Class / Patent application number | Description | Number of patent applications / Date published |
365185140 | Program gate | 47 |
20080225593 | Single poly EEPROM without separate control gate nor erase regions - A single-poly EEPROM memory device comprises source and drain regions in a semiconductor body, a floating gate overlying a portion of the source and drain regions, which defines a source-to-floating gate capacitance and a drain-to-floating gate capacitance, wherein the source-to-floating gate capacitance is substantially greater than the drain-to-floating gate capacitance. The source-to-floating gate capacitance is, for example, at least about three times greater than the drain-to-floating gate capacitance to enable the memory device to be electrically programmed or erased by applying a potential between a source electrode and a drain electrode without using a control gate. A current path between the source and drain electrodes generally defines current carrying portions of the source and drain regions, and a non-current carrying portion of the source region residing outside the current carrying portion, wherein substantially more of the floating gate overlies the non-current carrying portion than the current carrying portions. | 09-18-2008 |
20080239816 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor memory device comprises a memory cell unit including at least one memory cell having a structure with a floating gate and a control gate stacked via an insulator on a semiconductor substrate. A common source line is connected to one end of the memory cell unit. A bit line is connected to the other end of the memory cell unit. The control gate has at least an upper portion with a width along the gate length formed wider than the width of the floating gate. | 10-02-2008 |
20110199827 | MEMORY ARRAY HAVING MEMORY CELLS COUPLED BETWEEN A PROGRAMMABLE DRAIN SELECT GATE AND A NON-PROGRAMMABLE SOURCE SELECT GATE - Memories and their memory arrays are disclosed. One such memory array has a string of series-coupled memory cells, a non-programmable select gate coupled in series to a first end of the string of series-coupled memory cells, and a programmable select gate coupled in series to a second end of the string of series-coupled memory cells. | 08-18-2011 |
20110299336 | SINGLE-POLYSILICON LAYER NON-VOLATILE MEMORY AND OPERATING METHOD THEREOF - A single-polysilicon layer non-volatile memory having a floating gate transistor, a program gate and a control gate is provided. The floating gate transistor has a floating gate and a tunneling dielectric layer. The floating gate is disposed on a substrate. The tunneling dielectric layer is disposed between the floating gate and the substrate. The program gate, the control gate and the erase gate are respectively disposed in the substrate under the floating gate separated by the tunneling dielectric layer. Therefore, during a program operation and an erase operation, charges are injected in and expelled out through different regions of the tunneling dielectric layer, so as to increase reliability of the non-volatile memory. | 12-08-2011 |
20120127795 | NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF AND OPERATING METHOD OF MEMORY CELL - A non-volatile memory and a manufacturing method thereof and a method for operating a memory cell are provided. The non-volatile memory includes a substrate, first and second doped regions, a charged-trapping structure, first and second gates and an inter-gate insulation layer. The first and second doped regions are disposed in the substrate and extend along a first direction. The first and second doped regions are arranged alternately. The charged-trapping structure is disposed on the substrate. The first and second gates are disposed on the charged-trapping structure. Each first gate is located above one of the first doped regions. The second gates extend along a second direction and are located above the second doped regions. The inter-gate insulation layer is disposed between the first gates and the second gates. Adjacent first and second doped regions and the first gate, the second gate and the charged-trapping structure therebetween define a memory cell. | 05-24-2012 |
20120236646 | NON-VOLATILE MEMORY CELL - The non-volatile memory cell includes a coupling device and a first select transistor. The coupling device is formed in a first conductivity region. The first select transistor is serially connected to a first floating gate transistor and a second select transistor, all formed in a second conductivity region. An electrode of the coupling device and a gate of the first floating gate transistor are a monolithically formed floating gate; wherein the first conductivity region and the second conductivity region are formed in a third conductivity region; wherein the first conductivity region, the second conductivity region, and the third conductivity region are wells. | 09-20-2012 |
20130033934 | Memory Cell Arrangement, Method for Controlling a Memory Cell, Memory Array and Electronic Device - In an embodiment of the invention, a memory cell arrangement includes a substrate and at least one memory cell including a charge storing memory cell structure and a select structure. The memory cell arrangement further includes a first doping well, a second doping well and a third doping well arranged within the substrate, wherein the charge storing memory cell structure is arranged in or above the first doping well, the first doping well is arranged within the second doping well, and the second doping well is arranged within the third doping well. The memory cell arrangement further includes a control circuit coupled with the memory cell and configured to control the memory cell such that the charge storing memory cell structure is programmed or erased by charging or discharging the charge storing memory cell structure via at least the first doping well. | 02-07-2013 |
20130223149 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME - A nonvolatile semiconductor memory device includes: forming a stacked body by alternately stacking a plurality of interlayer insulating films and a plurality of control gate electrodes; forming a through-hole extending in a stacking direction in the stacked body; etching a portion of the interlayer insulating film facing the through-hole via the through-hole to remove the portion; forming a removed portion; forming a first insulating film on inner faces of the through-hole and the portion in which the interlayer insulating films are removed; forming a floating gate electrode in the portion in which the interlayer insulating films are removed; forming a second insulating film so as to cover a portion of the floating gate electrode facing the through-hole; and burying a semiconductor pillar in the through-hole. | 08-29-2013 |
20130242659 | SPLIT-GATE TYPE NONVOLATILE MEMORY DEVICE, SEMICONDUCTOR DEVICE HAVING SPLIT-TYPE NONVOLATILE MEMORY DEVICE EMBEDDED THEREIN, AND METHODS OF FORMING THE SAME - A split-gate type nonvolatile memory device includes a semiconductor substrate having a first conductivity type, a deep well having a second conductivity type in the semiconductor substrate, a pocket well having the first conductivity type in the deep well, a source line region having the second conductivity type in the pocket well, an erase gate on the source line region, and a first floating gate and a first control gate stacked sequentially on the pocket well on a side of the erase gate. The pocket well is electrically isolated from the substrate by the deep well, so that a negative voltage applied to the pocket well may not adversely affect operation of other devices formed on the substrate. | 09-19-2013 |
20130343128 | NON-VOLATILE MEMORY DEVICE WITH SINGLE-POLYSILICON-LAYER MEMORY CELLS - An embodiment of a nonvolatile-memory device includes: a body accommodating at least a first semiconductor well and a second semiconductor well; an insulating structure; and at least one nonvolatile memory cell. The cell includes: at least one first control region in the first well; conduction regions in the second well; and a floating gate region, which extends over portions of the first well and of the second well, is capacitively coupled to the first control region and forms a floating-gate memory transistor with the conduction regions. The insulating structure includes: first insulating regions, which separate the floating gate region from the first control region and from the second well outside the conduction regions and have a first thickness; and second insulating regions, which separate the floating gate region from the first well outside the first control region and have a second thickness greater than the first thickness. | 12-26-2013 |
20140177338 | NON-VOLATILE MEMORY CELL - A non-volatile memory cell comprises a coupling device, a first and a second select transistor, and a first and a second floating gate transistor is disclosed. The coupling device is formed in a first conductivity region. The first select transistor is serially connected to the first floating gate transistor and the second select transistor. Moreover, the first select transistor, the first floating gate transistor, and the second select transistor are formed in a second conductivity region. The second floating gate transistor is formed in a third conductivity region, wherein the first conductivity region, the second conductivity region, and the third conductivity region are formed in a fourth conductivity region. The first conductivity region, the second conductivity region, and the third conductivity region are wells, and the fourth conductivity region is a deep well. The third conductivity region surrounds the first conductivity region and the second conductivity region. | 06-26-2014 |
365185150 | Weak inversion injection | 36 |
20080239817 | Nonvolatile semiconductor memory device and method of erasing and programming the same - A nonvolatile semiconductor memory device includes a semiconductor substrate having a source, a drain, and a channel region between the source and the drain. The channel region has a first end portion near the drain, a second end portion near the source, and a middle portion between the first and second end portions. The first and second end portions having approximately same width. The memory device is electrically erased by using a hot carrier generated in the first end portion due to avalanche breakdown. The channel region includes a first channel extending from the drain and a second channel adjacent to the first channel. An impurity concentration of the second channel is higher than that of the first channel. An interface between the first and second channels is located in the middle portion between the first and second end portions. | 10-02-2008 |
20080273387 | Nonvolatile Semiconductor Storage Device and Method for Writing Therein - A hot electron (BBHE) is generated close to a drain by tunneling between bands, and bit data writing is performed by injecting the hot electron into a charge storage layer. When Vg is a gate voltage, Vsub is a cell well voltage, Vs is a source voltage and Vd is a drain voltage, a relation of Vg>Vsub>Vs>Vd is satisfied, Vg−Vd is a value of a potential difference required for generating a tunnel current between the bands or higher, and Vsub−Vd is substantially equivalent to a barrier potential of the tunnel insulating film or higher. | 11-06-2008 |
20090027967 | NON-VOLATILE MEMORY DEVICE PROGRAMMING SELECTION TRANSISTOR AND METHOD OF PROGRAMMING THE SAME - A memory system includes a flash memory device and a memory controller for controlling the flash memory device. The flash memory device includes a cell string and a selection transistor connected in series to the cell string. The cell string includes multiple series-connected memory cells. The selection transistor has the same structure as a memory cell of the series-connected memory cells, and is programmed through channel hot electron injection. | 01-29-2009 |
20090154246 | PROGRAMMING IN MEMORY DEVICES USING SOURCE BITLINE VOLTAGE BIAS - Systems and methods that facilitate improved programming memory cells in a nonvolatile memory (e.g., flash memory) are presented. An optimized voltage component can facilitate supplying respective voltages to a source, drain, and gate associated with a memory cell during operations, such as programming operations. The optimized voltage component can facilitate supplying a predetermined source bitline voltage to a memory cell during programming of the cell to facilitate reducing leakage currents associated with the bitlines, which can improve programming of the memory cell, and to facilitate reducing the programming current, which can result in power efficient programming and improved programming speed. | 06-18-2009 |
20090168531 | METHOD FOR PROGRAMMING A MEMORY STRUCTURE - A memory structure includes a first memory cell and a second memory cell located at an identical bit line and adjacent to the first memory cell. Each memory cell includes a substrate, a source, a drain, a charge storage device, and a gate. A method for programming the memory structure includes respectively providing a first gate biasing voltage and a second gate biasing voltage to the first memory cell and the second memory cell, boosting the absolute value of a channel voltage of the first memory cell to generate electron and hole pairs at the drain of the second memory cell through gate-induced drain leakage or band-to-band tunneling, and injecting the electron of the generated electron and hole pairs into the charge storage device of the first memory cell to program the first memory cell. | 07-02-2009 |
20090296474 | PROGRAM AND ERASE METHODS WITH SUBSTRATE TRANSIENT HOT CARRIER INJECTIONS IN A NON-VOLATILE MEMORY - The present invention describes a uniform program method and a uniform erase method of a charge trapping memory by employing a substrate transient hot electron technique for programming, and a substrate transient hot hole technique for erasing, which emulate an FN tunneling method for NAND memory operation. The methods of the present invention are applicable to a wide variety of charge trapping memories including n-channel or p-channel SONOS types of memories and floating gate (FG) type memories. the programming of the charge trapping memory is conducted using a substrate transient hot electron injection in which a body bias voltage Vb has a short pulse width and a gate bias voltage Vg has a pulse width that is sufficient to move electrons from a channel region to a charge trapping structure. | 12-03-2009 |
20090316484 | SEMICONDUCTOR MEMORY DEVICE, METHOD OF DRIVING THE SAME AND METHOD OF MANUFACTURING THE SAME - Disclosed is a semiconductor storage device comprising a semiconductor substrate, a first and a second impurity diffusion layer formed in the semiconductor substrate, a gate insulating film formed on the semiconductor substrate, and a first gate electrode formed on the semiconductor substrate via the gate insulating film. The gate insulating film has a nitrogen-containing silicon oxide film inside, and a silicon oxide film is so arranged on both sides of the nitrogen-containing silicon oxide film as to sandwich the nitrogen-containing silicon oxide film. In addition, the nitrogen composition in the nitrogen-containing silicon oxide film is increased from the semiconductor substrate side to the first gate electrode side. | 12-24-2009 |
20100074013 | Semiconductor Device and Method of Fabricating the Same - A method of fabricating a semiconductor device and a flash memory device are provided. The method of fabricating the semiconductor device includes: forming a nitride film on a semiconductor substrate; forming a sacrificial vertical structure on the nitride film; forming sacrificial spacers on lateral surfaces of the sacrificial vertical structure; performing an initial patterning of the nitride film using the sacrificial vertical structure and the sacrificial spacers as etch masks; removing the sacrificial spacers after the initial patterning of the nitride film and forming gate electrodes on the lateral surfaces of the sacrificial vertical structure; and removing the sacrificial vertical structure from between the gate electrodes and performing a secondary patterning of the nitride film using the gate electrodes as etch masks. | 03-25-2010 |
20100135080 | FABRICATION METHOD AND STRUCTURE OF SEMICONDUCTOR NON-VOLATILE MEMORY DEVICE - A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other. | 06-03-2010 |
20100202205 | SEMICONDUCTOR DEVICE - The degree of integration and the number of rewriting of a semiconductor device having a nonvolatile memory element are improved. A first MONOS nonvolatile-memory-element and a second MONOS nonvolatile-memory-element having a large gate width compared with the first MONOS nonvolatile-memory-element are mounted together on the same substrate, and the first MONOS nonvolatile-memory-element is used for storing program data which is scarcely rewritten, and the second MONOS nonvolatile-memory-element is used for storing processed data which is frequently rewritten. | 08-12-2010 |
20100246267 | Systems and Methods Of Providing Programmable Voltage And Current Reference Devices - The present invention describes systems and methods to for providing stable and programmable voltage and current reference devices. An exemplary embodiment of the present invention provides a voltage reference device having a first floating-gate transistor with a first source, a first drain, and a first gate. The first gate is provided coupled to a first programming capacitor and a first input capacitor. Furthermore, the voltage reference device includes a second floating-gate transistor having a second source, a second drain, and a second gate. The second gate is provided coupled to a second programming capacitor and a second input capacitor. Additionally, the charge difference between the first floating-gate transistor and the second floating-gate transistor is a reference voltage. | 09-30-2010 |
20100259984 | ERASE METHOD OF NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - An erase method of a nonvolatile semiconductor memory device including a semiconductor substrate with diffusion regions spaced from each other, a first insulating layer formed on the semiconductor substrate, a first gate electrode formed in a first area on the first insulating layer, a charge accumulation layer formed in a second area on the first insulating layer, a second insulating layer formed on the charge accumulation layer and a second gate electrode formed on the second insulating layer includes a step of injecting hot holes into the charge accumulation layer from the diffusion region and a step of injecting channel hot electrons into a part of the charge accumulation layer close to the first gate electrode side. | 10-14-2010 |
20100259985 | Trap-charge non-volatile switch connector for programmable logic - A nonvolatile trap charge storage cell selects a logic interconnect transistor uses in programmable logic applications, such as FPGA. The nonvolatile trap charge element is an insulator located under a control gate and above an oxide on the surface of a semiconductor substrate. The preferred embodiment is an integrated device comprising a word gate portion sandwiched between two nonvolatile trap charge storage portions, wherein the integrated device is connected between a high bias, a low bias and an output. The output is formed by a diffusion connecting to the channel directly under the word gate portion. The program state of the two storage portions determines whether the high bias or the low bias is coupled to a logic interconnect transistor connected to the output diffusion. | 10-14-2010 |
20100259986 | Trap-charge non-volatile switch connector for programmable logic - A nonvolatile trap charge storage cell selects a logic interconnect transistor uses in programmable logic applications, such as FPGA. The nonvolatile trap charge element is an insulator located under a control gate and above an oxide on the surface of a semiconductor substrate. The preferred embodiment is an integrated device comprising a word gate portion sandwiched between two nonvolatile trap charge storage portions, wherein the integrated device is connected between a high bias, a low bias and an output. The output is formed by a diffusion connecting to the channel directly under the word gate portion. The program state of the two storage portions determines whether the high bias or the low bias is coupled to a logic interconnect transistor connected to the output diffusion. | 10-14-2010 |
20100271878 | INJECTION METHOD WITH SCHOTTKY SOURCE/DRAIN - An injection method for non-volatile memory cells with a Schottky source and drain is described. Carrier injection efficiency is controlled by an interface characteristic of silicide and silicon. A Schottky barrier is modified by controlling an overlap of a gate and a source/drain and by controlling implantation, activation and/or gate processes. | 10-28-2010 |
20110063914 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes: a memory unit; and a control unit. The memory unit includes: a multilayer structure including electrode films and interelectrode insulating films alternately stacked; a semiconductor pillar piercing the multilayer structure; insulating films and a memory layer provided between the electrode films and the semiconductor pillar; and a wiring connected to the semiconductor pillar. In an erase operation, the control unit performs: a first operation setting the wiring at a first potential and the electrode film at a second potential lower than the first potential during a first period; and a second operation setting the wiring at a third potential and the electrode film at a fourth potential lower than the third potential during a second period after the first operation. A length of the second period is shorter than the first period, and/or a difference between the third and fourth potentials is smaller than a difference between the first and second potentials. | 03-17-2011 |
20110116316 | NONVOLATILE RANDOM ACCESS MEMORY - A nonvolatile random access memory that can be mounted on a substrate during a standard CMOS process. A memory cell comprises: a first MIS transistor including a first semiconductor layer of a first conductivity type in an electrically floating state, first drain and source regions of a second conductivity type formed on the first semiconductor layer, and a first gate electrode formed over the first semiconductor layer via a first gate insulating film; and a second MIS transistor including a second semiconductor layer of the first conductivity type isolated from the first semiconductor layer, second drain and source regions of the second conductivity type formed on the second semiconductor layer, a second gate electrode formed over the second semiconductor layer via a second gate insulating film. The first and second gate electrodes are electrically connected to each other so as to form a floating gate in an electrically floating state. | 05-19-2011 |
20110116317 | PROGRAM AND ERASE METHODS WITH SUBSTRATE TRANSIENT HOT CARRIER INJECTIONS IN A NON-VOLATILE MEMORY - The present invention describes a uniform program method and a uniform erase method of a charge trapping memory by employing a substrate transient hot electron technique for programming, and a substrate transient hot hole technique for erasing, which emulate an FN tunneling method for NAND memory operation. The methods of the present invention are applicable to a wide variety of charge trapping memories including n-channel or p-channel SONOS types of memories and floating gate (FG) type memories. the programming of the charge trapping memory is conducted using a substrate transient hot electron injection in which a body bias voltage Vb has a short pulse width and a gate bias voltage Vg has a pulse width that is sufficient to move electrons from a channel region to a charge trapping structure. | 05-19-2011 |
20110176365 | TWO TERMINAL PROGRAMMABLE HOT CHANNEL ELECTRON NON-VOLATILE MEMORY - A programmable two terminal non-volatile device uses a floating gate that can be programmed by a hot electron injection induced by a potential between a source and drain. The floating gate layer can also function as a FET gate for other circuits in an integrated circuit containing an array of the devices. The invention can be used in environments such as data encryption, reference trimming, manufacturing ID, security ID, and many other applications. | 07-21-2011 |
20110205799 | OPERATION METHOD OF MEMORY DEVICE - A method for operating a memory device is provided. In accordance with the method, the charges are stored in a source storage region, a drain storage region, and a channel storage region of a charge storage layer which respectively correspond to a source, a drain, and a channel of a SONOS transistor, thereby achieving 3-bit information storage in one cell. The channel storage region is programmed and erased by FN tunneling. Both of the source storage region and the drain storage region are programmed by channel hot electrons and erased by source-side or drain-side FN tunneling. The present invention can store three-bit data per cell, such that the storage density of the memory device can be substantially increased. | 08-25-2011 |
20110216595 | NAND FLASH MEMORY OF USING COMMON P-WELL AND METHOD OF OPERATING THE SAME - A flash memory using hot carrier injection and a method of operating the same are provided. A plurality of strings constituting a page are formed on a single p-well and share the p-well. During a program operation, a string selection transistor is turned off, and electrons are accumulated in a source or drain region in response to a bias voltage applied to the p-well. Thereafter, the accumulated electrons are trapped in a charge trap layer of a memory cell in response to a program voltage applied through a word line. Also, during an erase operation, holes accumulated in response to a bias voltage applied to the p-well are trapped in the charge trap layer in response to an erase voltage. The flash memory performs NAND-type program and erase operations using hot carrier injection. | 09-08-2011 |
20110235419 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE - In a split gate MONOS memory which carries out rewrite by hot carrier injection, retention characteristics are improved. A select gate electrode of a memory cell is connected to a select gate line, and a memory gate electrode is connected to a memory gate line. A drain region is connected to a bit line, and a source region is connected to a source line. Furthermore, a well line is connected to a p type well region in which the memory cell is formed. When write to the memory cell is to be carried out, write by a source side injection method is carried out while applying a negative voltage to the p type well region via the well line. | 09-29-2011 |
20110305088 | HOT CARRIER PROGRAMMING IN NAND FLASH - A memory device includes a plurality of memory cells arranged in series in the semiconductor body, such as a NAND string, having a plurality of word lines. A selected memory cell is programmed by hot carrier injection using a boosted channel potential to establish the heating field. Boosted channel hot carrier injection can be based on blocking flow of carriers between a first side of a selected cell and a second side of the selected cell in the NAND string, boosting by capacitive coupling the first semiconductor body region to a boosted voltage level, biasing the second semiconductor body region to a reference voltage level, applying a program potential greater than a hot carrier injection barrier level to the selected cell and enabling flow of carriers from the second semiconductor body region to the selected cell to cause generation of hot carriers. | 12-15-2011 |
20110310669 | Logic-Based Multiple Time Programming Memory Cell - A non-volatile memory system includes one or more non-volatile memory cells. Each non-volatile memory cell comprises a floating gate, a coupling device, a first floating gate transistor, and a second floating gate transistor. The coupling device is located in a first conductivity region. The first floating gate transistor is located in a second conductivity region, and supplies read current sensed during a read operation. The second floating gate transistor is located in a third conductivity region. Such non-volatile memory cell further comprises two transistors for injecting negative charge into the floating gate during a programming operation, and removing negative charge from the second floating gate transistor during an erase operation. The floating gate is shared by the first floating gate transistor, the coupling device, and the second floating gate transistor, and extends over active regions of the first floating gate transistor, the coupling device and the second floating gate transistor. | 12-22-2011 |
20120081962 | LOW VOLTAGE PROGRAMMING IN NAND FLASH - A memory device includes a plurality of memory cells arranged in series in the semiconductor body, such as a NAND string, having a plurality of word lines. A selected memory cell is programmed by hot carrier injection. The program operation is based on metering a flow of carriers between a first semiconductor body region on a first side of the selected cell in the NAND string and a second semiconductor body region on a second side of the selected cell. A program potential higher than a hot carrier injection barrier level is applied to the selected cell, and then the drain to source voltage across the selected cell and the flow of carriers in the selected cell reach a level sufficient to support hot carrier injection, which is controlled by a switch cell adjacent the selected cell. | 04-05-2012 |
20120127796 | RETENTION IN NVM WITH TOP OR BOTTOM INJECTION - Retention of charges in a nonvolatile memory (NVM) cell having a nitride-based injector (such as SiN, SIRN, SiON) for facilitating injection of holes into a charge-storage layer (for NROM, nitride) of a charge-storage stack (for NROM, ONO) may be improved by providing an insulating layer (for NROM, oxide) between the charge-storage layer and the injector has a thickness of at least 3 nm. Top and bottom injectors are disclosed. Methods of operating NVM cells are disclosed. The NVM cell may be NROM, SONOS, or other oxide-nitride technology NVM cells such as SANOS, MANOS, TANOS. | 05-24-2012 |
20120155176 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor memory device and a method of manufacturing the same. The semiconductor memory device includes a first conductive type well and a second conductive type well disposed on and/or over a semiconductor substrate; a first gate and a second gate disposed on and/or over the first conductive type well and the second conductive type well, respectively; a second conductive type first ion implantation region disposed in the first conductive type well at one side of the first gate and a second conductive type second ion implantation region disposed in the first conductive type well at the other side of the first gate; a first conductive type first ion implantation region disposed in the second conductive type well at one side of the second gate and a first conductive type second ion implantation region disposed in the second conductive type well at the other side of the second gate; and a line electrically connecting the second conductive type second ion implantation region with the first conductive type first ion implantation region. | 06-21-2012 |
20120195124 | PROGRAMMING A NON-VOLATILE MEMORY - In a system having a plurality of non-volatile memory cells, a method includes performing hot carrier injection on a first non-volatile memory cell in a first mode of programming. In the first mode, current flows from a first current electrode to a second electrode of the first non-volatile memory cell and charge is transferred from the current to a floating gate of the first non-volatile memory cell at a location nearer the first current electrode than the second current electrode. The method further includes performing hot carrier injection on the first non-volatile memory cell in a second mode of programming. In the second mode, current flows from the second current electrode to the first electrode of the first non-volatile memory cell and charge is transferred from the current to the floating gate of the first non-volatile memory cell at a location nearer the second current electrode than the first current electrode. | 08-02-2012 |
20120195125 | OPERATING METHOD OF NONVOLATILE MEMORY DEVICE - Disclosed is an operating method of a nonvolatile memory device, which includes programming the first selection transistors of the plurality of cell strings and programming the plurality of memory cells of the plurality of cell strings. The programming the first selection transistors comprises supplying a first voltage to a first bit line connected with a first selection transistor to be programmed and a different second voltage to a second bit line connected to a first selection transistor to be program inhibited; turning on the second selection transistors of the plurality of cell strings, and supplying a first program voltage to a selected first selection line among a plurality of first selection lines connected with the first selection transistors and a third voltage to an unselected first selection line among the plurality of first selection lines. | 08-02-2012 |
20120287715 | Zero Cost NVM Cell Using High Voltage Devices in Analog Process - A non-volatile memory cell and array structure is disclosed situated within a high voltage region of an integrated circuit. The cell utilizes capacitive coupling based on an overlap between a gate and a drift region to impart a programming voltage. Programming is effectuated using a drain extension which can act to inject hot electrons. The cell can be operated as a one-time programmable (OTP) or multiple-time programmable (MTP) device. The fabrication of the cell relies on processing steps associated with high voltage devices, thus avoiding the need for additional masks, manufacturing steps, etc. | 11-15-2012 |
20130135933 | RFID TAG HAVING NON-VOLATILE MEMORY DEVICE HAVING FLOATING-GATE FETS WITH DIFFERENT SOURCE-GATE AND DRAIN-GATE BORDER LENGTHS - Non-volatile memory (NVM) devices are disclosed. In one aspect, a NVM device may include a substrate, and a field-effect transistor (FET). The FET may include a first doped region in the substrate and a second doped region in the substrate. The first and the second doped regions may define a channel region of the substrate between them. An insulating layer may overlie the channel region. A floating gate may overlie the insulating layer. Charge of an amount that encodes a value may be stored on the floating gate. The floating gate and the first and the second doped regions may be shaped such that the floating gate defines with the first doped region a first border of a first length, and the floating gate defines with the second doped region a second border of a second length that is less than 90% of the first length. | 05-30-2013 |
20130329498 | MEMORY CELL HAVING CLOSED CURVE STRUCTURE - A memory cell including a drain, a channel, and a floating gate. The channel surrounds the drain and includes a first rounded closed curve structure around the drain. The floating gate is situated over the channel and includes a second rounded closed curve structure over the channel. | 12-12-2013 |
20140056075 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor memory device and a method of operating the same are disclosed. The semiconductor memory device includes a memory cell array configured to include memory cells, a peripheral circuit configured to perform an erase operation and a soft program operation and a control circuit configured to control the peripheral circuit so that the memory cells are programmed though a hot carrier injection HCI method when the soft program operation is performed. | 02-27-2014 |
20140056076 | VERY DENSE NONVOLATILE MEMORY BITCELL - An asymmetric non-volatile memory bitcell is described. The bitcell comprises source and drain regions comprising carriers of the same conductivity type. A floating gate rests on top of the well, and extends over a channel region, and at least a portion of the source and drain regions. The drain region comprises additional carriers of a second conductivity type, allowing band to band tunneling. The source region comprises additional carriers of a first conductivity type, thereby increasing source-gate capacitance. Thus, the bitcell incorporates a select device, thereby decreasing the overall size of the bitcell. The bitcell may be created without any additional CMOS process steps, or through the addition of a single extra mask step. | 02-27-2014 |
20140063958 | N-Channel Multi-Time Programmable Memory Devices - N-channel multi-time programmable memory devices having an N-conductivity type substrate, first and second P-conductivity type wells in the N-conductivity type substrate, N-conductivity type source and drain regions formed in the first P-conductivity type well, the source and drain regions being separated by a channel region, an oxide layer over the N-conductivity type substrate; and a floating gate extending over the channel region and over the second P-conductivity type well in the N-conductivity type substrate, the multi-time programmable memory cell being programmable by hot electron injection and erasable by hot hole injection. | 03-06-2014 |
20140198574 | NONVOLATILE MEMORY AND MANIPULATING METHOD THEREOF - A manipulating method of a nonvolatile memory is provided and comprises following steps. The nonvolatile memory having a plurality of memory cell is provided. Two adjacent memory cells correspond to one bit and comprise a substrate, a first and another first doping regions, a second doping region, a charge trapping layer, a control gate, a first bit line, a source line and a second bit line different from the first bit line. A first and a second channel are formed. The charge trapping layer is disposed on the first and the second channels. The two adjacent memory cells are programmed by following steps. A first positive and negative voltages are applied to the control gate between the first and the second doping regions and the control gate between the second and the another first doping regions, respectively. A first voltage is applied to the source line. | 07-17-2014 |