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Transistors or diodes

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365 - Static information storage and retrieval

365063000 - INTERCONNECTION ARRANGEMENTS

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DocumentTitleDate
20130044531SEMICONDUCTOR MEMORY DEVICES - A semiconductor memory device includes a stacked structure including a plurality of wordline structures sequentially stacked that each include: a plurality of wordlines with sidewalls and extending in a first direction on the substrate, and a connecting pad extending in a second direction on the substrate and being connected in common to the plurality of wordlines. A plurality of interconnections at a height over the substrate are connected to the connecting pads of the wordline structures, respectively. The device further includes bitlines substantially vertical to a top surface of the substrate and crossing one of the sidewalls of the plurality of wordlines, and memory elements between the bitlines and the plurality of wordlines, respectively. A length of the connecting pad in the second direction is substantially equal to a product of a minimum pitch between the interconnections and a stack number of one of the plurality of wordlines.02-21-2013
20110199808MEMORY DEVICE FROM WHICH DUMMY EDGE MEMORY BLOCK IS REMOVED - A semiconductor memory device having an open bitline memory structure from which an edge dummy memory block is removed, the semiconductor memory device includes a memory block, an edge sense amplification block including a first sense amplifier having a first bitline, a first complementary bitline, and a first amplification circuit comprising a first transistor having a first size, a central sense amplification block including a second sense amplifier having a second bitline, a second complementary bitline, and a second amplification circuit comprising a second transistor having a second size different from the first size, a capacitor block electrically connected to the edge sense amplification block.08-18-2011
20100142253SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell array disposing a plurality of memory cells at each intersection of word lines and bit lines, the memory cell including one pair of cross-connected inverters including a transistor, a first dummy transistor having a threshold voltage which has a certain relationship with a threshold voltage of the transistor of the memory cell, a dummy bit line connected to one end of the first dummy transistor, and the dummy bit line charged so as to have a predetermined voltage, a dummy transistor control circuit configured to control conduction of the first dummy transistor, and a word line driver configured to supply a word line voltage to the word line connected to the selected memory cell, and the word line driver configured to change a rise time of the word line voltage in accordance with a change in a voltage of the dummy bit line.06-10-2010
20110205774SEMICONDUCTOR MEMORY DEVICE, DRIVING METHOD THEREOF, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A matrix is formed using a plurality of memory cells in each of which a drain of the writing transistor is connected to a gate of a reading transistor and one electrode of a capacitor. A gate of the writing transistor, a source of the writing transistor, a source of the reading transistor, and a drain of the reading transistor are connected to a writing word line, a writing bit line, a reading bit line, and a bias line, respectively. The other electrode of the capacitor is connected to a reading word line. In order to decrease the number of wirings, the writing bit line is substituted for the reading bit line. The reading bit line is formed so as to be embedded in a groove-like opening formed over a substrate.08-25-2011
20110194327SEMICONDUCTOR DEVICE AND METHOD OF DRIVING SEMICONDUCTOR DEVICE - The number of wirings per unit memory cell is reduced by sharing a bit line by a writing transistor and a reading transistor. Data is written by turning on the writing transistor so that a potential of the bit line is supplied to a node where one of a source electrode and a drain electrode of the writing transistor and a gate electrode of the reading transistor are electrically connected, and then turning off the writing transistor so that a predetermined amount of charge is held in the node. Data is read by using a reading signal line connected to one of a source electrode and a drain electrode of the reading transistor so that a predetermined reading potential is supplied to the reading signal line, and then detecting a potential of the bit line.08-11-2011
20130077375LAYOUT FOR SEMICONDUCTOR MEMORIES - A semiconductor memory includes a first conductive layer including a first pair of bit lines coupled to a first bit cell and a second conductive layer including a second pair of bit lines coupled to the first bit cell. The first and second conductive layers are vertically separated from each other.03-28-2013
20130039113INTEGRATED DRAM MEMORY DEVICE - A DRAM memory device includes at least one memory cell including a transistor having a first electrode, a second electrode and a control electrode. A capacitor is coupled to the first electrode. At least one electrically conductive line is coupled to the second electrode and at least one second electrically conductive line is coupled to the control electrode. The electrically conductive lines are located between the transistor and the capacitor. The capacitor can be provided above a fifth metal level.02-14-2013
20100328985SEMICONDUCTOR DEVICE HAVING PLURAL CIRCUIT BLOCKS LAID OUT IN A MATRIX FORM - To include an input circuit block to which a plurality of bits are input and a processing circuit block that processes an internal signal output from the input circuit block. The input circuit block includes a plurality of unit input circuits arranged in an X direction to which the bits are input, respectively. Each of the unit input circuits includes an input wiring pattern that extends in a Y direction and a transistor of which a control electrode is connected to a corresponding one of the input wiring pattern. Coordinates of the input wiring pattern and the transistor corresponding to the input wiring pattern in the X direction do not overlap with each other. With this arrangement, by sharing the input wiring pattern between circuit blocks adjacent to each other in the Y direction, it is possible to reduce the number of pre-decode wirings.12-30-2010
20130088908SEMICONDUCTOR DEVICE - Memory cells adjacent to each other in a second direction are formed in a first p-type well region, a first n-type well region, and a second p-type well region arranged in a first direction. Each memory cell includes a first transfer transistor and a first driver transistor formed in the first p-type well region, a second transfer transistor and a second driver transistor formed in the second p-type well region, and first and second load transistors formed in the first n-type well region. In an SRAM, gate electrodes of the first and second transfer transistors of the memory cells adjacent to each other in the second direction are electrically connected to first and second word lines, respectively. The first and second word lines are electrically connected to the first and second p-type well regions, respectively.04-11-2013
20100085792Semiconductor Device - A semiconductor device including a memory cell is provided. The memory cell comprises a transistor and a capacitor, and one of a resistor and a diode. A gate of the transistor is electrically connected to a word line, and one of a source and a drain of the transistor is electrically connected to a bit line. One terminal of the capacitor is electrically connected to the other of the source and the drain of the transistor, and the other terminal of the capacitor is electrically connected to a wiring. One terminal of one of the resistor and the diode is electrically connected to the other of the source and the drain of the transistor, and the other terminal of one of the resistor and the diode is electrically connected to the wiring.04-08-2010
20090073740NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - An object of this invention is to provide a rewritable nonvolatile memory cell that can have a wide reading margin, and can control both a word line and a bit line by changing the level of Vcc. As a solution, a flip-flop is formed by cross (loop) connect of inverters comprising memory transistors that can control a threshold voltage by charge injection into the side spacer of the transistors. In the case of writing data to one memory transistor, a high voltage is supplied to a source of the memory transistor through a source line and a high voltage is supplied to a gate of the memory transistor through a load transistor of the other side inverter. In the case of erasing the written data, a high voltage is supplied to the source of the memory transistor through the source line.03-19-2009
20120224405SEMICONDUCTOR DEVICE - A semiconductor device with a memory unit of which the variations in the operation timing are reduced is provided. For example, the semiconductor device is provided with dummy bit lines which are arranged collaterally with a proper bit line, and column direction load circuits which are sequentially coupled to the dummy bit lines. Each column direction load circuit is provided with plural NMOS transistors fixed to an off state, predetermined ones of which have the source and the drain suitably coupled to any of the dummy bit lines. Load capacitance accompanying diffusion layer capacitance of the predetermined NMOS transistors is added to the dummy bit lines, and corresponding to the load capacitance, the delay time from a decode activation signal to a dummy bit line signal is set up. The dummy bit line signal is employed when setting the start-up timing of a sense amplifier.09-06-2012
20130163305APPARATUSES AND METHODS INCLUDING MEMORY WITH TOP AND BOTTOM DATA LINES - Some embodiments include apparatuses and methods having a first set of data lines, a second set of data lines, and memory cells located in different levels of the apparatus. In at least one of such embodiments, the memory cells can be arranged in memory cell strings between the first and second set of data lines. Other embodiments including additional apparatuses and methods are described.06-27-2013
20120236621Semiconductor Device - A semiconductor device including a memory cell is provided. The memory cell comprises a transistor and a capacitor, and one of a resistor and a diode. A gate of the transistor is electrically connected to a word line, and one of a source and a drain of the transistor is electrically connected to a bit line. One terminal of the capacitor is electrically connected to the other of the source and the drain of the transistor, and the other terminal of the capacitor is electrically connected to a wiring. One terminal of one of the resistor and the diode is electrically connected to the other of the source and the drain of the transistor, and the other terminal of one of the resistor and the diode is electrically connected to the wiring.09-20-2012
20120236620Nonvolatile Memory Device and Manufacturing Method Thereof - The present invention relates to a nonvolatile memory device and a manufacturing method thereof, the device comprising a plurality of word lines; a plurality of bit lines perpendicular to the word lines; and a plurality of memory cells including a transistor with a source connected to a source line, a gate, and a drain connected to a memory element, with the other end of the memory element connected to the bit lines. Between memory cells adjacent along a bit line, a gate terminal in a groove between the memory cells connects the gates in the memory cells to a word line. Memory cells adjacent along a word line are connected to one bit line contact point, and memory cells sharing a gate terminal are connected to different bit lines. Bit lines are disposed at the upper portion and source lines at the lower end of the memory cell.09-20-2012
20120236619SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a memory array and a peripheral circuit. The memory array has a plurality of memory cells, word lines, and bit lines, in which a first, second, and third blocks are set in the order along the bit line. The peripheral circuit has a transistor group. The transistor group includes a first transfer transistor belonging to the first block, a second transfer transistor belonging to the second block, and a third transfer transistor belonging to the third block. The first, second, and third transfer transistors share the other of a source and a drain of each. With regard to a direction in which either of the source and the drain is connected to the other in each of the first, second, and third transfer transistors, the directions of the adjacent transfer transistors are different from each other by 90° or 180°.09-20-2012
20120099360SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF - In a memory cell, a transistor with extremely high off-resistance is used as a write transistor; a drain and a source of the write transistor are connected to a write bit line and an input of an inverter, respectively; and a drain and a source of a read transistor are connected to a read bit line and an output of the inverter, respectively. Capacitors may be intentionally disposed to the source of the write transistor. Alternatively, parasitic capacitance may be used. Since the data retention is performed using charge stored on these capacitors, a potential difference between power sources for the inverter can be 0. This eliminates leakage current between the positive and negative electrodes of the inverter, thereby reducing power consumption.04-26-2012
20120087168MEMORY DEVICE INCLUDING VARIABLE RESISTANCE ELEMENTS - A memory device including variable resistance elements comprises a plurality of memory cells configured to store data; a first signal transmission/reception unit and a second signal transmission/reception unit configured to transmit a signal to the memory cells or receive a signal from the memory cells; a first transmission line arranged to couple first ends of the memory cells to the first signal transmission/reception unit; and a second transmission line configured to couple second ends of the memory cells to the second signal transmission/reception unit, wherein a first resistance of a first signal path coupled between the first and second signal transmission/reception units through a first memory cell of the memory cells is substantially equal to a second electrical resistance of a second signal path coupled between a second memory cell and the first and second signal transmission/reception units through a second memory cell of the memory cells.04-12-2012
20120294061WORD LINE DIVIDER AND STORAGE DEVICE - A word line divider which has a simplified circuit structure and can operate stably is provided. A storage device which has a simplified circuit structure and can operate stably is provided. A transistor whose leakage current is extremely low is connected in series with a portion between a word line and a sub word line so that the word line divider is constituted. The transistor can include an oxide semiconductor for a semiconductor layer in which a channel is formed. Such a word line divider whose circuit structure is simplified is used in the storage device.11-22-2012
20110286257SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a plurality of memory cell transistors arranged in a matrix; a plurality of word lines commonly coupling the control gates of the plural memory cell transistors present in a identical first direction; a plurality of source lines commonly coupling the sources of the plural memory cell transistors present in the identical first direction; a plurality of bit lines commonly coupling the drains of the plural memory cell transistors present in a identical second direction intersecting the first direction; a first transistor having a drain coupled to the source line; a second transistor having a drain coupled to a source of the first transistor, a gate coupled to the word line and a source grounded; and a control line commonly coupling the gates of the plural first transistors.11-24-2011
20110286256SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING SEMICONDUCTOR DEVICE - A semiconductor device with a reduced area and capable of higher integration and larger storage capacity is provided. A multi-valued memory cell including a reading transistor which includes a back gate electrode and a writing transistor is used. Data is written by turning on the writing transistor so that a potential according to the data is supplied to a node where one of a source electrode and a drain electrode of the writing transistor and a gate electrode of the reading transistor are electrically connected to each other, and then turning off the writing transistor and holding a predetermined potential in the node. Data is read by supplying a reading control potential to a control signal line connected to one of a source electrode and a drain electrode of the reading transistor, and then detecting potential change of a reading signal line.11-24-2011
20110292709SEMICONDUCTOR DEVICE - A semiconductor device includes a sense amplifier circuit. The sense amplifier circuit includes a cross-coupled first transistor and second transistor that perform amplification. The sources of the cross-coupled transistors are respectively connected in series with a third transistor and a fourth transistor, and electrical current supply capability of the third and fourth transistors is controlled by a control voltage given to control electrodes of the third and fourth transistors. In a data retaining period, a minimum sub-threshold current necessary for retaining the data is flowed to the third and fourth transistors according to the control voltage, and bit line potential is maintained.12-01-2011
20100020586FB DRAM Memory with State Memory - A memory chip with a plurality of FB DRAM cells, having a word line coupled to a first FB DRAM cell and a second FB DRAM cell is disclosed. The memory chip further has a first bit line coupled to the first FB DRAM cell, and a first state memory circuit coupled to the first bit line. The memory chip further includes a second bit line coupled to the second FB DRAM cell, and a second state memory circuit coupled to the second bit line. The memory chip further includes a sense amplifier, which can be coupled to the first FB DRAM cell, the second FB DRAM cell, the first state memory circuit or the second state memory circuit.01-28-2010
20110267867SEMICONDUCTOR DEVICE - A semiconductor device includes a memory cell array area, a peripheral circuit area on a periphery of the memory cell array area, and a boundary area having a specific width between the memory cell array area and the peripheral circuit area, the memory cell array area including a cell area including nonvolatile semiconductor memory cells, linear wirings extending from inside of the cell area to an area outside the cell area, and lower layer wirings in a lower layer than the linear wirings in the boundary area and electrically connected to the linear wirings, and wiring widths of the lower layer wirings being larger than widths of the linear wirings, the peripheral circuit area including a patterns electrically connected to the linear wirings via the lower layer wirings, the boundary area failing to be provided with the linear wirings and a wiring in same layer as the linear wirings.11-03-2011
20090168484MULTIPLE-PORT SRAM DEVICE - A multiple-port SRAM cell includes a latch having a first node and a second node for retaining a value and its complement, respectively. The cell has a write port separate from a read port for parallel operation. A number of transistors are used to connect the first and second nodes to a number of bit lines, such as a read port bit line, a read port complementary bit line, a read/write port bit line, and a read/write port complementary bit line. In a layout view of the multiple-port SRAM cell, the read port bit line, read port complementary bit line, read/write port bit line and read/write port complementary bit line are separated by at least one supply voltage line, one or more complementary supply voltage lines, and one or more word line landing pads.07-02-2009
20090168483Ultra low voltage and minimum operating voltage tolerant register file - Methods and apparatus relating ultra-low voltage memory bit cells are described. In an embodiment, an ultra-low voltage memory device is provided using redundant paths to data storage nodes controlled by complementary write word lines. Other embodiments are also described.07-02-2009
20100277966Memory Array and Storage Method - A memory arrangement comprises a first memory transistor (11-04-2010
20090219746Circuit Arrangement Comprising a Non-Volatile Memory Cell and Method - The circuit arrangement comprises a symmetrically constructed comparator (09-03-2009
20090273962FOUR-TERMINAL MULTIPLE-TIME PROGRAMMABLE MEMORY BITCELL AND ARRAY ARCHITECTURE - Embodiments disclosed herein relate to a non-volatile memory bitcell and arrays thereof, methods of detecting whether the bitcell is in a programmed state, methods of detecting whether the bitcell is in an erased state, methods of setting the bitcell in a programmed state and methods of setting the bitcell in an erased state. The non-volatile memory bitcell may be a four terminal bitcell. The bitcell may have a pull-up electrode, a pull-down electrode, a cantilever electrode and a contact electrode. An NMOS transistor may be coupled to the contact electrode. Depending upon the orientation of the word line, the current through the bitcell may be measured on the bitline, the data line or the pull-down electrode.11-05-2009
20090190387Semiconductor device - A semiconductor device to improve layout uniformity may include an active region formed in a substrate, a dummy active region formed in the substrate and separated from the active region, a word line crossing over the active region, and a dummy word line. The dummy word line is formed over the dummy active region to overlap at least part of the dummy active region and may have an end positioned within the dummy active region.07-30-2009
20090103346SEMICONDUCTOR DEVICE - There is provided a semiconductor storage device having a memory cell including a transfer transistor, a load transistor and a drive transistor, which includes a first transfer transistor to become conductive by a potential applied to a first word line placed in parallel with a pair of bit lines, a second transfer transistor to become conductive by a potential applied to a second word line placed orthogonal to the pair of bit lines, and a control circuit to output a control signal for controlling the potentials of the first word line and the second word line in such a way that the first transfer transistor becomes conductive earlier than the second transfer transistor when setting both of the first transfer transistor and the second transfer transistor to a conductive state.04-23-2009
20120294060SEMICONDUCTOR DEVICE - A semiconductor device capable of assessing and rewriting data at a desired timing is provided. A semiconductor device includes a register circuit, a bit line, and a data line. The register circuit includes a flip-flop circuit, a selection circuit, and a nonvolatile memory circuit electrically connected to the flip-flop circuit through the selection circuit. The data line is electrically connected to the flip-flop circuit. The bit line is electrically connected to the nonvolatile memory circuit through the selection circuit. The selection circuit selectively stores data based on a potential of the data line or a potential of the bit line in the nonvolatile memory circuit.11-22-2012
20110199807SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME - A semiconductor device includes a first signal line, a second signal line, a memory cell, and a potential converter circuit. The memory cell includes a first transistor including a first gate electrode, a first source electrode, a first drain electrode, and a first channel formation region; a second transistor including a second gate electrode, a second source electrode, a second drain electrode, and a second channel formation region; and a capacitor. The first channel formation region and the second channel formation region include different semiconductor materials. The second drain electrode, one electrode of the capacitor, and the first gate electrode are electrically connected to one another. The second gate electrode is electrically connected to the potential converter circuit through the second signal line.08-18-2011
20080278987LAYOUT STRUCTURE OF SUB-WORD LINE DRIVER AND FORMING METHOD THEREOF - A layout structure of a Sub-Word Line Driver (SWD) and a forming method thereof. A layout structure of an SWD may include first through fourth metal-oxide-semiconductor (MOS) transistors. The layout structure may include a first area including an active area of the first MOS transistor, wherein a gate-poly (GP) of the first MOS transistor may be disposed in a predefined direction over a portion of the first area. The layout structure may also include a second area including an active area of the second through fourth MOS transistors. Each GP of the second through fourth MOS transistors may be disposed in parallel to each other. The GP of the first MOS transistor disposed in the predefined direction may be substantially perpendicular to each GP of the second through fourth MOS transistors. The layout structure of an SWD can improve a driving capability without increasing an area of the chip.11-13-2008
20080291714SEMICONDUCTOR MEMORY DEVICE - Subarrays, which constitute a memory cell array, each include a bit line driving transistor having a drain connected to a bit line, a source is connected to an interconnection having a power supply potential, and a gate is connected to a sub-bit line. The plurality of memory cells are each provided in such away that a gate is connected to a word line, a source is grounded, and whether a drain is connected to the sub-bit line or not is selected in correspondence to data to be stored. Transmission transistors each have a gate connected to the bit line, a source connected to a loading transistor section, and a drain connected to the sub-bit line.11-27-2008
20080266928SEMICONDUCTOR MEMORY DEVICE - This invention provides a semiconductor memory device with enhanced speed performance or enabling timing adjustment reflected in characteristic variation of memory cells, adapted to suppress an increase in the number of circuit elements. A write dummy bit section comprises a first dummy line and a second dummy line corresponding to complementary bit lines and a plurality of first dummy cells formed to be similar in shape to static memory cells, wherein a write current path is coupled between the first dummy line and the second dummy line. In the write dummy bit section, one voltage level is input to the first dummy line through driver MOSFETs in relation to write signal inputs to the static memory cells and a signal change in the second dummy line precharged at the other voltage level is sensed and output. A timing control circuit deselects a word line selected by an output signal from the write dummy bit section.10-30-2008
20080285326HIGH DENSITY NON-VOLATILE MEMORY ARRAY - A high-density non-volatile memory array. In one aspect of the invention, a memory array circuit includes a plurality of word lines, a plurality of bit-lines, and a plurality of memory cell transistors. The gate of each memory cell transistor is connected to one of the word lines, and the drains and sources of each memory cell transistor are connected only to the bit-lines.11-20-2008
20110205776SEMICONDUCTOR STORAGE CIRCUIT - The present invention provides a semiconductor storage circuit that may suppress a data read characteristic from being deteriorated due to influence of characteristic change of a sense amplifier, in a multi-bit-type memory cell. The semiconductor storage circuit includes a memory cell array that has plural multi-bit-type memory cells, two multiplexers, and two sense amplifiers. The first multiplexer connects a main bit line connected to an R-side electrode of the even-numbered memory cell in a row direction to the first sense amplifier, and connects a main bit line connected to an L-side electrode of the odd-numbered memory cell to the second sense amplifier. The second multiplexer connects a main bit line connected to an L-side electrode of the even-numbered memory cell to the first sense amplifier, and connects a main bit line connected to an R-side electrode of the odd-numbered memory cell to the second sense amplifier.08-25-2011
20110205775SEMICONDUCTOR DEVICE - An object is to provide a semiconductor device with a novel structure, which can hold stored data even when not powered and which has an unlimited number of write cycles. A semiconductor device is formed using a material capable of sufficiently reducing the off-state current of a transistor, such as an oxide semiconductor material that is a widegap semiconductor. The use of a semiconductor material capable of sufficiently reducing the off-state current of a transistor allows data to be held for a long time. In addition, the timing of potential change in a signal line is delayed relative to the timing of potential change in a write word line. This makes it possible to prevent a data writing error.08-25-2011
20110205777Semiconductor memory device having vertical transistors - A device includes a first region including a plurality of first memory elements and a plurality of first vertical transistors, the first vertical transistors comprising a plurality of first selective transistors and a first switching transistor, each of the first selective transistors including an upper electrode coupled to a corresponding one of the first memory elements and a lower electrode, the first switching transistor including an upper electrode and a lower electrode coupled in common to the lower electrodes of the first selective transistors through a first signal line, a second region arranged to make a first line with the first region in a first direction and including a plurality of second memory elements and a plurality of second vertical transistors, the second vertical transistors comprising a plurality of second selective transistors and a second switching transistor, and a third region sandwiched between the first and the second regions.08-25-2011
20090129138Semiconductor Integrated Circuit - It is an object of the present invention to provide a semiconductor integrated circuit having a chip layout that reduces line length to achieve faster processing. A cache comprises a TAG memory module and a cache data memory module. The cache data memory module is divided into first and second cache data memory modules which are disposed on both sides of the TAG memory module, and input/output circuits of a data TLB are opposed to the input/output circuit of the TAG memory module and the input/output circuits of the first and second cache data memory modules across a bus area to reduce the line length to achieve faster processing.05-21-2009
20090059644Semiconductor memory device having vertical transistors - A semiconductor memory device includes a memory cell array region in which vertical transistors each having a lower electrode connected to a bit line is regularly arranged with a predetermined pitch, including memory cells formed using at least the vertical transistors; a peripheral circuit region arranged adjacent to the memory cell array region in a bit line extending direction; and a predetermined circuit arranged overlapping the peripheral circuit region and the memory cell array region. In the semiconductor memory device, the vertical transistors each having an upper electrode connected to the predetermined circuit are included in an end region of the memory cell array region, in which no word line is provided.03-05-2009
20110228584SEMICONDUCTOR MEMORY DEVICE - In a matrix including a plurality of memory cells, each in which a drain of a writing transistor is connected to a gate of a reading transistor and the drain is connected to one electrode of a capacitor, a gate of the writing transistor is connected to a writing word line, a source of the writing transistor and a source of the reading transistor is connected to a bit line, and a drain of the reading transistor is connected to a reading word line. A conductivity type of the writing transistor is different from a conductivity type of the reading transistor. In order to increase the integration degree, a bias line may be substituted with a reading word line in another row, or memory cells are connected in series so as to have a NAND structure, and a reading word line and a writing word line may be shared.09-22-2011
20090086523Integrated circuit and method of forming an integrated circuit - An integrated circuit comprises a memory cell array portion and a support circuitry portion. The memory cell array portion comprises at least one bitline and at least one wordline, which is disposed above the bitline. The support circuitry portion comprises a FinFET comprising a gate electrode. An upper side of a portion of the gate electrode is disposed at the same height as an upper side of a portion of the bitline. A method of manufacturing an integrated circuit comprises the steps of forming a memory cell array and forming a support circuitry. The step of forming the memory cell array comprises forming a bitline and forming a wordline disposed above the bitline. The step of forming the support circuitry comprises forming a FinFET. The step of forming the FinFET comprises forming a gate electrode, an upper side of a portion of the gate electrode being formed at the same height as an upper side of a portion of the bitline.04-02-2009
20110222329Semiconductor device having its standby current reduced - A semiconductor device includes a plurality of drain lines each being commonly connected to first nodes of a plurality of memory cells, a plurality of bit lines respectively connected to second nodes of the memory cells, a source line, a transistor that connects the drain lines to the source line, and a transistor that connects the source line to a ground potential in response to an access to the memory cell. Under control in which the memory cells are all deactivated, the semiconductor device controls the drain line to a drain potential that is higher than the ground potential, and controls the source line to be in a floating state by deactivating the transistors.09-15-2011
20090251941Semiconductor Device - A semiconductor device is provided, which includes a transistor, a memory element, a first control circuit and a second control circuit. A gate of the transistor is electrically connected to the first control circuit through a first word line, one of a source and a drain of the transistor is electrically connected to the second control circuit through a bit line, the other of the source and the drain of the transistor is electrically connected to a first terminal of the memory element, and a second terminal of the memory element is electrically connected to the first control circuit through a second word line.10-08-2009
20100188879Cross-point semiconductor memory device and method of manufacturing the same - A cross-point semiconductor memory device includes: a plurality of first wirings extending in a first direction; a plurality of second wirings positioned on a layer different from the first wirings to extend in a second direction different from the first direction; and memory parts provided in overlap areas of the first wirings and the second wirings, wherein the odd-numbered first wirings and the even-numbered first wirings are arranged on different insulating interlayers in an up-down direction.07-29-2010
20090296447FLASH- AND ROM- MEMORY - Method for conversion of a Flash memory cell on a first semiconductor device to a ROM memory cell in a second semiconductor device, the first and second semiconductor device each being arranged on a semiconductor substrate and each comprising an identical device portion and an identical wiring scheme for wiring the device portion to the Flash memory cell and to the ROM memory cell, respectively; the Flash memory cell being made in non-volatile memory technology and comprising an access transistor and a floating transistor, the floating transistor comprising a floating gate and a control gate; the ROM memory cell being made in a baseline technology and comprising a single gate transistor, which method includes manipulating a layout of at least one baseline mask as used in the baseline technology; the manipulation including: incorporating into the layout of the at least one baseline mask a layout of the Flash memory cell, and converting the layout of the Flash memory cell to a layout of one ROM memory cell by eliminating, from the at least one baseline mask, a layout for the floating transistor from the layout of the Flash memory cell and designating the layout of the access transistor of the Flash memory cell as a layout of the single gate transistor of the ROM memory cell.12-03-2009
20130215661MEMORY CIRCUIT AND SEMICONDUCTOR DEVICE - Included is a first transistor for controlling rewriting and reading of a first data, a second transistor for controlling rewriting and reading of a second data, a first inverter including an input terminal for the first data, a second inverter including an input terminal for the second data, a third transistor between an output terminal of the second inverter and the input terminal of the first inverter, a fourth transistors between the output of the first inverter and the input terminal of the second inverter, a fifth transistor for controlling rewriting and reading of the first data in the first capacitor, and a sixth transistor for controlling rewriting and reading of the second data in a second capacitor. The first data and the second data are held in the first capacitor and the second capacitor even while power supply is cut off.08-22-2013
20080232149INTEGRATED CIRCUIT CHIP WITH IMPROVED ARRAY STABILITY - A multi-threshold integrated circuit (IC) that may be supplied by multiple supplies, with an array of latches such as an array static random access memory (SRAM) cells and a CMOS SRAM with improved stability and reduced subthreshold leakage. Selected devices (NFETs and/or PFETs) in array cells and support logic, e.g., in the data path and in non-critical logic, are tailored for lower gate and subthreshold leakage. Normal base FETs have a base threshold and tailored FETs have a threshold above. In a multi-supply chip, circuits with tailored FETs are powered by an increased supply voltage.09-25-2008
20100232202DUAL PORT MEMORY DEVICE - A multi-port memory device having a storage node, a precharge node, a first, second, third, and fourth transistor, and a control module. The first transistor includes a current electrode connected to the storage node, another current electrode connected to a first bit line, and a gate connected to a first wordline. The second transistor includes a current electrode connected to the storage node, another current electrode connected to a second bit line, and a gate connected to a second wordline. The third transistor includes a current electrode connected to the reference node, another current electrode connected to the first bit line, and a gate. The fourth transistor includes a current electrode connected to the precharge node, another current electrode connected to the second bit line, and a gate. The control module deactivates the fourth transistor in response to a dummy access of the first storage module at the second transistor.09-16-2010
20100149851MEMORY DEVICE AND MANUFACTURING METHOD THE SAME - A semiconductor device that can transmit and receive data without contact is popular partly as some railway passes, electronic money cards, and the like; however, it has been a prime task to provide an inexpensive semiconductor device for further popularization. In view of the above current conditions, a semiconductor device of the present invention includes a memory with a simple structure for providing an inexpensive semiconductor device and a manufacturing method thereof. A memory element included in the memory includes a layer containing an organic compound, and a source electrode or a drain electrode of a TFT provided in the memory element portion is used as a conductive layer which forms a bit line of the memory element.06-17-2010
20090116272Non-volatile memory device including diode-storage node and cross-point memory array including the non-volatile memory device - Provided are a non-volatile memory device and a cross-point memory array including the same which have a diode characteristic enabling the non-volatile memory device and the cross-point memory array including the same to operate in a simple structure, without requiring a switching device separately formed so as to embody a high density non-volatile memory device. The non-volatile memory device includes a first electrode; a diode-storage node formed on the first electrode; and a second electrode formed on the diode-storage node.05-07-2009
20090116273SEMICONDUCTOR MEMORY DEVICE - This disclosure concerns a memory including: unit cells having ferroelectric capacitors and cell transistors; two depletion transistors and two enhancement transistors serially connected between two adjacent unit series configurations configured by serially connecting the unit cells; four selective lines respectively connected to the gates of the two enhancement transistors and the two depletion transistors; word lines connected to the gates of the cell transistors; a bit line connected to the unit series configuration via at least one of the enhancement transistors and the depletion transistors; and a bit line contact connecting the bit line to at least one of the enhancement transistors and the depletion transistors, wherein in two of adjacent bit lines, the bit line contact connected to one of the two adjacent bit lines and the bit line contact connected to the other bit line are opposed to each other with respect to one of the selective lines.05-07-2009
20100034006SEMICONDUCTOR MEMORY DEVICE - In an exemplary aspect, the present invention provides a semiconductor memory device including sense amplifiers that drive bit lines to which memory cells are connected, and driver transistors that supply a power supply to the sense amplifiers, wherein the sense amplifiers are arranged in rows and constitutes a first sense-amplifier row in which transistors of a first conductive type are arranged and a second sense-amplifier row in which transistors of a second conductive type are arranged, and the driver transistors constitutes at least one transistor row including a first driver transistor of the first conductive type corresponding to the first sense-amplifier row and a second driver transistor of the second conductive type corresponding to the second sense-amplifier row between the first sense-amplifier row and the second sense-amplifier row.02-11-2010
20110032741SEMICONDUCTOR MEMORY DEVICE - The SRAM cell is formed by an inverter circuit (P02-10-2011
20100238697SYSTEMS AND DEVICES INCLUDING LOCAL DATA LINES AND METHODS OF USING, MAKING, AND OPERATING THE SAME - Disclosed are methods, systems and devices including local data lines. In some embodiments, the device includes a local data line connected to a plurality of access devices, at least a portion of a capacitor plate connected to the plurality of access devices, and a global data line connected to the local data line by the capacitor plate.09-23-2010
20110176348SEMICONDUCTOR DEVICE - An object is to provide a semiconductor device in which stored data can be retained even when power is not supplied, and there is no limitation on the number of write cycles. The semiconductor device includes a source line, a bit line, a first signal line, a second signal line, a word line, a memory cell connected between the source line and the bit line, a first driver circuit electrically connected to the bit line, a second driver circuit electrically connected to the first signal line, a third driver circuit electrically connected to the second signal line, and a fourth driver circuit electrically connected to the word line and the source line. The first transistor is formed using a semiconductor material other than an oxide semiconductor. The second transistor is formed using an oxide semiconductor material.07-21-2011
20120243287SEMICONDUCTOR MEMORY DEVICE CAPABLE OF IMPROVING DISTURBABILITY AND WRITABILITY - According to one embodiment, a semiconductor memory device includes memory cells and sense amplifiers. Each of the memory cells comprises a flip-flop circuit and first to fourth transistors. The flip-flop circuit includes a first storage node and a second storage node. The first and second transistors are connected between the first and second storage nodes of the flip-flop circuit and the first and second bit lines, respectively, and have gate electrodes are connected to the word line. The third and fourth transistors have gate electrodes connected to the word line and disconnect a feedback loop of the flip-flop circuit when the first and second transistors are selected. In data write, of a plurality of sense amplifiers, a sense amplifier including an unselected memory cell which is connected to the word line writes back data output from the unselected memory cell to the unselected memory cell.09-27-2012
20110096585SEMICONDUCTOR DEVICE HAVING HIERARCHICAL DATA LINE STRUCTURE AND CONTROL METHOD THEREOF - To provide a semiconductor device including switch transistor provided between a sub-data line and a main data line. Upon transferring data, the semiconductor device supplies a potential of a VPP level to a gate electrode of the switch transistor when causing the switch transistor to be a conductive state, and supplies a potential of a VPERI level to the gate electrode when causing the switch transistor to be a non-conductive state. According to the present invention, because a potential of the gate electrode is not decreased to a VSS level when causing the switch transistor to be a non-conductive state, it is possible to reduce a current required to charge and discharge a gate capacitance of the switch transistor. Furthermore, because the VPP level is supplied to the gate electrode when causing the switch transistor to be a conduction state, a level of a signal after transfer never drops down by the amount of the threshold voltage.04-28-2011
20110176349Low-cost high-density rectifier matrix memory - A high-density memory device is fabricated three-dimensionally in layers. To keep points of failure low, address decoding circuits are included within each layer so that, in addition to power and data lines, only the address signal lines need be interconnected between the layers.07-21-2011
20110176347SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING SEMICONDUCTOR MEMORY - According to one embodiment, a memory cell array includes memory cells arranged at crossing points of bit lines and word lines. The bit lines include first, second, third, and fourth bit lines sequentially arranged. A first sense circuit is arranged on a first end side of the memory cell array, electrically connected to the first and third bit lines. A second sense circuit is arranged on a second end side of the memory cell array, electrically connected to the second and fourth bit lines. A first hookup region is arranged between the memory cell array and the first sense circuit and includes a first transfer transistor connected to the first bit line and the first sense circuit. A second hookup region is arranged between the first hookup region and the first sense circuit and includes a second transfer transistor connected to the third bit line and the first sense circuit.07-21-2011
20110249484SEMICONDUCTOR MEMORY DEVICE - An object is to provide a semiconductor memory device which stores data with the use of a transistor having small leakage current between a source and a drain in an off state as a writing transistor. In a matrix including a plurality of memory cells, gates of the writing transistors are connected to writing word lines. In each of the memory cells, a drain of the writing transistor is connected to a gate of a reading transistor, and the drain is connected to one electrode of a capacitor. Further, the other electrode of the capacitor is connected to a reading word line. In the semiconductor memory device in which the memory cells are connected in series so as to have a NAND structure, gates of the reading transistors are provided alternately, and the reading word line and the writing word line are shared.10-13-2011
20120120705SEMICONDUCTOR DEVICE HAVING BIT LINES AND LOCAL I/O LINES - The present invention efficiently decides line failure and contact failure in a semiconductor device. The semiconductor device has a plurality of bit line groups in which connection with local I/O lines is controlled by the same column selection signal line. A failure detecting circuit compares a first data group read from a first bit line group and a second data group read from a second bit line group to detect whether or not connection failure (contact failure) with the column selection signal line occurs in one of the first and second bit line groups.05-17-2012
20120120704SINGLE EVENT UPSET HARDENED STATIC RANDOM ACCESS MEMORY CELL - A single event upset (SEU) hardened memory cell to be utilized in static random access memories is disclosed. The SEU hardened memory cell includes a first transistor, a second transistor and a first resistor connected between a source of the first transistor and a drain of the second transistor. The SEU hardened memory cell also includes a third transistor, a fourth transistor and a second resistor connected between a source of the third transistor and a drain of the fourth transistor. The first resistor is also connected between a gate of the third transistor and the drain of a the second transistor. The second resistor is also connected between a gate of a the first transistor and the drain of the fourth transistor.05-17-2012
20080253160INTEGRATED CIRCUIT HAVING A MEMORY CELL ARRAY AND METHOD OF FORMING AN INTEGRATED CIRCUIT - An integrated circuit having a memory cell array and a method of forming an integrated circuit is disclosed. One embodiment provides bitlines running along a first direction, wordlines running along a second direction substantially perpendicular to the first direction, active areas and bitline contacts. The bitline contacts are arranged in columns extending in the second direction and in rows extending in the first direction. A distance between neighboring bitlines is DL, and a distance between neighboring bitline contacts is DC, DC being measured parallel to the first direction. The following relation holds: 1/2.25≦DL/DC≦1/1.75.10-16-2008
20080205114Semiconductor memory device and method of operating same - There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to a memory device and technique of reading data from and writing data into memory cells of the memory device. In this regard, in one embodiment of this aspect of the invention, the memory device and technique for operating that device that minimizes, reduces and/or eliminates the debilitating affects of the charge pumping phenomenon. This embodiment of the present invention employs control signals that minimize, reduce and/or eliminate transitions of the amplitudes and/or polarities. In another embodiment, the present invention is a semiconductor memory device including a memory array comprising a plurality of semiconductor dynamic random access memory cells arranged in a matrix of rows and columns. Each semiconductor dynamic random access memory cell includes a transistor having a source region, a drain region, a electrically floating body region disposed between and adjacent to the source region and the drain region, and a gate spaced apart from, and capacitively coupled to, the body region. Each transistor includes a first state representative of a first charge in the body region, and a second data state representative of a second charge in the body region. Further, each row of semiconductor dynamic random access memory cells includes an associated source line which is connected to only the semiconductor dynamic random access memory cells of the associated row.08-28-2008
20100328984PIEZO-EFFECT TRANSISTOR DEVICE AND APPLICATIONS - A piezo-effect transistor (PET) device includes a piezoelectric (PE) material disposed between first and second electrodes; and a piezoresistive (PR) material disposed between the second electrode and a third electrode, wherein the first electrode comprises a gate terminal, the second electrode comprises a common terminal, and the third electrode comprises an output terminal such that an electrical resistance of the PR material is dependent upon an applied voltage across the PE material by way of an applied pressure to the PR material by the PE material.12-30-2010
20100302831SEMICONDUCTOR STORAGE DEVICE - A memory cell of a static random access memory (SRAM) includes a pair of drive transistors, a pair of load transistors, a pair of write-only transfer transistors, a pair of read-only transfer transistors, a pair of read-only drive transistors, and a pair of column selection transistors. The memory cell also includes a word line, a pair of write bit lines, a pair of read bit lines, and a column selection line.12-02-2010
20110255325SEMICONDUCTOR DEVICE - An object is to provide a semiconductor device having a novel structure, which can hold stored data even when not powered and which has an unlimited number of write cycles. A semiconductor device includes a memory cell including a widegap semiconductor, for example, an oxide semiconductor. The memory cell includes a writing transistor, a reading transistor, and a selecting transistor. Using a widegap semiconductor, a semiconductor device capable of sufficiently reducing the off-state current of a transistor included in a memory cell and holding data for a long time can be provided.10-20-2011
20120147652THREE DIMENSIONAL NON-VOLATILE STORAGE WITH ASYMMETRICAL VERTICAL SELECT DEVICES - A three-dimensional array adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.06-14-2012
20110096586SEMICONDUCTOR MEMORY DEVICE HAVING LAYOUT AREA REDUCED - A metal supplying an N well voltage is provided in a first metal interconnection layer. The metal is electrically coupled to an active layer provided in an N well region by shared contacts so that the N well voltage is supplied to the N well region. A metal supplying a P well voltage is provided in a third metal interconnection layer. The metal supplying the N well voltage is formed using a metal in the first metal interconnection layer and thus does not require a piling region to the underlayer, and only a piling region to the underlayer of the metal for the P well voltage needs to be secured. Therefore, the length in the Y direction of a power feed cell can be reduced thereby reducing the layout area of the power feed cell.04-28-2011
20100214815MULTIPLE THRESHOLD VOLTAGE REGISTER FILE CELL - In one embodiment, a memory circuit comprises a pair of cross-coupled inverters configured to store a bit of data and a first transistor coupled to a first node of the pair of cross-coupled inverters. A plurality of transistors that form the pair of inverters have a first nominal threshold voltage. The first transistor is coupled to a first bit line, and has a second nominal threshold voltage that is lower than the first nominal threshold voltage. More specifically, in one embodiment, the first transistor is a write transistor and another write transistor having the second nominal threshold voltage is coupled to the other node of the pair of cross-coupled inverters. In an embodiment, a register file comprises a bit storage section comprising at least one pair of cross-coupled inverters, wherein transistors forming the inverters have a first nominal threshold voltage; a write transistor section comprising a first plurality of transistors; and a read transistor section comprising a second plurality of transistors. The first transistors and the second transistors have a second nominal threshold voltage that is lower than the first nominal threshold voltage. The write transistor section is physically located on a first side of the bit storage section, and the read transistor section is physically located on a second side of the bit storage section opposite the first side.08-26-2010
20100165696Memory Cell Array - Disclosed is a memory cell array including word and first bit lines and second bit lines respectively connected to memory cells, wherein each memory cell includes a MOS transistor and switching element having first and second conductive layers and a gap in which a resistance value changes by applying a predetermined voltage, and data is written by specifying the first bit line to connect it to a ground, specifying the word line and supplying a write voltage to the second bit lines, and read by specifying the word line, and specifying the first bit line to supply a read voltage lower than the write voltage to the second bit lines, and the word line is specified when the voltage of the word line becomes a gate threshold value voltage or more and a sum of a drive voltage and the gate threshold value voltage or less.07-01-2010
20100165697SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes: a memory cell array including a plurality of first wirings, a plurality of second wirings intersecting with the first wirings, and a plurality of memory cells respectively arranged at intersections of the first and second wirings; a plurality of drivers that drive the first wirings; a dummy wiring continuously extending in a direction of the first wirings and in a direction of the second wirings, a part of the dummy wiring extending in the direction of the second wirings being connected to the plurality of drivers; a plurality of switch circuits connected to respective connection portions of the plurality of drivers and the dummy wiring; and a replica line extending in the direction of the second wirings and connected to the dummy wiring through the plurality of switch circuits.07-01-2010
20110149630HIGH READ SPEED ELECTRONIC MEMORY WITH SERIAL ARRAY TRANSISTORS - Providing a serial array semiconductor architecture achieving fast program, erase and read times is disclosed herein. By way of example, a memory architecture can comprise a serial array of semiconductors coupled to a metal bitline of an electronic memory device at one end of the array, and a gate of a pass transistor at an opposite end of the array. Furthermore, a second metal bitline is coupled to a drain of the pass transistor. A sensing circuit that measures current or voltage at the second metal bitline, which is modulated by a gate potential of the pass transistor, can determine a state of transistors of the serial array. Because of low capacitance of the pass transistor, the serial array can charge or discharge the gate of the pass transistor quickly, resulting in read times that are significantly reduced as compared with conventional serial semiconductor array devices.06-23-2011
20090175064SEMICONDUCTOR MEMORY DEVICE WITH REDUCED COUPLING NOISE - A semiconductor device includes a plurality of word lines, a plurality of bit lines, a plurality of memory cells provided at the intersections of the plurality of word lines and the plurality of bit lines and each of that includes a MIS transistor and a memory element, a decoder circuit for selecting a plurality of word lines, and a sense-amplifier circuit for determining information that is read from any of the plurality of memory cells to any of the plurality of bit lines, wherein a twist connector for switching the wiring order of the plurality of word lines is provided and level-stabilizing circuits, for supplying the potential level of a non-selected state to the plurality of word lines in the non-selected state are arranged in the area below the twist connector.07-09-2009
20100027311INTEGRATED CIRCUIT AND METHOD OF FORMING AN INTEGRATED CIRCUIT - An integrated circuit and a method of forming an integrated circuit. One embodiment includes a conductive line formed above a surface of a carrier. A slope of the sidewalls of the conductive line in a direction perpendicular to the surface of the carrier reveals a discontinuity and a width of the conductive line in an upper portion thereof is larger than the corresponding width in the lower portion.02-04-2010
20110216571SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE - A matrix is formed using a plurality of memory cells in each of which a drain of the writing transistor is connected to a gate of a reading transistor and one electrode of a capacitor. A gate of the writing transistor, a source of the writing transistor, a source of the reading transistor, and a drain of the reading transistor are connected to a writing word line, a writing bit line, a reading bit line, and a bias line, respectively. In order to reduce the number of wirings, a writing word line to which the gate of the writing transistor is not connected is substituted for the reading word line. Further, the writing bit line is substituted for the reading bit line.09-08-2011
20110051489SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a first inverter and a second inverter each having an input and an output, the output of each of the first and second inverters being connected to the input of the other so that data is stored, a CMOS switch configured to connect the input of the first inverter and a write bit line, a read MOS transistor having a gate connected to the output of the first inverter, and a MOS switch configured to connect the read MOS transistor to a read bit line. The first and second inverters have different sizes and are connected to different source power supplies.03-03-2011
20110051488SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device to an exemplary aspect of the present invention includes a plurality of memory cells, a plurality of word lines, a plurality of bit line pairs, a plurality of column selectors, a common signal line pair including one common line commonly connected to one of each of the plurality of bit line pairs, and the other common line commonly connected to the other of each of the plurality of bit line pairs, a sense amplifier amplifying the potential difference of the common signal line pair, and a plurality of capacitance adding circuits that balance with parasitic capacitances of the column selectors which are not selected, the capacitance adding circuits being provided respectively between the one of each of the bit line pairs and the other common line and between the other of each of the bit line pairs and the one common line.03-03-2011
20120099359Nonvolatile Memory Architecture - Representative implementations of memory devices have transistors between memory cells of a memory device. Memory devices may be arranged in memory arrays. The use of transistors may include alternately providing electrical isolation or current paths between pairs or groups of memory cells in a memory array.04-26-2012
20090080231SEMICONDUCTOR MEMORY DEVICE - A basic cell comprises a memory cell capable of retaining data having at least a binary value, a first selecting transistor connected between a first terminal of the memory cell and the Mth bit line, and a second selecting transistor connected between the first terminal of the memory cell and the M+1th bit line. A gate of the first selecting transistor is connected to the 2·N−1th selecting line, and a gate of the second selecting transistor is connected to the 2·Nth selecting line.03-26-2009
20120206956MEMORY CIRCUIT - While the supply of power is stopped, a data signal that has been held in a volatile memory section can be held in a nonvolatile memory section. In the nonvolatile memory section, a transistor having an extremely low off-state current allows a data signal to be held in the capacitor for a long period of time. Thus, the nonvolatile memory section can hold the logic state even while the supply of power is stopped. When the supply of power is started again, the data signal that has been held in the capacitor while the supply of power has been stopped is set at such a potential that malfunction does not occur by turning on the reset circuit.08-16-2012
20110317466HIGH READ SPEED MEMORY WITH GATE ISOLATION - Providing for a serial array memory transistor architecture that achieves high read speeds compared with conventional serial array memory is described herein. By way of example, the serial array memory can be connected to and can drive a gate voltage of a small capacitance pass transistor, to facilitate sensing memory transistors of the serial array. The pass transistor modulates current flow or voltage at an adjacent metal bitline, which can be utilized to sense a program or erase state(s) of the memory transistors. Due to the small capacitance of the pass transistor, read latency for the serial array can be significantly lower than conventional serial array memory (e.g., NAND memory). Further, various mechanisms for forming an amplifier region of the serial array memory comprising discrete pass transistor are described to facilitate efficient fabrication of the serial array memory transistor architecture.12-29-2011
20120155143SEMICONDUCTOR DEVICE - A semiconductor device includes a plurality of gates of high voltage transistors configured to couple a plurality of global word lines to a plurality of local word lines and the plurality of local word lines arranged over each of the gates. The plurality of local word lines is arranged within a width of the gate.06-21-2012
20120014157SEMICONDUCTOR DEVICE - A plurality of memory cells included in a memory cell array are divided into a plurality of blocks every plural rows. A common bit line is electrically connected to the divided bit lines through selection transistors in the blocks. One of the memory cells includes a first transistor, a second transistor, and a capacitor. The first transistor includes a first channel formation region. The second transistor includes a second channel formation region. The first channel formation region includes a semiconductor material different from the semiconductor material of the second channel formation region.01-19-2012
20120026774SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME - An object is to provide a semiconductor device in which lower power consumption is realized by lowering voltage for data writing without increase in types of power supply potentials. Another object is to provide a semiconductor device in which threshold voltage drop of a selection transistor is suppressed without increase in types of power supply potentials for data writing. A diode-connected transistor is electrically connected in series with a word line electrically connected to a gate of an n-channel selection transistor. A capacitor is provided between the word line and a bit line electrically connected to one of a source and a drain of the selection transistor; alternatively, the capacitance between the bit line and the word line is used. In data writing, the timing of selecting the word line is earlier than the timing of selecting the bit line.02-02-2012
20120026773SEMICONDUCTOR MEMORY APPARATUS HAVING SENSE AMPLIFIER - Disclosed is a semiconductor memory apparatus comprising an upper mat and a lower mat with a sense amplifier array region in between, where the sense amplifier array region includes a plurality of sense amplifiers. There is also a plurality of bit lines configured to extend toward the sense amplifier array region from the upper mat, and a plurality of complementary bit lines configured to extend toward the sense amplifier array region from the lower mat. Bit lines of the upper mat and complementary bit lines of the lower mat are configured to be alternately disposed at a predetermined interval in the sense amplifier array region, and the sense amplifier is configured to be formed between a bit line and a corresponding complementary bit line.02-02-2012
20110090729SEMICONDUCTOR STORAGE DEVICE AND ROM GENERATOR - According to one embodiment, a semiconductor storage device includes a first memory cell, a second memory cell and a third memory cell. The first memory cell forms a connection path used for storage of data. The second memory cell varies a connection place from a connection place of the connection path formed in the first memory cell, and stores data different from the data stored in the first memory cell is stored. The third memory cell varies a connection place from the connection place of the connection path formed in the second memory cell, and stores data same as the data stored in the first memory cell is stored.04-21-2011
20110103126SEMICONDUCTOR MEMORY DEVICE - A control circuit supplies a word line drive voltage to one of m word lines which corresponds to a memory cell to which data is to be written, during a word line drive period including a first period and a second period following the first period, to decrease current capabilities of first and second load transistors included in the memory cell during the first period, and increase the current capabilities of the first and second load transistors during the second period.05-05-2011
20110103125MEMORY CELLS HAVING A FOLDED DIGIT LINE ARCHITECTURE - Memory arrays having folded architectures and methods of making the same. Specifically, memory arrays having a portion of the transistors in a row that are reciprocated and shifted with respect to other transistors in the same row. Trenches formed between the rows may form a weave pattern throughout the array, in a direction of the row. Trenches formed between legs of the transistors may also form a weave pattern throughout the array in a direction of the row.05-05-2011
20120120706SEMICONDUCTOR MEMORY DEVICE - A plurality of contact plugs to be connected to a drain region or a source region of each of transistors constituting a sub-word line driver that drives a sub-word line are formed, by using a SAC line technique of selectively etching an insulation layer that covers each of the transistors by using a mask having line-shaped openings provided across a portion in which the contact plugs of each of the transistors are to be formed.05-17-2012
20100246235Memory Cell Heating Elements - The present disclosure relates to the heating of memory cells.09-30-2010
20100246236SEMICONDUCTOR MEMORY DEVICE HAVING LAYOUT AREA REDUCED - A metal supplying an N well voltage is provided in a first metal interconnection layer. The metal is electrically coupled to an active layer provided in an N well region by shared contacts so that the N well voltage is supplied to the N well region. A metal supplying a P well voltage is provided in a third metal interconnection layer. The metal supplying the N well voltage is formed using a metal in the first metal interconnection layer and thus does not require a piling region to the underlayer, and only a piling region to the underlayer of the metal for the P well voltage needs to be secured. Therefore, the length in the Y direction of a power feed cell can be reduced thereby reducing the layout area of the power feed cell.09-30-2010
20120314469SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes a semiconductor substrate and an active area on the semiconductor substrate. A plurality of cell transistors are formed on the active area. A first bit line and a second bit line are paired with each other. A plurality of word lines intersect the first and second bit lines. A plurality of storage elements respectively has a first end electrically connected to a source or a drain of one of the cell transistors and a second end connected to the first or second bit line. Both of the first and second bit lines are connected to the same active area via the storage elements.12-13-2012
20120127775SECURE STORAGE OF A CODEWORD WITHIN AN INTEGRATED CIRCUIT - The invention discloses an integrated circuit (05-24-2012
20100080033VOLATILE MEMORY ELEMENTS WITH SOFT ERROR UPSET IMMUNITY - Memory elements are provided that exhibit immunity to soft error upset events when subjected to high-energy atomic particle strikes. The memory elements may each have ten transistors. To overcome difficulties in writing data into the memory elements, signal strengths for one or more of the signals provided to the array may be adjusted. There may be two positive power supply voltages that are used in powering each memory element. One of the power supply voltages may be temporarily lowered relative to the other power supply voltage to enhance write margin during data loading operations. Other signal strengths that may be adjusted in this way include other power supply signals, data signal levels, address and clear signal magnitudes, and ground signal strengths. Adjustable power supply circuitry and data read-write control circuitry may be used in making these signal strength adjustments.04-01-2010
20120134195Memory Device and Manufacturing Method Thereof - The present invention relates to a memory device having 05-31-2012
20120314470MEMORY DEVICE - A memory cell includes a first transistor controlling writing of the first date by being in an on state, and holding of the first data by being in an off state, a second transistor in which a potential of one of a source and a drain is a potential of the second data and a potential of a gate is a potential of the first data, and a third transistor which has a conductivity type opposite to that of the second transistor, which has one of a source and a drain electrically connected to the other of the source and the drain of the second transistor, and in which a potential of a gate is a potential of the first data.12-13-2012
20090059643SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device has a simple layout pattern of a sub hole region. The semiconductor memory device includes a segment input/output line, a first local input/output line and a second local input/output line corresponding to the segment input/output line, an input/output switch configured to selectively connect the segment input/output line and the first local input/output line in response to a first switch control signal, and a dummy input/output switch which is connected to a second local input/output line but is not connected to the segment input/output line.03-05-2009
20120075904SEMICONDUCTOR DEVICE - A semiconductor device includes a memory cell, a bit line coupled to the memory cell, first and second wells arranged adjacently to each other, the first and second wells being different in conductivity type from each other and defining a boundary therebetween, first and second transistors formed in the first and second wells, respectively, and being different in channel type from each other, gate electrodes of the first and second transistors being connected in common to the bit line, and a third transistor formed in the first well such that the third transistor is sandwiched between the boundary and the first transistor, and a gate of the third transistor being supplied with a bit line precharge signal.03-29-2012
20100271858TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE HAVING GANGED CARRIER INJECTION LINES - Techniques for providing a direct injection semiconductor memory device having ganged carrier injection lines are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus including a first region coupled to a bit line and a second region coupled to a source line. The apparatus may also comprise a body region spaced apart from and capacitively coupled to a word line, wherein the body region is electrically floating and disposed between the first region and the second region. The apparatus may further comprise a third region coupled to a constant voltage source via a carrier injection line configured to inject charges into the body region through the second region.10-28-2010
20100271857TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for biasing a direct injection semiconductor memory device. The method may comprise applying a first voltage potential to a first N-doped region via a bit line and applying a second voltage potential to a second N-doped region via a source line. The method may also comprise applying a third voltage potential to a word line, wherein the word line is spaced apart from and capacitively coupled to a body region that is electrically floating and disposed between the first N-doped region and the second N-doped region. The method may further comprise applying a fourth voltage potential to a P-type substrate via a carrier injection line.10-28-2010
20120314471SEMICONDUCTOR DEVICE - A semiconductor device comprises a first region and a second region. The first region includes a plurality of memory cells each of which holds respective data and a plurality of sense amplifiers that respectively amplify the data in the plurality of memory cells, based on a first voltage. The second region is provided along one side of the first region and includes a first power supply generation circuit that generates the first voltage, based on a second voltage. The second voltage being supplied to the first power supply circuit by a first power supply interconnect extends on the first region in a first direction parallel to the one side of the first region.12-13-2012
20120262979MEMORY DEVICE - A memory device includes a memory cell storing data as stored data, an output signal line, and a wiring to which a voltage is applied. The memory cell includes a comparison circuit performing a comparison operation between the stored data and search data and taking a conduction state or a non-conduction state in accordance with the operation result, and a field-effect transistor controlling writing and holding of the stored data. A voltage of the output signal line is equal to the voltage of the wiring when the comparison circuit is in the conduction state.10-18-2012
20120262978SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - Transistors formed in one identical diffusion layer and performing complementary operations are generally arranged symmetrically with respect to the diffusion layer. A semiconductor integrated device using a layout capable of partially avoiding restriction on the design of the semiconductor integrated circuit device and reducing the size and economizing the manufacturing cost is provided by breaking the stereotype idea. The size of the semiconductor integrated circuit device can be decreased further by arranging two transistors formed in one identical diffusion layer and conducting complementary operations by intentionally arranging them in an asymmetric pattern.10-18-2012
20090207642SEMICONDUCTOR SIGNAL PROCESSING DEVICE - A unit operator cell includes a plurality of SOI (Silicon on Insulator) transistors, write data is stored in a body region of at least two SOI transistors, and the storage SOI transistors are connected in series with each other to a read port or each of the storage SOI transistors is singly connected to the read port. Therefore, an AND operation result or a NOT operation result of data stored in the unit operator cells can be obtained, and operation processing can be performed only by writing and reading data. A semiconductor signal processing device that can perform logic operation processing and arithmetic operation processing at high speed is implemented with low power consumption and a small occupation area.08-20-2009
20100296327TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region connected to a bit line extending in a first orientation and a second region connected to a source line extending in a second orientation. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line extending in the second orientation, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region connected to a carrier injection line extending in the second orientation, wherein the first region, the second region, the body region, and the third region are disposed in sequential contiguous relationship.11-25-2010
20110122670SEMICONDUCTOR DEVICE - An object of the present invention is to provide a semiconductor device combining transistors integrating on a same substrate transistors including an oxide semiconductor in their channel formation region and transistors including non-oxide semiconductor in their channel formation region. An application of the present invention is to realize substantially non-volatile semiconductor memories which do not require specific erasing operation and do not suffer from damages due to repeated writing operation. Furthermore, the semiconductor device is well adapted to store multivalued data. Manufacturing methods, application circuits and driving/reading methods are explained in details in the description.05-26-2011
20120320655SEMICONDUCTOR DEVICES - A semiconductor device includes a cell region including memory cells that have a selection element and a data storage element, and a driving circuit region including a driving transistor configured to operate the selection element. The driving transistor includes active portions defined by a device isolation pattern in a substrate and a gate electrode running across the active portion along a first direction, the gate electrode including channel portions of a ring-shaped structure. The driving transistor further includes first impurity doped regions disposed in the active portions that are surrounded by channel portions, and second impurity doped regions disposed in the active portion that are separated from the first impurity doped regions by the channel portions.12-20-2012
20120268979SEMICONDUCTOR DEVICE - A nonvolatile memory is provided. A semiconductor device (a nonvolatile memory) has a circuit configuration similar to that of a general SRAM. By providing a transistor whose off-state current is small between a stored data holding portion and a power supply line of the SRAM, leakage of electric charge from the stored data holding portion is prevented. As the transistor whose off-state current is small provided for preventing leakage of electric charge from the stored data holding portion, a transistor including an oxide semiconductor film is preferably used. Such a configuration can also be applied to a shift register, whereby a shift register with low power consumption can be obtained.10-25-2012
20120327698INTERCONNECTION ARCHITECTURE FOR MEMORY STRUCTURES - An interconnect architecture for connecting read/write circuitry to a memory structure, the interconnect architecture includes a switching layer having a number of access switches arranged in at least one set of two offset switch blocks, the access switches being connected to a first set of parallel wire tracks and a second set of parallel wire tracks intersecting the first set of parallel wire tracks; and a routing layer connecting the switches to a number of access vias of the memory structure; in which four wire tracks are used to select a programmable device of the memory structure.12-27-2012
20110157954SRAM MEMORY DEVICE - An embodiment of a memory device includes a plurality of memory cells; each memory cell includes a latch adapted to store an information bit. Said latch includes a first logic gate including a first input terminal and a first output terminal and a second logic gate including a second input terminal and a second output terminal. Said first input terminal is connected to said second output terminal and said first output terminal is connected to said second input terminal. The memory device further includes reading and writing means adapted to perform a read operation or a write operation of the information bit. Said first logic gate includes a pull-up branch coupled between a terminal for providing a supply voltage and the first output terminal, and a pull-down branch coupled between the first output terminal and a terminal for providing a reference voltage. Said second logic gate includes a pull-up branch coupled between a terminal for providing the supply voltage and the second output terminal, and a pull-down branch coupled between the second output terminal and a terminal for providing the reference voltage. Said memory device includes variation means adapted to selectively vary a gain factor of at least one between the pull-down branch and the pull-up branch of said first logic gate and second logic gate depending on the operation performed by the reading and writing means.06-30-2011
20090135639SEMICONDUCTOR STORAGE DEVICE - In a semiconductor storage device, either two memory cell gates TG or a memory cell gate TG and a bit-line connecting gate SW are formed in every set of n-type doped regionsOOD at the intersections with word lines WL or bit-line selecting lines KS. A portion near the center of the set of n-type doped regions OD serves as a source/drain region shared by two gates, whereas portions near both ends thereof serve as source/drain regions for respective gates. Each of the source/drain regions is connected to a storage electrode SN of a memory cell capacitor via a storage contact CA or is connected to a sub bit line or a main bit line via a sub-bit-line contact CH and/or a via of a metal interconnection. A pattern formed of four memory cell gates TG and four bit-line connecting gates SW is repeated.05-28-2009
20130141959SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to an embodiment comprises: a plurality of memory cells arranged in a first direction and a second direction; local bit lines connected to group of the memory cells; a global bit line to be commonly connected to a plurality of the local bit lines; and switch circuits connected between the local bit lines and the global bit line. The switch circuits connect the global bit line to one of the local bit lines, the one of the local bit lines being electrically connected to the memory cells of the group located at a position specified by select information of the first direction and the second direction.06-06-2013
20110261604MEMORY CELL AND AN ASSOCIATED MEMORY DEVICE - A memory cell includes a pair of sub-cells, each including an access transistor, a storage transistor, and an isolation transistor that are serially coupled in sequence with their source/drain connected. The isolation transistor is shared with a sub-cell of an adjacent memory cell and always turned off, wherein the storage transistor is always turned on. A wordline is coupled to a gate of the access transistor of each sub-cell, and complementary bit lines are respectively coupled to sources/drains of the access transistors of the pair of sub-cells, such that data bit may be accessed between the bit line and the corresponding storage transistor through the corresponding access transistor.10-27-2011
20130100723SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF - A semiconductor memory device in which capacitance of a capacitor is lower and integration degree is higher. A plurality of memory blocks is connected to one bit line BL_m. A memory block MB_n_m includes a sub bit line SBL_n_m, a write switch, and a plurality of memory cells. A sub bit line SBL_n+1_m adjacent to the sub bit line SBL_n_m is connected to an amplifier circuit AMP_n/n+1_m including two inverters and two selection switches. A circuit configuration of the amplifier circuit can be changed with the selection switches. The amplifier circuit is connected to the bit line BL_m through a read switch. Because of a sufficiently low capacitance of the sub bit line SBL_n_m, potential change due to electric charges of the capacitor in each memory cell can be amplified by the amplifier circuit AMP_n/n+1_m without an error, and the amplified data can be output to the bit line BL_m.04-25-2013
20130121055WORD LINE DRIVER CELL LAYOUT FOR SRAM AND OTHER SEMICONDUCTOR DEVICES - A word line driver cell suitable for RAM devices such as SRAM, static random access memory devices, is provided. The word line driver cell is compatible with double pattern processing techniques and enables the formation of all word lines from a single metal layer which, in turn, enables overlying and underlying metal levels to be used for other features such as signal lines for word line decoders. A power mesh is formed using multiple metal layers and the formation of all the word lines from a single metal layer enables VDD and VSS power lines that are formed from an overlying layer to extend orthogonal to the cell direction and include wider widths reducing metal line resistance and increasing the deliverable power.05-16-2013
20110255326Semiconductor Device - The invention provides a semiconductor device that power is stabilized by suppressing power consumption as much as possible. The semiconductor device of the invention includes a logic portion and a memory portion each including a plurality of transistors, a detecting portion for detecting one or both of operation frequencies of the logic portion and the memory portion, a Vth control for supplying a Vth control signal to one or both of the logic portion and the memory portion, and an antenna. Each of the plurality of transistors has a first gate electrode which is input with a logic signal, a second gate electrode which is input with the Vth control signal, and a semiconductor film such that the second gate electrode, the semiconductor film, and the first gate electrode are provided in this order from the bottom.10-20-2011
20090268503NON-VOLATILE MEMORY BITCELL - A non-volatile memory bitcell which comprises a first bistable cantilever module and a second bistable cantilever modules. The bistable cantilever modules have a shared output terminal and each has an input terminal and two actuating terminals. The first and second cantilever modules are arranged such that their states are complementary. The memory bitcell further includes buffering means arranged to prevent the flow of current from the shared output terminal and further arranged to indicate the states of the first and second cantilever modules.10-29-2009
20120275207SRAM CELL PARAMETER OPTIMIZATION - An integrated circuit having an SRAM cell includes a pair of cross-coupled inverters with first driver and load transistors connected to provide a first storage node and second driver and load transistors connected to provide a second storage node. The SRAM cell also includes first and second pass gate transistors controlled by at least one word line and respectively connected between a first bit line and the first storage node and a second bit line and the second storage node; wherein a first driver transistor threshold voltage is different than a second driver transistor threshold voltage and one of the first and second driver threshold voltages is different than a pass gate transistor threshold voltage. Alternately, a threshold voltage of the first and second driver transistors is different than a symmetrical pass gate transistor threshold voltage. Additionally, methods of manufacturing an integrated circuit having an SRAM cell are provided.11-01-2012
20130155753METHOD FOR IMPLEMENTING SPARE LOGIC OF SEMICONDUCTOR MEMORY APPARATUS AND STRUCTURE THEREOF - A method for implementing a spare logic of a semiconductor memory apparatus includes the steps of: forming one or more contact conductive layers, which are independent, in a power line and an active area, respectively; and performing metal programming on the contact conductive layers formed in the power line and the active area to electrically couple the independent contact conductive layers formed in the power line and the active area.06-20-2013
20130194855HIGH CURRENT CAPABLE ACCESS DEVICE FOR THREE-DIMENSIONAL SOLID-STATE MEMORY - The present invention generally relates to three-dimensional arrangement of memory cells and methods of addressing those cells. The memory cells can be arranged in a 3D orientation such that macro cells that are in the middle of the 3D arrangement can be addressed without the need for overhead wiring or by utilizing a minimal amount of overhead wiring. An individual macro cell within a memory cell can be addressed by applying three separate currents to the macro cell. A first current is applied to the memory cell directly. A second current is applied to the source electrode of the MESFET, and a third current is applied to the gate electrode of the MESFET to permit the current to travel through the channel of the MESFET to the drain electrode which is coupled to the memory element.08-01-2013
20120075903Nonvolatile Semiconductor Memory - A select gate transistor has a select gate electrode composed of a first-level conductive layer and a second-level conductive layer. The first-level conductive layer has contact areas. The second-level conductive layer has its portions removed that are located above the contact areas. Two adjacent select gate electrodes that are adjacent to each other in the column direction are arranged such that the contact areas of one select gate electrode are not opposed to the contact areas of the other select gate electrode. One select gate electrode has its first- and second-level conductive layers removed in their portions that are opposed to the contact areas of the other select gate electrode.03-29-2012
20120087169CIRCUIT FOR CONCURRENT READ OPERATION AND METHOD THEREFOR - A non-volatile memory device includes a plurality of memory units provided in an array, each memory unit having a plurality of resistive memory cells and a local word line. Each resistive memory units has a first end and a second end, the second ends of the resistive memory cells of each memory unit being coupled to the local word line of the corresponding memory unit. A plurality of bit lines is provided, each bit line being coupled to the first end of one of the resistive memory cells. A plurality of select transistors is provided, each select transistor being assigned to one of the memory units and having a drain terminal coupled to the local word line of the assigned memory unit. First and second global word lines are provided, each global word line being coupled to a control terminal of at least one select transistor. First and second source lines are provided, each source line being coupled to a source terminal of at least one select transistor. The memory device is configured to concurrently read out all of the resistive memory cells in one of the memory units selected for a read operation.04-12-2012

Patent applications in class Transistors or diodes