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Particular biasing

Subclass of:

365 - Static information storage and retrieval

365185010 - FLOATING GATE

Patent class list (only not empty are listed)

Deeper subclasses:

Class / Patent application numberDescriptionNumber of patent applications / Date published
365185200 Reference signal (e.g., dummy cell) 552
365185190 Multiple pulses (e.g., ramp) 280
365185290 Erase 189
365185250 Line charging (e.g., precharge, discharge, refresh) 117
365185230 Drive circuitry (e.g., word line driver) 92
365185280 Tunnel programming 62
365185240 Threshold setting (e.g., conditioning) 55
365185270 Substrate bias 23
365185260 Floating electrode (e.g., source, control gate, drain) 23
Entries
DocumentTitleDate
20130044547DEVICE, METHOD AND COMPUTER READABLE PROGRAM FOR ACCESSING MEMORY CELLS USING SHORTENED READ ATTEMPTS - A device, a computer readable medium and a method that may include performing a shortened read attempt of multiple data memory cells that store data to provide an estimate of the data; wherein the shortened read attempt has a duration that is shorter than a duration of a full read attempt; performing a shortened read attempt of redundant memory cells that store redundant information to provide an estimate of the redundant information; wherein the estimate of the redundant information is indicative of an expected number of data memory cells that store a certain logic value; determining, based on the estimate of the data, an estimated number of data memory cells that store the certain logic value; comparing the expected number to the estimated number; and providing the estimate of the data as a read result if the expected number and the estimated number equal each other.02-21-2013
20130044546DETERMINING SYSTEM LIFETIME CHARACTERISTICS - The present disclosure includes methods and systems for determining system lifetime characteristics. A number of embodiments include a number of memory devices and a controller coupled to the number of memory devices. The controller can be configured to perform a number of operations on the number of memory devices using a number of trim parameters at a testing level, and determine a system lifetime characteristic based, at least partially, on the number of operations performed on the number of memory devices using the number of trim parameters at the testing level.02-21-2013
20130028022DYNAMIC PROGRAM WINDOW DETERMINATION IN A MEMORY DEVICE - Methods for determining a program window and memory devices are disclosed. One such method for determining the program window measures an amount of program disturb experienced by a particular state and determines the program window responsive to the amount of program disturb.01-31-2013
20130028024APPARATUSES AND METHODS INCLUDING MEMORY ARRAY DATA LINE SELECTION - Some embodiments include an apparatus having data lines coupled to memory cell strings and a selector configured to selectively couple one of the data lines to a node. The memory cell strings and the selector can be formed in the same memory array of the apparatus. Other embodiments including additional apparatus and methods are described.01-31-2013
20130028023APPARATUSES AND METHODS INCLUDING MEMORY ARRAY AND DATA LINE ARCHITECTURE - Some embodiments include apparatus and methods having memory cells located in different device levels of a device, at least a portion of a transistor located in a substrate of the device, and a data line coupled to the transistor and the memory cells. The data line can be located between the transistor and the memory cells. Other embodiments including additional apparatus and methods are described.01-31-2013
20080304323Method and apparatus for programming data of memory cells considering floating poly coupling - A method and an apparatus for programming data of memory cells considering coupling are provided. The method includes: calculating a change of a threshold voltage based on source data of the memory cells; converting source data which will be programmed based on the calculated change of the threshold voltage; and programming the converted source data.12-11-2008
20120163088SEMICONDUCTOR MEMORY DEVICE AND CONTROL METHOD THEREFOR - According to one embodiment, a semiconductor memory device includes a memory cell array including memory cells, each of which is arranged at a position of between a word line and a bit line, a row decoder, and a bit line control circuit. And when data is to be read out from the memory cell, a charge control circuit controls the gate voltages of a first transistor, a second transistor, a third transistor, and a fourth transistor, respectively, so that the bit line is charged in accordance with a first characteristic obtained by increasing a current driving capacity of the first transistor during a desired period after start of charge of the bit line, and the bit line is then charged in accordance with a second characteristic obtained by returning the current driving capacity of the first transistor to the lower current driving capacity after elapse of the desired period.06-28-2012
20120163084Early detection of degradation in NAND flash memory - Techniques for early detection of degradation in NAND Flash memories by measuring the dispersion of the threshold voltages (VT's), of a set (e.g. page) of NAND Flash memory cells during read operations are described. In an embodiment of the invention the time-to-completion (TTC) values for the read operation for the memory cells are used as a proxy for dispersion of the threshold voltages (VT's). A Dispersion Analyzer determines the dispersion of the set of TTC values. In one embodiment the delta between the maximum and minimum TTC values is used as the dispersion measurement. If the measured TTC dispersion differs by more than a selected amount from a reference dispersion value, a warning signal is provided to indicate that the page of memory has degraded. The warning signal can be used to take appropriate action such as moving the data to a new page.06-28-2012
20090080262METHOD OF PROGRAMMING A NAND FLASH MEMORY DEVICE - A method of programming a NAND flash memory device includes providing a flash memory device, wherein word lines are disposed between a drain selecting line and a source selecting line, wherein a first word line is provided adjacent to the source selecting line and a last word line is provided adjacent to the drain selecting line; and selecting a word line to program memory cells coupled to the selected word line to perform an even LSB program operation and an odd LSB program operation for the selected first word line. Each of the word lines is selected until all of the word lines have been selected, so that the even LSB program operation and the odd LSB program operation can be performed for all of the word lines. The even LSB program operation is performed to store a lower rank data bit in memory cells coupled to an even bit line assigned a selected word line. The odd LSB program operation is performed to store a lower rank data bit in memory cells coupled to an odd bit line assigned to the selected word line.03-26-2009
20130028025NONVOLATILE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A flash memory device comprises alternately arranged odd and even memory cells. The odd and even memory cells are connected to corresponding odd and even bitlines, which are connected to corresponding odd and even page buffers. In a read operation of the flash memory device, data is sensed at two different times via the odd and even bitlines. In certain embodiments, data is read from the odd page buffers while data is being sensed via the even bit lines, or vice versa.01-31-2013
20110188314BIT LINE STABILITY DETECTION - A power supply and monitoring apparatus such as in a nonvolatile memory system. A power supply circuit provides power to a large number of sense modules, each of which is associated with a bit line and a string of non-volatile storage elements. During a sensing operation, such as a read or verify operation, a discharge period is set in which a sense node of each sense module discharges into the associated bit line and string of non-volatile storage elements, when the string of non-volatile storage elements, is conductive. This discharge sinks current from the power supply, causing a perturbation. By sampling the power supply, a steady state condition can be detected from a rate of change. The steady state condition signals that the discharge period can be concluded and data can be latched from the sense node. The discharge period automatically adapts to different memory devices and environmental conditions08-04-2011
20080259690FLASH MEMORY DEVICE - A NAND flash memory device includes a high voltage switch and a bulk voltage supplying circuit. The high voltage switch is configured to transfer a word line voltage to selected word lines of selected memory cells. The bulk voltage supplying circuit is configured to provide a negative voltage to a bulk region of the high voltage switch in response to an operation mode.10-23-2008
20100157681Read, Verify Word Line Reference Voltage to Track Source Level - A non-volatile memory device has individual pages of memory cells to be sensed in parallel. The memory device includes a source level tracking circuit coupled to receive a predetermined word line voltage from a word line voltage supply and the voltage level at the aggregate source node of one or more pages and coupled to provide to word lines of the memory an output voltage during the sensing operation, where the source level tracking circuit includes an op amp whereby the output voltage is the word line voltage offset by an amount to track the voltage level at the aggregate node and compensate for source bias errors due to a finite resistance in the ground loop.06-24-2010
20100020616Soft Errors Handling in EEPROM Devices - Soft errors occur during normal use of a solid-state memory such as EEPROM or Flash EEPROM. A soft error results from the programmed threshold voltage of a memory cell being drifted from its originally intended level. The error is initially not readily detected during normal read until the cumulative drift becomes so severe that it develops into a hard error. Data could be lost if enough of these hard errors swamps available error correction codes in the memory. A memory device and techniques therefor are capable of detecting these drifts and substantially maintaining the threshold voltage of each memory cell to its intended level throughout the use of the memory device, thereby resisting the development of soft errors into hard errors.01-28-2010
20100074023SEMICONDUCTOR DEVICE HAVING NON-VOLATILE MEMORY AND METHOD OF FABRICATING THE SAME - A memory cell of a non-volatile memory device, comprises: a select transistor gate of a select transistor on a substrate, the select transistor gate comprising: a gate dielectric pattern; and a select gate on the gate dielectric pattern; first and second memory cell transistor gates of first and second memory cell transistors on the substrate at opposite sides of the select transistor, each of the first and second memory cell transistor gates comprising: a tunnel insulating layer pattern; a charge storage layer pattern on the tunnel insulating layer pattern; a blocking insulating layer pattern on the charge storage layer pattern; and a control gate on the blocking insulating layer pattern; first and second floating junction regions in the substrate between the select transistor gate and the first and second memory cell transistor gates respectively; and first and second drain regions in the substrate at sides of the first and second memory cell transistor gates respectively opposite the first and second floating junction regions respectively. Methods of formation thereof are also provided03-25-2010
20100074022MEMORY AND METHOD FOR PROGRAMMING THE SAME - A method for programming a memory is provided. The memory includes multiple rows of memory cells each including two half cells. The method includes the following steps. Whether the two half cells of a to-be-programmed memory cell of the n03-25-2010
20130077405NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device in an embodiment includes a semiconductor layer, a memory cell array, word lines, bit lines, a source line, and a control circuit. The memory cell array has memory strings, each of the memory strings having memory cells. The word lines are connected to the control gates of the memory cells. The control circuit controls a voltage applied to the semiconductor layer, the control gates, the bit lines, and the source line. When executing a read operation, the control circuit begins application of a first voltage to the source line at a first time, the first voltage having a positive value. The control circuit begins application of a second voltage to unselected word lines at the first time or thereafter, the second voltage setting the memory cells to a conductive state regardless of retained data of the memory cells.03-28-2013
20130077406Flash Memory Device - A flash memory device is provided. The flash memory device includes a memory cell array and a pre-charge unit. The pre-charge unit, coupled to a plurality of bit lines corresponding with the memory cell array, pre-charges the bit lines to a predetermined voltage during a pre-charge stage. The pre-charge unit includes a voltage stabilizing unit to provide a constant current to the bit lines. Due to the voltage stabilizing unit, in a programming process, the voltage applied to the bit lines which are not related with programming may not drop as a result of current leakage. Therefore, the memory cells except the memory cell to be programmed are kept in cut off state, without a current passing. As a result, interference with the memory cells which are not to be programmed may be effectively avoided and the accuracy of programming may be improved.03-28-2013
20100008143NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND CONTROL METHOD THEREOF - A nonvolatile semiconductor memory device includes a multi-layer insulating film having at least charge storage layers and formed on bottom surfaces and both side surfaces of a plurality of trench portions respectively formed in portions between the plurality of active areas formed in a first direction, a plurality of gate electrodes filled in internal portions of the plurality of trench portions with the multi-layer insulating film, a plurality of first metal interconnections formed in a second direction and each functioning as a bit line or source line, and a plurality of first conductivity-type diffusion layer regions arranged in a staggered form in corresponding portions of the plurality of active areas which intersect with the plurality of first metal interconnections. The device further includes a plurality of connection contacts form to respectively connect the plurality of first conductivity-type diffusion layer regions to the plurality of first metal interconnections.01-14-2010
20100046299PROGRAMMING RATE IDENTIFICATION AND CONTROL IN A SOLID STATE MEMORY - Memory devices adapted to receive and transmit analog data signals representative of bit patterns of two or more bits facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits. Programming of such memory devices includes determining a rate of programming (i.e., rate of movement of the respective threshold voltage) of the memory cells and biasing the corresponding bit line with a programming rate control voltage that is greater than the bit line enable voltage and less than the inhibit voltage. This voltage can be adjusted to change the speed of programming. A capacitor coupled to the bit line stores the programming rate control voltage in order to maintain the proper bit line bias for the duration of the programming operation or until it is desired to change the programming rate.02-25-2010
20100046297NON-VOLATILE MEMORY AND METHOD FOR RAMP-DOWN PROGRAMMING - A ramp-down programming voltage is used to program a group of nonvolatile memory cells in parallel, step by step from a highest step to a lowest step. Overall programming time is improved when a conventional setup for program inhibit together with a verify after each program step are avoided. A program voltage estimate is provided for each cell indicating the programming voltage expected to program the cell to its target. Initially, all but those cells having estimates at or above the current program voltage step will be program-inhibited. Thereafter, with each descending program voltage step, additional cells will be un-inhibited. Once un-inhibited, a cell need not be re-inhibited even if programmed to its target. This is because subsequent program steps are at lower voltages and ineffective in programming the cell beyond its target. The un-inhibit operation in one implementation amounts to simply pulling the associated bit lines to ground.02-25-2010
20100046296METHOD FOR READING AND PROGRAMMING A MEMORY - A method for programming a memory is provided. The memory includes a number of cells and has a preset PV level for a target cell. The method includes programming a first-side of the target cell to have a Vt level not lower than the preset PV level; reading a Vt level of a second-side of the target cell and accordingly obtaining a corrected PV level corresponding to the first-side; and programming the first-side of the target cell to have a Vt level not lower than the corresponding corrected PV level.02-25-2010
20130033935MEMORY DIE SELF-DISABLE IF PROGRAMMABLE ELEMENT IS NOT TRUSTED - Techniques are disclosed herein for automatically self-disabling a memory die in the event that a programmable element on the memory die for indicating whether the memory die is defective cannot be trusted. Memory die are provided with chip enable circuitry to allow particular memory die to be disabled. If the programmable element can be trusted, the state of the programmable element is provided to the chip enable circuitry to enable/disable the memory die based on the state. However, if the programmable element cannot be trusted, then the chip enable circuitry may automatically disable the memory die. This provides a greater yield for multi-chip memory packages because packages having memory die with a programmable element that cannot be trusted can still be used.02-07-2013
20130083605MEMORY WITH WEIGHTED MULTI-PAGE READ - A memory device is described that provides increased output data to help evaluate data errors from bit line coupling and floating gate coupling during a read operation. Multiple rows, or pages, of data are read to allow an internal or external decoder to evaluate memory cell data.04-04-2013
20100110793Flash Memory Device and Memory System Including the Same - Provided is a flash memory device. The flash memory device includes a memory cell array, and a voltage generator. The memory cell array is connected to a plurality of word lines. The voltage generator generates a program voltage which is supplied to a selected word line of the word lines and a pass voltage which is supplied to a non-selected word line of the word lines, in a program operation. The voltage generator varies a level of the pass voltage with a temperature.05-06-2010
20090154248NONVOLATILE MEMORY DEVICE STORING DATA BASED ON CHANGE IN TRANSISTOR CHARACTERISTICS - A nonvolatile memory device includes a pair of PMOS transistors, and a control circuit configured to operate in a store mode to apply to a first one of the PMOS transistors potentials that cause an NBTI degradation purposefully and to apply to a second one of the PMOS transistors potentials that cause no NBTI degradation while causing no current to flow between a source node and a drain node of the first one of the PMOS transistors, and to operate in a recall mode to set gate nodes of the PMOS transistors to a common potential to detect a difference in the NBTI degradation between said PMOS transistors.06-18-2009
201000915722T NOR-TYPE NON-VOLATILE MEMORYT CELL ARRAY AND METHOD OF PROCESSING DATA OF 2T NOR-TYPE NON-VOLATILE MEMORY - Provided are a 2-transistor (2T) NOR cell array which includes at least a cell, and a cell comprising a selection transistor and a storage transistor including a charge storage floating gate or a charge storage dielectric, and a method of processing data of a 2T NOR flash memory cell which is used to store data in a 2T NOR cell array, read the stored data, and erase the stored data. The 2T NOR cell array includes a selection transistor and a storage transistor. The selection transistor includes a terminal connected to a bit line and a gate terminal applied with a selection signal. The storage transistor includes a terminal connected to the other terminal of the selection transistor, the other terminal connected to a common source line, and a gate applied with a control voltage. A back bias voltage is applied to bulk regions of the selection transistor and the storage transistor when a programming operation is performed, and a floating gate or a charge storage dielectric is provided between the gate and the bulk region of the storage transistor.04-15-2010
20090213660Three-Terminal Single Poly NMOS Non-Volatile Memory Cell - A three terminal non-volatile memory (NVM) cell for a CMOS IC is formed by a standard CMOS process flow. The NVM cell includes two transistors that share a common floating gate. The floating gate includes a first portion disposed over the channel region of the first (NMOS) transistor, a second portion disposed over the channel region of the second (NMOS or PMOS) transistor, and a third portion extending into an enlarged drain diffusion area away from the channel regions, whereby the gate-to-drain capacitance is higher than the gate-to-source capacitances. A pocket implant or CMOS standard LV N-LDD is formed under the second transistor to enhance CHE programming. Both HV LDD and LV LDD implants are introduced together enabling LDD implant merging under the floating gate extension. The floating gate is formed using substantially T-shaped, C-shaped, U-shaped, Y-shaped or O-shaped polysilicon structures. Various array addressing schemes are disclosed.08-27-2009
20130083604APPARATUS AND METHOD FOR SMART VCC TRIP POINT DESIGN FOR TESTABILITY - An apparatus and method for testing is provided. An integrated circuit includes a comparison circuit that is arranged to trip based on a power supply signal reaching a trip point. The integrated circuit also includes an analog-to-digital converter that is arranged to convert the power supply signal into a digital signal. The integrated circuit also includes a storage component that stores a digital value associated with the digital signal, and provides the power supply value at an output pin of the integrated circuit. The integrated circuit includes a latch that is coupled between the analog-to-digital converter and the storage component. The latch is arranged to open when the comparison circuit trips, such that, when the comparison circuit trips, the storage component continues to store a digital value such that the digital value corresponds to the voltage associated with the power supply signal when the comparison circuit tripped.04-04-2013
20100329017SEMICONDUCTOR DEVICE FOR SHORT-CIRCUITING OUTPUT TERMINALS OF TWO OR MORE VOLTAGE GENERATOR CIRCUITS AT READ TIME AND CONTROL METHOD FOR THE SAME - According to one embodiment, a semiconductor device includes a first voltage generator, a second voltage generator, a first MOS transistor, and a controller. The first voltage generator outputs a first voltage to a first node. The second voltage generator outputs a second voltage to a second node. The first MOS transistor is capable of short-circuiting the first node and second node. The controller performs a control operation to short-circuit the first node and second node by turning on the first MOS transistor. The controller controls a period in which the first MOS transistor is kept in an on state based on time.12-30-2010
20100329013SEMICONDUCTOR MEMORY DEVICE INCLUDING NONVOLATILE MEMORY CELL AND DATA WRITING METHOD THEREOF - A semiconductor memory device includes memory cells, bit lines, and first and second control circuits. The first control circuit supplies a write voltage and a write control voltage to a selected memory cell to write the data in the selected memory cell, the first control circuit changes a supply state of the write control voltage to further write the data when the selected memory cell reaches a first write state by the write, the first control circuit further changes the supply state of the write control voltage to prohibit the write when the selected memory cell reaches a second write state by the write. The second control circuit controls a rising of the write control voltage when the first control circuit starts the writing to make the selected memory cell the second write state.12-30-2010
20120182809Data State-Dependent Channel Boosting To Reduce Channel-To-Floating Gate Coupling In Memory - In a programming operation, selected storage elements on a selected word line are programmed while unselected storage elements on the selected word line are inhibited from programming by channel boosting. To provide a sufficient but not excessive level of boosting, the amount of boosting can be set based on a data state of the unselected storage element. A greater amount of boosting can be provided for a lower data state which represents a lower threshold voltage and hence is more vulnerable to program disturb. A common boosting scheme can be used for groups of multiple data states. The amount of boosting can be set by adjusting the timing and magnitude of voltages used for a channel pre-charge operation and for pass voltages which are applied to word lines. In one approach, stepped pass voltages on unselected word lines can be used to adjust boosting for channels with selected data states.07-19-2012
20120182808Memory Device, Manufacturing Method and Operating Method of the Same - A memory device, a manufacturing method and an operating method of the same are provided. The memory device includes a substrate, stacked structures, a channel element, a dielectric element, a source element, and a bit line. The stacked structures are disposed on the substrate. Each of the stacked structures includes a string selection line, a word line, a ground selection line and an insulating line. The string selection line, the word line and the ground selection line are separated from each other by the insulating line. The channel element is disposed between the stacked structures. The dielectric element is disposed between the channel element and the stacked structure. The source element is disposed between the upper surface of the substrate and the lower surface of the channel element. The bit line is disposed on the upper surface of the channel element.07-19-2012
20120182807Three-Dimensional Stacked and-Type Flash Memory Structure and Methods of Manufacturing and Operating the Same Hydride - A 3D stacked AND-type flash memory structure comprises several horizontal planes of memory cells arranged in a three-dimensional array, and each horizontal plane comprising several word lines and several of charge trapping multilayers arranged alternately, and the adjacent word lines spaced apart from each other with each charge trapping multilayer interposed between; a plurality of sets of bit lines and source lines arranged alternately and disposed vertically to the horizontal planes; and a plurality of sets of channels and sets of insulation pillars arranged alternatively, and disposed perpendicularly to the horizontal planes, wherein one set of channels is sandwiched between the adjacent sets of bit lines and source lines.07-19-2012
20130051153FLOATING ADDRESSING OF AN EEPROM MEMORY PAGE - A method for electrically programming a non-volatile memory in which a programming cycle includes prior addressing of memory cells from an initial address corresponding to a first row and a column of a memory plane. The method may include addressing the memory cells in a second consecutive row when the end of the first row i is reached to store data on bits with consecutive and increasing addresses in two consecutive rows.02-28-2013
20130051149APPARATUSES AND METHODS OF REPROGRAMMING MEMORY CELLS - Apparatuses and methods for reprogramming memory cells are described. One or more methods for memory cell operation includes programming a number of memory cells such that each of the number of memory cells are at either a first program state or a second program state, the second program state having a first program verify voltage associated therewith; and reprogramming the number of memory cells such that at least one of the number of memory cells is reprogrammed to a third program state having a second program verify voltage associated therewith, wherein those of the number of memory cells having a threshold voltage less than the second program verify voltage represent a same data value.02-28-2013
20130051150Three-Dimensional NAND Memory With Stacked Mono-Crystalline Channels - A three-dimensional (3D) non-volatile memory (NVM) array including spaced-apart horizontally-disposed bitline structures arranged in vertical stacks, each bitline structures including a mono-crystalline silicon beam and a charge storage layer entirely surrounding the beam. Vertically-oriented wordline structures are disposed next to the stacks such that each wordline structure contacts corresponding portions of the charge storage layers. NVM memory cells are formed at each bitline/wordline intersection, with corresponding portions of each bitline structure forming each cell's channel region. The bitline structures are separated by air gaps, and each charge storage layer includes a high-quality thermal oxide layer that entirely covers (i.e., is formed on the upper, lower and opposing side surfaces of) each of the mono-crystalline silicon beams. The 3D NVM array effectively includes multiple NVM NAND string structures, where each NAND string structure is formed by multiple series-connected NVM memory cells disposed along an associated bitline structure.02-28-2013
20130088922SEMICONDUCTOR MEMORY DEVICE HAVING A PLURALITY OF CHIPS AND CAPABILITY OF OUTPUTTING A BUSY SIGNAL - One package contains a plurality of memory chips. Each memory chip has an I/O terminal which generates a busy signal. The busy signal enables a busy state when a power supply voltage value reaches a specified and guaranteed range after a power-on sequence. The busy signal maintains the busy state until completion of initialization operations for the plurality of memory chips. The busy signal releases the busy state after completion of all initialization operations for the plurality of memory chips.04-11-2013
20090303797SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate, a gate insulating film formed on the substrate, a first gate electrode formed on the gate insulating film, source and drain regions formed in the substrate so as to sandwich the first gate electrode, an intergate insulating film formed on the first gate electrode and including an opening, a second gate electrode formed on the intergate insulating film and electrically connected to the first gate electrode through the opening, and a boost electrode formed on the intergate insulating film and electrically isolated from the first gate electrode and the second gate electrode.12-10-2009
20120218825WORDLINE VOLTAGE TRANSFER APPARATUS, SYSTEMS, AND METHODS - The apparatus and systems described herein may comprise a plurality of memory cells coupled to a local wordline, and a wordline drive circuit that includes a regulator coupled to a plurality of pass transistors and a string driver. The regulator may comprise a regulator transistor having a threshold voltage that is substantially the same as the threshold voltage of the string driver during memory cell program operations. In some embodiments, the regulator may comprise a cascode-connected pair of transistors. Methods of manufacturing and operating the apparatus and systems are also described.08-30-2012
20120218823VOLTAGE GENERATION AND ADJUSTMENT IN A MEMORY DEVICE - Voltage generation devices and methods are useful in determining a data state of a selected memory cell in a memory device. Voltages applied to an access line coupled to a selected memory cell can be determined at least partially in response to a sensed operating characteristic of the memory device, such as operating temperature, and to a particular data state to be determined in the selected memory cell.08-30-2012
20090091982EXTERNAL CLOCK TRACKING PIPELINED LATCH SCHEME - A flash memory including a first latch having at least one external input to receive at least one command, at least one memory address, and a plurality of data bits, a command decoder coupled to the first latch output; a command latch including a first command latch input, a second command latch input, and a command latch output, the first command latch input to couple to the command decoder output, and the second command latch input to couple to a write command output of an internal clock control generator; and a command register including a first command register input and a second command register input, the first command register input to couple to the command latch output, and the second command register input to couple to an internal latch command output of the internal clock control generator. Additional apparatus, systems, and methods are disclosed.04-09-2009
20130058166SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes memory cells, word lines, a driver circuit, and a control circuit. The memory cells are stacked above a semiconductor substrate, and each includes a charge accumulation layer and control gate. The word lines are coupled to the control gates. The driver circuit repeats a programming operation to write data in a memory cell coupled to a selected word line. In the programming operation, a first voltage is applied to the selected word line, a second voltage to a first unselected word line, and a third voltage to a second unselected word line. The control circuit steps up the first voltage and steps down the second voltage in repeating the programming.03-07-2013
20110038214GATE-SEPARATED TYPE FLASH MEMORY WITH SHARED WORD LINE - A gate-separated type flash memory with a shared word line includes: a semiconductor substrate, on which a source electrode area and a drain electrode area are separately arranged; a word line, which is arranged between the source electrode area and the drain electrode area; a first storage bit unit, which is arranged between the word line and the source electrode area, and a second storage bit unit, which is arranged between the word line and the drain electrode area. The two storage bit units and word line are separated by a tunneling oxide layer. The two storage bit units respectively have a first control gate, a first floating gate and a second control gate, a second floating gate, and the two control gates are separately respectively arranged on two floating gates.02-17-2011
20110038212CONTROLLER AND NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A controller includes a generation unit configured to aggregate comparison results between second threshold voltage levels held in the memory cells and predetermined third threshold voltage levels, and generate a histogram of the second threshold voltage levels, an estimation unit configured to estimate statistical parameter of a distribution of the second threshold voltage levels with respect to a first threshold voltage level according to writing data, based on the histogram, and a determination unit configured to determine a fifth threshold voltage level defining a boundary of a fourth threshold voltage level indicating a read result of the memory cells from the third threshold voltage levels based on the statistical parameter in such a manner that mutual information amount between the first threshold voltage level and the fourth threshold voltage level becomes maximum.02-17-2011
20130058168METHODS, DEVICES, AND SYSTEMS FOR DEALING WITH THRESHOLD VOLTAGE CHANGE IN MEMORY DEVICES - The present disclosure includes methods, devices, and systems for dealing with threshold voltage change in memory devices. A number of embodiments include an array of memory cells and control circuitry having sense circuitry coupled to the array. The control circuitry is configured to determine changes in threshold voltages (Vts) associated with the memory cells without using a reference cell, and adjust the sense circuitry based on the determined changes and without using a reference cell.03-07-2013
20130058167SEMICONDUCTOR DEVICE USING CHARGE PUMP CIRCUIT - A semiconductor device including a plurality of capacitance units connected in parallel between a first voltage and a second voltage. Each of the plurality of capacitance units includes: a capacitance element connected with the first voltage; and a capacitance disconnecting circuit connected between the second voltage and the capacitance element. The capacitance disconnecting circuit includes a non-volatile memory cell with a threshold voltage changed based on a change of a leakage current which flows from the capacitance element, and blocks off the leakage current based on a rise of the threshold voltage of the non-volatile memory cell when the leakage current exceeds a predetermined value.03-07-2013
20110013458MEMORY DEVICES SUPPORTING SIMULTANEOUS PROGRAMMING OF MULTIPLE CELLS AND PROGRAMMING METHODS THEREOF - Some embodiments of the present invention provide methods of programming memory devices that include an array of vertical channels passing through a stacked plurality of word plates, wherein respective columns of vertical channels are configured to be coupled to respective bit lines. In some method embodiments, potentials of the vertical channels are boosted, followed by selectively applying respective data to vertical channels via the bit lines to thereby selectively change the potentials of the vertical channels according to the data. A program voltage is subsequently applied to a selected word plate to thereby program a plurality of cells.01-20-2011
20110013457NONVOLATILE MEMORY DEVICES AND PROGRAMMING METHODS THEREOF IN WHICH A PROGRAM INHIBIT VOLTAGE IS CHANGED DURING PROGRAMMING - Provided are nonvolatile memory devices and programming methods thereof. A non-volatile memory device is programmed by performing a plurality of programming loops on memory cells in a memory cell array and changing a program inhibit voltage applied to bit lines of the memory cells that have completed programming while performing the plurality of programming loops.01-20-2011
20090268526SEMICONDUCTOR MEMORY DEVICE WITH A STACKED GATE INCLUDING A CHARGE STORAGE LAYER AND A CONTROL GATE AND METHOD OF CONTROLLING THE SAME - A semiconductor memory device includes a transfer circuit and a control circuit. The transfer circuit which includes a p-type MOS transistor with a source to which is applied a first voltage and an n-type MOS transistor to whose gate the drain of the p-type MOS transistor is connected and the first voltage is transferred, to whose source a second voltage is applied, and whose drain is connected to a load. The control circuit which turns the p-type MOS transistor on and off and which turns the p-type MOS transistor on to make the p-type MOS transistor transfer the second voltage to the load and, during the transfer, turns the p-type MOS transistor off to make the gate of the n-type MOS transistor float at the first voltage.10-29-2009
20090268525NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device capable of preventing the disturb phenomenon that could become a serious problem as the nonvolatile memory having a virtual grounding bit line is miniaturized comprises a program row voltage application circuit for applying a predetermined program row voltage to the selected word line in programming in the selected memory cell, a program column voltage application circuit for applying a ground voltage to one of a pair of selected bit lines and applying a predetermined program column voltage to the other of the selected bit lines in programming; and a counter voltage application circuit for applying a counter voltage of an intermediate voltage between the ground voltage and program column voltage, to an adjacent unselected bit line not connected to the selected memory cell in the first and second bit lines and adjacent to the selected bit line to which the program column voltage is applied.10-29-2009
20120224428CHARGE PUMP OPERATION IN A NON-VOLATILE MEMORY DEVICE - A charge pump in a memory device is activated to produce a programming voltage prior to data loading during a programming operation. During an initial programming cycle, first and second load voltages are charged from the charge pump. The first load is removed from the charge pump during a verify operation. The first load voltage is subsequently recharged by charge sharing from the second load voltage so that the charge pump is not initially necessary for recharging the first load voltage.09-06-2012
20130064015METHOD OF BURN-IN TEST OF EEPROM OR FLASH MEMORIES - The disclosure relates to a method for testing an integrated circuit, comprising in a burn-in test mode, two steps during which gate oxides of conductive high voltage MOS transistors of the integrated circuit are subjected to a first test voltage, and blocked high voltage MOS transistors of the integrated circuit are subjected to a second test voltage, the first test voltage being set to a value higher than a high supply voltage supplied to the high voltage MOS transistors in a normal operating mode, to make the gate oxides of transistors considered as insufficiently robust break down, the second test voltage being set to a value lower than the first test voltage and which can be supported by the blocked transistors, the states of the transistors being changed between the two steps.03-14-2013
20130064014EEPROM MEMORY PROTECTED AGAINST BREAKDOWN OF CONTROL GATE TRANSISTORS - The disclosure relates to an electrically erasable and programmable memory comprising at least one word of memory cells with first and second control gate transistors in parallel to apply a control gate voltage to the memory cells of the word. The memory also comprises s first control circuit to supply a first control voltage to a control terminal of the first control gate transistor through a first current limiter, and a second control circuit to supply a second control voltage to a control terminal of the second control gate transistor through second current limiter.03-14-2013
20130188424SYSTEM AND METHOD FOR STORING AT LEAST A PORTION OF INFORMATION RECEIVED IN ASSOCIATION WITH A FIRST OPERATION FOR USE IN PERFORMING A SECOND OPERATION - A method includes: receiving first information in association with a first operation to be performed on at least one of multiple flash memory circuits; storing at least a portion of the first information; receiving second information in association with a second operation to be performed on at least one of the multiple flash memory circuits, in which the second operation is a read operation or a write operation; receiving data from the flash memory circuits based on at least the first information and storing the data in a buffer; and performing the second operation utilizing the stored portion of the first information in addition to the second information on the data in the buffer.07-25-2013
20130188425READOUT CIRCUIT FOR NON-VOLATILE MEMORY DEVICE - Provided is a readout circuit for a non-volatile memory device, which has a large readout margin for distinguishing between 0 and 1 of data and has a small circuit area. A voltage output from a single bias circuit is applied to a gate of a memory element and a gate of an NMOS transistor serving as a reference current source to be compared with a current flowing through the memory element. Thus, the gates are controlled by the same voltage, and hence characteristics fluctuations in the operating temperature range and the operating power supply voltage range are reduced. Therefore, a large readout margin for distinguishing 0 and 1 of data can be obtained, resulting in a simplified circuit configuration.07-25-2013
20090238004Method of operating sonos memory device - A silicon-oxide-nitride-oxide-silicon (SONOS) memory device includes a memory type transistor including a gate with a SONOS structure on a semiconductor substrate. The gate is formed by sequentially stacking a tunneling oxide layer, a memory node structure including a trap site having nano-sized trap elements in which charges passing through the tunneling oxide layer are trapped, and a gate electrode. The nano-sized trap elements may be a crystal layer composed of nanocrystals that are separated from one another to trap the charges. The memory node structure may include additional memory node layers which are isolated from the nano-sized trap elements.09-24-2009
20090231922Nonvolatile Memory Device and Read Method Thereof - Disclosed is a read method of a non-volatile memory device which includes performing a first read operation in which a first read voltage is applied to a selected word line. If a read fail arises at the first read operation, a second read operation is performed in which a second read voltage lower than the first read voltage is applied to the selected word line. If no read fail arises at the second read operation, the read fail generated at the first read operation is cured by performing a program operation.09-17-2009
20090231921MANUFACTURING METHOD OF NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND NONVOLATILE SEMICONDUCTOR STORAGE DEVICE - In a nonvolatile semiconductor storage device having a split-gate memory cell including a control gate electrode and a sidewall memory gate electrode and a single-gate memory cell including a single memory gate electrode on the same silicon substrate, the control gate electrode is formed in a first region via a control gate insulating film, the sidewall memory gate electrode is formed in the first region via a charge trapping film, and at the same time, a single memory gate electrode is formed in a second region via the charge trapping film. At this time, the sidewall memory gate electrode and the single memory gate electrode are formed in the same process, and the control gate electrode and the sidewall memory gate electrode are formed so as to be adjacently disposed to each other in a state of being electrically isolated from each other.09-17-2009
20090231920PROGRAMMING METHOD AND MEMORY DEVICE USING THE SAME - A programming method applied to a memory is provided. The memory includes a number of memory cells. The method includes the following steps. A target cell of the memory cells is programmed in response to a first programming command. The target cell is programmed in response to a second programming command.09-17-2009
20090010066FLASH MEMORY DEVICE AND METHOD IN WHICH TRIM INFORMATION IS STORED IN MEMORY CELL ARRAY - A flash memory device which includes a memory cell array which stores data and trim information, and control logic which controls programming, erasing, and reading modes of the memory cell array. The control logic is operative to receive the trim information from the memory cell array in a power-up mode, and to optimize operational time periods of the programming, erasing, and reading modes in accordance with the trim information.01-08-2009
20120113722Selecting programming voltages in response to at least a data latch in communication with a sense amplifier - Memory devices and methods of programming memory cells including selecting a voltage to apply to a control gate of the memory cell during programming of a data value of a sense amplifier to the memory cell in response to at least a data value contained in a data latch that is in communication with the sense amplifier.05-10-2012
20120236652NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a nonvolatile semiconductor memory device includes a first memory string including a first memory cell and a second memory cell aligned along a first axis, a source contact provided at a source-side end of the first memory string, a second memory string that extends along the first axis and includes a third memory cell that aligns with the first memory cell along a second axis perpendicular to the first axis, and a shield conductive layer. The shield conductive layer extends along the first axis between the first memory string and the second memory string and is electrically connected to the source contact.09-20-2012
20120236651SYSTEM AND METHOD FOR DETERMINING DATA DEPENDENT NOISE CALCULATION FOR A FLASH CHANNEL - Disclosed is an system and method for determining a probability that a memory cell was programmed to a certain input level. An output level is received from a memory cell and a probability is determined that the output level corresponds to each of a plurality of programming levels. Each probability is determined as a function of the output level, a mean value of a distribution corresponding to the programming level, and a variance from the mean value with the variance being determined by a relative position of the output level with respect to the mean value. A probability value is generated as a function of the plurality of determined probabilities and then provided for use at a demodulator.09-20-2012
20120236650NAND ARCHTECTURE INCLUDING RESITIVE MEMORY CELLS - A non-volatile memory device includes a first select transistor, a second select transistor, and a first string of first memory cells provided between the first and second select transistors. Each first memory cell has a first resistive memory cell and a first transistor. The first resistive memory cell is in series with a gate of the first transistor. The non-volatile memory device further includes a first bit line coupled to a drain of the first select transistor and a plurality of word lines. Each word line is coupled to one of the first memory cells.09-20-2012
20120236649HOT CARRIER PROGRAMMING OF NAND FLASH MEMORY - A NAND memory device includes strings of NAND memory cells, where each memory cell includes a charge trapping structure formed over a lightly-doped substrate region. A selected one of the NAND memory cells can be programmed by application of a relatively low program voltage in combination with a previously-applied set-up voltage, which is applied to the substrate for initiating inversion. The inversion in the substrate causes electrons to become hot in the channel regions, including the channel of the selected memory cell. As a result, the relatively lower program voltage can be used at the control gate of the selected memory cell for sufficiently energizing hot electrons to tunnel into the charge trapping structure of the selected memory cell.09-20-2012
20120236648ELECTRICALLY ADDRESSED NON-VOLATILE MEMORY MAINTENTANCE - An electrically addressed non-volatile memory is maintained by measuring a voltage threshold for each selected memory cell in the electrically addressed non-volatile memory. The voltage threshold is a voltage around which a controllable voltage signal applied to a control gate of a selected memory cell produces a change in value read from the selected memory cell. A measured voltage threshold distribution of the measured voltage thresholds is generated for the selected memory cells. The voltage threshold distribution is analyzed to identify memory cells having greater probabilities of read errors, for example. In response to the analysis, an operating parameter that affects the memory cells identified as having greater probabilities of read errors is selectively changed.09-20-2012
20080291732Three cycle SONOS programming - A method to eliminate over-erase in a nonvolatile trapped-charge memory array during write operations includes a three-cycle process of bulk programming the memory array, bulk erasing the memory array and selectively inhibiting one or more memory cells in the memory array while applying a programming voltage to the memory array.11-27-2008
20100014354USE OF RECOVERY TRANSISTORS DURING WRITE OPERATIONS TO PREVENT DISTURBANCE OF UNSELECTED CELLS - A memory array and method for performing a write operation in a memory array that eliminates parasitic coupling between selected and unselected bitlines and protects memory cells on unselected bitlines. A memory array (01-21-2010
20110280080MEMORY WITH MULTI-PAGE READ - A memory device is described that provides increased output data to help evaluate data errors from bit line coupling and floating gate coupling during a read operation. Multiple rows, or pages, of data are read to allow an internal or external decoder to evaluate memory cell data.11-17-2011
20110280081NON-VOLATILE SEMICONDUCTOR MEMORY - When a plurality of non-volatile memory cells in a memory cell array are simultaneously written, bit lines of the plurality of non-volatile memory cells are connected to M data lines, where M is an integer of two or more, based on a column address signal. N switches, where N is an integer of one or more, and a switch control circuit for controlling the N switches, are provided for each data line. The M switch control circuits control the M×N switches to change the levels or apply periods of drain voltages applied to the bit lines of the plurality of memory cells on a memory cell-by-memory cell basis.11-17-2011
20110280077MULTI-SEMICONDUCTOR MATERIAL VERTICAL MEMORY STRINGS, STRINGS OF MEMORY CELLS HAVING INDIVIDUALLY BIASABLE CHANNEL REGIONS, MEMORY ARRAYS INCORPORATING SUCH STRINGS, AND METHODS OF ACCESSING AND FORMING THE SAME - Multi-semiconductor vertical memory strings, strings of memory cells having individually biasable channel regions, arrays incorporating such strings and methods for forming and accessing such strings are provided. For example non-volatile memory devices are disclosed that utilize NAND strings of serially-connected non-volatile memory cells. One such string can include two or more serially connected non-volatile memory cells each having a channel region. Each memory cell of the two or more serially connected non-volatile memory cells shares a common control gate and each memory cell of the two or more serially connected non-volatile memory cells is configured to receive an individual bias to its channel region.11-17-2011
20110280079NAND FLASH MEMORY PROGRAMMING - A method of charging a floating gate in a nonvolatile memory cell comprises bringing a substrate channel within the memory cell to a first voltage, bringing a control gate to a programming voltage, and floating the substrate channel voltage while the control gate is at the programming voltage. Memory devices include state machines or controllers operable to perform the described method, and operation of such a state machine, memory device, and information handling system are described.11-17-2011
20110280078CHARGE PUMP OPERATION IN A NON-VOLATILE MEMORY DEVICE - A charge pump in a memory device is activated to produce a programming voltage prior to data loading during a programming operation. During an initial programming cycle, first and second load voltages are charged from the charge pump. The first load is removed from the charge pump during a verify operation. The first load voltage is subsequently recharged by charge sharing from the second load voltage so that the charge pump is not initially necessary for recharging the first load voltage.11-17-2011
20130163339READING METHOD OF NON-VOLATILE MEMORY DEVICE - A non-volatile memory device includes a first selection transistor, a second selection transistor, and a plurality of memory cells serially coupled between the first selection transistor and the second selection transistor. A reading method of the non-volatile memory device includes applying a read voltage to a gate of a selected memory cell; applying a first pass voltage to a gate of a memory cell adjacent to the selected memory cell, and applying a second pass voltage to gates of the other memory cells, wherein the selected memory cell is in one program state among first to T06-27-2013
20130163340NON-VOLATILE STORAGE SYSTEM WITH THREE LAYER FLOATING GATE - A non-volatile storage system includes memory cells with floating gates that comprises three layers separated by two dielectric layers (an upper dielectric layer and lower dielectric layer). The dielectric layers may be an oxide layers, nitride layers, combinations of oxide and nitride, or some other suitable dielectric material. The lower dielectric layer is close to the bottom of the floating gate (near interface between floating gate and tunnel dielectric), while the upper dielectric layer is close to top of the floating gate (near interface between floating gate and inter-gate dielectric).06-27-2013
20120287719FLASH MEMORY DEVICE HAVING SEED SELECTOR CIRCUIT - A flash memory device includes a memory cell array, a seed selector circuit, and a randomizing and de-randomizing circuit. The memory cell array includes memory cells forming multiple pages. The seed selector circuit stores seeds corresponding to the multiple pages, respectively. The randomizing and de-randomizing circuit randomizes data to be stored in a selected page. Each page has a corresponding seed and includes multiple sectors having corresponding sector offset values and seed values generated from the seed corresponding to the page. The seed selector circuit selects a seed value from the seed values of the selected page based on a sector offset value indicating a sector of the selected page to which a column offset value, input with an access request, belongs. The randomizing and de-randomizing circuit randomizes data to be stored in the selected page based on the seed value selected by the seed selector circuit.11-15-2012
20090207663Flash Memory Devices Including Ready/Busy Control Circuits and Methods of Testing the Same - A flash memory device includes a chip disable fuse circuit that has a fuse and that outputs a chip disable signal when the fuse is cut out, and a ready/busy control circuit that forcibly activates a ready/busy signal representing an internal operational state in response to the chip disable signal and externally outputs the ready/busy signal through a ready/busy output pin.08-20-2009
20120287717FLASH MEMORY DEVICE AND ASSOCIATED CHARGE PUMP CIRCUIT - A charge pump circuit comprises a first booster set, a second booster group, and a detecting circuit. The first booster set receives a supply voltage and generates a first output voltage. The detecting circuit generates a detecting signal depending on the voltage level of the first output voltage. The second booster group receives the supply voltage and generates the first output voltage or a second output voltage according to the detecting signal. The second booster group is composed of a plurality of booster sets connected in parallel, wherein each booster set comprises a plurality of charge pump stages and a plurality of switch units. The number of serially-connected charge pump stages of each booster set in the second booster group is controlled by the plurality of switch units according to the stable voltage levels of the first and second output voltages.11-15-2012
20110286278METHOD OF STORING E-FUSE DATA IN FLASH MEMORY DEVICE - Provided is a method of storing configuration data regarding an operating environment of a flash memory device, which includes a memory cell array having an electrical fuse (E-Fuse) block for storing the configuration data. The method includes storing the configuration data in multiple strings of the E-Fuse block, each string including multiple memory cells configured to store one bit.11-24-2011
20110286276PARTIAL LOCAL SELF BOOSTING FOR NAND - A memory system is programmed with minimal program disturb and reduced junction and channel leakage during self-boosting. Pre-charging bias signals are applied to word lines adjacent to a selected word line before a program signal is applied to the selected word line and a pass signal is applied to the remaining word lines. The pre-charging bias signals apply a pre-charge to the memory cells. The pre-charging bias signals are chosen to improve the isolation of the memory cells on word lines adjacent to the selected word line, improve self boost efficiency and reduce current leakage to prevent or reduce program disturb and/or programming errors especially in the inhibited memory cells on the selected word line.11-24-2011
20110299337METHODS AND APPARATUS FOR AN ISFET - An ISFET includes a control gate coupled to a floating gate in a CMOS device. The control gate, for example, a poly-to-well capacitor, is configured to receive a bias voltage and effect movement of a trapped charge between the control gate and the floating gate. The threshold voltage of the ISFET can therefore by trimmed to a predetermined value, thereby storing the trim information (the amount of trapped charge in the floating gate) within the ISFET itself.12-08-2011
20110299339NONVOLATILE SEMICONDUCTOR MEMORY, METHOD FOR READING OUT THEREOF, AND MEMORY CARD - A nonvolatile semiconductor memory includes: a memory cell unit including a plurality of memory cells having an electric charge accumulation layer and a control electrode, said memory cells being electrically connected in series; a plurality of word lines, each of which is electrically connected to said control electrode of said plurality of memory cells; a source line electrically connected to said memory cells at one end of said memory cell unit; a bit line electrically connected to said memory cells at the other end of said memory cell unit; and a control signal generation circuit, which during a data readout operation staggers a timing for selecting the word line connected to said memory cells of said memory cell unit from a timing for selecting a non-selected word line connected to a non-selected memory.12-08-2011
20120106256ELECTRONIC CIRCUIT WITH A FLOATING GATE TRANSISTOR AND A METHOD FOR DEACTIVATING A FLOATING GATE TRANSISTOR TEMPORARILY - An electronic circuit includes a floating gate transistor with a floating gate capacitor. The floating gate transistor can be programmed to be in an ON or an OFF state by charging the floating gate capacitor. The circuit further includes a deactivation capacitor adapted to store a charge sufficient for deactivating the floating gate transistor temporarily. The deactivation capacitor is connectable in series to the floating gate capacitor. A method for deactivating a floating gate transistor temporarily is provided, wherein the floating gate transistor includes a floating gate capacitor. A deactivation capacitor is charged with a charge sufficient for changing the state of the floating gate transistor temporarily. The deactivation capacitor is connected in series to the floating gate capacitor for deactivating the floating gate transistor.05-03-2012
20110141815Methods and Apparatus for Read-Side Intercell Interference Mitigation in Flash Memories - Methods and apparatus are provided for read-side intercell interference mitigation in flash memories, A flash memory device is read by obtaining a read value for at least one target cell; obtaining a value representing a voltage stored in at least one aggressor cell that was programmed after the target cell; determining intercell interference for the target cell from the at least one aggressor cell; and obtaining a new read value that compensates for the intercell interference by removing the determined intercell interference from the read value for the at least one target cell. The new read value can optionally be provided to a decoder. In an iterative implementation, one or more intercell interference mitigation parameters can be adjusted if a decoding error occurs.06-16-2011
20120008401SYSTEMS AND METHODS FOR STORING, RETRIEVING, AND ADJUSTING READ THRESHOLDS IN FLASH MEMORY STORAGE SYSTEM - A method, system and computer-readable medium are provided for reading information from a memory unit. A request may be received to read information from a set of memory cells in the memory unit. At least one read threshold in an initial set of read thresholds may be perturbed to generate a perturbed set of read thresholds. The set of memory cells may be read using the perturbed set of read thresholds to provide a read result. The performance of said reading may be evaluated using the perturbed set of read thresholds. The at least one read threshold may be iteratively perturbed for each sequential read operation that the read performance is evaluated to be sub-optimal.01-12-2012
20110292733ELECTRICALLY PROGRAMMABLE FLOATING COMMON GATE CMOS DEVICE AND APPLICATIONS THEREOF - A programmable CMOS device includes a PFET and an NFET that have a common floating gate. Depending on the configuration, the programmable CMOS device can be programmed, erased, and re-programmed repeatedly. The programming, erasure, and/or reprogramming can be effected by injection of electrons and/or holes into the floating gate. The programmable CMOS device can be employed as a fuse or an antifuse, to program a floating gate of another device, and/or to function as a latch. The programmable CMOS device can be formed employing standard logic compatible processes, i.e., without employing any additional processing steps.12-01-2011
20090296480CIRCUIT FOR GENERATING A VOLTAGE AND A NON-VOLATILE MEMORY DEVICE HAVING THE SAME - A circuit for providing a voltage, which includes a first voltage generating circuit to output a first voltage generated by dividing an input voltage on the basis of resistance rate varied in accordance with a first control signal, a second voltage generating circuit to output a third voltage by using a second voltage, where the third voltage is shifted in accordance with a temperature, a third voltage generating circuit to change the third voltage by using a voltage shift rate set in accordance with a level of an operation voltage to be outputted at the temperature, thereby outputting a fourth voltage, and a comparison amplifying circuit configured to output the operation voltage in accordance with the first voltage, the fourth voltage and resistance rate.12-03-2009
20110299338Memory system and method of accessing a semiconductor memory device - A memory system is provided with a processor, a main memory, and a flash memory. Performance of the memory system is improved through achievement of speed-up and high data reliability. The memory system includes a nonvolatile memory device and a controller configured to drive a control program to control the nonvolatile memory device. The control program executes a second access operation for the nonvolatile memory device even before a first access operation to the nonvolatile memory device is completed.12-08-2011
20100080063NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell group, transfer transistor, and switching circuit. The memory cell group has a plurality of memory cells each including a floating gate and control gate, and the current paths of the plurality of memory cells are connected in series. The transfer transistor transfers a write voltage to at least one memory cell in the memory cell group. The switching circuit applies a voltage to the gate of the transfer transistor. In a write operation, when a first voltage higher than a power supply voltage and lower than the write voltage is applied to the control gate of an unselected memory cell, the switching circuit applies an intermediate voltage higher than the first voltage and equal to or lower than the write voltage to the gate of the transfer transistor.04-01-2010
20100034023NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT, NONVOLATILE SEMICONDUCTOR MEMORY, AND METHOD FOR OPERATING NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT - According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory element including: a semiconductor substrate including: a source region; a drain region; and a channel region; a lower insulating film that is formed on the channel region; a charge storage film that is formed on the lower insulating film and that stores data; an upper insulating film that is formed on the charge storage film; and a control gate that is formed on the upper insulating film, wherein the upper insulating film includes: a first insulting film; and a second insulating film that is laminated with the first insulating film, and wherein the first insulating film is formed to have a trap level density larger than that of the second insulating film.02-11-2010
20100034025NON-VOLATILE SEMICONDUCTOR STORAGE SYSTEM - There is provided a non-volatile memory having electrically rewritable non-volatile memory cells arranged therein. A controller controls operation at the non-volatile memory. The non-volatile memory comprises a status output section configured to output status information indicating a status of read operation, write operation or erase operation in the non-volatile memory cell. The controller comprises a control signal generating section configured to output a control signal for a certain operation in the non-volatile memory, and a control signal switching section configured to instruct the control signal generating section to switch the control signal based on the status information.02-11-2010
20100034024Control Method For Nonvolatile Memory and Semiconductor Device - In a nonvolatile memory, the threshold is restored to a state before changing, without increasing number of writing undesirably. In a system including a nonvolatile memory, a random number generator, and a controller accessible to the nonvolatile memory, every time access to the nonvolatile memory is performed, the controller determines a refresh-targeted area, based on a random number generated by the random number generator. The controller is made to perform refresh control to re-write to the refresh-targeted area. By such refresh control, the threshold is restored to a state before changing, without increasing the number of writing undesirably.02-11-2010
20100034022COMPENSATING FOR COUPLING DURING READ OPERATIONS IN NON-VOLATILE STORAGE - Capacitive coupling from storage elements on adjacent bit lines is compensated by adjusting voltages applied to the adjacent bit lines. An initial rough read is performed to ascertain the data states of the bit line-adjacent storage elements, and during a subsequent fine read, bit line voltages are set based on the ascertained states and the current control gate read voltage which is applied to a selected word line. When the current control gate read voltage corresponds to a lower data state than the ascertained state of an adjacent storage element, a compensating bit line voltage is used. Compensation of coupling from a storage element on an adjacent word line can also be provided by applying different read pass voltages to the adjacent word line, and obtaining read data using a particular read pass voltage which is identified based on a data state of the word line-adjacent storage element.02-11-2010
20100008144SYSTEM AND MEMORY FOR SEQUENTIAL MULTI-PLANE PAGE MEMORY OPERATIONS - A system and method for performing memory operations in a multi-plane flash memory. Commands and addresses are sequentially provided to the memory for memory operations in memory planes. The memory operations are sequentially initiated and the memory operation for at least one of the memory planes is initiated during the memory operation for another memory plane. In one embodiment, each of a plurality of programming circuits is associated with a respective memory plane and is operable to program data to the respective memory plane in response to programming signals and when it is enabled. Control logic coupled to the plurality of programming circuits generates programming signals in response to the memory receiving program commands and further generates programming enable signals to individually enable each of the programming circuits to respond to the programming signals and stagger programming of data to each of the memory planes.01-14-2010
20100002519Flash memory device and programming method thereof - A flash memory device including a controller to determine higher, M, and lower, N, word-line address bits based on an input word-line address, to determine a selected area of a memory array based on the higher and lower word-line address bits, and an unselected area of the memory array based on the selected area; and a high voltage generator to provide a first pass voltage to a word line of the selected area, and to provide a second pass voltage to a word line of the unselected area. The pass voltages are discriminately applied to the programmed and non-programmed memory cells, enlarging the pass voltage window. The memory array is divided into pluralities of zones to which local voltages are each applied in different levels.01-07-2010
20090316486PROGRAM AND READ TRIM SETTING - A method and apparatus for setting trim parameters in a memory device provides multiple trim settings that are assigned to portions of the memory device according to observed or tested programming speed and reliability.12-24-2009
20090103366Non-volatile memory device - A non-volatile memory device may include at least one string, at least one bit line corresponding to the at least one string, and/or a sensing transistor. The at least one string may include a plurality of memory cell transistors connected in series. The sensing transistor may include a gate configured to sense a voltage of the corresponding bit line. A threshold voltage of the sensing transistor may be higher than a voltage obtained by subtracting a given voltage from a voltage applied to read the corresponding bit line connected to a memory cell transistor to be read of the plurality of memory cell transistors.04-23-2009
20090080261NONVOLATILE SEMICONDUCTOR MEMORY - A nonvolatile semiconductor memory, has a first wire; a second wire adjacent to the first wire; a third wire disposed next to the second wire such that the second wire is disposed between the first wire and the third wire; a power supply circuit for setting each of the wires at a predetermined potential; and a determining circuit for determining presence or absence of a short circuit between the wires.03-26-2009
20110170356Methods of Programming Data in a Non-Volatile Memory Device and Methods of Operating a Nand Flash Memory Device Using the Same - Methods of programming data in a non-volatile memory cell are provided. A memory cell according to some embodiments may include a gate structure that includes a tunnel oxide layer pattern, a floating gate, a dielectric layer and a control gate sequentially stacked on a substrate, impurity regions that are formed in the substrate at both sides of the gate structure, and a conductive layer pattern that is arranged spaced apart from and facing the floating gate. Embodiments of such methods may include applying a programming voltage to the control gate, grounding the impurity regions and applying a fringe voltage to the conductive layer pattern to generate a fringe field in the floating gate.07-14-2011
20110170354Method and System to Access Memory - This document discusses among other things, a system comprising a host controller, an Input/Output buffer, and a memory device. The memory device is coupled to the host controller and is configured to receive a read command from the host controller. The non-volatile includes an interface control logic, which is in communication with a non-volatile memory. The interface control logic includes a latency programming circuit coupled to the non-volatile memory and the Input/Output buffer. The latency programming circuit stores at least one value corresponding to dummy byte delays to be provided at the non-volatile memory prior to transferring data from the non-volatile memory during a read operation.07-14-2011
20090147585FLEXIBLE WORD LINE BOOSTING ACROSS VCC SUPPLY - Systems and methods for producing a boosted voltage which can be used as a boosted word line voltage for read mode operations of memory cells are disclosed. The system contains a VCC comparator, a look up table, and a boosting circuit including a set of boosting capacitors. The look up table has a list of trim codes that indicates desired boosting ratios. The boosting ratio can vary depending on a level of a supply voltage to provide a sufficient word line voltage, thereby preventing and/or mitigating delay in reading operations. The number of the capacitors in the boosting circuit can be predetermined to be turned on or off according to the trim code. Accordingly, the voltage boost circuit provides a sufficient boosted word line voltage to a core cell gate with flexibility despite fluctuation of the supply voltage level.06-11-2009
20100118609Nonvolatile semiconductor memory, and method for reading data - A nonvolatile semiconductor memory includes a memory cell, a first gate control circuit that is coupled to the memory cell, and a second gate control circuit that is coupled to the memory cell. The memory cell includes a first gate electrode that is formed above a channel region in a semiconductor substrate, a second gate electrode that is formed beside the first gate electrode, and that is capacitively coupled with the first gate electrode through a first insulating layer, and a charge trapping layer that is formed between the channel region and the second gate electrode, and that includes a second insulating layer for trapping a charge. Data stored in a memory cell transistor including the second gate electrode changes depending on an amount of the charge trapped in the charge trapping layer. The first gate control circuit applies a potential to the first gate electrode, when reading the data stored in the memory cell transistor. The second gate control circuit brings the second gate electrode into a floating state, when the potential is applied to the first gate electrode.05-13-2010
20090310417SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes a non-volatile memory built into the semiconductor integrated circuit, the non-volatile memory electrically writing and erasing data and including a memory cell, the memory cell including: a selecting transistor controlled by a word line; an impurity diffused region formed inside a semiconductor substrate, the impurity diffused region being coupled to one of a source and a drain of the selecting transistor; a first electrode formed above the semiconductor substrate with an insulating film therebetween, the first electrode receiving a control signal and part of the first electrode having an opening; a second electrode formed avobe the first electrode so as to oppose the first electrode with an insulating film therebetween, the second electrode having a protrusion which opposes the impurity diffused region with a tunnel film therebetween and projects toward the semiconductor substrate through the opening of the first electrode, and storing information based on an applied voltage; and a sensing transistor operating based on charges accumulated in the second electrode, so as to sense the information stored in the memory cell.12-17-2009
20100124119Nonvolatile Memory Device and Read Methods Thereof - An object of the present inventive concept is providing a nonvolatile memory device having improved reliability by compensating a threshold voltage of a flash memory cell.05-20-2010
20110261622NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MEMORY SYSTEM HAVING THE SAME - A nonvolatile semiconductor memory device includes a first string including a first number of memory cells connected in series each storing therein information in a nonvolatile manner; and a second string including a second number of memory cells connected in series each storing therein information in a nonvolatile manner, wherein the second number is smaller than the first number.10-27-2011
20110149658METHOD, APPARATUS, AND SYSTEM FOR IMPROVED READ OPERATION IN MEMORY - Various embodiments include methods, apparatus, and systems for reading an adjacent cell of a memory array in an electronic device to determine a threshold voltage value of the adjacent cell, the adjacent cell being adjacent a target cell, and reading the target cell of the memory array using a wordline voltage value based on the threshold voltage value of the adjacent cell. Additional apparatus, systems, and methods are described.06-23-2011
20110149657Methods and Apparatus for Write-Side Intercell Interference Mitigation in Flash Memories - Methods and apparatus are provided for write-side intercell interference mitigation in flash memories. A flash memory device is written by obtaining program data to be written to at least one target cell in the flash memory; obtaining one or more bits of program data for at least one aggressor cell to be programmed later than the target cell: and precompensating for intercell interference for the target cell by generating precompensated program values. The aggressor cells comprise one or more cells adjacent to the target cell, such as adjacent cells in a same wordline as the target cell and/or cells in an upper or lower adjacent wordline to the target cell. The precompensated program values for the target cell are optionally provided to the flash memory.06-23-2011
20100118610NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A stacked body with a plurality of dielectric films and electrode films alternately stacked therein is provided. The electrode film is divided into a plurality of control gate electrodes extending in one direction. The stacked body is provided with a U-pillar penetrating through the select gate electrodes and the control gate electrodes, having one end connected to a source line, and having the other end connected to a bit line. Moreover, a different potential is applied to uppermost one of the control gate electrodes than that applied to the other control gate electrodes.05-13-2010
20120033499FLASH MEMORY DEVICE AND READING METHOD THEREOF - A flash memory device and reading method of the flash memory device. The reading method includes determining a read voltage set of memory cells corresponding to a first word line from at least one of flag cell data of the first word line and flag cell data of a second word line adjacent to the first word line, and reading the memory cells corresponding to the first word line according to the determined read voltage set.02-09-2012
20120033498SEMICONDUCTOR MEMORY DEVICE AND METHOD OF READING THE SAME - A semiconductor memory device comprises planes each configured to comprise flag cells storing data about program methods of memory cells of the plane, page buffer units configured to sense the data of the flag cells, a flag cell data detection circuit configured to make a determination of program methods of the planes on the basis of a result, obtained by comparing the sensed data of the flag cells of the planes, and the sensed data of the flag cells, and a microcontroller configured to control the page buffer units, wherein the page buffer units read least significant bit (LSB) data of the planes or both the least significant bit (LSB) data and most significant bit (MSB) data on the basis of the determination of the flag cell data detection circuit.02-09-2012
20120294088MEMORY SEGMENT ACCESSING IN A MEMORY DEVICE - Bit lines of a memory segment are read at substantially the same time by coupling a selected memory segment and, at some of the data lines of any intervening segments, to respective data caches. The bit lines of the unselected memory segments that are not used to couple the selected segment to the data caches can be coupled to their respective source lines.11-22-2012
20120294087PROGRAM METHOD OF NONVOLATILE MEMORY DEVICE - A program method of a nonvolatile memory device includes applying a program voltage to a selected word line, applying a first pass voltage to at least one word line adjacent to the selected word line, applying at least one first middle voltage lower than the first pass voltage but higher than an isolation voltage to at least one word line adjacent to the word line receiving the first pass voltage, applying the isolation voltage to a word line adjacent to the word line receiving the first middle voltage, applying at least one second middle voltage higher than the isolation voltage but lower than a second pass voltage to at least one word line adjacent to the word line receiving the isolation voltage, and applying a second pass voltage to at least one word line adjacent to the word line receiving the second middle voltage.11-22-2012
20090296483NONVOLATILE MEMORY DEVICE WITH EXPANDED TRIMMING OPERATIONS - A nonvolatile memory device includes a trimming cell array storing trimming data for a plurality of operating modes, a trimming cell sense amplifier sensing the trimming data and a trimming cell latch storing the sensed trimming data. A plurality of trimming circuits performs trimming operations in response to a trimming control signals derived from trimming data. A single temporary trimming control logic unit receives externally provided control data and controls operation of a single summation circuit. The summation circuit controls the operation of the trimming circuits by respectively and selectively varying the trimming control signal provided to each one of the plurality of trimming circuits in response to the externally provided control data.12-03-2009
20090296479SEMICONDUCTOR MEMORY DEVICE - There are provided a first nonvolatile memory array including a plurality of nonvolatile memory elements which require an erase operation before a write operation, and a second nonvolatile memory array including a plurality of overwritable nonvolatile memory elements. A request to rewrite data is received by a control circuit. The control circuit writes data to be rewritten to the second nonvolatile memory array when the capacity of the data to be rewritten is not more than that of the second nonvolatile memory array.12-03-2009
20120106254MEMORY SYSTEM - According to one embodiment, a memory system includes a NAND flash memory, a first unit, and an second unit. Memory cells capable of holding data and management data as a first control signal. Memory cells are arranged in a matrix in the NAND flash memory. The first unit holds a second and a third signal. The second signal is made variable in accordance with an output frequency. The third signal is made variable. The second unit outputs the data to an outside in accordance with the first to third signals. The second unit includes a buffer unit including first to third transistors. The output frequency includes a first frequency and a second frequency. If the first to third transistors output the data to the outside in synchronization with the second frequency, the first to third transistors may be turned on regardless of a value of the first control signal.05-03-2012
20110170357NONVOLATILE MEMORY WITH A UNIFIED CELL STRUCTURE - A novel FLASH-based EEPROM cell, decoder, and layout scheme are disclosed to eliminate the area-consuming divided triple-well in cell array and allows byte-erase and byte-program for high P/E cycles. Furthermore, the process-compatible FLASH cell for EEPROM part can be integrated with FLASH and ROM parts so that a superior combo, monolithic, nonvolatile memory is achieved. Unlike all previous arts, the novel combo nonvolatile memory of the present invention of ROM, EEPROM and FLASH or combination of any two is made of one unified, fully compatible, highly-scalable BN+ cell and unified process. In addition, its cell operation schemes have zero array overhead and zero disturbance during P/E operations. The novel combo nonvolatile memory is designed to meet the need in those markets requiring flexible write size in units of bytes, pages and blocks at a lower cost.07-14-2011
20110170355SEMICONDUCTOR MEMORY DEVICE HAVING A PLURALITY OF CHIPS AND CAPABILITY OF OUTPUTTING A BUSY SIGNAL - One package contains a plurality of memory chips. Each memory chip has an I/O terminal which generates a busy signal. The busy signal enables a busy state when a power supply voltage value reaches a specified and guaranteed range after a power-on sequence. The busy signal maintains the busy state until completion of initialization operations for the plurality of memory chips. The busy signal releases the busy state after completion of all initialization operations for the plurality of memory chips.07-14-2011
20110170353ACCESS LINE DEPENDENT BIASING SCHEMES - The present disclosure includes methods, devices, and systems for access line biasing. One embodiment includes selecting, using a controller external to the memory device, a particular access line dependent biasing scheme and corresponding bias conditions for use in performing an access operation on an array of memory cells of the memory device, and performing the access operation using the selected particular access line dependent biasing scheme and corresponding bias conditions. In one or more embodiments, the selected particular access line dependent biasing scheme and corresponding bias conditions is selected by the controller external to the memory device based, at least partially, on a target access line of the array.07-14-2011
20090201739METHOD FOR DRIVING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - In a case of writing to a trap type non-volatile memory cell that includes: a laminated insulating film, containing a charge accumulation layer, that is formed on a semiconductor substrate where source, drain and well regions are formed; and a first gate electrode formed on the laminated insulating film, charge injections that are carried on a single memory node multiple times under two or more different writing conditions, the writing condition is a combination of a well voltage applied to the well, a drain voltage applied to the drain and a gate voltage is applied to the first gate. Thereby, it is possible to form a trapezoid-shaped electron distribution in the charge accumulation layer, and thus prevent the charge retention characteristic from deteriorating.08-13-2009
20090262581NON VOLATILE MEMORY - An electrically programmable and erasable non-volatile semiconductor memory such as a flash memory is designed into a configuration in which, when a cutoff of the power supply occurs in the course of a write or erase operation carried out on a memory cell employed in the non-volatile semiconductor memory, the operation currently being executed is discontinued and a write-back operation is carried out to change a threshold voltage of the memory cell in the reversed direction. In addition, the configuration also allows the number of charge-pump stages in an internal power-supply configuration to be changed in accordance with the level of a power-supply voltage so as to make the write-back operation correctly executable. As a result, no memory cells are put in deplete state even in the event of a power-supply cutoff in the course of a write or erase operation.10-22-2009
20090296484Apparatus for Generating A Voltage and Non-Volatile Memory Device Having the Same - An apparatus for generating a voltage includes a first voltage outputting circuit configured to receive an input voltage and adjust and output a first voltage in accordance with a temperature, a buffer circuit configured to receive the first voltage and output the received first voltage as a second voltage at an output node of the buffer circuit, and a second voltage outputting circuit configured to receive the second voltage at an input terminal and output a third voltage by dividing a driving voltage in accordance with a resistance ratio, wherein the second voltage outputting circuit includes a sub-voltage outputting circuit and a controlling circuit configured to adjust a voltage level of the third voltage through a feedback of the third voltage to the input terminal.12-03-2009
20090279361Addressable Memory Array - This document discloses non-volatile memory cells and methods of manufacturing the same. The memory arrays are byte, word, and/or page addressable without using a byte select transistor. The byte select transistor is eliminated by using the well, memory transistor control gates, and select transistor gates to selectively program a byte, word, or page.11-12-2009
20090103367ONE-TRANSISTOR CELL SEMICONDUCTOR ON INSULATOR RANDOM ACCESS MEMORY - Silicon-oxide-nitride-oxide-silicon SONOS-type devices (or BE-SONOS) fabricated in Silicon-On-Insulator (SOI) technology for nonvolatile implementations. An ultra-thin tunnel oxide can be implemented providing for very fast program/erase operations, supported by refresh operations as used in classical DRAM technology. The memory arrays are arranged in divided bit line architectures. A gate injection, DRAM cell is described with no tunnel oxide.04-23-2009
20090296485DIFFERENTIAL FLASH MEMORY PROGRAMMING TECHNIQUE - The invention relates flash memory programming techniques. An object of the invention is to provide a flash memory programming technique avoiding problems of the known state of the art and in particular, saving a significant amount of time during the development and/or production phases of any equipment containing flash memory devices and also saving time during an updating or upgrading procedure of such an equipment already being in use. Accordingly, the invention proposes for programming a flash memory device to program only differences in information between data already stored in the flash memory device and new data to be stored.12-03-2009
20090296481EEPROMS USING CARBON NANOTUBES FOR CELL STORAGE - An electrically erasable programmable read only memory (EEPROM) cell includes cell selection circuitry and a storage cell for storing the informational state of the cell. The storage cell is an electro-mechanical data retention cell in which the physical positional state of a storage cell element represents the informational state of the cell. The storage cell element is a carbon nanotube switching element. The storage is writable with supply voltages used by said cell selection circuitry. The storage is writable and readable via said selection circuitry with write times and read times being within an order of magnitude. The write times and read times are substantially the same. The storage has no charge storage or no charge trapping.12-03-2009
20090296478METHOD OF PROGRAMMING NONVOLATILE MEMORY DEVICE - In one aspect of the method of programming a nonvolatile memory device, memory cells selected for a program are determined to belong to a first memory cell group or a second memory cell group based on address information and a program command. According to this determination, to-be-programmed data are input based on information about the number of set data bits, and programming and verification are performed.12-03-2009
20090180326Non-Volatile Memory and Semiconductor Device - There is provided a non-volatile memory which enables high accuracy threshold control in a writing operation. In the present invention, a drain voltage and a drain current of a memory transistor are controlled to carry out a writing operation of a hot electron injection system, which is wherein a charge injection speed does not depend on a threshold voltage. FIGS. 07-16-2009
20110199830FLOTOX-BASED, BIT-ALTERABLE, COMBO FLASH AND EEPROM MEMORY - A non-volatile memory array having FLOTOX-based memory cells connected by a plurality of word lines and a plurality of bit lines is disclosed. In the memory array, the FLOTOX-based memory cells in a common word line do not share a common source line. Instead, the FLOTOX-based memory cells associated with a bit line are provided with a source line laid out in parallel with the bit line to avoid punch-through leakage. The FLOTOX-based memory cells may be 2T FLOTOX-based EEPROM cells or 1T FLOTOX-based flash cells. The byte-alterable and page-alterable functions of a 2T EEPROM array and the block-alterable function of a 1T flash array are preserved. In addition, a novel bit-alterable function is added to both 2T FLOTOX-based EEPROM array and 1T FLOTOX-based flash array to reduce the unnecessary high voltage over-stress in a write operation to improve program/erasure endurance cycles.08-18-2011
20100103740Nonvolatile Memory Device, Methods of Programming the Nonvolatile Memory Device and Memory System Including the Same - A nonvolatile memory device is provided. A counter counts an amount of data to be program-inhibited among data to be written to memory cells to provide a first count value. The counter also counts an amount of program-inhibited data among data written to the memory cells to provide a second count value. Control logic controls a program operation by comparing the first count value with the second count value.04-29-2010
20100214845NAND MEMORY CELL ARRAY, NAND FLASH MEMORY HAVING NAND MEMORY CELL ARRAY, DATA PROCESSING METHOD FOR NAND FLASH MEMORY - A NAND memory cell array which can be programmed in a hot carrier injection scheme, a NAND flash memory having the NAND memory cell array, and a data processing method for the NAND flash memory are provided. The NAND memory cell array includes one select transistor and at least two storage transistors. The NAND memory cell array can be programmed by controlling a bulk bias voltage and a voltage applied to a gate in the hot carrier injection scheme.08-26-2010
20100061152METHOD AND SYSTEM TO ACCESS MEMORY - This document discusses among other things, a system comprising a host controller, an Input/Output buffer, and a memory device. The memory device is coupled to the host controller and is configured to receive a read command from the host controller. The non-volatile includes an interface control logic, which is in communication with a non-volatile memory. The interface control logic includes a latency programming circuit coupled to the non-volatile memory and the Input/Output buffer. The latency programming circuit stores at least one value corresponding to dummy byte delays to be provided at the non-volatile memory prior to transferring data from the non-volatile memory during a read operation.03-11-2010
20090003072NON-VOLATILE MEMORY DEVICE - A non-volatile memory device is provided. In an aspect, the non-volatile memory device includes two or more common source lines that are included in one memory cell block in order to distribute the current that could have been concentrated on one common source line. As a result, the bouncing phenomenon generated by the nose of the source line can be reduced. That is, at the time of a verifying operation performed during a program operation, the current concentrated on a common source line can be distributed and, therefore, the occurrence of under-programmed cells can be prevented.01-01-2009
20090003074Scalable Electrically Eraseable And Programmable Memory (EEPROM) Cell Array - A non-volatile memory (NVM) system includes a plurality of NVM cells fabricated in a dual-well structure. Each NVM cell includes an access transistor and an NVM transistor, wherein the access transistor has a drain region that is continuous with a source region of the NVM transistor. The drain regions of each NVM transistor in a column of the array are commonly connected to a corresponding bit line. The control gates of each NVM transistor in a row of the array are commonly connected to a corresponding word line. The source regions of each of the access transistors in the array are commonly coupled. The NVM cells are programmed and erased without having to apply the high programming voltage V01-01-2009
20090003071SEMICONDUCTOR STORAGE DEVICE AND READ VOLTAGE CORRECTION METHOD - A semiconductor memory device comprises a semiconductor memory, a corrected voltage storage circuit which stores a corrected voltage produced by correcting a read voltage of the semiconductor memory, and a memory controller which reads the corrected voltage from the corrected voltage storage circuit and performs a read operation of the semiconductor memory using the corrected voltage.01-01-2009
20110199831COARSE AND FINE PROGRAMMING IN A SOLID STATE MEMORY - Memory devices adapted to receive and transmit analog data signals representative of bit patterns of two or more bits facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits. Programming of such memory devices includes initially programming a cell with a coarse programming pulse to move its threshold voltage in a large step close to the programmed state. The neighboring cells are then programmed using coarse programming. The algorithm then returns to the initially programmed cells that are then programmed with one or more fine pulses that slowly move the threshold voltage in smaller steps to the final programmed state threshold voltage.08-18-2011
20110199832MAGNETIC FLOATING GATE MEMORY - An apparatus includes at least one memory device including a floating gate element and a magnetic field generator that operably applies a magnetic field to the memory device. The magnetic field directs electrons in the memory device into the floating gate element.08-18-2011
20090168537METHOD OF PROGRAMMING A NON-VOLATILE MEMORY DEVICE - A method of programming a non-volatile memory device includes applying a first pass voltage to word lines in a direction of a source select line based on a first word line selected for a program operation, wherein the word lines do not include a second word line adjacent to the first word line in a direction of the source select line; and applying a first voltage, a program voltage and a second pass voltage when the first pass voltage reaches a given level. The first voltage is applied to the second word line, the program voltage is provided to the first word line, and the second pass voltage is applied to word lines in a direction of a drain select line on the basis of the first word line.07-02-2009
20090168538Method of Programming Non-Volatile Memory Device - A programming method of a non-volatile memory device may include providing a memory device in which a first word line is preprogrammed in an erase operation of a memory block, pre-programming a second word line according to a program command, and programming the first word line.07-02-2009
20090168536METHOD OF PROGRAMMING NON-VOLATILE MEMORY DEVICE - A method of programming a non-volatile memory device includes applying a power supply voltage to a drain select line, applying a high level voltage to a drain-side pass word line or a source-side pass word line, and applying a pass voltage to unselected word lines and a program voltage to a selected word line. The high level voltage is applied to the drain-side pass word line or the source-side pass word line before applying the pass voltage to the unselected word lines and the program voltage to the selected word line.07-02-2009
20090168535NON-VOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A non-volatile memory device includes a memory cell array and a controller. The memory cell array includes memory cells for data storage and a plurality of flag cells. The flag cells indicate program states of the memory cells for each of a plurality of word lines. The controller determines the program states of the memory cells by employing the flag cells and controls a pass voltage provided to a corresponding word line according to the determined program states.07-02-2009
20080273391Regulator Bypass Start-Up in an Integrated Circuit Device - An internal voltage regulator in an integrated circuit device is always active upon initial start-up and/or power-on-reset operations. The internal voltage regulator protects the low voltage core logic circuits of the integrated circuit device from excessively high voltages that may be present in a particular application. In addition, nonvolatile memory may be part of and operational with the low voltage core logic circuits for storing device operating parameters. Therefore, the internal voltage regulator also protects the low voltage nonvolatile memory from excessive high voltages. Once the integrated circuit device has stabilized and all logic circuits therein are fully function, a bit(s) in the nonvolatile memory may be read to determine if the internal voltage regulator should remain active, e.g., how power operation with a high voltage source, or be placed into a bypass mode for low power operation when the integrated circuit device is powered by a low voltage.11-06-2008
20080279010FLASH MEMORY DEVICE AND PROGRAM METHOD THEREOF - A method for programming a flash memory device comprising programming memory cells via repetition of program loops, a first of the program loops including a program execution interval and a verify read interval, a second of the program loops including the program execution interval, the verify read interval, and a judging interval. Also disclosed is a flash memory device comprising a memory cell array having memory cells arranged in rows and columns, a read/program circuit configured to perform program and read operations to the memory cell array, and a control logic circuit configured to control the read/program circuit so as to perform a judging operation according to a program loop number.11-13-2008
20080279009Nonvolatile Semiconductor Memory Device and Writing Method of the Same - A nonvolatile semiconductor memory device and a writing method thereof are provided. The nonvolatile semiconductor memory device includes a cell array, a controller configured to receive input data from an outside source, an address latch unit configured to store a Y-address of the input data and X-addresses respectively corresponding to at least two wordlines, over which the input data is written, based on an address of the input data output from the controller, and a page buffer configured to receive the input data from the controller and temporarily store the input data. The controller writes the data stored in the page buffer over the two wordlines in the cell array based on the at least two X-addresses and the Y-address.11-13-2008
20080304324NONVOLATILE SEMICONDUCTOR MEMORY DEVICE WHICH REALIZES "1" WRITE OPERATION BY BOOSTING CHANNEL POTENTIAL - A nonvolatile semiconductor memory device includes a memory cell array having a plurality of cell units each including a preset number of memory cells and select gate transistors on drain and source sides. The nonvolatile semiconductor memory device includes a voltage control circuit to prevent occurrence of an erroneous write operation due to excessively high boost voltage of a channel when “1” is written into the memory cell.12-11-2008
20080310234NONVOLATILE MEMORY DEVICE AND METHODS OF PROGRAMMING AND READING THE SAME - A read method of a non-volatile memory device includes reading an initial threshold voltage value of an index cell from threshold voltage information cells that store information indicating the initial threshold voltage, determining a current threshold voltage value from the index cell, and comparing the initial threshold voltage value and the current threshold voltage value to calculate a shifted threshold voltage level of the index cell. A read voltage is changed by the shifted threshold voltage level to read user data using the changed read voltage.12-18-2008
20080279011DATA PROCESSING APPARATUS - The present invention is directed to largely reduce peak current at the time of operation of a boosting circuit provided for an EEPROM. In the erase/write operation, first, a low-frequency clock signal as a selection clock signal is input by a low-frequency clock control signal to a charge pump. After lapse of a certain period (about ⅓ of fall time), a high-frequency clock signal having a frequency higher than that of the low-frequency clock signal is output by a high-frequency clock control signal and is input as the selection clock signal to the charge pump to boost a voltage to a predetermined voltage level. In such a manner, while suppressing the peak of consumption current, the fall time of the boosted voltage can be shortened.11-13-2008
20080205154Semiconductor Memory Device - A semiconductor memory device comprises memory cells, a bitline connected to the memory cells, a read circuit including a precharge circuit, and a first transistor connected between the bitline and the read circuit, wherein a first voltage is applied to a gate of the first transistor when the precharge circuit precharges the bitline, and a second voltage which is different from the first voltage is applied to the gate of the first transistor when the read circuit senses a change in a voltage of the bitline.08-28-2008
20110002172NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes: a memory unit; and a control unit. The memory unit includes a multilayer structure including electrode films and inter-electrode insulating films alternately stacked in a first direction; a semiconductor pillar piercing the multilayer structure in the first direction; a memory layer provided between the semiconductor pillar and the electrode films; a inner insulating film provided between the memory layer and the semiconductor pillar; a outer insulating film provided between the memory layer and the electrode films; and a wiring electrically connected to the first semiconductor pillar. In erasing operation, the control unit sets the first wiring at a first potential and sets the electrode film at a second potential lower than the first potential, and then sets the first wiring at a third potential and sets the electrode film at a fourth potential higher than the third potential.01-06-2011
20120294089SEMICONDUCTOR MEMORY DEVICE CAPABLE OF MEMORIZING MULTIVALUED DATA - In a memory cell array, a plurality of memory cells connected to word lines and bit lines are arranged in a matrix. A data storage circuit is connected to the bit lines and stores write data. The data storage circuit includes at least one static latch circuit and a plurality of dynamic latch circuits when setting 211-22-2012
20080266967NONVOLATILE SEMICONDUCTOR MEMORY - A semiconductor memory device comprising: a memory cell array having memory cell units each formed by connecting a plurality of memory cells; a first and a second select gate transistors, the first select gate transistor being connected between one end of the memory cell array and a common source line, the second select gate transistor being connected between the other end of the memory cell array and bit lines; word lines acting also as control gates of the memory cells; a first select gate voltage-generating circuit for generating a first select gate voltage; a second select gate-setting circuit for setting an instructed value of a second select gate voltage; a second select gate voltage-generating circuit for generating the second select gate voltage based on the set, instructed value; a first transfer circuit for transferring the first select gate voltage generated by the first select gate voltage-generating circuit to a second select gate; a discharging circuit for discharging the first select gate voltage transferred to the second select gate; and a discharging characteristics selection circuit for selecting discharging characteristics of the discharging circuit.10-30-2008
20080205150HYBRID NON-VOLATILE MEMORY - A non-volatile memory (NVM) circuit includes at least two types of NVM sub-circuits that share common support circuitry. Different types of NVM sub-circuits include ordinary NVM circuits that provide a logic output upon being addressed, programmable fuses that provide an output upon transitioning to a power-on state, NVM circuits that provide an ON/OFF state output, and the like. Some of the outputs are used to calibrate circuits within a device following power-on. Other outputs are used to store information to be employed by various circuits.08-28-2008
20110007570METHOD OF READING AN NVM CELL THAT UTILIZES A GATED DIODE - A method of reading an NVM cell structure formed on a deep well of N-type semiconductor material, wherein the NVM cell structure includes a PMOS transistor formed in an N-type well, the PMOS transistor including spaced-apart p-type source and drain region defining an n-type cannel region therebetween, an NMOS transistor formed in a P-type well that is adjacent to the N-type well, the NMOS transistor including spaced-apart n-type source and drain regions defining a p-type channel region therebetween, a conductive floating gate that includes a first section that extends over the n-type channel region of the PMOS transistor and is separated therefrom by intervening dielectric material and a second section that extends over the p-type channel region and is separated therefrom by intervening dielectric material, and a conductive control gate formed over at least a portion of the second section of the floating gate and is separated therefrom by intervening dielectric material, the method comprising: biasing the deep N-type well at a preselected read voltage; holding the source region of the PMOS transistor at the read voltage; holding the drain of the PMOS transistor at ground; and holding the control gate at ground for a preselected read time.01-13-2011
20080253192SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit device includes a memory cell array having a plurality of blocks, a storage unit, a block replacement information register group, and a bad block flag register group. The storage unit includes a block replacement information registration area with which it is possible to register block replacement information, and a bad block information registration area with which it is possible to register bad block information. The block replacement information register group is set in accordance with the block replacement information read out of the storage unit during a boot sequence, and the bad block flag register group is set in accordance with both of the block replacement information and the bad block information read out of the storage unit during the boot sequence.10-16-2008
20080266966OPERATION METHOD OF NON-VOLATILE MEMORY AND METHOD OF IMPROVING COUPLING INTERFERENCE FROM NITRIDE-BASED MEMORY - An operation method of a non-volatile memory is provided. The operation method is that a reading operation is performed to a selected nitride-based memory cell, a first positive voltage is applied to a word line adjacent to one side of the selected memory cell and a second positive voltage is applied to another word line adjacent to the other side of the selected memory cell. The operation method of this present invention not only can reduce a coupling interference issue but also can obtain a wider operation window.10-30-2008
20090097322SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device including: a memory cell array including a plurality of word lines, a plurality of bit lines, and memory cells arranged in portions where the plurality of word lines and the plurality of bit lines intersect with each other; a plurality of data bus lines connected to the plurality of bit lines; a plurality of sense amplifiers individually connected to the plurality of data bus lines and configured for detecting memory data stored in corresponding memory cells based on values of currents that are generated in the individual data bus lines in accordance with the memory data.04-16-2009
20090067249MEMORY WITH MULTI-PAGE READ - A memory device is described that provides increased output data to help evaluate data errors from bit line coupling and floating gate coupling during a read operation. Multiple rows, or pages, of data are read to allow an internal or external decoder to evaluate memory cell data.03-12-2009
20110205801SEMICONDUCTOR MEMORY DEVICE - In writing operation, charge pumps of a memory apply any of first to n-th voltages which are different from each other. An application-voltage selector selects voltages to be applied to WLs among the first to n-th voltages. A word-line number register stores the number of WLs to which each of the first to n-th voltages is to be applied for the first to n-th voltages. A storage stores a correspondence table that stores a relationship between the number of WLs for each of the first to n-th voltages and the number of charge pumps allocated to the first to n-th voltages. A generation-voltage selector allocates charge pumps to generate the first to n-th voltages based on the correspondence table according to the number of WLs for each of the first to n-th voltages. Each charge pump generates any of the first to n-th voltages allocated by the generation-voltage selector.08-25-2011
20100142282METHOD OF PROGRAMMING FLASH MEMORY DEVICE - A method of programming data in a flash memory device is disclosed. The memory device includes a memory cell array which in turn includes at least one block, and the block in turn includes a plurality of pages. A program command to program a plurality of pages in the block is received. The plurality of pages is programmed in a predefined order. An address corresponding to a page that was programmed last amongst the plurality of pages is stored.06-10-2010
20100142281Non-Volatile Memory Device and Program Method Thereof - Disclosed is a program method of a non-volatile memory device which comprises classifying plural memory cells into aggressor cells and victim cells based on program data to be written in the plural memory cells; and programming the aggressor cells by a program manner different from the victim cells.06-10-2010
20100142283PROGRAM METHOD WITH OPTIMIZED VOLTAGE LEVEL FOR FLASH MEMORY - A non-volatile memory device and programming process is described that increases the programming voltage of successive programming cycles in relation to the percentage of the data bits that failed programming verification during the previous programming cycle and were not correctly programmed into the memory array. This allows for a faster on average program operation and a more accurate match of the subsequent increase in the programming voltage to the non-volatile memory device, the specific region or row being programmed and any changes due to device wear. In one embodiment of the present invention the manufacturing process/design and/or specific memory device is characterized by generating a failed bit percentage to programming voltage increase profile to set the desired programming voltage delta/increase. In another embodiment of the present invention, methods and apparatus are related for the programming of data into non-volatile memory devices and, in particular, NAND and NOR architecture Flash memory.06-10-2010
20090161438METHODS OF FORMING AND PROGRAMMING FLOATING-GATE MEMORY CELLS HAVING CARBON NANOTUBES - Floating-gate memory cells having carbon nanotubes interposed between the substrate and the tunnel dielectric layer facilitate ballistic injection of charge into the floating gate. The carbon nanotubes may extend across the entire channel region or a portion of the channel region. For some embodiments, the carbon nanotubes may be concentrated near the source/drain regions. For some embodiments, the tunnel dielectric layer may adjoin the substrate in at least a portion of the channel region.06-25-2009
20090122614SINGLE POLY EEPROM ALLOWING CONTINUOUS ADJUSTMENT OF ITS THRESHOLD VOLTAGE - A single-poly EEPROM memory device comprises a control gate isolated within a well of a first conductivity type in a semiconductor body of a second conductivity type, first and second tunneling regions isolated from one another within respective wells of the first conductivity type in the semiconductor body, a read transistor isolated within a well of the first conductivity type, and a floating gate overlying a portion of the control gate, the read transistor, and the first and second tunneling regions. The memory device is configured to be electrically programmed by changing a charge on the floating gate that changes the device threshold voltage. In one embodiment, the memory device is configured to be electrically programmed by applying a first potential between the first and second tunneling regions, and a second potential to the control gate, the second potential having a value less than the first potential.05-14-2009
20090180327NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE - In a memory cell array which is constituted with flash memory, a pair of a positive memory cell and a negative memory cell, to which data with mutually opposite values are written, is plurally provided. Bit lines and I/O lines connected to the memory cells of a data reading object are charged, and then a potential WL of a word line connected to the data reading object memory cells is raised. Hence, currents flow in the data reading object memory cells in accordance with the data that were written, and consequently one of a potential BL and a potential BLN of the I/O lines begins to fall. When one of the potentials BL and BLN falls below the circuit threshold of a sense amplifier, reading data is established, and the established reading data is outputted as a sense amplifier output signal SAOUT.07-16-2009
20110267889A HIGH SECOND BIT OPERATION WINDOW METHOD FOR VIRTUAL GROUND ARRAY WITH TWO-BIT MEMORY CELLS - A non-volatile VG memory array employing memory semiconductor cells capable of storing two bits of information having a non-conducting charge trapping dielectric, such as silicon nitride, layered in associating with at least one electrical insulating layer, such as an oxide, is disclosed. Bit lines of the memory array are capable of transmitting positive voltage to reach the source/drain regions of the memory cells of the array. A method that includes the hole injection erasure of the memory cells of the array that lowers the voltage threshold of the memory cells to a value lower than the initial voltage threshold of the cells is disclosed. The hole injection induced lower voltage threshold reduces the second bit effect such that the window of operation between the programmed and un-programmed voltage thresholds of the bits is widened. The programming and read steps reduce leakage current of the memory cells in the array.11-03-2011
20090129167SEMICONDUCTOR MAGNETIC MEMORY INTEGRATING A MAGNETIC TUNNELING JUNCTION ABOVE A FLOATING-GATE MEMORY CELL - A semiconductor magnetic memory device has a magnetic tunneling junction formed over a memory cell. The memory cell has a control gate surrounded by a floating gate. The floating gate is coupled to the magnetic tunneling junction through a pinning layer that maintains the magnetic orientation of the lower magnetic layer of the junction. A current through a selected word line, coupled to the control gate, generates a first magnetic field. A current through a cell select line generates a second magnetic field that is orthogonal to the first magnetic field. This changes the magnetic orientation of the upper magnetic layer of the junction to lower its resistance, thus allowing a write/erase voltage on a program/erase line to program/erase the floating gate.05-21-2009
20110205802NONVOLATILE MEMORY DEVICE AND METHOD OF READING THE SAME - Provided are a nonvolatile memory device and a method of reading the same. The nonvolatile memory device includes: a memory cell; a transistor disposed between a common source line and the memory cell; and a control logic for controlling a bias voltage of the transistor to reduce the amount of current flowing into the common source line during a read operation. The method includes: applying a read voltage to the memory cell; and controlling a bias voltage of the transistor to reduce the amount of current flowing into the common source line.08-25-2011
20120140563PUMP CIRCUIT AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME - A pump circuit includes a plurality of clock control circuits configured to transfer a clock to respective output terminals in response to respective pump-off signals or block the clock from being transferred to the respective output terminals, a plurality of charge pumps configured to generate respective high voltages by performing respective pumping operations in response to respective clock signals of the output terminals, and a plurality of switching circuits configured to transfer the respective high voltages to a final output terminal in response to respective control signals.06-07-2012
20090027969METHOD OF USING HOT-CARRIER-INJECTION DEGRADATION AS A PROGRAMMABLE FUSE/SWITCH - Method and apparatus for providing nonvolatile storage with a programmable transistor. The method includes receiving a data value to be stored in the programmable transistor and programming the programmable transistor to store the received data value. Programming includes applying a selected voltage to the programmable transistor. The selected voltage is selected to inject carriers into a gate oxide layer of the programmable transistor. The carriers are maintained in the gate oxide layer of the programmable transistor in the absence of the selected voltage, thereby programming the programmable transistor with the received data value.01-29-2009
20080316831Nonvolatile semiconductor device, system including the same, and associated methods - A nonvolatile memory device is provided. The nonvolatile memory device includes a semiconductor substrate and memory cell units arranged in a matrix on the semiconductor substrate. Each of the memory cell units includes a tunnel insulation layer on the semiconductor substrate. A first memory gate and a second memory gate are disposed on the tunnel insulation layer. An isolation gate is disposed between the first and second memory gates. A word line covers the first memory gate, the second memory gate and the isolation gate. A method of forming the nonvolatile memory device is also provided.12-25-2008
20080316830COMPENSATION METHOD TO ACHIEVE UNIFORM PROGRAMMING SPEED OF FLASH MEMORY DEVICES - Systems and methodologies are provided herein for increasing operation speed uniformity in a flash memory device. Due to the characteristics of a typical flash memory array, memory cells in a memory array may experience distributed substrate resistance that increases as the distance of the memory cell from an edge of the memory array increases. This difference in distributed substrate resistance can vary voltages supplied to different memory cells in the memory array depending on their location, which can in turn cause non-uniformity in the speed of high voltage operations on the memory array such as programming. The systems and methodologies provided herein reduce this non-uniformity in operation speed by providing compensated voltage levels to memory cells in a memory array based at least in part on the location of each respective memory cell. For example, a compensated operation voltage can be provided that is higher near the center of the memory array and lower near an edge of the memory array, thereby lessening the effect of distributed substrate resistance and providing increased operation speed uniformity throughout the memory array.12-25-2008
20120069670Semiconductor Integrated Circuit Device for Driving Liquid Crystal Display - The present invention realizes a semiconductor integrated circuit device for driving liquid crystal (liquid crystal control driver IC) capable of easily setting drive conditions and the like according to specifications of a liquid crystal display to be used. An electrically-programmable nonvolatile memory circuit (EPROM) or an electrically erasable and programmable nonvolatile memory circuit (EEPROM) is provided in a semiconductor integrated circuit device for driving a liquid crystal display, and setting information is stored in the memory circuit. The memory circuit is constructed by a normal device which can be formed in the same process as a semiconductor manufacturing process of forming devices of other circuits.03-22-2012
20120069669NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF CONTROLLING AND MANUFACTURING THE SAME - A nonvolatile semiconductor storage device is disclosed. The device includes a cell group having a first memory cell and a second memory cell located first directionally adjacent to the first memory cell, and a programming circuit. The first memory cell is used for data retention and the second memory cell is used for adjustment of a threshold voltage of the first memory cell. The programming circuit is configured to program the first memory cell by applying voltage to the second memory cell to control the threshold voltage of the first memory cell to be higher than a first threshold voltage.03-22-2012
20120069668SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor storage device includes a transistor, a first node, a first capacitor, a first switch, and a second switch. One end of the transistor is connected to a first voltage source supplying a first voltage. The first node is charged to the first voltage by the transistor. One of electrodes of the first capacitor is connected to the first node, and the other of the electrodes of the first capacitor is supplied with a first clock signal having a second voltage. One end of the first switch is connected to the first node. The first switch outputs a potential of the first node at a first time at which the first switch is turned on. One end of the second switch is connected to the first node. The second switch outputs the potential of the first node at a second time.03-22-2012
20090185427SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD FOR THE SAME - The semiconductor memory device includes: a first well of a first conductivity type, a second well of the first conductivity type and a third well of a second conductivity type formed in a substrate: a diffusion bit line extending in a row direction and a word line extending in a column direction both formed in the second well; a plurality of semiconductor memory elements arranged in a matrix, each connected with the diffusion bit line and the word line; a selection transistor formed in the first well for applying a voltage to the diffusion bit line; and a forward diode formed of a diffusion layer of the first conductivity type formed in the third well and the third well. The diffusion bit line, the forward diode and the source of the selection transistor are electrically connected with one another.07-23-2009
20090185426Semiconductor memory device and method of forming the same - The present invention discloses a semiconductor memory device comprising a source, a drain, a floating gate, a control gate, a recess channel and a gated p-n diode. The said p-n diode connects said floating gate and said drain. The said floating gate is for charge storage purpose, it can be electrically charged or discharged by current flowing through the gated p-n diode. An array of memory cells formed by the disclosed semiconductor memory device is proposed. Furthermore, an operating method and a method for producing the disclosed semiconductor memory device and array are described.07-23-2009
20110222352METHOD FOR PROGRAMMING A NON-VOLATILE MEMORY DEVICE TO REDUCE FLOATING-GATE-TO-FLOATING-GATE COUPLING EFFECT - A method for programming a non-volatile memory array comprising a plurality of memory cells. Each cell is adapted to store a lower and an upper page of data. The method: programs the lower page of predetermined memory cells with first predetermined data and the upper page with second predetermined data. One of the lower page or the upper page of the predetermined memory cells is reprogrammed with the first or second predetermined data, respectively.09-15-2011
20110222347NAND NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND WRITE METHOD FOR NAND NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a NAND nonvolatile semiconductor memory device comprises memory cell transistors and a write circuit. The memory cell transistors are arranged in a matrix in a column direction and in a row direction. Each of the memory cell transistors comprises a charge accumulation layer and a control gate electrode configured to control the charge accumulation state of the charge accumulation layer. The write circuit carries out write on the memory cell transistors. The memory cell transistors arranged in the same line include first memory cell transistors and second memory cell transistors that are smaller than the first memory cell transistors in the column direction. The write circuit carries out write on a predetermined first memory cell transistor and then on another first memory cell transistor. After the write on the another first memory cell transistor, the write circuit carries out write on the second memory cell transistor.09-15-2011
20130121080Adaptive Estimation of Memory Cell Read Thresholds - A method for operating a memory (05-16-2013
20130121081NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory unit and a control unit. The memory unit includes a multilayer structure including electrode films and inter-electrode insulating films alternately stacked in a first direction; a semiconductor pillar piercing the multilayer structure in the first direction; a memory layer provided between the semiconductor pillar and the electrode films; an inner insulating film provided between the memory layer and the semiconductor pillar; an outer insulating film provided between the memory layer and the electrode films; and a wiring electrically connected to the first semiconductor pillar. In an erasing operation, the control unit sets the first wiring at a first potential and sets the electrode film at a second potential lower than the first potential, and then sets the first wiring at a third potential and sets the electrode film at a fourth potential higher than the third potential.05-16-2013
20090097321Non-volatile memory device, method of operating the same, and method of fabricating the same - A non-volatile memory device may include at least one semiconductor layer, a plurality of control gate electrodes, a plurality of charge storage layers, at least one first auxiliary electrode, and/or at least one second auxiliary electrode. The plurality of control gate electrodes may be recessed into the semiconductor layer. The plurality of charge storage layers may be between the plurality of control gate electrodes and the semiconductor layer. The first and second auxiliary electrodes may be arranged to face each other. The plurality of control gate electrodes may be between the first and second auxiliary electrodes and capacitively coupled with the semiconductor layer.04-16-2009
20090080259Post-Facto Correction For Cross Coupling In A Flash Memory - A method of storing and reading data, using a memory that includes a plurality of cells (e.g. flash cells), such that data are stored in the cells by setting respective values of a physical parameter of the cells (e.g. threshold voltage) to be indicative of the data, and such that data are read from the cells by measuring those values. One of the cells and its neighbors are read. The data stored in the cell are estimated, based on the measurements and on respective extents to which the neighbors disturb the reading. Preferably, the method also includes determining those respective extents to which the neighbors disturb the reading, for example based on the measurements themselves.03-26-2009
20090080260Programmable CSONOS logic element - A complementary SONOS-type (CSONOS) logic device is programmed and erased with a common voltage. The CSONOS device retains data integrity over extended read endurance cycles.03-26-2009
20090201740INTEGRATED CIRCUIT, METHOD TO PROGRAM A MEMORY CELL ARRAY OF AN INTEGRATED CIRCUIT, AND MEMORY MODULE - An integrated circuit having a memory cell arrangement with a plurality of memory cells and a memory cell arrangement controller is provided. The memory cell arrangement controller is configured such that during programming of at least one memory cell of the plurality of memory cells, at least one memory cell, which is arranged adjacent to the memory cell to be programmed, is driven to shield the memory cell to be programmed.08-13-2009
20090086543Highly Compact Non-Volatile Memory And Method Thereof - A non-volatile memory device capable of reading and writing a large number of memory cells with multiple read/write circuits in parallel has an architecture that reduces redundancy in the multiple read/write circuits to a minimum. The multiple read/write circuits are organized into a bank of similar stacks of components. In one aspect, each stack of components has individual components factorizing out their common subcomponents that do not require parallel usage and sharing them as a common component serially. Other aspects, include serial bus communication between the different components, compact I/O enabled data latches associated with the multiple read/write circuits, and an architecture that allows reading and programming of a contiguous row of memory cells or a segment thereof. The various aspects combined to achieve high performance, high accuracy and high compactness.04-02-2009
20090207662Multi-Transistor Non-Volatile Memory Element - The present disclosure provides a multi-transistor element including a substrate, a first floating gate disposed on the substrate, a second floating gate disposed on the substrate and coupled to the first floating gate, and a first active region disposed in the substrate and coupled to the first and second floating gates.08-20-2009
20090097320Memory Cells, Electronic Systems, Methods Of Forming Memory Cells, And Methods of Programming Memory Cells - Some embodiments include memory cells having vertically-stacked charge-trapping zones spaced from one another by dielectric material. The dielectric material may comprise high-k material. One or more of the charge-trapping zones may comprise metallic material. Such metallic material may be present as a plurality of discrete isolated islands, such as nanodots. Some embodiments include methods of forming memory cells in which two charge-trapping zones are formed over tunnel dielectric, with the zones being vertically displaced relative to one another, and with the zone closest to the tunnel dielectric having deeper traps than the other zone. Some embodiments include electronic systems comprising memory cells. Some embodiments include methods of programming memory cells having vertically-stacked charge-trapping zones.04-16-2009
20090251970SEMICONDUCTOR DEVICE AND CONTROL METHOD THEREOF - A semiconductor device in accordance with one embodiment of the invention can include a first data storage region including a non-volatile main data storage region. Additionally, the semiconductor device can include a second data storage region including a non-volatile reference region wherein an erasing operation and a writing operation are performed on both the first data storage region and the second data storage region. Moreover, the semiconductor device can also include a control unit coupled to the first and second data storage regions which determines a stress condition corresponding to the first data storage region based on a stress information related to the second data storage region.10-08-2009
20100177567NONVOLATILE SEMICONDUCTOR MEMORY DEVICE WHICH CAN ELECTRICALLY REWRITE DATA AND SYSTEM THEREFOR - A nonvolatile semiconductor memory device includes a memory cell, latch circuits, and an arithmetic operation circuit. The memory cell stores data by a difference in threshold voltage. A read operation is performed twice or more on the memory cell under the same read conditions, and the latch circuits store a plurality of read data. The arithmetic operation circuit takes majority decision of the plurality of data stored in the latch circuits and decides data determined by the majority decision as data stored in the memory cell.07-15-2010
20090129166METHOD, CIRCUIT AND SYSTEM FOR SENSING A CELL IN A NON-VOLATILE MEMORY ARRAY - Disclosed is a method, circuit and system for evaluating the status of a data storage area in a non-volatile memory cell within a non-volatile memory cell array. According to some embodiments of the present invention, leakage current in at least one other cell in proximity with the cell being evaluated is suppressed. Leakage current suppression may be achieved by applying a suppression voltage to the word of the cell(s) whose leakage current(s) are to be suppressed.05-21-2009
20100157683APPARATUS AND METHOD FOR REDUCED PEAK POWER CONSUMPTION DURING COMMON OPERATION OF MULTI-NAND FLASH MEMORY DEVICES - System and method for executing a global memory command in a multi-chip non-volatile memory device having a plurality of non-volatile memories. The global memory command is received at each non-volatile memory concurrently. The memory command is initiated at different times relative to receiving the global memory command for at least two of the plurality of non-volatile memory to mitigate peak power consumption.06-24-2010
20090316485MEMORY CARD USING MULTI-LEVEL SIGNALING AND MEMORY SYSTEM HAVING THE SAME - A memory card including a memory controller, a memory system and a method to control a memory are provided. The memory card includes a flash memory, a memory interface outputting a writing data signal to be written into the flash memory, and a multi-level converter transforming the writing data signal into a writing voltage signal to be provided to the flash memory. The writing voltage signal has one of different voltage levels in accordance with plural bits of the writing data signal.12-24-2009
20090122615NON-VOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME - Program voltages of a non-volatile memory device are controlled variably according to a program/erase operation count. The non-volatile memory device includes a program voltage supply unit for applying a program voltage to a memory cell, a program/erase count storage unit for storing a total program/erase operation count of the non-volatile memory device, a program start voltage storage unit for storing levels of program start voltages to be differently supplied according to the program/erase operation count, and a program voltage controller for controlling the program start voltage according to the program/erase operation count.05-14-2009
20100149876Reverse Reading In Non-Volatile Memory With Compensation For Coupling - Shifts in the apparent charge stored by a charge storage region such as a floating gate in a non-volatile memory cell can occur because of electrical field coupling based on charge stored in adjacent (or other) charge storage regions. Although not exclusively, the effects are most pronounced in situations where adjacent memory cells are programmed after a selected memory cell. To account for the shift in apparent charge, one or more compensations are applied when reading storage elements of a selected word line based on the charge stored by storage elements of other word lines. Efficient compensation techniques are provided by reverse reading blocks (or portions thereof) of memory cells. By reading in the opposite direction of programming, the information needed to apply (or select the results of) an appropriate compensation when reading a selected cell is determined during the actual read operation for the adjacent word line rather than dedicating a read operation to determine the information.06-17-2010
20090185425Integrated Circuit Having a Memory Cell Arrangement and Method for Reading a Memory Cell State Using a Plurality of Partial Readings - Embodiments of the invention relate generally to an integrated circuit having a memory cell arrangement and a method for reading a memory cell state using a plurality of partial readings. In an embodiment of the invention, an integrated circuit having a memory cell arrangement is provided. The memory cell arrangement may include at least one memory cell, the memory cell being capable of storing a plurality of memory cell states being distinguishable by a predefined number of memory cell threshold values, and a controller configured to read a memory cell state of the at least one memory cell using a number of reference levels that is higher than the predefined number of memory cell threshold values, wherein the reading includes a first partial reading using a first set of a plurality of reference levels and a second partial reading using a second set of a plurality of reference levels, wherein the second set of a plurality of reference levels includes at least one reference level which is different from the reference levels of the first set of a plurality of reference levels.07-23-2009
20100157680SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor region, a tunnel insulating film formed on the semiconductor region, a charge-storage insulating film formed on the tunnel insulating film, a block insulating film formed on the charge-storage insulating film, and a control gate electrode formed on the block insulating film, wherein the tunnel insulating film comprises a first region which is formed on a surface of the semiconductor region and contains silicon and oxygen, a second region which contains silicon and nitrogen, a third region which is formed on a back surface of the charge-storage insulating film and contains silicon and oxygen, and an insulating region which is formed at least between the first region and the second region or between the second region and the third region, and contains silicon and nitrogen and oxygen and the second region is formed between the first region and the third region.06-24-2010
20100157679MONITOR STRUCTURE FOR MONITORING A CHANGE OF A MEMORY CONTENT - A monitor structure for monitoring a change of a memory content in a memory field of a non-volatile memory comprising a reference transistor in the memory field and a monitor transistor. The monitor transistor and the reference transistor comprise a common floating gate. Moreover, the memory field is arranged in a first well, and the monitor transistor in a second well. The first well and the second well are of different doping types.06-24-2010
20090052254Non-Volatile Semiconductor Memory - A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range. In the caching operation mode, data transfer between one of the memory cells selected in accordance with a first address and the first latch is performed while data transfer is performed between the second latch and input/output terminals in accordance with a second address with respect to one-bit two-level data to be stored in one of the memory cells.02-26-2009
20120140560METHOD AND MEMORY CONTROLLER FOR READING DATA STORED IN FLASH MEMORY BY REFERRING TO BINARY DIGIT DISTRIBUTION CHARACTERISTICS OF BIT SEQUENCES READ FROM FLASH MEMORY - An exemplary method for reading data stored in a flash memory includes: controlling the flash memory to perform a plurality of read operations upon each of a plurality of memory cells included in the flash memory; obtaining a plurality of bit sequences read from the memory cells, respectively, wherein the read operations read bits of a predetermined bit order from each of the memory cells as one of the bit sequences by utilizing different control gate voltage settings; and determining readout information of the memory cells according to binary digit distribution characteristics of the bit sequences.06-07-2012
20100002520METHOD FOR PROGRAMMING A FLASH MEMORY DEVICE - A method for programming a flash memory device includes applying a program bias to a memory cell of a plurality of memory cells within a memory cell string. Each memory cell string comprises a source select line, a plurality of memory cells and a drain select line. A first pass bias is applied to at least one of the memory cells in a source select line direction relative to the memory cell to which the program bias has been applied. A second pass bias is applied to the memory cells in a drain select line direction relative the memory cell(s) to which the first pass bias has been applied.01-07-2010
20100002518Flash memory device and programming method thereof - The flash memory device includes a memory cell array having a plurality of memory cells, a high voltage generator configured to generate a plurality of pass voltages, with a first pass voltage of the plurality of pass voltages supplied to the memory cell array during a programming operation; and a main controller including a voltage controller configured to shift the first pass voltage at a plurality of time intervals during the programming operation.01-07-2010
20100002517SEMICONDUCTOR DEVICE AND METHOD FOR CONTROLLING - A semiconductor device is disclosed. The semiconductor device includes a plurality of memory cells that are provided in a matrix and that have a charge storage layer made of an insulating film that is provided on a semiconductor substrate and a plurality of word lines that are provided on the charge storage layer. A plurality of memory cells that are arranged in a single line among the plurality of memory cells arranged in the matrix are coupled to the same word line. The semiconductor device further includes an application section that when reading data from a selected memory cell selected from the plurality of memory cells, applies a voltage to a selected word line to be coupled to the selected memory cell among the plurality of word lines. The application section applies a voltage that has a polarity that is opposite to the voltage applied to the selected word line to non-selected word lines arranged on both adjacent sides of the selected word line.01-07-2010
20090290421FLASH MEMORY DEVICE AND METHOD OF PROGRAMMING THE SAME - A flash memory device and a method of programming the same are disclosed. The flash memory device includes an array of memory cells intersected by a plurality of bit lines and a plurality of word lines. A page buffer circuit includes a plurality of latches coupled to an even virtual bit line and an odd virtual bitline. The page buffer circuit is configured to load data into the array of memory cells responsive to a select circuit, which is structured to electrically couple at least some of the bit lines to the plurality of latches of the page buffer circuit.11-26-2009
20100182838FLASH MEMORY DEVICE WITH DATA OUTPUT CONTROL - An apparatus, system, and computer-implemented method for controlling data transfer between a plurality of serial data link interfaces and a plurality of memory banks in a semiconductor memory is disclosed. In one example, a flash memory device with multiple links and memory banks, where the links are independent of the banks, is disclosed. The flash memory devices may be cascaded in a daisy-chain configuration using echo signal lines to serially communicate between memory devices. In addition, a virtual multiple link configuration is described wherein a single link is used to emulate multiple links.07-22-2010
20100188901Three-Terminal Single Poly NMOS Non-Volatile Memory Cell - A three terminal non-volatile memory (NVM) cell for a CMOS IC is formed by a standard CMOS process flow. The NVM cell includes two transistors that share a common floating gate. The floating gate includes a first portion disposed over the channel region of the first (NMOS) transistor, a second portion disposed over the channel region of the second (NMOS or PMOS) transistor, and a third portion extending into an enlarged drain diffusion area away from the channel regions, whereby the gate-to-drain capacitance is higher than the gate-to-source capacitances. A pocket implant or CMOS standard LV N-LDD is formed under the second transistor to enhance CHE programming. Both HV LDD and LV LDD implants are introduced together enabling LDD implant merging under the floating gate extension. The floating gate is formed using substantially T-shaped, C-shaped, U-shaped, Y-shaped or O-shaped polysilicon structures. Various array addressing schemes are disclosed.07-29-2010
20100165736FLASH MEMORY DEVICE AND MANUFACTURING METHOD OF THE SAME - A flash memory device and a method for manufacturing the same are provided. The flash memory device can include first and second memory gates on a substrate, an oxide layer on sides of and on the substrate outside of the first and second memory gates, a source poly contact between the first and second memory gates, first and second select gates outside the first and second memory gates, a drain region outside the first and second select gates, and a metal contact on the drain region and the source poly contact.07-01-2010
20090296482Non-volatile memory device and method of operation therefor - In one embodiment, the non-volatile memory device includes a plurality of normal memory cells, and at least one flag memory cell associated with one of the plurality of normal memory cells. A normal page buffer is configured to store data read from one of the plurality of normal memory cells. The normal page buffer includes a main latch storing the read data. A control circuit is configured to selectively change data stored in the main latch during a read operation based on a state of the flag memory cell.12-03-2009
20100157684FLASH MEMORY PROGRAM INHIBIT SCHEME - A method for minimizing program disturb in Flash memories. To reduce program disturb in a NAND Flash memory cell string where no programming from the erased state is desired, a local boosted channel inhibit scheme is used. In the local boosted channel inhibit scheme, the selected memory cell in a NAND string where no programming is desired, is decoupled from the other cells in the NAND string. This allows the channel of the decoupled cell to be locally boosted to a voltage level sufficient for inhibiting F-N tunneling when the corresponding wordline is raised to a programming voltage. Due to the high boosting efficiency, the pass voltage applied to the gates of the remaining memory cells in the NAND string can be reduced relative to prior art schemes, thereby minimizing program disturb while allowing for random page programming.06-24-2010
20100238735NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - In a nonvolatile semiconductor memory device storing data by accumulating charges in a floating gate, memory units, each of which includes a first MOS transistor as a read device, a bit cell composed of a first capacitor as a capacitance coupling device and a second capacitor as an erase device, and a decode device including a second MOS transistor and a third MOS transistor, are arranged in array. This attains nonvolatile memory capable of bit by bit selective erase arranged in array to thus reduce the core area remarkably.09-23-2010
20090003073Rd Algorithm Improvement for Nrom Technology - Selecting a read voltage level for a NVM cell by using an initial value for the read voltage and performing a read operation, comparing an actual number of bits found to an expected number of bits and, if there is a discrepancy between the actual number and the expected number, adjusting the read voltage level, based on variable data such as statistics available, level occupation, neighbor level, previous chunks data, and other data used during read, program or erase. For example, based on a number of missing bits, or upon a result of a previous read operation, or a result obtained at another program level, or upon how many times the memory cell has been cycled, or upon how many memory cells are at each program level, or on a number of bits at another program level in a selected chunk of memory.01-01-2009
20110110160AREA-EFFICIENT ELECTRICALLY ERASABLE PROGRAMMABLE MEMORY CELL - Electrically erasable programmable “read-only” memory (EEPROM) cells in an integrated circuit, and formed by a single polysilicon level. The EEPROM cell consists of a coupling capacitor and a combined read transistor and tunneling capacitor. The capacitance of the coupling capacitor is much larger than that of the tunneling capacitor. In one embodiment, field oxide isolation structures isolate the devices from one another; a lightly-doped region at the source of the read transistor improves breakdown voltage performance. In another embodiment, trench isolation structures and a buried oxide layer surround the well regions at which the coupling capacitor and combined read transistor and tunneling capacitor are formed.05-12-2011
20100246269NONVOLATILE MEMORY AND METHODS FOR MANUFACTURING THE SAME WITH MOLECULE-ENGINEERED TUNNELING BARRIERS - Embodiments of tunneling barriers and methods for same can embed modules exhibiting a monodispersion characteristic into a dielectric layer (e.g., between first and second layers forming a dielectric layer). In one embodiment, by embedding C09-30-2010
20090251969ANALOG READ AND WRITE PATHS IN A SOLID STATE MEMORY DEVICE - A memory array in a memory device is coupled to an analog I/O data interface that enables analog voltage levels to be written to the memory array. The I/O interface is comprised of a plurality of analog data paths that each includes a capacitor for storing charge corresponding to a target voltage to which a selected memory cell, coupled to its respective data path, is to be programmed. A plurality of comparators can be included in the I/O interface, with each such comparator coupled to a respective bit line. Such a comparator can compare a threshold voltage of a selected memory cell to its target voltage and inhibits further programming when the threshold voltage equals or exceeds the target voltage.10-08-2009
20120195126CELL OPERATION MONITORING - Memory devices adapted to process and generate analog data signals representative of data values of two or more bits of information facilitate increases in data transfer rates relative to devices processing and generating only binary data signals indicative of individual bits. Programming of such memory devices includes programming to a target threshold voltage range representative of the desired bit pattern. Reading such memory devices includes generating an analog data signal indicative of a threshold voltage of a target memory cell. Atypical cell, block, string, column, row, etc. . . . operation is monitored and locations and type of atypical operation stored. Adjustment of operation is performed based upon the atypical cell operation.08-02-2012
20120243319NONVOLATILE SEMICONDCUTOR MEMORY DEVICE, IC CARD AND PORTABLE APPARATUS - According to one embodiment, a nonvolatile semiconductor memory device includes a first nonvolatile memory, and a voltage generation circuit configured to apply a voltage to the first nonvolatile memory, the voltage generation circuit includes a charge pump and an oscillator configured to generate a clock to be used to operate the charge pump. The voltage generation circuit changes a frequency of the clock.09-27-2012
20120243321SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, there is provided a semiconductor memory device including a memory cell array, a storage unit, a selection unit, a startup processing unit, and an operation control unit. The memory cell array includes memory cells. The storage unit stores a plurality of operating parameters. The selection unit accesses the storage unit and selects a first operating parameter for operating the memory cells from among the plurality of operating parameters stored in the storage unit, based on a first instruction input. The startup processing unit performs a power startup and reads out the first operating parameter from the storage unit and sets the first operating parameter so as to be ready for use, based on a second instruction input. The operation control unit uses the first operating parameter set by the startup processing unit in order to operate the memory cells.09-27-2012
20090323427SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device is provided which can achieve high performance, such as an improvement in reliability, an improvement in yield, and the like, without increasing the chip area. The semiconductor memory device is a non-volatile semiconductor memory device operable to program and erase data, and hold the data in the absence of a supplied voltage, comprising a memory cell including a first charge localized portion and a second charge localized portion each operable to store static charge corresponding to the data. The second charge localized portion stores static charge corresponding to static charge which should be stored in the first charge localized portion, thereby serving as a backup to the first charge localized portion.12-31-2009
20090168539Semiconductor integrated circuit and unstable bit detection method for the same - A semiconductor integrated circuit including a nonvolatile memory cell is provided with a detection/word line voltage control circuit for sequentially supplying two or more mutually different unstable bit detecting voltages to a control gate of the nonvolatile memory cell to cause the nonvolatile memory cell to output a plurality of pieces of readout data, and an OK/NG determination circuit for comparing the plurality of pieces of readout data to determine whether the nonvolatile memory cell is stable or not.07-02-2009
20090135652Method for Extracting the Distribution of Charge Stored in a Semiconductor Device - The invention relates to a method for determining a set of programming conditions for a given type of charge-trapping non-volatile memory device, comprising the steps of: (a) selecting different sets of programming parameters to be applied to the corresponding number of non-volatile memory devices of said type, (b) programming said number of non-volatile memory devices by means of the sets of programming parameters, (c) determining an actual spatial charge distribution of the charge trapping layer of each of the programmed devices, (d) determining the influence of at least one of the programming parameters on the spatial charge distribution, (e) determining an optimised value for at least one of the programming parameters, (f) entering each optimised value in said sets of programming parameters and repeating steps b) to e) at least once.05-28-2009
20130128671FLASH MEMORY DEVICE AND PROGRAM METHOD - Disclosed is a flash memory device and programming method that includes; receiving buffer data and determining between a high-speed mode and a reliability mode for buffer data, and upon determining the reliability mode storing the buffer data in a first buffer region, and upon determining the high-speed mode storing the buffer data in a second buffer region. The memory cell array of the flash memory including a main region and a separately designated buffer region divided into the first buffer region and second buffer region.05-23-2013
20090109758NONVOLATILE MEMORY ARRAY PARTITIONING ARCHITECTURE AND METHOD TO UTILIZE SINGLE LEVEL CELLS AND MULTI LEVEL CELLS WITHIN SAID ARCHITECTURE - A system comprising a program component that programs one or more non-volatile memory (“NVM”) cells of an array of pairs of NVM cells using FN tunneling, an erase component that erases the one or more NVM cells of the array of pairs of NVM cells using FN tunneling, and a read component that reads the one or more NVM cells of the array of pairs of NVM cells.04-30-2009
20080291733LOADING DATA WITH ERROR DETECTION IN A POWER ON SEQUENCE OF FLASH MEMORY DEVICE - A semiconductor device is provided to have two groups of nonvolatile memory cells, two groups of data registers and a compare circuit. Each of the two groups of the nonvolatile memory cells stores a set of predetermined data and a set of complementary data respectively. The two groups of data registers are respectively connected to the two groups of the nonvolatile memory cells. The compare circuit is connected to the two groups of the data registers, for performing a comparison to generate a compare result.11-27-2008
20080291734NONVOLATILE MEMORY DEVICES AND METHODS OF CONTROLLING THE WORDLINE VOLTAGE OF THE SAME - A nonvolatile memory device includes an array of memory cells arranged in rows and columns, the array of memory cells having wordlines associated therewith. A wordline voltage controller determines the levels of wordline voltages to be supplied to the respective wordlines and a wordline voltage generator generates the wordline voltages at the determined levels. Related methods are also provided.11-27-2008
20100296340NANOTUBE MEMORY CELL WITH FLOATING GATE BASED ON PASSIVATED NANOPARTICLES AND MANUFACTURING PROCESS THEREOF - A method for manufacturing a nanotube non-volatile memory cell is proposed. The method includes the steps of: forming a source electrode and a drain electrode, forming a nanotube implementing a conduction channel between the source electrode and the drain electrode, forming an insulated floating gate for storing electric charges by passivating conductive nanoparticles with passivation molecules and arranging a disposition of passivated conductive nanoparticles on the nanotube, the conductive nanoparticles being adapted to store the electric charges and being insulated by the passivation molecules from the nanotube, and forming a control gate coupled with the channel.11-25-2010
20100296341SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING SAME - The disclosure of this application enhances the data writing speed of an electrically erasable and writable semiconductor memory. In a semiconductor storage device of this application, at a time of writing data, when a positive voltage lower than a voltage at control gate 11-25-2010
20130135936MEMORY CONTROLLER SELF-CALIBRATION FOR REMOVING SYSTEMIC INFLUENCE - Self-calibration for a memory controller is performed by writing a voltage to a selected cell. Adjacent cells around the selected cell are programmed. After each of the adjacent programming operations, the voltage on the selected cell is read to determine any change in voltage caused by systemic offsets such as, for example, floating gate-to-floating gate coupling. These changes are averaged and stored in a table as an offset for use in adjusting a programming voltage or a read voltage in a particular area of memory represented by the offset. Self calibration method for temperature is determined by writing cells at different temperatures and reading at different temperatures to generate temperature offset tables for the write path and read path. These offset tables are used to adjust for systematic temperature related offsets during programming and during read.05-30-2013
20100302854Area-Efficient Electrically Erasable Programmable Memory Cell - Electrically erasable programmable “read-only” memory (EEPROM) cells in an integrated circuit, and formed by a single polysilicon level. The EEPROM cell consists of a coupling capacitor and a combined read transistor and tunneling capacitor. The capacitance of the coupling capacitor is much larger than that of the tunneling capacitor. In one embodiment, field oxide isolation structures isolate the devices from one another; a lightly-doped region at the source of the read transistor improves breakdown voltage performance. In another embodiment, trench isolation structures and a buried oxide layer surround the well regions at which the coupling capacitor and combined read transistor and tunneling capacitor are formed.12-02-2010
20100302856NONVOLATILE MEMORY DEVICE AND METHOD OF PROGRAMMING AND READING THE SAME - A nonvolatile memory device includes a control circuit configured to generate a control signal by counting a number of first data among input data, a buffer unit configured to temporarily store the input data, invert the input data in response to the control signal, and store the inverted data or the input data as the program data, and a memory cell block configured to receive and store the program data.12-02-2010
20100302855MEMORY DEVICE AND METHODS FOR FABRICATING AND OPERATING THE SAME - The memory device is described, which includes a substrate, a conductive layer, a plurality of charge storage layers and a plurality of doped regions. The substrate has a plurality of trenches formed therein. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layers are disposed between the substrate and the conductive layer in the trenches respectively, wherein the charge storage layers are separated from each other. The doped regions are configured in the substrate under bottoms of the trenches, respectively.12-02-2010
20110122700RELAXED METAL PITCH MEMORY ARCHITECTURES - A relaxed metal pitch architecture may include a bit line and a first active area string and a second active area string. The bit line may be directly coupled to the first active area string and to the second active area string. The relaxed metal pitch architecture may be applied to a non-volatile memory structure.05-26-2011
20110122698SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to an embodiment of the present invention includes a substrate, a gate insulator formed on the substrate and serving as an F-N (Fowler-Nordheim) tunneling film, a first floating gate formed on the gate insulator, a first intergate insulator formed on the first floating gate and serving as an F-N tunneling film, a second floating gate formed on the first intergate insulator, a second intergate insulator formed on the second floating gate and serving as a charge blocking film, and a control gate formed on the second intergate insulator.05-26-2011
20130141981MEMORY DEVICE AND METHOD HAVING CHARGE LEVEL ASSIGNMENTS SELECTED TO MINIMIZE SIGNAL COUPLING - A non-volatile memory device programs memory cells in each row in a manner that minimizes the coupling of spurious signals. A control logic unit programs the cells in a row using a set of bit state assignments chosen by evaluating data that are to be written to the cells in the row. The control logic unit performs this evaluation by determining the number of cells in the row that will be programmed to each of a plurality of bit states corresponding to the write data. The control logic unit then selects a set of bit state assignments that will cause the programming level assigned to each bit state to be inversely proportional to the number of memory cells in the row that are programmed with the bit state. The selected set of bit states is then used to program the memory cells in the row.06-06-2013
20100322008NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array including regular memory cells and permanent memory cells and a control circuit. The regular memory cells are capable of switching between a first data storage state and a second data storage state. The permanent memory cells are fixed in a third data storage state that is read as the same logic level data as the first storage state. Data is stored in at least one of the regular memory cells and at least one of the permanent memory cells. The control circuit rewrites at least one of the regular memory cells from the second data storage state to the first data storage state at the time of data holding. The control circuit performs a reading operation after rewriting the regular memory cells from the first data storage state to the second data storage state.12-23-2010
20100322009SEMICONDUCTOR MEMORY DEVICE INCLUDING CHARGE ACCUMULATION LAYER - According to one embodiment, a semiconductor memory device includes a semiconductor substrate, memory cells without a source region and a drain region, and a first insulating film. The memory cells are arranged adjacent to one another on the semiconductor substrate and include a first gate electrode including a charge accumulation layer. A current path functioning as a source region or a drain region of a selected memory cell is formed in the semiconductor substrate when a voltage is applied to the first gate electrode of one of unselected memory cells. The first insulating film is formed on the semiconductor substrate to fill a region between the first gate electrodes of the memory cells adjacent to each other.12-23-2010
20100322007FLASH MEMORY DEVICE AND METHOD OF READING DATA - A flash memory device and method of reading data are disclosed. The method includes; performing a test read operation directed to test data stored in a memory cell array of the flash memory device by iteratively applying a sequence of test read retry operations, wherein each successive test read retry operation uses a respectively higher test read voltage level than a preceding test read retry operation, until one test read retry operation in the sequence of test read retry operations successfully reads the test data using a minimum test read retry voltage associated with the one test read retry operation, setting an initial read voltage for the flash memory device equal to the minimum test read retry voltage, and thereafter performing a normal read operation directed to user data stored in the memory cell array by iteratively applying a sequence of read retry operations, wherein an initial read12-23-2010
20110242894METHOD AND SYSTEM TO ISOLATE MEMORY MODULES IN A SOLID STATE DRIVE - A method and system to facilitate the usage of memory modules that have one or more defective memory dies. In one embodiment of the invention, a memory module is packaged with a number of dies and the memory module is tested and sorted according to the number of dies that pass testing. Each signal of each die in the memory module has an unique bond-out or connection point in the package of the memory module. By separating the signals of each die in the memory module, any defective die can be easily isolated and this allows a significant cost reduction in products that use a large number of dies.10-06-2011
20110026329SEMICONDUCTOR DEVICE USING CHARGE PUMP CIRCUIT - A semiconductor device including a plurality of capacitance units connected in parallel between a first voltage and a second voltage. Each of the plurality of capacitance units includes: a capacitance element connected with the first voltage; and a capacitance disconnecting circuit connected between the second voltage and the capacitance element. The capacitance disconnecting circuit includes a non-volatile memory cell with a threshold voltage changed based on a change of a leakage current which flows from the capacitance element, and blocks off the leakage current based on a rise of the threshold voltage of the non-volatile memory cell when the leakage current exceeds a predetermined value.02-03-2011
20130148428Non-volatile Memory Device And A Method Of Programming Such Device - A non-volatile memory device has a charge pump for providing a programming current and an array of non-volatile memory cells. Each memory cell of the array is programmed by the programming current from the charge pump. The array of non-volatile memory cells is partitioned into a plurality of units, with each unit comprising a plurality of memory cells. An indicator memory cell is associated with each unit of non-volatile memory cells. A programming circuit programs the memory cells of each unit using the programming current, when fifty percent or less of the memory cells of each unit is to be programmed, and programs the inverse of the memory cells of each unit and the indicator memory cell associated with each unit, using the programming current, when more than fifty percent of the memory cells of each unit is to be programmed.06-13-2013
20130148429MEMORY DEVICE, METHOD OF PERFORMING READ OR WRITE OPERATION AND MEMORY SYSTEM INCLUDING THE SAME - Provided is a memory device having a first switch configured to receive a first CSL signal to input or output data. A second switch is configured to receive a second CSL signal. A sensing and latch circuit (SLC) is coupled between the first and second switches. And at least one memory cell is coupled to the second switch. The second switch is configured to control timing of read or write operations of the at least one memory cell in response to the second CSL signal, e.g., where a read operation can be performed in not more than about 5 ns. The SLC operates as a latch in a write mode and as an amplifier in a read mode. The memory device may comprise part of a memory system or other apparatus including such memory device or system. Methods of performing read and write operations using such memory device are also provided.06-13-2013
20130148431ON-CHIP MEMORY TESTING - An integrated circuit is described that has a substrate with a memory array with dedicated support hardware formed on the substrate. An access wrapper circuit is coupled to address and data lines of the memory array and to control lines of the dedicated support hardware. The wrapper circuit is configured to provide an access port to the memory array. A test controller is formed on the substrate and coupled in parallel with the access wrapper circuit to the address and data lines of the memory array and to the control lines of the dedicated support hardware, wherein the test controller is operable to perform a test of the memory array by manipulating control signals to the support hardware in addition to those required to write data patterns into the memory array and to read the contents of the memory array.06-13-2013
20090067250MEMORY DEVICES WITH PAGE BUFFER HAVING DUAL REGISTERS AND METHOD OF USING THE SAME - A nonvolatile memory device and programming method and apparatus therefore are described that include operatively coupled first and second sense amplifiers having first and second data registers or latches, a storage circuit for storing a data of the second amplifier, a pass/fail check circuit for checking the content of the second data register whether a cell of the memory device has been sufficiently programmed and a restore circuit for resetting the second data register for reprogramming the device until sufficiently programmed.03-12-2009
20090067248PROGRAM METHOD OF FLASH MEMORY DEVICE - In a program method of a flash memory device where memory cells within a string are turned on to electrically connect channel regions, all of the channel regions within a second string are precharged uniformly by applying a ground voltage to a first bit line connected to a first string including to-be-programmed cells and a program-inhibited voltage to a second bit line connected to the second string including program-inhibited cells. If a program operation is executed, channel boosting occurs in the channel regions within the second string including the program-inhibited cells. Accordingly, a channel boosting potential can be increased and a program disturbance phenomenon, in which the threshold voltage of program-inhibited cells is changed, can be prevented.03-12-2009
20110026330PROGRAM METHOD OF FLASH MEMORY DEVICE - In a program method of a flash memory device where memory cells within a string are turned on to electrically connect channel regions, all of the channel regions within a second string are precharged uniformly by applying a ground voltage to a first bit line connected to a first string including to-be-programmed cells and a program-inhibited voltage to a second bit line connected to the second string including program-inhibited cells. If a program operation is executed, channel boosting occurs in the channel regions within the second string including the program-inhibited cells. Accordingly, a channel boosting potential can be increased and a program disturbance phenomenon, in which the threshold voltage of program-inhibited cells is changed, can be prevented.02-03-2011
20110019481TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for biasing a direct injection semiconductor memory device including the steps of applying a first non-negative voltage potential to a first region via a bit line and applying a second non-negative voltage potential to a second region via a source line. The method may also include applying a third voltage potential to a word line, wherein the word line may be spaced apart from and capacitively to a body region that may be electrically floating and disposed between the first region and the second region. The method may further include applying a fourth positive voltage potential to a third region via a carrier injection line, wherein the third region may be disposed below at least one of the first region, the body region, and the second region.01-27-2011
20110019479TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region coupled to a source line, a second region coupled to a bit line. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region coupled to a carrier injection line configured to inject charges into the body region through the second region.01-27-2011
20110026328SYSTEM AND METHOD OF MAINTAINING DATA INTEGRITY IN A FLASH STORAGE DEVICE - A flash storage device includes a power hold circuit including a double layer capacitor. A power source supplies power to the flash storage device and charges the double layer capacitor. The double layer capacitor supplies power for maintaining integrity of data during a data transfer occurring in the flash storage device when the power supplied by the power source is disrupted. Additionally, the flash storage device can inhibit subsequent data transfers until the power supplied by the power source is restored.02-03-2011
20100157682METHOD OF ENHANCING CHARGE STORAGE IN AN E2PROM CELL - A method is provided for enhancing charge storage in an E06-24-2010
20110044112SEMICONDUCTOR DEVICE - A semiconductor device includes a first memory cell which includes a first memory transistor and a first selector transistor. The semiconductor device further includes a second memory cell which includes a second memory transistor and a second selector transistor. The semiconductor device further includes a first word line electrically coupled to a gate electrode of the first memory transistor and to a gate electrode of the second selector transistor, and a second word line electrically coupled to a gate electrode of the second memory transistor and to a gate electrode of the first selector transistor. The semiconductor device further includes a first source line electrically coupled to a source region of the first memory transistor and to a source region of the second memory transistor.02-24-2011
20100172184Asymmetric Single Poly NMOS Non-Volatile Memory Cell - An asymmetric non-volatile memory (NVM) cell for a CMOS IC formed by a standard CMOS process flow used to form both low voltage and high voltage transistors on a substrate. The NVM cell includes an NMOS floating gate transistor and an optional select transistor. The floating gate transistor includes an elongated floating gate having a first portion disposed over the channel region C07-08-2010
20090034337METHOD, APPARATUS, AND SYSTEM FOR IMPROVED READ OPERATION IN MEMORY - Various embodiments include methods, apparatus, and systems for reading an adjacent cell of a memory array in an electronic device to determine a threshold voltage value of the adjacent cell, the adjacent cell being adjacent a target cell, and reading the target cell of the memory array using a wordline voltage value based on the threshold voltage value of the adjacent cell. Additional apparatus, systems, and methods are disclosed.02-05-2009
20110242896SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor device includes a booster circuit and a detector. The booster circuit is configured to boost an input voltage and output an output voltage, and the detector is configured to output the output voltage, which is output from the booster circuit, and control the booster circuit to generate a plurality of different voltages in accordance with an operating mode.10-06-2011
20110116319MEMORY ARRAY OF FLOATING GATE-BASED NON-VOLATILE MEMORY CELLS - A memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a high voltage access transistor, a floating gate memory transistor electrically connected to the access transistor, and a coupling capacitor electrically connected to the memory transistor. A first set of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A second set of word lines are each electrically connected to the access transistor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the access transistor in each of the memory cells in a respective column. A second set of bit lines are each electrically connected to the memory transistor in each of the memory cells in a respective column. Various combinations of voltages can be applied to the word lines and bit lines in operations to program, erase, read, or inhibit a logic state stored by the memory transistor in one or more of the memory cells.05-19-2011
20110116318MEMORY ARRAY OF FLOATING GATE-BASED NON-VOLATILE MEMORY CELLS - A memory array comprises a plurality of memory cells organized in a matrix of rows and columns. Each of the memory cells includes a high voltage access transistor, a floating gate memory transistor electrically connected to the access transistor, and a coupling capacitor electrically connected to the memory transistor. A first set of word lines are each electrically connected to the capacitor in each of the memory cells in a respective row. A second set of word lines are each electrically connected to the access transistor in each of the memory cells in a respective row. A first set of bit lines are each electrically connected to the access transistor in each of the memory cells in a respective column. A second set of bit lines are each electrically connected to the memory transistor in each of the memory cells in a respective column. Various combinations of voltages can be applied to the word lines and bit lines in operations to program, erase, read, or inhibit a logic state stored by the memory transistor in one or more of the memory cells.05-19-2011
20110019482TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. At least one of the plurality of memory cells may include a first region coupled to a respective bit line of the array and a second region coupled to a respective source line of the array. At least one of the plurality of memory cells may also include a body region spaced apart from and capacitively coupled to a respective word line of the array, wherein the body region may be electrically floating and disposed between the first region and the second region. At least one of the plurality of memory cells may further include a third region coupled to a respective carrier injection line of the array and wherein the respective carrier injection line may be one of a plurality of carrier injection lines in the array that are coupled to each other.01-27-2011
20100165734SYSTEM AND METHOD FOR DATA RECOVERY IN A DISABLED INTEGRATED CIRCUIT - Systems and methods for providing memory access circuitry in application specific integrated circuits, and in certain configurations for recovering data from non-volatile memory registers in a partially disabled application specific integrated circuit as provided. In one configuration, a virtual partial dual-port non-volatile memory is provided having a secondary partial read only port. In another configuration, a physical partial dual-port non-volatile memory is provided having a secondary partial read only port.07-01-2010
20110122699CONTROLLING A MEMORY DEVICE RESPONSIVE TO DEGRADATION - Embodiments of the present invention disclosed herein include devices, systems and methods, such as those directed to non-volatile memory devices and systems capable of determining a degradation parameter associated with one or more memory cells. Disclosed devices and systems according to embodiments of the present invention include those that utilize the degradation parameter to adjust control signals coupled to the memory cells.05-26-2011
20110242893NON-VOLATILE MEMORY UNIT CELL WITH IMPROVED SENSING MARGIN AND RELIABILITY - A non-volatile memory unit cell includes a first transistor pair and first and second control gates. The first transistor pair includes first and second transistors that are connected in series and of the same type. The first and second transistors have a first floating polysilicon gate and a second floating polysilicon gate, respectively. The first control gate is coupled to the first floating polysilicon gate through a tunneling junction and the second control gate is coupled to the second floating polysilicon gate through another tunneling junction.10-06-2011
20110141816Tracking Cells For A Memory System - Tracking cells are used in a memory system to improve the read process. The tracking cells can provide an indication of the quality of the data and can be used as part of a data recovery operation if there is an error. The tracking cells provide a means to adjust the read parameters to optimum levels in order to reflect the current conditions of the memory system. Read operations are performed on the tracking cells, where threshold voltages of physical states of the tracking cells are further apart than threshold voltages of physical states of non-tracking cells. Based on the read operations, an extent to which the tracking cells are errored is determined.06-16-2011
20120230109Method of Setting Trim Codes for a Flash Memory and Related Device - A flash memory device with auto-trimming functionality includes a memory cell array comprising first memory cells and a fuse sector, a read circuit for reading a memory state of the first memory cells, an offset circuit for outputting offset current values, and an auto-trimming circuit. The auto-trimming circuit has a register for storing a current characteristic, a current control module for modifying input current applied to a first memory cell under test at a first address according to the memory state, and updating the current characteristic to the modified input current, an address counter for starting application of the modified input current to a second memory cell at a second address for test when reading the first memory cell passes, and a programming circuit for programming the fuse sector according to the current characteristic and the offset current values.09-13-2012
20090323428METHOD FOR IMPROVING MEMORY DEVICE CYCLING ENDURANCE BY PROVIDING ADDITIONAL PULSES - A method for programming and erasing a PHINES memory device is comprising providing one or more additional pulses that are associated with a program or erase pulse, wherein the additional pulses are of similar polarity, but of lesser magnitude than the program or erase pulses. For an erase pulse on a PHINES memory device, two additional pulses can be utilized. For a program pulse on the source-side of a PHINES memory device, one additional pulse can be utilized that comprises a negative bias measured from a gate of the memory device to a source of the memory device. For a program pulse on the drain-side of a PHINES memory device, one additional pulse can be utilized that comprises a negative bias measured from a gate of the memory device to a drain of the memory device.12-31-2009
20090323423METHODS, CIRCUITS AND SYSTEMS FOR READING NON-VOLATILE MEMORY CELLS - The present invention includes methods, circuits and systems for reading non-volatile memory (“NVM”) cells, including multi-level NVM cells. According to some embodiments of the present invention, there may be provided a NVM cell threshold voltage detection circuit adapted to detect an approximate threshold voltage associated with a charge storage region of a NVM cell, where the NVM cell may be a single or a multi-charge storage region cell. A decoder circuit may be adapted to decode and/or indicate the logical state of a NVM cell charge storage region by mapping or converting a detected approximate threshold voltage of the charge storage region into a logical state value.12-31-2009
20090323424SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a plurality of memory cell transistors arranged in a matrix; a plurality of word lines commonly coupling the control gates of the plural memory cell transistors present in a identical first direction; a plurality of source lines commonly coupling the sources of the plural memory cell transistors present in the identical first direction; a plurality of bit lines commonly coupling the drains of the plural memory cell transistors present in a identical second direction intersecting the first direction; a first transistor having a drain coupled to the source line; a second transistor having a drain coupled to a source of the first transistor, a gate coupled to the word line and a source grounded; and a control line commonly coupling the gates of the plural first transistors.12-31-2009
20110211394FIELD EFFECT TRANSISTORS FOR A FLASH MEMORY COMPRISING A SELF-ALIGNED CHARGE STORAGE REGION - Storage transistors for flash memory areas in semiconductor devices may be provided on the basis of a self-aligned charge storage region. To this end, a floating spacer element may be provided in some illustrative embodiments, while, in other cases, the charge storage region may be efficiently embedded in the electrode material in a self-aligned manner during a replacement gate approach. Consequently, enhanced bit density may be achieved, since additional sophisticated lithography processes for patterning the charge storage region may no longer be required.09-01-2011
20110242895MEMORY DEVICE, MANUFACTURING METHOD FOR MEMORY DEVICE AND METHOD FOR DATA WRITING - A memory device to which an electron beam is irradiated to store data therein is provided. The memory device includes a plurality of floating electrodes that store data through irradiation of the electron beam thereto, a charge amount detecting section that detects data stored in each of the floating electrodes based on a charge amount accumulated in each of the floating electrode.10-06-2011
20110242897PROGRAM AND READ TRIM SETTING - A method and apparatus for setting trim parameters in a memory device provides multiple trim settings that are assigned to portions of the memory device according to observed or tested programming speed and reliability.10-06-2011
20090052253Memory device and method reducing fluctuation of read voltage generated during read while write operation - Provided is a device and method for reducing a fluctuation of a read voltage generated during a read while write (RWW) operation. A semiconductor memory device may include a write voltage generator configured to generate a write voltage to perform the write operation to at least one of a plurality of banks where the write voltage generator generates the write voltage to have a voltage level of a read voltage before the write operation changes to a read operation. The semiconductor device may also include a read voltage generator configured to generate a read voltage to perform the read operation to at least one of the other plurality of banks and/or a plurality of switches configured to switch a voltage applied to at least one of the banks to one of the write voltage and the read voltage in response to a plurality of control signals.02-26-2009
20100027344SEMICONDUCTOR MEMORY DEVICE - A drain voltage generator circuit includes a first switching element coupled between a first power supply voltage and an output end of the drain voltage generator circuit, a second switching element coupled in parallel to the first switching element and having a smaller current capability than that of the first switching element, and a control circuit for turning ON the second switching element and then the first switching element, and generates a voltage to supply to a drain of a memory cell. A source of the memory cell is set to be floated or grounded by a transistor.02-04-2010
20100046298Non-volatile semiconductor memory circuit - Provided is a non-volatile semiconductor memory circuit capable of improving data retention characteristics and decreasing an area thereof by connecting a constant current circuit (02-25-2010
20090323422GAIN CONTROL FOR READ OPERATIONS IN FLASH MEMORY - A technique for performing read operations with reduced errors in a memory device such as flash memory. An automatic gain control approach is used in which cells which have experienced data retention loss are read by a fine M-level quantizer which uses M-1 read threshold voltage levels. In one approach, M-quantized threshold voltage values are multiplied by a gain to obtain gain-adjusted threshold voltage values, which are quantized by an L-level quantizer, where L12-31-2009
20090323426SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a sense amplifier which senses identical multilevel data, which is stored in a memory cell, a plurality of number of times at a time of read, and a n-channel MOS transistor which has a current path one end of which is connected to the sense amplifier and the other end of which is connected to a bit line. The device further include a control unit which applies a first voltage to a gate electrode of the n-channel MOS transistor, thereby setting the n-channel MOS transistor in an ON state, and applies a second voltage which is higher than the first voltage, to the gate electrode during a period after first sense and before second sense.12-31-2009
20090323425SYSTEMS AND METHODS FOR IMPROVED FLOATING-GATE TRANSISTOR PROGRAMMING - The present invention describes systems and methods for improving the programming of floating-gate transistors. An exemplary embodiment of the present invention provides a floating-gate transistor programming system including an array of floating-gate transistors and a measuring circuit comprising a logarithmic transimpedance amplifier and an analog-to-digital converter. Furthermore, the floating-gate transistor programming system includes an injecting circuit comprising a digital-to-analog converter, wherein the pulsing circuit can inject charge into each of the floating-gate transistors and the measuring circuit can measure a present charge value in one of the plurality of floating-gate transistors.12-31-2009
20090016115TESTING NON-VOLATILE MEMORY DEVICES FOR CHARGE LEAKAGE - A method of and apparatus for testing a floating gate non-volatile memory semiconductor device comprising an array of cells including floating gates for storing data in the form of electrical charge. The method includes applying a test pattern of said electrical charge to the floating gates, exposing the device to energy to accelerate leakage of the electrical charges out of the cells, and subsequently comparing the remaining electrical charges in the cells to the test pattern. The energy is applied in the form of electromagnetic radiation of a wavelength such as to excite the charges in the floating gates to an energy level sufficient for accelerating charge loss from the floating gates of defective cells relative to charge loss from non-defective cells. The wavelength is preferably in the range of 440 to 560 nm.01-15-2009
20090016114CIRCUIT AND METHOD OF GENERATING HIGH VOLTAGE FOR PROGRAMMING OPERATION OF FLASH MEMORY DEVICE - Provided is a high voltage generator for a flash memory device including a voltage pumping unit configured to generate a high voltage in response to a pumping clock signal, a transistor having a gate coupled to the high voltage and a source coupled to a program voltage, a voltage distributor coupled to the drain of the transistor, the voltage distributor configured to generate a distributor voltage, and a pumping clock controller configured to compare the distributor voltage to a reference voltage and to generate the pumping clock signal when the high voltage is less than a voltage substantially equal to the program voltage plus the threshold voltage of the transistor.01-15-2009
20090016113NON-DIFFUSION JUNCTION SPLIT-GATE NONVOLATILE MEMORY CELLS AND ARRAYS, METHODS OF PROGRAMMING, ERASING, AND READING THEREOF, AND METHODS OF MANUFACTURE - Nonvolatile flash memory systems and methods are disclosed having a semiconductor substrate of a first conductivity type, including non-diffused channel regions through which electron flow is induced by application of voltage to associated gate elements. A plurality of floating gates are spaced apart from one another and each insulated from the channel region. A plurality of control gates are spaced apart from one another and insulated from the channel region, with each control gate being located between a first floating gate and a second floating gate and capacitively coupled thereto to form a subcell. A plurality of spaced-apart assist gates are insulated from the channel region, with each assist gate being located between and insulated from adjacent subcells. The channel is formed of three regions, two beneath adjacent control gate elements as well as a third region between the first two and beneath an associated assist gate.01-15-2009
20100054040METHOD OF PROGRAMMING AND SENSING MEMORY CELLS USING TRANSVERSE CHANNELS AND DEVICES EMPLOYING SAME - A first channel in the substrate underlying a trap gate is biased to cause trapping of holes or electrons in the trap gate and thereby program the memory device to a programmed state. A second channel in the substrate underlying the trap gate and transverse to the first channel is biased to sense the programmed state. For example, biasing a first channel in the substrate underlying the trap gate to cause trapping of holes or electrons in the trap gate and thereby program the memory device to a programmed state may include applying voltages to a first source/drain region and first gate on a first side of the trap gate and to a second source/drain region and a second gate on a second side of the trap gate, and biasing a second channel in the substrate underlying the trap gate and transverse to the first channel to sense the programmed state may include applying voltages to a third source/drain region on a third side of the trap gate and to a fourth source/drain region on a fourth side of the trap gate.03-04-2010
20100014355NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - In a nonvolatile memory cell, a selection transistor is connected to a memory cell transistor in series. The selection transistor is formed into a double layer gate structure, and has a voltage of each gate driven individually and separately. Using capacitive coupling between these stacked gate electrode layers of the selection transistor, a gate potential of the selection transistor is set to the predetermined voltage level. An absolute value of the voltage level generated by a voltage generator to the gates of the selection transistor can be made small, so that current consumption can be reduced and an layout area of the voltage generator can be reduced. Thus, a nonvolatile semiconductor memory device with a low current consumption and a small chip layout area is provided.01-21-2010
20100135081NONVOLATILE MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell array and a control circuit configured to control reading and programming operations for reading data from and inputting data to the memory cell array, respectively. The control circuit includes first and second units. The first unit is configured to count a number of bits having logic 0 or a number of bits having logic 1, to set a logic where the counted number is greater than n/2 as an initial state to regenerate programming data, and to perform a programming operation based on the regenerated data, when simultaneously programming the programming data of n bits input for a designated address. The second unit is configured to program a recognition bit for recognizing which of the logic 0 and the logic 1 the initial state of the memory cell of the designated address is in, when the programming operation is performed.06-03-2010
20090027970Programming based on controller performance requirements - Methods and solid state drives are disclosed, for example a solid state drive that is adapted to receive and transmit analog data signals representative of bit patterns of three or more levels (such as to facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits). Programming of the solid state drive, comprising an array of non-volatile memory cells, might include adjusting the level of each memory cell being programmed in response to a desired performance level of a controller circuit.01-29-2009
20110080787NON-VOLATILE MEMORY APPARATUS AND METHODS - Some embodiments include apparatus and methods having memory cells coupled in series and a module to cause an application of voltages with at least three different values to gates of the memory cells during an operation to retrieve information stored in at least one of the memory cells. Additional apparatus and methods are described.04-07-2011
20090213659FLASH MEMORY DEVICE AND FLASH MEMORY SYSTEM INCLUDING THE SAME - A flash memory device including: a memory cell array; a signal generator inputting a first data fetch signal and outputting a second data fetch signal; and an output buffer circuit configured to output data from the memory cell array in sync with rising and falling edges of the second data fetch signal, wherein second data fetch signal is output along with data output from the output buffer circuit.08-27-2009
20110075488Non-Volatile Semiconductor Memory - A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range. In the caching operation mode, data transfer between one of the memory cells selected in accordance with a first address and the first latch is performed while data transfer is performed between the second latch and input/output terminals in accordance with a second address with respect to one-bit two-level data to be stored in one of the memory cells.03-31-2011
20110075487BOOSTER CIRCUIT AND SEMICONDUCTOR MEMORY - A booster circuit includes a first capacitor and a second capacitor serially coupled between a first node and a second node through a third node; a third capacitor and a fourth capacitor serially coupled between a fourth node and a fifth node through a sixth node; a first switch coupling the third node with a power supply line when the fourth node is set to a first level; a second switch coupling the sixth node with the power supply line when the first node is set to the first level; a third switch transferring a plurality of electric charges of the sixth node to the second node; a fourth switch transferring a plurality of electric charges of the third node to the fifth node; a fifth switch coupling the second node with a voltage line; and a sixth switch coupling the fifth node with the voltage line.03-31-2011
20110069552NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF DATA READ THEREIN - A nonvolatile semiconductor memory device comprises: a memory cell array having a plurality of memory strings each having a plurality of memory cells connected in series; and a control circuit configured to execute a read operation for reading data from the memory cells included in a selected memory string from among the plurality of memory strings. During the read operation, the control circuit is configured to apply a first voltage to a gate of at least one of the memory cells in a non-selected memory string not subject to the read operation, and apply a second voltage lower than the first voltage to a gate of another of the memory cells in the non-selected memory string not subject to the read operation.03-24-2011
20100246268METHOD OF PROGRAMMING NONVOLATILE MEMORY DEVICE - In a method of programming a nonvolatile memory device, when a program is performed, a program voltage is applied to a first word line selected for the program. A first pass voltage is applied to three second word lines neighboring the first word line toward a source select line. First and second voltages are applied to third and fourth word lines neighboring the first word line toward the source select line. A second pass voltage is applied to the remaining word lines other than the first to fourth word lines.09-30-2010
20100302857METHOD OF PROGRAMMING AN ARRAY OF NMOS EEPROM CELLS THAT MINIMIZES BIT DISTURBANCES AND VOLTAGE WITHSTAND REQUIREMENTS FOR THE MEMORY ARRAY AND SUPPORTING CIRCUITS - A method for programming and erasing an array of NMOS electrically erasable programmable read only memory (EEPROM) cells that minimizes bit disturbances and high voltage requirements for the memory array cells and supporting circuits. In addition, the array of N-channel memory cells may be separated into independently programmable memory segments by creating multiple, electrically isolated P-wells upon which the memory segments are fabricated. The multiple, electrically isolated P-wells may be created, for example, by p-n junction isolation or dielectric isolation.12-02-2010
20110002173NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell array in which a plurality of nonvolatile memory cells are arrayed, and a program voltage generator that switches current supply amount based on the number of memory cells that are programmed at the same time, among the plurality of memory cells. The nonvolatile semiconductor memory device further includes a selection circuit that selects, among the plurality of memory cells, one or more memory cells that are programmed, to flow a current outputted by the program voltage generator.01-06-2011
20100259992METHODS AND APPARATUS FOR PROGRAMMING A MEMORY CELL USING ONE OR MORE BLOCKING MEMORY CELLS - Methods and apparatus for programming a memory cell using one or more blocking memory cells facilitate mitigation of capacitive voltage coupling. The methods include applying a program voltage to a selected memory cell of a string of memory cells, and applying a cutoff voltage to a set of one or more memory cells of the string between the selected memory cell and a select gate. The methods further include applying a pass voltage to one or more other memory cells of the string between the selected memory cell and the select gate. Other methods further include applying other pass voltages, other cutoff voltages and/or intermediate voltages to still other memory cells of the string.10-14-2010
20100296342NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - When bit lines or sense amplifiers are checked whether they are defective during a test performed to check whether the bit lines are defectively open, an electrical current supplied from one sense amplifier is detected by another sense amplifier. Thus, if plural bit lines are defectively open, they can be detected simultaneously. Consequently, the test time can be shortened greatly.11-25-2010
20100296343Non-Volatile Memory and Semiconductor Device - There is provided a non-volatile memory which enables high accuracy threshold control in a writing operation. In the present invention, a drain voltage and a drain current of a memory transistor are controlled to carry out a writing operation of a hot electron injection system, which is wherein a charge injection speed does not depend on a threshold voltage. FIGS. 11-25-2010
20100259991Nonvolatile memory cell and method for producing the same - A nonvolatile memory cell comprising a semiconductor substrate, a gate electrode formed on a surface of the semiconductor substrate with a gate insulation film interposed between them, a pair of impurity diffusion layers formed in a surface layer of the semiconductor substrate on both sides of the gate electrode, a channel region positioned in the surface layer of the semiconductor substrate between the pair of impurity diffusion layers, a charge storage layer formed on a surface of at least one impurity diffusion layer and along a side wall of the gate electrode, and a charge storage layer electrode laminated on the charge storage layer.10-14-2010
20100097863Method of programming non-volatile memory device and non-volatile memory device using the same - A program method of a nonvolatile memory device according to example embodiments includes a operation (a) of detecting a level of a program voltage; and a operation (b) of providing a unselected word line voltage and a bit line precharge voltage having a variable level respectively according to the detected level of the program voltage.04-22-2010
20100097864SEMICONDUCTOR MEMORY SYSTEM INCLUDING A PLURALITY OF SEMICONDUCTOR MEMORY DEVICES - A communication line is connected to first and second chips, and held at a first signal level. A monitor circuit changes a signal level of the communication line from the first signal to a second signal level while one of the first and second chips uses a current larger than a reference current. When the signal level of the communication line is the second signal level, the other of the first and second chips is controlled to a wait state that does not transfer to an operating state of using a current larger than the reference current.04-22-2010
20100080062NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SAME - A nonvolatile semiconductor memory device includes: a semiconductor substrate including a first channel, and a source region and a drain region provided on both sides of the first channel; a first insulating film provided on the first channel; a charge retention layer provided on the first insulating film; a second insulating film provided on the charge retention layer; and a semiconductor layer including a second channel provided on the second insulating film, and a source region and a drain region provided on both sides of the second channel.04-01-2010
20120201081SEMICONDUCTOR STORAGE DEVICE - The invention provides a semiconductor storage device which can restrain the uneven high voltage applied to the storage unit and can provide the high voltage with high precision. The semiconductor storage device includes a storage unit array, a Y decoder circuit, a X decoder circuit, a sense amplifier circuit, a Y gate circuit, a high voltage generating circuit, a high voltage regulator circuit, and a voltage adjusting circuit. The voltage modifying data for adjusting the potential of the anode of the zener diode so as to adjust the high voltage applied to the storage unit array is written into the storage unit array. The voltage modifying data is used to adjust voltage by the voltage adjusting circuit.08-09-2012
20080247235FLASH MEMORY DEVICE AND METHOD FOR DRIVING THE SAME - Provided are a flash memory device and a method of driving the same for reading set information and stably storing the read set information in a latch. The method of driving the flash memory device includes applying power to the flash memory device, which includes a memory cell array for storing set information used to set an operating environment of the flash memory device. An initial read operation of the memory cell array is performed to read the set information. The set information read in the initial read operation is stored in a latch. It is determined whether the set information is normally stored in the latch based on set data input to the latch and set data output from the latch.10-09-2008
20110255340Nonvolatile semiconductor memory and method for testing the same - A nonvolatile semiconductor memory, includes a nonvolatile memory array, a voltage generator circuit that generates a drive voltage which changes depending on a supply voltage and a code, a control circuit that applies the generated drive voltage to the nonvolatile memory array, and a code output circuit that outputs any one of a plurality of codes to the voltage generator circuit, wherein the plurality of codes includes a first code and a second code, wherein the second code is different from the first code, wherein, in a first state, the code output circuit outputs the first code to the voltage generator circuit, and the voltage generator circuit generates the drive voltage according to the first code, and wherein, in a second state, the code output circuit outputs the second code to the voltage generator circuit, and the voltage generator circuit generates the drive voltage according to the second code.10-20-2011
20090021986OPERATING METHOD OF NON-VOLATILE MEMORY DEVICE - An operating method for a non-volatile memory device is applicable on a non-volatile memory device in which a substrate is disposed. The substrate includes a trench, a first conductive type first well region disposed in the substrate, and a second conductive type second well region disposed above the first conductive type first well region. The operating method includes applying a first voltage to a control gate, a second voltage to a drain region, and a third voltage to a source region. Besides, a channel F-N tunneling effect is employed to program a memory cell.01-22-2009
20090021985INTERNAL VOLTAGE GENERATOR AND CONTROL METHOD THEREOF, AND SEMICONDUCTOR MEMORY DEVICE AND SYSTEM INCLUDING THE SAME - An internal voltage of a semiconductor memory device is controlled, where the internal voltage is set according to a reference voltage. The reference voltage is controlled according to first control data to increase the internal voltage to be higher than a target voltage in a power-up operation, and second control data is read. The reference voltage is then controlled according to the second control data to decrease the internal voltage to the target voltage.01-22-2009
20080239823NONVOLATILE SEMICONDUCTOR MEMORY AND METHOD FOR CONTROLLING THE SAME - A nonvolatile semiconductor memory includes a memory cell array, a flag information storage that stores a write flag indicating success/failure of writing in association with each address of a plurality of data segments contained in the data block, an internal address storage that selects the address where the writing has failed, a write circuit that performs data writing, a comparator that performs verify operation to verify success/failure of the data writing, and a sequence controller that updates a write flag according to the result of the verify operation.10-02-2008
20120268998Flash Memory Device and Method for Handling Power Failure Thereof - A flash memory device. In one embodiment, the flash memory device comprises a flash memory, a diode, a controller, and a capacitor. The flash memory has a voltage source pin. The diode is coupled between a voltage source and the voltage source pin of the flash memory. The controller is coupled to the flash memory via a data bus. The capacitor is coupled between the voltage source pin of the flash memory and a ground, and supplies power to the flash memory to enable the flash memory to complete writing of at least one data page when the level of the voltage source is lowered.10-25-2012
20110211395NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device, in which interference between adjoining cells can be reduced and an expansion of a chip area can be suppressed, comprising: a memory cell array in which plural memory cells connected to plural word lines and plural bit lines are disposed in a matrix form; sense amplifiers each of which is to be connected to each of the bit lines; a control circuit which controls voltages of the word lines and the bit lines, and programs data into the memory cells or reads data from the memory cells; wherein the plural bit lines include at least a first, a second, a third and a fourth bit lines adjoining to each other, and the sense amplifiers include at least a first and a second sense amplifiers, a first and a fourth selection transistors which are provided between the first and the fourth bit lines and the first sense amplifier, and connect the first and the fourth bit lines to the first sense amplifier; and a second and a third selection transistors which are provided between the second and the third bit lines and the second sense amplifier, and connect the second and the third bit lines to the second sense amplifier.09-01-2011
20080298128METHOD OF STORING E-FUSE DATA IN FLASH MEMORY DEVICE - Provided is a method of storing configuration data regarding an operating environment of a flash memory device, which includes a memory cell array having an electrical fuse (E-Fuse) block for storing the configuration data. The method includes storing the configuration data in multiple strings of the E-Fuse block, each string including multiple memory cells configured to store one bit.12-04-2008
20080285353Flash memory device, method of manufacturing the same, and method of operating the same - Provided are a memory device, a method of manufacturing the same, and a method of operating the same. The memory device may include a channel region having an upper end where both sides of the upper end are curved, the curved portions of both sides allowing charges to be injected thereinto in a program or erase voltage such that the curved portions into which the charges are injected are separate from a portion which determines a threshold voltage, and a gate structure on the channel region.11-20-2008
20080285352Method of writing/reading data into/from memory cell and page buffer using different codes for writing and reading operations - Provided are a method of writing/reading data into/from a memory cell and a page buffer using different codes for the writing and reading operations. The method of writing/reading data into/from a memory cell that has a plurality of threshold voltage distributions includes a data writing operation and a data reading operation. In the data writing operation, data having a plurality of bits is written into the memory cell by using a plurality of writing codes corresponding to threshold voltage distributions. In the data reading operation, the data having a plurality of bits is read from the memory cell by using reading codes corresponding to the threshold voltage distributions from among the threshold voltage distributions. In the method of writing/reading data into/from a memory cell, a part of the writing codes is different from a corresponding part of the reading codes.11-20-2008
20080285351MEASURING THRESHOLD VOLTAGE DISTRIBUTION IN MEMORY USING AN AGGREGATE CHARACTERISTIC - A threshold voltage distribution of a set of storage elements in a memory device is measured by sweeping a control gate voltage while measuring a characteristic of the set of storage elements as a whole. The characteristic indicates how many of the storage elements meet a given condition, such as being in a conductive state. For example, the characteristic may be a combined current, voltage or capacitance of the set which is measured at a common source of the set. The control gate voltage can be generated internally within a memory die. Similarly, the threshold voltage distribution can be determined internally within the memory die. Optionally, storage elements which become conductive can be locked out, such as by changing a bit line voltage, so they no longer contribute to the characteristic. New read reference voltages are determined based on the threshold voltage distribution to reduce errors in future read operations.11-20-2008
20110176368MULTIPLE TIME PROGRAMMABLE (MTP) PMOS FLOATING GATE-BASED NON-VOLATILE MEMORY DEVICE FOR A GENERAL PURPOSE CMOS TECHNOLOGY WITH THICK GATE OXIDE - A multiple time programmable (MTP) memory cell, in accordance with an embodiment, includes a floating gate PMOS transistor, a high voltage NMOS transistor, and an n-well capacitor. The floating gate PMOS transistor includes a source that forms a first terminal of the memory cell, a drain and a gate. The high voltage NMOS transistor includes a source connected to ground, an extended drain connected to the drain of the PMOS transistor, and a gate forming a second terminal of the memory cell. The n-well capacitor includes a first terminal connected to the gate of the PMOS transistor, and a second terminal forming a third terminal of the memory cell. The floating gate PMOS transistor can store a logic state. Combinations of voltages can be applied to the first, second and third terminals of the memory cell to program, inhibit program, read and erase the logic state.07-21-2011
20120170372MEMORY DEVICE BIASING METHOD AND APPARATUS - Memory devices and methods are disclosed, such as those facilitating data line shielding by way of capacitive coupling with data lines coupled to a memory string source line. For example, alternating data lines are sensed while adjacent data lines are coupled to a common source line of the data lines being sensed. Data line shielding methods and apparatus disclosed can reduce effects of source line bounce occurring during a sense operation of a memory device.07-05-2012
20120170371PROGRAMMING METHOD OF NON-VOLATILE MEMORY DEVICE - A programming method of a non-volatile memory device that includes a string of memory cells with a plurality of floating gates and a plurality of control gates disposed alternately, wherein each of the memory cells includes one floating gate and two control gates disposed adjacent to the floating gate and two neighboring memory cells share one control gate. The programming method includes applying a first program voltage to a first control gate of a selected memory cell and a second program voltage that is higher than the first program voltage to a second control gate of the selected memory cell, and applying a first pass voltage to a third control gate disposed adjacent to the first control gate and a second pass voltage that is lower than the first pass voltage to a fourth control gate disposed adjacent to the second control gate.07-05-2012
20080266969METHOD OF OPERATING NON-VOLATILE MEMORY - A method of operating a non-volatile memory having a substrate, a gate, a charge-trapping layer, a source region and a drain region is provided. The charge-trapping layer close to the source region is an auxiliary charge region and the charge-trapping layer close to the drain region is a data storage region. Before prosecuting the operation, electrons have been injected into the auxiliary charge region. When prosecuting the programming operation, a first voltage is applied to the gate, a second voltage is applied to the source region, a third voltage is applied to the drain region and a fourth voltage is applied to the substrate. The first voltage is greater than the fourth voltage, the third voltage is greater than the second voltage, and the second voltage is greater than the fourth voltage to initiate a channel initiated secondary hot electron injection to inject electrons into the data storage region.10-30-2008
20080198659SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes: a memory cell array having a plurality of memory cells arranged therein; and a sense amplifier circuit configured to read data of the memory cell array, wherein a comparison operation is performed between read out data from the memory cell array and externally supplied expectance data in the sense amplifier circuit.08-21-2008
20100322010NON-VOLATILE MEMORY PROGRAMMABLE THROUGH AREAL CAPACITIVE COUPLING - A programmable non-volatile device is made which uses a floating gate that functions as a FET gate that overlaps a portion of a source/drain region. This allows a programming voltage for the device to be imparted to the floating gate through capacitive coupling, thus changing the state of the device. The invention can be used in environments such as data encryption, reference trimming, manufacturing ID, security ID, and many other applications.12-23-2010
20110164452MEMORY DEVICE07-07-2011
20080253190Non-volatile memory device and method of operating the same - The present invention is directed to a non-volatile memory device and a method of operating the same. The non-volatile memory device includes a first transistor connected to an nth bitline and a second transistor connected to an (n+1)th bitline. The first transistor and the second transistor are serially coupled between the nth bitline and the (n+1)th bitline. The non-volatile memory device may include a 2-transistor 1-bit unit cell where a drain region and a source region of a memory cell have the same or similar structure. Since a cell array of a non-volatile memory device according to the invention may include a 2-transistor 2-bit unit cell, storage capacity of the non-volatile memory device may be doubled.10-16-2008
20080253191FLASH MEMORY DEVICE AND SET-UP DATA INITIALIZATION METHOD - A flash memory device includes a memory cell array having a set-up data region configured to store set-up data, wherein the set-up data includes first data and second data. The second data is stored in an empty cell area of the set-up data region. The flash memory also includes a page buffer and decoder configured to read the set-up data from the set-up data region, and a status detector receiving the set-up data from the page buffer and decoder and configured to discriminate the first data from the second data and generate a Pass/Fail status signal.10-16-2008
20080205153METHOD AND APPARATUS FOR CONTROLLING TWO OR MORE NON-VOLATILE MEMORY DEVICES - A method and apparatus for controlling two or more non-volatile memory devices includes activating a read enable signal or a write enable signal, which is input to the first and second non-volatile memory devices, using a controller. A first chip enable signal is alternately activated for selecting the first non-volatile memory device and a second chip enable signal is activated for selecting the second non-volatile memory device using the controller. This is done while the read enable signal or the write enable signal is input to the first and second non-volatile memory devices being activated. Accordingly, even when the minimum cycle of the controller is longer than that of a memory device read/write time is reduced, thereby improving read/write performance.08-28-2008
20080205152FLASH MEMORY DEVICE FOR OVER-SAMPLING READ AND INTERFACING METHOD THEREOF - A memory system having a flash memory device that performs an over-sampling read operation to read data from a memory cell in the flash device by using an over-sampling read voltage that falls within a threshold voltage distribution range. A memory controller supplies a read mode signal to the flash memory device to perform the over-sampling read operation.08-28-2008
20080205151Non-Volatile Memory Device and Method of Driving the Same - A non-volatile memory device capable of stably setting its operating environment and a method of driving the non-volatile memory device are provided. The method includes providing power to the non-volatile memory device having a memory cell array that stores initial setting data for setting the operating environment of the non-volatile memory device. An initial read operation is performed on the memory cell array. The operating environment of the non-volatile memory device is set using the initial setting data that is read through the initial read operation. The initial setting data stored in the memory cell array includes main data having information about the operating environment to be set and an indicator corresponding to the main data for indicating a start and an end of the main data.08-28-2008
20080205149METHOD OF PROGRAMMING NON-VOLATILE MEMORY DEVICE - A method of programming a non-volatile memory device enables a pump in response to a first program confirm command. The pump generates a voltage. An initial page of a memory block is programmed. Subsequent intermediate pages of the memory block are programmed in response to a second program confirm command while the pump remains enabled. A final page of the memory block is programmed in response to a third program confirm command. The pump is then disabled after the final page is programmed.08-28-2008
20110164453SYSTEM AND MEMORY FOR SEQUENTIAL MULTI-PLANE PAGE MEMORY OPERATIONS - A system and method for performing memory operations in a multi-plane flash memory. Commands and addresses are sequentially provided to the memory for memory operations in memory planes. The memory operations are sequentially initiated and the memory operation for at least one of the memory planes is initiated during the memory operation for another memory plane. In one embodiment, each of a plurality of programming circuits is associated with a respective memory plane and is operable to program data to the respective memory plane in response to programming signals and when it is enabled. Control logic coupled to the plurality of programming circuits generates programming signals in response to the memory receiving program commands and further generates programming enable signals to individually enable each of the programming circuits to respond to the programming signals and stagger programming of data to each of the memory planes.07-07-2011
20110085381CHARGE CARRIER DEVICE - A device comprises an impurity ion disposed in an insulating region, a semiconductor region adjacent to the insulating region, an electrometer arranged to detect charge carriers in the semiconductor region and at least one control gate configured to apply an electric field to the insulating region and semiconductor region. The at least one control gate is operable to cause at least one charge carrier in the semiconducting material region to bind to the impurity ion without the at least one charge carrier leaving the semiconductor material region. The electrometer is operable to detect whether the at least one charge carrier is bound to the impurity ion.04-14-2011
20110134700Nonvolatile Semiconductor Memory - A select gate transistor has a select gate electrode composed of a first-level conductive layer and a second-level conductive layer. The first-level conductive layer has contact areas. The second-level conductive layer has its portions removed that are located above the contact areas. Two adjacent select gate electrodes that are adjacent to each other in the column direction are arranged such that the contact areas of one select gate electrode are not opposed to the contact areas of the other select gate electrode. One select gate electrode has its first- and second-level conductive layers removed in their portions that are opposed to the contact areas of the other select gate electrode.06-09-2011
20110134699APPARATUS FOR REDUCING THE IMPACT OF PROGRAM DISTURB - The unintentional programming of an unselected (or inhibited) non-volatile storage element during a program operation that intends to program another non-volatile storage element is referred to as “program disturb.” A system is proposed for programming and/or reading non-volatile storage that reduces the effect of program disturb. In one embodiment, different verify levels are used for a particular word line (or other grouping of storage elements) during a programming process. In another embodiment, different compare levels are used for a particular word (or other grouping of storage elements) during a read process.06-09-2011
20110080788DRIVING METHOD OF SEMICONDUCTOR DEVICE - It is an object to reduce defects caused by reading wrong data by judging whether a storage state held in a non-volatile memory element is correct or not in the case where accumulation or discharge of electrons in/from a charge accumulation layer.04-07-2011
20110085382Universal dual charge-retaining transistor flash NOR cell, a dual charge-retaining transistor flash NOR cell array, and method for operating same - A NOR flash memory cell is formed of dual serially connected charge retaining transistors. A drain/source of a first of the dual charge retaining transistors connected to a local bit line and a source/drain of a second of the dual charge retaining transistors connected to a local source line. The drain/sources of the commonly connected dual serially connected charge retaining transistors are connected solely together. The drain/sources and source drains are formed in a diffusion well. In some embodiments, the diffusion well is formed in a deep diffusion well. The dual serially connected charge retaining transistors are N-channel or P-channel charge retaining transistors with the charge retaining layers being either floating gate or SONOS charge trapping layers. Selected charge retaining transistors are programmed by a combination of a band-to-band tunneling and a Fowler-Nordheim tunneling and erased by a Fowler Nordheim tunneling.04-14-2011
20110134698FLASH MEMORY CELL ON SeOI HAVING A SECOND CONTROL GATE BURIED UNDER THE INSULATING LAYER - The invention relates to a flash memory cell having a FET transistor with a floating gate on a semiconductor-on-insulator (SOI) substrate composed of a thin film of semiconductor material separated from a base substrate by an insulating buried oxide (BOX) layer, The transistor has in the thin film, a channel, with two control gates, a front control gate located above the floating gate and separated from it by an inter-gate dielectric, and a back control gate located within the base substrate directly under the insulating (BOX) layer and separated from the channel by only the insulating (BOX) layer. The two control gates are designed to be used in combination to perform a cell programming operation. The invention also relates to a memory array made up of a plurality of memory cells according to the first aspect of the invention, which can be in an array of rows and columns, and a method of fabricating such memory cells and memory arrays.06-09-2011
20100110794NON-VOLATILE SEMICONDUCTOR MEMORY HAVING MULTIPLE EXTERNAL POWER SUPPLIES - A memory device includes core memory such as flash memory for storing data. The memory device includes a first power input to receive a first voltage used to power the flash memory. Additionally, the memory device includes a second power input to receive a second voltage. The memory device includes power management circuitry configured to receive the second voltage and derive one or more internal voltages. The power management circuitry supplies or conveys the internal voltages to the flash memory. The different internal voltages generated by the power management circuitry (e.g., voltage converter circuit) and supplied to the core memory enable operations such as read/program/erase with respect to cells in the core memory.05-06-2010
20110096607PROGRAMMING A MEMORY DEVICE TO INCREASE DATA RELIABILITY - Methods for programming a memory array, memory devices, and memory systems are disclosed. In one such method, the target reliability of the data to be programmed is determined. The relative reliability of different groups of memory cells of the memory array is determined. The data is programmed into the group of memory cells of the array having a relative reliability corresponding to the target reliability.04-28-2011
20110096606SEMICONDUCTOR INTEGRATED CIRCUIT ADAPTED TO OUTPUT PASS/FAIL RESULTS OF INTERNAL OPERATIONS - In a semiconductor integrated circuit, an internal circuit is capable of executing a first operation and a second operation concurrently, and an output circuit outputs to the outside of the semiconductor integrated circuit information indicating whether or not the first operation is being executed and information indicating whether or not the second operation is executable.04-28-2011
20100214842NONVOLATILE SEMICONDUCTOR MEMORY INCLUDING CHARGE ACCUMULATION LAYER AND CONTROL GATE - A nonvolatile semiconductor memory includes a transistor, a first MOS, a second MOS, a first voltage circuit, and a second voltage circuit. The transistor includes a accumulation layer, a control gate, and a first impurity diffused layer. The first MOS includes a first electrode and a second layer. The second MOS includes a second electrode and a third layer, after the channels being formed, the first MOS and the second MOS being cut off. The first voltage circuit applies a first voltage to an active region to generate a forward bias. The second voltage circuit applies a second voltage, and a third voltage to the control gate of the transistor, after the first voltage circuit charges the first to third impurity diffused layer to the first voltage, the second voltage circuit applying the second voltage and the third voltage to the control gate of the transistor.08-26-2010
20100214843NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM HAVING THE SAME - A non-volatile memory device including a cell array having memory cells arranged at intersections of word lines and bit lines; an address decoder configured to select one of the word lines in response to an address; a write circuit configured to write program data in memory cells connected with the selected word line; and a control circuit configured to control the address decoder and the write circuit such that a plurality of band program (write) operations are sequentially executed during a write operation, wherein the control circuit is further configured to select each band write operation the optimal write condition of the next band write operation. A plurality of available write conditions are stored as trim information in a plurality of registers. The control circuit selects the register storing information for performing programming under the optimal write condition.08-26-2010
20100214847SEMICONDUCTOR STORAGE DEVICE AND READ VOLTAGE CORRECTION METHOD - A semiconductor memory device comprises a semiconductor memory, a corrected voltage storage circuit which stores a corrected voltage produced by correcting a read voltage of the semiconductor memory, and a memory controller which reads the corrected voltage from the corrected voltage storage circuit and performs a read operation of the semiconductor memory using the corrected voltage.08-26-2010
20100214846Flash Memory Devices, Methods for Programming the Same, and Memory Systems Including the Same - A programming method of a nonvolatile memory device is provided including: applying a local voltage to a first unselected word line; applying a local voltage to a second unselected word line, after the local voltage is applied to the first unselected word line; and applying a pass voltage to the first unselected word line, after the local voltage is applied to the second unselected word line. Related devices and systems are also provided herein.08-26-2010
20100214841MEMORY APPARATUS AND METHOD THEREOF FOR OPERATING MEMORY - A memory apparatus and a method thereof for operating a memory are provided herein. The apparatus has the memory and a controller. The memory has a plurality of memory cells, and each the memory cells has a first side and the second side. Each of the first side and the second side is programmable to store one bit of data. The controller programs the first sides and the second sides of the memory cells to different levels. Several threshold voltage distributions of the programmed memory cells could be overlapped with each other. The controller distinguishes the bits of the memory cells by comparing the threshold voltages of the memory cells with the different levels and by comparing the threshold voltages with those of neighbor sides.08-26-2010
20100165737ELECTROMECHANICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME - In a memory device and a method of forming the same, in one embodiment, the memory device comprises a first word line structure on a substrate, the first word line structure extending in a first direction. A bit line is provided over the first word line structure and spaced apart from the first word line by a first gap, the bit line extending in a second direction transverse to the first direction. A second word line structure is provided over the bit line and spaced apart from the bit line by a second gap, the second word line structure extending in the first direction. The bit line is suspended between the first word line structure and the second word line structure such that the bit line deflects to be electrically coupled with a top portion of the first word line structure through the first gap in a first bent position and deflects to be electrically coupled with a bottom portion of the second word line structure through the second gap in a second bent position, and is isolated from the first word line structure and the second word line structure in a rest position.07-01-2010
20100067302NAND-TYPE FLASH MEMORY AND NAND-TYPE FLASH MEMORY CONTROLLING METHOD - A method of controlling a NAND-type flash memory provided with a latch circuit in which data is temporarily stored has measuring a first consumption current of the latch circuit in a first state in which the latch circuit is caused to retain first logic; measuring a second consumption current of the latch circuit in a second state in which the latch circuit is caused to retain second logic obtained by inverting the first logic; and comparing the first consumption current and the second consumption current to cause the latch circuit to retain logic corresponding to the state corresponding to a smaller one of the first consumption current and the second consumption current.03-18-2010
20100067304WRITE ONCE READ ONLY MEMORY EMPLOYING CHARGE TRAPPING IN INSULATORS - Structures and methods for write once read only memory employing charge trapping in insulators are provided. The write once read only memory cell includes a metal oxide semiconductor field effect transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, and a gate separated from the channel region by a gate insulator. A plug couples the first source/drain region to an array plate. A bitline is coupled to the second source/drain region. The MOSFET can be programmed by operation in a reverse direction trapping charge in the gate insulator adjacent to the first source/drain region such that the programmed MOSFET operates at reduced drain source current when read in a forward direction.03-18-2010
20100067303FLASH MEMORY DEVICE CAPABLE OF REDUCED PROGRAMMING TIME - A flash memory device comprising a high voltage generator circuit that is adapted to supply a program voltage having a target voltage to a selected word line is provided. The flash memory device is adapted to terminate the program interval in accordance with when the program voltage has been restored to the target voltage after dropping below the target voltage. A method for operating the flash memory device is also provided.03-18-2010
20100067301COLUMNAR NON-VOLATILE MEMORY DEVICES WITH AUXILIARY TRANSISTORS AND METHODS OF OPERATING THE SAME - A non-volatile memory device includes at least one semiconductor column having a first sidewall and a second sidewall. The device also includes at least one gate electrode is disposed on the first sidewall and at least one control gate electrode disposed on the second sidewall. The device further includes at least one charge storage layer is disposed between the second sidewall and the at least one control gate electrode. The at least one gate electrode and the at least one control gate electrode may be disposed on opposite sides of the at least one semiconductor column such that they commonly control a channel region in the semiconductor column.03-18-2010
20100195399MEMORY SEGMENT ACCESSING IN A MEMORY DEVICE - Methods for programming memory devices, a memory device, and memory systems are provided. According to at least one such method, bit lines a memory segment are read at substantially the same time by coupling a selected memory segment, and at some of the data lines of any intervening segments, to respective data caches. The bit lines of the unselected memory segments that are not used to couple the selected segment to the data caches can be coupled to their respective source lines. Other methods, devices, and systems are also provided.08-05-2010
20110149656MULTI-CELL VERTICAL MEMORY NODES - Embodiments of the invention pertain to vertical memory structures. Embodiments of the invention describe memory nodes comprising two memory cells on opposing sides of a vertical channel separating a source region and a drain region. Embodiments of the invention may utilize floating gate NAND memory cells, polysilicon diodes, MiM diodes, or MiiM diodes. Embodiments of the invention may be used to form flash memory, RRAM, Memristor RAM, Oxide Ram or OTPROM.06-23-2011
20090175085NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF WRITING AND READING THE SAME - MOS transistors each having different ON withstanding voltages that are drain withstanding voltages when gates thereof are turned on are formed on the same substrate. One of the MOS transistors having the lower ON withstand voltage is used as a memory element. Using the fact that the drain withstanding voltage is low when a gate thereof is turned on, a short-circuit occurs in a PN junction between a drain and the substrate of the one of the MOS transistors having the lower ON withstand voltage to write data.07-09-2009
20090175084Buffering systems for accessing multiple layers of memory in integrated circuits - Embodiments of the invention relate generally to data storage and computer memory, and more particularly, to systems, integrated circuits and methods for accessing memory in multiple layers of memory implementing, for example, third dimension memory technology. In a specific embodiment, an integrated circuit is configured to implement write buffers to access multiple layers of memory. For example, the integrated circuit can include memory cells disposed in multiple layers of memory. In one embodiment, the memory cells can be third dimension memory cells. The integrated circuit can also include read buffers that can be sized differently than the write buffers. In at least one embodiment, write buffers can be sized as a function of a write cycle. Each layer of memory can include a plurality of two-terminal memory elements that retain stored data in the absence of power and store data as a plurality of conductivity profiles.07-09-2009
20100027347Three-Terminal Single Poly NMOS Non-Volatile Memory Cell - A three terminal non-volatile memory (NVM) cell for a CMOS IC is formed by a standard CMOS process flow. The NVM cell includes two transistors that share a common floating gate. The floating gate includes a first portion disposed over the channel region of the first (NMOS) transistor, a second portion disposed over the channel region of the second (NMOS or PMOS) transistor, and a third portion extending into an enlarged drain diffusion area away from the channel regions, whereby the gate-to-drain capacitance is higher than the gate-to-source capacitances. A pocket implant or CMOS standard LV N-LDD is formed under the second transistor to enhance CHE programming. Both HV LDD and LV LDD implants are introduced together enabling LDD implant merging under the floating gate extension. The floating gate is formed using substantially T-shaped, C-shaped, U-shaped, Y-shaped or O-shaped polysilicon structures. Various array addressing schemes are disclosed.02-04-2010
20100027346Asymmetric Single Poly NMOS Non-Volatile Memory Cell - An asymmetric non-volatile memory (NVM) cell for a CMOS IC formed by a standard CMOS process flow used to form both low voltage and high voltage transistors on a substrate. The NVM cell includes an NMOS floating gate transistor and an optional select transistor. The floating gate transistor includes an elongated floating gate having a first portion disposed over the channel region C02-04-2010
20100027342Memory device and memory data determination method - A memory device and a memory data determination method are provided. The memory device may estimate a threshold voltage shift of a first memory cell based on data before the first memory cell is programmed and a target program threshold voltage of the first memory cell. The memory device may generate a metric of a threshold voltage shift of a second memory cell based on the estimated threshold voltage shift of the first memory cell. Also, the memory device may determine data stored in the second memory cell based on the metric.02-04-2010
20100020615CLOCK SYNCHRONIZED NON-VOLATILE MEMORY DEVICE - A nonvolatile memory apparatus including a control circuit, plural terminals having clock, command and other terminals, data and command registers, and plural nonvolatile memory cells. The clock terminal receives a clock signal and the command terminal receives commands including read and program commands. The data register receives from and outputs data to outside. The control circuit reads operation steps from memory used to control the apparatus. The control circuit, responsive to the read command, controls reading data from the memory cells, storing read data to the data register, and outputting read data via the other terminal, not the command terminal, based on the clock signal. The control circuit, responsive to the program command, controls receiving data via the other terminal, not the command terminal, based on the clock signal, storing received data to the data register and writing received data to the memory cells.01-28-2010
20110216599SEMICONDUCTOR MEMORY DEVICE AND CONTROL METHOD THEREOF - According to one embodiment, a semiconductor memory device includes a memory cell array, a column decoder, and a control circuit configured to control the memory cell array and the column decoder. The control circuit is configured to load program data from outside, to execute a first data program in a first even-numbered bit line, to execute a second data program in a first odd-numbered bit line, to execute a verify read of the programmed bit lines, to determine whether a value of the verify read is programmed up to a predetermined threshold value, and to change, in a case where the value of the verify read fails to be programmed to the predetermined threshold value, an order of the first and second data programs, to execute the second data program in the first odd-numbered bit line, and then to execute the first data program in the first even-numbered bit line.09-08-2011
20110216598MEMORY SYSTEM AND OPERATING METHOD THEREOF - Provided are a memory system and an operating method thereof. The operating method reads an observation memory cell at least one time with different read voltages to configure a first read data symbol, reads a plurality of interference memory cells adjacent to the observation memory cell at least one time with different read voltages to configure second read data symbols, and determines a logical value of the observation memory cell based on the first read data symbol and the second read data symbols.09-08-2011
20110216597NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A memory string comprises a semiconductor layer, a charge storage layer, and a plurality of first conductive layers. The semiconductor layer includes a columnar portion that extends in a perpendicular direction to a substrate. The charge storage layer is formed around a side surface of the columnar portion. The plurality of first conductive layers are formed around the side surface of the columnar portion and the charge storage layer. A control circuit comprises a plurality of second conductive layers, an insulating layer, and a plurality of plug layers. The plurality of second conductive layers are formed in the same layers as the plurality of first conductive layers. The insulating layer is formed penetrating the plurality of second conductive layers in the perpendicular direction. The plurality of plug layers are formed penetrating the insulating layer in the perpendicular direction. The insulating layer has a rectangular shaped cross-section with a constricted portion in a horizontal direction to the substrate. The constricted portion is positioned on a long side of the cross-section.09-08-2011
20110216596Reliability Protection for Non-Volatile Memories - A non-volatile memory cell having enhanced protection against mobile ions. The electric field within the memory cell is controlled in a manner that minimizes migration of mobile ions toward the floating gate. Each conductive layer in the memory cell is biased to reduce the flow of mobile ions toward the floating gate. The memory cell is preferably manufactured using a conventional logic process.09-08-2011
20090021984METHODS AND STRUCTURES FOR HIGHLY EFFICIENT HOT CARRIER INJECTION PROGRAMMING FOR NON-VOLATILE MEMORIES - A metal oxide semiconductor field effect transistor (MOSFET) in a non-volatile memory cell has a source, a drain and a channel region between the source and the drain, all formed in a substrate of opposite conductivity type to the conductivity type of the source and drain. The MOSFET is programmed by connecting the drain electrode to the supply source of the main voltage, V01-22-2009
20120147677BIASING SYSTEM AND METHOD - Embodiments are provided that include a memory system that includes a memory system, having an access device coupled between a global line and a local line and a voltage source coupled to the global line and configured to output a bias voltage on the global line when the memory system is in a non-operation state. The access device is selected when the memory system is in the non-operation state, and the access device is deselected when the memory system is in an other state. Further embodiments provide, for example, a method that includes coupling a global access line to a local access line, biasing the local access line to a voltage other than a negative supply voltage while a memory device is in a first state and uncoupling the global access line from the local access line while the memory device is in an other state.06-14-2012
20110019480NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device, includes: a stacked structural unit including electrode films alternately stacked with inter-electrode insulating films; a first and second semiconductor pillars piercing the stacked structural unit; a connection portion semiconductor layer to electrically connect the first and second semiconductor pillars; a connection portion conductive layer opposing the connection portion semiconductor layer; a memory layer, an inner insulating film, and an outer insulating film provided between the first and second semiconductor layers and the electrode films and between the connection portion semiconductor layer and the connection portion conductive layer. At least a portion of a face of the connection portion conductive layer opposing the outer insulating film is a curved surface having a recessed configuration on a side of the outer insulating film.01-27-2011
20120307563NONVOLATILE MEMORY WITH BITLINE CAPACITIVE COUPLING COMPENSATION - A method of programming memory cells in a nonvolatile memory, includes applying a programming voltage to a first bitline and setting a second bitline in a floating state. The method further includes applying a compensation voltage to a shield conductive line coupled to the bitline set in the floating state, and setting in the floating state a shield conductive line coupled to the bitline receiving the programming voltage. The method is applicable to the reduction of the parasitic programming phenomena of memory cells by capacitive coupling between bitlines.12-06-2012
20120307562NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment includes: a semiconductor substrate; a memory cell array including a plurality of memory cells, the memory cells being stacked on the semiconductor substrate; and a power supply circuit provided on the semiconductor substrate. The power supply circuit includes: a pump circuit configured to generate a voltage and supply the voltage to the memory cell array; a limiter circuit configured to output control signal for activating the pump circuit according to a comparison result between a voltage value of the output terminal and a first value; a capacitor configured to adjust a voltage of the output terminal; a boost circuit configured to charge the capacitor using a constant current based on the control signal; and a switch configured to stop a charge operation of the boost circuit. The capacitor is provided directly below the memory cell array.12-06-2012
20120039129COST SAVING ELECTRICALLY-ERASABLE-PROGRAMMABLE READ-ONLY MEMORY (EEPROM) ARRAY - A cost saving electrically-erasable-programmable read-only memory (EEPROM) array, having: a plurality of parallel bit lines, a plurality of parallel word lines, and a plurality of parallel common source lines. The bit lines are classified into a plurality of bit line groups, containing a first group bit lines; the word line includes a first and a second word lines; and the common source line includes a first common source line. And, a plurality of sub-memory arrays are provided. Each sub-memory array includes a first and a second memory cells disposed opposite to each other and located on two different sides of the first common source line; the first memory cell is connected to the first group bit lines, the first common source line, and the first word line, and the second memory cell is connected to the first group bit line, the first common source line, and the second word line.02-16-2012
20110305090MEMORY CONTROLLER SELF-CALIBRATION FOR REMOVING SYSTEMIC INFLUENCE - Self-calibration for a memory controller is performed by writing a voltage to a selected cell. Adjacent cells around the selected cell are programmed. After each of the adjacent programming operations, the voltage on the selected cell is read to determine any change in voltage caused by systemic offsets such as, for example, floating gate-to-floating gate coupling. These changes are averaged and stored in a table as an offset for use in adjusting a programming voltage or a read voltage in a particular area of memory represented by the offset. Self calibration method for temperature is determined by writing cells at different temperatures and reading at different temperatures to generate temperature offset tables for the write path and read path. These offset tables are used to adjust for systematic temperature related offsets during programming and during read.12-15-2011
20110051519Novel NAND-based hybrid NVM design that integrates NAND and NOR in 1-die with serial interface - A nonvolatile memory device includes multiple independent nonvolatile memory arrays that concurrently for parallel reading and writing the nonvolatile memory arrays. A serial interface communicates commands, address, device status, and data between a master device and nonvolatile memory arrays for concurrently reading and writing of the nonvolatile memory arrays and sub-arrays. Data is transferred on the serial interface at the rising edge and the falling edge of the synchronizing clock. The serial interface transmits a command code and an address code from a master device and transfers a data code between the master device and the nonvolatile memory device, wherein the data code has a length that is determined by the command code and a location determined by the address code. An enable signal defines a beginning and termination of a reading or writing operation. Reading one nonvolatile memory array may be interrupted for another operation and then resumed.03-03-2011
20110110161Method of Programming a Flash Memory Device - A non-volatile memory device includes an array of flash memory cells therein and a voltage generator. The voltage generator is configured to generate a program voltage (Vpgm), a pass voltage (Vpass), a blocking voltage (Vblock) and a decoupling voltage (Vdcp) during a flash memory programming operation. The blocking voltage is generated at a level that inhibits inadvertent programming of an unselected memory cell(s). This voltage level of the blocking voltage is set so that Vdcp05-12-2011
20120039130Nonvolatile Memory Devices, Channel Boosting Methods Thereof, Programming Methods Thereof, And Memory Systems Including The Same - Non-volatile memory device channel boosting methods in which at least two strings are connected to one bit line, the channel boosting methods including applying an initial channel voltage to channels of strings in a selected memory block, floating inhibit strings each having an un-programmed cell among the strings, and boosting channels of the floated inhibit strings.02-16-2012
20110069553SEMICONDUCTOR STORAGE DEVICE COMPRISING DOT-TYPE CHARGE ACCUMULATION PORTION AND CONTROL GATE, AND METHOD OF MANUFACTURING THE SAME - A semiconductor memory device includes a first insulation film, Charge accumulation portions, a second insulation film, and a control gate. The first insulation film is located on an active area (AA). The charge accumulation portions comprise minute crystals arranged on the first insulation film. A density of the charge accumulation portions at an end portion in an AA width direction of the first insulation film is higher than a density of the charge accumulation portions at a central potion in the AA width direction. The second insulation film is located on the first insulation film so as to coat the charge accumulation portions. The control gate is located on the second insulation film.03-24-2011
20110075486CHARGE TRAPPING MEMORY CELL HAVING BANDGAP ENGINEERED TUNNELING STRUCTURE WITH OXYNITRIDE ISOLATION LAYER - A band gap engineered, charge trapping memory cell includes a charge storage structure including a trapping layer. a blocking layer, and a dielectric tunneling structure including a thin tunneling layer, a thin bandgap offset layer and a thin isolation layer comprising silicon oxynitride. The memory cell is manufactured using low thermal budget processes.03-31-2011
20130170302SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATION AND OPERATION - A non-volatile semiconductor memory device comprises a semiconductor substrate and a plurality of gate structures formed on a cell region of the semiconductor substrate. The plurality of gate structures include: a first select-gate structure and a second select-gate structure disposed on the cell region, the first select-gate structure and the second select-gate structure spaced apart from each other, and a plurality of cell gate structures disposed between the first select-gate structure and the second select-gate structure. At least one of the select-gate structures comprises plural select gates.07-04-2013
20090180328Method for Accessing in Reading, Writing and Programming to a NAND Non-Volatile Memory Electronic Device Monolithically Integrated on Semiconductor - A method for accessing, in reading, programming, and erasing a semiconductor-integrated non-volatile memory device of the Flash EEPROM type with a NAND architecture having at least one memory matrix organized in rows or word lines and columns or bit lines, and wherein, for the memory, a plurality of additional address pins are provided. The method provides both an access protocol of the asynchronous type and a protocol of the extended type allowing to address, directly and in parallel, a memory extended portion by loading an address register associated with the additional pins in two successive clock pulses. A third multi-sequential access mode and a parallel additional bus referring to the additional address pins are also provided to allow a double addressing mode, sequential and in parallel.07-16-2009
20110063918IDENTIFYING AT-RISK DATA IN NON-VOLATILE STORAGE - The non-volatile storage system predicts which blocks (or other units of storage) will become bad based on performance data. User data in those blocks predicted to become bad can be re-programmed to other blocks, and the blocks predicted to become bad can be removed from further use.03-17-2011
20120206969Memory Array - A memory array used in the field of semiconductor technology includes a plurality of memory cells, bit lines, word lines perpendicular to the bit lines, and first/second control lines. The memory array uses split-gate memory cells, wherein two memory bit cells of a memory cell share one word line, thereby the read, program and erase of the memory cell can be realized by applying different voltages to the word line, two control gates and source/drain regions; the word line sharing structure enables a split-gate flash memory to effectively reduce the chip area and avoid over-erase problems while maintaining electrical isolation performance of the chip unchanged and not increasing the complexity of the process.08-16-2012
20110157994NAND-TYPE FLASH MEMORY AND NAND-TYPE FLASH MEMORY CONTROLLING METHOD - A method of controlling a NAND-type flash memory provided with a latch circuit in which data is temporarily stored has measuring a first consumption current of the latch circuit in a first state in which the latch circuit is caused to retain first logic; measuring a second consumption current of the latch circuit in a second state in which the latch circuit is caused to retain second logic obtained by inverting the first logic; and comparing the first consumption current and the second consumption current to cause the latch circuit to retain logic corresponding to the state corresponding to a smaller one of the first consumption current and the second consumption current.06-30-2011
20110157993SEMICONDUCTOR MEMORY DEVICE AND READ METHOD THEREOF - A read method using a semiconductor memory device includes reading data of a cell adjacent to a cell to be read and storing the data in a first latch of a first page buffer, sending the data, stored in the first latch, to a second latch of a second page buffer adjacent to the first page buffer, setting a read voltage of the cell to be read according to a value of the data stored in the first and second latches, and reading data of the cell to be read using the set read voltage.06-30-2011
20110157992APPARATUS, SYSTEM, AND METHOD FOR BIASING DATA IN A SOLID-STATE STORAGE DEVICE - An apparatus, system, and method are disclosed for improving performance in a non-volatile solid-state storage device. Non-volatile solid-state storage media includes a plurality of storage cells. The plurality of storage cells is configured such that storage cells in an empty state store initial binary values that satisfy a bias. An input module receives source data for storage in the plurality of storage cells of the non-volatile solid-state storage media. Bits of the source data have a source bias that is different from the bias of the plurality of storage cells. A bit biasing module biases the bits of the source data toward the bias of the plurality of storage cells. A write module writes the biased source data to the plurality of storage cells of the non-volatile solid-state storage media.06-30-2011
20110317490NONVOLATILE SEMICONDUCTOR MEMORY - A nonvolatile semiconductor memory can reduce variations in an amount of current during data writing operation. This allows for the writing of data to memory cells with high precision. The nonvolatile semiconductor memory includes a plurality of memory cells, word lines connected to the memory cells, and bit lines connected to each of the memory cells. At least two of the bit lines are selected, and a current is simultaneously supplied from a power supply line to those memory cells which are connected to the selected bit lines in order to write data thereto. The nonvolatile semiconductor memory also includes charge amount measurement units for measuring respective amounts of charge stored in the memory cells. The nonvolatile semiconductor memory also includes current path switching circuits connected to the respective bit lines. Those current path switching circuits which are connected to the selected bit lines supply a current from the power supply line to the memory cells or a predetermined terminal depending on a measured value of the amount of charge measured by the charge amount measurement section.12-29-2011
20110317489Nonvolatile Memory Devices, Read Methods Thereof And Memory Systems Including The Nonvolatile Memory Devices - Reading methods of nonvolatile memory devices including a substrate and a plurality of memory cells which are stacked in a direction intersecting the substrate. The reading methods apply a bit line voltage to a plurality of bit lines and apply a first string selection line voltage to at least one selected string selection line. The reading methods apply a second string selection line voltage to at least one unselected string selection line and apply a read voltage to a plurality of word lines. The reading methods apply a first ground selection line voltage to at least one selected ground selection line and apply a second ground selection line voltage to at least one unselected ground selection line.12-29-2011
20120044767NON-VOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME - A non-volatile memory device includes a plurality of unit cells. Each unit cell includes lower and upper electrodes over a substrate, a conductive organic material layer between the lower and the upper electrodes, and a nanocrystal layer located within the conductive organic material layer, wherein the nanocrystal layer includes a plurality of nanocrystals surrounded by an amorphous barrier. A read operation is performed when an input voltage is in a first voltage range. A first write operation is performed when the input voltage is in a second voltage range higher than the first voltage range. A second write operation is performed when the input voltage is in a third voltage range higher than the second voltage range. An erase operation is performed when the input voltage is higher than the third voltage range.02-23-2012
20120044766SEMICONDUCTOR MEMORY DEVICE WITH A STACKED GATE INCLUDING A CHARGE STORAGE LAYER AND A CONTROL GATE AND METHOD OF CONTROLLING THE SAME - A semiconductor memory device includes a transfer circuit and a control circuit. The transfer circuit which includes a p-type MOS transistor with a source to which is applied a first voltage and an n-type MOS transistor to whose gate the drain of the p-type MOS transistor is connected and the first voltage is transferred, to whose source a second voltage is applied, and whose drain is connected to a load. The control circuit which turns the p-type MOS transistor on and off and which turns the p-type MOS transistor on to make the p-type MOS transistor transfer the second voltage to the load and, during the transfer, turns the p-type MOS transistor off to make the gate of the n-type MOS transistor float at the first voltage.02-23-2012
20120002481METHOD OF PROGRAMMING A NON-VOLATILE MEMORY DEVICE - A method of programming a non-volatile memory device includes applying a first pass voltage to word lines in a direction of a source select line based on a first word line selected for a program operation, wherein the word lines do not include a second word line adjacent to the first word line in a direction of the source select line; and applying a first voltage, a program voltage and a second pass voltage when the first pass voltage reaches a given level. The first voltage is applied to the second word line, the program voltage is provided to the first word line, and the second pass voltage is applied to word lines in a direction of a drain select line on the basis of the first word line.01-05-2012
20120002479CIRCUIT FOR THE OPTIMIZATION OF THE PROGRAMMING OF A FLASH MEMORY - A non volatile memory device is provided. The memory device includes a plurality of memory cells and programming means. The programming circuitry is configured to select a group of memory cells, receive a first data word and program memory cells of the selected group based on the data word. the program means includes a program circuit configured to receive at least one second data word, and, for each second data word, select a corresponding portion of memory cells of the group and send a program current in parallel to discriminated memory cells of the portion based on the corresponding second data word during a corresponding program phase. The memory device further includes an optimization circuit configured to generate said at least one second data word from the first data word. Each of said at least one second data word is such to cause during each program phase that the number of discriminated memory cells is maximized compatibly with a maximum predetermined limit of the total program current provided by the program circuit.01-05-2012
20120008402SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A method of operating a semiconductor memory device includes performing an LSB program operation for selected memory cells while raising a program voltage, when the threshold voltages of some of the selected memory cells reach a target level, storing data, corresponding to a relevant program voltage, in a first flag cell, performing the LSB program operation for some of the selected memory cells, having threshold voltages not reached the target level, until the threshold voltages of all the selected memory cells reach the target level, and after the LSB program operation is completed, performing an MSB program operation for the selected memory cells by using a program voltage, set based on the data stored in the first flag cell, as a start program voltage.01-12-2012
20120008403SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes a boost circuit configured to boost a power supply voltage so as to generate first and second voltages, the second voltage being lower than the first voltage, a load circuit supplied with the first voltage, and a capacitor. The capacitor has first and second diffusion regions, a first insulating film formed on a channel region, a first electrode formed on the first insulating film, a second insulating film formed on the first electrode, and a second electrode formed on the second insulating film. The second voltage is applied to the first electrode. The first voltage is applied to the second electrode. The power supply voltage is applied to at least one of the first and second diffusion regions.01-12-2012
20120008404SYSTEM AND METHOD FOR REDUCING PIN-COUNT OF MEMORY DEVICES, AND MEMORY DEVICE TESTERS FOR SAME - Methods, memory devices and systems are disclosed. In one embodiment, a non-volatile memory device receives command signals through the same input/output terminals that receive address signals and write data signals and transmit read data signals. The input/output terminals are connected to a multiplexer, which is responsive to a received mode control signal to couple the input/output terminals to either a command bus or an input/output bus. A latch in the memory device latches the command signals when the mode control signal causes the input/output terminals to be coupled to the input/output bus. As a result, the command signals continue to be applied to the command bus. When the mode control signal causes the input/output terminals to be coupled to the input/output bus, write data signals are clocked into the memory device and read data signals are clocked out of the memory device responsive to a received clock signal.01-12-2012
20120008400NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME - A non-volatile semiconductor storage device includes: a memory string; a select transistor; and a carrier selection element. The select transistor has one end connected to one end of the memory string. The carrier selection element has one end connected to the other end of the select transistor, and selects a majority carrier flowing through respective bodies of the memory transistors and the select transistor. The carrier selection element includes: a third semiconductor layer; a metal layer; a second gate insulation layer; and a third conductive layer. The metal layer extends in the vertical direction. The metal layer extends in the vertical direction from the top of the third semiconductor layer. The second gate insulation layer surrounds the third semiconductor layer and the metal layer. The third conductive layer surrounds the third semiconductor layer and the metal layer via the second gate insulation layer and extends in a parallel direction.01-12-2012
20100214844Memory system and programming method thereof - Provided are a non-volatile memory system and a programming method thereof. The programming method of the non-volatile memory system includes adjusting a program-verify-voltage of a selected memory cell referring to program data to be written in an interfering cell configured to provide interference for the selected memory cell and programming the selected memory cell depending on the adjusted program-verify-voltage.08-26-2010
20120300552CHARGE PUMP CIRCUIT WITH FAST START-UP - A charge pump circuit (11-29-2012
20100329015METHOD OF OPERATING NONVOLATILE MEMORY DEVICE - A method of operating a nonvolatile memory device includes reading data stored in a main cell and a flag cell using a first read voltage, the nonvolatile memory device comprising the main cell for storing data including a least significant bit (LSB) and a most significant bit (MSB), and the flag cell for determining a program state of the main cell, determining a program state of the main cell based on the data read from the flag cell, reading data stored in the main cell and the flag cell using a second read voltage if a MSB page program has been performed on the main cell, and reading data stored in the main cell using a third or a fourth read voltage based on the data read from the flag cell using the second read voltage, if a threshold voltage of the main cell shifts.12-30-2010
20120026796STORAGE DEVICE AND METHOD FOR OPERATING THE SAME - A storage device includes a control unit, a first voltage supply unit for supplying a first working voltage to the control unit, N memory units, a second voltage supply unit for supplying a second working voltage to each memory unit, a logic gate, a first voltage detecting unit and a second voltage detecting unit. Once the first voltage detecting unit detects that the first working voltage of the control unit is abnormal, the logic gate outputs a first write protect signal to notify the control unit and control the memory units to enter a write protect mode. Once the second voltage detecting unit detects that the second working voltage of one or more memory units is abnormal, the logic gate outputs a second write protect signal to notify the control unit and control the one or more memory units to enter the write protect mode.02-02-2012
20120206971PROGRAMMABLE MEMORY DEVICE AND MEMORY ACCESS METHOD - A programmable memory device includes a plurality of one-time programmable (OTP) memory units, a search unit, a writing unit, and a reading unit. Each OTP memory unit is assigned an address. The search unit searches for the first writable OTP memory unit from the plurality of OTP memory units in a writing operation, or searches for the last programmed OTP memory unit from the plurality of OTP memory units in a reading operation. The writing unit writes data to be written and the bit length of the data to the first writable OTP memory unit. The reading unit sequentially reads data from the last programmed OTP memory unit.08-16-2012
20120206970SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, an interface includes first to third input circuits, delay and selection circuits. The first input circuit outputs an active first internal signal in response to an active first control signal received by a memory device. The second input circuit outputs an active second internal signal in response to an active second control signal received by the device while the device is receiving the active first control signal. The delay circuit outputs a selection signal in first or second states after the elapse of a first period from inactivation or activation of the first control signal. The selection circuit outputs the first and second internal signals as an enable signal while receiving the selection signal of the first and second states. The third input circuit outputs an input signal received from the outside from the interface to inside the device while receiving the active enable signal.08-16-2012
20120063230Trench MONOS memory cell and array - The MONOS vertical memory cell of the present invention allow miniaturization of the memory cell area. The two embodiments of split gate and single gate provide for efficient program and erase modes as well as preventing read disturb in the read mode.03-15-2012
20120063231Apparatus, System, and Method for Non-Volatile Storage Element Programming - Methods, storage controllers, and systems for non-volatile storage element programming are described. One method includes programming user data in pages associated with a set of wordlines of an erase block of a non-volatile, solid-state storage element. The method further includes selecting at least one of the wordlines of the set programmed with the user data and restricting further programming of user data in the pages associated with the selected wordline. In some embodiments, the selected wordline occurs subsequent to the pages associated with the other wordlines of the set in a page programming order for the erase block.03-15-2012
20090135653METHOD FOR PERFORMING OPERATIONS ON A MEMORY CELL - A method for performing operations on a memory cell is disclosed. The memory cell includes a substrate, a first doping region and a second doping region. The first doping region and the second doping region are formed on the substrate with a channel region therebetween. A dielectric layer is formed above the channel region and a conductive gate is formed over the dielectric layer. The method includes applying a first constant voltage for a first period to the conductive gate followed by applying a second constant voltage for a second period to the conductive gate repeatedly. The value of the first constant voltage is different from the value of the second constant voltage. A third constant voltage and a fourth voltage are applied to the first doping region and the second doping region respectively.05-28-2009
20090135654MEMORY READ METHODS, APPARATUS, AND SYSTEMS - Some embodiments include first memory cells and a first line used to access the first memory cells, second memory cells and at least one second line used to access the second memory cells. The first and second memory cells have a number of threshold voltage values corresponding to a number of states. The states represent values of information stored in the memory cells. During a read operation to read the first memory cells, a first voltage may be applied to the first line and a second voltage may be applied to the second line. At least one of the first and second voltages may include a value based on a change of at least one of the threshold voltage values changing from a first value to a second value. The first and second values may correspond to a unique state selected from all of the states. Other embodiments including additional apparatus, systems, and methods are disclosed.05-28-2009
20100027343Non-Volatile Memory Monitor - The invention provides circuits, systems, and methods for monitoring a non-volatile memory (NVM) cell, or an array of NVM cells. The monitor is capable of switching from a normal operating state to an evaluation state, monitoring for one or more particular characteristics, and returning to the normal operating state. Alternative embodiments of the invention are disclosed using various triggers and producing outputs capable of reporting or feeding back to influence the operation of the monitoring systems and methods, the NVM circuitry, or an external system. The invention includes an energy conservation feature, in that no power is consumed in the normal operating state, and low power in the evaluation state.02-04-2010
20120155181Method and Apparatus for Reducing Read Disturb in Memory - Various aspects of a NAND memory include have multiple versions of a high threshold voltage distribution—a version with a reduced maximum, and another version. The version with a reduced maximum has a reduced word line pass voltage.06-21-2012
20120106255VOLTAGE GENERATION CIRCUIT WHICH IS CAPABLE OF REDUCING CIRCUIT AREA - According to one embodiment, a voltage generation circuit includes a first boost circuit, a first output circuit, a rectifying circuit, a second output circuit, and a detection circuit. The first boost circuit outputs a first voltage in first and second operation modes. The first output circuit is connected to the first boost circuit, and outputs the first voltage as a second voltage in the first operation mode. The rectifying circuit is connected to the first boost circuit, and outputs a third voltage which is lower than the first voltage in the first operation mode. The second output circuit short-circuits the rectifying circuit in the second operation mode, and outputs the first voltage as a fourth voltage. The detection circuit detects the second and fourth voltages which are supplied from the first and second output circuits.05-03-2012
20100238734SEMICONDUCTOR NON-VOLATILE MEMORY, CHARGE ACCUMULATING METHOD FOR SEMICONDUCTOR NON-VOLATILE MEMORY, CHARGE ACCUMULATING PROGRAM STORAGE MEDIUM - There is provided a semiconductor non-volatile memory including: plural memory sections, a voltage application section, and a control section that controls the voltage application section wherein the control section controlling voltage application such that, based on a value of current detected by a current detection section, in a region where the current flowing in a channel region is greater than a predetermined target value at which a amount of charge accumulated has become a specific value in at least one of a first charge accumulating section or a second charge accumulating section, when a value of current flowing in the channel region approaches a target value, a rate of increase in the charge accumulating amount per time is decreased at least once.09-23-2010
20110090742SEMICONDUCTOR INTEGRATED CIRCUIT ADAPTED TO OUTPUT PASS/FAIL RESULTS OF INTERNAL OPERATIONS - In a semiconductor integrated circuit, an internal circuit is capable of executing a first operation and a second operation concurrently, and an output circuit outputs to the outside of the semiconductor integrated circuit information indicating whether or not the first operation is being executed and information indicating whether or not the second operation is executable.04-21-2011
20110090741NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE ADAPTED TO STORE A MULTI-VALUED DATA IN A SINGLE MEMORY CELL - A non-volatile semiconductor memory device includes an electrically data rewritable non-volatile semiconductor memory cell and a write circuit for writing data in the memory cell, the write circuit writing a data in the memory cells by supplying a write voltage Vpgm and a write control voltage VBL to the memory cell, continuing the writing of the data in the memory cell by changing the value of the write control voltage VBL in response to an advent of a first write state of the memory cell and inhibiting any operation of writing a data to the memory cell by further changing the value of the write control voltage VBL to Vdd in response to an advent of a second write state of the memory cell.04-21-2011
20110090740NONVOLATILE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A flash memory device comprises alternately arranged odd and even memory cells. The odd and even memory cells are connected to corresponding odd and even bitlines, which are connected to corresponding odd and even page buffers. In a read operation of the flash memory device, data is sensed at two different times via the odd and even bitlines. In certain embodiments, data is read from the odd page buffers while data is being sensed via the even bit lines, or vice versa.04-21-2011
20110090739INDEPENDENT WELL BIAS MANAGEMENT IN A MEMORY DEVICE - Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods.04-21-2011
20100182837MAGNETIC FLOATING GATE MEMORY - An apparatus includes at least one memory device including a floating gate element and a magnetic field generator that operably applies a magnetic field to the memory device. The magnetic field directs electrons in the memory device into the floating gate element.07-22-2010
20100172183Method and Apparatus to Suppress Fringing Field Interference of Charge Trapping NAND Memory - With advanced lithographic nodes featuring a half-pitch of 30 nm or less, charge trapping NAND memory has neighboring cells sufficiently close together that fringing fields from a neighboring pass gate interferes with the threshold voltage. The interference results from fringing fields that occupy the gaps that separate the neighboring charge storage structures. The fringing electric fields are suppressed, by the insulating structures having a relative dielectric constant with respect to vacuum that is less than a relative dielectric constant of silicon oxide, from entering the neighboring charge storage structures. In some embodiments, the insulating structures suppress the fringing electric fields from entering a channel region. This suppresses the short channel effects despite the small dimensions of the devices.07-08-2010
20110103148Normally off gallium nitride field effect transistors (FET) - A heterostructure field effect transistor (HFET) gallium nitride (GaN) semiconductor power device comprises a hetero-junction structure comprises a first semiconductor layer interfacing a second semiconductor layer of two different band gaps thus generating an interface layer as a two-dimensional electron gas (2DEG) layer. The power device further comprises a source electrode and a drain electrode disposed on two opposite sides of a gate electrode disposed on top of the hetero-junction structure for controlling a current flow between the source and drain electrodes in the 2DEG layer. The power device further includes a floating gate located between the gate electrode and hetero-junction structure, wherein the gate electrode is insulated from the floating gate with an insulation layer and wherein the floating gate is disposed above and padded with a thin insulation layer from the hetero-junction structure and wherein the floating gate is charged for continuously applying a voltage to the 2DEG layer to pinch off the current flowing in the 2DEG layer between the source and drain electrodes whereby the HFET semiconductor power device is a normally off device.05-05-2011
20110103149NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SAME - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array includes a stacked body, a through-hole, a semiconductor pillar, and a charge storage film. The stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films. The through-hole is made in the stacked body to align in a stacking direction. The semiconductor pillar is buried in the through-hole. The charge storage film is provided between the electrode films and the semiconductor pillar. Memory cells are formed at each intersection between the electrode films and the semiconductor pillar. The control circuit writs a first value to at least some of the memory cells, performs an erasing operation of the first value from the memory cell written with the first value, reads data stored in the memory cell having undergone the erasing operation, and sets the memory cell to be unusable in a case that the first value is read from the memory cell.05-05-2011
20110032766N-CHANNEL SONOS NON-VOLATILE MEMORY FOR EMBEDDED IN LOGIC - A system and method of an electrically programmable and erasable non-volatile memory cell fabricated using a single-poly, logic process with the addition of ONO deposition and etching is disclosed. In one embodiment, a non-volatile memory system includes at least one non-volatile memory cell consists of a SONOS transistor fabricated on a P substrate, with a deep N-well located in the P substrate, with a P-well located in the deep N-well. The memory cell further includes an access NMOS transistor, coupled to the SONOS transistor and located in the same P-well that includes an oxide only gate-dielectric. The cell can be fabricated in a modified logic process with other transistors and with their physical characteristics preserved.02-10-2011
20110032765Memory Formed By Using Defects - A non-volatile memory is provided. The non-volatile memory comprises at least a silicon-on-insulator transistor including a substrate; an insulating layer disposed on the substrate; an active region disposed on the insulating layer; and an energy barrier device disposed in the active region and outputting a relatively small current when the non-volatile memory is read.02-10-2011
20120120728NON-VOLATILE MEMORY DEVICE - A non-volatile memory device is provided, including a substrate formed of a single crystalline semiconductor, pillar-shaped semiconductor patterns extending perpendicular to the substrate, a plurality of gate electrodes and a plurality of interlayer dielectric layers alternately stacked perpendicular to the substrate, and a charge spread blocking layer formed between the plurality of gate electrodes and the plurality of interlayer dielectric layers.05-17-2012
20120250417HOT ELECTRON INJECTION NANOCRYSTALS MOS TRANSISTOR - The disclosure relates to a hot electron injection MOS transistor, comprising source and drain regions formed in a semiconductor substrate, a control gate, and a floating gate comprising electrically conductive nanoparticles. The control gate comprises a first portion arranged at a first distance from the substrate, a second portion arranged at a second distance less than the first distance from the substrate, and an intermediary portion linking the first and the second portions.10-04-2012
20090116291METHOD OF MAKING INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE ONE-TIME - PROGRAMMABLE AND MULTIPLE-TIME PROGRAMMABLE MEMORY - A programmable non-volatile device is made which uses a floating gate that functions as a FET gate that overlaps a portion of a source/drain region. This allows a programming voltage for the device to be imparted to the floating gate through capacitive coupling, thus changing the state of the device. The invention can be used in environments such as data encryption, reference trimming, manufacturing ID, security ID, and many other applications.05-07-2009
20100290288NONVOLATILE MEMORY DEVICE AND METHOD OF TESTING THE SAME - A nonvolatile memory device includes a storage unit configured to store pattern data selected based on a test command set, and a control unit configured to consecutively perform a program operation on a number of pages in response to the pattern data to obtain programmed pages, consecutively perform a read operation on the programmed pages, and provide information about a bit line coupled to a fail memory cell and about a number of fail bit lines checked as a result of the read operation.11-18-2010
20120213007CONTROLLING A NON-VOLATILE MEMORY - Controlling a non-volatile memory. The non-volatile memory includes a plurality of memory cells in an integrated circuit substrate. The non-volatile memory also includes a high-voltage node in power-transmissive communication with the plurality of memory cells. Further, the non-volatile memory includes an intermediate-voltage node in power-transmissive communication with the plurality of memory cells. Moreover, the non-volatile memory includes a counter-doped-gate device, coupled within the integrated circuit substrate, in power-transmissive communication between the high-voltage node and the intermediate-voltage node.08-23-2012
20120127798METHOD AND APPARATUS FOR SHARING INTERNAL POWER SUPPLIES IN INTEGRATED CIRCUIT DEVICES - A method, system and apparatus for sharing internal power supplies in integrated circuit devices is described. A multiple device integrated circuit 05-24-2012
20120163089METHOD FOR WRITING DATA IN SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE DEVICE - A method for writing data in a semiconductor storage device and a semiconductor storage device are provided, that can reduce variations in readout current from a sub storage region which serves as a reference cell for the memory cells of the semiconductor storage device, thereby preventing an improper determination from being made when determining the readout current from a memory cell. In the method, data is written on a memory cell in two data write steps by applying voltages to the first and second impurity regions of the memory cell, the voltages being different in magnitude from each other.06-28-2012
20120163091SEMICONDUCTOR MEMORY DEVICE WHICH STORES PLURAL DATA IN A CELL - A memory cell array is configured to have a plurality of memory cells arranged in a matrix, each of the memory cells being connected to a word line and a bit line and being capable of storing n values (n is a natural number equal to or larger than 3). A control circuit controls the potentials of the word line and bit line according to input data and writes data into a memory cell. The control circuit writes data into the memory cell to a k-valued threshold voltage (k<=n) in a write operation, precharges the bit line once, and then changes the potential of the word line an i number of times to verify whether the memory cell has reached an i-valued (i<=k) threshold voltage.06-28-2012
20120163090INFORMATION RECORDING/REPRODUCING DEVICE - According to one embodiment, an information recording/reproducing device includes a recording layer, and a recording circuit configured to record information by generating a phase change in the recording layer while applying a voltage to the recording layer. The recording layer comprises a compound including at least one type of cationic element, and at least one type of anionic element, at least the one type of cationic element is a transition element including a d orbital incompletely filled with electrons, and the average shortest distance between adjacent cationic elements is 0.32 nm or less, and the recording layer is provided with a material selected from (i) A06-28-2012
20100208522MEMORY DEVICE AND READING METHOD THEREOF - A memory device (08-19-2010
20100165735NONVOLATILE SEMICONDUCTOR MEMORY - A nonvolatile semiconductor memory of an aspect of the present invention comprises a voltage step-down circuit including a first and a second circuit to achieve a voltage drop and configured to decrease the first voltage to a second voltage less than the first voltage, a transfer transistor to transfer the second voltage to a word line, and a control circuit to generate the second voltage as a first write voltage in a first mode wherein the first write voltage less than or equal to a prescribed magnitude is applied to the word line, and to generate the second voltage as a second write voltage in a second mode wherein the second write voltage greater than the prescribed magnitude is applied to the word line, wherein the difference between the first voltage and the second voltage is greater than or equal to the threshold voltage of the transfer transistor.07-01-2010
20120163087Decoder for Nand Memory - An integrated circuit device has multiple blocks of NAND memory cells, and a high voltage switch. The high voltage switch is coupled to a decoder output and the blocks of NAND memory cells. The high voltage switch has an output voltage range with positive and negative voltages.06-28-2012
20100027345ERASABLE NON-VOLATILE MEMORY DEVICE USING HOLE TRAPPING IN HIGH-K DIELECTRICS - A non-volatile memory is described having memory cells with a gate dielectric. The gate dielectric is a multilayer charge trapping dielectric between a control gate and a channel region of a transistor to trap positively charged holes. The multilayer charge trapping dielectric comprises at least one layer of high-K.02-04-2010
20120314503COARSE AND FINE PROGRAMMING IN A SOLID STATE MEMORY - Memory devices adapted to receive and transmit analog data signals representative of bit patterns of two or more bits facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits. Programming of such memory devices includes initially programming a cell with a coarse programming pulse to move its threshold voltage in a large step close to the programmed state. The neighboring cells are then programmed using coarse programming. The algorithm then returns to the initially programmed cells that are then programmed with one or more fine pulses that slowly move the threshold voltage in smaller steps to the final programmed state threshold voltage.12-13-2012
20120314502PROGRAMMING NON-VOLATILE STORAGE WITH SYNCHONIZED COUPLING - A process for programming non-volatile storage is able to achieve faster programming speeds and/or more accurate programming through synchronized coupling of neighboring word lines. The process for programming includes raising voltages for a set of word lines connected a group of connected non-volatile storage elements. The set of word lines include a selected word line, unselected word lines that are adjacent to the selected word line and other unselected word lines. After raising voltages for the set of word lines, the process includes raising the selected word line to a program voltage and raising the unselected word lines that are adjacent to the selected word line to one or more voltage levels concurrently with the raising the selected word line to the program voltage. The program voltage causes at least one of the non-volatile storage elements to experience programming.12-13-2012
20120134213METHOD COMPENSATION OPERATING VOLTAGE, FLASH MEMORY DEVICE, AND DATA STORAGE DEVICE - Disclosed is a method generating a compensated operating voltage, such as a read voltage, in a non-volatile memory device, and a related non-volatile memory device. The operating voltage is compensated in response to one or more memory cell conditions such as temperature variation, programmed data state or physical location of a selected memory cell, page information for selected memory cell, or the location of a selected word line.05-31-2012
20100177568READ MODE FOR FLASH MEMORY - A method for reading a nonvolatile memory array including an array of memory cells, each memory cell including a substrate, a control gate, a charge storage element, a source region and a drain region, includes receiving, at an address register, a read command including an address for a memory cell in the array of memory cells and an indication regarding whether the read command is a full page read command or a partial page read command. A starting address for a page including the received address is identified, wherein the page includes multiple rows of memory cells in the array of memory cells. The address register is reset to the starting address for the page. It is determined whether all memory cells in the page are non-programmed. Data indicative of a non-programmed state of the page is output if it is determined that all memory cells in the page are non-programmed.07-15-2010
20120163086CONCURRENT OPERATION OF PLURAL FLASH MEMORIES - A device comprises an address storage device. A first circuit includes a first flash memory, configured to sequentially receive first and second addresses and store the first address in the address storage device. The first circuit has a first set of control inputs for causing the first circuit to perform a first operation from the group consisting of read, program and erase on a cell of the first flash memory corresponding to a selected one of the first and second addresses. A second circuit includes a second flash memory, configured to receive the second address. The second circuit has a second set of control inputs for causing the second circuit to read data from a cell of the second flash memory corresponding to the second address while the first operation is being performed.06-28-2012
20120163085Non-Volatile Memory And Methods With Soft-Bit Reads While Reading Hard Bits With Compensation For Coupling - A non-volatile memory has its cells' thresholds programmed within any one of a first set of voltage bands partitioned by a first set of reference thresholds across a threshold window. Hard bits are obtained when read relative to the first set of reference thresholds. The cells are read at a higher resolution relative to a second set of reference thresholds so as to provide additional soft bits for error correction. The soft bits are generated by a combination of a first modulation of voltage on a current word line WLn and a second modulation of voltage on an adjacent word line WLn+1, as in a reading scheme known as “Direct-Lookahead (DLA)”.06-28-2012
20090059670NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - There is provided a nonvolatile semiconductor memory device which can read and verify a cell with a negative threshold voltage by biasing voltages of a source line and well line to a positive voltage. The nonvolatile semiconductor memory device includes a voltage control circuit which applies a select gate voltage obtained by adding the biased positive voltage to a voltage set at read time of a cell with a positive threshold voltage to a select gate at a read time and verify time for the cell with the negative threshold voltage.03-05-2009
20110188315NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE HAVING NON-SELECTED WORD LINES ADJACENT TO SELECTED WORD LINES BEING CHARGED AT DIFFERENT TIMING FOR PROGRAM DISTURB CONTROL - A non-volatile semiconductor memory device includes a memory cell array of data-rewritable non-volatile memory cells or memory cell units containing the memory cells, and a plurality of word lines each commonly connected to the memory cells on the same row in the memory cell array. In write pulse applying during data writing, a high voltage for writing is applied to a selected word line, and an intermediate voltage for writing is applied to at least two of non-selected word lines. The beginning of charging a first word line located between the selected word line and a source line to a first intermediate voltage for writing is followed by the beginning of charging a second word line located between the selected word line and a bit line contact to a second intermediate voltage for writing.08-04-2011
20120176842Memory System - The present invention provides a memory system which contributes to improvement in efficiency of a data process accompanying a memory access. A memory system has a rewritable nonvolatile memory, a buffer memory, and a controller. The controller controls, in response to an access request from an external apparatus, first data transfer between the controller and the external apparatus, second data transfer between the controller and the nonvolatile memory, and third data transfer between the controller and the buffer memory, controls transfer from the controller to the buffer memory in the third data transfer and transfer from the buffer memory to the controller in a time sharing manner, and enables the first data transfer or the second data transfer to be performed in parallel with the transfer carried out in the time sharing manner.07-12-2012
20100271882NONVOLATILE SEMICONDUCTOR MEMORY APPARATUS COMPRISING CHARGE ACCUMULATION LAYER AND CONTROL GATE - A nonvolatile semiconductor memory apparatus includes memory cell strings, first and second bit lines, a first buffer, a second buffer, and a controlling unit. The memory cell strings each include memory cells. The first and second bit lines connected to the memory cell strings. The first buffer connects to the first bit line and holds first data. The second buffer connects to the second bit line and holds second data. The controlling unit includes first and second latches and controls timing to output the first and second data according to an internal terminal, a second signal, and a third signal, and transfers a control signal synchronized with the timing of the first and second data to the external terminal. The controlling unit allows the first latch to hold the first and second data, and transfers the first data, and thereafter transfers the second data.10-28-2010
20100271881SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit device includes a memory cell array including a plurality of planes each including a plurality of memory cells, a power supply voltage generating circuit including a voltage generating circuit configured to generate a power supply voltage common to the plurality of planes, a select number detection circuit configured to detect a number of selected planes of the plurality of planes, and a resistance variable circuit configured to vary a wiring resistance between the plurality of planes and the voltage generating circuit in accordance with the number of selected planes, which is reported from the select number detection circuit, and a control circuit configured to control the power supply voltage generating circuit.10-28-2010
20100271880TECHNIQUES FOR CONTROLLING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for controlling a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for controlling a direct injection semiconductor memory device. The method may comprise applying a first voltage potential to a first region via a bit line and applying a second voltage potential to a second region of the memory device via a source line. The method may also comprise applying a control voltage potential to a body region of the memory device via a word line that is spaced apart and capacitively coupled to the body region, wherein the body region is electrically floating and disposed between the first region and the second region. The method may further comprise applying a third voltage potential to a third region of the memory device via a carrier injection line in order to bias at least one of the first region, the second region, the third region, and the body region to perform one or more operations.10-28-2010
20100284225NONVOLATILE MEMORY DEVICE - A nonvolatile memory device includes a memory cell array configured to include cell strings coupled between respective bit lines and a source line, a unilateral element coupled to the source line, and a negative voltage generation unit coupled to the unilateral element and configured to generate a negative voltage.11-11-2010
20120218824INDEPENDENT WELL BIAS MANAGEMENT IN A MEMORY DEVICE - Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods.08-30-2012
20080266968CHARGE PUMP CIRCUIT, SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR DRIVING THE SAME - A semiconductor memory device includes: a memory cell array including a plurality of memory cells arranged in rows and columns for holding information, each of the memory cells having a control gate; a plurality of word lines extending in a row direction, each of the word lines being connected to the control gates of the memory cells of a corresponding row of the memory cell array; a plurality of bit lines extending in a column direction and connected to sources or drains of the memory cells; a row decoder for selecting any of the plurality of word lines; a column decoder for selecting any of the plurality of bit lines; a charge pump circuit for generating a voltage higher than a supply voltage; and a first switch located in a connection path between the row decoder and the charge pump circuit.10-30-2008
20120257453NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to one embodiment of the present invention includes: a memory cell array and a control circuit. The control circuit executes a first reading operation and a second reading operation. The first reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between a control gate electrode and source of the selected memory cell to a first value. The second reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between the control gate electrode and source of the selected memory cell to a second value lower than the first value. When executing the second reading operation, the control circuit keeps a voltage of the control gate electrode of the selected memory cell to 0 or a positive value.10-11-2012
20120188823SEMICONDUCTOR DEVICE - A semiconductor device includes a charge pump circuit that generates a first voltage during a first period and a second voltage during a second period following the first period by a boosting operation, a load current application circuit that includes a first memory cell, and that applies the first voltage to the first memory cell, a memory circuit that includes a second memory cell, and that applies the second voltage to the second memory cell; and a voltage detection circuit that monitors a value of the first voltage to determine whether or not the first voltage is increased to the predetermined voltage, wherein the charge pump circuit stops the boosting operation if the first voltage is less than the predetermined voltage at an end of the first period.07-26-2012
20120262991METHODS AND DEVICES FOR DETERMINING SENSING VOLTAGES - The present disclosure includes methods and devices for determining sensing voltages. One such method includes comparing data associated with a number of template distributions to data associated with a first threshold voltage distribution and a second threshold voltage distribution associated with a number of memory cells programmed to particular adjacent program states, determining an intersection of the first and second threshold voltage distributions based on a template distribution of the number template distributions which most closely compares to the first and second threshold voltage distributions, and using the determined intersection to determine a sensing voltage used to sense the number of memory cells programmed to the particular adjacent program states.10-18-2012
20120262992SEMICONDUCTOR DEVICE INCLUDING MULTI-CHIP - In order to implement a memory having a large storage capacity and a reduced data retention current, a non-volatile memory, an SRAM, a DRAM, and a control circuit are modularized into one package. The control circuit conducts assignment of addresses to the SRAM and DRAM, and stores data that must be retained over a long period of time in the SRAM. In the DRAM, a plurality of banks are divided into two sets, and mapped to the same address space, and sets are refreshed alternately. A plurality of chips of them are stacked and disposed, and wired by using the BGA and chip-to-chip bonding.10-18-2012
20120257454FLASH STORAGE DEVICE WITH DATA INTEGRITY PROTECTION - A flash storage device includes a power hold circuit including a double layer capacitor. A power source supplies power to the flash storage device and charges the double layer capacitor. The double layer capacitor supplies power for maintaining integrity of data during a data transfer occurring in the flash storage device when the power supplied by the power source is disrupted. Additionally, the flash storage device can inhibit subsequent data transfers until the power supplied by the power source is restored.10-11-2012
20120081968N WELL IMPLANTS TO SEPARATE BLOCKS IN A FLASH MEMORY DEVICE - A semiconductor memory device that has an isolated area formed from one conductivity and formed in part by a buried layer of a second conductivity that is implanted in a substrate. The walls of the isolated area are formed by implants that are formed from the second conductivity and extend down to the buried layer. The isolated region has implanted source lines and is further subdivided by overlay strips of the second conductivity that extend substantially down to the buried layer. Each isolation region can contain one or more blocks of memory cells.04-05-2012
20120081967METHOD AND SYSTEM FOR PROGRAMMING NON-VOLATILE MEMORY CELLS BASED ON PROGRAMMING OF PROXIMATE MEMORY CELLS - A multi-level non-volatile memory device programs cells in each row in a manner that takes into account the coupling from the programming of cells that are proximate the row to be programmed. In one example of the invention, after the row has been programmed, the proximate cells are verified by read, comparison, and, if necessary, reprogramming operations to compensate for charge added to proximate memory cells resulting from programming the row. In another example of the invention, a row of memory cells is programmed with charge levels that take into account the charge that will be added to the memory cells when proximate memory cells are subsequently programmed.04-05-2012
20120081966COMBINED EEPROM/FLASH NON-VOLATILE MEMORY CIRCUIT - A non-volatile memory circuit includes memory rows and supporting circuits coupled to the memory rows, where at least one of the memory rows include at least one Electrically Erasable Programmable Read-Only Memory (EEPROM) memory element and at least one Flash memory element. The EEPROM and Flash elements are configured to share some of the supporting circuits and can be accessed in parallel.04-05-2012
20120230108MEMORY DEVICE WITH MULTIPLE PLANES - Disclosed herein is a device that comprises at least one selection/non-selection voltage receiving line, at least one word line operatively coupled to the selection/non-selection voltage receiving line, and a plurality of memory cells coupled to the word line; a selection voltage source line; and a selection voltage supply circuit comprising a first switch circuit and a first driver circuit driving the first switch circuit to be turned ON or OFF, the first switch circuit including a first node coupled to the selection voltage source line, a second node coupled to the selection/non-selection voltage receiving line of the first memory plane and a third node coupled to the selection/non-selection voltage receiving line of the second memory plane, and the first driver circuit being provided in common to the first and second memory planes.09-13-2012
20120230111LEVEL SHIFTING CIRCUIT - A level shifting circuit having an input and an output where the level shifting circuit is configured to receive a logical high level having a first voltage level at the input and to output a logical high level having a second voltage level at the output where the second voltage level is higher than the first voltage level. Level shifting circuit embodiments having two or more parallel coupled depletion mode transistors coupled to a high voltage source and further coupled to the output by an enhancement mode transistor, and an additional transistor coupled between a first signal and the output of the level shifting circuit where the first signal has the same logic level of the input are disclosed.09-13-2012
20120230112NONVOLATILE MEMORY DEVICE, DRIVING METHOD THEREOF, AND MEMORY SYSTEM HAVING THE SAME - A nonvolatile memory device (NVM), memory system and apparatus include control logic configured to perform a method of applying negative voltage on a selected wordline of the NVM. During a first time a first high voltage level is applied to the channel of a transistor of a address decoder and a ground voltage is applied to the well of the transistor. And, during a second time a second high voltage level is applied to the channel of the transistor, and within the second time interval a first negative voltage is applied to the well of the transistor. The first high voltage level is higher than the second high voltage level, and a voltage applied on the selected wordline is negative within the second time interval.09-13-2012
20120230110METHOD AND APPARATUS FOR ADDRESSING MEMORY ARRAYS - The present description relates to non-volatile memory arrays and the operation thereof In at least one embodiment, the non-volatile memory array may include a plurality of memory modules coupled in a daisy chain with enable in/out signals, and a single chip enable signal coupled in parallel to each memory module. With such a configuration, all memory units within each of the memory modules of each memory array may be addressed with the single chip enable09-13-2012
20110122701SEMICONDUCTOR MEMORY HAVING ELECTRICALLY ERASABLE AND PROGRAMMABLE SEMICONDUCTOR MEMORY CELLS - An electrically alterable non-volatile multi-level memory device and a method of operating such a device, which includes setting a status of at least one of the memory cells to one state selected from a plurality of states including at least first to fourth level states, in response to information to be stored in the one memory cell, and reading the status of the memory cell to determine whether the read out status corresponds to one of the first to fourth level states by utilizing a first reference level set between the second and third level states, a second reference level set between the first and second level states and a third reference level set between the third and fourth level states.05-26-2011
20090238005MULTI-PLANE TYPE FLASH MEMORY AND METHODS OF CONTROLLING PROGRAM AND READ OPERATIONS THEREOF - A multi-plane type flash memory device comprises a plurality of planes each including a plurality of memory cell blocks, page buffers each latching an input data bit to be output to its corresponding plane or latching an output data bit to be received from the corresponding plane, cache buffers each storing an input or output data bits in response to one of cache input control signals and each transferring the stored data bit to the page buffer or an external device in response to one of cache output control signals, and a control logic circuit generating the cache input and output control signals in response to command and chip enable signals containing plural bits. The program and read operations for the plural planes are conducted simultaneously in response to the chip enable signal containing the plural bits, which increases an operation speed and data throughput processed therein.09-24-2009
20100329019SEMICONDUCTOR STORAGE DEVICE AND ELECTRONIC DEVICE USING THE SAME - When data is read from a memory cell of a top array block to a bit line, a switching device is closed so that the data is stored in the form of electrical charges at a bit line of a bottom array block. The switching device at a top array side is opened to drive a sense amplifier, and thus, the data read from the memory cell and retained at the bit line of the bottom array block is output to the outside. While the data is output in the above-described manner, a potential of the bit line of the top array block can be precharged to start a next read operation.12-30-2010
20100329018METHOD OF OPERATING NONVOLATILE MEMORY DEVICE CAPABLE OF READING TWO PLANES - A nonvolatile memory device is operated by receiving a dual plane read command for simultaneously reading first and second planes, each comprising memory cells, receiving an MSB read address for reading data stored in the memory cells, checking whether an MSB program operation has been performed on each of the first and second planes, and performing the read operation on the first and second planes according to a result of the check and outputting the read data.12-30-2010
20100329016SEMICONDUCTOR DEVICE - The performance of a semiconductor device including a nonvolatile memory is enhanced. Each of nonvolatile memory cells arranged over a silicon substrate includes: a first n-well; a second n-well formed in a place different from the place thereof; a selection transistor formed in the first n-well; and an electric charge storage portion having a floating gate electrode and a storage portion p-well. The floating gate electrode is so placed that it overlaps with part of the first n-well and the second n-well. The storage portion p-well is placed in the first n-well so that it partly overlaps with the floating gate electrode. In this nonvolatile memory cell, memory information is erased by applying positive voltage to the second n-well to discharge electrons in the floating gate electrode to the second n-well.12-30-2010
20100329014SEMICONDUCTOR MEMORY DEVICE AND METHOD OF READING THE SAME - A semiconductor memory device includes a memory cell array including an even page cell group and an odd page cell group, and a page buffer configured to read data stored in memory cells of the even page cell group and the odd page cell group and store the read data. The page buffer comprises a first latch configured to store first even page data of the even page cell group when a first read operation is performed, a second latch configured to store odd page data of the odd page cell group when a second read operation is performed, and a third latch configured to store second even page data of the even page cell group when a third read operation is performed.12-30-2010
20080298130MEMORY DEVICE DISTRIBUTED CONTROLLER SYSTEM - A memory device distributed controller circuit distributes memory control functions amongst a plurality of memory controllers. A master controller receives an interpreted command and activates the appropriate slave controllers depending on the command. The slave controllers can include a data cache controller that is coupled to and controls the data cache and an analog controller that is coupled to and controls the analog voltage generation circuit. The respective controllers have appropriate software/firmware instructions that determine the response the respective controllers take in response to the received command.12-04-2008
20080298129NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE ADAPTED TO STORE A MULTI-VALUED DATA IN A SINGLE MEMORY CELL - A non-volatile semiconductor memory device includes an electrically data rewritable non-volatile semiconductor memory cell and a write circuit for writing data in the memory cell, the write circuit writing a data in the memory cells by supplying a write voltage Vpgm and a write control voltage VBL to the memory cell, continuing the writing of the data in the memory cell by changing the value of the write control voltage VBL in response to an advent of a first write state of the memory cell and inhibiting any operation of writing a data to the memory cell by further changing the value of the write control voltage VBL to Vdd in response to an advent of a second write state of the memory cell.12-04-2008
20120320680METHOD, APPARATUS, AND MANUFACTURE FOR STAGGERED START FOR MEMORY MODULE - A method, apparatus, and manufacture for memory device startup is provided. Flash memory devices are configured such that, upon the power supply voltage reaching a pre-determined level, each flash memory is arranged to load the random access memory with instructions for the flash memory, and then execute a first portion of the instructions for the flash memory. After executing the first portion of the instructions for the flash memory, each separate subset of the flash memories waits for a separate, distinct delay period. For each flash memory, after the delay period expires for that flash memory, the flash memory executes a second portion of the instructions for the flash memory.12-20-2012
20120320681REDUCING THE PROGRAMMING CURRENT FOR MEMORY MATRICES - A sector of an electrically programmable non-volatile memory includes memory cells connected to word lines and to bit lines, each cell including at least one transistor having a gate connected to a word line, a drain connected to a bit line and a source connected to a source line. The sector includes at least two distinct wells insulated from one another, each including a number of cells of the sector, being able to take different potentials, and in that the sector has at least one bit line electrically linked to the drain of at least two cells mounted on two distinct wells.12-20-2012
20110038213MULTI-DOT FLASH MEMORY - A multi-dot flash memory set potentials of bit lines being disposed at a left side of a selected floating gate to V02-17-2011
20120268997NONVOLATILE SEMICONDUCTOR DEVICE - A nonvolatile memory device includes a plurality of global word lines, a voltage pump configured to generate a plurality of voltages, a control unit configured to divide the plurality of global word lines into a first group and a second group in response to an input row address and generate control signals, a first selection unit configured to output at least two different voltages that are to be applied to global word lines of the first group, a second selection unit configured to output a voltage that is to be applied to global word lines of the second group, and a third selection unit configured to apply output voltages of the first selection unit to the global word lines of the first group, and apply an output voltage of the second selection unit to the global word lines of the second group.10-25-2012
20110222351SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises memory cells which includes a selection transistor and a memory transistor; selection gate lines coupled to a gate of the selection transistor; control gate lines coupled to the control gate of the memory transistor; source lines coupled to a source of the memory transistor; bit lines coupled to the selection transistor; a selection gate line driver circuit; a control gate line driver circuit; and a source line driver circuit, wherein the selection gate line driver circuit comprises a first transistor including a first gate insulation film and drives the selection gate line with a first driving voltage, and the control gate line driver circuit and the source line driver circuit comprises a second transistor including second gate insulation films and drives the control gate line and the source line with a boost voltage higher than the first driving voltage.09-15-2011
20110222349TRANSFER CIRCUIT, NONVOLATILE SEMICONDUCTOR DEVICE USING THE SAME, AND TRANSFER METHOD OF THE SAME - According to one embodiment, a transfer circuit includes a first inverter, a second inverter, a first line, a second line, a first holder, and a second holder. The first inverter inverts data at a first node and transfers the inverted data to a second node. The second inverter inverts the data at the second node and transfers the inverted data to the first node. The first line connected to the first node. The second line connected to the second node. The first holder may output data to the first node. The second holder may output data to the second node. When the first holder outputs the data to the first line, the first and second inverters are turned off. When the second holder outputs the data to the first line through the second node, the first inverter is turned off.09-15-2011
20100254193WIRITING METHOD OF A NONVOLATILE MEMORY DEVICE - A method of performing a writing operation of a nonvolatile memory device is provided. The method includes performing a first band program using trim information from a first band register of multiple band registers, which include at least a default band register; and performing a second band program using trim information from a second band register or trim information from the default band register after performing the first band program. The second band register is selected while the first band program is being performed.10-07-2010
20120127799WRITE-PRECOMPENSATION AND VARIABLE WRITE BACKOFF - A technique for writing data is disclosed. The technique includes estimating an amount of additional voltage on a victim cell of a solid-state storage device caused by writing to one or more other cells in the solid-state storage device, determining a modified write value for the victim cell based at least in part on a desired value for the victim cell and the estimated amount of additional voltage, and writing the modified write value to the victim cell.05-24-2012
20110235426FLASH MEMORY SYSTEM HAVING A PLURALITY OF SERIALLY CONNECTED DEVICES - A semiconductor memory device and system are disclosed. The memory device includes a memory, a plurality of inputs, and a device identification register for storing register bits that distinguish the memory device from other possible memory devices. Circuitry for comparing identification bits in the information signal with the register bits provides positive or negative indication as to whether the identification bits match the register bits. If the indication is positive, then the memory device is configured to respond as having been selected by a controller. If the indication is negative, then the memory device is configured to respond as having not been selected by the controller. A plurality of outputs release a set of output signals towards a next device.09-29-2011
20110235425METHOD OF DIRECTLY READING OUTPUT VOLTAGE TO DETERMINE DATA STORED IN A NON-VOLATILE MEMORY CELL - An NVM cell design enables direct reading of cell output voltage to determine data stored in the cell, while providing low current consumption and a simple program sequence that utilizes reverse Fowler-Nordheim tunneling.09-29-2011
20100232225SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device has a sense amplifier. The sense amplifier includes a first lower interconnection; a second interlayer insulation film formed on the first interlayer insulation film and top of the first interconnection; a contact interconnection formed in a direction perpendicular to a substrate plane of the semiconductor substrate so as to pass through the second interlayer insulation film, and connected to the first lower interconnection; a first upper interconnection formed on the second interlayer insulation film and connected to the contact interconnection disposed under the first upper interconnection; a dummy contact interconnection formed in a direction perpendicular to the substrate plane of the semiconductor substrate in the second interlayer insulation film, and adjacent to the contact interconnection; and a second upper interconnection formed on the second interlayer insulation film so as to extend in the first direction, and connected to the dummy contact interconnection disposed under the second upper interconnection.09-16-2010
20100232224NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE - A memory cell array has plural memory strings arranged therein, each of which including a plurality of electrically-rewritable memory transistors and selection transistors. Each memory string includes a body semiconductor layer including four or more columnar portions, and a joining portion formed to join the lower ends thereof. An electric charge storage layer is formed to surround a side surface of the columnar portions. A first conductive layer is formed to surround a side surface of the columnar portions as well as the electric charge storage layer. A plurality of second conductive layers are formed on side surfaces of the joining portion via an insulation film, and function as control electrodes of a plurality of back-gate transistors formed at a respective one of the joining portions.09-16-2010
20120087191Symmetric, Differential Nonvolatile Memory Cell - Some embodiments relate to a differential memory cell. The memory cell includes a first transistor having a source, a drain, a gate, and a body. A first capacitor has a first plate and a second plate, wherein the first plate is coupled to the gate of the first transistor and extends over the body region. The memory cell also includes a second transistor having a source, a drain, a gate, and a body, wherein the source and body of the second transistor is coupled to the second plate of the first capacitor. A second capacitor has a third plate and a fourth plate, wherein the third plate is coupled to the gate of the second transistor and the fourth plate is coupled to the source and the body of the first transistor.04-12-2012
20120287718PROGRAMMING MEMORY CELLS - Methods for programming, memory devices, and methods for reading are disclosed. One such method for programming a memory device (e.g., an SLC memory device) includes encoding a two level data stream to a three level stream prior to programming the memory.11-15-2012
20100202210REDUCING EFFECTS OF PROGRAM DISTURB IN A MEMORY DEVICE - A selected word line that is coupled to cells for programming is biased with an initial programming voltage. The unselected word lines that are adjacent to the selected word line are biased at an initial V08-12-2010
20100202209FLASH MEMORY DEVICE AND PROGRAM METHOD THEREOF - A flash memory device includes a memory cell array on which data is stored, and page buffers that are connected to the memory cells through the bit lines and apply one of the first voltage, second voltage or third voltage between the first and second voltage, to the respective bit line when performing the program.08-12-2010
20100202208SEMICONDUCTOR DEVICE INCLUDING CONTACT PLUG HAVING AN ELLIPTICAL SECTIONAL SHAPE - A semiconductor device includes a first MOS transistor, second MOS transistors, first contact plugs, and a second contact plug. The first MOS transistor with a first conductivity is formed on a semiconductor substrate. The second MOS transistors with a second conductivity are formed on the semiconductor substrate. The first contact plugs has a circular planar shape. The second contact plug has an elliptical planar shape and is formed on a source or a drain in one of the second MOS transistors. The first contact plugs are formed on sources or drains in the remaining second MOS transistors and the first MOS transistor.08-12-2010
20120140565Scalable Electrically Eraseable And Programmable Memory - A non-volatile memory including one or more EEPROM cell pairs. Each EEPROM cell pair includes three transistors and stores two data bits, effectively providing a 1.5 transistor EEPROM cell. An EEPROM cell pair includes a first non-volatile memory transistor connected to a first bit line, a second non-volatile memory transistor connected to a second bit line, and a source access transistor coupled to common source line. The source access transistor includes: a first diffusion region continuous with a source region of the first non-volatile memory transistor and a second diffusion region continuous with a source region of the second non-volatile memory transistor.06-07-2012
20120140564NON-VOLATILE ONE-TIME-PROGRAMMABLE AND MULTIPLE-TIME PROGRAMMABLE MEMORY CONFIGURATION CIRCUIT - A programmable non-volatile configuration circuit uses a pair of non-volatile memory devices arranged in a pull-up and pull-down arrangement. The non-volatile memory devices have floating gates that overlaps a variable portion of a source/drain region. This allows a programming voltage for the device to be imparted to the floating gate through variable capacitive coupling, thus changing the state of the device. The invention can be used in environments to store configuration data for programmable logic devices, field programmable arrays, and many other applications.06-07-2012
20120140562NONVOLATILE MEMORY DEVICE AND METHOD OF MAKING THE SAME - A nonvolatile memory device includes a substrate, a structure including a stack of alternately disposed layers of conductive and insulation materials disposed on the substrate, a plurality of pillars extending through the structure in a direction perpendicular to the substrate and into contact with the substrate, and information storage films interposed between the layers of conductive material and the pillars. In one embodiment, upper portions of the pillars located at the same level as an upper layer of the conductive material have structures that are different from lower portions of the pillars. In another embodiment, or in addition, upper string selection transistors constituted by portions of the pillars at the level of an upper layer of the conductive material are programmed differently from lower string selection transistors.06-07-2012
20120140561MEMORY DEVICE CAPABLE OF IMPROVING WRITE PROCESSING SPEED AND MEMORY CONTROL METHOD - According to one embodiment, a memory device includes a memory unit, a first storage unit, a second storage unit, a third storage unit, a data move unit, and a controller. The first storage unit stores a logical address and an intermediate address. The second storage unit stores the intermediate address and the physical address corresponding to the intermediate address. The third storage unit stores a flag corresponding to the logical address and the intermediate address. The flag represents whether read of latest data by a read operation has succeeded. When the flag stored in the third storage unit represents a success of the read of the latest data, the controller determines whether write has been done for the same logical address of the memory unit during the data move processing, and if the write has been done, invalidates the data move processing.06-07-2012
20130016563MEMORY CIRCUITAANM OSANAI; JunAACI Chiba-shiAACO JPAAGP OSANAI; Jun Chiba-shi JPAANM Hirose; YoshitsuguAACI Chiba-shiAACO JPAAGP Hirose; Yoshitsugu Chiba-shi JPAANM Tsumura; KazuhiroAACI Chiba-shiAACO JPAAGP Tsumura; Kazuhiro Chiba-shi JPAANM Inoue; AyakeAACI Chiba-shiAACO JPAAGP Inoue; Ayake Chiba-shi JP - Provided is a memory circuit in which erroneous writing is less likely to occur at the time of power-on. A memory circuit (01-17-2013
20110157991EEPROM DEVICE - A stable and reliable EEPROM device includes an EEPROM cell having first, second and third control voltage terminals for performing operations for programming, reading and erasing data, respectively, a first transistor configured to supply a programming operation voltage to the first control voltage terminal during the programming operation, a second transistor configured to supply a ground voltage to the first control voltage terminal, the data of which will not be programmed during the programming operation, and a third transistor connected to the second control voltage terminal and turned on by an address selected for reading the data of the EEPROM cell during the reading operation.06-30-2011
20120243322SEMICONDUCTOR INTEGRATED CIRCUIT ADAPTED TO OUTPUT PASS/FAIL RESULTS OF INTERNAL OPERATIONS - In a semiconductor integrated circuit, an internal circuit is capable of executing a first operation and a second operation concurrently, and an output circuit outputs to the outside of the semiconductor integrated circuit information indicating whether or not the first operation is being executed and information indicating whether or not the second operation is executable.09-27-2012
20120243320SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a plurality of memory cells, a logic gate chain, and a counter. The memory cells are capable of retaining data and are associated with the columns. The logic gate chain includes a plurality of logic gates associated with the columns. Each of the logical gates outputs a logical level to a next-stage logical gate in the series connection. The logic level indicates presence or absence of verify-failure in the associated column. The counter counts the number of output times of the logic level indicating the presence of the verify-failure in a final-stage logic gate of the series connection. A content indicated by the logic level output from each of the logic gates is inverted at a boundary of the logic gate associated with the column having the verify-failure in the logic gate chain.09-27-2012
20120243318NON-VOLATILE MEMORY PROGRAMMING - Some embodiments include a memory device and a method of programming memory cells of the memory device. One such method can include applying a signal to a line associated with a memory cell, the signal being generated based on digital information. The method can also include, while the signal is applied to the line, determining whether a state of the memory cell is near a target state when the digital information has a first value, and determining whether the state of the memory cell has reached the target state when the digital information has a second value. Other embodiments including additional memory devices and methods are described.09-27-2012
20080253189MEMORY UNIT - A memory unit is provided herein. The present invention utilizes two non-volatile devices having a split gate structure to save a logic state of the memory unit. Thus, even when a power supply for the memory unit is shut down, the non-volatile devices can still save the logic state. The memory unit not only has the advantage of high speed operation of a static random access memory, but also functions as a non-volatile memory for saving data.10-16-2008
20130170301Wordline-to-Wordline Stress Configuration - A method and system for performing wordline-to-wordline stress routines on a storage device is disclosed. Stress routines may be performed to reduce state widening in multi-level memory cells in the storage device. However, data retention problems may result if the stress routines are performed too often. In order to perform the stress routines at the proper times, a stress control variable is used. The stress control variable may be indicative of age of the storage device (such as the number of erase cycles performed on a memory block in the storage device). The stress control variable is input to a look-up table (or other logical construct), with the output of the look-up table indicating whether to perform the wordline-to-wordline stress routine. In this way, the stress routines may be performed to reduce state widening while reducing the ill effects of data retention.07-04-2013
20130141979SEMICONDUCTOR MEMORY APPARATUS - A semiconductor memory apparatus including a latch unit configured to be driven in response to activation of a reset selection signal and resetting a first node and a second node; and an auxiliary driving unit configured to support a driving force of the latch unit in response to the reset selection signal and a voltage logic level of the first node or the second node, wherein the first node and the second node have substantially opposite voltage logic levels.06-06-2013
20130176787Method and Apparatus for Training a DLL in a Memory Subsystem - A method and apparatus for training a DLL in a memory subsystem is disclosed. In one embodiment, a memory subsystem includes a memory coupled to convey data read therefrom on one or more channels. Each memory channel may include a delay locked loop (DLL) configured to apply a desired amount of delay to a data strobe signal received from the memory during a read operation. Upon detecting a read request, a controller may initiate a training procedure in which the DLL is trained to the desired delay. During the training procedure, an input clock signal may be provided to the DLL. The delay within the DLL may be adjusted until an output clock signal has a desired phase relationship with the input clock signal. Once the desired phase relationship is attained, the training procedure may be terminated and the DLL input may be switched to receive the data strobe signal.07-11-2013
20130176788DEVICE SELECTION SCHEMES IN MULTI CHIP PACKAGE NAND FLASH MEMORY SYSTEM - Systems and methods are provided for perform device selection in multi-chip package NAND flash memory systems. In some embodiments, the memory controller performs device selection by command. In other embodiments, the memory controller performs device selection by input address.07-11-2013
20090135655Embedded Flash Memory Devices on SOI Substrates and Methods of Manufacture Thereof - Flash memory device structures and methods of manufacture thereof are disclosed. The flash memory devices are manufactured on silicon-on-insulator (SOI) substrates. Shallow trench isolation (STI) regions and the buried oxide layer of the SOI substrate are used to isolate adjacent devices from one another. The methods of manufacture require fewer lithography masks and may be implemented in stand-alone flash memory devices, embedded flash memory devices, and system on a chip (SoC) flash memory devices.05-28-2009
20080219056SYSTEM THAT COMPENSATES FOR COUPLING DURING PROGRAMMING - Shifts in the apparent charge stored on a floating gate (or other charge storing element) of a non-volatile memory cell can occur because of the coupling of an electric field based on the charge stored in adjacent floating gates (or other adjacent charge storing elements). To compensate for this coupling, the read or programming process for a given memory cell can take into account the programmed state of an adjacent memory cell. To determine whether compensation is needed, a process can be performed that includes sensing information about the programmed state of an adjacent memory cell (e.g., on an adjacent bit line or other location).09-11-2008
20120250416SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes: a memory cell array including plural memory cells; a first word line connected to a control gate of a first memory cell; a second word line connected to a control gate of a second memory cell and neighboring the first word line on one side; a third word line connected to a control gate of a third memory cell and neighboring the first word line on the opposite side to the one side; and a control circuit configured to read data from the first word line under a condition in which the memory cell connected to the second word line holds data while the memory cell connected to the third word line does not hold data, and to set a first voltage applied to the third word line to be lower than a second voltage applied to the second word line.10-04-2012
20130094298STORAGE DEVICES WITH SOFT PROCESSING - A storage device includes a storage array having a group of storage elements. Each storage element can written to a discrete set of physical states. A read circuit selects one or more storage elements and generates, for each selected storage element, an analog signal representative of the physical state of the selected storage element. A signal processing circuit processes the analog signal to generate a plurality of outputs, with each output representing a degree of an association of the selected storage element with a different subset of one or more of the discrete set of physical states.04-18-2013
20130114343SEMICONDUCTOR DEVICE WITH ONE-TIME PROGRAMMABLE MEMORY CELL INCLUDING ANTI-FUSE WITH METAL/POLYCIDE GATE - A one-time programmable (OTP) memory cell includes two transistors including a dual gate transistor. The dual gate transistor is formed using the same processing operations used to form floating gate transistors in other areas of the semiconductor device. The dual gate transistor includes an upper gate isolated from a floating gate by a floating gate oxide, the combination of which produces an anti-fuse. The nonvolatile memory device may include a plurality of such OTP memory cells and one or more OTP memory cells are selected and programmed by applying a voltage sufficient to blow the anti-fuse by causing the floating gate oxide layer to break down and the upper gate to become shorted to the floating gate.05-09-2013
20130114344ERRATIC PROGRAM DETECTION FOR NON-VOLATILE STORAGE - Methods and non-volatile storage systems are provided for determining erratically programmed storage elements, including under-programmed and over-programmed storage elements. Techniques do not require any additional data latches. A set of data latches may be used to store program data for a given memory element. This program data may be maintained after the programming is over for use in erratic program detection. In one embodiment, lockout status is kept in a data latch that is used to serially receive program data to be programmed into the storage element. Therefore, no extra data latches are required to program the storage elements and to maintain the program data afterwards.05-09-2013
201301007413-D NONVOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME, AND MEMORY SYSTEM INCLUDING THE 3-D NONVOLATILE MEMORY DEVICE - A three-dimensional (3-D) nonvolatile memory device includes vertical channel layers protruded from a substrate, interlayer insulating layers and memory cells, which are alternately stacked along the vertical channel layers, and select transistors including planar channel layers, each contacted with at least one of the vertical channel layers and being parallel to the substrate, and gate insulating layers formed over the planar channel layers.04-25-2013
20130100742NONVOLATILE MEMORY DEVICE - A nonvolatile memory device is provided. The device may include a plurality of cell strings that are configured to share a bit line, word lines, and selection lines. Each of the cell strings may include a plurality of memory cells connected in series to each other and a string selection device controlling connections between the memory cells and the bit line, and the string selection device may include a first string selection element with a first threshold voltage and a second string selection element connected in series to the first string selection element and having a second threshold voltage different from the first threshold voltage. At least one of the first and second string selection elements may include a plurality of switching elements connected in series to each other.04-25-2013
20130100743METHOD FOR OPERATING A SEMICONDUCTOR STRUCTURE - A method for operating a semiconductor structure is provided. The semiconductor structure includes a first conductor extending in a first direction, a second conductor extending in a second direction different from the first direction, and a dielectric layer between the first conductor and the second conductor. The method for operating the semiconductor structure comprises following steps. A current is provided to flow in the first direction in the first conductor.04-25-2013
20130128670MEMORY ACCESS METHOD AND FLASH MEMORY USING THE SAME - A memory access method is applied in a memory controller for accessing an NAND memory array, including a number of respective select switches globally controlled with a string select signal. The memory access method includes the following steps. A stream bias signal and a selected word line signal are respectively provided on a selected stream and on a selected cell of the selected stream, and the rest of memory cells are turned on as pass transistors, in the setup phase. A discharge path is provided to eliminate coupling charge presented on unselected streams, in the setup phase. Then, the string select signal is enabled to have the selected stream connected to a sense unit via a metal bit line and according read the selected cell in a voltage sensing scheme, in a read phase, which does not overlap with the setup phase.05-23-2013
20130135934NONVOLATILE MEMORY DEVICE AND OPERATING METHOD THEREOF - Disclosed is a method of operating a nonvolatile memory device which includes a first memory area and a second memory area, the number of pages being stored in each word line of the first memory area being smaller than the number of pages being stored in each word line of the second memory area, and the first memory area being configured to buffer data to be written in the second memory area. The method includes sensing pages stored in the first memory area to store the sensed pages in a page buffer; receiving an address for storing pages stored in the page buffer in the second memory area; and randomizing the pages stored in the page buffer based on the address.05-30-2013
20130135935ACCESS LINE DEPENDENT BIASING SCHEMES - The present disclosure includes methods, devices, and systems for access line biasing. One embodiment includes selecting, using a controller external to the memory device, a particular access line dependent biasing scheme and corresponding bias conditions for use in performing an access operation on an array of memory cells of the memory device, and performing the access operation using the selected particular access line dependent biasing scheme and corresponding bias conditions. In one or more embodiments, the selected particular access line dependent biasing scheme and corresponding bias conditions is selected by the controller external to the memory device based, at least partially, on a target access line of the array.05-30-2013
20130141978FLASH MEMORY DEVICES AND SYSTEMS - Flash memory devices and systems are provided. One flash memory device includes an n-channel metal oxide semiconductor field-effect transistor (nMOSFET), a silicon-oxide-nitride-oxide silicon (SONOS) transistor coupled to the nMOSFET, and an isolated p-well coupled to the nMOSFET and the SONOS transistor. A flash memory system includes an array of memory devices divided into a plurality of paired sectors, a global bit line (GBL) configured to provide high voltage to each respective sector during erase and program operations coupled to each of the plurality of sectors, and a plurality of sense amplifiers coupled between a respective pair of sectors. Methods for operating a flash memory are also provided. One method includes providing high voltage, via the GBL, to the paired sectors during erase and program operations and providing low voltage, via a local bit line, to each memory device during read operations.06-06-2013
20130141980REDUCED SIGNAL INTERFACE MEMORY DEVICE, SYSTEM, AND METHOD - A memory has a serial interface. The serial interface is programmable to either use separate dedicated input and output pads, or to use one bidirectional pad. When one bidirectional pad is used, the interface signal count is reduced by one.06-06-2013
20110273934Interleaving Charge Pumps for Programmable Memories - Systems and methods, including computer software for performing operations enable interleaving of charging operations in a charging pump. A first charge pump is charged to a predetermined level, and a first operation is performed using a charge stored in the first charge pump after it reaches the predetermined level. A second charge pump is charged during a time that overlaps with performing the first operation. A second operation is performed using a charge stored in the second charge pump as a result of charging the second charge pump.11-10-2011
20110222350MULTI-LEVEL CELL ACCESS BUFFER WITH DUAL FUNCTION - An access buffer, such as page buffer, for writing to non-volatile memory, such as Flash, using a two-stage MLC (multi-level cell) operation is provided. The access buffer has a first latch for temporarily storing the data to be written. A second latch is provided for reading data from the memory as part of the two-stage write operation. The second latch has an inverter that participates in the latching function when reading from the memory. The same inverter is used to produce a complement of an input signal being written to the first latch with the result that a double ended input is used to write to the first latch.09-15-2011
20110222348Nonvolatile Memory Devices Having Memory Cell Arrays with Unequal-Sized Memory Cells and Methods of Operating Same - Nonvolatile memory devices include a two-dimensional array of nonvolatile memory cells having a plurality of memory cells of unequal size therein. These memory cells may include those that have unequal channel widths associated with respective word lines and those having unequal channel lengths associated with respective bit lines that are connected to corresponding strings of nonvolatile memory cells (e.g., NAND-type strings). Control circuitry is also provided that is electrically coupled to the two-dimensional array of nonvolatile memory cells. This control circuitry may operate to concurrently program first and second nonvolatile memory cells having unequal sizes from an erased state (e.g., logic 1) to an equivalent programmed state (e.g., logic 0). This is done by establishing unequal first and second word line-to-channel region voltages in the first and second nonvolatile memory cells, respectively, during an operation to program a row of memory cells in the two-dimensional array of nonvolatile memory cells, which includes the first and second nonvolatile memory cells of unequal size.09-15-2011
20080198658MEMORY CARD, SEMICONDUCTOR DEVICE, AND METHOD OF CONTROLLING MEMORY CARD - A semiconductor device includes a transfer section which receives, from an external source, a second program for modifying a function of a first program stored in a read-only memory (ROM) and information required in activation of the second program, and which writes the program and the information to a nonvolatile semiconductor memory, and a load section which activates the second program on the basis of the information written to the nonvolatile semiconductor memory to modify the function of the first program.08-21-2008
20080198657NON-VOLATILE SEMICONDUCTOR MEMORY HAVING MULTIPLE EXTERNAL POWER SUPPLIES - A memory device includes core memory such as flash memory for storing data. The memory device includes a first power input to receive a first voltage used to power the flash memory. Additionally, the memory device includes a second power input to receive a second voltage. The memory device includes power management circuitry configured to receive the second voltage and derive one or more internal voltages. The power management circuitry supplies or conveys the internal voltages to the flash memory. The different internal voltages generated by the power management circuitry (e.g., voltage converter circuit) and supplied to the core memory enable operations such as read/program/erase with respect to cells in the core memory.08-21-2008
20130148430NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A non-volatile semiconductor memory device according to one embodiment includes: a cell array; and a data writing unit that repeatedly executes a write loop including a programming operation of applying a program voltage to a selected word line and a passage voltage to non-selected word lines during writing of data, in which, when a difference between the passage voltage used in an n-th write loop and the passage voltage used in an n+1-th write loop is expressed as ΔVn and when a condition of L06-13-2013
20110249502SEMICONDUCTOR DEVICE - The semiconductor device includes the read circuit which reads data written to a memory cell. The read circuit includes a first transistor, a second transistor, a first switch, and a second switch. A first terminal of the first transistor is electrically connected to a gate of the first transistor, and a second terminal of the first transistor is electrically connected to an output from the read circuit via the first switch. A first terminal of the second transistor is electrically connected to a gate of the second transistor, and a second terminal of the second transistor is electrically connected to the output from the read circuit via the second switch. A channel formation region of the first transistor can be formed using an oxide semiconductor, and a channel formation region of the second transistor can be formed using silicon.10-13-2011
20120275230METHOD OF STORING DATA ON A FLASH MEMORY DEVICE - Methods and apparatus are disclosed, such as those involving a flash memory device. One such method includes storing data on memory cells on a memory block including a plurality of word lines and a plurality of memory cells on the word lines. The word lines comprising one or more bottom edge word lines, one or more top edge word lines, and intermediate word lines between the bottom and top edge word lines. The data is stored first on memory cells on the intermediate word lines. Then, a remaining portion, if any, of the data is stored on memory cells on the bottom edge word lines and/or the top edge word lines. This method enhances the life of the flash memory by preventing a premature failure of memory cells on the bottom or top edge word lines, which can be more prone to failure.11-01-2012
20120275229APPARATUS AND METHOD FOR EXTERNAL CHARGE PUMP ON FLASH MEMORY MODULE - A memory module is provided. The memory module includes die packages and a charge pump that is external the die packages. Each die package includes a flash memory device, and each of the flash memory devices includes bit lines and memory cells coupled to the bit lines. The charge pump provides a charge pump voltage that is selectively provided to the bit lines in each flash memory device in each of the die packages.11-01-2012
20120275228INTERNAL WORDLINE CURRENT LEAKAGE SELF-DETECTION METHOD, DETECTION SYSTEM AND COMPUTER-READABLE STORAGE MEDIUM FOR NOR-TYPE FLASH MEMORY DEVICE - A wordline internal current leakage self-detection method, system and a computer-readable storage medium thereof employ the originally existed high voltage supply unit and the voltage detector connected to the wordline in the flash memory device, in which the high voltage supply unit applies the test signal to the selected wordline, and the voltage detector detects the voltage signal of the wordline. By comparing the test signal with the voltage signal, the wordline will be indicated as current leakage when the voltage signal is lower than the test signal.11-01-2012
20100315876MEMORY DEVICES AND OPERATIONS THEREOF USING PROGRAM STATE DETERMINATION BASED ON DATA VALUE DISTRIBUTION - In a memory device, a proportion of at least one cell state in a unit of the memory is determined. A program state of the unit of the memory is determined based on the determined proportion of the at least one cell state. Determining a proportion of at least one cell state in a unit of the memory may be preceded by processing data to be stored in the unit of the memory according to a data value distribution function to produce transformed data having data values conforming to a predetermined distribution and storing the transformed data in the unit of the memory. The distribution function may be configured, for example, to provide a uniform distribution of data values in the unit of the memory.12-16-2010
20120281478THERMALLY ASSISTED FLASH MEMORY WITH DIODE STRAPPING - A memory includes an array of memory cells including rows and columns. The memory includes circuitry coupled to the word lines applying a first bias voltage to a first set of spaced-apart locations on a word line or word lines in the array, while applying a second bias voltage different than the first bias voltage, to a second set of spaced-apart locations on the word line or word lines, locations in the first set of spaced-apart locations being interleaved among locations in the second set of spaced-apart locations, whereby current flow is induced between locations in the first and second sets of locations that cause heating of the word line or word lines.11-08-2012
20120281477SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a memory cell array includes a plurality of cell units each composed of a plurality of memory cells which are arranged at intersections of a plurality of bit lines and a plurality of word lines and whose current paths are connected in series and select transistors each connected to either end of the series connection, a voltage generator circuit which generates a voltage applied to the memory cell array, and a control circuit which controls the memory cell array and the voltage generator circuit.11-08-2012
20120281476MEMORY APPARATUS AND METHODS - Embodiments of apparatus and methods having a memory device can include a line to exchange information with a string of memory cells and a transistor coupled between the string of memory cells and the line. Such a memory device can also include a module configured to couple a gate of the transistor to a node during a first time interval of a memory operation and decouple the gate from the node during a second time interval of the memory operation. Additional apparatus and methods are described.11-08-2012
20130182506PROGRAMMING ALGORITHM FOR IMPROVED FLASH MEMORY ENDURANCE AND RETENTION - A method for programming a flash cell using a series of programming pulses, the method comprising providing a plurality of first successive programming pulses, wherein each of the first successive programming pulse is incremented by a first incremental amount and providing a plurality of second successive programming pulses, wherein each of the second successive programming pulses is incremented by a second incremental amount and wherein the second increment amount is smaller than the first incremental amount. A system and machine-readable media are also provided.07-18-2013
20110286277SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a plurality of memory cell transistors arranged in a matrix; a plurality of word lines commonly coupling the control gates of the plural memory cell transistors present in a identical first direction; a plurality of source lines commonly coupling the sources of the plural memory cell transistors present in the identical first direction; a plurality of bit lines commonly coupling the drains of the plural memory cell transistors present in a identical second direction intersecting the first direction; a first transistor having a drain coupled to the source line; a second transistor having a drain coupled to a source of the first transistor, a gate coupled to the word line and a source grounded; and a control line commonly coupling the gates of the plural first transistors.11-24-2011
20090279362PARTIAL SCRAMBLING TO REDUCE CORRELATION - Decorrelation is provided between data stored in respective pairs of adjacent memory cells in a plurality of bit lines of a flash memory. Each of the pairs of adjacent memory cells is located along a respective one of the bitlines and common to two adjacent wordlines. The decorrelation is achieved by storing scrambled data in at least one memory cell of each of the pairs of adjacent memory cells and storing unscrambled data in at least one memory cell of at least one of the pairs of adjacent memory cells.11-12-2009
20120002480NONVOLATILE MEMORY APPARATUS - A nonvolatile memory device includes: a data transmission line configured to transmit internal configuration data; a data path control unit configured to control a data transmission path direction of the data transmission line according to control of a test signal; and a configuration data latch unit configured to latch a signal transmitted through the data transmission line or drive a latched signal to the data transmission line, according to control of the test signal.01-05-2012
20120014182APPARATUS FOR GENERATING A VOLTAGE AND NON-VOLATILE MEMORY DEVICE HAVING THE SAME - An apparatus for generating a voltage includes a first voltage outputting circuit configured to receive an input voltage and adjust and output a first voltage in accordance with a temperature, a buffer circuit configured to receive the first voltage and output the received first voltage as a second voltage at an output node of the buffer circuit, and a second voltage outputting circuit configured to receive the second voltage at an input terminal and output a third voltage by dividing a driving voltage in accordance with a resistance ratio, wherein the second voltage outputting circuit includes a sub-voltage outputting circuit and a controlling circuit configured to adjust a voltage level of the third voltage through a feedback of the third voltage to the input terminal.01-19-2012
20120020165SEMICONDUCTOR STORAGE DEVICE AND CONTROL METHOD THEREOF - In one embodiment, there is provided a semiconductor storage device including: a memory cell array; a high voltage generator; and a controller that controls the high voltage generator. When a word line to is selected from word lines, the controller controls the high voltage generator to: apply a first read pass voltage to one or two first adjacent word lines adjacent to the selected word line; apply a second read pass voltage to a second adjacent word line adjacent to the first adjacent word lines, wherein the second read pass voltage is higher than the first read pass voltage; and apply a third read pass voltage to remaining word lines other than the selected word line, the first adjacent word line and the second adjacent word line, wherein the third read pass voltage is higher than the first read pass voltage and lower than the second read pass voltage.01-26-2012
20120020164TEST METHOD FOR SCREENING MANUFACTURING DEFECTS IN A MEMORY ARRAY - A method of screening manufacturing defects at a memory array may include programming a background pattern of physically inverse data along conductive lines extending in a first direction. The programming may include providing a program conductive line with a high value. The method may further include programming a memory cell at an intersection of the program conductive line and a conductive line extending in a second direction to a selected high value, and determining whether a cell initially at a low value and associated with a conductive line extending in the first direction and adjacent to the program conductive line is disturbed.01-26-2012
20120020163Array architecture for reduced voltage, low power, single poly EEPROM - An Electrically Erasable Programmable Read Only Memory (EEPROM) memory array (FIG. 01-26-2012
20120020162Low power, single poly EEPROM cell with voltage divider - An Electrically Erasable Programmable Read Only Memory (EEPROM) memory array (FIGS. 01-26-2012
20130194874Dynamic Healing Of Non-Volatile Memory Cells - Methods and systems are disclosed for dynamic healing of non-volatile memory (NVM) cells within NVM systems. The dynamic healing embodiments described herein relax damage within tunnel dielectric layers for NVM cells that occurs over time from charges (e.g., holes and/or electrons) becoming trapped within these tunnel dielectric layers. NVM operations with respect to which dynamic healing processes can be applied include, for example, erase operations, program operations, and read operations. For example, dynamic healing can be applied where performance for the NVM system degrades beyond a selected performance level for an NVM operation, such as elevated erase/program pulse counts for erase/program operations and bit errors for read operations. A variety of healing techniques can be applied, such as drain stress processes, gate stress processes, and/or other desired healing techniques.08-01-2013
20130194873SYSTEMS AND METHODS FOR AUTO-CALIBRATION OF A STORAGE MEMORY CONTROLLER - Systems and methods for auto-calibrating a storage memory controller are disclosed. In some embodiments, the systems and methods may be realized as a method for auto-calibrating a storage memory controller including instructing a controllable delay circuit to delay a read strobe signal at one of a plurality of delay settings, receiving data captured at a data latch using the delayed read strobe signal, selecting an adjustment factor from the plurality of delay settings using a multi-scale approach, based on an accuracy of the data captured at the data latch, and instructing the controllable delay circuit to delay the read strobe signal by the adjustment factor.08-01-2013
20120026797NonVolatile Memory Devices, Methods Of Programming The Same, And Memory Systems Including The Same - A nonvolatile memory device including a bit line connected to a cell string, a page buffer connected to the bit line, the page buffer is configured to output a target bit line forcing voltage level to the bit line during a programming operation, and a bit line forcing voltage clamp circuit connected between the bit line and the page buffer, and the bit line forcing voltage clamp circuit is configured to adjust the target bit line forcing voltage level to the bit line.02-02-2012
20130100740Compact Sense Amplifier for Non-Volatile Memory Suitable for Quick Pass Write - A compact and versatile sense amp is presented. Among its other features this sense amp arrangement provides a way to pre-charge bit lines while doing data scanning. Another feature is that the sense amp circuit can provide a way to set three different bit line levels used in the quick pass write (QPW) technique using dynamic latch, where quick pass write is a technique where cells along a given word line selected for programming can be enabled, inhibited, or partially inhibited for programming. Also, it can provide a convenient way to measure the cell current.04-25-2013
20130201763METHOD AND APPARATUS FOR READING DATA STORED IN FLASH MEMORY BY REFERRING TO BINARY DIGIT DISTRIBUTION CHARACTERISTICS OF BIT SEQUENCES READ FROM FLASH MEMORY - A method for reading data stored in a flash memory includes at least the following steps: controlling the flash memory to perform a plurality of read operations upon a plurality of memory cells included in the flash memory; obtaining a plurality of bit sequences read from the memory cells, respectively, wherein the read operations read bits of a predetermined bit order from the memory cells by utilizing different control gate voltage settings; and determining readout information of the memory cells according to binary digit distribution characteristics of the bit sequences.08-08-2013
20120069671MEMORY AND OPERATION METHOD THEREFOR - An operation method for a memory device having a plurality of memory cells includes: reading the plurality of memory cells by a first word line voltage to get a first number of a first logic state; reading the plurality of memory cells by a second word line voltage to get a second number of the first logic state, the second word line voltage different from the first word line voltage; and using the second word line voltage as a target word line voltage if the first number of the first logic state is equal to the second number of the first logic state.03-22-2012

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