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EMI

Subclass of:

361 - Electricity: electrical systems and devices

361600000 - HOUSING OR MOUNTING ASSEMBLIES WITH DIVERSE ELECTRICAL COMPONENTS

361679000 - For electronic systems and devices

361816000 - Shielding

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Entries
DocumentTitleDate
20110199751ELECTROMAGNETIC INTERFERENCE FILTER - A differential mode and common mode combination choke (DCCC) includes: a theta-shaped magnetic core including an essentially round magnetic ring and a magnetic plate engaged with magnetic ring across the area surrounded by the magnetic ring; and two common mode coils with the same number of turns and the same winding direction being wound around the magnetic ring. An EMI (electromagnetic interference) filter and an EMI filter module including the DCCC are also provided.08-18-2011
20100020520EMI SHIELDING DEVICE - An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.01-28-2010
20080259587Enclosure And Gasket Assembly For Reducing EMI - Enclosures and gasket assemblies for reducing EMI for computer systems and other electronic devices are disclosed. In an exemplary embodiment a gasket assembly for reducing EMI may comprise a soft core sizable to extend along at least the length of an opening in an EMI housing. The gasket assembly may also comprise a plurality of fingers positionable at spaced-apart positions along the entire length of the opening in the EMI housing, the plurality of fingers maintaining conductivity between mating surfaces of the EMI housing.10-23-2008
20090122508SYSTEMS, METHODS, AND APPARATUS FOR COMBINED SUPERCONDUCTING MAGNETIC SHIELDING AND RADIATION SHIELDING - A device is at least partially contained within a shielded enclosure formed by a first material that has a high thermal conductivity and plated with a second material that is superconductive below a critical temperature. An exterior of the shielded enclosure is at least partially wound by a compensation coil that is coupled to a current source. One or more measurement devices are responsive to magnetic fields in close proximity to the device, allowing compensation by controlling current to the compensation coil. Thus, magnetic shielding may be provided by compensation fields that may be trapped within the shielded enclosure when the system is cooled below the critical temperature of the second material. Radiation shielding may be provided by cooling the shielded enclosure to a temperature that is approximately equal to the temperature of the device.05-14-2009
20130077282INTEGRATED THERMAL AND EMI SHIELDS AND METHODS FOR MAKING THE SAME - Electronic devices having integrated thermal and EMI shields for providing thermal dissipation and EMI shielding of one or more circuitry components, and methods for making the same, are provided. The integrated shield combines both thermal and EMI shielding properties into a single layer material that saves space within the electronic device. The integrated shield can be constructed from a silicon material having one or more EMI shielding additives incorporated therein.03-28-2013
20090196008ELECTROMAGNETIC INTERFERENCE (EMI) COLLAR AND METHOD FOR USE WITH A PLUGGABLE OPTICAL TRANSCEIVER MODULE - An EMI collar is provided that is configured to be secured about a housing of a pluggable optical transceiver module. The configuration of the EMI collar and the method by which the collar is attached to the housing of the transceiver module ensures that the collar will not be damaged when the transceiver module housing is inserted into a cage. Ensuring that the collar will not be damaged during insertion ensures that electrically conductive contact points on the collar will not be eliminated by insertion of the housing into a cage. In addition, dimples, or indentations, formed on the spring fingers of the EMI collar result in additional electrically conductive contact points on the fingers that result in a reduction in the size of the maximum EMI aperture dimension of the collar. Reducing the maximum EMI aperture dimension of the collar greatly improves the ability of the collar to attenuate EMI signals, even EMI signals having high frequencies.08-06-2009
20100067210RADIO WAVE SHIELDING CASE - An aspect of the invention is a radio wave shielding case including, a case body having at least a first facet and a second facet connected to the first facet, the first facet including an opening configured to surround a reading facet of a wireless tag reader antenna, a wireless tag slit which is formed in the second facet of the case body and enables a wireless tag to be inserted in the case body so as to face the reading facet of the antenna surrounded by the opening, and a radio wave absorber which covers the opening of the case body and an inner surface except for the wireless tag slit.03-18-2010
20130188328QUASI-ELECTRIC SHORT WALL - Provided is an assembly and process for isolating internal regions of an electromagnetic cavity from interfering electromagnetic radiation. The assembly includes a first portion defining a first electrically conducting broad wall and an elongated, electrically conducting isolating wall, coupled to and extending away from the first broad wall. The assembly also includes a second portion defining a second electrically conducting broad wall and an elongated, electrically conducting trough defined therein. The trough is sized to accept at least a portion of the isolating wall. The first and second portions are adapted for assembly in a facing arrangement in which the isolating wall is aligned with the trough. When assembled, a tip portion of the isolating wall extends to a uniform depth within the trough, such that the isolating wall-trough combination substantially rejects a transfer of electromagnetic energy across the isolating wall over at least a predetermined range of wavelengths.07-25-2013
20090154134LIGHTWEIGHT ELECTRONIC DEVICE FOR AUTOMOTIVE APPLICATIONS AND METHOD - A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.06-18-2009
20090303693Wireless Power Transmitting Apparatus - A wireless power transmitting apparatus for remotely transmitting energy is implemented with a closed metal housing and a plurality of conductive plates disposed within the closed metal housing. With the aid of a high impedance between the closed metal housing and the conductive plates, a surface having the high impedance is formed on both the closed metal housing and the conductive plates for constraining electromagnetic power within the closed metal housing from dissipating and being consumed. The wireless power transmitting apparatus is not merely able to effectively and uniformly restrict electromagnetic field energy to the closed metal housing with the aid of the high impedance, but is also be able to raise a power transmitting efficiency between a power emitting device and a power receiving device.12-10-2009
20120218734Packing Member - A packing member is provided in which waterproofness is achieved and electromagnetic waves are blocked. The packing member has: a first member; and a second member for covering at least a part of the surface of the first member. The first member is composed of a material having a larger elastic deformability than the second member. The second member is composed of a composite material containing electrically conductive substance and is electrically connected to the surface of a base on which the first member is mounted.08-30-2012
20090091908ELECTRONIC MODULE COMPRISING A SHIELDED CONNECTOR FIXED TO AN INTEGRATED CIRCUIT CARD BY MEANS OF A LUG FOR FIXING THE SHIELDING - The invention concerns an electronic module for converting electrical voltage that is intended to supply a light source, which comprises: 04-09-2009
20100128456Electronic Package - The present invention relates to a device package, such as an electronic system package, that is suitable for use in harsh military or commercial environments. The package components, including a base enclosure and mating cover, comprise a series of interconnected electrically conductive materials, forming a tortuous electrically conductive path, that advantageously shield electromagnetic interference (“EMI”). The electrically conductive, EMI-shielding layers and other coated layers (e.g., insulative electrocoated paint layers) are smooth layers that provide corrosion resistance to the interior and exterior surfaces of the package. The package is also designed such that its components form a water tight seal. Thus, innovatively, the package comprises a combination of components that synergistically shield electromagnetic interference, resist interior and exterior corrosion, and form a water tight seal. The package is configured to pass military specification EMI and salt fog standard testing.05-27-2010
20130063923DISPLAY DEVICE - Disclosed is a display device wherein moving of a display panel in the planar direction is suppressed, while reducing EMI. The liquid crystal display device is provided with the liquid crystal display panel, and a holding member, which holds the end portion of the liquid crystal display panel. The holding member includes: a front side holding section, which is disposed on the front side of the liquid crystal display panel; a rear side holding section, which is disposed on the rear side of the liquid crystal display panel; and regulating sections, which are disposed on the side of the liquid crystal display panel, and which regulate moving of the liquid crystal display panel in the planar direction of the liquid crystal display panel. The front side holding section has a function of blocking electromagnetic waves.03-14-2013
20090237907Plasma display device - A plasma display device capable of reducing an electromagnetic interference wave due to a driving current flowing in a plasma display panel is provided. The plasma display device includes a plasma display panel having electrodes that are parallel to each other, a driver circuit board for applying a voltage to the electrodes, a chassis conductor holding the plasma display panel and to which a ground of the driver circuit board is connected, and a first additional conductor plate provided to the chassis conductor via an insulating layer and to which grounds of at least one circuit board in circuit boards other than the driver circuit board are attached.09-24-2009
20090046443Ground Structure for a tuner - On a circuit board to be mounted on a metal chassis, a tuner having a metal sleeve protruding from a side of its case is mounted, with the sleeve protruding beyond an edge of the circuit board. A metal ground plate is fitted on the sleeve. With a flexible leg portion formed at a lower portion of the ground plate disposed on the chassis, the circuit board is fixed to the chassis with screws, thereby the leg portion comes into elastic contact with the chassis.02-19-2009
20090046442FORMED SHIELDING FEATURE - An metal housing comprising an electrical device includes electrical pins that protrude from the metal housing, and the metal housing formed with a compressible protrusion around the pins.02-19-2009
20100014270ELECTROMAGNETIC SHIELDING DEVICE - A shielding article including a substantially conductive layer; and a substantially magnetically permeable layer adjacent the conductive layer. Embodiments of the invention can feature the substantially conductive layer and the substantially magnetically permeable layer as collectively providing electromagnetic shielding characteristics.01-21-2010
20120236528MULTILAYER EMI SHIELDING THIN FILM WITH HIGH RF PERMEABILITY - A flexible multilayer electromagnetic shield is provided that includes a flexible substrate, a thin film layer of a first ferromagnetic material with high magnetic permeability disposed upon the substrate and a multilayer stack disposed upon the first ferromagnetic material. The multilayer stack includes pairs of layers, each pair comprising a polymeric spacing layer and a thin film layer of at least a second ferromagnetic material disposed on the spacing layer. At least one or more of the spacing layers includes an acrylic polymer. Also methods of making the flexible multilayer electromagnetic shield are provided.09-20-2012
20110032692EMI SHIELDING SLIDE ASSEMBLIES FOR SLIDABLY OPENING AND CLOSING PORTABLE ELECTRONIC DEVICES AND FOR PROVIDING EMI SHIELDING FOR BOARD-MOUNTED ELECTRONIC COMPONENTS - According to various aspects, exemplary embodiments are provided of slide assemblies for slidably opening and closing portable communications terminals, which also are configured to provide electromagnetic interference (EMI) shielding for electronic components of a substrate, such as board-mounted electronic components on a printed circuit board (PCB) of a cellular phone, etc. In one exemplary embodiment, a slide assembly generally includes first and second slide members slidably coupled so as to allow the first slide member to be slidably moved relative to the second slide member. EMI shielding structure is along at least one surface of at least one of the first and second slide members. The EMI shielding structure and the at least one of the first and second slide members are operable for cooperatively providing EMI shielding for one or more board-mounted electronic components of a substrate when disposed within the interior cooperatively defined by the EMI shielding structure, the at least one of the first and second slide members, and the substrate.02-10-2011
20090244877PCB layout structrue for suppressing EMI and method thereof - A PCB layout structure for suppressing EMI and a method thereof is disclosed. The PCB layout structure for suppressing EMI includes a multi-layer PCB, a plurality of electric grids, and a plurality of conductive vias. The multi-layer PCB has a plurality of signal layers and a grounding layer. Each of the signal layers is disposed with a plurality of signal lines. The plurality of electric grids are disposed on each of the signal layers and cover the signal lines on each of the signal layers. The plurality of conductive vias are located between the layers of the multi-layer PCB to electrically connect the grounding layer with the electric grids on each of the signal layers. Thereby, electromagnetic waves of a specific wavelength are shielded by appropriately choosing the dimensions of the electric grids.10-01-2009
20110279995METHOD OF SHIELDING A CIRCUIT BOARD, CIRCUIT BOARD, ELECTROMAGNETIC SHIELD AND METHOD OF MANUFACTURING SAME - There is disclosed a method of shielding a circuit board, a circuit board, an electromagnetic shield and a method of manufacturing an electromagnetic shield. In an aspect, the method comprises placing a first electromagnetic shield (11-17-2011
20090231825ELECTROMAGNETIC SHIELDING DEVICE - An electromagnetic shielding device includes a base board mounted with an electronic component on a top surface thereof and having a looped surrounding surface interconnecting the top surface and a bottom surface. The surrounding surface has an inclined upper surface portion extending outwardly and downwardly from a periphery of the top surface and attached with a looped solder pad. A metal cover is mounted on the base board, and has a looped surrounding wall extending downwardly from a periphery of a top wall. The surrounding wall has a bottom end connected electrically and fixedly to the solder pad such that the metal cover cooperates with the base board to define an inner receiving space therebetween for receiving the electronic component.09-17-2009
20090052154ELECTROMAGNETIC ISOLATION SHIELD - An electronic shielding component includes a shielding body, at least one cavity on a first side of the shielding body, the at least one cavity adapted to accommodate an electronic component therein, and at least two cavities on a second side of the shielding body, each of the at least two cavities adapted to accommodate an electronic component therein. Each cavity is adapted to electromagnetically isolate an electronic component therein from cavities on an opposite side of the shielding body and from cavities on the same side of the shielding body.02-26-2009
20110299263ENCLOSURE OF ELECTRONIC DEVICE - An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.12-08-2011
20110299264EMI NOISE SHIELD BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE - The present invention provides an EMI noise shield board in which an EBG structure is inserted. The EMI noise shield board in accordance with an embodiment of the present invention can include: a first board portion, an electronic part being mounted on an upper surface of the first board portion, a circuit for transferring a signal and power to the electronic part being in the first board portion; and 12-08-2011
20110299262BOARD LEVEL ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDS WITH THROUGH HOLE LATCHING MECHANISMS - Disclosed herein are exemplary embodiments of EMI shielding apparatus (e.g., one-piece shields, multi-piece shields, frames, etc.) having one or more latching members insertable into openings or holes in a substrate (e.g., printed circuit board, etc.) and engagable to the substrate. The engagement of the latching members with the substrate mechanically attaches the EMI shielding apparatus to the substrate.12-08-2011
20110292631APERTURE EDGE EMISSION SUPPRESSION USING FERRITE - An electronic device is within a housing that has an aperture through an enclosure surface of the housing. A ferrite block is attached to an edge of the aperture, thus transforming electromagnetically-induced current next to the aperture into heat in order to reduce a voltage across the aperture, thereby suppressing aperture edge emissions.12-01-2011
20090129043EMI SHIELDING AND ENVIRONMENTAL SEAL DEVICE - An EMI shield for a movable component such as an antenna of an electronic device includes a microfiber ring of densely packed microfibers extending from an EMI shielding housing across the space defined by an opening in the housing for the movable component. Multiple microfiber rings can be used separated by spacers, and an environmental shield can be included.05-21-2009
20090196007ELECTROMAGNETIC INTERFERENCE (EMI) SYSTEM AND METHOD FOR USE WITH AN OPTICAL TRANSCEIVER MODULE - An EMI system is provided for use with an optical transceiver module. The EMI system comprises an EMI collar that is secured about the housing of the transceiver module. The EMI collar is configured such that when the collar is secured to the module housing and the module is contained within a cage, features on the EMI collar provide electrically conductive pathways between the module housing and the cage.08-06-2009
20090284946FLEXIBLE PRINTED CIRCUIT FILM AND DISPLAY APPARATUS HAVING THE SAME - A flexible printed circuit (FPC) film includes a film body portion connected to a display panel, and an electromagnetic (EM) wave blocking portion extended from the film body portion, wherein the EM wave blocking portion covers a portion of a driving chip disposed on the display panel.11-19-2009
20120140431Electromagnetically-Protected Electronic Equipment - Equipment and systems for protecting electronics against damage or upsets from electromagnetic pulse (HEMP or EMP), intentional electromagnetic interference (IEMI), and high power RF weapons are disclosed. This equipment can include a shielding arrangement includes a metallic enclosure having an interior volume defining a protected portion and an unprotected portion separated by an electromagnetically shielding barrier, and having a portal providing access to the protective portion and including an access opening, a shielding cover sized to cover the access opening, and an electromagnetically sealing gasket positioned around a perimeter of the access opening. The shielding arrangement also includes one or more filters positioned at least partially within the unprotected portion and along the electromagnetically shielding barrier to dampen electromagnetic signals and/or power signals outside a predetermined acceptable range. In some cases, waveguides beyond cutoff are included, to provide passage of optical signals or airflow through the enclosure.06-07-2012
20090147494ELECTRONIC DEVICE AND SLOT - An electronic device includes a casing having an opening, a cover that covers the opening, a slot connector provided on a board arranged in the casing, and a conducting member that is provided at the slot and that electrically connects the printed circuit board to the cover.06-11-2009
20090147493Electronic module with seamless anti-emi device - An electronic module (06-11-2009
20090141471Collapsible EMC Gasket - A method and associated assembly is provided for a collapsible EMC gasket is provided. In one embodiment, the gasket comprises a flexible conductive sheet disposed between corner of a first and a second surface of a computer frame capable of housing electronic components. The sheet is larger in area than the corner area of the frame such that when disposed, said sheet forms a curved structure. The sheet is being fabricated of a material that can be compressed and then decompressed back to its original shape.06-04-2009
20110085316CONFORMING EMI SHIELDING - This is directed to an EMI shield constructed from a conformal coating. A circuit board can include electronic components for which EMI shielding is required. To provide such shielding in a space-efficient manner, a first non-conductive conformal coating can be placed over the circuit board and the electronic components. A second conductive conformal coating can then be placed over the first such that at least portions of the second coating around the periphery of the electronic components are electrically coupled to the circuit board.04-14-2011
20080266831Filter and plasma display device comprising the same - A filter including: a base film; a reflection preventing layer which is formed on one side of the base film; an electro magnetic interference (EMI) shielding layer which is formed on another side of the base film; an adhesive layer, which is formed between the EMI shielding layer and a front substrate of a display panel so as to directly adhere the filter to the front substrate of the display panel; and a conductive member which is formed to externally protrude and is formed inside a groove that penetrates the reflection preventing layer and the base film so as to electrically connect the EMI shielding layer and the conductive member. Accordingly, the filter includes a single base film and can ground the EMI shielding layer at the front surface of the plasma display device. The filter is included in a plasma display device.10-30-2008
20100118506ELECTROMAGNETIC INTERFERENCE SUPPRESSING APPARATUS FOR HIGH-FREQUENCY SIGNAL GENERATION DEVICE - The present utility model relates to an electromagnetic interference suppressing apparatus for a high-frequency signal generation device. The high-frequency signal generation device includes an inverter means which is used for converting a direct current signal into a high-frequency alternating current signal, wherein the electromagnetic interference suppressing apparatus includes an electric conductor which is in capacitive or inductive coupling with the high-frequency signal generation device and is connected to the reference zero voltage point of the direct current signal. With the present utility model, the electromagnetic interference generated by the high-frequency signal generation device may be effectively suppressed in the case where a reliable earthing is not achievable. The present utility model relates also to an electronic ballast having the function of suppressing electromagnetic interference, and a fluorescent lamp of a compact type having the function of suppressing electromagnetic interference.05-13-2010
20120155054ELECTROMAGNETIC INTERFERENCE (EMI) ABSORBING ASSEMBLY AND METHOD FOR USE IN AN OPTICAL TRANSCEIVER MODULE - An optical transceiver module is provided that has an EMI absorbing assembly that comprises an EMI absorbing device that is electrically grounded rather than standing in free space in the transceiver module so that the assembly absorbs both the magnetic and electrical components of the EMI. In accordance with an embodiment, the EMI absorbing assembly includes a leadframe about which an EMI absorbing material is cast. The leadframe preferably is shaped in a way that prevents or lessens the occurrence of resonant EMI modes in the transceiver module housing.06-21-2012
20090207578APPARATUS FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND SPREADING HEAT - A radio module for use in an electronic device is disclosed. The radio module has a shield for reducing electromagnetic interference on the radio module. The shield may include a heat-spreading layer made of a material including graphite. The heat-spreading layer may spread heat generated by the radio module. The shield may also include a reflective layer overlapping the heat-spreading layer and configured to reflect electromagnetic energy to the heat-spread layer. The heat-spreading layer is also configured to absorb at least a portion of the electromagnetic energy, thereby reducing the electromagnetic interference on the radio module.08-20-2009
20090201660CONTROL BOARD ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME - A control board assembly includes a board, at least one electronic component mounted on one surface of the board, and a shield case receiving therein the board on which the at least one electronic component is mounted. On one surface of the shield case facing the at least one electronic component, at least one opening is formed to expose the at least one electronic component.08-13-2009
20120106119MOBILE PHONE WITH METAL HINGED SHIELD - The mobile phone includes a printed circuit board (PCB), a metal hinged shield, and a connecting member. The metal hinged shield is pivoted on the PCB by the connecting member. The metal hinged shield further comprises a high metal body and a low metal body. The high metal body partially overlaps the low metal body.05-03-2012
20090290320Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the same - A structure for blocking electromagnetic interference (EMI) may include at least one electromagnetic wave inducing member and an electromagnetic wave filtering member. The at least one electromagnetic wave inducing member may be provided to an electronic device to induce an electromagnetic wave applied to the electronic device. The electromagnetic wave filtering member may be provided to the electronic device to filter the electromagnetic wave induced by the at least one electromagnetic wave inducing member. Thus, the electromagnetic wave filtering member may remove the electromagnetic wave concentrated on the at least one electromagnetic wave inducing member, so that the electromagnetic wave applied to the electronic device may be effectively removed. As a result, circuits in the electronic device may be protected from the EMI.11-26-2009
20090273912INTERLOCKING EMI SHIELD - An electromagnetic interference shield system is provided. Each EMI shield may include a frame providing the structure around the electronic device components to be shielded, and a cover operative to be placed over the frame to prevent electromagnetic radiation from passing over the frame. Each frame may be coupled to a circuit board, and enclose electronic components in need of shielding. Each cover may be coupled to its corresponding frame using at least one snap that extends from the periphery of the cover towards the frame and circuit board. To minimize the space taken by the EMI shields, the snaps of adjacent covers may be offset or staggered so that opposing snaps engage voids left between snaps of the opposing cover, thus reducing the space needed between adjacent EMI shields by up to the width of a snap.11-05-2009
20100284162ELECTRONIC DEVICE - An electronic device is provided. The electronic device includes a base, a power supply chassis mounted in the base, and a shielding member. The power supply chassis defines a receiving space. A power supply is accommodated in the power supply chassis and occupies part of the receiving space. The power supply and the power supply chassis cooperatively define an opening. The shielding member blocks the opening. A securing slot is defined in the power supply chassis. An elastic securing member is formed on the shielding member and engages with the securing slot.11-11-2010
20090207579EMI SHIELDING ASSEMBLIES AND RELATED METHODS OF RETAINING COMPONENTS THEREOF TOGETHER - In one exemplary embodiment, an electromagnetic interference (EMI) shielding apparatus generally includes a shield and a gasket. The gasket includes at least one tab formed monolithically with the gasket and attached to a support or portion of the gasket. The at least one tab is movable relative to the support from a first, pre-installed configuration in which the at least one tab is generally co-planar with the support to a second, installed configuration in which the at least one tab extends generally outwardly relative to the support. Movement of the at least one tab from the first configuration to the second configuration may position the at least one tab at least partially within the at least one opening of the shield. Frictional engagement of the at least one tab within the at least one opening may help retain the relative positioning of the gasket to the shield.08-20-2009
20090290319ELECTROMAGNETIC SHIELDING IN SMALL-FORM-FACTOR DEVICE - In a device having a circuit board bearing one or more components requiring electromagnetic shielding, and having a subassembly with a conductive backplane, the circuit board is mounted beneath that backplane. Each component or group of components requiring shielding is surrounded by a grounded shielding can having an open top. Conductive spring fingers, aligned with the walls of the can, are formed in or on the backplane. When the device is assembled, the backplane closes the can. The spring fingers press against, or interengage with, the tops of the can walls, electrically bridging any gap resulting from assembly tolerances.11-26-2009
20080212304Wave Absorber and Manufacturing Method of Wave Absorber - The problem of the present invention is to offer a wave absorber that has reflection attenuation capability sufficient to enable prevention of communication disturbances due to reflection and the like of EM waves, that enables greater thinness and lighter weight, and that has wide-band attenuation properties, as well as a manufacturing method of the wave absorber. The wave absorber of the present invention has a structure which sequentially laminates a grid-like conductor layer composed of an electric conductor, a first dielectric layer, a high-resistance conductor layer having a surface resistivity within a prescribed range, a second dielectric layer, and a pattern layer having multiple patterns composed of an electric conductor, wherein each pattern in said pattern layer differs in either or both of size and form relative to another adjacent pattern.09-04-2008
20100110656CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate.05-06-2010
20090086462Method And Apparatus For Reducing EMI Emissions From A Power Inverter - A power inverter for a hybrid automotive vehicle having a case with an interior and at least one electrical port mounted on the case to electrically connect electrical signals from the interior of the case to an exterior device. A cable connector is associated with each electrical port while a non-electrical sensing conductor extends serially through each electrical port and its associated cable connector. A circuit is provided which detects a break in the continuity of the sensing conductor and generates a signal representative of that break in continuity. The non-electrical sensing conductor thus minimizes the emission of EMI from the inverter. Additionally, a circuit board is mounted within the interior of the case by fasteners which minimize the spacing between the circuit board and the case to further reduce EMI emissions.04-02-2009
20100103639Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system architectures - Disclosed are ferroelectric and ferromagnetic noise isolation structures that reduce electromagnetic interference and noise in integrated circuit devices and system architectures. Representative structures comprise two or more devices that are vertically disposed relative to one another, and a thin ferroelectric or ferromagnetic film layer disposed between the respective devices that isolates electromagnetic energy coupling from one device to another.04-29-2010
20090002971BOTTOM SIDE SUPPORT STRUCTURE FOR CONFORMAL SHIELDING PROCESS - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.01-01-2009
20090002972BACKSIDE SEAL FOR CONFORMAL SHIELDING PROCESS - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.01-01-2009
20090002970CONFORMAL SHIELDING PROCESS USING PROCESS GASES - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.01-01-2009
20090002968APPARATUS FOR UNIVERSAL ELECTROMAGNETIC NAVIGATION TARGET FOR FLUOROSCOPIC SYSTEMS - Certain embodiments of the present invention provide a system for an electromagnetic shield assembly for use with C-arms. In an embodiment, the system may include a ring shield configured to encompass an x-ray detector. The ring shield may have a first window opening to receive x-rays. The system may also include a window shield configured to shield the first window opening of the ring shield. Certain embodiments of the present invention may provide a system for a universal navigation target. In an embodiment, the system may include a radiolucent calibration target and an electromagnetic shield. The electromagnetic shield may include a ring shield having a first window opening to receive x-rays and a window shield configured to shield the first window opening of the ring shield.01-01-2009
20090002969FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.01-01-2009
20100128455FARADAY CAGE FOR CAMERA - A camera includes an electrically conductive housing defined by exterior walls and an interior cavity. The exterior walls of the housing have a lens opening and a connector opening formed therein. An imaging device is disposed within the interior cavity of the housing and communicates with the lens opening. A printed wiring board (PWB) is disposed within the interior cavity of the housing separating the imaging device from the connector opening. The PWB has an electrically conductive chassis plane operatively connected to the exterior walls of the housing so that the chassis plane and the housing form at least a partial Faraday cage around the imaging device.05-27-2010
20100128454Optical waveguide EMI shield - A circuit board assembly is configured to attenuate and prevent electromagnetic fields from interfering with operation below a desired cutoff frequency, of electromagnetic interference (EMI) susceptible circuit board electronics disposed within a shielded enclosure, while allowing signals to be transmitted between the EMI susceptible circuit board electronics at frequencies below the desired cutoff frequency, and circuits or devices external to the shielded enclosure.05-27-2010
20080304247BOSS STRUCTURE AND CASING OF ELECTRONIC DEVICE USING THE SAME - A boss structure including a boss and a metal layer is provided. The boss has a flat surface located on a top end of the boss and a chamfer connected to the flat surface. The metal layer wholly covers an exposed surface of the boss. Since the boss has the chamfer, a burr is located below the flat surface on the top end of the boss when the boss has the burr. Therefore, another element does not damage the burr of the boss when being locked to the boss structure, so as to keep the completeness of the metal layer of the boss structure.12-11-2008
20080310139ELECTROMAGNETIC INTERFERENCE SHIELDING APPARATUS - A shielding apparatus is disclosed suitable for use in providing electromagnetic interference shielding for an electrical component on a substrate. The shielding apparatus includes a frame that is at least partially drawn in construction and is configured for installation to the substrate. Side walls of the frame generally surround the electrical component, and a cover is attachable to the frame for substantially covering the electrical component. The cover includes an upper surface having an inverted embossment formed therein, and a cover member extending generally downwardly from the upper surface adjacent the inverted embossment. The inverted embossment and cover member define a guide for guiding and receiving at least part of the frame into the guide when the cover is attached to the frame. The guide is configured to help facilitate and generally hold the cover in electrical contact with the frame when the cover is attached to the frame.12-18-2008
20080291654WIRELESS COMMUNICATION NODULE ASSEMBLY - A wireless communication module assembly includes a main board having a top surface on which a plurality of grounding pads are provided, a circuit board unit, and a metal cap. The circuit board unit has a bottom surface electrically mounted on the top surface of the main board, a top surface with a plurality of grounding pads, and a plurality of notches corresponding to the grounding pads of the main board. The metal cap covers the circuit board unit and has first mounting legs respectively and electrically connected with the grounding pads of the circuit board unit, and second mounting legs respectively passing through the notches of the circuit board unit and electrically connected with the grounding pads of the main board.11-27-2008
20080247147Electromagnetic-shielding device - An electromagnetic-shielding device disposed in an electronic device prevents that an electric component in the electronic device is interfered by electromagnetic wave. The electromagnetic-shielding device has at least one positioning and leaning wall, which is mounted on a laminate member as a part of a housing of the electronic device or a central plate within the electronic device. By means of the positioning and leaning wall, an electromagnetic-shielding mask is conveniently mounted within the electronic device so as to cover the electronic component.10-09-2008
20100149780SHIELDING ASSEMBLY AND ELECTRONIC DEVICE UTILIZING THE SAME - A shielding assembly comprises at least two shielding modules, each comprising a frame and a cover mounted on the frame. Each of the at least two covers comprises a plurality of engaging portions and a plurality of slots between each two adjacent engaging portions, and one portion of one of the at least two frames abuts one portion of another of the at least two frames. Each of the plurality of engaging portions of one of the at least two covers is received in a corresponding slot of another of the at least two covers to connect the at least two shielding covers to form a cover to reduce electromagnetic interference for an electronic components positioned on a circuit board.06-17-2010
20090097223ELECTROMAGNETIC SHIELDING DEVICE FOR PRINTED CIRCUIT BOARD - A shielding enclosure (04-16-2009
20090052153ON CHIP SHIELDING STRUCTURE FOR INTEGRATED CIRCUITS OR DEVICES ON A SUBSTRATE AND METHOD OF SHIELDING - An electromagnetic shielding structure that includes a conductive structure surrounding and accommodating a circuit or a circuit device arranged on a substrate. At least one feed through device is associated with the conductive structure and provides signals to the circuit or circuit device. The method includes forming a shielding structure so that the shielding structure at least one of is at least partially arranged within the substrate and surrounds the circuit or circuit device and associating at least one feed through device with the shielding structure.02-26-2009
20090122507Conductive elastomeric shielding device and method of forming same - A conductive elastomeric shielding device (05-14-2009
20090161334Wireless communication module - A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame space; and a plurality of conductive bodies embedded in the dielectric frame and surrounding the frame space so as to prevent electromagnetic interference resulting from the electronic component.06-25-2009
20090161335Housing of a Power Filter - A housing adapted for a power filter and a power filter comprising the housing are provided. The power filter further comprises a filter element, a protection ring, and a connection line. The housing comprises a bottom wall, a sidewall, and an opening. The sidewall is disposed adjacent to the bottom wall to define a receiving space for receiving the filter element. The sidewall comprises an upper edge, with the opening extending downwards from the upper edge. The protection ring for protecting the connection line can be inserted into and fixed in the opening from the upper edge. With this opening, the power filter of the present invention can be assembled with greater ease.06-25-2009
20090129042Modular EMI Waveguide Suppression For Openings In Electrical Enclosures - A method for suppression of EMI emissions around an opening of an electronic enclosure that holds a physical layer switch. Fiber optic cables are installed on a plurality of ports attached to the switch such that the cables pass through the opening in the cabinet. The cables are divided into a plurality of discrete bundles. An enclosure is placed around each bundle while the enclosure is in an open state and thereafter the enclosure is closed such that the enclosure surrounds the bundle. The enclosure is designed such that it suppresses EMI emissions. After the enclosures are closed, they are positioned in an arrangement in the opening of the electronic enclosure.05-21-2009
20120069542Communication module - A communication module includes a communication circuit, a connector coupled to the communication circuit, a housing having a space for arranging the communication circuit and an aperture for arranging the connector, and a projection provided at facing inside wall surface of the housing and attenuating an electromagnetic wave within a frequency range transmitted in the space.03-22-2012
20130120957RF SHIELDING FOR ELECTRONIC COMPONENTS - An RF shield formed of RF opaque material that permits access to components on a printed circuit board is described. The RF shield can include a first portion attached to the PCB and a removable top portion attached to the first portion at an interface. The top portion is removed from the first portion to expose the components on the PCB. In one aspect of the described embodiment, the top portion is peeled away from the first portion. The components are enclosed within the RF shield after the removal of the top portion by attaching and sealing another top portion to the first portion at the interface by, for example, laser attaching the first portion and the other top portion at the interface.05-16-2013
20130120958METHOD FOR PERFORMING CHIP LEVEL ELECTROMAGNETIC INTERFERENCE REDUCTION, AND ASSOCIATED APPARATUS - A method for performing chip level electromagnetic interference (EMI) reduction is provided, where the method is applied to an electronic device. The method includes: providing at least one EMI suppression circuit within at least one chip of the electronic device; and utilizing the at least one EMI suppression circuit within the at least one chip to perform EMI reduction on at least one signal within the at least one chip. In particular, the at least one chip includes a first chip and a second chip; and the at least one EMI suppression circuit includes a first EMI suppression circuit positioned within the first chip, and further includes a second EMI suppression circuit positioned within the second chip. An associated apparatus is also provided.05-16-2013
20130120959DIELECTRIC MATERIAL SHEET AND PROCESS FOR PRODUCTION THEREOF, AND ELECTROMAGNETIC WAVE ABSORBER - The dielectric sheet of the present invention is made of a sheet having a thickness of 5-30 μm, which is formed by drying a coated film of a coating liquid containing a resin and a natural graphite powder having an average particle diameter of 10 μm or less. Preferably, the sheet is formed from a coating liquid containing a resin, a natural graphite powder having an average particle diameter of 10 μm or less, and a solvent, wherein the content rate of the natural graphite powder to the resin exceeds 5% by volume and is not more than 20% by volume, and the total content of the resin and the natural graphite powder is 10-55 wt %.05-16-2013
20110141714METAL SHIELDING CAN AND ASSEMBLY OF THE METAL SHIELDING CAN AND A CIRCUIT BOARD - A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.06-16-2011
20090213565EMC SHIELDING FOR PRINTED CIRCUITS USING FLEXIBLE PRINTED CIRCUIT MATERIALS - Exemplary embodiments of the present invention relate to a method for making multilayer flexible printed circuit carrier. The method comprises producing a first flexible conductor layer having a first width, producing a second flexible conductor layer having a second width larger than the first width, and separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator. The method also comprises placing a second insulator over at least a portion of a second surface of the first flexible conductor, and wrapping a portion of the second flexible conductor over the at least a portion of the second surface of the first flexible conductor.08-27-2009
20090021925PROTECTIVE TELECOMMUNICATIONS ENCLOSURE SYSTEMS AND METHODS - Protective containers for electronic equipment, and methods of testing and manufacture thereof, are provided. Enclosure systems and methods for protecting telecommunications equipment from electromagnetic fields include cabinets having a maximum width dimension that does not exceed about 26 inches and a maximum depth dimension that does not exceed about 22⅜ inches. The cabinets provide a HEMP protection level to electronic equipment housed therein that meets a HEMP protection level according to MIL-STD-188-125-1.01-22-2009
20090244878Conforming, electro-magnetic interference reducing cover for circuit components - An electronic circuit component is provided with shielding for electro-magnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is then covered by a layer of EMI shielding that conforms to the shape of the surface of the insulation to which the shielding is applied.10-01-2009
20090091907Shielding structure for electronic components - A shielding structure for electronic components includes a circuit board, at least one electronic module disposed on the circuit board and electrically connected thereto, at least one first covering layer, at least one shielding layer, and one second covering layer. Each first covering layer covers one electronic module and each first covering layer is covered by the shielding layer. The second covering layer covers the shielding layers. In the above-mentioned structure, the shielding layer is formed by coating or printing on the first covering layer in order to shield the electromagnetic radiation emitted by the function module. The time and the costs required for the manufacture of the above invention are reduced compared to the prior art.04-09-2009
20090257213SHIELD CASE AND CIRCUIT BOARD ASSEMBLY - A shield case of the present invention include a first case; and a second case, combinable with the first case. The first and second cases are provided with a plurality of abutting parts. The abutting parts abut on all respective surfaces of the component mounting board and hold the component mounting board in suspension in a state where the first and second cases are combined.10-15-2009
20100149781WATERPROOF COMMUNICATION APPARATUS - An electromagnetic interference shielding apparatus for a signal transceiver comprises a metal cover, a chassis, adhesive, and a waveguide output hole. A first combination portion having a first curved section is disposed on the edge of the metal cover. The first curved section of the first combination portion includes at least one opening The edge of the chassis includes a second combination portion having a groove corresponding to the first combination portion. A lateral slot is at the location of the second combination portion corresponding to the opening The adhesive combines the first combination portion and the second combination portion. A waveguide is disposed in the chassis, and extends to the exterior of the chassis through the waveguide output hole. A flat tool can be inserted into a space between one of the openings and a corresponding lateral slot to separate the metal cover from the chassis.06-17-2010
20100259914Mobile terminal having noise shielding structure for electronic circuit board - A mobile terminal includes a noise shielding structure for an electronic circuit board for shielding noise generated from the at least one electronic part. The mobile terminal includes a lower case and an upper case slidably moving on the lower case. The mobile station also includes an electronic circuit board installed in the lower case and having at least one electronic part mounted on its front surface. The noise shielding structure includes a front cover installed on the front surface of the electronic circuit board and formed with an opening for receiving the at least one electronic part and a sliding hinge installed between the upper case and the lower case. A shielding wall installed between the rear surface of the front cover and the front surface of the electronic circuit board and elongated around at least a part of a periphery of the opening.10-14-2010
20100226112MIRROR IMAGE SHIELDING STRUCTURE - A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical to the projection shape of the electronic element, and the horizontal size of the ground shielding plane is greater than or equal to that of the electronic element. Thus, the parasitic effect between the electronic element and the ground shielding plane is effectively reduced, and the vertical coupling effect between electronic elements is also reduced. Furthermore, the vertical impact on the signal integrity of the embedded elements caused by the layout of the transmission lines is prevented.09-09-2010
20120243199ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREOF - An electromagnetic interference (EMI) shielding structure, which includes: a substrate, at least one chip unit, a packing layer, and an EMI shielding unit. The chip unit is disposed on the surface of the substrate and electrically coupled thereto. The packing layer is formed on the substrate and covers the chip unit. The EMI shielding unit includes: a first, second, and third shielding layer. The first shielding layer covers the outer surface of the packing layer and the lateral surface of the substrate. The second and third shielding layer respectively covers the outer surface of the first and second shielding layer. Based on the instant disclosure, the EMI shielding unit uses the methods of sputtering and electroless plating, to increase the adhesion strength of the EMI shielding unit and make the thickness of the shielding layer uniform. The instant disclosure raises the EMI shielding efficiency and lowers the manufacturing cost.09-27-2012
20100208447ELECTROMAGNETIC SHIELD STRUCTURE OF ELECTRONICS HOUSING - An electromagnetic shield structure of an electronics housing includes a terminal having a protrusion for external connection; a substrate having the terminal disposed thereon and electrically connected to the terminal; a housing made of resin, enclosing the substrate and having an opening at a position corresponding to the protrusion of the terminal on a front surface side where the protrusion of the terminal is located; and an electromagnetic shield disposed so as to surround the substrate inside the housing, having an opening at the position corresponding to the protrusion of the terminal, and electromagnetically shielding the substrate. The electromagnetic shield has a bent portion formed on the front surface side for filling a gap between the terminal and the housing.08-19-2010
20090284947INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED FARADAY SHIELD - A packaged integrated circuit (IC) (11-19-2009
20090040743FILTER APPARATUS AND FREQUENCY COVERTER TO WHICH THE FILTER APPARATUS IS CONNECTED - A power converter connected to a wiring drawing portion of a frequency converter, said filter apparatus including: a condenser element having an electronic part having an insulator as a dielectric material held between conductor plates; a sealing agent sealing said condenser element; a filter circuit comprising said condenser element; a connection conductor establishing wiring connections of said filter circuit; and a filter housing supporting said sealing agent.02-12-2009
20090073672ELECTROMAGNETIC SHIELD AND ELECTRONIC DEVICE USING THE SAME - An electromagnetic shield includes a conductive foam, a plurality of adhesive tapes attached to a side of the conductive foam. The adhesive tapes are separated from each other. An electronic device using the electromagnetic shield to block electromagnetic energy from inner component or outer component is also provided.03-19-2009
20090244876MULTI-CAVITY ELECTROMAGNETIC SHIELDING DEVICE - An electromagnetic shielding device includes a metal frame mounted on a circuit board and having a looped surrounding wall configured with an inner space divided into first and second space portions by a partition wall unit. A cover is mounted fittingly into the inner space in the metal frame, and includes a dielectric cover body, and a conductive material layer attached to an outer surface of the cover body. The cover body has a looped surrounding wall extending downwardly from a periphery of a top wall and disposed in proximity to the looped surrounding wall of the metal frame such that the conductive material layer is in electrical contact with the looped surrounding wall of the metal frame. The cover cooperates with the metal frame to define first and second cavities having different depths and corresponding respectively to the first and second space portions.10-01-2009
20090175021Electromagnetic-wave suppressing material, electromagnetic-wave suppressing device, and electronic apparatus - An electromagnetic-wave suppressing material is provided. The electromagnetic-wave suppressing material includes an ionic liquid and nanometer-order particles mixed with the ionic liquid, where 10 wt % or more of the nanometer-order particles is mixed with respect to 100 wt % of the ionic liquid.07-09-2009
20110032691PLASMA DISPLAY APPARATUS TO REDUCE EMI EMISSION - A plasma display apparatus having a structure of a base chassis to reduce EMI emission is provided. The plasma display apparatus includes a panel, a driving circuit, and a base chassis having at least one slit formed thereon.02-10-2011
20080304246EMI SHIELDING OF DIGITAL X-RAY DETECTORS WITH NON-METALLIC ENCLOSURES - An imaging system is provided having an EMI shield configured to shield one or more imaging components. The EMI shield includes a first material having a first plurality of conductive elements integrally formed within a first nonconductive material and also includes a generally nonconductive exterior. A method is provided for shielding EMI in an imaging system. The method includes providing an EMI shielding enclosure that includes a first material having a first plurality of conductive elements disposed in a first non-conductive material, and a second material having a second plurality of conductive elements disposed in a second non-conductive material, wherein the first plurality of conductive elements engages the second plurality of conductive elements to form a conduction path. Another method for shielding EMI in an imaging system is provided, that includes providing an EMI shielding enclosure having a first material that has a non-conductive surface and a second EMI shielding material disposed on the non-conductive surface of the first material.12-11-2008
20130135841CHARGER ASSEMBLY AND ELECTROMAGNETIC INTERFERENCE SHIELD ASSEMBLY - An electromagnetic interference shield assembly is provided with a first housing formed of a first conductive polymer. The first housing has a cavity sized to receive an electronic sub-assembly therein. A second housing is formed of a second conductive polymer. The second housing has a cavity sized to receive the first housing therein.05-30-2013
20110122596Electromagnetic wave shielding material, and method for manufacturing same - The present invention is to provide an electromagnetic wave shielding material including a transparent substrate and a convex pattern layer composed of a conductive composition formed in a prescribed pattern on the transparent substrate, wherein the conductive composition contains conductive particles and a binder resin; and in observation of a transverse cross section of the convex pattern layer by electron microscopic photography, at least a part of the conductive particles has a fused continuation and a method for manufacturing the same. The electromagnetic wave shielding material and the method for manufacturing the same include a configuration capable of achieving a lower surface resistivity in an electromagnetic wave shielding material which is required to achieve a much more reduction in a line width of the pattern, specifically, a reduction to a line width of not more than 30 μm, and more preferably not more than 15 to 20 μm and a treatment method capable of reducing the surface resistivity by an easy and short-time treatment.05-26-2011
20110122595ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a housing which has a shielding layer on its inner surface and is provided with an opening, a housed component which is contained inside the housing, and a module which is provided at the exterior of the housing, and has a first conducting section that is electrically connected to the housed component and a second conducting section that is different from the first conducting section. The electronic device includes a connection portion, and the connection portion has a contact portion and an elastic support portion which is extended to a part near the opening and supports the contact portion. The contact portion equalizes the potential of the shielding layer with the potential of the second conducting section by electrically connecting to the shielding layer by the opening, and contacting the second conducting section.05-26-2011
20100309644POWER MODULE AND DISPLAY DEVICE - There are provided a power module and a display device. There is provided the power module for a display device that includes a panel, a backlight unit supporting the panel and including a light source, and a conductive back cover coupled to the backlight unit, the power module including: a circuit board supplying power to the light source included in the backlight unit; a transformer mounted on the circuit board and supplying power to the circuit board; and a shielding plate mounted on the circuit board and covering, in a non-contact manner, the upper surface of the transformer opposed to the lower surface 12-09-2010
20090067150Protection Film for Preventing Leakage of Information, Portable Pouch, Card Case, and Information-Leakage Preventing Plate - A laminated film (protection film for preventing leakage of information) is laminated on each of base clothes of a portable pouch. The laminated film is formed by lamination of an aluminum foil layer and a resin layer. The portable pouch has the laminated film over the inner surface thereof, whereby electromagnetic wave does not leak outside. That avoids skimming.03-12-2009
20110242787FERRITE INDUCTORS INTEGRATED WITHIN INPUT/OUTPUT CABLE PORT ASSEMBLY OF AN ELECTRONICS RACK - An input/output cable port assembly and electromagnetic interference (EMI) attenuation method are provided. The port assembly includes a cable port structure for an electronics rack with an opening for input/output cables to pass therethrough, and a first and a second partition. The first and second partitions couple to the cable port structure and reside within the opening. The first partition includes at least one ferrite inductor portion and the second partition includes at least one second ferrite inductor portion. The partitions are configured to be disposed adjacent to each other as adjoining partitions within the cable port structure, and when disposed as adjoining partitions, the first and second ferrite inductor portions mate and define a ferrite inductor with a central opening for input/output cable(s) of the electronics rack to pass. The ferrite inductor attenuates electromagnetic interference resulting from transient or steady state currents on the cable(s) passing therethrough.10-06-2011
20110085317SHIELD COVER, SHIELD CASE, AND CIRCUIT BOARD MODULE - The invention provides a shield cover adapted to cover at least a first electronic component mounted on a first surface of a circuit board. The first electronic component has a metal shell or has a ground/earth terminal on a lateral surface thereof. The shield cover has a contact portion being elastically contactable with a lateral surface of the metal shell or the ground/earth terminal of the first electronic component.04-14-2011
20100039787EMI SHIELDING DEVICE - An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.02-18-2010
20100046193DISPLAY APPARATUS - A display apparatus is provided. A frame is fixed and supported at the rear of a front panel forming the front portion of the display apparatus, and a separate bracket member is not mounted on the edges of the front panel. Thus, the front exterior of the display apparatus is neatly finished, and the display screen looks bigger than it actually is.02-25-2010
20100046192ELECTROMAGNETIC INTERFERENCE SHIELDING DEVICE - An electromagnetic interference shielding device includes a printed circuit board, a metal member and an elastic member. The elastic member includes a first resisting portion which contacts the printed circuit board and a second resisting portion which contacts the metal member, and the second resisting portion is saw-toothed, and is capable of piercing an oxidized layer of the metal member. Thus, the elastic member keeps contacting the metal member maximally no matter the metal member is oxidized or not, and reduces the electromagnetic interference effectively.02-25-2010
20110069470Electromagnetic interference noise reduction board using electromagnetic bandgap structure - An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes a first area having a ground layer and a power layer, a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes a plurality of first conductive plates placed along the side portion of the first area, a plurality of second conductive plates placed on a planar surface that is different from the first conductive plates so as to overlap with the first conductive plates, and a via configured to connect the first conductive plate and the second conductive plate.03-24-2011
20110075394SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES - A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via.03-31-2011
20110069469Anti-electromagnetic interference shielding device - An anti-electromagnetic interference (anti-EMI) shielding device for fastening to a PC board is disclosed. The anti-EMI shielding device includes a frame having an upper lid closed onto an open top thereof, the frame including a plurality of side walls sequentially connected to one another to enclose a space therein and having a receiving hole formed on one of the side walls at a predetermined position; a connector including an annular ring portion, a body portion, and a tubular portion following the body portion, the annular ring portion being located at a front end of the connector for engaging with the receiving hole on the side wall of the frame; and a sealing structure forming a 360-degree sealing between the frame and the connector to effectively prevent electromagnetic wave from leaking out of and entering into the shielding device.03-24-2011
20120147582EMI SHIELD APPARATUS AND ELECTRONIC DEVICE WITH SAME - An electromagnetic interference (EMI) shield apparatus includes a shell, a hub, a shield member, a partition plate, a resilient member, and a cover. The hub is rotatably mounted within the shell. The shield member is wrapped around the hub. The partition plate is fastened to and rotatable together with the hub. The cover covered on an open end of the shell. The resilient member is connected between the partition plate and the cover to drive the hub to rotate to reel the shield member. The shield member is made of EMI shield material.06-14-2012
20110044019ELECTROMAGNETIC SHIELD STRUCTURE, WIRELESS DEVICE USING THE STRUCTURE, AND METHOD OF MANUFACTURING ELECTROMAGNETIC SHIELD - Provided are an electromagnetic shield structure capable of reducing the contamination of electromagnetic noise which is radiated from a digital device into a wireless device, and a wireless apparatus using the electromagnetic shield structure. This structure has a shield function to reduce the influence of the noise radiated from an LSI (02-24-2011
20110038136BACKSIDE SEAL FOR CONFORMAL SHIELDING PROCESS - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.02-17-2011
20110032690DISPLAY APPARATUS FOR PREVENTING ELECTROMAGNETIC INTERFERENCE (EMI) - A display apparatus is provided, which includes a front cover having an opening through which an image is exposed; a rear cover which is coupled to the front cover and which is made of conductive materials; an image providing panel which provides an image through the opening of the front cover; a protection filter which is disposed between the front cover and the image providing panel and which has a conductive film to shield electromagnetic waves; and a connection unit which is in contact with an edge surface of the protection filter. The connection unit electrically connects the rear cover to an exposed end of the conductive film which is exposed on the edge surface.02-10-2011
20100246154Electromagnetic Interference Suppressing Device and Related Electronic Device - An electromagnetic interference suppressing device includes a plurality of signal guiding units coupled to a metal housing of an electronic component for receiving a plurality of signals transmitted from the metal housing (the electronic component is installed on a circuit board), a plurality of grounding units coupled to a plurality of ground pads of the circuit board for transmitting the plurality of signals to the plurality of ground pads, and a main body coupled to the plurality of signal guiding units and the plurality of grounding units for transmitting the plurality of signals between the plurality of signal guiding units and the plurality of grounding units so as to implement a return path.09-30-2010
20100254112Stacked pluggable cage having iintermediate walls interengaged each other - A stacked pluggable cage (10-07-2010
20100046191Plasma display panel including frameless EMI filter, and/or method of making the same - A plasma display panel (PDP) includes a frameless EMI filter supported by a glass substrate for blocking/shielding substantial amounts of electromagnetic waves, with the filter being supported by a side of the substrate opposite a viewer. In certain example embodiments, the PDP filter includes a transparent conductive coating (TCC) for electromagnetic interference (EMI) and near infrared (NIR) blocking without the need for a conductive, peripheral buss bar. Additionally, in certain example embodiments, the need for a conductive frame is reduced or eliminated. The filter has high visible transmission, and is capable of blocking/shielding electromagnetic waves.02-25-2010
20120201011CONDUCTIVE PLASTIC OVERMOLD ON SHIELDED PLASTIC WINDOW - An integrated assembly is provided for installation on a housing for electronic components. The integrated assembly includes a shielded window and a bezel overmolded onto the shielded window in an injection molding process. Since both the shielded window and the bezel have EMI resistant properties, the assembly represents an efficient method for providing high quality EMI shielding while eliminating the use of costly parts and assembly procedures.08-09-2012
20110255262ELECTROMAGNETIC SHIELDING ENCLOSURE AND ELECTRONIC APPARATUS HAVING SAME - An electromagnetic shielding enclosure includes a main body for enclosing a mounting region of a printed circuit board, a plurality of fixing fins, and a number of resilient fins. The fixing fins and resilient fins extend out from edges of the main body. Each of the resilient fins has a protrusion formed thereon. The fixing fins are configured for being fixedly attached the main body on the PCB in a manner that ensures the main body encloses the mounting region and the protrusions resiliently contact with a grounding region of the printed circuit board.10-20-2011
20110164394DISPLAY DEVICE - A display device having a compact structure includes a main board and an inverter board of the display device connected to each other. A bracket supports the main board and the inverter board. The bracket includes a shielding part to block electromagnetic waves, an inverter board holding part to allow the inverter board to be easily seated on the bracket, and a support and fixing part to support and fix the bracket. Further, a front cover and a back cover are connected in a snap-fit manner, and a bottom chassis includes a cable receipt groove to organize the internal wiring of the display device.07-07-2011
20080205026Electromagnetic Compliance Spring of Drive Carrier - Systems and arrangements to provide electromagnetic compliance (EMC) for a drive carrier are disclosed. Embodiments may include an EMC spring. The EMC spring may include a shield portion to fasten to one side of a frame of the drive carrier and multiple fingers attached to the shield portion. At least one of the fingers may include an upper spring section to contact an adjoining drive carrier as the drive carrier is inserted into a computing device and a lower spring section. The lower spring section may be folded over against the upper spring section and attached to the shield portion of the spring. The lower spring section may deflect in response to the upper spring section contacting the adjoining drive carrier. In some embodiments, a lead in portion of the upper spring section may deflect to a position nearly parallel to the adjoining drive carrier.08-28-2008
20100284163METHOD AND SYSTEM FOR ISOLATING LOCAL AREA NETWORKS OVER A CO-AXIAL WIRING FOR ENERGY MANAGEMENT - An energy management system. The system includes a coax controller apparatus comprising an exterior housing and plurality of coax modules numbered from 2 through N, where N is an integer greater than 3. In a specific embodiment, each of the coax modules comprises a powerline chip (PLC) module coupled to an analog front end, which is coupled to a coaxial connector. The system also has an electromagnetic shield configured to each of the coax modules. In a specific embodiment, the electromagnetic shield is configured to substantially maintain the coax module substantially free from interference noise or other disturbances. The system has a power meter coupled to one or more ports of the coax controller apparatus.11-11-2010
20110261552METHOD FOR AFFIXING ADHESIVE FILMS AND MAIN BOARD WITH ADHESIVE FILMS APPLIED USING THE METHOD - A method for affixing adhesive films to a main board is provided. The main board includes a main body and a shield. The shield includes a first shield and a second shield. The second shield defines openings. When the second shield is attached to the main body, components of the main body are confined within the openings, respectively. The method includes: first absorbing a single adhesive film to an electrostatic absorbing film. Then, stamping the electrostatic absorbing film and the single adhesive film to form adhesive films that have substantially the same shape and arrangement as the openings. Next, aligning the electrostatic absorbing film with the first shield and affixing the adhesive films to the first shield. Then, removing the electrostatic absorbing film from the first shield. And, assembling the first shield to the second shield.10-27-2011
20080218989THIN FILM DEPOSITION AS AN ACTIVE CONDUCTOR AND METHOD THERFOR - A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In addition, a method includes forming an EMI shield within a medical device by depositing a thin film of metal on a surface within the medical device. The thin film of metal, of gold, aluminum, or copper, is formed by vapor deposition or sputtering. An apparatus includes a first substrate assembly including a first substrate having a cavity. A first set of electronic components are disposed within the cavity, and a first polymer is disposed over the first set of components. Deposited on an outer surface of the first polymer by vapor deposition is a thin film of metal. The thin film of metal is electrically coupled with a ground. A second substrate assembly including a second substrate is coupled with the first substrate assembly.09-11-2008
20110096524ELECTRIC APPARATUS MODULE - An electric apparatus module 04-28-2011
20100214759Integrated Circuit Package Having Integrated Faraday Shield - A packaged integrated circuit (IC) (08-26-2010
20090190321Shield Casing and Electronic Apparatus - A shield casing, which is configured to surround an electronic component mounted on a circuit board, includes a frame body including an engagement recess and a lid body including a hook unit configured to engage with the engagement recess. The lid body is fitted to the frame body to cover the frame body. The hook unit is elastically deformable in a second direction that is opposite to a first direction in which the lid body is fitted to the frame body as the lid body is fitted to the frame body, and then snaps into mating engagement in the engagement recess.07-30-2009
20100079972SHIELD CAN - A shield can includes a frame and an enclosure, the frame includes a top wall and sidewalls, the sidewalls defines a plurality of latching holes extending through the top wall, and the top wall forms extending portion corresponding to the latching hole. The enclosure includes a main plate and walls, the wall forms depression portions corresponding to the latching holes, the depression portion defines a cutout extending through the main plate. The enclosure is attached to the frame, the depression portions latch into the latching holes and the extending portions latch into the cutouts accordingly.04-01-2010
20100067211DISPLAY SUBSTRATE AND DISPLAY APPARATUS HAVING THE SAME - A display substrate includes a base substrate having a plurality of pixel areas, a switching device arranged in each pixel area to switch a pixel voltage, a pixel electrode arranged in each pixel area and electrically connected to the switching device to receive the pixel voltage, and a shielding member positioned between two adjacent pixel areas.03-18-2010
20100195305RADIATION LEVEL REDUCING DEVICE - A radiation level reducing device, including: a metal plate for covering surface of an electromagnetic wave generation source for radiating an electromagnetic wave; a cover region, set within a plane of the metal plate, for covering the surface; and a plurality of slits formed to a band-shape in the cover region, and spaced apart from each other, wherein each of the plurality of slits includes, a drawing slit extending towards a central part of the cover region from an intense electric field position where an electric field generated in between the electromagnetic wave generation source by the electromagnetic wave is stronger than other positions at an outer periphery of the cover region, and a coupling slit extending so as to line in parallel to another slit from an end in the central part direction of the cover region in the drawing slit.08-05-2010
20110261551EM SHIELD FOR INTERNAL ANTENNA OF HANDHELD TERMINALS - A portable terminal having a plurality of electronic components and an antenna such that at least a portion of the plurality of electronic components and the antenna are housed internally by a housing. The terminal comprising a first enclosure of the housing having a first interior to contain the plurality of electronic components and a ground. The terminal has a second enclosure of the housing for coupling to the first enclosure, the second enclosure having a second interior to contain the antenna and for facilitating at least one of receiving or transmitting of EM signals between the antenna and an environment external to the second enclosure. The terminal has an electromagnetic (EM) shield positioned at an interface between the first interior and the second interior, the EM shield including electrically conductive material to absorb EM radiation generated by the plurality of electronic components being directed towards the antenna and to convert at least a portion of the absorbed EM radiation into electrical current and direct the electrical current towards the ground of the first enclosure. Also included is an electrically conductive coupling to couple the EM shield to the ground of the first enclosure.10-27-2011
20110261550USE OF CONDUCTIVE PAINT AS A METHOD OF ELECTROMAGNETIC INTERFERENCE SHIELDING ON SEMICONDUCTOR DEVICES - A conductive paint electromagnetic interference (EMI) shield for an electronic module or device. The conductive paint is composed of metal particles suspended in a fluidic carrier. In one embodiment, the conductive paint is sprayed onto exterior surfaces of an electronic module or device from a spray gun. The sprayed conductive paint is cured to remove the fluidic carrier, leaving a metal film coated to the outside of the module or device. In one embodiment used with electronic packages in array form, grooves are cut into an encapsulation material of a module so that the shield protection includes sidewalls of the package. In another embodiment used with camera modules, masking is used to selectively shield portions of the module. In a further embodiment, the shield is electrically connected to a ground conductor of a circuit of the electronic module.10-27-2011
20110188227SHIELD STRUCTURE FOR AN ELECTRONIC ELEMENT AND ELECTRONIC DEVICE - A shield structure for an electronic element, includes a grand pattern provided in a board; and a first member having electrical conductivity, covering the electronic element, and connected with the grand pattern.08-04-2011
20090175020METAL RETAINING FEATURES FOR HANDHELD ELECTRONIC DEVICE CASING - This invention is directed to mechanical and electromagnetic shielding features of an electronic device case. An electronic device case is formed of two housings, each housing having integrated snaps, channels, or other retaining features used to secure the housings together. The housings additionally include integrated retaining features used to secure electronic components within the device case. The housings and retaining features are formed of amorphous metals or other materials with high elasticities. Because the retaining features necessary to assemble the case and secure the electronic components to the case form integral parts of the housings, no external retaining features are required to assemble the electronic device in the case.07-09-2009
20110188226SHIELD APPARATUS FOR EMI SHIELDING - A shield apparatus for EMI (ElectroMagnetic Interference) shielding is provided. The shield apparatus includes a case and a metal clip. The case is box-shaped with at least one open side, and has a recess defined from the open side into a sidewall. The metal clip is housed in the recess, and is resiliently inserted on the sidewall to retain a certain height.08-04-2011
20100020523EMI SHIELDING DEVICE - An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.01-28-2010
20100020522EMI SHIELDING DEVICE - An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.01-28-2010
20100020519EMI SHIELDING DEVICE - An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.01-28-2010
20100020518RF shielding arrangement for semiconductor packages - A packaging for semiconductor modules such as multi chip modules (MCM). At least one via is created on saw street region of a substrate having circuit components. The substrate is transfer molded and the transfer molded substrate is partially singulated from a first surface along with the via to create a groove. The partially singulated substrate including the groove on the saw street region and the via is coated or plated with a conducting material for RF shielding. Accordingly, the conducting material and a ground terminal of the substrate are connected through the via on the substrate.01-28-2010
20100020521EMI SHIELDING DEVICE - An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.01-28-2010
20080266830RADIO FREQUENCY ABSORBER - An exemplary embodiment of the present invention comprises a radio frequency absorber that is operative for absorbing electromagnetic energy, scattering electromagnetic signals, and/or attenuating electromagnetic signals. In accordance with certain aspects of the invention, the radio frequency absorber is substantially flat and comprises an absorbing surface. The absorbing surface is operative to absorb electromagnetic energy, scatter electromagnetic signals, and/or attenuate electromagnetic signals. In exemplary embodiments of the invention, the radio frequency absorber comprises a plurality of holes disposed within the radio frequency absorber. The radio frequency absorber, according to various embodiments of the present invention, is configured to reduce cavity oscillations and/or cavity modes and resonances within an integrated circuit device, such as a device that houses a monolithic microwave integrated circuit.10-30-2008
20110051391CHIP CARD HOLDER - A chip card holder for holding a chip card is disclosed including a base member, a mounting frame and a holding member. The mounting frame is made of metal materials and secured to the base member. The holding member is used to hold the chip card and is slidably mounted within the mounting frame. When the holding member is completely received in the mounting frame, the mounting frame and the base member cooperatively enclose and preventing the chip card from electromagnetic interference.03-03-2011
20110051390ELECTRONIC ASSEMBLY FOR AN IMAGE SENSING DEVICE - An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.03-03-2011
20100188833ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE INCLUDING CARBON NANOTUBE OR NANOFIBER FILMS AND METHODS - A composite material for electromagnetic interference shielding is provided. The composite material comprises a stack including at least two electrically conductive nanoscale fiber films, which are spaced apart from one another by at least one insulating gap positioned between the at least two nanoscale fiber films. The stack is effective to provide a substantial multiple internal reflection effect. An electromagnetic interference shielded apparatus and a method for shielding an electrical circuit from electromagnetic interference is provided07-29-2010
20110317393Operating Container for a Magnetic Resonance Apparatus - An operating container for a magnetic resonance apparatus is proposed. The container has outer walls that enclose an interior space which is embodied for accommodating and operating a magnetic resonance apparatus. The container has a magnetic field shield arranged inside the outer walls. A latent heat storage material is arranged between the outer walls and the magnetic field shield.12-29-2011
20120044664ELECTROMAGNETIC INTERFERENCE REDUCTION APPARATUS - Provided is an Electromagnetic Interference (EMI) reduction apparatus. The EMI reduction apparatus includes: an electromagnetic wave absorbing unit absorbing electromagnetic waves from an electromagnetic wave generator and converting the absorbed electromagnetic waves into thermal energy through thermal conversion and emitting the thermal energy; and a thermoelectric unit converting the emitted thermal energy into electric energy.02-23-2012
20120044663REMOVEABLE SHIELD-CAN AND PRINTED CIRCUIT BOARD ASSEMBLY USING SAME - A PCB assembly, includes a shield-can and a PCB, the shield-can forms resisting portions and hook members; The PCB has a top surface and an opposite bottom surface, and the PCB defines engaging holes through the top surface and bottom surface; The shield-can be detachably assembled on the PCB, the resisting portions resist against the top surface of the PCB, and the hook members pass through the engaging holes, the distal ends of the hook members resist against the bottom surface of the PCB.02-23-2012
20120008303Communication module - An electromagnetic wave suppression material is fixed to a case of a communication module. The electromagnetic wave suppression material suppresses radiation of electromagnetic waves by coming into contact with a cage that is a module insertion portion of a chassis when the communication module is inserted into the cage. A piezoelectric element is provided on the case, and located between the case and the electromagnetic wave suppression material. When the communication module is inserted into the cage, the controller applies a voltage to the piezoelectric element to stretch it by the applied voltage, thereby increasing contact pressure between the cage and the electromagnetic wave suppression material.01-12-2012
20120008302SHIELDING ASSEMBLY - A shielding assembly comprises a pair of opposite first sidewalls, a pair of opposite second sidewalls, a pair of opposite first covers, a pair of latching portion and a pair of opposite second covers. The first sidewalls and the second sidewalls are connected with each other to collectively form a hollow frame. The first covers are resiliently connected to the first sidewalls, respectively, and suitable to be bent to collectively cover the hollow frame. The pair of latching portions extend the first covers and are bent perpendicular to the first covers, respectively. A pair of gaps are defined respectively on two tail ends of each of the latching portions. The second covers are resiliently connected to the second sidewalls, respectively, and are bent to cover on the first covers and latched in corresponding gaps.01-12-2012
20120057323DEFECTED GROUND STRUCTURE WITH SHIELDING EFFECT - A defected ground structure with shielding effect is provided. The structure includes a dielectric layer, a defected metal layer, a grounded metal layer and at least a conductive mushroom-like structure. The defected metal layer has a line-shaped opening and is disposed in the dielectric layer. The conductive mushroom-like structure is disposed between the defected metal layer and the grounded metal layer and is arranged along an extending direction of the line-shaped opening periodically. The conductive mushroom-like structure includes a fungating part and a stipe part. The fungating part is parallel to the defected metal layer and a distance is maintained away from the defected metal layer. The projection area of the fungating part on the defected metal layer covers a length of the line-shaped opening corresponding to the fungating part. The stipe part connects the fungating part and the grounded metal layer.03-08-2012
20100182765RF/EMI SHIELD - An RF/EMI shield has a planar conductive element and a plurality of solder spheres extending around the edges making electrical and mechanical contact with the conductive element to form a shield which can be soldered in a surface mount process directly over components needing shielding. The solder spheres have a diameter sufficient to provide the desired clearance between the shielding element and the component being shielded and a melting temperature equivalent to existing solder contacts to which the shield is bonded.07-22-2010
20120206898ELECTRONIC DEVICE WITH ADHESIVE-LESS FIXED FLAT CABLE - An electronic device includes an EMI shielding board, two electronic components and a flat cable. The EMI shielding board includes a first side and a second side opposite to the first side. The two electronic components are arranged at the first side of the EMI shielding board. The flat cable is connected between the two electronic components. The EMI shielding board further includes a first through slot and a second through slot both configured therein. The flat cable passes through the EMI shielding board via the first and second through slots. A part of the flat cable is on the first side of the EMI shielding board, and the remaining part of the flat cable is on the second side of the EMI shielding board.08-16-2012
20090135579TOUCH PAD HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING PLATE - A touch pad including an ElectroMagnetic Interference (EMI) shielding plate and method for detecting a touch on the touch pad is provided. The touch pad includes a touch plate for generating, when a touch is generated on a surface of the touch plate, a change of a physical property, a touch sensor coupled to the touch plate for detecting a position of the generated touch by measuring the change of the physical property, and an EMI shielding plate disposed adjacent to or attached to a surface of the touch plate and formed with a plurality of openings. The density of the openings formed at a position of the EMI shielding plate increases as the position becomes farther from the touch sensor. Accordingly, the touch pad having an EMI shielding plate can more accurately detect a touch generated at any position close to or remote from the touch sensor of the touch pad, and thereby increase user convenience of a portable terminal.05-28-2009
20110090664SHIELD CASE MOUNTING SUBSTRATE - In a shield case mounting substrate, a downwardly extending portion of a shield case is solder-bonded to a first land pattern and a second land pattern which are provided on the surface of a substrate. The width of the first land pattern in the thickness direction of the downwardly extending portion is greater than the width of the second land pattern in the thickness direction of the downwardly extending portion. Consequently, the high bonding strength between the shield case and the substrate can be ensured, and the positioning accuracy of the shield case on the substrate can also be ensured.04-21-2011
20120127688ELECTRONIC DEVICE WITH CARD CONNECTION MECHANISM - A shield case is configured for supporting a memory card. The shield case includes a recessed portion, and a first edge, a second edge, and a third edge arranged around the recessed portion. The first edge forms a first support plate. The second edge forms a second support plate. The first support plate and the second support plate cooperatively support the memory card.05-24-2012
20100188834LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD - A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members are extruded of aluminum defining self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection.07-29-2010
20090059551DISK DRIVE CAGE WITH SHIELDING MEMBER - A disk drive cage comprises a bracket (03-05-2009
20090116209Housing for an optoelectronic component emitting electromagnetic radiation, component emitting electromagnetic radiation, and method for the production of a housing or a component - A housing for an electromagnetic-radiation-emitting optoelectronic component. Exterior side faces of the housing are at least partly provided with a screening layer suitable for screening an electromagnetic radiation. A lateral emission of electromagnetic radiation from the housing, which is disadvantageous for many applications, is thereby intended to be avoided. An electromagnetic-radiation-emitting component having a housing of this type and a method for producing a corresponding housing or component are additionally described.05-07-2009
20120257369EMI SHIELD AND ELECTRONIC DEVICE USING THE SAME - An EMI shield includes a first contacting member and a second contacting member connected to the first contacting member. The first contacting member includes a first bent portion and a second bent portion extending from the first bent portion. An opening is defined in the first bent portion. The second bent portion comprises a main body connected to and slanted to the first bent portion, a tongue-like sheet extending from the main body, towards and corresponding to the opening of the first bent portion, and one or more hooks formed on the sides of the main body. The tongue-like sheet includes a latching portion. An electronic device using the EMI shield is also provided.10-11-2012
20120262898ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS - An electro-optical device includes: a frame that has a conductive portion; an electro-optical panel that is housed in the frame; and an electronic component that is mounted in a mounting area of the electro-optical panel, wherein a shield member having a conductive layer that covers at least a part of the mounting area is brought into contact with the electronic component through an insulating layer, and wherein the conductive layer of the shield member is electrically connected to the conductive portion of the frame.10-18-2012
20090016039Structure And Method For Attaching Shield Case To Circuit Board, Electronic Component Module And Portable Telephone - A structure for attachment of a shield case to a circuit board. Electronic components are mounted at one face of the circuit board. The shield case is for covering the electronic components and blocking electromagnetic waves. The attachment structure includes toe portions, formed to protrude from the shield case, and holes formed in the circuit board, at which the toe portions can be inserted. The toe portions are fixed to the circuit board by being inserted into the holes and soldered to soldering lands at the other face of the circuit board. Thus, it is possible to prevent solder balls and solder flux entering the shield case, it is further possible to reserve space for soldering lands, with sizes that are required for fixing of the shield case, at a rear face of the circuit board, and it is possible to attach the shield case to the circuit board strongly.01-15-2009
20110122597DRIVING DEVICE AND A LIQUID CRYSTAL DISPLAY INCLUDING THE SAME - A driving device including a board on which a timing controller for signal processing and a memory are mounted, the board having a conductive field, in which the conductive field has a non-contact region which is coated with an insulating material, and an exposed contact region which is not covered with the insulating material, the exposed contact region formed adjacent to the timing controller or the memory, a conductive member disposed in the exposed contact region, and a shield covering the board and electrically connected to the conductive field via the conductive member05-26-2011
20080298041ELECTROMAGNETIC RADIATION SHIELD FOR AN OPTICAL SUBASSEMBLY - In one example embodiment, an electromagnetic radiation (EMR) shield includes a central portion, an opening defined in the central portion, a wing attached to and extending outward from the central portion, and a protrusion defined in the wing. The perimeter of the EMR shield is approximately the same size and shape as that of a portion of an associated optical subassembly (OSA).12-04-2008
20120327629TRANSCEIVER MODULE AND SHEET METAL HOUSING FOR TRANSCEIVER MODULE - A transceiver module includes a sheet metal housing, an EMI finger, and a slot, wherein the EMI finger extends away from the sheet metal housing, and the slot is formed on the sheet metal housing and by the base of the EMI finger. By the slot, the sheet metal housing is prevented from getting stuck or jammed inside the cage upon removing the transceiver module from the cage.12-27-2012
20120327630Hi-Definition Multimedia Interface Shield with Fingers - An electromagnetic shield comprises a sheet of metal having slots along an edge of the sheet to form a plurality of resilient fingers. The single sheet is bent around first and second bends axes inwardly and approximately ninety degrees to form a top planar surface and first and second side walls. The single sheet of metal is sized and dimensioned to receive a connector in between the first and second side walls and top planar surface. The fingers are bent outward with a bend radius of approximately 0.020 inches with respect to a flat surface of the sidewalls and top planar surface. The fingers apply a biasing force against a surface of a faceplate. Each of the side walls includes an elongated leg, which is interconnected with a circuit board and each of the elongated legs extends beyond a bottom edge of each of the side walls.12-27-2012
20120320557ELECTRICAL COLLECTING COVER FOR COVERING AN ELECTROSTATIC GUN AND ELECTROSTATIC TESTING DEVICE THEREWITH - An electrical collecting cover for covering an electrostatic gun is disclosed. The electrical collecting cover includes a connecting portion for connecting with a main body of the electrostatic gun, a shielding portion connected to the connecting portion for shielding the main body of the electrostatic gun, a sleeve portion connected to the shielding portion for sheathing with a discharging head of the electrostatic gun, and an electrostatic discharge portion connected to the sleeve portion and located on a side of the discharging head for guiding static electricity from the discharging head of the electrostatic gun as the sleeve portion sheathes with the discharging head of the electrostatic gun.12-20-2012
20120320559MODULE HAVING ELECTRICAL SHIELD - A module includes a circuit board, a first and a second circuit block mounted on the top surface of the circuit board, and a first boundary formed between these circuit blocks. The module further includes a first metal piece and a resin part. The first metal piece is mounted on the first boundary. The resin part is provided, on its upper surface, with a first groove in a position corresponding to the first metal piece. The first groove includes a first exposed portion in which the first metal piece is partially exposed from the resin part and is connected to a shielded conductor.12-20-2012
20120320558Electromagnetic Shielding Structures for Selectively Shielding Components on a Substrate - Electronic components on a substrate may be shielded using electromagnetic shielding structures. Insulating materials may be used to provide structural support and to help prevent electrical shorting between conductive materials and the components. The shielding structures may include compartments formed using metal fences that surround selected components or by injection molding plastic. The shielding structures may be formed using metal foil wrapped over the components and the substrate. Electronic components may be tested using test posts or traces to identify components that are faulty. The test posts or traces may be deposited on the substrate and may be used to convey test signals between test equipment and the components. After successful testing, the test posts may be permanently shielded. Alternatively, temporary shielding structures may be used to allow testing of individual components before an electronic device is fully assembled.12-20-2012
20100246155LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD - A housing assembly for a lightweight electronic device for vehicular application is virtually “fastenerless” and includes a one-piece case formed of a layered composite structure including polymer based, electrically insulating sheet material and electrically conductive sheet material that is compression molded or hydroformed to provide three-dimensional case details to accept one or more electronic devices such as circuit boards required for electrical control and display of vehicle based systems. The conductive sheet material is preferably a wire mesh which provides shielding from electrical anomalies and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.09-30-2010
20110242788FERRITE INDUCTORS INTEGRATED WITHIN TOP-MOUNTED INPUT/OUTPUT CABLE PORT ASSEMBLY OF AN ELECTRONICS RACK - An input/output cable port assembly and electromagnetic interference attenuation method are provided. The cable port assembly includes a cable port structure mounted to an electronics rack with an opening for input/output cables to pass therethrough, and multiple bottom ferrite inductor portions and multiple top ferrite inductor portions. The bottom and top ferrite inductor portions include first and second surfaces, respectively. The inductor portions are configured to be stacked within the cable port structure with their first and second surfaces in opposing relation to define at least one ferrite inductor with a central opening defined by the first and second surfaces for input/output cable(s) of the electronics rack to pass. The ferrite inductor attenuates electromagnetic interference resulting from transient or steady state current on the cable(s) passing therethrough.10-06-2011
20100202127ELECTRONIC MODULE WITH EMI PROTECTION - An electronic module with EMI protection is disclosed. The electronic module comprises a component (08-12-2010
20120140432RADIO FREQUENCY CIRCUIT WITH IMPEDANCE MATCHING - A radio frequency (RF) circuit is configured for impedance matching, such as for mitigating noise. In connection with an example embodiment, an RF circuit includes a transceiver in a substrate, and a conductive ring-type of material in the substrate and around at least a portion of the transceiver circuit. An upper conductive ring material is over the substrate and separated from the conductive ring-type material by an insulating layer. The upper conductive ring material is configured to generate an inductance that matches input impedance characteristics of the transceiver circuit. In some implementations, the upper conductive ring material connects a gate input pin of the circuit with the gate of an input transistor of an amplifier in the transceiver, and exhibits an impedance that matches the impedance of the input transistor.06-07-2012
20130021772PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME - A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate.01-24-2013
20100091476ELECTRICAL DEVICE WITH SCREEN - An electronic device (04-15-2010
20090237908ELECTROMAGNETIC CONTAINMENT MODULE FOR ELECTRONIC COMPONENTS - The present invention relates to an electromagnetic containment module. The module includes a metal casing sealed by a metal cover. The module contains a printed circuit arranged flat in the bottom of the casing, and an input/output line leaving the printed circuit via one of its edges to pass perpendicularly through a wall of the casing. A cylinder of hollow axis is arranged on the internal face of this wall, the axis of the cylinder being substantially perpendicular to the wall and the input/output line passing through the cylinder substantially along its axis. The cover includes a notch, the bottom of which has the form of a half-cylinder of the same diameter as the cylinder, the cylinder fitting substantially without play in the notch when the cover is closed, so as to electromagnetically contain the portion of the input/output line situated in the module between the edge of the printed circuit and the wall of the casing.09-24-2009
20080225504Lightweight electromagnetic interference shielding for automotive igniters - In an igniter module housing (F) of an automotive headlamp assembly, an improved EMI shielding includes a thin coating (09-18-2008
20130170172METHOD FOR PRODUCING A PLURALITY OF ELECTRONIC DEVICES HAVING ELECTROMAGNETIC SHIELDING AND IN PARTICULAR HAVING HEAT DISSIPATION AND ELECTRONIC DEVICE HAVING ELECTROMAGNETIC SHIELDING AND IN PARTICULAR HAVING HEAT DISSIPATION - An electronic device comprises a substrate (07-04-2013
20130114235EMI SHIELD - An EMI shield can be formed directly on a component, e.g., an unpackaged or packaged semiconductor die, by depositing and curing a curable composition which includes electrically conductive particles and a carrier. In examples, the shield can be configured as a grid or net of electrically conductive traces or lines. The curable electrically conductive material may be applied to the component surface in a flowable form and cured or allowed to cure to form the electrically conductive shield. The shield can be electrically coupled to contacts on an underlying circuit panel or support. The coupling material may be a conductive adhesive, and may be or may include a material the same as, or similar to, the shield material.05-09-2013
20110267795ELECTRONIC PASSPORT CASE FOR PREVENTING LEAKAGE OF INFORMATION AND IMPROVING RECOGNITION RATE - The present invention relates to an electronic passport case for preventing a leakage of information and improving a recognition rate. More particularly, the present invention relates to an electronic passport case that prevents a leakage of information by shielding electromagnetic waves which reach an electronic chip and improves a recognition rate of the electronic chip incorporated in the electronic passport in order to prevent personal information of an electronic passport owner stored in the electronic chip incorporated in the electronic passport from being leaked arbitrarily unintentionally. The present invention provides an electronic passport case for preventing a leakage of information and improving a recognition rate, including an electromagnetic wave shielding layer formed to cover an electronic passport and preventing an electronic wave from reaching an electronic chip incorporated in the electronic passport. According to the present invention, it is possible to prevent biological information and personal information of an electronic passport owner recorded in an electronic chip of an electronic passport from being arbitrarily leaked and misused, and to perform communication between the electronic chip and a recognizer stably.11-03-2011
20130141888Field Device for Automation Technology - A field device for automation technology, wherein the field device has a metal housing for accommodating a field device electronics, an RFID chip and a first RFID antenna for wireless communication and/or energy transmission between an RFID reading device arranged outside of the field device. The first RFID antenna is spaced from a neighboring wall of the metal housing, wherein shielding is provided between the first RFID antenna and the neighboring wall of the metal housing. The separation between the first RFID antenna and the wall of the metal housing and the shielding between the first RFID antenna and the neighboring wall of the metal housing are so dimensioned, that the metal housing does not prevent wireless communication and/or energy transmission between the RFID reading device and the field device.06-06-2013
20130141887CHASSIS FOR ELECTRONIC DEVICE - A chassis for an electronic device includes a main housing and a removable cover. The main housing includes a base plate and two opposite side plates integrally formed together. The removable cover includes a main portion and two opposite side portions. The side portions are latched on the side plates. A space is defined between each side portion of the cover and each side plates of the main housing. A waveguide is formed between each side portion and each side plate to attenuate electromagnetic radiation in the space.06-06-2013
20110211327INTERLOCKING EMI SHIELD - An electromagnetic interference shield system, is provided. Each EMI shield may include a frame providing the structure around the electronic device components to be shielded, and a cover operative to be placed over the frame to prevent electromagnetic radiation from passing over the frame. Each frame may be coupled to a circuit board, and enclose electronic components in need of shielding. Each cover may be coupled to its corresponding frame using at least one snap that extends from the periphery of the cover towards the frame and circuit board. To minimize the space taken by the EMI shields, the snaps of adjacent covers may be offset or staggered so that opposing snaps engage voids left between snaps of the opposing cover, thus reducing the space needed between adjacent EMI shields by up to the width of a snap.09-01-2011
20130094170ELECTROMAGNETIC INTERFERENCE SHIELD - An electromagnetic interference (EMI) shield that increases the airflow through the EMI shield while preventing line-of-sight openings through the EMI shield. Two plates are coupled together. Each of the respective plates has a raised component with an aperture therethrough to provide a path through the plate. The raised component is preferably scoop-shaped with the aperture at one end and an opposite end tapering into the respective plate. At least a portion of one of the raised components overlaps at least a portion of the other of the raised components when the plates are coupled together to form a path through the plates, while the plates are coupled together. Line-of-sight openings through the plates, to an electronic device protected by the EMI shield, are at least partially prevented by the raised components.04-18-2013
20100315799HIGH FREQUENCY STORING CASE AND HIGH FREQUENCY MODULE - A cavity configured by electrically connecting an earth conductor formed on a multilayer dielectric substrate and on which a plurality of high frequency circuits are mounted, and a shield cover member. A waveguide aperture is formed on the earth conductor on which the high frequency circuits are mounted and is electrically coupled to the cavity, and an end-short-circuited dielectric waveguide formed in a direction of layer lamination of the multilayer dielectric substrate is connected to the waveguide aperture, and has a length approximately ¼ of an effective wavelength in the substrate of a signal wave. Spatial isolation between the high frequency circuits is ensured by an inexpensive and simple configuration using the single cavity.12-16-2010
20120281386EASILY SOLDERABLE SHIELD CASE FOR ELECTROMAGNETIC WAVE SHIELDING - An easily soldered shield case for electromagnetic-wave shielding comprises: a metal main body in the shape of a box of which the bottom surface is open; a flange which is formed extending integrally outward or inward from the open edge of the main body; a plurality of through holes formed along the flange or a plurality of recesses formed along the rear surface of the flange; and a solder member which is stably placed on the through holes or the recesses and projects in the thickness direction of the flange, wherein the shield case is mounted on a printed circuit board and the solder member is electrically and mechanically joined to the printed circuit board by means of soldering.11-08-2012
20120281385LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD - A housing assembly for a lightweight electronic device for vehicular application is virtually “fastenerless” and includes a one-piece case formed of a layered composite structure including polymer based, electrically insulating sheet material and electrically conductive sheet material that is compression molded or hydroformed to provide three-dimensional case details to accept one or more electronic devices such as circuit boards required for electrical control and display of vehicle based systems. The conductive sheet material is preferably a wire mesh which provides shielding from electrical anomalies and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.11-08-2012
20120020048Shielding housing - A shielding housing has an electromagnetic closure. The housing has a base part and a lid part. The base part and the lid part may be hingedly connected to one another at a rear portion of the housing. There may also be an opening device for opening the lid.01-26-2012
20130194771BATTERY PACK - A battery pack providing power to a portable electronic device is disclosed which inhibits electromagnetic waves generated by the battery pack from interfering with the portable electronic device. The portable electronic device may include a radiofrequency (RF) circuit including a transceiver. The battery pack may include a battery cell and a protection circuit module (PCM) which operates to prevent the battery cell from overcharge/overdischarge and overheating. The PCM may include a substrate and a protection device mounted to the substrate. Electromagnetic waves generated when the protection device operates are shielded from the portable electronic device by a shielding layer formed on the substrate of the PCM. The substrate may include a plurality of circuit layers, each including a circuit layer, with the circuit layers in electrical communication with one another. A shielding pattern is formed on at least one of the circuit layers.08-01-2013
20130194772Protective Telecommunications Enclosure Systems and Methods - Protective containers for electronic equipment, and methods of testing, use, and/or manufacture thereof, are provided. The cabinets provide a HEMP protection level to electronic equipment housed therein that meets a HEMP protection level according to MIL-STD-188-125-1.08-01-2013
20130194773RF Apparatus and Accelerator Having Such an RF Apparatus - An RF apparatus may include: an RF resonance device having an electrically conductive outer wall, the outer wall comprising a gap extending over its circumference, and an input coupling device having an RF generator, arranged on the outer side of the outer wall of the RF resonance device in the region of the gap, for coupling RF radiation of a particular frequency through the gap into the interior of the RF resonance device, and shielding which externally shields the generator and electrically bridges the gap on the outer side of the outer wall, wherein the shielding is formed as a resonator having a high impedance at the generator frequency08-01-2013
20130201650MOLDED RADIO-FREQUENCY STRUCTURE WITH SELECTIVE ELECTROMAGNETIC SHIELDING AND FORMING METHOD THEREOF - A molded radio-frequency (RF) structure with electromagnetic shielding includes a substrate layer, an RF layer, a molded layer and a metal layer. The RF element is disposed on the substrate layer. The molded layer is located on the substrate layer and overlays the RF element. The metal layer is coated on the molded layer, and has an opening located above the RF element.08-08-2013
20130201651HOUSING FOR ACCOMMODATING ELECTRIC AND ELECTRONIC COMPONENTS - A housing for accommodating electric and electronic components is EMC safe in the manner of a Faraday cage. At least one accommodating chamber, open toward the outside of the housing and otherwise substantially closed to all sides, is formed in at least one outer wall of the housing. At least one non EMC safe transmitter in the form of a non EMC safe transmitting or receiving device is adapted to provide wireless communication between housing side control electronics and an external control device. A functional component is adapted to be controlled by the housing side control electronics. The transmitter may be an antenna, the arrangement thereof inside the accommodating chamber ensuring that it is located outside the EMC protection or shielding. The functional component can be a peristaltic-type pump that is protected by the arrangement inside the accommodating chamber and does not protrude from the housing.08-08-2013

Patent applications in class EMI