosed embodiment is a programmable memory cell comprising an elevated ground node having a voltage greater than a common ground node by an amount substantially equal to a voltage drop across a trigger point adjustment element. In one embodiment, the trigger point adjustment element can be a diode. The trigger voltage of the programmable memory cell is raised closer to a supply voltage when current passes through the trigger point adjustment element during a write operation. The programmable memory cell can comprise a pair of cross-coupled inverters, and first and second programmable antifuses that can be coupled to each inverter in the pair of cross-coupled inverters. Since the trigger voltage of the programmable memory cell is raised closer to the supply voltage, a programmed antifuse can easily reach below the trigger voltage and result in a successful write operation even when the supply voltage is a low voltage.09-24-2009
20090231900Fuse devices and methods of operating the same - A fuse device includes a fuse unit, which includes a cathode, an anode, and a fuse link coupling the cathode and the anode. A transistor includes at least a portion of the fuse unit to be used as an element of the transistor.09-17-2009
20090231901SEMICONDUCTOR INTEGRATED CIRCUIT FOR SUPPORTING A TEST MODE - A semiconductor integrated circuit for supporting a test mode includes a program region including at least one One Time Programmable Cell Array, and a program region control unit configured to activate the program region in response to an enabled fuse signal of a fuse corresponding to the program region, and to activate the program region in response to a test mode signal of the program region.09-17-2009
20100177548MULTILEVEL ONE-TIME PROGRAMMABLE MEMORY DEVICE - A multilevel one-time programmable memory device includes a plurality of memory cells, wherein each of the plurality of memory cells includes: a first electrode to which a first voltage is applied, a second electrode to which a second voltage is applied and a plurality of fuse lines performing a fusing operation according to a voltage difference between the first electrode and the second electrode. The plurality of fuse lines are connected to each other between the first electrode and the second electrode. In addition, at least one of the first electrode and the second electrode is formed such that the first electrode and the second electrode have different valid line lengths from each other therebetween so that the plurality of fuse lines have different resistances from each other.07-15-2010
20110292711DATA ENCODING SCHEME TO REDUCE SENSE CURRENT - Techniques for encoding and decoding fuse data to reduce sense current are disclosed. An embodiment to encode fuse sense data includes inverting each of the bits of the fuse data and using an individual fuse as a flag bit to record the data inversion. The states of the respective fuses may represent different logic states. A fuse may be blown to indicate a logic one and likewise, an unblown fuse may indicate a logic zero. A blown fuse and an unblown fuse may have different current consumption. An unblown fuse may consume more sensing current compared to a blown fuse. Another embodiment to decode the encoded fuse data includes embedded logic circuits and a separate fuse as a flag bit. Encoding and decoding fuse data may reduce fuse sensing current.12-01-2011
20100118584MEMORY DEVICE USING ANTIFUSES - Herein described is a method of implementing one or more native NMOS antifuses in an integrated circuit. Also described is a method for programming one or more native NMOS antifuses used within a memory device. The method further comprises verifying one or more states of the one or more native NMOS antifuses after the programming has been performed. In a representative embodiment, the one or more native NMOS antifuses are implemented by blocking the implantation of a dopant into a substrate of an integrated circuit. In a representative embodiment, an integrated circuit incorporates the use of one or more native NMOS antifuses. In a representative embodiment, the integrated circuit comprises a memory device, such as a one time programmable memory.05-13-2010
20090201713Unit cell of nonvolatile memory device and nonvolatile memory device having the same - A One-Time Programmable (OTP) unit cell and a nonvolatile memory device having the same are disclosed. A unit cell of a nonvolatile memory device includes: an anti-fuse connected between an output terminal and a ground voltage terminal; a first switching unit connected to the output terminal to transfer a write voltage to the output terminal; and a second switching unit connected to the output terminal to transfer a read voltage to the output terminal.08-13-2009
20090262566MASK PROGRAMMABLE ANTI-FUSE ARCHITECTURE - A memory array having both mask programmable and one-time programmable memory cells connected to the wordlines and the bitlines. All memory cells of the memory array are configured as one-time programmable memory cells. Any number of these one-time programmable memory cells are convertible into mask programmable memory cells through mask programming, such as diffusion mask programming or contact/via mask programming. Manufacturing of such a hybrid memory array is simplified because both types of memory cells are constructed of the same materials, therefore only one common set of manufacturing process steps is required. Inadvertent user programming of the mask programmable memory cells is inhibited by a programming lock circuit.10-22-2009
20090262567NONVOLATILE MEMORY DEVICE - A nonvolatile memory device including one-time programmable (OTP) unit cell is provided. The nonvolatile memory device includes: a unit cell; a detecting unit configured to detect data from the unit cell; and a read voltage varying unit configured to vary an input voltage and supply a varied read voltage to the unit cell.10-22-2009
20110199809SECURITY CIRCUIT HAVING AN ELECTRICAL FUSE ROM - A security circuit includes an electrical fuse read only memory (ROM) including a plurality of electrical fuse units. The electrical fuse units are arranged to correspond to bit values of an initial security key before the electrical fuse ROM is programmed.08-18-2011
20100110750NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - The row decoder receives writing instruction signal and reading instruction signal to selectively activate one of the word lines according to an input state of row address signals. The data buffer receives a data input signal when the writing instruction signal is received, and drives corresponding one of the bit lines and amplifies a minute reading signal transmitted to one of the bit lines to output a data output signal when the reading instruction signal is received.05-06-2010
20100061136Semiconductor Memory Device and Semiconductor Device - An anti-fuse memory device includes a plurality of word lines, a plurality of bit lines, and a memory cell provided with respect to an intersecting portion of any of the plurality of word lines and any of the plurality of bit lines. Memory cell includes a PIN diode and an anti-fuse. An anode of the PIN diode is electrically connected to any of the bit lines. A cathode of the PIN diode is electrically connected to a first terminal of the anti-fuse. A second terminal of the anti-fuse is electrically connected to any of the word lines. The anti-fuse includes a silicon layer and an insulating layer which are interposed between electrodes.03-11-2010
20080198642SEMICONDUCTOR MEMORY DEVICE - A memory cell includes an antifuse device that is capable of having data written thereto by breakdown of a gate dielectric film by application of a high voltage. A data inversion portion generates, according to a relationship between the sense amplifier's determination and write data to be written to the memory cell, inverted write data obtained by inverting the write data. The data inversion portion also inverts, when data is read from the memory cell to which the inverted write data is written, the read data and reads it.08-21-2008
20090059645One time programmable memory - A one-time programmable memory. The one-time programmable memory has an antifuse and a read circuit configured to read the antifuse. An isolation transistor couples the antifuse to the read circuit. The read circuit and the isolation transistor have different power domains.03-05-2009
20090080232AREA EFFICIENT PROGRAMMABLE READ ONLY MEMORY (PROM) ARRAY - A programmable ROM (PROM) architecture includes cascode NMOS transistors with a fuse bit cell that is arrayed, with sleep transistors located in each column of the array that in a standby mode shut down the entire fuse array. A fuse redundancy scheme may be used to repair a defective fuse row.03-26-2009
20090135640ELECTROMIGRATION-PROGRAMMABLE SEMICONDUCTOR DEVICE WITH BIDIRECTIONAL RESISTANCE CHANGE - An electromigration-programmable semiconductor device may be programmed to increase the resistance or to decrease the resistance by selecting the amount of current passed through the electromigration-programmable semiconductor device. The electromigration-programmable semiconductor device comprises an anode, a cathode, and a link, each having a semiconductor portion and a metal semiconductor alloy portion. The metal semiconductor alloy portion of the link comprises two disjoined sub-portions with a gap therebetween. A low programming current fills the gap by electromigrating a small amount of metal semiconductor alloy from the cathode, A high programming current forms a large metal-semiconductor-alloy-deleted area in the cathode to increase the resistance. A tri-state programming is achieved by selecting the programming current level.05-28-2009
20090141535METHODS INVOLVING MEMORY WITH HIGH DIELECTRIC CONSTANT ANTIFUSES ADAPTED FOR USE AT LOW VOLTAGE - Methods involve using a memory array having memory cells comprising a diode and an antifuse, in which the antifuse is made smaller and programmed at lower voltage by using an antifuse material having a higher dielectric constant and a higher acceleration factor than those of silicon dioxide, and in which the diode is made of a material having a lower band gap than that of silicon. Such memory arrays can be made to have long operating lifetimes by using the high acceleration factor and lower band gap materials. Antifuse materials having dielectric constants between 5 and 27, for example, hafnium silicon oxynitride or hafnium silicon oxide, are particularly effective. Diode materials with band gaps lower than that of silicon, such as germanium or a silicon-germanium alloy, are particularly effective.06-04-2009
20120092916Built-In Self Test for One-Time-Programmable Memory - An apparatus and method of testing one-time-programmable memory provides one-time-programmable memory having one or more memory locations for storing data and corresponding programming circuitry for each memory location. In addition, each programming circuitry has a circuit element configured to permanently change state to store the data in the memory. The method also reads each memory location to verify that the memory location is unprogrammed and activates the programming circuitry for each memory location, which applies a test current to the programming circuitry. The test current is less than a threshold current needed to permanently change the state of the circuit element. The method then determines whether the programming circuitry is functioning properly.04-19-2012
20090141533METAL GATE COMPATIBLE ELECTRICAL ANTIFUSE - A metal layer and a semiconductor layer are sequentially deposited on a substrate. The semiconductor layer and the metal layer are lithographically patterned to form a stack of a semiconductor portion and a metal gate portion, which is preferably performed concurrently with formation of at least one metal gate stack. In one embodiment, the size of the semiconductor portion is reduced and a metal semiconductor alloy portion is formed on the semiconductor portion by metallization. In a first electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the metal semiconductor alloy portion and the metal gate portion. In another embodiment, two disjoined metal semiconductor alloy portions are formed on the semiconductor portion. In a second electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the two previously disjoined metal semiconductor alloy portions.06-04-2009
20090052220ONE-TIME PROGRAMMABLE NON-VOLATILE MEMORY - An apparatus includes a semiconductor substrate, elongated diffused well regions, and elongated conductors. The semiconductor substrate has a first electrical conductivity type. The elongated diffused well regions are in the semiconductor substrate. The diffused well regions have a second electrical conductivity type opposite the first electrical conductivity type. Each of the elongated electrical conductors crosses the diffused well regions at respective locations of one-time programmable memory cells. Each of the memory cells includes a antifuse structure between the respective diffused well region and the respective electrical conductor. Each of the memory cells has a first state in which the antifuse structure has a first electrical resistance and a second state in which the antifuse structure has a second electrical resistance lower than the first electrical resistance. In the second state, each of the memory cells includes a rectifying junction between the respective diffused well region and the respective electrical conductor.02-26-2009
20090052221SEMICONDUCTOR DEVICE INCLUDING ANTIFUSE ELEMENT - An element isolation region exists at a side opposite to a diffusion layer region as seen from a channel region, without another electrode to which the same potential as one applied to the diffusion layer region is applied interposed between the channel region and the element isolation region. The electric field applied to the gate insulating film is not uniform and the magnitude of the electric field is increased when approaching closer to the diffusion layer region. Therefore, breakdown is likely to occur at parts closer to the diffusion layer region.02-26-2009
20090003028Carbon nanotube fuse element - In one embodiment of the invention, a fuse element for a one time programmable memory may include carbon nanotubes coupled to a first transistor node and to a second transistor node. The carbon nanotubes may have a first resistance which may be changed upon programming the memory cell with low current levels.01-01-2009
20090219747METHOD OF PROGRAMMING A MEMORY HAVING ELECTRICALLY PROGRAMMABLE FUSES - An array of memory cells is arranged in a plurality of columns and rows, each of the memory cells comprising a programmable fuse connected to a predetermined bit line and in series with a select transistor. The select transistor has a first current electrode connected to a reference voltage terminal, a control electrode connected to a predetermined word line, and a second current electrode connected to the programmable fuse. The select transistor further has a semiconductor body adjacent to which the first current electrode and the second current electrode are located. These electrodes are separated by a channel. A signal terminal that is connected to the semiconductor body receives an input signal to forward bias the channel to the first current electrode during programming of the programmable fuse to increase a programming current of the programmable fuse.09-03-2009
20090251943TEST CIRCUIT FOR AN UNPROGRAMMED OTP MEMORY ARRAY - Circuits for testing unprogrammed OTP memories to ensure that wordline and bitline connections, column decoders, wordline drivers, correctness of decoding, sensing and multiplexing operate properly. The OTP testing system includes one or both of column test circuitry and row test circuitry. The column test circuitry charges all the bitlines to a voltage level similar to that provided by a programmed OTP memory cell during a read operation, in response to activation of a test wordline. The bitline voltages can be sensed, thereby allowing for testing of the column decoding and sense amplifier circuits. The row test circuitry charges a test bitline to a voltage level similar to that provided by a programmed OTP memory cell during a read operation, in response to activation of a wordline of the OTP memory array. This test bitline voltage can be sensed, thereby allowing for testing of the row decoding and driver circuits.10-08-2009
20100265754SEMICONDUCTOR MEMORY DEVICE AND DATA PROCESSING DEVICE - When writing into an antifuse memory element finishes, a value of resistance of the memory element rapidly decreases; accordingly, an output voltage of a boosting circuit which produces a writing voltage rapidly decreases. By detecting a change in the output voltage of the boosting circuit to control a writing command, the writing operation can be stopped immediately after the memory element is shorted. Thus, unnecessary current consumption caused by continuing a writing operation on the shorted memory element can be suppressed.10-21-2010
20120195091Method and System for Split Threshold Voltage Programmable Bitcells - A memory device includes an antifuse. The antifuse is configured to program a bit cell of the memory device. The antifuse is configured with a PMOS device08-02-2012
20100182818Non-volatile semiconductor memory device and method of writing data therein - A device includes a memory cell array and a control circuit, the memory cell array inclusing word-lines, bit-lines, and memory cells arranged at the intersections of the word-lines and the bit-lines, each memory cell inclusing an electrically programmable antifuse element. The control circuit may perform, as a first step, applying a programming voltage to one of the word-lines while applying a ground voltage to bit-lines each connected to respective selected memory cells, and as a second step, after the first step, keeping one of the one word-lines at the programming voltage while concurrently reading the electrical states of the selected memory cells, and according to the read electrical states, applying the ground voltage again to a bit-line connected to an unprogrammed selected memory cell after the first step, and applying a voltage higher than the ground voltage to a bit-line connected to a programmed selected memory cell after the first step.07-22-2010
20100188881Method and Device for Correcting and Obtaining Reference Voltage - The present invention discloses a method for adjusting a reference voltage, including: decoding a default code configured in a reference voltage register in a chip to obtain an actual reference voltage; comparing the actual reference voltage with a benchmark value to obtain a deviation value between the two; configuring an adjustment code according to the deviation value; and, burning the adjustment code into a nonvolatile storage medium. The present invention also discloses an apparatus for adjusting a reference voltage. According to the method and apparatus for adjusting a reference voltage provided by embodiments of the present invention, the reference voltage need not be adjusted according to an external power supply's different application schemes. Thus, adjustment on the reference voltage of the chip is standardized and costs of the chip's application schemes are saved. Embodiments of the present invention further provide a method and apparatus for obtaining a reference voltage, which makes it not necessary to configure a dedicated reference voltage pin in the chip for introducing an external reference voltage, and thus stability of the circuit's working is improved and costs of the chip's applications are decreased.07-29-2010
20100157648SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WITH FUSE ELEMENTS AND CONTROL METHOD THEREFORE - A semiconductor integrated circuit device includes a first block, a second block, and a control section. The first block includes a first fuse, a first switching configured to write data to the first fuse, a first holding portion capable of holding a first instruction, and a first instruction portion configured to turn on the first switching when a second instruction is given thereto with the first instruction. The second block includes a second fuse, a second switching configured to write data to the second fuse, a second holding portion capable of holding the first instruction, and a second instruction portion configured to turn on the second switching when the second instruction is given thereto with the first instruction. The control section issues the second instruction at a point in time when the first instruction is held in the first and second holding portions.06-24-2010
20100177549Silicide-silicon oxide-semiconductor antifuse device and method of making - An antifuse contains a first silicide layer, a grown silicon oxide antifuse layer on a first surface of the first silicide layer, and a first semiconductor layer having a first surface in contact with the antifuse layer.07-15-2010
20100214816SEMICONDUCTOR DEVICES SUPPORTING MULTIPLE FUSE PROGRAMMING MODES - Semiconductor devices include a plurality of fuses and a plurality of program circuits, respective ones of which are configured to program respective ones of the plurality of fuses. The devices further include a shift register configured to activate at least two of the program circuits. In some embodiments, the shift register includes a first shift register configured to generate first select signals and a second shift register configured to generate second select signals corresponding to data to be programmed to the plurality of fuses. Respective ones of the program circuits may be configured to program respective ones of the fuses responsive to respective pairs of the first select signals and the second select signals.08-26-2010
20110058402Semiconductor device having nonvolatile memory elements - A bit memory circuit of an antifuse element set includes two antifuse elements of which logical states are changed from an insulation state to a conductive state when a program voltage is applied. 1-bit data is represented by the logical states of the two antifuse elements. The two antifuse elements are collectively controlled by one decoder circuit. When writing data, the decoder circuit simultaneously performs insulation-breakdown on the two antifuse elements by simultaneously connecting the two antifuse elements to program voltage lines, respectively.03-10-2011
20090116274DIODE-LESS ARRAY FOR ONE-TIME PROGRAMMABLE MEMORY - A one-time programmable memory array includes a first row conductor extending in a first row direction and disposed at a first elevation, a second row conductor extending in a second row direction and disposed at a second elevation and a column conductor extending in a column direction and disposed adjacent to the first row conductor and adjacent to the second row conductor. The array also includes a dielectric layer covering at least a portion of the column conductor, a fuse link coupled between the dielectric layer on the column conductor and the second row conductor.05-07-2009
20090141534DETECTION APPARATUS AND METHOD FOR SEQUENTIALLY PROGRAMMING MEMORY - A detection apparatus for sequentially programming a memory is provided. The detection apparatus comprises a current sensor and a programming controller. The current sensor is coupled to a programming source and a memory cell. The current sensor detects change of a programming current between the programming source and the memory cell and generates a control signal according to the detection result. The programming controller is coupled to the current sensor. The programming controller receives the control signal and generates a programming state signal.06-04-2009
20100220511LOW POWER ANTIFUSE SENSING SCHEME WITH IMPROVED RELIABILITY - Generally, a method and circuit for improving the retention and reliability of unprogrammed anti-fuse memory cells. This is achieved by minimizing the tunneling current through the unprogrammed anti-fuse memory cells which can cause eventual gate oxide breakdown. The amount of time a read voltage is applied to the anti-fuse memory cells is reduced by pulsing a read voltage applied to a wordline connected to the unprogrammed anti-fuse memory cells, thereby reducing the tunneling current. Further tunneling current can be reduced by decoupling the unprogrammed anti-fuse memory cells from a sense amplifier that can drive the corresponding bitline to VSS.09-02-2010
20090109723Quad SRAM Based One Time Programmable Memory - A quad SRAM based one time programmable memory cell is provided. Prior to programming, the memory cell operates as an SRAM memory cell. After programming, the memory cell operates as a one-time programmable non-volatile memory cell. The memory cell includes a storage element coupled at a first side to a first upper fuse and a first lower fuse and coupled at a second side to a second upper fuse and a second lower fuse. When the first upper fuse and second lower fuse are programmed, the storage element outputs a first value. When the second upper fuse and first lower fuse are programmed, the storage element outputs a second value. After programming the upper fuse acts as a pull-up fuse and the lower fuse acts as a pull-down fuse hold the state of the cell.04-30-2009
20090109725Data storage in circuit elements with changed resistance - A method of storing data in an array of circuit elements, said method comprising injecting a current into selected circuit elements, said current causing a persistent change in a resistance of said selected circuit elements from a first resistance to a second higher resistance indicative of a binary data bit, wherein said current does not break an electrical circuit in which said circuit element is disposed.04-30-2009
20100309709UNIT CELL OF NONVOLATILE MEMORY DEVICE AND NONVOLATILE MEMORY DEVICE WITH THE SAME - Disclosed are a unit cell capable of improving a reliability by enhancing a data sensing margin in a read operation, and a nonvolatile memory device with the same. The unit cell of a nonvolatile memory device includes: an antifuse having a first terminal between an input terminal and an output terminal; and a first switching unit coupled between a second terminal of the antifuse and a ground voltage terminal.12-09-2010
20100302833Semiconductor device having nonvolatile memory element and manufacturing method thereof - To provide a semiconductor device including a pair of antifuse elements at either a high level or a low level, an OR circuit that outputs different logic information for a case that at least one of the antifuse elements is at a high level and a case that both of the antifuse elements are at a low level, and an exclusive OR circuit that outputs different logic information for a case that the logic states are different from each other and a case that they are same as each other.12-02-2010
20110116299SEMICONDUCTOR DEVICE - To provide a semiconductor device capable of reducing the line width of a fuse.05-19-2011
20120243288METHOD FOR LEAKAGE REDUCTION IN MEMORY CIRCUITS - An apparatus includes a bit cell of a programmable memory circuit. The bit cell includes a programmable device. The bit cell includes a first device having a first type. The first device is configured to conduct a first current between a first node and a second node in response to a first value of a signal on the word line and a signal on a bit line. The programmable device is configured to be programmed in response to a first level of the first current. The bit cell includes a circuit coupled to the second node. The circuit is configured to reduce a leakage current through the first device in response to a second value of the signal on the word line and based on a feedback signal. In at least one embodiment of the apparatus, the feedback signal is based on a signal on the bit line.09-27-2012
20090323388Buried Bit Line Anti-Fuse One-Time-Programmable Nonvolatile Memory - An anti-fuse one-time-programmable (OTP) nonvolatile memory cell has a P well substrate with two P.sup.− doped regions. Another N.sup.+ doped region, functioning as a bit line, is positioned adjacent and between the two P.sup.− doped regions on the substrate. An anti-fuse is defined over the N.sup.+ doped region. Two insulator regions are deposited over the two P.sup.− doped regions. An impurity doped polysilicon layer is defined over the two insulator regions and the anti-fuse. A polycide layer is defined over the impurity doped polysilicon layer. The polycide layer and the polysilicon layer function as a word line. A programmed region, i.e., a link, functioning as a diode, is formed on the anti-fuse after the anti-fuse OTP nonvolatile memory cell is programmed. The array structure of anti-fuse OTP nonvolatile memory cells and methods for programming, reading, and fabricating such a cell are also disclosed.12-31-2009
20100014340Quad SRAM Based One Time Programmable Memory - A differential latch-based one time programmable memory cell is provided. The differential latch-based one time programmable memory cell includes a differential latching amplifier having a first set of fuse devices coupled to the first input and a second set of fuse devices coupled to the second input. Only one set of fuse devices can be programmed in a memory cell. If one or more fuse devices in a set of fuse devices are programmed, the side having the programmed fuse will present a lower voltage at its input to the differential latching amplifier. Differential latching amplifier outputs a “0” or a “1” depending on the side having the programmed fuse.01-21-2010
20090067211Electronic Fuse System and Methods - An electronic fuse system and method are disclosed employing a fuse ROM having one or more blocks of memory. Each block of memory comprises a plurality of words with at least one word of the plurality of words containing security bits associated with a respective block. An electronic fuse controller is in communication with the fuse ROM and one or more external devices that are configured to request one or more words that reside in the fuse ROM from the electronic fuse controller. At least one security register includes indication bits that provide an indication whether security bits have been obtained for a respective block of memory of the fuse ROM after a power down and power up cycle. The electronic fuse controller provides the requested word if an indication bit associated with the block of memory is set.03-12-2009
20090109724Differential Latch-Based One Time Programmable Memory - A differential latch-based one time programmable memory cell is provided. The differential latch-based one time programmable memory cell includes a differential latching amplifier having a first set of fuse devices coupled to the first input and a second set of fuse devices coupled to the second input. Only one set of fuse devices can be programmed in a memory cell. If one or more fuse devices in a set of fuse devices are programmed, the side having the programmed fuse will present a lower voltage at its input to the differential latching amplifier. Differential latching amplifier outputs a “0” or a “1” depending on the side having the programmed fuse.04-30-2009
20100128511High density prom - The invention shows how diodes in a modern semiconductor process can be used as a very compact switch element in a Programmable Read Only Memory (PROM) using common integrated circuit fuse elements such as polysilicon and metal. This compact switch element allows very dense PROM arrays to be realized since diodes have the highest conduction density of any semiconductor device. The high conduction density is used to provide the relatively high current needed to blow the fuse element open. Since MOSFETs are typically used as fuse array switch elements, a relatively large area is required for the MOSFET to reach the current needed to blow the fuse element. Since diodes are two terminal switch elements unlike MOSFETs which are three terminal devices, methods are outlined on how to both read and write the arrays using this two terminal switch.05-27-2010
20080316789Random Access Electrically Programmable E-Fuse Rom - A one-time-programmable-read-only-memory (OTPROM) is implemented in a two-dimensional array of aggressively scaled suicide migratable e-fuses. Word line selection is performed by decoding logic operating at V12-25-2008
20110080764ONE-TIME PROGRAMABLE CELL CIRCUIT, SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING THE SAME, AND DATA JUDGING METHOD THEREOF - Provided is a semiconductor integrated circuit including: an anti-fuse element that electrically connects a first node and a first power supply terminal when data is written and electrically disconnect the first node and the first power supply terminal when data is not written; a first switch circuit that is connected between the first node and a first data line applied with a predetermine first voltage, and enters an off state from an on state according to a first control signal; and a detection part that detects write data of the anti-fuse element according to whether a voltage of the first node is substantially the same as the first voltage or substantially the same as a supply voltage of the first power supply terminal when the first switch circuit enters the off state.04-07-2011
20100165699ANTIFUSE PROGRAMMABLE MEMORY ARRAY - Techniques and circuitry are disclosed for efficiently implementing programmable memory array circuit architectures, such as PROM, OTPROM, and other such programmable non-volatile memories. The circuitry employs an antifuse scheme that includes an array of memory bitcells, each containing a program device and an antifuse element configured with current path isolation well and for storing the memory cell state. The bitcell configuration, which can be used in conjunction with column/row select circuitry, power selector circuitry, and/or readout circuitry, allows for high-density memory array circuit designs and layouts.07-01-2010
20120039105SEMICONDUCTOR DEVICE - Both decreasing access time and power consumption and improving storage bit count per one word line are compatibly attained. A memory cell array 02-16-2012
20110317468Non-Volatile Memory with Split Write and Read Bitlines - Read and write operations of a non-volatile memory (NVM) bitcell have different optimum parameters resulting in a conflict during design of the NVM bitcell. A single bitline in the NVM bitcell prevents optimum read performance. Read performance may be improved by splitting the read path and the write path in a NVM bitcell between two bitlines. A read bitline of the NVM bitcell has a low capacitance for improved read operation speed and decreased power consumption. A write bitline of the NVM bitcell has a low resistance to handle large currents present during write operations. A memory element of the NVM bitcell may be a fuse, anti-fuse, eFUSE, or magnetic tunnel junction. Read performance may be further enhanced with differential sensing read operations.12-29-2011
20120044740ONE-TIME PROGRAMMABLE MEMORIES USING JUNCTION DIODES AS PROGRAM SELECTORS - Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. The OTP device has an OTP element coupled to the diode. The OTP device can be used to construct a two-dimensional OTP memory with the N terminals of the diodes in a row connected as a wordline and the OTP elements in a column connected as a bitline. By applying a high voltage between a selected bitline and a selected wordline to turn on a diode in a selected cell for suitable duration of time, a current flows through an OTP element in series with the program selector may change the resistance state. The cell data in the OTP memory can also be read by turning on a selected wordline and to couple a selected bitline to a sense amplifier. The wordlines may have high-resistivity local wordlines coupled to low-resistivity global wordlines through conductive contact(s) or via(s).02-23-2012
20120044739CIRCUIT AND SYSTEM OF USING JUNCTION DIODE AS PROGRAM SELECTOR FOR ONE-TIME PROGRAMMABLE DEVICES - Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The OTP device has an OTP element coupled to a diode in a memory cell. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. By applying a high voltage to the P terminal of a diode and switching the N terminal of a diode to a low voltage for suitable duration of time, a current flows through an OTP element in series with the program selector may change the resistance state. The P+ active region of the diode can be isolated from the N+ active region in the N well by using dummy MOS gate, SBL, or STI/LOCOS isolations. If the resistive element is an interconnect fuse based on CMOS gate material, the resistive element can be coupled to the P+ active region by an abutted contact such that the element, active region, and metal are connected in a single rectangular contact.02-23-2012
20120044738ONE-TIME PROGRAMMABLE MEMORIES USING POLYSILICON DIODES AS PROGRAM SELECTORS - Polysilicon diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, using electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse etc. as OTP element The diode can be constructed by P+/N+ implants on a polysilicon as a program selector. The OTP device has an OTP element coupled to a polysilicon diode. The OTP devices can be used to construct a two-dimensional OTP memory with the N-terminals of the diodes in a row connected as a wordline and the OTP elements in a column connected as a bitline. By applying a high voltage between a selected bitline and a selected wordline to turn on a diode in a selected cell for suitable duration of time, a current flows through an OTP element may change the resistance state. The cell data in the OTP memory can also be read by turning on a selected wordline and to couple a selected bitline to a sense amplifier. The wordlines may have high-resistivity local wordlines coupled to low-resistivity global wordlines through conductive contact(s) or via(s).02-23-2012
20120044737CIRCUIT AND SYSTEM OF USING POLYSILICON DIODE AS PROGRAM SELECTOR FOR ONE-TIME PROGRAMMABLE DEVICES - Polysilicon diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The OTP device has an OTP element coupled to a diode in a memory cell. The diode can be constructed by P+/N+ implants on a polysilicon as a program selector. By applying a high voltage to an OTP element coupled to the P-terminal of a diode and switching the N-terminal of a diode to a low voltage for suitable duration of time, a current flows through the OTP element may change the resistance state. On the polysilicon diode, the spacing and doping level of a gap between the P- and N-implants can be controlled for different breakdown voltages and leakage currents. The Silicide Block Layer (SBL) can be used to block silicide formation on the top of polysilicon to prevent shorting. If the OTP element is a polysilicon electrical fuse, the fuse element can be merged with the polysilicon diode in one piece to save area.02-23-2012
20120008363Diode-Less Array for One-Time Programmable Memory - A one-time programmable memory array includes a first row conductor extending in a first row direction and disposed at a first elevation, a second row conductor extending in a second row direction and disposed at a second elevation and a column conductor extending in a column direction and disposed adjacent to the first row conductor and adjacent to the second row conductor. The array also includes a dielectric layer covering at least a portion of the column conductor, a fuse link coupled between the dielectric layer on the column conductor and the second row conductor.01-12-2012
20090086526APPARATUS, EMBEDDED MEMORY, ADDRESS DECODER, METHOD OF READING OUT DATA AND METHOD OF CONFIGURING A MEMORY - Embodiments of the invention relate generally to an apparatus, to an embedded memory, to an address decoder, to a method of reading out data and to a method of configuring a memory. In an embodiment of the invention an apparatus is provided. The apparatus may include a plurality of read-only memory (ROM) cells and an address decoder to access a ROM cell of the plurality of ROM cells, the address decoder further being fuse-programmable to divert an access to the ROM cell to a different memory cell.04-02-2009
20100202184One-Time Programmable Fuse with Ultra Low Programming Current - A method of operating a FinFET fuse includes providing the FinFET fuse including a drain, a gate, a source, and a channel between the drain and the source; and applying a program voltage to one of the source and the drain of the FinFET fuse to cause a punch-through in the channel of the FinFET fuse. The method further includes determining a program state of the FinFET fuse.08-12-2010
20110080765PROGRAMMABLE ANTIFUSE TRANSISTOR AND METHOD FOR PROGRAMMING THEREOF - Programmable antifuse transistor, in particular n-channel MOS transistor, and a method for programming at least one such antifuse transistor, includes at least one gate with a gate terminal, source with a source terminal, drain with a drain terminal, and substrate with a substrate terminal, configured so that active circuits/circuit elements do not have to be located at a distance from the antifuse, minimizing area requirements, without additional process steps the level of the potential difference between source terminal and substrate terminal is less than about 0.5 volts, drain terminal and source terminal lie at different potentials. By adjusting drain-source voltage and/or the gate-source voltage a flow of charge carriers occurs between source and drain, causing semiconductor material between source and drain to be thermally heated and to locally melt, forming at least one permanently conducting channel between source and drain.04-07-2011
20110103127AND-TYPE ONE TIME PROGRAMMABLE MEMORY CELL - An AND-type anti-fuse memory cell, and a memory array consisting of AND-type anti-fuse memory cells. Chains of AND type anti-fuse cells are connected in series with each other, and with a bitline contact, in order to minimize the area occupied by the memory array. Each AND type anti-fuse cell includes an access transistor serially connectable to the bitline or the access transistors of other AND type anti-fuse cells, and an anti-fuse device. The channel region of the access transistor is connected to the channel region of the anti-fuse device, and both channel regions are covered by the same wordline. The wordline is driven to a programming voltage level for programming the anti-fuse device, or to a read voltage level for reading the anti-fuse device.05-05-2011
20120314473Multiple-State One-Time Programmable (OTP) Memory to Function as Multi-Time Programmable (MTP) Memory - A circuit, method, and system for using multiple-state One-Time Programmable (OTP) memory to function as a multiple-bit programmable (MTP) memory are disclosed. The OTP memory can have N(N>2) distinct resistance states, that can be differentiated by at least N−1 reference resistances, can be functionally equivalent programmed N−1 times. The multiple-state OTP memory can have a plural of multiple-state OTP cells that can be selectively programmed to a resistance state. The reference resistance can be set to determine a state of the from the programmed multiple-state OTP cells.12-13-2012
20100246237ANTI-FUSE ELEMENT - Programmable anti-fuse circuitry including at least one anti-fuse cell having a first anti-fuse device coupled between a supply voltage and a first node and a second anti-fuse device coupled between the first node and a ground voltage, and control logic coupled to the first node and arranged to generate a programming voltage having one of at least a first voltage level for breaking-down the first anti-fuse device but not the second anti-fuse device and coupling the first node to the supply voltage; and a second voltage level for breaking-down the second anti-fuse device but not the first anti-fuse device and coupling the first node to the ground voltage.09-30-2010
20090109722REPROGRAMMABLE ELECTRICAL FUSE - The present invention provides a reprogrammable electrically blowable fuse and associated design structure. The electrically blowable fuse is programmed using an electro-migration effect and is reprogrammed using a reverse electro-migration effect. The state (i.e., “opened” or “closed”) of the electrically blowable fuse is determined by a sensing system which compares a resistance of the electrically blowable fuse to a reference resistance.04-30-2009
20120314472Multiple-Bit Programmable Resistive Memory Using Diode as Program Selector - A method and system for multiple-bit programmable resistive cells having a multiple-bit programmable resistive element and using diode as program selector are disclosed. The first and second terminals of the diode having a first and second types of dopants can be fabricated from source/drain of MOS in a well for MOS devices or fabricated on the same polysilicon structure. If a multiple-bit programmable resistive cell has 212-13-2012
20100296328BURIED BIT LINE ANTI-FUSE ONE-TIME-PROGRAMMABLE NONVOLATILE MEMORY - An anti-fuse one-time-programmable (OTP) nonvolatile memory cell has a P well substrate with two P.sup.-doped regions. Another N.sup.+doped region, functioning as a bit line, is positioned adjacent and between the two P.sup.-doped regions on the substrate. An anti-fuse is defined over the N.sup.+doped region. Two insulator regions are deposited over the two P.sup.-doped regions. An impurity doped polysilicon layer is defined over the two insulator regions and the anti-fuse. A polycide layer is defined over the impurity doped polysilicon layer. The polycide layer and the polysilicon layer function as a word line. A programmed region, i.e., a link, functioning as a diode, is formed on the anti-fuse after the anti-fuse OTP nonvolatile memory cell is programmed. The array structure of anti-fuse OTP nonvolatile memory cells and methods for programming, reading, and fabricating such a cell are also disclosed.11-25-2010
20110122672Non-volatile semiconductor memory device - A non-volatile semiconductor memory device having a memory cell in which operating potentials are few and the scale of the peripheral circuitry is reduced includes a select transistor having a source/drain on both sides of a channel of a semiconductor substrate and having a gate electrode disposed on the channel via a thick gate insulating film; an element isolation region formed on the semiconductor substrate in an area adjacent to the select transistor; an antifuse adjacent to the element isolation region, having a lower electrode formed on the semiconductor substrate and having an upper electrode disposed on the semiconductor substrate in an area between the element isolation region and lower electrode via a thin gate insulating film; and a connection contact electrically connecting the source and upper electrode and contacting the source and the upper electrode.05-26-2011
20080298112Memory array including programmable poly fuses - According to one exemplary embodiment, a memory array includes a memory cell having a programmable poly fuse coupled between a designated program node and a ground node, where the programmable poly fuse includes a P type resistive poly segment forming a P-N junction with an adjacent N type resistive poly segment. In the programmable poly fuse, the P type resistive poly segment is coupled to the ground node and the N type resistive poly segment is coupled to the designated program node. The programmable poly fuse further includes a P side silicided poly line contiguous with the P type resistive poly segment and coupled to the ground node. The programmable poly fuse further includes an N side silicided poly line contiguous with the N type resistive poly segment and coupled to the designated program node.12-04-2008
20120320657Programmable Resistive Memory Unit with Multiple Cells to Improve Yield and Reliability - A method and system for a programmable resistive memory to improve yield and reliability has a plurality of programmable resistive units. Each programmable resistive unit can have at least one programmable resistive cell. Each programmable resistive cell can have a programmable resistive element with a first end coupled to a first supply voltage line and a second end coupled to at least one diode serving as program selector. Each diode can have at least first and second terminals with first and second types of dopants, with the second terminal being coupled to a second supply voltage line. The first and second terminals of the diode can be fabricated from source/drain of MOS in a well for MOS devices or fabricated on the same polysilicon structure.12-20-2012
20120320656Programmable Resistive Memory Unit with Data and Reference Cells - A method and system of a programmable resistive memory having a plurality of programmable resistive memory units is disclosed. At least one of the programmable resistive memory units has at least one data cell and at least one reference cell. The data cell can have one programmable resistive element coupled to at least one diode as a program selector and also coupled to a bitline (BL). The reference cell can have a reference resistive element coupled to at least one reference diode as reference program selector and also coupled to a reference bitline (BLR). In one embodiment, the reference resistive element can have substantially the same material, structure, or shape of the programmable resistive element. In one embodiment, the reference diode can have the same material, structure, or shape of the diode serving as the program selector diode.12-20-2012
20110216572ELECTRICALLY PROGRAMMABLE FUSE BIT - One-time programmable (OTP) nonvolatile fuse memory cells are disclosed that do not require decoding or addressing for reading their data content. Each fuse memory cell has its content latched at its output and available at all times and can be used, for example, for code storage memories, serial configuration memories, and as individual fuse bits for ID (identification), trimming, and other post-fabrication System-on-Chip (SoC) customization needs. Means are also provided for temporary data storage for design testing, etc. In alternative embodiments, using two differentially programmed fuses in a single memory cell, the selection and programming circuitry are merged.09-08-2011
20110235388NONVOLATILE SEMICONDUCTOR STORAGE DEVICE - According to an embodiment of the invention, a nonvolatile semiconductor storage device includes a first memory cell and a second memory cell. A first fuse element in which data can be electrically written only once is provided in the first memory cell. A second fuse element in which data can be electrically written only once is provided in the second memory cell to repair a defect of the first memory cell.09-29-2011
20100232203ELECTRICAL ANTI-FUSE AND RELATED APPLICATIONS - A first terminal and a second terminal of a FinFET transistor are used as two terminals of an anti-fuse. To program the anti-fuse, a gate of the FinFET transistor is controlled, and a voltage having a predetermined amplitude and a predetermined duration is applied to the first terminal to cause the first terminal to be electrically shorted to the second terminal.09-16-2010
20100182819NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprising: a memory cell array in which two bit lines are provided to each one bit of input data, and memory cells each including an anti-fuse element are arranged at an intersection point between one of the two bit lines and an even address word line, and an intersection point between the other one of the two bit lines and an odd address word line, respectively; a plurality of booster circuits which are arranged in a plurality of memory banks, respectively, and each of which generates a write voltage and a read voltage to be supplied to a corresponding one of the anti-fuse elements of the respective memory banks, each of the memory banks obtained by dividing the memory cell array; a booster circuit controller to issue an instruction to generate the write voltage and the read voltage to the plurality of booster circuits; a word line selector to activate a different word line at the time of writing from one to be activated at the time of reading, with respect to the same address value of an address signal; a write bit line selector to select bit lines one by one from the memory banks, respectively, at the time of writing, the bit lines performing writing simultaneously; and a read bit line selector to select a bit line at the time of reading, the bit line outputting data.07-22-2010
20130170276ONE-TIME PROGRAMMABLE FUSE READ - This document discusses, among other things, a reference voltage generator circuit coupled to a plurality of fuse read circuits. The reference voltage generator circuit can be configured to mirror a reference current to produce a reference voltage and a gate bias voltage. The plurality of fuse read circuits can each be coupled to the reference voltage generator circuit and can also be coupled to a fuse of a plurality of fuses. Each fuse read circuit of the plurality of fuse read circuits can be configured to mirror the reference current using the gate bias voltage to produce a fuse read voltage across each fuse coupled to the plurality of fuse read circuits. Each fuse read circuit of the plurality of fuse read circuits can compare the fuse read voltage of each fuse and the reference voltage and can indicate a state of each fuse coupled to each fuse read circuit using the comparison.07-04-2013
20120243290MULTI-LEVEL ELECTRICAL FUSE USING ONE PROGRAMMING DEVICE - A method for programming a multi-level electrical fuse system comprises providing a fuse box with an electrical fuse and providing one of at least two fuse writing voltages to the electrical fuse to program the electrical fuse to one of at least two resistance states. The fuse box comprises at least one electrical fuse, a programming device serially coupled to the electrical fuse, and a variable power supply coupled to the fuse box and configured to generate two or more voltage levels.09-27-2012
20120243289ELECTRIC FUSE, SEMICONDUCTOR DEVICE, AND INFORMATION WRITING METHOD OF ELECTRIC FUSE - An electric fuse includes: a filament having a first conductive layer and a second conductive layer formed on the first conductive layer, wherein at least three discernible resistive states are generated in the filament by changing of a combination of a state of the first conductive layer and a state of the second conductive layer.09-27-2012
20080232152Method and Structure for Implementing a Reprogrammable ROM - A method and structure for implementing a reprogrammable read only memory (ROM), and a design structure on which the subject circuit resides are provided. A pair of fuse elements having different lengths are selectively arranged to define an initial bit state. A group of a plurality of the pairs of fuse elements defines a predetermined data pattern of ones and zeros, providing initial states stored in the reprogrammable ROM. The reprogrammable ROM is reprogrammed when needed by selectively blowing a selected fuse or selected fuses to change the data pattern stored in the ROM.09-25-2008
20080232151System and method to control one time programmable memory - Systems and methods to control one time programmable (OTP) memory are disclosed. A method may include determining a functionality for a hardware capability bus in an integrated circuit. The method may also include storing data in a first register of the integrated circuit based on the functionality. The method may also include disabling the functionality in the integrated circuit by setting at least one bit in a one time programmable memory bank in the integrated circuit based on the data.09-25-2008
20080232150Method and Structure for Implementing a Reprogrammable ROM - A method and structure implementing a reprogrammable read only memory (ROM) include a pair of fuse elements having different lengths and selectively arranged to define an initial bit state. A group of a plurality of the pairs of fuse elements defines a predetermined data pattern of ones and zeros, providing initial states stored in the reprogrammable ROM. The reprogrammable ROM is reprogrammed when needed by selectively blowing a selected fuse or selected fuses to change the data pattern stored in the ROM.09-25-2008
20080225566Using eFuses to Store PLL Configuration Data - A mechanism for using electrical fuses (eFuses) to store phase-locked loop (PLL) configuration data are provided. With the mechanism, a portion of the eFuses present in the integrated circuit are reserved for the PLL configuration data. Upon power up, a power up controller and eFuse controller direct the sensing and serial transfer of the data in the portion of eFuses to the PLL under the reference clock. When the transfer is complete, the power up controller directs the PLL logic to load the configuration data and start. The mechanism of the present invention allows manufacturing to tailor the PLL configuration on a given device based on the characteristics of that device and its intended usage. Thus, the same PLL may be used in the same or different architectures to perform different operations based on the configuration data passed into the PLL from the eFuses.09-18-2008
20130176765ONE-TIME PROGRAMABLE CELL CIRCUIT, SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING THE SAME, AND DATA JUDGING METHOD THEREOF - Provided is a semiconductor integrated circuit including: an anti-fuse element that electrically connects a first node and a first power supply terminal when data is written and electrically disconnect the first node and the first power supply terminal when data is not written; a first switch circuit that is connected between the first node and a first data line applied with a predetermine first voltage, and enters an off state from an on state according to a first control signal; and a detection part that detects write data of the anti-fuse element according to whether a voltage of the first node is substantially the same as the first voltage or substantially the same as a supply voltage of the first power supply terminal when the first switch circuit enters the off state.07-11-2013
20110267869CIRCUIT FOR VERIFYING THE WRITE ENABLE OF A ONE TIME PROGRAMMABLE MEMORY - A memory system including a one time programmable (OTP) memory is provided. The memory system further includes a write enable verification circuit including an asymmetric inverter stage and a symmetric inverter stage coupled at a node. The write enable verification circuit is configured to receive a write enable signal. When the write enable signal changes from a first voltage level to a second voltage level, a voltage at the node changes at a first rate and wherein when the write enable signal changes from the second voltage level to the first voltage level, the voltage at the node changes at a second rate higher than the first rate. The write enable verification circuit is further configured to generate a verified write enable signal for enabling programming of the OTP memory.11-03-2011
20080198643One-time programmable cell and memory device having the same - One-time programmable cell and memory device having the same includes a first metal oxide semiconductor (MOS) transistor configured to form a current path between a first node and a second node in response to a read-control signal, a second MOS transistor configured to form a current path between a third node and the second node in response to a write-control signal and an anti-fuse connected between the second node and a ground voltage terminal, wherein a voltage applied to the second node is output as an output signal.08-21-2008
20120257435NON-SALICIDE POLYSILICON FUSE - The embodiments of methods and structures disclosed herein provide mechanisms of forming and programming a non-salicided polysilicon fuse. The non-salicided polysilicon fuse and a programming transistor form a one-time programmable (OTP) memory cell, which can be programmed with a low programming voltage.10-11-2012
20120275208RELIABLE ELECTRICAL FUSE WITH LOCALIZED PROGRAMMING AND METHOD OF MAKING THE SAME - An electrical fuse has an anode contact on a surface of a semiconductor substrate. The electrical fuse has a cathode contact on the surface of the semiconductor substrate spaced from the anode contact. The electrical fuse has a link within the substrate electrically interconnecting the anode contact and the cathode contact. The link comprises a semiconductor layer and a silicide layer. The silicide layer extends beyond the anode contact. An opposite end of the silicide layer extends beyond the cathode contact. A silicon germanium region is embedded in the semiconductor layer under the silicide layer, between the anode contact and the cathode contact.11-01-2012
20120281450ELECTRICALLY PROGRAMMABLE FUSE MODULE IN SEMICONDUCTOR DEVICE - A semiconductor device has an e-fuse module and a programming current generator. The e-fuse module includes an array of electrically programmable e-fuse elements. The programming current generator has a set of reference transistor elements, a selector for actuating the reference transistor elements to generate a selected reference current, and a current mirror for applying a programming current that is a function of the selected reference current to a selected e-fuse element of the array to program the resistance of the e-fuse element.11-08-2012
20120020139Apparatus and Method for Testing One-Time-Programmable Memory - An apparatus and method of testing one-time-programmable memory limits current through a one-time-programmable memory to less than a threshold amplitude, where the memory has a fuse configured to blow upon receipt of a signal having the threshold amplitude. The method also uses blow signal assertion circuitry to attempt to assert a blow signal to the fuse. When not defective, blow signal assertion circuitry is configured to permit the low amplitude signal to flow through the fuse when the fuse is not blown and the blow signal is asserted. The method then produces an output signal having a success value if the limited current flows through the fuse, and a failure value if the current does not flow through the fuse.01-26-2012
20130201745Circuit and System of a Low Density One-Time Programmable Memory - A low density One-Time Programmable (OTP) memory is disclosed to achieve low gate count and low overhead in the peripheral circuits to save the cost. A maximum-length Linear Feedback Shift Register (LFSR) can be used to generate 208-08-2013
20130201746CIRCUIT AND SYSTEM FOR TESTING A ONE-TIME PROGRAMMABLE (OTP) MEMORY - Circuits, systems and techniques for testing a One-Time Programmable (OTP) memory are disclosed. An extra OTP bit can be provided as a test sample to be programmed. The programmed extra OTP bit can be read with any virgin cells in the OTP memory alternatively to generate a stream of logic 0 and logic 1 data so that every row or column path can be tested and the outcome can be observed in a pseudo-checkerboard pattern or other predetermined pattern. By carefully setting control signals, checkerboard-like pattern can be generated without actual programming any OTP cells in the memory array.08-08-2013
20130201747PERMANENT SOLID STATE MEMORY USING CARBON-BASED OR METALLIC FUSES - A permanent solid state memory device is disclosed. Recording data in the permanent solid state memory device forms voids in a data layer between a first wire array and a second wire array. Wires of the first wire array extend transversely to wires in the second wire array. The material is made of a carbon allotrope such that when current is passed through the carbon allotrope, the carbon is quickly oxidized (burned) leaving a complete gap (void) where the fuse once was. One of the advantages of this method is that the fuse material is fully oxidized in the particular “neck region of the bowtie”, such that there is no material left over from which dendrites can grow. In other embodiments, the data layer is a metal or metal oxide selected from the following metals: Tungsten (W), Rhenium (Rh), Osmium (Os), Iridium (Ir), Molybdenum (Mo), Ruthenium (Ru), Rhodium (Rh), Chromium (Cr), and Manganese (Mn).08-08-2013
20130208525SOFT BREAKDOWN MODE, LOW VOLTAGE, LOW POWER ANTIFUSE-BASED NON-VOLATILE MEMORY CELL - A non-volatile memory cell uses two transistors only, a bit select and a sense device. Each cell further comprises an antifuse device implemented, for example, with a field-effect transistor operated to behave like an antifuse when the cell is selected and a modest programming voltage under 5.5 volts and under 5-μA is applied. Only a soft breakdown is needed in the thin gate oxide because a local sense transistor is used during read operations to detect the programming and amplify it for column sense amplifiers. Reading also only requires low voltages of about one volt.08-15-2013

Patent applications in class Fusible